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WO2018061355A1 - Outil de coupe - Google Patents

Outil de coupe Download PDF

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Publication number
WO2018061355A1
WO2018061355A1 PCT/JP2017/023138 JP2017023138W WO2018061355A1 WO 2018061355 A1 WO2018061355 A1 WO 2018061355A1 JP 2017023138 W JP2017023138 W JP 2017023138W WO 2018061355 A1 WO2018061355 A1 WO 2018061355A1
Authority
WO
WIPO (PCT)
Prior art keywords
cutting tool
diamond layer
tool according
flank
face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2017/023138
Other languages
English (en)
Japanese (ja)
Inventor
小林　豊
克夫 風早
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Hardmetal Corp
Original Assignee
Sumitomo Electric Hardmetal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Hardmetal Corp filed Critical Sumitomo Electric Hardmetal Corp
Publication of WO2018061355A1 publication Critical patent/WO2018061355A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B27/00—Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
    • B23B27/14—Cutting tools of which the bits or tips or cutting inserts are of special material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B27/00—Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
    • B23B27/14—Cutting tools of which the bits or tips or cutting inserts are of special material
    • B23B27/18—Cutting tools of which the bits or tips or cutting inserts are of special material with cutting bits or tips or cutting inserts rigidly mounted, e.g. by brazing
    • B23B27/20—Cutting tools of which the bits or tips or cutting inserts are of special material with cutting bits or tips or cutting inserts rigidly mounted, e.g. by brazing with diamond bits or cutting inserts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23C—MILLING
    • B23C5/00—Milling-cutters
    • B23C5/16—Milling-cutters characterised by physical features other than shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23C—MILLING
    • B23C5/00—Milling-cutters
    • B23C5/02—Milling-cutters characterised by the shape of the cutter
    • B23C5/10—Shank-type cutters, i.e. with an integral shaft

Definitions

  • Patent Document 1 a cutting tool described in JP-A-2015-85462
  • Patent Document 1 a cutting tool in which a base material is coated with a diamond layer.
  • the tool main body of the cutting tool described in Patent Document 1 has a flank, a rake face, and a cutting edge formed on the ridge line of the flank and the rake face.
  • the tool body is covered with a hard coating.
  • the cutting tool includes a rake face, a flank face connected to the rake face, and a cutting edge constituted by a ridge line between the rake face and the flank face.
  • a cutting tool according to an aspect of the present disclosure covers a base material having a first surface that is a rake face side surface and a second surface that is a flank face side, and covers the first surface and the second surface. With a diamond layer.
  • a part of the flank is constituted by a base material.
  • a part of the flank formed by the base material is located between the diamond layer covering the first surface and the diamond layer covering the second surface.
  • FIG. 1 is a top view of the cutting tool according to the first embodiment.
  • FIG. 2 is an enlarged top view of region II in FIG.
  • FIG. 3 is a schematic diagram of cutting using the cutting tool according to the first embodiment.
  • 4 is a cross-sectional view taken along line IV-IV in FIG.
  • FIG. 5 is a process diagram of the manufacturing method of the cutting tool according to the first embodiment.
  • FIG. 6 is a cross-sectional view of the cutting tool according to the first embodiment after the diamond layer forming step is completed and before the diamond layer removing step is performed.
  • FIG. 7 is a cross-sectional view of the cutting tool according to the first embodiment after the end of the rake face treatment process and before the flank face treatment process.
  • FIG. 8 is a cross-sectional view in a cross section perpendicular to the cutting edge of the cutting tool according to the second embodiment.
  • FIG. 9 is a cross-sectional view in a cross section perpendicular to the cutting edge of the cutting tool according to the comparative example.
  • the present disclosure has been made in view of the above-described problems of the prior art. More specifically, the present disclosure provides a cutting tool that can suppress peeling of a diamond layer covering a flank side surface of a substrate. [Effects of the present disclosure] According to the above, peeling of the diamond layer covering the flank side surface of the substrate can be suppressed.
  • a cutting tool includes a rake face, a flank face continuous with the rake face, and a cutting edge constituted by a ridge line between the rake face and the flank face.
  • a cutting tool according to an aspect of the present disclosure covers a base material having a first surface that is a rake face side surface and a second surface that is a flank face side, and covers the first surface and the second surface. With a diamond layer.
  • a part of the flank is constituted by a base material.
  • a part of the flank formed by the base material is located between the diamond layer covering the first surface and the diamond layer covering the second surface.
  • the first surface is connected to the first top surface that is continuous with the second surface and the first top surface, and the first top surface is sandwiched between the second surface and the first top surface.
  • the second top surface may be included.
  • the angle formed by the first top surface and the second top surface may be a negative angle in a cross section perpendicular to the cutting edge.
  • the distance in the direction parallel to the ridgeline between the first top surface and the second top surface and the rake face of the cutting edge is 0.001 ⁇ m or more. It may be 5 ⁇ m or less.
  • flank separation of the diamond layer can be suppressed by thickly covering the first top surface with the diamond layer.
  • the thickness of the diamond layer covering the first surface of the substrate may be 0.1 ⁇ m or more and 50 ⁇ m or less.
  • the radius of curvature of the cutting edge tip may be not less than 0.01 ⁇ m and not more than 10 ⁇ m.
  • the cutting tool of (5) it is possible to improve the sharpness of the cutting tool while suppressing the peeling of the diamond layer covering the flank side surface of the substrate.
  • FIG. 1 is a top view of the cutting tool according to the first embodiment.
  • the cutting tool according to the first embodiment has a tip portion 1, a body portion 2, and a shank portion 3.
  • the cutting tool according to the embodiment is a ball end mill.
  • the cutting tool according to the first embodiment is not limited to the ball end mill.
  • the cutting tool according to the first embodiment may be a radius end mill or the like.
  • FIG. 2 is an enlarged top view of region II in FIG.
  • the cutting tool according to the first embodiment has a rake face 11 and a flank 12 (see FIG. 4) at the distal end portion 1.
  • the rake face 11 is continuous with the flank face 12.
  • a ridge line between the rake face 11 and the flank face 12 forms a cutting edge 13.
  • FIG. 3 is a schematic diagram of cutting using the cutting tool according to the first embodiment. As shown in FIG. 3, in the cutting tool according to the first embodiment, the cutting edge 13 is urged against the work material while rotating about the central axis A. As a result, the work material is cut.
  • FIG. 4 is a cross-sectional view taken along IV-IV in FIG.
  • the cutting tool according to the first embodiment includes a base material 4 and a diamond layer 5.
  • the substrate 4 has a first surface 41 (top surface) and a second surface 42.
  • the first surface 41 is a surface of the base material 4 on the rake face 11 side.
  • the second surface 42 is a surface on the flank 12 side of the substrate 4.
  • the base material 4 may have a third surface 43.
  • the third surface 43 is connected to the first surface 41 and the second surface 42 and is disposed at a position sandwiched between the first surface 41 and the second surface 42.
  • the angle formed by the third surface 43 and the first surface 41 is an angle ⁇ 1.
  • the angle ⁇ 1 is greater than 0 ° and less than 90 °.
  • the base material 4 is covered with a diamond layer 5. More specifically, the first surface 41 and the second surface 42 of the substrate 4 are covered with the diamond layer 5, but the third surface 43 of the substrate 4 is not covered with the diamond layer 5. That is, a part of the flank 12 is configured by the base material 4 (third surface 43). A part (third surface 43) of the flank 12 constituted by the base material 4 covers the diamond layer 5 covering the first surface of the base material 4 and the second surface of the base material 4. It is located between the diamond layer 5.
  • the diamond layer 5 covering the first surface 41 of the substrate 4 and the diamond layer 5 covering the second surface 42 of the substrate 4 are continuous. Absent.
  • the diamond layer 5 covering the first surface 41 of the base material 4 and the diamond layer 5 covering the second surface 42 of the base material 4 are discontinuous in part of the cutting edge 13. It only has to be.
  • the diamond layer 5 covering the first surface 41 of the substrate 4 and the diamond layer 5 covering the second surface 42 of the substrate 4 are at least near the tip 1a of the cutting tool according to the embodiment. It is preferable that it is discontinuous in the cutting edge 13 located in the position. This is because in the vicinity of the tip 1a, the peripheral speed is close to zero during processing, and the load during cutting is particularly large.
  • flank 12 the third surface 43 constituted by the base material 4 is preferably arranged away from the cutting edge 13.
  • the thickness of the diamond layer 5 covering the first surface 41 of the substrate 4 is a thickness h.
  • the thickness h is preferably 0.1 ⁇ m or more and 50 ⁇ m or less.
  • a cemented carbide which is a sintered body containing a powder such as WC (tungsten carbide) and a binder such as Co (cobalt) is used.
  • the material used for the base material 4 is not restricted to this.
  • the diamond layer 5 is, for example, a layer containing diamond crystals.
  • the diamond layer 5 is, for example, a diamond polycrystalline film.
  • the diamond layer 5 may contain a non-diamond component (for example, an amorphous component).
  • the diamond layer 5 may not contain diamond crystals.
  • the diamond layer 5 may be a DLC (Diamond Like Carbon) layer.
  • the radius of curvature at the tip of the cutting edge 13 is a radius of curvature R.
  • the curvature radius R is preferably 0.01 ⁇ m or more and 10 ⁇ m or less.
  • FIG. 5 is a process diagram of the manufacturing method of the cutting tool according to the first embodiment.
  • the manufacturing method of the cutting tool according to the first embodiment includes a diamond layer forming step S1 and a diamond layer removing step S2.
  • the diamond layer removal step S2 may include a rake face treatment step S21 and a flank face treatment step S22.
  • FIG. 6 is a cross-sectional view of the cutting tool according to the first embodiment after the diamond layer forming step S1 is completed and before the diamond layer removing step S2 is performed.
  • the diamond layer 5 is formed on the substrate 4, and the substrate 4 is covered with the diamond layer 5.
  • the diamond layer 5 is formed by using, for example, HFCVD (Hot Filament Chemical Vapor Deposition).
  • the periphery of the tip of the cutting tool according to the first embodiment is rounded. This is because when the diamond layer 5 is formed, the temperature around the tip of the cutting tool according to the first embodiment is higher than that of the other portions, so that the formation of the diamond layer 5 is promoted.
  • the diamond layer 5 covering the base material 4 is partially removed.
  • the base material 4 is exposed from the flank 12 by removing the diamond layer 5 covering the second surface 42 of the base material 4.
  • FIG. 7 is a cross-sectional view of the cutting tool according to the first embodiment after the end of the rake face treatment step S21 and before the flank face treatment step S22 is performed.
  • the diamond layer 5 covering the first face 41 of the base material 4 is partially removed.
  • the roundness on the rake face 11 side at the tip of the cutting tool according to the first embodiment is flattened.
  • the removal of the diamond layer 5 is performed by irradiating a laser on the rake face 11 side.
  • the laser used for removing the diamond layer 5 is, for example, a second harmonic of a YVO 4 laser.
  • the diamond layer 5 covering the second surface 42 of the base material 4 is partially removed. Partial removal of the diamond layer 5 covering the second surface 42 of the substrate 4 is continued until the substrate 4 is exposed from the flank 12. Thereby, the structure of the cutting tool according to the first embodiment shown in FIG. 4 is formed.
  • the roundness on the flank side of the tip of the cutting tool according to the first embodiment is flattened.
  • the cutting edge 13 of the cutting tool according to the first embodiment is sharpened, and the cutting edge 13 having a curvature radius R of 0.01 ⁇ m or more and 10 ⁇ m or less is obtained.
  • the removal of the diamond layer 5 covering the second surface 42 of the substrate 4 is performed by irradiating a laser on the flank 12 side.
  • the laser used for removing the diamond layer 5 is, for example, a second harmonic of a YVO 4 laser.
  • FIG. 8 is a cross-sectional view in a cross section perpendicular to the cutting edge 13 of the cutting tool according to the second embodiment.
  • the cutting tool according to the second embodiment has a rake face 11, a flank face 12, and a cutting edge 13.
  • the cutting tool according to the second embodiment has a base material 4 and a diamond layer 5.
  • the base material 4 is exposed from the flank 12 (that is, a part of the flank 12 is constituted by the base material 4), and is constituted by the base material 4.
  • a part of the flank 12 is located between the diamond layer 5 covering the first surface 41 of the substrate 4 and the diamond layer 5 covering the second surface 42 of the substrate 4. Yes.
  • the cutting tool according to the second embodiment is common to the cutting tool according to the first embodiment.
  • the cutting tool according to the second embodiment is different from the cutting tool according to the first embodiment in the following points.
  • the first surface 41 of the substrate 4 has a first top surface 41a and a second top surface 41b.
  • the first top surface 41 a is continuous with the second surface 42 of the substrate 4.
  • the second top surface 41b is continuous with the first top surface 41a.
  • the second top surface 41 b is disposed at a position where the first top surface 41 a is sandwiched between the second top surface 41 b and the second surface 42 of the substrate 4.
  • the angle formed by the first top surface 41a and the second top surface 41b is an angle ⁇ 2.
  • the angle ⁇ 2 is a negative angle.
  • the angle ⁇ 2 is a negative angle when the cutting tool is disposed with the second top surface 41b facing upward and the cutting edge 13 facing leftward.
  • the first top surface 41a is the second top surface. This is a case where the rotation is counterclockwise with respect to 41b around the boundary line between the first top surface 41a and the second top surface 41b.
  • the angle ⁇ 2 is a negative angle when the cutting tool is disposed with the second top surface 41b facing upward and the cutting edge 13 facing left. This refers to the case where the surface 41a is inclined leftward with respect to the second top surface 41b.
  • the thickness of the diamond layer 5 covering the first top surface 41a of the substrate 4 is a thickness h1.
  • the thickness h ⁇ b> 1 is the distance between the ridge line between the first top surface 41 a and the second surface 42 and the rake surface 11.
  • the thickness of the diamond layer 5 covering the second top surface 41b of the substrate 4 is a thickness h2.
  • the thickness h ⁇ b> 2 is a distance between the second top surface 41 b and the rake surface 11. Since the angle ⁇ 2 is a negative angle, thickness h1> thickness h2.
  • the distance between the ridgeline between the first top surface 41a and the second top surface 41b and the cutting edge 13 is a distance L.
  • the distance L is a distance in a direction parallel to the rake face 11 in a cross section perpendicular to the cutting edge 13.
  • the distance L is preferably 0.001 ⁇ m or more and 5 ⁇ m or less.
  • the cutting tool manufacturing method according to the second embodiment includes a diamond layer forming step S1 and a diamond layer removing step S2, similar to the cutting tool manufacturing method according to the first embodiment.
  • the layer removal step S2 has a rake face treatment step S21 and a flank face treatment step S22.
  • the manufacturing method of the cutting tool according to the second embodiment is the first in that the first surface 41 of the substrate 4 to be used has the first top surface 41a and the second top surface 41b. It differs from the manufacturing method of the cutting tool which concerns on embodiment.
  • FIG. 9 is a cross-sectional view in a cross section perpendicular to the cutting edge 13 of the cutting tool according to the comparative example.
  • the cutting tool according to the comparative example has a rake face 11, a flank face 12, and a cutting edge 13.
  • the cutting tool according to the comparative example has a base material 4 and a diamond layer 5.
  • the diamond layer 5 covers the first surface 41 and the second surface 42 of the base 4, and the base 4 is not exposed from the flank 12. That is, in the cutting tool according to the comparative example, the diamond layer 5 covers the first surface 41 and the second surface 42 of the base material 4 continuously (without a break).
  • the main component force (cutting force in the direction from the rake face 11 toward the flank 12) is applied to the rake face 11 near the cutting edge 13.
  • the diamond layer 5 covers the first surface 41 and the second surface 42 of the base material 4 continuously (without breaks), so that the main component force is the first component force of the base material 4. It tends to act on the diamond layer 5 covering the two surfaces 42.
  • the flank peeling of the diamond layer 5 tends to occur.
  • a part of the flank 12 is constituted by the base material 4, and a part of the flank 12 constituted by the base material 4. Is located between the diamond layer 5 covering the first surface 41 of the substrate 4 and the diamond layer 5 covering the second surface of the substrate 4. That is, the diamond layer 5 covering the first surface 41 of the substrate 4 and the diamond layer 5 covering the second surface 42 of the substrate 4 are not continuous at least at a part of the cutting edge 13. .
  • the main component force generated on the rake face 11 when performing the cutting process hardly acts on the diamond layer 5 covering the second surface 42 of the base material 4. .
  • flank separation of the diamond layer 5 can be suppressed.
  • the first surface 41 of the base material 4 has the first top surface 41a and the second top surface 41b, and the angle ⁇ 2 is a negative angle. It has become. Therefore, in the cutting tool according to the second embodiment, the diamond layer 5 is in contact with the first surface 41 of the base material 4 with a wider area than the cutting tool according to the first embodiment. Therefore, according to the cutting tool which concerns on 2nd Embodiment, peeling of the diamond layer 5 can further be suppressed.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Vapour Deposition (AREA)
  • Cutting Tools, Boring Holders, And Turrets (AREA)

Abstract

L'invention concerne, selon un mode de réalisation, un outil de coupe comprenant : une face de dépouille ; une face latérale continue avec la face de dépouille ; et un bord de coupe constitué d'une ligne de crête entre la face de dépouille et la face latérale. L'outil de coupe, selon un mode de réalisation de l'invention, comprend : un matériau de base présentant une première face qui est la face sur le côté face de dépouille, et une seconde face qui est la face sur le côté de face latérale ; et une couche diamantée recouvrant la première face et la seconde face. Une partie de la face latérale est constituée du matériau de base. La partie de la face latérale constituée du matériau de base est située entre la couche diamantée recouvrant la première face et la couche diamantée recouvrant la seconde face.
PCT/JP2017/023138 2016-09-29 2017-06-23 Outil de coupe Ceased WO2018061355A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016191641 2016-09-29
JP2016-191641 2016-09-29

Publications (1)

Publication Number Publication Date
WO2018061355A1 true WO2018061355A1 (fr) 2018-04-05

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2017/023138 Ceased WO2018061355A1 (fr) 2016-09-29 2017-06-23 Outil de coupe

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TW (1) TW201813745A (fr)
WO (1) WO2018061355A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190201985A1 (en) * 2017-08-22 2019-07-04 Sumitomo Electric Hardmetal Corp. Rotary cutting tool and method of manufacturing the same
EP3520939A4 (fr) * 2016-09-29 2020-05-27 Sumitomo Electric Hardmetal Corp. Outil de coupe
US10882117B2 (en) * 2016-06-29 2021-01-05 Sumitomo Electric Hardmetal Corp. Cutting tool
JP2022553276A (ja) * 2019-10-21 2022-12-22 マパル ファブリック フュール プラツィジョンズベルクゼウグ ドクトル．クレス カーゲー 工具部品および工具部品を製造するための方法
WO2023222822A1 (fr) * 2022-05-17 2023-11-23 Rollomatic S.A Procédé de production d'un outil de coupe

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001212703A (ja) * 1999-11-25 2001-08-07 Sumitomo Electric Ind Ltd 多結晶硬質焼結体切削工具
JP2005022073A (ja) * 2003-06-11 2005-01-27 Sumitomo Electric Hardmetal Corp Ｄｌｃ被覆工具
WO2006073233A1 (fr) * 2005-01-03 2006-07-13 Yang-Gu Lee Plaquette d'outil de coupe
JP2008142890A (ja) * 2007-12-25 2008-06-26 Kyocera Corp 切削工具を用いた精密加工方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001212703A (ja) * 1999-11-25 2001-08-07 Sumitomo Electric Ind Ltd 多結晶硬質焼結体切削工具
JP2005022073A (ja) * 2003-06-11 2005-01-27 Sumitomo Electric Hardmetal Corp Ｄｌｃ被覆工具
WO2006073233A1 (fr) * 2005-01-03 2006-07-13 Yang-Gu Lee Plaquette d'outil de coupe
JP2008142890A (ja) * 2007-12-25 2008-06-26 Kyocera Corp 切削工具を用いた精密加工方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10882117B2 (en) * 2016-06-29 2021-01-05 Sumitomo Electric Hardmetal Corp. Cutting tool
EP3520939A4 (fr) * 2016-09-29 2020-05-27 Sumitomo Electric Hardmetal Corp. Outil de coupe
US20190201985A1 (en) * 2017-08-22 2019-07-04 Sumitomo Electric Hardmetal Corp. Rotary cutting tool and method of manufacturing the same
US10981235B2 (en) * 2017-08-22 2021-04-20 Sumitomo Electric Hardmetal Corp. Rotary cutting tool and method of manufacturing the same
JP2022553276A (ja) * 2019-10-21 2022-12-22 マパル ファブリック フュール プラツィジョンズベルクゼウグ ドクトル．クレス カーゲー 工具部品および工具部品を製造するための方法
WO2023222822A1 (fr) * 2022-05-17 2023-11-23 Rollomatic S.A Procédé de production d'un outil de coupe

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