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WO2018047760A1 - Produit durci, feuille de conversion de longueur d'onde, dispositif électroluminescent, élément d'étanchéité et dispositif électroluminescent semi-conducteur - Google Patents

Produit durci, feuille de conversion de longueur d'onde, dispositif électroluminescent, élément d'étanchéité et dispositif électroluminescent semi-conducteur Download PDF

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Publication number
WO2018047760A1
WO2018047760A1 PCT/JP2017/031732 JP2017031732W WO2018047760A1 WO 2018047760 A1 WO2018047760 A1 WO 2018047760A1 JP 2017031732 W JP2017031732 W JP 2017031732W WO 2018047760 A1 WO2018047760 A1 WO 2018047760A1
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Prior art keywords
cured product
silicone resin
formula
group
wavelength conversion
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PCT/JP2017/031732
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English (en)
Japanese (ja)
Inventor
理彦 西田
篤典 土居
建太朗 増井
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Sumitomo Chemical Co Ltd
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Sumitomo Chemical Co Ltd
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Priority to CN201780054504.3A priority Critical patent/CN109689790A/zh
Priority to KR1020197009931A priority patent/KR20190053875A/ko
Publication of WO2018047760A1 publication Critical patent/WO2018047760A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0239—Combinations of electrical or optical elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • C09K3/1018—Macromolecular compounds having one or more carbon-to-silicon linkages
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses

Definitions

  • the present invention relates to a cured product, a wavelength conversion sheet, a light emitting device, a sealing member, and a semiconductor light emitting device.
  • a light emitting device using a semiconductor laser (LD, Laser Diode) or a light emitting diode (LED, Light Emitting Diode) has been studied.
  • the semiconductor laser can maintain high conversion efficiency even in a high current density region.
  • the semiconductor laser can be downsized by separating the light emitting portion and the excitation portion. Therefore, it is expected that a semiconductor laser is used for the lighting device.
  • Light-emitting diodes are becoming brighter due to recent technological developments.
  • a cured silicone resin is known as a transparent material used in a light emitting device.
  • Patent Document 1 describes that a cured product of a polymerizable silicone resin is used as a matrix material of a phosphor sheet of an LED.
  • the cured silicone resin not only has excellent light transmittance, but also has excellent heat resistance and UV resistance. Therefore, a member using a cured silicone resin as a forming material is suitable because it hardly deteriorates even when used in a light-emitting device that is used for a long period of time.
  • a member made of a hardened silicone resin cured material has an advantage that it is difficult to be damaged.
  • the hardened silicone resin cured product has a disadvantage that the yield tends to decrease because cracks are likely to occur during curing.
  • a hardened silicone resin cured product has a drawback that cracks due to thermal stress or the like are likely to occur during use. Therefore, there has been a demand for a cured silicone resin having a high hardness, which is less likely to crack during curing and less likely to crack during heating.
  • crack resistance the property that cracks hardly occur during curing
  • heat resistance the property that cracks are less likely to occur during heating
  • a member In a light emitting device using a semiconductor laser or UV-LED, a member may be irradiated with light having a high energy density. Moreover, in the light-emitting device using high-intensity LED, a member may be exposed to high temperature by the heat_generation
  • the present invention has been made in view of such circumstances, and an object thereof is to provide a cured product having both high hardness, high crack resistance, and high heat resistance. It is another object of the present invention to provide a wavelength conversion sheet, a light emitting device, a sealing member, and a semiconductor light emitting device using the cured product as a forming material.
  • the present invention provides the following [1] to [13].
  • a cured product that includes a cured cured silicone resin and satisfies the following (1) and (2).
  • (1) In the solid 29 Si-nuclear magnetic resonance spectrum of the cured silicone resin cured product, there is a peak attributed to the silicon atom of the T form. (Here, the silicon atom of the T form means a silicon atom bonded to three oxygen atoms.)
  • (2) The following non-uniform domain size is 50 mm or more.
  • non-uniform domain size means The measurement value of small-angle X-ray scattering of a sample obtained by impregnating tetrahydrofuran of the condensed silicone resin cured product with swelling, A graph obtained by plotting, with the horizontal axis representing the wave number of X-rays used in the measurement of small-angle X-ray scattering, and the vertical axis representing the scattering intensity obtained by subtracting blank scattering from the measured scattering intensity measured by small-angle X-ray scattering, It is a value obtained by fitting with the following formula (A).
  • the T3 silicon atom means a silicon atom in which all three oxygen atoms are bonded to other silicon atoms in the T-body silicon atoms.
  • the cured silicone resin cured product includes a structural unit represented by formula (A1), formula (A1 ′), formula (A2), or formula (A3) Cured product according to crab.
  • R 1 represents an alkyl group having 1 to 10 carbon atoms or an aryl group having 6 to 10 carbon atoms.
  • R 2 represents an alkoxy group having 1 to 4 carbon atoms or a hydroxyl group.
  • R 1 and R 2 may be the same or different.
  • R 1 is a methyl group
  • R 2 is an alkoxy group having 1 to 3 carbon atoms or a hydroxyl group
  • a plurality of R 2 may be the same or different.
  • the cured product according to [6], wherein the filler is a wavelength conversion material.
  • the cured product according to [7], wherein the wavelength conversion material is a phosphor.
  • a wavelength conversion sheet using the cured product according to [7] or [8] as a forming material [10] a light source that emits light; A wavelength conversion sheet according to [9], which is disposed at a position where light emitted from the light source is incident. [11] A sealing member comprising the cured product according to any one of [1] to [8] as a forming material. [12] a substrate; A semiconductor light emitting device disposed on the substrate; A sealing member for sealing at least a part of the semiconductor light emitting element, A semiconductor light-emitting device, wherein the sealing member is the sealing member according to [11]. [13] The semiconductor light emitting device according to [12], wherein an emission wavelength of the semiconductor light emitting element is 400 nm or less.
  • a cured product having both high hardness, high crack resistance and high heat resistance can be provided.
  • cured material as a forming material, a light-emitting device, the member for sealing, and a semiconductor light-emitting device can be provided.
  • the structural unit contained in the silicone resin is preferably contained in the silicone resin as a repeating unit.
  • the cured product of the present invention includes a condensed silicone resin cured product and satisfies the following (1) and (2).
  • (1) In the solid 29 Si-nuclear magnetic resonance spectrum of the cured silicone resin cured product, there is a peak attributed to the silicon atom of the T form. (Here, the silicon atom of the T form means a silicon atom bonded to three oxygen atoms.)
  • (2) The following non-uniform domain size is 50 mm or more.
  • non-uniform domain size means The measurement value of small-angle X-ray scattering of a sample obtained by impregnating tetrahydrofuran of the condensed silicone resin cured product with swelling, A graph obtained by plotting, with the horizontal axis representing the wave number of X-rays used in the measurement of small-angle X-ray scattering, and the vertical axis representing the scattering intensity obtained by subtracting blank scattering from the measured scattering intensity measured by small-angle X-ray scattering, It is a value obtained by fitting with the following formula (A). )
  • SAXS small angle X-ray scattering
  • condensation type silicone resin is used as a raw material of the condensation type silicone resin cured product contained in the cured product of the present embodiment.
  • Condensation type silicone resin may be used individually by 1 type, and may use 2 or more types.
  • the condensation type silicone resin is a resin that undergoes polycondensation by subjecting a hydroxyl group bonded to a silicon atom and an alkoxy group or hydroxyl group bonded to another silicon atom to a dealcoholization reaction or a dehydration reaction.
  • the condensation type silicone resin that is a raw material of the condensation type silicone resin cured product contained in the cured product of the present embodiment includes a structural unit represented by the following formula (A3).
  • the condensed silicone resin is one or more selected from the group consisting of a structural unit represented by the formula (A1), a structural unit represented by the formula (A1 ′), and a structural unit represented by the formula (A2).
  • the structural unit is preferably further included, and further includes all of the structural unit represented by the formula (A1), the structural unit represented by the formula (A1 ′), and the structural unit represented by the formula (A2). More preferred.
  • R 1 represents an alkyl group having 1 to 10 carbon atoms or an aryl group having 6 to 10 carbon atoms.
  • R 2 represents an alkoxy group having 1 to 4 carbon atoms or a hydroxyl group. A plurality of R 1 and R 2 may be the same or different.
  • a structural unit including a silicon atom bonded to three oxygen atoms is referred to as a “T body”.
  • a structural unit containing a silicon atom in which all of the three oxygen atoms are bonded to another silicon atom is referred to as a “T3 body”.
  • a structural unit containing a silicon atom in which two of the three oxygen atoms are bonded to another silicon atom is referred to as a “T2 body”.
  • a structural unit including a silicon atom in which one of the three oxygen atoms is bonded to another silicon atom is referred to as a “T1 body”. That is, “T body” means “T1 body”, “T2 body”, and “T3 body”.
  • D-form a structural unit containing a silicon atom bonded to two oxygen atoms
  • M body A structural unit containing a silicon atom bonded to one oxygen atom
  • the structural unit represented by the formula (A3) includes three oxygen atoms bonded to other silicon atoms and a silicon atom bonded to R 1 . Since R 1 is an alkyl group having 1 to 10 carbon atoms or an aryl group having 6 to 10 carbon atoms, the structural unit represented by the formula (A3) is a T3 isomer.
  • the structural unit represented by the formula (A2) includes two oxygen atoms bonded to other silicon atoms, and a silicon atom bonded to R 1 and R 2 . Since R 2 is an alkoxy group having 1 to 4 carbon atoms or a hydroxyl group, the structural unit represented by the formula (A2) is a T2 isomer.
  • the structural unit represented by the formula (A1) includes one oxygen atom bonded to another silicon atom, a silicon atom bonded to R 1 and two R 2 atoms. Since R 1 is an alkyl group having 1 to 10 carbon atoms or an aryl group having 6 to 10 carbon atoms, and R 2 is an alkoxy group having 1 to 4 carbon atoms or a hydroxyl group, the structural unit represented by the formula (A1) Is T1 body.
  • the structural unit represented by the formula (A1 ′) includes a silicon atom bonded to R 1 and two R 2, and the silicon atom is bonded to a silicon atom in another structural unit. It is bonded to an atom. Since R 1 is an alkyl group having 1 to 10 carbon atoms or an aryl group having 6 to 10 carbon atoms, and R 2 is an alkoxy group having 1 to 4 carbon atoms or a hydroxyl group, the structure represented by the formula (A1 ′) The unit is T1 body.
  • the structural unit represented by the formula (A1) and the structural unit represented by the formula (A1 ′) constitute the end of the organopolysiloxane chain contained in the condensed silicone resin.
  • the structural unit represented by the formula (A3) constitutes a branched structure of an organopolysiloxane chain contained in the condensation type silicone resin. That is, the structural unit represented by the formula (A3) forms a part of a network structure or a ring structure in the condensed silicone resin.
  • T3 silicon atom A silicon atom contained in the T2 body is referred to as “T2 silicon atom”.
  • T1 silicon atom The silicon atom contained in the T1 body is referred to as “T1 silicon atom”.
  • the total content of T1 body, T2 body and T3 body is preferably 50 mol% or more based on the total content of all structural units of the condensation type silicone resin.
  • the total content of T1 silicon atoms, T2 silicon atoms, and T3 silicon atoms is preferably 50 mol% or more with respect to the total content of all silicon atoms in the condensed silicone resin.
  • the total content of T1 silicon atoms, T2 silicon atoms, and T3 silicon atoms is more preferably 60 mol% or more, and 70 mol% or more based on the total content of all silicon atoms in the condensation type silicone resin. More preferably, it is 80 mol% or more, still more preferably 90 mol% or more.
  • the content of D-form is preferably 30 mol% or less, more preferably 20 mol% or less, and more preferably 10 mol% or less with respect to the total content of all structural units of the condensation-type silicone resin. Is more preferably 5 mol% or less, and still more preferably 4 mol% or less.
  • the total content of T1, T2, and T3 is the total area of signals of all silicon atoms determined by solid-state 29 Si-NMR measurement, and is the signal attributed as T1, T2, and T3 silicon atoms. It can be obtained by dividing the total area.
  • the content of the T3 body is preferably 50 mol% or more with respect to the total content of all structural units of the condensation type silicone resin.
  • the content of T3 silicon atoms is preferably 50 mol% or more with respect to the total content of all silicon atoms in the condensation type silicone resin.
  • the content of T3 silicon atoms is more preferably 60 mol% or more, and further preferably 70 mol% or more, based on the total content of all silicon atoms in the condensation type silicone resin.
  • the content of T3 silicon atoms can be obtained by dividing the area of signals attributed as T3 silicon atoms by the total area of signals of all silicon atoms obtained in solid 29 Si-NMR measurement.
  • the content of silicon atoms other than T3 silicon atoms can be determined in the same manner.
  • the alkyl group having 1 to 10 carbon atoms represented by R 1 may be a linear alkyl group, a branched alkyl group, or an alkyl group having a cyclic structure. Good. Among these, a linear or branched alkyl group is preferable, and a linear alkyl group is more preferable.
  • one or more hydrogen atoms constituting the alkyl group may be substituted with another functional group.
  • substituent of the alkyl group include aryl groups having 6 to 10 carbon atoms such as a phenyl group and a naphthyl group, and a phenyl group is preferable.
  • Examples of the alkyl group having 1 to 10 carbon atoms represented by R 1 include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a tert-butyl group, and an n-pentyl group. And an unsubstituted alkyl group such as a neopentyl group, a hexyl group, an octyl group, a nonyl group and a decyl group, and an aralkyl group such as a phenylmethyl group, a phenylethyl group and a phenylpropyl group.
  • a methyl group, an ethyl group, an n-propyl group or an n-butyl group is preferable, a methyl group, an ethyl group or an isopropyl group is more preferable, and a methyl group is more preferable.
  • one or more hydrogen atoms constituting the aryl group may be substituted with another functional group.
  • substituent for the aryl group include alkyl groups having 1 to 10 carbon atoms such as a methyl group, an ethyl group, a propyl group, and a butyl group.
  • Examples of the aryl group having 6 to 10 carbon atoms represented by R 1 include unsubstituted aryl groups such as a phenyl group and a naphthyl group, and alkylaryl groups such as a methylphenyl group, an ethylphenyl group, and a propylphenyl group. It is done. Among these, a phenyl group is preferable.
  • R 1 is preferably an alkyl group, more preferably a methyl group, an ethyl group or an isopropyl group, and even more preferably a methyl group.
  • the C 1-4 alkoxy group represented by R 2 may be a linear alkoxy group, a branched alkoxy group, or an alkoxy group having a cyclic structure. Good. Among these, a linear or branched alkoxy group is preferable, and a linear alkoxy group is more preferable.
  • the alkoxy group having 1 to 4 carbon atoms represented by R 2 is, for example, preferably a methoxy group, an ethoxy group, an n-propoxy group, an isopropoxy group, an n-butoxy group, an isobutoxy group or a tert-butoxy group.
  • a group, an ethoxy group or an isopropoxy group is more preferable.
  • R 2 is preferably a methoxy group, an ethoxy group, an isopropoxy group or a hydroxyl group.
  • the condensation type silicone resin that is a raw material of the condensation type silicone resin cured product contained in the cured product of the present embodiment is represented by the following formula (C1), formula (C1 ′), formula (C2), formula (C3), or formula (C4). ) May be further included.
  • a structural unit including a silicon atom bonded to four oxygen atoms is referred to as a “Q body”.
  • a structural unit containing a silicon atom in which one of the four oxygen atoms is bonded to another silicon atom is referred to as “Q1 body”.
  • the structural unit represented by the formula (C1) and the structural unit represented by the formula (C1 ′) are Q1 isomers.
  • a structural unit containing a silicon atom in which two of the four oxygen atoms are bonded to another silicon atom is referred to as “Q2 body”.
  • the structural unit represented by the formula (C2) is Q2 isomer.
  • a structural unit including a silicon atom in which three oxygen atoms among the four oxygen atoms are bonded to other silicon atoms is referred to as “Q3 body”.
  • the structural unit represented by the formula (C3) is Q3 body.
  • a structural unit containing a silicon atom in which all of the four oxygen atoms are bonded to another silicon atom is referred to as “Q4 body”.
  • the silicon atom contained in Formula (C4) is Q4 body.
  • Q body means Q1, Q2, Q3 and Q4 bodies.
  • the specific gravity of the condensed silicone resin cured product contained in the cured product of this embodiment is preferably 1.20 to 1.35.
  • the specific gravity of the condensed silicone resin cured product can be appropriately adjusted by controlling the content ratio of the D-form, T-form and Q-form.
  • the cured silicone resin cured product was measured for small-angle X-ray scattering, and the specific parameters calculated from the measured values of the small-angle X-ray scattering determined the crack resistance and hardness ( That is, it was found to correlate with the mechanical properties of the cured product. That is, it has been found that a cured product in which a specific parameter satisfies a predetermined requirement is excellent in hardness and crack resistance. Moreover, the hardened
  • a cured product having the following non-uniform domain size of 50 mm or more as a parameter is excellent in hardness, crack resistance and heat resistance.
  • the heterogeneous domain size is a measured value of small-angle X-ray scattering of a sample in which a condensed silicone resin cured product is impregnated with tetrahydrofuran and swollen.
  • the mesh mesh size represented by ⁇ is an index value related to the distance between T3 silicon atoms, which are crosslinking points, in a sample obtained by impregnating and expanding a condensed silicone resin cured product contained in the cured product of this embodiment with tetrahydrofuran. It is.
  • the fitting constants represented by A and B are arbitrary constants used when fitting with the formula (A).
  • Equation (A) means that curve fitting is performed using a Squared Laurentian function and an Ornstein Zernike function.
  • the fitting parameter is obtained by the least square method.
  • the initial value of the fitting is 1 ⁇ ⁇ ⁇ 50 ⁇ and 1 ⁇ ⁇ ⁇ 250 ⁇ .
  • Measurement of small-angle X-ray scattering can be performed using a small-angle X-ray scattering device equipped with a two-dimensional detector.
  • a small-angle X-ray scattering device equipped with a two-dimensional detector.
  • An example of such a device is NanoSTAR (device name, manufactured by Bruker AXS Co., Ltd.).
  • the condensed silicone resin cured product is pulverized using a freeze pulverizer.
  • the freeze pulverizer include JFC-300 manufactured by Nippon Kogyo Co., Ltd.
  • the silicone cured product is pulverized until the average particle size becomes 100 ⁇ m or less.
  • X-rays are generated at an output of 50 kV and 100 mA using, for example, a rotating anti-cathode X-ray generator of a Cu target. Then, the generated X-ray is irradiated to the swollen sample (specimen).
  • X-rays are irradiated to the swollen sample through an X-ray optical system consisting of, for example, a cross-coupled gobel mirror and three pinhole slits (the diameters of the slits are 500 ⁇ m ⁇ , 150 ⁇ m ⁇ and 500 ⁇ m ⁇ from the X-ray generator side). Is done.
  • the X-rays scattered by the swollen sample are detected using a two-dimensional detector (two-dimensional multi wire detector, Hi-STAR).
  • the length from the swollen sample to the detector can be, for example, 106 cm, and the size of the direct beam stopper can be, for example, 2 mm ⁇ .
  • the degree of vacuum in the apparatus is, for example, 40 Pa or less.
  • the range of the scattering angle 2 ⁇ that can be measured is 0.08 to 3 °.
  • a two-dimensional scattered image obtained by detection can be analyzed using, for example, analysis software (SAXS Ver. 4.1.29) manufactured by Bruker AXS, and a small-angle X-ray small-angle scattering spectrum can be obtained.
  • SAXS Ver. 4.1.29 analysis software manufactured by Bruker AXS
  • the horizontal axis is the wave number of X-rays (unit: ⁇ -1 )
  • the vertical axis is the measured scattering intensity.
  • the horizontal axis represents the wave number of X-rays used in the measurement of small-angle X-ray scattering of the swollen sample, and blank scattering from the measured scattering intensity measured by small-angle X-ray scattering of the swollen sample
  • a graph in which the measured values of small-angle X-ray scattering of the swollen sample are plotted with the scattering intensity obtained by subtracting the ordinate as the vertical axis is created.
  • the contrast of electron density in a substance derived from the shape of particles and the density of cross-linking points is generally reflected in the scattering profile.
  • a region having a high crosslinking density for example, a region where T3 silicon atoms are dense
  • scattering due to an electron density difference at a crosslinking point cannot be obtained by ordinary small-angle X-ray scattering.
  • the network structure in the cured product is expanded and the contrast between the solvent and the cured product is increased, so that scattering resulting from the non-uniformity of the crosslinking points in the cured product is obtained. Can do.
  • FIG. 1 is a schematic diagram showing the above-described polymerization state, and shows the distribution of T3 silicon atoms contained in the condensed silicone resin cured product.
  • the shades of color indicate the amount of T3 silicon atoms.
  • a lightly colored portion indicates that the region has few T3 silicon atoms, and a darkly colored portion indicates that the region has many T3 silicon atoms.
  • a scattering profile is obtained based on the contrast of the electron density between region A and region B.
  • the non-uniform domain size ⁇ ⁇ ⁇ ⁇ described above corresponds to the average distance of the center-to-center distance d between the region A1 and the region A2 schematically shown in FIG.
  • the center of the area A1 is indicated by reference numeral P1
  • the center of the area A2 is indicated by reference numeral P2.
  • the center of the area corresponds to the center of gravity of each area. That is, P1 that is the center of the region A1 and P1 that is the center of the region A2 correspond to the centers of gravity of the region A1 and the region A2, respectively.
  • the T3 silicon atoms are uniformly distributed in the cured product, the T3 silicon atoms are uniformly distributed even in the swollen sample, so that the non-uniform domain size is small. That is, it means that the distribution of T3 silicon atoms is uniform in a cured product having a small heterogeneous domain size ⁇ .
  • T3 silicon atoms are distributed more unevenly than the predetermined standard in the cured product, even if stress is applied to the cured product, the stress can be dispersed throughout the cured product. Therefore, a cured product in which T3 silicon atoms are distributed more unevenly than a predetermined standard has high crack resistance.
  • a cured product having a non-uniform domain size ⁇ of 50 ⁇ or more has both high hardness and high crack resistance. This is because the strength is maintained in the region where the T3 silicon atoms are dense and the stress is relaxed in the region where the T3 silicon atoms are sparse.
  • the cured silicone resin cured product contained in the cured product of this embodiment preferably has a non-uniform domain size of 50 to 600 cm.
  • the heterogeneous domain size wrinkle is preferably 60 mm or more, more preferably 70 mm or more, further preferably 80 mm or more, particularly preferably 90 mm or more, and particularly preferably 100 mm or more. Preferably, it is 110 mm or more, even more preferably 120 mm or more, even more preferably 130 kg or more.
  • the heterogeneous domain size wrinkle is preferably 500 mm or less, more preferably 400 mm or less, further preferably 300 mm or less, particularly preferably 200 mm or less, and preferably 150 mm or less. Even more preferred.
  • a cured product having a non-uniform domain size ⁇ within this range satisfies a high hardness (Shore D hardness of 70 or more) and a high crack resistance, and thus is suitable for device application.
  • the hardness measured at a descending speed of 1 mm / second using a type D durometer is defined as Shore D hardness.
  • the condensed silicone resin cured product contained in the cured product of the present embodiment is a condensed silicone obtained by blending a silicone resin as a main ingredient (hereinafter referred to as “silicone resin A”) and an oligomer component described later. It is preferable that it is a hardened
  • the heterogeneous domain size wrinkles can be controlled by adjusting the types and blending ratios of the silicone resin A and the oligomer component as raw materials, and adjusting the curing conditions at the time of curing. Adjustment of the curing conditions during curing is more effective for controlling the non-uniform domain size wrinkles.
  • Silicone resin A is a material containing many crosslinking points (branched structures) that form a network structure.
  • the oligomer component has a linear structure such as a T2 body or a D body structure, and is a material having fewer crosslinking points than the silicone resin A.
  • the silicone resin A and the oligomer component will be described.
  • Silicone resin A includes a structural unit represented by the above formula (A3).
  • the silicone resin A is selected from the group consisting of a structural unit represented by the above formula (A1), a structural unit represented by the above formula (A1 ′), and a structural unit represented by the above formula (A2). It is preferable that a structural unit of more than seeds is further included.
  • the total content of the T1 body, the T2 body, and the T3 body is usually 70 mol% or more with respect to the total content of all the structural units of the silicone resin A.
  • the content of the T3 body is usually 60 mol% or more and 90 mol% or less with respect to the total content of all the structural units of the silicone resin A.
  • the polystyrene-reduced weight average molecular weight of the silicone resin A is usually 1500 or more and 8000 or less.
  • the total content of the T1, T2 and T3 bodies is preferably 80 mol% or more and 90 mol% or more with respect to the total content of all structural units of the silicone resin A. More preferably, it is more preferably 95 mol% or more.
  • the content of the T3 body is preferably 65% or more and 90% or less, and more preferably 70% or more and 85% or less with respect to the total content of all the structural units of the silicone resin A. preferable.
  • the weight average molecular weight in terms of polystyrene of the silicone resin A is preferably 1500 or more and 7000 or less, and more preferably 2000 or more and 5000 or less.
  • silicone resin A a commercially available silicone resin can be used.
  • the silicone resin A preferably has a silanol group (Si—OH).
  • the silicon atom having a silanol group is preferably 1 to 30 mol%, more preferably 5 to 27 mol%, based on all silicon atoms contained in the silicone resin A. More preferably, it is ⁇ 25 mol%.
  • the curing speed will be within an appropriate range, and it is cured by combining with the structure control by the curing conditions of the silicone resin described later. It is possible to effectively control mechanical properties such as hardness and strength of the object.
  • the silicon atom having an alkoxy group is preferably more than 0 mol% and not more than 20 mol%, more than 0 mol% and not more than 10 mol% with respect to all silicon atoms contained in the silicone resin A. More preferably, it is 1 mol% or more and 10 mol% or less.
  • the silicone resin A if the content of silicon atoms having an alkoxy group is within the above range, the fluidity of the silicone resin composition obtained by dissolving the silicone resin in a solvent is within the appropriate range, and the silicone resin The handling property of the composition is improved.
  • the silicone resin A can be synthesized using an organosilicon compound having a functional group capable of generating a siloxane bond as a starting material.
  • the “functional group capable of generating a siloxane bond” include a halogen atom, a hydroxyl group, and an alkoxy group.
  • the organosilicon compound corresponding to the structural unit represented by the above formula (A3) include organotrihalosilane and organotrialkoxysilane.
  • Silicone resin A is obtained by reacting an organic silicon compound, which is a starting material, with a hydrolysis condensation method in the presence of an acid such as hydrochloric acid or a base such as sodium hydroxide at a ratio corresponding to the existing ratio of each structural unit. Can be synthesized. By appropriately selecting an organic silicon compound that is a starting material, the abundance ratio of T3 silicon atoms contained in the silicone resin A can be adjusted.
  • the content of the silicone resin A contained in the condensation type silicone resin is preferably 60% by mass to 100% by mass, preferably 70% by mass to the total content of all silicone resins contained in the condensation type silicone resin. More preferably, it is 95 mass%.
  • the condensation-type silicone resin contains silicone resin A and an oligomer having a linear structure with less content of T3 than silicone resin A, a region where polymerization reaction easily occurs and a region where polymerization reaction hardly occurs are generated. . As a result, the resulting cured product has “appropriate non-uniformity”.
  • oligomer component examples include an oligomer containing a structural unit represented by the following formula (B1), formula (B1 ′), formula (B2), or formula (B3).
  • R 3 represents an alkyl group having 1 to 10 carbon atoms or an aryl group having 6 to 10 carbon atoms.
  • R 4 represents an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a hydroxyl group.
  • a plurality of R 3 and R 4 may be the same or different.
  • the weight average molecular weight in terms of polystyrene of the oligomer containing the structural unit represented by the formula (B1), formula (B1 ′), formula (B2) and formula (B3) is preferably 1000 to 10,000, and 2000 to 8000. More preferably, it is 3000 to 6000.
  • oligomer B an oligomer component having a structural unit represented by formula (B1), formula (B1 ′), formula (B2), and formula (B3) and having a polystyrene-equivalent weight average molecular weight of 1000 to 10,000 is used. , Referred to as “oligomer B”.
  • Oligomer B is preferably (a) an oligomer containing T2 form or (b) an oligomer containing D form, more preferably an oligomer satisfying (a) and (b), that is, (c) an oligomer containing T2 form and D form. .
  • the oligomer containing T2 isomer is a structural unit represented by the formula (B2), wherein R 4 is an alkoxy group having 1 to 4 carbon atoms or a hydroxyl group
  • the T2 isomer content is preferably 30 to 60 mol%, more preferably 40 to 55 mol%.
  • oligomer B is an oligomer containing (a) T2 form
  • the condensation type silicone resin ensures the solubility of silicone resin A and oligomer B, Good curing reactivity is exhibited during heat curing.
  • the oligomer containing D isomer is a silicone resin containing a structural unit represented by formula (B1), formula (B1 ′), formula (B2) or formula (B3).
  • a silicone resin having an average composition formula represented by the following formula (I) is preferable.
  • n represents a real number satisfying 1 ⁇ n ⁇ 2.
  • m represents a real number satisfying 0 ⁇ m ⁇ 1.
  • the oligomer B whose average composition formula is represented by the following formula (I) includes the above-mentioned “T-form” and “D-form”.
  • R 5 is preferably a methyl group
  • R 6 is preferably a methyl group or a hydrogen atom
  • n is a real number satisfying 1 ⁇ n ⁇ 1.5
  • m is preferably a real number satisfying 0.5 ⁇ m ⁇ 1
  • n is a real number satisfying 1.1 ⁇ n ⁇ 1.4.
  • m is a real number that satisfies 0.55 ⁇ m ⁇ 0.75.
  • a structural unit represented by the formula (B1) and a structural unit represented by the formula (B1 ′) one of the two R 4 has 1 to 10 carbon atoms
  • the structural unit in which the alkyl group or aryl group having 6 to 10 carbon atoms and the other is an alkoxy group having 1 to 4 carbon atoms or a hydroxyl group is “D1 form”.
  • the total content of D1 isomer and D2 isomer among all structural units contained in the oligomer B is preferably 5 to 80 mol%. It is more preferably 70 mol%, and further preferably 15 to 50 mol%.
  • the structural unit which is a hydroxyl group is T1 body.
  • the structural unit represented by the formula (B2), in which R 4 is an alkoxy group having 1 to 4 carbon atoms or a hydroxyl group, is a T2 isomer.
  • the structural unit represented by the formula (B3) is a T3 body.
  • the oligomer B is an oligomer containing (c) the T2 form and the D form, among the total structural units contained in the oligomer B, the total content of the T1 form, the T2 form and the T3 form, and the content of the D form
  • the molar ratio (T-form: D-form) is preferably 60:40 to 90:10.
  • the oligomer B can be synthesized using an organosilicon compound having a functional group capable of forming a siloxane bond as a starting material corresponding to each of the structural units described above constituting the silicone resin.
  • a functional group capable of generating a siloxane bond include a halogen atom, a hydroxyl group, and an alkoxy group.
  • organosilicon compound corresponding to the structural unit represented by the above formula (B3) examples include organotrihalosilane, organotrialkoxysilane and the like.
  • organosilicon compound corresponding to the structural unit represented by the above formula (B2) examples include organodihalosilane and organodialkoxysilane.
  • Oligomer B is obtained by reacting an organosilicon compound as a starting material at a ratio corresponding to the abundance ratio of each structural unit in the presence of an acid such as hydrochloric acid or a base such as sodium hydroxide by a hydrolytic condensation method. Can be synthesized. By appropriately selecting the organosilicon compound as the starting material, the abundance ratio of the T-form silicon atom and the D-form silicon atom contained in the oligomer B can be adjusted.
  • the content of the oligomer B contained in the condensation type silicone resin is preferably 0.1% by mass to 20% by mass with respect to the total content of all silicone resins contained in the condensation type silicone resin.
  • the content is more preferably from 15% by mass to 15% by mass, and further preferably from 0.5% by mass to 10% by mass.
  • the content of the oligomer B contained in the condensation type silicone resin is preferably 0.1% by mass to 20% by mass with respect to the content of the silicone resin A contained in the condensation type silicone resin. % To 15% by mass is more preferable, and 5% to 12% by mass is even more preferable.
  • oligomer C include, for example, a silicone resin containing a structural unit represented by the above formula (A1), the above formula (A1 ′), the above formula (A2), or the above formula (A3), The ratio of the content of the structural unit represented by the above formula (A3) to the total content of the structural units represented by A1), the above formula (A1 ′), the above formula (A2) and the above formula (A3) is A silicone resin having a polystyrene-reduced weight average molecular weight of less than 1500 and having a molecular weight of 0 to 30 mol% can be mentioned. In the following description, such a silicone resin is referred to as “oligomer C”.
  • Oligomer C is a silicone in which the ratio of the content of T3 silicon atoms to the total content of T1 silicon atoms, T2 silicon atoms and T3 silicon atoms is 0 to 30 mol%, and the weight average molecular weight in terms of polystyrene is less than 1500 Resin.
  • the ratio of the content of T3 silicon atoms to the total content of T1 silicon atoms, T2 silicon atoms, and T3 silicon atoms is preferably 0 to 25 mol%.
  • the oligomer C preferably has substantially no silicon atom (hydrosilyl group) bonded to a hydrogen atom and silicon atom bonded to an alkenyl group.
  • the heat resistance of the cured product of this embodiment tends to be low.
  • the oligomer C is preferably an oligomer having an organopolysiloxane structure represented by the following formula (2).
  • R 1 and R 2 represent the same meaning as described above.
  • a plurality of R 1 and R 2 may be the same or different.
  • R 1 is one or more groups selected from the group consisting of a methyl group, an ethyl group and a phenyl group
  • R 2 is a methoxy group, an ethoxy group, an iso group. It is preferably one or more groups selected from the group consisting of a propoxy group and a hydroxyl group
  • R 1 is one or more groups selected from the group consisting of a methyl group and an ethyl group
  • R 2 is a methoxy group
  • R 1 is preferably a methyl group.
  • the abundance ratio of each silicon atom in the oligomer C can be adjusted by appropriately adjusting the numerical values of p 2 , q 2 , r 2 , a 2 and b 2 .
  • [A 2 ⁇ q 2 ] / [(p 2 + b 2 ⁇ q 2 ) + a 2 ⁇ q 2 + (r 2 + q 2 )] is a T3 silicon atom in the organopolysiloxane structure represented by the formula (2) Abundance ratio: equal to [y 2 / (x 2 + y 2 + z 2 )]. That is, p 2 , q 2 , r 2 , a 2 and b 2 in the formula (2) are appropriately adjusted so that the abundance ratio of T3 silicon atoms is in the range of 0 to 0.3.
  • the oligomer C that may be contained in the condensed silicone resin that is the raw material of the condensed silicone resin cured product contained in the cured product of the present embodiment is a silicone resin having an organopolysiloxane structure represented by the formula (2).
  • the ratio of the content of T3 silicon atom to the total content of T1 silicon atom, T2 silicon atom and T3 silicon atom: [y 2 / (x 2 + y 2 + z 2 )] is 0 to 0.3
  • the oligomer whose weight average molecular weight of polystyrene conversion is less than 1500 is preferable.
  • the abundance ratio of T3 silicon atoms is within this range, the abundance ratio of T2 silicon atoms: [x 2 / (x 2 + y 2 + z 2 )] and the abundance ratio of T1 silicon atoms: [z 2 / (x 2 + y 2 + z 2 )] is not particularly limited.
  • the oligomer C [y 2 / (x 2 + y 2 + z 2 )] is preferably in the range of 0 to 0.25, more preferably in the range of 0.05 to 0.2.
  • Oligomer C has a relatively low abundance ratio of T3 silicon atoms, and therefore has a small branched chain structure and contains many linear molecules and cyclic molecules.
  • the oligomer C may include only cyclic molecules, but preferably includes many linear molecules.
  • an abundance ratio of T1 silicon atom: [z 2 / (x 2 + y 2 + z 2 )] is preferably in the range of 0 to 0.80, preferably 0.30 to 0.80. Those within the range are more preferred, those within the range of 0.35 to 0.75 are still more preferred, and those within the range of 0.35 to 0.55 are particularly preferred.
  • the content of the oligomer C contained in the condensation type silicone resin is preferably 0.1% by mass to 20% by mass with respect to the total content of all silicone resins contained in the condensation type silicone resin.
  • the content is more preferably from 15% by mass to 15% by mass, and further preferably from 0.5% to 10% by mass.
  • the content of the oligomer C contained in the condensation type silicone resin is preferably 0.1% by mass to 20% by mass with respect to the content of the silicone resin A contained in the condensation type silicone resin. It is more preferably 3% by mass to 10% by mass, and further preferably 0.5% by mass to 5% by mass.
  • the weight average molecular weight of the oligomer C in terms of polystyrene is less than 1500.
  • the polystyrene-converted weight average molecular weight of the oligomer C measured by GPC may be less than 1000.
  • the number of T1 silicon atoms, T2 silicon atoms, and T3 silicon atoms in one molecule of oligomer C is appropriately adjusted so that the resin having an organopolysiloxane structure represented by formula (2) has a desired molecular weight. .
  • the sum of the number of T1 silicon atoms, the number of T2 silicon atoms and the number of T3 silicon atoms in the oligomer C1 molecule is preferably 2 or more.
  • the oligomer C can be synthesized using an organosilicon compound having a functional group capable of generating a siloxane bond corresponding to each structural unit described above constituting the oligomer C as a starting material.
  • the “functional group capable of generating a siloxane bond” has the same meaning as described above.
  • Examples of the organosilicon compound corresponding to the structural unit represented by the above formula (A3) include organotrihalosilane and organotrialkoxysilane.
  • the oligomer C can be synthesized by reacting such an organic silicon compound as a starting material at a ratio corresponding to the abundance ratio of each structural unit by a hydrolytic condensation method.
  • an organosilicon compound corresponding to the structural unit represented by the above formula (A1) and an organosilicon compound corresponding to the structural unit represented by the above formula (A1 ′) are mixed. Will be.
  • these organosilicon compounds are polymerized by hydrolytic condensation reaction, these organosilicon compounds are bonded to the terminals of the polymerization reaction to stop the polymerization reaction.
  • the condensation type silicone resin that is a raw material of the condensation type silicone resin cured product contained in the cured product of the present embodiment preferably includes the silicone resin A and an oligomer component.
  • oligomer component oligomer B or oligomer C is preferable.
  • the condensation-type silicone resin that is a raw material of the condensation-type silicone resin cured product contained in the cured product of the present embodiment preferably includes silicone resin A and oligomer B, and silicone resin A, oligomer B, and oligomer C. And more preferably.
  • Examples of other oligomer components include a silicone resin containing a structural unit represented by the above formula (A1) and a structural unit represented by the above formula (A2).
  • the silicone resin may contain a D body.
  • the condensation type silicone resin which is a raw material of the condensation type silicone resin cured product contained in the cured product of the present embodiment has a high content of T3 body. Therefore, a solvent may be added to the condensation-type silicone resin for the purpose of improving handling properties.
  • a composition containing a condensation type silicone resin and a solvent is referred to as a “silicone resin composition”.
  • the solvent is not particularly limited as long as the silicone resin can be dissolved.
  • the solvent for example, two or more solvents having different boiling points (hereinafter referred to as solvent P and solvent Q) can be used.
  • an organic solvent having a boiling point of less than 100 ° C. is preferable.
  • ketone solvents such as acetone and methyl ethyl ketone
  • alcohol solvents such as methanol, ethanol, isopropyl alcohol, and normal propyl alcohol
  • hydrocarbon solvents such as hexane, cyclohexane, heptane, and benzene
  • An acetate solvent such as diethyl ether or tetrahydrofuran is preferred.
  • alcohol solvents such as methanol, ethanol, isopropyl alcohol, and normal propyl alcohol are more preferable.
  • Solvent Q is preferably an organic solvent having a boiling point of 100 ° C. or higher. Specifically, a glycol ether solvent and a glycol ester solvent are preferable.
  • glycol ether solvent examples include ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monoisopropyl ether, ethylene glycol monobutyl ether, ethylene glycol monohexyl ether, ethylene glycol monoethyl hexyl ether, ethylene glycol monophenyl ether, ethylene Glycol monobenzyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monoisopropyl ether, diethylene glycol monobutyl ether, diethylene glycol monohexyl ether, diethylene glycol monoethyl hexyl ether, diethylene glycol monophenyl ether, di Tylene glycol monobenzyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monoisopropyl ether, propylene glycol monobutyl ether, propylene glyco
  • glycol ester solvent examples include ethylene glycol monoethyl ether acetate, ethylene glycol monoisopropyl ether acetate, ethylene glycol monobutyl ether acetate, ethylene glycol monohexyl ether acetate, ethylene glycol monoethyl hexyl ether acetate, ethylene glycol monophenyl ether acetate, And ethylene glycol monobenzyl ether acetate.
  • ethylene glycol monobutyl ether diethylene glycol monobutyl ether, dipropylene glycol monomethyl ether, and ethylene glycol monobutyl ether acetate are more preferable.
  • silicone resin composition A silicone resin composition is obtained by mixing a condensation-type silicone resin, which is a raw material of the condensation-type silicone resin cured product contained in the cured product of this embodiment, and a solvent.
  • the silicone resin composition may contain a curing catalyst, a filler, and other components described below.
  • the viscosity of the silicone resin composition is usually 100 to 500000 mPa ⁇ s, preferably 300 to 20000 mPa ⁇ s, more preferably 400 to 15000 mPa ⁇ s, and more preferably 500 to 10000 mPa ⁇ s at 25 ° C. More preferably. If the viscosity of the silicone resin composition is within the above range, when the wavelength conversion material is further included, the mixing property of the condensation type silicone resin and the wavelength conversion material is good, and the precipitation of the wavelength conversion material is suppressed. Is done.
  • the mixing method of the silicone resin A, the oligomer B, and the oligomer C is not particularly limited, and any known method that is performed when two or more kinds of polymers are mixed may be used.
  • the silicone resin A, the oligomer B, the oligomer C, and other components as necessary may be dissolved in an organic solvent, and then the obtained solution may be mixed.
  • the silicone resin can be mixed more uniformly and the stability of the prepared silicone resin composition can be improved, after dissolving the silicone resin in an organic solvent having high volatility and solubility, It is preferable to substitute the organic solvent with another solvent.
  • the silicone resin A is heated to a temperature near the boiling point of the solvent P and stirred to thereby form the silicone.
  • Resin A is dissolved in solvent P.
  • oligomer B, oligomer C, and other components as needed to the obtained solution oligomer B, oligomer C, and other components as needed in the same manner as above.
  • the ingredients are dissolved in solvent P.
  • a solvent having a lower volatility than the solvent P (for example, the solvent Q described above) is added to the obtained solution, and then the solvent P is distilled by heating until the concentration of the solvent P becomes 1% or less.
  • solvent Q can be performed. In order to efficiently perform solvent replacement, heat distillation may be performed under reduced pressure.
  • Residual solvent, water, and the like that can be contained in each of the silicone resin A, the oligomer B, the oligomer C, and other components can be removed by performing solvent substitution. Therefore, the stability of the silicone resin composition can be improved by solvent replacement.
  • the non-uniform domain size wrinkles of the cured product can be controlled.
  • the rate of temperature increase from 80 ° C to 125 ° C is preferably 4 ° C / min or more, and 4.5 ° C / min or more. More preferred.
  • the temperature rise rate in this temperature range the molecular motion at the initial stage of curing of the condensation-type silicone resin is activated, and the condensation reaction occurs simultaneously at various places, so the distance between the regions where the crosslinking points are dense is increased. Become.
  • the condensation type silicone resin being cured may be in a gel state and have fluidity when the temperature reaches 120 ° C. or higher. . In such a state, the domain formation reaction proceeds more effectively, and a large domain is formed early. The large domains formed in this way are immobilized by a late curing reaction.
  • the temperature rising rate from 125 ° C. to 180 ° C. is preferably 0.1 ° C. to 7 ° C./min.
  • the heterogeneous domain size can be controlled by the temperature increase rate in this temperature range. For example, when the rate of temperature increase is 0.1 ° C./min, a reaction in which a region having a denser cross-linking point is formed is likely to occur, so that the heterogeneous domain size can be set to 100 mm or more. Further, for example, if the temperature rising rate is 5.5 ° C./min, the curing reaction is completed before the reaction for forming a region where the crosslinking points are denser is completed. It can be made less than 100 mm.
  • a cured product having a large heterogeneous domain size is in an energetically stabilized state, and has high hardness, high crack resistance, and high heat resistance.
  • a curing accelerator such as a phosphoric acid catalyst or a metal catalyst may be added to the silicone resin.
  • Examples of the curing catalyst include R 2 in the structural unit represented by the above formula (A1), the structural unit represented by the above formula (A1 ′), and the structural unit represented by the above formula (A2).
  • inorganic acids such as hydrochloric acid, sulfuric acid, nitric acid and phosphoric acid
  • organic acids such as formic acid, acetic acid, succinic acid, citric acid, propionic acid, butyric acid, lactic acid and succinic acid are used to promote the hydrolysis and condensation reaction.
  • inorganic acids such as hydrochloric acid, sulfuric acid, nitric acid and phosphoric acid
  • organic acids such as formic acid, acetic acid, succinic acid, citric acid, propionic acid, butyric acid, lactic acid and succinic acid are used to promote the hydrolysis and condensation reaction.
  • the curing catalyst not only an acidic compound but also an alkaline compound can be used. Specifically, ammonium hydroxide, tetramethylammonium hydroxide, tetraethylammonium hydroxide, or the like can be used as a curing catalyst.
  • An organometallic compound catalyst can also be used as the curing catalyst.
  • an organometallic compound catalyst containing aluminum, zirconium, tin, titanium, or zinc can be used as the curing catalyst.
  • organometallic compound catalyst containing aluminum examples include aluminum triacetyl acetate and aluminum triisopropoxide.
  • organometallic compound catalyst containing zirconium examples include zirconium tetraacetylacetonate, zirconium tributoxyacetylacetonate, zirconium dibutoxydiacetylacetonate, zirconium tetranormal propoxide, zirconium tetraisopropoxide, zirconium tetranormal butoxide, Examples include zirconium acylate and zirconium tributoxy systemate.
  • organometallic compound catalyst containing tin examples include tetrabutyltin, monobutyltin trichloride, dibutyltin dichloride, dibutyltin oxide, tetraoctyltin, dioctyltin dichloride, dioctyltin oxide, tetramethyltin, dibutyltin laurate, dioctyltin laurate Rate, bis (2-ethylhexanoate) tin, bis (neodecanoate) tin, di-n-butylbis (ethylhexylmalate) tin, di-normal butylbis (2,4-pentanedionate) tin, di-normal Examples thereof include butyl butoxychlorotin, di-normal butyl diacetoxy tin, di-normal butyl dilaurate tin, and dimethyl dineodecanoate
  • titanium-containing organometallic compound catalyst examples include titanium tetraisopropoxide, titanium tetranormal butoxide, butyl titanate dimer, tetraoctyl titanate, titanium acetylacetonate, titanium octylene glycolate, and titanium ethyl acetoacetate.
  • organometallic compound catalyst containing zinc examples include zinc triacetylacetonate.
  • phosphoric acid ester or phosphoric acid is preferable, and phosphoric acid is more preferable.
  • the curing catalyst In order to add the curing catalyst to the silicone resin at a predetermined concentration, it is preferable to dilute the curing catalyst in water, an organic solvent, a silicone-based monomer, an alkoxysilane oligomer, etc., and then add it to the silicone resin.
  • the content of the curing catalyst can be appropriately adjusted in consideration of the temperature and time of the curing reaction of the silicone resin, the type of catalyst, and the like.
  • the content of the curing catalyst is preferably 0.01 parts by mass or more and 10 parts by mass or less, and more preferably 0.01 parts by mass or more and 5 parts by mass or less with respect to 100 parts by mass of the condensation type silicone resin.
  • 0.1 part by mass or more and 1 part by mass or less are particularly preferable.
  • the curing catalyst may be added to the silicone resin in advance, or may be added to the silicone resin immediately before the curing reaction of the silicone resin is performed.
  • a filler may be dispersed in the condensed silicone resin cured product.
  • a wavelength conversion material is preferable.
  • wavelength conversion materials include phosphors and quantum dots.
  • the phosphor include a red phosphor emitting fluorescence in the wavelength range of 570 nm to 700 nm, a green phosphor emitting fluorescence in the range of 490 nm to 570 nm, and a blue phosphor emitting fluorescence in the range of 420 nm to 480 nm.
  • red phosphor examples include europium-activated alkaline earth silicon nitride phosphors composed of fractured particles having a red fracture surface and represented by (Mg, Ca, Sr, Ba) 2 Si 5 N 8 : Eu.
  • a europium-activated rare earth oxychalcogenide phosphor composed of grown particles having a substantially spherical shape as a regular crystal growth shape and represented by (Y, La, Gd, Lu) 2 O 2 S: Eu;
  • red phosphors include fluorescence containing oxynitride and / or oxysulfide containing at least one element selected from the group consisting of Ti, Zr, Hf, Nb, Ta, W and Mo, or both. And phosphors containing an oxynitride having an alpha sialon structure in which a part or all of the Al element is substituted with a Ga element.
  • red phosphors include Eu-activated oxysulfide phosphors such as (La, Y) 2 O 2 S: Eu; Eu such as Y (V, P) O 4 : Eu, Y 2 O 3 : Eu Activated oxide phosphor; (Ba, Sr, Ca, Mg) 2 SiO 4 : Eu, Mn, (Ba, Mg) 2 SiO 4 : Eu, Mn activated silicate phosphor such as Eu, Mn; (Ca Sr) Eu: Eu-activated sulfide phosphors such as Eu; YAlO 3 : Eu-activated aluminate phosphors such as Eu; LiY 9 (SiO 4 ) 6 O 2 : Eu, Ca 2 Y 8 (SiO 4 ) 6 O 2 : Eu, (Sr, Ba, Ca) 3 SiO 5 : Eu, Sr 2 BaSiO 5 : Eu-activated silicate phosphor such as Eu; (Y, Gd) 3 Al 5
  • Eu, Ce-activated nitride phosphors such as (Ca, Sr, Ba, Mg) 10 (PO 4 ) 6 (F, Cl, Br, OH): Eu, Mn-activated halophosphoric acid such as Eu, Mn Salt phosphor; ((Y, Lu, Gd, Tb) 1-x Sc x Ce y ) 2 (Ca, Mg) 1-r (Mg, Zn) 2+ r Si z-q Ge q O 12 + ⁇ , etc.
  • Examples include silicate phosphors.
  • red phosphors include red organic phosphors composed of rare earth element ion complexes having an anion such as ⁇ -diketonate, ⁇ -diketone, aromatic carboxylic acid and Bronsted acid as ligands, and perylene pigments (for example, Dibenzo ⁇ [f, f ′]-4,4 ′, 7,7′-tetraphenyl ⁇ diindeno [1,2,3-cd: 1 ′, 2 ′, 3′-lm] perylene), anthraquinone pigment, Lake pigments, azo pigments, quinacridone pigments, anthracene pigments, isoindoline pigments, isoindolinone pigments, phthalocyanine pigments, triphenylmethane basic dyes, indanthrone pigments, indophenol pigments, Examples thereof include cyanine pigments and dioxazine pigments.
  • perylene pigments for example, Dibenzo ⁇ [f, f
  • a red phosphor having a peak wavelength of fluorescence emission of 580 nm or more, preferably 590 nm or more and a peak wavelength of fluorescence emission of 620 nm or less, preferably 610 nm or less is suitable as an orange phosphor.
  • orange phosphors include (Sr, Ba) 3 SiO 5 : Eu, (Sr, Mg) 3 PO 4 ) 2 : Sn 2+ , and SrCaAlSiN 3 : Eu.
  • yellow phosphors include oxide-based, nitride-based, oxynitride-based, sulfide-based, and oxysulfide-based phosphors.
  • RE 3 M 5 O 12 Ce (where RE represents at least one element selected from the group consisting of Y, Tb, Gd, Lu and Sm, and M represents Al, Ga and Represents at least one element selected from the group consisting of Sc), M 2 3 M 3 2 M 4 3 O 12 : Ce (where M 2 represents a divalent metal element, and M 3 represents trivalent).
  • M 4 represents a tetravalent metal element garnet phosphor having a garnet structure represented by like; AE 2 M 5 O 4: Eu ( here, AE is, Ba, Sr , And at least one element selected from the group consisting of Ca, Mg and Zn, and M 5 represents at least one element selected from the group consisting of Si and Ge.
  • Oxynitride-based phosphor obtained by substituting a part of oxygen atoms are formed elemental nitrogen atom; AEAlSiN 3: Ce (here, AE is at least 1 selected from the group consisting of Ba, Sr, Ca, Mg and Zn And phosphors activated with Ce such as a nitride-based phosphor having a CaAlSiN 3 structure.
  • yellow phosphors include sulfide phosphors such as CaGa 2 S 4 : Eu (Ca, Sr) Ga 2 S 4 : Eu, (Ca, Sr) (Ga, Al) 2 S 4 : Eu; Examples include phosphors activated with Eu such as oxynitride phosphors having a SiAlON structure such as x (Si, Al) 12 (O, N) 16 : Eu.
  • Green phosphor for example, a europium-activated alkaline earth silicon oxynitride fluorescent material composed of fractured particles having a fracture surface and represented by (Mg, Ca, Sr, Ba) Si 2 O 2 N 2 : Eu Body: Europium-activated alkaline earth silicate phosphors composed of fractured particles having a fractured surface and represented by (Ba, Ca, Sr, Mg) 2 SiO 4 : Eu.
  • green phosphors include Eu-activated aluminate phosphors such as Sr 4 Al 14 O 25 : Eu, (Ba, Sr, Ca) Al 2 O 4 : Eu; (Sr, Ba) Al 2 Si 2 O 8 : Eu, (Ba, Mg) 2 SiO 4 : Eu, (Ba, Sr, Ca, Mg) 2 SiO 4 : Eu, (Ba, Sr, Ca) 2 (Mg, Zn) Si 2 O 7 : Eu Eu activated silicate phosphor such as Y 2 SiO 5 : Ce, Tb activated silicate phosphor such as Ce, Tb; Eu activated such as Sr 2 P 2 O 7 —Sr 2 B 2 O 5 : Eu Borate phosphate phosphor; Sr 2 Si 3 O 8 -2SrCl 2 : Eu-activated halosilicate phosphor such as Eu; Zn 2 SiO 4 : Mn-activated silicate phosphor such as Mn; CeMgAl 11 O
  • green phosphors include pyridine-phthalimide condensed derivatives, benzoxazinone-based, quinazolinone-based, coumarin-based, quinophthalone-based, naltalimide-based fluorescent dyes; terbium complexes having hexyl salicylate as a ligand, etc. And organic phosphors.
  • a europium-activated barium magnesium aluminate phosphor composed of grown particles having a substantially hexagonal shape as a regular crystal growth shape and represented by BaMgAl 10 O 17 : Eu; a regular crystal growth shape A europium-activated calcium halophosphate phosphor expressed by (Ca, Sr, Ba) 5 (PO 4 ) 3 Cl: Eu; a substantially cubic shape as a regular crystal growth shape A europium-activated alkaline earth chloroborate-based phosphor represented by (Ca, Sr, Ba) 2 B 5 O 9 Cl: Eu; a fractured particle having a fracture surface (Sr , Ca, Ba) Al 2 O 4: Eu or (Sr, Ca, Ba) 4 Al 1 4O 25: Eu Europium-activated alkaline earth aluminate phosphors represented the like.
  • blue phosphors include Sn-activated phosphate phosphors such as Sr 2 P 2 O 7 : Sn; Sr 4 Al 14 O 25 : Eu, BaMgAl 10 O 17 : Eu, BaAl 8 O 13 : Eu, etc.
  • Eu-activated aluminate phosphors Ce-activated thiogallate phosphors such as SrGa 2 S 4 : Ce, CaGa 2 S 4 : Ce; (Ba, Sr, Ca) MgAl 10 O 17 : Eu, BaMgAl 10 O 17 : Eu-activated aluminate phosphor such as Eu, Tb, Sm; (Ba, Sr, Ca) MgAl 10 O 17 : Eu, Mn-activated aluminate phosphor such as Eu, Mn; (Sr, Ca, Ba, Mg) 10 (PO 4 ) 6 Cl 2 : Eu, (Ba, Sr, Ca) 5 (PO 4 ) 3 (Cl, F, Br, OH): Eu-activated halophosphoric acid such as Eu, Mn, Sb Salt phosphor; B Al 2 Si 2 O 8: Eu , (Sr, Ba) 3 MgSi 2 O 8: Eu -activated silicate phosphors
  • blue phosphors examples include fluorescent dyes such as naphthalic acid imide compounds, benzoxazole compounds, styryl compounds, coumarin compounds, pyrarizone compounds, triazole compounds, and organic phosphors such as thulium complexes. .
  • These phosphors may be used alone or in combination of two or more.
  • the content of the wavelength conversion material is usually 20% by mass to 95% by mass and 40% by mass to 95% by mass with respect to the total content of the condensed silicone resin cured product and the wavelength conversion material. It is preferably 50% by mass or more and 95% by mass or less, and more preferably 60% by mass or more and 95% by mass or less.
  • the cured product of the present embodiment may contain a silicone filler.
  • the silicone filler include a silicone resin filler and a silicone rubber filler.
  • the cured product of this embodiment may contain additives such as inorganic particles and a silane coupling agent in addition to the condensed silicone resin cured product and the filler.
  • Inorganic particles can scatter light in the hardened
  • inorganic particles include oxides such as silicon, titanium, zirconia, aluminum, iron, and zinc, carbon black, barium titanate, calcium silicate, and calcium carbonate, and oxidation of silicon, titanium, zirconia, aluminum, and the like. Things are preferred.
  • Examples of the shape of the inorganic particles include a substantially spherical shape, a plate shape, a columnar shape, a needle shape, a whisker shape, and a fiber shape, and a substantially uniform composition is obtained, so that a substantially spherical shape is preferable.
  • the inorganic particles contained in the cured product of the present embodiment may be only one type or two or more types, but are preferably two or more types of inorganic particles having different particle sizes.
  • the cured product of the present embodiment more preferably includes inorganic particles having an average primary particle diameter of 100 nm to 500 nm and inorganic particles having an average primary particle diameter of less than 100 nm. preferable.
  • the average particle diameter of the primary particles of the inorganic particles can be determined by, for example, an image imaging method in which the particles are directly observed with an electron microscope or the like. Specifically, first, a liquid in which inorganic particles to be measured are dispersed in an arbitrary solvent is prepared, and the obtained dispersion liquid is dropped on a slide glass or the like and dried. Alternatively, inorganic particles may be directly sprayed on the adhesive surface of the adhesive tape to produce inorganic particles attached thereto. Next, the average particle diameter of the primary particles of the inorganic particles is obtained by directly observing the particles with a scanning electron microscope (SEM) or a transmission electron microscope (TEM) and determining the size of the inorganic particles from the obtained shape. It is done.
  • SEM scanning electron microscope
  • TEM transmission electron microscope
  • the content of the inorganic particles is preferably 0.01 parts by mass or more and 100 parts by mass or less, and preferably 0.1 parts by mass or more and 50 parts by mass or less with respect to 100 parts by mass of the cured silicone resin product. More preferred.
  • silane coupling agent examples include at least one group selected from the group consisting of a vinyl group, an epoxy group, a styryl group, a methacryl group, an acrylic group, an amino group, a ureido group, a mercapto group, a sulfide group, and an isocyanate group.
  • a coupling agent having an epoxy group or a mercapto group is preferable.
  • silane coupling agent examples include 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltrimethoxysilane, and 3-glycidoxy.
  • examples thereof include propylmethyldiethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-mercaptopropylmethyldimethoxysilane, and 3-mercaptopropyltrimethoxysilane.
  • a composition containing a silicone resin contains a silane coupling agent
  • the silicon atom contained in the silane coupling agent is also detected as a 29 Si-NMR signal.
  • a composition containing a silicone resin is used.
  • the signal of the silane coupling agent shall be included in the calculation of the signal area.
  • the content of the silane coupling agent is preferably 0.0001 parts by mass or more and 1.0 parts by mass or less, and 0.001 parts by mass or more and 0.1 parts by mass with respect to 100 parts by mass of the total content of the silicone resin. It is more preferable that the amount is not more than parts.
  • cured material of this embodiment may also contain additives other than the above-mentioned material.
  • additives other than the above-described materials include dispersants, leveling agents, and antifoaming agents.
  • the condensed silicone resin cured product contained in the cured product of the present embodiment preferably includes a structural unit represented by the above formula (A3). Further, the condensed silicone resin cured product is selected from the group consisting of the structural unit represented by the above formula (A1), the structural unit represented by the above formula (A1 ′), and the structural unit represented by the above formula (A2). More preferably, it further contains one or more selected structural units.
  • the condensed silicone resin cured product contained in the cured product of the present embodiment is represented by the above formula (C1), the above formula (C1 ′), the above formula (C2), the above formula (C3), or the above formula (C4). Further structural units may be included.
  • the content of the T3 body is 50 mol% or more with respect to the total content of all structural units of the condensed silicone resin cured product.
  • the content of T3 silicon atoms is preferably 50 mol% or more with respect to the total content of all silicon atoms of the condensed silicone resin cured product.
  • the content of T3 silicon atoms is more preferably 60 mol% or more, further preferably 70 mol% or more, with respect to the total content of all silicon atoms of the condensed silicone resin cured product, More preferably, it is 75 mol% or more.
  • a cured product having a non-uniform domain size of 50 mm or more When a cured product having a non-uniform domain size of 50 mm or more is stressed, the stress can be dispersed throughout the cured product. On the other hand, a cured product having a non-uniform domain size of less than 50 mm has a uniform distribution of T3 silicon atoms. Therefore, when stress is applied, the stress cannot be dispersed throughout the cured product, and cracks are easily generated.
  • a cured product having a non-uniform domain size of 50 mm or more has both high hardness and high crack resistance. For example, even when continuously heated at 250 ° C., the stress caused by heating is dispersed throughout the cured product. Can be made.
  • a cured product having both high hardness, high crack resistance, and high heat resistance can be provided.
  • FIG. 2 is a schematic diagram showing the wavelength conversion sheet of the present embodiment.
  • the wavelength conversion sheet 30 is formed of a cured product that includes a condensed silicone resin cured product 40 and a filler 50 that is a wavelength conversion material dispersed in the condensed silicone resin cured product 40.
  • Such a wavelength conversion sheet 30 is formed into a thin plate shape using the above-described cured product of the present embodiment as a forming material.
  • the wavelength conversion sheet 30 may include a base material on one surface.
  • a base material what is necessary is just to select suitably by the use of a wavelength conversion sheet
  • metal base materials such as aluminum
  • Transparent base materials such as quartz and sapphire, are mentioned.
  • the wavelength conversion sheet of the present embodiment can be used for wavelength conversion in LEDs, solar cells, semiconductor lasers, photodiodes, CCDs, CMOSs, and the like.
  • the wavelength conversion sheet of this embodiment is excellent in heat resistance, it can be suitably used for a light emitting part of a semiconductor laser that is expected to be used at high temperatures.
  • the wavelength conversion sheet of this embodiment may contain the inorganic particles described above.
  • the wavelength conversion material can be effectively excited by scattering light in the wavelength conversion sheet. Moreover, it can suppress that a wavelength conversion material settles in the composition containing a silicone resin in the manufacture stage of a wavelength conversion sheet.
  • the thickness (film thickness) of the wavelength conversion sheet is preferably 10 ⁇ m or more.
  • the thickness of the wavelength conversion sheet is preferably 1 mm or less, more preferably 500 ⁇ m or less, and even more preferably 200 ⁇ m or less from the viewpoint of enhancing the optical properties and heat resistance of the wavelength conversion sheet.
  • the thickness of the wavelength conversion sheet is 1 mm or less, light absorption and light scattering by the silicone resin can be reduced.
  • the film thickness of the wavelength conversion sheet can be determined, for example, by measuring the film thickness at a plurality of locations of the wavelength conversion sheet using a micrometer and calculating the average value.
  • the plurality of locations may include a total of five locations including one central portion of the wavelength conversion sheet and four corner portions of the wavelength conversion sheet.
  • the wavelength conversion sheet 30 may be formed on a support base material.
  • a support base material a base material using a known metal, film, glass, ceramic, paper, or the like as a forming material can be used.
  • the material for forming the supporting substrate include transparent inorganic oxide glasses such as quartz glass, borosilicate glass, and sapphire; metal plates and foils such as aluminum (including aluminum alloys), zinc, copper, and iron; cellulose acetate Polyethylene terephthalate (PET), polyethylene, polyester, polyamide, polyimide, polyphenylene sulfide, polystyrene, polypropylene, polycarbonate, polyvinyl acetal, aramid and other plastic films; paper laminated with the plastic; paper coated with the plastic; Examples include a paper on which the metal is laminated or vapor-deposited; and a plastic film on which the metal is laminated or vapor-deposited. Among these, inorganic oxide glass or a metal plate is preferable.
  • the thickness of the supporting substrate is preferably 30 ⁇ m or more, and more preferably 50 ⁇ m or more. When the thickness of the support substrate is 30 ⁇ m or more, the support substrate has sufficient strength to protect the shape of the wavelength conversion sheet.
  • the thickness of the supporting substrate is preferably 5000 ⁇ m or less, more preferably 3000 ⁇ m or less, from the viewpoint of economy.
  • a wavelength conversion material-containing silicone resin composition in which a wavelength conversion material is dispersed in the above-described silicone resin composition (condensation type silicone resin + solvent) is prepared.
  • the wavelength conversion material-containing silicone resin composition may contain additives such as inorganic particles and adhesion aids. .
  • a wavelength conversion material-containing silicone resin composition can be obtained by uniformly mixing and dispersing using a known stirring and kneading machine.
  • known stirring and kneading machines include a homogenizer, a self-revolving stirrer, a three-roller, a ball mill, a planetary ball mill, and a bead mill.
  • the wavelength conversion material-containing silicone resin composition may be defoamed under vacuum or reduced pressure as necessary.
  • the obtained wavelength conversion material-containing silicone resin composition is applied onto a supporting substrate.
  • coating of the wavelength conversion material containing silicone resin composition can be performed using a well-known coating device.
  • Known coating devices include, for example, reverse roll coaters, blade coaters, slit die coaters, direct gravure coaters, offset gravure coaters, reverse roll coaters, blade coaters, kiss coaters, natural roll coaters, air knife coaters, roll blade coaters, varistors. Examples include a bar roll blade coater, a two stream coater, a rod coater, a wire bar coater, an applicator, a dip coater, a curtain coater, a spin coater, and a knife coater. Among these, a slit die coater or an applicator is preferable because the film thickness of the obtained wavelength conversion sheet tends to be uniform.
  • the coating film formed on the support substrate is heated and cured to obtain a wavelength conversion sheet.
  • the coating film is heated using a natural convection oven, a blower oven, a vacuum oven, an inert oven, a hot plate, a hot press, an infrared heater, or the like.
  • a blower oven is preferable from the viewpoint of productivity.
  • Examples of the heating conditions for the coating film include a method of heating at 40 ° C. to 250 ° C. for 5 minutes to 100 hours.
  • the heating time is preferably 1 to 30 hours, more preferably 2 to 10 hours, still more preferably 3 to 8 hours. When the heating time is within this range, the solvent can be sufficiently removed and coloring during heating can be prevented.
  • the coating film After coating the wavelength conversion material-containing silicone resin composition on the support substrate, the coating film may be cured by leaving it in an atmosphere having a temperature of 250 ° C. or lower. The coating film may be cured by leaving it in the atmosphere. Further, when curing the coating film, in order to reduce the solvent and water present in the wavelength conversion material-containing silicone resin composition, and to control the condensation reaction rate between the silicone resin A and the silicone oligomer, for example, The coating film is formed in stages, such as at 40 to 60 ° C. for 5 to 30 minutes, then at 60 to 100 ° C. for 10 to 60 minutes, and then at 140 to 200 ° C. for 30 to 5 hours. It may be cured.
  • cured material which forms a wavelength conversion sheet can be enlarged by making the temperature increase rate from 80 degreeC to 125 degreeC into 4 degrees C / min or more.
  • the coating film may be in a gel state and have fluidity when the temperature reaches 120 ° C. or higher. In such a state, the domain formation reaction proceeds more effectively, and a large domain is formed at an early stage, which is preferable.
  • the temperature rising rate from 125 ° C. to 180 ° C. is preferably 0.1 ° C. to 7 ° C./min.
  • the nonuniform domain size of the cured product forming the wavelength conversion sheet can be controlled by the temperature increase rate in this temperature range. For example, when the rate of temperature rise is 0.1 ° C./min, a reaction in which a region having a denser crosslinking point is formed is likely to occur. Therefore, the non-uniform domain size ⁇ of the cured product forming the wavelength conversion sheet is 100 ⁇ . This can be done.
  • the non-uniform domain size wrinkle of the cured product can be 50 mm or more and less than 100 mm.
  • the non-uniform domain size of the cured product forming the wavelength conversion sheet becomes larger and the non-uniform domain size is fixed in a large state.
  • the wavelength conversion sheet of this embodiment uses the cured product of this embodiment as a forming material, it has high hardness, high crack resistance, and high heat resistance, and has high reliability.
  • FIG. 3 is a schematic view showing the light emitting device of this embodiment.
  • the light emitting device 100 includes the wavelength conversion sheet 30 and the light source 60 described above.
  • the light source 60 a known light source such as a mercury lamp or a semiconductor light emitting element can be used.
  • a light source that emits high-density energy such as a high-intensity LED or a semiconductor laser, or a light source that emits high-energy ultraviolet light having a wavelength of 400 nm or less and 300 nm or less is used.
  • the light source 60 includes a substrate 70 and a light emitting element 80 provided on one surface of the substrate 70.
  • the wavelength conversion sheet 30 is disposed at a position where the light L1 emitted from the light source 60 is incident.
  • the light L1 emitted from the light source 60 enters the wavelength conversion sheet 30.
  • the filler 50 which is a wavelength conversion material, converts the light L1 into converted light L2 having a wavelength different from that of the light L1.
  • the converted light L2 is emitted from the wavelength conversion sheet 30.
  • FIG. 4 is a cross-sectional view showing the structure of a light emitting device provided with the wavelength conversion sheet of the present embodiment.
  • the light emitting device 1000 includes a substrate 110, a semiconductor laser element (light source) 120, a light guide unit 130, a wavelength conversion sheet 140, and a reflecting mirror 150.
  • the wavelength conversion sheet 140 can be configured as described above.
  • the semiconductor laser element 120 is set on the substrate 110.
  • the light guide unit 130 receives the laser beam La emitted from the semiconductor laser element 120 and guides the laser beam La therein.
  • the semiconductor laser element 120 is optically connected to one end of the light guide unit 130, and the wavelength conversion sheet 140 is optically connected to the other end.
  • the light guide unit 130 has a weight shape in which the width gradually decreases from one end side to the other end side, and the laser light La emitted from the semiconductor laser element 120 is focused on the wavelength conversion sheet 140. .
  • the reflecting mirror 150 is a bowl-shaped member disposed around the wavelength conversion sheet 140, and a curved surface facing the wavelength conversion sheet 140 is a light reflecting surface.
  • the reflecting mirror 150 deflects the light emitted from the wavelength conversion sheet 140 toward the front of the apparatus (irradiation direction of the laser light La).
  • the laser light La irradiated on the wavelength conversion sheet 140 is converted into white light Lb by the wavelength conversion material contained in the wavelength conversion sheet 140 and output from the light emitting device 1000.
  • the light emitting device 1000 has one semiconductor laser element 120, but may have two or more.
  • FIG. 5 is a cross-sectional view showing a modification of the light emitting device. 5 and the following description, the same components as those described in FIG. 4 are denoted by the same reference numerals as those in FIG.
  • the light emitting device 1100 includes a plurality of substrates 110, a plurality of semiconductor laser elements (light sources) 120, a plurality of optical fibers 180, a light guide unit 130, a wavelength conversion sheet 140, a reflecting mirror 150, and a transparent support 190. have.
  • the optical fiber 180 receives the laser beam La emitted from the semiconductor laser element 120 and guides the laser beam La therein.
  • a semiconductor laser element 120 is optically connected to one end of each of the plurality of optical fibers 180.
  • the plurality of optical fibers 180 are bundled on the other end side, and are optically connected to the light guide unit 130 at the other end in a bundled state.
  • the light guide unit 130 receives the laser beam La emitted from the semiconductor laser element 120 therein, guides the laser beam La therein, and then emits the laser beam La toward the front of the apparatus.
  • the light guide unit 130 may have a function of condensing the laser light La emitted to the front of the apparatus.
  • the wavelength conversion sheet 140 is disposed so as to be separated from the light guide unit 130 and opposed to the light guide unit 130 while being supported by the transparent support 190.
  • the transparent support 190 is provided in front of the apparatus so as to cover the opening of the reflecting mirror 150.
  • the transparent support 190 is a member made of a transparent material that does not deteriorate due to heat generated during use of the apparatus, and for example, a glass plate can be used.
  • the laser light La irradiated on the wavelength conversion sheet 140 is converted into white light Lb by the wavelength conversion material contained in the wavelength conversion sheet 140 and is output from the light emitting device 1100.
  • the light source semiconductor laser element 120
  • the light emitting unit wavelength conversion sheet 140
  • the light emitting device having the above-described configuration includes the wavelength conversion sheet of the present embodiment having both high hardness, high crack resistance, and high heat resistance, the light emitting device has high reliability.
  • FIG. 6 is a cross-sectional view of the semiconductor light emitting device 200 of this embodiment.
  • the semiconductor light emitting device of this embodiment can also be used as a light source of the light emitting device in FIGS.
  • the semiconductor light emitting device 200 includes a substrate 210, a semiconductor light emitting element 220 disposed on the substrate, and a sealing member 230 that seals the semiconductor light emitting element 220.
  • the sealing member 230 uses the above-described cured product as a forming material.
  • the semiconductor light emitting element 220 is covered and sealed by the substrate 210 and the sealing member 230 and is isolated from the outside air.
  • the cured product constituting the sealing member 230 has both high hardness, high crack resistance, and high heat resistance as described above. Moreover, compared with the sealing part comprised with quartz glass, the transmittance
  • the cured product constituting the sealing member 230 includes a condensed silicone resin cured product as a constituent element, the cured product is hardly deteriorated by UV light. Therefore, the semiconductor light emitting device 200 having the sealing member 230 of the present embodiment is deteriorated even if the semiconductor light emitting element 220 that is a light source is a UV light source having an emission wavelength of 400 nm or less, and further 300 nm or less. It is difficult and reliable.
  • the semiconductor light emitting element 220 is not limited to one that emits UV light.
  • the emission wavelength of the semiconductor light emitting device 220 may be in the ultraviolet region (for example, 10 to 400 nm), in the visible light region (for example, more than 400 nm and less than 830 nm), or in the infrared region (for example, 830 nm to 1000 nm). It may be.
  • the sealing member having the above-described configuration uses the above-described cured product of the present embodiment as a forming material, the sealing member has high reliability. Moreover, since the semiconductor light-emitting device having the above configuration includes a sealing member that uses the cured product of the present embodiment described above as a forming material, the reliability is high.
  • the obtained sample was evaluated or measured by the following method.
  • ⁇ Crack resistance> 1.2 g of the silicone resin composition was added to an aluminum cup having a diameter of 4 cm and cured. About the obtained hardened
  • the average value of the load (bending fracture load, unit N) when the test piece was broken was defined as the bending strength.
  • a specimen having a bending strength of 20 MPa or more was considered good.
  • the average value of the fracture displacement (amount of deflection at break, unit mm) when the test piece was broken was defined as the strain at break.
  • a specimen having a strain at break of 3.0% or more was regarded as good.
  • ⁇ Heat resistance> A condensed silicone resin cured product (a disk shape having a diameter of 4 cm and a thickness of 500 ⁇ m) was heated in an oven at 250 ° C. About the hardened
  • a durometer (manufactured by Teclock Co., Ltd., model number GS-720G, type D) mounted on an automatic low-pressure loader for durometer (manufactured by Teclock Co., Ltd., model number GS-610) was used as a measuring device.
  • the durometer is a rubber / plastic hardness meter. Using this measuring apparatus, the Shore D hardness of the cured silicone resin was measured at a descending speed of 1 mm / second. Measurement was carried out at five locations, and the average value was calculated.
  • a cured product of a condensation type silicone resin having a Shore D hardness of 70 or more was considered good.
  • ⁇ Transmissivity> A cured product having a thickness of 500 ⁇ m was prepared. About the obtained hardened
  • a cured product having a transmittance of 85% or more was considered good.
  • Measuring device Small-angle X-ray scattering device (NanoSTAR, Bruker AXS Co., Ltd.)
  • Light source Rotating anti-cathode type X-ray generator of Cu target. Output 50kV, 100mA.
  • Two-dimensional detector Two-dimensional multi wire detector, Hi-STAR Degree of vacuum in the device: 40 Pa Analysis software: SAXS Ver. 4.1.29 (Bruker AXS)
  • the silicone cured product was pulverized using a freeze pulverizer.
  • a freeze pulverizer JFC-300 manufactured by Nippon Kogyo Co., Ltd. was used.
  • the silicone cured product was allowed to stand in liquid nitrogen for 10 minutes and then pulverized for 15 minutes.
  • FIG. 7 is an SEM photograph of the cured silicone after pulverization.
  • the swollen sample (sample) was irradiated with X-rays, and the small-angle X-ray scattering of the swollen sample was measured.
  • the length from the swollen sample to the detector was 106 cm, and the size of the direct beam stopper was 2 mm ⁇ .
  • the range of measurable scattering angle 2 ⁇ was 0.08 to 3 °.
  • the measurement result was analyzed using analysis software (SAXS Ver. 4.1.29) manufactured by Bruker AXS, and a small-angle X-ray small-angle scattering spectrum was obtained.
  • SAXS Ver. 4.1.29 analysis software manufactured by Bruker AXS
  • blank measurement using a quartz cell into which no swollen sample was added was performed in the same manner as described above.
  • the horizontal axis represents the wave number of X-rays used in the measurement of small-angle X-ray scattering of the swollen sample, and blank scattering from the measured scattering intensity measured by small-angle X-ray scattering of the swollen sample
  • a graph in which the measured values of small-angle X-ray scattering of the swollen sample were plotted with the scattering intensity obtained by subtracting the ordinate as the vertical axis was prepared.
  • the initial values of the fitting were 1 ⁇ ⁇ ⁇ 50 ⁇ and 1 ⁇ ⁇ ⁇ 250 ⁇ .
  • the alkoxysilicone oligomer corresponds to “oligomer B” in the present specification.
  • the low molecular silicone corresponds to “oligomer C” in the present specification.
  • the sum of the peak areas existing in a region having a weight average molecular weight of 7500 or more is 20% or more of the total peak area, and the peak existing in a region having a weight average molecular weight of 1000 or less.
  • the total area was 30% or more with respect to the total peak area.
  • the structural units contained in the silicone resin A are shown in Table 1.
  • Table 2 shows the structural units contained in the low molecular silicone.
  • the alkoxysilicone oligomer contained 95% or more of a resin composed of the structural units shown in Table 3.
  • the abundance ratio of the structural units of each condensation type silicone resin shown in Tables 1 to 3 is a value calculated based on the measurement result of solution NMR measured under the following conditions.
  • the obtained mixture is set in an evaporator, the temperature of the mixture is 85 ° C., and the degree of vacuum of the evaporator is 2.0 kPa. Then, the total concentration of propyl acetate and isopropyl alcohol in the mixture is 1% by mass or less. Until then, propyl acetate and isopropyl alcohol were distilled off.
  • the obtained silicone resin composition is heated stepwise from room temperature (25 ° C.) to 80 ° C., 125 ° C. and 180 ° C., held at 80 ° C. for 30 minutes, held at 125 ° C. for 30 minutes, and held at 180 ° C. for 60 minutes.
  • the step cure which hardens by doing was implemented. Specifically, the temperature was raised from room temperature (25 ° C.) to 80 ° C. at 1.4 ° C./min and held at 80 ° C. for 30 minutes. Subsequently, it heated up to 125 degreeC at 4.5 degreeC / min, and hold
  • the SAXS profile was created from the result of the SAXS measurement.
  • the SAXS profile is shown in FIG. In FIG. 8, the horizontal axis Q indicates the wave number (unit: ⁇ -1 ) of X-rays used in the measurement of small-angle X-ray scattering.
  • the vertical axis I indicates the scattering intensity obtained by subtracting blank scattering from the measured scattering intensity measured by small-angle X-ray scattering of the cured silicone resin cured product. From the created SAXS profile, it was confirmed that the heterogeneous domain size ⁇ was 74 ⁇ .
  • the obtained cured product was subjected to a heat resistance test at 250 ° C. for 100 hours. In the appearance of the cured product after the heat resistance test, wrinkles and cracks were not observed. Further, the transmittance of the cured product after the heat resistance test was 92%, and transparency was maintained.
  • Example 2 About the thermosetting conditions of the silicone resin composition in Example 1, the hardened
  • a SAXS profile was created from the results of SAXS measurement.
  • the created SAXS profile is shown in FIG. From the created SAXS profile, it was confirmed that the heterogeneous domain size ⁇ was 134 ⁇ .
  • the obtained cured product was subjected to a heat resistance test at 250 ° C. for 100 hours. In the appearance of the cured product after the heat resistance test, wrinkles and cracks were not observed. Further, the transmittance of the cured product after the heat resistance test was 92%, and transparency was maintained.
  • the abundance ratio of the structural unit of the silicone resin B shown in Table 4 is a value calculated based on the measurement result of the solution NMR described above.
  • Silicone resin B corresponds to “condensation type silicone resin” in the present specification.
  • the obtained silicone resin composition was thermally cured under the same conditions as the silicone resin composition in Example 2 to obtain a cured product.
  • the obtained cured product was subjected to a heat resistance test at 250 ° C. for 100 hours. In the appearance of the cured product after the heat resistance test, wrinkles and cracks were not observed. Further, the transmittance of the cured product after the heat resistance test was 92%, and transparency was maintained.
  • the obtained silicone composition composition was heated from room temperature to 150 ° C. and kept at 150 ° C. for 5 hours to be thermoset. Specifically, the temperature was raised from 25 ° C. (room temperature) to 40 ° C. at 3 ° C./min and held at 40 ° C. for 10 minutes. Next, the temperature was raised to 150 ° C. at 4 ° C./min and held at 150 ° C. for 5 hours. Then, the hardened
  • a SAXS profile was created from the results of SAXS measurement.
  • the created SAXS profile is shown in FIG. From the created SAXS profile, it was confirmed that the heterogeneous domain size ⁇ was 36 ⁇ .
  • the obtained cured product had cracks and had poor crack resistance.
  • the obtained cured product was not large enough to measure the bending strength, Shore D hardness and transmittance.
  • a cured product having both high hardness, high crack resistance and high heat resistance can be provided.
  • cured material as a forming material, a light-emitting device, the member for sealing, and a semiconductor light-emitting device can be provided.

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Abstract

L'invention concerne un produit durci présentant à la fois une dureté élevée, une forte résistance aux fissures et une forte résistance à la chaleur. Le produit durci contient un produit durci de résine de silicone de type condensation et satisfait à (1) et (2). (1) Dans un spectre de résonance magnétique nucléaire 29Si solide du produit durci de résine de silicone de type condensation, un pic attribuable à un atome de silicium de corps T (atome de silicium lié à trois atomes d'oxygène) est présent. (2) La taille de domaine non uniforme est supérieure ou égale à 50 Å (valeur obtenue par : imprégnation avec du tétrahydrofurane et provoquant ainsi un gonflement du produit durci de résine de silicone de type condensation ; tracé d'un graphique des valeurs de mesure de diffusion de rayons X à petit angle pour cet échantillon, avec le nombre d'onde de rayons X sur l'axe horizontal, et les intensités de diffusion comprenant les intensités de diffusion mesurées moins la diffusion à blanc sur l'axe vertical ; et ajustement du graphique avec la formule (A)). (Dans la formule, ξ représente la taille de maille de réseau, Ξ représente la taille de domaine non uniforme, I(q) représente l'intensité de diffusion, q représente le nombre d'onde, A et B représentent des constantes d'ajustement)
PCT/JP2017/031732 2016-09-07 2017-09-04 Produit durci, feuille de conversion de longueur d'onde, dispositif électroluminescent, élément d'étanchéité et dispositif électroluminescent semi-conducteur Ceased WO2018047760A1 (fr)

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CN201780054504.3A CN109689790A (zh) 2016-09-07 2017-09-04 固化物、波长转换片材、发光装置、密封用构件及半导体发光装置
KR1020197009931A KR20190053875A (ko) 2016-09-07 2017-09-04 경화물, 파장 변환 시트, 발광 장치, 밀봉용 부재 및 반도체 발광 장치

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109661418A (zh) * 2016-09-07 2019-04-19 住友化学株式会社 固化物、波长转换片材、发光装置、密封用构件及半导体发光装置
US20210376563A1 (en) * 2020-05-26 2021-12-02 Excelitas Canada, Inc. Semiconductor Side Emitting Laser Leadframe Package and Method of Producing Same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112072455B (zh) * 2020-09-16 2021-08-06 深圳市恒川激光技术有限公司 一种具有染料激光性质的固体激光工作物质的制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007119517A1 (fr) * 2006-03-31 2007-10-25 Jsr Corporation Composition de polysiloxane contenant des particules d'oxyde de metal et son procede de production
JP2010126596A (ja) * 2008-11-26 2010-06-10 Showa Denko Kk 液状硬化性樹脂組成物、ナノ粒子蛍光体を含む硬化樹脂の製造方法、発光装置の製造方法、発光装置及び照明装置
JP2010280908A (ja) * 2005-02-23 2010-12-16 Mitsubishi Chemicals Corp 半導体発光デバイス用部材及びその製造方法、並びにそれを用いた半導体発光デバイス
JP2015089898A (ja) * 2013-11-05 2015-05-11 信越化学工業株式会社 無機蛍光体粉末、無機蛍光体粉末を用いた硬化性樹脂組成物、波長変換部材および光半導体装置
WO2016017592A1 (fr) * 2014-07-28 2016-02-04 住友化学株式会社 Composition de matériau d'étanchéité à base de silicone et dispositif électroluminescent semi-conducteur

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5862066B2 (ja) 2011-06-16 2016-02-16 東レ株式会社 蛍光体含有シート、それを用いたｌｅｄ発光装置およびその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010280908A (ja) * 2005-02-23 2010-12-16 Mitsubishi Chemicals Corp 半導体発光デバイス用部材及びその製造方法、並びにそれを用いた半導体発光デバイス
WO2007119517A1 (fr) * 2006-03-31 2007-10-25 Jsr Corporation Composition de polysiloxane contenant des particules d'oxyde de metal et son procede de production
JP2010126596A (ja) * 2008-11-26 2010-06-10 Showa Denko Kk 液状硬化性樹脂組成物、ナノ粒子蛍光体を含む硬化樹脂の製造方法、発光装置の製造方法、発光装置及び照明装置
JP2015089898A (ja) * 2013-11-05 2015-05-11 信越化学工業株式会社 無機蛍光体粉末、無機蛍光体粉末を用いた硬化性樹脂組成物、波長変換部材および光半導体装置
WO2016017592A1 (fr) * 2014-07-28 2016-02-04 住友化学株式会社 Composition de matériau d'étanchéité à base de silicone et dispositif électroluminescent semi-conducteur

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109661418A (zh) * 2016-09-07 2019-04-19 住友化学株式会社 固化物、波长转换片材、发光装置、密封用构件及半导体发光装置
EP3511360A4 (fr) * 2016-09-07 2020-05-06 Sumitomo Chemical Co., Ltd. Produit durci, feuille de conversion de longueur d'onde, dispositif électroluminescent, élément d'étanchéité et dispositif électroluminescent à semi-conducteur
US20210376563A1 (en) * 2020-05-26 2021-12-02 Excelitas Canada, Inc. Semiconductor Side Emitting Laser Leadframe Package and Method of Producing Same

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