[go: up one dir, main page]

WO2017109929A1 - Oscillateur à ultrasons et dispositif médical à ultrasons - Google Patents

Oscillateur à ultrasons et dispositif médical à ultrasons Download PDF

Info

Publication number
WO2017109929A1
WO2017109929A1 PCT/JP2015/086175 JP2015086175W WO2017109929A1 WO 2017109929 A1 WO2017109929 A1 WO 2017109929A1 JP 2015086175 W JP2015086175 W JP 2015086175W WO 2017109929 A1 WO2017109929 A1 WO 2017109929A1
Authority
WO
WIPO (PCT)
Prior art keywords
piezoelectric body
metal block
block
ultrasonic transducer
bonding surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2015/086175
Other languages
English (en)
Japanese (ja)
Inventor
塩谷　浩一
長英 坂井
伊藤　寛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Priority to PCT/JP2015/086175 priority Critical patent/WO2017109929A1/fr
Publication of WO2017109929A1 publication Critical patent/WO2017109929A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers

Definitions

  • the present invention relates to an ultrasonic transducer and an ultrasonic medical device using the ultrasonic transducer.
  • an ultrasonic medical apparatus that performs various treatments on a tissue by using friction and heat generated by ultrasonic vibration.
  • Such an ultrasonic medical device includes an ultrasonic transducer that generates ultrasonic vibrations.
  • the ultrasonic transducer is disposed, for example, in an operation unit on the hand side of the ultrasonic medical apparatus.
  • the ultrasonic vibration generated in the operation unit is transmitted to the treatment unit on the distal end side through a rod-like probe or the like.
  • the ultrasonic vibrator described in Patent Document 1 has a structure in which piezoelectric elements (piezoelectric bodies) and a plurality of metal blocks are alternately stacked and integrated.
  • the piezoelectric element and the metal block are joined by, for example, a thermosetting resin adhesive.
  • the piezoelectric element may be damaged.
  • One cause of the damage is a difference in thermal expansion coefficient between the piezoelectric element and the metal block. That is, when the adhesive is cured and the piezoelectric element and the metal block are joined in a state where the piezoelectric element and the metal block are expanded at different expansion rates at the time of thermosetting, the piezoelectric element and the terminal plate are contracted by returning to room temperature. Stress is generated at the joint site. The generated stress may damage the piezoelectric element.
  • a first aspect of the present invention includes a piezoelectric body portion in which a plurality of piezoelectric bodies are arranged and bonded in the stacking direction, and a metal block bonded to an end portion in the stacking direction of the piezoelectric body portion, At least one of the bonding surface facing the metal block in the piezoelectric body closest to the metal block among the plurality of piezoelectric bodies and the block bonding surface bonded to the piezoelectric body portion in the metal block are bonded counterparts. It is an ultrasonic transducer having a non-bonding region that can move relative to the piezoelectric body or the metal block.
  • the second aspect of the present invention is an ultrasonic medical device including the ultrasonic transducer of the present invention.
  • the ultrasonic transducer of the present invention it is possible to suitably prevent damage in the manufacturing process while having a laminated structure of piezoelectric bodies. Moreover, according to the ultrasonic medical device of the present invention, the ultrasonic transducer can be efficiently manufactured by including the ultrasonic transducer.
  • FIG. 1 is a schematic diagram showing a partial cross-sectional view of the overall configuration of an ultrasonic medical device 1 including the ultrasonic transducer according to the present embodiment.
  • the ultrasonic medical device 1 includes an insertion unit 10 to be inserted into a living body, a treatment unit 20 provided at a distal end of the insertion unit 10, an operation unit 30 connected to the insertion unit 10, and an operation unit 30.
  • the vibrator unit 40 is disposed.
  • the ultrasonic transducer 50 of the present embodiment is disposed in the transducer unit 40.
  • the transducer unit 40 is connected to an ultrasonic power source (not shown) via a cable 41.
  • the treatment unit 20 includes a probe 21 inserted through the insertion unit 10. The proximal end of the probe 21 is connected to the transducer unit 40.
  • the living tissue can be grasped by the treatment unit 20.
  • the ultrasonic transducer 50 vibrates.
  • the ultrasonic vibration generated by the ultrasonic vibrator 50 is transmitted to the distal end portion of the probe 21, and the treatment section 20 vibrates. Thereby, desired treatments such as coagulation and incision can be performed on the grasped living tissue.
  • FIG. 2 is a perspective view showing the ultrasonic transducer 50.
  • the ultrasonic transducer 50 includes a piezoelectric body portion 52 in which a plurality of piezoelectric bodies 51 are arranged and joined in the stacking direction, and a metal block 55 joined to the piezoelectric body portion 52, and functions as a Langevin vibrator. To do.
  • Each piezoelectric body 51 is a rectangular parallelepiped having a square front and back, and the front and back surfaces of adjacent piezoelectric bodies are joined together and stacked in a stacking direction connecting the front and back surfaces.
  • a single crystal of lithium niobate (LiNbO 3 ) is used as the piezoelectric body 51.
  • the material of the piezoelectric body 51 is not limited to lithium niobate, but from the viewpoint of use in the ultrasonic medical device 1, lithium niobate having high resistance to high temperatures is preferable.
  • the two metal blocks 55 are respectively joined to both end portions in the stacking direction of the piezoelectric body portion 52.
  • Examples of the material of the metal block 55 include duralumin, titanium alloy, and the like, and may be appropriately selected in consideration of required strength, vibration efficiency, and the like.
  • the dimension in the stacking direction of the metal blocks 55 is appropriately set based on the vibration frequency set in the ultrasonic transducer 50.
  • the adjacent piezoelectric bodies 51, and the piezoelectric body 51 and the metal block 55 are joined together using solder 56 which is a brazing material.
  • the ultrasonic vibrator 50 has improved resistance to high temperatures by using a solder (a brazing material), which is a metal material, for bonding, and can be suitably used for the ultrasonic medical device 1.
  • a base metal layer is provided on the entire front and back surfaces of the piezoelectric body 51 excluding piezoelectric bodies 51A and 51B, which will be described later, and the bonding surface of the metal block 55 with the piezoelectric body 51. Yes.
  • FIG. 3 shows a state before joining of the piezoelectric body 51A located on the most distal end side in the piezoelectric body portion 52 among the plurality of piezoelectric bodies 51.
  • a base metal layer 53 is formed on a front surface (bonding surface) 51 a bonded to the metal block 55.
  • the base metal layer 53 is formed so as to have a single-layer or multiple-layer structure using, for example, titanium, platinum, gold, or the like.
  • the base metal layer 53 can be formed on the surface of the piezoelectric body 51 by, for example, vapor deposition or sputtering.
  • a base metal layer 53 is formed on the entire surface on the back surface 51b to be joined with another piezoelectric body.
  • the base metal layer 53 is not formed on a part of the periphery including the four corners of the square of the front surface 51a, and the piezoelectric body 51 is exposed at a portion where the base metal layer 53 is not formed. is doing.
  • the base metal layer having such a shape can be formed, for example, by vapor deposition using a mask or sputtering.
  • the front surface 51a of the piezoelectric body 51A has a non-bonded region 54 that is not bonded to the metal block 55 at a part of the periphery including the four corners.
  • the base metal layer 53 formed on the back surface (joint surface) 51b joined to the metal block 55 in the piezoelectric body 51B (see FIG. 2) located closest to the base end side in the piezoelectric body portion 52, the base metal layer 53 formed on the back surface (joint surface) 51b joined to the metal block 55.
  • the piezoelectric body 51 ⁇ / b> B also has a non-bonding region 54 on the bonding surface with the metal block 55.
  • a base metal layer 53 is formed on the entire front surface of the piezoelectric body 51B.
  • the plurality of piezoelectric bodies 51 on which the base metal layer 53 is formed are arranged in the stacking direction, and the metal blocks 55 are arranged on both sides of the plurality of piezoelectric bodies 51 in the stacking direction. Further, a sheet-like or film-like solder 56 is sandwiched between the adjacent piezoelectric bodies 51 and between the piezoelectric body 51 and the metal block 55, and the piezoelectric body 51 and the metal block 55 are brought into close contact with each other via the solder 56.
  • the piezoelectric body 51, the metal block 55, and the solder 56 are heated to a temperature equal to or higher than the melting temperature of the solder 56 while maintaining the state where the piezoelectric body 51 and the metal block 55 are in close contact with each other. Thereby, the solder 56 is melted and spreads on the base metal layer 53.
  • the temperature of the piezoelectric body 51, the metal block 55, and the solder 56 is lowered after the solder 56 is melted, the solder 56 is solidified and the adjacent piezoelectric bodies 51, and the piezoelectric body 51 and the metal block 55 are replaced with the solder 56. Are joined together.
  • the piezoelectric body melts away from the solder 56. Therefore, even if the solder 56 exists between the piezoelectric body and the metal block 55, The piezoelectric body and the metal block 55 are not joined. Through the above procedure, the ultrasonic transducer 50 in which the piezoelectric body portion 52 and the metal block 55 are joined by the solder 56 is completed.
  • the ultrasonic transducer 50 of the present embodiment has non-bonded regions 54 on the front surface 51a of the piezoelectric body 51A and the back surface 51b of the piezoelectric body 51B, which are the bonding surfaces of the piezoelectric body portion 52 and the metal block 55, respectively.
  • the non-bonded region 54 since the piezoelectric body 51 and the metal block 55 are not integrally bonded, the piezoelectric body and the metal block that is the counterpart to be bonded behave differently during expansion and contraction. It is possible to move. As a result, no stress is generated in the non-bonded region 54 due to the difference in thermal expansion coefficient.
  • the ultrasonic transducer 50 of the present embodiment it is possible to suitably suppress the breakage of the piezoelectric body during the manufacturing process while having a laminated structure of piezoelectric bodies.
  • the ultrasonic medical device 1 of the present embodiment it is possible to efficiently manufacture by using the ultrasonic transducer 50 in which breakage of the piezoelectric body in the manufacturing process is suitably suppressed.
  • the size of the non-bonding region 54 may be appropriately set depending on the shape, size, material, and the like of the piezoelectric body 51 and the metal block 55. As the area of the non-bonded region increases, the damage suppressing effect increases, but the bonding strength decreases. According to the inventor's study, the stress generated between the piezoelectric body and the metal block decreases as the proportion of the non-bonded region in the bonded surface (for example, the area of the non-bonded region 54 / the area of the front surface 51a) increases. The decrease rate rapidly decreased when the proportion of the non-bonded area in the bonding surface exceeded 8%. From this result, it is considered that the proportion of the non-bonded region in the bonding surface is preferably about 5% to 10%.
  • the position and shape of the non-bonded region 54 can be appropriately set by changing the shape of the base metal layer 53.
  • a non-joining region 54 may be formed in a region excluding four corners on the periphery of the joining surface.
  • the non-bonding region 54 may be formed on the entire periphery including the four corners.
  • the non-bonding region may be formed so as to extend only in a specific direction.
  • thermo expansion coefficient x in the direction in which one side extends is different from the thermal expansion coefficient y in the direction in which the other side perpendicular to the one side extends, as shown in FIG.
  • a non-joining region may be provided only in a portion orthogonal to the direction in which the difference in thermal expansion coefficient with the metal block becomes larger (FIG. 4C shows an example in which the thermal expansion difference in the x direction is larger).
  • region is not restricted to the periphery of a joining surface.
  • a non-joining region 54 may be formed in a frame shape inside the periphery of the joining surface.
  • the non-joining regions may be formed only in the portions close to the four corners inside the periphery of the joining surface.
  • the base metal layer does not exist in the dicing line when cutting out the piezoelectric body, there is an advantage that the piezoelectric body can be easily cut out.
  • the base metal layer 53 formed on the metal block 55 may have the same shape as the base metal layer formed on the bonding surface of the piezoelectric body.
  • the base metal layer of the piezoelectric body closest to the metal block may be provided on the entire bonding surface.
  • a second embodiment of the present invention will be described with reference to FIGS.
  • the ultrasonic transducer of this embodiment is different from the ultrasonic transducer 1 of the first embodiment in that an insulator is provided.
  • components that are the same as those already described are assigned the same reference numerals and redundant description is omitted.
  • FIG. 6 is a perspective view showing the ultrasonic transducer 150 of the present embodiment.
  • An insulator 151 is disposed between the piezoelectric body portion 52 and the metal block 55, and the piezoelectric body portion 52 and the metal block 55 are joined with the insulator 151 interposed therebetween.
  • the insulator 151 has substantially the same shape and dimensions as the piezoelectric body 51, but the thickness (dimension in the stacking direction) may be set as appropriate. Although there is no restriction
  • the piezoelectric body 51 is formed of an anisotropic material such as a lithium niobate substrate having a crystal orientation of 36 degrees Y-Cut or the like
  • the thermal expansion coefficient in one direction in the bonding surface (for example, X described above)
  • the insulator 151 is preferably made of a material having a thermal expansion coefficient that is intermediate between the thermal expansion coefficient (for example, Y described above) in a direction orthogonal to the one direction. If it does in this way, generation
  • the material of the insulator 151 that exhibits such an effect include zirconia (ZrO 2 ).
  • FIG. 7 shows the insulator 151 before being joined.
  • a base metal layer 53 is formed on each surface of the insulator 151 in the stacking direction.
  • the base metal layer 53 provided on the first surface 151a in the stacking direction has the same shape as the base metal layer formed on the bonding surface of the piezoelectric body to be bonded to the metal block 55 in the first embodiment.
  • a base metal layer 53 is formed on the entire surface of the second surface 151b in the stacking direction.
  • Each of the two insulators 151 is disposed with the first surface 151a facing the metal block 55 side.
  • a base metal layer 53 is provided on the entire surface of the bonding surface with the insulator 151. In this state, when joining by the solder 56 is performed in the same procedure as in the first embodiment, the entire joining surfaces of the piezoelectric bodies 51C and 51D and the insulator 151 are joined. However, only the region where the base metal layer 53 is formed is bonded to the metal block 55 and the insulator 151.
  • the region corresponding to the portion of the first surface 151a where the base metal layer 53 is not provided, that is, the ultrasonic transducer 150 is viewed in the stacking direction.
  • a region of the first surface 151 a that overlaps a portion where the base metal layer 53 is not provided is a non-bonded region that is not bonded to the metal block 55 integrally. Therefore, also in the ultrasonic transducer 150 of this embodiment, the non-bonded region behaves differently from the metal block during expansion / contraction due to temperature change, so that the piezoelectric body is damaged during the manufacturing process as in the first embodiment. It can suppress suitably.
  • the insulator 151 is disposed between the piezoelectric body portion 52 and the metal block 55, it is easy to ensure insulation between the metal block 55 and other surrounding members when the ultrasonic vibrator 150 is disposed. can do.
  • the first surface 151a of the insulator 151 may be directed not to the metal block 55 side but to the piezoelectric bodies 51C and 51D.
  • the metal block 55 and the insulator 151 are bonded to each other on the entire bonding surface, but the piezoelectric body 51 and the insulator 151 are bonded only to the region where the base metal layer 53 is formed.
  • a region corresponding to a portion of the first surface 151a where the base metal layer 53 is not provided is similarly a non-bonded region. Therefore, also in this case, the same effect as the above-described aspect is obtained.
  • one of the metal blocks 55 may be bonded to the first surface 151a, and the other may be bonded to the second surface 151b.
  • a third embodiment of the present invention will be described with reference to FIGS.
  • the ultrasonic transducer of this embodiment is different from the ultrasonic transducers of the above embodiments in the shape of the metal block.
  • FIG. 8 is a perspective view showing the ultrasonic transducer 250 of the present embodiment.
  • FIG. 9 is a perspective view showing the metal block 255 of the ultrasonic transducer 250.
  • the metal block 255 In the metal block 255, four corners on the side of the bonding surface (block bonding surface) 255a bonded to the piezoelectric body portion 52 are chamfered. Thereby, the joint surface 255a is octagonal.
  • the metal block 255 and the piezoelectric body 51 have different joint surfaces, and the joint surface 255a of the metal block 255 is smaller. Therefore, a part of the joint surface of the piezoelectric body 51 is part of the metal block 255. It does not come into contact with the joint surface 255a. As a result, a portion of the bonding surface of the piezoelectric body 51 that does not come into contact with the bonding surface 255a becomes a non-bonding region.
  • the ultrasonic transducer 150 of the present embodiment similarly to the ultrasonic transducers of the respective embodiments described above, it is possible to suitably suppress the breakage of the piezoelectric body during the manufacturing process.
  • a part of the bonding surface of the piezoelectric body 51 is set as a non-bonding region by making the area of the bonding surface 255a of the metal block 255 smaller than the bonding surface of the piezoelectric body 51. Therefore, in both the piezoelectric body 51 and the metal block 255, the base metal layer 53 can be provided on the entire bonding surface, so that it is not necessary to use a mask or the like to make the base metal layer into a predetermined shape. As a result, the process of forming the base metal layer can be simplified and the manufacturing cost can be reduced.
  • the shape of the block joint surface is not limited to the octagon described above.
  • the shape of the block bonding surface may be a square that is slightly smaller than the bonding surface of the piezoelectric body.
  • the shape of the block joint surface is changed.
  • the insulator may be changed so that the area of the insulator bonding surface is smaller than the bonding surface of the piezoelectric body.
  • the area of the block joint surface may be reduced by making the cross-sectional shape in the stacking direction of the metal blocks smaller than that of the piezoelectric body.
  • the area of the block joint surface is reduced by chamfering, the position of a part of the periphery in the cross-sectional shape in the stacking direction can be matched with the piezoelectric body.
  • the piezoelectric body and the metal block are arranged in the stacking direction in the manufacturing process of the ultrasonic vibrator, there is an advantage that it is easy to position the two so that their centers coincide with each other.
  • the bonding surface may be formed so that the area of the bonding surface of the piezoelectric body becomes smaller than the area of the block bonding surface, for example, by removing four corners of the piezoelectric body.
  • the non-bonding region is generated on the block bonding surface.
  • a part of the expansion / contraction generated in the metal block is absorbed by the non-bonding region of the block bonding surface or released from the non-bonding region. Therefore, substantially the same effect can be obtained.
  • non-bonding regions may be provided on both the bonding surface and the block bonding surface of the piezoelectric body.
  • the shape of the bonding surface of the piezoelectric body is not limited to the above-described square. Therefore, it may be a rectangle, a polygon other than a rectangle, or a circle having no corners.
  • the cross-sectional shape in the stacking direction of the ultrasonic transducer is preferably a shape with high rotational symmetry
  • the shape of the joint surface is more preferably a polygon such as a polygon with a high rotational symmetry or a perfect circle.
  • the metal block may be provided only on one side in the stacking direction.
  • the present invention can be applied to an ultrasonic transducer and an ultrasonic medical device.

Landscapes

  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Surgery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Molecular Biology (AREA)
  • Animal Behavior & Ethology (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Medical Informatics (AREA)
  • Mechanical Engineering (AREA)
  • Otolaryngology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)

Abstract

La présente invention concerne un oscillateur à ultrasons, comprenant : une partie de corps piézoélectrique dans laquelle une pluralité de corps piézoélectriques sont agencés dans la direction de stratification et liés ; et un bloc métallique lié à une partie d'extrémité de la partie de corps piézoélectrique dans la direction de stratification. La surface liée en regard du bloc métallique du corps piézoélectrique le plus proche du bloc métallique parmi la pluralité de corps piézoélectriques et/ou la surface liée au bloc du bloc métallique, la surface liée au bloc étant liée à la partie de corps piézoélectrique, possède une région non liée capable de se déplacer par rapport au corps piézoélectrique ou au bloc métallique auquel la surface liée ou la surface liée au bloc est liée.
PCT/JP2015/086175 2015-12-25 2015-12-25 Oscillateur à ultrasons et dispositif médical à ultrasons Ceased WO2017109929A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2015/086175 WO2017109929A1 (fr) 2015-12-25 2015-12-25 Oscillateur à ultrasons et dispositif médical à ultrasons

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2015/086175 WO2017109929A1 (fr) 2015-12-25 2015-12-25 Oscillateur à ultrasons et dispositif médical à ultrasons

Publications (1)

Publication Number Publication Date
WO2017109929A1 true WO2017109929A1 (fr) 2017-06-29

Family

ID=59091035

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2015/086175 Ceased WO2017109929A1 (fr) 2015-12-25 2015-12-25 Oscillateur à ultrasons et dispositif médical à ultrasons

Country Status (1)

Country Link
WO (1) WO2017109929A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023027197A (ja) * 2017-08-17 2023-03-01 クレオ・メディカル・リミテッド Ｒｆ及び／またはマイクロ波エネルギーを生体組織内に送達するための電気外科装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11186626A (ja) * 1997-12-25 1999-07-09 Kyocera Corp 積層型圧電アクチュエータ
JP2008128875A (ja) * 2006-11-22 2008-06-05 Nec Tokin Corp 超音波振動体
JP2015039689A (ja) * 2013-08-23 2015-03-02 オリンパス株式会社 超音波振動デバイス、超音波振動デバイスの製造方法および超音波医療装置
JP2015211535A (ja) * 2014-04-25 2015-11-24 オリンパス株式会社 超音波振動子及び超音波医療装置
JP2015208710A (ja) * 2014-04-25 2015-11-24 オリンパス株式会社 超音波振動子及び超音波医療装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11186626A (ja) * 1997-12-25 1999-07-09 Kyocera Corp 積層型圧電アクチュエータ
JP2008128875A (ja) * 2006-11-22 2008-06-05 Nec Tokin Corp 超音波振動体
JP2015039689A (ja) * 2013-08-23 2015-03-02 オリンパス株式会社 超音波振動デバイス、超音波振動デバイスの製造方法および超音波医療装置
JP2015211535A (ja) * 2014-04-25 2015-11-24 オリンパス株式会社 超音波振動子及び超音波医療装置
JP2015208710A (ja) * 2014-04-25 2015-11-24 オリンパス株式会社 超音波振動子及び超音波医療装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023027197A (ja) * 2017-08-17 2023-03-01 クレオ・メディカル・リミテッド Ｒｆ及び／またはマイクロ波エネルギーを生体組織内に送達するための電気外科装置
JP7469824B2 (ja) 2017-08-17 2024-04-17 クレオ・メディカル・リミテッド Ｒｆ及び／またはマイクロ波エネルギーを生体組織内に送達するための電気外科装置

Similar Documents

Publication Publication Date Title
JP6326275B2 (ja) 超音波振動子及び超音波医療装置
JP5963603B2 (ja) 超音波振動デバイス、超音波振動デバイスの製造方法および超音波医療装置
JP6648205B2 (ja) 埋め込まれた圧電アクチュエータを伴う微細加工超音波メス
TW201349622A (zh) 二次電池之製造方法、二次電池、熔接裝置
CN104321966B (zh) 弹性波装置
WO2007129496A1 (fr) Composant électronique et son procédé de fabrication
JP7128628B2 (ja) 積層圧電セラミック部品及び圧電デバイス
WO2017109929A1 (fr) Oscillateur à ultrasons et dispositif médical à ultrasons
JP5458651B2 (ja) 弾性表面波素子用基板及び弾性表面波素子の製造方法
JP6270505B2 (ja) 積層型超音波振動デバイス、積層型超音波振動デバイスの製造方法および超音波医療装置
JP6270506B2 (ja) 積層型超音波振動デバイスおよび超音波医療装置
JP2015122566A (ja) 弾性波装置
JP2014011737A (ja) 超音波振動デバイス、超音波振動デバイスの製造方法および超音波医療装置
JP6323863B2 (ja) 圧電素子、圧電アクチュエータおよび圧電素子の製造方法
JP6086742B2 (ja) 超音波振動デバイスおよび超音波医療装置
JPWO2007091433A1 (ja) 圧電振動子
JP2018010963A (ja) 圧電アクチュエータ
JP6529576B2 (ja) 超音波振動子及び超音波医療装置
JP5716629B2 (ja) 磁気冷凍材料を用いたマイクロチャネル熱交換器の製造方法およびマイクロチャネル熱交換器
JP6292963B2 (ja) 超音波振動子及び超音波医療装置
JP2012079814A (ja) 圧電素子
JP2015211535A (ja) 超音波振動子及び超音波医療装置
JP5387867B2 (ja) 振動片
JP2012079816A (ja) 圧電素子
JP2009044793A (ja) 圧電アクチュエータおよびその駆動方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15911367

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 15911367

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP