WO2017168677A1 - Laminated body manufacturing device - Google Patents

Abstract

Since an ejection head 22 and a UV light irradiation device 24 are arranged with a gate type gantry 21 placed therebetween, reflected light (indicated by dotted-line arrows in Fig. 2(a)) of UV light irradiated by the UV light irradiation device 24 and air (indicated by solid-line arrows in Fig. 2(b)) blown by a fan 26 that cools the UV light source 25 can be shielded by the gantry 21. Therefore, a shaping failure of a substrate due to an ejection failure, an ejection position deviation, or the like of the ejection head 22 can be suppressed. In addition, since the ejection head 22 and the UV light irradiation device 24 arranged with the gantry 21 placed therebetween are not required to be separated from each other by a greater distance, a compact configuration is allowed.

Description

Laminate manufacturing equipment

The present invention relates to a laminate manufacturing apparatus for manufacturing a laminate.

2. Description of the Related Art Conventionally, there has been known a laminate manufacturing apparatus for manufacturing a functional material film or a laminate by discharging ink (liquid material) containing a functional material from a nozzle. For example, Patent Document 1 includes a gantry fixed to a stage, and a gantry provided with a discharge head having a plurality of nozzles. Have been disclosed to form a liquid water film or to apply ink to a polymer film.

JP2015-125125A

By the way, as such a manufacturing apparatus, an apparatus having an ejection head that ejects UV curable resin ink and an UV light irradiation apparatus that irradiates UV light. The device may be placed adjacent to it. In that case, reflected light of UV light irradiated from the UV light irradiation device, cooling air from the UV light irradiation device, or the like may easily hit the ejection head. In this case, the ink is likely to be clogged in the nozzle or the trajectory of the flying ink is likely to be changed, and there may be a modeling failure due to ejection failure or ejection position deviation.

The main object of the present invention is to suppress the formation failure of the laminate while having a compact configuration.

The present invention adopts the following means in order to achieve the main object described above.

The laminate manufacturing apparatus of the present invention is
A laminated body production apparatus for producing a laminated body by laminating resin layers on a stage,
An ejection head for ejecting UV curable resin ink toward the stage;
A UV light irradiation device that irradiates UV light toward the stage;
A gantry configured to be gate-shaped so as to be able to move relative to the stage and straddle the stage, and to mount the ejection head and the UV light irradiation device;
With
The gist of the invention is that the ejection head and the UV light irradiation device are arranged with the gantry in between in the relative movement direction.

In the laminate manufacturing apparatus of the present invention, a discharge head that discharges UV curable resin ink and a UV light irradiation device that irradiates UV light are arranged with a gantry interposed between them in the direction of relative movement between the stage and the gantry. Yes. Thereby, the reflected light of the UV light irradiated from the UV light irradiation device, the blowing of the fan that cools the UV light source, and the like can be blocked by the gantry. For this reason, the modeling defect of the laminated body resulting from the discharge defect of a discharge head, discharge position shift, etc. can be suppressed, without providing the exclusive shielding board for interrupting reflected light and ventilation. In addition, since it is not necessary to dispose the discharge head and the UV light irradiation device disposed with the gantry interposed therebetween, the entire device can be configured compactly. As a result, it is possible to suppress the formation failure of the laminate while having a compact configuration.

1 is a configuration diagram showing an outline of the configuration of a wiring board manufacturing apparatus 10. FIG. The block diagram which shows the outline of a structure of the resin layer formation unit 20. FIG. The block diagram which shows the electrical connection relationship of the wiring board production apparatus 10. FIG. The flowchart which shows an example of a wiring board preparation process. The block diagram which shows the outline of a structure of the resin layer forming unit 20B of a modification.

Next, embodiments of the present invention will be described with reference to the drawings. 1 is a configuration diagram showing an outline of the configuration of the wiring board manufacturing apparatus 10, FIG. 2 is a configuration diagram showing an outline of the configuration of the resin layer forming unit 20, and FIG. It is a block diagram which shows an electrical connection relationship. In FIG. 1, the front-rear direction is the X direction, the left-right direction is the Y direction, and the up-down direction is the Z direction.

As shown in FIG. 1, the wiring board manufacturing apparatus 10 includes a base 12, a transport device 16 installed on the base 12 and transporting the stage 14 in the Y direction, and a resin layer laminated on the stage 14. A resin layer forming unit 20 for producing a substrate, a wiring layer forming unit 30 for forming a wiring pattern on the resin layer, and a control device 40 (see FIG. 3) for controlling the entire apparatus are provided.

The transport device 16 includes, for example, a conveyor device, and drives the conveyor device to reciprocate the stage 14 in the Y direction. The stage 14 is configured to be movable up and down by a lifting device (not shown). The stage 14 is increased by the control device 40 so that the distance from the ejection head 22 of the resin layer forming unit 20 to the resin layer forming surface is constant, for example, even if the resin layers are laminated and the thickness of the resin base material is increased. Is controlled.

As shown in FIGS. 1 and 2, the resin layer forming unit 20 includes a portal gantry 21 erected on the base 12 and an ejection head capable of ejecting UV curable resin ink toward the stage 14. 22 and a UV light irradiation device 24 capable of irradiating the resin ink discharged onto the stage 14 with UV light. The ejection head 22 and the UV light irradiation device 24 are mounted on the gantry 21. The gantry 21 is composed of a pair of front and rear (X direction) leg portions 21 a erected on the base 12 and a beam portion 21 b spanned between the pair of leg portions 21 a and is arranged so as to straddle the stage 14. Has been. For this reason, the stage 14 reciprocates below the gantry 21 in the Y direction. The ejection head 22 and the UV light irradiation device 24 are arranged so as to sandwich the gantry 21 in the Y direction in which the stage 14 reciprocates.

The discharge head 22 is configured as a line head in which a plurality of nozzles 23 are arranged in the X direction. The ejection head 22 applies (prints) a rectangular resin layer by ejecting resin ink from the nozzles 23 to the stage 14 that is transported (moved forward) in the Y direction by the transport device 16. The ejection head 22 may be configured as a serial head mounted on a carriage that can scan in the X direction.

The UV light irradiation device 24 includes a UV light source 25 that emits line-shaped UV light in the X direction, and a fan 26 that is disposed above the UV light source 25 and blows air toward the UV light source 25. The UV light irradiation device 24 irradiates the rectangular resin layer applied on the stage 14 while conveying the stage 14 in the Y direction by irradiating a linear (X direction) UV light from the UV light source 25. The layers are cured sequentially. For example, a mercury lamp or a metal halide lamp can be used as the UV light source 25. Further, the fan 26 is controlled by the control device 40 so as to blow air toward the UV light source 25 while the UV light source 25 irradiates the UV light.

Further, the UV light irradiation device 24 of the present embodiment is attached to the gantry 21 via the lifting device 28 as shown in FIG. The lifting device 28 includes a Z-axis motor (not shown) whose output shaft is connected to the ball screw shaft, and a slide 28a that moves in the Z direction as the ball screw shaft rotates. The UV light irradiation device 24 is attached to the slider 28 a and can be moved up and down (Z direction) by driving a Z-axis motor of the lifting device 28. 2A shows a case where the UV light irradiation device 24 is in the raised position (upper position), and FIG. 2B shows a case where the UV light irradiation device 24 is in the lowered position (lower end position). Even when UV light having a constant intensity is output from the UV light source 25, if the UV light irradiation device 24 is in the raised position, the irradiation intensity of the UV light reaching the stage 14 becomes weak, and the UV light irradiation device 24 is lowered. In this case, the irradiation intensity of the UV light reaching the stage 14 is high. In this way, the lifting device 28 moves the UV light irradiation device 24 up and down, whereby the irradiation intensity of the UV light reaching the stage 14 from one UV light source 25 can be controlled.

Here, in this embodiment, since the ejection head 22 and the UV light irradiation device 24 are arranged with the gantry 21 interposed therebetween, as shown in FIG. 2A, reflected light of UV light (shown by dotted lines). Can be prevented from moving toward the ejection head 22 side. Further, as shown in FIG. 2B, it is possible to block the cooling air blown from the fan 26 (shown by a solid line) from moving toward the ejection head 22 side. For this reason, it is possible to prevent the resin ink in the nozzle 23 from being cured by the reflected light of the UV light, or to change the trajectory of the ink flying from the nozzle 23 due to the blowing of the fan 26. For convenience of illustration, FIG. 2A in which the UV light irradiation device 24 is in the raised position shows a state in which the reflected light of the UV light is blocked by the gantry 21, and the UV light irradiation device 24 is in the lowered position. In FIG. 5B, the cooling air is blocked by the gantry 21. Even when the UV light irradiation device 24 is in the raised position, the cooling air is blocked by the gantry 21 and the UV light irradiation device 24 is in the lowered position. The reflected light of the UV light is blocked by the gantry 21.

The resin layer forming unit 20 repeats the application of the resin layer by the ejection head 22 and the curing of the resin layer by the UV light irradiation device 24 a plurality of times, thereby laminating the resin layers, and a resin having a predetermined thickness. A base material (laminated body) is formed.

The wiring layer forming unit 30 includes a discharge head 32 that can discharge conductive particle-containing ink containing conductive particles such as metal nanoparticles in a dispersant, and a laser beam to the conductive particle-containing ink discharged from the discharge head 32. And a laser irradiation device 36 for irradiation.

The discharge head 32 is configured as a line head in which a plurality of nozzles are arranged in the X direction. The discharge head 32 applies the conductive particle-containing ink to any position on the resin layer (printing) by discharging the conductive particle-containing ink from the corresponding nozzle while the stage 14 is transported in the Y direction by the transport device 16. )can do. Specifically, the discharge head 32 forms a wiring layer on a resin layer (resin base material) by discharging conductive particle-containing ink from a corresponding nozzle along a predetermined wiring line.

The laser irradiation device 36 is mounted on a carriage 35 that can move in the X direction by driving a carriage motor (not shown). The stage 14 is moved by moving the laser irradiation device 36 in the X direction and moving the stage 14 in the Y direction. A laser beam is scanned along a wiring line (wiring layer) on the resin base material formed on the substrate. The wiring layer is made conductive by decomposing the dispersant around the conductive particles by the laser beam.

The wiring layer forming unit 30 laminates the wiring layer while making the wiring layer conductive by repeating the application of the conductive particle-containing ink by the discharge head 32 and the conduction of the conductive particle-containing ink by the laser irradiation device 36 a plurality of times. Then, a wiring pattern is formed on the resin base material.

As shown in FIG. 3, the control device 40 is configured as a microprocessor centered on the CPU 41, and includes a ROM 42, an HDD 43, a RAM 44, and an input / output interface 45 in addition to the CPU 41. These are electrically connected via a bus 46. Although not shown in the figure, the control device 40 detects a detection signal from a detection sensor that detects the position of the stage 14 in the Y direction and the position (height) in the Z direction, and detection that detects the position of the UV light irradiation device 24 in the Z direction. A detection signal from the sensor, a detection signal from a detection sensor for detecting the position of the carriage 35 in the X direction, and the like are input via the input / output interface 45. Further, from the control device 40, a control signal to the stage 14 (elevating device), a control signal to the transport device 16 (conveyor device), a control signal to the ejection head 22, a UV light irradiation device 24 (UV light source 25, A control signal to the fan 26) and the lifting device 28 (Z-axis motor), a control signal to the ejection head 32, a control signal to the carriage 35 (carriage motor) and the laser irradiation device 36, etc. are output via the input / output interface 45. Has been.

Next, the operation of the wiring board manufacturing apparatus 10 thus configured will be described. FIG. 4 is a flowchart showing an example of the wiring board manufacturing process. This process is executed by the CPU 41 of the control device 40.

When the wiring board manufacturing process is executed, the CPU 41 first inputs process data defining the execution order of the resin layer formation and the wiring layer formation (S100), and the current process is executed based on the input process data. It is determined whether it is a resin layer forming step (S110). When the CPU 41 determines that the current process is the resin layer forming process, the stage 14 moves in the Y direction by adjusting the height of the stage 14 so that the distance from the ejection head 22 to the resin layer forming surface is a predetermined distance. The stage 14, the transport device 16, and the ejection head 22 are controlled so that the resin ink is ejected from each nozzle 23 while moving (S120). Thereby, a rectangular resin layer is formed on the stage 14.

Further, when starting the current resin layer forming step, the CPU 41 determines whether or not the next step is a wiring layer forming step (S130). When the CPU 41 determines that the next process is the wiring layer formation process, the CPU 41 determines whether or not the UV light irradiation device 24 is in the raised position (S140). The elevating device 28 is controlled so as to descend (S150), and the UV light irradiation device 24 is controlled so as to irradiate UV light (S180). If the CPU 41 determines in S140 that the UV light irradiation device 24 is not in the raised position but in the lowered position, the CPU 41 skips S150 and irradiates the UV light in S180. On the other hand, when the CPU 41 determines that the next process is not the wiring layer forming process but the resin layer forming process, the CPU 41 determines whether or not the UV light irradiation device 24 is in the lowered position (S160). If it determines, the raising / lowering apparatus 28 will be controlled so that the UV light irradiation apparatus 24 may raise (S170), and UV light is irradiated by S180. If the CPU 41 determines in S160 that the UV light irradiation device 24 is not in the lowered position but in the raised position, it skips S170 and irradiates with UV light in S180.

Here, when the UV light irradiation device 24 is in the lowered position, a strong irradiation intensity necessary for completely curing the applied resin layer with UV light can be obtained. On the other hand, when the UV light irradiation device 24 is in the raised position, the irradiation intensity of the UV light applied to the applied resin layer is weaker than the lowered position, so the applied resin layer is not completely cured (semi-cured). . When the next process is a wiring layer forming process, when a wiring layer is formed on a resin layer that is not sufficiently cured, organic gas is generated from the uncured component of the underlying resin layer due to heat generated by laser beam irradiation. There is a possibility that the organic gas hinders the decomposition of the dispersant and cannot secure sufficient conductivity. For this reason, if the next process is a wiring layer forming process, the UV light irradiation device 24 is lowered in S150 to increase the irradiation intensity of the UV light applied to the resin layer. On the other hand, when the next process is a resin layer forming process, such a fear does not occur. In such a case, when the irradiation intensity of the UV light applied to the resin layer (stage 14) is increased with the UV light irradiation device 24 in the lowered position, reflected light having a relatively high intensity is generated. For this reason, if the next process is a resin layer forming process, the UV light irradiation device 24 is raised in S170, and the irradiation intensity of the UV light applied to the resin layer is not increased more than necessary, so that the reflected light The strength is suppressed. Thereby, coupled with the arrangement of the ejection head 22 and the UV light irradiation device 24 with the gantry 21 interposed therebetween, the reflected light of the UV light can be made difficult to reach the ejection head 22.

Then, the CPU 41 determines whether or not the forwardly moving stage 14 has reached a predetermined position on the forward side (S190), and if it is determined that the stage 14 has reached a predetermined position on the forward side, the stage 14 is moved. The stage 14 is moved backward to return the stage 14 to a predetermined position on the backward movement side (S200). The CPU 41 irradiates the UV light from the UV light irradiation device 24 even during the backward movement. Further, when the next time is the wiring layer forming process, the CPU 41 may move the stage 14 to the starting position of the wiring layer forming process instead of the process of S200. In the present embodiment, the UV light irradiation device 24 irradiates the UV light during the forward movement and the backward movement of the stage 14. However, the UV light irradiation apparatus 24 may irradiate the UV light only during the backward movement.

Next, the CPU 41 determines whether or not all processes have been completed (S210). If it is determined that all processes have not been completed, the process returns to S110 and repeats the process. If the CPU 41 determines in S110 that the current process is not a resin layer forming process but a wiring layer forming process, the CPU 41 executes a wiring layer forming process (S220), and proceeds to S210. In the wiring layer forming process, the CPU 41 first adjusts the height of the stage 14 so that the distance from the ejection head 32 to the wiring layer forming surface is a predetermined distance, and moves the stage 14 to the planned wiring line while moving in the Y direction. The stage 14, the transport device 16, and the ejection head 32 are controlled so that the conductive particle-containing ink is ejected from the nozzles of the ejection head 32. Next, the CPU 41 moves the carriage 35 and the conveying device 16 so that the laser beam is scanned from the laser irradiation device 36 along the planned wiring line with respect to the resin layer (resin base material) coated with the conductive particle-containing ink. Control. Then, when executing the wiring layer forming process, the CPU 41 determines whether or not all the processes are completed in S210, and when determining that all the processes are completed, the CPU 41 ends the wiring board manufacturing process.

Here, the correspondence between the components of the present embodiment and the components of the present invention will be clarified. The ejection head 22 of this embodiment corresponds to the ejection head of the present invention, the UV light irradiation device 24 corresponds to a UV light irradiation device, and the gantry 21 corresponds to a gantry. The lifting device 28 corresponds to a lifting device, the UV light source 25 corresponds to a UV light source, and the fan 26 corresponds to a fan.

In the wiring board manufacturing apparatus 10 of the present embodiment described above, the discharge head 22 and the UV light irradiation device 24 are arranged with the portal gantry 21 interposed therebetween, so that the UV light irradiated from the UV light irradiation device 24 is used. The gantry 21 can block the reflected light and the fan 26 that cools the UV light source 25. For this reason, since the reflected light and the airflow of the UV light reaching the ejection head 22 are reduced, the resin light in the nozzle 23 of the ejection head 22 is promoted by the reflected light, or the air is blown from the nozzle 23 of the ejection head 22 by the airflow. It is possible to suppress changes in the trajectory of the flying ink. Therefore, it is possible to suppress the formation failure of the substrate (laminated body) due to the discharge failure or the discharge position shift without providing a dedicated shielding plate for blocking the reflected light and the air flow. Further, since the reflected light and the blowing of UV light reaching the ejection head 22 are reduced, it is not necessary to further dispose the ejection head 22 and the UV light irradiation device 24 arranged with the gantry 21 therebetween. The resin layer forming unit 20 can be configured compactly.

Moreover, since the wiring board manufacturing apparatus 10 includes the lifting / lowering device 28 that moves the UV light irradiation device 24 up and down with respect to the gantry 21, the UV light irradiation intensity can be easily controlled by the one UV light irradiation device 24. Is possible. For this reason, since it is not necessary to provide a plurality of UV light sources having different irradiation intensities in order to make the irradiation intensity of the UV light variable, it is possible to easily realize a compact configuration.

Further, in the wiring board manufacturing apparatus 10, the UV light irradiation device 24 includes a UV light source 25 and a fan 26 that is disposed above the UV light source 25 and blows air toward the UV light source 25. For this reason, since the air (cooling air) blown by the fan 26 is easily directed toward the ejection head 22, the effect of blocking the blowing by the gantry 21 can be made remarkable.

It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.

For example, in the above-described embodiment, the UV light irradiation device 24 is provided with the fan 26 that blows air from above to the UV light source 25 side. However, the present invention is not limited to this, and the modification shown in FIG. Good. FIG. 5 is a configuration diagram showing an outline of the configuration of a modified resin layer forming unit 20B. In addition, the solid line arrow in FIG. 5 shows the flow of air. As illustrated, the UV light irradiation device 24B of the resin layer forming unit 20B includes a fan 26B that is disposed above the UV light source 25 and cools the UV light source 25 by sucking air from the UV light source 25 side. In this way, since the air sucked by the fan 26B is discharged upward, it is difficult to move toward the ejection head 22 side. For this reason, in combination with the arrangement of the ejection head 22 and the UV light irradiation device 24B with the gantry 21 sandwiched therebetween, it is possible to further suppress molding defects of the substrate (laminated body).

In the embodiment described above, the gantry 21 blocks both the reflected light of the UV light emitted from the UV light source 25 and the air (cooling air) blown from the fan 26. However, the present invention is not limited to this. Absent. For example, the UV light irradiation device 24 may not include the fan 26, and the gantry 21 may block at least reflected light of the UV light.

In the above-described embodiment, the reflected light of the UV light and the air to be blown are blocked by the structure (the leg portion 21a and the beam portion 21b) of the gantry 21, but the present invention is not limited to this, and the surface of the gantry 21 is blocked. It is good also as what attaches a flat plate. This flat plate can be made of, for example, stainless steel or aluminum.

In the above-described embodiment, the stage 14 is moved with the gantry 21 fixed. However, as long as the gantry 21 and the stage 14 move relative to each other, such as the stage 14 fixed and the gantry 21 moving. Good.

In the embodiment described above, the UV light irradiation device 24 is moved up and down with respect to the gantry 21 by the lifting device 28. However, the present invention is not limited to this, and the UV light irradiation device 24 is not provided with the lifting device 28. It is good also as what was fixed to.

In the above-described embodiment, the height of the UV light irradiation device 24 is changed depending on whether or not the next process is a wiring layer forming process, but the present invention is not limited to this. The height of the UV light irradiation device 24 may be changed according to various forming conditions such as the type of resin ink ejected (applied) by the ejection head 22, the thickness of the applied resin ink, the application time, and the irradiation time. Moreover, it is not restricted to what changes the height of the UV light irradiation apparatus 24 in two steps, You may change into three or more steps | paragraphs, or you may change in a non-step.

In the above-described embodiment, the wiring board manufacturing apparatus 10 including the resin layer forming unit 20 and the wiring layer forming unit 30 is exemplified. However, the present invention is not limited to this, and only the resin layer forming unit 20 is provided and the resin layers are stacked. It is good also as a laminated body production apparatus which produces a body.

In the embodiment described above, the application of the resin layer by the ejection head 22 and the irradiation of the UV light by the UV light irradiation device 24 are performed by one reciprocation of the stage 14, but the present invention is not limited to this. For example, after the resin layer is applied by the ejection head 22 a plurality of times by the reciprocating movement of the stage 14, the UV light irradiation by the UV light irradiation device 24 may be collectively performed on the plurality of resin layers.

The present invention can be used for a laminate manufacturing apparatus for manufacturing a laminate of resin layers.

10 Wiring board manufacturing device, 12 base, 14 stage, 16 transport device, 20, 20B resin layer forming unit, 21 gantry, 21a leg, 21b beam, 22 ejection head, 23 nozzle, 24, 24B UV light irradiation device , 25 UV light source, 26, 26B fan, 28 lifting device, 28a slider, 30 wiring layer forming unit, 32 ejection head, 35 carriage, 36 laser irradiation device, 40 control device, 41 CPU, 42 ROM, 43 HDD, 44 RAM 45 I / O interface, 46 buses.

Claims (4)

A laminated body production apparatus for producing a laminated body by laminating resin layers on a stage,
An ejection head for ejecting UV curable resin ink toward the stage;
A UV light irradiation device that irradiates UV light toward the stage;
A gantry configured to be gate-shaped so as to be able to move relative to the stage and straddle the stage, and to mount the ejection head and the UV light irradiation device;
With
The discharge body and the UV light irradiation device are disposed with the gantry in between in the direction of relative movement. It is a laminated body preparation apparatus of Claim 1, Comprising:
A laminate manufacturing apparatus comprising a lifting device that moves the UV light irradiation device up and down with respect to the gantry. It is a laminated body preparation apparatus of Claim 1 or 2,
The UV light irradiation device includes a UV light source and a fan that is disposed above the UV light source and blows air toward the UV light source. It is a laminated body preparation apparatus of Claim 1 or 2,
The UV light irradiation device includes a UV light source and a fan that is disposed above the UV light source and sucks air from the UV light source side.

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