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WO2017183310A1 - Ruban adhésif sensible à la pression intégrée à une feuille adhésive et procédé de fabrication d'une puce à semi-conducteur - Google Patents

Ruban adhésif sensible à la pression intégrée à une feuille adhésive et procédé de fabrication d'une puce à semi-conducteur Download PDF

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Publication number
WO2017183310A1
WO2017183310A1 PCT/JP2017/007735 JP2017007735W WO2017183310A1 WO 2017183310 A1 WO2017183310 A1 WO 2017183310A1 JP 2017007735 W JP2017007735 W JP 2017007735W WO 2017183310 A1 WO2017183310 A1 WO 2017183310A1
Authority
WO
WIPO (PCT)
Prior art keywords
film
adhesive tape
pressure
adhesive
sensitive adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2017/007735
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English (en)
Japanese (ja)
Inventor
齊藤　岳史
雄紀 柴山
智章 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denka Co Ltd filed Critical Denka Co Ltd
Priority to JP2018512813A priority Critical patent/JP6917362B2/ja
Publication of WO2017183310A1 publication Critical patent/WO2017183310A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers

Definitions

  • the present invention relates to an adhesive film-integrated pressure-sensitive adhesive tape and a method for producing a semiconductor chip.
  • an electronic component As a method of manufacturing an electronic component, after forming a plurality of circuit patterns on a wafer or an insulating substrate to form an electronic component assembly, the electronic component assembly is processed into a chip, the chip is picked up, and the bottom surface of the chip is A method is known in which an adhesive is applied, a chip is fixed to a lead frame or the like with an adhesive, and the chip is sealed with a resin or the like to form an electronic component.
  • the circuit pattern of the electronic component assembly is attached to an adhesive tape, the back surface of the circuit pattern is thinly polished (back grind), the adhesive tape is peeled off, and then the circuit A method is known in which an adhesive tape is bonded to the pattern surface, and further fixed to a ring frame, then cut and separated (diced) into individual chips, and the chips are stacked and fixed using an adhesive.
  • a method using an adhesive film-integrated adhesive tape in which an adhesive film and an adhesive tape are laminated has been proposed (see Patent Documents 1 to 4, etc.). *
  • the adhesive film integrated adhesive tape can be used for the production of electronic components, thereby eliminating the back grinding and adhesive application steps after dicing.
  • the adhesive film-integrated adhesive tape in which the adhesive film and the adhesive tape are integrated is superior in controlling the thickness of the adhesive portion and suppressing the protrusion of the adhesive as compared with a method using an adhesive.
  • the adhesive film-integrated pressure-sensitive adhesive tape is used for manufacturing electronic components such as a chip size package, a stack package, a system-in-package, and a TSV (Through Silicon Via).
  • TSV Thinit Silicon Via
  • the adhesive film-integrated pressure-sensitive adhesive tape has insufficient followability to bumps on the circuit pattern surface of the wafer, and adhesion failure is a problem.
  • the adhesive force between the adhesive film and the adhesive tape is low, the adhesiveness between the adhesive film and the adhesive film is poor, so that the adhesive film peels off during the operation, and when the adhesive force is strong, there is a case where defective peeling occurs.
  • the present invention has been made in view of the above circumstances, and has an adhesive film-integrated pressure-sensitive adhesive tape that has good followability to a wafer having bumps and has both adhesiveness and peelability of the adhesive film and the pressure-sensitive adhesive tape, and the same.
  • An object is to provide a method for manufacturing a semiconductor chip.
  • the present invention employs the following means in order to solve the above problems.
  • the pressure-sensitive adhesive layer is a (meth) acrylate copolymer (A ) 100 parts by weight and polyfunctional isocyanate curing agent (B) 1 part by weight or more and 10 parts by weight or less
  • Adhesive film-integrated pressure-sensitive adhesive in which the (meth) acrylic acid ester copolymer (A) contains 70% by mass to 98% by mass of n-butyl (meth) acrylate and has a weight average molecular weight of 1,200,000 to 2,200,000.
  • the thickness of the base film is 60 ⁇ m or more and 120 ⁇ m or less, the thickness of the pressure-sensitive adhesive layer is 15 ⁇ m or more and 40 ⁇ m or less, and the thickness of the pressure-sensitive adhesive layer is 0.00 with respect to the thickness of the base film.
  • the adhesive film-integrated pressure-sensitive adhesive tape according to (1) which is 2 or more and 0.5 or less.
  • the adhesive film-integrated pressure-sensitive adhesive tape of the present invention has good followability to a wafer having bumps, and achieves both adhesion and peelability between the adhesive film and the pressure-sensitive adhesive tape.
  • a semiconductor chip manufacturing method using the same can be provided.
  • the monomer unit means a structural unit derived from a monomer.
  • the (meth) acryloyl group is a general term for an acryloyl group and a methacryloyl group.
  • a compound containing (meth) such as (meth) acrylic acid is a general term for a compound having “meta” in the name and a compound not having “meta”.
  • the adhesive film-integrated pressure-sensitive adhesive tape according to the present invention has a pressure-sensitive adhesive tape and an adhesive film.
  • each member of the adhesive film-integrated pressure-sensitive adhesive tape will be described.
  • An adhesive tape has a base film and an adhesive layer.
  • the pressure-sensitive adhesive tape is formed by applying a pressure-sensitive adhesive layer on a base film, for example, a method of directly applying a pressure-sensitive adhesive on a base film with a coater such as a gravure coater, comma coater, bar coater, knife coater or roll coater. There is a method in which a pressure-sensitive adhesive is applied to a release film and bonded to a base film after drying.
  • the pressure-sensitive adhesive may be printed on the base film by convex printing, concave printing, flat printing, flexographic printing, offset printing, screen printing, or the like.
  • the thickness of the pressure-sensitive adhesive layer is preferably 0.2 or more and 0.5 or less, and more preferably 0.3 or more and 0.45 or less with respect to the thickness of the base film. If less than 0.2, workability is poor when the adhesive film-integrated adhesive tape is bonded to the wafer, and air bubbles may be mixed. If it is more than 0.5, the adhesive tape has high wettability and adhesion. Sometimes peeling from the film is difficult.
  • the pressure-sensitive adhesive layer of the present invention contains 100 parts by weight of the (meth) acrylic acid ester copolymer (A) and 1 part by weight or more and 10 parts by weight or less of the polyfunctional isocyanate curing agent (B), and the (meth) acrylic acid ester
  • the copolymer (A) contains 70% by mass to 98% by mass of n-butyl (meth) acrylate, and has a weight average molecular weight of 1,200,000 to 2,200,000.
  • ((Meth) acrylic acid ester copolymer (A)) examples include a polymer obtained by polymerizing a monomer that is an acrylic monomer such as methyl (meth) acrylate, a copolymer obtained by polymerizing plural types of monomers, and these monomers. And a copolymer obtained by copolymerizing an unsaturated monomer copolymerizable with (eg, vinyl acetate, styrene, acrylonitrile).
  • acrylic monomer examples include n-butyl (meth) acrylate, 2-butyl (meth) acrylate, t-butyl (meth) acrylate, pentyl (meth) acrylate, octyl (meth) acrylate, and 2-ethylhexyl (meth).
  • the acrylic monomer contains 70% by mass or more and 98% by mass or less, and more preferably 80% by mass or more and 96% by mass or less of n-butyl (meth) acrylate, from the viewpoint of adhesion to the adhesive film and releasability.
  • amount is less than 70% by mass, air bubbles may be mixed when bonded to the adhesive film.
  • amount exceeds 98% by mass, the adhesive tape has a high adhesive force and may be difficult to peel from the adhesive film.
  • the acrylic monomer preferably has a monomer containing a functional group at least in part.
  • the monomer containing this functional group includes a functional group such as hydroxyl group, carboxyl group, epoxy group, amide group, amino group, methylol group, sulfonic acid group, sulfamic acid group or (sub) phosphate group.
  • a monomer having one or more types is exemplified. Of these, vinyl compounds having a hydroxyl group are preferred. In addition, the acrylate mentioned later is included in the vinyl compound here.
  • Examples of the functional group-containing monomer having a hydroxyl group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and 2-hydroxybutyl (meth) acrylate.
  • Examples of the monomer having a carboxyl group include (meth) acrylic acid, crotonic acid, maleic acid, maleic anhydride, itaconic acid, fumaric acid, acrylamide N-glycolic acid, and cinnamic acid.
  • Examples of the monomer having an epoxy group include allyl glycidyl ether and (meth) acrylic acid glycidyl ether.
  • Examples of the monomer having an amide group include (meth) acrylamide.
  • Examples of the monomer having an amino group include N, N-dimethylaminoethyl (meth) acrylate.
  • Examples of the monomer having a methylol group include N-methylol acrylamide.
  • Vinyl monomers other than those described above may be used for the acrylic polymer.
  • the weight average molecular weight of the (meth) acrylic acid ester copolymer (A) is from 1.2 million to 2.2 million, preferably from 1.5 million to 2 million. If it is less than 1,200,000, the adhesive force becomes too strong due to component transfer from the adhesive film, and the adhesive tape and the adhesive film may not be peeled off. If it exceeds 2.2 million, the pressure-sensitive adhesive force is lowered and the adhesive film peels off. There is.
  • the polyfunctional isocyanate curing agent (B) is not particularly limited except that it has two or more isocyanate groups, and examples thereof include aromatic polyisocyanates, aliphatic polyisocyanates, alicyclic polyisocyanates, and adducts thereof. .
  • the aromatic polyisocyanate is not particularly limited, and for example, 1,3-phenylene diisocyanate, 4,4′-diphenyl diisocyanate, 1,4-phenylene diisocyanate, 4,4′-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate, 2, , 6-tolylene diisocyanate, 4,4′-toluidine diisocyanate, 2,4,6-triisocyanate toluene, 1,3,5-triisocyanate benzene, dianisidine diisocyanate, 4,4′-diphenyl ether diisocyanate, and 4, 4 ′, 4 ′′ -triphenylmethane triisocyanate and the like.
  • the aliphatic polyisocyanate is not particularly limited.
  • diisocyanate and 2,4,4-trimethylhexamethylene diisocyanate examples thereof include diisocyanate and 2,4,4-trimethylhexamethylene diisocyanate.
  • the alicyclic polyisocyanate is not particularly limited.
  • 1,3-phenylene diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate and hexamethylene diisocyanate are obtained by reacting with a polyol compound such as trimethylolpropane. It may be an adduct body.
  • the blending ratio of the polyfunctional isocyanate curing agent (B) is preferably 1 to 10 parts by mass with respect to 100 parts by mass of the (meth) acrylic acid ester copolymer (A).
  • curing agents (B) adhesive force is too strong and an adhesive tape and an adhesive film may be unable to peel. If the polyfunctional isocyanate curing agent (B) is excessive, the adhesive strength is reduced, and the adhesive film may be peeled off.
  • a tackifying resin is not particularly limited.
  • the tackifying resin is not particularly limited.
  • the blending amount of the tackifying resin is not particularly limited, and is preferably 200 parts by mass or less, and preferably 30 parts by mass or less with respect to 100 parts by mass of the (meth) acrylic acid ester polymer (A).
  • the thickness of the pressure-sensitive adhesive layer is preferably 15 ⁇ m or more and 40 ⁇ m or less, and more preferably 20 ⁇ m or more and 35 ⁇ m or less. If the thickness is less than 15 ⁇ m, bubbles may be mixed in when the adhesive film-integrated pressure-sensitive adhesive tape is bonded to the wafer. If it is thicker than 40 ⁇ m, the adhesive tape has high wettability (adhesive strength) and is difficult to peel off from the adhesive film. There are cases. ⁇ Base film>
  • the base film various synthetic resin sheets can be used.
  • the material of the base film is not particularly limited, but polyvinyl chloride, polyethylene terephthalate, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, polyethylene, polypropylene, ethylene-acrylic acid copolymer, ionomer resin, etc. Can be mentioned. A mixture of these resins and a multilayer film can also be used for the base film.
  • ionomer resins obtained by crosslinking copolymers having ethylene units, (meth) methacrylic acid units and (meth) acrylic acid alkyl ester units with metal ions such as Na + , K + and Zn 2+ It tends to suppress air bubbles when bonded to a film, and tends to have good adhesion when bonded to a semiconductor wafer, and is preferably used.
  • the molding method of the base film is not particularly limited, and examples thereof include calendar, T-die extrusion, inflation, and casting.
  • the thickness of the base film is preferably 60 ⁇ m or more and 120 ⁇ m or less, and more preferably 70 ⁇ m or more and 120 ⁇ m or less. When the thickness is less than 60 ⁇ m, workability is poor when the adhesive film-integrated pressure-sensitive adhesive tape is bonded to the wafer, and when it is thicker than 120 ⁇ m, bubbles may be mixed when the adhesive film-integrated pressure-sensitive adhesive tape is bonded to the wafer. .
  • an antistatic agent may be applied to one side or both sides of the base film to carry out an antistatic treatment.
  • the adhesive film is not particularly limited, and is, for example, an acrylic, epoxy, polyimide, silicone, phenol, rubber, or a mixture thereof, and includes additives such as a thermal polymerization initiator and a photoinitiator.
  • additives such as a thermal polymerization initiator and a photoinitiator.
  • commercially available NCF (polyimide) Dexerials 3D-IC mounting required film type underfill (epoxy system) and Hitachi Chemical DF-335-7 can be used.
  • the manufacturing method of the electronic component using the adhesive film integrated adhesive tape of this embodiment is not specifically limited, For example, the following procedure is mentioned. (1) In a silicon wafer having a hemispherical bump surface and a flat surface on the other surface, the silicon wafer is placed on a stage heated at 70 ° C. with the surface having the bump up, and bonded to the surface having the bump. Affix the film-integrated adhesive tape. (2) The adhesive tape of the adhesive film integrated adhesive tape is peeled from the adhesive film. (3) A dicing adhesive tape is bonded to the silicon wafer opposite to the surface on which the adhesive film is bonded. (4) A silicon wafer with an adhesive film is diced into semiconductor chips. (5) The semiconductor chip with the adhesive film is peeled off from the dicing adhesive tape and picked up.
  • the adhesive film integrated pressure-sensitive adhesive tape according to Example 1 was prepared and evaluated according to the following formulation. ⁇ Adhesive film integrated adhesive tape ⁇ An adhesive film was laminated on the pressure-sensitive adhesive layer side of the pressure-sensitive adhesive tape at 23 ° C. to obtain an adhesive film-integrated pressure-sensitive adhesive tape.
  • the adhesive tape etc. are as follows. [Adhesive tape] The pressure-sensitive adhesive tape was applied on a PET separator film so that the thickness of the pressure-sensitive adhesive solution after drying was 30 ⁇ m, and after drying, a base film (mainly a Zn salt of an ethylene-methacrylic acid copolymer, with an MFR value of 1.
  • the pressure-sensitive adhesive solution was a (meth) acrylic acid ester copolymer (A) (A-1: a copolymer of 95% by mass of n-butyl acrylate and 5% by mass of 2-hydroxyethyl acrylate, a weight average molecular weight of 1,650,000 (Soken) Chemical, SK Dyne 2147)) 100 parts by mass contains 5 parts by mass of polyfunctional isocyanate curing agent (B) (trimethylolpropane adduct of 2,4-tolylene diisocyanate (Tosoh Corp., Coronate L-45E)) .
  • A-1 a copolymer of 95% by mass of n-butyl acrylate and 5% by mass of 2-hydroxyethyl acrylate, a weight average molecular weight of 1,650,000 (Soken) Chemical, SK Dyne 2147)
  • B polyfunctional isocyanate curing agent
  • the weight average molecular weight of the (meth) acrylic acid ester copolymer (A) was measured by gel permeation chromatography (GPC).
  • Solvent THF
  • As the adhesive film DF-335-7 (thickness 25 ⁇ m) manufactured by Hitachi Chemical was used.
  • Adhesive peelability is obtained by bonding the adhesive film-integrated pressure-sensitive adhesive tape obtained above onto a silicon wafer previously heated to 70 ° C., and at 2 ° C. in an atmosphere at a temperature of 23 ° C. ⁇ 2 ° C. and a humidity of 50 ⁇ 5%. -After one round of crimping, 1 day after crimping, 1.
  • the wafer is placed on a stage heated at 70 ° C. with the bump having the upper surface, and the adhesive film is integrated on the surface having the bump.
  • the pressure-sensitive adhesive tape was bonded with a roller having a cylinder pressure of 0.4 MPa
  • the adhesive film-integrated pressure-sensitive adhesive tape was evaluated as being adhered to a portion that was not a bump. That is, the area (the non-bump part) excluding the bump area (circle) from the area of the wafer having the bumps is defined as 100%, and the ratio of the adhesive film-integrated adhesive tape in contact with the non-bump part is calculated. It was evaluated by.
  • the bumps were hemispherical with a diameter of 20 ⁇ m and a height of 10 ⁇ m, and were evenly arranged at intervals of 100 ⁇ m.
  • ⁇ Excellent: When the bonded area is 95% or more
  • ⁇ Good: When the bonded area is 70 or more and less than 95%
  • ⁇ (Not possible): When the bonded area is less than 70%
  • Tables 1 to 3 summarize the design of the pressure-sensitive adhesive layers of Examples 2 to 15 and Comparative Examples 1 to 8, the thicknesses of the base film and the pressure-sensitive adhesive layer, and the evaluation results.
  • the (meth) acrylic acid ester copolymer (A) and the like are as follows. ((Meth) acrylic acid ester copolymer (A)) The composition is as shown in Table 1, and the model is as follows.
  • Multifunctional isocyanate curing agent (B) A trimethylolpropane adduct of 2,4-tolylene diisocyanate (Tosoh, Coronate L-45E).
  • Base film Mainly composed of Zn salt of ethylene-methacrylic acid copolymer, MFR value 1.5 g / 10 min (JIS K7210, 210 ° C.), melting point 96 ° C. (manufactured by Mitsui DuPont Polychemical Co., Ltd., Himiran 1650).
  • the pressure-sensitive adhesive tape of the present invention suppresses a decrease in the followability of the adhesive film, suppresses a decrease in the adhesion between the pressure-sensitive adhesive tape and the adhesive film, and has good peelability from the adhesive film.
  • the comparative example was defective for the following reason. ⁇ Comparative Examples 1 and 2> Since the content of n-butyl acrylate in the (meth) acrylic acid ester copolymer (A) is low, it is considered that bubbles were mixed when bonded to the adhesive film.
  • the above adhesive film-integrated pressure-sensitive adhesive tape has good followability to a wafer having bumps and achieves both adhesion and peelability between the adhesive film and the pressure-sensitive adhesive tape. Therefore, it is suitably used in a method for manufacturing an electronic component in which chips are stacked and fixed.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

La solution selon la présente invention consiste à fournir un ruban adhésif sensible à la pression intégré à une feuille adhésive qui présente une conformabilité satisfaisante aux plaquettes qui ont des bosses et dans lequel le ruban adhésif sensible à la pression combine l'adhésion à la feuille adhésive et la séparabilité de la feuille adhésive, et un procédé de fabrication de puces à semi-conducteur utilisant ledit ruban adhésif sensible à la pression. Le ruban adhésif sensible à la pression intégré à une feuille adhésive comprend un ruban adhésif sensible à la pression constitué d'une feuille de base et d'une couche adhésive sensible à la pression et comprend en outre une feuille adhésive stratifiée sur la couche adhésive sensible à la pression, la couche adhésive sensible à la pression comprenant des constituants spécifiques. Par conséquent, la présente invention concerne un ruban adhésif sensible à la pression intégré à une feuille adhésive qui présente une conformabilité satisfaisante aux plaquettes qui ont des bosses et dans lequel le ruban adhésif sensible à la pression combine l'adhésion à la feuille adhésive et la séparabilité de la feuille adhésive.
PCT/JP2017/007735 2016-04-21 2017-02-28 Ruban adhésif sensible à la pression intégrée à une feuille adhésive et procédé de fabrication d'une puce à semi-conducteur Ceased WO2017183310A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2018512813A JP6917362B2 (ja) 2016-04-21 2017-02-28 接着フィルム一体型粘着テープ及び半導体チップの製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-084965 2016-04-21
JP2016084965 2016-04-21

Publications (1)

Publication Number Publication Date
WO2017183310A1 true WO2017183310A1 (fr) 2017-10-26

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PCT/JP2017/007735 Ceased WO2017183310A1 (fr) 2016-04-21 2017-02-28 Ruban adhésif sensible à la pression intégrée à une feuille adhésive et procédé de fabrication d'une puce à semi-conducteur

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JP (1) JP6917362B2 (fr)
TW (1) TWI720179B (fr)
WO (1) WO2017183310A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003142505A (ja) * 2001-10-31 2003-05-16 Lintec Corp ウエハダイシング・接着用シートおよび半導体装置の製造方法
WO2012017568A1 (fr) * 2010-08-05 2012-02-09 古河電気工業株式会社 Pellicule adhésive et ruban pour traitement de plaquette de semi-conducteur
JP2013001847A (ja) * 2011-06-17 2013-01-07 Hitachi Chemical Co Ltd 半導体用積層シート、接着剤層付き半導体チップの製造方法及び半導体装置の製造方法
JP2013187376A (ja) * 2012-03-08 2013-09-19 Hitachi Chemical Co Ltd 半導体装置用接着フィルム、半導体装置の製造方法及びそれを用いた半導体装置
WO2015046529A1 (fr) * 2013-09-30 2015-04-02 リンテック株式会社 Feuille composite pour la formation d'un film en résine
JP2015122423A (ja) * 2013-12-24 2015-07-02 日東電工株式会社 ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102344987B1 (ko) * 2013-12-24 2021-12-30 닛토덴코 가부시키가이샤 다이싱·다이 본드 필름, 반도체 장치의 제조 방법 및 반도체 장치

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003142505A (ja) * 2001-10-31 2003-05-16 Lintec Corp ウエハダイシング・接着用シートおよび半導体装置の製造方法
WO2012017568A1 (fr) * 2010-08-05 2012-02-09 古河電気工業株式会社 Pellicule adhésive et ruban pour traitement de plaquette de semi-conducteur
JP2013001847A (ja) * 2011-06-17 2013-01-07 Hitachi Chemical Co Ltd 半導体用積層シート、接着剤層付き半導体チップの製造方法及び半導体装置の製造方法
JP2013187376A (ja) * 2012-03-08 2013-09-19 Hitachi Chemical Co Ltd 半導体装置用接着フィルム、半導体装置の製造方法及びそれを用いた半導体装置
WO2015046529A1 (fr) * 2013-09-30 2015-04-02 リンテック株式会社 Feuille composite pour la formation d'un film en résine
JP2015122423A (ja) * 2013-12-24 2015-07-02 日東電工株式会社 ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置

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TWI720179B (zh) 2021-03-01
JPWO2017183310A1 (ja) 2019-02-21
TW201807129A (zh) 2018-03-01
JP6917362B2 (ja) 2021-08-11

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