[go: up one dir, main page]

WO2017115441A1 - Structure de montage, dispositif de prise de vue et endoscope - Google Patents

Structure de montage, dispositif de prise de vue et endoscope Download PDF

Info

Publication number
WO2017115441A1
WO2017115441A1 PCT/JP2015/086568 JP2015086568W WO2017115441A1 WO 2017115441 A1 WO2017115441 A1 WO 2017115441A1 JP 2015086568 W JP2015086568 W JP 2015086568W WO 2017115441 A1 WO2017115441 A1 WO 2017115441A1
Authority
WO
WIPO (PCT)
Prior art keywords
region
electronic component
temperature increase
rate
lands
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2015/086568
Other languages
English (en)
Japanese (ja)
Inventor
悠 柴山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Priority to PCT/JP2015/086568 priority Critical patent/WO2017115441A1/fr
Priority to JP2017558834A priority patent/JPWO2017115441A1/ja
Publication of WO2017115441A1 publication Critical patent/WO2017115441A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/555—Constructional details for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Definitions

  • the present invention relates to a mounting structure, an imaging device, and an endoscope.
  • endoscopes have been widely used for various examinations in the medical field and the industrial field.
  • medical endoscopes incise a subject by inserting an elongated flexible insertion portion having an imaging element at the tip into the body cavity of the subject such as a patient. At least an in-vivo image in the body cavity can be acquired.
  • endoscopes are widely used because treatment treatment can be performed by projecting a treatment tool from the distal end of the insertion portion as necessary.
  • An imaging module including a solid-state imaging device and a multilayer substrate on which electronic components such as a capacitor and an IC chip constituting a driving circuit of the solid-state imaging device are mounted is fitted at the distal end of the insertion portion of such an endoscope. Yes.
  • electronic components are connected to the multilayer substrate by soldering, the electronic components are heated to a higher temperature than the lands of the multilayer substrate by heating, and the molten solder is gathered and bonded to the lower part of the electronic components, that is, inside the lands.
  • a fillet is not formed on the side surface of the electrode, and connection reliability may be insufficient.
  • Patent Document 1 is a technique for connecting an insulating container to a land of a printed circuit board, and has a problem regarding fillet formation when an electronic component is connected to a circuit board, that is, a problem that connection reliability is insufficient. It does not solve.
  • the present invention has been made in view of the above, and an object thereof is to provide a mounting structure, an imaging apparatus, and an endoscope that can be miniaturized and have high connection reliability.
  • a mounting structure includes an electronic component having two electrodes formed in continuous regions on the bottom surface and side surfaces, and the electronic component mounted by soldering.
  • a board having a pair of lands, wherein the lands have two or more regions having different temperature rise rates per unit time, and are exposed without being hidden by the mounted electronic component.
  • the region where the temperature increase rate is high is wider than the region where the temperature increase rate is low.
  • the length at which the ridge line portion formed by the bottom surface and the side surface constituting the electrode is mounted has a higher temperature increase rate in the region where the temperature increase rate is higher. It is characterized by being longer than the low region.
  • the mounting structure according to the present invention is the mounting structure according to the present invention, wherein the electronic component has a prismatic shape, the electrodes are arranged at both ends in the longitudinal direction, and the region where the temperature rise rate is high is the electronic component of the land. The region where the temperature rise rate is low is disposed in a region inside the end surface of the electronic component in the short direction of the land. To do.
  • the electronic component has a prismatic shape
  • the electrodes are disposed at both ends in the longitudinal direction
  • the region having a low temperature increase rate is disposed inside the land.
  • the region where the temperature increase rate is high is an outer peripheral region of the land, and is arranged so as to surround the region where the temperature increase rate is low.
  • the mounting structure according to the present invention is characterized in that, in the above invention, the region having a high temperature increase rate is made of a material having a higher thermal conductivity than the region having a low temperature increase rate.
  • the mounting structure according to the present invention is characterized in that, in the above invention, the land is made of copper in a region where the temperature increase rate is high, and aluminum in a region where the temperature increase rate is low, and has a gold plating layer on the surface.
  • the region where the temperature increase rate is high and the region where the temperature increase rate is low are made of the same material, and the region where the temperature increase rate is high is the temperature increase rate. It is characterized in that the thickness is thinner than that of the low region.
  • an imaging device includes a mounting structure according to any one of the above, an imaging device connected to a substrate of the mounting structure, and converting light incident from the outside into an electrical signal; And an optical system that makes the collected light incident on the imaging device.
  • an endoscope according to the present invention includes the above-described imaging device, and an insertion portion that has a cylindrical tip portion formed of a hard member and can be inserted into a subject.
  • a fillet having a sufficient connection strength is formed on the electrode side surface of an electronic component, and an area required for connection of the electronic component can be reduced, so that high-density mounting is possible, and the imaging apparatus and endoscope Can be miniaturized.
  • FIG. 1 is a diagram schematically illustrating the overall configuration of the endoscope system according to the first embodiment of the present invention.
  • FIG. 2 is a partial cross-sectional view of the distal end of the endoscope shown in FIG.
  • FIG. 3 is a top view of the imaging apparatus shown in FIG. 4 is a cross-sectional view taken along line AA in FIG. 5 is a cross-sectional view taken along line BB in FIG.
  • FIG. 6 is a top view of the land.
  • FIG. 7 is a top view of the land according to the second embodiment. 8 is a cross-sectional view taken along the line CC of FIG.
  • FIG. 9 is a top view of the land when the electronic component according to the third embodiment is mounted.
  • FIG. 1 is a diagram schematically illustrating the overall configuration of the endoscope system according to the first embodiment of the present invention.
  • FIG. 2 is a partial cross-sectional view of the distal end of the endoscope shown in FIG.
  • FIG. 3 is a
  • FIG. 10 is a top view of the land when the electronic component according to the fourth embodiment is mounted.
  • FIG. 11 is a top view of the land when the electronic component according to the fifth embodiment is mounted.
  • FIG. 12 is a top view of the land when the electronic component according to the sixth embodiment is mounted.
  • FIG. 13 is a top view of the land when the electronic component according to the seventh embodiment is mounted.
  • 14 is a cross-sectional view taken along the line EE of FIG.
  • FIG. 15 is a cross-sectional view of a land when the electronic component according to the eighth embodiment is mounted.
  • an endoscope provided with an imaging device will be described as a mode for carrying out the present invention (hereinafter referred to as “embodiment”). Moreover, this invention is not limited by this embodiment. Furthermore, the same code
  • FIG. 1 is a diagram schematically illustrating the overall configuration of the endoscope system according to the first embodiment of the present invention.
  • the endoscope system 1 includes an endoscope 2, a universal cord 3, a connector 5, a processor (control device) 6, a display device 7, and a light source device 8.
  • the endoscope 2 captures an in-vivo image of the subject and outputs an imaging signal by inserting the insertion unit 30 into the body cavity of the subject.
  • the electric cable bundle inside the universal cord 3 extends to the distal end of the insertion portion 30 of the endoscope 2 and is connected to an imaging device provided at the distal end portion 3 ⁇ / b> A of the insertion portion 30.
  • the connector 5 is provided at the base end of the universal cord 3 and is connected to the light source device 8 and the processor 6, and performs predetermined signal processing on the imaging signal output from the imaging device of the distal end portion 3 ⁇ / b> A connected to the universal cord 3.
  • the image pickup signal is converted from analog to digital (A / D conversion) and output as an image signal.
  • the light source device 8 is configured using, for example, a white LED.
  • the pulsed white light that is turned on by the light source device 8 becomes illumination light that is irradiated toward the subject from the distal end of the insertion portion 30 of the endoscope 2 via the connector 5 and the universal cord 3.
  • the processor 6 performs predetermined image processing on the image signal output from the connector 5 and controls the entire endoscope system 1.
  • the display device 7 displays the image signal processed by the processor 6.
  • the operation part 4 provided with various buttons and knobs for operating the endoscope function is connected to the proximal end side of the insertion part 30 of the endoscope 2.
  • the operation unit 4 is provided with a treatment instrument insertion port 4a for inserting a treatment instrument such as a biological forceps, an electric knife and an inspection probe into the body cavity of the subject.
  • the insertion section 30 is connected to the distal end portion 3A where the imaging device is provided, the bending portion 3B which is connected to the proximal end side of the distal end portion 3A and is bendable in a plurality of directions, and the proximal end side of the bending portion 3B. And the flexible tube portion 3C.
  • the bending portion 3B is bent by the operation of a bending operation knob provided in the operation portion 4, and can be bent in four directions, for example, up, down, left, and right as the bending wire inserted through the insertion portion 30 is pulled or loosened. Yes.
  • the endoscope 2 is provided with a light guide bundle (not shown) that transmits illumination light from the light source device 8, and an illumination lens (not shown) is disposed at an emission light emitting end of the light guide bundle.
  • This illumination lens is provided at the distal end portion 3A of the insertion portion 30, and the illumination light is irradiated toward the subject.
  • FIG. 2 is a partial cross-sectional view of the distal end of the endoscope 2.
  • 2 is a cross-sectional view taken along a plane that is orthogonal to the substrate surface of the imaging device provided at the distal end portion 3A of the endoscope 2 and is parallel to the optical axis direction of the imaging device. is there.
  • a distal end portion 3A of the insertion portion 30 of the endoscope 2 and a part of the bending portion 3B are illustrated.
  • the bending portion 3B can be bent in four directions, up, down, left and right, as the bending wire 82 inserted into the bending tube 81 disposed inside the later-described cladding tube 42 is pulled and loosened.
  • An imaging device 35 is provided inside the distal end portion 3A extending to the distal end side of the curved portion 3B.
  • the imaging device 35 includes a lens unit 43 and an imaging unit 40 disposed on the proximal end side of the lens unit 43, and is adhered to the inside of the distal end portion main body 41 with an adhesive 41a.
  • the tip end body 41 is formed of a hard member for forming an internal space for accommodating the imaging device 40.
  • the proximal end outer peripheral portion of the distal end portion main body 41 is covered with a flexible cladding tube 42.
  • the member on the base end side with respect to the distal end portion main body 41 is configured by a flexible member so that the bending portion 3B can be bent.
  • positioned become a hard part of the insertion part 30.
  • the lens unit 43 includes a plurality of objective lenses 43a-1 to 43a-4 and a lens holder 43b that holds the objective lenses 43a-1 to 43a-4.
  • the tip of the lens holder 43b is the tip portion main body 41. It is fixed to the tip end body 41 by being inserted and fixed inside.
  • the imaging unit 40 receives light from a CCD or CMOS, etc., and performs photoelectric conversion to generate an electrical signal, and the back side facing the light receiving surface on which the light receiving portion 44a of the solid state imaging device 44 is formed.
  • a flexible printed circuit board 45 (hereinafter referred to as “FPC board 45”) extending to the surface of the FPC board 45, a multilayer board 46 having a plurality of conductor layers connected to the surface of the FPC board 45, and a solid-state image sensor 44 covering the light-receiving surface.
  • a glass lid 49 that adheres to the image sensor 44 is provided.
  • the multilayer substrate 46 of the imaging unit 40 is mounted with electronic components 55 to 57 which are active components and passive components that constitute the drive circuit of the solid-state imaging device 44, and is electrically connected to a plurality of conductor layers (not shown) inside. Vias to be formed are formed. Further, the laminated substrate 46 is formed with an external electrode 63 for connecting the distal ends of the signal cables 48 of the electric cable bundle 47 on the base end side (see FIG. 3).
  • each signal cable 48 extends in the base end direction of the insertion portion 30.
  • the electric cable bundle 47 is inserted into the insertion portion 30 and extends to the connector 5 via the operation portion 4 and the universal cord 3 shown in FIG.
  • the subject images formed by the objective lenses 43a-1 to 43a-4 of the lens unit 43 are detected by the solid-state imaging device 44 provided at the imaging positions of the objective lenses 43a-1 to 43a-4, and imaged. Converted to a signal.
  • the imaging signal is output to the processor 6 via the signal cable 48 and the connector 5 connected to the FPC board 45 and the laminated board 46.
  • the solid-state imaging device 44 is bonded to the side surface of the multilayer substrate 46 via the adhesive 54a on the back side facing the light receiving surface on which the light receiving portion 44a is formed.
  • the solid-state image sensor 44 and the outer periphery of the side surface of the solid-state image sensor 44 are covered with a metal reinforcing member 52.
  • the reinforcing member 52 is installed apart from the solid-state imaging device 44, the FPC substrate 45, and the multilayer substrate 46.
  • the outer ends of the image pickup unit 40 and the tip end portion of the electric cable bundle 47 are covered with a heat shrinkable tube 50 in order to improve resistance. Inside the heat shrinkable tube 50, a gap between components is filled with an adhesive resin 51.
  • the solid-state image sensor holder 53 holds the solid-state image sensor 44 that adheres to the glass lid 49 by fitting the outer peripheral surface of the glass lid 49 to the inner peripheral surface of the base end side of the solid-state image sensor holder 53.
  • the proximal end side outer peripheral surface of the solid-state image sensor holder 53 is fitted to the distal end side inner peripheral surface of the reinforcing member 52.
  • the base end side outer peripheral surface of the lens holder 43 b is fitted to the front end side inner peripheral surface of the solid-state image sensor holder 53.
  • the outer peripheral surface of the lens holder 43b, the outer peripheral surface of the solid-state imaging device holder 53, and the outer peripheral surface of the distal end side of the heat shrinkable tube 50 are bonded to the distal end portion main body 41 by the adhesive 41a. It is fixed to the inner peripheral surface of the tip.
  • FIG. 3 is a top view of the imaging device 35 shown in FIG. 4 is a cross-sectional view taken along line AA in FIG. 5 is a cross-sectional view taken along line BB in FIG.
  • FIG. 6 is a top view of the land.
  • the lens unit 43 and the signal cable 48 are not shown.
  • lands 60-1, 60-2, 61-1, 61-2, 62-1 and 62-2 on which electronic components 55, 56 and 57 are mounted are formed on the upper surface of the multilayer substrate 46. Is formed.
  • the electronic components 55 to 57 have a prismatic shape and have electrodes 55a-1, 55a-2, 56a-1, 56a-2, 57a-1, and 57a-2 at both ends in the longitudinal direction.
  • the electrodes 55a-1 and 55a-2 of the electronic component 55 are connected to the pair of lands 60-1 and 60-2 by solder 58, and the electrodes 56a-1 and 56a-2 of the electronic component 56 are connected to the pair of lands 61- 1 and 61-2 are connected by solder 58, and electrodes 57a-1 and 57a-2 of the electronic component 57 are connected by a solder 58 to a pair of lands 62-1 and 62-2.
  • the electronic components 55, 56, and 57 are not limited to the prismatic shape as shown in FIG. 4, and may be, for example, those having round corners.
  • the lands 60-1 and 60-2 have two regions 601 and 602 having different temperature increase rates per unit time when the solder is heated, and the temperature increase rate is high.
  • the high region 601 is mainly disposed outside the region where the electronic component 55 is placed, that is, the region outside the end surface f1 in the longitudinal direction of the electronic component 55 in the lands 60-1 and 60-2.
  • the region 602 with a low temperature rise rate is mainly disposed in a region where the electronic component 55 is placed, that is, in a region inside the end surface f1 in the longitudinal direction of the electronic component 55 in the lands 60-1 and 60-2.
  • the region 601 with a high temperature increase rate is wider than the region 602 with a low temperature increase rate.
  • the length mounted on the lands 60-1 and 60-2 is the length of the ridge line A in the region 601 where the temperature increase rate is high. This is longer than the ridgeline B in the region 602 where the temperature increase rate is low.
  • the mounting position of the electronic component 55 is indicated by a dotted line, and the ridge line A in the region 601 where the temperature increase rate is high among the ridge line portion constituted by the bottom surface and the side surface of the electrode 55 a-2 is indicated by a dashed line.
  • the ridge line B in the region 602 where the rate is low is indicated by a two-dot broken line.
  • the solder 58 is melted by heating so that the electronic component 55 is
  • the temperature of the region 601 with the high rate of temperature increase first increases the solder 58 in the region 601 and the electronic component 55 Fillets are likely to be formed on the end surfaces f1 of the electrodes 55a-1 and 55a-2, and on the side surfaces of some end surfaces f2 and f3. Thereby, the reliability of the connection between the electronic component 55 and the lands 60-1 and 60-2 can be improved.
  • the fillet height can be increased by allowing the solder 58 to exist outside the region where the electronic component 55 is placed, that is, outside the end face f1 in the longitudinal direction of the electronic component 55 in the lands 60-1 and 60-2.
  • the length in the longitudinal direction of the electronic component 55 in the region 601 where the temperature rise rate is high is preferably 50% or less, and more preferably 30% or less.
  • the length 601 of the electronic component 55 in the longitudinal direction of the region 601 where the temperature rise rate is high is preferable that the length d3 in the longitudinal direction of the electronic component 55 in the region 602 where the temperature increase rate is low is substantially the same.
  • the region 601 having a high temperature increase rate is formed from a material having a higher thermal conductivity than the region 602 having a low temperature increase rate.
  • a region having a high temperature increase rate is formed from copper and a region having a low temperature increase rate is formed from aluminum.
  • a gold plating layer 603 for improving conductivity is formed on the surfaces of the regions 601 and 602.
  • the lands 60-1 and 60-2 on which the electronic component 55 is mounted have been described.
  • the lands 61-1, 61-2, 62-1, and 62-2 on which the electronic components 56 and 57 are mounted are also included in the land 60.
  • the two regions 601 and 602 having different temperature rise rates per unit time, and the region 601 having a high temperature rise rate is mainly outside the region where the electronic components 56 and 57 are placed.
  • the lands 61-1, 61-2, 62-1, and 62-2 are mainly disposed in a region outside the end face f1 in the longitudinal direction of the electronic components 56 and 57.
  • FIG. 7 is a top view of the land according to the second embodiment.
  • 8 is a cross-sectional view taken along the line CC of FIG.
  • the region 601 having a high temperature rise rate is mainly disposed in a region outside the end surface of the electronic component 55 in the short direction.
  • the same materials as those in Embodiment 1 can be used for the region 601 with a high temperature increase rate and the region 602 with a low temperature increase rate.
  • a gold plating layer 603 for improving conductivity is formed on the surfaces of the regions 601 and 602 as in the first embodiment.
  • the region 601 where the temperature rise rate is high is mainly disposed outside the region where the electronic component 55 is placed, that is, the region outside the end faces f2 and f3 in the short direction of the electronic component 55 in the lands 60A-1 and 60A-2.
  • the region 602 having a low temperature rise rate is mainly disposed in a region where the electronic component 55 is placed, that is, in a region inside the end surfaces f2 and f3 in the short direction of the electronic component 55 in the lands 60A-1 and 60A-2. Yes.
  • the lands 60A-1 and 60A-2 three regions are formed in parallel in the short direction of the electronic component 55.
  • the three regions include two regions 601 having a high rate of temperature rise, and 1
  • the two temperature increase rates are two regions 602, and the two high temperature increase rates region 601 are arranged so as to sandwich the low temperature increase rate region 602 and are hidden by the electronic component 55 after the electronic component 55 is mounted.
  • the lands 60A-1 and 60A-2 that are exposed without being exposed are only the region 601 having a high temperature rise rate.
  • the region 602 where the temperature rise rate is low is completely hidden by the electronic component 55.
  • the region 601 having a high temperature rise rate is mainly disposed in a region outside the end faces f2 and f3 in the short direction of the electronic component 55 in the lands 60A-1 and 60A-2.
  • the temperature of the region 601 where the rate of temperature increase is high first, so that the solder 58 gathers in the region 601 and the electrodes 55a-1, 55a of the electronic component 55 are collected.
  • -2 tends to form fillets on the side surfaces of the end surfaces f2 and f3. Thereby, the reliability of the connection between the electronic component 55 and the lands 60A-1 and 60A-2 can be improved.
  • the fillet height is increased. Can be high.
  • the length in the short direction of the electronic component 55 in the region 601 where the temperature rise rate is high.
  • the length d5 of the lower part of the electronic component 55 in the region 601 where the temperature rise rate is high with respect to the length d4 is preferably 50% or less, and more preferably 30% or less.
  • the length d6 in the short direction of the electronic component 55 in the region 602 with a low rate of temperature rise is preferably substantially the same as the length d4 in the short direction of the electronic component 55 in the region 601 where the increase rate is high.
  • the end surfaces in the longitudinal direction of the electronic components 55 of the lands 60A-1 and 60A-2 are formed so as to be aligned with the end surfaces f1 in the longitudinal direction of the electronic components 55. Therefore, the length required in the longitudinal direction of the electronic component 55 of the lands 60A-1 and 60A-2 required for mounting the electronic component 55 can be shortened, and high-density mounting in the longitudinal direction of the electronic component 55 becomes possible.
  • FIG. 9 is a top view of a land when the electronic component 55 according to the third embodiment is mounted.
  • the region 601 where the temperature rise rate is high is outside the end surface in the longitudinal direction of the electronic component 55 and the short side of the electronic component 55. It is mainly disposed in a region outside the end face in the direction.
  • the same materials as those in Embodiment 1 can be used for the region 601 with a high temperature increase rate and the region 602 with a low temperature increase rate.
  • a gold plating layer 603 for improving conductivity is formed on the surfaces of the regions 601 and 602 as in the first embodiment.
  • the region 601 having a high temperature rise rate is mainly disposed in the lands 60B-1 and 60B-2 outside the longitudinal end face f1 of the electronic component 55 and outside the lateral end faces f2 and f3.
  • the region 602 where the rate of temperature increase is low is mainly in the region where the electronic component 55 is placed, that is, on the lands 60B-1 and 60B-2, inside the longitudinal end surface f1 of the electronic component 55 and in the short side end surface f2. It is arranged in a region inside f3.
  • the lands 60B-1 and 60B-2 are arranged so that the region 601 having a high temperature increase rate surrounds the region 602 having a low temperature increase rate in a U shape, and after the electronic component 55 is mounted.
  • the lands 60B-1 and 60B-2 exposed without being hidden by the electronic component 55 are only the region 601 having a high temperature rise rate.
  • the region 602 where the temperature rise rate is low is completely hidden by the electronic component 55.
  • the region 601 having a high rate of temperature rise mainly in the regions outside the end surfaces f1 and f3 in the short direction and outside the end surfaces f2 and f3 in the short direction in the lands 60B-1 and 60B-2 By disposing the region 601 having a high rate of temperature rise mainly in the regions outside the end surfaces f1 and f3 in the short direction and outside the end surfaces f2 and f3 in the short direction in the lands 60B-1 and 60B-2, the temperature of the region 601 where the temperature rise rate is high first increases, so that the solder 58 gathers in the region 601 and the electrons Fillets are likely to be formed on the side surfaces of the electrodes 55a-1, 55a-2 of the component 55 on the side of the end faces f1, f2, f3. Thereby, the reliability of the connection between the electronic component 55 and the lands 60B-1 and 60B-2 can be improved.
  • Solder 58 is placed outside the area where electronic component 55 is placed, that is, outside land 50B-1 and 60B-2, outside end surface f1 in the longitudinal direction of electronic component 55 and outside end surfaces f2 and f3 in the short direction. By making it mainly exist, the height of the fillet can be increased. In order to make many solders 58 exist in places other than the lower portions of the electrodes 55a-1 and 55a-2 in the region 601 where the temperature rise rate is high, the length in the longitudinal direction of the electronic component 55 in the region 601 where the temperature rise rate is high.
  • the length d2 in the longitudinal direction of the lower part of the electronic component 55 in the region 601 with a high temperature rise rate with respect to d1 is preferably 50% or less, and more preferably 30% or less. Further, the length d5 in the short direction of the lower part of the electronic component 55 in the region 601 with a high temperature rise rate is 50% or less with respect to the length d4 in the short direction of the electronic component 55 in the region 601 with a high temperature rise rate. It is preferably 30% or less.
  • Solder 58 is placed outside the area where electronic component 55 is placed, that is, outside lands 60B-1 and 60B-2, outside end surface f1 in the longitudinal direction of electronic component 55 and outside end surfaces f2 and f3 in the short direction.
  • the length d3 in the longitudinal direction of the electronic component 55 in the region 602 with a low rate of temperature rise relative to the length d1 in the longitudinal direction of the electronic component 55 in the region 601 with a high temperature rise rate is 100% or more and 150%. The following is preferable.
  • the length d6 in the short direction of the electronic component 55 in the region 602 with a low temperature increase rate with respect to the length d4 in the short direction of the electronic component 55 in the region 601 with a high temperature increase rate is 100% or more and 300% or less. Preferably there is.
  • FIG. 10 is a top view of a land when the electronic component 55 according to the fourth embodiment is mounted.
  • the region 601 having a high temperature increase rate is disposed so as to surround the region 602 having a low temperature increase rate.
  • the same materials as those in Embodiment 1 can be used for the region 601 with a high temperature increase rate and the region 602 with a low temperature increase rate.
  • a gold plating layer 603 for improving conductivity is formed on the surfaces of the regions 601 and 602 as in the first embodiment.
  • the region 601 having a high temperature increase rate is disposed in the outer peripheral region of the lands 60C-1 and 60C-2, and the region 602 having a low temperature increase rate is disposed inside the lands 60C-1 and 60C-2. That is, the region 601 with a high temperature rise rate is arranged so as to surround the region 602 with a low temperature rise rate, and the land 60C-1 exposed without being hidden by the electronic component 55 after the electronic component 55 is mounted. , 60C-2 is only the region 601 where the temperature rise rate is high. The region 602 where the temperature rise rate is low is completely hidden by the electronic component 55.
  • the solder 58 When the region 601 having a high temperature rise rate is arranged in the outer peripheral region of the lands 60C-1 and 60C-2, the solder 58 is melted by heating to connect the electronic component 55 to the lands 60C-1 and 60C-2.
  • the temperature of the region 601 where the rate of temperature increase is high first the solder 58 gathers in the region 601 and is formed on the side surfaces of the end surfaces f1, f2, f3, and f4 of the electrodes 55a-1 and 55a-2 of the electronic component 55. Fillets are easily formed. Thereby, the reliability of the connection between the electronic component 55 and the lands 60C-1 and 60C-2 can be improved.
  • the fillet height can be increased.
  • the length d2 in the longitudinal direction of the lower part of the electronic component 55 is preferably 50% or less, and more preferably 30% or less.
  • the length d5 in the short direction of the lower part of the electronic component 55 in the region 601 with a high temperature rise rate is 50% or less with respect to the length d4 in the short direction of the electronic component 55 in the region 601 with a high temperature rise rate. It is preferably 30% or less.
  • Solder 58 is placed outside the area where electronic component 55 is placed, that is, outside lands 60C-1 and 60C-2, outside end surface f1 in the longitudinal direction of electronic component 55 and outside end surfaces f2 and f3 in the short direction.
  • the length d3 in the longitudinal direction of the electronic component 55 in the region 602 with a low rate of temperature rise relative to the length d1 in the longitudinal direction of the electronic component 55 in the region 601 with a high temperature rise rate is 50% or more and 100%. The following is preferable.
  • the length d6 in the short direction of the electronic component 55 in the region 602 with a low temperature increase rate with respect to the length d4 in the short direction of the electronic component 55 in the region 601 with a high temperature increase rate is 100% or more and 300% or less. Preferably there is.
  • FIG. 11 is a top view of a land when the electronic component 55 according to the fifth embodiment is mounted.
  • the region 601 where the rate of temperature rise is high is mainly inside the longitudinal end surface f4 of the electronic component 55 and the electronic component 55. It is mainly arranged in a region outside the end faces f2, f3 in the short direction.
  • the same materials as those in the first embodiment can be used for the region 601 having a high temperature increase rate and the region 602 having a low temperature increase rate.
  • a gold plating layer 603 for improving conductivity is formed on the surfaces of the regions 601 and 602 as in the first embodiment.
  • the region 601 having a high temperature rise rate is mainly inside the longitudinal end face f4 of the electronic component 55 in the lands 60D-1 and 60D-2 (center side of the electronic component 55) and outside the end faces f2 and f3 in the short direction. Located mainly in the area.
  • the region 602 where the rate of temperature rise is low is mainly in the region where the electronic component 55 is placed, that is, on the lands 60D-1 and 60D-2, inside the longitudinal end surface f1 of the electronic component 55 and in the short side end surface f2. It is arranged in a region inside f3.
  • the lands 60D-1 and 60D-2 are arranged so that the region 601 having a high temperature increase rate surrounds the region 602 having a low temperature increase rate in a U shape (the opening side is opposite to that of the third embodiment).
  • the lands 60D-1 and 60D-2 that are exposed without being hidden by the electronic component 55 after the electronic component 55 is mounted are only the region 601 having a high temperature rise rate.
  • the region 602 where the temperature rise rate is low is completely hidden by the electronic component 55.
  • the region 601 having a high temperature rise rate mainly in the region inside the longitudinal end surface f4 of the electronic component 55 and outside the lateral end surfaces f2, f3 in the lands 60D-1 and 60D-2 By disposing the region 601 having a high temperature rise rate mainly in the region inside the longitudinal end surface f4 of the electronic component 55 and outside the lateral end surfaces f2, f3 in the lands 60D-1 and 60D-2, When the solder 58 is melted by heating and the electronic component 55 is connected to the lands 60D-1 and 60D-2, the temperature of the region 601 where the temperature rise rate is high first increases, so that the solder 58 gathers in the region 601 and Fillets are likely to be formed on the side surfaces of the electrodes 55a-1, 55a-2 of the component 55 on the side of the end faces f2, f3, f4. Thereby, the reliability of the connection between the electronic component 55 and the lands 60D-1 and 60D-2 can be improved.
  • Solder 58 is located outside the area where electronic component 55 is placed, that is, in the land 60D-1, 60D-2, inside the longitudinal end surface f4 of electronic component 55 and outside the lateral end surfaces f2, f3. By making it mainly exist, the height of the fillet can be increased.
  • the length in the longitudinal direction of the electronic component 55 in the region 601 where the temperature rise rate is high is preferably 50% or less, and more preferably 30% or less.
  • the length d5 in the short direction of the lower part of the electronic component 55 in the region 601 with a high temperature rise rate is 50% or less with respect to the length d4 in the short direction of the electronic component 55 in the region 601 with a high temperature rise rate. It is preferably 30% or less.
  • Solder 58 is placed outside the area where electronic component 55 is placed, that is, inside lands 60D-1 and 60D-2, inside end surface f4 in the longitudinal direction of electronic component 55 and outside end surfaces f2 and f3 in the short direction.
  • the length d3 in the longitudinal direction of the electronic component 55 in the region 602 with a low temperature rise rate relative to the length d1 in the longitudinal direction of the electronic component 55 in the region 601 with a high temperature rise rate is 150% or more and 200%. The following is preferable.
  • the length d6 in the short direction of the electronic component 55 in the region 602 with a low temperature increase rate with respect to the length d4 in the short direction of the electronic component 55 in the region 601 with a high temperature increase rate is 100% or more and 300% or less. Preferably there is.
  • FIG. 12 is a top view of a land when the electronic component 55 according to the sixth embodiment is mounted.
  • the region 601 having a high temperature rise rate is mainly disposed in a region outside the end face in the longitudinal direction of the electronic component 55,
  • the end surfaces in the short direction of the electronic components 55 of 60E-1 and 60E-2 are formed so as to be aligned with the end surfaces f2 and f3 of the electronic components 55 in the short direction.
  • the same materials as those in Embodiment 1 can be used for the region 601 with a high temperature increase rate and the region 602 with a low temperature increase rate.
  • a gold plating layer 603 for improving conductivity is formed on the surfaces of the regions 601 and 602 as in the first embodiment.
  • the region 601 where the temperature rise rate is high is mainly disposed outside the region where the electronic component 55 is placed, that is, the region outside the end face f1 in the longitudinal direction of the electronic component 55 in the lands 60E-1 and 60E-2.
  • the region 602 where the rate of temperature rise is low is mainly disposed in the region where the electronic component 55 is placed, that is, in the region inside the longitudinal end face f1 of the electronic component 55 in the lands 60E-1 and 60E-2.
  • the lands 60E-1 and 60E-2 which are exposed without being hidden by the electronic component 55 after the 55 is mounted are only the region 601 where the temperature rise rate is high.
  • the region 602 where the temperature rise rate is low is completely hidden by the electronic component 55.
  • the solder 58 is melted by heating, so that the electronic component 55 is When connecting to the lands 60E-1 and 60E-2, the temperature of the region 601 where the rate of temperature increase is high first, so that the solder 58 gathers in the region 601 and the electrodes 55a-1 and 55a-2 of the electronic component 55 are connected. Fillets are easily formed on the side surface on the end face f1 side. Thereby, the reliability of the connection between the electronic component 55 and the lands 60E-1 and 60E-2 can be improved.
  • the fillet height can be increased.
  • the length in the longitudinal direction of the electronic component 55 in the region 601 where the temperature rise rate is high is preferably 50% or less, and more preferably 30% or less.
  • the short-side end surfaces of the electronic components 55 of the lands 60E-1 and 60E-2 are aligned with the long-side end surfaces f2 and f3 of the electronic components 55. Therefore, the length required in the short direction of the electronic component 55 of the lands 60E-1 and 60E-2 required for mounting the electronic component 55 can be shortened, and high-density mounting in the short direction of the electronic component 55 becomes possible.
  • FIG. 13 is a top view of a land when the electronic component 55 according to the seventh embodiment is mounted.
  • 14 is a cross-sectional view taken along the line EE of FIG.
  • the lands 60F-1 and 60F-2 on which the electronic component 55 is mounted have three regions with different temperature rise rates.
  • the lands 60F-1 and 60F-2 have three regions formed in parallel in the longitudinal direction of the electronic component 55.
  • the three regions include a region 601 having a high temperature increase rate and a region 602 having a low temperature increase rate.
  • the region 604 has a medium temperature increase rate, and the region 601, region 604, and region 602 are arranged in order of increasing temperature increase rate from the outside of the lands 60F-1 and 60F-2, and the electronic component 55 is mounted.
  • the areas of the lands 60F-1 and 60F-2 that are exposed without being hidden by the electronic component 55 are higher in the region 601 having a higher temperature increase rate and in the region 602 having a lower temperature increase rate or a medium temperature increase rate. It is wider than the area 604.
  • the region 601 having a high temperature increase rate, the region 604 having a medium temperature increase rate, and the region 602 having a low temperature increase rate are formed of, for example, copper, aluminum, or brass. Further, a gold plating layer 603 that improves conductivity is formed on the surfaces of the regions 601, 604, and 602.
  • the solder 58 is melted by heating and moved to a region having a high temperature.
  • the position shift of the electronic component 55 can be prevented.
  • the region 601, the region 604, and the region 602 are arranged in descending order of the temperature increase rate from the outside, so that the solder 58 is melted by heating and the electronic component 55 is replaced with the land 60F-1.
  • the solder 58 gathers in the outer region 601 where the rate of temperature rise is high, and a fillet is easily formed on the side surface of the electrodes 55a-1 and 55a-2 of the electronic component 55 on the side of the end surface f1.
  • the reliability of the connection between the electronic component 55 and the lands 60F-1 and 60F-2 can be improved.
  • the fillet height can be increased by making the solder 58 mainly exist in a region outside the end face f1 in the longitudinal direction of the electronic component 55.
  • FIG. 15 is a cross-sectional view of the land when the electronic component 55 according to the eighth embodiment is mounted.
  • the region 601 ′ having a high temperature increase rate is made of the same material as the region 602 ′ having a low temperature increase rate, for example, copper.
  • the thickness h1 of the region 601 ′ having a high temperature increase rate is formed thinner than the thickness h2 of the region 602 ′ having a low temperature increase rate.
  • a gold plating layer 603 for improving conductivity is formed on the surfaces of the regions 601 ′ and 602 ′ as in the first embodiment.
  • the lands 60G-1 and 60G-2 have two regions 601 ′ and 602 ′ having different temperature rise rates per unit time when viewed from the top during heating, and the region 601 ′ having a high temperature rise rate is mainly an electronic component.
  • 55 is mainly disposed outside the area where 55 is placed, that is, outside the end face f1 in the longitudinal direction of the electronic component 55 in the lands 60G-1 and 60G-2.
  • the region 602 ′ having a low temperature rise rate is mainly disposed in a region where the electronic component 55 is placed, that is, in a region inside the end surface f1 in the longitudinal direction of the electronic component 55 in the lands 60G-1 and 60G-2. .
  • the region 601 ′ having a high temperature rise rate is mainly disposed in a region outside the end face f1 in the longitudinal direction of the electronic component 55 in the lands 60G-1 and 60G-2, so that the solder 58 is melted by heating and the electronic component 55 is heated.
  • the temperature of the region 601 ′ having a high rate of temperature rise first increases, so that the solder 58 gathers in the region 601 ′, and the electrodes 55a-1, 55a of the electronic component 55
  • the fillet is easily formed on the side surface of the end surface f1. Thereby, the reliability of the connection between the electronic component 55 and the lands 60G-1 and 60G-2 can be improved.

Landscapes

  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Surgery (AREA)
  • Medical Informatics (AREA)
  • Molecular Biology (AREA)
  • Pathology (AREA)
  • Radiology & Medical Imaging (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Biophysics (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Endoscopes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'objectif de l'invention est de pourvoir à une structure de montage qui permette une réduction de taille et présente une fiabilité de connexion élevée, un dispositif de prise de vue et un endoscope. Une structure de montage de la présente invention est caractérisée en ce qu'elle comprend : un composant électronique (55), qui présente une forme prismatique et comprend des électrodes (55a-1, 55a-2) aux deux extrémités dans la direction longitudinale ; et une carte stratifiée (46) qui est pourvue d'une paire de plages d'accueil (60-1, 60-2) sur lesquelles le composant électronique (55) est monté au moyen d'une brasure (58). La structure de montage est également caractérisée en ce que : chacune des plages d'accueil (60-1, 60-2) comporte deux régions (601, 602) ayant des vitesses d'élévation de température par unité de temps différentes ; et la région (601) ayant une grande vitesse d'élévation de température est disposée à l'extérieur d'une région dans laquelle le composant électronique (55) est principalement placé.
PCT/JP2015/086568 2015-12-28 2015-12-28 Structure de montage, dispositif de prise de vue et endoscope Ceased WO2017115441A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2015/086568 WO2017115441A1 (fr) 2015-12-28 2015-12-28 Structure de montage, dispositif de prise de vue et endoscope
JP2017558834A JPWO2017115441A1 (ja) 2015-12-28 2015-12-28 実装構造体、撮像装置および内視鏡

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2015/086568 WO2017115441A1 (fr) 2015-12-28 2015-12-28 Structure de montage, dispositif de prise de vue et endoscope

Publications (1)

Publication Number Publication Date
WO2017115441A1 true WO2017115441A1 (fr) 2017-07-06

Family

ID=59225005

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2015/086568 Ceased WO2017115441A1 (fr) 2015-12-28 2015-12-28 Structure de montage, dispositif de prise de vue et endoscope

Country Status (2)

Country Link
JP (1) JPWO2017115441A1 (fr)
WO (1) WO2017115441A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024262239A1 (fr) * 2023-06-21 2024-12-26 ローム株式会社 Dispositif électronique
JP2025029031A (ja) * 2020-09-18 2025-03-05 日亜化学工業株式会社 発光装置
WO2025142038A1 (fr) * 2023-12-27 2025-07-03 株式会社村田製作所 Structure de montage pour composant électronique

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007250564A (ja) * 2006-03-13 2007-09-27 Mitsubishi Electric Corp セラミック回路モジュールおよびその製造方法
JP2009158668A (ja) * 2007-12-26 2009-07-16 Sumitomo Metal Electronics Devices Inc セラミック多層配線基板及びその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007250564A (ja) * 2006-03-13 2007-09-27 Mitsubishi Electric Corp セラミック回路モジュールおよびその製造方法
JP2009158668A (ja) * 2007-12-26 2009-07-16 Sumitomo Metal Electronics Devices Inc セラミック多層配線基板及びその製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025029031A (ja) * 2020-09-18 2025-03-05 日亜化学工業株式会社 発光装置
WO2024262239A1 (fr) * 2023-06-21 2024-12-26 ローム株式会社 Dispositif électronique
WO2025142038A1 (fr) * 2023-12-27 2025-07-03 株式会社村田製作所 Structure de montage pour composant électronique

Also Published As

Publication number Publication date
JPWO2017115441A1 (ja) 2018-10-18

Similar Documents

Publication Publication Date Title
US9345395B2 (en) Imaging module and endoscope device
CN105592773B (zh) 摄像模块和内窥镜装置
EP3050491B1 (fr) Dispositif d'endoscope
JP6464321B2 (ja) 電子回路ユニット、撮像ユニットおよび内視鏡
JP6570657B2 (ja) 撮像装置、内視鏡および撮像装置の製造方法
JP6205228B2 (ja) 撮像モジュールおよび内視鏡装置
CN106999023A (zh) 摄像单元、内窥镜以及摄像单元的制造方法
WO2017081720A1 (fr) Structure de connexion de câble, module d'imagerie, et endoscope
WO2017115441A1 (fr) Structure de montage, dispositif de prise de vue et endoscope
US10517465B2 (en) Cable connection structure and endoscope apparatus
US10191270B2 (en) Imaging unit and endoscope apparatus
JP6099541B2 (ja) 内視鏡及び内視鏡の製造方法
JP6321916B2 (ja) 撮像装置および電子内視鏡
JP6503205B2 (ja) 撮像装置
JP6081347B2 (ja) 撮像ユニットおよび内視鏡
JP2015080633A (ja) 電気ユニット及び電気ユニットを用いた内視鏡装置
WO2017104055A1 (fr) Unité de capture d'images, endoscope et procédé de fabrication pour unité de capture d'image

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15912107

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2017558834

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 15912107

Country of ref document: EP

Kind code of ref document: A1