WO2017158252A1 - Power electronic module for controlling a multiphase electrical system, electric motor and vehicle equipped with this module - Google Patents

Abstract

The invention relates to a power electronic module (1) for controlling a multiphase electrical system (2), the module (1) comprising a plurality of electronic devices (4a, 4b, 4c) forming at least one incoming electrical signal (SI) and a plurality of outgoing electrical signals (S2) capable of powering the multiphase electrical system (2). Each electronic device (4a, 4b, 4c) comprises a substrate (17) integrating an electrical circuit and at least one electronic component (18) firmly joined to the substrate (17) and electrically connected to the electrical circuit. The module (1) also comprises an electrical connector (16) for injecting the at least one incoming electrical signal (SI) into the plurality of electronic devices (4a, 4b, 4c), and a cylindrical mechanical support (3) having an inner cavity (19) receiving the plurality of electronic devices (4a, 4b, 4c). The electronic components (18) of each electronic device (4a, 4b, 4c) are oriented radially towards the inside of the cavity (19) and the substrate (17) of each electronic device (4a, 4b, 4c) is oriented radially towards the outside of the cavity (19). The invention also relates to an electric vehicle.

Description

 "ELECTRONIC POWER MODULE FOR CONTROLLING A MULTIPHASE ELECTRICAL SYSTEM, ELECTRIC MOTOR AND VEHICLE EQUIPPED WITH SAID

 MODULE »

The present invention claims the priority of the French application 1652195 filed March 15, 2016 whose content (text, drawings and claims) is here incorporated by reference.

Technical area

The present invention relates to a power electronics module for controlling a multiphase electrical system. The invention lies in the field of power electronics, for controlling multiphase electric motors fitted in particular motorized vehicles whose propulsion is provided at least partially by an electric motor.

State of the art

The power electronics modules are very widely used in the field of the transport industry to control a multiphase electrical system. This is particularly the case of road or rail vehicles, the propulsion is provided at least partially by an electric motor driven by such a power electronics module.

The power electronics modules are subjected to numerous constraints during their operation, in particular mechanical and thermal. Thus, the temperature gradients introduced at their substrate under the effect of the heat dissipation of the components they support generate thermomechanical stresses cyclically repeated throughout the life of said module, producing thermal fatigue, mechanical stress and consecutively risks of malfunction and / or breakdowns.

For example, poor temperature control degrades the performance of electronic components embedded on such modules when their temperature exceeds a planned range of operation. More sustainably, the temperature variations associated with the periods of operation and shutdown of the power electronics modules can also lead to degradations of the electrical connection wires and / or to damage or even breakage of the solders of the various components. as well as a decrease in their reliability. Thus taking into account the thermal effects related to the operation of power electronics modules is essential to increase the robustness and overall performance of such modules. Power electronics modules are therefore commonly cooled by a finned cooling system for example. The latter is typically cooled by a flow of air, in particular drawn by a fan, and is traversed by thermally bonded conduits with the power electronics module through which circulates a coolant.

In parallel with these thermal constraints, it is necessary to reduce the size and bulk of these power electronics modules. However, this reduction is, in the state of the art, limited by the need to cool these modules. Such a difficulty is essentially induced because of the bulk of the ducts of the cooling apparatus. Such bulk is particularly detrimental in the thermal connection zone of the conduits with one or more electronic devices of the power electronics module to be cooled.

In addition, the various electronic components of the power electronics modules generate electromagnetic waves that can affect the operation of other electrical devices. It is therefore best to organize electronic power modules to limit their interference with other electrical elements with which they can collaborate.

The object of the present invention is to respond at least in large part to the problems, difficulties and / or disadvantages described above and to furthermore to other advantages.

Another object of the invention is to solve at least one of these problems, difficulties and / or disadvantages, by a new power electronics module.

Another object of the invention is to provide such a power electronics module whose size is sought as low as possible while improving its performance. Another object of the invention is to propose methods for protecting electronic devices from electromagnetic waves.

Another object of the invention is to propose a new thermal design for such a power electronics module, to reduce the adverse effects related to the heat dissipation of the components during operation.

Another object of the present invention is to cool as efficiently as possible such a power electronics module, while reducing at best its size and reliability of its perennial operation. Another object of the present invention is to improve the reliability and robustness of such a power electronics module.

Another object of the present invention is to reduce the causes of breakdowns and the maintenance costs of such a power module. Finally, a general object of the invention is to reduce the size and weight of such a power module, while ensuring reliable cooling thereof, to facilitate on the one hand the implementation of said module in a motor vehicle at least partially electric, and secondly to increase the autonomy of such a vehicle.

Improved performance of the power electronics module, considered alone or in combination, are particularly sought by the invention can be applied to both road vehicles and railway vehicles.

Presentation of the invention

According to a first aspect of the invention, there is provided a power electronics module arranged to control a multiphase electrical system, particularly electric motor and more particularly a propulsive engine of a motor vehicle at least partially electric.

Said module is of the type of power electronics module comprising (i) a plurality of electronic devices each comprising a substrate integrating an electrical circuit and at least one electronic component integrally bonded to the substrate and electrically connected to the electrical circuit, said electronic devices being arranged to shape at least one so-called incoming electrical signal into a plurality of so-called outgoing electrical signals, (ii) an electrical connector for injecting said at least one incoming electrical signal to the plurality of electronic devices and (iii) a mechanical support of cylindrical shape and comprising an inner recess receiving the plurality of electronic devices. In this context and according to a first aspect of the invention, the electronic components of each electronic device are oriented radially towards the inside of the recess and the substrates of each electronic device are radially oriented towards the outside of the recess. The support advantageously forms an electromagnetic shield around the plurality of electronic devices. The structural arrangement of the support and in particular its recess, are able to provide effective mechanical protection of the electronic devices housed inside said support. In addition, such provisions provide effective protection of the components of electronic devices against electromagnetic waves. The outgoing electrical signals are in particular capable of supplying the multiphase electrical system, each outgoing electrical signal constituting an electrical phase of the multiphase electrical system.

Preferably, each electronic device is arranged to form an arm of an electric inverter. The power electronics module according to the invention may comprise any number of inverter arms.

By way of non-limiting indication, the electronic components of each electronic device comprise in particular at least two insulated gate bipolar transistors, each transistor being associated with a diode to form a bidirectional switch. Alternatively, a diode may be associated with a MOFSET (Metal Oxide Grid Field Effect Transistor). More generally, the components of each electronic device are used in a binary mode, passing or blocking, oscillating at frequencies between 10 kHz and 100 kHz and thus making it possible to carry out pulse width modulations whose frequencies, amplitudes and / or cyclic ratios are controlled. All electronic devices preferably include the same components.

Each electronic device advantageously extends in a longitudinal direction oriented parallel to the axis of extension of the cylindrical support. Such a longitudinal direction of extension of the electronic devices promotes their grouping and the confinement of said electronic devices in the transverse direction. In addition, the plurality of electronic components of each of the electronic devices may advantageously be aligned in the longitudinal extension direction of the electronic device comprising it. It is thus favored the heat dissipation of each component and their cooling, in particular via a thermal interface as described below. In addition, the wiring of the components equipping each of the electronic devices on their substrate is facilitated.

According to another aspect of the invention relating in particular to a specific architecture of the support, the recess of the support is advantageously arranged in a plurality of faces forming a polygonal section frame. Each of the faces of the recess is intended in particular to receive an electronic device assigned to it. Thus the transverse size of the support is constrained and limited, without affecting the mechanical and electromagnetic protection it provides by its mass enveloping the electronic devices and the material used. According to one embodiment, the faces of the recess of the support are each formed by a wall element formed inside the recess of the support. Such a wall element may advantageously form at least one collector on which are connected cooling ducts of the electronic devices, as described below. Thus, the electronic devices are preferably individually attached to a respective face of the frame, to better organize their cooling and to facilitate their installation inside the support.

By way of non-limiting example, the power electronics module according to the invention comprises three electronic devices and the frame is of triangular section, in particular in a plane perpendicular to the longitudinal direction of extension of the electronic devices. The number of electronic devices and / or the polygonal shape of the support frame can be easily adapted as required, without unduly increasing the volume of said support, in particular transversely.

According to one embodiment, the faces of the recess of the support form a frame with a closed contour in a plane transverse to the axis of extension of the cylindrical support. In other words, the faces of the recess of the support are joined two by two along their longitudinal edges.

According to an alternative embodiment, the outline of the frame is open and possibly comprises a small gap formed between at least two longitudinal edges of respective adjacent electronic devices. The electronic devices are preferably electrically connected to the connector fixedly secured to the support. The connector is advantageously housed at least partly between the electronic devices attached to the respective faces of the frame.

Preferably, the connection between the connector and the electronic devices may be alternately or additionally an electrical connection, such as for example made by simple contact, and or a mechanical connection mechanically linking the two parts together, for example by brazing. Thus, the connector is likely to advantageously constitute a mechanical joining member of the electronic devices between them.

According to another aspect of the invention including the cooling methods of electronic devices, the module further comprises at least one cooling system arranged to cool the power electronics module. The cooling system comprises in particular (i) a thermal interface in thermal coupling with at least a part of the electronic devices and (ii) a plurality of conduits in thermal coupling with the thermal interface. The ducts are advantageously arranged for transporting a coolant between an opposite first end and a second end of the conduits.

Such an architecture promotes the efficiency of the cooling of electronic devices by transferring the calories produced at the electronic devices to said conduits and via the thermal interface.

According to an advantageous embodiment, the thermal interface may be formed by the support itself or by at least one member mounted on the support against which the electronic devices are fixed.

According to another embodiment, the thermal interface preferably comprises a plurality of collectors thermally coupled with the substrates of the electronic devices which are individually assigned to them; and each collector is further thermally coupled with at least one conduit. The at least one duct collaborating with the collector is preferably fixed integrally to it. By way of nonlimiting examples, such collectors may be made by attached elements and fixed integrally on the support or, alternatively, the support may be shaped so that partial or total openings make it possible to perform a coupling thermal and mechanical ducting near electronic devices.

Thus, one face of the collectors may advantageously form a respective face of the frame formed in the recess of the support and receiving a given electronic device, and the collectors may comprise open openings arranged to allow at least partial introduction of the conduits and ensure their coupling mechanical and / or thermal.

According to another aspect of the invention relating in particular to the organization of the conduits and their methods of thermal and / or mechanical coupling with the collectors, each duct is in particular a heat pipe containing in particular a heat transfer fluid phase change. According to an advantageous embodiment, each duct comprises (i) a mechanical and thermal coupling section with a collector, (ii) at least one bent portion located in the extension of at least one side of the coupling section, and (iii) ) at least one rectilinear part situated in the extension of the at least one bent part and forming at least one heat exchange zone with at least one cooling device mechanically bonded with the at least one rectilinear part and arranged to cool the at least one rectilinear part.

This clever configuration makes it possible, on the one hand, to increase the density of conduits by an electronic device and, on the other hand, to optimize the space between the electronic devices and the arrangement of said conduits around the power electronics module. Moreover, the plurality of ducts is advantageously arranged so that the effect of gravity on the coolant is isotropic, firstly between the first and second end of said ducts and secondly between each duct.

Such an architecture of the ducts makes it possible to achieve efficient thermal coupling of the ducts with the collectors in a small space. The distribution of the cooling members relative to the support can be carried out in a reduced space available around the support, arranging them for example laterally on either side of the support.

Thus, at least one heat exchange zone formed by the rectilinear parts of all the ducts may advantageously be located radially outwardly of the support. Said at least one heat exchange zone is in particular subdivided into a first heat exchange zone and a second heat exchange zone distinct from the first heat exchange zone, the first and second heat exchange zones being preferentially located radially on either side of the support, and preferably still symmetrically with respect to said support and / or relative to the plane containing the cylindrical extension axis of the support.

In other words, the first heat exchange zone and the second heat exchange zone are located outside the support, on either side of a plane containing the cylindrical extension axis of the support .

According to various embodiments, taken alone or in combination at least two by two:

the cooling apparatus comprises a first and a second cooling member;

 at least one electronic device is thermally coupled to a first plurality of ducts, each duct of the plurality of ducts comprising a first rectilinear portion located on a first side of the coupling section and forming the first heat exchange zone with the first one; cooling member and a second straight portion located on a second side of the coupling section and forming the second heat exchange zone with the second cooling member;

 at least one electronic device is thermally coupled to a second plurality of ducts, each duct of the plurality of ducts comprising a single rectilinear portion located on one side of the coupling section and forming the heat exchange zone with the appliance of cooling;

at least one electronic device is thermally coupled to the conduits of the first plurality and through the conduits of the second plurality; Preferably, the heat exchange zones of the cooling apparatus with the straight portions of two directly adjacent ducts of the second plurality of ducts are located alternately on either side of the support.

According to advantageous embodiments, the conduits are distributed in a plurality of groups of conduits having specific configurations and / or specific thermal and / or mechanical coupling methods with the cooling apparatus. The plurality of electronic devices is thus thermally coupled to at least one of these groups. Such groups of conduits include, for example, at least one of the following groups:

 at least one first group of conduits falling in the ducts of the first plurality of ducts. According to this first group of ducts, the coupling section of the ducts of the first plurality of ducts is extended at each of its ends by a first bent portion and a second bent portion. The first bent portion is extended by a first rectilinear portion and the second bent portion is extended by a second rectilinear portion. ;

 at least one second group of conduits alternately rising from ducts of the first and second plurality of ducts;

 at least a third group of ducts falling in conduits of the second plurality of ducts. According to this third group of ducts of the second plurality of ducts, the coupling section of the ducts is extended at one of its ends by a bent portion extended in turn by a rectilinear part, the other end of the coupling section being closed.

Advantageously, the first group of conduits may be assigned to at least one first electronic device, and / or the second group of conduits may be assigned to at least one second electronic device and / or the third group of conduits may be assigned to at least one a third electronic device. by way of non-limiting example, at least one first electronic device is thermally coupled to a plurality of conduits of the first group, said conduits of the first plurality of conduits being adjacent in the longitudinal direction of the substrate of the first electronic device and extending transversely to said first electronic device.

Complementarily or alternatively, at least one second electronic device is thermally coupled to a plurality of conduits of the second group, said conduits being adjacent in the longitudinal direction of the substrate of the second electronic device and extending transversely with respect to said second electronic device, the conduits of the first plurality of conduits being arranged alternately with the conduits of the second plurality of conduits.

Complementarily or alternatively, at least one third electronic device is thermally coupled to a plurality of conduits of the third group, said conduits of the second plurality of conduits being adjacent in the longitudinal direction of the substrate of the third electronic device and extending transversely through report to said third electronic device alternately on one side and the other of the module

The alternation of successive disposition of the ducts assigned to the second electronic device and the ducts assigned to the third electronic device is advantageously offset. Such an arrangement of the ducts between them makes it possible to reduce the space requirement resulting from the successive and alternating adjacency of the ducts, while allowing an optimization of the number of ducts used for the cooling of the electronic devices.

Another aspect of the invention relates to the organization of the cooling apparatus for improving the robustness and / or the efficiency of the heat exchange between the ducts and the cooling system.

According to this aspect of the invention, the cooling apparatus comprises at least one cooling member comprising a set of fins crossed by the rectilinear part of the ducts. The fins of the same cooling member are preferably arranged successively along the straight portion of the ducts. Preferably, the fins of the same cooling member are oriented substantially parallel to each other and substantially perpendicular to the straight portion of the ducts. Such arrangements make it possible in particular to promote thermal coupling and / or to reinforce the robustness of the mechanical connection between the ducts and the cooling apparatus. According to a particular embodiment, the fins of a cooling member are thermally and mechanically coupled to the rectilinear part of all the ducts.

Optionally, and especially for the ducts of the first plurality of ducts, the first straight portion of each duct is thermally and mechanically coupled to the fins of a first cooling member, and the second straight portion of each duct is thermally and mechanically coupled to the ducts. fins of a second cooling member. Furthermore, the cooling apparatus preferably comprises at least one fan arranged to generate an air flow, especially when the vehicle is off.

Said at least one fan is advantageously arranged, for example on the cooling apparatus, so that the generated air flow is directed between the rectilinear parts of the ducts and between the fins of the cooling apparatus.

More particularly, the cooling apparatus comprises a first fan assigned to the first cooling member and a second fan assigned to the second cooling member.

In order to reinforce the robustness of the maintenance of the duct network while limiting its size and optimizing heat transfers with the ambient air, the cooling system of a module according to the invention provides several embodiments relating to the arrangement of ducted through the fins.

Consider a plane containing a fin of a given cooling member. In this plane, the ducts are preferably arranged in a two-dimensional array extending in two particular directions. Advantageously, these two directions extend respectively parallel and perpendicular to the axis of the cylindrical support.

The pitch of the network defined above may be alternately identical or different in one and the other of the two particular directions.

According to an alternative variant, the ducts are advantageously organized in staggered rows. Such a staggered arrangement can be obtained from an offset of the alignment of the heat-coupled ducts with a first collector with respect to the heat-coupled ducts with another collector.

According to a second aspect of the invention, there is provided a set of components comprising an electric motor and a power electronics module according to the first aspect of the invention or any of its variants. In this context, the electric motor is in particular controlled by the power electronics module.

The multi-phase electrical system may comprise an electric motor for propelling a means of transport, such as a road motor vehicle or a railway vehicle. More generally, the assembly according to the second aspect of the invention is arranged to control a wide variety of electrical systems, without limitation of the field of application. According to a third aspect of the invention, there is provided a motor vehicle comprising a set of components according to the second aspect of the invention. The electric motor constituting the multiphase electrical system and whose control is operated by the electronic control module of the invention, is advantageously a propulsive engine of the vehicle. The vehicle of the present invention is likely to be any vehicle with at least partially electric propulsion, such as for example a motor vehicle or a railway vehicle, such as a prime mover of a train.

According to a fourth aspect of the invention, it is proposed the use of a set of components according to the second aspect of the invention, for the propulsion of a motor vehicle propulsive at least partially electric.

Various embodiments of the invention can be made by integrating, according to all of their possible combinations, the various optional features disclosed in this document.

DESCRIPTION OF THE FIGURES AND EMBODIMENTS Other features and advantages of the invention will become apparent from the following description, and non-limiting exemplary embodiments relating to one or more aspects of the invention. with reference to the schematic drawings of the attached plates, in which:

 - FIGURE 1 is a perspective illustration of an embodiment of a control electronics module of a multiphase electrical system according to the first aspect of the present invention.

 FIG. 2 and FIG. 3 are perspective illustrations of an exemplary embodiment of a support for the electronic devices of a module according to the first aspect of the present invention, seen respectively from the one and the other of its axial ends.

 - FIGURE 4 is a perspective view cut along a median plane, of an embodiment of a cooling system of a control electronics module according to the first aspect of the present invention.

FIGURE 5 is a cross-sectional view of the control electronics module as shown in FIGURE 4. FIGURE 6 is a perspective detail of the control electronics module shown in FIGURE 4 and FIGURE 5.

The embodiments which will be described below are in no way limiting. Other embodiments of the invention may be developed from a selection of characteristics described hereinafter isolated from the other characteristics described, if this selection of characteristics is sufficient to confer a technical advantage and / or to exploit the at least one of the technical results generally provided by the invention, differing structurally and / or functionally from the state of the prior art. This selection may comprise at least one preferably functional feature without structural details, or with only a part of the structural details if this part alone is sufficient to confer a technical advantage or to differentiate the invention from the state of the prior art .

In particular, all the improvements and all the embodiments described are combinable with each other if nothing stands in the way of this combination on a technical level. Moreover, to avoid an overload of the figures, to make them easy to read and to clarify their description, the elements common to several figures retain the same reference, as much in their representation as for their description, without implying their individual and / or precise representation on each of the FIGS.

FIG. 1 represents an exemplary embodiment of a control electronics module 1 according to the first aspect of the invention. Module 1 is organized to control the operation of a multiphase electrical system 2, of the type for example of a propulsion engine of a motor vehicle at least partially electric.

The module 1 comprises a cylindrical support 3 arranged to house a plurality of electronic devices, such as the electronic devices 4a, 4b, 4c illustrated in FIGS. 4 to 6. The electronic devices 4a, 4b, 4c are arranged to shape at the same time. minus an incoming electrical signal S1 and generate a plurality of outgoing electrical signals S2, at least three in number, controlling the operation of the multiphase electrical system 2. The injection of the incoming electrical signal S1 will be detailed later.

As a non-limiting example, the electronic devices 4a, 4b, 4c may be of the DC-DC converter type, such as choppers. The incoming electrical signal (s) SI are indicatively non-limiting of the type of a DC voltage whose nominal value is between 150V and 600V. The outgoing electrical signals S2 shaped by the power electronics module 1 are of the "Pulse Width Modulation" type (PWM for "Pulse Width Modulation"). Each electronic device 4a, 4b, 4c performs such a transformation with a frequency and a given duty cycle. Preferably, each outgoing electrical signal S2 is out of phase with the others.

The support 3 is thermally coupled with a plurality of conduits 5 arranged between them in a network of conduits for cooling the electronic devices 4a, 4b, 4c. For this purpose, the ducts 5 may advantageously be heat pipes containing a heat transfer fluid with phase change, and are moreover thermally coupled with a cooling apparatus 6.

The cooling apparatus 6 illustrated in FIG. 1 comprises two cooling members 6a, 6b arranged laterally on either side of the support 3 and more specifically on either side of a plane PI containing the axis A of the 3. Each of the cooling members 6a, 6b consists, for example, of a finned heat exchanger 7, the fins 7 being arranged parallel to one another. Each cooling member 6a, 6b thus comprises a mechanical block formed of a set of fins 7 oriented parallel to each other and preferably parallel to the plane PI containing the axis A of the support 3.

The fins 7 of each cooling member 6a, 6b are traversed by a rectilinear portion 8 of the ducts 5 perpendicularly to the extension plane P2 of the fins 7. At its straight portion, each duct 5 is firmly secured to the fins 7 of the one and / or the other of the cooling members 6a, 6b. Such fastening is in particular carried out by any means of mechanical coupling between the rectilinear parts 8 of the ducts 5 and the fins 7, such as by brazing, for example.

Due to the heat exchange between the ducts 5 and the support 3 on the one hand, and between the ducts 5 and the cooling element or members 6a, 6b on the other hand, the heat transfer fluid changes phase and is entrained between their ends. inside the ducts 5 circulating between the support 3 and at least one of the cooling members 6a, 6b. The heat transfer fluid then takes heat from the electronic devices 4a, 4b, 4c via the support 3 and / or the thermal interface to restore them and dissipate them with the ambient air surrounding the fins 7 ai at least one level. cooling apparatuses 6a, 6b. To promote the heat transfer between the cooling device 6 and the ambient air, at least one air flow Fl, F2 passes through both cooling members 6a, 6b. Such a flow of air F1, F2 can be generated by a remote means and dissociated from the power electronics module 1. Advantageously, the cooling apparatus 6 comprises one or more fans 9a, 9b generating air flows Fl, F2. A first fan 9a is mounted at the base of the fin block 7 of a first cooling member 6a of a first side of the module 1, and a second fan 9b is mounted at the base of the fin block 7 of a second cooling member 6b of a second side of the module 1.

For example, each cooling device 6a, 6b is thus equipped with a fan 9a, 9b generating a flow of air Fl, F2 assigned to its cooling. The fans 9a, 9b are advantageously configured to draw or draw air to generate the air flow Fl, F2 through the fin blocks 7 of the cooling members 6a, 6b. The speed and / or the flow rate of the airflows Fl, F2 generated respectively by one and / or the other of the fans 9a, 9b may vary according to the cooling requirements specific to each of the cooling devices 6a, 6b and / or the operation of said module 1 and / or the movement of the vehicle. They may in particular be invariant or programmed to be slaved to the operation of the module, and more particularly to the temperature measured at the level of the electronic devices 4a, 4b, 4c. to this end, the module according to the first aspect of the invention may advantageously comprise at least one temperature sensor arranged to measure the temperature in the vicinity of at least one electronic device, and preferably at or in the cylindrical support 3.

The air flows F1, F2 respectively generated by the fans 9a, 9b are oriented parallel to the plane P2 of the fins 7 and advantageously rush between the fins 7 to impact the straight portions 8 of the ducts 5 which extend between the fins 7.

In the example illustrated in FIGURE 2 and FIGURE 3, the support 3 is shown in perspective as seen from its respective axial ends. The support 3 has a generally cylindrical shape extending along an axis A oriented perpendicular to the direction of extension of the portion of the conduits 5 placed in thermal coupling with the support 3. The support 3 consists of a body arranged in several facets 10a, 10b, 10c, three in number on the illustrated embodiment.

Depending on the number of electronic devices 4 included in the module 1 according to the first aspect of the invention, the support 3 may comprise a larger number of facets 10. In general, the number of facets 10a, 10b, 10c of the support 3 corresponds to the number of electronic devices 4a, 4b, 4c that it houses and to the number of groups of conduits 5 respectively in thermal coupling with said electronic devices 4a, 4b, 4c. The facets 10a, 10b, 10c of the support 3 are arranged to form a thermal interface, each taking the form of a collector 11a, 11b, 11c. Each collector collaborates with a group of ducts 5 for effecting a mechanical and thermal coupling of said ducts 5 with the support 3.

The facets 10a, 10b, 10c of the support 3 may be formed of a one-piece assembly constituting the body of the support 3. In the illustrated example, each facet 10a, 10b, 10c of the support 3 is individually formed by a wall element 12a , 12b, 12c distinct from the other wall elements 12a, 12b, 12c. The wall elements 12a, 12b, 12c are assembled together by means of plates 13a, 13b respectively arranged at the axial end faces of the support 3.

For this purpose, the wall elements 12a, 12b, 12c each comprise a tongue 14 acting as leaf spring and to maintain the plates 13a, 13b of the support 3. The tabs 14 extending at their axial face facing the outside the support 3, parallel to the axis A of the support 3. The axial ends of the tongues 14 are respectively fixed to the plates 13a, 13b of the support 3, at least by interlocking inside slots 15 formed therethrough, such an interlocking assembly being preferably reinforced by sealing. Alternatively, the tongues 14 could be replaced by removable fastening means, such as assembly screws.

In the example illustrated in FIGS. 4 to 6, the support 3 houses in its central zone a connector 16 whose location is shown schematically by dotted lines. Such a connector 16 may for example comprise a bus bar receiving said at least one incoming electrical signal SI processed by the electronic devices 4a, 4b, 4c to generate the outgoing electrical signals SI. The connector 16 is advantageously housed between the electronic devices 4a, 4b, 4c with which it is electrically bonded. The electrical connection between the connector 16 and each of the electronic devices 4a, 4b, 4c is formed by means of substrates 17 that typically comprise such electronic devices 4a, 4b, 4c. The connector 16 is arranged to establish an electrical connection with each of the electronic devices.

More particularly in FIGURE 5, each of the electronic devices 4a, 4b, 4c comprises a substrate 17 and incorporating an electrical circuit, on which electronic components 18 are fixed. The electronic components 18 each comprise at least two insulated gate bipolar transistors. , each of the transistors being associated with a diode assigned to them. Fixing electronic components 18 preferably allows to provide an electrical connection with said electrical circuit and a mechanical coupling between them. By way of non-limiting example, such a fixing is preferably of the type of a brazing. The substrate 17 extends longitudinally along the axis A of the support 3 and the electronic components 18 are aligned in the longitudinal direction of the substrates 17 bearing them respectively. As a result, the wiring of the electronic components 18 on the substrate 17 is facilitated and the transverse bulk of the electronic devices 4a, 4b, 4c is limited. The overall transverse bulk of the assembly formed by the electronic devices 4a, 4b, 4c is thus limited.

In the following, the planes Pa, Pb and Pc are defined as being the planes of the substrates 17 respectively of the electronic devices 4a, 4b and 4c. The planes Pa, Pb and Pc extend longitudinally parallel to the axis A of the support 3 and in a circular distribution depending on the number of electronic devices 4a, 4b and 4c that includes the module 1.

According to an essential aspect of the invention, the electronic components 18 of each electronic device 4a, 4b, 4c are oriented towards the inside of a recess 19 of the support 3 housing the electronic devices 4a, 4b, 4c. The substrate 17 of each electronic device 4a, 4b, 4c is oriented towards the outside of the recess 19 of the support 3. Thus, the electromagnetic waves generated by the electronic components 18 of the electronic devices 4a, 4b, 4c are at least confined part inside the recess 19 of the support 3. The support 3 is advantageously arranged in a cage surrounding the electronic assembly consisting of electronic devices 4a, 4b, 4c.

Complementarily, the connector 16 is arranged to advantageously constitute a carrier member of the electronic devices 4a, 4b, 4c when it is mechanically coupled to the substrate 17 of said electronic devices 4a, 4b, 4c. Thus, the connector 16 and the electronic devices 4a, 4b, 4c together form an integral mechanical assembly that may be assembled before insertion into the recess 19 of the support 3. Such an installation may in particular be operated from an introduction of said one-piece mechanical assembly 16, 4a, 4b, 4c inside the recess 19 of the support 3 from an axial end face of the support 3.

In this context, and with reference to FIGURES 2 and 3, the connector 16 is electrically connected with a plurality of input terminals 20a emerging axially out of the support 3 for the injection of said at least one incoming electrical signal SI. Preferably, the input lugs 20a emerge from the support 3 through a first opening 21a formed axially in a first plate 13a of the support 3.

Moreover, at their opposite end, each electronic device 4a, 4b, 4c is electrically individually connected to a corresponding output terminal 20b. The output lugs 20b are able to be electrically connected to the multiphase electrical system 2. output lugs 20b emerge axially out of the support 3 through a second opening 21b formed axially through a second plate 13b of the support.

Advantageously, the first opening 21a and the second opening 21b are respectively aligned axially with the recess 19 of the support 3, so as to provide access to the recess 19 of the support 3 facilitating the installation of the electronic devices 4a, 4b, 4c inside the recess 19 of the support 3.

Referring to FIGURES 4 to 6, the recess 19 of the support 3 is arranged in a plurality of faces 22a, 22b, 22c forming a frame 23. The frame 23 has a polygonal section along a plane transverse to the planes Pa, Pb, Pc extending electronic devices 4a, 4b, 4c respectively defined by their respective substrates 17.

Each electronic device 4a, 4b, 4c is fixed via its substrate 17 to a face of the frame 23 which is assigned to it. This fixing makes it possible to establish preferentially both a mechanical coupling and a thermal coupling between the electronic devices 4a, 4b, 4c and the frame 23. The electronic devices 4a, 4b, 4c can be mechanically fixed to the frame 23 by brazing, for example 17 In the illustrated example, in which the electronic devices 4a, 4b, 4c are three in number, the frame 23 is more particularly of a triangular, preferably equilateral, trans verse section.

The faces of the frame 23 are advantageously formed by the collectors 1a, 11b, 11c on which the groups of ducts 5 are respectively fixed. The fixing of the ducts 5 on the collectors ci 1 corresponding to this makes it possible to mechanically couple between said ducts 5 and the thermal interfaces formed by the collectors 11a, 11b, 11c. Therefore, the fixing of the electronic devices 4a, 4b, 4c on the respective faces of the frame 23 also makes it possible to thermally couple the electronic devices 4a, 4b, 4c with the groups G1, G2 and G3 of the conduits 5 which are respectively assigned via collectors 11a, 11b, 11c.

Each of the ducts 5 comprises a coupling section 24 mechanical and thermal with a collector 11a, 11b, 11c corresponding. The coupling section 24 preferably extends over the entire transverse dimension of the collectors 11a, 11b, 11c in order to optimize the heat exchange between them. The coupling sections 24 of the ducts 5 extend individually inside respective passages 25 formed through the collectors 11a, 11b, 11c, perpendicular to the axis A of the support 3. Advantageously, the coupling section 24 of each of the ducts 5 extends in the plane of the connectors 11a, 11b, 11c perpendicular to the axis A of the support 3. The coupling section 24 of each of the ducts 5 extends radially outwards from the frame 23, by a bent portion 26. Thus, the volume between the two cooling members 6a, 6b is occupied by the support 3 outside which the bent portions 26 of the ducts 5 emerge. At least one of the bent portions 26 of each of the ducts 5 is extended by a rectilinear portion 8 placed in thermal coupling with a corresponding cooling member 6a, 6b. Thus, each of the rectilinear portions 8 of the ducts 5 forms a heat exchange zone between the ducts 5 and the cooling apparatus 6.

Such arrangements make it possible to restrict the size of the power electronics module 1 while optimizing the heat exchange between the conduits 5 and, on the one hand, the electronic devices 4a, 4b, 4c and, on the other hand, the 6. They allow in particular to increase the density of conduits in thermal coupling with each electronic device 4, and thus increase the cooling capacity of the corresponding heat exchanger. Subsequently, the reliability of a module incorporating such a heat exchanger in such a configuration is improved. More particularly visible in FIGURE 6, the respective arrangements of the ducts 5 are differentiated into a first plurality of ducts 5a and a second plurality of ducts 5b.

According to the first plurality of ducts 5a, the ducts comprise a first straight portion 8 located on a first side of the coupling section 24 and forming the first heat exchange zone with the first cooling member 6a and a second rectilinear portion 8 located a second side of the coupling section 24 and forming the second heat exchange zone with the second cooling member 6b. More particularly, the straight portions 8 of each duct 5a of the first plurality of ducts are thermally coupled respectively to one and the other of the cooling members 6a, 6b.

According to the second plurality of conduits 5b, the ducts 5b comprise a single bent portion 26 extending one end of the coupling section 24, said bent portion 26 being extended by a single straight portion 8. The other end of the coupling section 24 is closed 27 at the outlet of the passage 25 of the collector 11a, 11b, 11c with which it collaborates. The rectilinear part 8 of the ducts 5b of the second plurality of ducts 5b is thermally coupled to the cooling apparatus 6 via one of the cooling members 6a, 6b that it comprises. In this context, the ducts 5a of the first plurality and / or the ducts 5b of the second plurality are likely to be associated by groups G1, G2, G3 separate ducts respectively assigned individually to the electronic devices 4a, 4b, 4c.

A group of conduits 5a of the first plurality may be exclusively assigned to one or more electronic devices 4a, 4b, 4c given. A group of conduits 5a, 5b of the second plurality may be exclusively assigned to one or more electronic devices 4a, 4b, 4c given. A combination of conduits 5a of the first plurality and conduits 5b of the second may be assigned to one or more electronic devices 4a, 4b, 4c given. Such operating distributions of the ducts 5a, 5b of the first plurality and / or the second plurality are in particular carried out as a function of the number and / or orientation of the electronic devices 4a, 4b, 4c in their plans Pa, Pb, Pc respectively with respect to the plane P2 of the fins 7, as well as the cooling requirements of said electronic devices. The distribution allocations of the ducts 5a, 5b of the first plurality and / or the second plurality are advantageously carried out in such a way as to optimize the heat exchanges between the ducts 5 and, on the one hand, one and / or the other of the cooling members 6a, 6b and the other electronic devices 4a, 4b, 4c to which the ducts 5 are respectively affected by group.

The distribution allocations of the ducts 5 of the first plurality and / or the second plurality are advantageously made in such a way as to best restrict the overall size of the assembly formed by the support 3 and the extension of the ducts 5.

The restriction of the bulk of said assembly makes it possible to limit the difference between the cooling members 6a, 6b and to limit the extension of the ducts 5 between the electronic devices 4a, 4b, 4c and the cooling apparatus 1. The performance heat exchanges between the ducts 5 and the cooling member or 6a, 6b is improved and the overall size of the power electronics module 1 is restricted.

Thus, according to the exemplary embodiment illustrated in FIG. 5, ducts 5a of the first plurality may be grouped into a first group G1 of ducts 5a assigned to a first electronic device 4a. The first electronic device 4a is in particular oriented in its plane perpendicular to the plane PI containing the axis A of the support 3 on either side of which are distributed the cooling members 6a, 6b.

The coupling section 24 of the ducts 5a of the first group G1 is oriented parallel to the straight portions 8 respectively extending the bent portions 26 of the ducts 5a of the first group Gl. The bent portions 26 of the ducts 5a of the first group G1 are inclined with respect to the face 22a of the frame 23 in thermal coupling with the ducts 5a of the first group G1 and with the first electronic device 4a. Advantageously, the bent portions 26 are respectively oriented parallel to the plane of the other faces of the frame 23. In addition, ducts 5a of the first plurality and ducts 5b of the second plurality may be grouped into a second group G2 assigned ducts to a second electronic device 4b.

According to their respective plans Pa, Pb, Pc, the electronic devices 4a, 4b and 4c are concurrent two by two. The ducts 5a of the first plurality and the ducts 5b of the second plurality of the second group G2 of ducts are notably placed in alternating adjacency according to the planes Pb, Pc of the electronic devices 4b, 4c with which they collaborate respectively.

Indeed, a clearance in the extension of the closed end 27 of each of the bent portions 26 of the ducts 5b of the second plurality of ducts allows the passage of one of the bent portions 26 of the ducts 5a of the first plurality of ducts respectively assigned to the second electronic device 4b or the third electronic device 4c.

In addition, conduits 5b of the second plurality may also be grouped into a third group G3 of conduits and assigned to a third electronic device 4c. Preferably, the conduits 5b of the second plurality of conduits grouped in the third group G3 collaborate with the corresponding manifold so as to extend alternately to a cooling member 6a or another 6b. More particularly, two ducts 5b of the third group G3 successively adjacent extend to two different cooling members 6a, 6b.

According to FIGURES 4 to 6, the ducts 5 of the power electronics module 1 are organized in a bidirectional duct network extending along the two directions of a plane P2 containing a given fin 7.

The straight portions 8 of the ducts 5 of a group G1, G2, G3 of given ducts are adjacent, being aligned in a first direction D1. The first direction D1 is oriented parallel to the axis A of the support 3. The conduits 5 of the groups G1, G2, G3 of conduits respectively assigned to the electronic devices 4a, 4b, 4c are also aligned in a second direction D2. The second direction D2 is preferably oriented perpendicularly to the axis A of the support 3. As a result of the particular organization of the ducts 5 on the collectors 11 of the electronic devices 4, the ducts 5 are preferably arranged in staggered rows in the plane P2.

The number of ducts 5 respectively composing the different groups G1, G2, G3 of ducts are preferably identical, as in the example illustrated, to optimize and / or to better homogenize the cooling of the various electronic devices 4a, 4b, 4c. This configuration is however not limiting and the groups G1, G2 and G3 may possibly comprise different numbers of conduits.

Of course, the invention is not limited to the examples that have just been described and many adjustments can be made to these examples without departing from the scope of the invention. In particular, the different characteristics, shapes, variants and embodiments of the various components of the control electronics module 1 of the invention, alone or in combination, can be associated with each other according to various variants insofar as they are not incompatible or exclusive of each other. In particular, all the variants and embodiments described above, both as regards individually the different members of the power electronics module 1 and as regards their arrangement between them at least two to two, are combinable according to variants. possible specific embodiments of the invention providing one or more particular technical effects. Such alternative embodiments of the invention may be made in particular to promote and / or to provide a satisfactory compromise between the various technical results obtained, particularly with regard to the objects of the invention.

Claims

claims Power electronics module (1) for controlling a multiphase electrical system (2), said module (1) comprising:  a plurality of electronic devices (4a, 4b, 4c) shaping at least one so-called incoming electrical signal (SI) into a plurality of so-called outgoing electrical signals (S2) capable of supplying the multiphase electrical system (2), each device electronic device (4a, 4b, 4c) comprising:  a substrate (17) integrating an electric circuit,  at least one electronic component (18) integrally bonded to the substrate (17) and electrically connected to the electric circuit,  an electrical connector (16) for injecting the at least one incoming electrical signal (SI) towards the plurality of electronic devices (4a, 4b, 4c);  a mechanical support (3) of cylindrical shape and comprising an interior recess (19) receiving the plurality of electronic devices (4a, 4b, 4c);  characterized in that the electronic components (18) of each electronic device (4a, 4b, 4c) are oriented radially inwardly of the recess (19) and the substrates (17) of each electronic device (4a, 4b, 4c) are oriented radially outwardly of the recess (19). Module according to the preceding claim, characterized in that, in a plane transverse to the axis (A) of extension of the support (3) cylindrical, the faces (22a, 22b, 22c) form a frame (23) closed contour . 3. Module according to any one of claims 1 or 2, characterized in that the connector (16) is fixed integrally to the support (3) and is at least partly housed between the electronic devices (4a, 4b, 4c). Module according to any one of the preceding claims, characterized in that it furthermore comprises at least one cooling system arranged to cool said module and comprising: a thermal interface (l ia, 1 lb, 1 le) in thermal coupling with at least a part of the electronic devices (4a, 4b, 4c), a plurality of ducts (5) thermally coupled with the thermal interface (11a, 11b, 11c), said ducts (5) being arranged to transport a heat transfer fluid between an opposite end and a second end of the ducts (5); ). Module according to Claim 4, characterized in that the thermal interface comprises a plurality of collectors (11a, 11b, 11c) thermally coupled with the substrates (17) of the electronic devices (4a, 4b, 4c) assigned to them individually. each collector being further thermally coupled with at least one conduit (5). Module according to Claim 5, characterized in that one face of the collectors (11a, 11b, 11c) forms a respective face (22a, 22b, 22c) of the frame (23) formed in the recess (19) of the support ( 3). Module according to any one of Claims 5 to 6, characterized in that each duct (5) comprises:  - a coupling section (24) mechanical and thermal with a collector (l ia, 1 lb, 1 le), at least one bent portion (26) located in the extension of at least one side of the coupling section (24),  at least one rectilinear part (8) situated in the extension of the at least one bent part (26) and forming at least one heat exchange zone with at least one cooling device (6) mechanically linked with at least one rectilinear part (8) and arranged to cool the at least one rectilinear part (8). Module according to claim 7, characterized in that the at least one heat exchange zone formed by the rectilinear parts (8) of all the conduits (5) is located radially outwardly of the support (3), the at least one heat exchange zone being subdivided into a first heat exchange zone and a second heat exchange zone situated radially on either side of the support (3). 9. Module according to any one of claims 7 or 8, characterized in that the cooling apparatus (6) comprises a first and a second cooling member (6a, 6b), and in that at least one device electronics (4a, 4b, 4c) is thermally coupled to a first plurality of ducts (5a), each duct (5a) of the plurality of ducts comprising a first straight portion (8) located on a first side of the duct section; coupling and forming the first heat exchange zone with the first cooling member (6a) and a second straight portion (8) located on a second side of the coupling section and forming the second heat exchange zone with the second cooling member (6b) 10. Module according to any one of claims 7 to 9, characterized in that at least one electronic device (4a, 4b, 4c) is thermally coupled to a second plurality of ducts (5b), each duct (5b) of the plurality of conduits comprising a single straight portion (8) located on one side of the coupling section and forming the heat exchange zone with the cooling apparatus (6). 11. Module according to claims 9 and 10, characterized in that at least one electronic device (4a, 4b, 4c) is thermally coupled to the conduits (5a) of the first plurality and the conduits (5b) of the second plurality . 12. Module according to any one of claims 10 and 11, characterized in that the heat exchange zones of the cooling apparatus (6) with the straight portions (8) of two directly adjacent ducts of the second plurality of conduits (5b) are located alternately on either side of the support (3). Module according to any one of claims 10 to 12, characterized in that the plurality of electronic devices (4a, 4b, 4c) is thermally coupled to a group (G1, G2, G3) of conduits selected from at least one of:  at least a first group (G1) of ducts (5) belonging to ducts of the first plurality of ducts (5a) and assigned to at least a first electronic device, at least a second group (G2) of conduits (5) alternately rising from ducts of the first (5a) and second (5b) plurality of ducts and assigned to at least one second electronic device,  at least a third group (G3) of ducts (5) belonging to ducts of the second plurality of ducts (5b) and assigned to at least one third device. Module according to Claim 13, characterized in that: at least one first electronic device (4a) is thermally coupled to a plurality of ducts (5a) of the first group (Gl), said ducts (5a) of the first plurality of ducts (5a) being adjacent in the longitudinal direction of the substrate (17) of the first electronic device (4a) and extending transversely with respect to said first electronic device (4a), at least one second electronic device (4b) is thermally coupled to a plurality of ducts (5a, 5b) of the second group (G2), said ducts (5a) and (5b) being adjacent in the longitudinal direction of the substrate (17) the second electronic device (4b) and extending transversely to said second electronic device (4b), the conduits of the first plurality of conduits (5a) being arranged alternately with the conduits of the second plurality of conduits (5b),  at least a third electronic device (4c) is thermally coupled to a plurality of ducts (5b) of the third group (G3), said ducts of the second plurality of ducts (5b) being adjacent in the longitudinal direction of the substrate (17) the third electronic device (4c) and extending transversely with respect to said third electronic device (4c) alternately on one side and the other of said module. 15. Module according to any one of claims 8 to 14, characterized in that the cooling member (6a, 6b) comprises a set of fins (7) traversed by the straight portion (8) of the ducts (5). the fins (7) of a cooling member (6a, 6b) being thermally and mechanically coupled to the rectilinear part (8) of the ducts (5). 16. Module according to any one of claims 8 to 15, characterized in that the cooling apparatus (6) comprises at least one fan (9a, 9b) arranged to generate a flow of air (Fl, F2) directed between the rectilinear parts (8) of the ducts (5) and between the fins (7) of the cooling apparatus (6). 17. Module according to any one of claims 14 to 16, characterized in that, in a plane (P2) containing a fin (7) of a given cooling member (6a, 6b), the ducts (5) are arranged in a two-dimensional array extending in two directions (D1, D2). Motorized vehicle comprising a set of components (1,2) comprising an electric motor and a power electronics module (1) according to any one of claims 1 to 17, characterized in that the electric motor is controlled by the power electronics module (1).