WO2017111348A1 - Flip device handler - Google Patents

Abstract

The present invention relates to a flip device handler, and more specifically, to a flip device handler for picking up a device having finished undergoing a sawing process from a wafer and placing same on a substrate for performing a packaging process. The present invention discloses a flip device handler comprising: a wafer ring table (200) which supports and transfers, in a horizontal direction, a wafer ring (60) having a plurality of devices (1) attached thereto; one or more receiver tables (300) which are installed on one side of the wafer ring table (200) and transfer, in a horizontal direction, a receiver (70) which receives the devices from the wafer ring table (200) and has same attached thereto; flip tools (400) which are installed so that the number thereof corresponds to the number of receiver tables (300), and which pick up, at the wafer ring table (200), the devices (1) from the wafer ring (60), and reverse the picked-up devices (1) so that same face upward; and loading tools (500) which are installed so that the number thereof corresponds to the number of receiver tables (300), and which pick up the devices (1) reversed by the flip tools (400), and attach, at the receiver table (300), the devices (1) to the receiver (70).

Description

Flip device handler

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flip device handler, and more particularly, to a flip device handler that picks up a finished device from a wafer and places it on a substrate for carrying out a packaging process.

BACKGROUND OF THE INVENTION As semiconductor devices develop fine processes such as nano processes, their overall sizes tend to be significantly smaller than before.

In addition, with the development of smart phones and the trend of thinning of smart phones, when used in smart phones, smart watches, etc., it is required to minimize the size of the device as well as the thickness.

In response to these trends and demands, semiconductor devices are packaged into individual devices through a sawing process, instead of a packaging process by molding after the sawing process by a bonder, so-called WL-. Wafer level chip scale pacake (CSP) is used as in Patent No. 10-1088205.

On the other hand, in forming the WL-CSP device, when the device is small, there are many limitations in forming the ball terminal at the wafer level, so that the device manufacturing process is difficult.

Accordingly, a so-called Fan-Out WLP process for performing a sawing process and molding individual devices, forming terminals, etc., has been proposed for devices that have completed the semiconductor process.

SUMMARY OF THE INVENTION An object of the present invention is to provide a device handler capable of placing a wafer-level device into a wafer panel for performing a fan-out WLP process in response to the above trend.

The present invention was created in order to achieve the object of the present invention as described above, the present invention, the wafer ring table 200 for supporting the wafer ring 60 to which the plurality of elements (1) is attached to move in a horizontal direction and; At least one receiver table (300) installed at one side of the wafer ring table (200) and moving the receiver (70) to receive a device from the wafer ring table (200) and attached thereto; A flip tool installed corresponding to the number of the receiver tables 300 and picking up the element 1 from the wafer ring 60 in the wafer ring table 200 and inverting the picked up element 1 upwards ( 400); A stacking device installed corresponding to the number of the receiver tables 300 and picking up the inverted device 1 in the flip tool 400 to attach the device 1 to the receiver 70 in the receiver table 300. Disclosed is a flip device handler comprising a tool 500.

The flip device handler is installed on the transfer path of the device 1 between the wafer ring table 200 and the receiver table 300 and is picked up by the flip tool 400 and inverted upward. It may include a top vision unit 820 to obtain an image for 1).

The flip device handler is installed on the transfer path of the device 1 between the wafer ring table 200 and the receiver table 300 and is transferred to the device 1 that is picked up and transferred by the loading tool 500. It may include an under vision unit 830 to obtain an image for.

The receiver table 300 may be installed in a pair to face each other with respect to the wafer ring table 200.

The pair of flip tools 400 may be alternately moved between a pick-up position on the wafer ring 60 and a transfer position for transferring the device to the stacking tool 500.

The flip tool 400 may include one or more pickers 410 picking up the device 1, a linear moving unit for moving the pickers 410 picking up the device 1 from the pick-up position to the transfer position; In addition, the picker 410 picking up the device 1 may include an inverting unit for inverting upward.

The flip element handler may include an image acquisition unit 810 which is installed directly above the pick-up position and acquires an image of all or a portion of the wafer ring 60.

The flip tool 400 includes a plurality of pickers 410 picking up one element 1, and the plurality of pickers 410 of the flip tool 400 are each on the wafer ring 60. The device 1 is sequentially picked up at a pick-up position, and the stacking tool 500 includes a plurality of pickers 510 corresponding to the number of the flip tools 400. The plurality of pickers 510 may be configured to attach the device 1 sequentially to the receiver 70, respectively.

Pick-up position ① of the element 1 picked up by the picker 410 of the flip tool 400 on the wafering table 200, the loading tool 500 in a state of being pulled out by the flip tool 400. The delivery position ② for transmitting the furnace element 1, and the attachment position ③ to which the element 1 is attached by the loading tool 500 on the receiver table 300 may be arranged in a straight line.

Pick-up position ① of the element 1 picked up by the picker 410 of the flip tool 400 on the wafering table 200, and the stacking tool 500 in a state of being pulled out by the flip tool 400. A first direction formed by a delivery position ② for transmitting the element 1 to the) and an attachment position ③ to which the element 1 is attached by the stacking tool 500 on the delivery position ②, and the receiver table 300. The second direction to be formed may be disposed perpendicular to each other.

The flip device handler according to the present invention provides a flip device handler for placing a wafer-level device into a wafer panel for performing a fan-out WLP process (either loading or attaching), thereby making the fan-out WLP process more efficient. There is an advantage that can be done with.

In particular, by using a flip device handler according to the present invention, a wafer-level device is placed on a wafer panel for performing a fan-out WLP process, for example, by attaching the wafer-level device to improve productivity by performing a fan-out WLP process quickly and effectively. There is an advantage to this.

Furthermore, in the flip device handler according to the present invention, the fan-out WLP process can be efficiently and efficiently provided by having two or more receiver tables for handling the wafer panel around the wafer ring to which the wafer after the semiconductor process and the sawing process is attached. By doing so, there is an advantage to improve productivity.

1 is a layout view showing an example of a flip device handler according to the present invention.

2A and 2B are a perspective view and a cross-sectional view illustrating an example of a wafer ring used in the flip device handler of FIG. 1, respectively.

3 is a perspective view illustrating an example of a receiver used in the flip device handler of FIG. 1.

4 is a conceptual diagram illustrating a process of transferring a device in the flip device handler of FIG. 1.

FIG. 5 is a layout view illustrating a modified example of the flip device handler of FIG. 1.

6 is a conceptual diagram illustrating a process of transferring a device in the flip device handler of FIG. 5.

FIG. 7 is a layout view illustrating another modified example of the flip device handler of FIG. 1.

FIG. 8 is a layout view illustrating another modified example of the flip device handler of FIG. 1.

Hereinafter, a flip device handler according to the present invention will be described with reference to the accompanying drawings.

As shown in FIG. 1, a flip device handler includes: a wafer ring table 200 supporting a wafer ring 60 to which a plurality of devices 1 are attached and moving in a horizontal direction; At least one receiver table (300) installed at one side of the wafer ring table (200) and moving the receiver (70) to receive the element (1) from the wafer ring table (200) and attached thereto; The flip tool 400 is installed corresponding to the number of receiver tables 300 and picks up the element 1 from the wafer ring 60 in the wafer ring table 200 and inverts the picked-up element 1 upward. and; The stacking tool 500 installed corresponding to the number of receiver tables 300 and picking up the inverted elements 1 in the flip tool 400 and attaching the elements 1 to the receiver 70 in the receiver table 300. It includes.

Herein, the device 1 mounted on the wafer ring 60 may be a device that has been subjected to a semiconductor process and a sawing process in a wafer state, and a device classified by a separate flip device handler through vision inspection in the wafer state.

In particular, the device 1 is a device that has completed a semiconductor process and a sawing process, and may be an object attached to a receiver 70 such as a wafer panel so that a so-called Fan-Out WLP process may be performed.

On the other hand, the wafer ring 60, as shown in Figures 2a and 2b, is a configuration that is attached to the wafer after the semiconductor process and sawing process, the fixing of the tape 61 and the tape 61 to which the wafer is attached It may be configured to include a frame member 62.

The wafer ring 60 may be separated into individual elements 1 by the expansion of the tape 61 in the wafer attached to the tape 61.

In addition, the frame member 62, as shown in Figures 2a and 2b as a configuration for fixing the tape 61 to which the elements 1 are attached, it is possible to a variety of configurations, such as circular ring, square ring.

The wafer ring table 200 supports the wafer ring 60 to which the plurality of devices 1 are attached to move the wafer ring 60 in a horizontal direction to allow device pickup by the pull tool 400 described later. Various configurations are possible as a structure to make.

For example, the wafer ring table 200 receives the wafer ring 60 from the wafer ring cassette unit 100 by a wafer ring loading unit (not shown), so that the pull tool 400 receives the element ( As the configuration in which the wafer ring 60 is moved in the horizontal direction to pick up 1), various configurations such as an XY table and an XY-Θ table are possible.

In addition, the wafer ring table 200 may be moved in the vertical direction, that is, the Z axis direction.

In addition, it is preferable that the needle pin assembly 490 is installed at the lower side of the wafer ring table 200 for smooth element pickup at the pickup position ①.

Here, the pick-up position ① is set on the wafer ring table 200 and is defined as a position picked up by the picker 410 of the flip tool 400 together with the needle pin assembly 490.

The needle pin assembly 490 presses the bottom surface of the wafer ring 60, for example, the tape 61 of the wafer ring 60, when the flip tool 400 picks up the element 1 at the pick-up position ①. By pushing the tape 61 attached to the device 1 toward the flip tool 400, various configurations are possible.

On the other hand, when the flip tool 400 picks up the element 1 at the pick-up position ①, the wafer ring (1) is placed directly above the pick-up position ① to check the position and alignment of the element 1 on the wafer ring 60. 60) an image acquisition unit 810 is provided for acquiring an image of all or a portion thereof.

The image acquisition unit 810 is configured to acquire an image of all or a portion of the wafer ring 60 at the upper portion of the pickup position ①, and is composed of a camera or the like, and the obtained image is formed on the wafer ring 60. It is transmitted to the control unit to check the position and alignment of the device (1).

The controller may be configured to control the operation of the flip device handler as well as the image acquisition unit 810, and may be configured in a circuit configuration rather than a physical configuration.

On the other hand, the wafer ring cassette unit 100 is a configuration in which a plurality of wafer rings 60 to which a plurality of elements 1 are attached are loaded, and various configurations are possible.

For example, the wafer ring cassette unit 100 may form a cassette structure in which a plurality of wafer rings 60 are stacked up and down, and the wafer ring is transferred or returned to the wafer ring table 200 by a pusher or a gripper. Can be.

The receiver table 300 is installed on one side of the wafer ring table 200, and is configured to move the receiver 70, which receives the element 1 from the wafer ring table 200, and is attached to one or more horizontally in one or more configurations. Can be installed.

As illustrated in FIG. 1, the receiver table 300 may be installed as one, or as illustrated in FIG. 5, such that the receiver table 300 is arranged in a pair to face each other with respect to the wafer ring table 200. Can be.

5 and 6, when the receiver table 300 is installed in a pair to face each other with respect to the wafer ring table 200, the flip tool 400 and the stacking tool 500 to be described later will be described later. It is also installed in pairs.

And while the first flip tool 400, which is one of the pair of flip tools 400, picks up the element 1 at the pickup position ①, the second flip tool 400, which is the other one, is a transfer position ②. The first process of transferring the device 1 to the stacking tool 500, and after the first process, the second flip tool 400 picks up the device 1 at the pickup position ① and the second flip tool ( 400 is moved to the delivery position ② is carried out in sequence to repeat the second process of transferring the device 1 to the loading tool (500).

In addition, the first flip tool 400 and the second flip tool 400 are alternately moved between the pick-up position ① and the transfer position ② for efficient and stable repeating of the first and second processes. It can be configured to linearly move between the pickup position ① and the transfer position ② in a state supported by the support of the.

The transfer position ② is a position set to transfer the element 1 picked up and flipped by the flip tool 400 to the stacking tool 500 and according to the device transfer of the flip tool 400 and the stacking tool 500. It can be set in various ways.

Meanwhile, the receiver 70 may have various configurations according to a subsequent process performed as a configuration in which the device 1 is attached to perform a subsequent process in an inverted state by the flip tool 400 and the stacking tool 500. It is possible.

For example, the receiver 70 may have a configuration similar to the wafer ring 60 described above, or may have various shapes such as a circle and a quadrangle.

As another example, as shown in FIG. 3, the receiver 70 may include a tape 71 to which the elements 1 are attached and a frame member 72 to fix the tape 71. have.

The receiver 70 is configured to form a fan-out WLP wafer in which the device 1 is embedded by being molded by a molding material such as EMC by a subsequent process after the device 1 is inverted and attached. This is possible.

The Fan-Out WLP wafer is formed as a Fan-Out WLP chip through a sawing process after forming a molding and a terminal such as a ball terminal as part of the Fan-Out WLP.

The receiver table 300 receives the receiver 70 from the receiver cassette unit 900 by a receiver loading unit (not shown) so that the loading tool 500 can attach the element 1 at the attachment position ③. As the configuration for moving the receiver 70 in the horizontal direction, various configurations such as an XY table and an XY-Θ table are possible.

In addition, the receiver table 300 may be moved in the vertical direction, that is, the Z axis direction.

The attachment position 3 is an attachment position 3 of the element 1 on the receiver 70 located in the receiver table 300 and is set according to the type, size, etc. of the element 1.

Meanwhile, an image acquisition unit (not shown) for acquiring an image of all or a portion of the receiver 70 may be installed at an upper portion of the attachment position ③ in the receiver table 300.

The image acquisition unit is configured to acquire an image of all or a part of the receiver 70 at the upper portion of the attachment position ③, and is composed of a camera or the like, and the obtained image is a surface state of the element 1 on the receiver 70. It is delivered to the control unit to check the attachment state.

The flip tool 400 is installed corresponding to the number of receiver tables 300 and picks up the device 1 from the wafer ring 60 in the wafer ring table 200 and moves the picked up device 1 upward. Various configurations are possible as the configuration to be reversed so as to.

For example, the flip tool 400 may include one or more pickers 410 picking up the device 1 and linear movements of the pickers 410 picking up the device 1 from the pick-up position ① to the transfer position ②. The moving unit may include an inverting unit for inverting the pickers 410 picking up the element 1 upward.

The picker 410 may be configured to pick up the device 1 from the wafer ring 60 by vacuum pressure.

As an example, the picker 410 may include a pneumatic connection portion that receives air pressure from the outside, and a pickup head installed at the end to pick up or release the element 1 by pneumatic pressure transmitted by the pneumatic connection portion. Can be.

Here, the pickers 410 are preferably provided in plurality in order to increase the feed speed of the device 1.

Specifically, the pickers 410 are installed in four, picking up the device 10 in sequence at the pickup position ①, by transferring the four devices 1 at a time to the stacking tool 500 to be described later ( The feed speed of 1) can be increased.

The linear moving unit is configured to move the pickers 410 picking up the element 1 from the pick-up position ① to the transfer position ②.

The inverting unit is configured to invert the pickers 410 picking up the element 1 upward, and any configuration may be used as long as the inverting unit picks up the pickers 410 picking up the element 1.

The stacking tool 500 is installed in correspondence with the number of receiver tables 300, and the device 1 picked up by the flip tool 400 at the transfer position ② of the device 1 inverted in the flip tool 400. It is possible to pick up and to attach the element 1 to the receiver 70 at the receiver 70 of the receiver table 300, that is, at the attachment position e.

Specifically, the stacking tool 500 includes one or more pickers 510 picking up the device 1 picked up by the flip tool 400 and a picker 510 picking up the device 1. It may include a linear moving unit to move from ② to the attachment position ③.

The picker 510 may be configured to pick up the element 1 picked up by the flip tool 400 at the transfer position ② by vacuum pressure.

As an example, the picker 510 may include a pneumatic connection portion which receives air pressure from the outside, and a pickup head installed at an end to pick up or release the element 1 by pneumatic pressure transmitted by the pneumatic connection portion. Can be.

Here, the pickers 510 may be installed in correspondence with the number of pickers 510 of the pick-up tool 400 in order to increase the feeding speed of the device 1.

Specifically, the pickers 510 are installed in four and picked up the elements 1 picked up by the flip tool 400 at the transfer position ② at one time, thereby sequentially picking up the elements 1 to the receiver 70. By attaching, the conveyance and attachment speed of the element 1 can be increased.

The linear moving unit is configured to move the pickers 510 picking up the element 1 from the transfer position ② to the attachment position ③, and various configurations are possible.

On the other hand, the handler according to the present invention is installed on the transfer path of the device 1 between the wafer ring table 200 and the receiver table 300, picked up by the flip tool 400 and inverted toward the upper side ( It may include a top vision unit 820 to obtain an image for 1).

The top vision unit 820 may analyze the acquired image to check the surface state, alignment state, etc. of the device 1 before the device 1 is transferred from the flip tool 400 to the loading tool 500. It may be configured as a camera or the like as a configuration for acquiring an image of the device 1 picked up by the tool 400 and inverted upward.

Here, the top vision unit 820 transfers an image of the device 1, which is picked up by the flip tool 400 and inverted upward, to the controller, and the controller performs image analysis on the surface state of the device 1. You can check the alignment status.

In addition, the image of the device 1 obtained by the top vision unit 820 is an image of the surface, that is, the bottom surface, attached to the tape 61 based on the device 1 on the wafer ring.

On the other hand, the handler according to the present invention is installed on the transfer path of the device 1 between the wafer ring table 200 and the receiver table 300 to the device 1 picked up by the stacking tool 500 and transferred. It may include an under vision unit 830 to obtain an image for.

The under vision unit 830 analyzes the acquired image and checks the surface state, alignment state, etc. of the device 1 before attaching the device 1 to the receiver 70 by the loading tool 500. As a configuration for acquiring an image of the device 1 picked up by the stacking tool 500, it may be configured as a camera.

Here, the under vision unit 830 transmits an image of the device 1 picked up by the loading tool 500 to the control unit, and the control unit displays the surface state, the alignment state, etc. of the device 1 through image analysis. You can check it.

In addition, the image of the device 1 obtained by the under vision unit 830 is an image of an opposite surface, that is, an upper surface of the surface attached to the tape 61 based on the device 1 on the wafer ring.

On the other hand, the flip element handler having the above configuration, various embodiments are possible depending on the arrangement of the pickup position (1), the transfer position (2) and the attachment position (3).

For example, in the flip element handler according to the present invention, as illustrated in FIGS. 1 and 5, the pickup position ①, the transfer position ② and the attachment position ③ may be disposed in a straight line, that is, in the X-axis direction.

As another example, the flip element handler according to the present invention, as shown in Figures 7 and 8, the first direction that the pick-up position ① and the transfer position ②, that is, the X-axis direction, the transfer position ② and the attachment position ③ The second direction ie, the Y-axis direction may be perpendicular to each other.

In this case, the wafer ring cassette unit 100 and the receiver cassette unit 900 may be variously disposed according to surrounding conditions such as loading and unloading of the wafer ring cassette, loading and unloading of the receiver cassette.

Since the above has been described only with respect to some of the preferred embodiments that can be implemented by the present invention, the scope of the present invention, as is well known, should not be construed as limited to the above embodiments, the present invention described above It will be said that both the technical idea and the technical idea which together with the base are included in the scope of the present invention.

Claims (12)

A wafer ring table 200 supporting the wafer ring 60 to which the plurality of elements 1 are attached and moving in the horizontal direction; At least one receiver table (300) installed at one side of the wafer ring table (200) and moving the receiver (70) to receive a device from the wafer ring table (200) and attached thereto; A flip tool installed corresponding to the number of the receiver tables 300 and picking up the element 1 from the wafer ring 60 in the wafer ring table 200 and inverting the picked up element 1 upwards ( 400); A stacking device installed corresponding to the number of the receiver tables 300 and picking up the inverted device 1 in the flip tool 400 to attach the device 1 to the receiver 70 in the receiver table 300. Flip device handler, characterized in that it comprises a tool (500). The method according to claim 1, The image of the device 1 is installed on the transfer path of the device 1 between the wafer ring table 200 and the receiver table 300 and picked up by the flip tool 400 and inverted upward. Flip device handler, characterized in that it comprises a top vision portion (820) to obtain. The method according to claim 2, Under which is installed on the transfer path of the device (1) between the wafer ring table 200 and the receiver table (300) and under which an image for the device (1) picked up and transported by the loading tool (500) Flip device handler, characterized in that it comprises a vision portion (830). The method according to claim 1, Under which is installed on the transfer path of the device (1) between the wafer ring table 200 and the receiver table (300) and under which an image for the device (1) picked up and transported by the loading tool (500) Flip device handler, characterized in that it comprises a vision portion (830). The method according to any one of claims 1 to 4, The receiver table (300) is flip element handler, characterized in that installed in pairs facing each other around the wafer ring table (200). The method according to claim 5, The flip tool 400 is installed in pairs corresponding to the receiver table 300, The pair of flip tools (400), the flip element handler, characterized in that alternately moved between the pickup position (1) on the wafer ring (60) and the transfer position (2) to transfer the device to the stacking tool (500). The method according to claim 6, The flip tool 400 may include one or more pickers 410 picking up the device 1 and linear movements of the pickers 410 picking up the device 1 from the pick-up position ① to the transfer position ②. And an inverting portion for inverting the picker (410) picking up the element (1) upward. The method according to claim 7, And an image acquisition unit (810) installed at the upper portion of the pick-up position (1) and acquiring an image of all or a portion of the wafer ring (60). The method according to any one of claims 1 to 4, The flip tool 400 includes a plurality of pickers 410 picking up one device 1, A plurality of pickers 410 of the flip tool 400, each picking up the element 1 in sequence at the pickup position ① on the wafer ring 60, The stacking tool 500 includes a number of pickers 510 corresponding to the number of the flip tools 400, The plurality of pickers (510) of the stacking tool (500), each flip element handler, characterized in that to attach the element (1) sequentially to the receiver (70). The method according to claim 9, The receiver table (300) is flip element handler, characterized in that installed in pairs facing each other around the wafer ring table (200). The method according to any one of claims 1 to 4, Pick-up position ① of the element 1 picked up by the picker 410 of the flip tool 400 on the wafering table 200, the loading tool 500 in a state of being pulled out by the flip tool 400. And a transfer position (2) for transferring the element (1) to a row, and an attachment position (3) to which the element (1) is attached by the stacking tool (500) on the receiver table (300). The method according to any one of claims 1 to 4, Pick-up position ① of the element 1 picked up by the picker 410 of the flip tool 400 on the wafering table 200, and the stacking tool 500 in a state of being pulled out by the flip tool 400. The first direction formed by the transfer position ② for transferring the element 1 to The second direction formed by the transfer position ②, and the attachment position ③ to which the element 1 is attached by the loading tool 500 on the receiver table 300, Flip device handler, characterized in that perpendicular to each other.

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