WO2018052104A1 - 積層体 - Google Patents
積層体 Download PDFInfo
- Publication number
- WO2018052104A1 WO2018052104A1 PCT/JP2017/033379 JP2017033379W WO2018052104A1 WO 2018052104 A1 WO2018052104 A1 WO 2018052104A1 JP 2017033379 W JP2017033379 W JP 2017033379W WO 2018052104 A1 WO2018052104 A1 WO 2018052104A1
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- Prior art keywords
- resin
- adhesive layer
- film
- acid
- laminate
- Prior art date
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/35—Heterocyclic compounds having nitrogen in the ring having also oxygen in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
- C09J177/06—Polyamides derived from polyamines and polycarboxylic acids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
Definitions
- the present invention relates to a laminate comprising a resin film and an adhesive layer and suitable for applications exposed to high temperatures during production and use, and having excellent heat resistance.
- Patent Document 1 discloses a heat-resistant adhesive sheet in which a polyimide resin film, which is a heat-resistant resin film, is used as a base film, and a thermosetting adhesive is laminated thereon.
- the present invention is a laminate formed by forming an adhesive layer on a heat-resistant resin film, and the adhesive layer of this laminate can be bonded to an adherend by a short-time thermocompression bonding. It is a technical problem to provide a laminate that is excellent in adhesiveness and does not deteriorate the adhesiveness even at high temperatures.
- the present inventors have been able to laminate an adhesive layer containing a dimer acid-based polyamide resin on a resin film composed of a specific resin in a short time.
- the body is excellent in the adhesion between the resin film and the adhesive layer, can be bonded to the adherend in a short time, and the adhesion with the adherend is found to be excellent at both normal temperature and high temperature,
- the present invention has been reached. That is, the gist of the present invention is as follows.
- the resin constituting the resin film is a semi-aromatic polyamide and / or a polyimide resin
- a laminate comprising an adhesive layer containing a dimer acid-based polyamide resin having an amine value of less than 1.0 mgKOH / g and a crosslinking agent.
- the crosslinking agent is an oxazoline compound.
- the laminate of the present invention is composed of an adhesive layer containing a dimer acid-based polyamide resin and a crosslinking agent, and a resin film made of a specific resin, and the adhesive layer is formed on the resin film in a short time.
- This adhesive layer is excellent in adhesion to the resin film.
- the adhesive layer of the laminate of the present invention can be bonded to the adherend by short-time thermocompression bonding, and is excellent in adhesion to the adherend at both normal temperature and high temperature.
- Specific examples of the adherend include a resin film such as polyimide, a metal plate, and a hard coat layer formed by applying a coating liquid on the surface of the adhesive layer.
- the laminate of the present invention can be used in any mode of a single-sided adhesive sheet in which an adhesive layer is provided on one side of a resin film or a double-sided adhesive sheet in which an adhesive layer is provided on both sides of a resin film.
- the laminate of the present invention is one in which an adhesive layer is provided on at least one side of a resin film, and the adhesive layer contains a dimer acid-based polyamide resin and a crosslinking agent.
- the dimer acid-based polyamide resin constituting the adhesive layer has a large hydrocarbon group, it is excellent in flexibility as compared with resins such as nylon 6, nylon 66, and nylon 12, which are widely used as polyamide resins.
- the dimer acid-based polyamide resin contains dimer acid as the dicarboxylic acid component, and the dimer acid is preferably contained in an amount of 50 mol% or more, more preferably 60 mol% or more of the entire dicarboxylic acid component. More preferably, it is more preferable to contain 70 mol% or more.
- the ratio of the dimer acid is less than 50 mol%, it becomes difficult to achieve the characteristics and effects of the dimer acid-based polyamide resin. As a result, sufficient adhesion with the resin film as the base material and the adherend In some cases, sufficient adhesion cannot be obtained.
- the dimer acid is obtained by dimerizing an unsaturated fatty acid having 18 carbon atoms such as oleic acid or linoleic acid, and is a monomer if it is 25% by mass or less of the dimer acid component.
- Monomer acid (18 carbon atoms), trimer trimer acid (54 carbon atoms), other polymerized fatty acids having 20 to 54 carbon atoms may be included, and hydrogenated to reduce the degree of unsaturation Good.
- Dimer acids are commercially available as the Hari dimer series (manufactured by Harima Kasei Co., Ltd.), the pre-pole series (manufactured by Croda Japan Co., Ltd.), the Tsuno Dime series (manufactured by Tsukino Food Industry Co., Ltd.), etc.
- a component other than dimer acid is used as the dicarboxylic acid component of the dimer acid-based polyamide resin
- adipic acid, azelaic acid, sebacic acid, pimelic acid, suberic acid, nonanedicarboxylic acid, fumaric acid, etc. By containing, control of the softening point of resin, adhesiveness, etc. becomes easy.
- the diamine component of the dimer acid polyamide resin ethylenediamine, hexamethylenediamine, tetramethylenediamine, pentamethylenediamine, m-xylenediamine, phenylenediamine, diethylenetriamine, piperazine and the like can be used, among which ethylenediamine, hexamethylene. Diamine, diethylenetriamine, m-xylenediamine and piperazine are preferred.
- the polymerization degree or acid value or amine value of the resin can be controlled by changing the charging ratio of the dicarboxylic acid component and the diamine component.
- the amine value of the dimer acid polyamide resin needs to be less than 1.0 mgKOH / g, preferably less than 0.7 mgKOH / g, and less than 0.4 mgKOH / g. More preferred.
- the heat resistance of the adhesive layer may decrease, and even when used as a primer or as a primer. Adhesiveness with a to-be-adhered body may fall.
- the acid value of the dimer acid polyamide resin is preferably 1 to 20 mgKOH / g, more preferably 1 to 15 mgKOH / g, from the viewpoint of adhesion to an adherend when used as a primer. It is preferably 3 to 12 mgKOH / g, more preferably 5 to 12 mgKOH / g. Further, from the viewpoint of adhesion to an adherend such as a metal plate, it is preferably 1 to 20 mgKOH / g, more preferably 1 to 15 mgKOH / g, and most preferably 5 to 12 mgKOH / g. preferable.
- the acid value of the dimer acid-based polyamide resin is less than 1 mgKOH / g, the adhesion with the resin film as the base material and the adhesion with the resin film or metal as the adherend may be insufficient. When it exceeds 20 mgKOH / g, the adhesiveness with the resin film which is a base material may become inadequate.
- the acid value is defined as the number of milligrams of potassium hydroxide required to neutralize the acidic component contained in 1 g of resin.
- the amine value is represented by the number of milligrams of potassium hydroxide that is molar equivalent to the base component in 1 g of the resin. Both are measured by the method described in JIS K2501.
- the softening point of the dimer acid-based polyamide resin is preferably 70 to 250 ° C, more preferably 80 to 240 ° C, and further preferably 80 to 200 ° C.
- the softening point is less than 70 ° C.
- the resulting adhesive layer tends to have low heat resistance, and tends to increase tackiness at room temperature.
- the softening point exceeds 250 ° C.
- the resulting adhesive layer has insufficient resin fluidity when bonded, and sufficient adhesiveness may not be obtained.
- the adhesive layer in the present invention contains a dimer acid polyamide resin and a crosslinking agent.
- a dimer acid polyamide resin By crosslinking the dimer acid-based polyamide resin, it is possible to obtain an adhesive layer that exhibits heat resistance even when heated to a temperature higher than the softening point of the resin, and it is possible to obtain a laminate having excellent hot adhesiveness.
- Any crosslinking agent can be used as long as it can crosslink dimer acid polyamide resins.
- hydrazide compounds, isocyanate compounds, melamine compounds, urea compounds, epoxy compounds, carbodiimide compounds, oxazoline compounds, and those having self-crosslinkability and those having a multivalent coordination position can be mentioned. Or it can mix and use.
- an oxazoline compound, a carbodiimide compound, an epoxy compound, and an isocyanate compound are preferable, and an oxazoline compound is more preferable.
- a commercially available crosslinking agent may be used because it is easily available.
- APA series (APA-M950, APAM980, APA-P250, APA-P280, etc.) manufactured by Otsuka Chemical Co., Ltd. can be used as the hydrazide compound.
- BASONAT PLR 8878 manufactured by BASF Vasonate HW-100, Bayhydur 3100 manufactured by Sumitomo Bayer Urethane, and Bihydur VPLS 2150/1 can be used.
- a melamine compound Cymel 325 manufactured by Mitsui Cytec Co., Ltd. can be used.
- urea compound becamine series manufactured by DIC, etc.
- the epoxy compound Denacol series (EM-150, EM-101, etc.) manufactured by Nagase Chemtech, Adeka Resin EM-0517, EM-0526, EM-051R, EM-11-50B manufactured by ADEKA, etc. can be used.
- carbodiimide compounds carbodilite series (SV-02, V-02, V-02-L2, V-04, E-01, E-02, V-01, V-03, V-, manufactured by Nisshinbo Chemical Co., Ltd.) 07, V-09, V-05) and the like can be used.
- EPOCROSS series (WS-500, WS-700, K-1010E, K-1020E, K-1030E, K-2010E, K-2020E, K-2030E) manufactured by Nippon Shokubai Co., Ltd. can be used. These are commercially available as dispersions or solutions containing a cross-linking agent.
- the adhesive layer in the present invention contains a dimer acid polyamide resin and a crosslinking agent, and preferably contains 0.5 to 50 parts by mass of the crosslinking agent with respect to 100 parts by mass of the dimer acid polyamide resin.
- the content of the crosslinking agent is less than 0.5 parts by mass, it becomes difficult to obtain sufficient heat resistance in the adhesive layer.
- the content exceeds 50 parts by mass, the liquid stability and processing of the adhesive layer-forming coating agent described later
- the adhesiveness with the resin film which is a base material, the adhesiveness with the resin film and metal which is a to-be-adhered body, and the basic performance as an adhesive layer may be difficult to obtain.
- the thickness of the adhesive layer in the laminate is not particularly limited and is preferably 0.01 to 50 ⁇ m, but can be arbitrarily selected according to the method of laminating the adherend. In the case of bonding by hot pressing, the thickness is preferably 0.1 to 50 ⁇ m, more preferably 0.5 to 20 ⁇ m, and most preferably 1.0 to 15 ⁇ m.
- the thickness is preferably 0.01 to 30 ⁇ m, more preferably 0.03 to 20 ⁇ m, and most preferably 0.05 to 10 ⁇ m. If the thickness is less than 0.01 ⁇ m, the adhesiveness may not be sufficiently exhibited. On the other hand, if the thickness exceeds 50 ⁇ m, the adhesiveness may be saturated, which may be disadvantageous in terms of cost.
- an adhesive layer containing a dimer acid-based polyamide resin and a cross-linking agent is provided on at least one surface of a resin film, and has excellent adhesiveness with the adhesive layer.
- the resin constituting the resin film needs to be a semi-aromatic polyamide and / or a polyimide resin.
- the semi-aromatic polyamide is composed of a dicarboxylic acid component and a diamine component, and has an aromatic component in the dicarboxylic acid component or diamine component.
- the dicarboxylic acid component constituting the semi-aromatic polyamide is preferably terephthalic acid as a main component, and as dicarboxylic acid components other than terephthalic acid, oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, sebacic acid , Aliphatic dicarboxylic acids such as dodecanedioic acid, tetradecanedioic acid and octadecanedioic acid, and aromatics such as 1,4-naphthalenedicarboxylic acid, 1,3-naphthalenedicarboxylic acid, 1,2-naphthalenedicarboxylic acid and isophthalic acid Dicarboxylic acid is mentioned.
- the diamine component constituting the semi-aromatic polyamide is preferably composed mainly of an aliphatic diamine having 4 to 15 carbon atoms, such as 1,4-butanediamine, 1,5-pentanediamine, and 1,6-hexane.
- a dicarboxylic acid component consisting of terephthalic acid only (100 mol% terephthalic acid), and 1,9-
- a semi-aromatic polyamide comprising a diamine component containing 60 to 100 mol% of nonanediamine and 2-methyl-1,8-octanediamine in total in the diamine component or a diamine component containing 1,10-decanediamine is preferred.
- the semi-aromatic polyamide may be copolymerized with lactams such as ⁇ -caprolactam, ⁇ -enantolactam, ⁇ -capryllactam, and ⁇ -laurolactam as long as the object of the present invention is not impaired.
- lactams such as ⁇ -caprolactam, ⁇ -enantolactam, ⁇ -capryllactam, and ⁇ -laurolactam
- the type and copolymerization ratio of the monomers constituting the semiaromatic polyamide are preferably selected so that the Tm (melting point) of the obtained semiaromatic polyamide is in the range of 280 to 350 ° C.
- the thermal decomposition of the semi-aromatic polyamide when processed into a resin film can be efficiently suppressed. If the Tm is less than 280 ° C., the resulting resin film may have insufficient heat resistance. On the other hand, if Tm exceeds 350 ° C., thermal decomposition may occur during the production of the resin film.
- commercially available products can be suitably used as the semi-aromatic polyamide.
- examples of such commercially available products include “Genesta (registered trademark)” manufactured by Kuraray Co., Ltd., “Zecott (registered trademark)” manufactured by Unitika, “Reny (registered trademark)” manufactured by Mitsubishi Engineering Plastics, and Mitsui Chemicals Examples include “Aalen (registered trademark)”, “Ultramid (registered trademark)” manufactured by BASF Corporation.
- Semi-aromatic polyamide can be produced using any known method. Examples thereof include a solution polymerization method or an interfacial polymerization method using an acid chloride and a diamine component as raw materials. Alternatively, a method of preparing a prepolymer using a dicarboxylic acid component and a diamine component as raw materials and increasing the molecular weight of the prepolymer by melt polymerization or solid phase polymerization can be mentioned.
- an end-capping agent may be used together with the diamine component, dicarboxylic acid component and polymerization catalyst as necessary.
- the end-capping agent is not particularly limited as long as it is a monofunctional compound having reactivity with an amino group or a carboxyl group at the end of the semi-aromatic polyamide, from the viewpoint of suppressing thermal decomposition or suppressing increase in molecular weight.
- Examples include monocarboxylic acids, monoamines, acid anhydrides, monoisocyanates, monohalides, monoesters, and monoalcohols.
- the polyimide resin constituting the resin film is a polymer containing an imide bond in the repeating unit, and examples thereof include polyimide, polyetherimide, and polyamideimide.
- the polyimide resin is produced by any known method.
- a polyimide resin obtained by reacting a tetracarboxylic dianhydride and a diamine compound is used. It is preferable to be obtained by imidizing a resin precursor (polyamic acid).
- tetracarboxylic dianhydride examples include pyromellitic dianhydride, 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride, and 2,2-bis (2,3-dicarboxyphenyl).
- diamine compound examples include m-phenylenediamine, p-phenylenediamine, 3,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl sulfone, 3,3'-diaminodiphenyl sulfone.
- the polyimide resin is composed of tetracarboxylic dianhydride pyromellitic dianhydride and diamine compound 4,4'-diaminodiphenyl ether.
- tetracarboxylic dianhydride is 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride and the diamine compound is p-phenylenediamine is preferable.
- the polyimide resin may be a polyamideimide, which is a polymer in which a tricarboxylic acid component and a diamine component are bonded to an imide bond and an amide bond.
- a tricarboxylic acid component include trimellitic acid, diphenyl ether-3,3 ', 4'-tricarboxylic acid, diphenylsulfone-3,3', 4'-tricarboxylic acid, benzophenone-3,3 ', 4'-tricarboxylic acid, etc.
- the diamine component include those exemplified as the diamine compound constituting the polyimide resin.
- Polyamideimide can usually be produced by polymerizing by reaction of trimellitic anhydride and diisocyanate, or by reaction of trimellitic anhydride chloride and diamine, and then imidizing.
- the method for producing a resin film from the above semi-aromatic polyamide or polyimide resin is not particularly limited, and examples thereof include an extrusion method or a solvent casting method, and the resin film constituting the laminate of the present invention is Any of these methods may be used.
- the resin film is required to be composed of the above resin, but includes known additives and stabilizers, such as antistatic agents, plasticizers, lubricants, antioxidants, etc., as long as the effects of the present invention are not impaired. It may be.
- the resin film may be subjected to a corona treatment, a plasma treatment, an ozone treatment, a chemical treatment, a solvent treatment, or the like as a pretreatment on the surface in consideration of adhesiveness when laminated with the adhesive layer.
- the thickness of the resin film is preferably 0.5 ⁇ m to 1.5 mm, more preferably 15 to 200 ⁇ m, and even more preferably 25 to 100 ⁇ m. If the thickness of the resin film is less than 0.5 ⁇ m, the production is difficult, and if it exceeds 1.5 mm, it is difficult to handle, which is not preferable.
- the resin film may be an unstretched film or a stretched film.
- the resin film constituting the laminate is required to have excellent transparency depending on the use of the laminate.
- the transparency of a film is represented by haze and total light transmittance.
- the resin film constituting the laminate of the present invention preferably has a haze of less than 15%, more preferably less than 10%, and a total light transmittance of preferably 60% or more, 80% More preferably.
- the laminate of the present invention is one in which an adhesive layer is provided on at least one side of a resin film, for example, an adhesive layer forming coating containing a dimer acid-based polyamide resin and a crosslinking agent is applied to the resin film, It can be manufactured by drying.
- the adhesive layer-forming coating agent is a dispersion obtained by dispersing or dissolving a dimer acid-based polyamide resin and a crosslinking agent in an aqueous medium or solvent, and is an aqueous dispersion dispersed in an aqueous medium in consideration of the working environment.
- the aqueous medium is a liquid mainly composed of water, and may contain a basic compound or a hydrophilic organic solvent described later.
- a basic compound In order to disperse the dimer acid-based polyamide resin in an aqueous medium with good stability, it is preferable to use a basic compound.
- the basic compound By using the basic compound, some or all of the carboxyl groups contained in the dimer acid-based polyamide resin are neutralized, carboxyl anions are generated, and the electric repulsive force releases the aggregation between the resin fine particles, The dimer acid-based polyamide resin is stably dispersed in the aqueous medium.
- the aqueous dispersion in the present invention has a carboxyl group in the dimer acid-based polyamide resin neutralized with a basic compound, and can maintain a stable form in an alkaline region.
- the pH of the aqueous dispersion is preferably in the range of 7-13.
- the basic compound a basic compound having a boiling point of less than 185 ° C. at normal pressure is preferable.
- Examples of the basic compound having a boiling point of less than 185 ° C. at normal pressure include amines such as ammonia and organic amine compounds.
- Specific examples of the organic amine compound include triethylamine, N, N-dimethylethanolamine, isopropylamine, iminobispropylamine, ethylamine, diethylamine, 3-ethoxypropylamine, 3-diethylaminopropylamine, sec-butylamine, propylamine, Examples thereof include methylaminopropylamine, methyliminobispropylamine, 3-methoxypropylamine, monoethanolamine, morpholine, N-methylmorpholine, N-ethylmorpholine and the like.
- the basic compounds having a boiling point of less than 185 ° C. at normal pressure triethylamine and N, N-dimethylethanolamine are preferred.
- the boiling point of the basic compound at normal pressure exceeds 185 ° C., it becomes difficult to volatilize the basic compound, particularly the organic amine compound by drying, when applying a water-based coating to form a coating film. May adversely affect hygiene and coating properties.
- the content of the basic compound in the aqueous dispersion is preferably 0.01 to 100 parts by weight, more preferably 1 to 40 parts by weight, and further preferably 1 to 15 parts by weight with respect to 100 parts by weight of the resin solid content. preferable.
- the content of the basic compound is less than 0.01 parts by mass, the effect of adding the basic compound is poor, and it becomes difficult to obtain an aqueous dispersion excellent in dispersion stability.
- the content of the basic compound exceeds 100 parts by mass, the aqueous dispersion tends to be colored or gelled, and the pH of the emulsion tends to be too high.
- the boiling point at normal pressure is 185 ° C. or higher or a non-volatile aqueous additive is not contained.
- a boiling point at normal pressure of 185 ° C. or higher, or a non-volatile aqueous auxiliary agent refers to an emulsifier component or a compound having a protective colloid effect. That is, in the present invention, a stable aqueous dispersion having a fine resin particle size can be obtained without using an aqueous additive.
- the present invention does not preclude the use of an aqueous additive.
- the aqueous dispersion is clearly distinguished from that obtained by a method based on the so-called phase inversion emulsification method containing an aqueous auxiliary agent as an essential component. Therefore, an aqueous auxiliary agent is not used as much as possible. It is particularly preferred that it is not used at all.
- an aqueous auxiliary agent may be used positively depending on the purpose, for example, when newly obtaining another coating material containing the aqueous dispersion. Needless to say, an aqueous auxiliary agent may be added accordingly.
- the emulsifier component examples include a cationic emulsifier, an anionic emulsifier, a nonionic emulsifier, and an amphoteric emulsifier.
- surfactants are also included.
- anionic emulsifiers include higher alcohol sulfates, higher alkyl sulfonates, higher carboxylates, alkyl benzene sulfonates, polyoxyethylene alkyl sulfate salts, polyoxyethylene alkyl phenyl ether sulfate salts, vinyl sulfosuccinates.
- Nonionic emulsifiers include polyoxyethylene alkyl ether, polyoxyethylene alkyl phenyl ether, polyethylene glycol fatty acid ester, ethylene oxide propylene oxide block copolymer, polyoxyethylene fatty acid amide, ethylene oxide-propylene oxide Examples thereof include a compound having a polyoxyethylene structure such as a copolymer and a sorbitan derivative.
- amphoteric emulsifiers include lauryl betaine and lauryl dimethylamine oxide.
- the compounds having protective colloid action include polyvinyl alcohol, carboxyl group-modified polyvinyl alcohol, carboxymethyl cellulose, hydroxyethyl cellulose, hydroxypropyl cellulose, modified starch, polyvinyl pyrrolidone, polyacrylic acid and salts thereof, carboxyl group-containing polyethylene wax, carboxyl group-containing Acid-modified polyolefin waxes having a number average molecular weight of usually 5000 or less, such as polypropylene wax and carboxyl group-containing polyethylene-propylene wax, and salts thereof, acrylic acid-maleic anhydride copolymers and salts thereof, styrene- (meth) acrylic acid Copolymer, ethylene- (meth) acrylic acid copolymer, isobutylene-maleic anhydride alternating copolymer, (meth) acrylic acid- (meth) acrylic Carboxyl group-containing polymer having an unsaturated carboxylic acid content of 10% by mass or more, such as a
- the adhesive layer in the laminate of the present invention is preferably an aqueous dispersion in which a dimer acid-based polyamide resin is dispersed in an aqueous medium from the viewpoint of work environment, but is not limited thereto.
- a sealable container a means for preparing each component in a sealable container, heating and stirring is preferably employed. Specifically, first, a predetermined amount of dimer acid-based polyamide resin, a basic compound, and an aqueous medium are put into a container.
- the basic compound or the hydrophilic organic solvent described later may be contained in the aqueous medium, for example, if an aqueous medium containing the basic compound is used, the basic compound is separately provided. As a result, the basic compound is charged into the container. Next, the container is sealed and heated and stirred at a temperature of preferably 70 to 280 ° C., more preferably 100 to 250 ° C. When the temperature at the time of heating and stirring is less than 70 ° C., the dispersion of the dimer acid-based polyamide resin is difficult to proceed and the number average particle diameter of the resin tends to be difficult to be 0.5 ⁇ m or less.
- the molecular weight of the dimer acid-based polyamide resin may decrease, and the internal pressure of the system may increase to a level that cannot be ignored.
- heating and stirring it is preferable to heat and stir at 10 to 1000 revolutions per minute until the resin is uniformly dispersed in the aqueous medium.
- a hydrophilic organic solvent may be added to the container.
- the hydrophilic organic solvent has a solubility in water at 20 ° C. from the viewpoint of further reducing the particle size of the dimer acid-based polyamide resin and further promoting the dispersion of the dimer acid-based polyamide resin in the aqueous medium.
- a hydrophilic organic solvent that is soluble in an arbitrary ratio with water may be selected and used, preferably 50 g / L or more, more preferably 100 g / L or more, further preferably 600 g / L or more.
- the boiling point of the hydrophilic organic solvent is preferably 30 to 250 ° C, more preferably 50 to 200 ° C.
- the hydrophilic organic solvent is likely to volatilize during the preparation of the aqueous dispersion. As a result, the meaning of using the hydrophilic organic solvent is lost and the working environment is also liable to be lowered. On the other hand, when it exceeds 250 ° C., it tends to be difficult to remove the hydrophilic organic solvent from the aqueous dispersion. As a result, when the coating film is formed, the organic solvent remains in the coating film, May reduce solvent resistance.
- a hydrophilic organic solvent may be contained in the aqueous medium, so if an aqueous medium containing a hydrophilic organic solvent is used, an additional hydrophilic organic solvent is added separately. Even if not, as a result, the hydrophilic organic solvent is charged in the container.
- the blending amount of the hydrophilic organic solvent is preferably 60% by mass or less based on the total of the components constituting the aqueous medium (water, basic compounds and various organic solvents including the hydrophilic organic solvent). It is more preferably 1 to 50% by mass, further preferably 2 to 40% by mass, particularly preferably 3 to 30% by mass.
- the blending amount of the hydrophilic organic solvent exceeds 60% by mass, not only the effect of promoting aqueous formation can be expected, but also the aqueous dispersion tends to gel in some cases, such being undesirable.
- hydrophilic organic solvent examples include methanol, ethanol, n-propanol, isopropanol, n-butanol, isobutanol, sec-butanol, tert-butanol, n-amyl alcohol, isoamyl alcohol, sec-amyl alcohol, tert- Alcohols such as amyl alcohol, 1-ethyl-1-propanol, 2-methyl-1-butanol, n-hexanol, cyclohexanol; ketones such as methyl ethyl ketone, methyl isobutyl ketone, ethyl butyl ketone, cyclohexanone, isophorone; tetrahydrofuran, Ethers such as dioxane; ethyl acetate, acetic acid-n-propyl, isopropyl acetate, acetic acid-n-butyl, isobutyl acetate,
- a part of the organic solvent or basic compound blended in the aqueous treatment can be removed from the aqueous dispersion by a solvent removal operation called stripping.
- stripping a solvent removal operation
- the content of the organic solvent can be reduced to 0.1% by mass or less as necessary. Even if the content of the organic solvent is 0.1% by mass or less, the influence on the performance of the aqueous dispersion is not particularly confirmed.
- the stripping method include a method in which the aqueous dispersion is heated with stirring at normal pressure or reduced pressure to distill off the organic solvent. At this time, it is preferable to select a temperature and pressure at which the basic compound is not completely distilled off.
- a solid content concentration in an aqueous dispersion becomes high when a part of aqueous medium is distilled off simultaneously, it is preferable to adjust the solid content concentration appropriately.
- hydrophilic organic solvents that can be easily removed include, for example, ethanol, n-propanol, isopropanol, n-butanol, methyl ethyl ketone, cyclohexanone, tetrahydrofuran, dioxane, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol mono Examples thereof include butyl ether, and ethanol, n-propanol, isopropanol, tetrahydrofuran and the like are particularly preferably used in the present invention.
- a hydrophilic organic solvent that can be easily removed from the solvent is preferably used in the present invention because it generally contributes to the promotion of water-based resin.
- a hydrocarbon-based organic solvent such as toluene or cyclohexane is added to the entire components constituting the aqueous medium. You may mix
- the aqueous dispersion of the dimer acid-based polyamide resin can be obtained by the above method, but after each component is heated and stirred, the obtained aqueous dispersion may be cooled to room temperature as necessary.
- the aqueous dispersion does not aggregate at all even through such a cooling process, and the stability is naturally maintained. And after cooling an aqueous dispersion, even if this is immediately paid out and it uses for the next process, there is basically no problem.
- an aqueous coating agent for forming an adhesive layer can be obtained by mixing an appropriate amount of this aqueous dispersion and a dispersion or solution containing a crosslinking agent.
- the dimer acid polyamide resin when dissolved in an aqueous medium to form an aqueous coating, for example, the polyamide resin is added to a hydrophilic organic solvent such as n-propanol and heated at a temperature of 30 to 100 ° C. After the resin is once dissolved by stirring, an aqueous coating agent for forming an adhesive layer can be obtained by adding an appropriate amount of a dispersion or solution containing water and the above-mentioned crosslinking agent.
- a hydrophilic organic solvent such as n-propanol
- the adhesive layer-forming coating agent is preferably an aqueous coating agent as described above, but may be one in which a dimer acid-based polyamide resin and a crosslinking agent are dispersed or dissolved in an organic solvent.
- organic solvents include methanol, ethanol, n-propanol, isopropanol, n-butanol, isobutanol, sec-butanol, tert-butanol, n-amyl alcohol, isoamyl alcohol, sec-amyl alcohol, tert-amyl alcohol, 1- Alcohols such as ethyl-1-propanol, 2-methyl-1-butanol, n-hexanol and cyclohexanol; ketones such as methyl ethyl ketone, methyl isobutyl ketone, ethyl butyl ketone, cyclohexanone and isophorone; ethers such as tetrahydrofuran
- the content (solid content concentration) of the dimer acid-based polyamide resin in the adhesive layer-forming coating material can be appropriately selected according to the purpose of use and the storage method, and is not particularly limited, but is preferably 3 to 40% by mass. Of these, the content is preferably 10 to 35% by mass. If the content of the dimer acid polyamide resin in the adhesive layer forming coating is less than the above range, it may take time to form the coating film by the drying process, and it tends to be difficult to obtain a thick coating film. It is in. On the other hand, when the content of the dimer acid-based polyamide resin in the coating for forming an adhesive layer is more than the above range, the coating tends to have low storage stability.
- the viscosity of the adhesive layer-forming coating material is not particularly limited, but it is preferably low viscosity even at room temperature.
- the rotational viscosity measured at 20 ° C. using a B-type viscometer is preferably 20000 mPa ⁇ s or less, more preferably 5000 mPa ⁇ s or less, More preferably 500 mPa ⁇ s or less.
- the viscosity of the adhesive layer-forming coating agent exceeds 20000 mPa ⁇ s, it tends to be difficult to uniformly apply the coating agent to the resin film.
- the adhesive layer-forming coating may be an antistatic agent, leveling agent, UV absorber, antifoaming agent, thickener, wax, anti-skinning agent, matting agent, inorganic or organic particles.
- Additives such as lubricants may be blended, and good dispersion stability is maintained even when a basic material is blended as the additive.
- inorganic particles to be added include silica, colloidal silica, alumina, alumina sol, tin oxide, titanium oxide, zinc oxide, niobium oxide, neodymium oxide, lanthanum oxide, zirconium oxide, cerium oxide, magnesium oxide, and the like.
- a method of providing an adhesive layer on the above-mentioned resin film As a method of providing an adhesive layer on the above-mentioned resin film, a method of applying the above-mentioned adhesive layer forming coating agent to a biaxially stretched resin film (offline method), an adhesive layer to a resin film before biaxial stretching A method (in-line method) of stretching and heat treatment after applying the coating agent for formation can be mentioned, and any method can be adopted.
- a method of providing an adhesive layer by bonding a substrate provided with an adhesive layer to a substrate to be adhered to a resin film, or a resin obtained by forming an adhesive layer on a substrate film such as a release film It is also possible to adopt a method such as transferring the adhesive layer by peeling the release film after bonding to the film.
- the adhesive layer forming coating agent can be applied in a state where the degree of orientation crystallization on the resin film surface is small. Adhesion between the resin film and the adhesive layer is improved. Moreover, adhesiveness of the adhesive layer can be improved without lowering the quality of the resin film by performing higher temperature heat treatment on the adhesive layer in a state where the resin film is in tension.
- the heat treatment temperature can be 250 ° C. or higher, which is the heat setting temperature of the resin film, and orientation crystallization proceeds in the adhesive layer together with the resin film at this temperature.
- the dimer acid-based polyamide resin and the cross-linking agent sufficiently react, and the adhesive layer is expected to increase the coating strength of itself and to increase the adhesion to the resin film.
- the in-line method of applying the adhesive layer forming coating during the resin film manufacturing process not only simplifies the manufacturing process compared to off-line coating, but also reduces the cost of the adhesive layer. This is also advantageous.
- a temperature higher by 50 ° C. than Tg to Tg of the resin constituting the resin film after applying and drying the adhesive layer forming coating on the unstretched film In this range, biaxial stretching is performed so that the stretching ratio is about 2 to 4 times in the longitudinal and width directions. Prior to guiding to the simultaneous biaxial stretching machine, preliminary longitudinal stretching of about 1 to 1.2 times may be performed.
- the adhesive film forming coating agent is applied to the resin film stretched in the uniaxial direction, and then the resin film is further stretched in the direction perpendicular to the direction. However, it is preferable for reasons of simplicity and operation.
- a known method can be adopted. For example, gravure roll coating, reverse roll coating, wire bar coating, lip coating, air knife coating, curtain flow coating, spray coating, dip coating, brush coating, etc. can be employed. By these methods, it can apply
- the aqueous medium After applying the adhesive layer-forming coating agent to the resin film, the aqueous medium can be removed by drying and heat treatment to obtain a laminate in which the adhesive layer composed of a dense coating film is adhered to the resin film. it can.
- the laminate of the present invention is composed of an adhesive layer containing a dimer acid-based polyamide resin and a crosslinking agent, and a specific resin film, and thus has transparency and excellent adhesion between the resin film and the adhesive layer.
- the adhesive layer is excellent in adhesion to the adherend even in a short manufacturing process. Therefore, the laminate of the present invention can be used as a single-sided adhesive sheet for adhesion to an adherend or as a double-sided adhesive sheet for adhesion between adherends, and the laminate and the adherend are bonded. Articles can be manufactured.
- the method for adhering the laminate of the present invention and the adherend is not particularly limited, but specifically, a method of laminating by hot pressing, a method of laminating and extruding a resin on the laminate, and laminating Examples thereof include a method of coating on the body and a method of forming a film by vapor deposition.
- the adhesive layer in the present invention contains dimer acid polyamide resin, so that the thermal pressing conditions such as temperature, pressure, time, etc. are milder than those of the adhesive layer containing thermosetting resin. It can be.
- the hot press is preferably at or above the softening point of the resin, particularly preferably at 180 ° C. or more, and more preferably at 180 to 200 ° C.
- the hot pressing time is preferably about 1 to 120 minutes, more preferably 3 to 60 minutes, and further preferably 5 to 30 minutes.
- heat pressing condition is 180 ° C. for 15 minutes.
- the temperature can be lowered and shortened.
- the hot press conditions can be changed and selected in various ways depending on the characteristics required for the metal plate to be used, the type of adhesive layer, the type of resin layer, the type of hot press machine, the combination of capabilities, or the resulting laminate. This is not the case.
- the adherend used for bonding by hot pressing is not particularly limited, and examples thereof include metals, resins, and ceramics. Metals include copper, tin, aluminum, lead, brass, zinc, silver, chromium, titanium, platinum, gallium, indium, antimony, molybdenum, cobalt, palladium, tungsten, germanium, antimony, and mixtures, compounds, alloys, etc. Is mentioned.
- the thickness of the metal plate is not particularly limited.
- the shape of the metal is not particularly limited, and may be any shape such as a plate shape, a rod shape, a wire shape, a tube shape, a foil top, and a block shape.
- the metal forming method is not particularly limited, and can be formed by various methods such as casting, plastic working, sheet metal forming, cutting, cold forging, pressing, drawing, extrusion, and threading. is there.
- a surface having a mirror surface or a rough surface can be used by performing surface treatment such as machining, lathing, threading, grinding, and file processing. The surface may be subjected to treatments such as plating, thermal spraying, oxidation, rust prevention, quenching, painting, and coating.
- resins include polyethylene, polystyrene, polypropylene, polycarbonate, polyamide, polyurethane, polymethyl methacrylate, polyethylene terephthalate, polyacetal, polyvinyl chloride, polysulfone, polyethersulfone, polyphenylene sulfide, polyarylate, polyamideimide, polyetherimide, polyimide, Examples include polyether ether ketone, liquid crystal polymer, polytetrafluoroethylene, and polyvinylidene fluoride.
- the ceramic include alumina, aluminum nitride, silicon nitride, steatite, sialon, zirconia, silicon carbide, forsterite, and cordierite. The ceramic is not particularly limited.
- Examples of the adherend formed by coating or vapor deposition on the laminate using the adhesive layer of the present invention as a primer layer include a hard coat layer, a printing layer, an adhesive layer, a release layer, an antistatic layer,
- Examples of the functional layer include a conductive layer, a barrier layer, a hydrophilic layer, a water repellent layer, an oil repellent layer, an ultraviolet absorbing layer, an infrared absorbing layer, and an antireflection layer.
- any conventionally used hard coat layer can be laminated, and it is preferable to laminate a layer mainly composed of a curable resin having chemical resistance and / or scratch resistance.
- the curable resin include an ionizing radiation curable resin, a thermosetting resin, and a thermoplastic resin.
- the layer forming operation for the resin film provided with the adhesive layer is easy, and the pencil hardness is easily set to a desired value. Therefore, ionizing radiation curable resins are preferable.
- Specific examples of the curable resin used for forming the hard coat layer include, for example, acrylic resins, silicone resins, melamine resins, epoxy resins, urethane resins, and the like. From the viewpoint of further reduction of precipitated oligomers, further reduction of interference spots, and adhesion to the hard coat layer and the resin film, acrylic resins and silicone resins are preferable, and acrylic resins are more preferable.
- the acrylic resin preferably has an acrylate functional group such as an acryloyl group and a methacryloyl group, and particularly preferably a polyester acrylate or a urethane acrylate.
- the polyester acrylate may be a (poly) acrylate of a polyester polyol oligomer.
- the urethane acrylate may be a (meth) acrylate of a urethane oligomer composed of a polyol compound and a polyisocyanate compound.
- (meth) acrylate constituting polyester acrylate or urethane acrylate
- examples include ethyl (meth) acrylate, butoxyethyl (meth) acrylate, and phenyl (meth) acrylate.
- Examples of the oligomer of polyester polyol constituting the polyester acrylate include aliphatic dicarboxylic acid such as adipic acid and glycol (for example, ethylene glycol, polyethylene glycol, propylene glycol, polypropylene glycol, butylene glycol, polybutylene glycol, etc.) and / or triol.
- aliphatic dicarboxylic acid such as adipic acid and glycol
- products such as glycerin, trimethylolpropane and the like (eg, polyadipate triol), and aliphatic dicarboxylic acids such as sebacic acid and glycol (specific examples are the same as those described above) and / or triols (specific examples are Examples thereof include condensation products (for example, polysebacate polyol) and the like.
- the other organic acid isophthalic acid, terephthalic acid, phthalic anhydride, or the like is preferable because high hardness is expressed in the hard coat layer.
- the polyurethane oligomer constituting the urethane acrylate can be obtained from a condensation product of a polyisocyanate compound and a polyol compound.
- Specific polyisocyanate compounds include adducts of methylene bis (p-phenylene diisocyanate), hexamethylene diisocyanate / hexane triol, hexamethylene diisocyanate, tolylene diisocyanate, tolylene diisocyanate trimethylolpropane, 1,5 -Naphthylene diisocyanate, thiopropyl diisocyanate, ethylbenzene-2,4-diisocyanate, 2,4-tolylene diisocyanate dimer, hydrogenated xylylene diisocyanate, tris (4-phenylisocyanate) thiophosphate and the like.
- polyol compound examples include polyether polyols such as polyoxytetramethylene glycol, polyester polyols such as polyadipate polyol and polycarbonate polyol, and copolymers of acrylic acid esters and hydroxyethyl methacrylate.
- polyether polyols such as polyoxytetramethylene glycol
- polyester polyols such as polyadipate polyol and polycarbonate polyol
- copolymers of acrylic acid esters and hydroxyethyl methacrylate examples of acrylic acid esters and hydroxyethyl methacrylate.
- a polyfunctional monomer can be used in combination with polyester acrylate or urethane acrylate.
- Specific polyfunctional monomers include, for example, trimethylolpropane tri (meth) acrylate, hexanediol di (meth) acrylate, tripropylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, pentaerythritol tri (meth) Examples include acrylate, dipentaerythritol hexa (meth) acrylate, 1,6 hexanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, and the like.
- an acetophenone, benzophenone, mifilabenzoylbenzoate, ⁇ -amyloxime ester or thioxanthone is used as a photopolymerization initiator in these resins.
- n-butylamine, triethylamine, tri-n-butylphosphine and the like are preferably used as a photosensitizer.
- Urethane acrylate is preferable from the viewpoint that the hard coat layer is rich in elasticity and flexibility and excellent in workability (foldability).
- Polyester acrylate is preferable from the viewpoint that a hard coat layer with extremely high hardness can be formed by selecting the constituent components of the polyester. Therefore, since it is easy to achieve both high hardness and flexibility, when the total amount of acrylic resin is 100 parts by mass, an acrylic compound containing 60 to 90 parts by mass of urethane acrylate and 40 to 10 parts by mass of polyester acrylate is blended. A hard coat layer formed from a resin is preferred.
- Acrylic resins are available as commercial products. For example, Seika Beam series manufactured by Dainichi Seika Co., Ltd., Opstar series manufactured by JSR, UV curable hard coat agent purple light series manufactured by Nippon Synthetic Chemical Industry, UV manufactured by Yokohama Rubber Co., Ltd. Curing type hard coating agent HR320 series, HR330 series, HR350 series, HR360 series, UV curing type functional hard coating agent Lioduras / LCH series manufactured by Toyo Ink Co., Ltd. can be used. Acrylic resins may be used alone or in combination.
- the silicone-based resin may be one in which an acrylic group is covalently bonded to the silicone resin, or includes a condensate having a silanol group obtained by hydrolytic polycondensation of alkoxysilane. There may be. In particular, in the latter case, a silanol group is converted into a siloxane bond by heat curing after coating, and a hard coat layer is obtained as a cured film.
- Silicone resins are commercially available, for example, UV curable silicone hard coat agent X-12 series manufactured by Shin-Etsu Chemical Co., Ltd., UV curable silicone hard coat agent UVHC series manufactured by Momentive Performance Materials Japan
- a thermosetting silicone hard coat agent SHC series, a UV curable functional hard coat agent Lipdiras ⁇ S series manufactured by Toyo Ink, Inc. can be used. Silicone resins may be used alone or in combination.
- the pencil hardness of the hard coat layer may vary depending on the application, and is usually HB or higher, preferably H or higher, more preferably 2H or higher.
- the resin film has improved scratch resistance and can be used in various applications.
- the hardness can be controlled by selecting the thickness, material, curing conditions and the like of the hard coat layer.
- the thickness of the hard coat layer is not particularly limited, but is preferably adjusted within a range that does not impair optical characteristics, and is preferably within a range of 1 to 15 ⁇ m.
- Hard coat films are required to have excellent transparency in various applications such as large displays such as televisions and small displays such as mobile phones, personal computers and smartphones.
- the transparency of a film is represented by haze and total light transmittance.
- the hard coat film obtained by laminating the above hard coat layer on the laminate of the present invention preferably has a haze of 5.0% or less, more preferably 4.0% or less, and even more preferably 3.5%.
- the total light transmittance is preferably 80% or more, more preferably 85%, and still more preferably 90% or more.
- a method of forming the hard coat layer a method of applying a hard coat layer-forming coating solution on the adhesive layer laminated on the resin film and curing it may be mentioned.
- the coating liquid for forming a hard coat layer usually contains the above-mentioned curable resin, and may contain additives such as an ultraviolet absorber, a leveling agent, an antifoaming agent, and an antioxidant as desired.
- a monomer or oligomer for forming the curable resin described above dissolved in a solvent or a solution dispersed in water may be used, or a liquid monomer or oligomer may be used. May be used as they are.
- the solvent for dissolving the monomer or oligomer for forming the curable resin the organic solvent exemplified in the production of the easy-adhesion layer-forming coating material can be used.
- a known method can be employed. For example, gravure roll coating, reverse roll coating, wire bar coating, lip coating, air knife coating, curtain flow coating, spray coating, dip coating, brush coating, etc. can be employed. By these methods, it can apply
- the resin After applying the coating liquid for forming the hard coat layer to the adhesive layer, depending on the type of curable resin, the resin can be cured sufficiently by employing a method of irradiating ionizing radiation such as ultraviolet rays, a method of heating, etc.
- a hard coat layer can be formed on the easy adhesion layer laminated on the film.
- the printed layer is a layer having a colored pigment and / or dye and a binder (also referred to as a vehicle), and includes a stabilizer, a light stabilizer, a curing agent, a crosslinking agent, a plasticizer, an antioxidant, an ultraviolet absorber, a lubricant, Additives such as antistatic agents, fillers, etc. may be added as necessary.
- a binder also referred to as a vehicle
- Additives such as antistatic agents, fillers, etc. may be added as necessary.
- Binders include rosin, rosin ester, rosin modified resin, shellac, alkyd resin, phenolic resin, polyacetic acid resin, polystyrene resin, polyvinyl butyral resin, acrylic or methacrylic resin, polyamide resin, polyester resin, polyurethane Resin, epoxy resin, urea resin, melamine resin, aminoalkyd resin, nitrified cotton, nitrocellulose, ethyl cellulose, chlorinated rubber, cyclized rubber, linseed oil, cutting oil, soybean oil, hydrocarbon oil, etc. .
- the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer may be a pressure-sensitive adhesive usually used for pressure-sensitive adhesive tapes, and examples thereof include a rubber-based pressure-sensitive adhesive, an acrylic pressure-sensitive adhesive, a silicone-based pressure-sensitive adhesive, and a urethane-based pressure-sensitive adhesive.
- an acrylic pressure-sensitive adhesive and a silicone pressure-sensitive adhesive excellent in adhesiveness and heat resistance are preferable. You may mix
- the release agent constituting the release layer may be any release agent that is usually used for release films, and examples thereof include silicone resins, fluororesins, long-chain alkyl polymers, waxes, and olefin resins.
- the release layer may contain an additive such as a peel strength adjusting agent or oil.
- the material constituting the antistatic layer and the conductive layer may be any material that is usually used as an antistatic film or a conductive film.
- a material that is usually used as an antistatic film or a conductive film For example, indium doped oxide, antimony doped tin oxide, tin oxide, indium oxide, zinc oxide And conductive metal oxides such as polyaniline, polypyrrole, polythiophene, conductive carbon such as carbon black and ketjen black, metals such as silver, copper, and aluminum, and surfactants.
- a resin component or the like may be included as a binder.
- the material constituting the barrier layer may be any material that is normally used as a barrier film, such as a soft metal foil such as aluminum foil, or a vapor deposition layer such as aluminum vapor deposition, silica vapor deposition, alumina vapor deposition, or silica alumina binary vapor deposition.
- a soft metal foil such as aluminum foil
- a vapor deposition layer such as aluminum vapor deposition, silica vapor deposition, alumina vapor deposition, or silica alumina binary vapor deposition.
- organic barrier layers made of vinylidene chloride resin, modified polyvinyl alcohol, ethylene vinyl alcohol copolymer, MXD nylon and the like.
- the material constituting the hydrophilic layer may be any material that is normally used as a hydrophilic film, such as those using a hydrophilic polymer such as a polymer in which a hydrophilic functional group is added to polyvinyl alcohol, polyethylene glycol, acrylic, or the like. , Surfactants, inorganic materials such as silica, and the like.
- the material constituting the water-repellent layer and the oil-repellent layer may be any material that is usually used as a water-repellent / oil-repellent film, and examples thereof include fluorine resins, waxes, and silicones.
- the material constituting the ultraviolet absorbing layer may be any material that is usually used as an ultraviolet absorber, and organic materials such as benzophenone, benzotriazole, triazine, cyanoacrylate, oxalinide, salicylate, formamidine, and the like. System ultraviolet absorbers and the like.
- an ultraviolet reflector such as titanium oxide or zinc oxide, a radical scavenger such as a hindered amine, or the like may be added.
- the material constituting the infrared absorbing layer may be any material that is normally used as an infrared absorbing agent, such as lanthanum hexaboride, cesium tungsten oxide, cyanine dye, phthalocyanine dye, naphthalocyanine compound, nickel dithiolene complex, squalium dye. Quinone compounds, diimmonium compounds, azo compounds and the like.
- the material constituting the antireflection layer may be any material that is usually used as an antireflection film, and examples thereof include inorganic particles such as silica and organic particles such as styrene and acrylic. In addition to these, components such as a binder may be included.
- the laminated body of this invention is excellent in adhesiveness with various to-be-adhered bodies, it can expand
- an article in which a metal is bonded to the laminate of the present invention can be applied to a flexible blind substrate, a sensor component, and the like.
- the article to which the hard coat layer is bonded has excellent adhesion between the resin film and the adhesive layer, and the adhesion between the adhesive layer and the hard coat layer is excellent even in a moist heat environment, and is transparent and flexible.
- it since it has a hard coat layer that prevents scratches, it can be used for flexible display applications using organic EL of next-generation display panels.
- pharmaceutical packaging materials such as retort foods, electronic component packaging materials for semiconductor packages, motors, transformers, cables Electrical insulation materials for capacitor materials, derivative materials for capacitor applications, cassette tapes, magnetic tapes for data storage for digital data storage, magnetic tape materials such as video tapes, solar cell substrates, liquid crystal plates, conductive films, organic LEDs Films mounted on sensors, protective plates for display devices, LED mounting substrates, flexible printed wiring boards, flexible flat cable and other electronic board materials, flexible printed wiring coverlay films, heat-resistant masking tapes, industrial tapes, etc.
- Aqueous dispersion [solid content concentration] An appropriate amount of the obtained aqueous dispersion was weighed and heated at 150 ° C. until the mass of the residue (solid content) reached a constant weight, and the solid content concentration was determined.
- the number average particle size of the resin in the aqueous dispersion was measured by a dynamic light scattering method using a Microtrac particle size distribution analyzer UPA150 (MODEL No. 9340) manufactured by Nikkiso Co., Ltd.
- Laminate [Adhesion] About the adhesive layer of the laminated body produced in the Example, according to the method of JISK5600, it evaluated by the residual rate after cellophane tape peeling by the crosscut method. When considering the practical performance, it can be said that each adhesion has no problem if the residual ratio is 80% or more.
- Total light transmittance and haze The laminates obtained in the examples were measured according to JIS K 7136 using a turbidimeter (manufactured by Nippon Denka Kogyo Co., Ltd., “NDH2000”).
- B The sample was not changed up to 5000 times, but by 10,000 times, any one of crease marks, cracks, whitening, peeling or floating of the hard coat layer occurred.
- C The sample did not change up to 1000 times, but by 5000 times, any one of crease marks, cracks, whitening, peeling off or floating of the hard coat layer occurred.
- D The sample was not changed up to 500 times, but by 1000 times, any of creases, cracks, whitening, peeling off or floating of the hard coat layer occurred.
- E There was no change in the sample at 250 times, but by 500 times, any one of crease marks, cracks, whitening, peeling of the hard coat layer and floating occurred.
- F The sample did not change after 100 times, but by 250 times, any of creases, cracks, whitening, peeling of the hard coat layer, and floating occurred.
- G Up to 100 times, fold marks, cracks, whitening, peeling or floating of the hard coat layer occurred.
- the following P-1 to P-5 were used as the dimer acid-based polyamide resin, and P-6 was used as the polyolefin resin to produce aqueous dispersions.
- the dicarboxylic acid component contains 100% by mole of dimer acid, and the diamine component contains 100% by mole of ethylenediamine.
- the acid value is 10.0 mgKOH / g, the amine value is 0.1 mgKOH / g, and the softening point is 158 ° C.
- Polyamide resin Polyamide resin.
- dimer acid is contained in 85 mol%
- azelaic acid is contained in 15 mol%
- piperazine is contained in 50 mol%
- ethylenediamine is contained in 50 mol%
- the acid value is 15.0 mgKOH / g and the amine value is Polyamide resin having 0.3 mg KOH / g and a softening point of 110 ° C.
- the dicarboxylic acid component contains 100% by mole of dimer acid, the diamine component contains 100% by mole of ethylenediamine, the acid value is 20.3 mgKOH / g, the amine value is 0.1 mgKOH / g, and the softening point is 129 ° C. Polyamide resin.
- the dicarboxylic acid component contains 60 mol% dimer acid, 40 mol% azelaic acid, the diamine component contains 50 mol% piperazine, 50 mol% ethylenediamine, the acid value is 10.5 mgKOH / g, and the amine value is Polyamide resin having 0.1 mg KOH / g and a softening point of 165 ° C.
- Polyolefin resin P-6 As the polyolefin resin, “Bondyne LX4110” manufactured by Sumitomo Chemical Co., Ltd. was used.
- the obtained aqueous dispersion was put into a 1 L eggplant flask and reduced in pressure using an evaporator while being put in a hot water bath heated to 80 ° C., and about 100 g of a mixed medium of IPA, THF, and water was distilled off to obtain a milky white uniform dimer acid.
- -Based polyamide resin aqueous dispersion E-1 was obtained.
- the solid content concentration of E-1 was 20% by mass, the number average particle size of the resin in the dispersion was 0.040 ⁇ m, the pH was 10.4, and the viscosity was 36 mPa ⁇ s.
- the obtained aqueous dispersion was put into a 1 L eggplant flask and reduced in pressure using an evaporator while being put in a hot water bath heated to 80 ° C., and about 130 g of a mixed medium of IPA and water was distilled off to obtain a milky white uniform dimer acid polyamide.
- An aqueous resin dispersion E-2 was obtained.
- the solid content concentration of E-2 was 20% by mass, the number average particle size of the resin in the dispersion was 0.052 ⁇ m, the pH was 10.6, and the viscosity was 30 mPa ⁇ s.
- a dimer acid-based polyamide resin aqueous dispersion E-3 was obtained by the same production method except that the resin P-1 was changed to the resin P-3 in the production of the dimer acid-based polyamide resin aqueous dispersion E-1.
- the solid content concentration of E-3 was 20% by mass, the number average particle size of the resin in the dispersion was 0.058 ⁇ m, the pH was 10.3, and the viscosity was 45 mPa ⁇ s.
- aqueous dispersion was put into a 1 L eggplant flask and reduced in pressure using an evaporator while being put in a hot water bath heated to 80 ° C., and about 330 g of a mixed medium of IPA, THF, toluene and water was distilled off to obtain a milky white uniform Dimer acid-based polyamide resin aqueous dispersion E-4 was obtained.
- the solid content concentration of E-4 was 20% by mass, the number average particle size of the resin in the dispersion was 0.065 ⁇ m, the pH was 10.3, and the viscosity was 8 mPa ⁇ s.
- aqueous dispersion was put into a 1 L eggplant flask, and reduced in pressure using an evaporator while being placed in a hot water bath heated to 80 ° C., and about 100 g of a mixed medium of IPA, THF, toluene, and water was distilled off to obtain a milky white uniform Dimer acid-based polyamide resin aqueous dispersion E-5 was obtained.
- the solid content concentration of E-5 was 20% by mass, the number average particle size of the resin in the dispersion was 0.045 ⁇ m, the pH was 10.6, and the viscosity was 5 mPa ⁇ s.
- Polyolefin resin aqueous dispersion N-1 Into a sealable pressure-resistant 1 liter glass container equipped with a stirrer and a heater, 60.0 g of polyolefin resin P-6, 28.0 g of IPA, 1.5 g of TEA and 210.5 g of distilled water were charged into a glass container. When the stirring blade was rotated at a rotational speed of 300 rpm, the resin bottoms were not observed at the bottom of the container, and it was confirmed that the container was in a floating state. Therefore, while maintaining this state, the heater was turned on and heated after 10 minutes. Then, the system temperature was kept at 140 ° C. and further stirred for 20 minutes.
- the temperature was raised to 230 ° C. Then, it heated at 230 degreeC for 3 hours. Thereafter, the mixture was cooled and the reaction product was taken out. After the reaction product was pulverized, it was heated in a dryer under a nitrogen stream at 220 ° C. for 5 hours and subjected to solid phase polymerization to obtain a polymer. And it melt-kneaded on the conditions of cylinder temperature 320 degreeC, and extruded in the shape of a strand. Thereafter, the mixture was cooled and cut to prepare a semi-aromatic polyamide resin T-1 in the form of pellets.
- the molten polymer was filtered using a metal fiber sintered filter (“NF-10” manufactured by Nippon Seisen Co., Ltd., absolute particle size: 30 ⁇ m). Then, it was extruded into a film form from a T die set at 320 ° C. to obtain a film-like melt. On the cooling roll set to 50 degreeC, this melt was closely_contact
- a tenter type simultaneous biaxial stretching machine inlet width: 193 mm, outlet width: 605 mm
- the stretching conditions are as follows: the temperature of the preheating part is 120 ° C., the temperature of the stretching part is 130 ° C., the MD stretching strain rate is 2400% / min, the TD stretching strain rate is 2760% / min, and the MD stretching ratio is 3.0.
- the draw ratio of TD was 3.3 times.
- heat setting was performed at 270 ° C. in the same tenter, 5% relaxation treatment was applied in the width direction of the film, and biaxial stretching with a thickness of 25 ⁇ m, a haze of 4.2%, and a total light transmittance of 88.0%.
- a film was obtained.
- the obtained biaxially stretched semi-aromatic polyamide resin film was used as the resin film F-1.
- Polyimide resin film F-3 As the resin film F-3, a polyimide film (Kapton 100H manufactured by Toray DuPont, thickness 25 ⁇ m) was used.
- Polyetherimide resin film F-4 As the resin film F-4, a polyetherimide film (Mitsubishi Resin Superior UT, thickness 25 ⁇ m) was used.
- the semi-aromatic polyamide resin T-1 was changed to an aromatic nylon resin (Zecot XN500 manufactured by Unitika), and a film was obtained by the same operation as the semi-aromatic polyamide resin film F-1.
- the obtained aromatic nylon film was used as resin film F-5.
- Transparent polyimide resin film F-6 A polyimide film (Neoprim L-3450 30 ⁇ m, haze 1.0%, total light transmittance 91.0%, manufactured by Mitsubishi Gas Co., Ltd.) was used as the resin film F-6.
- Polyethylene terephthalate resin film F-7 As the resin film F-7, a polyethylene terephthalate film (Embret S-25 manufactured by Unitika Ltd., thickness 25 ⁇ m, haze 4.5%, total light transmittance 88%) was used.
- nylon 6 resin film F-8 As the resin film F-8, nylon 6 film (Emblem ON-25 manufactured by Unitika Ltd., thickness 25 ⁇ m, haze 4.0%, total light transmittance 88%) was used.
- nylon 6,6 resin film F-9 The semi-aromatic polyamide resin T-1 was changed to nylon 6,6 resin (UBE nylon 66 manufactured by Ube Industries), and a film was obtained in the same manner as the semi-aromatic polyamide resin film F-1. The obtained nylon 6,6 film was used as the resin film F-9.
- Polyetheretherketone resin film F-10 As the resin film F-10, a polyether ether ketone film (EXPEEK manufactured by Kurabo Industries, thickness 25 ⁇ m) was used.
- Example 1 Dimer acid-based polyamide resin aqueous dispersion E-1 and an oxazoline group-containing polymer aqueous solution (Nippon Shokubai Co., Ltd., Epocros WS-700, solid content concentration 25% by mass), each having a solid content of 100 parts by mass / 10 It mix
- the obtained coating agent was dried and applied to a semi-aromatic polyamide resin film F-1 at a thickness of 3 ⁇ m, and dried at 150 ° C. for 30 seconds to obtain a laminate.
- Adhesion of polyimide film A polyimide film (Kapton 100H, Toray DuPont Kapton 100H, thickness 25 ⁇ m) as an adherend is superimposed on the surface of the adhesive layer of the obtained laminate, and a heat press (sealing pressure 0.2 MPa, 200 ° C., 10 minutes) is used. An article was obtained by pressing to adhere a polyimide film to the laminate.
- a coating liquid for forming a hard coat layer (acrylic hard coat resin (Seika Beam EXF01BPHC manufactured by Dainichi Seika Co., Ltd.)) is applied at a thickness of 3 ⁇ m after curing to the adhesive layer surface of the obtained laminate, and a low-pressure mercury lamp UV cure device ( Curing was performed with Toshiba Lighttech Co., Ltd. (40 mW / cm single lamp type) to obtain an article (hard coat film) in which a hard coat layer was laminated as an adherend on the laminate.
- acrylic hard coat resin Seika Beam EXF01BPHC manufactured by Dainichi Seika Co., Ltd.
- Example 1B an aluminum foil (Toyo Aluminum Co., A1N30, thickness 15 ⁇ m) was used as the metal plate.
- Example 1C a stainless steel foil (Nisshin Steel Co., Ltd., SUS-304-H-TA) was used. , Thickness 20 ⁇ m).
- Examples 2 to 15 and Comparative Examples 1 to 9 The same procedure as in Example 1 was conducted except that the type of aqueous dispersion, the type and amount of solid content of the crosslinking agent, and the type of resin film were those shown in Table 1, and a coating agent for forming an adhesive, A laminate and article were obtained.
- an epoxy group-containing polymer aqueous solution manufactured by ADEKA, Adeka Resin EM-051R, solid content concentration 49.8% by mass
- a carbodiimide group-containing polymer dispersion manufactured by Nisshinbo Chemical Co., Ltd., Carbodilite series E-01, solid content concentration 40% by mass
- an epoxy resin is used instead of the aqueous dispersion. Specifically, 100 parts of an epoxy resin (jER1001 manufactured by Mitsubishi Chemical Corporation) and diaminodiphenyl sulfone (Tokyo Chemical Industry) as a curing agent are used. 20 parts of Kogyo Kogyo Co., Ltd.
- Example 9 a hot melt resin (STAYSTIK # 383 manufactured by Techno Alpha Co., Ltd.) was heated and then adjusted to a thickness of 15 ⁇ m, and a laminate was obtained in the same manner as in Example 1.
- Example 16 The semi-aromatic polyamide resin T-1 was charged in a 65 mm single screw extruder set at a cylinder temperature of 295 ° C. (front stage), 320 ° C. (middle stage) and 320 ° C. (second stage), and melted to set to 320 ° C. Extruded into a film form from a T-die and cooled by pressing and adhering to a cooling roll with a circulating oil temperature set to 50 ° C. by an electrostatic application method to form a substantially non-oriented unstretched film A having a thickness of 240 ⁇ m Obtained. The cooling roll used was coated with ceramic (Al 2 O 3) to 0.15mm thickness on the surface.
- two carbon brushes were arranged on the upstream side of the point where the roll surface and the film were in contact with each other and brought into contact with the cooling roll, and the surface of the ceramic coating layer was discharged by grounding the carbon brush holder.
- a tungsten wire having a diameter of 0.2 mm was used as an electrode, and a voltage of 6.5 kV was applied with a 300 W (15 kV ⁇ 20 mA) DC high voltage generator.
- a laminate having an adhesive layer having a thickness of 150 nm was obtained on a biaxially stretched semi-aromatic polyamide film having a width of 0.5 m and a length of 500 m.
- Example 17 In the same manner as in Example 16, an unstretched film A was obtained. This unstretched film A was stretched 3.0 times with a roll-type longitudinal stretching machine at 105 ° C. to obtain a longitudinally stretched film B. Next, the adhesive layer-forming coating agent prepared by the method described in Example 1 was applied to the surface of the longitudinally stretched film B so as to have a gravure roll of 6.0 g / m 2, and then continuously the end of the film. The part is gripped by a clip of a flat type stretching machine, stretched 3.3 times in the transverse direction at 140 ° C, and then heat-fixed at 285 ° C with a lateral relaxation rate of 5%. A laminate having a thickness of 25 ⁇ m was obtained.
- composition of the adhesive layer in the laminates of Examples and Comparative Examples, the types of resin films are shown in Table 1, the adhesion of the resulting laminates, the total light transmittance, the evaluation results of haze, and the adhesion to the laminates Table 2 shows the characteristics of an article to which a polyimide film is bonded as a body.
- the laminates obtained in the examples were bonded to at least one surface of a film made of a semi-aromatic polyamide or a polyimide resin and composed of a dimer acid polyamide resin defined in the present invention and a crosslinking agent.
- the resin film and the adhesive layer show good adhesion, and the article obtained by adhering the polyimide film to the adhesive layer of the laminate in a short thermocompression step is Good adhesion was exhibited at room temperature and at high temperatures.
- the oxazoline compound was used as a crosslinking agent, the adhesiveness was the best.
- the laminate (Comparative Example 1) containing no cross-linking agent in the adhesive layer has good adhesion between the adhesive layer and the resin film, but the polyimide film-adhered article has poor adhesion and heat resistance.
- the laminate (Comparative Example 2) in which the amine value of the dimer acid-based polyamide resin in the adhesive layer exceeded the range defined in the present invention was poor in adhesiveness in the polyimide film adhesive article.
- polyethylene terephthalate was used for resin which comprises a resin film (comparative example 3), it was inferior to heat resistance.
- a laminate (Comparative Example 7) provided with an adhesive layer using an aqueous dispersion of a polyolefin resin instead of a dimer acid-based polyamide resin was inferior in adhesiveness and heat resistance in a polyimide film adhesive article.
- the laminate (Comparative Example 8) provided with an adhesive layer using an epoxy resin adhesive instead of the dimer acid polyamide resin was inferior in adhesion and adhesiveness.
- Table 3 shows the characteristics of articles in which a hard coat layer was adhered as an adherend to the laminates in Examples and Comparative Examples.
- Table 4 shows the characteristics of the articles obtained by bonding the metal plates as adherends to the laminates in the examples and comparative examples.
- the article A in which the metal plate was adhered to the adhesive layers of the laminates of Examples 1, 5, and 7 was the article B obtained by the thermocompression bonding process at a high temperature of 200 ° C. and 120 minutes for a long time.
- excellent adhesiveness was exhibited even in a heat-pressing process at 180 ° C. for 15 minutes, and the adhesiveness was maintained even after the heat cycle test, and no blistering or peeling occurred.
- the resin constituting the adhesive layer was a polyolefin resin (Comparative Example 7)
- the adhesiveness was inferior, and both blistering and peeling were observed in the article after the heat cycle test.
- the resin constituting the adhesive layer is an epoxy resin (Comparative Example 8)
- the article A having a low pressing temperature and a short pressing time when the metal plates are laminated has low adhesiveness, and blistering or peeling occurs after the heat cycle test.
- the article B having a higher pressing temperature and longer pressing time at the time of laminating metal plates did not cause swelling or peeling after the heat cycle test, but had low adhesion.
- the adhesive layer is a hot melt resin (Comparative Example 9)
- the peel strength cannot be measured because the adhesive layer has melted out of the laminate after the heat cycle test of the article A because the adhesive layer has low heat resistance. In the article after the heat cycle test, both blistering and peeling were observed.
- the adhesive layer was melted from the laminate during the production of the article B with the press temperature increased and the press time increased, the peel strength could not be measured and the heat cycle test could be performed. There wasn't.
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Abstract
Description
すなわち、本発明の要旨は下記の通りである。
(1)樹脂フィルムの少なくとも片面に接着層が設けられた積層体であり、
樹脂フィルムを構成する樹脂が、半芳香族ポリアミドおよび/またはポリイミド系樹脂であって、
接着層が、アミン価が1.0mgKOH/g未満であるダイマー酸系ポリアミド樹脂と、架橋剤とを含有することを特徴とする積層体。
(2)ダイマー酸系ポリアミド樹脂100質量部に対し、架橋剤を0.5~50質量部含有することを特徴とする(1)記載の積層体。
(3)架橋剤が、オキサゾリン化合物であることを特徴とする(1)または(2)記載の積層体。
(4)ダイマー酸系ポリアミド樹脂は、酸価が1~20mgKOH/gであることを特徴とする(1)~(3)のいずれかに記載の積層体。
(5)上記(1)~(4)のいずれかに記載の積層体と被着体とが接着されてなる物品。
(6)被着体がハードコート層である(5)記載の物品。
(7)ヘイズが5.0%以下であることを特徴とする(5)または(6)記載の物品。
(8)前記物品がフレキシブルディスプレイ用物品であることを特徴とする(5)~(7)のいずれかに記載の物品。
(9)被着体が金属である(5)記載の物品。
(10)前記物品がフレキシブルプリント基板またはセンサー部品であることを特徴とする(5)または(9)記載の物品。
また、本発明の積層体の接着層は、短時間の熱圧着で被着体と接着することができ、常温時および高温時のいずれにおいても、被着体との接着性に優れている。具体的な被着体としては、ポリイミド等の樹脂フィルム、金属板、接着層表面に塗液を塗布して形成されたハードコート層などが挙げられる。
本発明の積層体は、樹脂フィルムの片面に接着層を設けた片面接着シート、または、樹脂フィルムの両面に接着層を設けた両面接着シートのいずれの態様でも使用することができる。
本発明の積層体は、樹脂フィルムの少なくとも片面に接着層が設けられたものであり、接着層は、ダイマー酸系ポリアミド樹脂と架橋剤とを含有する。
接着層を構成するダイマー酸系ポリアミド樹脂は、大きな炭化水素グループを有するため、ポリアミド樹脂として広く使用されているナイロン6、ナイロン66、ナイロン12などの樹脂に比べて、柔軟性に優れている。
本発明において、ダイマー酸系ポリアミド樹脂は、ジカルボン酸成分としてダイマー酸を含有するものであり、ダイマー酸がジカルボン酸成分全体の50モル%以上含有することが好ましく、60モル%以上含有することがより好ましく、70モル%以上含有することがさらに好ましい。ダイマー酸の割合が50モル%未満であると、ダイマー酸系ポリアミド樹脂の特性や効果を奏することが困難となり、その結果、基材である樹脂フィルムとの十分な密着性や被着体との十分な接着性が得られない場合がある。
また、ダイマー酸系ポリアミド樹脂のジアミン成分としては、エチレンジアミン、ヘキサメチレンジアミン、テトラメチレンジアミン、ペンタメチレンジアミン、m-キシレンジアミン、フェニレンジアミン、ジエチレントリアミン、ピペラジンなどを用いることができ、中でもエチレンジアミン、ヘキサメチレンジアミン、ジエチレントリアミン、m-キシレンジアミン、ピペラジンが好ましい。
ダイマー酸系ポリアミド樹脂を重合する際に、上記ジカルボン酸成分とジアミン成分の仕込み比を変更することによって、樹脂の重合度または酸価もしくはアミン価を制御することが可能となる。
また、ダイマー酸系ポリアミド樹脂の酸価は、プライマーとして使用した場合に被着体との接着性の観点で、1~20mgKOH/gであることが好ましく、1~15mgKOH/gであることがより好ましく、3~12mgKOH/gであることがさらに好ましく、5~12mgKOH/gであることが最も好ましい。また、金属板などの被着体との接着性の観点で、1~20mgKOH/gであることが好ましく、1~15mgKOH/gであることがより好ましく、5~12mgKOH/gであることが最も好ましい。ダイマー酸系ポリアミド樹脂の酸価が1mgKOH/g未満の場合、基材である樹脂フィルムとの密着性や、被着体である樹脂フィルムや金属との接着性が不十分になることがあり、20mgKOH/gを超えると、基材である樹脂フィルムとの密着性が不十分になることがある。
なお、酸価とは、樹脂1g中に含まれる酸性成分を中和するのに要する水酸化カリウムのミリグラム数で定義されるものである。一方、アミン価とは、樹脂1g中の塩基成分とモル当量となる水酸化カリウムのミリグラム数で表されるものである。いずれも、JIS K2501に記載の方法で測定される。
本発明における接着層は、ダイマー酸系ポリアミド樹脂と架橋剤とを含有する。ダイマー酸系ポリアミド樹脂を架橋することにより、樹脂の軟化点以上に加熱しても耐熱性を示す接着層を得ることができ、熱間接着性に優れた積層体を得ることが可能となる。
本発明における接着層は、ダイマー酸系ポリアミド樹脂および架橋剤を含有するものであり、ダイマー酸系ポリアミド樹脂100質量部に対し、架橋剤を0.5~50質量部含有することが好ましい。架橋剤の含有量が0.5質量部未満になると、接着層において十分な耐熱性が得難くなり、一方、50質量部を超えると、後述する接着層形成用塗剤の液安定性や加工性などが低下したり、基材である樹脂フィルムとの密着性や、被着体である樹脂フィルムや金属との接着性、接着層としての基本性能が得難くなることがある。
本発明の積層体は、ダイマー酸系ポリアミド樹脂と架橋剤とを含有する接着層が樹脂フィルムの少なくとも片面に設けられたものであり、接着層との優れた密着性を有し、高温環境下においても耐熱接着シートとして用いるために、樹脂フィルムを構成する樹脂は、半芳香族ポリアミドおよび/またはポリイミド系樹脂であることが必要である。
半芳香族ポリアミドを構成するジカルボン酸成分は、テレフタル酸を主成分とすることが好ましく、テレフタル酸以外のジカルボン酸成分としては、シュウ酸、マロン酸、コハク酸、グルタル酸、アジピン酸、セバシン酸、ドデカン二酸、テトラデカン二酸、オクタデカン二酸等の脂肪族ジカルボン酸や、1,4-ナフタレンジカルボン酸、1,3-ナフタレンジカルボン酸、1,2-ナフタレンジカルボン酸、イソフタル酸等の芳香族ジカルボン酸が挙げられる。ジカルボン酸成分中のテレフタル酸の割合は、60~100モル%であることが好ましい。
ジアミン化合物としては、例えば、m-フェニレンジアミン、p-フェニレンジアミン、3,4′-ジアミノジフェニルエーテル、4,4′-ジアミノジフェニルエーテル、4,4′-ジアミノジフェニルスルホン、3,3′-ジアミノジフェニルスルホン、2,2-ビス(4-アミノフェノキシフェニル)プロパン、2,2-ビス(4-アミノフェノキシフェニル)ヘキサフルオロプロパン、1,3-ビス(4-アミノフェノキシ)ベンゼン、1,4-ビス(4-アミノフェノキシ)ベンゼン、2,4-ジアミノトルエン、2,6-ジアミノトルエン、3,3′-ジアミノジフェニルメタン、4,4′-ジアミノジフェニルメタン、4,4′-ジアミノ-2,2-ジメチルビフェニル、2,2-ビス(トリフルオロメチル)-4,4′-ジアミノビフェニルが挙げられる。これらジアミン化合物は、単独で用いられてもよく、また2種以上が併用されてもよい。
耐熱性や機械的強度、電気特性、耐薬品性に優れることから、ポリイミド系樹脂は、テトラカルボン酸二無水物がピロメリット酸二無水物であり、ジアミン化合物が4,4′-ジアミノジフェニルエーテルである構成や、テトラカルボン酸二無水物が3,3′,4,4′-ビフェニルテトラカルボン酸二無水物であり、ジアミン化合物がp-フェニレンジアミンである構成が好ましい。
トリカルボン酸成分としては、トリメリット酸、ジフェニルエーテル-3,3′,4′-トリカルボン酸、ジフェニルスルホン-3,3′,4′-トリカルボン酸、ベンゾフェノン-3,3′,4′-トリカルボン酸などが挙げられ、ジアミン成分としては、前記ポリイミド系樹脂を構成するジアミン化合物として例示したものが挙げられる。
ポリアミドイミドは、通常、無水トリメリット酸とジイソシアネートとの反応、または無水トリメリット酸クロライドとジアミンとの反応により重合した後、イミド化することにより製造することができる。
また、樹脂フィルムには、接着層と積層する場合の密着性などを考慮して、表面に前処理としてコロナ処理、プラズマ処理、オゾン処理、薬品処理、溶剤処理などが施されていてもよい。
樹脂フィルムの厚みは、0.5μm~1.5mmであることが好ましく、15~200μmであることがより好ましく、25~100μmであることがさらに好ましい。樹脂フィルムの厚みが、0.5μm未満であると、製造が困難であり、1.5mmを超えると、取扱い上困難であるため好ましくない。樹脂フィルムは未延伸フィルムでも延伸フィルムでもよい。
本発明の積層体は、樹脂フィルムの少なくとも片面に接着層が設けられたものであり、例えば、ダイマー酸系ポリアミド樹脂と架橋剤とを含有する接着層形成用塗剤を、樹脂フィルムに塗布、乾燥することにより製造することができる。
接着層形成用塗剤は、ダイマー酸系ポリアミド樹脂と架橋剤とを、水性媒体または溶剤に分散または溶解したものであり、作業環境面を考慮して、水性媒体に分散させた水性分散体であることが好ましい。水性媒体は、水を主成分とする液体であり、後述する塩基性化合物や親水性有機溶剤を含有してもよい。
本発明における水性分散体は、ダイマー酸系ポリアミド樹脂中のカルボキシル基が塩基性化合物で中和されており、アルカリ性域で安定した形態を保つことができる。水性分散体のpHとしては、7~13の範囲が好ましい。塩基性化合物としては、常圧時の沸点が185℃未満の塩基性化合物が好ましい。
塩基性化合物の常圧時の沸点が185℃を超えると、水性塗剤を塗布して塗膜を形成する際に、乾燥によって塩基性化合物、特に有機アミン化合物を揮発させることが困難になり、衛生面や塗膜特性に悪影響を及ぼす場合がある。
保護コロイド作用を有する化合物としては、ポリビニルアルコール、カルボキシル基変性ポリビニルアルコール、カルボキシメチルセルロース、ヒドロキシエチルセルロース、ヒドロキシプロピルセルロース、変性デンプン、ポリビニルピロリドン、ポリアクリル酸およびその塩、カルボキシル基含有ポリエチレンワックス、カルボキシル基含有ポリプロピレンワックス、カルボキシル基含有ポリエチレン-プロピレンワックスなどの数平均分子量が通常は5000以下の酸変性ポリオレフィンワックス類およびその塩、アクリル酸-無水マレイン酸共重合体およびその塩、スチレン-(メタ)アクリル酸共重合体、エチレン-(メタ)アクリル酸共重合体、イソブチレン-無水マレイン酸交互共重合体、(メタ)アクリル酸-(メタ)アクリル酸エステル共重合体などの不飽和カルボン酸含有量が10質量%以上のカルボキシル基含有ポリマーおよびその塩、ポリイタコン酸およびその塩、アミノ基を有する水溶性アクリル系共重合体、ゼラチン、アラビアゴム、カゼインなど、一般に微粒子の分散安定剤として用いられている化合物などが挙げられる。
ダイマー酸系ポリアミド樹脂の水性分散体を得るにあたっては、密閉可能な容器を用いることが好ましい。つまり、密閉可能な容器に各成分を仕込み、加熱、攪拌する手段が好ましく採用される。
具体的に、まず、所定量のダイマー酸系ポリアミド樹脂と、塩基性化合物と、水性媒体とを容器に投入する。なお、前述したように、水性媒体中に塩基性化合物や後述する親水性有機溶剤を含有させてもよいので、例えば、塩基性化合物を含有する水性媒体を用いるのであれば、別途、塩基性化合物を投入せずとも、結果的に容器中に塩基性化合物が仕込まれることになる。
次に、容器を密閉し、好ましくは70~280℃、より好ましくは100~250℃の温度で、加熱撹拌する。加熱攪拌時の温度が70℃未満になると、ダイマー酸系ポリアミド樹脂の分散が進み難く、樹脂の数平均粒子径を0.5μm以下とすることが難しくなる傾向にあり、一方、280℃を超えると、ダイマー酸系ポリアミド樹脂の分子量が低下する恐れがあり、また、系の内圧が無視できない程度まで上がることがあり、いずれも好ましくない。
加熱撹拌する際は、樹脂が水性媒体中に均一に分散されるまで毎分10~1000回転で加熱撹拌することが好ましい。
前述の塩基性化合物のときと同様、水性媒体中に親水性有機溶剤を含有させてもよいので、親水性有機溶剤を含有する水性媒体を用いるのであれば、別途、親水性有機溶剤を追加投入せずとも、結果的に容器中に親水性有機溶剤が仕込まれることになる。
そして、水性分散体を冷却した後は、直ちにこれを払い出し、次なる工程に供しても基本的に何ら問題ない。しかしながら、容器内には異物や少量の未分散樹脂が稀に残っていることがあるため、水性分散体を払い出す前に、一旦濾過工程を設けることが好ましい。濾過工程としては、特に限定されないが、例えば、300メッシュのステンレス製フィルター(線径0.035mm、平織)で加圧濾過(例えば空気圧0.5MPa)する手段が採用できる。
ダイマー酸系ポリアミド樹脂の水性分散体を得た後は、この水性分散体と、架橋剤を含む分散体または溶液とを適量混合することで、接着層形成用水性塗剤を得ることができる。
有機溶剤としては、メタノール、エタノール、n-プロパノール、イソプロパノール、n-ブタノール、イソブタノール、sec-ブタノール、tert-ブタノール、n-アミルアルコール、イソアミルアルコール、sec-アミルアルコール、tert-アミルアルコール、1-エチル-1-プロパノール、2-メチル-1-ブタノール、n-ヘキサノール、シクロヘキサノールなどのアルコール類;メチルエチルケトン、メチルイソブチルケトン、エチルブチルケトン、シクロヘキサノン、イソホロンなどのケトン類;テトラヒドロフラン、ジオキサンなどのエーテル類;酢酸エチル、酢酸-n-プロピル、酢酸イソプロピル、酢酸-n-ブチル、酢酸イソブチル、酢酸-sec-ブチル、酢酸-3-メトキシブチル、プロピオン酸メチル、プロピオン酸エチル、炭酸ジエチル、炭酸ジメチルなどのエステル類;エチレングリコール、エチレングリコールモノメチルエーテル、エチレングリコールモノエチルエーテル、エチレングリコールモノプロピルエーテル、エチレングリコールモノブチルエーテル、エチレングリコールエチルエーテルアセテート、ジエチレングリコール、ジエチレングリコールモノメチルエーテル、ジエチレングリコールモノエチルエーテル、ジエチレングリコールモノブチルエーテル、ジエチレングリコールエチルエーテルアセテート、プロピレングリコール、プロピレングリコールモノメチルエーテル、プロピレングリコールモノブチルエーテル、プロピレングリコールメチルエーテルアセテートなどのグリコール誘導体;さらには、3-メトキシ-3-メチルブタノール、3-メトキシブタノール、アセトニトリル、ジメチルホルムアミド、ジメチルアセトアミド、ジアセトンアルコール、アセト酢酸エチル、トルエン、キシレン、シクロヘキサンが挙げられ、必要に応じて、これらの有機溶剤を混合して用いてもよい。
前述の樹脂フィルムに接着層を設ける方法として、二軸延伸された樹脂フィルムに対し、上記接着層形成用塗剤を塗布する方法(オフライン法)、二軸延伸前の樹脂フィルムに対し、接着層形成用塗剤を塗布した後、延伸および熱処理する方法(インライン法)が挙げられ、いずれの方法も採用できる。また、被着体となる基材に接着層を設けたものを樹脂フィルムと貼り合せることにより接着層を設ける方法や、離型フィルムなどの基材フィルムの上に接着層を形成したものを樹脂フィルムと貼り合せたのち離型フィルムを剥離することで接着層を転写させるなどの方法を採用することもできる。
さらに、樹脂フィルムの製造工程中に接着層形成用塗剤を塗布するインライン法は、オフラインでの塗布に比べると、製造工程を簡略化することができるばかりか、接着層の薄膜化により、コスト面でも有利である。
また、逐次二軸延伸法を採用する場合には、一軸方向に延伸された樹脂フィルムに、接着層形成用塗剤を塗布し、その後、樹脂フィルムを前記方向と直交する方向にさらに延伸することが、簡便さや操業上の理由から好ましい。
本発明の積層体は、ダイマー酸系ポリアミド樹脂と架橋剤を含有する接着層と、特定の樹脂フィルムとから構成されるため、透明性を有し、樹脂フィルムと接着層との密着性に優れ、また短時間の製造工程においても接着層は被着体との接着性に優れる。したがって、本発明の積層体は、片面接着シートとして被着体との接着や、両面接着シートとして被着体どうしの接着に使用することができ、積層体と被着体とが接着されてなる物品を製造することができる。
本発明の積層体と被着体とを接着する方法としては、特に限定されないが、具体的には、熱プレスによって貼り合わる方法、積層体の上に樹脂を溶融押出して貼り合わせる方法、積層体の上にコーティングする方法、蒸着により膜を形成する方法などが挙げられる。
熱プレスによる貼り合わせに使用する被着体は、特に限定されないが、例えば、金属、樹脂、またはセラミックなどが挙げられる。
金属としては、銅、スズ、アルミニウム、鉛、真鍮、亜鉛、銀、クロム、チタン、白金、ガリウム、インジウム、アンチモン、モリブデン、コバルト、パラジウム、タングステン、ゲルマニウム、アンチモン及びこれらの混合物、化合物、合金などが挙げられる。
金属板の厚みは、特に限定されない。
金属の形状は特に限定されず、板状、棒状、ワイヤ状、チューブ状、フォイル上、ブロック状など、いずれの形状でもよい。
金属の成形加工の方法は特に限定されず、鋳造、塑性加工、板金成形、切削加工、冷間圧造、プレス加工、絞り加工、押出成形、ねじ切り加工など様々な方法で成形したものが使用可能である。また、機械加工、施盤加工、ねじ切り加工、研削加工、ヤスリがけ加工などの表面処理が施されることにより、表面が、鏡面、粗面になっているものを使用できる。また、表面に、メッキ、溶射、酸化、防錆、焼入れ、塗装、コーティングなどの処理が施されていてもよい。
樹脂としてはポリエチレン、ポリスチレン、ポリプロピレン、ポリカーボネート、ポリアミド、ポリウレタン、ポリメチルメタクリレート、ポリエチレンテレフタレート、ポリアセタール、ポリ塩化ビニル、ポリスルホン、ポリエーテルスルホン、ポリフェニレンスルファイド、ポリアリレート、ポリアミドイミド、ポリエーテルイミド、ポリイミド、ポリエーテルエーテルケトン、液晶ポリマー、ポリテトラフロロエチレン、ポリフッ化ビニリデンなど挙げられる。
セラミックとしては、アルミナ、チッ化アルミ、チッ化ケイ素、ステアタイト、サイアロン、ジルコニア、炭化ケイ素、フォルステライト、コージライトなどが挙げられる。セラミックとしては、特に限定されないが、具体的には、チタン酸バリウム、窒化ホウ素、チタン酸ジルコン酸鉛、フェライト、アルミナ、フォルステライト、ジルコン、ムライト、ステアタイト、コーディエライト、炭化ケイ素、窒化ケイ素、窒化アルミニウム、ステアタイト、酸化亜鉛、ジルコニア、サイアロン、炭化ケイ素、フォルステライト、コージライト、イットリウム系超伝導体、ビスマス系超伝導体などが挙げられる。
硬化性樹脂としては、電離放射線硬化型樹脂、熱硬化型樹脂、熱可塑性樹脂などが挙げられ、接着層を設けた樹脂フィルムに対する層形成作業が容易であり、かつ鉛筆硬度を所望の値に容易に高めやすいことから、電離放射線硬化型樹脂が好ましい。
ハードコート層の形成に用いられる硬化性樹脂の具体例として、例えば、アクリル系樹脂、シリコーン系樹脂、メラミン系樹脂、エポキシ系樹脂、ウレタン系樹脂等が挙げられる。析出オリゴマーのさらなる低減、干渉斑のさらなる低減、およびハードコート層と樹脂フィルムに対する接着性の観点から、アクリル系樹脂およびシリコーン系樹脂が好ましく、アクリル系樹脂がより好ましい。
なお、ポリエステルアクリレートまたはウレタンアクリレートを構成する(メタ)アクリレート化のための単量体としては、メチル(メタ)アクリレート、エチル(メタ)アクリレート、ブチル(メタ)アクリレート、2エチルヘキシル(メタ)アクリレート、メトキシエチル(メタ)アクリレート、ブトキシエチル(メタ)アクリレート、フェニル(メタ)アクリレートなどがある。
具体的なポリイソシアネート化合物としては、メチレン・ビス(p-フェニレンジイソシアネート)、ヘキサメチレンジイソシアネート・ヘキサントリオールの付加体、ヘキサメチレンジイソシアネート、トリレンジイソシアネート、トリレンジイソシアネートトリメチロールプロパンのアダクト体、1,5-ナフチレンジイソシアネート、チオプロピルジイソシアネート、エチルベンゼン-2,4-ジイソシアネート、2,4-トリレンジイソシアネート二量体、水添キシエイレンジイソシアネート、トリス(4-フェニルイソシアネート)チオフォスフェートなどが例示できる。
具体的なポリオール化合物としては、ポリオキシテトラメチレングリコールなどのポリエーテル系ポリオール、ポリアジペートポリオール、ポリカーボネートポリオールなどのポリエステル系ポリオール、アクリル酸エステル類とヒドロキシエチルメタアクリレートとのコポリマーなどが例示できる。
ポリエステルアクリレートは、ポリエステルの構成成分の選択により、極めて高い硬度のハードコート層を形成することができる観点から好ましい。
そこで、高硬度と可撓性とを両立しやすいことから、アクリル系樹脂の合計量を100質量部としたとき、ウレタンアクリレート60~90質量部およびポリエステルアクリレート40~10質量部を配合させたアクリル系樹脂から形成されたハードコート層が好ましい。
例えば、本発明の積層体に金属が接着された物品は、フレキシブルブリント基板、センサー部品などに適用可能である。また、ハードコート層が接着された物品は、樹脂フィルムと接着層との密着性に優れるともに、接着層とハードコート層との密着性は、湿熱環境下においても優れ、透明性、耐屈曲性に優れ、また、傷つきを防止するハードコート層を有しているため、次世代ディスプレイパネルの有機ELを使用したフレキシブルディスプレイ用途などに使用することができる。
その他にも、本発明の積層体に各種被着体や機能層を接着することで、医薬品包装材料、レトルト食品などの食品包装材料、半導体パッケージ用などの電子部品包装材料、モーター、トランス、ケーブルなどのための電気絶縁材料、コンデンサ用途などの誘導体材料、カセットテープ、デジタルデータストレージ向けデータ保存用磁気テープ、ビデオテープなどの磁気テープ用材料、太陽電池基板、液晶板、導電性フィルム、有機LED、センサーに実装するフィルム、表示機器などの保護板、LED実装基板、フレキシブルプリント配線板、フレキシブルフラットケーブルなどの電子基板材料、フレキシブルプリント配線用カバーレイフィルム、耐熱マスキング用テープ、工業用テープなどの耐熱粘着テープ、耐熱バーコードラベル、耐熱リフレクター、各種離型フィルム、耐熱粘着ベースフィルム、写真フィルム、成形用材料、農業用材料、医療用材料、土木、建築用材料、ろ過膜など、家庭用、産業資材用のフィルムなどとして好適に使用することが可能である。
(1)ダイマー酸系ポリアミド樹脂
〔酸価、アミン価〕
JIS K 2501に記載の方法により測定した。
樹脂10mgをサンプルとし、顕微鏡用加熱(冷却)装置ヒートステージ(リンカム社製、Heating-Freezing ATAGE TH-600型)を備えた顕微鏡を用いて、昇温速度20℃/分の条件で測定を行い、樹脂が溶融した温度を軟化点とした。
テトラクロロエタン(d2)中、120℃にて1H-NMR分析(バリアン社製、300MHz)を行い、求めた。
〔固形分濃度〕
得られた水性分散体を適量秤量し、これを150℃で残存物(固形分)の質量が恒量に達するまで加熱し、固形分濃度を求めた。
pHメータ(堀場製作所社製、F-52)を用い、pHを測定した。
B型粘度計(トキメック社製、DVL-BII型デジタル粘度計)を用い、温度25℃における回転粘度(mPa・s)を測定した。
水性分散体中の樹脂の数平均粒子径は、日機装社製、マイクロトラック粒度分布計UPA150(MODEL No.9340)を用いて動的光散乱法によって測定した。
〔密着性〕
実施例で作製した積層体の接着層について、JIS K 5600に記載の方法に従い、クロスカット法によって、セロハンテープ剥離後の残存率にて評価した。各密着性は、実用上の性能を考えた場合、残存率が80%以上であれば問題ないと言える。
実施例で得られた積層体を、濁度計(日本電飾工業社製、「NDH2000」)を用い、JIS K 7136に従って測定した。
(4.1)接着性
実施例で作製した、積層体にポリイミドフィルムを接着した物品から、幅25mm、長さ10cmの測定サンプルを切り出し、引張り試験機(インテスコ社製精密万能材料試験機2020型)を用い、室温下、引張り速度200mm/分の条件にてT型剥離試験を行うことにより剥離強度を測定し、その値の大きさで接着性を評価した。なお、測定はn=5で行い、その平均値を剥離強度とした。実用上の強度として、4N/25mm以上であることが好ましい。
実施例で作製した、積層体にポリイミドフィルムを接着した物品から、幅25mm、長さ10cmの測定サンプルを切り出し、引張り試験機(インテスコ社製精密万能材料試験機2020型)を用い、80℃、引張速度200mm/分の条件にてT型剥離試験を行うことにより剥離強度を測定し、その値の大きさで熱間接着性を評価した。なお、測定はn=3で行い、その平均値を剥離強度とした。実用上の性能を考えた場合、80℃下で測定した剥離強度は、(4.1)で測定した剥離強度の60%以上の維持率を有していることが好ましい。
実施例で作製した、積層体にポリイミドフィルムを接着した物品を、-20℃で30分、次いで2時間かけて150℃まで昇温後、150℃で30分保持した後、再び2時間かけて-20℃まで降温するサイクルを1サイクルとし、これを100サイクル繰り返した。
引張り試験機(インテスコ社製精密万能材料試験機2020型)を用い、室温下、引張り速度200mm/分の条件にてT型剥離試験を行うことにより剥離強度を測定し、その値の大きさで耐ヒートサイクル性を評価した。実用上の性能を考えた場合、ヒートサイクルを行った後の剥離強度は、(4.1)で測定した剥離強度の50%以上の維持率を有していることが好ましい。
(5.1)密着性
実施例で作製したハードコートフィルムの、樹脂フィルムと接着層との密着性、および接着層にハードコート層を積層後の積層体全体についての密着性については、JIS K 5600に記載の方法に従い、クロスカット法によって、セロハンテープ剥離後の残存率にて評価した。各密着性は、実用上の性能を考えた場合、残存率が85%以上であれば問題ないと言える。
ハードコートフィルムの、樹脂フィルムと接着層との耐湿熱性、および接着層とハードコート層との耐湿熱性については、積層体を恒温恒湿槽中で80℃、95%RHの環境下48時間放置後、室温常湿で12時間放置し、前記(5.1)と同様の方法で密着性を求めた。密着性は、実用上の性能を考えた場合、残存率が85%以上であれば問題ないと言える。
ハードコートフィルム(以下、ハードコート層を形成した側の面を表面とし、その反対側面を裏面とする)を、30mm×100mmの長方形にカットして作製したサンプルを、耐久試験機(DLDMLH-FU、ユアサシステム機器社製)に曲げ内径が5mmとなるようにして取り付け、サンプルの表面の全面を180度折り畳む試験(裏面が外側となるように折り畳む試験)を10000回行い、以下のように評価した。なお、実用的には評価A~Cが求められている。
A:10000回まで、サンプルに折れ痕、割れ、白化、ハードコート層の剥がれや浮きは生じなかった。
B:5000回までサンプルに変化はなかったが、10000回までに、折れ痕、割れ、白化、ハードコート層の剥がれや浮きのいずれかが生じた。
C:1000回までサンプルに変化はなかったが、5000回までに、折れ痕、割れ、白化、ハードコート層の剥がれや浮きのいずれかが生じた。
D:500回までサンプルに変化はなかったが、1000回までに、折れ痕、割れ、白化、ハードコート層の剥がれや浮きのいずれかが生じた。
E:250回ではサンプルに変化はなかったが、500回までに、折れ痕、割れ、白化、ハードコート層の剥がれや浮きのいずれかが生じた。
F:100回ではサンプルに変化はなかったが、250回までに、折れ痕、割れ、白化、ハードコート層の剥がれや浮きのいずれかが生じた。
G:100回までに、折れ痕、割れ、白化、ハードコート層の剥がれや浮きのいずれかが生じた。
ハードコートフィルムを、濁度計(日本電飾工業社製、「NDH2000」)を用い、JIS K 7136に従って測定した。
ハードコートフィルムを10cm×15cmの面積に切り出し、ハードコート層を形成した側の面とは反対の面に黒色光沢テープ(ヤマト製、ビニールテープNo.200-5黒)を貼り合わせ、ハードコート面を上面にして、3波長形昼白色蛍光灯(ナショナルパルック、F.L15EX-N15W)を光源として、30~60°の斜め上方より反射光を目視で観察した。
良:干渉縞が見られず、外観が良好。
可:干渉縞がわずかにみられるが、実用上問題のないレベルの外観。
不可:干渉縞が非常に目立ち、外観が不良。
ハードコートフィルムについて、鉛筆硬度をJIS K 5600-5-4(1999)に基づいて測定した(1kg荷重)。実用上の性能を考えた場合、鉛筆硬度はH以上であることが望ましい。
ハードコートフィルムを10cm×15cmの面積に切り出し、ハードコート層表面を、#0000番のスチールウール(商品名:BONSTAR、日本スチールウール社製)を用いて、1kg/cm2の荷重をかけながら、速度50mm/secで3500回往復摩擦し、その後のハードコート層表面についた傷の数を目視にて確認した。実用上の性能を考えた場合、傷は20本未満が好ましく、10本未満がより好ましい。
(6.1)剥離強力
(6.1.1)ヒートサイクル試験前の剥離強力
実施例、比較例で作製した金属板積層物品A、Bから、幅25mm、長さ10cmの測定用サンプルを切り出し、金属板の表面を両面テープでステンレス板に貼り合わせて固定し、樹脂フィルムを掴んで、引張試験機(インテスコ社製精密万能材料試験機2020型)を用い、室温下、引張速度200mm/分の条件にてT型剥離試験を行い、剥離強度を測定し、その値の大きさで接着性を評価した。なお、測定サンプルを5枚採取し、その平均値をヒートサイクル試験前の剥離強力とした。
また、金属板積層物品AとBを、-20℃で30分、次いで2時間かけて150℃まで昇温後、150℃で30分保持した後、再び2時間かけて-20℃まで降温するサイクルを1サイクルとし、これを100サイクル繰り返した。ヒートサイクル試験後の物品AとBについて、上記と同様の方法で、剥離強力を測定し、ヒートサイクル試験後の接着性の評価を行った。実用上、剥離強力は、ヒートサイクル試験前後共に4N/25mm以上であることが好ましい。
前記ヒートサイクル試験後の物品AとBについて、さらに260℃×15分間保持し、その後の外観を、下記判断基準で目視にて確認した。なお、この耐熱試験は、本発明の積層体が、実際に装置部品として用いられる状態、特にリフローはんだに供される状態を想定している。
最良:フクレ、剥がれが見られない。かつ積層体に外観異常が全く認められない。
良:フクレ、剥がれが見られない。ただし積層体にやや歪みが見られる。
可:フクレもしくは剥がれが見られる。
不可:フクレと剥がれ両方が見られる
〔ダイマー酸系ポリアミド樹脂P-1〕
ジカルボン酸成分として、ダイマー酸を100モル%含有し、ジアミン成分としてエチレンジアミンを100モル%含有し、酸価が10.0mgKOH/g、アミン価が0.1mgKOH/g、軟化点が158℃であるポリアミド樹脂。
ジカルボン酸成分として、ダイマー酸を85モル%、アゼライン酸を15モル%含有し、ジアミン成分としてピペラジンを50モル%、エチレンジアミンを50モル%含有し、酸価が15.0mgKOH/g、アミン価が0.3mgKOH/g、軟化点が110℃であるポリアミド樹脂。
ジカルボン酸成分として、ダイマー酸を100モル%含有し、ジアミン成分としてエチレンジアミンを100モル%含有し、酸価が20.3mgKOH/g、アミン価が0.1mgKOH/g、軟化点が129℃であるポリアミド樹脂。
ジカルボン酸成分として、ダイマー酸を60モル%、アゼライン酸を40モル%含有し、ジアミン成分としてピペラジンを50モル%、エチレンジアミンを50モル%含有し、酸価が10.5mgKOH/g、アミン価が0.1mgKOH/g、軟化点が165℃であるポリアミド樹脂。
ジカルボン酸成分として、ダイマー酸を100モル%、ジアミン成分としてエチレンジアミンを100モル%含有し、酸価が10.0mgKOH/g、アミン価が1.0mgKOH/g、軟化点が163℃であるポリアミド樹脂。
ポリオレフィン樹脂として、住友化学社製「ボンダインLX4110」を用いた。
撹拌機およびヒーター付きの密閉できる耐圧1リットル容ガラス容器に、75.0gのダイマー酸系ポリアミド樹脂P-1、37.5gのイソプロパノール(IPA)、37.5gのテトラヒドロフラン(THF)、7.2gのN,N-ジメチルエタノールアミンおよび217.8gの蒸留水を仕込んだ。回転速度を300rpmで撹拌しながら、系内を加熱し、120℃で60分間加熱攪拌を行った。その後、撹拌しながら室温付近(約30℃)まで冷却し、100gの蒸留水を追加した後、300メッシュのステンレス製フィルター(線径0.035mm、平織)でごくわずかに加圧しながらろ過した。得られた水性分散体を1Lナスフラスコに入れ、80℃に加熱した湯浴につけながらエバポレーターを用いて減圧し、IPA、THF、水の混合媒体約100gを留去し、乳白色の均一なダイマー酸系ポリアミド樹脂水性分散体E-1を得た。E-1の固形分濃度は20質量%、分散体中の樹脂の数平均粒子径は0.040μm、pHは10.4、粘度は36mPa・sであった。
撹拌機およびヒーター付きの密閉できる耐圧1リットル容ガラス容器に、75.0gのダイマー酸系ポリアミド樹脂P-2、93.8gのIPA、6.0gのN,N-ジメチルエタノールアミンおよび200.3gの蒸留水を仕込んだ。回転速度を300rpmで撹拌しながら、系内を加熱し、120℃で60分間加熱攪拌を行った。その後、撹拌しながら室温付近(約30℃)まで冷却し、130gの蒸留水を追加した後、300メッシュのステンレス製フィルター(線径0.035mm、平織)でごくわずかに加圧しながらろ過した。得られた水性分散体を1Lナスフラスコに入れ、80℃に加熱した湯浴につけながらエバポレーターを用いて減圧し、IPA、水の混合媒体約130gを留去し、乳白色の均一なダイマー酸系ポリアミド樹脂水性分散体E-2を得た。E-2の固形分濃度は20質量%、分散体中の樹脂の数平均粒子径は0.052μm、pHは10.6、粘度は30mPa・sであった。
ダイマー酸系ポリアミド樹脂水性分散体E-1の製造において、樹脂P-1を樹脂P-3に変更した以外は同様の製造方法で、ダイマー酸系ポリアミド樹脂水性分散体E-3を得た。E-3の固形分濃度は20質量%、分散体中の樹脂の数平均粒子径は0.058μm、pHは10.3、粘度は45mPa・sであった。
撹拌機およびヒーター付きの密閉できる耐圧1リットル容ガラス容器に、110.0gのダイマー酸系ポリアミド樹脂P-4、110.0gのIPA、110.0gのTHF、9.2gのN,N-ジメチルエタノールアミン、11.0gのトルエン、および199.8gの蒸留水を仕込んだ。回転速度を300rpmで撹拌しながら、系内を加熱し、120℃で60分間加熱攪拌を行った。その後、撹拌しながら室温付近(約30℃)まで冷却し、330gの蒸留水を追加した後、300メッシュのステンレス製フィルター(線径0.035mm、平織)でごくわずかに加圧しながらろ過した。得られた水性分散体を1Lナスフラスコに入れ、80℃に加熱した湯浴につけながらエバポレーターを用いて減圧し、IPA、THF、トルエン、水の混合媒体約330gを留去し、乳白色の均一なダイマー酸系ポリアミド樹脂水性分散体E-4を得た。E-4の固形分濃度は20質量%、分散体中の樹脂の数平均粒子径は0.065μm、pHは10.3、粘度は8mPa・sであった。
攪拌機およびヒーター付の密閉できる耐圧1リットル容ガラス容器に、75.0gのダイマー酸系ポリアミド樹脂P-5、37.5gのIPA、37.5gのTHF、7.2gのN,N-ジメチルエタノールアミン、および217.8gの蒸留水を仕込んだ。回転速度を300rpmで撹拌しながら、系内を加熱し、120℃で60分間加熱攪拌を行った。その後、撹拌しながら室温付近(約30℃)まで冷却し、100gの蒸留水を追加した後、300メッシュのステンレス製フィルター(線径0.035mm、平織)でごくわずかに加圧しながらろ過した。得られた水性分散体を1Lナスフラスコに入れ、80℃に加熱した湯浴につけながらエバポレーターを用いて減圧し、IPA、THF、トルエン、水の混合媒体約100gを留去し、乳白色の均一なダイマー酸系ポリアミド樹脂水性分散体E-5を得た。E-5の固形分濃度は20質量%、分散体中の樹脂の数平均粒子径は0.045μm、pHは10.6、粘度は5mPa・sであった。
攪拌機およびヒーター付きの密閉できる耐圧1リットル容ガラス容器に、60.0gのポリオレフィン樹脂P-6、28.0gのIPA、1.5gのTEAおよび210.5gの蒸留水をガラス容器内に仕込み、撹拌翼の回転速度を300rpmとして撹拌したところ、容器底部には樹脂粒状物の沈澱は認められず、浮遊状態となっていることが確認された。そこでこの状態を保ちつつ、10分後にヒーターの電源を入れ加熱した。そして系内温度を140℃に保ってさらに20分間撹拌した。その後、水浴につけて、回転速度300rpmのまま攪拌しつつ室温(約25℃)まで冷却した後、300メッシュのステンレス製フィルター(線径0.035mm、平織)で加圧濾過(空気圧0.2MPa)し、乳白色の均一なポリオレフィン樹脂水性分散体N-1を得た。
〔半芳香族ポリアミド樹脂T-1〕
1343gの1,9-ノナンジアミン(NMDA)、237gの2-メチル-1,8-オクタンジアミン(MODA)、1627gのテレフタル酸(TPA)(平均粒径:80μm)(NMDA:MODA:TPA=85:15:99、モル比)、48.2gの安息香酸(BA)(ジカルボン成分とジアミン成分の総モル数に対して4.0モル%)、3.2gの亜リン酸(PA)(ジカルボン成分とジアミン成分の合計量に対して0.1質量%)、1100gの水を反応装置に入れ、窒素置換した。さらに、80℃で0.5時間、毎分28回転で攪拌した後、230℃に昇温した。その後、230℃で3時間加熱した。その後冷却し、反応物を取り出した。該反応物を粉砕した後、乾燥機中において、窒素気流下、220℃で5時間加熱し、固相重合してポリマーを得た。そして、シリンダー温度320℃の条件下で溶融混練してストランド状に押し出した。その後、冷却、切断して、ペレット状の半芳香族ポリアミド樹脂T-1を調製した。
100質量部の半芳香族ポリアミド樹脂T-1、および0.2質量部の3,9-ビス[2-{3-(3-t-ブチル-4-ヒドロキシ-5-メチルフェニル)プロピオニルオキシ}-1,1-ジメチルエチル]-2,4,8,10-テトラオキサスピロ[5.5]ウンデカン(GA)(住友化学社製、「スミライザーGA-80」、熱分解温度392℃)をシリンダー温度320℃に加熱した、スクリュー経が50mmである単軸押出機に投入して溶融して、溶融ポリマーを得た。該溶融ポリマーを金属繊維焼結フィルター(日本精線社製、「NF-10」、絶対粒径:30μm)を用いて濾過した。その後、320℃にしたTダイよりフィルム状に押出し、フィルム状の溶融物とした。50℃に設定した冷却ロール上に、該溶融物を静電印加法により密着させて冷却し、実質的に無配向の未延伸フィルム(厚さ:250μm)を得た。
次に、この未延伸フィルムの両端をクリップで把持しながら、テンター方式同時二軸延伸機(入口幅:193mm、出口幅:605mm)に導いて、同時二軸延伸をおこなった。延伸条件は、予熱部の温度が120℃、延伸部の温度が130℃、MDの延伸歪み速度が2400%/分、TDの延伸歪み速度が2760%/分、MDの延伸倍率が3.0倍、TDの延伸倍率が3.3倍であった。
そして、同テンター内で、270℃で熱固定を行い、フィルムの幅方向に5%の弛緩処理を施し、厚さ25μm、ヘイズ4.2%、全光線透過度88.0%の二軸延伸フィルムを得た。
得られた二軸延伸半芳香族ポリアミド樹脂フィルムを樹脂フィルムF-1として使用した。
半芳香族ポリアミド樹脂T-1をナイロン6T樹脂(三井化学社製 アーレンE)に変更した以外は、半芳香族ポリアミド樹脂フィルムF-1と同様の操作でフィルムを得た。得られたナイロン6Tフィルムを樹脂フィルムF-2として使用した。
樹脂フィルムF-3として、ポリイミドフィルム(東レ・デュポン社製 カプトン100H、厚み25μm)を使用した。
樹脂フィルムF-4として、ポリエーテルイミドフィルム(三菱樹脂社製 スペリオUT、厚み25μm)を使用した。
半芳香族ポリアミド樹脂T-1を芳香族ナイロン樹脂(ユニチカ社製 ゼコットXN500)に変更し、半芳香族ポリアミド樹脂フィルムF-1と同様の操作でフィルムを得た。得られた芳香族ナイロンフィルムを樹脂フィルムF-5として使用した。
樹脂フィルムF-6として、ポリイミドフィルム(三菱ガス社製 ネオプリムL-3450 30μm、ヘイズ1.0%、全光線透過度91.0%)を使用した。
樹脂フィルムF-7として、ポリエチレンテレフタレートフィルム(ユニチカ社製 エンブレット S-25、厚み25μm、ヘイズ4.5%、全光線透過度88%)を使用した。
樹脂フィルムF-8として、ナイロン6フィルム(ユニチカ社製 エンブレムON-25、厚み25μm、ヘイズ4.0%、全光線透過度88%)を使用した。
半芳香族ポリアミド樹脂T-1をナイロン6,6樹脂(宇部興産社製 UBEナイロン66)に変更し、半芳香族ポリアミド樹脂フィルムF-1と同様の操作でフィルムを得た。得られたナイロン6,6フィルムを樹脂フィルムF-9として使用した。
樹脂フィルムF-10として、ポリエーテルエーテルケトンフィルム(クラボウ社製 EXPEEK、厚み25μm)を使用した。
ダイマー酸系ポリアミド樹脂水性分散体E-1と、オキサゾリン基含有高分子水溶液(日本触媒社製、エポクロスWS-700、固形分濃度25質量%)とを、それぞれの固形分が100質量部/10質量部の割合になるように配合し、室温で5分間混合攪拌して接着層形成用塗剤を得た。
得られた塗剤を半芳香族ポリアミド樹脂フィルムF-1に乾燥後厚み3μmで塗布し、150℃、30秒の条件で乾燥し、積層体を得た。
(ポリイミドフィルムの接着)
得られた積層体の接着層表面に、被着体としてポリイミドフィルム(東レ・デュポン社製 カプトン100H、厚み25μm)を重ね合わせ、ヒートプレス機(シール圧0.2MPa、200℃、10分間)でプレスし、積層体にポリイミドフィルムを接着した物品を得た。
(ハードコート層の積層)
得られた積層体の接着層表面に、ハードコート層形成用塗液(アクリル系ハードコート樹脂(大日精化社製 セイカビームEXF01BPHC))を硬化後の厚み3μmで塗布し、低圧水銀灯UVキュア装置(東芝ライテック社製 40mW/cm 一灯式)でキュアリングを行い、積層体に被着体としてハードコート層を積層した物品(ハードコートフィルム)を得た。
(金属板の積層)
得られた積層体の接着層表面に、金属板としての電解銅箔(古河電工社製、表面CTS処理、厚み18μm)を重ね合わせ、ヒートプレス機(180℃、15分間、2MPa)でプレスし、金属板、接着層、樹脂フィルムの順から構成される物品A(180℃×15minプレス品)を得た。
またヒートプレス機(200℃、120分間、2MPa)でプレスし、金属板、接着層、樹脂フィルムの順から構成される物品B(200℃×120minプレス品)を得た。
なお、実施例1Bにおいて、金属板として、アルミニウム箔(東洋アルミニウム社製、A1N30、厚み15μm)を使用し、実施例1Cにおいては、ステンレス箔(日新製鋼社製、SUS-304-H-TA、厚み20μm)を使用した。
水性分散体の種類、架橋剤の種類と固形分量、また樹脂フィルムの種類が表1記載のものになるようにした以外は実施例1と同様の操作を行って、接着剤形成用塗剤、積層体、物品を得た。なお、実施例8、9においては、架橋剤の水溶液として、エポキシ基含有高分子水溶液(ADEKA社製、アデカレジンEM-051R、固形分濃度49.8質量%)を使用し、実施例10においては、架橋剤の分散体として、カルボジイミド基含有高分子分散体(日清紡ケミカル社製、カルボジライトシリーズE-01、固形分濃度40質量%)を使用した。
また、比較例8においては、水性分散体の代わりにエポキシ樹脂を使用しており、具体的には、エポキシ樹脂(三菱ケミカル社製jER1001)100部と、硬化剤としてのジアミノジフェニルスルホン(東京化成工業社製)20部とを、メチルエチルケトン(東京化成工業株式会社製)に溶解分解させて、濃度40%の接着剤を得た。比較例9においては、ホットメルト樹脂(テクノアルファ社製STAYSTIK#383)を加温後、厚み15μmとなるようにし、実施例1と同様にして積層体を得た。
半芳香族ポリアミド樹脂T-1を、シリンダー温度を295℃(前段)、320℃(中段)および320℃(後段)に設定した65mm単軸押出機に投入して溶融し、320℃に設定したTダイよりフィルム状に押し出し、循環オイル温度を50℃に設定した冷却ロール上に、静電印加法により押し付けて密着させて冷却し、厚さ240μmの実質的に無配向の未延伸フィルムAを得た。なお、冷却ロールは、表面にセラミック(Al2O3)を0.15mm厚に被覆したものを用いた。また、ロール表面とフィルムとが接触する点よりも上流側にカーボンブラシを2つ並べて冷却ロールに接触させ、カーボンブラシのホルダーを接地することにより、セラミック被覆層の表面を除電した。電極には、直径0.2mmのタングステン線を用い、300W(15kV×20mA)の直流高圧発生装置で6.5kVの電圧を印加した。
次に、実施例1記載の方法で調製した接着層形成用塗剤を、グラビアロールで8.0g/m2となるように、未延伸フィルムAの片面に塗布した後、未延伸フィルムAの両端をクリップで把持しながら、テンター方式同時二軸延伸機(日立製作所社製)に導いて、予熱部温度125℃、延伸部温度130℃、縦延伸歪み速度2400%/min、横延伸歪み速度2760%/min、縦方向延伸倍率3.0倍、横方向延伸倍率3.3倍で同時二軸延伸した。そして、同テンター内で285℃の熱固定を行い、フィルムの幅方向に5%の弛緩処理を施した後、均一に徐冷し、フィルム両端をクリップから解放し、耳部をトリミングして、幅0.5mで長さ500mを巻取り、厚さ25μmの二軸延伸された半芳香族ポリアミドフィルム上に、厚さ150nmの接着層が設けられた積層体を得た。
実施例16と同様にして、未延伸フィルムAを得た。この未延伸フィルムAをロール式縦延伸機で105℃の条件下、3.0倍に延伸して縦延伸フィルムBを得た。
次いで、実施例1記載の方法で調製した接着層形成用塗剤を、縦延伸フィルムBの表面にグラビアロールで6.0g/m2となるように塗布したのち、その後連続的にフィルムの端部をフラット式延伸機のクリップに把持させ、140℃の条件下、横3.3倍に延伸を施し、その後、横方向の弛緩率を5%として、285℃で熱固定を行い、接着層が設けられた厚さ25μmの積層体を得た。
接着層におけるダイマー酸系ポリアミド樹脂のアミン価が本発明で規定する範囲を超える積層体(比較例2)は、ポリイミドフィルム接着物品において、接着性に劣っていた。
また、樹脂フィルムを構成する樹脂にポリエチレンテレフタレートを用いた場合(比較例3)、耐熱性に劣っていた。
樹脂フィルムを構成する樹脂にナイロン6、ナイロン6,6、ポリエーテルエーテルケトンを用いた場合(比較例4、5、6)、密着性、接着性、耐熱性に劣っていた。
ダイマー酸系ポリアミド樹脂の代わりにポリオレフィン樹脂の水性分散体を用いて接着層を設けた積層体(比較例7)は、ポリイミドフィルム接着物品において、接着性、耐熱性に劣っていた。
ダイマー酸系ポリアミド樹脂の代わりにエポキシ樹脂接着剤を用いて接着層を設けた積層体(比較例8)は、密着性、接着性に劣っていた。
ダイマー酸系ポリアミド樹脂の代わりにホットメルト樹脂を用いて接着層を設けた積層体(比較例9)は、密着性、接着性、耐熱性に劣っていた。
一方、接着層に架橋剤を含まない積層体(比較例1)の接着層にハードコート層を接着した物品は、積層体全体の密着性に劣り、耐屈曲性試験ではハードコート層の剥がれや浮きが生じ耐屈曲性に劣っていた。
また、樹脂フィルムを構成する樹脂にポリエチレンテレフタレートを用いた場合(比較例3)、ハードコート層を接着した物品は、耐屈曲性試験では折れ痕、割れ、白化が生じ耐屈曲性に劣り、干渉縞が非常に目立ち外観が不良であった。
樹脂フィルムを構成する樹脂にナイロン6を用いた場合(比較例4)、接着層は樹脂フィルムとの密着性に劣っており、樹脂フィルムと接着層の層間でズレが生じ、耐傷性試験を実施できなかった。
一方、接着層を構成する樹脂がポリオレフィン樹脂である場合(比較例7)、接着性で劣るものであり、ヒートサイクル試験後の物品には、フクレと剥がれ両方が見られた。
接着層を構成する樹脂がエポキシ樹脂である場合(比較例8)、金属板積層時のプレス温度が低く、プレス時間が短い物品Aは、接着性が低く、ヒートサイクル試験後にフクレや剥がれが生じており、また、金属板積層時のプレス温度を高め、プレス時間を長くした物品Bは、ヒートサイクル試験後にフクレや剥がれが生じなかったが、接着性が低いものであった。
接着層がホットメルト樹脂である場合(比較例9)、接着層の耐熱性が低いため物品Aのヒートサイクル試験後は接着層が積層体から溶け出てきたため剥離強力を測定することができず、ヒートサイクル試験後の物品には、フクレと剥がれ両方が見られた。また、金型板積層時のプレス温度を高め、プレス時間を長くした物品Bの作製時に接着層が積層体から溶け出てきたため、剥離強力を測定することができず、ヒートサイクル試験は実施できなかった。
Claims (10)
- 樹脂フィルムの少なくとも片面に接着層が設けられた積層体であり、
樹脂フィルムを構成する樹脂が、半芳香族ポリアミドおよび/またはポリイミド系樹脂であって、
接着層が、アミン価が1.0mgKOH/g未満であるダイマー酸系ポリアミド樹脂と、架橋剤とを含有することを特徴とする積層体。 - ダイマー酸系ポリアミド樹脂100質量部に対し、架橋剤を0.5~50質量部含有することを特徴とする請求項1記載の積層体。
- 架橋剤が、オキサゾリン化合物であることを特徴とする請求項1または2記載の積層体。
- ダイマー酸系ポリアミド樹脂は、酸価が1~20mgKOH/gであることを特徴とする請求項1~3のいずれかに記載の積層体。
- 請求項1~4のいずれかに記載の積層体と被着体とが接着されてなる物品。
- 被着体がハードコート層である請求項5記載の物品。
- ヘイズが5.0%以下であることを特徴とする請求項5または6記載の物品。
- 前記物品がフレキシブルディスプレイ用物品であることを特徴とする請求項5~7のいずれかに記載の物品。
- 被着体が金属である請求項5記載の物品。
- 前記物品がフレキシブルプリント基板またはセンサー部品であることを特徴とする請求項5または9記載の物品。
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| JP2022134144A (ja) * | 2021-03-03 | 2022-09-15 | ユニチカ株式会社 | 積層体 |
| JP7695685B2 (ja) | 2021-03-03 | 2025-06-19 | ユニチカ株式会社 | 積層体 |
| CN115404020A (zh) * | 2022-10-14 | 2022-11-29 | 深圳市高仁电子新材料有限公司 | 一种用于全贴合和柔性折叠屏的三层结构的丙烯酸类光学胶膜及其制备方法 |
| CN115404020B (zh) * | 2022-10-14 | 2023-06-30 | 深圳市高仁电子新材料有限公司 | 一种用于全贴合和柔性折叠屏的三层结构的丙烯酸类光学胶膜及其制备方法 |
| WO2025115930A1 (ja) * | 2023-11-29 | 2025-06-05 | 太陽ホールディングス株式会社 | 樹脂組成物、フィルム及びディスプレイデバイス |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109689827A (zh) | 2019-04-26 |
| JP6970967B2 (ja) | 2021-11-24 |
| KR102375503B1 (ko) | 2022-03-17 |
| JP2018118515A (ja) | 2018-08-02 |
| JPWO2018052104A1 (ja) | 2018-09-13 |
| KR20190051988A (ko) | 2019-05-15 |
| JP6320669B1 (ja) | 2018-05-09 |
| TWI713788B (zh) | 2020-12-21 |
| CN109689827B (zh) | 2021-11-02 |
| TW201813818A (zh) | 2018-04-16 |
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