WO2017039083A1 - Patch type thermometer using infrared light temperature measuring method - Google Patents

Abstract

The present invention relates to a patch type thermometer and a temperature sensing device contained inside the patch type thermometer. Particularly, the present invention relates to a patch type thermometer and a temperature sensing device contained therein, and in the implementation of the patch type thermometer to be easily attached to an object, specifically, the skin of the human body, the patch type thermometer uses a medium having high thermal conductivity so as to measure a temperature by using infrared light or to more efficiently sense heat dissipated from the object.

Description

Patch type thermometer using infrared temperature measurement

The present invention relates to a patch thermometer and a temperature sensing device included in the patch thermometer. Specifically, the present invention utilizes a medium having high thermal conductivity so as to measure a temperature using infrared rays or to more efficiently sense heat emitted from an object in implementing a patch-type thermometer that is easily adhered to an object, particularly a human skin. It relates to a patch-type thermometer and a temperature sensing device included therein.

In general, body temperature depends on the body's immunity and should be measured and managed accurately because it is an important measure in determining whether or not there is abnormal health. In particular, the temperature of the body tells the state of the body is very important in the health of the infant.

In addition, since the increase in body temperature of infants is likely to occur in the process of removing the virus invading the body, continuous measurement of body temperature is required for the health care of infants.

On the other hand, the conventional barometric thermometer has been used a lot of bar-type thermometer because of less detection error and lower cost than other thermometers. However, this conventional bar scale thermometer has the inconvenience of having to stand in the armpit of the subject and wait for a long time due to the glass rod shape, and fixed to the armpit because the body temperature measurement subject unconsciously or withstand the long wait time When the old thermometer was released, various problems such as the measurement of temperature became impossible or the mercury leaked due to breakage occurred.

On the other hand, in order to overcome the above problems, a patch type thermometer for directly detecting heat emitted from an infrared thermometer or an object has appeared.

The infrared thermometer is manufactured in the form of an instrument that can be inserted into the user's ear. This type of thermometer is inconvenient to carry due to its small volume. There is a disadvantage that it is not easy to measure body temperature.

In addition, in the case of a patch-type thermometer, the substrate on which the temperature sensing means is mounted, and the adhesive layer existing between the substrate and the object are made of materials having low thermal conductivity, so that the thermal energy emitted from the object, particularly the human skin, is properly transferred to the temperature sensing means. There has been a problem that cannot be delivered, and accordingly, there is a problem that it is difficult to accurately measure the temperature of the object.

The present invention has been invented on the basis of this technical background, and in order to meet the salping technical needs in the above, as well as to provide additional technical elements that cannot be easily invented by those skilled in the art.

An object of the present invention is to provide a patch-type thermometer suitable for monitoring the temperature of an object, especially a human body temperature at all times.

In particular, the present invention is characterized by implementing the temperature sensing method of the patch-type thermometer divided into an infrared method, a heat sensing method.

In the case of an infrared patch type thermometer, a patch type of an infrared type thermometer which was previously manufactured only in the form of a bulky device is proposed to provide a methodology for measuring temperature without directly contacting a user's skin with a temperature sensing means. The purpose.

In the case of the patch-type thermometer of the heat sensing method, an object having a high thermal conductivity is formed or disposed between the object and the heat sensing unit, so that the heat energy emitted from the object can be more effectively detected.

In order to solve the above problems, the temperature sensing device according to the present invention is a substrate; An infrared receiver provided on the substrate and receiving infrared light emitted from an object; A temperature calculator configured to calculate a temperature of the object from the received infrared light; And a control unit (MCU) for controlling the infrared receiver and the temperature calculator, wherein the substrate includes an infrared transmission region through which infrared rays emitted from the object are transmitted, and the infrared transmission region includes the temperature sensing device. It is present between the infrared receiver and the object when driven.

In addition, in the temperature sensing device, the infrared ray transmitting region may be an area in which a cavity is formed in the substrate, and may include an infrared ray transmitting material.

In addition, in the temperature sensing device, the substrate may be transparent and may include an infrared ray transmissive material.

In addition, in the temperature sensing device, the infrared receiver, the temperature calculator, and the controller may be included in a chip, and the chip may be disposed on the substrate.

On the other hand, the temperature sensing device according to another embodiment of the present invention is a substrate; A heat sensing unit provided on the substrate and sensing heat emitted from an object; A temperature calculator configured to calculate a temperature of the object when heat is detected by the heat detector; And a control unit (MCU) for controlling the heat sensing unit and the temperature computing unit, wherein the substrate includes a heat transfer area in which heat emitted from the object is transferred between the heat sensing unit and the object. can do.

In addition, in the temperature sensing device, the heat transfer region may include a medium capable of heat transfer, wherein the medium has a thermal conductivity of 150 W / m · K to 220 W / m · K. Can have

In this case, the medium may be aluminum nitride (AlN) or silicon carbide (SiC).

In addition, in the temperature sensing device, the substrate itself may include a heat transfer material.

On the other hand, the temperature sensing device may further include a communication unit for transmitting the temperature calculated by the temperature calculator to a remote terminal.

According to the present invention, it is possible to provide a patch-type thermometer that can be easily detached to an object, in particular, the skin of a person, there is an effect that can easily measure the temperature for the object, and unlike the conventional thermometers to always measure the temperature for the object There is also an effect that can be done.

In addition, according to the present invention, even if the patch-type thermometer is attached to the user's skin, the user can freely act so that there is an effect that can solve the conventional inconvenience that the behavior is restricted according to the body temperature measurement.

In addition, according to the present invention by allowing only the temperature sensing device in the patch-type thermometer to be recycled, there is an effect that can be used semi-permanently patch-type thermometer when replacing the adhesive portion.

In addition, according to the present invention by utilizing the infrared method means for sensing the temperature can detect the temperature without directly contacting the object, in particular the user's skin can reduce the heterogeneity that the user feels, and at the same time increase the life of the product It can be effective.

In addition, according to the present invention there is an effect that more accurate temperature measurement is possible by placing an area for the infrared ray passing through the substrate itself in order to more effectively receive infrared rays, which is a key resource for sensing temperature.

In addition, according to the present invention, by forming a medium having a high thermal conductivity in the path from the object to the heat sensing unit, there is an effect of minimizing the loss of thermal energy to allow the heat to efficiently reach the heat sensing unit.

In particular, the present invention has the effect of maximizing the heat conduction efficiency by forming a medium having high thermal conductivity in the adhesive layer which is a layer in direct contact with the skin in addition to the substrate on which the heat sensing unit is disposed.

1 is a conceptual diagram of a patch-type thermometer according to the present invention and a temperature measurement using the same.

Figure 2 shows a view from the side of the patch-type thermometer of the infrared receiving method of the patch-type thermometer according to the invention in particular.

3 and 4 illustrate an example in which a chip including an infrared receiver is mounted on a substrate.

Figure 5 shows a side view of the patch-type thermometer of the heat-sensing type of the patch-type thermometer according to the invention from the side.

Figure 6 shows the heat transfer region formed on the substrate and the appearance of the medium formed thereon.

7 is a block diagram showing the detailed configuration of the temperature sensing device according to the present invention.

8 shows a state in which vent holes are formed in the substrate and the adhesive layer in the patch-type thermometer of the infrared reception method.

FIG. 9 illustrates a heat transfer region formed in the adhesive layer and a plurality of vent holes in the patch-type thermometer of a heat sensing method.

10 illustrates an embodiment of a method in which the temperature sensing device and the patch unit are combined.

Details of the object and technical configuration of the present invention and the resulting effects will be more clearly understood by the following detailed description based on the accompanying drawings. With reference to the accompanying drawings will be described in detail an embodiment according to the present invention.

The embodiments disclosed herein should not be interpreted or used as limiting the scope of the invention. It is obvious to those skilled in the art that the description, including the embodiments herein, has a variety of applications. Accordingly, certain embodiments described in the detailed description of the present invention are illustrative for better understanding of the present invention and are not intended to limit the scope of the present invention to the embodiments.

The functional blocks shown in the figures and described below are only examples of possible implementations. Other functional blocks may be used in other implementations without departing from the spirit and scope of the detailed description. Also, while one or more functional blocks of the present invention are represented by separate blocks, one or more of the functional blocks of the present invention may be a combination of various hardware and software configurations that perform the same function.

In addition, the expression of including certain components merely refers to the presence of the components as an open expression, and should not be understood as excluding additional components.

Further, when a component is referred to as being connected or connected to another component, it should be understood that there may be a direct connection or connection to that other component, but there may be other components in between.

In addition, an expression such as 'first' and 'second' is used only for distinguishing a plurality of components, and does not limit the order or other features between the components.

On the other hand, in the description of the embodiments, each layer (film), region, pattern or structure may be "top" or "under" the substrate, each layer (film), region, pad or pattern. The base material formed at ")" includes all those formed directly or through another layer. Criteria for the top / bottom or bottom / bottom of each layer are described with reference to the drawings.

When a part is said to be "connected" with another part, it includes not only the case where it is "directly connected" but also the case where it is "indirectly connected" with the other member in between. In addition, when a part is said to "include" a certain component, this means that it may further include other components, without excluding the other components unless otherwise stated.

Hereinafter, a schematic view of the patch-type thermometer 100 and its driving method will be described with reference to FIG. 1.

Figure 1 shows an example of the use of the patch-type thermometer 100 according to the present invention attached to the object, the human skin. According to FIG. 1, the patch-type thermometer 100 includes two components, that is, a patch portion for adhering the patch-type thermometer 100 to the skin and a temperature sensing device 200 that substantially senses the temperature of the object.

On the other hand, the patch-type thermometer 100 according to the present invention is driven by using infrared rays or directly detecting the heat emitted from the object when measuring the temperature of the object to calculate the current object temperature therefrom. In the following detailed description, the former will be referred to as an infrared reception method and the latter as a heat transfer method. Figure 1 (a) shows a patch-type thermometer of the infrared reception method, (b) shows a patch-type thermometer of the heat transfer method.

In the patch-type thermometer of the infrared reception method, there are various types of infrared sensors, the present invention relates to a pyroelectric infrared temperature sensing device using a pyroelectric effect, more specifically, heat sensing.

The pyroelectric infrared temperature sensing device uses the pyroelectric properties of the pyroelectric material, which detects infrared energy emitted from an object. Pyroelectric means, titanate zirconate (PZT) as a characteristic that the surface charge changes in response to temperature changes in the crystal structure, such as, in the case where the infrared light and temperature changes of the PZT, lithium tantalate, PVF _2, PbTaO ₃ including pyroelectric element In response to this, the phenomenon in which charge is induced on the surface of the crystal. This is the nature of crystals with spontaneous polarization. As temperature changes, the magnitude of polarization changes and the change in surface charge is observed.

Meanwhile, in order to apply the infrared temperature measurement, a process for receiving infrared rays emitted from an object and a means therefor are necessary. This is performed by the infrared receiver 311 of the temperature sensing apparatus 200, which will be described later.

On the other hand, the present invention is to detect the temperature based on the infrared rays emitted from the object, in particular the human body. The infrared ray emitted from the human body has a wavelength range of 6 to 14 um, and the infrared receiver 311 according to the present invention is preferably implemented to have a measurement band of 0.2 to 20 um.

On the other hand, the temperature sensing device 200 is manufactured in a form in which the module or chip 300 is disposed on one substrate 210, wherein the substrate 210 is more effective in the infrared radiation emitted from the object In order to receive a separate infrared transmission region is provided. That is, the present invention proposes a patch-type thermometer 100 that can be attached to an object, characterized in that for measuring the temperature of the object using infrared rays, furthermore, the substrate 210 to effectively receive the infrared rays It is characterized by separately providing an infrared transmission region on the image.

Next, in the patch-type thermometer of the heat transfer method, the heat energy sensing unit, more specifically, the heat sensing unit in the patch-type thermometer 100, when the heat is applied by the heat energy emitted from the object, the principle that the volume or length increases, that is, the thermal expansion principle By using the temperature sensor can determine the temperature based on how much the deformation is due to thermal expansion.

Meanwhile, in order to apply the heat transfer type temperature measurement, a process for receiving heat emitted from an object and a means for detecting heat emitted from the object are necessary, which is a heat detection of the temperature sensing device 200 which will be described later. By the unit 313.

On the other hand, like the patch-type thermometer of the infrared reception method, the heat-transfer patch-type thermometer is also produced in the form of a module or chip 300 is disposed on one substrate 210, this time, The substrate 210 has a separate heat transfer area so as to more efficiently receive the heat emitted from the object, more specifically, the heat emitted from the object can be better transferred to the temperature sensing device. That is, the present invention proposes a patch-type thermometer 100 that can be attached to the object, characterized in that for measuring the temperature of the object in a heat transfer method, furthermore, the substrate 210 to effectively detect the heat It is characterized by separately providing a heat transfer region on the phase.

On the other hand, the patch-type thermometer 100 according to the present invention may further include a communication unit 330 for communicating with the external terminal 500, the heat energy detected by the temperature or heat transfer method calculated from the infrared of the object. The calculated temperature may be provided to the external terminal 500 wirelessly. For example, assuming that the patch-type thermometer 100 is attached to the infant's skin, the infant's body temperature may be continuously detected, and such monitoring information may be transmitted to the infant's parent terminal, that is, a terminal such as a smartphone or a PC. It can provide an environment where parents can easily check the health of the infant.

Hereinafter, the patch-type thermometer of the infrared reception method will be described first with reference to FIGS. 2 to 4, and then the patch-type thermometer of the heat transfer method will be described with reference to FIGS. 5 to 6.

2, the patch-type thermometer 100 of the infrared light receiving method according to the present invention includes a release film 110, an adhesive layer 120, a substrate 210, and a chip 300 from below. In addition, the cover film 130 for protecting the temperature sensing device 200 may be implemented in a stacked form. The patch thermometer according to the present invention includes two components, namely, a patch part and a temperature sensing device 200. At this time, the patch part includes all components except the temperature sensing device 200 that measures substantially the temperature, that is, the release film 110. ), An adhesive layer 120 and a cover film 130.

First, the temperature sensing device 200 will be described in detail.

First, the infrared ray sensing temperature sensing apparatus 200 according to the present invention includes a substrate 210 and a heat energy sensing unit. In this case, the heat energy sensing unit more specifically means the infrared receiver 311. In addition, the substrate 210 includes an infrared transmission region through which infrared light emitted from an object may pass.

In relation to the substrate 210, the substrate 210 may be rigid or flexible. For example, the substrate 210 may include glass or plastic. Specifically, the substrate 210 may include chemically strengthened / semi-hardened glass such as soda lime glass or aluminosilicate glass, polyimide (PI), polyethylene terephthalate (PET) ), Propylene glycol (PPG) polycarbonate (PC), such as reinforced or soft plastics, or may include sapphire.

In addition, the substrate 210 may include a light isotropic film. For example, the substrate 210 may include a cyclic olefin copolymer (COC), a cyclic olefin polymer (COP), an isotropic polycarbonate (PC), or an isotropic polymethyl methacrylate (PMMA).

In addition, the substrate 210 may be bent while having a partially curved surface. That is, the substrate 210 may be partially curved and partially curved. In detail, an end of the substrate 210 may have a curved surface, or may have a curved surface or a surface including a random curvature.

In addition, the substrate 210 may be a flexible substrate 210 having flexible characteristics, or a curved or bent substrate 210. That is, the patch-type thermometer 100 including the substrate 210 may also be formed to have a flexible, curved or bent characteristic. As a result, the patch-type thermometer according to the embodiment is easy to carry, can be changed to various designs, and the shape can be modified according to the movement of the body to continuously detect the body temperature.

In addition, at this time, the substrate 210 may include a plurality of perforated vent holes having a size to allow ventilation and sweat discharge, and the vent holes may be used for the normal operation of the temperature sensing device 200. Perforations may be formed only in regions other than the electrode portions formed on the substrate.

On the other hand, the size of the vent hole formed on the substrate 210 may be formed in various sizes. When the diameter is 1.0 mm or more, the durability of the substrate 210 is weakened, so that the substrate 210 is damaged when bent or impacted. If the diameter is less than 0.3mm, there may be a phenomenon that the evaporated moisture is formed in the ventilation hole and the ventilation hole is blocked and the ventilation is not smooth. Therefore, it is appropriate to manufacture the size of the diameter between 0.3mm ~ 1.0mm for durability and smooth ventilation of the substrate 210.

On the other hand, when the diameter is 1.0mm, after about 24 hours after wearing the patch on the body, a problem occurs that the damage to the substrate 210 due to the movement of the body. In order to solve this problem, when the diameter is 0.7mm, the damage of the substrate 210 hardly occurs even when used for 24 hours or more, but when 7 days or more are used, fine dust in the air easily penetrates to block the ventilation holes. This occurred. When the diameter of 0.5mm was produced, the penetration of foreign matters while maintaining long durability, it was confirmed that the sweat is discharged smoothly. Therefore, the ventilation hole of the present invention was confirmed that the diameter of 0.3mm ~ 0.5mm is most suitable for durability and smooth skin breathing.

The patch having a conventional temperature sensor may cause problems with the skin when the infant or a person who is sensitive to the skin may not be able to smoothly ventilate and release sweat when it is attached for a long time. Therefore, the present invention can perforate the vent hole in the substrate 210 to facilitate the ventilation and sweat discharge to the patch attachment site can reduce the possibility of causing problems on the skin even if the infant or a person sensitive to the patch attach the patch for a long time.

As described above, the substrate 210 of the temperature sensing device 200 according to the present invention may be made of a material of various physical properties, and particularly has a flexible property to prevent damage due to movement when attached to the skin of a person. It is desirable to. In addition, a ventilation hole may be further included in order to accurately measure body temperature and improve a user's wearing comfort.

On the other hand, in the patch-type thermometer of the infrared reception method, the substrate 210 may further include an infrared transmission region to more effectively receive the infrared radiation emitted from the object.

3 and 4 exemplarily show an embodiment in which an infrared transmission region is implemented on the substrate 210.

First, FIG. 3 illustrates a state in which an infrared transmission region is realized by forming a cavity having a predetermined size in a substrate 210 and filling a material through which infrared light can pass through the cavity. The cavity refers to a predetermined volume of empty space formed on the substrate 210, and the cavity may be filled by filling a material through which infrared light can pass, for example, transparent plastic. As can be seen in FIG. 3, the cavity may be formed on the substrate 210 to be matched with the chip 300, more precisely the infrared receiver 311, which is preferably disposed on the substrate 210, the interior of the cavity. The medium filled in may also allow the infrared receiver 311 to match its area.

On the other hand, the cavity may be filled with a material capable of transmitting infrared rays therein, but also for the purpose of simply passing the infrared rays while filled with no material and, in other words, filled with air. Can be utilized. That is, a cavity having a predetermined size is formed in the substrate 210, and the infrared receiver 311 directly transmits infrared rays from the object by allowing the cavity, that is, the empty space (or air layer), to pass infrared rays generated from the object. Can be received.

Next, FIG. 4 shows that the substrate 210 itself is made of a transparent material so that infrared rays can pass through any area, and the chip 300, more precisely, the infrared receiver 311 is provided on the transparent substrate 210. By doing so, the infrared receiver 311 can effectively receive the infrared rays emitted from the object.

That is, in FIG. 4, since the substrate 210 itself is transparent, it is not necessary to form a cavity as shown in FIG. 3, and the chip 300, that is, the infrared receiver 311 is mounted at any position on the substrate 210 to sense temperature. The device 200 can be completed. On the other hand, the infrared transmission region in FIG. 4 is to be understood that the area where the chip 300, more precisely the infrared receiver 311 abuts the transparent substrate 210 is the infrared transmission region.

On the other hand, the material of the substrate itself as a medium for filling the cavity or for transmitting infrared rays is preferably i) having a large refractive index ii) having low thermal dispersion iii) having low dispersion and absorption iv) It is required that the antireflective coating be easy and durable. Materials satisfying the above conditions include germanium (Ge), silicon (Si), zinc sulfide (ZnS), zinc ceranide (ZnSe), magnesium fluoride (MgF ₂ ), sapphire, and the like. Materials may be included as material in the cavity or as material of the substrate itself.

On the other hand, the infrared receiver 311 is provided on the substrate 210 described above.

The infrared receiver 311 receives the infrared rays emitted from the object through the substrate 210 and the infrared transmission region of the substrate 210 described above.

The infrared receiver 311 may include, as a detailed configuration, a lens for concentrating infrared rays into a single point, a filter for filtering an area other than a wavelength of a required region among the infrared rays, and a photon detector for hitting photons in the infrared rays.

In addition, the infrared receiver 311 may be present in a form included in one configuration of the chip 300 mounted on the substrate 210. 2 to 4, a chip 300 is mounted on the substrate 210, where the chip 300 may include a module for measuring a temperature of an object. The infrared receiver 311 may be mounted on the substrate 210 while being provided in the chip 300 as one of these modules.

Hereinafter, the patch-type thermometer structure of the heat transfer method will be described with reference to FIGS. 5 and 6. Like the patch-type thermometer of the infrared reception method, the patch-type thermometer of the heat transfer method is composed of two components, the patch portion and the temperature sensing device 200. Hereinafter, the temperature sensing device 200 will be described.

Referring to FIG. 5, the temperature sensing device 200 includes a substrate 210 and a heat energy sensing unit, more specifically, a heat sensing unit 313, in particular, the substrate 210 is heat emitted from an object. The heat transfer region capable of being transferred (in the drawing, the heat transfer region on the substrate 210 is indicated as the first heat transfer region and the heat transfer region on the adhesive layer 120 as the second heat transfer region).

6 exemplarily illustrates a state in which a heat transfer region is implemented in the substrate 210.

Referring to FIG. 6, a cavity having a predetermined size is formed in the substrate 210, and a heat transfer region is implemented by filling a medium 400 through which heat can be transferred to the cavity. The cavity refers to a predetermined volume of empty space formed on the substrate 210, and the cavity may be filled with a material capable of conducting heat, for example, a metallic medium 400. As can also be seen in FIG. 6, the cavity may be formed on the substrate 210 to match the chip 300, more precisely the thermal sensing unit 313, which is preferably disposed on the substrate 210. An internal medium may also allow the thermal sensing unit 313 to match its area. In this case, the medium 400 for heat conduction may be formed larger than the contact surface with the heat sensing unit 313.

Meanwhile, as the medium 400, it is preferable to use a ceramic material having a high thermal conductivity and at the same time being insulated from the heat sensing unit 313.

Examples of media that can be filled in the cavity as having thermal conductivity are as follows. In Table 1 below, the unit of thermal conductivity is W / (mK).

medium AlN SiC BeO Al ₂ O ₃ Thermal Conductivity (W / mK) 170-220 150 250-300 20-30

Referring to the above example, it is preferable to use aluminum nitride (AlN) or silicon carbide (SiC) as the medium.

That is, in consideration of manufacturing cost, it is preferable to use the compound whose thermal conductivity is 150 W / m * K or more and 220 W / m * K. In general, the higher the thermal conductivity, the higher the price of a material that can be used as a medium, and considering the cost, the compound within the above range including the thermal conductivity of aluminum nitride and silicon carbide, which can be synthesized at a relatively low cost. Preference is given to using.

Aluminum nitride is a compound having a thermal conductivity of 170 to 220 W / m · K, and has a thermal expansion coefficient close to that of silicon, and thus is a medium having excellent compatibility with silicon. Generally, it is used as a material for a heat dissipation substrate, but in the present invention, as a material to fill the heat transfer region, it functions to efficiently transfer heat emitted from an object.

In addition, silicon carbide is a compound having a thermal conductivity of 150 W / m · K and is characterized by high hardness, high decomposition temperature, and high thermal conductivity. Silicon carbide is also generally utilized for many purposes for refractory purposes, but in the present invention, it effectively transfers heat emitted from the object to the heat sensing unit 313.

On the other hand, the medium is not necessarily limited to aluminum nitride, silicon carbide, it is to be understood that all of the metallic medium having a certain level of thermal conductivity can be utilized. In particular, referring to the above table, a compound having a property of thermal conductivity of 20 W / m · K or more and 300 W / m · K may be utilized. In other words, in the conventional adhesive layer for bonding to human skin, polyurethane, PVC and the like were used, but their thermal conductivity was only 0.018, 0.14, etc., respectively, so as to block most of the heat emitted from the object. However, according to the present invention, the heat transfer to the heat sensing unit 313 can be efficiently performed by forming a medium having high thermal conductivity as a heat transfer region on the substrate, and as will be described later.

The above-described cavity formed on the substrate 210 and a medium that can be filled therein (medium. 400), and among them, a metallic medium having high thermal conductivity have been described. However, according to the present invention, it is to be understood that an embodiment in which a cavity is formed in the substrate 210 and a metal medium is not filled therein, ie, air is used as a medium is considered. . In this case, a cavity is formed on the substrate 210, but no material is artificially filled, and an air medium may be implemented to transfer heat energy generated from an object.

Meanwhile, the thermal sensing unit 313 is provided on the substrate 210 described above.

The heat detector 313 receives and transmits heat emitted from the object through the substrate 210 and the heat transfer region of the substrate 210 described above.

The thermal sensing unit 313 may be present in a form included in one configuration of the chip 300 disposed on the substrate 210. 5 to 6, a chip 300 is disposed on the substrate 210, where the chip 300 may include a module for measuring a temperature of an object. The thermal sensing unit 313 may be disposed on the substrate 210 while being provided in the chip 300 as one of such modules.

On the other hand, Figure 7 shows a detailed configuration of the temperature sensing device 200 according to the present invention in a block diagram.

According to FIG. 7, the temperature sensing device 200 is a means for detecting thermal energy from an object (thermal energy sensing unit 310), in addition to the infrared receiver 311 or the thermal sensing unit 313, the temperature calculating unit 320, The communication unit 330 and the control unit 340 may further include.

The temperature calculator 320 functions to calculate the temperature of the object from the infrared rays received by the infrared receiver 311 or the heat detector 313, that is, calculate the temperature of the object as one value.

In the case of the infrared reception method, the infrared receiver 311 may know the magnitude of the light amount according to the extent to which the infrared rays emitted from the object hit the detector, and the temperature calculator 320 may recognize the magnitude of the light amount. Convert to a temperature value. In this case, the process of converting the amount of light into a specific value may be performed by, for example, measuring the magnitude of voltage and current generated in proportion to the amount of light and comparing it with a predetermined temperature value.

In the case of the heat transfer method, the heat detector 313 may know the amount of heat according to the degree of expansion of the heat detector 313 made of metal according to the heat energy emitted from the object, and the temperature calculator 320 The magnitude of the calories is converted into a temperature value that can be perceived by humans. In this case, the process of converting the amount of heat into a specific value may be performed by, for example, measuring a volume expansion amount of the heat sensing unit 313 made of metal and comparing the temperature with a preset temperature value. have.

An operation example of the abnormal temperature calculator 320 has been described. However, this has been described with reference to some embodiments for calculating the temperature calculating unit 320 temperature value, in addition to that it will be understood that the temperature of the object can be calculated in various ways.

On the other hand, the temperature sensing device 200 according to the present invention may further include a communication unit 330.

The communicator 330 is provided to enable the temperature sensing device 200 to transmit and receive data with the external terminal 500. In particular, the temperature sensing device 200 may be a target of the object previously calculated through the communication unit 330. The temperature can be transmitted.

In this case, the communication unit 330 may transmit and receive data through wireless communication, and may include NFC, Bluetooth, Wi-Fi, etc. In addition, the communication unit 330 may include a mobile communication network provided by a mobile communication company.

In addition, the temperature sensing device 200 according to the present invention may further include a controller 340 for controlling the infrared receiver 311 or the heat detector 313, the temperature calculator 320, and the communicator 330 described above. Can be. The controller 340 may include at least one arithmetic means and storage means, wherein the arithmetic means may be a general-purpose central processing unit (CPU), or a programmable device element (CPLD, FPGA) implemented for a specific purpose. ), Or an ASIC or a microcontroller chip 300. In addition, as the storage means, a volatile memory device, a nonvolatile memory device, or a nonvolatile electromagnetic storage device may be utilized.

Meanwhile, the infrared receiver 311 or the heat detector 313, the temperature calculator 320, and the controller 340 may exist as a module in one chip 300, and according to the design, the communication unit ( 330 may be further included.

The substrate 210 and each functional unit of the temperature sensing device 200 according to the present invention have been described above.

Hereinafter, the patch will be described.

2 or 5, the patch-type thermometer 100 includes a release film 110, an adhesive layer 120, and a cover film 130 in addition to the temperature sensing device 200.

The release film 110 has a uniform thickness and is a film used for protecting a temporary support or an adhesive layer of an adhesive component material, and serves to protect the adhesive layer 120 attached to a user's skin. That is, when the patch-type thermometer 100 is attached to the user's skin, the adhesive layer 120 is exposed when the release film 110 is removed, and the exposed adhesive layer 120 is attached to the user's skin.

Next, the adhesive layer 120 refers to a layer directly touching the user's skin as described above. One surface of the adhesive layer 120 is adhered to the user's skin, and at the same time, the substrate 210 of the temperature sensing device 200 is adhered to the rear surface of the adhesive layer 120.

Meanwhile, referring to FIG. 2, according to the present invention, an infrared ray transmitting region for passing infrared rays may also be formed in the adhesive layer 120 in the infrared ray sensing temperature sensing device 200. In this detailed description, the infrared transmission region formed on the substrate 210 is referred to as a first infrared transmission region and the infrared transmission region formed on the adhesive layer 120 is referred to as a second infrared transmission region.

The second infrared transmission region may be formed in a manner similar to that of forming the first infrared transmission region on the substrate 210. That is, the predetermined region of the adhesive layer 120 may be vacant, that is, the predetermined region of the adhesive layer 120 may be freely passed through the region through which the infrared rays are perforated. Alternatively, by forming a predetermined region of the adhesive layer 120 as an adhesive layer made of a transparent material, infrared rays may pass through, or by forming the adhesive layer itself as a transparent material, the infrared rays emitted from the object may pass therethrough.

On the other hand, the second infrared transmission region may also allow the infrared light to pass through the ventilation hole by densely forming a ventilation hole in a predetermined region of the adhesive layer 120. At this time, the adhesive layer 120 may be formed in the entire surface ventilating holes for ventilation and sweat discharge, in particular in the second infrared transmission region by increasing the number of ventilation holes per unit area, that is, density compared to other areas This allows the infrared to pass through smoothly.

FIG. 8 illustrates a vent hole formed in the substrate 210 and the adhesive layer 120 in the infrared ray sensing temperature sensing device 200. As mentioned above, vent holes may be formed in the substrate 210 to improve breathability when attached to the user's skin, and vent holes may be formed on the entire surface of the substrate except for the first infrared transmission region. In addition, when a predetermined electrode is formed on the substrate at this time, vent holes may be formed in the substrate region except for the portion where the electrode is formed.

Meanwhile, vent holes may also be formed in the adhesive layer 120, and vent holes may be formed over the entire area of the adhesive layer. Alternatively, vent holes may be formed on the surface of the adhesive layer 120 except for the second infrared ray transmitting region of the adhesive layer 120, or a portion of the second infrared ray transmitting region may have more vent holes per unit area. That is, vent holes may be formed more densely.

Meanwhile, referring to FIG. 5, according to the present invention, a heat transfer area for transferring heat to the adhesive layer 120 may also be formed in the heat transfer type temperature sensing device 200. In this detailed description, a heat transfer region formed on the substrate 210 is referred to as a first heat transfer region and a heat transfer region formed on the adhesive layer 120 as a second heat transfer region.

The second heat transfer region may be formed in a manner similar to that of forming the first heat transfer region on the substrate 210.

That is, referring to FIG. 5, the predetermined region of the adhesive layer 120 is made void of the void region, that is, the predetermined region of the adhesive layer 120, and is filled from the object by filling a medium having high thermal conductivity thereto. The heat can be transferred effectively through the area.

In addition, referring to FIG. 9, a plurality of vent holes may be formed in the adhesive layer 120. That is, the adhesive layer 120 is a part directly contacting an object, in particular, a human skin, and in particular, the presence of moisture on the adhesive surface may cause a user's wearing feeling to be disturbed or a trouble may occur in the corresponding skin region, as shown in FIG. 9. When the plurality of vent holes 450 are formed at 120, moisture may escape through the vent holes 450, thereby improving the fit.

Meanwhile, the cover film 130 is a film for covering and protecting the temperature sensing device 200 as a whole. The cover film 130 surrounds the upper portion of the temperature sensing device 200 to block exposure to the outside to maintain mechanical and electrical functions of the device. And protects from infiltration of foreign matter so that the patch-type thermometer 100 functions normally.

10 shows an embodiment of a structure in which the temperature sensing device according to the present invention can be combined with a patch part.

FIG. 10A illustrates an embodiment in which the patch part, among which the cover film 130 and the adhesive layer 120 are independently present, surrounds the temperature sensing device 200. That is, the temperature sensing device 200 may be disposed on the adhesive layer 120, and the completed patch-type thermometer may be realized by covering the cover film 130 over the temperature sensing device 200. In this case, the second infrared ray passing region or the second heat transfer region may be formed in the adhesive layer 120 as described above.

FIG. 10 (b) shows an embodiment in which the patch part, especially the cover film 130 and the adhesive layer 120, are integrally present to enclose the temperature sensing device 200. That is, the temperature sensing device 200 may be disposed in a space created therein in a state where the cover film 130 and the adhesive layer 120 are integrally formed. In addition, at this time, the cover film 130 may be implemented so that one side can be detached from the adhesive layer 120 so that the user can replace the temperature sensing device 200 if necessary.

In this case, a second infrared ray passing region or a second heat transfer region may be formed in the adhesive layer 120, and unlike (a), a plurality of second infrared ray passing regions or second heat transfer regions may be formed. Will have to understand. In this case, the formation region of the second infrared ray passing region or the second heat transfer region may be changed according to the arrangement of the infrared receiver 311 or the heat sensing unit 313 included in the temperature sensing device 200.

With reference to the drawings has been described with respect to the patch-type thermometer and the temperature sensing device according to the present invention.

Those skilled in the art to which the present invention pertains should understand that the present invention may be implemented in other specific forms without changing the technical spirit or essential features, and the embodiments described above are exemplary in all respects and limited. It should be understood as not something that is adversary. In addition, the scope of the present invention is represented by the appended claims rather than the detailed description, and all changes or modifications derived from the meaning and scope of the claims and equivalent concepts are included in the scope of the present invention. Should be.

Claims (10)

In the temperature sensing device included in the patch-type thermometer, Board; An infrared receiver provided on the substrate and receiving infrared light emitted from an object; A temperature calculator configured to calculate a temperature of the object from the received infrared light; And A controller (MCU) for controlling the infrared receiver and the temperature calculator; Including; The substrate includes an infrared transmission region through which infrared rays emitted from the object are transmitted, wherein the infrared transmission region is present between the infrared receiver and the object when the temperature sensing device is driven. The method of claim 1, Infrared transmission region, A region in which a cavity is formed in the substrate, the temperature sensing device comprising an infrared transmissive material. The method of claim 1, And the substrate is transparent and comprises an infrared transmissive material. The method of claim 1, The infrared receiver, the temperature calculator and the controller are included in the chip. And the chip is disposed on the substrate. In the temperature sensing device included in the patch-type thermometer, Board; A heat sensing unit provided on the substrate and sensing heat emitted from an object; A temperature calculator configured to calculate a temperature of the object when heat is detected by the heat detector; And A control unit (MCU) for controlling the heat detector and the temperature calculator; Including; The substrate is a temperature sensing device, characterized in that it exists between the heat sensing unit and the object includes a heat transfer region to which heat emitted from the object is transferred. The method of claim 5, Heat transfer zone, Temperature sensing device comprising a medium capable of heat transfer. The method of claim 6, And the medium has a thermal conductivity of 150 W / m · K to 220 W / m · K. The method of claim 6, And the medium is aluminum nitride (AlN) or silicon carbide (SiC). The method of claim 5, And the substrate comprises a heat transfer material. The method according to claim 1 or 5, A communication unit for transmitting the temperature calculated by the temperature calculator to a remote terminal; Temperature sensing device further comprising.

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