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WO2017164565A1 - Viscous solution application apparatus and viscous solution application method - Google Patents

Viscous solution application apparatus and viscous solution application method Download PDF

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Publication number
WO2017164565A1
WO2017164565A1 PCT/KR2017/002875 KR2017002875W WO2017164565A1 WO 2017164565 A1 WO2017164565 A1 WO 2017164565A1 KR 2017002875 W KR2017002875 W KR 2017002875W WO 2017164565 A1 WO2017164565 A1 WO 2017164565A1
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WO
WIPO (PCT)
Prior art keywords
aerosol
nozzle
pneumatic
viscous solution
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2017/002875
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French (fr)
Korean (ko)
Inventor
홍승민
김건희
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Protec Co Ltd Korea
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Protec Co Ltd Korea
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Filing date
Publication date
Application filed by Protec Co Ltd Korea filed Critical Protec Co Ltd Korea
Publication of WO2017164565A1 publication Critical patent/WO2017164565A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
    • B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
    • B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/14—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas designed for spraying particulate materials
    • B05B7/1404—Arrangements for supplying particulate material
    • B05B7/144—Arrangements for supplying particulate material the means for supplying particulate material comprising moving mechanical means
    • B05B7/1445—Arrangements for supplying particulate material the means for supplying particulate material comprising moving mechanical means involving vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/005—Nozzles or other outlets specially adapted for discharging one or more gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/02—Spray pistols; Apparatus for discharge
    • B05B7/04—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/02—Spray pistols; Apparatus for discharge
    • B05B7/04—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge
    • B05B7/0416—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/14—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas designed for spraying particulate materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/14—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas designed for spraying particulate materials
    • B05B7/1481—Spray pistols or apparatus for discharging particulate material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
    • H01L21/02307—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
    • H01L21/02343—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to a liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02623—Liquid deposition
    • H01L21/02628—Liquid deposition using solutions

Definitions

  • the present invention relates to a viscous solution application device and a viscous solution application method, and more particularly, to a viscous solution application device and a viscous solution application method for applying the viscous solution to the correct area of the material, such as semiconductor parts at the correct dose.
  • Apparatuses for applying viscous solutions such as silicones and epoxies are widely used in many industries.
  • various processes of applying silver paste or solder paste to a substrate or a semiconductor chip as well as a synthetic resin solution are widely used in many industries.
  • a dispenser for applying a solution using a pump such as a screw pump, a linear pump, or a piezoelectric pump has been widely used.
  • a pump such as a screw pump, a linear pump, or a piezoelectric pump.
  • Such a conventional dispenser uses a method of discharging a solution in a stream form or continuously discharging the solution in a droplet form of a small size.
  • Such a conventional coating method or coating apparatus has a limitation in finely controlling the amount of the solution to be applied.
  • the minimum droplet size of a widely used piezoelectric pump is usually several hundred micrometers or more. Therefore, there is a problem that it is difficult to use a conventional coating device in the process of applying the solution with a line width of several micrometers to several tens of micrometers or the process of applying the coating capacity of the viscous solution very finely.
  • the spray injection method may be used.
  • the spray spraying method has an advantage that it is easy to finely adjust the coating capacity, it is difficult to apply the solution in a very narrow area or to apply the solution in the form of a very thin line due to the property of being sprayed while spreading over a wide area. There is a problem.
  • the present invention has been made to solve the problems described above, it is possible to precisely control the coating capacity of the viscous solution and viscous solution coating device and viscous solution coating that can finely adjust the line thickness or area of the coating area It is an object to provide a method.
  • the viscous solution application device of the present invention for solving the above object, the storage unit for storing the solution; An aerosol generating unit for converting the solution delivered from the reservoir into an aerosol in a fine particle state; A chamber configured to receive and store the aerosol generated by the aerosol generating unit; An aerosol nozzle which receives the aerosol from the chamber and injects the aerosol; A supply pipe connecting the chamber and an aerosol nozzle; A feed pump for applying pressure to the aerosol delivered from the chamber to the aerosol nozzle through the supply pipe; And a controller for controlling the operation of the aerosol-generating unit and the feed pump.
  • the viscous solution application method of the present invention (a) storing the solution in the storage; (b) converting the solution stored in the reservoir into an aerosol in a fine particle state using an aerosol generating unit; (c) delivering the aerosol generated in step (b) to a chamber; And (d) spraying the aerosol stored in the chamber through an aerosol nozzle.
  • the viscous solution application device and the viscous solution application method of the present invention provide an effect of providing a viscous solution application device and a viscous solution application method capable of precisely adjusting the application amount of the viscous solution and finely controlling the application area of the viscous solution. There is.
  • FIG. 1 is a schematic diagram of a viscous solution application device according to an embodiment of the present invention.
  • FIG. 2 is a schematic view of a viscous solution application device according to another embodiment of the present invention.
  • FIG. 1 is a schematic diagram of a viscous solution application device according to an embodiment of the present invention.
  • the viscous solution application device of the present embodiment includes a storage unit 10, an aerosol generating unit 21, a chamber 30, an aerosol nozzle 50, a supply pipe 33, a supply pump 31, and a controller. 70 is made.
  • the storage unit 10 stores the solution to be applied to the material (S).
  • the solution used in the present embodiment may be a silver paste for EMI coating applied to a semiconductor chip, or a solder paste for bonding a semiconductor chip to a substrate.
  • the aerosol generating unit 21 converts the solution delivered from the storage unit 10 into an aerosol in the form of fine particles.
  • an aerosol generating unit 21 is installed inside the storage unit 10.
  • This embodiment uses an aerosol generating unit 21 having an ultrasonic diaphragm.
  • the ultrasonic diaphragm vibrates the solution inside the storage unit 10 to atomize the solution, thereby generating aerosols in the form of particles having a size of about several micrometers or smaller.
  • the aerosol generated by the aerosol generating unit 21 is delivered to the chamber 30 connected to the reservoir 10.
  • the aerosol delivered from the reservoir 10 to the chamber 30 is stored in the chamber 30.
  • the reservoir 10 and the chamber 30 are connected to the delivery pipe 13.
  • the delivery pipe 13 is provided with a delivery valve 12 to open and close the delivery pipe 13 or to adjust the flow rate.
  • the reservoir 10 is provided with a delivery pump 11 to adjust the pressure of the reservoir 10 so that the aerosol is delivered to the chamber 30.
  • the operation of the aerosol generating unit 21, the delivery pump 11, and the delivery valve 12 is controlled by the control unit 70, respectively.
  • the supply pipe 33 is connected to the chamber 30, and the aerosol nozzle 50 is installed in the supply pipe 33. That is, the supply pipe 33 connects the chamber 30 and the aerosol nozzle 50.
  • the aerosol stored in the chamber 30 is delivered to the aerosol nozzle 50 through the supply pipe 33 and injected. By positioning the aerosol nozzle 50 relative to the semiconductor chip or package, it is possible to apply the solution to a desired position.
  • the chamber 30 is provided with a feed pump 31 to adjust the pressure of the chamber 30.
  • a supply valve 32 is provided in the supply pipe 33 to open and close the supply pipe 33.
  • the supply pipe 33 operates the supply pump 31 and the supply valve 32.
  • the controller 70 may adjust the amount of aerosol injected through the aerosol nozzle 50 by applying pressure to the chamber 30 by the supply pump 31 and adjusting the operation of the supply valve 32.
  • a circulation tube 40 is installed between the chamber 30 and the storage 10.
  • the aerosol stored in the chamber 30 may be delivered to the aerosol generating unit 21 through the circulation pipe 40.
  • the circulation valve 41 is installed in the circulation pipe 40.
  • the operation of the circulation valve 41 is controlled by the controller 70.
  • the aerosol stored in the chamber 30 is stored through the circulation pipe 40. 10) to be circulated.
  • the aerosol generated by the aerosol generating unit 21 and not injected into the aerosol nozzle 50 in the aerosol delivered to the chamber 30 is delivered to the storage unit 10 through the circulation pipe 40 for reuse.
  • the aerosol nozzle 50 is provided with a pneumatic nozzle 61.
  • the pneumatic nozzle 61 is formed in a direction inclined to the extending direction of the aerosol nozzle 50.
  • a pneumatic nozzle formed to cover the outer diameter of the aerosol nozzle 50 may be used.
  • the pneumatic pipe 63 is connected to the pneumatic nozzle 61.
  • a pneumatic pump 62 is connected to the pneumatic tube 63 to supply compressed air to the pneumatic nozzle 61.
  • the pneumatic 63 is provided with a pneumatic valve 64 that opens and closes the pneumatic tube 63.
  • the operation of the pneumatic pump 62 and the pneumatic valve 64 is controlled by the control unit 70.
  • the viscous solution application device of this embodiment includes two sets of pneumatic nozzles 61, pneumatic pipes 63, and pneumatic valves 64, one on each side of the aerosol nozzle 50, respectively.
  • Compressed air injected from the pneumatic nozzle 61 serves to guide or guide the aerosol is injected through the aerosol nozzle 50.
  • both pneumatic valves 64 are closed, the aerosol is injected in the vertical direction from the aerosol nozzle 50.
  • the aerosol is injected in the lateral inclination direction in the aerosol nozzle 50.
  • both pneumatic valves 64 are opened, the spray area of the aerosol is expanded by the aerosol nozzle 50.
  • the delivery pump 11, the supply pump 31, the delivery valve 12, the supply valve 32, and the circulation valve 41 are described above as an example, but only some of them in some cases It is also possible to comprise a configuration and additionally it is also possible to comprise a separate valve and pump. For example, even when there is no delivery pump 11, the aerosol can be naturally delivered to the chamber 30 by the pressure generated by the aerosol in the reservoir 10.
  • the aerosol generating unit 21 may be provided between the storage 10 and the chamber 30. That is, the aerosol-generating unit 21 receives the solution stored in the reservoir 10 to generate an aerosol, and the aerosol may be configured to be delivered to the chamber 30.
  • the viscous solution application device of the embodiment shown in FIG. 2 has the same configuration except for the configuration of the aerosol generating unit 22 and the embodiment described with reference to FIG. 1.
  • the rest of the configuration except for the aerosol-generating unit 22 will be described with reference to the same member numbers as in FIG. 1.
  • the viscous solution application device of this embodiment includes an aerosol generating unit 22 in the form of a spray.
  • the aerosol generating unit 22 includes a spray tube 223 and a spray nozzle 222.
  • the spray tube 223 is installed in the reservoir 10 to supply the solution stored in the reservoir 10.
  • the spray nozzle 222 is connected to the spray tube 223.
  • the spray nozzle 222 is connected to the spray pump 221 to supply air pressure.
  • the spray pump 221 is controlled by the control unit 70.
  • the aerosol solution thus produced is sprayed through the aerosol nozzle 50 via the chamber 30 as in the viscous solution application device described above with reference to FIG. 1. Some of the aerosols stored in the chamber 30 is circulated to the reservoir 10 through the circulation tube 40.
  • the solution to be sprayed in the form of an aerosol is stored in the storage unit 10 (step (a)).
  • the storage unit 10 may be stored according to the use of various solutions such as silver paste and solder paste.
  • the solution stored in the storage unit 10 is converted into an aerosol in a fine particle state by using the aerosol generating unit 21 (step (b)).
  • the aerosol is generated by applying vibration to the solution by using the ultrasonic diaphragm installed in the storage unit 10. It is possible to generate various aerosols by adjusting the frequency of the diaphragm according to the type of solution. Since the size of the particles of the aerosol can be made smaller than several ⁇ m depending on the method of producing the aerosol, it is possible to finely control the application capacity of the solution and to apply the solution in the form of extremely thin lines.
  • the aerosol generated by the aerosol generating unit 21 is delivered to the chamber 30 (step (c)).
  • the aerosol stored in the chamber 30 is injected through the aerosol nozzle 50 (step (d)).
  • Some of the aerosol stored in the chamber 30 is delivered to the aerosol-generating unit 21 of the storage unit 10 through the circulation tube 40 to circulate (step (e)).
  • the controller 70 operates the aerosol generating unit 21, the supply pump 31, the supply valve 32, and the circulation valve 41 to control the amount of aerosol and the circulation pipe 40 injected through the aerosol nozzle 50. It adjusts the amount of aerosol delivered to the storage 10 through. It is also possible to adjust the concentration of the aerosol to be injected through the aerosol nozzle 50 by allowing external air to enter the chamber 30 through the feed pump 31.
  • compressed air may be injected through the pneumatic nozzle 61 installed in the aerosol nozzle 50 to induce the injection of the aerosol or guide the direction (step (f)).
  • the aerosol can be adjusted to be sprayed only in the desired area without spreading, there is an advantage that it is easy to adjust the injection direction of the aerosol.
  • the injection direction of the aerosol injected from the aerosol nozzle 50 may be adjusted.
  • the spraying direction of the aerosol is inclined laterally, so that the aerosol can be effectively injected from the side surface of the material (S).
  • the aerosol nozzles are opened by opening and closing the respective pneumatic valves 64 in a state in which a plurality of sets of pneumatic nozzles 61, pneumatic pipes 63, and pneumatic valves 64 are installed in the aerosol nozzles 50. It is possible to variously adjust the direction or the injection area of the aerosol injected in 50).
  • step (b) described above is to mix the solution supplied through the spray tube 223 with the compressed air through the spray nozzle 222, such as the viscous solution application device described with reference to Figure 2 without using a diaphragm It is also possible to carry out using an aerosol-generating unit 22 for generating an aerosol.
  • the viscous solution application method of the present invention may not perform step (f) or may not perform step (e) of circulating the aerosol of the chamber 30 according to circumstances.

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  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
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Abstract

The present invention relates to a viscous solution application apparatus and a viscous solution application method and, more specifically, to a viscous solution application apparatus and a viscous solution application method enabling a viscous solution to be applied on a precise area of a material such as a semiconductor component and at a precise volume. A viscous solution application apparatus and a viscous solution application method, according to the present invention, enable precise adjustment of the amount of a viscous solution applied and fine adjustment of the application area of the viscous solution.

Description

점성 용액 도포 장치 및 점성 용액 도포 방법Viscous solution application device and viscous solution application method

본 발명은 점성 용액 도포 장치 및 점성 용액 도포 방법에 관한 것으로, 더욱 상세하게는 점성 용액을 반도체 부품과 같은 자재의 정확한 영역에 정확한 용량으로 도포하는 점성 용액 도포 장치 및 점성 용액 도포 방법에 관한 것이다.The present invention relates to a viscous solution application device and a viscous solution application method, and more particularly, to a viscous solution application device and a viscous solution application method for applying the viscous solution to the correct area of the material, such as semiconductor parts at the correct dose.

실리콘, 에폭시와 같은 점성 용액을 도포하는 장치는 여러 산업 분야에 널리 사용된다. 특히 반도체 분야에서는 합성 수지 용액뿐만 아니라 은 페이스트(silver paste)나 솔더 페이스트(solder paste)를 기판이나 반도체 칩에 도포하는 여러 가지 공정이 있다.Apparatuses for applying viscous solutions such as silicones and epoxies are widely used in many industries. In particular, in the semiconductor field, there are various processes of applying silver paste or solder paste to a substrate or a semiconductor chip as well as a synthetic resin solution.

종래에 반도체 공정에는 스크류 펌프, 리니어 펌프, 압전 펌프 등의 펌프를 사용하여 용액을 도포하는 디스펜서가 널리 사용되었다. 이와 같은 종래의 디스펜서는 용액을 스트림(stream) 형태로 토출시키거나 작은 크기의 액적(droplet) 형태로 용액을 연속적으로 토출시켜 도포하는 방법을 사용하였다.Conventionally, in the semiconductor process, a dispenser for applying a solution using a pump such as a screw pump, a linear pump, or a piezoelectric pump has been widely used. Such a conventional dispenser uses a method of discharging a solution in a stream form or continuously discharging the solution in a droplet form of a small size.

이와 같은 종래의 도포 방법 또는 도포 장치는 도포하는 용액의 양을 미세하게 조절하는데 한계가 있다. 일반적으로 널리 사용되는 압전 펌프의 최소 액적의 크기는 통상 수백 ㎛ 이상이다. 따라서 수㎛ 내지 수십 ㎛ 의 선폭으로 용액을 도포하는 공정이나 점성 용액의 도포 용량을 매우 정교하게 조절하여 도포하여야 하는 공정에는 종래의 도포 장치를 사용하기 어려운 문제점이 있다.Such a conventional coating method or coating apparatus has a limitation in finely controlling the amount of the solution to be applied. In general, the minimum droplet size of a widely used piezoelectric pump is usually several hundred micrometers or more. Therefore, there is a problem that it is difficult to use a conventional coating device in the process of applying the solution with a line width of several micrometers to several tens of micrometers or the process of applying the coating capacity of the viscous solution very finely.

점성 용액의 도포 용량을 미세하기 조절하기 위해서 스프레이 분사 방법을 사용하는 경우도 있다. 스프레이 분사 방법은 도포 용량을 미세하게 조절하기 용이한 장점은 있으나, 넓은 영역에 퍼지면서 분사되는 특성으로 인해 매우 좁은 영역에 용액을 도포하거나 매우 가느다란 선의 형태로 용액을 도포하는 공정에 사용하기 어려운 문제점이 있다.In order to finely adjust the coating capacity of a viscous solution, the spray injection method may be used. Although the spray spraying method has an advantage that it is easy to finely adjust the coating capacity, it is difficult to apply the solution in a very narrow area or to apply the solution in the form of a very thin line due to the property of being sprayed while spreading over a wide area. There is a problem.

최근의 반도체 칩이나 반도체 패키지와 같은 반도체 부품의 경우 기존에 비해 점점 더 얇고 작은 제품이 개발되고 있어서, 이와 같이 작은 제품에 점성 용액의 도포량을 정밀하게 조절하여 도포할 수 있으면서 도포 영역의 선 두께 또는 면적도 미세하게 조절할 수 있는 용액 도포 장치 및 도포 방법이 필요하게 되었다.In recent years, semiconductor components such as semiconductor chips and semiconductor packages have been developed to be thinner and smaller than conventional products. Thus, the thickness of the coating area or the thickness of the coating area can be precisely controlled and applied to such small products. There is a need for a solution coating device and a coating method that can finely control the area.

본 발명은 상술한 바와 같은 문제점을 해결하기 위하여 안출된 것으로서, 점성 용액의 도포 용량을 정밀하게 조절하는 것이 가능하고 도포 영역의 선 두께 도는 면적을 미세하게 조절할 수 있는 점성 용액 도포 장치 및 점성 용액 도포 방법을 제공하는 것을 목적으로 한다.The present invention has been made to solve the problems described above, it is possible to precisely control the coating capacity of the viscous solution and viscous solution coating device and viscous solution coating that can finely adjust the line thickness or area of the coating area It is an object to provide a method.

상술한 바와 같은 목적을 해결하기 위한 본 발명의 점성 용액 도포 장치는, 용액이 저장되는 저장부; 상기 저장부에서 전달 받은 상기 용액을 미세 입자 상태의 에어로졸로 변환하는 에어로졸 발생 유닛; 상기 에어로졸 발생 유닛에서 생성된 상기 에어로졸을 전달 받아 저장하는 챔버; 상기 챔버에서 상기 에어로졸을 전달 받아 분사하는 에어로졸 노즐; 상기 챔버와 에어로졸 노즐을 연결하는 공급관; 상기 공급관을 통해 챔버에서 에어로졸 노즐로 전달되는 상기 에어로졸에 압력을 가하는 공급 펌프; 및 상기 에어로졸 발생 유닛과 상기 공급 펌프의 작동을 제어하는 제어부;를 포함하는 점에 특징이 있다.The viscous solution application device of the present invention for solving the above object, the storage unit for storing the solution; An aerosol generating unit for converting the solution delivered from the reservoir into an aerosol in a fine particle state; A chamber configured to receive and store the aerosol generated by the aerosol generating unit; An aerosol nozzle which receives the aerosol from the chamber and injects the aerosol; A supply pipe connecting the chamber and an aerosol nozzle; A feed pump for applying pressure to the aerosol delivered from the chamber to the aerosol nozzle through the supply pipe; And a controller for controlling the operation of the aerosol-generating unit and the feed pump.

또한, 본 발명의 점성 용액 도포 방법은, (a) 용액을 저장부에 저장하는 단계; (b) 에어로졸 발생 유닛을 이용하여 상기 저장부에 저장된 용액을 미세 입자 상태의 에어로졸로 변환하는 단계; (c) 상기 (b) 단계에서 발생한 에어로졸을 챔버로 전달하는 단계; 및 (d) 상기 챔버에 저장된 에어로졸을 에어로졸 노즐을 통해 분사하는 단계;를 포함하는 점에 특징이 있다.In addition, the viscous solution application method of the present invention, (a) storing the solution in the storage; (b) converting the solution stored in the reservoir into an aerosol in a fine particle state using an aerosol generating unit; (c) delivering the aerosol generated in step (b) to a chamber; And (d) spraying the aerosol stored in the chamber through an aerosol nozzle.

본 발명의 점성 용액 도포 장치 및 점성 용액 도포 방법은, 점성 용액의 도포량을 정확하게 조절하는 것이 가능하고 점성 용액의 도포 영역을 미세하게 조절하는 것이 가능한 점성 용액 도포 장치 및 점성 용액 도포 방법을 제공하는 효과가 있다.The viscous solution application device and the viscous solution application method of the present invention provide an effect of providing a viscous solution application device and a viscous solution application method capable of precisely adjusting the application amount of the viscous solution and finely controlling the application area of the viscous solution. There is.

도 1은 본 발명의 일실시예에 따른 점성 용액 도포 장치의 개략도이다.1 is a schematic diagram of a viscous solution application device according to an embodiment of the present invention.

도 2는본 발명의 다른 실시예에 따른 점성 용액 도포 장치의 개략도이다.2 is a schematic view of a viscous solution application device according to another embodiment of the present invention.

이하, 본 발명에 따른 점성 용액 도포 장치를 도면을 참조하여 상세히 설명한다.Hereinafter, a viscous solution application device according to the present invention will be described in detail with reference to the drawings.

도 1은 본 발명의 일실시예에 따른 점성 용액 도포 장치의 개략도이다.1 is a schematic diagram of a viscous solution application device according to an embodiment of the present invention.

도 1을 참조하면, 본 실시예의 점성 용액 도포 장치는 저장부(10)와 에어로졸 발생 유닛(21)과 챔버(30)와 에어로졸 노즐(50)과 공급관(33)과 공급 펌프(31)와 제어부(70)를 포함하여 이루어진다.Referring to FIG. 1, the viscous solution application device of the present embodiment includes a storage unit 10, an aerosol generating unit 21, a chamber 30, an aerosol nozzle 50, a supply pipe 33, a supply pump 31, and a controller. 70 is made.

저장부(10)에는 자재(S)에 도포하고자 하는 용액이 저장된다. 본 실시예에서 사용하는 용액은 반도체 칩에 도포하는 EMI 코팅용 은 페이스트(Silver Paste) 또는 반도체 칩을 기판에 본딩하기 위한 솔더 페이스트(Solder Paste) 등이 될 수 있다.The storage unit 10 stores the solution to be applied to the material (S). The solution used in the present embodiment may be a silver paste for EMI coating applied to a semiconductor chip, or a solder paste for bonding a semiconductor chip to a substrate.

에어로졸 발생 유닛(21)은 저장부(10)에서 전달 받은 용액을 미세 입자 상태의 에어로졸로 변환한다. 본 실시예의 경우 도 1에 도시한 것과 같이 에어로졸 발생 유닛(21)이 저장부(10) 내부에 설치된다. 본 실시예는 초음파 진동판을 구비하는 에어로졸 발생 유닛(21)을 사용한다. 초음파 진동판이 저장부(10) 내부의 용액에 진동을 가하여 용액을 무화(霧化)시킴으로써 수㎛ 내외 또는 그보다 작은 크기의 입자 상태로 에어로졸을 발생시킨다.The aerosol generating unit 21 converts the solution delivered from the storage unit 10 into an aerosol in the form of fine particles. In the present embodiment, as shown in FIG. 1, an aerosol generating unit 21 is installed inside the storage unit 10. This embodiment uses an aerosol generating unit 21 having an ultrasonic diaphragm. The ultrasonic diaphragm vibrates the solution inside the storage unit 10 to atomize the solution, thereby generating aerosols in the form of particles having a size of about several micrometers or smaller.

에어로졸 발생 유닛(21)에 의해 생성된 에어로졸은 저장부(10)에 연결된 챔버(30)로 전달된다. 저장부(10)에서 챔버(30)로 전달된 에어로졸은 챔버(30)에 저장된다. 저장부(10)와 챔버(30)는 전달관(13)으로 연결된다. 전달관(13)에는 전달 밸브(12)가 설치되어 전달관(13)을 개폐하거나 유량을 조절한다. 저장부(10)에는 전달 펌프(11)가 설치되어 저장부(10)의 압력을 조절함으로써 에어로졸이 챔버(30)로 전달되도록 한다.The aerosol generated by the aerosol generating unit 21 is delivered to the chamber 30 connected to the reservoir 10. The aerosol delivered from the reservoir 10 to the chamber 30 is stored in the chamber 30. The reservoir 10 and the chamber 30 are connected to the delivery pipe 13. The delivery pipe 13 is provided with a delivery valve 12 to open and close the delivery pipe 13 or to adjust the flow rate. The reservoir 10 is provided with a delivery pump 11 to adjust the pressure of the reservoir 10 so that the aerosol is delivered to the chamber 30.

에어로졸 발생 유닛(21)과 전달 펌프(11)와 전달 밸브(12)의 작동은 각각 제어부(70)에 의해 조절된다.The operation of the aerosol generating unit 21, the delivery pump 11, and the delivery valve 12 is controlled by the control unit 70, respectively.

챔버(30)에는 공급관(33)이 연결되고, 공급관(33)에는 에어로졸 노즐(50)이 설치된다. 즉, 공급관(33)이 챔버(30)와 에어로졸 노즐(50)을 연결한다. 챔버(30)에 저장된 에어로졸은 공급관(33)을 통해 에어로졸 노즐(50)로 전달되어 분사된다. 에어로졸 노즐(50)을 반도체 칩이나 패키지에 대해 위치시킴으로써 용액을 원하는 위치에 도포하는 것이 가능하다.The supply pipe 33 is connected to the chamber 30, and the aerosol nozzle 50 is installed in the supply pipe 33. That is, the supply pipe 33 connects the chamber 30 and the aerosol nozzle 50. The aerosol stored in the chamber 30 is delivered to the aerosol nozzle 50 through the supply pipe 33 and injected. By positioning the aerosol nozzle 50 relative to the semiconductor chip or package, it is possible to apply the solution to a desired position.

챔버(30)에는 공급 펌프(31)가 설치되어 챔버(30)의 압력을 조절한다. 공급관(33)에는 공급 밸브(32)가 설치되어 공급관(33)을 개폐한다. 공급관(33)은 공급 펌프(31)와 공급 밸브(32)를 작동시킨다. 제어부(70)는 공급 펌프(31)에 의해 챔버(30)에 압력을 가하고 공급 밸브(32)의 작동을 조절함으로써 에어로졸 노즐(50)을 통해 분사되는 에어로졸의 양을 조절할 수 있다.The chamber 30 is provided with a feed pump 31 to adjust the pressure of the chamber 30. A supply valve 32 is provided in the supply pipe 33 to open and close the supply pipe 33. The supply pipe 33 operates the supply pump 31 and the supply valve 32. The controller 70 may adjust the amount of aerosol injected through the aerosol nozzle 50 by applying pressure to the chamber 30 by the supply pump 31 and adjusting the operation of the supply valve 32.

챔버(30)와 저장부(10) 사이에는 순환관(40)이 설치된다. 챔버(30)에 저장된 에어로졸은 순환관(40)을 통해 에어로졸 발생 유닛(21)으로 전달될 수 있다. 순환관(40)에는 순환 밸브(41)가 설치된다. 순환 밸브(41)의 작동은 제어부(70)에 의해 조절된다. 공급 펌프(31)에 의해 증가된 챔버(30)의 압력과 순환 밸브(41) 및 공급 밸브(32)의 개폐 조작에 따라 챔버(30)에 저장된 에어로졸이 순환관(40)을 통해 저장부(10)로 전달되어 순환할 수 있다. 에어로졸 발생 유닛(21)에 의해 생성되어 챔버(30)로 전달된 에어로졸 중에 에어로졸 노즐(50)로 분사되지 않은 에어로졸은 순환관(40)을 통해 저장부(10)로 전달되어 재사용된다.A circulation tube 40 is installed between the chamber 30 and the storage 10. The aerosol stored in the chamber 30 may be delivered to the aerosol generating unit 21 through the circulation pipe 40. The circulation valve 41 is installed in the circulation pipe 40. The operation of the circulation valve 41 is controlled by the controller 70. According to the pressure of the chamber 30 increased by the feed pump 31 and the opening / closing operation of the circulation valve 41 and the supply valve 32, the aerosol stored in the chamber 30 is stored through the circulation pipe 40. 10) to be circulated. The aerosol generated by the aerosol generating unit 21 and not injected into the aerosol nozzle 50 in the aerosol delivered to the chamber 30 is delivered to the storage unit 10 through the circulation pipe 40 for reuse.

도 1을 참조하면, 에어로졸 노즐(50)에는 공압 노즐(61)이 설치된다. 본 실시예의 경우 공압 노즐(61)은 에어로졸 노즐(50)의 연장 방향에 경사진 방향으로 형성된다. 경우에 따라서는 에어로졸 노즐(50)의 외경을 감싸도록 형성된 공압 노즐을 사용할 수도 있다. 공압 노즐(61)에는 공압관(63)이 연결된다. 공압관(63)에는 공압 펌프(62)가 연결되어 공압 노즐(61)에 압축 공기를 공급한다. 공압(63)에는 공압관(63)을 개폐하는 공압 밸브(64)가 설치된다. 공압 펌프(62)와 공압 밸브(64)의 작동은 제어부(70)에 의해 조절된다. 본 실시예의 점성 용액 도포 장치는 에어로졸 노즐(50)의 양측에 각각 하나씩 두세트의 공압 노즐(61), 공압관(63), 공압 밸브(64)를 구비한다. Referring to FIG. 1, the aerosol nozzle 50 is provided with a pneumatic nozzle 61. In the case of the present embodiment, the pneumatic nozzle 61 is formed in a direction inclined to the extending direction of the aerosol nozzle 50. In some cases, a pneumatic nozzle formed to cover the outer diameter of the aerosol nozzle 50 may be used. The pneumatic pipe 63 is connected to the pneumatic nozzle 61. A pneumatic pump 62 is connected to the pneumatic tube 63 to supply compressed air to the pneumatic nozzle 61. The pneumatic 63 is provided with a pneumatic valve 64 that opens and closes the pneumatic tube 63. The operation of the pneumatic pump 62 and the pneumatic valve 64 is controlled by the control unit 70. The viscous solution application device of this embodiment includes two sets of pneumatic nozzles 61, pneumatic pipes 63, and pneumatic valves 64, one on each side of the aerosol nozzle 50, respectively.

공압 노즐(61)에서 분사되는 압축 공기는 에어로졸이 에어로졸 노즐(50)을 통해 분사되는 것을 유도하거나 그 방향을 가이드하는 역할을 한다. 두개의 공압 밸브(64)가 모두 닫혀 있는 경우에는 에어로졸 노즐(50)에서 에어로졸이 수직 방향으로 분사된다. 두개의 공압 밸브(64) 중 어느 하나만 개방된 경우에는 에어로졸 노즐(50)에서 에어로졸이 측방향으로 기울어진 방향으로 분사된다. 두개의 공압 밸브(64)가 모두 개방된 경우에는 에어로졸 노즐(50)에서 에어로졸의 분사 면적이 확장되어 분사된다. Compressed air injected from the pneumatic nozzle 61 serves to guide or guide the aerosol is injected through the aerosol nozzle 50. When both pneumatic valves 64 are closed, the aerosol is injected in the vertical direction from the aerosol nozzle 50. When only one of the two pneumatic valves 64 is opened, the aerosol is injected in the lateral inclination direction in the aerosol nozzle 50. When both pneumatic valves 64 are opened, the spray area of the aerosol is expanded by the aerosol nozzle 50.

이상, 본 발명의 점성 용액 도포 장치에 대해 바람직한 일 실시예를 들어 설명하였으나 본 발명의 범위가 앞에서 설명하고 도시한 형태로 한정되는 것은 아니다. As mentioned above, although the viscous solution coating apparatus of this invention was mentioned and demonstrated one preferable Example, the scope of the present invention is not limited to the form demonstrated and shown above.

예를 들어, 앞에서 전달 펌프(11), 공급 펌프(31), 전달 밸브(12), 공급 밸브(32) 및 순환 밸브(41)를 구비하는 경우를 예로 들어 설명하였으나 경우에 따라서는 이들 중 일부만을 구비하는 구성도 가능하고 추가로 별도의 밸브와 펌프를 구비하는 구성도 가능하다. 예를 들어 전달 펌프(11)가 없는 경우에도 저장부(10)에서 에어로졸이 발생하는 압력에 의해 자연적으로 에어로졸이 챔버(30)로 전달될 수 있다.For example, the case in which the delivery pump 11, the supply pump 31, the delivery valve 12, the supply valve 32, and the circulation valve 41 are described above as an example, but only some of them in some cases It is also possible to comprise a configuration and additionally it is also possible to comprise a separate valve and pump. For example, even when there is no delivery pump 11, the aerosol can be naturally delivered to the chamber 30 by the pressure generated by the aerosol in the reservoir 10.

또한, 앞에서 순환관(40)을 구비하는 경우를 예로 들어 설명하였으나 경우에 따라서는 순환관(40)을 구비하지 않는 실시예를 구성하는 것도 가능하다. 순환관(40)이 없는 경우에는 챔버(30) 내부의 에어로졸을 순환시키지 않고 전부 사용하거나 외부로 배출하게 된다.In addition, although the case in which the circulation tube 40 is provided as an example has been described above, in some cases, it is possible to configure an embodiment in which the circulation tube 40 is not provided. When there is no circulation pipe 40, all of the aerosol inside the chamber 30 is circulated without being circulated or discharged to the outside.

또한, 앞에서 공압 노즐(61)과 공압 펌프(62)와 공압관(63) 및 공압 밸브(64)를 구비하는 경우를 예로 들었으나 경우에 따라서는 이를 구비하지 않는 실시예를 구성하는 것도 가능하다.In addition, although the above-described case of having the pneumatic nozzle 61, the pneumatic pump 62, the pneumatic tube 63 and the pneumatic valve 64 has been exemplified, it is also possible to configure an embodiment that does not have this in some cases .

또한, 앞에서 에어로졸 발생 유닛(21)은 저장부(10)에 설치되는 것으로 설명하였으나 경우에 따라서는 저장부(10)와 챔버(30)의 사이에 에어로졸 발생 유닛(21)을 설치하는 것도 가능하다. 즉, 저장부(10)에 저장된 용액을 에어로졸 발생 유닛(21)이 전달 받아 에어로졸을 발생시키고 그 에어로졸이 챔버(30)로 전달되도록 구성하는 것도 가능하다. In addition, although the aerosol generating unit 21 has been described as being installed in the storage 10, in some cases, the aerosol generating unit 21 may be provided between the storage 10 and the chamber 30. . That is, the aerosol-generating unit 21 receives the solution stored in the reservoir 10 to generate an aerosol, and the aerosol may be configured to be delivered to the chamber 30.

다음으로 도 2를 참조하여 본 발명의 다른 실시예에 따른 점성 용액 도포 장치에 대해 설명한다. 도 2에 도시된 실시예의 점성 용액 도포 장치는 도 1을 참조하여 설명한 실시예와 에어로졸 발생 유닛(22)의 구성을 제외한 나머지 구성이 모두 동일하다. 편의상 에어로졸 발생 유닛(22)을 제외한 나머지 구성에 대해서는 도 1과 동일한 부재번호를 부여하여 도시하여 설명하기로 한다. Next, a viscous solution application device according to another embodiment of the present invention will be described with reference to FIG. 2. The viscous solution application device of the embodiment shown in FIG. 2 has the same configuration except for the configuration of the aerosol generating unit 22 and the embodiment described with reference to FIG. 1. For the sake of convenience, the rest of the configuration except for the aerosol-generating unit 22 will be described with reference to the same member numbers as in FIG. 1.

본 실시예의 점성 용액 도포 장치는 스프레이 형태의 에어로졸 발생 유닛(22)을 구비한다. 에어로졸 발생 유닛(22)은 스프레이 관(223)과 스프레이 노즐(222)을 구비한다. 스프레이 관(223)은 저장부(10)에 설치되어 저장부(10)에 저장된 용액을 공급한다. 스프레이 노즐(222)은 스프레이 관(223)에 연결된다. 스프레이 노즐(222)은 스프레이 펌프(221)에 연결되어 공압이 공급된다. 스프레이 펌프(221)에 의해 고압의 공기가 공급되면 스프레이 관(223)을 통해 공급된 용액과 공기가 섞이면서 용액이 에어로졸 형태로 스프레이 분사된다. 스프레이 펌프(221)의 작동은 제어부(70)에 의해 조절된다. The viscous solution application device of this embodiment includes an aerosol generating unit 22 in the form of a spray. The aerosol generating unit 22 includes a spray tube 223 and a spray nozzle 222. The spray tube 223 is installed in the reservoir 10 to supply the solution stored in the reservoir 10. The spray nozzle 222 is connected to the spray tube 223. The spray nozzle 222 is connected to the spray pump 221 to supply air pressure. When the high pressure air is supplied by the spray pump 221, the solution is sprayed in the form of an aerosol while the air supplied with the solution supplied through the spray tube 223 is mixed. Operation of the spray pump 221 is controlled by the control unit 70.

이와 같이 생성된 에어로졸 상태의 용액은 앞서 도 1을 참조하여 설명한 점성 용액 도포 장치와 마찬가지로 챔버(30)를 거쳐서 에어로졸 노즐(50)을 통해 분사된다. 챔버(30)에 저장된 에어로졸 중 일부는 순환관(40)을 통해서 저장부(10)로 순환된다.The aerosol solution thus produced is sprayed through the aerosol nozzle 50 via the chamber 30 as in the viscous solution application device described above with reference to FIG. 1. Some of the aerosols stored in the chamber 30 is circulated to the reservoir 10 through the circulation tube 40.

이하 상술한 바와 같이 구성된 점성 용액 도포 장치를 이용하여 본 발명에 따른 점성 용액 도포 방법을 실시하는 과정을 설명한다.Hereinafter, a process of performing the viscous solution application method according to the present invention using the viscous solution application device configured as described above will be described.

먼저, 도 1을 참조하여 설명한 점성 용액 도포 장치를 이용하여 점성 용액 도포 방법을 실시하는 과정을 설명한다. First, the process of implementing a viscous solution application method using the viscous solution application apparatus demonstrated with reference to FIG. 1 is demonstrated.

에어로졸의 형태로 분사할 용액을 저장부(10)에 저장한다((a) 단계). 상술한 바와 같이 은 페이스트, 솔더 페이스트 등의 다양한 용액의 용도에 따라 저장부(10)에 저장될 수 있다.The solution to be sprayed in the form of an aerosol is stored in the storage unit 10 (step (a)). As described above, the storage unit 10 may be stored according to the use of various solutions such as silver paste and solder paste.

다음으로, 에어로졸 발생 유닛(21)을 이용하여 저장부(10)에 저장된 용액을 미세 입자 상태의 에어로졸로 변환한다((b) 단계). 본 실시예에서는 상술한 바와 같이 저장부(10)에 설치된 초음파 진동판을 이용하여 용액에 진동을 가하는 방법으로 에어로졸을 발생시킨다. 용액의 종류에 따라 진동판의 진동수를 조절하는 방법으로 다양하게 에어로졸을 생성하는 것이 가능하다. 에어로졸을 생성하는 방법에 따라 에어로졸의 입자의 크기를 수㎛ 보다 작게 가능하기 때문에 용액의 도포 용량을 미세하게 조절하는 것이 가능하고 극히 가느다란 선의 형태로 용액을 도포하는 것도 가능하다.Next, the solution stored in the storage unit 10 is converted into an aerosol in a fine particle state by using the aerosol generating unit 21 (step (b)). In this embodiment, as described above, the aerosol is generated by applying vibration to the solution by using the ultrasonic diaphragm installed in the storage unit 10. It is possible to generate various aerosols by adjusting the frequency of the diaphragm according to the type of solution. Since the size of the particles of the aerosol can be made smaller than several μm depending on the method of producing the aerosol, it is possible to finely control the application capacity of the solution and to apply the solution in the form of extremely thin lines.

에어로졸 발생 유닛(21)에 의해 생성된 에어로졸은 챔버(30)로 전달된다((c) 단계). 챔버(30)에 저장된 에어로졸은 에어로졸 노즐(50)을 통해 분사된다((d) 단계). 챔버(30)에 저장된 에어로졸 중 일부는 순환관(40)을 통해 저장부(10)의 에어로졸 발생 유닛(21)으로 전달하여 순환하게 된다((e) 단계).The aerosol generated by the aerosol generating unit 21 is delivered to the chamber 30 (step (c)). The aerosol stored in the chamber 30 is injected through the aerosol nozzle 50 (step (d)). Some of the aerosol stored in the chamber 30 is delivered to the aerosol-generating unit 21 of the storage unit 10 through the circulation tube 40 to circulate (step (e)).

제어부(70)는 에어로졸 발생 유닛(21), 공급 펌프(31), 공급 밸브(32), 순환 밸브(41)를 조작하여 에어로졸 노즐(50)을 통해 분사되는 에어로졸의 양과 순환관(40)을 통해 저장부(10)로 전달되는 에어로졸의 양을 조절하게 된다. 공급 펌프(31)를 통해 외부 공기가 챔버(30)에 유입되도록 함으로써 에어로졸 노즐(50)을 통해서 분사될 에어로졸의 농도를 조절하는 것도 가능하다.The controller 70 operates the aerosol generating unit 21, the supply pump 31, the supply valve 32, and the circulation valve 41 to control the amount of aerosol and the circulation pipe 40 injected through the aerosol nozzle 50. It adjusts the amount of aerosol delivered to the storage 10 through. It is also possible to adjust the concentration of the aerosol to be injected through the aerosol nozzle 50 by allowing external air to enter the chamber 30 through the feed pump 31.

한편, 상술한 바와 같이 에어로졸 노즐(50)에 설치된 공압 노즐(61)을 통해 압축 공기를 분사하여 에어로졸의 분사를 유도하거나 방향을 가이드할 수 있다((f) 단계). 이와 같이 공압 노즐(61)을 통해 압축 공기를 에어로졸 노즐(50) 주위로 분사함으로써, 에어로졸이 퍼지지 않고 원하는 영역에만 분사되도록 조절할 수도 있고 에어로졸의 분사 방향을 조절하기 용이한 장점이 있다. 앞에서 설명한 것과 같이 고압 노즐(61)에서 분사되는 압축 공기의 방향을 에어로졸 노즐(50)의 방향과 다르게 조절함으로써, 에어로졸 노즐(50)에서 분사되는 에어로졸의 분사 방향을 조절할 수 있다. 이와 같이 에어로졸의 분사 방향이 측방향으로 기울어지게 함으로써 자재(S)의 측면에서 에어로졸을 효과적으로 분사할 수 있는 장점이 있다. 또한, 앞에서 설명한 바와 같이 복수 세트의 공압 노즐(61), 공압관(63), 공압 밸브(64)를 에어로졸 노즐(50)에 설치한 상태에서 각각의 공압 밸브(64)를 개폐함으로써 에어로졸 노즐(50)에서 분사되는 에어로졸의 방향이나 분사 면적을 다양하게 조절하는 것이 가능하다. Meanwhile, as described above, compressed air may be injected through the pneumatic nozzle 61 installed in the aerosol nozzle 50 to induce the injection of the aerosol or guide the direction (step (f)). In this way, by injecting compressed air around the aerosol nozzle 50 through the pneumatic nozzle 61, the aerosol can be adjusted to be sprayed only in the desired area without spreading, there is an advantage that it is easy to adjust the injection direction of the aerosol. As described above, by adjusting the direction of the compressed air injected from the high pressure nozzle 61 different from the direction of the aerosol nozzle 50, the injection direction of the aerosol injected from the aerosol nozzle 50 may be adjusted. As such, the spraying direction of the aerosol is inclined laterally, so that the aerosol can be effectively injected from the side surface of the material (S). As described above, the aerosol nozzles are opened by opening and closing the respective pneumatic valves 64 in a state in which a plurality of sets of pneumatic nozzles 61, pneumatic pipes 63, and pneumatic valves 64 are installed in the aerosol nozzles 50. It is possible to variously adjust the direction or the injection area of the aerosol injected in 50).

또한 에어로졸 노즐(50)의 내경을 작게 조절함으로써 에어로졸이 분사될 영역의 용액의 도포량을 매우 정밀하게 조절하는 것이 가능한 장점이 있다. 또한, 종래의 용액 도포방법으로는 거의 불가능했던 수㎛ 정도의 선폭으로 용액을 도포하는 것도 가능한 장점이 있다. 종래의 스프레이 분사 방법으로는 도포량의 미세 조절이나 도포 영역의 미세 조절이 어려웠지만 본 발명의 경우 에어로졸을 생성과 동시에 분사하는 것이 아니라 에어로졸의 생성과 분사가 각각 별도의 위치에서 수행되도록 분리함으로써 종래에 불가능했던 정확도로 용액을 도포하는 것이 가능하다.In addition, it is possible to control the application amount of the solution in the area to which the aerosol is to be injected very precisely by adjusting the inner diameter of the aerosol nozzle 50 small. In addition, there is an advantage that it is also possible to apply the solution in a line width of about several micrometers which was almost impossible with the conventional solution coating method. In the conventional spray spraying method, it is difficult to finely adjust the coating amount or finely control the coating area. However, in the present invention, the aerosol is not generated and sprayed at the same time. It is possible to apply the solution with an accuracy that was impossible.

한편, 앞에서 설명한 (b) 단계는 진동판을 사용하지 않고 도 2를 참조하여 설명한 점성 용액 도포 장치와 같이 스프레이 관(223)을 통해 공급된 용액을 스프레이 노즐(222)을 통해 압축 공기와 혼합되도록 함으로써 에어로졸을 발생시키는 에어로졸 발생 유닛(22)을 이용하여 수행하는 것도 가능하다.On the other hand, step (b) described above is to mix the solution supplied through the spray tube 223 with the compressed air through the spray nozzle 222, such as the viscous solution application device described with reference to Figure 2 without using a diaphragm It is also possible to carry out using an aerosol-generating unit 22 for generating an aerosol.

한편, 본 발명의 점성 용액 도포 방법은 상황에 따라서, (f) 단계를 실시하지 않을 수도 있고 챔버(30)의 에어로졸을 순환시키는 (e) 단계를 수행하지 않을 수도 있다.Meanwhile, the viscous solution application method of the present invention may not perform step (f) or may not perform step (e) of circulating the aerosol of the chamber 30 according to circumstances.

즉, 앞에서 설명한 본 발명의 점성 용액 도포 장치의 구성에 따라 다양한 방법으로 본 발명의 점성 용액 도포 방법을 수행하는 것이 가능하다.That is, it is possible to perform the viscous solution coating method of the present invention by various methods according to the structure of the viscous solution coating device of the present invention described above.

Claims (13)

용액이 저장되는 저장부;A storage unit for storing a solution; 상기 저장부에서 전달 받은 상기 용액을 미세 입자 상태의 에어로졸로 변환하는 에어로졸 발생 유닛;An aerosol generating unit for converting the solution delivered from the reservoir into an aerosol in a fine particle state; 상기 에어로졸 발생 유닛에서 생성된 상기 에어로졸을 전달 받아 저장하는 챔버;A chamber configured to receive and store the aerosol generated by the aerosol generating unit; 상기 챔버에서 상기 에어로졸을 전달 받아 분사하는 에어로졸 노즐;An aerosol nozzle which receives the aerosol from the chamber and injects the aerosol; 상기 챔버와 에어로졸 노즐을 연결하는 공급관;A supply pipe connecting the chamber and an aerosol nozzle; 상기 공급관을 통해 챔버에서 에어로졸 노즐로 전달되는 상기 에어로졸에 압력을 가하는 공급 펌프; 및A feed pump for applying pressure to the aerosol delivered from the chamber to the aerosol nozzle through the supply pipe; And 상기 에어로졸 발생 유닛과 상기 공급 펌프의 작동을 제어하는 제어부;를 포함하는 것을 특징으로 하는 점성 용액 도포 장치.And a control unit for controlling the operation of the aerosol-generating unit and the feed pump. 제1항에 있어서,The method of claim 1, 상기 에어로졸 발생 유닛은, 상기 저장부에 저장된 용액에 진동을 가하여 에어로졸을 발생시키는 초음파 진동판을 구비하는 것을 특징으로 하는 점성 용액 도포 장치.The aerosol generating unit, the viscous solution coating device characterized in that it comprises an ultrasonic vibration plate for generating an aerosol by applying vibration to the solution stored in the storage. 제1항에 있어서,The method of claim 1, 상기 에어로졸 발생 유닛은, 상기 저장부의 용액을 공급하는 스프레이 관과 상기 스프레이 관에 공압을 분사하는 스프레이 노즐을 구비하는 것을 특징으로 하는 점성 용액 도포 장치.The aerosol-generating unit includes a spray tube for supplying a solution of the reservoir and a spray nozzle for injecting pneumatic pressure to the spray tube. 제1항에 있어서,The method of claim 1, 상기 챔버에 저장된 상기 에어로졸을 상기 에어로졸 발생 유닛으로 전달하는 순환관; 및A circulation pipe which delivers the aerosol stored in the chamber to the aerosol generating unit; And 상기 순환관의 유량을 조절하는 순환 밸브;를 더 포함하고,Further comprising: a circulation valve for adjusting the flow rate of the circulation pipe, 상기 제어부는 상기 순환 밸브의 작동을 제어하는 것을 특징으로 하는 점성 용액 도포 장치.The control unit is a viscous solution coating device, characterized in that for controlling the operation of the circulation valve. 제4항에 있어서,The method of claim 4, wherein 상기 에어로졸 노즐에 설치되어 압축 공기를 분사하는 공압 노즐;A pneumatic nozzle installed in the aerosol nozzle to inject compressed air; 상기 공압 노즐에 연결되어 압축 공기를 공급하는 공압관;A pneumatic pipe connected to the pneumatic nozzle to supply compressed air; 상기 공압관에 상기 압축 공기를 공급하는 공압 펌프; 및A pneumatic pump for supplying the compressed air to the pneumatic pipe; And 상기 공압관을 개폐하는 공압 밸브;를 더 포함하고,It further comprises a pneumatic valve for opening and closing the pneumatic pipe, 상기 제어부는 상기 공압 펌프와 공압 밸브를 제어하는 것을 특징으로 하는 점성 용액 도포 장치.And the control unit controls the pneumatic pump and the pneumatic valve. 제5항에 있어서,The method of claim 5, 상기 공압 노즐은, 상기 에어로졸 노즐에서 상기 에어로졸이 분사되는 방향에 대해 경사진 방향으로 상기 압축 공기를 분사하도록 상기 에어로졸 노즐의 연장 방향에 대해 경사진 방향으로 형성되는 것을 특징으로 하는 점성 용액 도포 장치.And the pneumatic nozzle is formed in a direction inclined with respect to an extension direction of the aerosol nozzle to inject the compressed air in a direction inclined with respect to the direction in which the aerosol is injected from the aerosol nozzle. 제6항에 있어서,The method of claim 6, 상기 공압 노즐은 복수개 마련되고,The pneumatic nozzle is provided in plurality, 상기 공압관은 복수개 마련되어 상기 공압 노즐마다 각각 하나씩 연결되고,The pneumatic pipe is provided with a plurality is connected to each one of the pneumatic nozzle, 상기 공압 밸브는 복수개 마련되어 상기 복수의 공압관들에 하나씩 설치되는 것을 특징으로 하는 점성 용액 도포 장치.The pneumatic valve is provided with a plurality of viscous solution coating device, characterized in that installed in the plurality of pneumatic pipe one by one. (a) 용액을 저장부에 저장하는 단계;(a) storing the solution in a reservoir; (b) 에어로졸 발생 유닛을 이용하여 상기 저장부에 저장된 용액을 미세 입자 상태의 에어로졸로 변환하는 단계;(b) converting the solution stored in the reservoir into an aerosol in a fine particle state using an aerosol generating unit; (c) 상기 (b) 단계에서 발생한 에어로졸을 챔버로 전달하는 단계; 및(c) delivering the aerosol generated in step (b) to a chamber; And (d) 상기 챔버에 저장된 에어로졸을 에어로졸 노즐을 통해 분사하는 단계;를 포함하는 것을 특징으로 하는 점성 용액 도포 방법(d) spraying the aerosol stored in the chamber through an aerosol nozzle; viscous solution application method comprising a 제8항에 있어서,The method of claim 8, 상기 (b) 단계는 상기 저장부에 저장된 용액에 초음파 진동판을 이용하여 진동을 가하는 방법으로 에어로졸을 발생시키는 것을 특징으로 하는 점성 용액 도포 방법.Step (b) is a method for applying a viscous solution, characterized in that for generating aerosol by applying a vibration to the solution stored in the reservoir using an ultrasonic diaphragm. 제8항에 있어서,The method of claim 8, 상기 (b) 단계는, 상기 저장부의 용액을 스프레이 관을 통해 공급하고 상기 스프레이 관에 공압을 분사하여 스프레이 노즐을 통해 에어로졸을 발생시키는 것을 특징으로 하는 점성 용액 도포 방법.Step (b), supplying a solution of the reservoir through a spray tube and spraying pneumatic pressure to the spray tube to generate aerosol through a spray nozzle, characterized in that for generating an aerosol. 제8항에 있어서,The method of claim 8, (e) 상기 챔버에 저장된 상기 에어로졸을 상기 에어로졸 발생 유닛으로 전달하여 순환시키는 단계;를 더 포함하는 것을 특징으로 하는 점성 용액 도포 방법.(e) delivering the aerosol stored in the chamber to the aerosol-generating unit and circulating it. 제11항에 있어서,The method of claim 11, (f) 상기 에어로졸 노즐과 인접하는 위치에 설치된 공압 노즐을 통해 상기 에어로졸 노즐에서 분사되는 에어로졸에 대해 압축 공기를 분사하는 단계;를 더 포함하는 것을 특징으로 하는 점성 용액 도포 방법.(f) injecting compressed air to the aerosol injected from the aerosol nozzle through a pneumatic nozzle installed in a position adjacent to the aerosol nozzle; viscous solution coating method further comprising. 제12항에 있어서,The method of claim 12, 상기 (f) 단계는 상기 에어로졸 노즐에서 상기 에어로졸을 분사하는 방향에 대해 경사진 방향으로 상기 압축 공기를 분사하는 것을 특징으로 하는 점성 용액 도포 방법.Step (f) is a viscous solution coating method, characterized in that for injecting the compressed air in a direction inclined with respect to the direction injecting the aerosol in the aerosol nozzle.
PCT/KR2017/002875 2016-03-24 2017-03-17 Viscous solution application apparatus and viscous solution application method Ceased WO2017164565A1 (en)

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