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WO2017103344A1 - Substrat électronique et procédé de fabrication d'un substrat électronique - Google Patents

Substrat électronique et procédé de fabrication d'un substrat électronique Download PDF

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Publication number
WO2017103344A1
WO2017103344A1 PCT/FI2016/050892 FI2016050892W WO2017103344A1 WO 2017103344 A1 WO2017103344 A1 WO 2017103344A1 FI 2016050892 W FI2016050892 W FI 2016050892W WO 2017103344 A1 WO2017103344 A1 WO 2017103344A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
conductive adhesive
trace
electronic component
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/FI2016/050892
Other languages
English (en)
Inventor
Arttu HUTTUNEN
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
VTT Technical Research Centre of Finland Ltd
Original Assignee
VTT Technical Research Centre of Finland Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by VTT Technical Research Centre of Finland Ltd filed Critical VTT Technical Research Centre of Finland Ltd
Publication of WO2017103344A1 publication Critical patent/WO2017103344A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10628—Leaded surface mounted device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10651—Component having two leads, e.g. resistor, capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to an electronics substrate. Further, the present invention relates to a method for manufacturing an electronics substrate. Furthermore, the present invention relates to a method for increasing adhesion of electronic components assembled on printed electronics.
  • Printed electronics substrates and printed electronic circuit boards typically comprise electronic components such as semiconductor devices.
  • surface mount components are assembled on printed traces in a similar manner as in traditional circuit board assembly except that the solder joint is replaced by conductive adhesive due to temperature restrictions of the materials used.
  • document US 4,312,692 discloses a method of mounting electronic components on a printed circuit board by temporarily attaching the electronic component to the circuit board with adhesive applied to the board, irradiating the adhesive with ultraviolet rays with or without heating to cure the adhesive and thereby rigidly attach the component to the board, and thereafter joining the electrodes of the component to conductor portions on the board by soldering to form an electric circuit.
  • an electronics substrate comprising at least one printed conductor trace on a surface of a substrate made of insulating material, at least one portion of electrically conductive adhesive which is arranged on the surface of the substrate and electrically connected to the trace, an electronic component which is fixedly attached to the substrate by means of the adhesive, and wherein at least one contacting element of the electronic component is electrically connected to the trace via the adhesive.
  • Various embodiments of the first aspect may comprise at least one feature from the following bulleted list:
  • the contacting element is a component lead or a contacting surface of a contacting zone
  • the adhesive is partially arranged on a surface of the trace which surface is opposite to a surface of the trace facing the substrate
  • the electronic component is arranged above the substrate and laterally from the trace
  • a plurality of contacting elements is electrically connected to respective traces via respective portions of conductive adhesive
  • a method for manufacturing of an electronic substrate comprising providing a substrate with at least one printed conductor trace on the surface of the substrate, attaching at least one portion of conductive adhesive on the surface of the substrate and electrically connecting the portion of conductive adhesive to the trace, providing an electronic component which is electrically connected to the portion of adhesive by means of at least one contacting element of the electronic component.
  • Various embodiments of the second aspect may comprise at least one feature from the following bulleted list: partially arranging conductive adhesive on a surface of the trace which surface opposite to a surface of the trace facing the substrate between the electronic component and the substrate only conductive adhesive is arranged the electronic component is arranged above the substrate and laterally from the trace a plurality of contacting elements is electrically connected to respective printed traces via respective portions of conductive adhesive an electronic component is electrically connected to two circuit traces such that the maximum distance between two contacting elements of the electronic component is smaller than the minimum distance between two circuit traces different portions of conductive adhesive are separated from each other different portions of conductive adhesive are electrically connected to each other via the electronic component the portion of conductive adhesive is mechanically connected to the conductor trace the conductive adhesive faces a side surface of the conductor trace the conductive adhesive is directly in contact with the conductor trace
  • a method for increasing adhesion of electronic components assembled on printed electronics comprising providing a substrate with at least one printed conductor trace on the surface of the substrate, directly attaching at least one portion of electrically conductive adhesive on the surface of the substrate and electrically connecting the portion of conductive adhesive to the trace, providing an electronic component which is electrically connected to the portion of adhesive by means of at least one contacting element of the electronic component.
  • Various embodiments of the third aspect may comprise at least one feature from the following bulleted list:
  • Certain embodiments of the present invention provide an electronics substrate, wherein the mechanical interconnection between an electronic component and a substrate comprising printed circuit traces is improved. In other words, the adhesion of electronic components assembled on printed electronics can be increased.
  • Embodiments of the invention allow making mechanically stronger component interconnection with conductive adhesives without using additional support adhesives. Mechanical stress to the electronic component does not affect or at least decreases the risk to destroy or damage the mechanical interconnection between the conductor traces and the substrate. Thus, the life time of the structures can be improved.
  • the properties of the adhesives used can be engineered for optimum performance, whereas the performance of the printed circuit traces is limited by deposition methods used.
  • the conductive adhesive can have a suitable coefficient of thermal expansion, so that a thermal expansion of the adhesive will not damage or destroy the mechanical connection between the conductor traces and the substrate.
  • Certain embodiments of the present invention further provide a method for manufacturing an electronics substrate.
  • the method is capable of being performed simply and cost effectively.
  • the electronics substrates can be manufactured in industrial scale.
  • Complex electronics substrates comprising a plurality of electronic components can be manufactured step-wise or simultaneously by providing a plurality of portions of conductive adhesive in a pattern. Subsequently, electronic components can be placed step-wise or simultaneously.
  • FIGURE 1 illustrates a schematic view of a common printed electronics substrate
  • FIGURE 2 illustrates a schematic view of a printed electronics substrate in accordance with at least some embodiments of the present invention
  • FIGURE 3 illustrates a schematic view of a printed electronics substrate in accordance with at least some embodiments of the present invention.
  • Certain embodiments of the present invention provide an electronics substrate 1 comprising at least one printed circuit trace 5 on a surface 6 of a substrate 7 made of insulating material, at least one portion of electrically conductive adhesive 4 which is arranged on the surface 6 of the substrate 7 and electrically connected to the printed circuit trace 5, an electronic component 2 which is fixedly attached to the substrate 7 by means of the adhesive 4, and wherein at least one contacting element of the electronic component 2 is electrically connected to the printed circuit trace 5 via the adhesive 4.
  • the mechanical interconnection between the electronic component 2 and the substrate 7 can be improved by means of directly applying the conductive adhesive on the surface 6 of the substrate 7.
  • FIGURE 1 a schematic view of a common printed electronics substrate 1 is illustrated.
  • Conductor traces 5 are arranged on a surface 6 of a substrate 7.
  • the conductor traces 5 may be, for example, made of silver or other electrically conductive material.
  • the substrate 7 is made from insulating material.
  • a first surface 8 of the respective conductor trace 5 faces the surface 6 of the substrate 7.
  • Conducting elements such as component leads 3 of an electronic component
  • the conductive adhesive 4 is arranged on top of a second surface 9 of the respective conductor trace 5.
  • the component 2 is further arranged such that the component leads 3 are arranged at least partially over the second surface 9 of the respective conductor trace 5.
  • FIGURE 2 illustrates a schematic view of a printed electronics substrate 1 in accordance with at least some embodiments of the present invention.
  • Conductor traces 5 are arranged on a surface 6 of a substrate 7.
  • the conductor traces 5 may be, for example, made of silver or other electrically conductive material.
  • the substrate 7 is made from insulating material.
  • materials suitable for the substrate 7 are PI (polyimide), PET (polyethylene terephthalate), polyamide, FR1, FR4, FR5, aramid, polytetrafluorethylene, LCP (liquid crystal polymer) and a prehardened binder layer, i.e. prepreg.
  • An electronic component 2 comprising component leads 3 is attached to the substrate 7 by means of conductive adhesive 4.
  • the conductive adhesive 4 is directly arranged on top of the surface 6 of the substrate 7, thus creating a relatively strong mechanical interconnection between the electronic component 2 and the substrate 7.
  • the conductive adhesive 4 is arranged such that adhesive 4 is locally connected to a respective conductor trace 5 in order to create an electrical interconnection between the electronic component 2 and a conductor trace 5 via a component lead 3 and conductive adhesive 4.
  • the conductor leads 3 are arranged over the substrate 7 and do not overlap with the conductor traces 5. In other words, the component pad is removed from under the component lead 4. Instead, a conductive adhesive trail is placed from the lead 3 to the conducting trace 5 directly on the substrate 7. Thus, the mechanical stress is beared upon the stronger joint between the conductive adhesive 4 and the substrate 7. Electrical connection is provided by means of the adhesive reaching from the component lead 3 to the conductor trace 5.
  • the conductive adhesive is directly connected to the traces 5.
  • the conductive adhesive 4 is in addition to the electrical interconnection also mechanically connected to a trace 5.
  • a portion of the conductive adhesive 4 faces a side surface 12 of the trace 5.
  • a portion of the conductive adhesive 4 may be arranged on top of a second surface 9 or on top of a part of the second surface 9 of each conductor trace 5 in order to improve the electrical interconnection.
  • the term adhesive refers to a material, by means of which components 2 can be attached to the substrate 7.
  • the adhesive 4 used in the embodiments may be, for example, graphite filled electrically conductive adhesives, nickel filled electrically conductive adhesives, or silver filled electrically conductive adhesives.
  • the thickness of the adhesive layer 4 may be, for example, in the range between 2 ⁇ and 30 ⁇ , in the range between 0.2 mm and 0.5 mm, less than 1 mm, less than 2 mm, or even less than 3 mm.
  • the adhesive 7 used is selected in such a way that the adhesive used will have sufficient adhesion to the substrate 7.
  • the conductive adhesives 4 used provide an electrical path between a conductor trace 5 and a component 2 and a mechanical support between the component 2 and the substrate 7.
  • one beneficial property of the adhesive 4 may be, for example, a suitable coefficient of thermal expansion, so that a thermal expansion of the adhesive 4 will not damage or destroy the mechanical connection between the first surface 8 of a respective conductor trace 5 and the surface 6 of the substrate 7.
  • the adhesive 4 selected has a short hardening time, such as a few seconds at most.
  • the adhesive 4 hardens at least partly within this time so that the adhesive 4 will be able to hold the component 2 in place. The final hardening can take clearly more time and the final hardening can even be planned to take place in connection with later process stages during production of the electronics substrate 1.
  • the conductor pattern is made so that the component interconnection pads are not placed directly under the component leads 3.
  • the component leads 3 are placed next to the interconnection pads of the conductor traces 5.
  • the maximum distance Di between the component leads 3 of the electronic component 2 is smaller than the minimum distance D 2 between the circuit traces 5.
  • Different portions of conductive adhesive 4 are separated from each other. Different portions of conductive adhesive 4 are further electrically connected to each other via the electronic component 2.
  • a pattern of conductive adhesive 4 can be made on the surface 6 of the substrate 7 in order to provide predetermined conductive paths.
  • embodiments of the present invention can be assembled on printed electronics substrates in a manner that improves the mechanical strength of the interconnections.
  • embodiments of the present invention also provide a method for increasing adhesion of electronic components assembled on printed electronics. Electrical connections between conductor traces and components are created such that the pad is removed from under the component lead and instead a trail of conductive adhesive forms the connection. Adhesion of electronic components assembled on printed electronics can be increased by directly coupling the electronic components to the substrate.
  • the method for increasing adhesion of electronic components assembled on printed electronics comprises: providing a substrate 7 with at least one printed conductor trace 5 on the surface 6 of the substrate 7, directly attaching at least one portion of electrically conductive adhesive 4 on the surface 6 of the substrate 7 and electrically connecting the portion of conductive adhesive 4 to the trace 5, providing an electronic component 2 which is electrically connected to the portion of adhesive 4 by means of at least one contacting element of the electronic component 2.
  • FIGURE 3 illustrates a schematic view of a printed electronics substrate 1 in accordance with at least some embodiments of the present invention.
  • Conductor traces 5 are arranged on a surface 6 of a substrate 7.
  • the substrate 7 is made from insulating material.
  • the conductor traces 5 may be, for example, made of silver or other electrically conductive material.
  • a first surface 8 of the respective conductor trace 5 faces the surface 6 of the substrate 7.
  • An electronic component 2 comprising contacting zones 10 with contacting surfaces 11 is attached to the substrate 7 by means of conductive adhesive 4.
  • Each contacting surface 11 of a contacting zone 10 is covered with adhesive 4.
  • the conductive adhesive 4 is directly arranged on top of the surface 6 of the substrate 7, thus creating a relatively strong mechanical interconnection between the electronic component 2 and the substrate 7.
  • the conductive adhesive 4 is arranged such that adhesive 4 is locally connected to a respective conductor trace 5 in order to create an electrical interconnection between the contacting surface 11 of each contacting zone 10 of the electronic component 2 and a respective conductor trace 5.
  • the contacting surfaces 11 of the contacting zones 10 are arranged above the substrate 7 and do not overlap with the conductor traces 5. In other words, between the surface 6 of the substrate 7 and the electronic component 2 comprising the contacting elements only conductive adhesive 4 is arranged.
  • the maximum distance Di between the contacting surfaces 11 of the contacting zones 10 of the electronic component 2 is smaller than the minimum distance D 2 between the circuit traces 5.
  • Different portions of conductive adhesive 4 are separated from each other. Different portions of conductive adhesive 4 are further electrically connected to each other via the electronic component 2.
  • a portion of the conductive adhesive 4 may be, for example, arranged on top of a second surface 9 of each conductor trace 5 in order to improve the electrical interconnection.
  • the contacting surfaces 11 of the contacting zones 10 can protrude from the electronic component 2 into the conductive adhesive 4.
  • the contacting surfaces 11 of the contacting zones 10 are arranged in respective recesses in the electronic component 2.
  • conductive adhesive protrudes into the recesses.
  • the contacting surfaces 11 of the contacting zones 10 and a surface of the electronic component are arranged flush.
  • a portion of non-conductive support adhesive (not shown) may be arranged according to certain embodiments. The support adhesive may fill the entire space or may be applied in a dot-type manner.
  • the support adhesive may be applied simultaneously with the conductive adhesive 4 or at an earlier or later process stage.
  • the portions of conductive adhesive 4 and support adhesive may be applied by means of a nozzle comprising three different chambers, i.e. one chamber for applying support adhesive between two chambers for applying conductive adhesives.
  • At least some embodiments of the present invention find industrial application in production of printed electronics substrates.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

Un mode de réalisation de l'invention concerne un substrat électronique (1) comprenant au moins un tracé conducteur imprimé (5) sur une surface (6) d'un substrat (7) réalisé en matériau isolant, au moins une portion d'adhésif électroconducteur (4) disposée sur la surface (6) du substrat (7) et électriquement connectée au tracé (5), et un composant électronique (2) fixé au substrat (7) au moyen de l'adhésif (4), au moins un élément de contact du composant électronique (2) étant connecté électriquement au tracé (5) au moyen de l'adhésif (4).
PCT/FI2016/050892 2015-12-18 2016-12-16 Substrat électronique et procédé de fabrication d'un substrat électronique Ceased WO2017103344A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20155972 2015-12-18
FI20155972 2015-12-18

Publications (1)

Publication Number Publication Date
WO2017103344A1 true WO2017103344A1 (fr) 2017-06-22

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FI2016/050892 Ceased WO2017103344A1 (fr) 2015-12-18 2016-12-16 Substrat électronique et procédé de fabrication d'un substrat électronique

Country Status (1)

Country Link
WO (1) WO2017103344A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4312692A (en) 1979-03-09 1982-01-26 Matsushita Electric Industrial Co., Ltd. Method of mounting electronic components
EP0593155A1 (fr) * 1992-08-17 1994-04-20 Minebea Co.,Ltd. Structure d'installation pour composants et procédé de fabrication d'une structure d'installation pour composants
DE10241891A1 (de) * 2002-09-10 2004-03-11 Robert Bosch Gmbh Elektronisches Schaltungsteil für Hochfrequenzanwendungen

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4312692A (en) 1979-03-09 1982-01-26 Matsushita Electric Industrial Co., Ltd. Method of mounting electronic components
EP0593155A1 (fr) * 1992-08-17 1994-04-20 Minebea Co.,Ltd. Structure d'installation pour composants et procédé de fabrication d'une structure d'installation pour composants
DE10241891A1 (de) * 2002-09-10 2004-03-11 Robert Bosch Gmbh Elektronisches Schaltungsteil für Hochfrequenzanwendungen

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
CARSON R ET AL: "IMPROVED STRENGTH FOR CONDUCTIVE EPOXY SURFACE MOUNT ATTACHMENT", MOTOROLA TECHNICAL DEVELOPMENTS, MOTOROLA INC. SCHAUMBURG, ILLINOIS, US, vol. 34, 1 March 1998 (1998-03-01), pages 161, XP000781065, ISSN: 0887-5286 *
HAPPONEN, T.; VOUTILAINEN, J.-V.; FABRITIUS, T.: "Reliability Study on Adhesive Interconnections in Flex-to Flex Printed Electronics Applications Under Environmental Stresses", IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, vol. 14, no. 4, December 2014 (2014-12-01), XP011566293, DOI: doi:10.1109/TDMR.2014.2356477

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