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WO2017030140A1 - Dispositif de mise en place de composant électronique de type à puce, système de mise en place de composant électronique de type à puce, station de mise en place de composant électronique de type à puce, élément d'alignement, élément de pré-alignement, tige, élément de support, composant électronique de type à puce, et carte de circuit imprimé - Google Patents

Dispositif de mise en place de composant électronique de type à puce, système de mise en place de composant électronique de type à puce, station de mise en place de composant électronique de type à puce, élément d'alignement, élément de pré-alignement, tige, élément de support, composant électronique de type à puce, et carte de circuit imprimé Download PDF

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Publication number
WO2017030140A1
WO2017030140A1 PCT/JP2016/073970 JP2016073970W WO2017030140A1 WO 2017030140 A1 WO2017030140 A1 WO 2017030140A1 JP 2016073970 W JP2016073970 W JP 2016073970W WO 2017030140 A1 WO2017030140 A1 WO 2017030140A1
Authority
WO
WIPO (PCT)
Prior art keywords
chip
electronic component
type electronic
alignment
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2016/073970
Other languages
English (en)
Japanese (ja)
Inventor
石渡暉夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NANTOH Co Ltd
Original Assignee
NANTOH Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NANTOH Co Ltd filed Critical NANTOH Co Ltd
Priority to CN201680047859.5A priority Critical patent/CN107926153A/zh
Priority to JP2017535546A priority patent/JPWO2017030140A1/ja
Publication of WO2017030140A1 publication Critical patent/WO2017030140A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00

Definitions

  • the present invention relates to a chip-type electronic component placement apparatus, a chip-type electronic component placement system, a chip-type electronic component placement station, an alignment member, a pre-alignment member, a rod, a carrier member, and a chip-type electronic. Components and printed circuit boards.
  • the present invention relates to a chip-type electronic component placement apparatus that handles minute square chip-type electronic components having a size of 03015 (long side 0.3 mm ⁇ short side 0.15 mm).
  • a rectangular chip-type electronic component of 0603 size (long side 0.6 mm ⁇ short side 0.3 mm) or 0402 size (long side 0.4 mm ⁇ 0.2 mm) has a high density.
  • Such a chip-type electronic component is a passive component such as a resistor, a capacitor, an inductor, or a filter, and is called a chip component.
  • a chip component For example, about 500 to 800 chip components are mounted on a printed circuit board of a smartphone.
  • Patent Document 1 describes a rotary type component mounting machine.
  • a component mounter mounts chip components on a printed circuit board by a so-called pick and place method. That is, the component mounting machine mounts the chip component on the printed board using the suction nozzle.
  • the component mounting machine supplies a negative pressure gas to the suction nozzle and picks up a chip component placed on a paper carrier tape or the like.
  • the component mounter then transfers the chip component toward the printed circuit board, and then supplies positive pressure gas to the suction nozzle to place the chip component on the printed circuit board.
  • the conventional component mounter cannot cope. Specifically, as the chip components become finer, it becomes difficult to hold the chip components by suction. In particular, there is a problem that it is difficult to manufacture a suction nozzle that vacuum-sucks chip components. As high-density mounting progresses, it becomes difficult to place chip components with the required accuracy. In particular, there is a problem that the positioning accuracy required by the component conveying unit that conveys the chip component toward the printed circuit board cannot be satisfied. Since the number of chip components mounted on the printed circuit board increases, the working time becomes longer and the manufacturing efficiency becomes worse. In particular, there is a problem that it takes time to align chip components using image processing. Thus, with the progress of miniaturization of chip parts and the like, it is becoming difficult for so-called pick and place type component mounting machines to mount chip parts with high accuracy and high efficiency.
  • An object of the present invention is to provide a chip-type electronic component placement device capable of mounting a fine chip component on a printed board with high accuracy and high efficiency.
  • An object of the present invention is to provide a chip-type electronic component placement system, a chip-type electronic component placement station, an alignment member, a pre-alignment member, a rod, a carrier member, a chip-type electronic component, and a printed board.
  • the first embodiment of the chip-type electronic component placement device of the present invention includes an alignment member that has an alignment hole through which the chip-type electronic component passes while being fitted, and is arranged in parallel to the printed circuit board, and the chip-type electronic component And a rod that passes through the alignment hole and is placed on the printed circuit board.
  • the alignment hole has an inner surface into which the chip-type electronic component is fitted, and the chip-type electronic component faces the inner surface. And a hole slope to be guided.
  • the chip-type electronic component is placed on the alignment member so as to sandwich the chip-type electronic component.
  • a pre-alignment member that is aligned with the alignment hole is provided.
  • the pre-alignment member includes a pre-alignment hole into which the chip-type electronic component is fitted, and the pre-alignment hole. And an elastic part that urges the side surface toward the chip-type electronic component.
  • the pre-alignment hole has a hole slope on the inner surface for guiding the chip-type electronic component downward. It is characterized by.
  • the elastic portion includes a through hole provided on an outer periphery of the pre-alignment hole, and the pre-alignment. It consists of a hole and the beam formed by the said through-hole.
  • the pre-alignment member is integrally arranged on the upper surface side of the alignment member.
  • the eighth embodiment of the chip-type electronic component placement device of the present invention is characterized in that, in any of the first to seventh embodiments, a rod drive unit having a linear vibration actuator for reciprocating the rod is provided.
  • the chip-type electronic component is placed between the alignment member and the rod. And a carrier member that is held so as to overlap.
  • a tenth embodiment of the chip-type electronic component placement device of the present invention is characterized in that, in the ninth embodiment, the carrier member has a pocket for detachably storing the chip-type electronic component downward.
  • the carrier member has a chip-accommodating sheet having a through-hole-shaped pocket for accommodating the chip-type electronic component, and the chip.
  • a chip support sheet that is disposed in close contact with the receiving sheet to support the chip type electronic component and has a bottom portion that allows the chip type electronic component to be removed downward;
  • a chip presser sheet that supports the chip-type electronic component and has a rod insertion hole through which the rod is inserted.
  • the carrier member is moved along the alignment member, and the chip-type electronic component is moved.
  • a carrier positioning portion for positioning so as to overlap the alignment hole is provided.
  • the printed circuit board is moved along the alignment member, and the chip component of the printed circuit board is moved.
  • a board positioning unit is provided for positioning the mounting position so as to overlap the alignment hole.
  • the rod is moved along the alignment member, and the rod is moved into the alignment hole.
  • a rod positioning portion for positioning so as to overlap each other is provided.
  • a first embodiment of a chip-type electronic component placement system includes a carrier sheet that releasably holds a plurality of chip-type electronic components arranged in a grid pattern, and the chip-type electronic component from above the carrier sheet.
  • An extrusion head in which a plurality of rods to be pressed are arranged in a grid
  • a pre-alignment plate in which a plurality of pre-alignment holes for rough alignment of the chip-type electronic components detached from the carrier sheet are arranged in a grid
  • the pre-alignment An alignment plate that aligns the chip-type electronic components that have passed through the holes in a lattice pattern, and the carrier sheet and the extrusion head are moved in parallel to place the chip-type electronic components in a printed circuit board. It is mounted on.
  • a second embodiment of the chip-type electronic component placement system of the present invention is characterized in that, in the first embodiment, a substrate stage for moving the printed board in parallel with the alignment plate is provided.
  • a third embodiment of the chip-type electronic component placement system of the present invention is characterized in that, in the first or second embodiment, a pair of the extrusion heads are provided, and the extrusion heads are moved in opposite directions.
  • An embodiment of the chip-type electronic component placement station of the present invention includes a plurality of chip-type electronic component placement systems according to any one of the first to third embodiments, and the plurality of chip-type electronic component placement systems are arranged in series. It is characterized by.
  • An embodiment of the alignment member of the present invention is an alignment member used in a chip-type electronic component placement device that places a chip-type electronic component against a printed circuit board, and the alignment hole through which the chip-type electronic component passes is fitted. It is characterized by having.
  • An embodiment of the pre-alignment member of the present invention is a pre-alignment member used for a chip-type electronic component placement device that places a chip-type electronic component by pressing it toward a printed circuit board. It has a pre-alignment hole for rough alignment of the chip-type electronic component.
  • An embodiment of the rod of the present invention is a rod used in a chip-type electronic component placement device that places a chip-type electronic component by pressing it toward a printed circuit board, and has a tip surface that presses the upper surface of the chip-type electronic component.
  • the linear vibration actuator is reciprocated in the longitudinal direction.
  • An embodiment of the carrier member of the present invention is a carrier member used in a chip-type electronic component placement device that places a chip-type electronic component by pressing it toward a printed circuit board, and the chip-type electronic component can be detached downward. It has the pocket which accommodates in.
  • a first embodiment of the chip-type electronic component of the present invention is a chip-type electronic component mounted on a printed circuit board, and has a solder receiving hole formed in an electrode terminal that is in close contact with the printed circuit board. .
  • the solder receiving hole is fitted to positioning solder arranged so as to protrude from the mounting surface of the printed board, and Positioning is performed.
  • An embodiment of the printed circuit board of the present invention is a printed circuit board on which a chip-type electronic component is mounted, and has positioning solder arranged so as to protrude from the mounting surface, and the chip-type electronic component is mounted on the positioning solder.
  • the chip-type electronic component is positioned by fitting a solder receiving hole formed in the electrode terminal.
  • a fine chip component can be mounted on a printed board with high accuracy and high efficiency.
  • FIG. 6 is a cross-sectional view showing a process of placing the chip component C on the printed circuit board B. It is a figure which shows the chip component C and the printed circuit board B, Comprising: (a) Upper perspective view of the chip component C, (b) Lower perspective view of the chip component C, (c) Cross sectional view of the chip component C and the printed circuit board B is there.
  • FIG. 6 is a cross-sectional view showing a process of placing the chip component C on the printed circuit board B.
  • FIG. 4 is a transparent view of alignment member 10, pre-alignment member 20, and printed circuit board B as viewed from above.
  • FIG. It is sectional drawing which shows the chip-type electronic component arrangement
  • 3 is a plan view showing a pre-alignment member 120.
  • FIG. It is a figure which shows the digging 118 of the alignment member 10, Comprising: (a) Top view, (b) XIIIb-XIIIb sectional drawing.
  • FIG. 6 is a perspective view showing a holding member 125 of a pre-alignment member 120. It is a figure which shows the carrier member 130, Comprising: (a) Top view, (b) XVb-XVb sectional drawing.
  • FIG. 6 is a cross-sectional view showing a process of placing the chip component C on the printed circuit board B.
  • FIG. 6 is a perspective view showing a process of placing the chip component C on the printed circuit board B.
  • FIG. 6 is a figure which shows the chip-type electronic component arrangement
  • chip type electronic parts arrangement system 4 concerning an embodiment of the present invention.
  • FIG. 4 is a system configuration block diagram of chip type electronic component arrangement system 4 concerning the embodiment of the present invention.
  • 4 is a perspective view showing a substrate stage 50 and a carrier sheet stage 80.
  • FIG. 4 is a perspective view showing a rod unit 60.
  • FIG. It is a perspective view which shows the alignment unit 70 and the carrier sheet 85.
  • FIG. 1 is an explanatory diagram (cross-sectional view) of a component arrangement method used in the chip-type electronic component arrangement apparatuses 1 and 2 of the present invention.
  • 2A and 2B are diagrams showing the alignment member 10 (alignment hole 11), where FIG. 2A is a plan view and FIG. 2B is a cross-sectional view taken along IIb-IIb.
  • FIG. 2A is a plan view
  • FIG. 2B is a cross-sectional view taken along IIb-IIb.
  • the chip component (chip-type electronic component) C is a rectangular parallelepiped passive element disposed (mounted) on the surface of the printed circuit board B.
  • the chip component C is also called a square chip element.
  • the chip component C may be called a chip resistor, a chip capacitor, a chip inductor, or the like depending on its function.
  • the chip component C is, for example, 03015 size. Specifically, the chip component C is formed with a long side of 0.3 mm, a short side of 0.15 mm, and a height of 0.11 mm.
  • the surface on which the chip component C is disposed by the chip-type electronic component placement apparatuses 1 and 2 is referred to as an upper surface (mounting surface).
  • a direction along the upper surface of the printed circuit board B is referred to as a horizontal direction.
  • the longitudinal direction of the printed circuit board B is referred to as the X direction.
  • the short side direction of the printed circuit board B is referred to as a width direction or a Y direction.
  • a direction orthogonal to the upper surface of the printed circuit board B is referred to as a vertical direction or a Z direction.
  • the direction approaching the upper surface of the printed circuit board B is referred to as the downward direction
  • the direction away from the upper surface of the printed circuit board B is referred to as the upper direction.
  • the chip-type electronic component arranging devices 1 and 2 include an alignment member 10 and a rod 41, and are arranged immediately above the printed circuit board B in which these are arranged horizontally.
  • the alignment member 10 is a flat plate-like member and is arranged parallel (horizontally) to the printed circuit board B.
  • the alignment member 10 is formed of ceramics such as zirconia, for example.
  • the alignment member 10 is arranged at a distance of about 0.2 mm from the printed circuit board B, for example.
  • the thickness of the alignment member 10 is, for example, 0.3 mm.
  • the alignment member 10 has an alignment hole 11 penetrating in the vertical direction.
  • the alignment hole 11 is a through hole through which the chip component C passes while fitting.
  • the alignment hole 11 includes four inner side surfaces 12 into which the chip component C is fitted, and four hole inclined surfaces 13 that guide the chip component C toward the inner side surface 12.
  • the four inner side surfaces 12 are flat surfaces along the vertical direction, and are disposed on the lower side of the alignment member 10.
  • the interval between the inner side surfaces 12 (the inner diameter of the alignment hole 11) is formed such that the long side is 0.3 mm and the short side is 0.15 mm.
  • the length of the inner side surface 12 in the vertical direction (depth of the alignment hole 11) is, for example, 0.1 mm.
  • the four hole inclined surfaces 13 are surfaces facing obliquely upward, and are arranged on the upper side of the alignment member 10.
  • the hole slope 13 continues to the inner side surface 12. Arc-shaped reliefs are formed at the four corners of the alignment hole 11.
  • the chip component C is disposed close to the upper side of the alignment member 10.
  • the chip component C is held so as to overlap the alignment hole 11 in the vertical direction.
  • the method for holding and arranging the chip component C is arbitrary.
  • the rod 41 is arranged corresponding to the alignment hole 11.
  • the rod 41 is spaced apart above the alignment member 10.
  • the rod 41 is disposed so as to extend in the vertical direction.
  • a chip component C is disposed between the rod 41 and the alignment member 10.
  • the rod 41 is a rod-shaped member that contacts the upper surface of the chip component C and presses the chip component C toward the printed circuit board B.
  • the rod 41 is made of ceramics. Specifically, the rod 41 is formed of zirconia.
  • the tip surface of the rod 41 is formed in a rectangular shape, for example. The dimensions of the tip surface are, for example, a long side of 0.3 mm and a short side of 0.15 mm. That is, the tip surface of the rod 41 is formed to be the same as or slightly smaller than the shape of the upper surface of the chip component C.
  • the rod 41 is formed longer than the thickness of the alignment member 10. The length of the rod 41 is 2 mm or more, for example.
  • the rod 41 is reciprocated along the longitudinal direction (vertical direction) by an arbitrary driving device.
  • a solenoid can be used as the driving device.
  • the rod 41 reciprocates up and down, for example, about 20 times per second.
  • FIG. 3 is a cross-sectional view showing the process of placing the chip component C on the printed circuit board B.
  • the chip component C is arranged above the alignment member 10 and held so as to overlap the alignment hole 11 in the vertical direction.
  • the chip component C is held so that the surface closely contacting the surface of the printed circuit board B faces downward.
  • the rod 41 moves downward and presses the upper surface of the chip component C.
  • the chip component C is inserted into the alignment hole 11.
  • the chip component C abuts on the upper side (hole slope 13) of the alignment hole 11.
  • the chip component C is slidably contacted with the hole inclined surface 13 and guided toward the lower side (four inner side surfaces 12) of the alignment hole 11. Thereby, the chip component C fits smoothly into the four inner side surfaces 12.
  • the chip component C is aligned (positioned / positioned) with respect to the alignment member 10 by fitting into the alignment hole 11. That is, the position and posture of the chip component C excluding the vertical direction are restricted by the alignment hole 11 so as not to fluctuate.
  • the rod 41 further presses the chip part C and pushes it downward from the alignment hole 11 (passes through the alignment hole 11). Then, the chip component C is pressed against the printed circuit board B. For this reason, the chip component C is placed on the upper surface of the printed circuit board B in a state where the chip component C is aligned by the alignment member 10 (a state in which the position and orientation except the vertical direction are maintained). Thereafter, the rod 41 moves (withdraws) above the alignment member 10. In this way, the chip-type electronic component placement apparatuses 1 and 2 accurately place (mount) the chip component C on the upper surface of the printed board B.
  • the chip-type electronic component placement apparatuses 1 and 2 simply press the rod 41 without sucking the chip component C, the chip-type electronic component placement apparatuses 1 and 2 can reliably handle even a minute chip component.
  • the chip-type electronic component placement apparatuses 1 and 2 can align the chip component C only by passing the chip component C through the alignment hole 11. In other words, the chip component C can be aligned with high accuracy without being affected by the positioning accuracy of the component conveying unit or the like. For this reason, the chip component C can be accurately arranged with respect to the chip component mounting position of the printed circuit board B. Since the chip-type electronic component placement apparatuses 1 and 2 simply press the chip component C against the printed circuit board B with the rod 41, the work time is short and the mounting efficiency is improved. For this reason, even if the chip components C to be mounted on the printed circuit board B increase, the mounting can be performed efficiently. Therefore, the chip-type electronic component placement apparatuses 1 and 2 can mount the chip component C on the printed board B with high accuracy and high efficiency.
  • Chip component C and printed circuit board B In the push-and-place method (chip-type electronic component placement apparatuses 1 and 2) described above, the chip component C and the printed board B preferably have the following configuration.
  • 4A and 4B are diagrams showing the chip component C and the printed circuit board B, where (a) a perspective view of the chip component C viewed from above, (b) a perspective view of the chip component C viewed from below, and (c) a chip. It is sectional drawing of the component C and the printed circuit board B.
  • the chip component C having a size of 03015 is formed with a long side of 0.3 mm, a short side of 0.15 mm, and a height of 0.11 mm.
  • the chip component C has electrode terminals T at both ends in the long side direction.
  • the electrode terminal T is provided at least on the lower surface of the chip component C.
  • Each electrode terminal T is provided with a solder receiving hole H extending in the short side direction. That is, the groove-shaped solder accommodating holes H extending in the short side direction are formed at both ends of the chip part C in the long side direction.
  • the solder receiving hole H has a shape in which the lower surface of the electrode terminal T is dug into a rectangle and the bottom is dug into an inverted triangle.
  • the shape of the solder receiving hole H is arbitrary, and may be, for example, a triangle, a trapezoid, or a semicircle. The shape is not limited to a groove shape, and may be a cylindrical hole shape, a conical hole shape, or the like.
  • the solder accommodation hole H is formed at the center of the electrode terminal T. That is, the lower surface of the electrode terminal T is formed so as to be recessed leaving an outer edge portion (frame portion).
  • the solder receiving hole H is fitted into positioning solder S provided on the upper surface of the printed circuit board B. That is, when the chip component C is arranged, the positioning solder S arranged on the printed board B is fitted into the solder accommodation hole H and positioned.
  • a large number of positioning solders S made of cream solder are arranged in advance on the upper surface (mounting surface) of the printed circuit board B.
  • the positioning solder S is made of, for example, a plurality of hemispherical cream solders arranged in the Y direction.
  • the cross-sectional shape of the solder receiving hole H is arbitrary, and may be, for example, a triangle, a trapezoid, or a semicircle.
  • the shape is not limited to a plurality of hemispheres arranged in the Y direction, and may be a bowl shape, a cylindrical shape, a conical shape, or the like.
  • a pair of positioning solders S adjacent in the X direction are arranged on the upper surface of the printed circuit board B at a predetermined interval. The distance between the pair of positioning solders S is the same as the distance between the solder receiving holes H of the chip component C.
  • the chip component C When the chip component C is placed (mounted) on the printed circuit board B using the chip-type electronic component placement apparatuses 1 and 2 described above, the chip component C is positioned and arranged with high accuracy with respect to the printed circuit board B. Since the positioning solder S fits into the solder receiving hole H of the chip component C, the chip component C arranged on the printed circuit board B is not displaced. When the positioning solder S is melted, it stays at H and does not overflow. For this reason, the plurality of chip components C can be arranged with a gap of 0.01 mm in each of the X direction and the Y direction. That is, even if the adjacent chip components C are mounted at intervals of 0.01 mm in the X direction and the Y direction, they are not short-circuited.
  • solder may be arranged in advance in the solder receiving hole H of the chip component C. Even if the solder is melted after the chip component C is disposed on the upper surface of the printed circuit board B, the solder remains in the solder accommodating hole H and does not overflow. For this reason, the plurality of chip components C can be arranged with a gap of 0.01 mm in each of the X direction and the Y direction.
  • FIG. 5 is a cross-sectional view showing the chip-type electronic component placement device 1 according to the first embodiment of the present invention. About the member etc. which were already demonstrated, the same code
  • the chip-type electronic component placement apparatus 1 includes an alignment member 10, a pre-alignment member 20, a carrier member 30, and an extrusion rod portion 40.
  • FIGS. 8A and 8B are views showing the extrusion rod portion 40, where FIG. 8A is a front view and FIG. 8B is a rear view.
  • the pre-alignment member 20 is disposed so as to overlap the upper surface of the alignment member 10.
  • the thickness of the pre-alignment member 20 is 0.1 mm, for example.
  • the pre-alignment member 20 is made of, for example, stainless steel.
  • the pre-alignment member 20 sandwiches the chip part C and aligns the chip part C with the alignment hole 11. That is, the pre-alignment member 20 roughly aligns the chip component C with the alignment hole 11 (rough alignment) before inserting the chip component C into the alignment hole 11.
  • the pre-alignment member 20 includes a pre-alignment hole 21 through which the chip component C passes downward, and four elastic portions 23 that urge the inner surface of the pre-alignment hole 21 toward the chip component C.
  • the pre-alignment hole 21 is a through hole through which the chip component C passes while fitting.
  • the pre-alignment hole 21 has four inner side surfaces into which the chip component C is fitted, and the inner side surfaces are formed in a hole inclined surface 21a that guides the chip component C downward.
  • the elastic portion 23 includes four through holes 24 arranged on the outer peripheral side of the pre-alignment hole 21 and four beam bodies 25 formed by the pre-alignment hole 21 and the four through holes 24.
  • the four beam bodies 25 form pre-alignment holes 21.
  • the four beam bodies 25 are outer edges of the pre-alignment hole 21 and are formed in an arcuate shape that curves toward the pre-alignment hole 21.
  • the center of the beam body 25 projects toward the pre-alignment hole 21.
  • the inner diameter of the pre-alignment hole 21 (interval between the beam bodies 25) is 0.25 mm for the long side and 0.10 mm for the short side. That is, a space slightly smaller than the outer shape of the chip part C is formed by the four beam bodies 25.
  • Each beam body 25 is elastically deformed so as to reduce the through hole 24. In other words, each beam body 25 is elastically deformed so as to enlarge the pre-alignment hole 21.
  • the chip component C can be held in the pre-alignment hole 21.
  • the pre-alignment hole 21 is disposed at the opening edge (near the four sides) of the alignment hole 11 and sandwiches the chip component C before inserting it into the alignment hole 11.
  • the carrier member 30 is a flat plate member arranged so as to be in close contact with the upper surface of the pre-alignment member 20.
  • the carrier member 30 is made of paper or polystyrene resin.
  • the carrier member 30 is arranged at a distance of, for example, about 0.2 mm from the alignment member 10.
  • the carrier member 30 holds the chip component C so as to overlap the pre-alignment hole 21. That is, the carrier member 30 holds the chip component C directly above the alignment hole 11.
  • the carrier member 30 is composed of three sheets formed of paper or polystyrene resin.
  • the carrier member 30 is formed by stacking a chip storage sheet 31, a chip support sheet 34 and a chip pressing sheet 37.
  • the chip accommodating sheet 31 has a through-hole-shaped pocket 32 that accommodates the chip component C.
  • the pocket 32 is a through hole having substantially the same shape as the outer shape of the chip part C.
  • the thickness of the chip accommodating sheet 31 (depth of the pocket 32) is substantially the same as the thickness of the chip component C. For this reason, the pocket 32 can completely accommodate the chip component C.
  • the chip support sheet 34 is disposed in close contact with the lower surface of the chip storage sheet 31 and supports the chip component C from below.
  • the chip support sheet 34 can be detached from the bottom by protruding the bottom (projection piece 36) supporting the chip component C.
  • the thickness of the chip support sheet 34 is, for example, about 1/5 of the chip storage sheet 31.
  • the chip support sheet 34 has a bottom hole 35 having substantially the same shape as the planar shape of the chip component C. On the long side of the bottom hole 35, a pair of protruding pieces 36 that protrude toward the center of the bottom hole 35 are formed. The pair of protruding pieces 36 are in close contact with the lower surface of the chip component C to support the chip component C.
  • the chip support sheet 34 supports the chip component C with only a pair of protruding pieces 36 protruding from the long side of the bottom hole 35. For this reason, when the chip part C accommodated in the pocket 32 is pressed downward, the chip support sheet 34 comes out (the protruding piece 36 is bent downward and the bottom hole 35 is enlarged), and the chip part C is lowered. Detach into The chip component C detached from the pocket 32 falls toward the pre-alignment hole 21 as it is.
  • the chip pressing sheet 37 is disposed in close contact with the upper surface of the chip receiving sheet and covers the chip component C so as not to be detached from the pocket 32.
  • the thickness of the chip pressing sheet 37 is substantially the same as that of the chip receiving sheet 31.
  • the chip support sheet 34 has a rod insertion hole 38 through which the rod 41 is inserted.
  • the rod insertion hole 38 has a shape smaller than the planar shape of the chip part C. For this reason, the chip support sheet 34 presses the chip component C at the periphery of the rod insertion hole 38.
  • the push rod part 40 includes a rod 41 and a rod drive part 42, and is disposed above the pre-alignment member 20.
  • the rod drive unit 42 reciprocates the rod 41 along the longitudinal direction (Z direction) of the rod 41 by a solenoid.
  • the rod drive unit 42 can reciprocate the rod 41 up and down about 20 times per second.
  • the rod drive unit 42 causes the rod 41 to reciprocate with a stroke of about 2 mm in the Z direction.
  • a flat type linear vibration actuator Linear Resonant Actuator
  • Flat type linear vibration actuators are used for vibrations of smartphones and the like.
  • the rod drive unit 42 has, for example, a height of 14 mm, a width of 11 mm, and a thickness of 2.2 mm, and includes an electrode 43, a permanent magnet 44, a coil 45, a yoke 46, an impact absorbing spring 47, a rod rotation stopping member 48, and the like.
  • FIG. 9 is a cross-sectional view showing the process of placing the chip component C on the printed circuit board B.
  • FIG. 10 is a transparent view of the alignment member 10, the pre-alignment member 20, and the printed board B as viewed from above.
  • the chip component C is accommodated in the pocket 32 of the carrier member 30 (chip accommodating sheet 31) and disposed above the alignment member 10. Then, the chip component C is held so as to overlap the pre-alignment hole 21 and the alignment hole 11.
  • the rod driving section 42 of the push rod section 40 is driven to move the rod 41 downward to press the upper surface of the chip part C.
  • the rod 41 is moved downward and inserted into the rod insertion hole 38 of the carrier member 30 (chip pressing sheet 37).
  • the rod 41 is brought into contact with the upper surface of the chip part C, and the chip part C is pressed downward.
  • the protruding piece 36 of the carrier member 30 (chip support sheet 34) is bent downward, and the bottom hole 35 is enlarged. Therefore, the chip component C is detached downward from the pocket 32 while being pressed by the rod 41 and is directly fitted into the pre-alignment hole 21 of the pre-alignment member 20.
  • the chip component C Since the peripheral edge (four beam bodies 25) of the pre-alignment hole 21 is chamfered, the chip component C is guided toward the pre-alignment hole 21. At this time, the four beam bodies 25 are pressed by the chip component C and elastically deformed to the outer peripheral side. Accordingly, the four beam bodies 25 press the chip component C toward the center (center) of the pre-alignment hole 21 to sandwich the chip component C. Thus, the chip component C is pre-aligned with the alignment member 10 by fitting the chip component C into the pre-alignment hole 21. In other words, the position and posture of the chip component C are regulated by the pre-alignment member 20 so as not to fluctuate.
  • the chip component C is further pressed downward by the rod 41 to move the chip component C from the pre-alignment hole 21 to the alignment hole 11. Since the peripheral edge of the alignment hole 11 is chamfered, it is guided toward the alignment hole 11 and smoothly fitted. In this manner, the chip component C is aligned (aligned) with the alignment member 10 by fitting the chip component C into the alignment hole 11. In other words, the position and orientation of the chip component C are regulated by the alignment hole 11 so as not to fluctuate.
  • the chip component C is further pressed downward by the rod 41, and the chip component C is placed on the printed board B through the alignment hole 11.
  • the chip component C is placed on the upper surface of the printed circuit board B while being aligned by the alignment member 10 (while maintaining the position and posture).
  • the rod 41 is moved (retracted) above the alignment member 10. In this way, the chip-type electronic component placement apparatus 1 aligns and mounts the chip component C on the upper surface of the printed board B.
  • FIG. 11 is a cross-sectional view showing the chip-type electronic component placement device 2 according to the second embodiment of the present invention. About the member etc. which were already demonstrated, the same code
  • the chip-type electronic component placement device 2 includes a pre-alignment member 120 and a carrier member 130 in addition to the alignment member 10 and the push rod part 40.
  • FIG. 12 is a plan view showing the pre-alignment member 120.
  • FIGS. 13A and 13B are views showing the digging 118 of the alignment member 10 and are (a) a plan view and (b) a cross-sectional view taken along line XIIIb-XIIIb.
  • FIG. 14 is a perspective view showing the clamping member 125 of the pre-alignment member 120.
  • 15A and 15B are diagrams showing the carrier member 130, where FIG. 15A is a plan view and FIG. 15B is a cross-sectional view taken along XVb-XVb.
  • the pre-alignment member 120 is integrally formed on the upper side of the alignment member 10.
  • the pre-alignment member 120 sandwiches the chip part C and aligns the chip part C with the alignment hole 11. That is, the pre-alignment member 120 roughly aligns (rough alignment) the chip component C with the alignment hole 11 before inserting the chip component C into the alignment hole 11.
  • the pre-alignment member 120 includes four sandwiching members 125 that sandwich the chip component C, and four elastic bodies 124 that respectively bias the four sandwiching members 125 toward the chip component C.
  • the clamping member 125 is a T-shaped member, and is formed of ceramics such as zirconia.
  • the front ends of the holding members 125 face the alignment holes 11 and are arranged to face each other. That is, the four clamping members 125 are disposed at the opening edges (four sides) of the alignment hole 11 and clamp the chip component C before being inserted into the alignment hole 11.
  • a clamping surface (inner side surface) 126 that abuts the side surface of the chip component C and a slope (hole slope) 127 that guides the chip component C toward the clamping surface 126 are formed.
  • a substantially rectangular space (through hole) is formed by the four clamping members 125 facing each other.
  • the inner diameter of the through hole (the interval between the clamping surfaces 126) is formed such that the long side is 0.25 mm and the short side is 0.10 mm.
  • the thickness (depth) is, for example, 0.1 mm. That is, the four clamping members 125 are opposed to each other to form a through hole (pre-alignment hole 121a) that is slightly smaller than the shape of the chip component C.
  • the clamping member 125 includes a rod portion 128 that extends radially from the alignment hole 11 and an end portion 129 that is orthogonal to the rod portion 128.
  • the rod portion 128 functions as a guide when the clamping member 125 reciprocates toward the alignment hole 11.
  • the end portion 129 serves as a stopper that restricts the movement of the clamping member 125. Specifically, the end portion 129 restricts the movement of the clamping member 125 in the direction in which the clamping member 125 faces the alignment hole 11.
  • the end portion 129 receives pressure from the elastic body 124.
  • the elastic body (elastic portion) 124 is an annular rubber member, and is disposed in contact with the rear end (end portion 129) of the clamping member 125.
  • the elastic body 124 always presses the end portion 129 and urges the holding member 125 toward the alignment hole 11.
  • the pre-alignment members 120 (the four clamping members 125 and the four elastic bodies 124) are accommodated in the digging 118 formed on the upper surface of the alignment member 10.
  • the digging 118 includes one central hole 121, four grooves 122, and four elastic body accommodation holes 123.
  • the alignment member 10 is thick in order to form the digging 118.
  • the center hole 121 is larger than the alignment hole 11 and is formed so as to overlap the alignment hole 11. That is, the center hole 121 communicates with the alignment hole 11.
  • the four grooves 122 extend radially from the center hole 121 and accommodate the rod portion 128 of the clamping member 125.
  • the rod portion 128 reciprocates along the groove 122.
  • the tip of the rod portion 128 (the clamping surface 126 and the inclined surface 127) protrudes from the inner surface of the center hole 121 toward the alignment hole 11.
  • the four elastic body accommodation holes 123 are formed in a substantially rectangular shape, and the four grooves 122 communicate with each other.
  • the elastic body accommodation hole 123 accommodates the end portion 129 of the clamping member 125 and the elastic body 124.
  • the elastic body 124 is elastically deformed while being accommodated in the elastic body accommodation hole 123.
  • the end portion 129 regulates the movement of the rod portion 128 by contacting the inner surface of the elastic body accommodation hole 123.
  • the carrier member 130 is a flat plate-like member arranged parallel (horizontal) to the alignment member 10.
  • the carrier member 130 is formed of paper or polystyrene resin.
  • the carrier member 130 is arranged at a distance of, for example, about 0.2 mm from the alignment member 10.
  • the carrier member 130 holds the chip component C above the alignment hole 11. That is, the carrier member 130 holds the chip component C so as to overlap the alignment hole 11.
  • the carrier member 130 is provided with a pocket 131 for accommodating the chip component C.
  • the pocket 131 is a hole formed in the upper surface of the carrier member 130 and has substantially the same shape as the chip component C.
  • the long side of the pocket 131 is 0.3 mm and the short side is 0.15 mm.
  • the depth of the pocket 131 is, for example, 0.05 mm.
  • the pocket 131 has a bottom portion (protruding piece 132) that contacts the lower surface of the chip part C.
  • the pair of protruding pieces 132 protrude from the side surface of the pocket 131 and face each other. For this reason, when the chip part C accommodated in the pocket 131 is pressed from above, the bottom of the pocket 131 comes off (the protruding piece 132 is bent), and the chip part C is detached downward. The chip part C detached from the pocket 131 falls toward the alignment hole 11 as it is.
  • FIG. 16 is a cross-sectional view showing the process of placing the chip component C on the printed circuit board B.
  • FIG. 17 is a perspective view showing a process of placing the chip component C on the printed circuit board B.
  • the carrier member 30 is omitted.
  • the chip component C is accommodated in the pocket 131 of the carrier member 130 and arranged on the upper surface side of the alignment member 10. Then, the chip component C is held so as to overlap the alignment hole 11.
  • the push rod part 40 drives the rod drive part 42 to move the rod 41 downward, and presses the upper surface of the chip part C with the rod 41.
  • the extrusion rod part 40 pulls out the bottom part (projection piece 132) of the pocket 131, and makes the chip
  • the four clamping members 125 are pressed from the rod 41 via the chip part C and slightly moved (retracted) in the direction away from the center hole 121.
  • the chip component C is smoothly fitted between the four clamping members 125 (pre-alignment holes 121a), and the clamping surfaces 126 of the clamping members 125 are in contact with the side surfaces of the chip component C, respectively. That is, the chip component C is clamped by the four clamping members 125. Since the four clamping members 125 are equally urged toward the chip component C by the four elastic bodies 124, the chip component C is aligned (positioned) with respect to the alignment member 10. That is, the position and posture of the chip component C are regulated by the pre-alignment member 120 so as not to fluctuate.
  • the extrusion rod portion 40 drives the rod driving portion 42 and presses the upper surface of the chip part C with the rod 41. Then, the chip component C is inserted into the alignment hole 11. Since the four hole inclined surfaces 13 are formed on the upper surface side of the alignment hole 11, the chip component C is guided toward the four inner side surfaces 12. Thereby, the chip component C fits smoothly into the four inner side surfaces 12. When the chip part C is fitted into the alignment hole 11, the chip part C is aligned (aligned) with the alignment member 10. In other words, the position and orientation of the chip component C are regulated by the alignment hole 11 so as not to fluctuate.
  • the extrusion rod portion 40 further presses the chip part C, passes through the alignment hole 11, and is placed on the printed board B.
  • the chip component C aligned by the alignment member 10 is placed on the upper surface of the printed circuit board B while maintaining the position and posture. Thereafter, the rod 41 is moved (retracted) above the alignment member 10. In this manner, the chip-type electronic component placement apparatus 2 places the chip component C in alignment with the upper surface of the printed board B.
  • the chip-type electronic component placement apparatuses 1 and 2 include the carrier members 30 and 130, the chip component C can be reliably held above the alignment hole 11.
  • the carrier members 30 and 130 have pockets 32 and 131 for accommodating the chip component C, and the bottom portions (protruding pieces 36 and 132) of the pockets 32 and 131 come out to detach the chip component C. Therefore, the chip component C pressed by the extrusion rod portion 40 can be easily moved toward the alignment member 10.
  • the chip-type electronic component placement apparatuses 1 and 2 include the pre-alignment members 20 and 120, the chip component C can be aligned (rough alignment) with the alignment hole 11 immediately above the alignment hole 11. Therefore, the chip component C can be easily fitted into the alignment hole 11. Since the pre-alignment member 120 is disposed on the upper surface side of the alignment plate, the chip component C can be held immediately above the alignment hole 11. Therefore, the chip-type electronic component placement apparatuses 1 and 2 can efficiently and reliably mount the chip component C on the printed circuit board B.
  • FIG. 18 is a diagram showing the chip-type electronic component placement station 3 according to the embodiment of the present invention.
  • FIG. 19 is a diagram showing the chip-type electronic component placement system 4 according to the embodiment of the present invention.
  • FIG. 20 is a system configuration block diagram of the chip-type electronic component placement system 4 according to the embodiment of the present invention.
  • FIG. 21 is a perspective view showing the substrate stage 50 and the carrier sheet stage 80.
  • FIG. 22 is a perspective view showing the rod unit 60.
  • FIG. 23 is a perspective view showing the alignment plate 71, the pre-alignment plate 72, and the carrier sheet 85.
  • 24A is a plan view of the alignment unit 70, and FIG.
  • FIG. 24B is a plan view of the carrier sheet 85.
  • FIG. FIG. 25 is a diagram showing component mounting by the chip-type electronic component placement system 4. About the member etc. which were already demonstrated, the same code
  • the chip-type electronic component placement station 3 includes a plurality of chip-type electronic component placement systems 4. Specifically, the chip-type electronic component placement station 3 includes three chip-type electronic component placement systems 4 that are arranged in series along the X direction. The chip-type electronic component placement station 3 also includes loader conveyors and unloader conveyors that move the printed circuit board B in the X direction and carry it in and out of each chip-type electronic component placement system 4.
  • the chip-type electronic component placement system 4 has a large number of chip-type electronic component placement devices 1 and 2 arranged in a plane, and efficiently mounts a large number of chip components C on a printed board B.
  • the chip-type electronic component arrangement system 4 includes a large number of chip-type electronic component arrangement apparatuses 1 will be described.
  • the printed circuit board B is transported along the X direction. Then, the printed circuit board B sequentially passes through the three chip-type electronic component placement systems 4, and a large number of chip components C are mounted (mounted). The chip-type electronic component placement station 3 sequentially transports the plurality of printed circuit boards B along the X direction.
  • the chip-type electronic component placement system 4 includes a substrate stage 50, a rod unit 60, an alignment unit 70, a carrier sheet stage 80, and the like.
  • the substrate stage 50 is a so-called XY stage, on which the printed circuit board B is placed, and the printed circuit board B is translated in the X direction and the Y direction under the control of the substrate positioning unit 101.
  • the substrate stage 50 positions the printed circuit board B in the X and Y directions directly below the extrusion head 61.
  • the rod unit 60 includes a pair of extrusion heads 61 and is disposed above the substrate stage 50.
  • the two extrusion heads 61 are arranged in series along the X direction.
  • Each extrusion head 61 includes, for example, 60 extrusion rod portions 40.
  • the plurality of extrusion rod portions 40 are arranged in a lattice shape in the XY direction. Specifically, 60 extrusion rod portions 40 (rods 41) are arranged in 4 rows in the Y direction and 15 columns in the X direction. That is, in the rod unit 60, 120 extrusion rod portions 40 are arranged in 4 rows in the Y direction and 30 columns in the X direction.
  • the two extrusion heads 61 are controlled by the rod positioning unit 102 and reciprocate at high speed in the X direction.
  • the extrusion heads 61 move in parallel in opposite directions in synchronization. That is, the two extrusion heads 61 are simultaneously separated from each other or close to each other. Thereby, the vibration which generate
  • the two extrusion heads 61 can also move in the same direction in close contact.
  • the rod unit 60 positions the two extrusion heads 61 with respect to the printed circuit board B in the X direction.
  • the alignment unit 70 is disposed immediately above the substrate stage 50.
  • the alignment unit 70 includes an alignment plate 71 and a pre-alignment plate 72, and is disposed in parallel (horizontal) with respect to the substrate stage 50 in a state in which they are overlapped.
  • the alignment plate 71 is obtained by expanding the alignment member 10 into a planar shape, and has, for example, 240 alignment holes 11.
  • the pre-alignment plate 72 is obtained by expanding the pre-alignment member 20 in a planar shape, and has, for example, 240 pre-alignment holes 21.
  • the 240 alignment holes 11 and pre-alignment holes 21 are arranged in a lattice shape in the XY direction and overlap in the Z direction.
  • alignment holes 11 and pre-alignment holes 21 are arranged in 4 rows in the Y direction and 60 columns in the X direction (30 columns are two columns). That is, the alignment holes 11 and the pre-alignment holes 21 correspond to (match) the arrangement of the rods 41 when the four extrusion heads 61 are arranged in series in the X direction.
  • the carrier sheet stage 80 is disposed between the rod unit 60 and the alignment unit 70.
  • the carrier sheet stage 80 holds the carrier sheet 85 and is controlled by the carrier positioning unit 103 to move the carrier sheet 85 in the Y direction.
  • the carrier sheet stage 80 positions the carrier sheet 85 between the rod unit 60 and the alignment unit 70 in the Y direction.
  • the carrier sheet 85 is obtained by expanding the carrier member 30 in a planar shape, and has, for example, 3360 pockets 32. That is, the carrier sheet 85 holds, for example, 3360 chip components C.
  • the 3360 pockets 32 are arranged in a lattice shape in the XY direction. Specifically, 3360 pockets 32 are arranged in 56 rows in the Y direction (four rows of 14) and 60 columns in the X direction (two rows of 30). That is, the pocket 32 corresponds (matches) with the arrangement of the alignment holes 11 and the pre-alignment holes 21 when the 14 alignment units 70 are slightly shifted and overlapped in the Y direction.
  • the chip-type electronic component placement system 4 is comprehensively controlled by the control unit 100.
  • the control unit 100 instructs the substrate positioning unit 101, the substrate positioning unit 102, and the carrier positioning unit 103 to drive the substrate stage 50, the rod unit 60, and the carrier sheet stage 80. Then, the chip-type electronic component placement system 4 places a plurality of chip components C on the printed circuit board B at the same time.
  • the chip-type electronic component placement system 4 drives the substrate stage 50 by the substrate positioning unit 101 to position the chip component mounting position of the printed circuit board B directly below the alignment hole 11 (overlapping in the Z direction). . Further, the chip-type electronic component placement system 4 drives the rod unit 60 (the pair of extrusion heads 61) by the rod positioning unit 102 to position the rod 41 directly above the pre-alignment hole 21 (overlapping in the Z direction). Further, the chip-type electronic component placement system 4 drives the carrier sheet stage 80 by the carrier positioning unit 103 to position the chip component C held by the carrier sheet 85 directly above the pre-alignment hole 21 (overlapping in the Z direction). .
  • the chip-type electronic component placement system 4 drives a plurality of extruded rod portions 40 (rods 41) that are placed immediately above the chip component mounting position of the printed circuit board B. Thereby, the rod 41 presses the chip component C, and the chip component C is arranged on the upper surface of the printed circuit board B on the printed circuit board B.
  • the chip-type electronic component placement system 4 slightly moves the printed circuit board B in the XY direction and the carrier sheet 85 in the Y direction. Further, each of the pair of extrusion heads 61 is moved in the X direction. Then, the chip component C is arranged on the upper surface of the printed board B on the printed board B as described above.
  • the chip-type electronic component placement system 4 repeats such control (process) to place a large number of chip components C on the printed circuit board B.
  • the carrier sheet 85 is removed from the carrier sheet stage 80.
  • a new carrier sheet 85 is placed on the carrier sheet stage 80. In this way, the chip-type electronic component placement system 4 places a large number of chip components C on the printed circuit board B with high accuracy and high efficiency.
  • the chip-type electronic component placement system 4 can place a maximum of 120 chip components C on the printed circuit board B at a time.
  • the extrusion rod portion 40 can reciprocate the rod 41 about 20 times per second. Therefore, the chip-type electronic component placement system 4 has the capability of placing 1200 chip components C on the printed circuit board B per second. For example, if it is the printed circuit board B for smart phones, all the chip components C can be mounted in 1 second.
  • chip components C There are a plurality of sizes and types of chip components C arranged on the printed circuit board B. Therefore, in each chip-type electronic component placement system 4, chip components C of different sizes and types are placed on the printed circuit board B. As a result, the chip-type electronic component placement station 3 can place many chip components C of various sizes and types on the printed circuit board B.
  • the chip-type electronic component placement station 3 has a maximum mounting capacity of 12.96 million cph (Chip per hour). For example, even when the duty factor is 50%, 6.48 million cph can be realized.
  • a plurality of chip-type electronic component placement stations 3 may be placed in series in the X direction.
  • a plurality of chip-type electronic component placement stations 3 may be placed in parallel in the Y direction. Thereby, the mounting capability of the chip component C can be further increased. For example, if five chip-type electronic component placement stations 3 are arranged in parallel in the Y direction, a maximum of 64.8 million cph can be realized.
  • the present invention is not limited to the above-described embodiment, and includes various modifications made to the above-described embodiment without departing from the spirit of the present invention. That is, the specific shapes, configurations, and the like given in the embodiment are merely examples, and can be changed as appropriate.
  • the case where the chip component C arranged on the printed circuit board B is 03015 size has been described as an example.
  • the printed circuit board B may be provided with a mixture of chip parts C having a size of 03015, 0201, and 01005.
  • the printed circuit board B is not limited to the case where only the chip component C is arranged.
  • Various ICs integrated circuits
  • CSP ChipSizePackage
  • BGA BallGridArray
  • QFN QuadFlatNoleadpackage
  • DFN DualFlatNoleaded
  • LGA LandGridArray
  • the tip surface of the rod 41 may have, for example, a long side of 0.2 mm and a short side of 0.1 mm, or a long side of 0.1 mm and a short side of 0.05 mm.
  • the tip surface of the rod 41 is not limited to being flat. Any shape that can easily press the upper surface of the chip component C can be adopted.
  • the rod 41 is reciprocated up and down.
  • the printed circuit board B, the alignment member 10 and the like may be reciprocated in the vertical direction.
  • the number, arrangement, and arrangement interval of the extrusion rod portions 40 (rods 41) of the extrusion head 61 can be arbitrarily set.
  • the direction around each Z direction of each extrusion rod part 40 (rod 41) can also be set arbitrarily.
  • the number, arrangement, and arrangement interval of the alignment holes 11 and the pre-alignment holes 21 can be arbitrarily set.
  • the direction around the Z direction of the alignment hole 11 and the pre-alignment hole 21 can also be set arbitrarily.
  • the carrier sheet 85 the number, arrangement, and arrangement interval of the pockets 32 (chip parts C) can be arbitrarily set.
  • the direction around the Z direction of the pocket 32 (chip component C) can also be set arbitrarily.
  • the ratio of the rod 41 to the alignment hole 11 / pre-alignment hole 21 is not limited to one-to-two. One-to-one or one-to-three may be used.
  • the ratio between the rod 41 and the alignment hole 11 / pre-alignment hole 21 is 1: 1, the extrusion head 61 is fixed without moving in the X direction.
  • the ratio between the alignment hole 11 / pre-alignment hole 21 and the pocket 32 (chip component C) is not limited to 1: 1 but any ratio can be adopted.
  • the printed circuit board B may be fixed, and the rod unit 60, the alignment unit 70, and the carrier sheet stage 80 may be moved in the XY directions.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

Cette invention concerne un dispositif de mise en place de composant électronique de type à puce (1), comprenant les éléments suivants : un élément d'alignement (10) qui comprend un trou d'alignement (11) à travers lequel passe un composant électronique de type à puce (C) tandis qu'il s'adapte dans celui-ci, et qui est disposé parallèlement à une carte de circuit imprimé (B) ; et une tige (41) qui pousse le composant électronique de type à puce (C) de sorte à le faire passer à travers le trou d'alignement (11) et de l'amener à être monté sur la carte de circuit imprimé (B). Le trou d'alignement (11) présente une surface interne (12) le long de laquelle le composant électronique de type à puce (C) s'adapte, et une surface inclinée de trou (13) qui guide le composant électronique de type à puce (C) vers la surface interne (12).
PCT/JP2016/073970 2015-08-20 2016-08-17 Dispositif de mise en place de composant électronique de type à puce, système de mise en place de composant électronique de type à puce, station de mise en place de composant électronique de type à puce, élément d'alignement, élément de pré-alignement, tige, élément de support, composant électronique de type à puce, et carte de circuit imprimé Ceased WO2017030140A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201680047859.5A CN107926153A (zh) 2015-08-20 2016-08-17 芯片型电子部件配置装置、芯片型电子部件配置系统、芯片型电子部件配置站、对准构件、预对准构件、杆、载体构件、芯片型电子部件、印刷基板
JP2017535546A JPWO2017030140A1 (ja) 2015-08-20 2016-08-17 チップ型電子部品配置装置、チップ型電子部品配置システム、チップ型電子部品配置ステーション、アライメント部材、プリアライメント部材、ロッド、キャリア部材、チップ型電子部品、プリント基板

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2015162827 2015-08-20
JP2015-162827 2015-08-20
JP2016086699 2016-04-25
JP2016-086699 2016-04-25

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WO2017030140A1 true WO2017030140A1 (fr) 2017-02-23

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PCT/JP2016/073970 Ceased WO2017030140A1 (fr) 2015-08-20 2016-08-17 Dispositif de mise en place de composant électronique de type à puce, système de mise en place de composant électronique de type à puce, station de mise en place de composant électronique de type à puce, élément d'alignement, élément de pré-alignement, tige, élément de support, composant électronique de type à puce, et carte de circuit imprimé

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CN110572954A (zh) * 2019-09-11 2019-12-13 苏州汇川技术有限公司 引脚装配导向件及电路板组件
CN115938987A (zh) * 2022-11-30 2023-04-07 深圳市三联盛科技股份有限公司 一种半导体框架粘芯装置

Citations (3)

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Publication number Priority date Publication date Assignee Title
WO1998052399A1 (fr) * 1997-05-16 1998-11-19 Sony Corporation Dispositif et procede servant a monter des composants electroniques
JP2003188507A (ja) * 2001-12-18 2003-07-04 Mitsubishi Electric Corp 半導体集積回路およびこれを実装するためのプリント配線板
JP2004006460A (ja) * 2002-05-31 2004-01-08 Murata Mfg Co Ltd チップ状電子部品の取扱装置および取扱方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008101959A (ja) * 2006-10-18 2008-05-01 Hioki Ee Corp 基板治具ボードおよびこれを組み込んだ基板検査用治具ユニット
CN204131855U (zh) * 2014-10-21 2015-01-28 上海金鑫电子有限公司 一种柔性线路板的回流焊接辅助工装

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998052399A1 (fr) * 1997-05-16 1998-11-19 Sony Corporation Dispositif et procede servant a monter des composants electroniques
JP2003188507A (ja) * 2001-12-18 2003-07-04 Mitsubishi Electric Corp 半導体集積回路およびこれを実装するためのプリント配線板
JP2004006460A (ja) * 2002-05-31 2004-01-08 Murata Mfg Co Ltd チップ状電子部品の取扱装置および取扱方法

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