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WO2017154634A1 - Light-processing device, and method for adjusting interval between surface of object to be processed and window member - Google Patents

Light-processing device, and method for adjusting interval between surface of object to be processed and window member Download PDF

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Publication number
WO2017154634A1
WO2017154634A1 PCT/JP2017/007442 JP2017007442W WO2017154634A1 WO 2017154634 A1 WO2017154634 A1 WO 2017154634A1 JP 2017007442 W JP2017007442 W JP 2017007442W WO 2017154634 A1 WO2017154634 A1 WO 2017154634A1
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WO
WIPO (PCT)
Prior art keywords
window member
light
processing
unit
pressure
Prior art date
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Ceased
Application number
PCT/JP2017/007442
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French (fr)
Japanese (ja)
Inventor
元 菊入
昌仁 生井
憲太郎 野本
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Ushio Denki KK
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Ushio Denki KK
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Publication date
Application filed by Ushio Denki KK filed Critical Ushio Denki KK
Publication of WO2017154634A1 publication Critical patent/WO2017154634A1/en
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Ceased legal-status Critical Current

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065Plasma etching; Reactive-ion etching

Definitions

  • the present invention relates to a light processing apparatus and a method of adjusting the distance between the surface of an object to be processed and a window member. More specifically, the present invention relates to a light processing apparatus suitable for, for example, smear removal (desmear) processing in a printed circuit board manufacturing process, and a distance between a surface of an object to be processed and a window member used in the light processing apparatus. It relates to the adjustment method.
  • a light processing apparatus suitable for, for example, smear removal (desmear) processing in a printed circuit board manufacturing process, and a distance between a surface of an object to be processed and a window member used in the light processing apparatus. It relates to the adjustment method.
  • a light processing apparatus and a light processing method using ultraviolet light are known as a light processing apparatus and a light processing method used for smear removal (desmear) processing and the like in a manufacturing process.
  • an apparatus or method using active species such as ozone or oxygen radicals generated by vacuum ultraviolet radiation emitted from an excimer lamp etc. is suitably used because it can perform predetermined processing more efficiently in a short time. It is done.
  • Patent Document 1 Japanese Patent Laid-Open No. 2015-12012 proposes a method of irradiating the substrate with ultraviolet light as a desmear process for the via hole, and the substrate on which the via hole is formed is irradiated with ultraviolet light under an atmosphere containing oxygen. It has been proposed to do.
  • oxygen is irradiated with ultraviolet light, active species such as ozone and oxygen radicals are generated.
  • the smear combines with these active species and is removed as carbon dioxide and water vapor. Then, carbon dioxide and water vapor are exhausted to the outside of the processing chamber as exhaust gas.
  • the processing chamber in which the object to be processed (workpiece) such as a substrate is placed is separated from the light source emitting ultraviolet light by the transparent window member, and the distance between the window member and the work is as narrow as 1 mm or less It is set to. And, during the light processing, the distance between the window member and the work (the distance from the lower surface of the window member to the surface of the work, hereinafter, this distance is also called "gap") is equal over the entire surface of the work There is a need. Because the UV rays from the light source are absorbed by the processing gas flowing in the processing chamber, if the gap is non-uniform, the amount of UV rays reaching the work becomes non-uniform depending on the location of the work, which causes non-treatment.
  • suction holes are provided in the mounting table on which the workpiece is placed and vacuum suction is performed to bring the workpiece into close contact with the mounting table, thereby enhancing the flatness of the surface of the workpiece.
  • the surface of the object to be treated is exposed to the light emitted from the light source unit and the light emitted from the light source unit in the atmosphere of treatment gas.
  • Processing unit a window member separating the light source unit and the processing unit and transmitting light emitted from the light source unit, a surface of the object to be processed and the window member along the surface
  • a differential pressure adjusting unit configured to adjust a pressure difference between both sides separated by the window member in a state in which the processing gas flows.
  • the inventors have found that in the light processing apparatus, the central portion of the window member is lifted to the light source side during light processing (a convex deflection occurs) to cause partial nonuniformity in the gap. Furthermore, as a result of investigating the reason, the inventors found out that the following is the cause. (1) A differential pressure generated on the inlet side and the outlet side of the gas due to the process gas flowing in the narrow space between the window member and the work. (2) An increase in internal pressure caused by discharge resistance (pressure loss) in the discharge side piping of the processing gas. (3) Pushing up the window member by the repulsive force of the O-ring pressed against the periphery of the window member.
  • the deflection of the window member is not necessarily convex on the light source side, and depending on the conditions, it may be convex on the work side. If the window member is thickened to make it difficult to bend against such bending of the window member, the distance from the light source to the work becomes longer and the amount of ultraviolet light absorbed by the window member increases. The amount of ultraviolet light reaching the This increases the processing time. In addition, increasing the cost of the window member and increasing the total weight of the device also makes it undesirable to thicken the window member.
  • the gap can be easily made uniform by a simple method of adjusting the pressure difference by the differential pressure adjusting unit, and the size reduction and cost of the apparatus can be achieved along with the uniformity of the light processing. It can also contribute to suppression.
  • the differential pressure adjusting unit adjusts an amount of exhaust of the processing gas from the processing unit by the gas supply / discharge unit.
  • the influence on the processing capacity of the light processing apparatus is small. The method of adjusting the displacement is superior.
  • the light processing apparatus further includes a spacer which is interposed between the window member and the surface of the object to be treated to maintain the distance between the window member and the surface, and the differential pressure adjusting unit It is also preferable to adjust the pressure difference so that the pressure on the side of the object to be treated is lower than the pressure on the light source side among the two sides separated by the window member. Since the spacer prevents the window member from coming close to the surface of the object to be treated, the differential pressure adjustment unit makes the gap uniform by simple adjustment to lower the pressure on the object side by a certain amount or more. Can be
  • one aspect of the method of adjusting the distance between the surface of the object to be treated and the window member according to the present invention transmits the light and the surface of the object to be treated exposed to light. Adjusting the differential pressure to adjust the pressure difference between the two sides separated by the window member while the processing gas is flowing between the window member and the processing chamber. And a process. According to such an interval adjusting method, the gap can be easily made uniform by a simple method of adjusting the pressure difference in the pressure difference adjusting process, and the light processing can be made uniform.
  • the space adjusting method further includes a pressing process for pressing the sealing member elastic than the window member against the peripheral portion of the window member to prevent the leakage of the processing gas, and the differential pressure adjusting process includes the pressing process.
  • the pressure difference between the two sides separated by the window member may be adjusted to a pressure difference according to the pressing strength of the airtight member in the pressing process.
  • the strength of the pressure applied to the window member may be changed depending on conditions such as the size, material, thickness, surface condition, etc. of the object to be treated in the airtight member performed with the O-ring or sealing member.
  • the strength of pressing on the window member greatly affects the deflection of the window member. Therefore, in the differential pressure adjustment process, the gap can be made uniform by adjusting the pressure difference to a pressure difference corresponding to the strength of pressing.
  • the gap can be made uniform to make the process uniform.
  • FIG. 1 is a schematic configuration view showing the light processing apparatus of the present embodiment.
  • FIG. 2 is a view showing the structure of the ejector.
  • FIG. 3 is a cross-sectional view showing the structure of the window member.
  • FIG. 4 is a table showing experimental results confirming the contribution of differential pressure adjustment.
  • FIG. 5 is a graph showing a change in the gap difference between the central portion and the peripheral portion of the window member with respect to the pressure difference between the processing unit and the light irradiation unit.
  • FIG. 6 is a graph showing a change in the gap difference between the central portion and the peripheral portion of the window member with respect to the pressure difference between the processing unit and the light irradiation unit when the spacer is provided.
  • FIG. 1 is a schematic configuration view showing the light processing apparatus of the present embodiment.
  • the light processing apparatus 100 includes a light irradiation unit 10 and a processing unit 20 that holds a substrate (work) W, which is an example of an object to be processed.
  • the light irradiation unit 10 accommodates, for example, a plurality of ultraviolet light sources 11 that emit vacuum ultraviolet light, and irradiates the substrate W held by the processing unit 20 with the light from the ultraviolet light source 11.
  • the light irradiation unit 10 corresponds to an example of the light source unit according to the present invention
  • the processing unit 20 corresponds to an example of the processing unit according to the present invention.
  • the light irradiation part 10 is provided with the box-shaped casing 14 which has an opening part below.
  • a window member 12 such as quartz glass, which transmits vacuum ultraviolet light, for example, is airtightly provided.
  • the window member 12 corresponds to an example of the window member in the present invention.
  • the interior of the light irradiator 10 (casing 14) is maintained in an inert gas atmosphere by supplying an inert gas such as nitrogen gas from the supply port 15, for example.
  • a reflecting mirror 13 is provided above the ultraviolet light source 11 in the light irradiation unit 10. The reflecting mirror 13 reflects the light emitted from the ultraviolet light source 11 to the window member 12 side.
  • the light of the ultraviolet light source 11 is irradiated substantially uniformly to the region R substantially corresponding to the full width of the reflecting mirror 13. That is, the region R is a region to be irradiated with ultraviolet light in the region sandwiched between the window member 12 and the surface of the stage 21, and the ultraviolet treatment region to perform the ultraviolet irradiation processing (desmear processing) on the substrate W become.
  • the ultraviolet light source 11 emits, for example, ultraviolet light (vacuum ultraviolet light) having a wavelength of 220 nm or less, preferably 190 nm or less, and various known lamps can be used.
  • ultraviolet light vacuum ultraviolet light
  • the reason for setting the wavelength to 220 nm is that when the wavelength of ultraviolet light exceeds 220 nm, it becomes difficult to decompose and remove the smear caused by the organic substance such as resin.
  • a xenon excimer lamp peak wavelength 172 nm
  • low pressure mercury lamp 185 nm bright line
  • a xenon excimer lamp is preferable as the one used for the desmear treatment.
  • the processing unit 20 includes a stage 21 that adsorbs and holds the substrate W on which the ultraviolet irradiation process (desmear process) is performed on the surface.
  • the stage 21 is disposed to face the window member 12 of the light emitting unit 10. For example, suction holes (not shown) are bored in the stage 21 in order to suction the substrate W.
  • the stage 21 is formed of, for example, an aluminum material in order to ensure flatness.
  • An outer peripheral groove 21 a is formed on an outer peripheral portion of the surface of the stage 21.
  • the O-ring 22 is sandwiched between the outer peripheral groove 21 a and the window member 12 of the light irradiation unit 10, whereby the light irradiation unit 10 and the processing unit 20 are assembled in an airtight manner.
  • the O-ring 22 corresponds to an example of the airtight member in the present invention.
  • the stage 21 is supported by an actuator 51 that moves the stage 21 in a direction (upper and lower direction in the drawing) toward and away from the window member. As the stage 21 is moved by the actuator 51, the strength with which the O-ring 22 is pressed against the window member 12 is adjusted.
  • an air supply path 24 for supplying a processing gas (processing gas) to the processing region R is formed.
  • a supply device 41 for supplying a processing gas is connected to the air supply passage 24.
  • an exhaust path 25 for discharging the exhaust gas after desmearing processing to the outside of the stage portion 21 is formed.
  • the processing gas for example, a mixed gas of oxygen gas, oxygen and ozone or water vapor, or a mixture of these gases with an inert gas or the like is used.
  • the processing gas is supplied to the processing region R through the air supply passage 24 while the substrate W is irradiated with the ultraviolet light from the light irradiation unit 10, and is discharged to the outside of the stage unit 21 as an exhaust gas through the exhaust passage 25. Discharged into That is, the processing gas flows in the processing region R between the window member 12 and the substrate W from the right to the left in FIG.
  • the ejector 42 is attached to the exhaust passage 25.
  • the ejector 42 uses a fluid to create a reduced pressure state, and in the present embodiment, for example, the flow of compressed air generated by the compressor 45 is used.
  • the ejector 42 is attached to the exhaust path 25 to forcibly discharge the processing gas in the processing unit 20.
  • the pipe connecting the exhaust passage 25 and the ejector 42 is provided with a cock 46 which is opened and closed by motor drive to adjust the opening degree of the pipe.
  • the light processing apparatus 100 also includes a control unit 52 that controls the opening degree of the cock 46 and the driving of the actuator 51.
  • FIG. 2 is a view showing the structure of the ejector.
  • the ejector 42 has a suction port 421 connected to the exhaust path 25 described above, a primary side opening 422 to which compressed air is supplied from the compressor 45 described above, and a secondary side opening 423 from which gas is discharged.
  • the compressed air supplied from the primary side opening 422 is blown out from the nozzle 424 to increase the flow velocity and flow into the diffuser 425.
  • a reduced pressure state occurs between the nozzle 424 and the diffuser 425, and the exhaust gas is sucked from the suction port 421.
  • the exhaust gas thus sucked is led to the secondary side opening 423 and flows out together with the flow of the compressed air.
  • FIG. 3 is a cross-sectional view showing the structure of the window member.
  • the window member 12 is provided with a spacer 121 in contact with the surface of the workpiece W.
  • the height of the spacer 121 is, for example, about 100 ⁇ m to about 1 mm.
  • the window member 12 is a thin member in consideration of the transmittance of light to be irradiated, and for example, the thickness is 1/100 or less with respect to the length of one side. Therefore, the inventors have found that the window member 12 is bent due to the above-mentioned cause. Although the deflection in the direction approaching the workpiece W is suppressed by the spacer 121, the deflection in the direction away from the workpiece W can not be suppressed by the spacer 121.
  • FIG. 4 is a table showing experimental results confirming the contribution of differential pressure adjustment.
  • the uniformity of the gap is shown for each of the case where the differential pressure adjustment is not performed as in the prior art and the case where the differential pressure adjustment is performed using the ejector as in the present embodiment. .
  • the window member 12 having no spacer 121 shown in FIG. 3 is used. For this reason, the window member 12 can also bend in the direction away from the work W as well as in the direction approaching it.
  • the flow rate of the processing gas is 4 l / min to 12 l / min
  • the uniformity of the gap was compared with the presence or absence of differential pressure adjustment.
  • the workpiece W size is 340 mm ⁇ 510 mm, and the gap measurement point is 18 points.
  • a value obtained by subtracting the narrowest gap value from the widest gap value (PP value) was used.
  • PP value a value obtained by subtracting the narrowest gap value from the widest gap value
  • the pressure in the processing unit 20 was slightly reduced compared to the pressure in the light irradiation unit 10.
  • lightly reduced pressure means a pressure reduction of about 2 kPa at the maximum.
  • the PP value is reduced to about 1/10 when differential pressure adjustment is performed regardless of the flow rate of the processing gas.
  • the small PP value means that the variation of the gap in the surface of the workpiece W is small and the uniformity of the gap is good.
  • FIG. 5 is a graph showing the change in the difference in the gap between the central portion and the peripheral portion of the window member with respect to the pressure difference between the processing unit 20 and the light irradiation unit 10.
  • the window member 12 without the spacer 121 shown in FIG. 3 is used.
  • the horizontal axis of the drawing represents the differential pressure obtained by subtracting the pressure on the light irradiation unit 10 side from the pressure on the processing unit 20 side
  • the vertical axis represents the difference in gap between the central portion and the peripheral portion of the window member.
  • + the central portion is convex toward the light irradiation unit 10 side
  • the central portion is convex toward the work W side.
  • a thick line 61 with a diamond mark indicates a change in the gap difference under the condition A in which the O-ring 22 is strongly pressed to the window member 12.
  • a thin line 62 with a square mark indicates a change in the difference of the gap under the condition B in which the O-ring 22 is normally pressed to the window member 12.
  • the dotted line 63 marked with a triangle indicates the change in the difference of the gap under the condition C in which the O-ring 22 is weakly pressed against the window member 12.
  • the strength of the pressing of the O-ring 22 against the window member 12 is changed by the vertical movement of the stage 21 by the actuator 51 shown in FIG. 1, but depending on various conditions such as the size, material, thickness and surface condition of the work W It is assumed that the above conditions A to C are selected.
  • any of the above conditions A to C when the differential pressure is zero, it can be seen that the window member 12 is bent in a convex state toward the light irradiation unit 10 side. And by making processing part 20 side into negative pressure to light irradiation part 10 side, a gap of a central part can be smaller than a peripheral part of window member 12, and it can be bent in a convex state on work W side. .
  • the differential pressure when the gap is made uniform over the entire surface of the workpiece W differs depending on the conditions A to C described above.
  • the gap is made uniform at a negative pressure of 1 kPa, for example, in condition B, the gap is made uniform at a negative pressure of 0.8 kPa, and in condition C, for example, the gap is made uniform at a negative pressure of 0.5 kPa.
  • pressure values are small compared to the atmospheric pressure, but the influence on small gaps, for example 1 mm or less, is sufficiently large.
  • the change in the gap difference with respect to the differential pressure is, for example, the difference in the flow rate of the processing gas Also show different changes.
  • the gap is made uniform by setting the processing unit 20 side to a negative pressure with respect to the light irradiation unit 10 side, but for example, the case where the self weight deflection of the window member 12 is large or the O ring
  • the processing unit 20 side is positive with respect to the light irradiation unit 10 side.
  • the gap may be made uniform by pressure.
  • the change tendency of the gap difference as shown in FIG. 5 is measured prior to the light processing, and the differential pressure at which the gap is made uniform is obtained as a value corresponding to various conditions. You can.
  • An operation procedure in the light processing apparatus will be described below with reference to FIG. 1 on the premise that the differential pressure at which the gap is equalized is obtained in advance.
  • (1) The light irradiation unit 10 and the processing unit 20 are vertically separated.
  • the window member 12 is attached to the light emitting unit 10 side.
  • the work W is placed on the stage 21 and fixed by suction.
  • the light emitting unit 10 is lowered or the processing unit 20 is raised. Thereby, the window member 12 contacts the O-ring 22 and the processing unit 20 is sealed.
  • the control unit 52 controls the actuator 51 to move the stage 21 up and down to set the distance between the window member 12 and the work W to a predetermined distance of, for example, 1 mm or less.
  • the supply device 41 operates to introduce the processing gas into the processing unit 20. Further, the ejector 42 also operates, and the gas is discharged from the processing unit 20.
  • the process of (4) corresponds to an example of the gas supply and discharge process according to the present invention.
  • the various conditions in the present light processing are input to the control unit 52, and a differential pressure corresponding to the conditions is obtained. Then, the control unit 52 adjusts the opening degree of the cock 46 to realize the differential pressure, and the gap between the window member 12 and the work W is maintained constant. In the case of this embodiment, since a spacer is provided between the window member 12 and the work W, strict control of the differential pressure is not required. If the opening degree of the cock 46 is slightly deviated to a larger side than the opening degree for achieving the required differential pressure, the gap is kept constant by the spacer.
  • FIG. 6 is a graph showing the change in the difference in gap between the central portion and the peripheral portion of the window member with respect to the pressure difference between the processing unit 20 and the light irradiation unit 10 when the spacer 121 is provided on the window member 12.
  • the horizontal axis of the drawing represents the differential pressure obtained by subtracting the pressure on the light irradiation unit 10 side from the pressure on the processing unit 20 side, and the vertical axis represents the difference in gap between the central portion and the peripheral portion of the window member.
  • a thick line 64 with a diamond mark indicates a change in the difference of the gap under the condition A in which the O-ring 22 is strongly pressed to the window member 12.
  • a thin line 65 with a square mark indicates a change in the difference of the gap under the condition B in which the O-ring 22 is normally pressed to the window member 12.
  • the dotted line 66 marked with a triangle indicates the change in the difference of the gap under the condition C where the O-ring 22 is weakly pressed against the window member 12.
  • the gap difference is maintained at 0 at a negative pressure of 1.0 kPa or more.
  • the gap difference is maintained at 0 at a negative pressure of 0.8 kPa or more.
  • the gap difference is maintained at 0 at a negative pressure of 0.5 kPa or more.
  • the process of (5) above corresponds to an example of the differential pressure adjustment process according to the present invention
  • the control unit 52 shown in FIG. 1 corresponds to an example of the differential pressure adjustment section according to the present invention.
  • the operation procedure of the light processing apparatus will be described.
  • the ultraviolet light source 11 is turned on to start light processing.
  • the ultraviolet light source 11 is turned off.
  • the introduction of the processing gas into the processing unit 20 is stopped, and the operation of the ejector is also stopped.
  • the light emitting unit 10 rises or the processing unit 20 descends, and the light emitting unit 10 and the processing unit 20 are vertically separated.
  • a uniform ultraviolet irradiation process can be performed on the entire surface of the workpiece W by the above-described procedure.
  • the light processing apparatus of this invention may not have a spacer.
  • the present invention may be applied to the light ashing processing of the resist, the resist removing processing, the dry cleaning processing and the like.
  • the differential pressure adjustment unit according to the present invention one for adjusting the exhaust amount from the processing unit 20 is shown, but the differential pressure adjustment unit according to the present invention The amount of air may be adjusted, or the pressure on the light source unit side may be adjusted.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • General Engineering & Computer Science (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

Disclosed are a light-processing device 100 for equalizing processing by equalizing gaps, and a method for adjusting the interval between the surface of an object to be processed and a window member 12. One aspect of the light-processing device is provided with: a light source unit for emitting light; a processing unit 20 in which the surface of the object to be processed is exposed to light emitted from the light source unit in a processing gas atmosphere; a window member that separates the light source unit and the processing unit, the window member transmitting light emitted from the light source unit; a gas-charging/discharging unit for channeling the processing gas along the surface between the surface of the object to be processed and the window member; and a differential-pressure-regulating unit for regulating the pressure difference of both sides separated by the window member while the processing gas is flowing.

Description

光処理装置、および被処理物体の表面と窓部材との間隔調整方法Light processing apparatus, and method of adjusting distance between surface of object to be treated and window member

 本発明は、光処理装置、および被処理物体の表面と窓部材との間隔調整方法に関する。更に詳しくは、本発明は、例えば、プリント基板製造工程におけるスミアの除去(デスミア)処理などに好適な光処理装置、およびその光処理装置に用いられる、被処理物体の表面と窓部材との間隔調整方法に関する。 BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a light processing apparatus and a method of adjusting the distance between the surface of an object to be processed and a window member. More specifically, the present invention relates to a light processing apparatus suitable for, for example, smear removal (desmear) processing in a printed circuit board manufacturing process, and a distance between a surface of an object to be processed and a window member used in the light processing apparatus. It relates to the adjustment method.

 従来、例えば、半導体や液晶パネル等の製造工程におけるレジストの光アッシング処理、ナノインプリント装置におけるテンプレートのパターン面に付着したレジストの除去処理、液晶用のガラス基板やシリコンウエハなどのドライ洗浄処理、プリント基板製造工程におけるスミアの除去(デスミア)処理などに用いられる光処理装置および光処理方法として、紫外線を用いた光処理装置および光処理方法が知られている。特に、エキシマランプなどから放射される真空紫外線により生成されるオゾンや酸素ラジカル等の活性種を利用した装置や方法は、より効率良く短時間で所定の処理を行うことができることから、好適に利用されている。 Conventionally, for example, light ashing processing of resist in manufacturing process of semiconductor, liquid crystal panel, etc. removal processing of resist adhering to the pattern surface of template in nanoimprint apparatus, dry cleaning processing of glass substrate for liquid crystal, silicon wafer etc., printed substrate BACKGROUND ART A light processing apparatus and a light processing method using ultraviolet light are known as a light processing apparatus and a light processing method used for smear removal (desmear) processing and the like in a manufacturing process. In particular, an apparatus or method using active species such as ozone or oxygen radicals generated by vacuum ultraviolet radiation emitted from an excimer lamp etc. is suitably used because it can perform predetermined processing more efficiently in a short time. It is done.

 例えば特許文献1(特開2015-120129号公報)では、ビアホールのデスミア処理として、基板に紫外線を照射する方法が提案されており、酸素を含む雰囲気下で、ビアホールを形成した基板に紫外線を照射することが提案されている。酸素に紫外線を照射すると、オゾンや酸素ラジカルなどの活性種が発生する。スミアは、これらの活性種と結合し、二酸化炭素や水蒸気となって除去される。そして、二酸化炭素や水蒸気は、排ガスとなって処理室外に排気される。 For example, Patent Document 1 (Japanese Patent Laid-Open No. 2015-120129) proposes a method of irradiating the substrate with ultraviolet light as a desmear process for the via hole, and the substrate on which the via hole is formed is irradiated with ultraviolet light under an atmosphere containing oxygen. It has been proposed to do. When oxygen is irradiated with ultraviolet light, active species such as ozone and oxygen radicals are generated. The smear combines with these active species and is removed as carbon dioxide and water vapor. Then, carbon dioxide and water vapor are exhausted to the outside of the processing chamber as exhaust gas.

 基板などといった被処理物体(ワーク)が配置される処理室は、紫外線を発する光源とは、透明な窓部材で隔てられていて、窓部材とワークとの間隔は例えば1mm以下というような狭い間隔に設定されている。そして、光処理の間は、窓部材とワークとの間隔(窓部材の下面からワークの表面までの間隔、以下、この間隔のことを「ギャップ」とも称する)は、ワークの全面に渡って等しい必要がある。
 なぜなら、光源からの紫外線は処理室を流れる処理用ガスに吸収されるため、ギャップが不均一であると、ワークに届く紫外線の量が、ワークの場所により不均一となり、そのことにより処理に不均一が生じるためである。
 ギャップを均一化するため、ワークを載せる載置台に吸着穴を設けて真空吸着することでワークを載置台に密着させてワーク表面の平面度を高めている。
The processing chamber in which the object to be processed (workpiece) such as a substrate is placed is separated from the light source emitting ultraviolet light by the transparent window member, and the distance between the window member and the work is as narrow as 1 mm or less It is set to. And, during the light processing, the distance between the window member and the work (the distance from the lower surface of the window member to the surface of the work, hereinafter, this distance is also called "gap") is equal over the entire surface of the work There is a need.
Because the UV rays from the light source are absorbed by the processing gas flowing in the processing chamber, if the gap is non-uniform, the amount of UV rays reaching the work becomes non-uniform depending on the location of the work, which causes non-treatment. This is because uniformity occurs.
In order to make the gap uniform, suction holes are provided in the mounting table on which the workpiece is placed and vacuum suction is performed to bring the workpiece into close contact with the mounting table, thereby enhancing the flatness of the surface of the workpiece.

特開2015-120129号公報JP, 2015-120129, A

 しかしながら、デスミア処理などにおける処理精度が向上するにつれて、上記のような従来の手法でギャップの均一化を図っても、処理に不均一が生じることが分かってきた。このような処理の不均一は、ギャップの不均一が一因として考えられていたものの、そのようなギャップの不均一を生じさせる原因は知られていなかった。
 そこで、本発明は、ギャップを均一化して処理を均一化することを課題とする。
However, as the processing accuracy in the desmearing process and the like is improved, it has been found that even if the gap is made uniform by the conventional method as described above, the process becomes nonuniform. Although such non-uniformity in processing was considered to be due to non-uniformity of the gap, the cause of the non-uniformity of such gap was not known.
Then, this invention makes it a subject to equalize a gap and to equalize a process.

 上記課題を解決するために、本発明に係る光処理装置の一態様は、光を発する光源部と、前記光源部から発せられた光に被処理物体の表面が処理気体の雰囲気中で曝される処理部と、前記光源部と前記処理部とを隔て、該光源部から発せられた光を透過する窓部材と、前記被処理物体の表面と前記窓部材との間に、該表面に沿って前記処理気体を流す気体給排部と、前記処理気体が流れている状態で、前記窓部材で隔てられた両側の圧力差を調整する差圧調整部と、を備える。 In order to solve the above problems, in one aspect of the light processing apparatus according to the present invention, the surface of the object to be treated is exposed to the light emitted from the light source unit and the light emitted from the light source unit in the atmosphere of treatment gas. Processing unit, a window member separating the light source unit and the processing unit and transmitting light emitted from the light source unit, a surface of the object to be processed and the window member along the surface And a differential pressure adjusting unit configured to adjust a pressure difference between both sides separated by the window member in a state in which the processing gas flows.

 発明者らは、光処理装置において光処理中に窓部材の中央部が光源部側に持ち上がり(上に凸にたわみ)ギャップに部分的な不均一が生じることを見いだした。更に、発明者らは、その理由について調査した結果、次のようなことが原因であることを見出した。
(1)窓部材とワークとの間の狭い空間を処理用ガスが流れることによる、ガスの入り口側と出口側とで生じる差圧。
(2)処理気体の排出側配管における排出抵抗(圧力損失)で生じる内圧上昇。
(3)窓部材の周縁に押し当てられたOリングの反発力による窓部材の押し上げ。
 また、窓部材のたわみは、必ずしも光源部側に凸ではなく、条件によってはワーク側に凸のたわみとなる場合もあることも見いだした。
 このような窓部材のたわみに対し、窓部材を厚くしてたわみにくくすると、その分、光源部からワークまでの距離が長くなり、また窓部材により吸収される紫外線の量が増えることにより、ワークに届く紫外線の量が減少する。これにより処理時間が長くなる。また、窓部材のコストも高くなり、装置の総重量が増すといった点でも、窓部材を厚くすることは望ましくない。
The inventors have found that in the light processing apparatus, the central portion of the window member is lifted to the light source side during light processing (a convex deflection occurs) to cause partial nonuniformity in the gap. Furthermore, as a result of investigating the reason, the inventors found out that the following is the cause.
(1) A differential pressure generated on the inlet side and the outlet side of the gas due to the process gas flowing in the narrow space between the window member and the work.
(2) An increase in internal pressure caused by discharge resistance (pressure loss) in the discharge side piping of the processing gas.
(3) Pushing up the window member by the repulsive force of the O-ring pressed against the periphery of the window member.
In addition, it was also found that the deflection of the window member is not necessarily convex on the light source side, and depending on the conditions, it may be convex on the work side.
If the window member is thickened to make it difficult to bend against such bending of the window member, the distance from the light source to the work becomes longer and the amount of ultraviolet light absorbed by the window member increases. The amount of ultraviolet light reaching the This increases the processing time. In addition, increasing the cost of the window member and increasing the total weight of the device also makes it undesirable to thicken the window member.

 本発明に係る光処理装置によれば、差圧調整部による圧力差の調整という簡便な手法によって容易にギャップの均一化を図ることができ、光処理の均一化とともに、装置の小型化やコスト抑制にも寄与することができる。
 上記光処理装置において、前記差圧調整部は、前記気体給排部が前記処理気体を前記処理部から排気する排気量を調整するものであることが好適である。圧力差の調整という点では、前記処理気体の給気量を調整したり、前記光源部側の圧力を調整したりする方式でも実現可能であるが、光処理装置における処理能力に対する影響が少ない点で、排気量を調整する方式が優れている。
According to the light processing apparatus of the present invention, the gap can be easily made uniform by a simple method of adjusting the pressure difference by the differential pressure adjusting unit, and the size reduction and cost of the apparatus can be achieved along with the uniformity of the light processing. It can also contribute to suppression.
In the light processing device, preferably, the differential pressure adjusting unit adjusts an amount of exhaust of the processing gas from the processing unit by the gas supply / discharge unit. In terms of adjusting the pressure difference, although the method of adjusting the supply amount of the processing gas or adjusting the pressure on the light source unit side can also be realized, the influence on the processing capacity of the light processing apparatus is small. The method of adjusting the displacement is superior.

 また、上記光処理装置において、更に、前記窓部材と前記被処理物体の表面との間に挟まれて該窓部材と該表面との距離を保つスペーサを備え、前記差圧調整部は、前記窓部材で隔てられた両側のうち、前記被処理物体側の圧力が前記光源部側の圧力よりも低圧となるように圧力差を調整するものであることも好適である。スペーサを備えることで窓部材と被処理物体の表面との近づきすぎが回避されるため、差圧調整部では、被処理物体側の圧力をある程度以上低圧とする簡易な調整によってギャップの均一化を図ることができる。 The light processing apparatus further includes a spacer which is interposed between the window member and the surface of the object to be treated to maintain the distance between the window member and the surface, and the differential pressure adjusting unit It is also preferable to adjust the pressure difference so that the pressure on the side of the object to be treated is lower than the pressure on the light source side among the two sides separated by the window member. Since the spacer prevents the window member from coming close to the surface of the object to be treated, the differential pressure adjustment unit makes the gap uniform by simple adjustment to lower the pressure on the object side by a certain amount or more. Can be

 さらに、上記課題を解決するために、本発明に係る被処理物体の表面と窓部材との間隔調整方法の一態様は、光に曝されて処理される被処理物体の表面と該光を透過する窓部材との間に、該表面に沿って処理気体を流す気体給排過程と、前記処理気体が流れている状態で、前記窓部材で隔てられた両側の圧力差を調整する差圧調整過程と、を有する。
 このような間隔調整方法によれば、差圧調整過程による圧力差の調整という簡便な手法によって容易にギャップの均一化を図り、光処理の均一化を実現することができる。
Furthermore, in order to solve the above problems, one aspect of the method of adjusting the distance between the surface of the object to be treated and the window member according to the present invention transmits the light and the surface of the object to be treated exposed to light. Adjusting the differential pressure to adjust the pressure difference between the two sides separated by the window member while the processing gas is flowing between the window member and the processing chamber. And a process.
According to such an interval adjusting method, the gap can be easily made uniform by a simple method of adjusting the pressure difference in the pressure difference adjusting process, and the light processing can be made uniform.

 上記間隔調整方法において、更に、前記窓部材の周縁部分に、該窓部材よりも弾性的な気密部材を押し付けて前記処理気体の漏出を防ぐ押付過程を有し、前記差圧調整過程が、前記窓部材で隔てられた両側の圧力差を、前記押付過程における気密部材の押し付けの強弱に応じた圧力差に調整する過程であってもよい。
 例えばOリングやシーリング部材などと行った気密部材は、被処理物体の大きさ、材質、厚み、表面状態等といった諸条件に応じて窓部材への押付の強弱が変更されることがあるが、窓部材への押付の強弱は窓部材のたわみに大きく影響する。そこで、差圧調整過程で、圧力差を、押付の強弱に応じた圧力差に調整することでギャップの均一化を図ることができる。
The space adjusting method further includes a pressing process for pressing the sealing member elastic than the window member against the peripheral portion of the window member to prevent the leakage of the processing gas, and the differential pressure adjusting process includes the pressing process. The pressure difference between the two sides separated by the window member may be adjusted to a pressure difference according to the pressing strength of the airtight member in the pressing process.
For example, the strength of the pressure applied to the window member may be changed depending on conditions such as the size, material, thickness, surface condition, etc. of the object to be treated in the airtight member performed with the O-ring or sealing member. The strength of pressing on the window member greatly affects the deflection of the window member. Therefore, in the differential pressure adjustment process, the gap can be made uniform by adjusting the pressure difference to a pressure difference corresponding to the strength of pressing.

 本発明によれば、ギャップを均一化して処理を均一化することができる。
 上記した本発明の目的、態様及び効果並びに上記されなかった本発明の目的、態様及び効果は、当業者であれば添付図面及び請求の範囲の記載を参照することにより下記の発明を実施するための形態(発明の詳細な説明)から理解できるであろう。
According to the present invention, the gap can be made uniform to make the process uniform.
The objects, aspects and effects of the present invention described above as well as the objects, aspects and effects of the present invention not described above can be carried out by those skilled in the art by referring to the attached drawings and claims. It can be understood from the form (detailed description of the invention).

図1は、本実施形態の光処理装置を示す概略構成図である。FIG. 1 is a schematic configuration view showing the light processing apparatus of the present embodiment. 図2は、エジェクタの構造を示す図である。FIG. 2 is a view showing the structure of the ejector. 図3は、窓部材の構造を示す断面図である。FIG. 3 is a cross-sectional view showing the structure of the window member. 図4は、差圧調整の寄与を確認した実験結果を示す表である。FIG. 4 is a table showing experimental results confirming the contribution of differential pressure adjustment. 図5は、処理部と光照射部の差圧に対する窓部材の中央部と周辺部でのギャップ差の変化を示すグラフである。FIG. 5 is a graph showing a change in the gap difference between the central portion and the peripheral portion of the window member with respect to the pressure difference between the processing unit and the light irradiation unit. 図6は、スペーサが設けられた場合の、処理部と光照射部の差圧に対する窓部材の中央部と周辺部でのギャップ差の変化を示すグラフである。FIG. 6 is a graph showing a change in the gap difference between the central portion and the peripheral portion of the window member with respect to the pressure difference between the processing unit and the light irradiation unit when the spacer is provided.

 以下、本発明の実施の形態を図面に基づいて説明する。
 図1は、本実施形態の光処理装置を示す概略構成図である。本実施形態では光処理装置の一例として例えばデスミア処理装置への応用例が示されている。
(光処理装置の構成)
 光処理装置100は、光照射部10と、被処理物体の一例である基板(ワーク)Wを保持する処理部20とを備える。光照射部10は、例えば真空紫外線を発する複数の紫外線光源11を内部に収納し、処理部20が保持する基板Wに紫外線光源11からの光を照射する。光照射部10は、本発明にいう光源部の一例に相当し、処理部20は、本発明にいう処理部の一例に相当する。
Hereinafter, embodiments of the present invention will be described based on the drawings.
FIG. 1 is a schematic configuration view showing the light processing apparatus of the present embodiment. In the present embodiment, as an example of the light processing apparatus, an application example to a desmear processing apparatus is shown.
(Configuration of light processing device)
The light processing apparatus 100 includes a light irradiation unit 10 and a processing unit 20 that holds a substrate (work) W, which is an example of an object to be processed. The light irradiation unit 10 accommodates, for example, a plurality of ultraviolet light sources 11 that emit vacuum ultraviolet light, and irradiates the substrate W held by the processing unit 20 with the light from the ultraviolet light source 11. The light irradiation unit 10 corresponds to an example of the light source unit according to the present invention, and the processing unit 20 corresponds to an example of the processing unit according to the present invention.

 光照射部10は、下方に開口部を有する箱型形状のケーシング14を備える。ケーシング14の開口部には、例えば真空紫外線を透過する、例えば石英ガラス等の窓部材12が気密に設けられている。この窓部材12が、本発明にいう窓部材の一例に相当する。
 光照射部10(ケーシング14)の内部は、供給口15から例えば窒素ガス等の不活性ガスが供給されることで、不活性ガス雰囲気に保たれている。光照射部10内の紫外線光源11の上方には、反射鏡13が設けられている。反射鏡13は、紫外線光源11から発せられた光を窓部材12側に反射する。このような構成により、反射鏡13の全幅にほぼ対応した領域Rに対して、ほぼ均等に紫外線光源11の光が照射される。すなわち、領域Rは、窓部材12とステージ21の表面とで挟まれた領域のうち、紫外線が照射される領域であり、基板Wに対して紫外線照射処理(デスミア処理)を行う紫外線処理領域となる。
The light irradiation part 10 is provided with the box-shaped casing 14 which has an opening part below. At the opening of the casing 14, for example, a window member 12 such as quartz glass, which transmits vacuum ultraviolet light, for example, is airtightly provided. The window member 12 corresponds to an example of the window member in the present invention.
The interior of the light irradiator 10 (casing 14) is maintained in an inert gas atmosphere by supplying an inert gas such as nitrogen gas from the supply port 15, for example. A reflecting mirror 13 is provided above the ultraviolet light source 11 in the light irradiation unit 10. The reflecting mirror 13 reflects the light emitted from the ultraviolet light source 11 to the window member 12 side. With such a configuration, the light of the ultraviolet light source 11 is irradiated substantially uniformly to the region R substantially corresponding to the full width of the reflecting mirror 13. That is, the region R is a region to be irradiated with ultraviolet light in the region sandwiched between the window member 12 and the surface of the stage 21, and the ultraviolet treatment region to perform the ultraviolet irradiation processing (desmear processing) on the substrate W Become.

 紫外線光源11は、例えば波長220nm以下、好ましくは波長190nm以下の紫外線(真空紫外線)を出射するものであって、種々の公知のランプを利用できる。ここで、波長220nmとしたのは、紫外線の波長が220nmを超える場合には、樹脂などの有機物質に起因するスミアを分解除去することが困難となるためである。
 紫外線光源11としては、例えば、キセノンガスを封入したキセノンエキシマランプ(ピーク波長172nm)、低圧水銀ランプ(185nm輝線)などを用いることができる。なかでも、デスミア処理に用いるものとしては、例えばキセノンエキシマランプが好適である。
The ultraviolet light source 11 emits, for example, ultraviolet light (vacuum ultraviolet light) having a wavelength of 220 nm or less, preferably 190 nm or less, and various known lamps can be used. Here, the reason for setting the wavelength to 220 nm is that when the wavelength of ultraviolet light exceeds 220 nm, it becomes difficult to decompose and remove the smear caused by the organic substance such as resin.
As the ultraviolet light source 11, for example, a xenon excimer lamp (peak wavelength 172 nm), low pressure mercury lamp (185 nm bright line) or the like in which xenon gas is sealed can be used. Among them, for example, a xenon excimer lamp is preferable as the one used for the desmear treatment.

 処理部20は、紫外線照射処理(デスミア処理)を行う基板Wを表面に吸着して保持するステージ21を備える。ステージ21は、光照射部10の窓部材12に対向して配置されている。ステージ21には、基板Wを吸着するために例えば吸着孔(不図示)が穿たれている。このステージ21は、平坦性を確保するため、例えばアルミニウム材で形成されている。
 ステージ21表面の外周部分には、外周溝21aが形成されている。この外周溝21aと光照射部10の窓部材12との間にOリング22が挟まれることで、光照射部10と処理部20とが気密に組み付けられる。このOリング22が、本発明にいう気密部材の一例に相当する。
 ステージ21は、ステージ21を窓部材に対し接近乖離する方向(図の上下方向)に移動させるアクチュエータ51に支えられている。このアクチュエータ51によってステージ21が移動されることによって、Oリング22が窓部材12に押し付けられる強さが調整される。
The processing unit 20 includes a stage 21 that adsorbs and holds the substrate W on which the ultraviolet irradiation process (desmear process) is performed on the surface. The stage 21 is disposed to face the window member 12 of the light emitting unit 10. For example, suction holes (not shown) are bored in the stage 21 in order to suction the substrate W. The stage 21 is formed of, for example, an aluminum material in order to ensure flatness.
An outer peripheral groove 21 a is formed on an outer peripheral portion of the surface of the stage 21. The O-ring 22 is sandwiched between the outer peripheral groove 21 a and the window member 12 of the light irradiation unit 10, whereby the light irradiation unit 10 and the processing unit 20 are assembled in an airtight manner. The O-ring 22 corresponds to an example of the airtight member in the present invention.
The stage 21 is supported by an actuator 51 that moves the stage 21 in a direction (upper and lower direction in the drawing) toward and away from the window member. As the stage 21 is moved by the actuator 51, the strength with which the O-ring 22 is pressed against the window member 12 is adjusted.

 ステージ21の一方(図1の右側)の側縁部には、処理用ガス(処理気体)を処理領域Rに供給するための給気路24が形成されている。給気路24には、処理用ガスを供給する供給装置41が接続されている。
 また、ステージ21の他方(図1の左側)の側縁部には、デスミア処理後の排ガスをステージ部21外に排出するための排気路25が形成されている。
 ここで、処理用ガスとしては、例えば、酸素ガス、酸素とオゾンや水蒸気の混合ガス、これらのガスに不活性ガスなどを混合したガスなどが用いられる。処理用ガスは、基板Wに対して光照射部10からの紫外線が照射されている間、給気路24を通って処理領域Rに供給され、排気路25を通って排ガスとしてステージ部21外部に排出される。すなわち、処理用ガスは、窓部材12と基板Wとの間の処理領域Rを、図1の右から左へと流れていくこととなる。
At a side edge of one side (right side in FIG. 1) of the stage 21, an air supply path 24 for supplying a processing gas (processing gas) to the processing region R is formed. A supply device 41 for supplying a processing gas is connected to the air supply passage 24.
Further, at the side edge of the other side (left side in FIG. 1) of the stage 21, an exhaust path 25 for discharging the exhaust gas after desmearing processing to the outside of the stage portion 21 is formed.
Here, as the processing gas, for example, a mixed gas of oxygen gas, oxygen and ozone or water vapor, or a mixture of these gases with an inert gas or the like is used. The processing gas is supplied to the processing region R through the air supply passage 24 while the substrate W is irradiated with the ultraviolet light from the light irradiation unit 10, and is discharged to the outside of the stage unit 21 as an exhaust gas through the exhaust passage 25. Discharged into That is, the processing gas flows in the processing region R between the window member 12 and the substrate W from the right to the left in FIG.

 本実施形態の光処理装置100では、排気路25にエジェクタ42が取り付けられている。エジェクタ42は流体を利用して減圧状態を作り出すものであり、本実施形態では、例えばコンプレッサ45で生成される例えば圧縮空気の流れを利用している。このエジェクタ42が排気路25に取り付けられることで、処理部20内の処理用ガスが強制的に排出される。排気路25とエジェクタ42とを繋ぐ配管には、モータ駆動で開閉されて配管の開度を調整するコック46が設けられている。また、光処理装置100には、コック46の開度とアクチュエータ51の駆動を制御する制御部52も備えられている。 In the light processing apparatus 100 of the present embodiment, the ejector 42 is attached to the exhaust passage 25. The ejector 42 uses a fluid to create a reduced pressure state, and in the present embodiment, for example, the flow of compressed air generated by the compressor 45 is used. The ejector 42 is attached to the exhaust path 25 to forcibly discharge the processing gas in the processing unit 20. The pipe connecting the exhaust passage 25 and the ejector 42 is provided with a cock 46 which is opened and closed by motor drive to adjust the opening degree of the pipe. The light processing apparatus 100 also includes a control unit 52 that controls the opening degree of the cock 46 and the driving of the actuator 51.

 ここで、エジェクタ42の構造について説明する。
 図2は、エジェクタの構造を示す図である。
 エジェクタ42には、上述した排気路25に接続される吸込口421と、上述したコンプレッサ45から圧縮空気が供給される一次側開口422と、気体が排出される二次側開口423とを有する。一次側開口422から供給された圧縮空気は、ノズル424から吹き出すことで流速が増してディフューザ425へと流入する。このように流速が増すことで、ノズル424とディフューザ425との間で減圧状態が生じ、吸込口421から排ガスが吸い込まれる。このように吸い込まれた排ガスは、圧縮空気の流れとともに二次側開口423に導かれて流出する。
Here, the structure of the ejector 42 will be described.
FIG. 2 is a view showing the structure of the ejector.
The ejector 42 has a suction port 421 connected to the exhaust path 25 described above, a primary side opening 422 to which compressed air is supplied from the compressor 45 described above, and a secondary side opening 423 from which gas is discharged. The compressed air supplied from the primary side opening 422 is blown out from the nozzle 424 to increase the flow velocity and flow into the diffuser 425. As the flow velocity increases in this manner, a reduced pressure state occurs between the nozzle 424 and the diffuser 425, and the exhaust gas is sucked from the suction port 421. The exhaust gas thus sucked is led to the secondary side opening 423 and flows out together with the flow of the compressed air.

 図3は、窓部材の構造を示す断面図である。
 窓部材12には、ワークWの表面に接触するスペーサ121が設けられている。スペーサ121の高さは例えば約100μm~約1mmである。
 この窓部材12は照射する光の透過率を考慮した薄い部材であり、例えば1辺の長さに対して厚みが1/100以下である。このため、上述したような原因で窓部材12にたわみが生じることを発明者らは見いだした。ワークWに近づく方向のたわみはスペーサ121によって抑制されるものの、ワークWから離れる方向へのたわみはスペーサ121では抑制できない。そして、このような窓部材12のたわみを抑制してワークW全面でワークWと窓部材12とのギャップを均一化するために、発明者らが鋭意検討した結果、上述したエジェクタによる差圧調整が有効であることを見いだした。
FIG. 3 is a cross-sectional view showing the structure of the window member.
The window member 12 is provided with a spacer 121 in contact with the surface of the workpiece W. The height of the spacer 121 is, for example, about 100 μm to about 1 mm.
The window member 12 is a thin member in consideration of the transmittance of light to be irradiated, and for example, the thickness is 1/100 or less with respect to the length of one side. Therefore, the inventors have found that the window member 12 is bent due to the above-mentioned cause. Although the deflection in the direction approaching the workpiece W is suppressed by the spacer 121, the deflection in the direction away from the workpiece W can not be suppressed by the spacer 121. Then, as a result of intensive studies by the inventors in order to suppress such deflection of the window member 12 and equalize the gap between the workpiece W and the window member 12 over the entire surface of the workpiece W, the above-described differential pressure adjustment by the ejector Was found to be effective.

 図4は、差圧調整の寄与を確認した実験結果を示す表である。
 図4の表には、従来のように差圧調整を行わない場合と、本実施形態のようにエジェクタを用いて差圧調整を行った場合とのそれぞれについてギャップの均一性が示されている。但し、ここに結果が示された実験では、図3に示すスペーサ121を有さない窓部材12が用いられているものとする。このため、窓部材12はワークWから離れる方向にも近づく方向にもたわみ得る。
 この表に示す実験では、処理用ガスの流量が4l/min~12l/minであるとき、差圧調整の有無でギャップの均一性を比較した。また、ワークWサイズは340mm×510mm、ギャップの測定点は18点で、ギャップの均一性を表す数値としては、最も広いギャップの値から最も狭いギャップの値を引いた値(P-P値)を用いた。
 差圧調整の結果、処理部20内の圧力は、光照射部10内の圧力に較べてわずかに減圧された状態となった。ここで「わずかな減圧」とは、最大でも2kPa程度の減圧である。
 図4の表から分かるように、処理用ガスの流量の多少にかかわらず、差圧調整を行うと、P-P値が約10分の1に小さくなっている。P-P値が小さいということは、ワークW面内のギャップのばらつきが小さく、ギャップの均一度が良いということになる。
FIG. 4 is a table showing experimental results confirming the contribution of differential pressure adjustment.
In the table of FIG. 4, the uniformity of the gap is shown for each of the case where the differential pressure adjustment is not performed as in the prior art and the case where the differential pressure adjustment is performed using the ejector as in the present embodiment. . However, in the experiment in which the result is shown here, it is assumed that the window member 12 having no spacer 121 shown in FIG. 3 is used. For this reason, the window member 12 can also bend in the direction away from the work W as well as in the direction approaching it.
In the experiment shown in this table, when the flow rate of the processing gas is 4 l / min to 12 l / min, the uniformity of the gap was compared with the presence or absence of differential pressure adjustment. The workpiece W size is 340 mm × 510 mm, and the gap measurement point is 18 points. As the numerical value representing the uniformity of the gap, a value obtained by subtracting the narrowest gap value from the widest gap value (PP value) Was used.
As a result of the differential pressure adjustment, the pressure in the processing unit 20 was slightly reduced compared to the pressure in the light irradiation unit 10. Here, "slightly reduced pressure" means a pressure reduction of about 2 kPa at the maximum.
As can be seen from the table of FIG. 4, the PP value is reduced to about 1/10 when differential pressure adjustment is performed regardless of the flow rate of the processing gas. The small PP value means that the variation of the gap in the surface of the workpiece W is small and the uniformity of the gap is good.

 ここで、処理部20と光照射部10の差圧に対する窓部材の中央部と周辺部でのギャップの差分の変化について更に説明する。
 図5は、処理部20と光照射部10の差圧に対する窓部材の中央部と周辺部でのギャップの差分の変化を示すグラフである。なお、ここに結果が示された実験でも、図3に示すスペーサ121を有さない窓部材12が用いられている。
 図の横軸は、処理部20側の圧力から光照射部10側の圧力を差し引いた差圧を表し、縦軸は窓部材の中央部と周辺部でのギャップの差分を表している。但し、+:中央部が光照射部10側に凸状、-:中央部がワークW側に凸状と定義する。
Here, the change in the difference in the gap between the central portion and the peripheral portion of the window member with respect to the pressure difference between the processing unit 20 and the light irradiation unit 10 will be further described.
FIG. 5 is a graph showing the change in the difference in the gap between the central portion and the peripheral portion of the window member with respect to the pressure difference between the processing unit 20 and the light irradiation unit 10. Also in the experiment in which the result is shown here, the window member 12 without the spacer 121 shown in FIG. 3 is used.
The horizontal axis of the drawing represents the differential pressure obtained by subtracting the pressure on the light irradiation unit 10 side from the pressure on the processing unit 20 side, and the vertical axis represents the difference in gap between the central portion and the peripheral portion of the window member. However, +: the central portion is convex toward the light irradiation unit 10 side, and −: the central portion is convex toward the work W side.

 菱形のマークが付された太線61は、窓部材12にOリング22が強く押し当てられた条件Aにおけるギャップの差分の変化を示している。
 四角形のマークが付された細線62は、窓部材12にOリング22が通常程度に押し当てられた条件Bにおけるギャップの差分の変化を示している。
 三角形のマークが付された点線63は、窓部材12にOリング22が弱く押し当てられた条件Cにおけるギャップの差分の変化を示している。
 窓部材12に対するOリング22の押付の強弱は、図1に示すアクチュエータ51によるステージ21の上下移動によって変更されるが、ワークWの大きさ、材質、厚み、表面状態等といった諸条件に応じて上記の条件A~条件Cが選択されるものとする。
A thick line 61 with a diamond mark indicates a change in the gap difference under the condition A in which the O-ring 22 is strongly pressed to the window member 12.
A thin line 62 with a square mark indicates a change in the difference of the gap under the condition B in which the O-ring 22 is normally pressed to the window member 12.
The dotted line 63 marked with a triangle indicates the change in the difference of the gap under the condition C in which the O-ring 22 is weakly pressed against the window member 12.
The strength of the pressing of the O-ring 22 against the window member 12 is changed by the vertical movement of the stage 21 by the actuator 51 shown in FIG. 1, but depending on various conditions such as the size, material, thickness and surface condition of the work W It is assumed that the above conditions A to C are selected.

 上記の条件A~条件Cのいずれの場合でも、差圧がゼロの場合は窓部材12が光照射部10側に凸の状態に撓んでいることが分かる。そして、処理部20側を光照射部10側に対して陰圧とすることによって中央部のギャップを、窓部材12の周辺部分よりも小さく、ワークW側に凸の状態に撓ませることができる。但し、ワークW全面でギャップが均一化するときの差圧は上記の条件A~条件Cによって異なっている。例えば条件Aでは1kPaの陰圧でギャップが均一化し、例えば条件Bでは0.8kPaの陰圧でギャップが均一化し、例えば条件Cでは0.5kPaの陰圧でギャップが均一化する。これらの圧力値は大気圧に較べるとわずかな値であるが、例えば1mm以下などといった小さなギャップに及ぼす影響は充分に大きい。 In any of the above conditions A to C, when the differential pressure is zero, it can be seen that the window member 12 is bent in a convex state toward the light irradiation unit 10 side. And by making processing part 20 side into negative pressure to light irradiation part 10 side, a gap of a central part can be smaller than a peripheral part of window member 12, and it can be bent in a convex state on work W side. . However, the differential pressure when the gap is made uniform over the entire surface of the workpiece W differs depending on the conditions A to C described above. For example, in condition A, the gap is made uniform at a negative pressure of 1 kPa, for example, in condition B, the gap is made uniform at a negative pressure of 0.8 kPa, and in condition C, for example, the gap is made uniform at a negative pressure of 0.5 kPa. These pressure values are small compared to the atmospheric pressure, but the influence on small gaps, for example 1 mm or less, is sufficiently large.

 また、図5に示す例は、窓部材12に対するOリング22の押付以外は同一条件であるものとした例であるが、差圧に対するギャップ差の変化は、例えば処理用ガスの流量の相違などによっても異なる変化を示す。
 さらに、図5に示す例では、処理部20側を光照射部10側に対して陰圧とすることでギャップが均一化するが、例えば、窓部材12の自重たわみが大きい場合や、Oリング22の押付が弱い場合や、処理用ガスの流量が少ない場合や、排気側の配管における排出抵抗(圧力損失)が小さい場合などには、処理部20側を光照射部10側に対して陽圧とすることでギャップが均一化することもある。
Further, although the example shown in FIG. 5 is an example under the same conditions except that the O-ring 22 is pressed against the window member 12, the change in the gap difference with respect to the differential pressure is, for example, the difference in the flow rate of the processing gas Also show different changes.
Furthermore, in the example shown in FIG. 5, the gap is made uniform by setting the processing unit 20 side to a negative pressure with respect to the light irradiation unit 10 side, but for example, the case where the self weight deflection of the window member 12 is large or the O ring When the pressing force 22 is weak, when the flow rate of the processing gas is small, or when the discharge resistance (pressure loss) in the pipe on the exhaust side is small, etc., the processing unit 20 side is positive with respect to the light irradiation unit 10 side. The gap may be made uniform by pressure.

 このような場合であっても、図5に示すようなギャップ差の変化傾向を光処理に先立って測定し、ギャップが均一化する差圧を、各種の条件に応じた値として得ておくことはできる。ギャップが均一化する差圧がそのように事前に得られていることを前提とした、光処理装置における動作手順について以下図1を参照して説明する。
(1)光照射部10と処理部20とは上下に分離している。窓部材12は光照射部10側に取り付けられている。
(2)ワークWがステージ21上に載置されて吸着固定される。
(3)光照射部10が下降、もしくは処理部20が上昇する。これにより窓部材12がOリング22と接触し、処理部20が密閉される。制御部52がアクチュエータ51を制御してステージ21を上下移動し、窓部材12とワークWとの間隔を、あらかじめ設定された例えば1mm以下といった間隔にする。
Even in such a case, the change tendency of the gap difference as shown in FIG. 5 is measured prior to the light processing, and the differential pressure at which the gap is made uniform is obtained as a value corresponding to various conditions. You can. An operation procedure in the light processing apparatus will be described below with reference to FIG. 1 on the premise that the differential pressure at which the gap is equalized is obtained in advance.
(1) The light irradiation unit 10 and the processing unit 20 are vertically separated. The window member 12 is attached to the light emitting unit 10 side.
(2) The work W is placed on the stage 21 and fixed by suction.
(3) The light emitting unit 10 is lowered or the processing unit 20 is raised. Thereby, the window member 12 contacts the O-ring 22 and the processing unit 20 is sealed. The control unit 52 controls the actuator 51 to move the stage 21 up and down to set the distance between the window member 12 and the work W to a predetermined distance of, for example, 1 mm or less.

(4)供給装置41が動作し処理部20に処理用ガスが導入される。また、エジェクタ42も動作し、処理部20からガスが排出される。この(4)の過程が、本発明にいう気体給排過程の一例に相当する。
(5)制御部52には、今回の光処理における諸条件が入力されて、それらの条件に応じた差圧が求められる。そして、制御部52がコック46の開度を調整することでその差圧を実現し、窓部材12とワークWとのギャップが一定に維持される。なお、本実施形態の場合、窓部材12とワークWとの間にスペーサが設けられているため差圧の厳密な制御は求められない。コック46の開度が、求められている差圧を実現する開度よりも大きめの側にややずれた程度であればスペーサによってギャップは一定に維持される。
(4) The supply device 41 operates to introduce the processing gas into the processing unit 20. Further, the ejector 42 also operates, and the gas is discharged from the processing unit 20. The process of (4) corresponds to an example of the gas supply and discharge process according to the present invention.
(5) The various conditions in the present light processing are input to the control unit 52, and a differential pressure corresponding to the conditions is obtained. Then, the control unit 52 adjusts the opening degree of the cock 46 to realize the differential pressure, and the gap between the window member 12 and the work W is maintained constant. In the case of this embodiment, since a spacer is provided between the window member 12 and the work W, strict control of the differential pressure is not required. If the opening degree of the cock 46 is slightly deviated to a larger side than the opening degree for achieving the required differential pressure, the gap is kept constant by the spacer.

 この(5)の過程における、処理部20と光照射部10の差圧に対する窓部材の中央部と周辺部でのギャップの差分の変化について説明する。
 図6は、窓部材12にスペーサ121が設けられた場合の、処理部20と光照射部10の差圧に対する窓部材の中央部と周辺部でのギャップの差分の変化を示すグラフである。
 図の横軸は、処理部20側の圧力から光照射部10側の圧力を差し引いた差圧を表し、縦軸は窓部材の中央部と周辺部でのギャップの差分を表している。
 菱形のマークが付された太線64は、窓部材12にOリング22が強く押し当てられた条件Aにおけるギャップの差分の変化を示している。
 四角形のマークが付された細線65は、窓部材12にOリング22が通常程度に押し当てられた条件Bにおけるギャップの差分の変化を示している。
 三角形のマークが付された点線66は、窓部材12にOリング22が弱く押し当てられた条件Cにおけるギャップの差分の変化を示している。
The change of the difference of the gap in the central part and the peripheral part of the window member to the differential pressure of processing part 20 and light irradiation part 10 in the process of (5) is explained.
FIG. 6 is a graph showing the change in the difference in gap between the central portion and the peripheral portion of the window member with respect to the pressure difference between the processing unit 20 and the light irradiation unit 10 when the spacer 121 is provided on the window member 12.
The horizontal axis of the drawing represents the differential pressure obtained by subtracting the pressure on the light irradiation unit 10 side from the pressure on the processing unit 20 side, and the vertical axis represents the difference in gap between the central portion and the peripheral portion of the window member.
A thick line 64 with a diamond mark indicates a change in the difference of the gap under the condition A in which the O-ring 22 is strongly pressed to the window member 12.
A thin line 65 with a square mark indicates a change in the difference of the gap under the condition B in which the O-ring 22 is normally pressed to the window member 12.
The dotted line 66 marked with a triangle indicates the change in the difference of the gap under the condition C where the O-ring 22 is weakly pressed against the window member 12.

 太線64が示す条件Aでは、1.0kPa以上の陰圧でギャップの差分が0に維持される。また、細線65が示す条件Bでは、0.8kPa以上の陰圧でギャップの差分が0に維持される。更に、点線66が示す条件Cでは、0.5kPa以上の陰圧でギャップの差分が0に維持される。
 このように、スペーサを設けることにより、条件A~条件Cのいずれでも、差圧がある値以上であればギャップは常に一定に維持される。したがって、上記(5)の過程では、差圧をやや大きな値に設定しておけば、処理室内の圧力が、処理用ガスの流れの影響などにより多少変動するようなことがあったとしても、ギャップを一定に維持することができる。
Under the condition A indicated by the thick line 64, the gap difference is maintained at 0 at a negative pressure of 1.0 kPa or more. Further, under the condition B indicated by the thin line 65, the gap difference is maintained at 0 at a negative pressure of 0.8 kPa or more. Furthermore, under the condition C indicated by the dotted line 66, the gap difference is maintained at 0 at a negative pressure of 0.5 kPa or more.
As described above, by providing the spacer, the gap is always kept constant under any of the conditions A to C as long as the differential pressure is a certain value or more. Therefore, in the process (5), if the differential pressure is set to a relatively large value, even if the pressure in the processing chamber fluctuates somewhat due to the influence of the flow of the processing gas, etc., The gap can be kept constant.

 上記(5)の過程が、本発明にいう差圧調整過程の一例に相当し、図1に示す制御部52が本発明にいう差圧調整部の一例に相当する。以下、光処理装置における動作手順について説明を続ける。
(6)紫外線光源11を点灯し、光処理を開始する。
(7)光処理が終了すると、紫外線光源11を消灯する。
(8)処理部20への処理用ガスの導入を停止し、エジェクタの動作も停止する。
(9)光照射部10が上昇、もしくは処理部20が下降し、光照射部10と処理部20とが上下に分離する。
(10)ワークWを取り出す。
 以上のような手順によってワークW全面に対して均一な紫外線照射処理(デスミア処理)を施すことができる。
The process of (5) above corresponds to an example of the differential pressure adjustment process according to the present invention, and the control unit 52 shown in FIG. 1 corresponds to an example of the differential pressure adjustment section according to the present invention. Hereinafter, the operation procedure of the light processing apparatus will be described.
(6) The ultraviolet light source 11 is turned on to start light processing.
(7) When the light processing is completed, the ultraviolet light source 11 is turned off.
(8) The introduction of the processing gas into the processing unit 20 is stopped, and the operation of the ejector is also stopped.
(9) The light emitting unit 10 rises or the processing unit 20 descends, and the light emitting unit 10 and the processing unit 20 are vertically separated.
(10) Take out the work W.
A uniform ultraviolet irradiation process (desmear process) can be performed on the entire surface of the workpiece W by the above-described procedure.

 なお、上記実施形態ではスペーサを有する例を好適な例として示したが、本発明の光処理装置はスペーサを有さないものであってもよい。
 また、上記実施形態では、デスミア処理装置への応用例が示されているが、本発明は、レジストの光アッシング処理や、レジストの除去処理や、ドライ洗浄処理などに応用されてもよい。
 また、上記実施形態では、本発明にいう差圧調整部の一例として、処理部20からの排気量を調整するものを示したが、本発明にいう差圧調整部は、例えば処理気体の給気量を調整するものであってもよく、あるいは、光源部側の圧力を調整するものであってもよい。
In addition, although the example which has a spacer was shown as a suitable example in the said embodiment, the light processing apparatus of this invention may not have a spacer.
Further, although the application example to the desmear processing apparatus is shown in the above embodiment, the present invention may be applied to the light ashing processing of the resist, the resist removing processing, the dry cleaning processing and the like.
Further, in the above embodiment, as an example of the differential pressure adjustment unit according to the present invention, one for adjusting the exhaust amount from the processing unit 20 is shown, but the differential pressure adjustment unit according to the present invention The amount of air may be adjusted, or the pressure on the light source unit side may be adjusted.

 なお、上記において特定の実施形態が説明されているが、当該実施形態は単なる例示であり、本発明の範囲を限定する意図はない。本明細書に記載された装置及び方法は上記した以外の形態において具現化することができる。また、本発明の範囲から離れることなく、上記した実施形態に対して適宜、省略、置換及び変更をなすこともできる。かかる省略、置換及び変更をなした形態は、請求の範囲に記載されたもの及びこれらの均等物の範疇に含まれ、本発明の技術的範囲に属する。 Although specific embodiments are described above, the embodiments are merely examples and are not intended to limit the scope of the present invention. The devices and methods described herein may be embodied in forms other than those described above. In addition, omissions, substitutions and changes can be made as appropriate to the above-described embodiments without departing from the scope of the present invention. Such omissions, substitutions and changes are included in the scope of the claims and their equivalents, and belong to the technical scope of the present invention.

 100…光処理装置、W…ワーク、10…光照射部、12…窓部材、20…処理部、22…Oリング、24…給気路、25…排気路、41…供給装置、42…エジェクタ、45…コンプレッサ、46…コック、51…アクチュエータ、52…制御部 DESCRIPTION OF SYMBOLS 100 ... Light processing apparatus, W ... Work, 10 ... Light irradiation part, 12 ... Window member, 20 ... Processing part, 22 ... O ring, 24 ... Air supply path, 25 ... Exhaust path, 41 ... Supply apparatus, 42 ... Ejector , 45: compressor, 46: cock, 51: actuator, 52: control unit

Claims (5)

 光を発する光源部と、
 前記光源部から発せられた光に被処理物体の表面が処理気体の雰囲気中で曝される処理部と、
 前記光源部と前記処理部とを隔て、該光源部から発せられた光を透過する窓部材と、
 前記被処理物体の表面と前記窓部材との間に、該表面に沿って前記処理気体を流す気体給排部と、
 前記処理気体が流れている状態で、前記窓部材で隔てられた両側の圧力差を調整する差圧調整部と、
を備えることを特徴とする光処理装置。
A light source unit that emits light;
A processing unit in which the surface of the object to be processed is exposed in the atmosphere of the processing gas to the light emitted from the light source unit;
A window member which separates the light source unit from the processing unit and transmits light emitted from the light source unit;
A gas supply / discharge unit for flowing the processing gas along the surface, between the surface of the object to be processed and the window member;
A differential pressure adjusting unit configured to adjust a pressure difference between both sides separated by the window member in a state where the processing gas is flowing;
A light processing apparatus comprising:
 前記差圧調整部は、前記気体給排部が前記処理気体を前記処理部から排気する排気量を調整するものであることを特徴とする請求項1記載の光処理装置。 2. The light processing apparatus according to claim 1, wherein the differential pressure adjustment unit adjusts an exhaust amount of the gas supply / exhaust unit exhausting the processing gas from the processing unit.  前記窓部材と前記被処理物体の表面との間に挟まれて該窓部材と該表面との距離を保つスペーサを備え、
 前記差圧調整部は、前記窓部材で隔てられた両側のうち、前記被処理物体側の圧力が前記光源部側の圧力よりも低圧となるように圧力差を調整するものであることを特徴とする請求項1または2記載の光処理装置。
A spacer which is interposed between the window member and the surface of the object to be treated and which keeps the distance between the window member and the surface;
The differential pressure adjusting unit adjusts a pressure difference such that the pressure on the object side is lower than the pressure on the light source unit side among the two sides separated by the window member. The light processing device according to claim 1 or 2.
 光に曝されて処理される被処理物体の表面と該光を透過する窓部材との間に、該表面に沿って処理気体を流す気体給排過程と、
 前記処理気体が流れている状態で、前記窓部材で隔てられた両側の圧力差を調整する差圧調整過程と、
を有することを特徴とする被処理物体の表面と窓部材との間隔調整方法。
A gas supply and discharge process for flowing a processing gas along the surface between the surface of the object to be treated exposed to light and being processed and the window member transmitting the light;
A differential pressure adjustment process of adjusting a pressure difference between both sides separated by the window member in a state where the process gas is flowing;
And adjusting the distance between the surface of the object to be treated and the window member.
 前記窓部材の周縁部分に、該窓部材よりも弾性的な気密部材を押し付けて前記処理気体の漏出を防ぐ押付過程を有し、
 前記差圧調整過程が、前記窓部材で隔てられた両側の圧力差を、前記押付過程における気密部材の押し付けの強弱に応じた圧力差に調整する過程であることを特徴とする請求項4記載の間隔調整方法。
And a pressing process for pressing an airtight member that is more elastic than the window member against the peripheral portion of the window member to prevent the processing gas from leaking.
The differential pressure adjustment process is a process of adjusting a pressure difference between both sides separated by the window member to a pressure difference according to the pressure strength of the airtight member in the pressing process. How to adjust the interval.
PCT/JP2017/007442 2016-03-11 2017-02-27 Light-processing device, and method for adjusting interval between surface of object to be processed and window member Ceased WO2017154634A1 (en)

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