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WO2018066548A1 - Composition de résine d'encapsulation et feuille d'encapsulation - Google Patents

Composition de résine d'encapsulation et feuille d'encapsulation Download PDF

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Publication number
WO2018066548A1
WO2018066548A1 PCT/JP2017/035942 JP2017035942W WO2018066548A1 WO 2018066548 A1 WO2018066548 A1 WO 2018066548A1 JP 2017035942 W JP2017035942 W JP 2017035942W WO 2018066548 A1 WO2018066548 A1 WO 2018066548A1
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WO
WIPO (PCT)
Prior art keywords
resin
resin composition
epoxy resin
composition according
hydrotalcite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2017/035942
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English (en)
Japanese (ja)
Inventor
有希 久保
英治 馬場
恒介 堀次
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Priority to JP2018543913A priority Critical patent/JP7120017B2/ja
Priority to KR1020197010943A priority patent/KR102465011B1/ko
Priority to CN201780061227.9A priority patent/CN109804035A/zh
Publication of WO2018066548A1 publication Critical patent/WO2018066548A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations

Definitions

  • the present invention relates to a sealing resin composition and a sealing sheet, and particularly for sealing suitable for sealing light-emitting elements such as organic EL (Electroluminescence) elements and photoelectric conversion elements such as light-receiving elements such as solar cells.
  • the present invention relates to a resin composition and a sealing sheet.
  • An organic EL element is a light emitting element using an organic substance as a light emitting material, and has recently attracted attention because it can emit light with high luminance at a low voltage.
  • organic EL elements are extremely vulnerable to moisture, and the light emitting material (light emitting layer) is altered by moisture, resulting in a decrease in luminance, no light emission, or peeling of the interface between the electrode and the light emitting layer due to moisture.
  • the metal is oxidized to increase the resistance. Therefore, in order to block the inside of the element from moisture in the outside air, for example, a sealing layer is formed with a resin composition so as to cover the entire surface of the light emitting layer formed on the substrate, thereby sealing the organic EL element. Is done.
  • the sealing layer of such an organic EL element is required to have a high moisture barrier property. Furthermore, in the case of a structure for extracting light from a sealing surface or a transmissive structure for applications such as a display, a touch panel, and lighting, the sealing layer is also required to have high transparency. Thus, there is a demand for a resin composition that can form a sealing layer having both high moisture barrier properties and transparency.
  • Patent Document 1 describes that moisture barrier properties are improved by including a hygroscopic metal oxide in a resin composition.
  • Patent Document 2 describes a sealing resin composition containing baked hydrotalcite.
  • An object of the present invention is to provide a sealing resin composition capable of forming a sealing layer excellent in both moisture barrier properties and transparency.
  • the present inventors formulated semi-baked hydrotalcite into a sealing resin composition containing a thermosetting resin, and refracted the cured product of the resin composition.
  • the rate so as to satisfy a specific numerical range
  • the cured product of the resin composition exhibits high transparency, and the moisture blocking property is maintained over a long period of time. It was found that it can be suppressed.
  • the present invention based on such knowledge is as follows.
  • a resin composition comprising (A) a thermosetting resin, (B) semi-calcined hydrotalcite, and (C) a curing agent, wherein the refractive index of the cured product of the resin composition is 1.48 to 1.
  • a sealing resin composition of .54. [2] The resin composition according to [1], wherein (A) the thermosetting resin includes a thermosetting resin having a refractive index of 1.48 to 1.54. [3] The resin composition according to [1] or [2], wherein (A) the thermosetting resin includes an aromatic ring-containing epoxy resin.
  • thermosetting resin includes an epoxy resin (a1) having a refractive index of 1.48 to 1.54 and an aromatic ring-containing epoxy resin (a2). object.
  • the epoxy resin (a1) having a refractive index of 1.48 to 1.54 is a hydrogenated epoxy resin, a fluorine-containing epoxy resin, a chain aliphatic epoxy resin, a cyclic aliphatic epoxy resin, and an alkylphenol epoxy.
  • the resin composition according to [4] which is one or more selected from resins.
  • the aromatic ring-containing epoxy resin (a2) is selected from bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin, biphenyl aralkyl type epoxy resin, fluorene type epoxy resin and fluorine-containing aromatic type epoxy resin.
  • (D) the curing accelerator is at least one selected from an imidazole compound, a tertiary amine compound, a dimethylurea compound, and an amine adduct compound.
  • the amount of (D) the curing accelerator is 0.05 to 10% by mass based on the entire nonvolatile content of the resin composition.
  • thermoplastic resin is a phenoxy resin.
  • amount of the thermoplastic resin (E) is 0.1 to 60% by mass with respect to the entire nonvolatile content of the resin composition.
  • the sealing sheet according to [19] which is used for sealing an organic EL element.
  • the encapsulating resin composition of the present invention it is possible to form an encapsulating layer excellent in both moisture barrier properties and transparency.
  • the encapsulating resin composition of the present invention is a resin composition comprising (A) a thermosetting resin, (B) semi-calcined hydrotalcite and (C) a curing agent, which is a cured product of the resin composition.
  • the refractive index is 1.48 to 1.54.
  • the refractive index of the cured product is preferably 1.49 to 1.54, more preferably 1.50 to 1.54, and further preferably 1.50 to 1.53 which is the same as the refractive index of semi-calcined hydrotalcite. preferable.
  • thermosetting resin having a refractive index of a cured product of the resin composition of 1.48 to 1.54 is used.
  • a thermosetting resin having a refractive index of 1.49 to 1.54 is preferable, a thermosetting resin having a refractive index of 1.50 to 1.54 is more preferable, and the refractive index is half.
  • the refractive index of the cured product of the resin composition can be adjusted by a thermosetting resin or other components (for example, a thermoplastic resin).
  • the (A) thermosetting resin preferably includes a thermosetting resin having a refractive index of 1.48 to 1.54.
  • the refractive index of the thermosetting resin is more preferably 1.49 to 1.54, still more preferably 1.50 to 1.54.
  • the content of the thermosetting resin having a refractive index of 1.48 to 1.54 is not particularly limited as long as the refractive index of the cured product of the resin composition is 1.48 to 1.54.
  • the refractive index of the entire thermosetting resin (A) used in the present invention is preferably 1.48 to 1.54, more preferably 1.49 to 1.54, and still more preferably 1.50 to 1.54. is there. In the case of using a plurality of thermosetting resins, it is preferable that the refractive index of the entire mixture is within the above range.
  • thermosetting resin is not particularly limited as long as the refractive index of the cured product of the resin composition is 1.48 to 1.54.
  • epoxy resin cyanate ester resin, phenol
  • examples thereof include resins, bismaleimide-triazine resins, polyimide resins, acrylic resins, vinyl benzyl resins, and among them, epoxy resins are preferable from the viewpoint of low temperature curability.
  • the epoxy resin is not particularly limited as long as the epoxy resin has a refractive index of 1.48 to 1.54 of the cured product of the resin composition.
  • an epoxy resin one having an average of two or more epoxy groups per molecule and having a high transmittance can be used.
  • hydrogenated epoxy resin hydrogenated bisphenol A type epoxy resin, hydrogenated bisphenol F type epoxy resin, etc.
  • fluorine-containing epoxy resin chain aliphatic type epoxy resin, cyclic aliphatic type epoxy resin, bisphenol A type epoxy resin , Biphenyl type epoxy resin, biphenyl aralkyl type epoxy resin, fluorene type epoxy resin, naphthol type epoxy resin, naphthalene type epoxy resin, bisphenol F type epoxy resin, phosphorus-containing epoxy resin, bisphenol S type epoxy resin, aromatic glycidylamine type epoxy Resin (for example, tetraglycidyldiaminodiphenylmethane, triglycidyl-p-aminophenol, diglycidyltoluidine, diglycidylaniline, etc.), alicyclic epoxy resin, phenol novolac type epoxy Fat, alkylphenol type epoxy resin, cresol novolak type epoxy resin, bisphenol A novolak type epoxy resin, epoxy resin having
  • Epoxy resin may be used alone or in combination of two or more.
  • the epoxy equivalent of the epoxy resin is preferably 50 to 5,000, more preferably 50 to 3,000, still more preferably 80 to 2,000, and particularly preferably 100 to 1,500 from the viewpoint of reactivity and the like.
  • the “epoxy equivalent” is the number of grams (g / eq) of a resin containing 1 gram equivalent of an epoxy group, and is measured according to the method defined in JIS K 7236.
  • the weight average molecular weight of the epoxy resin is preferably 5,000 or less.
  • the epoxy resin may be either liquid or solid, and a liquid epoxy resin and a solid epoxy resin may be used in combination.
  • “liquid” and “solid” are states of the epoxy resin at normal temperature (25 ° C.) and normal pressure (1 atm). From the viewpoint of coatability, workability, and adhesiveness, it is preferable that 10% by mass or more of the entire epoxy resin to be used is a liquid epoxy resin. From the viewpoint of kneadability with hydrotalcite and varnish viscosity, it is particularly preferable to use a liquid epoxy resin and a solid epoxy resin in combination.
  • the mass ratio of the liquid epoxy resin to the solid epoxy resin is preferably 1: 2 to 1: 0, and more preferably 1: 1.5 to 1: 0.
  • the thermosetting resin (A) preferably has a refractive index of 1.48 to 1.54, and is preferably a hydrogenated epoxy resin, a fluorine-containing epoxy resin, or a chain aliphatic epoxy.
  • a hydrogenated epoxy resin preferably a hydrogenated epoxy resin, a fluorine-containing epoxy resin, or a chain aliphatic epoxy.
  • a highly transparent cured product can be obtained.
  • “Hydrogenated epoxy resin” means an epoxy resin obtained by hydrogenating an aromatic ring-containing epoxy resin. The hydrogenation rate of the hydrogenated epoxy resin is preferably 50% or more, more preferably 70% or more.
  • “Chain aliphatic type epoxy resin” means an epoxy resin having a linear or branched alkyl chain or alkyl ether chain
  • “Cyclic aliphatic type epoxy resin” means a cyclic aliphatic in the molecule. It means an epoxy resin having a family skeleton, for example, a cycloalkane skeleton.
  • alkylphenol type epoxy resin means an epoxy resin having a benzene ring skeleton having one or more alkyl groups and one or more hydroxy groups as substituents, wherein the hydroxy groups are converted to glycidyl ether groups.
  • hydrogenated epoxy resin hydrogenated bisphenol A type epoxy resin and hydrogenated bisphenol F type epoxy resin are preferable.
  • an epoxy other than the preferred epoxy resin is used.
  • the resin may be contained in the thermosetting resin.
  • hydrogenated bisphenol A type epoxy resin examples include liquid hydrogenated bisphenol A type epoxy resin (for example, “YX8000” (manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: about 205), “Denacol EX-252” (Nagase ChemteX Corporation). Manufactured, epoxy equivalent: about 213)) and solid hydrogenated bisphenol A type epoxy resin (for example, “YX8040” (manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: about 1000)).
  • liquid hydrogenated bisphenol A type epoxy resin for example, “YX8000” (manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: about 205), “Denacol EX-252” (Nagase ChemteX Corporation). Manufactured, epoxy equivalent: about 213)
  • solid hydrogenated bisphenol A type epoxy resin for example, “YX8040” (manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: about 1000)
  • fluorine-containing epoxy resin for example, a fluorine-containing epoxy resin described in WO2011 / 0899947 can be used.
  • chain aliphatic epoxy resin examples include polyglycerol polyglycidyl ether (for example, “Denacol EX-512”, “Denacol EX-521”, manufactured by Nagase ChemteX Corporation), pentaerythritol polyglycidyl ether (for example, “ Denacol EX-411 ", manufactured by Nagase ChemteX Corporation), diglycerol polyglycidyl ether (for example,” Denacol EX-421 “, manufactured by Nagase ChemteX Corporation), glycerol polyglycidyl ether (for example,” Denacol EX-313 ",” Denacol EX-314 "(manufactured by Nagase ChemteX), trimethylolpropane polyglycidyl ether (for example,” Denacol EX-321 ", manufactured by Nagase ChemteX), neopentyl glycol diglycidyl ether (for example, Dena
  • cycloaliphatic epoxy resin examples include “EHPE-3150” manufactured by Daicel Chemical Industries, Ltd.
  • alkylphenol type epoxy resin examples include “HP-820” manufactured by DIC; “YDC-1312” manufactured by Nippon Steel & Sumikin Chemical Industry; “EX-146” manufactured by Nagase ChemteX.
  • the thermosetting resin includes an epoxy resin having a refractive index of 1.48 to 1.54 and containing an aromatic ring in the molecule (an aromatic ring-containing epoxy resin).
  • an epoxy resin having an aromatic ring structure in the molecule because any or all of the reactivity of the resin composition, the glass transition temperature of the cured product, and the adhesion tend to be improved.
  • thermosetting resins include alkylphenol type epoxy resins and fluorine-containing aromatic type epoxy resins.
  • thermosetting resin (A) is preferably an epoxy resin (a1) having a refractive index of 1.48 to 1.54 (hereinafter abbreviated as “resin (a1)”). And an aromatic ring-containing epoxy resin (a2) (hereinafter sometimes abbreviated as “resin (a2)”). Resin (a1) may be only 1 type, and 2 or more types may be sufficient as it. Similarly, the resin (a2) may be only one kind or two or more kinds.
  • the reactivity of the resin composition and the glass transition temperature and adhesion of the cured product tend to be improved.
  • the epoxy resin contains an aromatic ring
  • the refractive index tends to increase. Therefore, generally, there are few aromatic ring-containing epoxy resins that satisfy a refractive index of 1.48 to 1.54. Therefore, by using the resin (a1) and the resin (a2) in combination, it is possible to achieve both a desirable refractive index and the reactivity of the resin composition and the glass transition temperature and adhesion of the cured product.
  • the total content of the resin (a1) and the resin (a2) is not particularly limited as long as the above effect is achieved, but (A) the total thermosetting resin is preferably 60 to 100% by mass, more It is preferably 70 to 100% by mass, more preferably 80 to 100% by mass, particularly preferably 90 to 100% by mass, and most preferably 100% by mass.
  • the resin (a1) is not particularly limited as long as it is an epoxy resin having a refractive index of 1.48 to 1.54. In general, many epoxy resins having a refractive index do not contain an aromatic ring structure.
  • the resin (a1) is preferably at least one selected from a hydrogenated epoxy resin, a fluorine-containing epoxy resin, a chain aliphatic epoxy resin, a cyclic aliphatic epoxy resin, and an alkylphenol epoxy resin.
  • the resin (a2) is not particularly limited as long as it is an epoxy resin containing an aromatic ring. From the viewpoint of improving the reactivity of the resin composition, the glass transition temperature of the cured product and / or the adhesion, the resin (a2) is preferably a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a phenol novolac type epoxy resin, It is 1 or more types chosen from a biphenyl aralkyl type epoxy resin, a fluorene type epoxy resin, and a fluorine-containing aromatic type epoxy resin.
  • the refractive index of the aromatic ring-containing epoxy resin is generally not from 1.48 to 1.54, but an aromatic ring-containing epoxy resin having a refractive index of 1.48 to 1.54 can also be used as the resin (a2). .
  • biphenyl aralkyl type epoxy resin means an epoxy resin having a main chain to which a novolak structure and a divalent biphenyl structure are bonded.
  • Fluorene type epoxy resin means an epoxy resin having a fluorene skeleton.
  • Fluorine-containing aromatic epoxy resin means a fluorine-containing epoxy resin having an aromatic ring. For example, a fluorine-containing aromatic epoxy resin described in WO2011 / 0889947 can be used.
  • the resin (a1) is more preferably a hydrogenated epoxy resin, a fluorine-containing epoxy resin, a cycloaliphatic epoxy resin, and an alkylphenol epoxy resin, and more preferably Is at least one selected from hydrogenated bisphenol A type epoxy resins, hydrogenated bisphenol F type epoxy resins and fluorine-containing epoxy resins, and particularly preferably selected from hydrogenated bisphenol A type epoxy resins and hydrogenated bisphenol F type epoxy resins. Most preferably, it is a hydrogenated bisphenol A type epoxy resin.
  • the resin (a2) is more preferably at least one selected from a bisphenol type epoxy resin and a fluorine-containing aromatic type epoxy resin, more preferably a bisphenol type epoxy resin, still more preferably a bisphenol. It is 1 or more types chosen from A type epoxy resin and bisphenol F type epoxy resin.
  • the amount of the resin (a2) is preferably 0.5 to 40% by mass per the total of the resin (a1) and the resin (a2). % Is more preferable, and 2 to 30% by mass is further preferable.
  • the bisphenol A type epoxy resin for example, “828EL”, “1001” and “1004AF” manufactured by Mitsubishi Chemical Corporation; “840” and “850-S” manufactured by DIC Corporation; “YD-128” manufactured by Nippon Steel & Sumikin Chemical Industry Co., Ltd. Etc.
  • examples of the mixture of the liquid bisphenol A type epoxy resin and the liquid bisphenol F type epoxy resin include “ZX-1059” (epoxy equivalent: about 165) manufactured by Nippon Steel Chemical Co., Ltd.
  • Examples of the bisphenol F-type epoxy resin include “807” manufactured by Mitsubishi Chemical Corporation; “830” manufactured by DIC Corporation; “YDF-170” manufactured by Nippon Steel & Sumikin Chemical Industry Co., Ltd.
  • phenol novolac type epoxy resin examples include “N-730A”, “N-740”, “N-770” and “N-775” manufactured by DIC; “152” and “154” manufactured by Mitsubishi Chemical Corporation; Can be mentioned.
  • biphenyl aralkyl type epoxy resin examples include “NC-3000”, “NC-3000L” and “NC-3100” manufactured by Nippon Kayaku Co., Ltd.
  • fluorene type epoxy tree examples include “OGSOL PG-100”, “CG-500EG-200”, and “EG-280” manufactured by Osaka Gas Chemical Company.
  • the amount of the thermosetting resin is preferably 10 to 95% by mass, more preferably 20 to 90% by mass, and still more preferably 30 to 85% by mass with respect to the entire nonvolatile content of the resin composition.
  • the amount of the epoxy resin is preferably 10 to 95% by mass, more preferably 20 to 90% by mass, and further preferably 30 to 85% by mass with respect to the entire nonvolatile content of the resin composition.
  • Hydrotalcite can be classified into unfired hydrotalcite, semi-fired hydrotalcite, and fired hydrotalcite.
  • Uncalcined hydrotalcite is a metal hydroxide having a layered crystal structure typified by natural hydrotalcite (Mg 6 Al 2 (OH) 16 CO 3 .4H 2 O), for example, It consists of a layer [Mg 1-X Al X (OH) 2 ] X + and a middle layer [(CO 3 ) X / 2 ⁇ mH 2 O] X— which are the basic skeleton.
  • the uncalcined hydrotalcite in the present invention is a concept including a hydrotalcite-like compound such as synthetic hydrotalcite. Examples of the hydrotalcite-like compound include those represented by the following formula (I) and the following formula (II).
  • M 2+ is Mg 2+, a divalent metal ion such as Zn 2+, M 3+ represents a trivalent metal ion such as Al 3+, Fe 3+, A n- is CO 3 2-, Cl Represents an n-valent anion such as ⁇ and NO 3 — , 0 ⁇ x ⁇ 1, 0 ⁇ m ⁇ 1, and n is a positive number.
  • M 2+ is preferably Mg 2+
  • M 3+ is preferably Al 3+
  • a n- is preferably CO 3 2-.
  • M 2+ represents a divalent metal ion such as Mg 2+ or Zn 2+
  • a n ⁇ represents an n-valent anion such as CO 3 2 ⁇ , Cl ⁇ , NO 3 ⁇
  • x is 2 or more.
  • Z is a positive number of 2 or less
  • m is a positive number
  • n is a positive number.
  • M 2+ is preferably Mg 2+, A n-is preferably CO 3 2-.
  • Semi-fired hydrotalcite refers to a metal hydroxide having a layered crystal structure in which the amount of interlayer water is reduced or eliminated, obtained by firing unfired hydrotalcite.
  • the “interlayer water” refers to “H 2 O” described in the composition formula of the unfired natural hydrotalcite and hydrotalcite-like compound described above using a composition formula.
  • the present invention is characterized by using this semi-calcined hydrotalcite.
  • calcined hydrotalcite refers to a metal oxide having an amorphous structure obtained by calcining uncalcined hydrotalcite or semi-calcined hydrotalcite, and not only interlayer water but also hydroxyl groups disappeared by condensation dehydration.
  • Unfired hydrotalcite, semi-fired hydrotalcite and fired hydrotalcite can be distinguished by saturated water absorption.
  • the saturated water absorption of the semi-calcined hydrotalcite is 1% by mass or more and less than 20% by mass.
  • the saturated water absorption rate of the unfired hydrotalcite is less than 1% by mass, and the saturated water absorption rate of the fired hydrotalcite is 20% by mass or more.
  • the saturated water absorption rate of the semi-fired hydrotalcite is preferably 3% by mass or more and less than 20% by mass, more preferably 5% by mass or more and less than 20% by mass.
  • unfired hydrotalcite, semi-fired hydrotalcite and fired hydrotalcite can be distinguished by the thermogravimetric reduction rate measured by thermogravimetric analysis.
  • the thermal weight loss rate at 280 ° C. of the semi-calcined hydrotalcite is less than 15% by mass, and the thermal weight reduction rate at 380 ° C. is 12% by mass or more.
  • the thermal weight reduction rate at 280 ° C. of the unfired hydrotalcite is 15% by mass or more, and the thermal weight reduction rate at 380 ° C. of the sintered hydrotalcite is less than 12% by mass.
  • Thermogravimetric analysis was performed using Hitachi High-Tech Science TG / DTA EXSTAR6300, weighing 5 mg of hydrotalcite into an aluminum sample pan, and without opening the lid, in an atmosphere with a nitrogen flow rate of 200 mL / min.
  • the temperature can be increased from 30 ° C. to 550 ° C. at a temperature increase rate of 10 ° C./min.
  • unfired hydrotalcite, semi-fired hydrotalcite and fired hydrotalcite can be distinguished by the peak and relative intensity ratio measured by powder X-ray diffraction.
  • Semi-calcined hydrotalcite shows a peak that is split into two around 8 to 18 ° by powder X-ray diffraction, or a peak having a shoulder due to the synthesis of two peaks.
  • the uncalcined hydrotalcite has only one peak at around 8 to 18 °, or the relative intensity ratio of the diffraction intensity of the peak or shoulder appearing on the low angle side and the peak or shoulder appearing on the high angle side is in the above range. Get out.
  • the calcined hydrotalcite does not have a characteristic peak in the region of 8 ° to 18 °, but has a characteristic peak at 43 °.
  • Powder X-ray diffraction measurement was performed using a powder X-ray diffractometer (Empyrean, manufactured by PANalytical), counter-cathode CuK ⁇ (1.5405 mm), voltage: 45 V, current: 40 mA, sampling width: 0.0260 °, scanning speed: 0 0.0657 ° / s, diffraction angle range (2 ⁇ ): 5.0131 to 79.9711 °.
  • the peak search uses the peak search function of the software attached to the diffractometer. “Minimum significance: 0.50, minimum peak tip: 0.01 °, maximum peak tip: 1.00 °, peak base width: 2 0.000, method: minimum value of second derivative ”.
  • BET specific surface area of the semi-sintered hydrotalcite is preferably 1 ⁇ 250m 2 / g, more preferably 5 ⁇ 200m 2 / g.
  • the BET specific surface area of the semi-calcined hydrotalcite is calculated using the BET multipoint method by adsorbing nitrogen gas on the sample surface using a specific surface area measuring device (Macsorb HM Model 1210, manufactured by Mountec) according to the BET method. be able to.
  • the average particle size of the semi-fired hydrotalcite is preferably 1 to 1,000 nm, and more preferably 10 to 800 nm.
  • the average particle size of the semi-calcined hydrotalcite is the median size of the particle size distribution when the particle size distribution is prepared on a volume basis by laser diffraction scattering type particle size distribution measurement (JIS Z 8825).
  • Semi-baked hydrotalcite can be surface-treated with a surface treatment agent.
  • a surface treatment agent used for the surface treatment for example, higher fatty acids, alkylsilanes, silane coupling agents and the like can be used, and among these, higher fatty acids and alkylsilanes are preferable.
  • One or more surface treatment agents can be used.
  • higher fatty acid examples include higher fatty acids having 18 or more carbon atoms such as stearic acid, montanic acid, myristic acid, and palmitic acid, among which stearic acid is preferable. These can use 1 type (s) or 2 or more types.
  • alkylsilanes include methyltrimethoxysilane, ethyltrimethoxysilane, hexyltrimethoxysilane, octyltrimethoxysilane, decyltrimethoxysilane, octadecyltrimethoxysilane, dimethyldimethoxysilane, octyltriethoxysilane, and n-octadecyl. Examples thereof include dimethyl (3- (trimethoxysilyl) propyl) ammonium chloride. These 1 type (s) or 2 or more types can be used.
  • silane coupling agent examples include 3-glycidyloxypropyltrimethoxysilane, 3-glycidyloxypropyltriethoxysilane, 3-glycidyloxypropyl (dimethoxy) methylsilane, and 2- (3,4-epoxycyclohexyl) ethyltrimethoxy.
  • Epoxy silane coupling agents such as silane; mercapto silane coupling agents such as 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, 3-mercaptopropylmethyldimethoxysilane and 11-mercaptoundecyltrimethoxysilane 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyldimethoxymethylsilane, N-phenyl-3-aminopropylto Amino silanes such as methoxysilane, N-methylaminopropyltrimethoxysilane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane and N- (2-aminoethyl) -3-aminopropyldimethoxymethylsilane Coupling agents; Ureido silane coupling agents such as 3-
  • the surface treatment of the semi-fired hydrotalcite is performed, for example, by adding and spraying the surface treatment agent and stirring for 5 to 60 minutes while stirring and dispersing the untreated semi-fired hydrotalcite at room temperature with a mixer.
  • a mixer a well-known mixer can be used, for example, blenders, such as V blender, a ribbon blender, and a bubble cone blender, mixers, such as a Henschel mixer and a concrete mixer, a ball mill, a cutter mill, etc. are mentioned.
  • the semi-fired hydrotalcite is pulverized with a ball mill or the like, the above-mentioned higher fatty acid, alkylsilanes or silane coupling agent can be added to carry out surface treatment.
  • the amount of the surface treatment agent used varies depending on the type of the semi-fired hydrotalcite or the type of the surface treatment agent, but is preferably 1 to 10 parts by mass with respect to 100 parts by mass of the semi-fired hydrotalcite that has not been surface-treated. .
  • the surface-treated semi-calcined hydrotalcite is also included in the “semi-calcined hydrotalcite” in the present invention.
  • the amount of the semi-fired hydrotalcite in the resin composition of the present invention is not particularly limited as long as the effect of the present invention is exhibited, but is preferably 5 to 60% by mass with respect to the entire nonvolatile content of the resin composition, 10 to 55% by mass is more preferable. Since semi-calcined hydrotalcite is excellent in moisture absorption performance, if the amount thereof is increased, the moisture barrier property of the obtained cured product is improved. However, if the amount exceeds 60% by mass, the viscosity of the resin composition increases, the adhesiveness between the substrate to be sealed and the resin composition decreases due to a decrease in wettability, and the strength of the cured product It tends to cause problems such as lowering and becoming brittle.
  • the amount of water in the sealing layer increases due to the interlayer water of the semi-fired hydrotalcite, for example, in the manufacture of an organic EL device, a light emitting material (light emission) due to moisture in the sealing layer
  • a light emitting material due to moisture in the sealing layer
  • the resin composition of the present invention can contain calcined hydrotalcite as long as the effects of the present invention are exhibited.
  • the amount is preferably 0 to 20% by mass, more preferably 0 to 15% by mass, still more preferably 0 to 10% by mass, and most preferably 0, based on the entire nonvolatile content of the resin composition. That is, it is most preferable that the resin composition of the present invention does not contain calcined hydrotalcite.
  • the mass ratio of semi-calcined hydrotalcite: calcined hydrotalcite is preferably 50:50 to 100: 0, more preferably 55:45 to 100: 0, and still more preferably 60:40 to 100: 0.
  • the resin composition of the present invention can contain unfired hydrotalcite as long as the effects of the present invention are exhibited.
  • the amount is preferably 0 to 20% by mass, more preferably 0 to 10% by mass, still more preferably 0 to 5% by mass, and most preferably 0, based on the entire nonvolatile content of the resin composition. That is, it is most preferable that the resin composition of the present invention does not contain unfired hydrotalcite.
  • the uncalcined hydrotalcite does not affect the transmittance of the cured product of the resin composition, but since the moisture content is large, a decrease in moisture shielding property is observed by increasing the amount, for example, the amount is 20 mass.
  • the mass ratio of semi-fired hydrotalcite: unfired hydrotalcite is preferably 50:50 to 100: 0, more preferably 55:45 to 100: 0, even more preferably 60:40 to 100: 0, The ratio is preferably 65:35 to 100: 0, particularly preferably 70:30 to 100: 0.
  • Examples of the semi-calcined hydrotalcite include “DHT-4C” (manufactured by Kyowa Chemical Industry Co., Ltd., average particle size: 400 nm), “DHT-4A-2” (manufactured by Kyowa Chemical Industry Co., Ltd., average particle size: 400 nm), and the like. Can be mentioned.
  • examples of the calcined hydrotalcite include “KW-2200” (manufactured by Kyowa Chemical Industry Co., Ltd., average particle size: 400 nm).
  • Examples of the uncalcined hydrotalcite include “DHT-4A” (Kyowa Chemical). Manufactured by Kogyo Co., Ltd., average particle size: 400 nm).
  • the resin composition of the present invention contains a curing agent. That is, the sealing layer is a cured product obtained by curing the resin composition.
  • the curing agent is not particularly limited as long as it has a function of curing the thermosetting resin. From the viewpoint of suppressing thermal deterioration of light-emitting elements such as organic EL elements during the curing treatment of the resin composition, the thermosetting resin is cured at a temperature of 140 ° C. or lower (preferably 120 ° C. or lower) as a curing agent. What is obtained is preferred. Only one type of curing agent may be used, or two or more types may be used in combination.
  • an epoxy resin curing agent particularly preferable as the thermosetting resin will be exemplified.
  • examples include ionic liquids, acid anhydride compounds, imidazole compounds, tertiary amine compounds, dimethyl urea compounds, amine adduct compounds, organic acid dihydrazide compounds, organic phosphine compounds, dicyandiamide compounds, and primary / secondary amine compounds. It is done.
  • the curing agent is preferably at least one selected from ionic liquids, acid anhydride compounds, imidazole compounds, tertiary amine compounds, dimethylurea compounds and amine adduct compounds, more preferably ionic liquids, acid anhydride compounds, One or more selected from imidazole compounds, tertiary amine compounds, and dimethylurea compounds.
  • an ionic liquid capable of curing a thermosetting resin (particularly an epoxy resin) at a temperature of 140 ° C. or lower (preferably 120 ° C. or lower), that is, 140 ° C. or lower (preferably 120 ° C. or lower).
  • the ionic liquid is desirably used in a state where it is uniformly dissolved in a thermosetting resin (especially an epoxy resin), and the ionic liquid is advantageous for improving the moisture barrier property of the cured product of the resin composition. Works.
  • the resin composition of the present invention may contain a curing accelerator for the purpose of adjusting the curing time in addition to the curing agent.
  • a hardening accelerator may use only 1 type and may use 2 or more types together.
  • the curing accelerator include epoxy resin curing accelerators that are particularly preferable as the thermosetting resin. Examples thereof include imidazole compounds, tertiary amine compounds, dimethylurea compounds, and amine adduct compounds.
  • the curing accelerator is preferably at least one selected from imidazole compounds, tertiary amine compounds, and dimethylurea compounds.
  • Examples of the cation constituting the ionic liquid as a curing agent in the present invention include ammonium-based cations such as imidazolium ion, piperidinium ion, pyrrolidinium ion, pyrazonium ion, guanidinium ion, pyridinium ion; tetraalkylphosphonium cation (for example, Phosphonium cations such as tetrabutylphosphonium ion and tributylhexylphosphonium ion; sulfonium cations such as triethylsulfonium ion and the like.
  • ammonium-based cations such as imidazolium ion, piperidinium ion, pyrrolidinium ion, pyrazonium ion, guanidinium ion, pyridinium ion
  • tetraalkylphosphonium cation for example
  • anion constituting the ionic liquid as the curing agent in the present invention examples include halide anions such as fluoride ion, chloride ion, bromide ion and iodide ion; alkylsulfuric acid type anions such as methanesulfonate ion; trifluoromethane Fluorine-containing compound anions such as sulfonate ion, hexafluorophosphonate ion, trifluorotris (pentafluoroethyl) phosphonate ion, bis (trifluoromethanesulfonyl) imide ion, trifluoroacetate ion, tetrafluoroborate ion; phenol ion Phenol anions such as 2-methoxyphenol ion and 2,6-di-tert-butylphenol ion; acidic amino acid ions such as aspartate ion and glutamate ion; g
  • R is a linear or branched alkyl group having 1 to 5 carbon atoms, or a substituted or unsubstituted phenyl group, and X represents a side chain of an amino acid.
  • amino acid in the formula (1) examples include aspartic acid, glutamic acid, glycine, alanine, phenylalanine, etc. Among them, glycine is preferable.
  • the cation is preferably an ammonium cation or a phosphonium cation, more preferably an imidazolium ion or a phosphonium ion. More specifically, the imidazolium ion is 1-ethyl-3-methylimidazolium ion, 1-butyl-3-methylimidazolium ion, 1-propyl-3-methylimidazolium ion or the like.
  • the anion is preferably a phenol anion, an N-acyl amino acid ion or a carboxylic acid anion represented by the general formula (1), more preferably an N-acyl amino acid ion or a carboxylic acid anion.
  • phenolic anion examples include 2,6-di-tert-butylphenol ion.
  • carboxylate anion examples include acetate ion, decanoate ion, 2-pyrrolidone-5-carboxylate ion, formate ion, ⁇ -lipoic acid ion, lactate ion, tartrate ion, hippurate ion, N- Methyl hippurate ion and the like, among which acetate ion, 2-pyrrolidone-5-carboxylate ion, formate ion, lactate ion, tartrate ion, hippurate ion and N-methylhippurate ion are preferable, acetate ion, decane Particularly preferred are acid ions, N-methylhippuric acid ions and formate ions.
  • N-acylamino acid ion represented by the general formula (1) examples include N-benzoylalanine ion, N-acetylphenylalanine ion, aspartate ion, glycine ion, N-acetylglycine ion, and the like.
  • N-benzoylalanine ion, N-acetylphenylalanine ion and N-acetylglycine ion are preferable, and N-acetylglycine ion is particularly preferable.
  • Specific ionic liquids include, for example, 1-butyl-3-methylimidazolium lactate, tetrabutylphosphonium-2-pyrrolidone-5-carboxylate, tetrabutylphosphonium acetate, tetrabutylphosphonium decanoate, tetrabutylphosphonium tri Fluoroacetate, tetrabutylphosphonium ⁇ -lipoate, tetrabutylphosphonium formate, tetrabutylphosphonium lactate, bis (tetrabutylphosphonium) tartrate, tetrabutylphosphonium hippurate, tetrabutylphosphonium N-methylhippurate, benzoyl-DL -Alanine tetrabutylphosphonium salt, N-acetylphenylalanine tetrabutylphosphonium salt, 2,6-di-tert-butylphenoltetrabutylphospho Um salt,
  • a precursor composed of a cation moiety such as an alkylimidazolium, alkylpyridinium, alkylammonium and alkylsulfonium ions and an anion moiety containing a halogen is added to NaBF 4 , NaPF 6 , CF 3 SO 3
  • Examples of the acid anhydride compound as a curing agent in the present invention include tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, methyl nadic acid anhydride, Examples include dodecenyl succinic anhydride.
  • Specific examples of the acid anhydride compound include Jamaicacid TH, TH-1A, HH, MH, MH-700, and MH-700G (all manufactured by Shin Nippon Rika Co., Ltd.).
  • Examples of the imidazole compound as a curing agent and a curing accelerator in the present invention include 1H-imidazole, 2-methyl-imidazole, 2-phenyl-4-methylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl- 2-ethyl-4-methyl-imidazole, 2-undecylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 2,4-diamino-6- (2 '-Undecylimidazolyl- (1'))-ethyl-s-triazine, 2-phenyl-4,5-bis (hydroxymethyl) -imidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenyl Imidazole, 2-phenyl-imidazole, 2-dodecyl- Midazole, 2-hepta
  • imidazole compounds include cuazole 2MZ, 2P4MZ, 2E4MZ, 2E4MZ-CN, C11Z, C11Z-CN, C11Z-CNS, C11Z-A, 2PHZ, 1B2MZ, 1B2PZ, 2PZ, C17Z, 1.2DMZ, 2P4MHZ-PW, 2MZ-A, 2MA-OK (All of them are manufactured by Shikoku Kasei Kogyo Co., Ltd.).
  • DBN 1,5-diazabicyclo [4.3.0] non-5-ene
  • DBU 1,8-diazabicyclo [5.4]. .0] undec-7-ene
  • 2-ethylhexanoate of DBU phenol salt of DBU
  • dimethylurea compound as a curing agent and a curing accelerator in the present invention examples include DCMU (3- (3,4-dichlorophenyl) -1,1-dimethylurea), U-CAT3512T (manufactured by San Apro), and the like.
  • examples thereof include aromatic dimethylurea, and aliphatic dimethylurea such as U-CAT3503N (manufactured by San Apro). Of these, aromatic dimethylurea is preferably used from the viewpoint of curability.
  • Examples of the amine adduct compound as a curing agent and a curing accelerator in the present invention include an epoxy adduct compound obtained by stopping the addition reaction of a tertiary amine to an epoxy resin.
  • Specific examples of the amine adduct compound include Amicure PN-23, Amicure MY-24, Amicure PN-D, Amicure MY-D, Amicure PN-H, Amicure MY-H, Amicure PN-31, Amicure PN-40, Amicure PN-40J (all manufactured by Ajinomoto Fine Techno Co., Ltd.)
  • organic acid dihydrazide compound as a curing agent in the present invention examples include Amicure VDH-J, Amicure UDH, Amicure LDH (all manufactured by Ajinomoto Fine Techno Co., Ltd.) and the like.
  • Examples of the organic phosphine compound as a curing agent and a curing accelerator in the present invention include triphenylphosphine, tetraphenylphosphonium tetra-p-tolylborate, tetraphenylphosphonium tetraphenylborate, tri-tert-butylphosphonium tetraphenylborate, (4-Methylphenyl) triphenylphosphonium thiocyanate, tetraphenylphosphonium thiocyanate, butyltriphenylphosphonium thiocyanate, triphenylphosphine triphenylborane and the like.
  • organic phosphine compound examples include TPP, TPP-MK, TPP-K, TTBuP-K, TPP-SCN, TPP-S (manufactured by Hokuko Chemical Co., Ltd.), and the like.
  • Examples of the dicyandiamide compound as the curing agent in the present invention include dicyandiamide.
  • Specific examples of the dicyandiamide compound include DICY7 and DICY15 (both manufactured by Mitsubishi Chemical Corporation), which are dicyandiamide finely pulverized products.
  • Examples of the primary / secondary amine compound as the curing agent in the present invention include aliphatic ethylene diethylenetriamine, triethylenetetraamine, tetraethylenepentamine, trimethylhexamethylenediamine, 2-methylpentamethylenediamine, , 3-bisaminomethylcyclohexane, diproprylenediamine, diethylaminopropylamine, bis (4-aminocyclohexyl) methane, norbornenediamine, 1,2-diaminocyclohexane, N-aminoethylpiverazine which is an alicyclic amine, Diaminodiphenylmethane, m-phenylenediamine, m-xylenediamine, metaphenylenediamine, diaminodiphenylmethane, diaminodi, which are aromatic amines such as 1,4-bis (3-aminopropyl) piperazine Enirusuruhon, diethyl
  • the amount of the curing agent is preferably 0.1 to 40% by mass, more preferably 0.5 to 38 parts by mass, and more preferably 1 to 35 parts by mass with respect to the entire nonvolatile content of the resin composition. Further preferred. If this amount is less than 0.1% by mass, sufficient curability may not be obtained. If this amount is more than 40% by mass, the storage stability of the resin composition may be impaired.
  • the amount of the ionic liquid is 0.1 to 20% by mass with respect to the entire nonvolatile content of the resin composition from the viewpoint of moisture barrier property of the cured product of the resin composition. Preferably, it is 0.5 to 18% by mass, more preferably 1 to 15% by mass.
  • the amount thereof is preferably 0.05 to 10% by mass, more preferably 0.1 to 8% by mass, based on the entire nonvolatile content of the resin composition. More preferably, it is 0.5 to 5% by mass. When this amount is less than 0.05% by mass, curing tends to be delayed and the heat curing time tends to be long, and when it exceeds 10% by mass, the storage stability of the resin composition tends to decrease.
  • thermosetting resin composition in the present invention is preferably used in combination with a curing agent and a curing accelerator.
  • a curing agent and the curing accelerator two or more selected from ionic liquids, acid anhydride compounds, imidazole compounds, tertiary amine compounds, dimethylurea compounds, and amine adduct compounds are preferable.
  • thermoplastic resin From the viewpoint of imparting flexibility to the sealing layer (that is, a cured product of the resin composition), coating properties (preventing repelling) of the resin composition varnish when preparing a sealing sheet, and the like.
  • You may make a resin composition contain a thermoplastic resin.
  • the thermoplastic resin include phenoxy resin, polyvinyl acetal resin, polyimide resin, polyamideimide resin, polyethersulfone resin, polysulfone resin, polyester resin, (meth) acrylic polymer, and the like. These thermoplastic resins may use only 1 type and may use 2 or more types together.
  • the weight average molecular weight is preferably 15,000 or more, and more preferably 20,000 or more. However, when the weight average molecular weight is too large, the compatibility between the thermoplastic resin and the thermosetting resin (particularly, epoxy resin) tends to decrease. Therefore, this weight average molecular weight is preferably 1,000,000 or less, and more preferably 800,000 or less.
  • the weight average molecular weight in the present invention is measured by gel permeation chromatography (GPC) method (polystyrene conversion).
  • GPC gel permeation chromatography
  • the weight average molecular weight by the GPC method is LC-9A / RID-6A manufactured by Shimadzu Corporation as a measuring device, Shodex K-800P / K-804L / K-804L manufactured by Showa Denko KK as a column, and mobile phase. It can be calculated by using a calibration curve of standard polystyrene by measuring at a column temperature of 40 ° C. using chloroform or the like.
  • the thermoplastic resin is not particularly limited as long as the refractive index of the cured product of the resin composition is 1.48 to 1.54.
  • a thermoplastic resin having a refractive index of the cured product of the resin composition higher than the refractive index of the cured product of the resin composition may be used.
  • the refractive index of the thermoplastic resin is preferably 1.40 to 1.70, more preferably 1.40 to 1.65. In the case of using a plurality of thermoplastic resins, it is preferable that the refractive index of the entire thermoplastic resin mixture is within the above range.
  • thermoplastic resin a phenoxy resin that has good compatibility with a thermosetting resin (particularly an epoxy resin) and can advantageously act to improve the moisture barrier property of the cured product of the resin composition is preferable.
  • the phenoxy resin can also have an epoxy group, like the epoxy resin.
  • the weight average molecular weight of the phenoxy resin is preferably 10,000 to 500,000, more preferably 20,000 to 300,000.
  • Suitable phenoxy resins include one or more skeletons selected from bisphenol A skeleton, bisphenol F skeleton, bisphenol S skeleton, bisphenolacetophenone skeleton, novolac skeleton, biphenyl skeleton, fluorene skeleton, dicyclopentadiene skeleton, and norbornene skeleton. The thing which has. One or more phenoxy resins can be used.
  • phenoxy resins examples include YX7200B35 (Mitsubishi Chemical Corporation: biphenyl skeleton-containing phenoxy resin), 1256 (Mitsubishi Chemical Corporation: bisphenol A skeleton-containing phenoxy resin), YX6954BH35 (Mitsubishi Chemical Corporation: bisphenolacetophenone skeleton-containing). Phenoxy resin) and the like.
  • the amount thereof is 0.1 to 60% by mass, preferably 3 to 60% by mass, and preferably 5 to 50% by mass, based on the entire nonvolatile content of the resin composition. Is more preferable.
  • the resin composition of the present invention may contain a coupling agent.
  • the coupling agent include silane coupling agents, aluminate coupling agents, and titanate coupling agents.
  • the silane coupling agent include 3-glycidyloxypropyltrimethoxysilane, 3-glycidyloxypropyltriethoxysilane, 3-glycidyloxypropyl (dimethoxy) methylsilane, and 2- (3,4-epoxycyclohexyl) ethyltrimethoxy.
  • Epoxy silane coupling agents such as silane; mercapto silane coupling agents such as 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, 3-mercaptopropylmethyldimethoxysilane and 11-mercaptoundecyltrimethoxysilane ; 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyldimethoxymethylsilane, N-phenyl-3-aminopropyltri Amino-based silane cups such as toxisilane, N-methylaminopropyltrimethoxysilane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane and N- (2-aminoethyl) -3-aminopropyldimethoxymethylsilane Ringing agent; Ureido silane coupling agent such
  • vinyl silane coupling agents and epoxy silane coupling agents are preferable, and epoxy silane coupling agents are particularly preferable.
  • the aluminate coupling agent include alkyl acetoacetate aluminum diisopropylate (for example, “Plenact AL-M” manufactured by Ajinomoto Fine Techno Co., Ltd.).
  • Specific examples of the titanate coupling agent include Preneact TTS, Preneact 46B, Preneact 55, Preneact 41B, Preneact 38S, Preneact 138S, Preneact 238S, Preneact 338X, Preneact 44, Preneact 9SA (all manufactured by Ajinomoto Fine Techno Co., Ltd.) Is mentioned.
  • the coupling agent can use 1 type (s) or 2 or more types.
  • the amount of the coupling agent in the resin composition of the present invention is preferably 0 to 15% by mass, more preferably 0.5 to 10% by mass, based on the entire nonvolatile content of the resin composition.
  • the resin composition of the present invention has the effects of the present invention from the viewpoint of the moisture barrier property of the cured product of the resin composition and the coating property (prevention of repelling) of the resin composition varnish when preparing a sealing sheet.
  • inorganic fillers other than semi-baked hydrotalcite can be further contained.
  • Such inorganic fillers include, for example, talc, silica, alumina, barium sulfate, clay, mica, aluminum hydroxide, magnesium hydroxide, calcium carbonate in addition to the above-mentioned uncalcined hydrotalcite and calcined hydrotalcite.
  • the particle size of the primary particles of the inorganic filler is preferably 5 ⁇ m or less, and more preferably 3 ⁇ m or less.
  • a primary particle having a particle size of 0.001 to 3 ⁇ m, more preferably 0.005 to 2 ⁇ m can be used.
  • the particle form of the inorganic filler is not particularly limited, and those having a substantially spherical shape, a rectangular parallelepiped shape, a plate shape, a linear shape such as a fiber, or a branched shape can be used.
  • talc, silica, zeolite, titanium oxide, alumina, zirconium oxide, silicate, mica, magnesium hydroxide, aluminum hydroxide and the like are preferable, talc and silica are more preferable, and talc is particularly preferable.
  • silica amorphous silica, fused silica, crystalline silica, synthetic silica wet silica, dry silica, colloidal silica (water dispersion type, organic solvent dispersion type, gas phase silica, etc.) is preferable, and it is difficult to precipitate and settle. From the standpoint of easy compounding, organic solvent-dispersed colloidal silica (organosilica sol) is particularly preferred.
  • talc “FG-15” (average particle size: 1.4 ⁇ m), “D-1000” (average particle size: 1.0 ⁇ m), “D-600” (average particle size: 0.6 ⁇ m) manufactured by Nippon Talc Co., Ltd. Etc.
  • examples of commercially available spherical fused silica include True Spherical Silica “Admafine Series” (“SO-C2; average particle size 0.5 ⁇ m”, “SC2500-SQ; average particle size 0.5 ⁇ m, manufactured by Admatechs, Inc. Silane coupling treatment ”and the like.
  • fumed silica examples include “Aerosil series” manufactured by Nippon Aerosil Co., Ltd. (“A-200: primary particle size 5 to 40 nm”, etc.) and the like.
  • organic solvent-dispersed colloidal silica examples include “MEK-EC-2130Y” manufactured by Nissan Chemical Industries, Ltd. (amorphous silica particle size 10 to 15 nm, non-volatile content 30% by mass, MEK solvent), “PGM-AC manufactured by Nissan Chemical Industries, Ltd.
  • the amount of the inorganic filler other than the semi-fired hydrotalcite is preferably 0 to 30% by mass and preferably 0 to 25% by mass with respect to the entire nonvolatile content of the resin composition, from the viewpoint of moisture shielding properties of the cured product of the resin composition. % Is more preferable.
  • Silica may be blended with the resin composition of the present invention in order to improve the moisture shielding property and transmittance of the cured resin composition.
  • the amount is preferably 0.1 to 10% by mass with respect to the entire nonvolatile content of the resin composition. When there is too much quantity of silica, it will become the tendency for adhesiveness to fall.
  • talc may be added to the resin composition of the present invention.
  • the amount is preferably 0.01 to 30% by mass, more preferably 0.1 to 20% by mass, and still more preferably 0.5 to 10% by mass, based on the entire nonvolatile content of the resin composition. .
  • the amount of talc is too small, the effect of improving moisture resistance and adhesion by talc tends to be difficult to be exhibited, and when the amount of talc is too large, transparency tends to deteriorate.
  • the resin composition of the present invention may further contain other additives different from the above components as long as the effects of the present invention are exhibited.
  • additives include organic fillers such as rubber particles, silicone powder, nylon powder, and fluororesin powder; thickeners such as Olven and Benton; silicone-based, fluorine-based, and polymer-based antifoaming agents. Or a leveling agent; Adhesion imparting agents, such as a triazole compound, a thiazole compound, a triazine compound, and a porphyrin compound;
  • the refractive index of a solid resin for example, solid epoxy resin, phenoxy resin, etc.
  • the refractive index of the cured product of the resin composition are both the refractive index of light having a wavelength of 594 nm at 25 ° C. It is a measured value based on the coupler method.
  • the refractive index of the sample can be measured by measuring the critical angle at the interface between the prism whose refractive index is known and the sample in contact with the prism by the prism coupler method.
  • a prism coupler for example, a prism coupler (model 2010 / M) manufactured by Metricon Corporation can be used.
  • the refractive index of a liquid resin is a measurement value based on a measurement method using a multiwavelength Abbe refractometer at 25 ° C.
  • a multiwavelength Abbe refractometer for example, DR-M2 manufactured by Atago Co., Ltd. can be used.
  • the D65 light parallel line transmittance of the cured layer of the resin composition having a thickness of 20 ⁇ m is preferably 80 to 100%.
  • Such a cured product layer can be recognized visually as being transparent.
  • the resin composition of the present invention can easily form a cured product (sealing layer) of a resin composition excellent in parallel line transmittance by appropriately adopting the above preferable conditions.
  • the D65 light parallel line transmittance of the cured product layer (sealing layer) of the resin composition having a thickness of 20 ⁇ m is preferably 80 to 100%, and more preferably 85 to 100%.
  • cured material is as described in the Example mentioned later, forms the laminated body by which the hardened
  • the value of the parallel line transmittance with D65 light described above is a measured value of the cured product layer of the resin composition having a thickness of 20 ⁇ m, but the thickness of the cured product layer is generally 3 to 200 ⁇ m. is there.
  • the resin composition of the present invention having a refractive index of the cured product of 1.48 to 1.54 uses a component having a refractive index comparable to the refractive index, or a resin having a lower refractive index. It can be manufactured by blending a high refractive index resin and adjusting the refractive index of the entire resin to the above range.
  • the resin composition of the present invention can be produced by mixing such components and, if necessary, an organic solvent using a kneading roller or a rotary mixer.
  • the resin composition of the present invention and an encapsulating sheet described later are, for example, encapsulating optical components such as semiconductors, solar cells, high-brightness LEDs, LCDs, and EL elements, preferably organic EL elements and solar cells. Used for.
  • the resin composition and sealing sheet of the present invention are particularly suitably used for sealing organic EL elements. Specifically, the resin composition and the sealing sheet of the present invention are applied to the upper part and / or the periphery (side part) of the light emitting part of the organic EL element to protect the light emitting part of the organic EL element from the outside. Can be used.
  • the sealing composition can be formed by directly applying the resin composition of the present invention to an object to be sealed and curing the coating film. Also, a sheet for sealing in which the layer of the resin composition of the present invention is formed on a support is prepared, and the sheet for sealing is laminated on a necessary portion of the object to be sealed, and the resin composition layer is coated on the object to be covered.
  • the sealing layer may be formed by transferring and curing.
  • the sealing sheet in which the layer of the resin composition of the present invention is formed on a support is prepared by a method known to those skilled in the art, for example, a resin composition varnish in which the resin composition is dissolved in an organic solvent, It can be produced by applying a varnish on a support and further drying the varnish applied by heating or blowing hot air to form a resin composition layer.
  • the support used for the sealing sheet examples include polyolefins such as polyethylene, polypropylene, and polyvinyl chloride, cycloolefin polymers, polyethylene terephthalate (hereinafter sometimes abbreviated as “PET”), polyesters such as polyethylene naphthalate, Examples thereof include plastic films such as polycarbonate and polyimide. As the plastic film, PET is particularly preferable.
  • the support may be a metal foil such as an aluminum foil, a stainless steel foil, or a copper foil.
  • the support may be subjected to a release treatment in addition to a mat treatment and a corona treatment. Examples of the release treatment include a release treatment with a release agent such as a silicone resin release agent, an alkyd resin release agent, and a fluororesin release agent.
  • a plastic film having a barrier layer may be used as a support.
  • the barrier layer include nitrides such as silicon nitride, oxides such as aluminum oxide, stainless steel foil, and metal foil of aluminum foil.
  • the plastic film include the above-described plastic film.
  • a commercial product may be used as the plastic film having the barrier layer.
  • the film which compound-laminated metal foil and the plastic film may be sufficient.
  • Examples of commercially available polyethylene terephthalate films with aluminum foil include “PET Tsuki AL1N30” manufactured by Tokai Toyo Aluminum Sales Co., “PET Tsuki AL3025” manufactured by Fukuda Metals, and “Alpet” manufactured by Panac Co., Ltd.
  • the support may be subjected to a release treatment using a silicone resin release agent, an alkyd resin release agent, a fluororesin release agent, a mat treatment, a corona treatment, or the like.
  • a release treatment using a silicone resin release agent, an alkyd resin release agent, a fluororesin release agent, a mat treatment, a corona treatment, or the like.
  • the release layer is also regarded as a part of the support.
  • the thickness of the support is not particularly limited, but is preferably 20 to 200 ⁇ m, more preferably 20 to 125 ⁇ m, from the viewpoint of handleability and the like.
  • organic solvent examples include ketones such as acetone, methyl ethyl ketone (hereinafter abbreviated as “MEK”), cyclohexanone, and acetates such as ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate, and carbitol acetate.
  • Carbitols such as cellosolve and butyl carbitol, aromatic hydrocarbons such as toluene and xylene, dimethylformamide, dimethylacetamide, N-methylpyrrolidone and the like. Any one organic solvent may be used alone, or two or more organic solvents may be used in combination.
  • Drying conditions are not particularly limited, but usually about 50 to 100 ° C. and about 3 to 15 minutes are preferable.
  • the thickness of the resin composition layer after drying is usually in the range of 3 ⁇ m to 200 ⁇ m, preferably 5 ⁇ m to 100 ⁇ m, more preferably 5 ⁇ m to 50 ⁇ m.
  • the resin composition layer may be protected with a protective film.
  • a protective film By protecting with a protective film, it is possible to prevent dust and the like from being attached to the surface of the resin composition layer and scratches.
  • the protective film is preferably a plastic film similar to the support. Further, the protective film may be subjected to a release treatment in addition to the mat treatment and the corona treatment.
  • the thickness of the protective film is not particularly limited, but is usually 1 to 150 ⁇ m, preferably 10 to 100 ⁇ m.
  • the sealing sheet has a moisture-proof and high-permeability support for the support, the sealing sheet is laminated on the necessary portion of the object to be sealed, and the resin composition is left as it is.
  • a sealing structure having high moisture resistance can be formed.
  • a support having moisture resistance and high transmittance include a plastic film in which an inorganic substance such as silicon oxide (silica), silicon nitride, SiCN, and amorphous silicon is deposited on the surface.
  • the plastic film include polyolefins such as polyethylene, polypropylene, and polyvinyl chloride, polyesters such as polyethylene terephthalate and polyethylene naphthalate, polycarbonate, and polyimide.
  • PET is particularly preferable.
  • examples of commercially available moisture-proof plastic films include Tech Barrier HX, AX, LX, L series (Mitsubishi Plastics) and X-BARRIER (Mitsubishi Plastics) with improved moisture resistance. It is done.
  • a support having a multilayer structure of two or more layers may be used.
  • the resin composition layer is usually cured by thermal curing.
  • the means include a hot-air circulating oven, an infrared heater, a heat gun, a high-frequency induction heating device, and heating by pressure bonding of a heat tool.
  • the curing temperature is preferably 50 ° C. or higher, more preferably 55 ° C. or higher, and the curing time is 10 minutes or more is preferable, and 20 minutes or more is more preferable.
  • Example 1 60 parts of liquid hydrogenated bisphenol A type epoxy resin (“YX8000” manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: about 205) and commercially available hydrotalcite A (semi-calcined hydrotalcite, BET specific surface area: 13 m 2 / g, average (Particle size: 400 nm) After kneading 40 parts, the mixture was dispersed by a three roll mill to obtain a mixture.
  • YX8000 liquid hydrogenated bisphenol A type epoxy resin manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: about 205
  • hydrotalcite A si-calcined hydrotalcite, BET specific surface area: 13 m 2 / g, average (Particle size: 400 nm
  • the resin composition varnish is dried on a support (polyethylene terephthalate film treated with a silicone release agent, thickness 38 ⁇ m, hereinafter abbreviated as “release PET film”).
  • release PET film a support
  • a die coater so that the thickness was 20 ⁇ m and dried at 80 ° C. for 5 minutes, and then a release PET film was placed as a protective film on the surface of the resin composition layer to obtain a sealing sheet.
  • Example 2 Resin composition as in Example 1 except that commercially available hydrotalcite B (semi-calcined hydrotalcite, BET specific surface area: 15 m 2 / g, average particle size: 400 nm) was used instead of hydrotalcite A A product varnish was produced to obtain a sealing sheet.
  • hydrotalcite B si-calcined hydrotalcite, BET specific surface area: 15 m 2 / g, average particle size: 400 nm
  • Example 3 Instead of the phenoxy resin solution (114.3 parts), 100 parts of a solution (solvent: MEK, nonvolatile content: 40%) of a solid hydrogenated bisphenol A type epoxy resin (“YX8040” manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: about 1000) A resin composition varnish was produced in the same manner as in Example 2 except that (40 parts of resin) was used, and a sealing sheet was obtained in the same manner as in Example 1.
  • Example 4 Resin composition in the same manner as in Example 2 except that 2 parts of an imidazole curing agent (“1B2MZ” manufactured by Shikoku Kasei Co., Ltd.) was used instead of 1.5 parts of a curing accelerator (“U-CAT3512T” manufactured by Sun Apro). A varnish was produced, and a sealing sheet was obtained in the same manner as in Example 1.
  • an imidazole curing agent (“1B2MZ” manufactured by Shikoku Kasei Co., Ltd.
  • U-CAT3512T a curing accelerator manufactured by Sun Apro
  • Example 5 30 parts of liquid hydrogenated bisphenol A type epoxy resin (“YX8000” manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: about 205), 30 parts of acid anhydride curing agent (“MH-700” manufactured by Shin Nippon Chemical Co., Ltd.), commercially available hydro 40 parts of talcite B (BET specific surface area: 13 m 2 / g, average particle size: 400 nm) was kneaded and then dispersed by a three roll mill to obtain a mixture.
  • talcite B BET specific surface area: 13 m 2 / g, average particle size: 400 nm
  • DBU-octylate curing accelerator (“U-CAT SA102” manufactured by San Apro)
  • Example 6 The amount of phenoxy resin solution (Mitsubishi Chemical Corporation “YX7200B35”, solvent: MEK, non-volatile content: 35%) was 57.2 parts (20 parts of resin), and solid hydrogenated bisphenol A type epoxy resin (Mitsubishi Chemical Corporation).
  • a resin composition varnish was produced in the same manner as in Example 2 except that 50 parts (20 parts of resin) of a solution (solvent: MEK, non-volatile content: 40%) of “YX8040” manufactured by Similarly, a sealing sheet was obtained.
  • Example 7 The amount of phenoxy resin solution (Mitsubishi Chemical Corporation “YX7200B35”, solvent: MEK, non-volatile content: 35%) was 85.7 parts (30 parts of resin), liquid bisphenol A type epoxy resin and liquid bisphenol F type epoxy.
  • a resin composition varnish was produced in the same manner as in Example 2 except that 10 parts of a resin mixture (“ZX-1059” manufactured by Nippon Steel Chemical Co., Ltd., epoxy equivalent: about 165) was used. Similarly, a sealing sheet was obtained.
  • Example 1 ⁇ Comparative Example 1> Example except that 60 parts of a mixture of liquid bisphenol A type epoxy resin and liquid bisphenol F type epoxy resin (“ZX-1059” manufactured by Nippon Steel Chemical Co., Ltd.) was used instead of liquid hydrogenated bisphenol A type epoxy resin. A resin composition varnish was produced in the same manner as in Example 2, and a sealing sheet was obtained in the same manner as in Example 1.
  • Example 3 A resin composition varnish was produced in the same manner as in Example 1 except that 40 parts of commercially available hydrotalcite D (unfired hydrotalcite, average particle size: 400 nm) was used instead of hydrotalcite A. A sealing sheet was obtained.
  • hydrotalcite D unfired hydrotalcite, average particle size: 400 nm
  • Hydrotalcite A, hydrotalcite B, hydrotalcite E and hydrotalcite F are “semi-calcined hydrotalcite” based on saturated water absorption, thermal weight loss rate and powder X-ray diffraction.
  • C is “calcined hydrotalcite” and hydrotalcite D is “unfired hydrotalcite”.
  • the sealing sheets produced in the examples and comparative examples were cut into a length of 70 mm and a width of 25 mm, the protective film (release PET film) was peeled off from the cut sealing sheet, and the sealing sheet was glass plate Batch type vacuum laminator (manufactured by Nichigo Morton, V-160) to micro slide glass (length 76mm, width 26mm and thickness 1.2mm, white slide glass S1112 Marin No. 2 manufactured by Matsunami Glass Industry Co., Ltd.) And laminated. Lamination conditions were a temperature of 80 ° C., a pressure reduction time of 30 seconds, and a pressure of 0.3 MPa for 30 seconds.
  • the support (release PET film) of the sealing sheet is peeled off and thermally cured in a heat circulation oven at 130 ° C. for 60 minutes, and a sample for evaluation which is a laminate of a cured product layer of resin composition and glass. Got.
  • Refractive index measurement was performed using a 540 nm laser beam using a Metricon prism coupler (model 2010 / M).
  • the evaluation sample was placed by bringing the surface of the cured product layer of the evaluation sample into contact with the prism in the apparatus by a pneumatically operated coupling head.
  • the angle between the prism and the sample is changed while irradiating the laser, and the laser light that has been totally reflected and introduced into the photodetector propagates from the air phase to the inside of the sample at a value called the mode angle.
  • the position (dip) at which the light intensity of the reaching laser light first suddenly dropped and entered the light propagation mode was confirmed, and the refractive index was determined thereby.
  • Table 2 The results are shown in Table 2.
  • the sealing sheets produced in the examples and comparative examples were cut into a length of 70 mm and a width of 25 mm, the protective film (release PET film) was peeled off from the cut sealing sheet, and the sealing sheet was glass plate Batch type vacuum laminator (manufactured by Nichigo Morton, V-160) to micro slide glass (length 76mm, width 26mm and thickness 1.2mm, white slide glass S1112 Marin No. 2 manufactured by Matsunami Glass Industry Co., Ltd.) And laminated. Lamination conditions were a temperature of 80 ° C., a pressure reduction time of 30 seconds, and a pressure of 0.3 MPa for 30 seconds.
  • seat for sealing was peeled, and the same glass plate as the above was further laminated on the exposed resin composition layer, and the laminated body was produced.
  • the obtained laminate was heated in a thermal circulation oven at 130 ° C. for 60 minutes to obtain a laminate (evaluation sample, thickness of cured product: 20 ⁇ m) having a cured product of the resin composition between glass plates.
  • An alkali-free glass 50 mm ⁇ 50 mm square was washed with boiled isopropyl alcohol for 5 minutes and dried at 150 ° C. for 30 minutes or more.
  • a calcium film (purity 99.8%) was vapor-deposited (thickness: 300 nm) using a mask with a distance of 3 mm from the edge using the glass.
  • a non-alkali glass on which a calcium film is deposited and a sealing sheet having the same resin composition layer as in each of the examples and the comparative examples are attached with a thermal laminator (Lamipacker DAiSY A4 (LPD2325) manufactured by Fuji Plastics).
  • a laminate was prepared. The obtained laminate was heated at a temperature of 130 ° C. for 60 minutes to cure the resin composition layer, thereby obtaining an evaluation sample.
  • the sample for evaluation containing a calcium film was used as a model of an organic EL device containing an organic EL element.
  • the distance from the end of the sample for evaluation to the calcium membrane was measured with a Measuring Microscope MF-U manufactured by Mitutoyo Corporation, and this value was designated as X2.
  • an evaluation sample was put into a constant temperature and humidity chamber set at a temperature of 85 ° C. and a humidity of 85% RH.
  • the sealing distance X1 (mm) from the end of the sample for evaluation after introduction into the thermostatic chamber to the calcium membrane is the seal from the end of the sample for evaluation before introduction into the thermostatic chamber to the calcium membrane.
  • the sample for evaluation was taken out from the constant temperature and humidity chamber at a time increased by 0.1 mm from the stopping distance X2 (mm), and the time was defined as a decrease start time t (hour).
  • the time when X1 was 5 mm was calculated as the emission area reduction start time, and evaluated according to the following criteria.
  • the results are shown in Table 2.
  • the unit “h” shown in Table 2 means “time”. (Standard of emission area decrease start time) Good ( ⁇ ): 300 hours or more possible ( ⁇ ): Less than 300 hours, 200 hours or more Defect (x): Less than 200 hours
  • Table 2 lists the types and amounts of the components used in addition to the results of the refractive index and the like of the cured products obtained in the examples and comparative examples.
  • the encapsulating resin composition of the present invention it is possible to form an encapsulating layer excellent in both moisture barrier properties and transparency. Therefore, the encapsulating resin composition and encapsulating sheet of the present invention can be suitably used for encapsulating moisture-sensitive elements such as organic EL elements.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)

Abstract

L'invention concerne une composition de résine d'encapsulation comprenant une résine thermodurcissable (A), une hydrotalcite semi-calcinée (B), ainsi qu'un agent de durcissement (C), un produit durci de la composition de résine présentant un indice de réfraction compris entre 1,48 et 1,54.
PCT/JP2017/035942 2016-10-04 2017-10-03 Composition de résine d'encapsulation et feuille d'encapsulation Ceased WO2018066548A1 (fr)

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KR20230104692A (ko) 2020-11-13 2023-07-10 아지노모토 가부시키가이샤 밀봉용 시트

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