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WO2017137172A1 - Procédé de fabrication d'un module d'éclairage, module d'éclairage et utilisation d'un élément optique dans un module d'éclairage - Google Patents

Procédé de fabrication d'un module d'éclairage, module d'éclairage et utilisation d'un élément optique dans un module d'éclairage Download PDF

Info

Publication number
WO2017137172A1
WO2017137172A1 PCT/EP2017/050046 EP2017050046W WO2017137172A1 WO 2017137172 A1 WO2017137172 A1 WO 2017137172A1 EP 2017050046 W EP2017050046 W EP 2017050046W WO 2017137172 A1 WO2017137172 A1 WO 2017137172A1
Authority
WO
WIPO (PCT)
Prior art keywords
film
optical element
pieces
particles
punched out
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2017/050046
Other languages
German (de)
English (en)
Inventor
Martin Reiss
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Publication of WO2017137172A1 publication Critical patent/WO2017137172A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/062—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being plastics
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • Injection molding cured, especially at a temperature between 100 ° C and 250 ° C.
  • the optical element is cured at a temperature between 180 ° C and 220 ° C, in particular at a temperature of 200 ° C. Curing at a predetermined temperature is also referred to as thermal curing.
  • thermal curing As an alternative to the thermal
  • Pieces of film are punched out sequentially one after the other or as a series in which several pieces of film are located.
  • Such Ausstanzart can achieve a high yield of pupilsstanzenden optical elements of the film.
  • Particle size distribution from 2 ⁇ to 20 ⁇ . The smaller the particles, the greater the likelihood of agglomeration of the particles in the material.
  • Plasma surface treatment in particular the modification of the surface, by means of a suitable plasma, in particular by means of an oxidative plasma, take place.
  • a suitable plasma in particular by means of an oxidative plasma
  • one Plasma surface treatment may be an accumulation of dust on the surface of the film or the optical element
  • the housing can also enclose the circuit board 3.
  • the cavity are other electronic components 5 of the light module 1 at the
  • Illuminating module 1 will be discussed in more detail, in particular the method steps for the production of the optical element. 6
  • a material is first provided.
  • the material can be the first
  • Foil can also be punched out several pieces of film.
  • the film thickness determines the thickness of the punched out
  • FIGS. 2 and 3 show two variants of punching out a plurality of film pieces 8 from a film 9.
  • the diffusers were punched out after the first punching variant.
  • the film 9 is rectangular.
  • the yield is calculated as a percentage by the sum of the individual surfaces of the diffusers based on the film surface. As a framework, it was specified that the diffusers have a round cross-sectional geometry. In the
  • volume diffusers which are made of silicone, can withstand significantly higher irradiance levels in blue light or with UV radiation than diffusers made of a thermoplastic material, such as polycarbonates or PMMA. Silicone-based diffusers, for example, can withstand high irradiance levels in excess of 5,000 Im.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Optical Elements Other Than Lenses (AREA)

Abstract

L'invention concerne un procédé de fabrication d'un module d'éclairage (1), comprenant un moyen d'éclairage (2). Une première étape du procédé consiste à prendre un matériau. Ensuite un élément optique (6) est fabriqué à partir de ce matériau. Enfin, l'élément optique (6) est disposé à une distance prédéfinie du moyen d'éclairage (2) de manière telle qu'un rayonnement émis par le moyen d'éclairage (2) est dirigé sur l'élément optique (6). On utilise du silicone comme premier constituant du matériau.
PCT/EP2017/050046 2016-02-11 2017-01-03 Procédé de fabrication d'un module d'éclairage, module d'éclairage et utilisation d'un élément optique dans un module d'éclairage Ceased WO2017137172A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016202103.6 2016-02-11
DE102016202103.6A DE102016202103A1 (de) 2016-02-11 2016-02-11 Verfahren zum Herstellen eines Leuchtmoduls, Leuchtmodul sowie Verwendung eines Optikelements in einem Leuchtmodul

Publications (1)

Publication Number Publication Date
WO2017137172A1 true WO2017137172A1 (fr) 2017-08-17

Family

ID=57755304

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2017/050046 Ceased WO2017137172A1 (fr) 2016-02-11 2017-01-03 Procédé de fabrication d'un module d'éclairage, module d'éclairage et utilisation d'un élément optique dans un module d'éclairage

Country Status (2)

Country Link
DE (1) DE102016202103A1 (fr)
WO (1) WO2017137172A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007094209A1 (fr) * 2006-02-13 2007-08-23 Zeon Corporation Procede de fabrication de plaque plate moulee, et plaque plate moulee
WO2008027280A2 (fr) * 2006-08-28 2008-03-06 Dow Corning Corporation Dispositifs optiques et compositions de silicium et procédés de fabrication des dispositifs optiques
WO2008062638A1 (fr) * 2006-11-24 2008-05-29 Zeon Corporation Membre optique plat en plaque et procédé de fabrication d'un membre optique plat en plaque
EP2551929A1 (fr) * 2010-03-23 2013-01-30 Asahi Rubber Inc. Substrat réfléchissant en résine de silicone, procédé de fabrication associé, et composition de matériau de base utilisé dans un substrat réfléchissant
US20150176770A1 (en) * 2013-12-20 2015-06-25 Cree, Inc. Led lamp

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101028304B1 (ko) * 2009-10-15 2011-04-11 엘지이노텍 주식회사 발광 장치
DE102012104363A1 (de) * 2012-05-21 2013-11-21 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu dessen Herstellung
DE102012210742A1 (de) * 2012-06-25 2014-01-02 Osram Gmbh Flexible streifenförmige leiterplatte mit leds

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007094209A1 (fr) * 2006-02-13 2007-08-23 Zeon Corporation Procede de fabrication de plaque plate moulee, et plaque plate moulee
WO2008027280A2 (fr) * 2006-08-28 2008-03-06 Dow Corning Corporation Dispositifs optiques et compositions de silicium et procédés de fabrication des dispositifs optiques
WO2008062638A1 (fr) * 2006-11-24 2008-05-29 Zeon Corporation Membre optique plat en plaque et procédé de fabrication d'un membre optique plat en plaque
EP2551929A1 (fr) * 2010-03-23 2013-01-30 Asahi Rubber Inc. Substrat réfléchissant en résine de silicone, procédé de fabrication associé, et composition de matériau de base utilisé dans un substrat réfléchissant
US20150176770A1 (en) * 2013-12-20 2015-06-25 Cree, Inc. Led lamp

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DENNIS GATZEMEIER 2014: "Ultrafire Taschenlampen Diffusor Silicon", 20 December 2015 (2015-12-20), XP055348227, Retrieved from the Internet <URL:https://web.archive.org/web/20151220230719/http://www.gatzetec.de/Zubehoer/Taschenlampen-Zubehoer/Ultrafire-Taschenlampen-Diffusor-Silicon.html> [retrieved on 20170221] *

Also Published As

Publication number Publication date
DE102016202103A1 (de) 2017-08-17

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