[go: up one dir, main page]

WO2017150438A1 - Electrically conductive paste, electronic component, and laminated ceramic capacitor - Google Patents

Electrically conductive paste, electronic component, and laminated ceramic capacitor Download PDF

Info

Publication number
WO2017150438A1
WO2017150438A1 PCT/JP2017/007447 JP2017007447W WO2017150438A1 WO 2017150438 A1 WO2017150438 A1 WO 2017150438A1 JP 2017007447 W JP2017007447 W JP 2017007447W WO 2017150438 A1 WO2017150438 A1 WO 2017150438A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive paste
dispersant
mass
powder
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2017/007447
Other languages
French (fr)
Japanese (ja)
Inventor
香織 中家
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP2018503286A priority Critical patent/JP6635186B2/en
Priority to KR1020187026479A priority patent/KR102647944B1/en
Priority to MYPI2018703019A priority patent/MY188260A/en
Priority to CN201780013785.8A priority patent/CN108780673B/en
Publication of WO2017150438A1 publication Critical patent/WO2017150438A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/232Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors

Definitions

  • the present invention relates to a conductive paste, an electronic component, and a multilayer ceramic capacitor.
  • Multilayer ceramic capacitors have a structure in which a plurality of dielectric layers and a plurality of internal electrode layers are alternately stacked. By reducing the thickness of these dielectric layers and internal electrode layers, the size and capacity can be reduced. Can be planned.
  • the conductive powder and the organic vehicle are contained under conditions used in combination with a ceramic green sheet having a thickness of 5 ⁇ m or less containing butyral resin, and the solvent in the organic vehicle
  • a conductive paste containing nyl acetate as a main component and having little change in viscosity over time is described.
  • the conductive paste used for the internal electrode may contain a dispersant in order to improve the dispersibility of the conductive powder or the like (for example, Patent Document 3).
  • the conductive powder also tends to have a smaller particle size.
  • the particle size of the conductive powder is small, the specific surface area of the particle surface increases, so that the surface activity of the conductive powder (metal powder) is increased, which may result in a decrease in dispersibility and a decrease in viscosity characteristics. .
  • Patent Documents 1 to 4 describe conductive pastes with little change in viscosity over time. However, as the thickening of the conductive paste over time becomes more problematic as the internal electrode layer becomes thinner, the conductive properties with improved viscosity characteristics have become available as the electrode pattern has become thinner in recent years. A paste is sought.
  • an object of the present invention is to provide a conductive paste that has very little change in viscosity over time and is superior in viscosity stability.
  • a conductive paste containing conductive powder, ceramic powder, a dispersant, a binder resin and an organic solvent, the dispersant containing an acid-based dispersant having a molecular weight of 500 or less, an acid
  • the conductive dispersant is provided with a conductive paste having a branched hydrocarbon group having one or more branched chains.
  • R 1 is a branched alkyl or branched alkenyl group having 10 to 20 carbon atoms having 10 to 20 carbon atoms.
  • the acid-based dispersant is preferably contained in an amount of 0.01 parts by mass or more and 3 parts by mass or less with respect to 100 parts by mass of the conductive powder. Further, it is preferable that the dispersant further contains a base dispersant. The dispersant is preferably contained in an amount of 0.01 parts by mass or more and 3 parts by mass or less with respect to 100 parts by mass of the conductive powder.
  • the conductive powder preferably contains at least one metal powder selected from Ni, Pd, Pt, Au, Ag, Cu, and alloys thereof.
  • the conductive powder preferably has an average particle size of 0.05 ⁇ m or more and 1.0 ⁇ m or less.
  • the ceramic powder preferably contains a perovskite oxide.
  • the ceramic powder preferably has an average particle size of 0.01 ⁇ m or more and 0.5 ⁇ m or less.
  • the binder resin preferably contains at least one of a cellulose resin, an acrylic resin, and a butyral resin.
  • the viscosity immediately after production of the conductive paste is 100%, the viscosity after standing for 60 days is preferably 80% or more and 120% or less.
  • the said electrically conductive paste is for internal electrodes of a multilayer ceramic component.
  • an electronic component formed using the conductive paste is provided.
  • FIG. 1 is a perspective view and a cross-sectional view showing a multilayer ceramic capacitor according to an embodiment.
  • the average particle size of the conductive powder is preferably 0.05 ⁇ m or more and 1.0 ⁇ m or less, more preferably 0.1 ⁇ m or more and 0.5 ⁇ m or less.
  • the average particle diameter of the conductive powder is in the above range, it can be suitably used as a paste for an internal electrode of a thin-film laminated ceramic capacitor, and for example, the smoothness of the dry film and the dry film density are improved.
  • the average particle diameter is a value obtained from observation with a scanning electron microscope (SEM), and refers to a particle diameter having an integrated value of 50% in the particle size distribution.
  • the content of the conductive powder is preferably 30% by mass to 70% by mass and more preferably 40% by mass to 65% by mass with respect to the total amount of the conductive paste.
  • content of electroconductive powder is the said range, it is excellent in electroconductivity and dispersibility.
  • the ceramic powder is not particularly limited.
  • a known ceramic powder is appropriately selected depending on the type of multilayer ceramic capacitor to be applied.
  • the ceramic powder include perovskite oxides containing Ba and Ti, and preferably barium titanate (BaTiO 3 ).
  • 1 type may be used for ceramic powder and 2 or more types may be used for it.
  • ceramic powder containing barium titanate as a main component and oxide as a subcomponent may be used.
  • oxide include oxides composed of one or more selected from Mn, Cr, Si, Ca, Ba, Mg, V, W, Ta, Nb, and rare earth elements.
  • the ceramic powder examples include a perovskite oxide ferroelectric ceramic powder in which Ba atoms and Ti atoms of barium titanate (BaTiO 3 ) are substituted with other atoms, for example, Sn, Pb, Zr, and the like. You can also
  • the ceramic powder in the internal electrode paste a powder having the same composition as that of the dielectric ceramic powder constituting the green sheet of the multilayer ceramic capacitor may be used. Thereby, the generation of cracks due to the shrinkage mismatch at the interface between the dielectric layer and the internal electrode layer in the sintering process is suppressed.
  • ceramic powder include, besides the perovskite oxide containing Ba and Ti, ZnO, ferrite, PZT, BaO, Al 2 O 3 , Bi 2 O 3 , R (rare earth element) 2 O 3. , TiO 2 , Nd 2 O 3 and other oxides.
  • Binder resin It does not specifically limit as binder resin, A well-known resin can be used.
  • the binder resin include cellulose resins such as methyl cellulose, ethyl cellulose, ethyl hydroxyethyl cellulose, and nitrocellulose, butyral resins such as acrylic resins and polyvinyl butyral. Among these, it is preferable to contain ethyl cellulose from the viewpoints of solubility in a solvent and combustion decomposability.
  • One type of binder resin may be used, or two or more types may be used.
  • the molecular weight of the binder resin is, for example, about 20,000 to 200,000.
  • the content of the binder resin is preferably 1 part by mass or more and 10 parts by mass or less, and more preferably 1 part by mass or more and 8 parts by mass or less with respect to 100 parts by mass of the conductive powder.
  • the content of the binder resin is preferably 0.5% by mass or more and 10% by mass or less, and more preferably 1% by mass or more and 6% by mass or less with respect to the total amount of the conductive paste.
  • content of binder resin is the said range, it is excellent in electroconductivity and dispersibility.
  • Organic solvent It does not specifically limit as an organic solvent, The well-known organic solvent which can melt
  • organic solvents include dihydroterpinyl acetate, isobornyl acetate, isobornyl propionate, isobornyl butyrate, isobornyl isobutyrate, ethylene glycol monobutyl ether acetate, dipropylene glycol methyl ether acetate, and the like.
  • terpene solvents such as terpineol and dihydroterpineol, saturated aliphatic hydrocarbon solvents such as tridecane, nonane, and cyclohexane.
  • the organic solvent may use 1 type and may use 2 or more types.
  • the organic solvent includes, for example, at least one acetate solvent (A) selected from dihydroterpinyl acetate, isobornyl acetate, isobornyl propionate, isobornyl butyrate and isobornyl isobutyrate. But you can. Among these, isobornyl acetate is more preferable.
  • the organic solvent contains the acetate solvent (A) as a main component, the acetate solvent (A) is preferably contained in an amount of 90% by mass or more and 100% by mass or less, more preferably 100% by mass with respect to the entire organic solvent. Contained.
  • the organic solvent may contain, for example, the above-mentioned acetate solvent (A) and at least one acetate solvent (B) selected from ethylene glycol monobutyl ether acetate and dipropylene glycol methyl ether acetate.
  • A acetate solvent
  • B acetate solvent selected from ethylene glycol monobutyl ether acetate and dipropylene glycol methyl ether acetate.
  • the organic solvent preferably contains 50 mass% or more and 90 mass% or less of the acetate solvent (A) with respect to the entire organic solvent. More preferably, the content is 60% by mass or more and 80% by mass or less.
  • the organic solvent contains 10% by mass to 50% by mass, more preferably 20% by mass to 40% by mass of the acetate solvent (B) with respect to 100% by mass of the whole organic solvent. .
  • the content of the organic solvent is preferably 40 parts by mass or more and 90 parts by mass or less, and more preferably 45 parts by mass or more and 85 parts by mass or less with respect to 100 parts by mass of the conductive powder.
  • the conductivity and dispersibility are excellent.
  • the content of the organic solvent is preferably 20% by mass or more and 50% by mass or less, and more preferably 25% by mass or more and 45% by mass or less with respect to the total amount of the conductive paste.
  • the conductivity and dispersibility are excellent.
  • the electrically conductive paste of this embodiment contains the acid type dispersing agent which has a branched hydrocarbon group.
  • the branched hydrocarbon group of the acid dispersant has one or more branched chains.
  • the acid dispersant preferably has a carboxyl group.
  • the reason is not limited, but the carboxyl group is adsorbed on the surface of the conductive powder, etc., neutralizing the surface potential, or inactivating the hydrogen bonding site, and the site other than the carboxyl group It is surmised that the specific three-dimensional structure as described above can effectively suppress aggregation of the conductive powder and the like, and can further improve the stability of the paste viscosity.
  • the acid dispersant may be a compound having an amide bond.
  • the acid dispersant preferably has a low molecular weight.
  • the low molecular weight acid-based dispersant refers to an acidic dispersant having a molecular weight of 500 or less, for example.
  • the lower limit of the molecular weight is preferably 100 or more, more preferably 200 or more.
  • the said dispersing agent may use 1 type and may use 2 or more types.
  • the hydrocarbon group in the acid-based dispersant may include one branched chain with respect to the main chain, or may include two or more branched chains.
  • the number of branched chains is preferably 1 or more and 3 or less. Further, the number of branched chains may be 4 or more.
  • the acid dispersant may be a mixture containing a plurality of acid dispersants having branched hydrocarbon groups having different branch positions.
  • the paste viscosity stability over time can be further improved.
  • the acid-based dispersant may be an acid-based dispersant having a complicated branched structure (for example, two or more branched chains).
  • a complicated branched structure for example, two or more branched chains.
  • Examples of the acid dispersant as described above include an acid dispersant represented by the following general formula (1).
  • R 1 represents a branched alkyl group having 10 to 20 carbon atoms (or a branched alkenyl group having 10 to 20 carbon atoms).
  • R 1 preferably has 15 to 20 carbon atoms, and more preferably 17 carbon atoms.
  • R 1 may be a branched alkyl group or a branched alkenyl group having a carbon double bond, and is preferably a branched alkyl group.
  • the presence or absence of a branched chain can be confirmed by, for example, the content of the methyl group (—CH 3 ) at the terminal of the hydrocarbon group calculated based on the 13 C-NMR or 1 H-NMR spectrum.
  • the acid dispersant represented by the general formula (1) is a mixture, or when the structure of R 1 in the general formula (1) is a complicated structure having a plurality of branches, There may be a case where a clear peak indicating the R 1 portion is not detected. Even in this case, a peak indicating a terminal methyl group (—CH 3 ) is clearly observed.
  • the content of the acid dispersant is preferably 0.5 parts by mass or more and 2 parts by mass or less with respect to 100 parts by mass of the conductive powder. Yes, more preferably 1 part by mass or more and 2 parts by mass or less.
  • the content of the acid dispersant is preferably small, and the upper limit of the content of the acid dispersant is, for example, 1 part by mass or less. , Preferably it can be 0.5 mass part or less.
  • the conductive paste of this embodiment for example, even when the acid-based dispersant is contained in an amount of 0.1 part by mass or more and 0.5 part by mass or less, the stability of the viscosity with time is sufficiently excellent.
  • the conductive paste may contain a dispersant other than the above acid-based dispersion, for example, an acid-based dispersant having a linear hydrocarbon group.
  • a dispersant other than the above-mentioned acid dispersion include acid dispersants such as higher fatty acids and polymer surfactants. These dispersants may be used alone or in combination of two or more.
  • the higher fatty acid may be an unsaturated carboxylic acid or a saturated carboxylic acid, and is not particularly limited.
  • stearic acid, oleic acid, myristic acid, palmitic acid, linoleic acid, lauric acid, linolenic acid and the like having 11 or more carbon atoms.
  • oleic acid or stearic acid is preferred.
  • alkyl monoamine salt types represented by monoalkylamine salts
  • alkyldiamine salt types represented by N-alkyl (C14 to C18) propylenediamine dioleate.
  • Alkyltrimethylammonium salt type represented by alkyltrimethylammonium chloride
  • Alkyldimethylbenzylammonium salt type represented by coconut alkyldimethylbenzylammonium chloride
  • Quaternary ammonium salt type represented by alkyl dipolyoxyethylenemethylammonium chloride
  • Alkylpyridinium salt type tertiary amine type typified by dimethylstearylamine
  • polyoxyethylene alkylamine type typified by polyoxypropylene / polyoxyethylene alkylamine
  • surfactants selected from oxyethylene addition forms of
  • alkyl monoamine salt type for example, oleoyl sarcosine, which is a compound of glycine and oleic acid, and an amide compound using a higher fatty acid such as stearic acid or lauric acid instead of oleic acid are preferable.
  • the dispersant may include a dispersant other than the acid-based dispersant.
  • examples of the dispersant other than the acid dispersion include a base dispersant, a nonionic dispersant, and an amphoteric dispersant. These dispersants may be used alone or in combination of two or more.
  • the base dispersant examples include aliphatic amines such as laurylamine, rosinamine, cetylamine, myristylamine and stearylamine.
  • the conductive paste contains the above acid-based dispersant having a branched hydrocarbon group and a base-based dispersion, the conductive paste is more excellent in dispersibility and superior in viscosity stability over time.
  • the base dispersant may be contained in an amount of, for example, 0.2 parts by mass or more and 2.5 parts by mass or less, preferably 0.2 parts by mass or more and 1 part by mass or less with respect to 100 parts by mass of the conductive powder. May be.
  • the base dispersant is contained in an amount of about 10 parts by mass to about 300 parts by mass, preferably 50 parts by mass or more and 150 parts by mass with respect to 100 parts by mass of the acid dispersant having the branched hydrocarbon group. be able to.
  • the base dispersion is contained in the above range, the viscosity stability over time of the paste is more excellent.
  • the dispersant other than the acid-based dispersant may be contained in an amount of, for example, 0.2 parts by mass or more and 2.5 parts by mass or less with respect to 100 parts by mass of the conductive powder. Further, the dispersant other than the acid dispersant can be contained in an amount of, for example, about 50 parts by mass or more and 300 parts by mass with respect to 100 parts by mass of the acid dispersant. Moreover, as a whole dispersing agent, it is preferable to contain 0.01 mass part or more and 3 mass parts or less with respect to 100 mass parts of electroconductive powder.
  • the organic solvent for the vehicle is preferably the same as the organic solvent for the paste for adjusting the viscosity of the conductive paste in order to improve the familiarity of the organic vehicle.
  • the content of the organic solvent for the vehicle is, for example, 5 parts by mass or more and 30 parts by mass or less with respect to 100 parts by mass of the conductive powder.
  • the content of the organic solvent for the conductive paste is preferably 10% by mass or more and 40% by mass or less with respect to the total amount of the conductive paste.
  • the conductive paste has a viscosity after standing for 60 days, for example, 70% or more and 130% or less, preferably 80% or more and 120% or less, assuming that the viscosity immediately after the production of the conductive paste is 100%. More preferably, they are 85% or more and 115% or less, More preferably, they are 90% or more and 110% or less.
  • the conductive paste can be suitably used for electronic parts such as multilayer ceramic capacitors.
  • the multilayer ceramic capacitor has a dielectric layer formed using a dielectric green sheet and an internal electrode layer formed using a conductive paste.
  • the dielectric ceramic powder contained in the dielectric green sheet and the ceramic powder contained in the conductive paste have the same composition.
  • the multilayer ceramic device manufactured using the conductive paste of the present embodiment even when the thickness of the dielectric green sheet is, for example, 3 ⁇ m or less, sheet attack and green sheet peeling failure are suppressed.
  • the multilayer ceramic capacitor 1 includes a multilayer body 10 and external electrodes 20 in which dielectric layers 12 and internal electrode layers 11 are alternately stacked.
  • an internal electrode layer 11 made of a conductive paste is formed on a dielectric layer 12 made of a ceramic green sheet by a printing method, and a plurality of dielectric layers having the internal electrode layer on the upper surface are laminated by pressure bonding.
  • the multilayer body 10 is fired and integrated to produce a multilayer ceramic fired body (not shown) that becomes a ceramic capacitor body.
  • the multilayer ceramic capacitor 1 is manufactured by forming a pair of external electrodes at both ends of the ceramic capacitor body. This will be described in more detail below.
  • a ceramic green sheet which is an unfired ceramic sheet.
  • this ceramic green sheet for example, a dielectric layer paste obtained by adding an organic binder such as polyvinyl butyral and a solvent such as terpineol to a predetermined ceramic raw material powder such as barium titanate, a PET film or the like. Examples thereof include a sheet formed on a support film and dried to remove the solvent.
  • the thickness of the dielectric layer made of the ceramic green sheet is not particularly limited, but is preferably 0.05 ⁇ m or more and 3 ⁇ m or less from the viewpoint of the demand for downsizing of the multilayer ceramic capacitor.
  • a plurality of sheets are prepared by printing and applying the above-described conductive paste on one surface of the ceramic green sheet by a known method such as a screen printing method to form the internal electrode layer 11 made of the conductive paste.
  • the thickness of the internal electrode layer 11 made of a conductive paste is preferably set to 1 ⁇ m or less after drying from the viewpoint of a request for thinning the internal electrode layer 11.
  • the ceramic green sheets were peeled off from the support film, and the dielectric layers 12 made of the ceramic green sheets and the internal electrode layers 11 made of the conductive paste formed on one surface thereof were laminated alternately. Then, the laminated body 10 is obtained by heating and pressurizing treatment. In addition, it is good also as a structure which further arrange
  • the organic binder in the green sheet is completely removed, and the ceramic raw material powder is fired to form the ceramic dielectric layer 12. Further, the organic vehicle in the internal electrode layer 11 is removed, and the nickel powder or the alloy powder containing nickel as a main component is sintered or melted and integrated to form an internal electrode.
  • the dielectric layer 12 and the internal electrode A multilayer ceramic fired body in which a plurality of layers 11 are alternately stacked is formed. In addition, annealing may be performed on the fired multilayer ceramic fired body from the viewpoint of taking oxygen into the dielectric layer to improve reliability and suppressing reoxidation of the internal electrode.
  • the multilayer ceramic capacitor 1 is manufactured by providing a pair of external electrodes 20 to the manufactured multilayer ceramic fired body.
  • the external electrode 20 includes an external electrode layer 21 and a plating layer 22.
  • the external electrode layer 21 is electrically connected to the internal electrode layer 11.
  • copper, nickel, or these alloys can be used conveniently, for example.
  • an electronic component other than the multilayer ceramic capacitor can be used.
  • Ceramic powder As the ceramic powder, barium titanate (BaTiO 3 ; particle size 0.06 ⁇ m) was used.
  • Binder resin Ethyl cellulose was used as the binder resin.
  • Table 1 shows the dispersant used.
  • FT-IR Fourier transform infrared spectroscopy
  • Example 1 For 100 parts by mass of Ni powder, which is a conductive powder, 5.3 parts by mass of ceramic powder, 0.1 parts by mass of acid dispersant A, 5 parts by mass of binder resin, and 49 parts by mass of organic solvent are mixed. Thus, a conductive paste was produced. The viscosity (60 days later) of the produced conductive paste was evaluated by the above method. The evaluation results of the amount of change in paste viscosity are shown in Table 2 together with the content of the acid dispersant with respect to 100 parts by mass of Ni powder.
  • Example 2 A conductive paste was prepared in the same manner as in Example 1 except that the content of the acid dispersant A was 0.5 parts by mass. The evaluation results of the amount of change in paste viscosity are shown in Table 2 together with the content of the acid dispersant with respect to 100 parts by mass of Ni powder.
  • Example 3 A conductive paste was prepared in the same manner as in Example 1 except that the content of the acid dispersant A was 1.0 part by mass.
  • Table 2 shows the characteristics of the dispersant used and the evaluation results of the amount of change in paste viscosity, together with the content of the acid dispersant with respect to 100 parts by mass of the Ni powder.
  • Example 5 A conductive paste was produced in the same manner as in Example 1 except that the content of the acid dispersant A was 2.0 parts by mass. The evaluation results of the amount of change in paste viscosity are shown in Table 2 together with the content of the acid dispersant with respect to 100 parts by mass of Ni powder.
  • Example 1 A conductive paste was prepared in the same manner as in Example 1, except that the acid dispersant was oleic acid (Table 1: No. 2, no hydrocarbon group branching). The evaluation results of the amount of change in paste viscosity are shown in Table 2 together with the content of the acid dispersant with respect to 100 parts by mass of Ni powder.
  • Comparative Examples 2 to 4 Comparative Example, except that the content of the acid dispersant (oleic acid) was 0.5 parts by mass (Comparative Example 2), 1 part by mass (Comparative Example 3), and 1.5 parts by mass (Comparative Example 4), respectively.
  • a conductive paste was prepared as in 1. The evaluation results of the amount of change in paste viscosity are shown in Table 2 together with the content of the acid dispersant with respect to 100 parts by mass of Ni powder.
  • Example 6 11.6 parts by mass of ceramic powder and 0.6 parts by mass of dispersant (0.2 parts by mass of acid-based dispersant A, base) with respect to 100 parts by mass of Ni powder (particle size: 0.3 ⁇ m) as conductive powder
  • a conductive paste was prepared by mixing 0.4 part by mass of a dispersant), 5 parts by mass of a binder resin, and 51 parts by mass of an organic solvent.
  • myristylamine was used as the basic dispersant (Table 1: No. 9).
  • the amount of change in viscosity (after 60 days) of the produced conductive paste was evaluated by the above method. The evaluation results of the paste viscosity are shown in Table 3 together with the particle size of the Ni powder and the contents of the dispersant and the ceramic powder.
  • content (mass part) in Table 3 shows the quantity with respect to 100 mass parts of Ni powder.
  • Example 7 A conductive paste was prepared in the same manner as in Example 6 except that the content of the acid dispersant A was 0.5 parts by mass.
  • the evaluation results of the paste viscosity are shown in Table 3 together with the particle size of the Ni powder and the contents of the dispersant and the ceramic powder.
  • content (mass part) in Table 3 shows the quantity with respect to 100 mass parts of Ni powder.
  • Example 8 A conductive paste was prepared in the same manner as in Example 6 except that the content of the acid dispersant A was 2.0 parts by mass.
  • the evaluation results of the paste viscosity are shown in Table 3 together with the particle size of the Ni powder and the contents of the dispersant and the ceramic powder.
  • content (mass part) in Table 3 shows the quantity with respect to 100 mass parts of Ni powder.
  • Example 9 A conductive paste was produced in the same manner as in Example 7 except that the content of the ceramic powder was 5.3 parts by mass.
  • the evaluation results of the paste viscosity are shown in Table 3 together with the particle size of the Ni powder and the contents of the dispersant and the ceramic powder.
  • content (mass part) in Table 3 shows the quantity with respect to 100 mass parts of Ni powder.
  • Example 10 Using Ni powder (particle size: 0.2 ⁇ m), the basic dispersant is myristylamine (Example 10), cetylamine (Example 11), stearylamine (Example 12), and the basic dispersant content is A conductive paste was produced in the same manner as in Example 9 except that the amount was 0.5 parts by weight.
  • the evaluation results of the paste viscosity are shown in Table 3 together with the particle size of the Ni powder and the contents of the dispersant and the ceramic powder.
  • content (mass part) in Table 3 shows the quantity with respect to 100 mass parts of Ni powder.
  • a conductive paste was prepared in the same manner as in Example 6 except that 0.3 parts by mass of oleic acid (Comparative Example 11) and 0.3 part by mass of stearic acid (Comparative Example 12) were used as the acid dispersant. .
  • the evaluation results of the paste viscosity are shown in Table 3 together with the particle size of the Ni powder and the contents of the dispersant and the ceramic powder.
  • content (mass part) in Table 3 shows the quantity with respect to 100 mass parts of Ni powder.
  • Example 14 A conductive paste was produced in the same manner as in Example 12 except that stearic acid was used as the acid dispersant.
  • the evaluation results of the paste viscosity are shown in Table 3 together with the particle size of the Ni powder and the contents of the dispersant and the ceramic powder.
  • content (mass part) in Table 3 shows the quantity with respect to 100 mass parts of Ni powder.
  • the conductive paste of the present invention is extremely excellent in viscosity stability over time, and is particularly suitable for use as a raw material for internal electrodes of multilayer ceramic capacitors that are chip parts of electronic devices such as mobile phones and digital devices. Can do.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

Provided is an electrically conductive paste, etc., which has exceptionally good adhesive strength. Provided is, inter alia, an electrically conductive paste containing an electrically conductive powder, a ceramic powder, a dispersant, a binder resin, and an organic solvent, wherein the dispersant includes an acid-based dispersant having a molecular weight of 500 or less, and the acid-based dispersant has a branched hydrocarbon group having at least one branched chain.

Description

導電性ペースト、電子部品及び積層セラミックコンデンサConductive paste, electronic components and multilayer ceramic capacitors

 本発明は、導電性ペースト、電子部品及び積層セラミックコンデンサに関する。 The present invention relates to a conductive paste, an electronic component, and a multilayer ceramic capacitor.

 携帯電話やデジタル機器などの電子機器の小型化および高性能化に伴い、積層セラミックコンデンサなどを含む電子部品についても小型化および高容量化が望まれている。積層セラミックコンデンサは、複数の誘電体層と複数の内部電極層とが交互に積層した構造を有し、これらの誘電体層及び内部電極層を薄膜化することにより、小型化及び高容量化を図ることができる。 As electronic devices such as mobile phones and digital devices become smaller and have higher performance, electronic components including multilayer ceramic capacitors are also required to be smaller and have higher capacities. Multilayer ceramic capacitors have a structure in which a plurality of dielectric layers and a plurality of internal electrode layers are alternately stacked. By reducing the thickness of these dielectric layers and internal electrode layers, the size and capacity can be reduced. Can be planned.

 積層セラミックコンデンサは、例えば、次のように製造される。まず、チタン酸バリウム(BaTiO)などの誘電体粉末及びバインダー樹脂を含有する誘電体グリーンシートの表面上に、導電性粉末、及びバインダー樹脂と有機溶剤などを含む内部電極用ペーストを、所定の電極パターンで印刷したものを、多層に積み重ねることにより、内部電極と誘電体グリーンシートとを多層に積み重ねた積層体を得る。次に、この積層体を加熱圧着して一体化し、圧着体を形成する。この圧着体を切断し、酸化性雰囲気または不活性雰囲気中にて脱有機バインダー処理を行った後、焼成を行い、焼成チップを得る。次いで、焼成チップの両端部に外部電極用ペーストを塗布し、焼成後、外部電極表面にニッケルメッキなどを施して、積層セラミックコンデンサが得られる。 The multilayer ceramic capacitor is manufactured, for example, as follows. First, on the surface of a dielectric green sheet containing a dielectric powder such as barium titanate (BaTiO 3 ) and a binder resin, an internal electrode paste containing a conductive powder, a binder resin, an organic solvent, etc. By stacking the layers printed with the electrode pattern in multiple layers, a laminate in which internal electrodes and dielectric green sheets are stacked in multiple layers is obtained. Next, this laminated body is integrated by thermocompression bonding to form a crimped body. The pressure-bonded body is cut and subjected to a deorganic binder treatment in an oxidizing atmosphere or an inert atmosphere, and then fired to obtain a fired chip. Next, an external electrode paste is applied to both ends of the fired chip, and after firing, the surface of the external electrode is subjected to nickel plating or the like to obtain a multilayer ceramic capacitor.

 内部電極層の形成に用いられる導電性ペーストは、経時的に粘度が増加しやすいという問題がある。このため、印刷当初は、所望粘度でセラミックグリーンシート上に所定厚みで形成することができるが、所定時間経過後には増粘し、印刷当初の印刷条件では同じ厚みを形成できない場合がある。 The conductive paste used for forming the internal electrode layer has a problem that the viscosity tends to increase with time. For this reason, at the beginning of printing, it can be formed on the ceramic green sheet with a desired viscosity with a predetermined thickness. However, after the predetermined time has elapsed, the viscosity increases, and the same thickness may not be formed under the initial printing conditions.

 そこで、導電性ペーストの経時的な粘度特性の改善の試みがなされている。例えば、導電性ペースト中のバインダー樹脂や有機溶剤の種類、配合割合等を選択することにより、粘度特性が向上することが報告されている。例えば、特許文献1では、バインダー樹脂として疎水性エチルヒドロキシエチルセルロース誘導体を含む有機ビヒクルと特定の有機溶剤を組み合わせることにより、シートアタックを生じさせず、経時変化の小さい導電性ペーストが記載されている。 Therefore, attempts have been made to improve the time-dependent viscosity characteristics of the conductive paste. For example, it has been reported that the viscosity characteristics are improved by selecting the kind of binder resin or organic solvent in the conductive paste, the blending ratio, and the like. For example, Patent Document 1 describes a conductive paste that does not cause sheet attack and has little change over time by combining an organic vehicle containing a hydrophobic ethylhydroxyethylcellulose derivative as a binder resin with a specific organic solvent.

 また、特許文献2では、ブチラール樹脂を含む厚さ5μm以下のセラミックグリーンシートと組み合わせて使用される条件下で、導電性粉末と、有機ビヒクルとを含み、前記有機ビヒクル中の溶剤が、ターピニルアセテートを主成分とする、経時的な粘度変化が少ない導電性ペーストが記載されている。 Further, in Patent Document 2, the conductive powder and the organic vehicle are contained under conditions used in combination with a ceramic green sheet having a thickness of 5 μm or less containing butyral resin, and the solvent in the organic vehicle A conductive paste containing nyl acetate as a main component and having little change in viscosity over time is described.

 一方、内部電極用に用いられる導電性ペーストは、導電性粉末などの分散性を向上させるために分散剤を含むことがある(例えば、特許文献3など)。近年の内部電極層の薄膜化に伴い、導電性粉末も小粒径化する傾向がある。導電性粉末の粒径が小さい場合、その粒子表面の比表面積が大きくなるため、導電性粉末(金属粉末)の表面活性が高くなり、分散性の低下や、粘度特性の低下が生じる場合がある。 On the other hand, the conductive paste used for the internal electrode may contain a dispersant in order to improve the dispersibility of the conductive powder or the like (for example, Patent Document 3). As the internal electrode layer becomes thinner in recent years, the conductive powder also tends to have a smaller particle size. When the particle size of the conductive powder is small, the specific surface area of the particle surface increases, so that the surface activity of the conductive powder (metal powder) is increased, which may result in a decrease in dispersibility and a decrease in viscosity characteristics. .

 例えば、特許文献4には、少なくとも金属成分と、酸化物と、分散剤と、バインダー樹脂とを含有する導電性ペーストであって、金属成分は、その表面組成が、特定の組成比を有するNi粉末であり、分散剤の酸点量は、500~2000μmol/gであり、バインダー樹脂の酸点量は、15~100μmol/gである導電性ペーストが、良好な分散性と粘度安定性を有することが記載されている。 For example, Patent Document 4 discloses a conductive paste containing at least a metal component, an oxide, a dispersant, and a binder resin, and the metal component has a surface composition of Ni having a specific composition ratio. The conductive paste is powder, the acid point amount of the dispersant is 500 to 2000 μmol / g, and the acid point amount of the binder resin is 15 to 100 μmol / g, and the conductive paste has good dispersibility and viscosity stability. It is described.

特開2011-159393号公報JP 2011-159393 A 特開2006-12690号公報JP 2006-12690 A 特開2012-77372号公報JP 2012-77372 A 特開2015-216244号公報JP-A-2015-216244

 上記特許文献1~4には、経時的粘度変化の少ない導電性ペーストが記載されている。しかしながら、導電性ペーストの経時的な増粘は、内部電極層の薄膜化に伴って、より問題が顕在化するため、近年の電極パターンの薄膜化に伴い、より粘度特性の改善された導電性ペーストが求められている。 Patent Documents 1 to 4 describe conductive pastes with little change in viscosity over time. However, as the thickening of the conductive paste over time becomes more problematic as the internal electrode layer becomes thinner, the conductive properties with improved viscosity characteristics have become available as the electrode pattern has become thinner in recent years. A paste is sought.

 本発明は、このような状況に鑑み、経時的な粘度変化が非常に少なく、粘度安定性により優れた導電性ペーストを提供することを目的とする。 In view of such circumstances, an object of the present invention is to provide a conductive paste that has very little change in viscosity over time and is superior in viscosity stability.

 本発明の第1の態様では、導電性粉末、セラミック粉末、分散剤、バインダー樹脂及び有機溶剤を含む導電性ペーストであって、分散剤は、分子量が500以下の酸系分散剤を含み、酸系分散剤は、分岐鎖を1つ以上有する分岐炭化水素基を有する、導電性ペーストが提供される。 In the first aspect of the present invention, a conductive paste containing conductive powder, ceramic powder, a dispersant, a binder resin and an organic solvent, the dispersant containing an acid-based dispersant having a molecular weight of 500 or less, an acid The conductive dispersant is provided with a conductive paste having a branched hydrocarbon group having one or more branched chains.

 酸系分散剤は、カルボキシル基を有する酸系分散剤であることが好ましい。酸系分散剤は、下記の一般式(1)で示されることが好ましい。 The acid dispersant is preferably an acid dispersant having a carboxyl group. The acid dispersant is preferably represented by the following general formula (1).

Figure JPOXMLDOC01-appb-C000002
 ただし、上記一般式(1)中、Rは、炭素数10以上20以下の分岐アルキル基又は炭素数10以上20以下の分岐アルケニル基である。
Figure JPOXMLDOC01-appb-C000002
However, in the general formula (1), R 1 is a branched alkyl or branched alkenyl group having 10 to 20 carbon atoms having 10 to 20 carbon atoms.

 また、酸系分散剤は、前記導電性粉末100質量部に対して、0.01質量部以上3質量部以下含有されることが好ましい。また、分散剤は、さらに塩基系分散剤を含むことが 好ましい。分散剤は、導電性粉末100質量部に対して、0.01質量部以上3質量部以 下含有されることが好ましい。導電性粉末は、Ni、Pd、Pt、Au、Ag、Cu及びこれらの合金から選ばれる少なくとも1種の金属粉末を含むことが好ましい。導電性粉末は、平均粒径が0.05μm以上1.0μm以下であることが好ましい。セラミック粉末は、ペロブスカイト型酸化物を含むことが好ましい。セラミック粉末は、平均粒径が0.01μm以上0.5μm以下であることが好ましい。バインダー樹脂は、セルロース系樹脂、アクリル系樹脂及びブチラール系樹脂のうち少なくとも1つを含むことが好ましい。導電性ペーストの製造直後の粘度を100%とした場合、60日間静置後の粘度が80%以上120%以下であることが好ましい。また、上記導電性ペーストは、積層セラミック部品の内部電極用であることが好ましい。 Further, the acid-based dispersant is preferably contained in an amount of 0.01 parts by mass or more and 3 parts by mass or less with respect to 100 parts by mass of the conductive powder. Further, it is preferable that the dispersant further contains a base dispersant. The dispersant is preferably contained in an amount of 0.01 parts by mass or more and 3 parts by mass or less with respect to 100 parts by mass of the conductive powder. The conductive powder preferably contains at least one metal powder selected from Ni, Pd, Pt, Au, Ag, Cu, and alloys thereof. The conductive powder preferably has an average particle size of 0.05 μm or more and 1.0 μm or less. The ceramic powder preferably contains a perovskite oxide. The ceramic powder preferably has an average particle size of 0.01 μm or more and 0.5 μm or less. The binder resin preferably contains at least one of a cellulose resin, an acrylic resin, and a butyral resin. When the viscosity immediately after production of the conductive paste is 100%, the viscosity after standing for 60 days is preferably 80% or more and 120% or less. Moreover, it is preferable that the said electrically conductive paste is for internal electrodes of a multilayer ceramic component.

 本発明の第2の態様では、上記導電性ペーストを用いて形成された電子部品が提供される。 In the second aspect of the present invention, an electronic component formed using the conductive paste is provided.

 本発明の第3の態様では、誘電体層と内部電極とを積層した積層体を少なくとも有し、前記内部電極は、上記導電性ペーストを用いて形成された、積層セラミックコンデンサが提供される。 In a third aspect of the present invention, there is provided a multilayer ceramic capacitor having at least a laminate in which a dielectric layer and an internal electrode are laminated, wherein the internal electrode is formed using the conductive paste.

 本発明の導電性ペーストは、経時的な粘度変化が非常に少なく、粘度安定性により優れる。また、本発明の導電性ペーストを用いて形成される積層セラミックコンデンサなどの電子部品の電極パターンは、薄膜化した電極を形成する際も導電性ペーストの印刷性に優れ、精度良く均一な幅及び厚みを有する。 The conductive paste of the present invention has very little change in viscosity over time and is excellent in viscosity stability. In addition, the electrode pattern of an electronic component such as a multilayer ceramic capacitor formed using the conductive paste of the present invention has excellent printability of the conductive paste even when forming a thinned electrode, and has a uniform width and a high accuracy. It has a thickness.

図1は、実施形態に係る積層セラミックコンデンサを示す斜視図及び断面図である。FIG. 1 is a perspective view and a cross-sectional view showing a multilayer ceramic capacitor according to an embodiment.

 本実施形態の導電性ペーストは、導電性粉末、セラミック粉末、分散剤、バインダー樹脂及び有機溶剤を含む。以下、各成分について詳細に説明する。 The conductive paste of this embodiment includes conductive powder, ceramic powder, a dispersant, a binder resin, and an organic solvent. Hereinafter, each component will be described in detail.

(導電性粉末)
 導電性粉末は、特に限定されず、例えば、Ni、Pd、Pt、Au、Ag、Cu、およびこれらの合金から選ばれる1種以上の粉末を用いることができる。これらの中でも、導電性、耐食性及びコストの観点から、Ni、またはその合金の粉末が好ましい。Ni合金としては、例えば、Mn、Cr、Co、Al、Fe、Cu、Zn、Ag、Au、PtおよびPdからなる群より選択される少なくとも1種以上の元素とNiとの合金を用いることができる。Ni合金におけるNiの含有量は、例えば、50質量%以上、好ましくは80質量%以上である。また、Ni粉末は、脱バインダー処理の際、バインダー樹脂の部分的な熱分解による急激なガス発生を抑制するために、数百ppm程度のSを含んでもよい。
(Conductive powder)
The conductive powder is not particularly limited, and for example, at least one powder selected from Ni, Pd, Pt, Au, Ag, Cu, and alloys thereof can be used. Among these, Ni or a powder of an alloy thereof is preferable from the viewpoint of conductivity, corrosion resistance, and cost. As the Ni alloy, for example, an alloy of Ni and at least one element selected from the group consisting of Mn, Cr, Co, Al, Fe, Cu, Zn, Ag, Au, Pt, and Pd is used. it can. The Ni content in the Ni alloy is, for example, 50% by mass or more, and preferably 80% by mass or more. Further, the Ni powder may contain about several hundred ppm of S in order to suppress rapid gas generation due to partial thermal decomposition of the binder resin during the debinding process.

 導電性粉末の平均粒径は、好ましくは0.05μm以上1.0μm以下であり、より好ましくは0.1μm以上0.5μm以下である。導電性粉末の平均粒径が上記範囲である場合、薄膜化した積層セラミックコンデンサの内部電極用ペーストとして好適に用いることができ、例えば、乾燥膜の平滑性及び乾燥膜密度が向上する。平均粒径は、走査型電子顕微鏡(SEM)による観察から求められる値であり、粒度分布における積算値50%の粒径をいう。 The average particle size of the conductive powder is preferably 0.05 μm or more and 1.0 μm or less, more preferably 0.1 μm or more and 0.5 μm or less. When the average particle diameter of the conductive powder is in the above range, it can be suitably used as a paste for an internal electrode of a thin-film laminated ceramic capacitor, and for example, the smoothness of the dry film and the dry film density are improved. The average particle diameter is a value obtained from observation with a scanning electron microscope (SEM), and refers to a particle diameter having an integrated value of 50% in the particle size distribution.

 導電性粉末の含有量は、導電性ペースト全量に対して、好ましくは30質量%以上70質量%以下であり、より好ましくは40質量%以上65質量%以下である。導電性粉末の含有量が上記範囲である場合、導電性及び分散性に優れる。 The content of the conductive powder is preferably 30% by mass to 70% by mass and more preferably 40% by mass to 65% by mass with respect to the total amount of the conductive paste. When content of electroconductive powder is the said range, it is excellent in electroconductivity and dispersibility.

(セラミック粉末)
 セラミック粉末としては、特に限定されず、例えば、積層セラミックコンデンサの内部電極用ペーストである場合、適用する積層セラミックコンデンサの種類により適宜、公知のセラミック粉末が選択される。セラミック粉末としては、例えば、Ba及びTiを含むペロブスカイト型酸化物が挙げられ、好ましくはチタン酸バリウム(BaTiO)である。なお、セラミック粉末は、1種類を用いてもよく、2種類以上を用いてもよい。
(Ceramic powder)
The ceramic powder is not particularly limited. For example, in the case of a paste for internal electrodes of a multilayer ceramic capacitor, a known ceramic powder is appropriately selected depending on the type of multilayer ceramic capacitor to be applied. Examples of the ceramic powder include perovskite oxides containing Ba and Ti, and preferably barium titanate (BaTiO 3 ). In addition, 1 type may be used for ceramic powder and 2 or more types may be used for it.

 セラミック粉末としては、チタン酸バリウムを主成分とし、酸化物を副成分として含むセラミック粉末を用いてもよい。酸化物としては、Mn、Cr、Si、Ca、Ba、Mg、V、W、Ta、Nbおよび希土類元素から選ばれる1種類以上からなる酸化物が挙げられる。 As the ceramic powder, ceramic powder containing barium titanate as a main component and oxide as a subcomponent may be used. Examples of the oxide include oxides composed of one or more selected from Mn, Cr, Si, Ca, Ba, Mg, V, W, Ta, Nb, and rare earth elements.

 また、セラミック粉末としては、例えば、チタン酸バリウム(BaTiO)のBa原子やTi原子を他の原子、例えば、Sn、Pb、Zrなどで置換したペロブスカイト型酸化物強誘電体のセラミック粉末を挙げることもできる。 Examples of the ceramic powder include a perovskite oxide ferroelectric ceramic powder in which Ba atoms and Ti atoms of barium titanate (BaTiO 3 ) are substituted with other atoms, for example, Sn, Pb, Zr, and the like. You can also

 内部電極用ペースト中のセラミック粉末としては、積層セラミックコンデンサのグリーンシートを構成する誘電体セラミック粉末と同一組成の粉末を用いてもよい。これにより、焼結工程における誘電体層と内部電極層との界面での収縮のミスマッチによるクラック発生が抑制される。このようなセラミック粉末としては、上記のBa及びTiを含むペロブスカイト型酸化物以外に、例えば、ZnO、フェライト、PZT、BaO、Al、Bi、R(希土類元素)、TiO、Ndなどの酸化物が挙げられる。 As the ceramic powder in the internal electrode paste, a powder having the same composition as that of the dielectric ceramic powder constituting the green sheet of the multilayer ceramic capacitor may be used. Thereby, the generation of cracks due to the shrinkage mismatch at the interface between the dielectric layer and the internal electrode layer in the sintering process is suppressed. Examples of such ceramic powder include, besides the perovskite oxide containing Ba and Ti, ZnO, ferrite, PZT, BaO, Al 2 O 3 , Bi 2 O 3 , R (rare earth element) 2 O 3. , TiO 2 , Nd 2 O 3 and other oxides.

 セラミック粉末の平均粒径は、例えば、0.01μm以上0.5μm以下であり、好ましくは0.01μm以上0.3μmの範囲以下である。セラミック粉末の平均粒径が上記範囲であることにより、内部電極用ペーストとして用いた場合、十分に細く薄い均一な内部電極を形成することができる。平均粒径は、走査型電子顕微鏡(SEM)による観察から求められる値であり、粒度分布における積算値50%の粒径をいう。 The average particle size of the ceramic powder is, for example, 0.01 μm or more and 0.5 μm or less, and preferably 0.01 μm or more and 0.3 μm or less. When the average particle diameter of the ceramic powder is within the above range, a sufficiently thin and thin uniform internal electrode can be formed when used as an internal electrode paste. The average particle diameter is a value obtained from observation with a scanning electron microscope (SEM), and refers to a particle diameter having an integrated value of 50% in the particle size distribution.

 セラミック粉末の含有量は、導電性粉末100質量部に対して、好ましくは1質量部以上30質量部以下であり、より好ましくは3質量部以上30質量部以下である。 The content of the ceramic powder is preferably 1 part by mass or more and 30 parts by mass or less, and more preferably 3 parts by mass or more and 30 parts by mass or less with respect to 100 parts by mass of the conductive powder.

 セラミック粉末の含有量は、導電性ペースト全量に対して、好ましくは1質量%以上20質量%以下であり、より好ましくは3質量%以上20質量%以下である。導電性粉末の含有量が上記範囲である場合、導電性及び分散性に優れる。 The content of the ceramic powder is preferably 1% by mass or more and 20% by mass or less, and more preferably 3% by mass or more and 20% by mass or less, with respect to the total amount of the conductive paste. When content of electroconductive powder is the said range, it is excellent in electroconductivity and dispersibility.

(バインダー樹脂)
 バインダー樹脂としては、特に限定されず、公知の樹脂を用いることができる。バインダー樹脂としては、例えば、メチルセルロース、エチルセルロース、エチルヒドロキシエチルセルロース、ニトロセルロースなどのセルロース系樹脂、アクリル系樹脂、ポリビニルブチラールなどのブチラール系樹脂などが挙げられる。中でも、溶剤への溶解性、燃焼分解性の観点などからエチルセルロースを含むことが好ましい。また、内部電極用ペーストとして用いる場合、グリーンシートとの接着強度を向上させる観点からブチラール樹脂を含む、又は、ブチラール樹脂単体で使用してもよい。バインダー樹脂は、1種類を用いてもよく、又は、2種類以上を用いてもよい。また、バインダー樹脂の分子量は、例えば、20000~200000程度である。
(Binder resin)
It does not specifically limit as binder resin, A well-known resin can be used. Examples of the binder resin include cellulose resins such as methyl cellulose, ethyl cellulose, ethyl hydroxyethyl cellulose, and nitrocellulose, butyral resins such as acrylic resins and polyvinyl butyral. Among these, it is preferable to contain ethyl cellulose from the viewpoints of solubility in a solvent and combustion decomposability. Moreover, when using as a paste for internal electrodes, you may use a butyral resin from a viewpoint of improving the adhesive strength with a green sheet, or you may use it by a butyral resin single-piece | unit. One type of binder resin may be used, or two or more types may be used. The molecular weight of the binder resin is, for example, about 20,000 to 200,000.

 バインダー樹脂の含有量は、導電性粉末100質量部に対して、好ましくは1質量部以上10質量部以下であり、より好ましくは1質量部以上8質量部以下である。 The content of the binder resin is preferably 1 part by mass or more and 10 parts by mass or less, and more preferably 1 part by mass or more and 8 parts by mass or less with respect to 100 parts by mass of the conductive powder.

 バインダー樹脂の含有量は、導電性ペースト全量に対して、好ましくは0.5質量%以上10質量%以下であり、より好ましくは1質量%以上6質量%以下である。バインダー樹脂の含有量が上記範囲である場合、導電性及び分散性に優れる。 The content of the binder resin is preferably 0.5% by mass or more and 10% by mass or less, and more preferably 1% by mass or more and 6% by mass or less with respect to the total amount of the conductive paste. When content of binder resin is the said range, it is excellent in electroconductivity and dispersibility.

(有機溶剤)
 有機溶剤としては、特に限定されず、上記バインダー樹脂を溶解することができる公知の有機溶剤を用いることができる。有機溶剤としては、例えば、ジヒドロターピニルアセテート、イソボルニルアセテート、イソボルニルプロピネート、イソボルニルブチレート、イソボルニルイソブチレート、エチレングリコールモノブチルエーテルアセテート、ジプロピレングリコールメチルエーテルアセテートなどのアセテート系溶剤、ターピネオール、ジヒドロターピネオールなどのテルペン系溶剤、トリデカン、ノナン、シクロヘキサンなどの飽和脂肪族炭化水素溶剤などが挙げられる。なお、有機溶剤は、1種類を用いてもよく、2種類以上を用いてもよい。
(Organic solvent)
It does not specifically limit as an organic solvent, The well-known organic solvent which can melt | dissolve the said binder resin can be used. Examples of organic solvents include dihydroterpinyl acetate, isobornyl acetate, isobornyl propionate, isobornyl butyrate, isobornyl isobutyrate, ethylene glycol monobutyl ether acetate, dipropylene glycol methyl ether acetate, and the like. And terpene solvents such as terpineol and dihydroterpineol, saturated aliphatic hydrocarbon solvents such as tridecane, nonane, and cyclohexane. In addition, the organic solvent may use 1 type and may use 2 or more types.

 有機溶剤は、例えば、ジヒドロターピニルアセテート、イソボルニルアセテート、イソボルニルプロピネート、イソボルニルブチレート及びイソボルニルイソブチレートから選ばれる少なくとも1種のアセテート系溶剤(A)を含んでもよい。これらの中でもイソボルニルアセテートがより好ましい。有機溶剤がアセテート系溶剤(A)を主成分として含む場合、アセテート系溶剤(A)は、有機溶剤全体に対して、好ましくは90質量%以上100質量%以下含有され、より好ましくは100質量%含有される。 The organic solvent includes, for example, at least one acetate solvent (A) selected from dihydroterpinyl acetate, isobornyl acetate, isobornyl propionate, isobornyl butyrate and isobornyl isobutyrate. But you can. Among these, isobornyl acetate is more preferable. When the organic solvent contains the acetate solvent (A) as a main component, the acetate solvent (A) is preferably contained in an amount of 90% by mass or more and 100% by mass or less, more preferably 100% by mass with respect to the entire organic solvent. Contained.

 また、有機溶剤は、例えば、上記のアセテート系溶剤(A)と、エチレングリコールモノブチルエーテルアセテート、ジプロピレングリコールメチルエーテルアセテートから選ばれる少なくとも1種のアセテート系溶剤(B)とを含んでもよい。このような混合溶剤を用いる場合、容易に導電性ペーストの粘度調整を行うことができ、導電性ペーストの乾燥スピードを速くすることができる。 The organic solvent may contain, for example, the above-mentioned acetate solvent (A) and at least one acetate solvent (B) selected from ethylene glycol monobutyl ether acetate and dipropylene glycol methyl ether acetate. When such a mixed solvent is used, the viscosity of the conductive paste can be easily adjusted, and the drying speed of the conductive paste can be increased.

 アセテート系溶剤(A)とアセテート系溶剤(B)とを含む混合液の場合、有機溶剤は、有機溶剤全体に対して、アセテート系溶剤(A)を好ましくは50質量%以上90質量%以下含有し、より好ましくは60質量%以上80質量%以下含有する。上記混合液の場合、有機溶剤は、有機溶剤全体100質量%に対して、アセテート系溶剤(B)を10質量%以上50質量%以下含有し、より好ましくは20%以上40質量%以下含有する。 In the case of a mixed solution containing an acetate solvent (A) and an acetate solvent (B), the organic solvent preferably contains 50 mass% or more and 90 mass% or less of the acetate solvent (A) with respect to the entire organic solvent. More preferably, the content is 60% by mass or more and 80% by mass or less. In the case of the above mixed liquid, the organic solvent contains 10% by mass to 50% by mass, more preferably 20% by mass to 40% by mass of the acetate solvent (B) with respect to 100% by mass of the whole organic solvent. .

 有機溶剤の含有量は、導電性粉末100質量部に対して、好ましくは40質量部以上90質量部以下であり、より好ましくは45質量部以上85質量部以下である。有機溶剤の含有量が上記範囲である場合、導電性及び分散性に優れる。 The content of the organic solvent is preferably 40 parts by mass or more and 90 parts by mass or less, and more preferably 45 parts by mass or more and 85 parts by mass or less with respect to 100 parts by mass of the conductive powder. When the content of the organic solvent is within the above range, the conductivity and dispersibility are excellent.

 有機溶剤の含有量は、導電性ペースト全量に対して、20質量%以上50質量%以下が好ましく、25質量%以上45質量%以下がより好ましい。有機溶剤の含有量が上記範囲である場合、導電性及び分散性に優れる。 The content of the organic solvent is preferably 20% by mass or more and 50% by mass or less, and more preferably 25% by mass or more and 45% by mass or less with respect to the total amount of the conductive paste. When the content of the organic solvent is within the above range, the conductivity and dispersibility are excellent.

(分散剤)
 本実施形態の導電性ペーストは、分岐炭化水素基を有する酸系分散剤を含む。この酸系分散剤の分岐炭化水素基は、分岐鎖を1つ以上有する。本発明者は、導電性ペーストに用いる分散剤について、種々の分散剤を検討した結果、分岐炭化水素基を有する酸系分散剤を含むことにより、その理由は不明であるが、導電性ペーストの経時的粘度変化が非常に抑制されることを見出した。
(Dispersant)
The electrically conductive paste of this embodiment contains the acid type dispersing agent which has a branched hydrocarbon group. The branched hydrocarbon group of the acid dispersant has one or more branched chains. As a result of examining various dispersants for the dispersant used in the conductive paste, the present inventor has included an acid-based dispersant having a branched hydrocarbon group. It has been found that the change in viscosity over time is greatly suppressed.

 また、酸系分散剤は、カルボキシル基を有することが好ましい。このような分散剤を用いることにより、理由は限定されないが、カルボキシル基が導電性粉末等の表面に吸着して、表面電位を中和、あるいは水素結合部位を不活性化し、カルボキシル基以外の部位の上記のような特定の立体構造が、効果的に導電性粉末等の凝集を抑制し、ペースト粘度の安定性をより向上させることができると推察される。また、この酸系分散剤は、アミド結合を有する化合物であってもよい。 Further, the acid dispersant preferably has a carboxyl group. By using such a dispersant, the reason is not limited, but the carboxyl group is adsorbed on the surface of the conductive powder, etc., neutralizing the surface potential, or inactivating the hydrogen bonding site, and the site other than the carboxyl group It is surmised that the specific three-dimensional structure as described above can effectively suppress aggregation of the conductive powder and the like, and can further improve the stability of the paste viscosity. The acid dispersant may be a compound having an amide bond.

 また、上記酸系分散剤は、低分子量であることが好ましい。ここで、低分子量の酸系分散剤とは、例えば、分子量が500以下である酸性を示す分散剤をいう。一方、分子量の下限は、好ましくは100以上であり、より好ましくは200以上である。なお、上記分散剤は、1種類を用いてもよく、2種類以上を用いてもよい。 In addition, the acid dispersant preferably has a low molecular weight. Here, the low molecular weight acid-based dispersant refers to an acidic dispersant having a molecular weight of 500 or less, for example. On the other hand, the lower limit of the molecular weight is preferably 100 or more, more preferably 200 or more. In addition, the said dispersing agent may use 1 type and may use 2 or more types.

 例えば、酸系分散剤中の炭化水素基は、主鎖に対して1つの分岐鎖を含んでもよいし、2以上の分岐鎖を含んでもよい。分岐鎖の数は、好ましくは1以上3以下である。また、分岐鎖の数は、4以上であってもよい。 For example, the hydrocarbon group in the acid-based dispersant may include one branched chain with respect to the main chain, or may include two or more branched chains. The number of branched chains is preferably 1 or more and 3 or less. Further, the number of branched chains may be 4 or more.

 酸系分散剤は、分岐の位置が異なる分岐炭化水素基を有する複数の酸系分散剤を含む混合物であってもよい。複数の酸系分散剤を含む混合物である場合、経時的なペースト粘度安定性をより向上させることができる。 The acid dispersant may be a mixture containing a plurality of acid dispersants having branched hydrocarbon groups having different branch positions. In the case of a mixture containing a plurality of acid dispersants, the paste viscosity stability over time can be further improved.

 また、酸系分散剤は、複雑な分岐構造(例えば、分岐鎖が2以上)を有する酸系分散剤であってもよい。このような複雑な分岐構造を有する酸系分散剤である場合、経時的なペースト粘度安定性をより向上させることができる。 Further, the acid-based dispersant may be an acid-based dispersant having a complicated branched structure (for example, two or more branched chains). In the case of an acid-based dispersant having such a complicated branched structure, the paste viscosity stability over time can be further improved.

 上記のような酸系分散剤として、例えば、下記の一般式(1)で示される酸系分散剤が挙げられる。 Examples of the acid dispersant as described above include an acid dispersant represented by the following general formula (1).

Figure JPOXMLDOC01-appb-C000003
Figure JPOXMLDOC01-appb-C000003

 上記、一般式(1)中、Rは、炭素数10以上20以下の分岐アルキル基(又は炭素数10以上20以下の分岐アルケニル基)を示す。Rは、好ましくは、炭素数15以上20以下であり、より好ましくは炭素数が17である。また、Rは、分岐アルキル基でもよく、炭素の二重結合を有する分岐アルケニル基であってもよく、好ましくは分岐アルキル基である。 In the above general formula (1), R 1 represents a branched alkyl group having 10 to 20 carbon atoms (or a branched alkenyl group having 10 to 20 carbon atoms). R 1 preferably has 15 to 20 carbon atoms, and more preferably 17 carbon atoms. R 1 may be a branched alkyl group or a branched alkenyl group having a carbon double bond, and is preferably a branched alkyl group.

 なお、分岐鎖の有無は、例えば、13C-NMR又はH-NMRのスペクトルに基づいて計算される炭化水素基の末端のメチル基(-CH)の含有割合により確認できる。なお、例えば、上記一般式(1)で示される酸系分散剤が混合物である場合や、一般式(1)中のRの構造が複数の分岐を有する複雑な構造である場合などでは、R部分を示す明確なピークが検出されない場合があってもよい。この場合においても、末端のメチル基(-CH)を示すピークは明確に観察される。 The presence or absence of a branched chain can be confirmed by, for example, the content of the methyl group (—CH 3 ) at the terminal of the hydrocarbon group calculated based on the 13 C-NMR or 1 H-NMR spectrum. For example, when the acid dispersant represented by the general formula (1) is a mixture, or when the structure of R 1 in the general formula (1) is a complicated structure having a plurality of branches, There may be a case where a clear peak indicating the R 1 portion is not detected. Even in this case, a peak indicating a terminal methyl group (—CH 3 ) is clearly observed.

 上記の酸系分散剤は、導電性粉末100質量部に対して、好ましくは0.01質量部以上3質量部以下含有され、より好ましくは、0.05質量部以上2質量部以下含有され、さらに好ましくは0.05質量部以上1質量部以下含有される。酸系分散剤の含有量が上記範囲である場合、導電性ペースト中の導電性粉末の分散性、及び導電性ペーストの経時的粘度の安定性に優れる。 The acid-based dispersant is preferably contained in an amount of 0.01 to 3 parts by weight, more preferably 0.05 to 2 parts by weight, with respect to 100 parts by weight of the conductive powder. More preferably 0.05 to 1 part by mass is contained. When the content of the acid dispersant is in the above range, the dispersibility of the conductive powder in the conductive paste and the stability of the viscosity of the conductive paste over time are excellent.

 特に、経時的粘度の安定性をより向上させるという観点からは、上記酸系分散剤の含有量は、導電性粉末100質量部に対して、好ましくは0.5質量部以上2質量部以下であり、より好ましくは1質量部以上2質量部以下である。また、導電性の向上や、シートアタックを抑制するという観点からは、上記酸系分散剤の含有量は少ない方が好ましく、上記酸系分散剤の含有量の上限は、例えば、1質量部以下、好ましくは0.5質量部以下とすることができる。本実施形態の導電性ペーストでは、例えば、上記酸系分散剤を0.1質量部以上0.5質量部以下含む場合においても、経時的粘度の安定性に十分優れる。 In particular, from the viewpoint of further improving the stability of the viscosity over time, the content of the acid dispersant is preferably 0.5 parts by mass or more and 2 parts by mass or less with respect to 100 parts by mass of the conductive powder. Yes, more preferably 1 part by mass or more and 2 parts by mass or less. Further, from the viewpoint of improving conductivity and suppressing sheet attack, the content of the acid dispersant is preferably small, and the upper limit of the content of the acid dispersant is, for example, 1 part by mass or less. , Preferably it can be 0.5 mass part or less. In the conductive paste of this embodiment, for example, even when the acid-based dispersant is contained in an amount of 0.1 part by mass or more and 0.5 part by mass or less, the stability of the viscosity with time is sufficiently excellent.

 上記の酸系分散剤は、導電性ペースト全体に対して、例えば、3質量%以下含有される。上記の酸系分散剤の含有量の上限は、好ましく2質量%以下であり、より好ましくは1.5質量%以下であり、さらに好ましくは1質量%以下である。酸系分散剤の含有量の下限は、特に限定されないが、例えば、0.01質量%以上であり、好ましくは0.05質量%以上である。酸系分散剤の含有量が上記範囲である場合、経時的粘度変化がより安定して抑制される。また、有機溶剤の中には、バインダー樹脂と組み合わせて用いたとき、シートアタックやグリーンシート剥離不良を生じさせるものもあるが、上記の酸系分散剤を特定量含有することで、これらの問題を抑制できる。 The above acid dispersant is contained, for example, in an amount of 3% by mass or less with respect to the entire conductive paste. The upper limit of the content of the acid-based dispersant is preferably 2% by mass or less, more preferably 1.5% by mass or less, and further preferably 1% by mass or less. Although the minimum of content of an acid type dispersing agent is not specifically limited, For example, it is 0.01 mass% or more, Preferably it is 0.05 mass% or more. When the content of the acid dispersant is in the above range, the change in viscosity with time is more stably suppressed. In addition, some organic solvents, when used in combination with a binder resin, cause sheet attack and green sheet peeling failure, but these problems are caused by containing a specific amount of the above-mentioned acid-based dispersant. Can be suppressed.

 上記の酸系分散剤は、例えば、市販の製品から、上記特性を満たすものを選択して用いることができる。また、酸系分散剤は、従来公知の製造方法を用いて、上記特性を満たすように製造してもよい。 The above-mentioned acid-based dispersant can be selected from, for example, commercially available products that satisfy the above characteristics. Moreover, you may manufacture an acid type dispersing agent so that the said characteristic may be satisfy | filled using a conventionally well-known manufacturing method.

 導電性ペーストは、上記の酸系分散以外の分散剤を含んでもよく、例えば、直鎖の炭化水素基を有する酸系分散剤を含んでもよい。このような上記の酸系分散以外の酸系分散剤としては、例えば、高級脂肪酸や高分子界面活性剤等の酸系分散剤などが挙げられる。これらの分散剤は、1種または2種以上組み合わせて用いてもよい。 The conductive paste may contain a dispersant other than the above acid-based dispersion, for example, an acid-based dispersant having a linear hydrocarbon group. Examples of the acid dispersant other than the above-mentioned acid dispersion include acid dispersants such as higher fatty acids and polymer surfactants. These dispersants may be used alone or in combination of two or more.

 高級脂肪酸としては、不飽和カルボン酸でも飽和カルボン酸でもよく、特に限定されるものではないが、ステアリン酸、オレイン酸、ミリスチン酸、パルミチン酸、リノール酸、ラウリン酸、リノレン酸など炭素数11以上のものが挙げられる。中でもオレイン酸、またはステアリン酸が好ましい。 The higher fatty acid may be an unsaturated carboxylic acid or a saturated carboxylic acid, and is not particularly limited. However, stearic acid, oleic acid, myristic acid, palmitic acid, linoleic acid, lauric acid, linolenic acid and the like having 11 or more carbon atoms. Can be mentioned. Of these, oleic acid or stearic acid is preferred.

 それ以外の酸系分散剤としては、特に限定されず、モノアルキルアミン塩に代表されるアルキルモノアミン塩型、N-アルキル(C14~C18)プロピレンジアミンジオレイン酸塩に代表されるアルキルジアミン塩型、アルキルトリメチルアンモニウムクロライドに代表されるアルキルトリメチルアンモニウム塩型、ヤシアルキルジメチルベンジルアンモニウムクロライドに代表されるアルキルジメチルベンジルアンモニウム塩型、アルキル・ジポリオキシエチレンメチルアンモニウムクロライドに代表される4級アンモニウム塩型、アルキルピリジニウム塩型、ジメチルステアリルアミンに代表される3級アミン型、ポリオキシプロピレン・ポリオキシエチレンアルキルアミンに代表されるポリオキシエチレンアルキルアミン型、N、N’、N’-トリス(2-ヒドロキシエチル)-N-アルキル(C14~18)1,3-ジアミノプロパンに代表されるジアミンのオキシエチレン付加型から選択される界面活性剤が挙げられ、これらの中でもアルキルモノアミン塩型が好ましい。 Other acid dispersants are not particularly limited, and are alkyl monoamine salt types represented by monoalkylamine salts, alkyldiamine salt types represented by N-alkyl (C14 to C18) propylenediamine dioleate. Alkyltrimethylammonium salt type represented by alkyltrimethylammonium chloride, Alkyldimethylbenzylammonium salt type represented by coconut alkyldimethylbenzylammonium chloride, Quaternary ammonium salt type represented by alkyl dipolyoxyethylenemethylammonium chloride , Alkylpyridinium salt type, tertiary amine type typified by dimethylstearylamine, polyoxyethylene alkylamine type typified by polyoxypropylene / polyoxyethylene alkylamine, N, ', N'-tris (2-hydroxyethyl) -N-alkyl (C14-18) 1,3-diaminopropane, and other surfactants selected from oxyethylene addition forms of diamines, Of these, the alkyl monoamine salt type is preferred.

 アルキルモノアミン塩型としては、例えば、グリシンとオレイン酸の化合物であるオレオイルザルコシンや、オレイン酸の代わりにステアリン酸あるいはラウリン酸などの高級脂肪酸を用いたアミド化合物が好ましい。 As the alkyl monoamine salt type, for example, oleoyl sarcosine, which is a compound of glycine and oleic acid, and an amide compound using a higher fatty acid such as stearic acid or lauric acid instead of oleic acid are preferable.

 また、分散剤は、酸系分散剤以外の分散剤を含んでもよい。酸系分散以外の分散剤としては、塩基系分散剤、非イオン系分散剤、両性分散剤などが挙げられる。これらの分散剤は、1種または2種以上組み合わせて用いてもよい。 Further, the dispersant may include a dispersant other than the acid-based dispersant. Examples of the dispersant other than the acid dispersion include a base dispersant, a nonionic dispersant, and an amphoteric dispersant. These dispersants may be used alone or in combination of two or more.

 塩基系分散剤としては、例えば、ラウリルアミン、ロジンアミン、セチルアミン、ミリスチルアミン、ステアリルアミンなどの脂肪族アミンなどが挙げられる。導電性ペーストは、上記の分岐炭化水素基を有する酸系分散剤と塩基系分散とを含有する場合、より分散性に優れ、経時的な粘度安定性にも優れる。 Examples of the base dispersant include aliphatic amines such as laurylamine, rosinamine, cetylamine, myristylamine and stearylamine. When the conductive paste contains the above acid-based dispersant having a branched hydrocarbon group and a base-based dispersion, the conductive paste is more excellent in dispersibility and superior in viscosity stability over time.

 塩基系分散剤は、例えば、導電性粉末100質量部に対して、0.2質量部以上2.5質量部以下含有されてもよく、好ましくは0.2質量部以上1質量部以下含有されてもよい。また、塩基系分散剤は、例えば、上記の分岐炭化水素基を有する酸系分散剤100質量部に対して、10質量部以上300質量部程度、好ましくは50質量部以上150質量部含有されることができる。塩基系分散を上記範囲で含有する場合、ペーストの経時的な粘度安定性により優れる。 The base dispersant may be contained in an amount of, for example, 0.2 parts by mass or more and 2.5 parts by mass or less, preferably 0.2 parts by mass or more and 1 part by mass or less with respect to 100 parts by mass of the conductive powder. May be. The base dispersant is contained in an amount of about 10 parts by mass to about 300 parts by mass, preferably 50 parts by mass or more and 150 parts by mass with respect to 100 parts by mass of the acid dispersant having the branched hydrocarbon group. be able to. When the base dispersion is contained in the above range, the viscosity stability over time of the paste is more excellent.

 塩基系分散剤は、例えば、導電性ペースト全体に対して、0質量%以上2.5質量%以下含有され、好ましくは0質量%以上1.0質量%以下、より好ましくは0.1質量%以上1.0質量%以下含有され、より好ましくは0.1質量%以上0.8質量%以下含有される。塩基系分散を上記範囲で含有する場合、ペーストの経時的な粘度安定性により優れる。 The base dispersant is contained, for example, in an amount of 0% by mass to 2.5% by mass, preferably 0% by mass to 1.0% by mass, and more preferably 0.1% by mass with respect to the entire conductive paste. It is contained in an amount of 1.0% by mass or less, more preferably 0.1% by mass or more and 0.8% by mass or less. When the base dispersion is contained in the above range, the viscosity stability over time of the paste is more excellent.

 上記酸系分散剤以外の分散剤は、例えば、導電性粉末100質量部に対して、0.2質量部以上2.5質量部以下含有されてもよい。また、上記酸系分散剤以外の分散剤は、例えば、酸系分散剤100質量部に対して、50質量部以上300質量部程度含有されることができる。また、分散剤全体としては、導電性粉末100質量部に対して、0.01質量部以上3質量部以下含有されることが好ましい。 The dispersant other than the acid-based dispersant may be contained in an amount of, for example, 0.2 parts by mass or more and 2.5 parts by mass or less with respect to 100 parts by mass of the conductive powder. Further, the dispersant other than the acid dispersant can be contained in an amount of, for example, about 50 parts by mass or more and 300 parts by mass with respect to 100 parts by mass of the acid dispersant. Moreover, as a whole dispersing agent, it is preferable to contain 0.01 mass part or more and 3 mass parts or less with respect to 100 mass parts of electroconductive powder.

 上記酸系分散剤以外の分散剤は、例えば、導電性ペースト全体に対して、0質量%以上2.5質量%以下含有され、好ましくは0質量%以上1.0質量%以下、より好ましくは0.1質量%以上1.0質量%以下含有され、より好ましくは0.1質量%以上0.8質量%以下含有される。酸系分散剤以外の分散剤が、1.0重量%を越えると、導電性ペーストの乾燥性が悪化するだけでなく、シートアタックの面でも好ましくない。 The dispersant other than the acid-based dispersant is, for example, contained in an amount of 0% by mass or more and 2.5% by mass or less, preferably 0% by mass or more and 1.0% by mass or less, more preferably, based on the entire conductive paste. It is contained in an amount of 0.1% by mass or more and 1.0% by mass or less, more preferably 0.1% by mass or more and 0.8% by mass or less. When the dispersant other than the acid dispersant exceeds 1.0% by weight, not only the drying property of the conductive paste is deteriorated but also the sheet attack is not preferable.

(導電性ペースト)
 本実施形態の導電性ペーストは、上記の各成分を用意し、ミキサーで攪拌・混練することにより製造することができる。その際、導電性粉末表面に予め分散剤を塗布すると、導電性粉末が凝集することなく十分にほぐれて、その表面に分散剤が行きわたるようになり、均一な導電性ペーストを得やすい。また、バインダー樹脂をビヒクル用の有機溶剤に溶解させ、有機ビヒクルを作製し、ペースト用の有機溶剤へ、導電性粉末、セラミック粉末、有機ビヒクル及び分散剤を添加し、ミキサーで攪拌・混練し、導電性ペーストを作製してもよい。
(Conductive paste)
The electrically conductive paste of this embodiment can be manufactured by preparing each said component, stirring and kneading with a mixer. At that time, if a dispersant is applied to the surface of the conductive powder in advance, the conductive powder is sufficiently loosened without agglomeration, and the dispersant is spread over the surface, so that a uniform conductive paste is easily obtained. In addition, the binder resin is dissolved in an organic solvent for the vehicle to prepare an organic vehicle, and the conductive powder, the ceramic powder, the organic vehicle, and the dispersant are added to the organic solvent for the paste, and the mixture is stirred and kneaded with a mixer. A conductive paste may be produced.

 また、有機溶剤中、ビヒクル用の有機溶剤としては、有機ビヒクルの馴染みをよくするため、導電性ペーストの粘度を調整するペースト用の有機溶剤と同じものを用いることが好ましい。ビヒクル用の有機溶剤の含有量は、導電性粉末100質量部に対して、例えば、5質量部以上30質量部以下である。また、導電性ペースト用の有機溶剤の含有量は、導電性ペースト全体量に対して、好ましくは10質量%以上40質量%以下である。 In the organic solvent, the organic solvent for the vehicle is preferably the same as the organic solvent for the paste for adjusting the viscosity of the conductive paste in order to improve the familiarity of the organic vehicle. The content of the organic solvent for the vehicle is, for example, 5 parts by mass or more and 30 parts by mass or less with respect to 100 parts by mass of the conductive powder. The content of the organic solvent for the conductive paste is preferably 10% by mass or more and 40% by mass or less with respect to the total amount of the conductive paste.

 導電性ペーストは、下記式で求められる60日間静置後の粘度が、例えば、0%以上30%以下であり、好ましくは25%以下であり、さらに好ましくは20%以下である。
  式:[60日間静置後の粘度-製造直後の粘度)/製造直後の粘度]×100)
The conductive paste has a viscosity after standing for 60 days determined by the following formula, for example, from 0% to 30%, preferably 25% or less, and more preferably 20% or less.
Formula: [viscosity after standing for 60 days−viscosity immediately after production) / viscosity immediately after production] × 100)

 また、導電性ペーストは、導電性ペーストの製造直後の粘度を100%とした場合、60日間静置後の粘度が、例えば、70%以上130%以下であり、好ましくは80%以上120%以下であり、より好ましくは85%以上115%以下であり、さらに好ましくは90%以上110%以下である。 The conductive paste has a viscosity after standing for 60 days, for example, 70% or more and 130% or less, preferably 80% or more and 120% or less, assuming that the viscosity immediately after the production of the conductive paste is 100%. More preferably, they are 85% or more and 115% or less, More preferably, they are 90% or more and 110% or less.

 導電性ペーストは、積層セラミックコンデンサなどの電子部品に好適に用いることができる。積層セラミックコンデンサは、誘電体グリーンシートを用いて形成される誘電体層及び導電性ペーストを用いて形成される内部電極層を有する。 The conductive paste can be suitably used for electronic parts such as multilayer ceramic capacitors. The multilayer ceramic capacitor has a dielectric layer formed using a dielectric green sheet and an internal electrode layer formed using a conductive paste.

 積層セラミックコンデンサは、誘電体グリーンシートに含まれる誘電体セラミック粉末と導電性ペーストに含まれるセラミック粉末とが同一組成の粉末であることが好ましい。本実施形態の導電性ペーストを用いて製造される積層セラミックデバイスは、誘電体グリーンシートの厚さが、例えば3μm以下である場合でも、シートアタックやグリーンシートの剥離不良が抑制される。 In the multilayer ceramic capacitor, it is preferable that the dielectric ceramic powder contained in the dielectric green sheet and the ceramic powder contained in the conductive paste have the same composition. In the multilayer ceramic device manufactured using the conductive paste of the present embodiment, even when the thickness of the dielectric green sheet is, for example, 3 μm or less, sheet attack and green sheet peeling failure are suppressed.

[電子部品]
 以下、本発明の電子部品等の実施形態について、図面を参照しながら説明する。図面においては、適宜、模式的に表現することや、縮尺を変更して表現することがある。また、部材の位置や方向などを、適宜、図1などに示すXYZ直交座標系を参照して説明する。このXYZ直交座標系において、X方向およびY方向は水平方向であり、Z方向は鉛直方向(上下方向)である。
[Electronic parts]
Hereinafter, embodiments of an electronic component and the like of the present invention will be described with reference to the drawings. In the drawings, they may be schematically expressed as appropriate, or may be expressed by changing the scale. Further, the positions and directions of the members will be described with reference to an XYZ orthogonal coordinate system shown in FIG. In this XYZ orthogonal coordinate system, the X direction and the Y direction are horizontal directions, and the Z direction is a vertical direction (up and down direction).

 図1A及びBは、実施形態に係る電子部品の一例である、積層セラミックコンデンサ1を示す図である。積層セラミックコンデンサ1は、誘電体層12及び内部電極層11を交互に積層した積層体10と外部電極20とを備える。 1A and 1B are diagrams showing a multilayer ceramic capacitor 1 which is an example of an electronic component according to an embodiment. The multilayer ceramic capacitor 1 includes a multilayer body 10 and external electrodes 20 in which dielectric layers 12 and internal electrode layers 11 are alternately stacked.

 以下、上記導電性ペーストを使用した積層セラミックコンデンサの製造方法について説明する。まず、セラミックグリーンシートからなる誘電体層12上に、導電性ペーストからなる内部電極層11を印刷法により形成し、この内部電極層を上面に有する複数の誘電体層を、圧着により積層させて積層体10を得た後、積層体10を焼成して一体化することにより、セラミックコンデンサ本体となる積層セラミック焼成体(不図示)を作製する。その後、当該セラミックコンデンサ本体の両端部に一対の外部電極を形成することにより積層セラミックコンデンサ1が製造される。以下に、より詳細に説明する。 Hereinafter, a method for manufacturing a multilayer ceramic capacitor using the conductive paste will be described. First, an internal electrode layer 11 made of a conductive paste is formed on a dielectric layer 12 made of a ceramic green sheet by a printing method, and a plurality of dielectric layers having the internal electrode layer on the upper surface are laminated by pressure bonding. After obtaining the multilayer body 10, the multilayer body 10 is fired and integrated to produce a multilayer ceramic fired body (not shown) that becomes a ceramic capacitor body. Thereafter, the multilayer ceramic capacitor 1 is manufactured by forming a pair of external electrodes at both ends of the ceramic capacitor body. This will be described in more detail below.

 まず、未焼成のセラミックシートであるセラミックグリーンシートを用意する。このセラミックグリーンシートとしては、例えば、チタン酸バリウム等の所定のセラミックの原料粉末に、ポリビニルブチラール等の有機バインダーとターピネオール等の溶剤とを加えて得た誘電体層用ペーストを、PETフィルム等の支持フィルム上にシート状に塗布し、乾燥させて溶剤を除去したもの等が挙げられる。なお、セラミックグリーンシートからなる誘電体層の厚みは、特に限定されないが、積層セラミックコンデンサの小型化の要請の観点から、0.05μm以上3μm以下が好ましい。 First, prepare a ceramic green sheet, which is an unfired ceramic sheet. As this ceramic green sheet, for example, a dielectric layer paste obtained by adding an organic binder such as polyvinyl butyral and a solvent such as terpineol to a predetermined ceramic raw material powder such as barium titanate, a PET film or the like. Examples thereof include a sheet formed on a support film and dried to remove the solvent. The thickness of the dielectric layer made of the ceramic green sheet is not particularly limited, but is preferably 0.05 μm or more and 3 μm or less from the viewpoint of the demand for downsizing of the multilayer ceramic capacitor.

 次いで、このセラミックグリーンシートの片面に、スクリーン印刷法等の公知の方法によって、上述の導電性ペーストを印刷して塗布し、導電性ペーストからなる内部電極層11を形成したものを複数枚、用意する。なお、導電性ペーストからなる内部電極層11の厚みは、当該内部電極層11の薄層化の要請の観点から、乾燥後1μm以下とすることが好ましい。 Next, a plurality of sheets are prepared by printing and applying the above-described conductive paste on one surface of the ceramic green sheet by a known method such as a screen printing method to form the internal electrode layer 11 made of the conductive paste. To do. The thickness of the internal electrode layer 11 made of a conductive paste is preferably set to 1 μm or less after drying from the viewpoint of a request for thinning the internal electrode layer 11.

 次いで、支持フィルムから、セラミックグリーンシートを剥離するとともに、セラミックグリーンシートからなる誘電体層12とその片面に形成された導電性ペーストからなる内部電極層11とが交互に配置されるように積層した後、加熱・加圧処理により積層体10を得る。なお、積層体10の両面に、導電性ペーストを塗布していない保護用のセラミックグリーンシートを更に配置する構成としても良い。 Next, the ceramic green sheets were peeled off from the support film, and the dielectric layers 12 made of the ceramic green sheets and the internal electrode layers 11 made of the conductive paste formed on one surface thereof were laminated alternately. Then, the laminated body 10 is obtained by heating and pressurizing treatment. In addition, it is good also as a structure which further arrange | positions the ceramic green sheet for protection which has not apply | coated the electrically conductive paste on both surfaces of the laminated body 10. FIG.

 次いで、積層体を所定サイズに切断してグリーンチップを形成した後、当該グリーンチップに対して脱バインダー処理を施し、還元雰囲気下において焼成することにより、積層セラミック焼成体を製造する。なお、脱バインダー処理における雰囲気は、大気またはNガス雰囲気にすることが好ましい。脱バインダー処理を行う際の温度は、例えば200℃以上400℃以下である。また、脱バインダー処理を行う際の、上記温度の保持時間を0.5時間以上24時間以下とすることが好ましい。また、焼成は、内部電極層に用いる金属の酸化を抑制するために還元雰囲気で行われ、また、積層体の焼成を行う際の温度は、例えば、1000℃以上1350℃以下であり、焼成を行う際の、温度の保持時間は、例えば、0.5時間以上8時間以下である。 Next, after the laminated body is cut to a predetermined size to form a green chip, the green chip is subjected to a binder removal treatment and fired in a reducing atmosphere to produce a laminated ceramic fired body. The atmosphere in the debinding process is preferably air or N 2 gas atmosphere. The temperature at which the binder removal treatment is performed is, for example, 200 ° C. or higher and 400 ° C. or lower. Moreover, it is preferable that the holding time of the said temperature at the time of performing a binder removal process shall be 0.5 hours or more and 24 hours or less. The firing is performed in a reducing atmosphere in order to suppress oxidation of the metal used for the internal electrode layer, and the temperature when firing the laminate is, for example, 1000 ° C. or higher and 1350 ° C. or lower. The holding time of the temperature at the time of performing is 0.5 hour or more and 8 hours or less, for example.

 グリーンチップの焼成を行うことにより、グリーンシート中の有機バインダーが完全に除去されるとともに、セラミックの原料粉末が焼成されて、セラッミック製の誘電体層12が形成される。また内部電極層11中の有機ビヒクルが除去されるとともに、ニッケル粉末またはニッケルを主成分とする合金粉末が焼結もしくは溶融、一体化されて、内部電極が形成され、誘電体層12と内部電極層11とが複数枚、交互に積層された積層セラミック焼成体が形成される。なお、酸素を誘電体層の内部に取り込んで信頼性を高めるとともに、内部電極の再酸化を抑制するとの観点から、焼成後の積層セラミック焼成体に対して、アニール処理を施してもよい。 By firing the green chip, the organic binder in the green sheet is completely removed, and the ceramic raw material powder is fired to form the ceramic dielectric layer 12. Further, the organic vehicle in the internal electrode layer 11 is removed, and the nickel powder or the alloy powder containing nickel as a main component is sintered or melted and integrated to form an internal electrode. The dielectric layer 12 and the internal electrode A multilayer ceramic fired body in which a plurality of layers 11 are alternately stacked is formed. In addition, annealing may be performed on the fired multilayer ceramic fired body from the viewpoint of taking oxygen into the dielectric layer to improve reliability and suppressing reoxidation of the internal electrode.

 そして、作製した積層セラミック焼成体に対して、一対の外部電極20を設けることにより、積層セラミックコンデンサ1が製造される。例えば、外部電極20は、外部電極層21及びメッキ層22を備える。外部電極層21は、内部電極層11と電気的に接続する。なお、外部電極20の材料としては、例えば、銅やニッケル、またはこれらの合金が好適に使用できる。なお、電子部品は、積層セラミックコンデンサ以外の電子部品を用いることもできる。 Then, the multilayer ceramic capacitor 1 is manufactured by providing a pair of external electrodes 20 to the manufactured multilayer ceramic fired body. For example, the external electrode 20 includes an external electrode layer 21 and a plating layer 22. The external electrode layer 21 is electrically connected to the internal electrode layer 11. In addition, as a material of the external electrode 20, copper, nickel, or these alloys can be used conveniently, for example. As the electronic component, an electronic component other than the multilayer ceramic capacitor can be used.

 以下、本発明を実施例と比較例に基づき詳細に説明するが、本発明は実施例によって何ら限定されるものではない。 Hereinafter, the present invention will be described in detail based on examples and comparative examples, but the present invention is not limited to the examples.

[評価方法]
(導電性ペーストの粘度の変化量)
 導電性ペーストの製造直後と、室温(25℃)で60日間静置後における、それぞれのサンプルの粘度を下記の方法で測定し、製造直後の粘度を基準(0%)とした場合の、各静置後のサンプルの粘度の変化量を百分率(%)で表した値を求めた([60日間静置後の粘度-製造直後の粘度)/製造直後の粘度]×100)。なお、導電性ペーストの粘度の変化量は少ないほど好ましい。
 導電性ペーストの粘度:ブルックフィールド社製B型粘度計を用いて10rpm(ずり速度=4sec-1)の条件で測定した。
[Evaluation methods]
(Change in viscosity of conductive paste)
Immediately after production of the conductive paste and after standing at room temperature (25 ° C.) for 60 days, the viscosity of each sample was measured by the following method, and the viscosity immediately after production was used as a reference (0%). The change in viscosity of the sample after standing was expressed as a percentage (%) ([viscosity after standing for 60 days−viscosity immediately after production) / viscosity immediately after production] × 100). The smaller the amount of change in the viscosity of the conductive paste, the better.
Viscosity of conductive paste: Measured using a Brookfield B-type viscometer at 10 rpm (shear rate = 4 sec −1 ).

[使用材料]
(導電性粉末)
 導電性粉末としては、Ni粉末(粒径0.3μm)又は、Ni粉末(粒径0.2μm)を使用した。
[Materials used]
(Conductive powder)
As the conductive powder, Ni powder (particle size 0.3 μm) or Ni powder (particle size 0.2 μm) was used.

(セラミック粉末)
 セラミック粉末としては、チタン酸バリウム(BaTiO;粒径0.06μm)を使用した。
(Ceramic powder)
As the ceramic powder, barium titanate (BaTiO 3 ; particle size 0.06 μm) was used.

(バインダー樹脂)
 バインダー樹脂としては、エチルセルロースを使用した。
(Binder resin)
Ethyl cellulose was used as the binder resin.

(分散剤)
 表1に用いた分散剤を示す。
(1)分子量500以下の分岐炭化水素鎖を有する酸系分散剤Aとして、下記一般式(1)(R=C1735)で示される酸系分散剤を用いた(表1:No.1)。分岐鎖の有無は、H-NMRのスペクトル及びフーリエ変換型赤外分光(FT-IR)を用いて確認した。これらの結果から、直鎖分岐鎖(直鎖炭化水素基)で検出されるピークが観察されず、末端のメチル基(-CH)を示すピークが観察され、Rが1以上の分岐を有することを確認した。
(Dispersant)
Table 1 shows the dispersant used.
(1) An acid dispersant represented by the following general formula (1) (R 1 = C 17 H 35 ) was used as the acid dispersant A having a branched hydrocarbon chain having a molecular weight of 500 or less (Table 1: No .1). The presence or absence of a branched chain was confirmed using 1 H-NMR spectrum and Fourier transform infrared spectroscopy (FT-IR). From these results, the peak detected in the linear branched chain (linear hydrocarbon group) was not observed, but the peak indicating the terminal methyl group (—CH 3 ) was observed, and R 1 had one or more branches. Confirmed to have.

Figure JPOXMLDOC01-appb-C000004
Figure JPOXMLDOC01-appb-C000004

(2)分子量500以下の直鎖炭化水素鎖を有する酸系分散剤として、オレイン酸(C1834NO)、ステアリン酸(C1836)、ベヘン酸(C2244)、オレオイルザルコシン(C2139NO)、ラウリン酸(C1224)、リノール酸(C1832)、パルミトレイン酸(C1630)を用いた(表1:No.2~8)。
(3)塩基系分散剤として、ミリスチルアミン、セチルアミン、ステアリルアミンを用いた(表1:No.9~11)。
(2) As an acid dispersant having a linear hydrocarbon chain having a molecular weight of 500 or less, oleic acid (C 18 H 34 NO 2 ), stearic acid (C 18 H 36 O 2 ), behenic acid (C 22 H 44 O) 2), oleoyl sarcosine (C 21 H 39 NO 3) , lauric acid (C 12 H 24 O 2) , linoleic acid (C 18 H 32 O 2) , use the palmitoleic acid (C 16 H 30 O 2) (Table 1: No. 2 to 8).
(3) Myristylamine, cetylamine, and stearylamine were used as the base dispersant (Table 1: No. 9 to 11).

Figure JPOXMLDOC01-appb-T000005
Figure JPOXMLDOC01-appb-T000005

(有機溶剤)
 有機溶剤としては、ターピネオールを使用した。
(Organic solvent)
Turpineol was used as the organic solvent.

[実施例1]
 導電性粉末であるNi粉末100質量部に対して、セラミック粉末5.3質量部と、酸系分散剤A0.1質量部と、バインダー樹脂5質量部と、有機溶剤49質量部とを混合して導電性ペーストを作製した。作製した導電性ペーストの粘度(60日後)を上記方法で評価した。ペースト粘度の変化量の評価結果を、Ni粉末100質量部に対する酸系分散剤の含有量と共に表2に示す。
[Example 1]
For 100 parts by mass of Ni powder, which is a conductive powder, 5.3 parts by mass of ceramic powder, 0.1 parts by mass of acid dispersant A, 5 parts by mass of binder resin, and 49 parts by mass of organic solvent are mixed. Thus, a conductive paste was produced. The viscosity (60 days later) of the produced conductive paste was evaluated by the above method. The evaluation results of the amount of change in paste viscosity are shown in Table 2 together with the content of the acid dispersant with respect to 100 parts by mass of Ni powder.

[実施例2]
 酸系分散剤Aの含有量を0.5質量部とした以外は、実施例1と同様に導電性ペーストを作製した。ペースト粘度の変化量の評価結果を、Ni粉末100質量部に対する酸系分散剤の含有量と共に表2に示す。
[Example 2]
A conductive paste was prepared in the same manner as in Example 1 except that the content of the acid dispersant A was 0.5 parts by mass. The evaluation results of the amount of change in paste viscosity are shown in Table 2 together with the content of the acid dispersant with respect to 100 parts by mass of Ni powder.

[実施例3]
酸系分散剤Aの含有量を1.0質量部とした以外は、実施例1と同様に導電性ペーストを作製した。用いた分散剤の特徴とペースト粘度の変化量の評価結果を、Ni粉末100質量部に対する酸系分散剤の含有量と共に表2に示す。
[Example 3]
A conductive paste was prepared in the same manner as in Example 1 except that the content of the acid dispersant A was 1.0 part by mass. Table 2 shows the characteristics of the dispersant used and the evaluation results of the amount of change in paste viscosity, together with the content of the acid dispersant with respect to 100 parts by mass of the Ni powder.

[実施例4]
酸系分散剤Aの含有量を1.5質量部とした以外は、実施例1と同様に導電性ペーストを作製した。ペースト粘度の変化量の評価結果を、Ni粉末100質量部に対する酸系分散剤の含有量と共に表2に示す。
[Example 4]
A conductive paste was produced in the same manner as in Example 1 except that the content of the acid dispersant A was 1.5 parts by mass. The evaluation results of the amount of change in paste viscosity are shown in Table 2 together with the content of the acid dispersant with respect to 100 parts by mass of Ni powder.

[実施例5]
 酸系分散剤Aの含有量を2.0質量部とした以外は、実施例1と同様に導電性ペーストを作製した。ペースト粘度の変化量の評価結果を、Ni粉末100質量部に対する酸系分散剤の含有量と共に表2に示す。
[Example 5]
A conductive paste was produced in the same manner as in Example 1 except that the content of the acid dispersant A was 2.0 parts by mass. The evaluation results of the amount of change in paste viscosity are shown in Table 2 together with the content of the acid dispersant with respect to 100 parts by mass of Ni powder.

[比較例1]
 酸系分散剤をオレイン酸(表1:No.2、炭化水素基の分岐なし)とした以外は、実施例1と同様に導電性ペーストを作製した。ペースト粘度の変化量の評価結果を、Ni粉末100質量部に対する酸系分散剤の含有量と共に表2に示す。
[Comparative Example 1]
A conductive paste was prepared in the same manner as in Example 1, except that the acid dispersant was oleic acid (Table 1: No. 2, no hydrocarbon group branching). The evaluation results of the amount of change in paste viscosity are shown in Table 2 together with the content of the acid dispersant with respect to 100 parts by mass of Ni powder.

[比較例2~4]
 酸系分散剤(オレイン酸)の含有量をそれぞれ0.5質量部(比較例2)、1質量部(比較例3)、1.5質量部(比較例4)とした以外は、比較例1と同様に導電性ペーストを作製した。ペースト粘度の変化量の評価結果を、Ni粉末100質量部に対する酸系分散剤の含有量と共に、表2に示す。
[Comparative Examples 2 to 4]
Comparative Example, except that the content of the acid dispersant (oleic acid) was 0.5 parts by mass (Comparative Example 2), 1 part by mass (Comparative Example 3), and 1.5 parts by mass (Comparative Example 4), respectively. A conductive paste was prepared as in 1. The evaluation results of the amount of change in paste viscosity are shown in Table 2 together with the content of the acid dispersant with respect to 100 parts by mass of Ni powder.

[比較例5~比較例10]
 酸系分散剤を、ステアリン酸(比較例5)、ベヘン酸(比較例6)、オレオイルザルコシン(比較例7)、ラウリン酸(比較例8)、リノール酸(比較例9)、パルミトレイン酸(比較例10)とした以外は、実施例1と同様に導電性ペーストを作製した。ペースト粘度の変化量の評価結果を、Ni粉末100質量部に対する酸系分散剤の含有量と共に、表2に示す。
[Comparative Examples 5 to 10]
Acidic dispersants include stearic acid (Comparative Example 5), behenic acid (Comparative Example 6), oleoyl sarcosine (Comparative Example 7), lauric acid (Comparative Example 8), linoleic acid (Comparative Example 9), palmitoleic acid A conductive paste was produced in the same manner as in Example 1 except that (Comparative Example 10) was used. The evaluation results of the amount of change in paste viscosity are shown in Table 2 together with the content of the acid dispersant with respect to 100 parts by mass of Ni powder.

Figure JPOXMLDOC01-appb-T000006
Figure JPOXMLDOC01-appb-T000006

[実施例6]
 導電性粉末であるNi粉末(粒径:0.3μm)100質量部に対して、セラミック粉末11.6質量部と、分散剤0.6質量部(酸系分散剤A0.2質量部、塩基系分散剤0.4質量部)と、バインダー樹脂5質量部と、有機溶剤51質量部とを混合して導電性ペーストを作製した。なお、塩基性分散剤としては、ミリスチルアミンを用いた(表1:No.9)。作製した導電性ペーストの粘度の変化量(60日後)を上記方法で評価した。ペースト粘度の評価結果を、Ni粉末の粒径と、分散剤及びセラミック粉末の含有量と共に、表3に示す。なお、表3中の含有量(質量部)は、Ni粉末100質量部に対する量を示す。
[Example 6]
11.6 parts by mass of ceramic powder and 0.6 parts by mass of dispersant (0.2 parts by mass of acid-based dispersant A, base) with respect to 100 parts by mass of Ni powder (particle size: 0.3 μm) as conductive powder A conductive paste was prepared by mixing 0.4 part by mass of a dispersant), 5 parts by mass of a binder resin, and 51 parts by mass of an organic solvent. In addition, myristylamine was used as the basic dispersant (Table 1: No. 9). The amount of change in viscosity (after 60 days) of the produced conductive paste was evaluated by the above method. The evaluation results of the paste viscosity are shown in Table 3 together with the particle size of the Ni powder and the contents of the dispersant and the ceramic powder. In addition, content (mass part) in Table 3 shows the quantity with respect to 100 mass parts of Ni powder.

[実施例7]
 酸系分散剤Aの含有量を0.5質量部とした以外は、実施例6と同様に導電性ペーストを作製した。ペースト粘度の評価結果を、Ni粉末の粒径と、分散剤及びセラミック粉末の含有量と共に、表3に示す。なお、表3中の含有量(質量部)は、Ni粉末100質量部に対する量を示す。
[Example 7]
A conductive paste was prepared in the same manner as in Example 6 except that the content of the acid dispersant A was 0.5 parts by mass. The evaluation results of the paste viscosity are shown in Table 3 together with the particle size of the Ni powder and the contents of the dispersant and the ceramic powder. In addition, content (mass part) in Table 3 shows the quantity with respect to 100 mass parts of Ni powder.

[実施例8]
 酸系分散剤Aの含有量を2.0質量部とした以外は、実施例6と同様に導電性ペーストを作製した。ペースト粘度の評価結果を、Ni粉末の粒径と、分散剤及びセラミック粉末の含有量と共に、表3に示す。なお、表3中の含有量(質量部)は、Ni粉末100質量部に対する量を示す。
[Example 8]
A conductive paste was prepared in the same manner as in Example 6 except that the content of the acid dispersant A was 2.0 parts by mass. The evaluation results of the paste viscosity are shown in Table 3 together with the particle size of the Ni powder and the contents of the dispersant and the ceramic powder. In addition, content (mass part) in Table 3 shows the quantity with respect to 100 mass parts of Ni powder.

[実施例9]
 セラミック粉末の含有量を5.3質量部とした以外は、実施例7と同様に導電性ペーストを作製した。ペースト粘度の評価結果を、Ni粉末の粒径と、分散剤及びセラミック粉末の含有量と共に、表3に示す。なお、表3中の含有量(質量部)は、Ni粉末100質量部に対する量を示す。
[Example 9]
A conductive paste was produced in the same manner as in Example 7 except that the content of the ceramic powder was 5.3 parts by mass. The evaluation results of the paste viscosity are shown in Table 3 together with the particle size of the Ni powder and the contents of the dispersant and the ceramic powder. In addition, content (mass part) in Table 3 shows the quantity with respect to 100 mass parts of Ni powder.

[実施例10~12]
 Ni粉末(粒径:0.2μm)を用い、塩基系分散剤をミリスチルアミン(実施例10)、セチルアミン(実施例11)、ステアリルアミン(実施例12)とし、塩基性分散剤の含有量を0.5重量部とした以外は、実施例9と同様に導電性ペーストを作製した。ペースト粘度の評価結果を、Ni粉末の粒径と、分散剤及びセラミック粉末の含有量と共に、表3に示す。なお、表3中の含有量(質量部)は、Ni粉末100質量部に対する量を示す。
[Examples 10 to 12]
Using Ni powder (particle size: 0.2 μm), the basic dispersant is myristylamine (Example 10), cetylamine (Example 11), stearylamine (Example 12), and the basic dispersant content is A conductive paste was produced in the same manner as in Example 9 except that the amount was 0.5 parts by weight. The evaluation results of the paste viscosity are shown in Table 3 together with the particle size of the Ni powder and the contents of the dispersant and the ceramic powder. In addition, content (mass part) in Table 3 shows the quantity with respect to 100 mass parts of Ni powder.

[比較例11~12]
 酸系分散剤として、オレイン酸0.3質量部(比較例11)、ステアリン酸0.3質量部(比較例12)、を用いた以外は、実施例6と同様に導電性ペーストを作製した。ペースト粘度の評価結果を、Ni粉末の粒径と、分散剤及びセラミック粉末の含有量と共に、表3に示す。なお、表3中の含有量(質量部)は、Ni粉末100質量部に対する量を示す。
[Comparative Examples 11 to 12]
A conductive paste was prepared in the same manner as in Example 6 except that 0.3 parts by mass of oleic acid (Comparative Example 11) and 0.3 part by mass of stearic acid (Comparative Example 12) were used as the acid dispersant. . The evaluation results of the paste viscosity are shown in Table 3 together with the particle size of the Ni powder and the contents of the dispersant and the ceramic powder. In addition, content (mass part) in Table 3 shows the quantity with respect to 100 mass parts of Ni powder.

[比較例13]
 酸系分散剤として、オレイン酸を用いた以外は、実施例11と同様に導電性ペーストを作製した。ペースト粘度の評価結果を、Ni粉末の粒径と、分散剤及びセラミック粉末の含有量と共に、表3に示す。なお、表3中の含有量(質量部)は、Ni粉末100質量部に対する量を示す。
[Comparative Example 13]
A conductive paste was prepared in the same manner as in Example 11 except that oleic acid was used as the acid dispersant. The evaluation results of the paste viscosity are shown in Table 3 together with the particle size of the Ni powder and the contents of the dispersant and the ceramic powder. In addition, content (mass part) in Table 3 shows the quantity with respect to 100 mass parts of Ni powder.

[比較例14]
 酸系分散剤として、ステアリン酸を用いた以外は、実施例12と同様に導電性ペーストを作製した。ペースト粘度の評価結果を、Ni粉末の粒径と、分散剤及びセラミック粉末の含有量と共に、表3に示す。なお、表3中の含有量(質量部)は、Ni粉末100質量部に対する量を示す。
[Comparative Example 14]
A conductive paste was produced in the same manner as in Example 12 except that stearic acid was used as the acid dispersant. The evaluation results of the paste viscosity are shown in Table 3 together with the particle size of the Ni powder and the contents of the dispersant and the ceramic powder. In addition, content (mass part) in Table 3 shows the quantity with respect to 100 mass parts of Ni powder.

Figure JPOXMLDOC01-appb-T000007
Figure JPOXMLDOC01-appb-T000007

(評価結果)
 実施例の導電性ペーストは、60日経過後のペースト粘度の変化量が、いずれの比較例の導電性ペーストと比べて、小さかった。よって、分子量500以下の分岐炭化水素鎖を有する酸系分散剤を含む導電性ペーストは、良好な粘度安定性を有することが示された。
(Evaluation results)
In the conductive paste of the example, the amount of change in paste viscosity after 60 days was small compared to the conductive paste of any comparative example. Therefore, it was shown that the conductive paste containing an acid dispersant having a branched hydrocarbon chain having a molecular weight of 500 or less has good viscosity stability.

 本発明の導電性ペーストは、経時的な粘度安定性に非常に優れており、特に携帯電話やデジタル機器などの電子機器のチップ部品である積層セラミックコンデンサの内部電極用の原料として好適に用いることができる。 The conductive paste of the present invention is extremely excellent in viscosity stability over time, and is particularly suitable for use as a raw material for internal electrodes of multilayer ceramic capacitors that are chip parts of electronic devices such as mobile phones and digital devices. Can do.

1    積層セラミックコンデンサ
10   セラミック積層体
11   内部電極層
12   誘電体層
20   外部電極
21   外部電極層
22   メッキ層
 
DESCRIPTION OF SYMBOLS 1 Multilayer ceramic capacitor 10 Ceramic multilayer body 11 Internal electrode layer 12 Dielectric layer 20 External electrode 21 External electrode layer 22 Plating layer

Claims (15)

 導電性粉末、セラミック粉末、分散剤、バインダー樹脂及び有機溶剤を含む導電性ペーストであって、
 前記分散剤は、分子量が500以下の酸系分散剤を含み、
 前記酸系分散剤は、分岐鎖を1つ以上有する分岐炭化水素基を有する、
ことを特徴とする導電性ペースト。
A conductive paste containing conductive powder, ceramic powder, dispersant, binder resin and organic solvent,
The dispersant includes an acid dispersant having a molecular weight of 500 or less,
The acid-based dispersant has a branched hydrocarbon group having one or more branched chains.
A conductive paste characterized by that.
 前記酸系分散剤は、カルボキシル基を有する酸系分散剤であることを特徴とする請求項1に記載の導電性ペースト。 The conductive paste according to claim 1, wherein the acid dispersant is an acid dispersant having a carboxyl group.  前記酸系分散剤は、下記の一般式(1)で示されることを特徴とする、請求項1又は2に記載の導電性ペースト。
Figure JPOXMLDOC01-appb-C000001
 ただし、一般式(1)中、Rは、炭素数10以上20以下の分岐アルキル基又は炭素数10以上20以下の分岐アルケニル基である。
The conductive paste according to claim 1 or 2, wherein the acid dispersant is represented by the following general formula (1).
Figure JPOXMLDOC01-appb-C000001
However, in General Formula (1), R 1 is a branched alkyl group having 10 to 20 carbon atoms or a branched alkenyl group having 10 to 20 carbon atoms.
 前記酸系分散剤は、前記導電性粉末100質量部に対して0.01質量部以上3質量部以下含有されることを特徴とする請求項1~3のいずれか一項に記載の導電性ペースト。 The conductive agent according to any one of claims 1 to 3, wherein the acid-based dispersant is contained in an amount of 0.01 parts by weight to 3 parts by weight with respect to 100 parts by weight of the conductive powder. paste.  前記分散剤は、さらに塩基系分散剤を含むことを特徴とする請求項1~4のいずれか一項に記載の導電性ペースト。 The conductive paste according to any one of claims 1 to 4, wherein the dispersant further contains a base dispersant.  前記分散剤は、前記導電性粉末100質量部に対して、0.01質量部以上3質量部以下含有されることを特徴とする請求項1~5のいずれか一項に記載の導電性ペースト。 The conductive paste according to any one of claims 1 to 5, wherein the dispersant is contained in an amount of 0.01 parts by weight to 3 parts by weight with respect to 100 parts by weight of the conductive powder. .  前記導電性粉末は、Ni、Pd、Pt、Au、Ag、Cu及びこれらの合金から選ばれる少なくとも1種の金属粉末を含むことを特徴とする請求項1~6のいずれか一項に記載の導電性ペースト。 The conductive powder includes at least one metal powder selected from Ni, Pd, Pt, Au, Ag, Cu, and alloys thereof, according to any one of claims 1 to 6. Conductive paste.  前記導電性粉末は、平均粒径が0.05μm以上1.0μm以下であることを特徴とする請求項1~7のいずれか一項に記載の導電性ペースト。 The conductive paste according to any one of claims 1 to 7, wherein the conductive powder has an average particle size of 0.05 to 1.0 µm.  前記セラミック粉末は、ペロブスカイト型酸化物を含むことを特徴とする請求項1~8のいずれか一項に記載の導電性ペースト。 The conductive paste according to any one of claims 1 to 8, wherein the ceramic powder contains a perovskite oxide.  前記セラミック粉末は、平均粒径が0.01μm以上0.5μm以下であることを特徴とする請求項1~9のいずれか一項に記載の導電性ペースト。 10. The conductive paste according to claim 1, wherein the ceramic powder has an average particle size of 0.01 μm or more and 0.5 μm or less.  前記バインダー樹脂は、セルロース系樹脂、アクリル系樹脂及びブチラール系樹脂のうち少なくとも1つを含むことを特徴とする請求項1~10のいずれか一項に記載の導電性ペースト。 The conductive paste according to any one of claims 1 to 10, wherein the binder resin contains at least one of a cellulose resin, an acrylic resin, and a butyral resin.  前記導電性ペーストの製造直後の粘度を100%とした場合、60日間静置後の粘度が80%以上120%以下であることを特徴とする請求項1~11のいずれか一項に記載の導電性ペースト。 The viscosity according to any one of claims 1 to 11, wherein when the viscosity immediately after production of the conductive paste is 100%, the viscosity after standing for 60 days is 80% or more and 120% or less. Conductive paste.  積層セラミック部品の内部電極用であることを特徴とする請求項1~12のいずれか一項に記載の導電性ペースト。 The conductive paste according to any one of claims 1 to 12, which is used for an internal electrode of a multilayer ceramic component.  請求項1~13のいずれか一項に記載の導電性ペーストを用いて形成された電子部品。 An electronic component formed using the conductive paste according to any one of claims 1 to 13.  誘電体層と内部電極とを積層した積層体を少なくとも有し、
 前記内部電極は、前記1~13のいずれか一項に記載の導電性ペーストを用いて形成されたことを特徴とする積層セラミック積層体。
Having at least a laminate in which a dielectric layer and an internal electrode are laminated,
14. A multilayer ceramic laminate, wherein the internal electrode is formed using the conductive paste according to any one of 1 to 13.
PCT/JP2017/007447 2016-02-29 2017-02-27 Electrically conductive paste, electronic component, and laminated ceramic capacitor Ceased WO2017150438A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018503286A JP6635186B2 (en) 2016-02-29 2017-02-27 Conductive paste, electronic components and multilayer ceramic capacitors
KR1020187026479A KR102647944B1 (en) 2016-02-29 2017-02-27 Conductive pastes, electronic components and multilayer ceramic capacitors
MYPI2018703019A MY188260A (en) 2016-02-29 2017-02-27 Conductive paste, electronic component, and multilayer ceramic capacitor
CN201780013785.8A CN108780673B (en) 2016-02-29 2017-02-27 Conductive pastes, electronic components, and multilayer ceramic capacitors

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-038188 2016-02-29
JP2016038188 2016-02-29

Publications (1)

Publication Number Publication Date
WO2017150438A1 true WO2017150438A1 (en) 2017-09-08

Family

ID=59744139

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2017/007447 Ceased WO2017150438A1 (en) 2016-02-29 2017-02-27 Electrically conductive paste, electronic component, and laminated ceramic capacitor

Country Status (6)

Country Link
JP (1) JP6635186B2 (en)
KR (1) KR102647944B1 (en)
CN (1) CN108780673B (en)
MY (1) MY188260A (en)
TW (1) TWI711053B (en)
WO (1) WO2017150438A1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019043674A3 (en) * 2017-08-30 2019-05-02 住友金属鉱山株式会社 Conductive paste, electronic component, and multilayer ceramic capacitor
WO2019043671A3 (en) * 2017-08-30 2019-05-02 住友金属鉱山株式会社 Conductive paste, electronic component, and multilayer ceramic capacitor
WO2019220667A1 (en) * 2017-05-23 2019-11-21 住友金属鉱山株式会社 Electroconductive paste, electronic component, and laminated ceramic capacitor
JP2020017405A (en) * 2018-07-25 2020-01-30 住友金属鉱山株式会社 Conductive paste, electronic component and laminate ceramic capacitor
JP2020053348A (en) * 2018-09-28 2020-04-02 住友金属鉱山株式会社 Conductive paste, electronic component, and multilayer ceramic capacitor
WO2021084790A1 (en) * 2019-10-31 2021-05-06 住友金属鉱山株式会社 Electrically conductive paste composition for laminated ceramic capacitor internal electrode, method for manufacturing said electrically conductive paste composition for laminated ceramic capacitor internal electrode, and electrically conductive paste
JPWO2021177420A1 (en) * 2020-03-04 2021-09-10

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6546309B1 (en) * 2018-03-19 2019-07-17 株式会社ノリタケカンパニーリミテド Conductive paste with stable viscosity over time
CN112955980B (en) * 2018-10-31 2023-01-10 昭荣化学工业株式会社 Ni paste and multilayer ceramic capacitor
KR102152839B1 (en) * 2018-11-30 2020-09-07 엘에스니꼬동제련 주식회사 Parameters for improving the printing characteristics of the conductive paste satisfying the parameters
WO2020137290A1 (en) * 2018-12-25 2020-07-02 住友金属鉱山株式会社 Conductive paste, electronic component, and laminated ceramic capacitor
CN110570993B (en) * 2019-10-09 2021-04-09 南通宇华新材料科技有限公司 Method for manufacturing conductive paste with high dry film density
WO2021106470A1 (en) * 2019-11-29 2021-06-03 住友金属鉱山株式会社 Electroconductive paste for gravure printing, electronic component, and laminated ceramic capacitor
JP7540459B2 (en) * 2022-05-09 2024-08-27 昭栄化学工業株式会社 Polymer-type conductive paste, conductive film, and solid electrolytic capacitor element

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011138704A (en) * 2009-12-28 2011-07-14 Kyocera Chemical Corp Conductive paste and ceramic capacitor
JP2012138579A (en) * 2010-12-27 2012-07-19 Samsung Electro-Mechanics Co Ltd Conductive paste composition for external electrode, multilayer ceramic capacitor including the same and manufacturing method thereof
JP2012226865A (en) * 2011-04-15 2012-11-15 Sumitomo Metal Mining Co Ltd Conductive paste composition
JP2012241068A (en) * 2011-05-17 2012-12-10 Nec Tokin Corp Conductive polymer suspension and production method thereof, conductive polymer material, and electrolytic condenser and production method thereof
JP2013115132A (en) * 2011-11-25 2013-06-10 Dai Ichi Kogyo Seiyaku Co Ltd Metal oxide semiconductor particle dispersion body composition and semiconductor
JP2013149457A (en) * 2012-01-19 2013-08-01 Sumitomo Metal Mining Co Ltd Conductive paste for internal electrode
JP2015216244A (en) * 2014-05-12 2015-12-03 株式会社村田製作所 Conductive paste and ceramic electronic part
JP2016035914A (en) * 2014-07-31 2016-03-17 住友金属鉱山株式会社 Conductive paste

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4161472B2 (en) * 1999-06-25 2008-10-08 株式会社村田製作所 Conductive thick film paste, method for producing the same, and multilayer ceramic capacitor using the same
JP3944495B2 (en) 2004-06-28 2007-07-11 Tdk株式会社 Conductive paste, multilayer ceramic electronic component and manufacturing method thereof
JP4930808B2 (en) 2010-01-29 2012-05-16 住友金属鉱山株式会社 Conductive paste
JP5556561B2 (en) 2010-10-06 2014-07-23 住友金属鉱山株式会社 Silver powder and method for producing the same
KR101228675B1 (en) * 2010-12-06 2013-01-31 삼성전기주식회사 The conductuve paste for inner electrode and multi-layer ceramic device uising thereof
JP5569747B2 (en) * 2011-02-18 2014-08-13 住友金属鉱山株式会社 Gravure printing conductive paste used for multilayer ceramic capacitor internal electrode
JP5967193B2 (en) * 2012-04-19 2016-08-10 株式会社村田製作所 Conductive paste and method for producing multilayer ceramic electronic component
JP6151017B2 (en) * 2012-12-20 2017-06-21 Jfeミネラル株式会社 Nickel ultrafine powder, conductive paste, and method for producing nickel ultrafine powder
KR101452186B1 (en) * 2012-12-26 2014-10-21 주식회사 누리비스타 Paste for internal electrode and multi-layer ceramic capacitor using the same
KR101668586B1 (en) * 2014-03-20 2016-10-21 세키스이가가쿠 고교가부시키가이샤 Electroconductive paste
JP2015191037A (en) * 2014-03-27 2015-11-02 ソニー株式会社 display device and electronic equipment

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011138704A (en) * 2009-12-28 2011-07-14 Kyocera Chemical Corp Conductive paste and ceramic capacitor
JP2012138579A (en) * 2010-12-27 2012-07-19 Samsung Electro-Mechanics Co Ltd Conductive paste composition for external electrode, multilayer ceramic capacitor including the same and manufacturing method thereof
JP2012226865A (en) * 2011-04-15 2012-11-15 Sumitomo Metal Mining Co Ltd Conductive paste composition
JP2012241068A (en) * 2011-05-17 2012-12-10 Nec Tokin Corp Conductive polymer suspension and production method thereof, conductive polymer material, and electrolytic condenser and production method thereof
JP2013115132A (en) * 2011-11-25 2013-06-10 Dai Ichi Kogyo Seiyaku Co Ltd Metal oxide semiconductor particle dispersion body composition and semiconductor
JP2013149457A (en) * 2012-01-19 2013-08-01 Sumitomo Metal Mining Co Ltd Conductive paste for internal electrode
JP2015216244A (en) * 2014-05-12 2015-12-03 株式会社村田製作所 Conductive paste and ceramic electronic part
JP2016035914A (en) * 2014-07-31 2016-03-17 住友金属鉱山株式会社 Conductive paste

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112106149A (en) * 2017-05-23 2020-12-18 住友金属矿山株式会社 Conductive paste, electronic component, and multilayer ceramic capacitor
WO2019220667A1 (en) * 2017-05-23 2019-11-21 住友金属鉱山株式会社 Electroconductive paste, electronic component, and laminated ceramic capacitor
CN112106149B (en) * 2017-05-23 2022-09-27 住友金属矿山株式会社 Conductive paste, electronic component, and multilayer ceramic capacitor
KR20210008473A (en) * 2017-05-23 2021-01-22 스미토모 긴조쿠 고잔 가부시키가이샤 Conductive paste, electronic components and multilayer ceramic capacitors
KR102731210B1 (en) * 2017-05-23 2024-11-18 스미토모 긴조쿠 고잔 가부시키가이샤 Challenger paste, electronic components and multilayer ceramic capacitors
WO2019043671A3 (en) * 2017-08-30 2019-05-02 住友金属鉱山株式会社 Conductive paste, electronic component, and multilayer ceramic capacitor
WO2019043674A3 (en) * 2017-08-30 2019-05-02 住友金属鉱山株式会社 Conductive paste, electronic component, and multilayer ceramic capacitor
JP2020017405A (en) * 2018-07-25 2020-01-30 住友金属鉱山株式会社 Conductive paste, electronic component and laminate ceramic capacitor
KR102798247B1 (en) * 2018-07-25 2025-04-18 스미토모 긴조쿠 고잔 가부시키가이샤 Challenger paste, electronic components and multilayer ceramic capacitors
CN112470236B (en) * 2018-07-25 2023-02-28 住友金属矿山株式会社 Conductive paste, electronic component, and multilayer ceramic capacitor
CN112470236A (en) * 2018-07-25 2021-03-09 住友金属矿山株式会社 Conductive paste, electronic component, and multilayer ceramic capacitor
KR20210040290A (en) * 2018-07-25 2021-04-13 스미토모 긴조쿠 고잔 가부시키가이샤 Conductive paste, electronic components and multilayer ceramic capacitors
JP7206671B2 (en) 2018-07-25 2023-01-18 住友金属鉱山株式会社 Conductive paste, electronic parts and laminated ceramic capacitors
WO2020022291A1 (en) * 2018-07-25 2020-01-30 住友金属鉱山株式会社 Conductive paste, electronic component, and laminated ceramic capacitor
KR20210056951A (en) * 2018-09-28 2021-05-20 스미토모 긴조쿠 고잔 가부시키가이샤 Conductive paste, electronic components, and multilayer ceramic capacitors
KR102737839B1 (en) * 2018-09-28 2024-12-04 스미토모 긴조쿠 고잔 가부시키가이샤 Challenger paste, electronic components, and multilayer ceramic capacitors
JP2020053348A (en) * 2018-09-28 2020-04-02 住友金属鉱山株式会社 Conductive paste, electronic component, and multilayer ceramic capacitor
WO2020067362A1 (en) * 2018-09-28 2020-04-02 住友金属鉱山株式会社 Conductive paste, electronic component, and laminated ceramic capacitor
CN112368786B (en) * 2018-09-28 2023-10-03 住友金属矿山株式会社 Conductive paste, electronic component, and multilayer ceramic capacitor
JP7215047B2 (en) 2018-09-28 2023-01-31 住友金属鉱山株式会社 Conductive paste, electronic parts, and laminated ceramic capacitors
CN112368786A (en) * 2018-09-28 2021-02-12 住友金属矿山株式会社 Conductive paste, electronic component, and multilayer ceramic capacitor
WO2021084790A1 (en) * 2019-10-31 2021-05-06 住友金属鉱山株式会社 Electrically conductive paste composition for laminated ceramic capacitor internal electrode, method for manufacturing said electrically conductive paste composition for laminated ceramic capacitor internal electrode, and electrically conductive paste
JP7508770B2 (en) 2019-10-31 2024-07-02 住友金属鉱山株式会社 Conductive paste composition for internal electrodes of multilayer ceramic capacitors, method for producing same, and conductive paste
JP2021072223A (en) * 2019-10-31 2021-05-06 住友金属鉱山株式会社 Conductive paste composition for multilayer ceramic capacitor internal electrode, manufacturing method thereof and conductive paste
TWI870478B (en) * 2019-10-31 2025-01-21 日商住友金屬礦山股份有限公司 Conductive paste composition for internal electrode of multilayer ceramic capacitor, manufacturing method thereof and conductive paste
JPWO2021177420A1 (en) * 2020-03-04 2021-09-10
WO2021177420A1 (en) * 2020-03-04 2021-09-10 住友金属鉱山株式会社 Electroconductive paste, electronic component, and laminated ceramic capacitor
JP7677320B2 (en) 2020-03-04 2025-05-15 住友金属鉱山株式会社 Conductive paste, electronic components and multilayer ceramic capacitors

Also Published As

Publication number Publication date
MY188260A (en) 2021-11-24
JPWO2017150438A1 (en) 2019-01-31
TW201805954A (en) 2018-02-16
CN108780673A (en) 2018-11-09
TWI711053B (en) 2020-11-21
KR102647944B1 (en) 2024-03-14
JP6635186B2 (en) 2020-01-22
KR20180117121A (en) 2018-10-26
CN108780673B (en) 2020-06-02

Similar Documents

Publication Publication Date Title
JP6635186B2 (en) Conductive paste, electronic components and multilayer ceramic capacitors
JP6531541B2 (en) Conductive paste
TWI798302B (en) Conductive paste, electronic parts, and laminated ceramic capacitors
CN112106149B (en) Conductive paste, electronic component, and multilayer ceramic capacitor
JP7750318B2 (en) Conductive paste, electronic components, and multilayer ceramic capacitors
JP7405098B2 (en) Conductive paste, electronic components, and multilayer ceramic capacitors
JP2019046781A (en) Conductive paste, and method of manufacturing electronic component and multilayer ceramic capacitor
CN111386579B (en) Conductive pastes, electronic components, and laminated ceramic capacitors
WO2019043674A2 (en) Conductive paste, electronic component, and multilayer ceramic capacitor
JP2019046783A (en) Conductive paste and methods for manufacturing electronic component and multilayer ceramic capacitor
JP2019046782A (en) Conductive paste, and method of manufacturing electronic component and multilayer ceramic capacitor
WO2019107500A1 (en) Conductive paste, electronic component, and laminate ceramic capacitor
CN112470236A (en) Conductive paste, electronic component, and multilayer ceramic capacitor
WO2019043672A2 (en) Conductive paste, electronic component, and multilayer ceramic capacitor
WO2019043673A2 (en) Conductive paste, electronic component, and multilayer ceramic capacitor
TW202016953A (en) Conductive slurry, electronic part and laminated ceramic capacitor have highly precision and uniformity in width and thickness

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 2018503286

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20187026479

Country of ref document: KR

Kind code of ref document: A

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17759904

Country of ref document: EP

Kind code of ref document: A1

122 Ep: pct application non-entry in european phase

Ref document number: 17759904

Country of ref document: EP

Kind code of ref document: A1