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WO2018084016A1 - Electronic apparatus - Google Patents

Electronic apparatus Download PDF

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Publication number
WO2018084016A1
WO2018084016A1 PCT/JP2017/038206 JP2017038206W WO2018084016A1 WO 2018084016 A1 WO2018084016 A1 WO 2018084016A1 JP 2017038206 W JP2017038206 W JP 2017038206W WO 2018084016 A1 WO2018084016 A1 WO 2018084016A1
Authority
WO
WIPO (PCT)
Prior art keywords
wall
cooling target
flow path
unit
lid wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2017/038206
Other languages
French (fr)
Japanese (ja)
Inventor
裕一朗 矢口
中島　雄二
太田　武志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Toshiba Infrastructure Systems and Solutions Corp
Original Assignee
Toshiba Corp
Toshiba Infrastructure Systems and Solutions Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Toshiba Infrastructure Systems and Solutions Corp filed Critical Toshiba Corp
Priority to KR1020187036199A priority Critical patent/KR102149444B1/en
Priority to JP2018548946A priority patent/JP6730444B2/en
Priority to CN201780038298.7A priority patent/CN109328487B/en
Priority to SG11201902293WA priority patent/SG11201902293WA/en
Publication of WO2018084016A1 publication Critical patent/WO2018084016A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications

Definitions

  • Embodiments described herein relate generally to an electronic device.
  • an electronic device that includes a cooling target part such as a CPU and a cooling device for cooling the cooling target part in a casing.
  • a cooling target part such as a CPU
  • a cooling device for cooling the cooling target part in a casing.
  • an electronic apparatus in which cooling target portions are provided at a plurality of locations.
  • Embodiment of this invention aims at providing an electronic device with high cooling property.
  • An electronic device is arranged in a casing, and is provided on a cooling target unit including a first cooling target unit and a second cooling target unit, and on the cooling target unit, and a space in the casing is provided.
  • a flow path guide section that has a wall-shaped member that divides into a plurality, and that forms a first flow path that passes through the first cooling target section and a second flow path that passes through the second cooling target section. .
  • FIG. 1 is a perspective view illustrating a configuration of an electronic device according to an embodiment.
  • the top view of the same electronic device Sectional drawing which shows the structure of a part of the electronic device.
  • the perspective view which shows the structure of the flow-path guide part of the same electronic device.
  • the top view which shows the structure of the flow-path guide part of the same electronic device.
  • FIG. 1 is a perspective view illustrating a configuration of an electronic device 10 according to the embodiment
  • FIG. 2 is a plan view of the electronic device 10.
  • FIG. 3 is a cross-sectional view illustrating a partial configuration of the electronic device 10.
  • FIG. 4 is a perspective view showing the configuration of the flow path guide unit 20
  • FIG. 5 is a plan view showing the configuration of the flow path guide unit 20.
  • arrows X, Y, and Z indicate three directions orthogonal to each other, where X is along the first direction, Y is along the second direction, and Z is along the third direction.
  • the orientation with the bottom plate down is shown as an example with respect to directions such as up and down, left and right, front and back, but the orientation changes appropriately according to the orientation of the electronic device 10.
  • the electronic device 10 includes a housing 11, a substrate unit 12 that is a cooling target unit, an HDD unit 13, an IC chip unit 15, a power supply unit 16, and a cooling unit 17. And a flow path guide unit 20.
  • the housing 11 includes, for example, a rectangular bottom plate 11a, a front side plate 11b, a pair of left and right side plates 11c and 11d, a rear side plate 11e, and a top plate 11f arranged to face the bottom plate 11a.
  • the housing 11 forms a rectangular parallelepiped accommodation space 11g surrounded by the bottom plate 11a, the top plate 11f, and the two sets of side plates 11b to 11e.
  • the housing 11 accommodates various electronic components such as the HDD unit 13, the cooling unit 17, and the board unit 12 in the accommodating space 11g.
  • the front side plate 11b includes a ventilation structure 31 that has a plurality of ventilation holes and is configured to allow intake, and is connected to a disk port for an optical drive disk, an insertion port for the HDD unit 13, and various cables such as a USB.
  • a ventilation structure 31 that has a plurality of ventilation holes and is configured to allow intake, and is connected to a disk port for an optical drive disk, an insertion port for the HDD unit 13, and various cables such as a USB.
  • Various terminals are provided.
  • the rear side plate 11e includes a ventilation structure portion 31 having a plurality of ventilation holes and various terminals to which various cables such as a USB are connected.
  • a plurality of HDD units 13 are arranged side by side in the X direction on one end side in the accommodation space 11g.
  • a cooling unit 17 is provided adjacent to the rear of the HDD unit 13 in the accommodation space 11g. Further, the substrate unit 12 is disposed behind the cooling unit 17 in the accommodation space 11g.
  • the HDD unit 13 includes a plurality of HDDs and an HDD housing that holds the HDDs.
  • a cooling unit 17 is disposed behind the HDD unit 13, in other words, on the secondary side of the air flow path.
  • a ventilation path is formed from the ventilation structure portion 31 of the front side plate 11b to the intake portion of the cooling unit 17.
  • the upstream side in the blowing direction is referred to as a primary side
  • the downstream side is referred to as a secondary side.
  • the cooling unit 17 includes a fan holder 32 disposed on the bottom plate 11 a of the housing 11 and a plurality of fan units 34 a to 34 c supported by the fan holder 32. .
  • three first fan units 34a, second fan units 34b, and third fan units 34c are arranged in parallel in the X direction.
  • the fan holder 32 is a frame disposed on the bottom plate 11a of the housing 11, and has a plurality of fan accommodating portions that respectively hold the fan units 34a to 34c.
  • the plurality of fan units 34 a to 34 c each include a fan case 35 having a blower opening 35 a and a blower fan 36 disposed in the fan case 35.
  • the blower fan 36 is connected to the output shaft of the fan motor and is driven to rotate.
  • the cooling unit 17 includes an intake port on the HDD unit 13 side, and includes a blower port 35a on the opposite side.
  • the first fan unit 34 a and the second fan unit 34 b are disposed to face the substrate unit 12, and the third fan unit 34 c is disposed to face the IC chip unit 15.
  • the substrate unit 12 is a bottom portion of the housing 11 and is disposed on the bottom plate 11 a, a first CPU unit 42 mounted on the substrate 41, and a second portion disposed on the secondary side of the first CPU unit 42. 2 CPU unit 43, and a RAID card unit 44 arranged behind the first CPU unit 42 and on the side of the second CPU unit 43.
  • the board 41 and the first CPU unit 42 on the board 41 are the first cooling target part
  • the second CPU unit 43 is the second cooling target part
  • the RAID card unit 44 is the third cooling target part.
  • the substrate 41 is a PCB substrate and is arranged in parallel with the bottom plate 11a along the XY plane.
  • the first CPU unit 42 is disposed near the air outlet 35a of the second fan unit 34b.
  • the first CPU unit 42 includes a first CPU 45 mounted on the substrate 41 and a first heat sink 47 mounted on the first CPU 45.
  • the first heat sink 47 includes a plurality of radiating fins standing at a predetermined pitch Pt1.
  • the second CPU unit 43 is arranged behind the right first fan unit 34a and behind the first CPU unit 42.
  • the second CPU unit 43 includes a second CPU 46 mounted on the substrate 41 and a second heat sink 48 mounted on the second CPU 46.
  • the second heat sink 48 includes a plurality of heat radiation fins erected at a predetermined pitch Pt2. The upper end of the second heat sink 48 is disposed at a predetermined position higher than the first heat sink 47.
  • the RAID card unit 44 is arranged behind the first CPU unit 42.
  • the RAID card unit 44 includes a plurality of RAID cards 44a that are erected on the substrate 41 and on which various electronic components are mounted.
  • the upper end portion of the RAID card 44 a is, for example, higher than the upper end of the first heat sink 47 and has the same height as the upper end of the second heat sink 48.
  • the flow path guide part 20 is molded from a transparent resin material having excellent heat resistance and workability.
  • the flow path guide unit 20 is formed along the outer shape of the substrate unit 12 and integrally includes a plurality of wall-like members that cover the substrate unit 12 and divide the flow path into a plurality of parts.
  • the flow path guide unit 20 is disposed on the substrate unit 12 to form a plurality of flow paths F1, F2, and F3 that pass backward from the cooling unit 17 through the substrate unit 12.
  • the flow path guide unit 20 includes a first lid wall 21 that is a partition wall disposed on the first heat sink 47 on the secondary side of the second fan unit 34b, and a second heat sink from the secondary side of the first fan unit 34a.
  • the duct part 22 which divides the 2nd flow path which reaches 48, and the power supply cover part 23 which covers a power supply unit are provided continuously and integrally.
  • the first lid wall 21 is a plate-like member that extends across the height direction on the secondary side of the air blowing port 35a of the second fan unit 34b and divides the space vertically.
  • the first lid wall 21 is disposed at a height near the center in the Z direction of the air blowing port 35a of the second fan unit 34b, and is disposed along the XY plane.
  • the first lid wall 21 is disposed opposite to the upper end of the first heat sink 47 with a slight gap.
  • a plurality of attachment pieces that are fastened to the housing 11 by fastening members are provided at the end of the first lid wall 21.
  • the first lid wall 21 has a narrowed portion 21a slightly ahead of the center of the first CPU 45.
  • the narrowed portion 21a is formed of a step which is continuous by a surface in which a part of the first lid wall 21 descends obliquely. That is, the first lid wall 21 is continuous by the narrowed portion 21a whose surfaces having different heights are inclined surfaces.
  • the distance of the gap between the first heat sink 47 and the first lid wall 21 is reduced on the secondary side of the throttle portion 21a.
  • a distance S1 between the first heat sink 47 and the first lid wall 21 is configured to be narrower than the pitch Pt1 of the heat sink fins of the heat sink at the rear portion of the throttle portion 21a.
  • a first guide rib 21b and a second guide rib 21c are formed on the upper surface of the first lid wall 21 so as to stand upward.
  • the first guide rib 21b and the second guide rib 21c are wall-shaped members having a predetermined thickness and extending obliquely so as to be displaced toward the center toward the rear.
  • the first guide rib 21 b and the second guide rib 21 c are configured to have a height equivalent to that of the second lid wall 24.
  • the first guide rib 21b and the second guide rib 21c are spaced apart from each other by a predetermined distance to form a first opening 21d through which cooling air can pass.
  • a first flow path F1 extending from the cooling unit 17 to the first heat sink 47 is formed below the first lid wall 21.
  • the duct portion 22 extends rearward from the vicinity of the air blowing port 35a of the first fan unit 34a by a predetermined width, and further displaces obliquely toward the rear and expands the width dimension. And cover the sides.
  • the duct portion 22 includes a second lid wall 24 and a pair of guide side walls 25 and 26 disposed on both side edges of the second lid wall 24.
  • the duct portion 22 forms a second flow path F2 extending from the vicinity of the air blowing port 35a of the first fan unit 34a to the second heat sink 48.
  • the second lid wall 24 is disposed at the height of the first fan unit 34a at the tip of the air outlet 35a and above the air outlet 35a.
  • the second lid wall 24 is a wall-like member that is arranged to intersect the height direction and divides the space vertically.
  • the second lid wall 24 is disposed at a predetermined distance above the first lid wall 21 and extends in parallel with the bottom plate 11a along the XY plane.
  • a throttle portion 24a is formed in a portion of the second lid wall 24 facing a predetermined position ahead of the center of the second CPU unit 43.
  • the narrowed portion 24a is configured by a step that descends obliquely so that the position is lowered at a predetermined position of the second lid wall 24.
  • a region behind the throttle portion 24 a of the second lid wall 24 is disposed opposite to the upper end of the second heat sink 48 with a slight gap.
  • the distance S2 between the second heat sink 48 and the second lid wall 24 on the secondary side of the throttle portion 24a is set to be narrower than the pitch Pt2 of the radiating fins of the second heat sink 48.
  • the guide side walls 25 and 26 are wall-like members extending along the ZY plane, and partition the space into a plurality in the X direction, which is the parallel direction of the blower fans.
  • One guide side wall 25 (first side wall portion) extends downward from one side edge of the second lid wall 24.
  • the guide side wall 25 is divided into two portions, and has a front side wall 25a and a rear side wall 25b.
  • the front side wall 25 a of the guide side wall 25 reaches a part of the other side edge of the first lid wall 21 at the lower end. In other words, the front side wall 25 a of the guide side wall 25 stands from the side edge of the first lid wall 21.
  • a second opening 25c having a predetermined width is formed between the front side wall 25a and the rear side wall 25b.
  • the second flow path F2 in the duct part 22 communicates with the space on the first lid wall 21 through the second opening 25c.
  • the other guide side wall 26 is formed over the entire length of the second lid wall 24.
  • a second flow path F ⁇ b> 2 extending from the first fan unit 34 a to the second heat sink 48 is formed in a region surrounded by the guide side walls 25 and 26 below the duct portion 22.
  • the rear part of the guide side wall 25 is erected from a rear side wall 25b which is an inner wall along the side wall of the second heat sink 48, a bottom wall part 25d having a predetermined width extending outside the rear side wall 25b, and the other end of the bottom wall part 25d.
  • the outer wall portion 25e is provided integrally and formed in a double structure.
  • the guide side wall 25 has a predetermined width. The guide side wall 25 narrows the gap between the second heat sink 48 and the RAID card unit 44, thereby suppressing the escape of wind into the gap and the air blowing direction so that the RAID card unit 44 is effectively cooled. To guide you.
  • a third flow path F3 extending from the vicinity of the air blowing port 35a of the second fan unit 34b to the RAID card unit 44 through the first lid wall 21 is formed outside the guide side wall 25.
  • the guide side wall 26 (second side wall portion) is opposed to the inner wall portion 26c along the side portion of the second heat sink 48, the bottom wall portion 26d having a predetermined width, and the inner wall portion 26c erected from the other end of the bottom wall portion 26d. And an outer wall portion 26e.
  • the guide side wall 26 has a predetermined width that fills the gap between the second heat sink 48 and the power supply unit 16. The guide side wall 26 prevents the wind from escaping through the gap and guides the blowing direction so that the second heat sink 48 is effectively cooled.
  • the upper end edge of the outer wall portion 26 e is continuous with the power source cover portion 23.
  • the inner wall part 26c of the guide side wall 26 is displaced and inclined toward the center of the duct part 22 in the throttle part 24a. That is, in the throttle part 24a, the flow path of the duct part 22 is narrowed not only in the Z direction but also in the X direction by the inner wall part 26c, so that the flow velocity is increased.
  • the power supply cover 23 is a plate-like member that is placed on the power supply unit 16 so as to face the power supply unit 16.
  • a plurality of attachment pieces that are fastened to the housing 11 by fastening members are provided at the edge of the power supply cover portion 23.
  • the flow path guide portion 20 configured as described above is placed over the substrate unit 12 and is fixed to the housing 11 by fastening members such as bolts at a plurality of mounting pieces 28 provided on the outer peripheral portion.
  • each part of the flow path guide part 20 are determined based on the air distribution ratio according to the heat generation amount of the plurality of cooling target parts. That is, the air volume from the two fan units 34a and 34b is set so as to be guided to the three flow paths F1, F2, and F3 with a distribution corresponding to the heat generation amount of the units 42, 43, and 44.
  • the heat generation amount of the first CPU unit 42 and the heat generation amount of the second CPU unit 43 are approximately the same, and the heat generation amount of the RAID card unit 44 is approximately 1/3 thereof.
  • the air when the fan motor 55 is rotationally driven by the control unit, the air is sucked into the fan case from the air inlet through the air intake passage formed above and below the HDD unit 13, and from the air outlet 35a, The air is blown backward toward the substrate unit 12.
  • the air sent from the air blowing port 35a is guided by the flow path guide unit 20 provided at the front of the air blowing port 35a. That is, the air from the two fan units 34a and 34b is vertically divided by the first lid wall 21 on one side and guided to the duct portion 22 on the other side.
  • the air guided onto the first lid wall 21 is further guided by the first guide rib 21b and the second guide rib 21c, partly guided from the first opening 21d to the third flow path F3, and partly second. Guided into the duct portion 22 from the opening 25c.
  • the air guided to the first flow path F1 cools the first CPU unit 42.
  • the air guided to the second flow path F2 cools the second CPU unit 43.
  • the air guided to the third flow path F3 cools the RAID card unit 44.
  • the flow rate from the cooling unit 17 is reduced by providing the flow path guide portion 20 that covers the substrate unit 12 and divides the flow path into a plurality of cooling targets. Can be distributed properly and effective cooling can be realized.
  • the duct portion 22 and the first lid wall 21 can effectively guide the heat sinks at different positions by dividing the air volume vertically and horizontally.
  • a desired air volume can be distributed also to the secondary-side second heat sink 48. That is, for example, in an arrangement in which a plurality of heat sinks of the same height are generally arranged at the front and back, the air heated by the first heat sink 47 on the primary side is supplied to the secondary heat sink, so that the cooling efficiency is lowered.
  • cold air can be reliably supplied to the second heat sink 48 on the secondary side.
  • the plurality of fan units 34a and 34b are arranged in parallel.
  • the first flow path F1 and the second flow path F2 are configured to communicate with both the fan units 34a and 34b, respectively.
  • the fan units 34a and 34b fail, the cooling air of the remaining fan units 34a and 34b can be distributed, and the cooling performance can be maintained.
  • the guide side walls 25 and 26 have a double structure to eliminate a dead space, and the shape of the flow path guide portion 20 is made to conform to the outer shape of the substrate unit 12 so that the cooling air escapes. This can be suppressed and cooling air can be used efficiently.
  • the flow path guide portion 20 by configuring the flow path guide portion 20 from a transparent resin, it is possible to check the wiring status even when the flow path guide portion 20 is attached. Further, since the plurality of wall-like members provided in the flow path guide portion 20 can define the positions of various cables in addition to the sections of the flow paths, the workability of the wiring work can be improved.
  • the present invention is not limited to the above embodiment.
  • the flow path guide portion 20 is made of a transparent resin material, but is not limited thereto, and may be made of other materials such as metal.
  • the flow path guide unit 20 is configured in the above-described shape in accordance with the shape of the substrate unit 12 and the amount of heat generated in each unit, but is not limited thereto.
  • the position and shape of the wall-shaped member can be changed as appropriate according to the positional relationship and number of the units 42, 43, and 44.
  • the number of flow paths can be increased or decreased according to the position and number of cooling target portions.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

An electronic apparatus relating to an embodiment of the present invention is provided with: a unit to be cooled, said unit being disposed in a housing, and being provided with a first section to be cooled, and a second section to be cooled; and a flow channel guide section, which is disposed on the unit to be cooled, and which has a wall-like member that partitions a space in the housing into a plurality of sections, said flow channel guide section forming a first flow channel passing the first section to be cooled, and a second flow channel passing the second section to be cooled.

Description

電子機器Electronics

　本発明の実施形態は、電子機器に関する。 Embodiments described herein relate generally to an electronic device.

　例えば電子機器において、筐体内に、ＣＰＵなどの冷却対象部と、冷却対象部を冷却する冷却装置と、を備えるものが知られている。また、冷却対象部が複数箇所に設けられる電子機器も知られている。 For example, an electronic device is known that includes a cooling target part such as a CPU and a cooling device for cooling the cooling target part in a casing. There is also known an electronic apparatus in which cooling target portions are provided at a plurality of locations.

特開平６－１２５１８７号公報JP-A-6-125187 特開２０１０－１９８１８５号公報JP 2010-198185 A

　本発明の実施形態は、冷却性の高い電子機器を提供することを目的とする。 Embodiment of this invention aims at providing an electronic device with high cooling property.

　実施形態にかかる電子機器は、筐体内に配され、第１冷却対象部と、第２冷却対象部と、を備える冷却対象ユニットと、前記冷却対象ユニット上に配され、前記筐体内の空間を複数に仕切る壁状部材を有し、前記第１冷却対象部を通る第１流路と、前記第２冷却対象部を通る第２流路と、を形成する、流路ガイド部と、を備える。 An electronic device according to an embodiment is arranged in a casing, and is provided on a cooling target unit including a first cooling target unit and a second cooling target unit, and on the cooling target unit, and a space in the casing is provided. A flow path guide section that has a wall-shaped member that divides into a plurality, and that forms a first flow path that passes through the first cooling target section and a second flow path that passes through the second cooling target section. .

実施形態にかかる電子機器の構成を示す斜視図。1 is a perspective view illustrating a configuration of an electronic device according to an embodiment. 同電子機器の平面図。The top view of the same electronic device. 同電子機器の一部の構成を示す断面図。Sectional drawing which shows the structure of a part of the electronic device. 同電子機器の流路ガイド部の構成を示す斜視図。The perspective view which shows the structure of the flow-path guide part of the same electronic device. 同電子機器の流路ガイド部の構成を示す平面図。The top view which shows the structure of the flow-path guide part of the same electronic device.

実施形態Embodiment

　以下、本発明の一実施形態に係る電子機器１０の構成について、図１乃至図５を参照して説明する。図１は実施形態にかかる電子機器１０の構成を示す斜視図であり、図２は、電子機器１０の平面図である。図３は電子機器１０の一部の構成を示す断面図である。図４は流路ガイド部２０の構成を示す斜視図であり、図５は流路ガイド部２０の構成を示す平面図である。 Hereinafter, the configuration of the electronic apparatus 10 according to an embodiment of the present invention will be described with reference to FIGS. 1 to 5. FIG. 1 is a perspective view illustrating a configuration of an electronic device 10 according to the embodiment, and FIG. 2 is a plan view of the electronic device 10. FIG. 3 is a cross-sectional view illustrating a partial configuration of the electronic device 10. FIG. 4 is a perspective view showing the configuration of the flow path guide unit 20, and FIG. 5 is a plan view showing the configuration of the flow path guide unit 20.

　なお、図においては説明のため天板を省略して筐体の内部構造を示している。図中矢印Ｘ，Ｙ，Ｚは互いに直交する３方向を示しており、Ｘは第１方向、Ｙは第２方向、Ｚは第３方向にそれぞれ沿っている。なお、本実施形態において上下左右前後等の方向については底板を下にした姿勢を一例として示しているが、電子機器１０の姿勢に応じて適宜変化するものである。 In the figure, the internal structure of the housing is shown with the top plate omitted for explanation. In the figure, arrows X, Y, and Z indicate three directions orthogonal to each other, where X is along the first direction, Y is along the second direction, and Z is along the third direction. In the present embodiment, the orientation with the bottom plate down is shown as an example with respect to directions such as up and down, left and right, front and back, but the orientation changes appropriately according to the orientation of the electronic device 10.

　図１及び図２に示すように、電子機器１０は、筐体１１と、冷却対象ユニットである基板ユニット１２と、ＨＤＤユニット１３と、ＩＣチップユニット１５と、電源ユニット１６と、冷却ユニット１７と、流路ガイド部２０と、を備える。　
　筐体１１は、例えば、長方形状の底板１１ａと、前方の側板１１ｂと、左右一対の側板１１ｃ，１１ｄと、後方の側板１１ｅと、底板１１ａに対向配置される天板１１ｆと、を備える。筐体１１は、これらの底板１１ａ、天板１１ｆ、及び２組の側板１１ｂ～１１ｅによって囲まれる直方体状の収容空間１１ｇを形成する。筐体１１は、収容空間１１ｇ内に、ＨＤＤユニット１３、冷却ユニット１７、基板ユニット１２等の、各種の電子部品を収容する。 As shown in FIGS. 1 and 2, the electronic device 10 includes a housing 11, a substrate unit 12 that is a cooling target unit, an HDD unit 13, an IC chip unit 15, a power supply unit 16, and a cooling unit 17. And a flow path guide unit 20.
The housing 11 includes, for example, a rectangular bottom plate 11a, a front side plate 11b, a pair of left and right side plates 11c and 11d, a rear side plate 11e, and a top plate 11f arranged to face the bottom plate 11a. The housing 11 forms a rectangular parallelepiped accommodation space 11g surrounded by the bottom plate 11a, the top plate 11f, and the two sets of side plates 11b to 11e. The housing 11 accommodates various electronic components such as the HDD unit 13, the cooling unit 17, and the board unit 12 in the accommodating space 11g.

　前方の側板１１ｂは、複数の通気孔を有し吸気可能に構成された通気構造部３１を備えるとともに、光学ドライブディスク用のディスク口や、ＨＤＤユニット１３の挿入口、ＵＳＢ等各種ケーブルが接続される各種の端子を備えている。 The front side plate 11b includes a ventilation structure 31 that has a plurality of ventilation holes and is configured to allow intake, and is connected to a disk port for an optical drive disk, an insertion port for the HDD unit 13, and various cables such as a USB. Various terminals are provided.

　後方の側板１１ｅは、複数の通気孔を有する通気構造部３１を備えるとともに、ＵＳＢ等各種ケーブルが接続される各種の端子を備えている。 The rear side plate 11e includes a ventilation structure portion 31 having a plurality of ventilation holes and various terminals to which various cables such as a USB are connected.

　収容空間１１ｇ内の一端側には、複数のＨＤＤユニット１３が、Ｘ方向に並んで配置されている。また、収容空間１１ｇ内には、ＨＤＤユニット１３の後方に隣接して、冷却ユニット１７が設けられている。さらに、収容空間１１ｇ内において、冷却ユニット１７の後方に、基板ユニット１２が配置されている。 A plurality of HDD units 13 are arranged side by side in the X direction on one end side in the accommodation space 11g. A cooling unit 17 is provided adjacent to the rear of the HDD unit 13 in the accommodation space 11g. Further, the substrate unit 12 is disposed behind the cooling unit 17 in the accommodation space 11g.

　ＨＤＤユニット１３は、複数のＨＤＤと、ＨＤＤをそれぞれ保持するＨＤＤハウジングと、を備える。ＨＤＤユニット１３の後方、換言すると空気の流路における二次側には、冷却ユニット１７が配置されている。前方の側板１１ｂの通気構造部３１から冷却ユニット１７の吸気部に至る通風路が形成されている。ここで、空気の流路において、送風方向の上流側を一次側、下流側を二次側と称する。 The HDD unit 13 includes a plurality of HDDs and an HDD housing that holds the HDDs. A cooling unit 17 is disposed behind the HDD unit 13, in other words, on the secondary side of the air flow path. A ventilation path is formed from the ventilation structure portion 31 of the front side plate 11b to the intake portion of the cooling unit 17. Here, in the air flow path, the upstream side in the blowing direction is referred to as a primary side, and the downstream side is referred to as a secondary side.

　図１乃至図４に示されるように、冷却ユニット１７は、筐体１１の底板１１ａ上に配置されるファンホルダ３２と、ファンホルダ３２に支持される複数のファンユニット３４ａ～３４ｃと、を備える。本実施形態においては３つの第１ファンユニット３４ａ、第２ファンユニット３４ｂ、及び第３ファンユニット３４ｃがＸ方向に並列して配置されている。 As shown in FIGS. 1 to 4, the cooling unit 17 includes a fan holder 32 disposed on the bottom plate 11 a of the housing 11 and a plurality of fan units 34 a to 34 c supported by the fan holder 32. . In the present embodiment, three first fan units 34a, second fan units 34b, and third fan units 34c are arranged in parallel in the X direction.

　ファンホルダ３２は、筐体１１の底板１１ａ上に配置されるフレームであって、ファンユニット３４ａ～３４ｃをそれぞれ保持するファン収容部を複数有する。 The fan holder 32 is a frame disposed on the bottom plate 11a of the housing 11, and has a plurality of fan accommodating portions that respectively hold the fan units 34a to 34c.

　複数のファンユニット３４ａ～３４ｃは、送風口３５ａを有するファンケース３５と、ファンケース３５内に配された送風ファン３６と、をそれぞれ備える。送風ファン３６は、ファンモータの出力軸に接続され、回転駆動される。冷却ユニット１７は、ＨＤＤユニット１３側に吸気口を備え、その反対側に送風口３５ａを備える。本実施形態において、第１ファンユニット３４ａ、第２ファンユニット３４ｂは、基板ユニット１２に対向して配置され、第３ファンユニット３４ｃはＩＣチップユニット１５に対向して配置されている。 The plurality of fan units 34 a to 34 c each include a fan case 35 having a blower opening 35 a and a blower fan 36 disposed in the fan case 35. The blower fan 36 is connected to the output shaft of the fan motor and is driven to rotate. The cooling unit 17 includes an intake port on the HDD unit 13 side, and includes a blower port 35a on the opposite side. In the present embodiment, the first fan unit 34 a and the second fan unit 34 b are disposed to face the substrate unit 12, and the third fan unit 34 c is disposed to face the IC chip unit 15.

　基板ユニット１２は、筐体１１の底部であって底板１１ａ上に配される基板４１と、基板４１上に搭載される第１ＣＰＵユニット４２と、第１ＣＰＵユニット４２の二次側に配される第２ＣＰＵユニット４３と、第１ＣＰＵユニット４２の後方であって第２ＣＰＵユニット４３の側方に配されるＲＡＩＤカードユニット４４と、を備える。なお、本実施形態では、基板４１や基板４１上の第１ＣＰＵユニット４２が第１冷却対象部となり、第２ＣＰＵユニット４３が第２冷却対象部となり、ＲＡＩＤカードユニット４４が第３冷却対象部となる。 The substrate unit 12 is a bottom portion of the housing 11 and is disposed on the bottom plate 11 a, a first CPU unit 42 mounted on the substrate 41, and a second portion disposed on the secondary side of the first CPU unit 42. 2 CPU unit 43, and a RAID card unit 44 arranged behind the first CPU unit 42 and on the side of the second CPU unit 43. In this embodiment, the board 41 and the first CPU unit 42 on the board 41 are the first cooling target part, the second CPU unit 43 is the second cooling target part, and the RAID card unit 44 is the third cooling target part. .

　基板４１はＰＣＢ基板であり、ＸＹ平面に沿って、底板１１ａと平行に配置される。 The substrate 41 is a PCB substrate and is arranged in parallel with the bottom plate 11a along the XY plane.

　第１ＣＰＵユニット４２は、第２ファンユニット３４ｂの送風口３５ａ付近に配置される。第１ＣＰＵユニット４２は、基板４１上に搭載される第１ＣＰＵ４５と、第１ＣＰＵ４５上に搭載される第１ヒートシンク４７と、を備える。第１ヒートシンク４７は所定のピッチＰｔ１で立設された複数の放熱フィンを備える。 The first CPU unit 42 is disposed near the air outlet 35a of the second fan unit 34b. The first CPU unit 42 includes a first CPU 45 mounted on the substrate 41 and a first heat sink 47 mounted on the first CPU 45. The first heat sink 47 includes a plurality of radiating fins standing at a predetermined pitch Pt1.

　第２ＣＰＵユニット４３は右側の第１ファンユニット３４ａの後方であって、第１ＣＰＵユニット４２よりも後方の位置に配置されている。 The second CPU unit 43 is arranged behind the right first fan unit 34a and behind the first CPU unit 42.

　第２ＣＰＵユニット４３は、基板４１上に搭載される第２ＣＰＵ４６と、第２ＣＰＵ４６上に搭載される第２ヒートシンク４８と、を備える。第２ヒートシンク４８は所定のピッチＰｔ２で立設された複数の放熱フィンを備える。第２ヒートシンク４８の上端は、第１ヒートシンク４７よりも高い所定位置に配される。 The second CPU unit 43 includes a second CPU 46 mounted on the substrate 41 and a second heat sink 48 mounted on the second CPU 46. The second heat sink 48 includes a plurality of heat radiation fins erected at a predetermined pitch Pt2. The upper end of the second heat sink 48 is disposed at a predetermined position higher than the first heat sink 47.

　ＲＡＩＤカードユニット４４は、第１ＣＰＵユニット４２の後方に配置される。ＲＡＩＤカードユニット４４は、基板４１上に立設し、各種電子部品が搭載された複数のＲＡＩＤカード４４ａを備える。ＲＡＩＤカード４４ａの上端部は、例えば第１ヒートシンク４７の上端よりも高く、第２ヒートシンク４８の上端と同程度の高さを有している。 The RAID card unit 44 is arranged behind the first CPU unit 42. The RAID card unit 44 includes a plurality of RAID cards 44a that are erected on the substrate 41 and on which various electronic components are mounted. The upper end portion of the RAID card 44 a is, for example, higher than the upper end of the first heat sink 47 and has the same height as the upper end of the second heat sink 48.

　流路ガイド部２０は耐熱性及び加工性に優れた透明な樹脂材料から成形される。流路ガイド部２０は、基板ユニット１２の外形に沿って形成され、基板ユニット１２を覆うとともに、流路を複数に分割する、複数の壁状部材を一体に備えて構成される。流路ガイド部２０は、基板ユニット１２上に配置されることで、冷却ユニット１７から基板ユニット１２を通って後方に抜ける複数の流路Ｆ１，Ｆ２，Ｆ３を形成する。 The flow path guide part 20 is molded from a transparent resin material having excellent heat resistance and workability. The flow path guide unit 20 is formed along the outer shape of the substrate unit 12 and integrally includes a plurality of wall-like members that cover the substrate unit 12 and divide the flow path into a plurality of parts. The flow path guide unit 20 is disposed on the substrate unit 12 to form a plurality of flow paths F1, F2, and F3 that pass backward from the cooling unit 17 through the substrate unit 12.

　流路ガイド部２０は、第２ファンユニット３４ｂの二次側で第１ヒートシンク４７上に配される仕切壁である第１蓋壁２１と、第１ファンユニット３４ａの二次側から第２ヒートシンク４８に至る第２流路を区画するダクト部２２と、電源ユニットを覆う電源カバー部２３と、を連続して一体に備える。 The flow path guide unit 20 includes a first lid wall 21 that is a partition wall disposed on the first heat sink 47 on the secondary side of the second fan unit 34b, and a second heat sink from the secondary side of the first fan unit 34a. The duct part 22 which divides the 2nd flow path which reaches 48, and the power supply cover part 23 which covers a power supply unit are provided continuously and integrally.

　第１蓋壁２１は、第２ファンユニット３４ｂの送風口３５ａの二次側において、高さ方向に交差して延び、空間を上下に区画する板状部材である。第１蓋壁２１は、第２ファンユニット３４ｂの送風口３５ａのＺ方向の中央付近の高さに配され、ＸＹ平面に沿って配される。第１蓋壁２１は第１ヒートシンク４７の上端に僅かな隙間を空けて対向配置される。第１蓋壁２１の端部には締結部材により筐体１１へ締結される複数の取付片が設けられている。 The first lid wall 21 is a plate-like member that extends across the height direction on the secondary side of the air blowing port 35a of the second fan unit 34b and divides the space vertically. The first lid wall 21 is disposed at a height near the center in the Z direction of the air blowing port 35a of the second fan unit 34b, and is disposed along the XY plane. The first lid wall 21 is disposed opposite to the upper end of the first heat sink 47 with a slight gap. A plurality of attachment pieces that are fastened to the housing 11 by fastening members are provided at the end of the first lid wall 21.

　第１蓋壁２１は、第１ＣＰＵ４５の中心部より僅かに前方に絞り部２１ａを有する。絞り部２１ａは第１蓋壁２１の一部が斜めに下降する面により連続する段差で構成される。すなわち、第１蓋壁２１は、異なる高さの面が傾斜面である絞り部２１ａにより連続している。絞り部２１ａよりも二次側において第１ヒートシンク４７と第１蓋壁２１との間の隙間の距離が縮小する。絞り部２１ａの後部において例えば第１ヒートシンク４７と第１蓋壁２１との間の距離Ｓ１は、ヒートシンクの放熱フィンのピッチＰｔ１よりも狭く構成されている。 The first lid wall 21 has a narrowed portion 21a slightly ahead of the center of the first CPU 45. The narrowed portion 21a is formed of a step which is continuous by a surface in which a part of the first lid wall 21 descends obliquely. That is, the first lid wall 21 is continuous by the narrowed portion 21a whose surfaces having different heights are inclined surfaces. The distance of the gap between the first heat sink 47 and the first lid wall 21 is reduced on the secondary side of the throttle portion 21a. For example, a distance S1 between the first heat sink 47 and the first lid wall 21 is configured to be narrower than the pitch Pt1 of the heat sink fins of the heat sink at the rear portion of the throttle portion 21a.

　第１蓋壁２１の上面には、上方に立設され第１ガイドリブ２１ｂ及び第２ガイドリブ２１ｃが形成されている。第１ガイドリブ２１ｂ及び第２ガイドリブ２１ｃは、所定の厚さを有し、後方に向けて中央側に変位するように斜めに延びる壁状部材である。第１ガイドリブ２１ｂ及び第２ガイドリブ２１ｃは、第２蓋壁２４と同等の高さに構成される。第１ガイドリブ２１ｂと第２ガイドリブ２１ｃとの間は所定距離離間して配され、冷却風が通過可能な第１開口部２１ｄを形成する。 A first guide rib 21b and a second guide rib 21c are formed on the upper surface of the first lid wall 21 so as to stand upward. The first guide rib 21b and the second guide rib 21c are wall-shaped members having a predetermined thickness and extending obliquely so as to be displaced toward the center toward the rear. The first guide rib 21 b and the second guide rib 21 c are configured to have a height equivalent to that of the second lid wall 24. The first guide rib 21b and the second guide rib 21c are spaced apart from each other by a predetermined distance to form a first opening 21d through which cooling air can pass.

　第１蓋壁２１の下側に、冷却ユニット１７から第１ヒートシンク４７に至る第１流路Ｆ１が形成される。 A first flow path F1 extending from the cooling unit 17 to the first heat sink 47 is formed below the first lid wall 21.

　ダクト部２２は、第１ファンユニット３４ａの送風口３５ａの近傍から一定幅で所定距離後方に延び、さらに後方に向けて斜めに変位するとともに幅寸法を拡大し、後部において第２ヒートシンク４８の上方及び側方を覆う。 The duct portion 22 extends rearward from the vicinity of the air blowing port 35a of the first fan unit 34a by a predetermined width, and further displaces obliquely toward the rear and expands the width dimension. And cover the sides.

　ダクト部２２は、第２蓋壁２４と、第２蓋壁２４の両側縁に配される一対のガイド側壁２５、２６と、を備える。ダクト部２２は、第１ファンユニット３４ａの送風口３５ａの近傍から、第２ヒートシンク４８に至る第２流路Ｆ２を形成する。 The duct portion 22 includes a second lid wall 24 and a pair of guide side walls 25 and 26 disposed on both side edges of the second lid wall 24. The duct portion 22 forms a second flow path F2 extending from the vicinity of the air blowing port 35a of the first fan unit 34a to the second heat sink 48.

　第２蓋壁２４は、第１ファンユニット３４ａの送風口３５ａの先方であって、送風口３５ａよりも上の高さ位置に配される。第２蓋壁２４は、高さ方向に交差して配され、空間を上下に区画する壁状部材である。第２蓋壁２４は、第１蓋壁２１よりも所定距離上方に配置され、ＸＹ平面に沿って底板１１ａと平行に延びている。 The second lid wall 24 is disposed at the height of the first fan unit 34a at the tip of the air outlet 35a and above the air outlet 35a. The second lid wall 24 is a wall-like member that is arranged to intersect the height direction and divides the space vertically. The second lid wall 24 is disposed at a predetermined distance above the first lid wall 21 and extends in parallel with the bottom plate 11a along the XY plane.

　第２蓋壁２４の第２ＣＰＵユニット４３の中心よりも前方の所定位置に対向する部位には、絞り部２４ａが形成されている。絞り部２４ａは、第２蓋壁２４の所定箇所において位置が低くなるように斜めに下降する段差で構成される。第２蓋壁２４の絞り部２４ａよりも後方の領域は、第２ヒートシンク４８の上端に僅かな隙間を空けて対向配置される。絞り部２４ａよりも二次側において第２ヒートシンク４８と第２蓋壁２４の間の距離Ｓ２は、第２ヒートシンク４８の放熱フィンのピッチＰｔ２よりも狭く設定されている。 A throttle portion 24a is formed in a portion of the second lid wall 24 facing a predetermined position ahead of the center of the second CPU unit 43. The narrowed portion 24a is configured by a step that descends obliquely so that the position is lowered at a predetermined position of the second lid wall 24. A region behind the throttle portion 24 a of the second lid wall 24 is disposed opposite to the upper end of the second heat sink 48 with a slight gap. The distance S2 between the second heat sink 48 and the second lid wall 24 on the secondary side of the throttle portion 24a is set to be narrower than the pitch Pt2 of the radiating fins of the second heat sink 48.

　ガイド側壁２５、２６は、ＺＹ平面に沿って延びる壁状部材であり、空間を送風ファンの並列方向であるＸ方向において複数に仕切る。一方のガイド側壁２５（第１側壁部）は第２蓋壁２４の一方の側縁から下方に延びる。ガイド側壁２５は２カ所に分割され、前側壁２５ａと後側壁２５ｂを有している。ガイド側壁２５の前側壁２５ａは下端が第１蓋壁２１の他方の側縁の一部に至る。言い換えると、ガイド側壁２５の前側壁２５ａは、第１蓋壁２１の側縁から立設している。前側壁２５ａと後側壁２５ｂとの間に所定幅の第２開口部２５ｃが形成される。当該第２開口部２５ｃを通じてダクト部２２内の第２流路Ｆ２が第１蓋壁２１上の空間に連通している。他方のガイド側壁２６は、第２蓋壁２４の全長にわたって形成されている。 The guide side walls 25 and 26 are wall-like members extending along the ZY plane, and partition the space into a plurality in the X direction, which is the parallel direction of the blower fans. One guide side wall 25 (first side wall portion) extends downward from one side edge of the second lid wall 24. The guide side wall 25 is divided into two portions, and has a front side wall 25a and a rear side wall 25b. The front side wall 25 a of the guide side wall 25 reaches a part of the other side edge of the first lid wall 21 at the lower end. In other words, the front side wall 25 a of the guide side wall 25 stands from the side edge of the first lid wall 21. A second opening 25c having a predetermined width is formed between the front side wall 25a and the rear side wall 25b. The second flow path F2 in the duct part 22 communicates with the space on the first lid wall 21 through the second opening 25c. The other guide side wall 26 is formed over the entire length of the second lid wall 24.

　ダクト部２２の下側においてガイド側壁２５，２６で囲まれる領域に、第１ファンユニット３４ａから第２ヒートシンク４８に至る第２流路Ｆ２が形成される。 A second flow path F <b> 2 extending from the first fan unit 34 a to the second heat sink 48 is formed in a region surrounded by the guide side walls 25 and 26 below the duct portion 22.

　ガイド側壁２５の後部は、第２ヒートシンク４８の側壁に沿う内壁である後側壁２５ｂと、後側壁２５ｂの外側に延びる所定幅の底壁部２５ｄと底壁部２５ｄの他端から立設される外壁部２５ｅが一体に設けられ、２重構造に形成されている。ガイド側壁２５は、所定の幅を有する。ガイド側壁２５は、第２ヒートシンク４８とＲＡＩＤカードユニット４４との間の隙間を狭めることで、当該隙間に風が逃げることを抑制し、ＲＡＩＤカードユニット４４が効果的に冷却されるように送風方向を案内する。 The rear part of the guide side wall 25 is erected from a rear side wall 25b which is an inner wall along the side wall of the second heat sink 48, a bottom wall part 25d having a predetermined width extending outside the rear side wall 25b, and the other end of the bottom wall part 25d. The outer wall portion 25e is provided integrally and formed in a double structure. The guide side wall 25 has a predetermined width. The guide side wall 25 narrows the gap between the second heat sink 48 and the RAID card unit 44, thereby suppressing the escape of wind into the gap and the air blowing direction so that the RAID card unit 44 is effectively cooled. To guide you.

　ガイド側壁２５の外側には、第２ファンユニット３４ｂの送風口３５ａの近傍から第１蓋壁２１上を通ってＲＡＩＤカードユニット４４に至る第３流路Ｆ３が形成される。 A third flow path F3 extending from the vicinity of the air blowing port 35a of the second fan unit 34b to the RAID card unit 44 through the first lid wall 21 is formed outside the guide side wall 25.

　ガイド側壁２６（第２側壁部）は、第２ヒートシンク４８の側部に沿う内壁部２６ｃと、所定幅の底壁部２６ｄと底壁部２６ｄの他端から立設される内壁部２６ｃと対向する外壁部２６ｅと、を一体に備えている。ガイド側壁２６は、第２ヒートシンク４８と電源ユニット１６との間の隙間を埋める所定の幅を有する。ガイド側壁２６は、当該隙間に風が逃げるのを抑制し、第２ヒートシンク４８が効果的に冷却されるように送風方向を案内する。外壁部２６ｅの上端縁は電源カバー部２３に連続している。 The guide side wall 26 (second side wall portion) is opposed to the inner wall portion 26c along the side portion of the second heat sink 48, the bottom wall portion 26d having a predetermined width, and the inner wall portion 26c erected from the other end of the bottom wall portion 26d. And an outer wall portion 26e. The guide side wall 26 has a predetermined width that fills the gap between the second heat sink 48 and the power supply unit 16. The guide side wall 26 prevents the wind from escaping through the gap and guides the blowing direction so that the second heat sink 48 is effectively cooled. The upper end edge of the outer wall portion 26 e is continuous with the power source cover portion 23.

　ガイド側壁２６の内壁部２６ｃは、絞り部２４ａにおいて、ダクト部２２の中央寄りに変位して傾斜している。すなわち、絞り部２４ａにおいて、ダクト部２２の流路は内壁部２６ｃによってＺ方向に加え、Ｘ方向においても狭められ、流速が上がるように構成されている。 The inner wall part 26c of the guide side wall 26 is displaced and inclined toward the center of the duct part 22 in the throttle part 24a. That is, in the throttle part 24a, the flow path of the duct part 22 is narrowed not only in the Z direction but also in the X direction by the inner wall part 26c, so that the flow velocity is increased.

　電源カバー部２３は、電源ユニット１６上に対向して被せられる板状部材である。電源カバー部２３の端縁部には締結部材により筐体１１へ締結される複数の取付片が設けられている。 The power supply cover 23 is a plate-like member that is placed on the power supply unit 16 so as to face the power supply unit 16. A plurality of attachment pieces that are fastened to the housing 11 by fastening members are provided at the edge of the power supply cover portion 23.

　以上のように構成された流路ガイド部２０は、基板ユニット１２の上から被せられ、外周部に設けられた複数の取付片２８においてボルト等の締結部材により筐体１１に固定される。 The flow path guide portion 20 configured as described above is placed over the substrate unit 12 and is fixed to the housing 11 by fastening members such as bolts at a plurality of mounting pieces 28 provided on the outer peripheral portion.

　流路ガイド部２０の各部の形状及びサイズは、複数の冷却対象部の発熱量に応じた送風分配割合に基づいて決定される。すなわち、２つのファンユニット３４ａ，３４ｂからの風量が、各ユニット４２，４３，４４の発熱量に対応する配分で３つの流路Ｆ１，Ｆ２，Ｆ３に案内されるように、設定される。ここで、例えば第１ＣＰＵユニット４２の発熱量と、第２ＣＰＵユニット４３の発熱量が同程度であり、ＲＡＩＤカードユニット４４の発熱量がその１／３程度である。 The shape and size of each part of the flow path guide part 20 are determined based on the air distribution ratio according to the heat generation amount of the plurality of cooling target parts. That is, the air volume from the two fan units 34a and 34b is set so as to be guided to the three flow paths F1, F2, and F3 with a distribution corresponding to the heat generation amount of the units 42, 43, and 44. Here, for example, the heat generation amount of the first CPU unit 42 and the heat generation amount of the second CPU unit 43 are approximately the same, and the heat generation amount of the RAID card unit 44 is approximately 1/3 thereof.

　本実施形態において、制御部によりファンモータ５５を回転駆動すると、空気がＨＤＤユニット１３の上下に形成された吸気側の通風路を通って、吸気口からファンケースに吸い込まれ、送風口３５ａから、基板ユニット１２に向けて、後方に、送風される。 In the present embodiment, when the fan motor 55 is rotationally driven by the control unit, the air is sucked into the fan case from the air inlet through the air intake passage formed above and below the HDD unit 13, and from the air outlet 35a, The air is blown backward toward the substrate unit 12.

　このとき、送風口３５ａから送られた空気は、送風口３５ａの先方に設けられた流路ガイド部２０によって、案内される。すなわち、２つのファンユニット３４ａ、３４ｂからの空気は、一方側において第１蓋壁２１によって上下に分割されるとともに、他方側においてダクト部２２に案内される。 At this time, the air sent from the air blowing port 35a is guided by the flow path guide unit 20 provided at the front of the air blowing port 35a. That is, the air from the two fan units 34a and 34b is vertically divided by the first lid wall 21 on one side and guided to the duct portion 22 on the other side.

　第１蓋壁２１上に案内された空気は、さらに第１ガイドリブ２１ｂ、第２ガイドリブ２１ｃによって案内され、一部が第１開口部２１ｄから第３流路Ｆ３に案内され、一部は第２開口部２５ｃからダクト部２２内に案内される。第１流路Ｆ１に案内された空気は、第１ＣＰＵユニット４２を冷却する。また、第２流路Ｆ２に案内された空気は、第２ＣＰＵユニット４３を冷却する。さらに第３流路Ｆ３に案内された空気はＲＡＩＤカードユニット４４を冷却する。 The air guided onto the first lid wall 21 is further guided by the first guide rib 21b and the second guide rib 21c, partly guided from the first opening 21d to the third flow path F3, and partly second. Guided into the duct portion 22 from the opening 25c. The air guided to the first flow path F1 cools the first CPU unit 42. The air guided to the second flow path F2 cools the second CPU unit 43. Further, the air guided to the third flow path F3 cools the RAID card unit 44.

　このとき、第１蓋壁２１及び第２蓋壁２４に形成された絞り部２１ａ，２４ａによって、空気の流速を増加させることで、特に発熱量の多い部位の、冷却性能を高めることができる。 At this time, by increasing the air flow rate by the throttle portions 21a and 24a formed on the first lid wall 21 and the second lid wall 24, it is possible to improve the cooling performance particularly in a portion having a large amount of heat generation.

　以上の様に構成された電子機器１０によれば、基板ユニット１２を覆うとともに、流路を複数に分割する流路ガイド部２０を設けることにより冷却ユニット１７からの風量を、複数箇所の冷却対象へ適正に分配することができ、効果的な冷却が実現できる。 According to the electronic apparatus 10 configured as described above, the flow rate from the cooling unit 17 is reduced by providing the flow path guide portion 20 that covers the substrate unit 12 and divides the flow path into a plurality of cooling targets. Can be distributed properly and effective cooling can be realized.

　具体的には、ダクト部２２と第１蓋壁２１により、風量を上下及び左右に分割することで、異なる位置に有るヒートシンクに効果的に案内できる。 Specifically, the duct portion 22 and the first lid wall 21 can effectively guide the heat sinks at different positions by dividing the air volume vertically and horizontally.

　また、二次側の第２ヒートシンク４８の高さを一次側の第１ヒートシンク４７よりも高く設定したことで、二次側の第２ヒートシンク４８にも所望の風量を分配できる。すなわち、例えば一般的に同じ高さのヒートシンクを前後に複数並べた配置では、二次側のヒートシンクには一次側の第１ヒートシンク４７で暖められた空気が供給されるため、冷却効率が低くなるが、本実施形態によれば二次側の第２ヒートシンク４８にも冷たい空気を確実に供給することができる。 Also, by setting the height of the secondary-side second heat sink 48 higher than that of the primary-side first heat sink 47, a desired air volume can be distributed also to the secondary-side second heat sink 48. That is, for example, in an arrangement in which a plurality of heat sinks of the same height are generally arranged at the front and back, the air heated by the first heat sink 47 on the primary side is supplied to the secondary heat sink, so that the cooling efficiency is lowered. However, according to the present embodiment, cold air can be reliably supplied to the second heat sink 48 on the secondary side.

　また、上記実施形態においては、第１蓋壁２１及び第２蓋壁２４でヒートシンク４７，４８上を覆うことで、冷却風が上方に逃げることを抑制し、冷却効果を高めることができる。さらに、第１蓋壁２１及び第２蓋壁２４に絞り部２１ａ，２４ａを形成したことにより発熱量の高い所望の部位で流速を上げることで、効果的に冷却することが可能となる。 Moreover, in the said embodiment, by covering the heat sinks 47 and 48 with the 1st cover wall 21 and the 2nd cover wall 24, it can suppress that a cooling wind escapes upwards and can improve a cooling effect. Furthermore, by forming the narrowed portions 21a and 24a on the first lid wall 21 and the second lid wall 24, it is possible to effectively cool by increasing the flow velocity at a desired portion where the calorific value is high.

　本実施形態において、複数のファンユニット３４ａ、３４ｂを並列に配置したが、第１流路Ｆ１及び第２流路Ｆ２は、双方のファンユニット３４ａ、３４ｂにそれぞれ連通する構成としたことにより、いずれかのファンユニット３４ａ、３４ｂが故障した場合に、残りのファンユニット３４ａ，３４ｂの冷風を分配することができ、冷却性能を維持できる。 In the present embodiment, the plurality of fan units 34a and 34b are arranged in parallel. However, the first flow path F1 and the second flow path F2 are configured to communicate with both the fan units 34a and 34b, respectively. When the fan units 34a and 34b fail, the cooling air of the remaining fan units 34a and 34b can be distributed, and the cooling performance can be maintained.

　また、例えば上記実施形態においては、ガイド側壁２５，２６を二重構造にしてデッドスペースを無くし、流路ガイド部２０の形状を基板ユニット１２の外形に沿う形状とすることで、冷却風が逃げることを抑制でき、冷却風を効率的に利用できる。 For example, in the above embodiment, the guide side walls 25 and 26 have a double structure to eliminate a dead space, and the shape of the flow path guide portion 20 is made to conform to the outer shape of the substrate unit 12 so that the cooling air escapes. This can be suppressed and cooling air can be used efficiently.

　さらに、流路ガイド部２０を透明な樹脂から構成することで、流路ガイド部２０が取付けられた状態でも配線状況を確認することが可能である。また、流路ガイド部２０に設けられる複数の壁状部材によって、流路の区画に加え、各種ケーブルの位置の規定もできるため、配線作業の作業性を向上できる。 Furthermore, by configuring the flow path guide portion 20 from a transparent resin, it is possible to check the wiring status even when the flow path guide portion 20 is attached. Further, since the plurality of wall-like members provided in the flow path guide portion 20 can define the positions of various cables in addition to the sections of the flow paths, the workability of the wiring work can be improved.

　本発明は上記実施形態に限定されるものではない。 The present invention is not limited to the above embodiment.

　例えば流路ガイド部２０は透明な樹脂材料で構成したが、これに限られるものではなく、金属など他の材料で形成してもよい。 For example, the flow path guide portion 20 is made of a transparent resin material, but is not limited thereto, and may be made of other materials such as metal.

　例えば上記実施形態においては、基板ユニット１２の形状や各部の発熱量に応じて流路ガイド部２０を上述の形状に構成したが、これに限られるものではない。例えば各ユニット４２，４３，４４の位置関係や数に応じて適宜壁状部材の位置や形状を変更することが可能である。また，冷却対象部の位置や数に応じて流路を増減できる。 For example, in the above-described embodiment, the flow path guide unit 20 is configured in the above-described shape in accordance with the shape of the substrate unit 12 and the amount of heat generated in each unit, but is not limited thereto. For example, the position and shape of the wall-shaped member can be changed as appropriate according to the positional relationship and number of the units 42, 43, and 44. In addition, the number of flow paths can be increased or decreased according to the position and number of cooling target portions.

　なお、本発明のいくつかの実施形態を説明したが、これらの実施形態は、例として提示したものであり、発明の範囲を限定することは意図していない。これら新規な実施形態は、その他の様々な形態で実施されることが可能であり、発明の要旨を逸脱しない範囲で、種々の省略、置き換え、変更を行うことができる。これら実施形態やその変形は、発明の範囲や要旨に含まれるとともに、特許請求の範囲に記載された発明とその均等の範囲に含まれる。 In addition, although several embodiment of this invention was described, these embodiment is shown as an example and is not intending limiting the range of invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

Claims (7)

　筐体内に配され、第１冷却対象部と、第２冷却対象部と、を備える冷却対象ユニットと、
　前記冷却対象ユニット上に配され、前記筐体内の空間を複数に仕切る壁状部材を有し、前記第１冷却対象部を通る第１流路と、前記第２冷却対象部を通る第２流路と、を形成する、流路ガイド部と、
を備える、電子機器。 A cooling target unit that is arranged in the housing and includes a first cooling target part and a second cooling target part;
A first flow path that passes through the first cooling target portion and a second flow that passes through the second cooling target portion; and a wall-like member that is disposed on the cooling target unit and that divides the space in the housing into a plurality of spaces. A flow path guide part forming a path;
An electronic device. 　送風装置を備え、
　前記第１冷却対象部は、前記送風装置の送風方向下流側に配され、
　前記第２冷却対象部は、前記第１冷却対象部よりも前記送風方向下流側に配され、
　前記第１冷却対象部と前記第２冷却対象部とは、前記送風装置に対して前記送風方向上流に向けて投影した場合に重なる位置に配され、
　前記流路ガイド部は、前記送風装置の送風方向下流側の空間を、前記送風方向と交差する第１方向に複数に分割する第１側壁部と、前記第１側壁部の第１方向一方側に延び前記第１冷却対象部上を覆う第１蓋壁と、前記第１側壁部の第１方向他方側に延びる第２蓋壁と、を有し、
　前記第１側壁部及び前記第２蓋壁は、前記第１冷却対象部よりも前記送風方向下流側に延び、送風方向下流側の部位において前記第２蓋壁が前記第２冷却対象部上を覆うとともに前記第１側壁部が前記第２冷却対象部の第１方向一方側の側方を覆う、請求項１記載の電子機器。 With a blower,
The first cooling target part is disposed on the downstream side in the blowing direction of the blower,
The second cooling target part is arranged on the downstream side in the blowing direction from the first cooling target part,
The first cooling target part and the second cooling target part are arranged at positions overlapping when projected toward the upstream in the air blowing direction with respect to the air blowing device,
The flow path guide portion includes a first side wall portion that divides a space on the downstream side in the air blowing direction of the blower device into a plurality of first directions intersecting the air blowing direction, and one side in the first direction of the first side wall portion. A first lid wall that extends to cover the first object to be cooled, and a second lid wall that extends to the other side of the first side wall in the first direction,
The first side wall portion and the second lid wall extend further downstream in the air blowing direction than the first cooling target portion, and the second lid wall extends on the second cooling target portion in a portion on the downstream side in the air blowing direction. The electronic device according to claim 1, wherein the first side wall portion covers a side of one side in the first direction of the second cooling target portion while being covered. 　前記送風装置は、複数の送風ファンを前記第１方向に並列して備え、
　前記冷却対象ユニットは、前記筐体内の底部に配される基板を備える基板ユニットであり、
　前記第１冷却対象部は、前記基板上に配される第１ＣＰＵと、第１ＣＰＵ上に配される第１の放熱フィンと、を備える第１のＣＰＵユニットであり、
　前記第２冷却対象部は、前記基板の前記第１ＣＰＵよりも送風方向下流側に配される第２ＣＰＵと、前記第２ＣＰＵ上に配されるとともに前記第１の放熱フィンよりも高さが高い第２の放熱フィンと、を備える第２のＣＰＵユニットであり、
　前記第２蓋壁は、前記第１蓋壁より高い位置に配され、
　前記第１蓋壁下に、前記第１冷却対象部に至る前記第１流路が形成され、
　前記第１側壁部は、前記第２蓋壁の前記第１方向一方の側縁から下方に延び、前記第１蓋壁の第１方向他方側の側縁に接続され、
　前記第２蓋壁の第１方向他方側の側縁から下方に延びる第２側壁部が設けられ、
　前記第２蓋壁と前記第１側壁部と前記第２側壁部とで構成されるダクト部により、前記第１流路の第１方向他方側から、送風方向下流側に延びて前記第２冷却対象部に至る、前記第２流路が形成される、請求項２に記載の電子機器。 The blower device includes a plurality of blower fans arranged in parallel in the first direction,
The cooling target unit is a substrate unit including a substrate disposed on a bottom portion in the housing,
The first cooling target portion is a first CPU unit including a first CPU disposed on the substrate and a first heat radiation fin disposed on the first CPU,
The second cooling target portion is disposed on the second CPU on the downstream side in the air blowing direction with respect to the first CPU of the substrate, and on the second CPU, and is higher in height than the first heat radiation fin. A second CPU unit comprising two radiating fins,
The second lid wall is disposed at a position higher than the first lid wall;
The first flow path reaching the first cooling target portion is formed under the first lid wall,
The first side wall portion extends downward from one side edge in the first direction of the second lid wall, and is connected to a side edge on the other side in the first direction of the first lid wall;
A second side wall portion extending downward from a side edge on the other side in the first direction of the second lid wall is provided;
By the duct part comprised by the said 2nd cover wall, the said 1st side wall part, and the said 2nd side wall part, it extends in the ventilation direction downstream from the 1st direction other side of the said 1st flow path, and the said 2nd cooling The electronic device according to claim 2, wherein the second flow path reaching the target portion is formed. 　前記第１蓋壁または前記第２蓋壁は、前記第１冷却対象部または前記第２冷却対象部の中心よりも送風方向上流側に、前記第１流路または前記第２流路が縮小するように下方に変位する絞り部を備える、請求項２または請求項３に記載の電子機器。 In the first lid wall or the second lid wall, the first flow path or the second flow path is reduced upstream of the center of the first cooling target part or the second cooling target part in the air blowing direction. The electronic device according to claim 2, further comprising a throttle portion that is displaced downward as described above. 　前記第１蓋壁及び前記第１冷却対象部より前記送風方向下流側に配される第３冷却対象部を備え、
　前記第１蓋壁は、空間を高さ方向に分割し、
　前記第１側壁部の前記第１方向一方側に、前記第１蓋壁の上側を通って第３冷却対象部に至る第３流路が形成される、請求項２乃至４のいずれかに記載の電子機器。 A third cooling target portion disposed downstream of the first lid wall and the first cooling target portion in the blowing direction;
The first lid wall divides the space in the height direction,
5. The third flow path is formed on one side in the first direction of the first side wall portion, through which a third flow path that reaches the third cooling target portion through the upper side of the first lid wall is formed. Electronic equipment. 　前記第１側壁部は、前側壁と後側壁とを有するとともに、前記第１蓋壁上の空間と前記第２流路との間に配され、前記前側壁と前記後側壁との間に、前記第１蓋壁上の空間と前記第２蓋壁下の前記第２流路とを連通する開口を有し、
　前記第１蓋壁の上面には、上方に延びる壁状部材であって、送風方向下流側が前記第２流路側に延び、前記第１側壁部の前記開口に向かう、ガイドリブが設けられる、請求項３乃至請求項５のいずれかに記載の電子機器。 The first side wall portion has a front side wall and a rear side wall, and is disposed between the space on the first lid wall and the second flow path, and between the front side wall and the rear side wall, An opening communicating the space on the first lid wall and the second flow path below the second lid wall;
The upper surface of the first lid wall is provided with a guide rib that is an upwardly extending wall-like member that extends toward the second flow path side on the downstream side in the air blowing direction and toward the opening of the first side wall portion. The electronic device according to any one of claims 3 to 5. 　前記流路ガイドは、透明な材料で構成される複数の壁状部材を一体に有するとともに、
　前記冷却対象部上から被せられた状態で前記筐体に締結される取付け部を、一体に備える、請求項１乃至６のいずれかに記載の電子機器。 The flow path guide integrally has a plurality of wall-shaped members made of a transparent material,
The electronic device according to claim 1, wherein the electronic device is integrally provided with an attachment portion that is fastened to the housing in a state of being covered from the cooling target portion.
PCT/JP2017/038206 2016-11-04 2017-10-23 Electronic apparatus Ceased WO2018084016A1 (en)

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