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WO2018000767A1 - 发动机温度的控制方法及系统 - Google Patents

发动机温度的控制方法及系统 Download PDF

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Publication number
WO2018000767A1
WO2018000767A1 PCT/CN2016/111019 CN2016111019W WO2018000767A1 WO 2018000767 A1 WO2018000767 A1 WO 2018000767A1 CN 2016111019 W CN2016111019 W CN 2016111019W WO 2018000767 A1 WO2018000767 A1 WO 2018000767A1
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WIPO (PCT)
Prior art keywords
temperature
engine
semiconductor refrigeration
heat dissipation
preset
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2016/111019
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English (en)
French (fr)
Inventor
刘均
刘新
宋朝忠
欧阳张鹏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Launch Technology Co Ltd
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Shenzhen Launch Technology Co Ltd
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Publication of WO2018000767A1 publication Critical patent/WO2018000767A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
    • F01P—COOLING OF MACHINES OR ENGINES IN GENERAL; COOLING OF INTERNAL-COMBUSTION ENGINES
    • F01P9/00—Cooling having pertinent characteristics not provided for in, or of interest apart from, groups F01P1/00 - F01P7/00
    • F01P9/06—Cooling having pertinent characteristics not provided for in, or of interest apart from, groups F01P1/00 - F01P7/00 by use of refrigerating apparatus, e.g. of compressor or absorber type
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
    • F01P—COOLING OF MACHINES OR ENGINES IN GENERAL; COOLING OF INTERNAL-COMBUSTION ENGINES
    • F01P2037/00—Controlling

Definitions

  • the invention relates to the technical field of new energy application, in particular to a method and a system for controlling engine temperature.
  • An engine is a machine that converts a certain type of energy into mechanical energy. Its function is to convert the chemical energy of liquid or gas combustion into heat by combustion, and then convert the heat energy into mechanical energy through expansion and externally output power, so that the automobile and the aircraft And the ship can operate normally.
  • a large amount of heat is generated in the engine work, which not only affects the working efficiency of the engine, but also, if the engine is operated in a high temperature environment for a long time, it is easy to age, thereby reducing the service life of the engine.
  • a motor vehicle generally uses a water-cooled type to dissipate heat from the engine.
  • the water-cooled heat-dissipating system is composed of a water pump, a radiator, a fan, a thermostat, and a water jacket, and uses the circulation of the cooling water to heat the high-temperature parts. Dissipating to the atmosphere through the radiator to maintain the normal operating temperature of the engine not only increases the heat dissipation cost of the engine, but also causes a large amount of waste of resources.
  • the main object of the present invention is to provide a method and system for controlling engine temperature, which aims to solve the problem that a complex heat dissipation system is formed by a plurality of heat dissipating devices to dissipate heat from the engine and dissipate excess heat to the atmosphere.
  • the present invention provides a method of controlling an engine temperature, wherein an outer surface of the engine is provided with a semiconductor refrigeration assembly, and the method for controlling the temperature of the engine includes the following steps:
  • the heat dissipation operation is performed on the engine according to the temperature control mode corresponding to the preset temperature range with the highest temperature, and an alarm operation is performed.
  • the temperature control mode of the semiconductor refrigeration component includes a preset heat dissipation duration and/or a preset number of semiconductor refrigeration and cooling fins, and the temperature control mode pair of the semiconductor refrigeration component corresponding to the matched preset temperature interval is used.
  • the steps of the engine performing a heat dissipation operation include:
  • the heat dissipation operation is performed by matching the heat dissipation duration corresponding to the preset temperature interval and/or the number of refrigerant sheets in the semiconductor refrigeration unit.
  • the step of performing the heat dissipation operation by using the matching heat dissipation duration corresponding to the preset temperature interval and/or the number of the cooling fins in the semiconductor refrigeration component includes:
  • the present invention also provides a method for controlling engine temperature, wherein an outer surface of the engine is provided with a semiconductor refrigeration assembly, and the method for controlling the temperature of the engine includes:
  • the engine is subjected to a heat dissipation operation using a temperature control mode of the semiconductor refrigeration unit corresponding to the matched preset temperature interval.
  • the step of performing the heat dissipation operation of the engine by using the temperature control mode of the semiconductor refrigeration component corresponding to the matched preset temperature interval is performed:
  • the step of performing the heat dissipation operation on the engine by using the temperature control mode of the semiconductor refrigeration component corresponding to the matched preset temperature interval further includes:
  • the heat dissipation operation is performed on the engine according to the temperature control mode corresponding to the preset temperature range with the highest temperature, and an alarm operation is performed.
  • the temperature control mode of the semiconductor refrigeration component includes a preset heat dissipation duration and/or a preset number of semiconductor refrigeration and cooling fins, and the temperature control mode pair of the semiconductor refrigeration component corresponding to the matched preset temperature interval is used.
  • the steps of the engine performing a heat dissipation operation include:
  • the heat dissipation operation is performed by matching the heat dissipation duration corresponding to the preset temperature interval and/or the number of refrigerant sheets in the semiconductor refrigeration unit.
  • the step of performing the heat dissipation operation by using the matching heat dissipation duration corresponding to the preset temperature interval and/or the number of the cooling fins in the semiconductor refrigeration component includes:
  • the present invention also provides a control system for an engine temperature
  • the outer surface of the engine is provided with a semiconductor refrigeration assembly
  • the control system for the engine temperature includes:
  • a first determining module configured to acquire a current temperature of the engine, and determine whether the current temperature is greater than a preset temperature threshold
  • a second determining module configured to determine a preset temperature interval that matches a current temperature of the engine when the current temperature is greater than a preset temperature threshold
  • the first heat dissipation module is configured to perform a heat dissipation operation on the engine by using a temperature control mode of the semiconductor refrigeration component corresponding to the matched preset temperature interval.
  • the engine temperature control system further comprises:
  • connection module configured to conduct a direct connection between the semiconductor refrigeration component and the battery, to transfer power generated by the semiconductor refrigeration component to a battery connected to the semiconductor refrigeration component, wherein the semiconductor refrigeration component will absorb heat Convert to power.
  • the engine temperature control system further comprises:
  • the second heat dissipation module is configured to perform heat dissipation operation on the engine according to a temperature control mode corresponding to a preset temperature range with the highest temperature when the current temperature is greater than a temperature of all the preset temperature intervals, and perform an alarm operation.
  • the temperature control mode of the semiconductor refrigeration component includes a preset heat dissipation time and/or a preset number of semiconductor refrigeration and cooling fins, and the first heat dissipation module is further configured to:
  • the heat dissipation operation is performed by matching the heat dissipation duration corresponding to the preset temperature interval and/or the number of refrigerant sheets in the semiconductor refrigeration unit.
  • the first heat dissipation module is further configured to:
  • the invention determines whether the current temperature is greater than a preset temperature threshold by acquiring a current temperature of the engine, and determines a preset temperature interval that the current temperature of the engine matches when the current temperature is greater than a preset temperature threshold, and adopts a matching preset temperature interval corresponding to
  • the temperature control mode of the semiconductor refrigeration unit performs heat dissipation operation on the engine. Since the present invention pre-stages the temperature that can be achieved by the engine during operation into a plurality of preset temperature intervals, each preset temperature interval corresponds to a temperature control mode of a semiconductor refrigeration component, and each interval is preset after starting the engine operation.
  • FIG. 1 is a schematic flow chart of a first embodiment of a method for controlling engine temperature according to the present invention
  • FIG. 2 is a schematic flow chart of a second embodiment of a method for controlling engine temperature according to the present invention.
  • FIG. 3 is a schematic flow chart of a third embodiment of a method for controlling engine temperature according to the present invention.
  • FIG. 4 is a schematic flow chart of a fourth embodiment of a method for controlling engine temperature according to the present invention.
  • FIG. 5 is a schematic flowchart of a refinement step of step S13 in the fourth embodiment shown in FIG. 4 according to the present invention.
  • Figure 6 is a schematic diagram of the functional modules of the first embodiment of the engine temperature control system of the present invention.
  • Figure 7 is a schematic diagram of functional modules of a second embodiment of the engine temperature control system of the present invention.
  • Figure 8 is a schematic diagram of functional modules of a third embodiment of the engine temperature control system of the present invention.
  • the present invention provides a method of controlling engine temperature.
  • FIG. 1 there is shown a flow chart of a first embodiment of a method for controlling engine temperature according to the present invention.
  • the method for controlling the engine temperature includes:
  • Step S10 obtaining a current temperature of the engine, and determining whether the current temperature is greater than a preset temperature threshold
  • the preset temperature threshold may be a normal temperature of 25 ° C, or may be a temperature that ensures the normal operation of the engine.
  • Step S20 determining a preset temperature interval that the current temperature of the engine matches when the current temperature is greater than the preset temperature threshold
  • a plurality of preset temperature intervals are preset in the device, for example, 25 ° C ⁇ T1 ⁇ 50 ° C, 50 ° C ⁇ T1 ⁇ 80 ° C and 80 ° C ⁇ T1 ⁇ 100 ° C.
  • the current temperature value of the engine is compared with each temperature in the preset temperature interval to determine a preset temperature interval that the current temperature of the engine matches.
  • Step S30 performing heat dissipation operation on the engine by using a temperature control mode of the semiconductor refrigeration component corresponding to the matched preset temperature interval.
  • a temperature control mode corresponding to one semiconductor refrigeration component is set in the device in advance, and after determining a preset temperature interval matched by the current temperature of the engine, and further preset from the device
  • the preset temperature range matched with the current temperature is selected to correspond to the temperature control mode of the semiconductor refrigeration component
  • the engine is subjected to a heat dissipation operation according to the temperature control mode of the semiconductor refrigeration component.
  • the outer surface of the engine is bonded with a plurality of semiconductor refrigerating sheets.
  • the cooling principle of the semiconductor refrigerating sheet is to attach the cold end of the semiconductor refrigerating sheet to the outside of the engine, and the hot end and the temperature difference semiconductor sheet power generating sheet in the semiconductor refrigerating unit are performed.
  • the cold end of the semiconductor refrigerating sheet absorbs excess heat generated by the engine, and the hot end of the semiconductor refrigerating sheet exotherms to perform a heat dissipating operation on the engine.
  • the number of the semiconductor refrigerating sheets depends on the actual conditions of the engine, and the number of the semiconductor refrigerating sheets is not limited in this embodiment.
  • the different temperature control modes of the semiconductor refrigeration components correspond to different preset temperature intervals to achieve heat dissipation operation for different current temperatures of the engine.
  • the temperature control mode of the specific semiconductor refrigeration component of the device is matched as shown in Table 1.
  • Preset temperature interval Temperature control mode of semiconductor refrigeration components 25°C ⁇ T1 ⁇ 50°C First temperature control mode 50 ° C ⁇ T1 ⁇ 80 ° C Second temperature control mode 80°C ⁇ T1 ⁇ 100°C Third temperature control mode
  • the first temperature control mode can be understood as a semiconductor refrigeration chip that is turned on by 1/3, the voltage applied to the semiconductor refrigeration chip is 3V, and the heat dissipation time of the engine is 2 minutes;
  • the second temperature control mode can be understood.
  • the voltage applied to the semiconductor refrigerating sheet is 6V and the heat dissipation time of the engine is 5 minutes;
  • the third temperature control mode can be understood as turning on all the semiconductor refrigerating sheets, plus The voltage on the semiconductor cooling sheet was 12 V and the heat dissipation time for the engine was 10 minutes.
  • the detection is performed.
  • obtaining the current temperature of the engine is 80 ° C
  • determining that the current temperature of the engine matches the preset temperature interval is 50 ° C ⁇ T1 ⁇ 80 ° C
  • the heat dissipation time set in the control mode is 5 minutes
  • the current temperature of the engine is detected to be 45 ° C, and the engine is subjected to heat dissipation operation according to the first temperature control mode in which the current temperature of the engine is 45 ° C, and so on. I will not repeat them here.
  • the current temperature of the engine is obtained to determine whether the current temperature is greater than a preset temperature threshold.
  • the preset temperature interval matched by the current temperature of the engine is determined, and the matched preset temperature interval is adopted.
  • the temperature control mode of the corresponding semiconductor refrigeration component performs a heat dissipation operation on the engine. Since the present invention pre-stages the temperature that can be achieved by the engine during operation into a plurality of preset temperature intervals, each preset temperature interval corresponds to a temperature control mode of a semiconductor refrigeration component, and each interval is preset after starting the engine operation.
  • FIG. 2 a schematic flowchart of a second embodiment of a method for controlling engine temperature according to the present invention is proposed.
  • the engine temperature is simultaneously performed while the S30 is being executed.
  • the control methods include:
  • step S40 the semiconductor refrigeration component is directly connected to the battery to transfer the power generated by the semiconductor refrigeration component to the battery connected to the semiconductor refrigeration component, wherein the semiconductor refrigeration component converts the absorbed heat into a quantity of electricity.
  • each of the temperature difference semiconductor wafers in the conductor refrigeration assembly is associated with each of the semiconductor refrigeration sheets in the conductor refrigeration assembly, wherein the end of the temperature difference semiconductor wafer associated with the hot end of the semiconductor refrigeration sheet absorbs the semiconductor refrigeration sheet.
  • the heat released from the hot end forms a temperature difference from the cold end of the temperature difference semiconductor piece, and the temperature difference semiconductor piece converts the absorbed heat into a quantity according to the Seebeck effect, and turns on the temperature difference semiconductor piece in the semiconductor refrigeration component and the device
  • the battery is connected to transfer the amount of electricity generated by the temperature difference semiconductor chip to the battery connected to the semiconductor refrigeration unit.
  • the present invention does not limit the low temperature holding mode of the cold end of the temperature difference semiconductor.
  • the first temperature control mode of the semiconductor refrigeration component when the first temperature control mode of the semiconductor refrigeration component is activated, 1/3 of the semiconductor refrigeration chip is turned on in the first temperature control mode, and the heat absorbed when the temperature difference semiconductor chip is energized
  • the temperature difference semiconductor piece that is consistent with the number and position of the semiconductor cooling fins of the first temperature control mode may be turned on; when the second temperature control mode or the third temperature control mode of the semiconductor refrigeration component is activated.
  • the manner in which the number and position of the temperature difference semiconductor chips are turned on the manner in which the number and position of the temperature difference semiconductor chips are turned on in the first temperature control mode can be referred to, and details are not described herein again.
  • the present embodiment directly connects the semiconductor refrigeration unit to the battery to transfer the amount of electricity generated by the semiconductor refrigeration unit to the battery to which the semiconductor refrigeration unit is connected, wherein the semiconductor refrigeration unit converts the absorbed heat into a quantity of electricity. Due to the association between the hot end of the temperature difference semiconductor wafer in the semiconductor refrigeration module and the hot end of the semiconductor refrigeration chip, the temperature difference semiconductor wafer recovers the waste heat of the engine absorbed, and converts the absorbed heat into a current according to the Seebeck effect. Thereby realizing resource reuse and avoiding waste of resources.
  • FIG. 3 a schematic flowchart of a third embodiment of a method for controlling engine temperature according to the present invention is proposed.
  • the method for controlling the engine temperature includes :
  • step S50 when the current temperature is greater than the temperature of all the preset temperature intervals, the heat dissipation operation is performed on the engine according to the temperature control mode corresponding to the preset temperature range with the highest temperature, and an alarm operation is performed.
  • the engine is dissipated according to the temperature control mode corresponding to the highest temperature preset temperature interval, for example, according to the pre-position of 100 ° C
  • the third temperature control mode corresponding to the temperature interval is used to perform heat dissipation operation on the engine, and at the same time, an alarm command is sent to the alarm system in the device to perform an alarm until the current temperature of the acquired engine matches the corresponding preset temperature interval.
  • the semiconductor refrigeration component is stopped to perform a heat dissipation operation on the engine, thereby The engine can work at room temperature.
  • the heat dissipation operation is performed on the engine according to the temperature control mode corresponding to the preset temperature range with the highest temperature, and an alarm operation is performed, by lowering the temperature of the transmitter.
  • FIG. 4 is a schematic flowchart of a fourth embodiment of a method for controlling engine temperature according to the present invention.
  • a method for controlling engine temperature includes:
  • Step S11 obtaining a current temperature of the engine, and determining whether the current temperature is greater than a preset temperature threshold
  • Step S12 determining a preset temperature interval that the current temperature of the engine matches when the current temperature is greater than the preset temperature threshold
  • Step S11 and step S12 in the third embodiment of the present invention are similar to those described in step S10 and step S20 in the first embodiment shown in FIG. 1, and details are not described herein again.
  • step S13 the heat dissipation operation is performed by using the heat dissipation duration corresponding to the matched preset temperature interval and/or the number of the cooling sheets in the semiconductor refrigeration unit.
  • the temperature control mode of the semiconductor refrigeration component corresponding to the preset temperature interval matched with the temperature is adopted, and the temperature control mode of the semiconductor refrigeration component is corresponding to The heat dissipation time and/or the number of cooling fins in the semiconductor refrigeration unit heats the engine.
  • the current temperature of the engine is detected to be 75 ° C, and the second temperature control corresponding to the preset temperature interval of 50 ° C ⁇ T1 ⁇ 80 ° C matched with the 75 ° C is adopted.
  • the mode performs a heat dissipation operation on the engine, and the number of the cooling sheets in the semiconductor refrigeration unit corresponding to the second temperature control mode and the heat dissipation time corresponding to the second temperature control mode are used to dissipate the engine during the heat dissipation process;
  • the current temperature of the engine is detected to be 75 ° C, and the second temperature control mode corresponding to the predetermined temperature interval of 50 ° C ⁇ T1 ⁇ 80 ° C matched with the 75 ° C is used.
  • the engine performs a heat dissipation operation, and the heat dissipation operation is performed on the engine by using the number of the cooling fins in the semiconductor refrigeration unit corresponding to the second temperature control mode during the heat dissipation process, but the heat dissipation duration corresponding to the second temperature control mode is not limited.
  • the current temperature of the engine is obtained to determine whether the current temperature is greater than a preset temperature threshold.
  • the preset temperature interval matched by the current temperature of the engine is determined, and the matched preset temperature interval is adopted.
  • the corresponding heat dissipation time and/or the number of the cooling fins in the semiconductor refrigeration unit perform heat dissipation operation to avoid excessive absorption of heat of the engine or insufficient heat dissipation, thereby causing an operational burden on the engine.
  • FIG. 5 is a schematic flowchart of the refinement step of step S13 in the fourth embodiment of the present invention.
  • the refinement step of step S13 includes:
  • Step S131 obtaining a number of cooling pieces corresponding to the matched preset temperature interval
  • the number of semiconductor cooling fins corresponding to each temperature control mode of the semiconductor refrigeration component is different, and the positions of the semiconductor cooling fins corresponding to the respective temperature control modes are also different.
  • the design of the position of the semiconductor refrigerating sheet is related to the structure of the engine, and the position of the semiconductor refrigerating sheet of the present invention is not limited.
  • Step S132 powering on the cooling sheet corresponding to the number of cooling pieces obtained in the semiconductor refrigeration unit, and controlling the heat dissipation time corresponding to the preset temperature interval matched by the cooling operation of the cooling piece, and then powering down to perform heat dissipation operation on the engine.
  • the semiconductor refrigerating sheet When the number of semiconductor refrigerating sheets corresponding to the temperature control mode of the semiconductor refrigeration unit matched with the preset temperature interval is obtained, the semiconductor refrigerating sheet is powered on, the heat dissipation operation is performed on the engine, and the heat dissipation operation is performed to the temperature of the semiconductor refrigeration unit.
  • the semiconductor cooling chip When the preset heat dissipation duration corresponding to the control mode is controlled, the semiconductor cooling chip is controlled to be powered down.
  • the cooling piece corresponding to the number of the cooling pieces obtained in the semiconductor refrigeration component is powered on, and the heat dissipation time corresponding to the preset temperature interval matched by the cooling operation of the cooling piece is controlled. Power down to dissipate heat from the engine, allowing the engine to operate stably at normal operating temperatures.
  • the invention further provides a control system for engine temperature.
  • Figure 6 is a schematic diagram of the functional modules of the first embodiment of the engine temperature control system of the present invention.
  • the engine temperature control system includes: a first determining module 10, a second determining module 20, and a first heat dissipation module 30.
  • the first determining module 10 is configured to acquire a current temperature of the engine, and determine whether the current temperature is greater than a preset temperature threshold;
  • the first determining module 10 acquires the current temperature of the engine every preset time interval, and determines whether the current temperature of the engine is greater than the pre-predetermined time.
  • the preset temperature threshold may be a normal temperature of 25 ° C, or may be a temperature that ensures the normal operation of the engine.
  • the second determining module 20 is configured to determine a preset temperature interval that matches a current temperature of the engine when the current temperature is greater than the preset temperature threshold;
  • a plurality of preset temperature intervals are preset in the device, for example, 25 ° C ⁇ T1 ⁇ 50 ° C, 50 ° C ⁇ T1 ⁇ 80 ° C and 80 ° C ⁇ T1 ⁇ 100 ° C.
  • the second determining module 20 compares the current temperature value of the engine with each temperature in the preset temperature interval to determine the current temperature of the engine.
  • the preset temperature range that is matched.
  • the first heat dissipation module 30 is configured to perform heat dissipation operation on the engine by using a temperature control mode of the semiconductor refrigeration component corresponding to the matched preset temperature interval.
  • the temperature control mode corresponding to one semiconductor refrigeration component is set in the device in advance, and after the second determining module 20 determines the preset temperature interval that the current temperature of the engine matches, the first heat dissipation module 30. From a temperature control mode of the semiconductor refrigeration component preset in the device, selecting a preset temperature interval matched to the current temperature corresponds to a temperature control mode of the semiconductor refrigeration component, and the engine is controlled according to a temperature control mode of the semiconductor refrigeration component Perform heat dissipation operations.
  • the outer surface of the engine is bonded with a plurality of semiconductor refrigerating sheets.
  • the cooling principle of the semiconductor refrigerating sheet is to attach the cold end of the semiconductor refrigerating sheet to the outside of the engine, and the hot end and the temperature difference semiconductor sheet power generating sheet in the semiconductor refrigerating unit are performed.
  • the cold end of the semiconductor refrigerating sheet absorbs excess heat generated by the engine, and the hot end of the semiconductor refrigerating sheet exotherms to perform a heat dissipating operation on the engine.
  • the number of the semiconductor refrigerating sheets depends on the actual conditions of the engine, and the number of the semiconductor refrigerating sheets is not limited in this embodiment.
  • the different temperature control modes of the semiconductor refrigeration components correspond to different preset temperature intervals to achieve heat dissipation operation for different current temperatures of the engine.
  • the temperature control mode of the specific semiconductor refrigeration component of the device is matched as shown in Table 1.
  • Preset temperature interval Temperature control mode of semiconductor refrigeration components 25°C ⁇ T1 ⁇ 50°C First temperature control mode 50 ° C ⁇ T1 ⁇ 80 ° C Second temperature control mode 80°C ⁇ T1 ⁇ 100°C Third temperature control mode
  • the first temperature control mode can be understood as a semiconductor refrigeration chip that is turned on by 1/3, the voltage applied to the semiconductor refrigeration chip is 3V, and the heat dissipation time of the engine is 2 minutes;
  • the second temperature control mode can be understood.
  • the voltage applied to the semiconductor refrigerating sheet is 6V and the heat dissipation time of the engine is 5 minutes;
  • the third temperature control mode can be understood as turning on all the semiconductor refrigerating sheets, plus The voltage on the semiconductor cooling sheet was 12 V and the heat dissipation time for the engine was 10 minutes.
  • the detection is performed.
  • obtaining the current temperature of the engine is 80 ° C
  • determining that the current temperature of the engine matches the preset temperature interval is 50 ° C ⁇ T1 ⁇ 80 ° C
  • the heat dissipation time set in the control mode is 5 minutes
  • the current temperature of the engine is detected to be 45 ° C, and the engine is subjected to heat dissipation operation according to the first temperature control mode in which the current temperature of the engine is 45 ° C, and so on. I will not repeat them here.
  • the first heat dissipation module 30 is further configured to perform a heat dissipation operation by using a matching heat dissipation time period corresponding to the preset temperature interval and/or the number of the cooling sheets in the semiconductor refrigeration component.
  • the first heat dissipation module 30 when it is detected that the current temperature of the engine is a certain temperature, the first heat dissipation module 30 adopts a temperature control mode of the semiconductor refrigeration component corresponding to the preset temperature interval matched by the temperature, and passes through the semiconductor refrigeration component.
  • the temperature control mode corresponds to the heat dissipation time and/or the number of cooling fins in the semiconductor refrigeration unit to perform heat dissipation operation on the engine. For example, when the engine is running at a lower temperature ambient temperature, the current temperature of the engine is detected to be 75 ° C, and the second temperature control corresponding to the preset temperature interval of 50 ° C ⁇ T1 ⁇ 80 ° C matched with the 75 ° C is adopted.
  • the mode performs a heat dissipation operation on the engine, and the number of the cooling sheets in the semiconductor refrigeration unit corresponding to the second temperature control mode and the heat dissipation time corresponding to the second temperature control mode are used to dissipate the engine during the heat dissipation process;
  • the current temperature of the engine is detected to be 75 ° C, and the second temperature control mode corresponding to the predetermined temperature interval of 50 ° C ⁇ T1 ⁇ 80 ° C matched with the 75 ° C is used.
  • the engine performs a heat dissipation operation, and the heat dissipation operation is performed on the engine by using the number of the cooling fins in the semiconductor refrigeration unit corresponding to the second temperature control mode during the heat dissipation process, but the heat dissipation duration corresponding to the second temperature control mode is not limited.
  • the first heat dissipation module 30 is further configured to obtain a number of cooling pieces corresponding to the matched preset temperature interval;
  • the first heat dissipation module 30 acquires a temperature control mode of the semiconductor refrigeration component corresponding to the preset temperature interval, thereby acquiring the temperature of the semiconductor refrigeration component.
  • the number of semiconductor cooling fins that need to be turned on in the control mode is not limited to, but not limited to, but not limited to, but not limited to, but not limited to, but not limited to, but not limited to, but not limited to, but not limited to, but not limited to, the first heat dissipation module 30 acquires a temperature control mode of the semiconductor refrigeration component corresponding to the preset temperature interval, thereby acquiring the temperature of the semiconductor refrigeration component. The number of semiconductor cooling fins that need to be turned on in the control mode.
  • the number of semiconductor cooling fins corresponding to each temperature control mode of the semiconductor refrigeration component is different, and the positions of the semiconductor cooling fins corresponding to the respective temperature control modes are also different.
  • the design of the position of the semiconductor refrigerating sheet is related to the structure of the engine, and the position of the semiconductor refrigerating sheet of the present invention is not limited.
  • the first heat dissipation module 30 is further configured to power on the cooling sheet corresponding to the number of cooling pieces obtained in the semiconductor refrigeration component, and control the heat dissipation time corresponding to the preset temperature interval matched by the cooling operation of the cooling piece, and then power down to the engine. Perform heat dissipation operations.
  • the first heat dissipation module 30 When acquiring the number of semiconductor refrigeration sheets corresponding to the temperature control mode of the semiconductor refrigeration component that matches the preset temperature interval, the first heat dissipation module 30 powers up the semiconductor refrigeration chip, performs a heat dissipation operation on the engine, and performs the heat dissipation operation to the When the temperature control mode of the semiconductor refrigeration component corresponds to a preset heat dissipation time, the semiconductor cooling chip is controlled to be powered down.
  • the first determining module 10 obtains the current temperature of the engine, and determines whether the current temperature is greater than a preset temperature threshold.
  • the second determining module 20 determines a preset that matches the current temperature of the engine.
  • the first heat dissipation module 30 performs a heat dissipation operation on the engine by using a temperature control mode of the semiconductor refrigeration component corresponding to the matched preset temperature interval. Since the present invention pre-stages the temperature that can be achieved by the engine during operation into a plurality of preset temperature intervals, each preset temperature interval corresponds to a temperature control mode of a semiconductor refrigeration component, and each interval is preset after starting the engine operation.
  • the engine temperature control system further includes: a connection module 40.
  • the connection module 40 is configured to conduct a direct connection between the semiconductor refrigeration component and the battery to transfer the power generated by the semiconductor refrigeration component to the battery connected to the semiconductor refrigeration component, wherein the semiconductor refrigeration component converts the absorbed heat into a quantity of electricity.
  • each of the temperature difference semiconductor wafers in the conductor refrigeration assembly is associated with each of the semiconductor refrigeration sheets in the conductor refrigeration assembly, wherein the end of the temperature difference semiconductor wafer associated with the hot end of the semiconductor refrigeration sheet absorbs the semiconductor refrigeration sheet.
  • the heat released from the hot end forms a temperature difference from the cold end of the temperature difference semiconductor piece, and the temperature difference semiconductor piece converts the absorbed heat into a quantity according to the Seebeck effect, and the connection module 40 turns on the temperature difference semiconductor piece in the semiconductor refrigeration component and the
  • the connection of the battery in the device is to transfer the amount of electricity generated by the temperature difference semiconductor chip to the battery connected to the semiconductor refrigeration unit.
  • the present invention does not limit the low temperature holding mode of the cold end of the temperature difference semiconductor.
  • the first temperature control mode of the semiconductor refrigeration component when the first temperature control mode of the semiconductor refrigeration component is activated, 1/3 of the semiconductor refrigeration chip is turned on in the first temperature control mode, and the heat absorbed when the temperature difference semiconductor chip is energized
  • the temperature difference semiconductor piece that is consistent with the number and position of the semiconductor cooling fins of the first temperature control mode may be turned on; when the second temperature control mode or the third temperature control mode of the semiconductor refrigeration component is activated.
  • the manner in which the number and position of the temperature difference semiconductor chips are turned on the manner in which the number and position of the temperature difference semiconductor chips are turned on in the first temperature control mode can be referred to, and details are not described herein again.
  • the present embodiment directly connects the semiconductor refrigeration unit to the battery to transfer the amount of electricity generated by the semiconductor refrigeration unit to the battery to which the semiconductor refrigeration unit is connected, wherein the semiconductor refrigeration unit converts the absorbed heat into a quantity of electricity. Due to the association between the hot end of the temperature difference semiconductor wafer in the semiconductor refrigeration module and the hot end of the semiconductor refrigeration chip, the temperature difference semiconductor wafer recovers the waste heat of the engine absorbed, and converts the absorbed heat into a current according to the Seebeck effect. Thereby realizing resource reuse and avoiding waste of resources.
  • the engine temperature control system further includes: a second heat dissipation module 50.
  • the second heat dissipation module 50 is configured to perform a heat dissipation operation on the engine according to a temperature control mode corresponding to a preset temperature range with the highest temperature when the current temperature is greater than the temperature of all the preset temperature intervals, and perform an alarm operation.
  • the second heat dissipation module 50 When the current temperature of the engine is greater than all the preset temperature intervals, such as greater than 100 ° C, the second heat dissipation module 50 performs a heat dissipation operation on the engine according to a temperature control mode corresponding to the highest temperature preset temperature interval, for example, according to The third temperature control mode corresponding to the preset temperature range where 100 °C is located performs heat dissipation operation on the engine, and at the same time, sends an alarm command to the alarm system in the device to perform an alarm until the current temperature of the obtained engine matches the corresponding pre- Set the temperature range.
  • the semiconductor refrigeration component is stopped to perform a heat dissipation operation on the engine, thereby The engine can work at room temperature.
  • the heat dissipation operation is performed on the engine according to the temperature control mode corresponding to the preset temperature range with the highest temperature, and an alarm operation is performed, by lowering the temperature of the transmitter.

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Abstract

一种发动机温度的控制方法及系统，所述发动机外表面设置有半导体制冷组件，该方法包括：获取发动机的当前温度，确定当前温度是否大于预设温度阈值（S10）；在当前温度大于预设温度阈值时，确定发动机的当前温度所匹配的预设温度区间（S20）；采用匹配的预设温度区间对应的半导体制冷组件的温控模式对发动机进行散热操作（S30）。该控制方法不仅降低了散热成本，而且使得对发动机的散热更加精细，从而保证发动机可在常温下运行。

Description

发动机温度的控制方法及系统
技术领域
本发明涉及新能源应用技术领域，尤其涉及一种发动机温度的控制方法及系统。
背景技术
发动机是将某一种型式的能量转换为机械能的机器，其作用是将液体或气体燃烧的化学能通过燃烧后转化为热能，再把热能通过膨胀转化为机械能并对外输出动力，使得汽车、飞机以及轮船可正常运转。但在发动机工作工程中会产生大量的热量，不仅影响发动机的工作效率，而且，若发动机长时间在高温环境下工作，易于老化，从而降低发动机的使用寿命。
目前，对发动机进行散热的方式有多种，但每种散热方式都需要多个散热装置组成一套复杂的散热系统对发动机进行散热，并将多余的热量散发到大气中，以维持发动机的正常工作温度，例如，机动车一般采用水冷却式对发动机进行散热，该水冷式散热系统是由水泵、散热器、风扇、节温器和水套等组成，利用冷却水的循环将高温零件的热量通过散热器散发到大气中，从而维持发动机的正常工作温度，不仅增加了发动机的散热成本，而且造成大量的资源浪费。
发明内容
本发明的主要目的在于提供一种发动机温度的控制方法及系统，旨在解决当前通过多个散热装置组成一套复杂的散热系统对发动机进行散热，并将多余的热量散发到大气中的问题。
为实现上述目的，本发明提供一种发动机温度的控制方法，所述发动机外表面设置有半导体制冷组件，所述发动机温度的控制方法包括以下步骤：
获取发动机的当前温度，确定所述当前温度是否大于预设温度阈值；
在所述当前温度大于预设温度阈值时，确定所述发动机的当前温度所匹配的预设温度区间；
采用匹配的预设温度区间对应的半导体制冷组件的温控模式对所述发动机进行散热操作，并导通所述半导体制冷组件与蓄电池直接的连接，以将所述半导体制冷组件产生的电量传输至所述半导体制冷组件连接的蓄电池中，其中所述半导体制冷组件将吸收的热量转换为电量；
在所述当前温度大于所有的预设温度区间的温度时，则按照温度最高的所述预设温度区间对应的温控模式对所述发动机进行散热操作，并进行报警操作。
其中，所述半导体制冷组件的温控模式包括预设的散热时长及/或预设的半导体制冷制冷片的数量，则所述采用匹配的预设温度区间对应的半导体制冷组件的温控模式对所述发动机进行散热操作的步骤包括：
采用匹配的所述预设温度区间对应的散热时长及/或半导体制冷组件中制冷片的数量进行散热操作。
其中，所述采用匹配的预设温度区间对应的散热时长及/或半导体制冷组件中制冷片的数量进行散热操作的步骤包括：
获取匹配的预设温度区间对应的制冷片数量；
对所述半导体制冷组件中获取的制冷片数量对应的制冷片上电，并控制所述制冷片上电运行所述匹配的预设温度区间对应的散热时长后掉电，以对所述发动机进行散热操作。
此外，为实现上述目的，本发明还提供一种发动机温度的控制方法，所述发动机外表面设置有半导体制冷组件，所述发动机温度的控制方法包括：
获取发动机的当前温度，确定所述当前温度是否大于预设温度阈值；
在所述当前温度大于预设温度阈值时，确定所述发动机的当前温度所匹配的预设温度区间；
采用匹配的预设温度区间对应的半导体制冷组件的温控模式对所述发动机进行散热操作。
其中，所述采用匹配的预设温度区间对应的半导体制冷组件的温控模式对所述发动机进行散热操作的步骤的同时，执行步骤：
导通所述半导体制冷组件与蓄电池直接的连接，以将所述半导体制冷组件产生的电量传输至所述半导体制冷组件连接的蓄电池中，其中所述半导体制冷组件将吸收的热量转换为电量。
其中，所述采用匹配的预设温度区间对应的半导体制冷组件的温控模式对所述发动机进行散热操作的步骤之前还包括：
在所述当前温度大于所有的预设温度区间的温度时，则按照温度最高的所述预设温度区间对应的温控模式对所述发动机进行散热操作，并进行报警操作。
其中，所述半导体制冷组件的温控模式包括预设的散热时长及/或预设的半导体制冷制冷片的数量，则所述采用匹配的预设温度区间对应的半导体制冷组件的温控模式对所述发动机进行散热操作的步骤包括：
采用匹配的所述预设温度区间对应的散热时长及/或半导体制冷组件中制冷片的数量进行散热操作。
其中，所述采用匹配的预设温度区间对应的散热时长及/或半导体制冷组件中制冷片的数量进行散热操作的步骤包括：
获取匹配的预设温度区间对应的制冷片数量；
对所述半导体制冷组件中获取的制冷片数量对应的制冷片上电，并控制所述制冷片上电运行所述匹配的预设温度区间对应的散热时长后掉电，以对所述发动机进行散热操作。
此外，为实现上述目的，本发明还提供一种发动机温度的控制系统，所述发动机外表面设置有半导体制冷组件，所述发动机温度的控制系统包括：
第一确定模块，用于获取发动机的当前温度，确定所述当前温度是否大于预设温度阈值；
第二确定模块，用于在所述当前温度大于预设温度阈值时，确定所述发动机的当前温度所匹配的预设温度区间；
第一散热模块，用于采用匹配的预设温度区间对应的半导体制冷组件的温控模式对所述发动机进行散热操作。
其中，所述发动机温度的控制系统还包括：
连接模块，用于导通所述半导体制冷组件与蓄电池直接的连接，以将所述半导体制冷组件产生的电量传输至所述半导体制冷组件连接的蓄电池中，其中所述半导体制冷组件将吸收的热量转换为电量。
其中，所述发动机温度的控制系统还包括：
第二散热模块，用于在所述当前温度大于所有的预设温度区间的温度时，则按照温度最高的预设温度区间对应的温控模式对所述发动机进行散热操作，并进行报警操作。
其中，所述半导体制冷组件的温控模式包括预设的散热时长及/或预设的半导体制冷制冷片的数量，所述第一散热模块，还用于：
采用匹配的所述预设温度区间对应的散热时长及/或半导体制冷组件中制冷片的数量进行散热操作。
其中，所述第一散热模块，还用于：
获取匹配的预设温度区间对应的制冷片数量；
对所述半导体制冷组件中获取的制冷片数量对应的制冷片上电，并控制所述制冷片上电运行所述匹配的预设温度区间对应的散热时长后掉电，以对所述发动机进行散热操作。
本发明通过获取发动机的当前温度，确定当前温度是否大于预设温度阈值，在当前温度大于预设温度阈值时，确定发动机的当前温度所匹配的预设温度区间，采用匹配的预设温度区间对应的半导体制冷组件的温控模式对发动机进行散热操作。由于本发明预先将发动机在运行过程中能达到的温度细分成多个预设温度区间，每个预设温度区间对应一个半导体制冷组件的温控模式，在启动发动机运行后，每间隔预设时间检测该发动机的当前温度，确定该发动机的当前温度匹配的预设温度区间，根据该预设温度区间对应半导体制冷组件的温控模式对该发动机进行散热操作，因此不仅降低了散热成本，而且使得对发动机的散热更加精细，从而保证发动机可在常温下运行。
附图说明
图1为本发明发动机温度的控制方法的第一实施例的流程示意图；
图2为本发明发动机温度的控制方法的第二实施例的流程示意图；
图3为本发明发动机温度的控制方法的第三实施例的流程示意图；
图4为本发明发动机温度的控制方法的第四实施例的流程示意图；
图5为本发明图4所示的第四实施例中步骤S13的细化步骤的流程示意图；
图6为本发明发动机温度的控制系统的第一实施例的功能模块示意图；
图7为本发明发动机温度的控制系统的第二实施例的功能模块示意图；
图8为本发明发动机温度的控制系统的第三实施例的功能模块示意图。
本发明目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
具体实施方式
应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
基于上述问题，本发明提供一种发动机温度的控制方法。
参照图1，图1为本发明发动机温度的控制方法的第一实施例的流程示意图。
在本实施例中，所述发动机温度的控制方法包括：
步骤S10，获取发动机的当前温度，确定当前温度是否大于预设温度阈值；
在本实施例中，在检测到设备的发动机启动时，如检测到汽车的发动机启动时，每间隔预设时间获取该发动机的当前温度，判断该发动机的当前温度是否大于预设温度阈值。其中，该预设温度阈值可以是常温25℃，也可以是保证该发动机正常工作的温度。
步骤S20，在当前温度大于预设温度阈值时，确定发动机的当前温度所匹配的预设温度区间；
在该设备中预先设定了多个预设温度区间，例如， 25℃<T1≤50℃，50℃<T1≤80℃以及80℃<T1≤100℃。当确定该发动机的当前温度大于预设温度阈值时，将该发动机的当前温度值与预设温度区间中的各个温度进行比对，确定该发动机的当前温度所匹配的预设温度区间。
步骤S30，采用匹配的预设温度区间对应的半导体制冷组件的温控模式对发动机进行散热操作。
预先在该设备中设定了每一个预设温度区间都对应一个半导体制冷组件的温控模式，在确定该发动机的当前温度所匹配的预设温度区间后，进而从该设备中预先设定的半导体制冷组件的温控模式中，选择与该当前温度所匹配的预设温度区间对应半导体制冷组件的温控模式，根据半导体制冷组件的温控模式对该发动机进行散热操作。该发动机的外表面贴合有多圈半导体制冷片，该半导体制冷片的制冷原理是将半导体制冷片的冷端贴合在发动机外部，热端与该半导体制冷组件中的温差半导体片发电片进行关联，当对该半导体制冷片进行通电时，该半导体制冷片的冷端吸收发动机产生的多余热量，该半导体制冷片的热端进行放热，以实现对该发动机进行散热操作。其中，该半导体制冷片的数量根据该发动机的实际情况而定，本实施例不对该半导体制冷片的数量进行限定。
需要说明的是，当对该半导体制冷片进行通电时，加在该半导体制冷片上的电压越大，对该发动机的散热时长越长及/或半导体制冷片的通电数量越多，对该发动机的散热效果就越好，因此半导体制冷组件不同的温控模式对应不同的预设温度区间，以实现对发动机的不同当前温度进行散热操作。在该预设温度区间内，该设备具体的半导体制冷组件的温控模式的匹配如表1所示。
表1
预设温度区间 半导体制冷组件的温控模式
25℃<T1≤50℃ 第一温控模式
50℃<T1≤80℃ 第二温控模式
80℃<T1≤100℃ 第三温控模式
其中，该第一温控模式可以理解为导通1/3的半导体制冷片，加在该半导体制冷片上的电压为3V以及对该发动机的散热时长为2分钟；该第二温控模式可以理解为导通2/3的半导体制冷片，加在该半导体制冷片上的电压为6V以及对该发动机的散热时长为5分钟；该第三温控模式可以理解为导通全部的半导体制冷片，加在该半导体制冷片上的电压为12V以及对该发动机的散热时长为10分钟。
在采用该发动机的当前温度匹配的预设温度区间所对应的半导体制冷组件的温控模式，对发动机进行散热操作的过程中，按照该半导体制冷组件的温控模式运行到预设时间时，检测该发动机的当前温度所匹配的预设温度区间是否发生变化，若确定该发动机的当前温度所匹配的预设温度区间未发生变化，则控制该半导体制冷组件继续按照当前温度匹配的预设温度区间对该发动机进行散热操作，若确定该发动机的当前温度所匹配的预设温度区间发生变化，则控制该半导体制冷组件按照当前发生变化的温度匹配的预设温度区间对应的温控模式，对该发动机进行散热操作。例如，获取到该发动机的当前温度为80℃，通过与该设备中的预设温度区间中的温度值进行匹配，确定该发动机的当前温度匹配的预设温度区间为50℃<T1≤80℃，基于该50℃<T1≤80℃的预设温度区间，确定采用第二温控模式对该发动机进行散热操作，在按照该第二温控模式对该发动机散热过程中，达到该第二温控模式中设定的散热时长5分钟时，检测该发动机的当前温度为45℃，则根据该发动机的当前温度为45℃所匹配的第一温控模式对该发动机进行散热操作，依次类推，此处不再赘述。
本实施例通过获取发动机的当前温度，确定当前温度是否大于预设温度阈值，在当前温度大于预设温度阈值时，确定发动机的当前温度所匹配的预设温度区间，采用匹配的预设温度区间对应的半导体制冷组件的温控模式对发动机进行散热操作。由于本发明预先将发动机在运行过程中能达到的温度细分成多个预设温度区间，每个预设温度区间对应一个半导体制冷组件的温控模式，在启动发动机运行后，每间隔预设时间检测该发动机的当前温度，确定该发动机的当前温度匹配的预设温度区间，根据该预设温度区间对应半导体制冷组件的温控模式对该发动机进行散热操作，因此不仅降低了散热成本，而且使得对发动机的散热更加精细，从而保证发动机可在常温下运行。
进一步的，基于上述第一实施例，请参照图2，提出本发明发动机温度的控制方法的第二实施例的流程示意图，在该第二实施例中，在执行该S30的同时，该发动机温度的控制方法包括：
步骤S40，导通半导体制冷组件与蓄电池直接的连接，以将半导体制冷组件产生的电量传输至半导体制冷组件连接的蓄电池中，其中半导体制冷组件将吸收的热量转换为电量。
在本实施例中，导体制冷组件中的各个温差半导体片与该导体制冷组件中的各个半导体制冷片关联，其中，该温差半导体片与半导体制冷片的热端关联的那一端吸收半导体制冷片的热端放出的热量，与该温差半导体片的冷端形成温度差，该温差半导体片根据赛贝克效应将吸收到的热量转换为电量，导通半导体制冷组件中的温差半导体片与该设备中的蓄电池的连接，以将该温差半导体片产生的电量传输至半导体制冷组件连接的蓄电池中。本发明不对该温差半导体的冷端的低温保持方式不做限定。
可以理解的是，当启动该半导体制冷组件的第一温控模式时，在该第一温控模式下导通了1/3的半导体制冷片，当对该温差半导体片进行通电将吸收的热量转换成电量时，可只导通与该第一温控模式的半导体制冷片数量以及位置的一致的该温差半导体片；当启动该半导体制冷组件的第二温控模式或者第三温控模式时，对该温差半导体片的数量以及位置进行导通的方式，可参照在第一温控模式下对该温差半导体片的数量以及位置进行导通的方式一致，此处不再赘述。
本实施通过导通半导体制冷组件与蓄电池直接的连接，以将半导体制冷组件产生的电量传输至半导体制冷组件连接的蓄电池中，其中半导体制冷组件将吸收的热量转换为电量。由于半导体制冷组件中的温差半导体片的热端与半导体制冷片的热端的关联，该温差半导体片将吸收到的该发动机的废热量进行回收，根据赛贝克效应将吸收到的热量转化成电流，从而实现了资源再利用，避免了资源浪费。
进一步的，基于上述第一实施例，请参照图3，提出本发明发动机温度的控制方法的第三实施例的流程示意图，在该第三实施例中，S30之前，该发动机温度的控制方法包括：
步骤S50，在当前温度大于所有的预设温度区间的温度时，则按照温度最高的预设温度区间对应的温控模式对发动机进行散热操作，并进行报警操作。
在当该发动机的当前温度大于所有的预设温度区间时，如大于100℃，则按照温度最高的预设温度区间对应的温控模式对该发动机进行散热操作，例如，按照100℃所在的预设温度区间对应的第三温控模式对该发动机进行散热操作，同时，向该设备中的报警系统发送报警指令，进行报警，直至获取到的发动机的当前温度匹配相应的预设温度区间。
需要说明的是，当确定该发动机的当前温度小于预设温度阈值时，例如，在检测到该发动机的当前温度小于常温25℃时，则停止该半导体制冷组件对该发动机进行散热操作，从而使得该发动机可在常温下工作。
本实施例通过在当前温度大于所有的预设温度区间的温度时，则按照温度最高的预设温度区间对应的温控模式对发动机进行散热操作，并进行报警操作，通过降低该发送机的温度，避免该发动机长时间在高温情况下运行易于出现老化的问题。
进一步的，基于上述任一实施例，请参照图4，为本发明提出的发动机温度的控制方法的第四实施例的流程示意图，在该第四实施例中，发动机温度的控制方法包括：
步骤S11，获取发动机的当前温度，确定当前温度是否大于预设温度阈值；
步骤S12，在当前温度大于预设温度阈值时，确定发动机的当前温度所匹配的预设温度区间；
本发明第三实施例中的步骤S11以及步骤S12分别与图1所示的第一实施例中的步骤S10以及步骤S20描述的内容相似，此处不再赘述。
步骤S13，采用匹配的预设温度区间对应的散热时长及/或半导体制冷组件中制冷片的数量进行散热操作。
在本实施例中，在检测到该发动机的当前温度为某一温度时，采用与该温度匹配的预设温度区间对应的半导体制冷组件的温控模式，通过该半导体制冷组件的温控模式对应的散热时长及/或半导体制冷组件中制冷片的数量对该发动机进行散热操作。例如，当发动机在较低温度的环境温度中运行时，检测到该发动机的当前温度为75℃，采用与该75℃匹配的预设温度区间50℃<T1≤80℃对应的第二温控模式对该发动机进行散热操作，在散热过程中采用与该第二温控模式对应的半导体制冷组件中制冷片的数量，以及该第二温控模式对应的散热时长对该发动机进行散热操作；当发动机在较高温度的环境温度中运行时，检测到该发动机的当前温度为75℃，采用与该75℃匹配的预设温度区间50℃<T1≤80℃对应的第二温控模式对该发动机进行散热操作，在散热过程中采用与该第二温控模式对应的半导体制冷组件中制冷片的数量对该发动机进行散热操作，但是对该第二温控模式对应的散热时长不做限定。
本实施例通过获取发动机的当前温度，确定当前温度是否大于预设温度阈值，在当前温度大于预设温度阈值时，确定发动机的当前温度所匹配的预设温度区间，采用匹配的预设温度区间对应的散热时长及/或半导体制冷组件中制冷片的数量进行散热操作，避免过度吸收发动机的热量或者散热不充分，而给发动机造成运行负担。
进一步的，基于上述四实施例，请参阅图5，为本发明第四实施例中步骤S13的细化步骤的流程示意图，该步骤S13的细化步骤包括：
步骤S131，获取匹配的预设温度区间对应的制冷片数量；
在本实施例中，在确定该发动机的当前温度匹配的预设温度区间时，获取该预设温度区间对应的半导体制冷组件的温控模式，进而获取该半导体制冷组件的温控模式需要导通的半导体制冷片的数量。
可以理解的是，为了达到更好的散热效果，半导体制冷组件的各个温控模式对应的半导体制冷片的数量是不同的，且各个温控模式对应的半导体制冷片所处的位置也是不同的，其中，该半导体制冷片的位置的设计与该发动机的结构关联，本发明对该半导体制冷片的位置不做限定。
步骤S132，对半导体制冷组件中获取的制冷片数量对应的制冷片上电，并控制制冷片上电运行匹配的预设温度区间对应的散热时长后掉电，以对发动机进行散热操作。
在获取到与该预设温度区间匹配的半导体制冷组件的温控模式对应的半导体制冷片数量时，对该半导体制冷片上电，对该发动机进行散热操作，在散热操作到该半导体制冷组件的温控模式对应的预设的散热时长时，控制该半导体制冷片掉电。
本实施例通过获取匹配的预设温度区间对应的制冷片数量，对半导体制冷组件中获取的制冷片数量对应的制冷片上电，并控制制冷片上电运行匹配的预设温度区间对应的散热时长后掉电，以对发动机进行散热操作，使得该发动在正常工作温度下稳定运行。
本发明进一步提供一种发动机温度的控制系统。
参照图6，图6为本发明发动机温度的控制系统的第一实施例的功能模块示意图。
在本实施例中，所述发动机温度的控制系统包括：第一确定模块10、第二确定模块20及第一散热模块30。
所述第一确定模块10，用于获取发动机的当前温度，确定当前温度是否大于预设温度阈值；
在本实施例中，在检测到设备的发动机启动时，如检测到汽车的发动机启动时，第一确定模块10每间隔预设时间获取该发动机的当前温度，判断该发动机的当前温度是否大于预设温度阈值。其中，该预设温度阈值可以是常温25℃，也可以是保证该发动机正常工作的温度。
所述第二确定模块20，用于在当前温度大于预设温度阈值时，确定发动机的当前温度所匹配的预设温度区间；
在该设备中预先设定了多个预设温度区间，例如， 25℃<T1≤50℃，50℃<T1≤80℃以及80℃<T1≤100℃。当第一确定模块10确定该发动机的当前温度大于预设温度阈值时，第二确定模块20将该发动机的当前温度值与预设温度区间中的各个温度进行比对，确定该发动机的当前温度所匹配的预设温度区间。
所述第一散热模块30，用于采用匹配的预设温度区间对应的半导体制冷组件的温控模式对发动机进行散热操作。
预先在该设备中设定了每一个预设温度区间都对应一个半导体制冷组件的温控模式，在第二确定模块20确定该发动机的当前温度所匹配的预设温度区间后，第一散热模块30从该设备中预先设定的半导体制冷组件的温控模式中，选择与该当前温度所匹配的预设温度区间对应半导体制冷组件的温控模式，根据半导体制冷组件的温控模式对该发动机进行散热操作。该发动机的外表面贴合有多圈半导体制冷片，该半导体制冷片的制冷原理是将半导体制冷片的冷端贴合在发动机外部，热端与该半导体制冷组件中的温差半导体片发电片进行关联，当对该半导体制冷片进行通电时，该半导体制冷片的冷端吸收发动机产生的多余热量，该半导体制冷片的热端进行放热，以实现对该发动机进行散热操作。其中，该半导体制冷片的数量根据该发动机的实际情况而定，本实施例不对该半导体制冷片的数量进行限定。
需要说明的是，当对该半导体制冷片进行通电时，加在该半导体制冷片上的电压越大，对该发动机的散热时长越长及/或半导体制冷片的通电数量越多，对该发动机的散热效果就越好，因此半导体制冷组件不同的温控模式对应不同的预设温度区间，以实现对发动机的不同当前温度进行散热操作。在该预设温度区间内，该设备具体的半导体制冷组件的温控模式的匹配如表1所示。
表1
预设温度区间 半导体制冷组件的温控模式
25℃<T1≤50℃ 第一温控模式
50℃<T1≤80℃ 第二温控模式
80℃<T1≤100℃ 第三温控模式
其中，该第一温控模式可以理解为导通1/3的半导体制冷片，加在该半导体制冷片上的电压为3V以及对该发动机的散热时长为2分钟；该第二温控模式可以理解为导通2/3的半导体制冷片，加在该半导体制冷片上的电压为6V以及对该发动机的散热时长为5分钟；该第三温控模式可以理解为导通全部的半导体制冷片，加在该半导体制冷片上的电压为12V以及对该发动机的散热时长为10分钟。
在采用该发动机的当前温度匹配的预设温度区间所对应的半导体制冷组件的温控模式，对发动机进行散热操作的过程中，按照该半导体制冷组件的温控模式运行到预设时间时，检测该发动机的当前温度所匹配的预设温度区间是否发生变化，若确定该发动机的当前温度所匹配的预设温度区间未发生变化，则控制该半导体制冷组件继续按照当前温度匹配的预设温度区间对该发动机进行散热操作，若确定该发动机的当前温度所匹配的预设温度区间发生变化，则控制该半导体制冷组件按照当前发生变化的温度匹配的预设温度区间对应的温控模式，对该发动机进行散热操作。例如，获取到该发动机的当前温度为80℃，通过与该设备中的预设温度区间中的温度值进行匹配，确定该发动机的当前温度匹配的预设温度区间为50℃<T1≤80℃，基于该50℃<T1≤80℃的预设温度区间，确定采用第二温控模式对该发动机进行散热操作，在按照该第二温控模式对该发动机散热过程中，达到该第二温控模式中设定的散热时长5分钟时，检测该发动机的当前温度为45℃，则根据该发动机的当前温度为45℃所匹配的第一温控模式对该发动机进行散热操作，依次类推，此处不再赘述。
所述第一散热模块30，还用于采用匹配的预设温度区间对应的散热时长及/或半导体制冷组件中制冷片的数量进行散热操作。
在本实施例中，在检测到该发动机的当前温度为某一温度时，第一散热模块30采用与该温度匹配的预设温度区间对应的半导体制冷组件的温控模式，通过该半导体制冷组件的温控模式对应的散热时长及/或半导体制冷组件中制冷片的数量对该发动机进行散热操作。例如，当发动机在较低温度的环境温度中运行时，检测到该发动机的当前温度为75℃，采用与该75℃匹配的预设温度区间50℃<T1≤80℃对应的第二温控模式对该发动机进行散热操作，在散热过程中采用与该第二温控模式对应的半导体制冷组件中制冷片的数量，以及该第二温控模式对应的散热时长对该发动机进行散热操作；当发动机在较高温度的环境温度中运行时，检测到该发动机的当前温度为75℃，采用与该75℃匹配的预设温度区间50℃<T1≤80℃对应的第二温控模式对该发动机进行散热操作，在散热过程中采用与该第二温控模式对应的半导体制冷组件中制冷片的数量对该发动机进行散热操作，但是对该第二温控模式对应的散热时长不做限定。
所述第一散热模块30，还用于获取匹配的预设温度区间对应的制冷片数量；
在本实施例中，在确定该发动机的当前温度匹配的预设温度区间时，第一散热模块30获取该预设温度区间对应的半导体制冷组件的温控模式，进而获取该半导体制冷组件的温控模式需要导通的半导体制冷片的数量。
可以理解的是，为了达到更好的散热效果，半导体制冷组件的各个温控模式对应的半导体制冷片的数量是不同的，且各个温控模式对应的半导体制冷片所处的位置也是不同的，其中，该半导体制冷片的位置的设计与该发动机的结构关联，本发明对该半导体制冷片的位置不做限定。
所述第一散热模块30，还用于对半导体制冷组件中获取的制冷片数量对应的制冷片上电，并控制制冷片上电运行匹配的预设温度区间对应的散热时长后掉电，以对发动机进行散热操作。
在获取到与该预设温度区间匹配的半导体制冷组件的温控模式对应的半导体制冷片数量时，第一散热模块30对该半导体制冷片上电，对该发动机进行散热操作，在散热操作到该半导体制冷组件的温控模式对应的预设的散热时长时，控制该半导体制冷片掉电。
本实施例通过第一确定模块10获取发动机的当前温度，确定当前温度是否大于预设温度阈值，在当前温度大于预设温度阈值时，第二确定模块20确定发动机的当前温度所匹配的预设温度区间，第一散热模块30采用匹配的预设温度区间对应的半导体制冷组件的温控模式对发动机进行散热操作。由于本发明预先将发动机在运行过程中能达到的温度细分成多个预设温度区间，每个预设温度区间对应一个半导体制冷组件的温控模式，在启动发动机运行后，每间隔预设时间检测该发动机的当前温度，确定该发动机的当前温度匹配的预设温度区间，根据该预设温度区间对应半导体制冷组件的温控模式对该发动机进行散热操作，因此不仅降低了散热成本，而且使得对发动机的散热更加精细，从而保证发动机可在常温下运行。
进一步的，基于第一实施例，提出本发明发动机温度的控制系统的第二实施例，在本实施例中，参照图7，所述发动机温度的控制系统还包括：连接模块40。
所述连接模块40，用于导通半导体制冷组件与蓄电池直接的连接，以将半导体制冷组件产生的电量传输至半导体制冷组件连接的蓄电池中，其中半导体制冷组件将吸收的热量转换为电量。
在本实施例中，导体制冷组件中的各个温差半导体片与该导体制冷组件中的各个半导体制冷片关联，其中，该温差半导体片与半导体制冷片的热端关联的那一端吸收半导体制冷片的热端放出的热量，与该温差半导体片的冷端形成温度差，该温差半导体片根据赛贝克效应将吸收到的热量转换为电量，连接模块40导通半导体制冷组件中的温差半导体片与该设备中的蓄电池的连接，以将该温差半导体片产生的电量传输至半导体制冷组件连接的蓄电池中。本发明不对该温差半导体的冷端的低温保持方式不做限定。
可以理解的是，当启动该半导体制冷组件的第一温控模式时，在该第一温控模式下导通了1/3的半导体制冷片，当对该温差半导体片进行通电将吸收的热量转换成电量时，可只导通与该第一温控模式的半导体制冷片数量以及位置的一致的该温差半导体片；当启动该半导体制冷组件的第二温控模式或者第三温控模式时，对该温差半导体片的数量以及位置进行导通的方式，可参照在第一温控模式下对该温差半导体片的数量以及位置进行导通的方式一致，此处不再赘述。
本实施通过导通半导体制冷组件与蓄电池直接的连接，以将半导体制冷组件产生的电量传输至半导体制冷组件连接的蓄电池中，其中半导体制冷组件将吸收的热量转换为电量。由于半导体制冷组件中的温差半导体片的热端与半导体制冷片的热端的关联，该温差半导体片将吸收到的该发动机的废热量进行回收，根据赛贝克效应将吸收到的热量转化成电流，从而实现了资源再利用，避免了资源浪费。
进一步的，基于第一实施例，提出本发明发动机温度的控制系统的第三实施例，在本实施例中，参照图8，所述发动机温度的控制系统还包括：第二散热模块50。
所述第二散热模块50，用于在当前温度大于所有的预设温度区间的温度时，则按照温度最高的预设温度区间对应的温控模式对发动机进行散热操作，并进行报警操作。
在当该发动机的当前温度大于所有的预设温度区间时，如大于100℃，则第二散热模块50按照温度最高的预设温度区间对应的温控模式对该发动机进行散热操作，例如，按照100℃所在的预设温度区间对应的第三温控模式对该发动机进行散热操作，同时，向该设备中的报警系统发送报警指令，进行报警，直至获取到的发动机的当前温度匹配相应的预设温度区间。
需要说明的是，当确定该发动机的当前温度小于预设温度阈值时，例如，在检测到该发动机的当前温度小于常温25℃时，则停止该半导体制冷组件对该发动机进行散热操作，从而使得该发动机可在常温下工作。
本实施例通过在当前温度大于所有的预设温度区间的温度时，则按照温度最高的预设温度区间对应的温控模式对发动机进行散热操作，并进行报警操作，通过降低该发送机的温度，避免该发动机长时间在高温情况下运行易于出现老化的问题。
以上仅为本发明的优选实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (13)

  1. 一种发动机温度的控制方法，其特征在于，所述发动机外表面设置有半导体制冷组件，所述发动机温度的控制方法包括以下步骤：
    获取发动机的当前温度，确定所述当前温度是否大于预设温度阈值；
    在所述当前温度大于预设温度阈值时，确定所述发动机的当前温度所匹配的预设温度区间；
    采用匹配的预设温度区间对应的半导体制冷组件的温控模式对所述发动机进行散热操作，并导通所述半导体制冷组件与蓄电池直接的连接，以将所述半导体制冷组件产生的电量传输至所述半导体制冷组件连接的蓄电池中，其中所述半导体制冷组件将吸收的热量转换为电量；
    在所述当前温度大于所有的预设温度区间的温度时，则按照温度最高的所述预设温度区间对应的温控模式对所述发动机进行散热操作，并进行报警操作。
  2. 如权利要求1所述的发动机温度的控制方法，其特征在于，所述半导体制冷组件的温控模式包括预设的散热时长及/或预设的半导体制冷制冷片的数量，则所述采用匹配的预设温度区间对应的半导体制冷组件的温控模式对所述发动机进行散热操作的步骤包括：
    采用匹配的所述预设温度区间对应的散热时长及/或半导体制冷组件中制冷片的数量进行散热操作。
  3. 如权利要求2所述的发动机温度的控制方法，其特征在于，所述采用匹配的预设温度区间对应的散热时长及/或半导体制冷组件中制冷片的数量进行散热操作的步骤包括：
    获取匹配的预设温度区间对应的制冷片数量；
    对所述半导体制冷组件中获取的制冷片数量对应的制冷片上电，并控制所述制冷片上电运行所述匹配的预设温度区间对应的散热时长后掉电，以对所述发动机进行散热操作。
  4. 一种发动机温度的控制方法，其特征在于，所述发动机外表面设置有半导体制冷组件，所述发动机温度的控制方法包括以下步骤：
    获取发动机的当前温度，确定所述当前温度是否大于预设温度阈值；
    在所述当前温度大于预设温度阈值时，确定所述发动机的当前温度所匹配的预设温度区间；
    采用匹配的预设温度区间对应的半导体制冷组件的温控模式对所述发动机进行散热操作。
  5. 如权利要求4所述的发动机温度的控制方法，其特征在于，所述采用匹配的预设温度区间对应的半导体制冷组件的温控模式对所述发动机进行散热操作的步骤的同时，执行步骤：
    导通所述半导体制冷组件与蓄电池直接的连接，以将所述半导体制冷组件产生的电量传输至所述半导体制冷组件连接的蓄电池中，其中所述半导体制冷组件将吸收的热量转换为电量。
  6. 如权利要求4所述的发动机温度的控制方法，其特征在于，所述采用匹配的预设温度区间对应的半导体制冷组件的温控模式对所述发动机进行散热操作的步骤之前还包括：
    在所述当前温度大于所有的预设温度区间的温度时，则按照温度最高的所述预设温度区间对应的温控模式对所述发动机进行散热操作，并进行报警操作。
  7. 如权利要求4所述的发动机温度的控制方法，其特征在于，所述半导体制冷组件的温控模式包括预设的散热时长及/或预设的半导体制冷制冷片的数量，则所述采用匹配的预设温度区间对应的半导体制冷组件的温控模式对所述发动机进行散热操作的步骤包括：
    采用匹配的所述预设温度区间对应的散热时长及/或半导体制冷组件中制冷片的数量进行散热操作。
  8. 如权利要求7所述的发动机温度的控制方法，其特征在于，所述采用匹配的预设温度区间对应的散热时长及/或半导体制冷组件中制冷片的数量进行散热操作的步骤包括：
    获取匹配的预设温度区间对应的制冷片数量；
    对所述半导体制冷组件中获取的制冷片数量对应的制冷片上电，并控制所述制冷片上电运行所述匹配的预设温度区间对应的散热时长后掉电，以对所述发动机进行散热操作。
  9. 一种发动机温度的控制系统，其特征在于，所述发动机外表面设置有半导体制冷组件，所述发动机温度的控制系统包括：
    第一确定模块，用于获取发动机的当前温度，确定所述当前温度是否大于预设温度阈值；
    第二确定模块，用于在所述当前温度大于预设温度阈值时，确定所述发动机的当前温度所匹配的预设温度区间；
    第一散热模块，用于采用匹配的预设温度区间对应的半导体制冷组件的温控模式对所述发动机进行散热操作。
  10. 如权利要求9所述的发动机温度的控制系统，其特征在于，所述发动机温度的控制系统还包括：
    连接模块，用于导通所述半导体制冷组件与蓄电池直接的连接，以将所述半导体制冷组件产生的电量传输至所述半导体制冷组件连接的蓄电池中，其中所述半导体制冷组件将吸收的热量转换为电量。
  11. 如权利要求9所述的发动机温度的控制系统，其特征在于，所述发动机温度的控制系统还包括：
    第二散热模块，用于在所述当前温度大于所有的预设温度区间的温度时，则按照温度最高的所述预设温度区间对应的温控模式对所述发动机进行散热操作，并进行报警操作。
  12. 如权利要求9所述的发动机温度的控制系统，其特征在于，所述半导体制冷组件的温控模式包括预设的散热时长及/或预设的半导体制冷制冷片的数量，所述第一散热模块，还用于：
    采用匹配的所述预设温度区间对应的散热时长及/或半导体制冷组件中制冷片的数量进行散热操作。
  13. 如权利要求12所述的发动机温度的控制系统，其特征在于，所述第一散热模块，还用于：
    获取匹配的预设温度区间对应的制冷片数量；
    对所述半导体制冷组件中获取的制冷片数量对应的制冷片上电，并控制所述制冷片上电运行所述匹配的预设温度区间对应的散热时长后掉电，以对所述发动机进行散热操作。
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111928521A (zh) * 2020-08-28 2020-11-13 珠海格力电器股份有限公司 采用半导体制冷的散热装置及其控制方法
CN115050710A (zh) * 2022-08-15 2022-09-13 深圳市威兆半导体股份有限公司 一种变频器mosfet的散热装置及散热方法
CN116447001A (zh) * 2023-06-12 2023-07-18 山东莱柴动力有限公司 一种柴油机的水冷组件

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106150663A (zh) * 2016-06-30 2016-11-23 深圳市元征科技股份有限公司 发动机温度的控制方法及系统
CN107415643B (zh) * 2017-04-24 2018-07-06 朱若东 废热钳制控制方法与自源式废热钳温器、车辆
CN113325892A (zh) * 2021-05-06 2021-08-31 珠海格力电器股份有限公司 发热设备控制方法、控制装置、高温杀菌设备、服务器
CN119593852B (zh) * 2024-11-27 2025-09-09 东风商用车有限公司 电子节温器开度调节方法、装置、电子设备及存储介质

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN200997575Y (zh) * 2006-12-28 2007-12-26 东风汽车集团股份有限公司 利用汽车水箱的水温实现温差发电装置
CN101554837A (zh) * 2008-12-31 2009-10-14 上海市延安中学 一种循环利用能源的公交车
CN102891635A (zh) * 2012-10-15 2013-01-23 无锡翱天电气科技有限公司 一种车用温差发电装置
CN203626942U (zh) * 2013-12-30 2014-06-04 佳木斯大学 用于发动机的冷却装置
CN104410328A (zh) * 2014-10-28 2015-03-11 上海翌先信息科技有限公司 低温差发电散热新技术
US20150135689A1 (en) * 2012-05-08 2015-05-21 Eberspächer Exhaust Technology GmbH & Co., KG Heat exchanger having a thermoelectric generator
CN104863692A (zh) * 2015-06-01 2015-08-26 中国人民解放军装甲兵技术学院 一种发动机的制冷片传热系统及控制方法
CN204663649U (zh) * 2015-06-01 2015-09-23 中国人民解放军装甲兵技术学院 一种发动机的制冷片传热系统
CN105150964A (zh) * 2015-09-17 2015-12-16 郭若昊 光热互补储能及电子制冷的汽车能源综合利用系统
CN105977574A (zh) * 2016-06-30 2016-09-28 深圳市元征科技股份有限公司 电池温度的控制方法及系统
CN106150663A (zh) * 2016-06-30 2016-11-23 深圳市元征科技股份有限公司 发动机温度的控制方法及系统

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102820273B (zh) * 2011-06-08 2016-02-24 北京中科美伦科技有限公司 用于ccd探测器的制冷系统
CN102522609B (zh) * 2012-01-11 2015-05-20 东莞市钜大电子有限公司 一种锂电池保温装置及其控制方法
CN203194078U (zh) * 2013-04-03 2013-09-11 联合汽车电子有限公司 散热器
SE539027C2 (sv) * 2013-04-25 2017-03-21 Scania Cv Ab Förfarande och system för styrning av ett kylsystem
KR101550981B1 (ko) * 2013-11-21 2015-09-07 현대자동차주식회사 가변분리냉각시스템 모드별 제어 방법

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN200997575Y (zh) * 2006-12-28 2007-12-26 东风汽车集团股份有限公司 利用汽车水箱的水温实现温差发电装置
CN101554837A (zh) * 2008-12-31 2009-10-14 上海市延安中学 一种循环利用能源的公交车
US20150135689A1 (en) * 2012-05-08 2015-05-21 Eberspächer Exhaust Technology GmbH & Co., KG Heat exchanger having a thermoelectric generator
CN102891635A (zh) * 2012-10-15 2013-01-23 无锡翱天电气科技有限公司 一种车用温差发电装置
CN203626942U (zh) * 2013-12-30 2014-06-04 佳木斯大学 用于发动机的冷却装置
CN104410328A (zh) * 2014-10-28 2015-03-11 上海翌先信息科技有限公司 低温差发电散热新技术
CN104863692A (zh) * 2015-06-01 2015-08-26 中国人民解放军装甲兵技术学院 一种发动机的制冷片传热系统及控制方法
CN204663649U (zh) * 2015-06-01 2015-09-23 中国人民解放军装甲兵技术学院 一种发动机的制冷片传热系统
CN105150964A (zh) * 2015-09-17 2015-12-16 郭若昊 光热互补储能及电子制冷的汽车能源综合利用系统
CN105977574A (zh) * 2016-06-30 2016-09-28 深圳市元征科技股份有限公司 电池温度的控制方法及系统
CN106150663A (zh) * 2016-06-30 2016-11-23 深圳市元征科技股份有限公司 发动机温度的控制方法及系统

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111928521A (zh) * 2020-08-28 2020-11-13 珠海格力电器股份有限公司 采用半导体制冷的散热装置及其控制方法
CN115050710A (zh) * 2022-08-15 2022-09-13 深圳市威兆半导体股份有限公司 一种变频器mosfet的散热装置及散热方法
CN116447001A (zh) * 2023-06-12 2023-07-18 山东莱柴动力有限公司 一种柴油机的水冷组件
CN116447001B (zh) * 2023-06-12 2023-08-22 山东莱柴动力有限公司 一种柴油机的水冷组件

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