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WO2017126793A1 - Sonde ultrasonore et procédé de fabrication de sonde ultrasonore - Google Patents

Sonde ultrasonore et procédé de fabrication de sonde ultrasonore Download PDF

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Publication number
WO2017126793A1
WO2017126793A1 PCT/KR2016/013151 KR2016013151W WO2017126793A1 WO 2017126793 A1 WO2017126793 A1 WO 2017126793A1 KR 2016013151 W KR2016013151 W KR 2016013151W WO 2017126793 A1 WO2017126793 A1 WO 2017126793A1
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WO
WIPO (PCT)
Prior art keywords
piezoelectric
layer
forming
elements
cuff
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2016/013151
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English (en)
Korean (ko)
Inventor
고종선
고현필
민해기
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Samsung Medison Co Ltd
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Samsung Medison Co Ltd
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Filing date
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Publication of WO2017126793A1 publication Critical patent/WO2017126793A1/fr
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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure

Definitions

  • An ultrasonic probe and a method for manufacturing the ultrasonic probe are provided.
  • the ultrasound imaging apparatus is a device that irradiates ultrasound from a surface of an object toward a target area inside the object and receives reflected echo ultrasound to non-invasively obtain an image of a fault or blood flow of soft tissue.
  • Ultrasound imaging devices are compact, inexpensive, and can display internal diagnostic images in real time compared to other imaging devices such as X-rays, computerized tomography scanners, magnetic resonance images (MRIs), and nuclear medical diagnostics. There is an advantage that it can. In addition, there is a high safety advantage because there is no risk of radiation exposure. Therefore, it is widely used for diagnosis of gynecology, heart, abdomen, urology.
  • the ultrasound imaging apparatus includes a probe for transmitting ultrasound to the object to receive an ultrasound image of the object and receiving echo ultrasound reflected from the object.
  • the ultrasound imaging apparatus is a device that irradiates ultrasound from a surface of an object toward a target area inside the object and receives reflected echo ultrasound to non-invasively obtain an image of a fault or blood flow of soft tissue.
  • Ultrasound imaging devices are compact, inexpensive, and can display internal diagnostic images in real time compared to other imaging devices such as X-rays, computerized tomography scanners, magnetic resonance images (MRIs), and nuclear medical diagnostics. There is an advantage that it can. In addition, there is a high safety advantage because there is no risk of radiation exposure. Therefore, it is widely used for diagnosis of gynecology, heart, abdomen, urology.
  • the ultrasound imaging apparatus includes a probe for transmitting ultrasound to the object to receive an ultrasound image of the object and receiving echo ultrasound reflected from the object.
  • an ultrasonic probe and a method of manufacturing the ultrasonic probe are provided.
  • the ultrasonic probe includes a plurality of piezoelectric bodies generating ultrasonic waves, at least one cuff formed at different intervals between the plurality of piezoelectric bodies, wherein the plurality of piezoelectric bodies include a single or a plurality of elements, and at least one of the plurality of piezoelectric bodies.
  • the two may be different in width from each other.
  • the plurality of piezoelectric elements may be stacked in a single layer or multiple layers.
  • the single or plurality of elements may have the same or different aspect ratios depending on the ratio of thickness and width.
  • the cuff may be formed at different intervals between the plurality of piezoelectric bodies, and the depth of the cuff may be adjusted.
  • the ultrasonic probe may further include a matching layer that reduces a difference in acoustic impedance between the plurality of piezoelectric bodies and the object.
  • the matching layer may include at least one cuff formed at different intervals in the matching layer.
  • the ultrasonic probe may further include a sound absorbing layer for absorbing the ultrasonic waves generated from the plurality of piezoelectric elements and traveling backward.
  • the ultrasonic probe may further include an enhanced layer positioned between the plurality of piezoelectric bodies and the sound absorbing layer to reflect the ultrasonic waves.
  • the reflective layer may include at least one cuff formed at different intervals in the reflective layer.
  • the ultrasonic probe may further include a lens layer positioned on the matching layer and focusing the ultrasonic waves traveling forward of the plurality of piezoelectric bodies to a specific point.
  • a method of manufacturing an ultrasonic probe includes forming a plurality of piezoelectric bodies for generating ultrasonic waves, and forming at least one cuff at different intervals between the plurality of piezoelectric bodies, wherein forming the plurality of piezoelectric bodies is single or Forming a plurality of elements, wherein at least two of the plurality of piezoelectric may be formed to be different from each other in width.
  • the forming of the plurality of piezoelectric elements may include forming a single layer or a multilayer.
  • Forming the single or plurality of elements may include forming the same or different aspect ratios according to the ratio of thickness and width.
  • the forming of the cuff may include forming the cuff at different intervals between the plurality of piezoelectric bodies, and controlling the depth of the cuff.
  • the method of manufacturing the ultrasound probe may further include forming a matching layer to reduce a difference in acoustic impedance between the plurality of piezoelectric bodies and the object.
  • Forming the matching layer may include forming at least one of the cuffs at different intervals in the matching layer.
  • the method of manufacturing an ultrasonic probe may further include forming a sound absorbing layer that absorbs the ultrasonic waves generated from the plurality of piezoelectric elements and traveling backward.
  • the method of manufacturing the ultrasonic probe may further include forming an enhanced layer positioned between the plurality of piezoelectric bodies and the sound absorbing layer and reflecting the ultrasonic waves.
  • Forming the reflective layer can include forming at least one of the cuffs at different intervals within the reflective layer.
  • the method of manufacturing an ultrasound probe may further include forming a lens layer positioned on an upper portion of the matching layer and focusing the ultrasound waves traveling forward of the plurality of piezoelectric elements to a specific point.
  • the plurality of piezoelectric layers stacked in a single layer or multilayer structure of the same or different thickness include a single or a plurality of elements having the same or different widths in the cuffs formed at different intervals. . This has the effect that a single or multiple elements can have the same or different aspect ratios depending on the ratio of thickness and width.
  • the ultrasonic probe has the effect of having a wide frequency bandwidth with optimized vibration characteristics.
  • FIG. 1 is a perspective view of an ultrasound imaging apparatus.
  • FIG. 2 is an external view of an ultrasonic probe including a one-dimensional array transducer.
  • FIG 3 is an external view of an ultrasonic probe including a two-dimensional array transducer.
  • FIG. 4 is a block diagram of an ultrasound imaging apparatus.
  • 5 is a perspective view of the ultrasonic probe.
  • FIG. 6 is a side cross-sectional view of the transducer module in an elevation direction.
  • FIG. 7 is a cross-sectional side view of a transducer module including a single element and a cuff with different widths.
  • FIG 8 is another side cross-sectional view of the transducer module including a single element and a cuff having different widths.
  • FIG. 9 is another side cross-sectional view of the transducer module including a single element and a cuff having different widths.
  • FIG. 10 is a cross-sectional side view of a transducer module including a single element and cuff having the same width.
  • FIG. 11 is a side cross-sectional view of a transducer module including a plurality of elements and cuffs formed in a multilayer structure.
  • FIG. 12 is a cross-sectional side view of a transducer module including a plurality of elements and cuffs formed to have different thicknesses.
  • FIG. 13 is another side sectional view of a transducer module including a plurality of elements and cuffs formed to have different thicknesses.
  • FIG. 14 is another side cross-sectional view of a transducer module including a plurality of elements and cuffs formed to have different thicknesses.
  • 15 is a side cross-sectional view of a transducer module formed of a multilayer structure and including a plurality of elements and cuffs having different widths.
  • 16 is another side cross-sectional view of a transducer module formed of a multilayer structure and including a plurality of elements and cuffs having different widths.
  • 17 is another side cross-sectional view of a transducer module formed of a multilayer structure and including a plurality of elements and cuffs having different widths.
  • FIG. 1 is a perspective view of an ultrasound imaging apparatus.
  • the ultrasound imaging apparatus 10 transmits an ultrasound signal to an object, receives an echo ultrasound signal from the object, converts the ultrasound signal into an electrical signal, and generates an ultrasound image based on the ultrasound signal.
  • It includes a main body 200.
  • the main body 200 may be connected to the ultrasonic probe 100 through a wired communication network or a wireless communication network.
  • the main body 200 may be a workstation having a display 300 and an input device 400.
  • the ultrasonic probe 100 is provided in the housing h to irradiate ultrasonic waves to the object ob, receive echo ultrasonic waves reflected from the object ob, and convert the electrical signal and the ultrasonic wave into a transducer module 110. , Which is physically coupled to a female connector of the main body 200 to connect a male connector 130 to the main body 200 to transmit and receive a signal, and to connect the male connector 130 to the transducer module 110. Cable 120.
  • the object ob may be a living body of a human or animal, or an in vivo tissue such as blood vessels, bones, muscles, etc., but is not limited thereto. If the internal structure may be imaged by the ultrasound imaging apparatus 10, the subject can be (ob).
  • the ultrasonic probe 100 is connected to the main body 200 through a wireless communication network to receive various signals necessary for controlling the ultrasonic probe 100 or an analog signal corresponding to the echo ultrasonic signal received by the ultrasonic probe 100. Or digital signals.
  • a wireless communication network means a communication network that can send and receive signals wirelessly.
  • the echo ultrasound is ultrasound reflected from the object ob irradiated with ultrasound, and has various frequency bands or energy intensities for generating various ultrasound images according to a diagnosis mode.
  • the transducer module 110 may generate ultrasonic waves according to the applied AC power.
  • the transducer module 110 may receive AC power from an external power supply device or an internal power storage device, for example, a battery.
  • the vibrator of the transducer module 110 may generate ultrasonic waves by vibrating according to the supplied AC power.
  • Three directions perpendicular to the center of the transducer module 110 may be defined as an axis dirextion A, a lateral direction L, and an elevation direction E, respectively.
  • the direction in which the ultrasonic wave is irradiated is defined as the axial direction (A)
  • the direction in which the transducer module 110 forms heat is defined as the lateral direction (L)
  • the other direction perpendicular to) may be defined as the altitude direction (E).
  • the cable 120 is connected to the transducer module 110 at one end and the male connector 130 at the other end, thereby connecting the transducer module 110 and the male connector 130.
  • the male connector 130 may be connected to the other end of the cable 120 to be physically coupled to the female connector 201 of the main body 200.
  • the male connector 130 transmits the electrical signal generated by the transducer module 110 to the physically coupled female connector 201, or the control signal generated by the main body 200 from the female connector 201. Receive.
  • the ultrasonic probe 100 when the ultrasonic probe 100 is implemented as the wireless ultrasonic probe 100, the cable 120 and the male connector 130 may be omitted, and a separate wireless communication module included in the ultrasonic probe 100 (The ultrasonic probe 100 and the main body 200 may transmit and receive a signal through the bar, which is not necessarily limited to the shape of the ultrasonic probe 100 shown in FIG. 1.
  • the main body 200 may perform wireless communication with the ultrasonic probe 100 through at least one of a short range communication module and a mobile communication module.
  • the short range communication module refers to a module for short range communication within a predetermined distance.
  • short-range communication technologies include wireless LAN, Wi-Fi, Bluetooth, Zigbee, WFD (Wi-Fi Direct), UWB (Ultra wideband), and infrared communication (IrDA).
  • the mobile communication module may transmit / receive a radio signal with at least one of a base station, an external terminal, and a server on a mobile communication network.
  • the radio signal means a signal including various types of data. That is, the main body 200 may exchange signals including various types of data with the ultrasonic probe 100 through at least one of the base station and the server.
  • the main body 200 may exchange a signal including various types of data with the ultrasonic probe 100 via a base station on a mobile communication network such as 3G and 4G.
  • the main body 200 may exchange data with a hospital server or another medical device in the hospital connected through a PACS (Picture Archiving and Communication System).
  • the main body 200 may transmit and receive data according to the Digital Imaging and Communications in Medicine (DICOM) standard, and there is no limitation.
  • DICOM Digital Imaging and Communications in Medicine
  • the main body 200 may exchange data with the ultrasonic probe 100 through a wired communication network.
  • Wired communication network means a communication network that can send and receive signals by wire.
  • the main body 200 may exchange various signals with the ultrasonic probe 100 using a wired communication network such as a peripheral component interconnect (PCI), a PCI-express, a universal serial bus (USB), etc. It is not limited.
  • PCI peripheral component interconnect
  • PCI-express PCI-express
  • USB universal serial bus
  • the display 300 and the input unit 400 may be provided in the main body 200 of the ultrasound imaging apparatus 10.
  • the input unit 400 may receive not only setting information about the ultrasonic probe 100 but also various control commands from the user.
  • the setting information about the ultrasound probe 100 may include gain information, zoom information, focus information, time gain compensation information, and depth. Information, frequency information, power information, frame average information, dynamic range information, and the like.
  • the setting information about the ultrasonic probe 100 is not limited to one embodiment, and includes various information that can be set for capturing an ultrasound image.
  • the information is transmitted to the ultrasound probe 100 through a wireless communication network or a wired communication network, and the ultrasound probe 100 may be set according to the received information.
  • the main body 200 may receive various control commands such as a command for transmitting an ultrasound signal through the input unit 400, and transmit the received control commands to the ultrasound probe 100.
  • the input unit 400 may be implemented by a keyboard, a foot switch, or a foot pedal.
  • the keyboard may be implemented in hardware.
  • Such a keyboard may include at least one of a switch, a key, a joystick, and a trackball.
  • the keyboard may be implemented in software such as a graphical user interface. In this case, the keyboard may be displayed through the display 300.
  • the foot switch or the foot pedal may be provided under the main body 200, and the user may control the operation of the ultrasound imaging apparatus 10 by using the foot pedal.
  • the display 300 may be formed by various known methods, such as a cathode ray tube (CRT), a liquid crystal display (LCD), a light emitting diode (LED), a plasma display panel (PDP), an organic light emitting diode (OLED), or the like. It may be implemented, but not limited to.
  • CTR cathode ray tube
  • LCD liquid crystal display
  • LED light emitting diode
  • PDP plasma display panel
  • OLED organic light emitting diode
  • the display 300 may display an ultrasound image of a target area inside the object.
  • the ultrasound image displayed on the display 300 may be a 2D ultrasound image or a 3D stereoscopic ultrasound image, and various ultrasound images may be displayed according to an operation mode of the ultrasound imaging apparatus 10.
  • the display 300 may display not only menus or guidance items necessary for the ultrasound diagnosis but also information on the operation state of the ultrasound probe 100.
  • the ultrasound image may include an A-mode (A-mode) image, a B-mode (B-mode) image, and an M-mode (M-mode) image.
  • A-mode A-mode
  • B-mode B-mode
  • M-mode M-mode
  • C Color
  • D Doppler
  • the A-mode image described below refers to an ultrasound image indicating the magnitude of an ultrasound signal corresponding to the echo ultrasound signal
  • the B-mode image refers to an ultrasound image indicating the brightness of the ultrasound signal corresponding to the echo ultrasound signal.
  • the M-mode image refers to an ultrasound image representing the movement of the object over time at a specific location.
  • the D-mode image refers to an ultrasound image representing a moving object in a waveform form using the Doppler effect, and also refers to an ultrasound image representing a C-mode moving object in a color spectrum form.
  • the display 300 when the display 300 is implemented as a touch screen type, the display 300 may also perform a function of the input unit 400. That is, the main body 200 may receive various commands from the user through at least one of the display 300 and the input unit 400.
  • a voice recognition sensor may be provided in the main body 200 to receive a voice command from a user.
  • a voice command may be received from a user.
  • FIG. 2 is an external view of an ultrasonic probe including a one-dimensional array transducer
  • FIG. 3 is an external view of an ultrasonic probe including a two-dimensional array transducer.
  • the ultrasound probe 200 is a part that contacts the surface of the object, and may transmit and receive an ultrasound signal. Specifically, the ultrasound probe 200 transmits an ultrasound signal to a specific part inside the object according to the transmission signal received from the main body, and receives the echo ultrasound signal reflected from the specific part inside the object and transmits the ultrasound signal to the main body. can do.
  • the echo ultrasound signal may be an ultrasound signal which is a radio frequency (RF) signal reflected from the object, but is not limited thereto.
  • the echo ultrasound signal may include all signals reflected by the ultrasound signal transmitted to the object.
  • the object may be a living body of a human or animal, but is not particularly limited thereto, and any object may be any object as long as its internal structure can be imaged by an ultrasonic signal.
  • the ultrasound probe 200 may include a transducer array for converting an electrical signal and an ultrasound signal to transmit an ultrasound signal to the inside of the object.
  • the transducer array consists of a single or a plurality of transducer elements.
  • the ultrasound probe 200 generates an ultrasound signal through the transducer array, transmits the ultrasound signal as a focal point, and receives the echo ultrasound signal reflected from the target area inside the object through the transducer array. have.
  • the transducer array may output an alternating current at a frequency corresponding to the vibration frequency of the transducer array while vibrating at a predetermined frequency corresponding to the frequency of the echo ultrasonic signal. Accordingly, the transducer array can convert the received echo ultrasound signal into an echo signal which is a predetermined electrical signal.
  • the transducer array may be a one-dimensional array or a two-dimensional array.
  • the transducer module 110 may include a one-dimensional transducer array as shown in FIG. 1.
  • Each transducer element constituting the one-dimensional transducer array may mutually convert an ultrasonic signal and an electrical signal.
  • the transducer element may be a magnetostrictive ultrasonic transducer using a magnetostrictive effect of a magnetic material, a piezoelectric ultrasonic transducer using a piezoelectric effect of a material, or a piezoelectric micromachined ultrasonic transducer. and a capacitive micromachined ultrasonic transducer (hereinafter, abbreviated as cMUT) that transmits and receives ultrasonic waves using vibrations of hundreds or thousands of thin films that have been microfabricated. It is also possible.
  • cMUT capacitive micromachined ultrasonic transducer
  • the ultrasonic probe 100 may be arranged in a linear (convex), the transducer module 110 may be arranged as shown in FIG.
  • the basic operating principle of the ultrasonic probe 100 is the same, but in the case of the ultrasonic probe 100 having the transducer module 110 arranged in a curved shape, the ultrasonic signal emitted from the transducer module 110 is a fan shape. Therefore, the generated ultrasound image may also have a fan shape.
  • the transducer module 110 may include a two dimensional transducer array, as shown in FIG. 3.
  • the inside of the object may be 3D imaged.
  • the ultrasonic probe 100 acquires volume information inside the object while mechanically moving the one-dimensional transducer array to obtain a three-dimensional ultrasound image.
  • the echo ultrasound signal capable of generating the signal may be transmitted to the main body 200.
  • Each transducer element constituting the two-dimensional transducer array is the same as the transducer element constituting the one-dimensional transducer array, a detailed description thereof will be omitted.
  • the internal structure of the ultrasonic probe and the ultrasonic imaging apparatus including the same will be described in more detail.
  • FIG. 4 is a block diagram of an ultrasound imaging apparatus.
  • the ultrasound probe 100 further includes a beam former 150, a transmission / reception switch 120, a voltage detector 130, and an analog-to-digital converter 140 provided in the housing h. .
  • the transmission / reception switch 120 switches the mode to the transmission mode when the ultrasound is irradiated or the reception mode when the ultrasound is received according to a control signal of the system controller 240 of the main body 200.
  • the voltage detector 130 detects the current output from the transducer module 110.
  • the voltage detector 130 may be implemented as, for example, an amplifier that amplifies the voltage according to the output current.
  • the voltage detector 130 may further include a pre-amplifier for amplifying an analog signal having a small size.
  • a low noise amplifier (LNA) may be used as the preamplifier.
  • the voltage detector 130 may further include a variable gain amplifier (VGA) (not shown) for controlling a gain value according to an input signal.
  • VGA variable gain amplifier
  • TGC Time Gain Compensation
  • the variable gain amplifier may be used as the variable gain amplifier to compensate the gain according to the focal point or the distance from the focal point, but is not limited thereto.
  • the analog-digital converter 140 converts the analog voltage output from the voltage detector 130 into a digital signal.
  • the digital signal converted from the analog-digital converter 140 is input to the beamformer 150.
  • the analog signal delayed by the beamformer 150 is input to the analog-digital converter 140.
  • the order is not limited.
  • analog-to-digital converter 140 is illustrated in the probe 100 in FIG. 4, the present invention is not limited thereto, and the analog-to-digital converter 140 may be provided in the main body 200. In this case, the analog-to-digital converter 140 may convert the analog signal focused by the adder into a digital signal.
  • the beam former 150 causes the ultrasonic waves generated by the transducer module 110 to be focused at one target point of the object ob at the same time desired, or echo ultrasonic waves reflected from one target point of the object ob are returned.
  • the device gives an appropriate delay time to the irradiated ultrasonic wave or the received echo ultrasonic wave.
  • the beam former 150 may be included in the ultrasound probe 100 corresponding to the front end as described above, or the main body 200 corresponding to the back end. It may also be included. Since the embodiment of the beam former 150 does not have a limitation in this regard, all or part of the components of the beam former 150 may be included in any of the front-end and the back-end.
  • the main body 200 is a device for controlling the ultrasonic probe 100 or accommodating components necessary for generating an ultrasound image based on a signal received from the ultrasonic probe 100.
  • the ultrasonic probe 100 and the cable 120 Can be connected via.
  • the signal processor 220, the image processor 230, and the system controller 240 included in the main body 200 will be described, and the display 300 and the input device 400 will be described.
  • the signal processor 220 converts the focused digital signal received from the ultrasound probe 100 into a format suitable for image processing.
  • the signal processor 220 may perform filtering to remove a noise signal outside a desired frequency band.
  • the signal processor 220 may be implemented as a digital signal processor (DSP), and may generate ultrasound image data by performing an envelope detection process for detecting the size of echo ultrasound based on the focused digital signal.
  • DSP digital signal processor
  • the image processor 230 generates an image for a user, for example, a doctor or a patient, to visually check the inside of the object ob, for example, the human body, based on the ultrasound image data generated by the signal processor 220. do.
  • the image processor 230 transmits the ultrasound image generated by using the ultrasound image data to the display 300.
  • the image processor 230 may further perform additional image processing on the ultrasound image, according to an exemplary embodiment.
  • the image processor 230 may further perform image post-processing, such as correcting or readjusting contrast, brightness, sharpness, or the like of the ultrasound image.
  • the additional image processing of the image processor 230 may be performed according to a predetermined setting, or may be performed according to a user's instruction or command input through the input device 400.
  • the system controller 240 controls the overall operation of the ultrasound imaging apparatus 10. For example, the system controller 240 controls operations of the signal processor 220, the image processor 230, the probe 100, and the display 300.
  • the system controller 240 may control an operation of the ultrasound imaging apparatus 10 according to a predetermined setting, and according to a user's instruction or command input through the input apparatus 400, a predetermined control command. After the operation, the operation of the ultrasound imaging apparatus 10 may be controlled.
  • the system controller 240 is input from a processor (ROM) in which a processor, a control program for controlling the ultrasound imaging apparatus 10, and an ultrasound probe 100 or an input device 400 of the ultrasound imaging apparatus 10 are stored. And a RAM used as a storage area corresponding to various operations performed by the ultrasound imaging apparatus 10.
  • ROM processor
  • a control program for controlling the ultrasound imaging apparatus 10 and an ultrasound probe 100 or an input device 400 of the ultrasound imaging apparatus 10 are stored.
  • RAM used as a storage area corresponding to various operations performed by the ultrasound imaging apparatus 10.
  • a separate processing circuit board electrically connected to the system controller 240 may include a processing board including a processor, RAM, or ROM.
  • the processor, RAM and ROM can be interconnected via an internal bus.
  • system controller 240 may be used as a term referring to a component including a processor, a RAM, and a ROM.
  • system controller 240 may be used as a term referring to a component including a processor, a RAM, a ROM, and a processing board.
  • the main body 200 may include one or more female connectors 201 (see FIG. 1), and the female connectors 201 may be connected to the ultrasonic probe 100 through the cable 120 and the male connector 130.
  • the display 300 displays the ultrasound image generated by the image processor 230 so that the user can visually check the structure or tissue inside the object ob.
  • the input device 400 receives a predetermined instruction or command from a user for controlling the ultrasound imaging apparatus 10.
  • the input device 400 may include, for example, a user interface such as a keyboard, a mouse, a trackball, a touch screen, or a paddle.
  • 5 is a perspective view of the ultrasonic probe.
  • the ultrasonic probe 100 includes a piezoelectric layer 111, a sound absorbing layer 112 provided below the piezoelectric layer 111, a matching layer 113 provided above the piezoelectric layer 111, and a matching layer 113. It includes a lens layer 115 covering the top of. Further, at least one cuff 118 is formed in the piezoelectric layer 111 to divide the piezoelectric layer 111 into a plurality of piezoelectric bodies.
  • the ultrasound probe 100 may describe each cross section based on three directions that form a right angle with respect to the inner center of the ultrasound probe 100.
  • the direction in which the ultrasonic wave is irradiated is defined as an axis dirextion A
  • the direction in which the transducer module 110 forms a column is defined as a lateral direction L
  • the other direction perpendicular to the direction A and the lateral direction L is defined as the elevation direction E.
  • FIG. In the following description with reference to FIGS. 6 to 17, which planes are indicated at the bottom right of each drawing, and for the transducer module 110 of the ultrasound probe 100 based on the coordinates indicating the three directions.
  • FIG. 6 is a side cross-sectional view of the transducer module in an elevation direction.
  • the ultrasonic transducer module 110 may include a piezoelectric layer 111, a sound absorbing layer 112 provided below the piezoelectric layer 111, and a matching layer 113 provided above the piezoelectric layer 111. And a lens layer 115 covering an upper portion of the matching layer 113.
  • the piezoelectric layer 111 is made of a piezoelectric material (piezoelectric material) that generates ultrasonic waves by converting it into mechanical vibration when an electrical signal is applied.
  • the piezoelectric body may be laminated in a single layer or a multilayer structure.
  • piezoelectric material When mechanical pressure is applied to a predetermined material, a voltage is generated, and the effect that mechanical deformation occurs when a voltage is applied is called a piezoelectric effect and a reverse piezoelectric effect, and a material having such an effect is called a piezoelectric material (piezoelectric material).
  • a piezoelectric material means a material that converts electrical energy into mechanical vibration energy and mechanical vibration energy into electrical energy.
  • the piezoelectric material may include a PZMT single crystal made of a solid solution of lead zirconate titanate (PZT), a magnesium magnesium niobate and a lead titanate, or a PZNT single crystal made of a solid solution of zinc niobate and lead titanate.
  • the piezoelectric layer 111 irradiates mechanical vibration energy as ultrasonic waves in the direction in which the lens is provided (hereinafter, front) and in the direction in which the sound absorbing layer 112 is provided (hereinafter, rear).
  • the sound absorbing layer 112 is disposed under the piezoelectric layer 111, and absorbs the ultrasonic waves generated in the piezoelectric layer 111 and proceeds to the rear to block the ultrasonic waves from proceeding to the rear of the piezoelectric layer 111. Therefore, it is possible to prevent distortion of the image.
  • the sound absorbing layer 112 may have a smaller acoustic impedance than the piezoelectric layer 111.
  • the sound absorbing layer 112 may be made of a material having an acoustic impedance of 2MRayl to 5MRayl.
  • the sound absorbing layer 112 may be made of a plurality of layers to improve the attenuation or blocking effect of the ultrasonic wave.
  • a matching layer 113 is provided on the piezoelectric layer 111.
  • the matching layer 113 may include a first matching layer 113a and a second matching layer 113b.
  • the first and second matching layers 113a and 113b are layers that transmit ultrasonic waves to or reduce the loss of ultrasonic waves transmitted from the object by appropriately matching the acoustic impedance of the piezoelectric layer 111 with the acoustic impedance of the object. Physical parameters such as sound velocity, thickness, and acoustic impedance of the first and second matching layers 113a and 113b may be adjusted to match the acoustic impedance of the object and the piezoelectric layer 111.
  • the first and second matching layers 113a and 113b suppress reflection of ultrasonic waves due to the difference between the acoustic impedance of the object and the acoustic impedance of the piezoelectric layer 111.
  • two matching layers are shown in FIG. 5, this embodiment is not limited to this.
  • one matching layer or three or more matching layers may be used.
  • the first and second matching layers 113a and 113b may be divided into a plurality of elements and provided on an upper end of the piezoelectric layer 111.
  • the matching layer 113 reduces the acoustic impedance difference between the piezoelectric layer 111 and the object ob to match the acoustic impedance of the piezoelectric layer 111 and the object ob so that the ultrasonic wave generated in the piezoelectric layer 111 is subjected to the object. to be passed efficiently to (ob).
  • the matching layer 113 may be made of a material having a smaller acoustic impedance than the piezoelectric layer 111 and larger than the object ob.
  • the matching layer 113 may be formed of glass or a resin material.
  • the plurality of matching layers 113 may be configured such that the acoustic impedance may gradually change from the piezoelectric layer 111 toward the object ob, and the materials of the plurality of matching layers 113 may be different from each other. Can be.
  • the piezoelectric layer 111 and the matching layer 113 may be processed into a two-dimensional array in the form of a matrix by a dicing process, or may be processed into a one-dimensional array.
  • the lens layer 115 may be provided to cover the top of the matching layer 113.
  • the lens layer 115 focuses the ultrasonic waves traveling toward the front of the transducer module 110 to a specific point.
  • the lens layer 115 may be formed of a material having strong wear resistance and high ultrasonic propagation speed in order to focus ultrasound and protect the acoustic module, in particular, the piezoelectric layer 111. have.
  • the lens layer 115 may have a convex shape in the radial direction of the ultrasonic wave to focus the ultrasonic wave, and may be implemented in a concave shape when the sound velocity is slower than the object ob.
  • one lens layer 115 is formed on the matching layer 113 is described as an example, but it is also possible to form a plurality of lens layers 115 having different physical properties.
  • FIG. 7 is a side cross-sectional view of a transducer including a single element and a cuff having different widths.
  • 8 is another side cross-sectional view of the transducer module including a single element and cuff with different widths.
  • 9 is another side cross-sectional view of the transducer module including a single element and cuff with different widths.
  • the transducer module 110 includes a piezoelectric layer 111, a sound absorbing layer 112 provided below the piezoelectric layer 111, and a matching layer provided above the piezoelectric layer 111. And a lens layer 115 covering an upper portion of the matching layer 113.
  • the transducer module 110 may further include an enhanced layer 114 positioned between the plurality of piezoelectric elements and the sound absorbing layer 112 to reflect ultrasonic waves generated from the plurality of piezoelectric elements.
  • the piezoelectric layer 111, the matching layer 113, and the reflective layer 114 which are different from those of FIG. 6, will be described, but the above-described parts will be omitted.
  • the piezoelectric layer 111 may have different spacings w3 and w4 between the plurality of piezoelectrics 111s and 111t (not shown in the remaining reference numerals) and the plurality of piezoelectric materials 111s and 111t (not shown in the remaining reference numerals). It may include at least one cuff 118 is formed as.
  • first piezoelectric material 111s and the second piezoelectric material 111t among the plurality of piezoelectric materials 111s and 111t will be described.
  • first piezoelectric material 111s and the second piezoelectric material 111t each consist of a single element
  • the first piezoelectric material 111s and the second piezoelectric material 111t may be named as the first element 111s and the second element 111t.
  • the first element 111s and the second element 111t have the same thickness h7 and different widths w3 and w4. Therefore, the aspect ratios of the first element 111s and the second element 111t are different from each other.
  • the aspect ratio means the ratio of the thickness and width of the element.
  • Each element is formed to have a variety of thicknesses and widths, thereby having different aspect ratios. Due to the vibration of the elements having various aspect ratios, the piezoelectric layer including each element can obtain a wider band width frequency characteristic.
  • the cuff 118 means a space formed at the time of the dicing process in which the piezoelectric layer 111 is divided into a plurality of piezoelectric members 111s and 111t (not shown).
  • the cuff 118 may be formed at different intervals in the matching layer 113 and the reflective layer 114 as well as the piezoelectric layer 111.
  • the matching layer 113 may include the first matching layer 113a, the second matching layer 113b, and at least one cuff 118 formed at different intervals in the matching layer 113.
  • the reflective layer 114 may include at least one cuff 118 formed at different intervals in the reflective layer 114.
  • the sound absorbing layer 112, the reflective layer 114, and the piezoelectric layer 111 are sequentially formed, and the matching layer 113 is formed on the piezoelectric layer 111, followed by a dicing process. While the piezoelectric layer 111, the matching layer 113, and the reflective layer 114 are divided into a plurality of cuffs 118, which are formed together, this may vary depending on the order in which the transducers 110 are generated. . For example, after the piezoelectric layer 111 is formed and divided by the dicing process, the matching layer 113 may be formed, and the cuff 118 is further formed by the dicing process in the matching layer 113. May be formed.
  • the depth of the cuff 118 formed in the single piezoelectric layer 111 may be adjusted as shown in FIGS. 8 and 9.
  • some of the plurality of cuffs 118 may be formed to abutment surfaces of the piezoelectric layer 111 and the sound absorption layer 112.
  • the piezoelectric layer 111 may be adjusted to a predetermined depth.
  • FIG. 10 is a cross-sectional side view of a transducer module including a single element and cuff having the same width.
  • the transducer module 110 includes a piezoelectric layer 111, a sound absorbing layer 112 provided below the piezoelectric layer 111, and a matching layer 113 provided above the piezoelectric layer 111. And a lens layer 115 covering an upper portion of the matching layer 113.
  • a description will be given of the piezoelectric layer 111 which is different from that of FIG. 6, and the above description will be omitted.
  • the piezoelectric layer 111 may include at least one cuff 118 formed at equal intervals between the plurality of piezoelectrics 111a (not shown) and the plurality of piezoelectrics 111a (not shown).
  • the third piezoelectric body 111a of the plurality of piezoelectric members 111a (not shown in the remaining reference number) will be described.
  • the third piezoelectric material 111a is formed of a single element, each of the third piezoelectric material 111a may be referred to as a third element 111a.
  • the third element 111a has the same thickness and the same width as the remaining elements (not shown). Accordingly, the aspect ratios of the respective elements including the third element 111a are the same.
  • FIG. 11 is a side cross-sectional view of a transducer module including a plurality of elements and cuffs formed in a multilayer structure.
  • the transducer module 110 includes a piezoelectric layer 111, a sound absorbing layer 112 provided below the piezoelectric layer 111, and a matching layer 113 provided above the piezoelectric layer 111. And a lens layer 115 covering an upper portion of the matching layer 113.
  • the transducer module 110 is positioned between the plurality of piezoelectric members 111a (not shown in the remaining reference numbers) and the sound absorbing layer 112 and reflects the ultrasonic waves generated from the plurality of piezoelectric members 111a (not shown in the remaining reference numbers). (enhanced layer) may further include.
  • a description will be given of the piezoelectric layer 111 which is different from that of FIG. 10, and the above description will be omitted.
  • the piezoelectric layer 111 may include a plurality of piezoelectrics 111a (not shown), and at least one cuff 118 formed between the plurality of piezoelectrics 111a (not shown).
  • the piezoelectric layer 111 may include a first piezoelectric layer 111b, a second piezoelectric layer 111c, and a third piezoelectric layer 111d.
  • the plurality of piezoelectric members 111a may include a plurality of elements 111a-1 to 111a-3 (not shown in the remaining reference numbers).
  • the plurality of elements 111a-1 to 111a-3 (the remaining reference numerals not shown) have the same or different thicknesses when stacked in multiple layers, and a cuff formed between the plurality of piezoelectric members 111a (not shown in the remaining reference numerals).
  • the thicknesses and widths of the plurality of elements 111a-1 to 111a-3 can be adjusted in such a manner as to make the intervals of 118 the same or different.
  • the remaining reference numbers may not be different from each other.
  • the plurality of elements 111a-1 to 111a-3, the remaining reference numbers may have the same or different aspect ratios according to the ratio of thickness and width.
  • the fourth piezoelectric material 111a is one of a plurality of piezoelectric elements, and the fourth piezoelectric material 111a includes the fourth element 111a-1 and the fifth element 111a-. 2) and the sixth element 111a-3.
  • the fourth element 111a-1, the fifth element 111a-2, and the sixth element 111a-3 have the same thickness h1 to h3 and the same width w1, respectively.
  • the aspect ratio means the ratio of the thickness and width of the fourth element 111a-1, the fifth element 111a-2, and the sixth element 111a-3.
  • the plurality of elements 111a-1 to 111a-3 (not shown) have the same width by the cuffs 118 formed at equal intervals between the plurality of piezoelectric members 111a (not shown). have.
  • the plurality of elements 111a-1 to 111a-3, the remaining reference numerals (not shown), are also the same as the stacked thicknesses h1 to h3. Accordingly, the plurality of elements 111a-1 to 111a-3, the remaining reference numerals not shown, all have the same aspect ratio.
  • the matching layer 113 may include a first matching layer 113a, a second matching layer 113b, and at least one cuff 118 formed at equal intervals in the matching layer 113.
  • the reflective layer 114 may include at least one cuff 118 formed at equal intervals in the reflective layer 114. That is, the cuff 118 may be formed at the same or different intervals in the matching layer 113 and the reflective layer 114 similarly to the piezoelectric layer 111.
  • FIG. 12 is another side cross-sectional view of a transducer module including a plurality of elements and cuffs formed to have different thicknesses.
  • the fifth piezoelectric material 111z which is one of the plurality of piezoelectric materials, will be described with reference to the fifth piezoelectric material 111z, the seventh element 111z-1, the eighth element 111z-2, and The ninth element 111z-3 may be included.
  • the seventh element 111z-1, the eighth element 111z-2, and the ninth element 111z-3 have different thicknesses h4 to h6 and the same width w2, respectively. Therefore, the seventh element 111z-1, the eighth element 111z-2, and the ninth element 111z-3 also have different aspect ratios due to different thicknesses h4 to h6.
  • the elements 111z-1 to 111z-3 (not shown in the drawing), not the elements 111z-1 to 111z-3, the plurality of elements 111z-1 to 111z-3 and the rest Reference numeral not shown) has the same width w2 by the cuff 118 formed at equal intervals w2 between the plurality of piezoelectrics 111z (not shown).
  • the stacked thicknesses h4 to h6 of the plurality of elements 111z-1 to 111z-3 are different from each other.
  • eight elements 111z-1 of the first piezoelectric layer 111b (not shown in the remaining reference numbers), eight elements 111z-2 of the second piezoelectric layer 111c (not shown in the remaining reference numbers) and a third
  • the eight elements 111z-3 of the piezoelectric layer 111d (not shown in the remaining reference numbers) have different aspect ratios because the stacked thicknesses are different.
  • eight elements 111z-1 having the same thickness h6 in the first piezoelectric layer 111b have the same aspect ratio
  • the same thickness h5 in the second piezoelectric layer 111c Eight elements 111z-2 (not shown) may have the same aspect ratio.
  • eight elements 111z-3 (not shown in FIG. 3) having the same thickness h4 in the third piezoelectric layer 111d may have the same aspect ratio.
  • FIG. 13 is another side sectional view of a transducer module including a plurality of elements and cuffs formed to have different thicknesses.
  • the piezoelectric layer 111 which is different from the above-described drawings, and the above description will be omitted.
  • the sixth piezoelectric body 111e and the seventh piezoelectric body 111f of the plurality of piezoelectric elements will be described, and the sixth piezoelectric body 111e includes the tenth element 111e-1 and the eleventh element 111e. -2).
  • the seventh piezoelectric body 111f since the seventh piezoelectric body 111f is composed of one element, the seventh piezoelectric body 111f may be referred to as a twelfth element 111f.
  • the tenth element 111e-1 and the eleventh element 111e-2 stacked on each other have different thicknesses h4 and h5 and the same width w2, respectively. Accordingly, the aspect ratios of the tenth element 111e-1 and the eleventh element 111e-2 are also different because of the different thicknesses h4 and h5.
  • the twelfth element 111f has a thickness h6 different from the thickness h4 of the tenth element 111e-1 and the thickness h5 of the eleventh element 111e-2, and the tenth element 111e ⁇ . It has a width w6 different from the width w2 of 1) and the 11th element 111e-2. Accordingly, the twelfth element 111f has an aspect ratio different from that of the tenth element 111e-1 and the aspect ratio of the eleventh element 111e-2.
  • the cuff 118 may be formed between the plurality of piezoelectrics 111e and 111f (not shown), and the depth of the cuff 118 may be adjusted. Referring to FIG. 13, four cuffs 118 of the seven cuffs 118 are formed to the depth of the second piezoelectric layer 111c, and the remaining three cuffs 118 are formed to the reflective layer 114. can do. This may control the depth of the cuff 118 is formed in a manner to adjust the depth to cut during the dicing process. As a result, a plurality of elements 111e-1, 111e-2, and 111f having the same or different aspect ratios can be formed.
  • FIG. 14 is another side cross-sectional view of a transducer module including a plurality of elements and cuffs formed to have different thicknesses.
  • the piezoelectric layer 111 which is different from the above-described drawings, but the above description will be omitted.
  • the eighth piezoelectric body 111g, the ninth piezoelectric body 111h, and the tenth piezoelectric body 111i of the plurality of piezoelectric bodies will be described.
  • the eighth piezoelectric 111g may be referred to as a thirteenth element 111g.
  • the ninth piezoelectric body 111h and the tenth piezoelectric body 111i may be referred to as a fourteenth element 111h and a fifteenth element 111i, respectively.
  • the thirteenth element 111g and the fourteenth element 111h have different thicknesses h5 and h6 and the same width w6, respectively. Accordingly, the aspect ratios of the thirteenth element 111g and the fourteenth element h are also different due to different thicknesses h5 and h6.
  • the fifteenth element 111i has a thickness h4 different from the thickness h6 of the thirteenth element 111g and the thickness h5 of the fourteenth element 111h, and the thirteenth element 111g and the fourteenth element It has a width w2 different from the width w6 of 111h. Accordingly, the fifteenth element 111i has an aspect ratio different from that of the thirteenth element 111g and the aspect ratio of the fourteenth element 111h.
  • the cuff 118 may be formed between the plurality of piezoelectrics 111g, 111h, 111i, and the remaining reference numbers, and the depth of the cuff 118 may be adjusted.
  • four cuffs 118 of the seven cuffs 118 are formed to the depth of the first piezoelectric layer 111d, and the remaining three cuffs 118 are formed to the reflective layer 114. can do.
  • a plurality of elements 111g, 111h, 111i (not shown in the remaining reference numbers) having the same or different aspect ratios may be formed.
  • 15 is a side cross-sectional view of a transducer module formed of a multilayer structure and including a plurality of elements and cuffs having different widths.
  • the plurality of cuffs 118 may be formed between the plurality of piezoelectrics 111j and 111k (not shown), and may be formed at the same or different intervals. In addition, the plurality of cuffs 118 may be formed by adjusting the depth to be formed.
  • all seven cuffs 118 may be formed to the depth of the reflective layer 114.
  • the seven cuffs 118 may be formed including not only constant intervals but also different intervals.
  • a plurality of piezoelectrics 111j and 111k may be formed by forming the plurality of cuffs 118.
  • the plurality of piezoelectrics 111j and 111k may include one or a plurality of elements.
  • the piezoelectric layer 111 may include a plurality of piezoelectric members 111j and 111k (not shown in the remaining reference numbers) having the same or different widths.
  • the eleventh piezoelectric material 111j and the twelfth piezoelectric material 111k having different widths among the plurality of piezoelectric materials 111j and 111k will be described.
  • the eleventh piezoelectric material 111j may include the sixteenth element 111j-1, the seventeenth element 111j-2, and the eighteenth element 111j-3.
  • the sixteenth element 111j-1, the seventeenth element 111j-2, and the eighteenth element 111j-3 may have different thicknesses h4 to h6, and may have the same width w4. Therefore, the sixteenth element 111j-1, the seventeenth element 111j-2, and the eighteenth element 111j-3 may have different aspect ratios due to different thicknesses h4 to h6.
  • the twelfth piezoelectric material 111k may include a nineteenth element 111k-1, a twentieth element 111k-2, and a twenty-first element 111k-3.
  • the nineteenth element 111k-1, the twentieth element 111k-2, and the twenty-first element 111k-3 may have different thicknesses h4 to h6, and may have the same width w3. Accordingly, the nineteenth element 111k-1, the twentieth element 111k-2, and the twenty-first element 111k-3 may have different aspect ratios due to different thicknesses h4 to h6.
  • the eleventh piezoelectric material 111j and the twelfth piezoelectric material 111k may have different widths w3 and w4 by the plurality of cuffs 118 formed at different intervals from each other. Therefore, each of the elements 111j-1 to 111j-3 and 111k-1 to 111k-3 configuring the same may have different aspect ratios.
  • 16 is another side cross-sectional view of a transducer module formed of a multilayer structure and including a plurality of elements and cuffs having different widths.
  • the plurality of cuffs 118 may be formed between the plurality of piezoelectrics 111m, 111l, 111n and the remaining reference numerals, and may be formed at the same or different intervals. In addition, the plurality of cuffs 118 may be formed by adjusting the depth to be formed.
  • four cuffs 118 of the seven cuffs 118 may be formed to the depth of the second piezoelectric layer 111c, and the remaining three cuffs 118 may be formed to the reflective layer 114. .
  • the seven cuffs 118 may be formed including not only constant intervals but also different intervals.
  • a plurality of piezoelectrics 111l, 111m, and 111n may be formed by forming the plurality of cuffs 118.
  • the plurality of piezoelectrics 111l, 111m, 111n and the remaining reference numbers may not include one or a plurality of elements.
  • the thirteenth piezoelectric material 111l, the fourteenth piezoelectric material 111m, and the fifteenth shape each having a different width w3, w4, and w5, respectively, from among the plurality of piezoelectric materials 111l, 111m, 111n and the remaining reference numerals (not shown). It demonstrates centering on the piezoelectric body 111n.
  • the thirteenth piezoelectric material 111l may include a twenty-second element 111l-1 and a twenty-third element 111l-2.
  • the twenty-second element 111l-1 and the twenty-third element 111l-2 have the same width w3 with different thicknesses h10 and h11. Accordingly, the twenty-second element 111l-1 and the twenty-third element 111l-2 have different aspect ratios due to different thicknesses h10 and h11.
  • the fourteenth piezoelectric material 111m may include the twenty-fourth element 111m-1 and the twenty-fifth element 111m-2.
  • the twenty-fourth element 111m-1 and the twenty-fifth element 111m-2 have the same width w4 with different thicknesses h10 and h11. Accordingly, the twenty-fourth element 111m-1 and the twenty-fifth element 111m-2 have different aspect ratios due to different thicknesses h10 and h11.
  • the fifteenth piezoelectric material 111n is composed of one element, and thus, the fifteenth piezoelectric material 111n can be referred to as the 26th element 111n.
  • the twenty-sixth element 111n has a thickness h12 different from the plurality of elements 111l-1 to 111l-2 and 111m-1 to 111m-2 which constitute the thirteenth piezoelectric material 111l and the fourteenth piezoelectric material 111m. And different widths w5. Therefore, the 26th element 111n has an aspect ratio different from the plurality of elements 111l-1 to 111l-2 and 111m-1 to 111m-2 constituting the thirteenth piezoelectric material 111l and the fourteenth piezoelectric material 111m.
  • 17 is another side cross-sectional view of a transducer module formed of a multilayer structure and including a plurality of elements and cuffs having different widths.
  • the plurality of cuffs 118 may be formed between the plurality of piezoelectrics 111o, 111p, 111q, 111r, and the remaining reference numerals (not shown), and may be formed at the same or different intervals. In addition, the plurality of cuffs 118 may be formed by adjusting the depth to be formed.
  • the seven cuffs 118 may be formed to the depth of the first piezoelectric layer 111d, and the remaining three cuffs 118 may be formed to the reflective layer 114. have.
  • the seven cuffs 118 may be formed including not only constant intervals but also different intervals.
  • a plurality of piezoelectrics 111o, 111p, 111q, and 111r may be formed due to the process of forming the plurality of cuffs 118.
  • the plurality of piezoelectrics 111o, 111p, 111q, 111r, and the remaining reference numerals may not include one or a plurality of elements.
  • the eighteenth piezoelectric body 111q and the nineteenth piezoelectric body 111r will be described below.
  • the sixteenth piezoelectric body 111o is composed of one element. Therefore, the sixteenth piezoelectric body 111o may be referred to as the twenty-seventh element 111o.
  • the seventeenth piezoelectric material 111p is composed of one element. Therefore, the seventeenth piezoelectric material 111p may be referred to as the twenty-eighth element 111p.
  • the eighteenth piezoelectric material 111q is composed of one element. Therefore, the eighteenth piezoelectric material 111q can be referred to as the twenty-ninth element 111q.
  • the nineteenth piezoelectric element 111r is composed of one element, and thus, the nineteenth piezoelectric element 111r may be referred to as a thirtieth element 111r.
  • the twenty-seventh element 111o and the thirtieth element 111r have different thicknesses h11 and h12 and the same width w5. Therefore, the twenty-seventh element 111o and the thirtieth element 111r have different aspect ratios due to different thicknesses h11 and h12.
  • the twenty-eighth element 111p and the twenty-ninth element 111q have the same thickness h10 and different widths w3 and w4. Therefore, the 28th element 111p and the 29th element 111q have different aspect ratios due to different widths w3 and w4.
  • the sound absorbing layer 112 is provided (S1100).
  • a piezoelectric layer 111 covering the upper portion of the sound absorbing layer 112 is provided (S1200).
  • the piezoelectric layer 111 is made of a piezoelectric material that generates ultrasonic waves by converting the electrical signal into mechanical vibrations.
  • the piezoelectric material may include a PZMT single crystal made of a solid solution of lead zirconate titanate (PZT), a magnesium magnesium niobate and a lead titanate, or a PZNT single crystal made of a solid solution of lead zinc niobate and lead titanate.
  • the piezoelectric layer 111 may be arranged in a single layer structure or a multilayer stacked structure.
  • the piezoelectric layer 111 having a single layer or multilayer structure may be formed to include a plurality of piezoelectric members 111a, 111e to 111r, 111z (not shown in the remaining reference numbers) and at least one cuff 118.
  • the cuff 118 may be formed at the same or different intervals between the plurality of piezoelectrics 111a, 111e to 111r, 111z and the remaining reference numerals.
  • the cuff 118 may be formed by adjusting a depth formed between the plurality of piezoelectrics 111a, 111e to 111r, and 111z (not shown).
  • a plurality of cuffs 118 are formed between the plurality of piezoelectric members 111a, 111e to 111r, and 111z (not shown), which are formed by stacking a single layer or a multilayer, thereby providing the same or different thickness and the same or different width.
  • the branch may be formed with a single or a plurality of elements.
  • at least two of the plurality of elements may be formed such that at least one of the thickness and the width is different from each other.
  • the plurality of elements may be formed to have the same or different aspect ratios depending on the ratio of thickness and width.
  • an enhanced layer 114 for reflecting ultrasonic waves may be further provided between the sound absorbing layer 112 and the piezoelectric layer 111 according to the type of the transducer 110.
  • the reflective layer 114 may be formed to include the plurality of cuffs 118 at the same or different intervals.
  • a matching layer 113 covering the upper portion of the piezoelectric layer 111 is provided (S1300).
  • the matching layer 113 may be provided as a layer of the first matching layer 113a and the second matching layer 113b.
  • a dicing process for dividing the piezoelectric layer 111 into a plurality of piezoelectric bodies may be performed as described above (s1400).
  • the plurality of piezoelectric bodies may be divided into single or multiple elements having the same or different widths by the generated cuff 118.
  • the depth to be cut during the dicing process can be adjusted, the depth of the formed cuff 118 can also be adjusted.
  • the piezoelectric layer 111 is described above, the present invention is not limited thereto, and the matching layer 113 and the reflective layer 114 may also be divided by forming a plurality of cuffs 118 at the same or different intervals in each layer. have.
  • the lens layer 115 covering the upper portion of the matching layer 113 is provided (S1500).
  • the lens layer 115 may be formed of a material having strong wear resistance and high ultrasonic propagation speed in order to focus ultrasonic waves and protect the piezoelectric layer 111.
  • the lens layer 115 may have a convex shape in the radial direction of the ultrasonic wave to focus the ultrasonic wave, and may be implemented in a concave shape when the sound velocity is slower than the object ob.
  • the transducer module is expressed with respect to the side cross section viewed from the altitude direction, but in the case of a two-dimensional array instead of a one-dimensional array, the structure viewed from other aspects of the present specification may also be the same. Accordingly, the piezoelectric layer 111, the matching layer 113, and the reflective layer 114 may be processed into a two-dimensional array in the form of a matrix by a dicing process, or may be processed into a one-dimensional array.
  • the process of forming the plurality of elements may also have various methods.
  • the piezoelectric layer 111, the matching layer 113, and the reflective layer 114 may be stacked in multiple layers, and then the piezoelectric layer 111 may be divided by a dicing process to form a plurality of elements.
  • the plurality of cuffs may be formed from the beginning, and then may be formed by stacking the diced piezoelectric elements or elements.
  • the structure of the piezoelectric layer and the plurality of cuffs in Figs. 6 to 17 are one example, may be of a more multilayered structure, and more cuffs may be formed.
  • single or multiple elements can also be formed to have more varied thicknesses and widths.
  • the ultrasonic probe and the method of manufacturing the ultrasonic probe have been described above to have a wide bandwidth frequency characteristic with optimized vibration characteristics of a single element or a plurality of elements having various aspect ratios.

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Abstract

La présente invention concerne une sonde ultrasonore et un procédé de fabrication d'une sonde ultrasonore. La sonde ultrasonore comprend : une pluralité de corps piézoélectriques pour générer des ondes ultrasonores ; et au moins une entaille formée à différents intervalles entre la pluralité de corps piézoélectriques. La pluralité de corps piézoélectriques comprend un élément unique ou de multiples éléments, et au moins deux éléments de la pluralité d'éléments piézoélectriques peuvent avoir des largeurs différentes respectivement.
PCT/KR2016/013151 2016-01-21 2016-11-15 Sonde ultrasonore et procédé de fabrication de sonde ultrasonore Ceased WO2017126793A1 (fr)

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KR102717595B1 (ko) * 2017-02-21 2024-10-16 삼성메디슨 주식회사 초음파 프로브
KR102658983B1 (ko) * 2017-12-21 2024-04-18 제네럴 일렉트릭 컴퍼니 초음파 변환기 및 초음파 프로브 제조 방법
KR102183238B1 (ko) * 2018-11-29 2020-11-26 한국기계연구원 압전소자 유닛의 설계방법, 이를 이용하여 제조되는 압전소자 유닛을 포함하는 초음파소자, 초음파소자의 제조방법 및 초음파소자를 포함하는 음압 집속장치
KR20200108642A (ko) * 2019-03-11 2020-09-21 삼성메디슨 주식회사 초음파 프로브 및 그 제조 방법

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