WO2017148074A1 - Imaging module and electronic device - Google Patents

Abstract

Disclosed are an imaging module and an electronic device. The imaging module comprises a flexible circuit board and at least two photographing modules. The flexible circuit board comprises at least two module mounting portions that are spaced apart from each other and at least two connector mounting portions that are spaced apart from each other. The module mounting portions each is connected to a corresponding connector mounting portion. The photographing modules each is provided on a corresponding module mounting portion. The at least two photographing modules have the same focal length.

Description

Imaging module and electronic device

Priority information

This application filed with the National Intellectual Property Office of China on March 3, 2016, and the patent application numbers are 201610120797.8, 201620163236.1, 201610120794.4, 201620163071.8, 201610120752.0, 201620163058.2, 201610120788.9, 201620163047.4, 201610120913.6, 201620163044.0, 201610120785.5, 201620162647.9, 201610120751.6, 201620162646.4, 201610120900.9 The priority and benefit of the patent applications of 201620162898.7, 201610120792.5 and 201620163207.5 are hereby incorporated by reference in its entirety.

Technical field

The present invention relates to the field of camera technologies, and in particular, to an imaging module and an electronic device.

Background technique

As people's quality requirements for captured images increase, dual camera photography technology came into being. In order to ensure the quality of the photograph, the optical axes of the two camera modules of the dual camera module are arranged in parallel and the two camera modules are photographed toward the same side.

The dual camera module can be applied to electronic devices such as mobile phones and tablet computers. Therefore, how to reduce the cost of the dual camera module has become an urgent problem to be solved.

Summary of the invention

The present invention is directed to solving one of the technical problems existing in the prior art. To this end, the present invention provides an imaging module and an electronic device.

The imaging module of the embodiment of the invention comprises a flexible circuit board and at least two camera modules. The flexible circuit board includes at least two module mounting portions spaced apart and at least two connector mounting portions spaced apart. Each module mounting portion is connected to a corresponding connector mounting portion. Each camera module is disposed on a corresponding module mounting portion, and at least two camera modules have the same focal length.

In the above imaging module, since the focal lengths of at least two camera modules are the same, the structure of at least two camera modules can be made simpler, which is advantageous for reducing the cost of the imaging module. At the same time, this can make the image processing algorithm of the imaging module simpler and further reduce the cost of the imaging module.

In some embodiments, the number of the camera modules and the number of the module mounting portions are two.

In some embodiments, the flexible circuit board includes two spaced apart connecting portions, each of the connecting portions connecting the corresponding module mounting portion and the corresponding connector mounting portion.

In some embodiments, each of the camera modules includes a printed circuit board and is disposed on the printed circuit board And an image sensor electrically connected to the printed circuit board, the printed circuit board is disposed on the module mounting portion and electrically connected to the module mounting portion.

In some embodiments, the imaging module includes an electrical connection pad disposed between the printed circuit board and the module mounting portion, and electrically connected to the printed circuit board. And the module mounting portion.

In some embodiments, the camera module includes a lens module disposed on the printed circuit board and positioned above the image sensor.

The lens module includes a lens and a voice coil motor, and the voice coil motor includes a housing, and the lens is disposed in the housing, and the two housings of the two camera modules are spaced apart.

In some embodiments, the imaging module includes a connector assembly including a substrate and a connector disposed on the substrate, the substrate being disposed on the connector mounting portion and The connector mounting portion is electrically connected.

In some embodiments, the imaging module includes a gel that bonds the two camera modules.

In some embodiments, the camera module includes a connection side opposite to another camera module, and the two camera modules are fixedly connected by soldering the connection side.

In some embodiments, the imaging module includes a frame, and the two camera modules are disposed in the frame and are fixedly coupled to the frame.

An electronic device according to an embodiment of the present invention includes the imaging module of any of the above embodiments.

In the above electronic device, since the focal lengths of at least two camera modules are the same, the image processing algorithm of the electronic device can be made simpler, and the cost of the electronic device can be reduced.

The additional aspects and advantages of the invention will be set forth in part in the description which follows.

DRAWINGS

The above and/or additional aspects and advantages of the present invention will become apparent and readily understood from

1 is a schematic structural view of an imaging module according to an embodiment of the present invention.

2 is a perspective view of an imaging module according to an embodiment of the present invention.

3 is a cross-sectional view of the imaging module of FIG. 2 taken along the line III-III.

4 is an enlarged schematic view of an IV portion of the imaging module of FIG. 3.

FIG. 5 is an exploded perspective view of an imaging module according to an embodiment of the present invention.

FIG. 6 is another exploded schematic view of an imaging module according to an embodiment of the present invention.

7 is a schematic structural view of a flexible circuit board of an imaging module according to an embodiment of the present invention.

detailed description

The embodiments of the present invention are described in detail below, and the examples of the embodiments are illustrated in the drawings, wherein the same or similar reference numerals indicate the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the drawings are intended to be illustrative of the invention and are not to be construed as limiting.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientations of "post", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, and is merely for the convenience of the description of the present invention and the simplified description, and is not intended to indicate or imply that the device or component referred to has a specific orientation, and is constructed and operated in a specific orientation. Therefore, it should not be construed as limiting the invention. Moreover, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" or "second" may include one or more of the described features either explicitly or implicitly. In the description of the present invention, the meaning of "a plurality" is two or more unless specifically and specifically defined otherwise.

In the description of the present invention, it should be noted that the terms "installation", "connected", and "connected" are to be understood broadly, and may be fixed or detachable, for example, unless otherwise explicitly defined and defined. Connected, or integrally connected; may be mechanically connected, may be electrically connected or may communicate with each other; may be directly connected, or may be indirectly connected through an intermediate medium, may be internal communication of two elements or interaction of two elements relationship. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.

In the present invention, the first feature "on" or "under" the second feature may include direct contact of the first and second features, and may also include first and second features, unless otherwise specifically defined and defined. It is not in direct contact but through additional features between them. Moreover, the first feature "above", "above" and "above" the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature. The first feature "below", "below" and "below" the second feature includes the first feature directly below and below the second feature, or merely the first feature level being less than the second feature.

The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and arrangements of the specific examples are described below. Of course, they are merely examples and are not intended to limit the invention. In addition, the present invention may be repeated with reference to the numerals and/or reference numerals in the various examples, which are for the purpose of simplicity and clarity, and do not indicate the relationship between the various embodiments and/or arrangements discussed. Moreover, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the use of other processes and/or the use of other materials.

1 is a schematic structural view of an imaging module according to an embodiment of the present invention. Figure 1 does not show the frame of the imaging module.

Referring to FIG. 1 , an imaging module 100 according to an embodiment of the present invention includes a flexible circuit board 10 and at least two camera modules 20 . The flexible circuit board 10 includes at least two module mounting portions 11 and at least two connections arranged at intervals Device mounting portion 12. Each of the module mounting portions 11 is connected to a corresponding connector mounting portion 12. Each camera module 20 is disposed on the corresponding module mounting portion 11, and the focal lengths of at least two camera modules 20 are the same.

In the imaging module 100 of the embodiment of the present invention, since the focal lengths of the at least two camera modules 20 are the same, the structure of the at least two camera modules 20 can be made simpler, which is advantageous for reducing the cost of the imaging module 100. At the same time, this can also make the image processing algorithm of the imaging module 100 simpler, and can further reduce the cost of the imaging module 100.

In the present embodiment, the number of the camera modules 20 and the number of the module mounting portions 11 are both two. It can be understood that in other embodiments, the number of camera modules and the number of module mounting portions may be three or more, and the number of camera modules corresponds to the number of module mounting portions.

For convenience of description, the following description will be further made by the embodiment in which the number of camera modules is two, but it is not to be construed as limiting the invention.

In an example, the focal length of each of the two camera modules 20 can be a fixed focal length, and the structure of each camera module 20 can be the same as that of the other camera module 20, thereby achieving two The focal lengths of the camera modules 20 are all the same.

In another example, the focal length of one of the two camera modules 20 may be a fixed focal length, and the focal length of the other camera module 20 is a zoom distance, which can be adjusted by the zoom module. The focal length is the same as the focal length of the camera module 20 with a fixed focal length.

In another example, it can be understood that the two camera modules 20 can simultaneously zoom the camera module 20, so that the focal lengths of the two camera modules 20 can be conveniently adjusted to be the same.

In one example, when assembling the imaging module 100, the two camera modules 20 are respectively fixed to the module mounting portion 11, and then one of the camera modules 20 can be clamped by a robot, and then the other is adjusted by the robot. The position of the camera module 20 is such that the optical axes of the two camera modules 20 are parallel.

Referring to FIG. 8 , in the present embodiment, the flexible circuit board 10 includes two connecting portions 13 disposed at intervals, and each connecting portion 13 is connected to the corresponding module mounting portion 11 and the corresponding connector mounting portion 12 .

In this way, the connecting portion 13 can realize communication between the module mounting portion 11 and the connector mounting portion 12, so that the camera module disposed on the module mounting portion 11 transmits the collected image information to the electronic device. The spacing of the two connecting portions 13 also facilitates replacement of the flexible circuit board 10.

Referring to FIG. 2 to FIG. 4 , in the embodiment, each camera module 20 includes a printed circuit board 21 (PCB) and an image sensor 22 . The printed circuit board 21 is disposed on the module mounting portion 11 and is electrically connected to the module mounting portion 11. The image sensor 22 is disposed on the printed circuit board 21 and electrically connected to the printed circuit board 21.

As such, the image sensor 22 can acquire an image of the object and transmit the image to the external device through the printed circuit board 21 and the flexible circuit board 10. It should be noted that the sensing faces of the two image sensors 22 are parallel or coplanar and face the same side.

The image sensor 22 can be, for example, a complementary metal oxide semiconductor (Complementary Metal Oxide). Semiconductor, CMOS) image sensor or charge-coupled device (CCD) image sensor.

In the embodiment, the imaging module 100 includes an electrical connection pad 211. The electrical connection pad 211 is disposed between the printed circuit board 21 and the module mounting portion 11 and electrically connected to the printed circuit board 21 and the module mounting portion 11 .

The electrical connection pad 211 can electrically connect and communicate between the flexible circuit board 10 and the camera module 20 . For example, the electrical connection pads 211 are all made of a conductive paste.

In the present embodiment, the shape and size of the printed circuit board 21 are slightly smaller than the shape and size of the corresponding module mounting portion 11.

This makes the structure of the imaging module 100 more compact, and is advantageous for reducing the volume of the imaging module 100. When the imaging module 100 is applied to an electronic device, the volume of the electronic device can be further reduced.

In the present embodiment, as an example, each printed circuit board 21 and the corresponding module mounting portion 11 have a flat shape. In other embodiments, the shape of each printed circuit board and the corresponding module mounting portion may be specifically set according to actual needs.

Referring to FIG. 5 and FIG. 6 , in the embodiment, the camera module 20 includes a lens module 23 disposed on the printed circuit board 21 and located above the image sensor 22 .

In this way, the lens module 23 can obtain an image of better quality by the image sensor 22, thereby improving the shooting quality of the imaging module 100.

In this embodiment, the lens module 23 includes a lens 231 and a voice coil motor 232. The voice coil motor 232 includes a housing 2321. The lens 231 is disposed in the housing 2321. The two housings 2321 of the two camera modules 20 are spaced apart from each other. .

The voice coil motor 232 can drive the lens 231 to move along the optical axis of the lens 231 to adjust the distance between the lens 231 and the image sensor 22, thereby achieving autofocus of the imaging module 100, so that the imaging module 100 can obtain a better quality image. . In addition, after the voice coil motor 232 can realize the movement of the driving lens 231, the focal lengths of the two camera modules 20 can be the same.

Further, a filter 24 is disposed between the lens 231 and the image sensor 22. The filter 24 can filter the light of a predetermined frequency such that the image sensor 22 forms a better image based on the filtered light.

Preferably, the filter 24 is an infrared cut filter. As such, the infrared cut filter 24 can filter infrared rays to avoid image distortion of the image sensor 22.

Specifically, the lens module 23 further includes a base 233. The base 233 defines a recess 2331. The bottom surface of the recess 2331 defines a through hole 2332. The filter 24 is disposed in the recess 2331 and supported on the bottom surface of the recess 2331, and the light filtered by the filter 24 can pass through the through hole 2332 to reach the image sensor 22. The light passes through the lens 231 and the filter 24 in turn and reaches the image sensor 22, so that the image sensor 22 can collect the external image.

In order to facilitate the take-up of the filter 24, the base 233 is provided with a connecting groove 2333, and the connecting groove 2333 communicates with the groove 2331.

In this embodiment, the imaging module 100 includes a connector assembly 30, and the connector assembly 30 includes a substrate 31 and a device. A connector 32 is disposed on the substrate 31. The substrate 31 is disposed on the connector mounting portion 12 and electrically connected to the connector mounting portion 12.

As such, the connector 32 can quickly mount the imaging module 100 to the electronic device.

Preferably, the substrate 31 corresponds to the shape and size of the connector mounting portion 12. This makes the structure of the connector 32 and the flexible circuit board 10 more compact.

In the embodiment, the imaging module 100 includes a colloid 40, and the colloid 40 bonds the two camera modules 20.

After the optical axes of the two camera modules 20 are adjusted to be parallel to each other, the colloid 40 is inserted between the two camera modules. The colloid 40 ensures that the two camera modules 20 are relatively fixed. The colloid 40 can increase the connection strength of the two camera modules 20, and can reduce the probability of the optical axis offset of the two camera modules 20.

It should be noted that, in the present embodiment, as shown by the orientation in FIG. 3 , the colloid 40 is located at a lower portion of the gap between the two camera modules 20 . In other embodiments, the colloid can fill the gap between the two camera modules.

The colloid 40 may be, for example, a colloidal colloid such as UV glue (Ultraviolet Glue).

In some embodiments, the camera module includes a connection side opposite to another camera module, and the two camera modules are fixedly connected by a solder connection side.

In this way, the two camera modules can be firmly fixed together by welding. For example, the connection side of each camera module can be fixedly connected to another camera module by laser spot welding or solder paste or tin wire bonding.

In the embodiment, the imaging module 100 includes a frame 50 , and the two camera modules 20 are disposed in the frame 50 and fixedly connected to the frame 50 . For example, the frame 50 and the two camera modules 20 can be fixedly connected by welding or colloid.

In this way, the frame 50 can further fix the positions of the two camera modules 20, reduce the impact force of the camera module 20 during the falling or oscillating process, increase the stability of the structure of the imaging module 100, and improve the imaging. The quality of the module 100.

Specifically, the frame 50 is provided with a fixing hole 50a, and a gap is formed between the hole wall of the fixing hole 50a and the two camera modules 20. Solder or colloid is filled in the gap between the wall of the fixing hole 50a and the two camera modules 20, and the two camera modules 20 are fixedly connected to the frame 50.

Further, the imaging module 100 further includes a reinforcing plate 60, and the two module mounting portions 11 are fixed on the reinforcing plate 60.

In this way, the reinforcing plate 60 can further fix the positions of the two camera modules 20, improve the anti-collision capability of the imaging module 100, and thereby improve the shooting quality.

In the embodiment, the imaging module 100 further includes an electromagnetic wave interference preventing member 70, and the reinforcing plate 60 is disposed on the electromagnetic wave preventing component 70. The anti-electromagnetic interference component 70 can prevent the imaging module 100 from being interfered by electromagnetic waves, and ensure that the imaging module 100 obtains a better quality image. The electromagnetic wave preventing member 70 can be made of, for example, a metal material.

An electronic device according to an embodiment of the present invention includes the imaging module of any of the above embodiments.

In the above electronic device, since the focal lengths of at least two camera modules are the same, the image processing algorithm of the electronic device can be made simpler, and the cost of the electronic device can be reduced.

In the description of the present specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiment", "example", "specific example", or "some examples", etc. Particular features, structures, materials or features described in the embodiments or examples are included in at least one embodiment or example of the invention. In the present specification, the schematic representation of the above terms does not necessarily mean the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples.

While the embodiments of the present invention have been shown and described, the embodiments of the invention may The scope of the invention is defined by the claims and their equivalents.

Claims (11)

An imaging module, comprising: a flexible circuit board comprising at least two module mounting portions spaced apart and at least two connector mounting portions spaced apart, each of the module mounting portions connecting a corresponding connector mounting portion; and The at least two camera modules are disposed on the corresponding module mounting portion, and the focal lengths of the at least two camera modules are the same. The imaging module of claim 1 , wherein the number of the camera modules and the number of the module mounting portions are two. The imaging module according to claim 2, wherein the flexible circuit board comprises two spaced apart connecting portions, each of the connecting portions connecting the corresponding module mounting portion and the corresponding connection Installation unit. The imaging module of claim 2, wherein each of the camera modules comprises a printed circuit board and an image sensor disposed on the printed circuit board and electrically connected to the printed circuit board. The printed circuit board is disposed on the module mounting portion and electrically connected to the module mounting portion. The imaging module of claim 4, wherein the imaging module comprises an electrical connection pad, the electrical connection pad being disposed between the printed circuit board and the module mounting portion, and The printed circuit board and the module mounting portion are electrically connected. The imaging module of claim 4, wherein the camera module comprises a lens module disposed on the printed circuit board and located above the image sensor; The lens module includes a lens and a voice coil motor, and the voice coil motor includes a housing, and the lens is disposed in the housing, and the two housings of the two camera modules are spaced apart. The imaging module of claim 2, wherein the imaging module comprises a connector assembly, the connector assembly comprising a substrate and a connector disposed on the substrate, the substrate being disposed on the The connector mounting portion is electrically connected to the connector mounting portion. The imaging module of claim 2, wherein the imaging module comprises a glue body, and the glue body bonds the two camera modules. The imaging module of claim 2, wherein the camera module comprises a connecting side opposite to the other camera module, and the two camera modules are fixedly connected by soldering the connecting side. The imaging module of claim 2, wherein the imaging module comprises a frame, and the two camera modules are disposed in the frame and fixedly connected to the frame. An electronic device comprising the imaging module of any of claims 1-10.

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