WO2017036511A1 - Electric multilayer component for surface-mount technology and method of producing an electric multilayer component - Google Patents
Electric multilayer component for surface-mount technology and method of producing an electric multilayer component Download PDFInfo
- Publication number
- WO2017036511A1 WO2017036511A1 PCT/EP2015/069844 EP2015069844W WO2017036511A1 WO 2017036511 A1 WO2017036511 A1 WO 2017036511A1 EP 2015069844 W EP2015069844 W EP 2015069844W WO 2017036511 A1 WO2017036511 A1 WO 2017036511A1
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- WO
- WIPO (PCT)
- Prior art keywords
- main surface
- electrode layer
- multilayer component
- base body
- electric multilayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/1006—Thick film varistors
Definitions
- Electric multilayer components comprise a stack of layers formed from ceramic material with inner electrode layers arranged between the ceramic layers. Outer electrodes are provided for external electric connections.
- a varistor is an electronic component with an electrical resistivity that varies with the applied voltage.
- a typical application of multilayer varistor devices is electrostatic discharge protection for electronic circuits.
- Surface-mount technology is a method of producing electronic circuits in which electronic components are mounted on the surface of a printed circuit board. An electronic device produced in this technology is called a surface-mount device.
- EP 2 201 585 Bl discloses an electric multilayer component comprising a stack of dielectric layers and electrode layers arranged between the dielectric layers. Each electrode layer is connected to one of two outer contacts, which are located on the same outer surface of the stack and are provided for connection in flipchip technology.
- US 2014/0252403 Al discloses an ESD protection component with a base body comprising a ceramic material. Contact areas that are suitable for flip-chip technology are arranged on one of the outer surfaces of the base body. A floating inner
- An object of the invention is to disclose an electric multilayer component for surface-mount technology that can easily be produced.
- a further object is to disclose a method of producing such an electric multilayer component.
- the electric multilayer component comprises a base body including a multilayered ceramic material, a first electrode layer and a second electrode layer arranged on a first main surface of the base body, the first and second electrode layers being spaced apart from one another by an intermediate area of the first main surface, and a third electrode layer arranged outside the base body on a second main surface of the base body, opposite the first main surface, as a
- the first and second electrode layers are provided as contact areas for external electric connection.
- the third electrode layer covers areas of the second main surface that are opposite the first and second electrode layers .
- the electrode layers may comprise a metal paste.
- electrode layers comprise copper or silver.
- An insulation material like glass or a silicon-based adhesive may cover surface areas of the base body outside the
- At least one slot is formed in the intermediate area of the first main surface. The slot may extend across the space between the electrode layers and may thus separate the first electrode layer and the second electrode layer.
- the method of producing an electric multilayer component comprises forming a base body including a multilayered ceramic material, and applying a metal paste to form
- a first electrode layer and a second electrode layer are formed on the first main surface, spaced apart from one another by an intermediate area of the first main surface, and a third electrode layer is formed on the second main surface as a continuous layer covering areas of the second main surface that are opposite the first electrode layer and the second electrode layer.
- an insulation layer is formed on the second main surface as a continuous layer covering areas of the second main surface that are opposite the first electrode layer and the second electrode layer.
- Figure 1 shows a top view onto the first main surface of an embodiment of the electric multilayer component.
- Figure 3 shows a top view onto the first main surface of a further embodiment.
- a first electrode layer 1 and a second electrode layer 2 are provided as contact areas for external electric connections of the electric multilayer component and are arranged at a distance from one another on the first main surface 31.
- the first and second electrode layers 1, 2 are sufficiently large to facilitate the electric connection, in particular the connection to contact areas of a printed circuit board, for instance .
- Electrode layers 1, 2 There is no restriction on the shape of the electrode layers 1, 2.
- a symmetrical arrangement of congruent electrode layers 1, 2, as shown in Figure 1, may be especially suitable.
- An intermediate area 5 of the first main surface 31 is left free from the electrode layers 1, 2, which are thus spaced apart from one another to inhibit leakage currents and flashover.
- Figure 2 shows a top view onto a second main surface 32 opposite the first main surface 31 of a base body 3.
- a third electrode layer 4 is applied on the second main surface 32 as a continuous layer.
- the third electode layer 4 comprises a portion that is located opposite the first electrode layer 1 and a further portion that is located opposite the second electrode layer 2.
- An insulation material 7 may be applied to the electric multilayer component to cover surface areas of the base body 3 that are not covered by the electrode layers 1, 2, 4, as indicated in Figure 4 by way of example.
- the insulation material 7, which may be a glass or a silicon-based adhesive, helps to prevent leakage currents or flashover between the electrode layers 1, 2, 4.
- the insulation material 7 may be employed on any embodiment of the electric multilayer
- the metal paste that is used for the electrode layers 1, 2, 4 can be applied on the first and second main surfaces 31, 32 by printing, for instance.
- the metal paste may comprise copper or silver, for instance. If a slot 6 or a plurality of slots are to be provided, they may be formed before or after the application of the electrode layers 1, 2, 4.
- a further insulation material may be applied to cover and protect the entire electric multilayer component after mounting.
- the described electric multilayer component can be easily manufactured by the described method, and it allows easy mounting on a printed circuit board in surface-mount
- a further advantage is the reduced height, which is enabled by the large-area third electrode layer connecting parts of the electric multilayer component.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The electric multilayer component comprises a base body (3) including a multilayered ceramic material, a first electrode layer (1) and a second electrode layer (2) arranged on a first main surface (31) of the base body, the first and second electrode layers being spaced apart from one another by an intermediate area (5) of the first main surface, and a third electrode layer arranged outside the base body on a second main surface of the base body, opposite the first main surface, as a continuous layer. The first and second electrode layers are provided as contact areas for external electric connection. The third electrode layer covers areas of the second main surface that are opposite the first and second electrode layers.
Description
Description
Electric multilayer component for surface-mount technology and method of producing an electric multilayer component
Electric multilayer components comprise a stack of layers formed from ceramic material with inner electrode layers arranged between the ceramic layers. Outer electrodes are provided for external electric connections. A varistor is an electronic component with an electrical resistivity that varies with the applied voltage. A typical application of multilayer varistor devices is electrostatic discharge protection for electronic circuits. Surface-mount technology is a method of producing electronic circuits in which electronic components are mounted on the surface of a printed circuit board. An electronic device produced in this technology is called a surface-mount device. EP 2 201 585 Bl discloses an electric multilayer component comprising a stack of dielectric layers and electrode layers arranged between the dielectric layers. Each electrode layer is connected to one of two outer contacts, which are located on the same outer surface of the stack and are provided for connection in flipchip technology.
US 2014/0252403 Al discloses an ESD protection component with a base body comprising a ceramic material. Contact areas that are suitable for flip-chip technology are arranged on one of the outer surfaces of the base body. A floating inner
electrode is arranged near the underside of the base body, the distance being in the range from 2 to 100 ceramic grains.
An object of the invention is to disclose an electric multilayer component for surface-mount technology that can easily be produced. A further object is to disclose a method of producing such an electric multilayer component.
These objects are achieved with the electric multilayer component according to claim 1 and with the method of producing an electric multilayer component according to claim 8.
The electric multilayer component comprises a base body including a multilayered ceramic material, a first electrode layer and a second electrode layer arranged on a first main surface of the base body, the first and second electrode layers being spaced apart from one another by an intermediate area of the first main surface, and a third electrode layer arranged outside the base body on a second main surface of the base body, opposite the first main surface, as a
continuous layer. The first and second electrode layers are provided as contact areas for external electric connection. The third electrode layer covers areas of the second main surface that are opposite the first and second electrode layers . The electrode layers may comprise a metal paste. In
embodiments of the electric multilayer component, the
electrode layers comprise copper or silver.
An insulation material like glass or a silicon-based adhesive may cover surface areas of the base body outside the
electrode layers.
In further embodiments of the electric multilayer component, at least one slot is formed in the intermediate area of the first main surface. The slot may extend across the space between the electrode layers and may thus separate the first electrode layer and the second electrode layer.
The method of producing an electric multilayer component comprises forming a base body including a multilayered ceramic material, and applying a metal paste to form
electrode layers on opposite main surfaces of the base body. A first electrode layer and a second electrode layer are formed on the first main surface, spaced apart from one another by an intermediate area of the first main surface, and a third electrode layer is formed on the second main surface as a continuous layer covering areas of the second main surface that are opposite the first electrode layer and the second electrode layer. Optionally, an insulation
material is applied to cover surface areas of the base body outside the electrode layers.
The following is a detailed description of the invention and its advantages in conjunction with the accompanying drawings.
Figure 1 shows a top view onto the first main surface of an embodiment of the electric multilayer component.
Figure 2 shows a top view onto the second main surface.
Figure 3 shows a top view onto the first main surface of a further embodiment.
Figure 4 shows a cross section at the position indicated in
Figure 3.
Figure 1 shows a top view onto a first main surface 31 of a base body 3 for an embodiment of the electric multilayer component. The base body 3 is formed as a multilayer ceramic body, which may include inner electrodes between the ceramic layers. Electric multilayer components are known per se and need not be described here in more detail. The base body 3 may be provided for a varistor, for instance. Details of the internal structure of the base body 3 are not essential for the invention and are therefore not further specified.
A first electrode layer 1 and a second electrode layer 2 are provided as contact areas for external electric connections of the electric multilayer component and are arranged at a distance from one another on the first main surface 31. The first and second electrode layers 1, 2 are sufficiently large to facilitate the electric connection, in particular the connection to contact areas of a printed circuit board, for instance .
There is no restriction on the shape of the electrode layers 1, 2. A symmetrical arrangement of congruent electrode layers 1, 2, as shown in Figure 1, may be especially suitable. An intermediate area 5 of the first main surface 31 is left free from the electrode layers 1, 2, which are thus spaced apart from one another to inhibit leakage currents and flashover.
Figure 2 shows a top view onto a second main surface 32 opposite the first main surface 31 of a base body 3. A third electrode layer 4 is applied on the second main surface 32 as a continuous layer. The third electode layer 4 comprises a portion that is located opposite the first electrode layer 1
and a further portion that is located opposite the second electrode layer 2.
The third electrode layer 4 provides a series connection between the part of the electric multilayer component that is connected to the first electrode layer 1 as terminal and the part of the electric multilayer component that is connected to the second electrode layer 2 as terminal. If both parts are provided as varistors, for instance, the arrangement of the electrode layers 1, 2, 4 yields a series connection of the two parts, which tolerates twice the voltage that each varistor is able to sustain individually. In this case the series connection corresponds to an electric multilayer component of about the double height. With the decribed arrangement of the electrode layers 1, 2, 4, the necessary height of the stack of ceramic layers can substantially be reduced .
The electrode layers 1, 2, 4 may be formed by a metal paste. The material of the electrode layers 1, 2, 4 may include copper and/or silver. Other metals that are employed for contact areas may be suitable as well.
Figure 3 shows a top view onto the first main surface 31 of a further embodiment. Leakage currents, which may occur between the first electrode layer 1 and the second electrode layer 2, can be inhibited by increasing the creepage length, which is the length of the path of a leakage current along the first main surface 31 from one electrode layer to the other. To increase the creepage length, the first main surface 31 can be provided with at least one recess or slot 6 between the electrode layers 1, 2.
Figure 4 shows a cross section of the embodiment according to Figure 3 at the position indicated in Figure 3 by a dotted line. In the example shown in Figures 3 and 4, the slot 6 extends over the entire space between the electrode layers 1, 2. Instead, the slot 6 may be narrower, so that it does not extend up to the electrode layers 1, 2. If the slot 6 is narrower than the one shown in Figures 3 and 4, more than one slot 6 may be applied. A corrugation of the intermediate area 5 of the first main surface 31 may be obtained by a plurality of similar slots, for instance.
An insulation material 7 may be applied to the electric multilayer component to cover surface areas of the base body 3 that are not covered by the electrode layers 1, 2, 4, as indicated in Figure 4 by way of example. The insulation material 7, which may be a glass or a silicon-based adhesive, helps to prevent leakage currents or flashover between the electrode layers 1, 2, 4. The insulation material 7 may be employed on any embodiment of the electric multilayer
component, independent of the presence of a slot as in the embodiment according to Figures 3 and 4, and may also be applied to lateral surfaces of the base body 3, outside the main surfaces 31, 32. An especially suitable method of producing the electric multilayer component includes an application of a metal paste for the formation of the electrode layers 1, 2, 4. The base body 3 comprising the internal electrodes according to the intended function of the electric multilayer component may be produced in a conventional way, including sintering of ceramic material. Then the first electrode layer 1 and the second electrode layer 2 is applied to the first main surface
31, and the third electrode layer 4 is applied to the
opposite second main surface 32.
The metal paste that is used for the electrode layers 1, 2, 4 can be applied on the first and second main surfaces 31, 32 by printing, for instance. The metal paste may comprise copper or silver, for instance. If a slot 6 or a plurality of slots are to be provided, they may be formed before or after the application of the electrode layers 1, 2, 4.
The surface areas of the base body 3 that are not covered by the electrode layers 1, 2, 4 may be covered with insulation material like glass or a silicon-based adhesive, for
instance. A further insulation material may be applied to cover and protect the entire electric multilayer component after mounting.
The described electric multilayer component can be easily manufactured by the described method, and it allows easy mounting on a printed circuit board in surface-mount
technology, in particular applying a conventional soldering process. A further advantage is the reduced height, which is enabled by the large-area third electrode layer connecting parts of the electric multilayer component.
List of reference numerals
1 first electrode layer
2 second electrode layer
3 base body
31 first main surface
32 second main surface
4 third electrode layer
5 intermediate area
6 slot
7 insulation material
Claims
1. An electric multilayer component, comprising:
- a base body (3) including a multilayered ceramic
material, the base body (3) having a first main surface (31) and an opposite second main surface (32), and
- a first electrode layer (1) and a second electrode layer (2) arranged on the first main surface (31), spaced apart from one another by an intermediate area (5) of the first main surface (31) and provided as contact areas for external electric connection,
characterized in that
- a third electrode layer (4) is arranged outside the base body (3) on the second main surface (32) as a continuous layer and covers areas of the second main surface (32) that are opposite the first electrode layer (1) and the second electrode layer (2).
2. The electric multilayer component of claim 1, wherein
the electrode layers (1, 2, 4) comprise a metal paste.
3. The electric multilayer component of claim 1 or 2,
wherein
the electrode layers (1, 2, 4) comprise copper or silver.
4. The electric multilayer component of one of claims 1 to 3, further comprising:
an insulation material (7) covering surface areas of the base body (3) outside the electrode layers (1, 2, 4) .
5. The electric multilayer component of claim 4, wherein
the insulation material (7) comprises a glass or a silicon-based adhesive.
6. The electric multilayer component of one of claims 1 to 5, further comprising:
at least one slot (6) formed in the intermediate area (5) of the first main surface (31) .
7. The electric multilayer component of claim 6, wherein
the at least one slot (6) separates the first electrode layer (1) and the second electrode layer (2) .
8. A method of producing an electric multilayer component, comprising :
- forming a base body (3) including a multilayered ceramic material, the base body (3) having a first main surface
(31) and an opposite second main surface (32), and
- applying a metal paste to form a first electrode layer (1) and a second electrode layer (2) on the first main surface (31), spaced apart from one another by an
intermediate area (5) of the first main surface (31), and a third electrode layer (4) on the second main surface
(32) as a continuous layer covering areas of the second main surface (32) that are opposite the first electrode layer (1) and the second electrode layer (2) .
9. The method of claim 8, further comprising:
applying an insulation material (7) to cover surface areas of the base body (3) outside the electrode layers (1, 2, 4) .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP2015/069844 WO2017036511A1 (en) | 2015-08-31 | 2015-08-31 | Electric multilayer component for surface-mount technology and method of producing an electric multilayer component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP2015/069844 WO2017036511A1 (en) | 2015-08-31 | 2015-08-31 | Electric multilayer component for surface-mount technology and method of producing an electric multilayer component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2017036511A1 true WO2017036511A1 (en) | 2017-03-09 |
Family
ID=54064314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/EP2015/069844 Ceased WO2017036511A1 (en) | 2015-08-31 | 2015-08-31 | Electric multilayer component for surface-mount technology and method of producing an electric multilayer component |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO2017036511A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110400665A (en) * | 2018-04-24 | 2019-11-01 | 成都铁达电子股份有限公司 | A kind of low natural capacity piezoresistor of chip type |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3694710A (en) * | 1970-04-13 | 1972-09-26 | Mallory & Co Inc P R | Variable capacitance multilayered ceramic capacitor |
| US20070217110A1 (en) * | 2005-11-22 | 2007-09-20 | Yung-Hao Lu | Tri-phase surge protector and its manufacturing method |
| DE102011109007A1 (en) * | 2011-07-29 | 2013-01-31 | Epcos Ag | Method for producing an electrical component and an electrical component |
| US20140252403A1 (en) | 2011-10-28 | 2014-09-11 | Epcos Ag | ESD Protection Component and Component Comprising an ESD Protection Component and an LED |
| EP2201585B1 (en) | 2007-09-19 | 2015-04-22 | Epcos AG | Electric multilayer component |
-
2015
- 2015-08-31 WO PCT/EP2015/069844 patent/WO2017036511A1/en not_active Ceased
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3694710A (en) * | 1970-04-13 | 1972-09-26 | Mallory & Co Inc P R | Variable capacitance multilayered ceramic capacitor |
| US20070217110A1 (en) * | 2005-11-22 | 2007-09-20 | Yung-Hao Lu | Tri-phase surge protector and its manufacturing method |
| EP2201585B1 (en) | 2007-09-19 | 2015-04-22 | Epcos AG | Electric multilayer component |
| DE102011109007A1 (en) * | 2011-07-29 | 2013-01-31 | Epcos Ag | Method for producing an electrical component and an electrical component |
| US20140252403A1 (en) | 2011-10-28 | 2014-09-11 | Epcos Ag | ESD Protection Component and Component Comprising an ESD Protection Component and an LED |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110400665A (en) * | 2018-04-24 | 2019-11-01 | 成都铁达电子股份有限公司 | A kind of low natural capacity piezoresistor of chip type |
| CN110400665B (en) * | 2018-04-24 | 2021-09-28 | 成都铁达电子股份有限公司 | Chip type low inherent capacitance piezoresistor |
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