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WO2017028274A1 - 手持装置及使用该手持装置的手持云台及电子装置 - Google Patents

手持装置及使用该手持装置的手持云台及电子装置 Download PDF

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Publication number
WO2017028274A1
WO2017028274A1 PCT/CN2015/087505 CN2015087505W WO2017028274A1 WO 2017028274 A1 WO2017028274 A1 WO 2017028274A1 CN 2015087505 W CN2015087505 W CN 2015087505W WO 2017028274 A1 WO2017028274 A1 WO 2017028274A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
circuit board
housing
module
handheld
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2015/087505
Other languages
English (en)
French (fr)
Inventor
孙荣健
赵喜峰
王勇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SZ DJI Technology Co Ltd
Original Assignee
SZ DJI Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SZ DJI Technology Co Ltd filed Critical SZ DJI Technology Co Ltd
Priority to CN201710938994.5A priority Critical patent/CN107660106B/zh
Priority to CN201580003653.8A priority patent/CN105993208B/zh
Priority to PCT/CN2015/087505 priority patent/WO2017028274A1/zh
Priority to JP2018508764A priority patent/JP6605710B2/ja
Publication of WO2017028274A1 publication Critical patent/WO2017028274A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0213—Venting apertures; Constructional details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing

Definitions

  • the present invention relates to a handheld device, and a handheld head and electronic device using the handheld device.
  • a handheld cloud platform typically includes a housing and a circuit board disposed within the housing.
  • the circuit board is provided with a plurality of functional modules for implementing different functions, such as an image processing module, a power module, etc., which usually generate heat when working. Since the functional module is located in a sealed space formed by the casing, the heat generated by the functional module is often difficult to dissipate effectively and timely. If the heat is accumulated to a certain extent, the performance of the functional module will be affected, thereby affecting the overall performance of the pan/tilt.
  • heat sinks such as fans
  • the heat sink increases the volume of the handheld head, making the handheld head unfavorable for miniaturization.
  • a handheld device includes a housing and an electronic component disposed in the housing, the housing being provided with an expansion interface for connecting an electronic device, the expansion interface being a heat conduction interface and extending from the outside of the housing to the In the housing, the expansion interface can derive heat generated when the electronic component operates from outside the housing.
  • the inner cavity of the housing includes a battery chamber and a receiving cavity for accommodating the battery assembly.
  • the accommodating cavity includes an electrical cavity and a heat dissipation cavity communicating with the electrical cavity, the electronic component is disposed in the electrical cavity, and heat generated in the electrical cavity is transmitted to the heat dissipation cavity through the heat dissipation cavity The expansion interface.
  • a heat absorbing member is disposed in the heat dissipation cavity, and the heat absorbing member absorbs heat generated when the electronic component operates, and transfers the heat to the expansion interface.
  • the expansion interface includes a heat conducting portion and a fixing portion extending from the heat conducting portion, the fixing portion passes through the housing and extends into the heat dissipation cavity, and the heat conducting portion abuts the housing
  • the outer surface of the fixing portion is for fixing the heat conducting portion to the outer casing.
  • the housing is provided with a mounting hole and a plurality of heat dissipation holes, and the plurality of heat dissipation holes are adjacent to and surround the mounting hole, and the fixing portion fixes the heat conducting portion through the mounting hole
  • the heat conducting portion abuts against an outer surface of the casing and shields a plurality of the heat dissipation holes.
  • the heat absorbing member includes a body and a covering portion protruding from the edge of the body, the covering portion covering the fixing portion and abutting the outer edge of the plurality of the heat dissipation holes An inner surface of the housing, the body absorbing heat generated by the electronic component and transferring the heat to the cladding portion, the cladding portion transferring the heat to the heat conducting portion through the fixing portion The covering portion also transfers the heat to the heat conducting portion through a plurality of the heat dissipation holes, and the heat conducting portion guides the heat out of the housing.
  • the fixing portion has a cylindrical shape
  • the covering portion has an arc shape
  • the heat absorbing member includes a body and a covering portion protruding from the edge of the body, the covering portion covers the fixing portion, and the body absorbs heat generated by the electronic component and The heat is transferred to the cladding portion, and the cladding portion transfers the heat to the heat conducting portion through the fixing portion, and the heat conducting portion guides the heat out of the housing.
  • the fixing portion has a cylindrical shape
  • the covering portion has an arc shape
  • the heat conducting portion is provided with a heat dissipation protrusion
  • the heat conducting portion is provided with a heat dissipating groove.
  • an outer surface of the housing is provided with an operation surface for mounting a function button and a mounting surface for mounting the expansion interface; the operation surface is a plane and is inclined with respect to an axial direction of the housing The mounting surface extends in the axial direction of the housing.
  • the electronic component includes a first circuit board that is vertically disposed within the electrical cavity and disposed along an axial direction of the housing.
  • the first circuit board includes at least one of the following: a wireless fidelity module, a voltage conversion module, a photoelectric conversion module, an image processing module, and an image transmission module, where the wireless fidelity module is configured to implement a wireless fidelity function.
  • the voltage conversion module is configured to implement a voltage conversion function
  • the photoelectric conversion module is configured to implement a photoelectric conversion function
  • the image processing module is configured to process an image
  • the image transmission module is configured to transmit an image.
  • the electronic component further includes a second circuit board, the second circuit board is located at a side of the first circuit board facing the operation surface, and is disposed facing the operation surface; the second circuit The board includes at least one of the following: a power management module and a PTZ management module, the power management module is configured to implement a power management function, and the PTZ management module is configured to implement a PTZ management function.
  • the electronic component further includes a third circuit board corresponding to one end of the first circuit board and perpendicular to the first circuit board; the third circuit board includes a connection module, The connection module is configured to implement an interface connection function between the handheld device and the pan-tilt device.
  • the electronic component further includes a fourth circuit board, the fourth circuit board being located between the third circuit board and the first circuit board, and disposed parallel to the third circuit board;
  • the fourth circuit board includes at least one of the following: an audio signal acquisition module and a displacement sensing module, wherein the audio signal acquisition module is configured to implement an audio signal collection function, and the position sensing module is configured to implement a displacement sense of the handheld device. Test function.
  • the heat absorbing member is a heat dissipation plate disposed parallel to the first circuit board.
  • the heat absorbing member is disposed on a side of the first circuit board facing the second circuit board.
  • the handheld device further includes a carrier disposed on a surface of the first circuit board facing the second circuit board, the carrier being configured to carry the heat sink.
  • the handheld device further includes an electromagnetic shielding plate disposed between the carrier and the heat absorbing member, and the heat absorbing member absorbs the operation generated when the first circuit board is operated by the electromagnetic shielding plate Heat.
  • a handheld cloud platform includes a handheld device and a pan-tilt device disposed on the handheld device, the handheld device comprising a housing and electronic components disposed in the housing, the housing being provided with an electronic device for connecting An expansion interface of the device and a connector, the handheld device being connected to the pan/tilt device via the connector, the expansion interface being a heat conduction interface and extending from the outside of the housing into the housing, the expansion interface capable of The heat generated when the electronic component operates is led out of the housing.
  • the inner cavity of the housing includes a battery chamber and a receiving cavity for accommodating the battery assembly.
  • the accommodating cavity includes an electrical cavity and a heat dissipation cavity communicating with the electrical cavity, the electronic component is disposed in the electrical cavity, and heat generated in the electrical cavity is transmitted to the heat dissipation cavity through the heat dissipation cavity The expansion interface.
  • a heat absorbing member is disposed in the heat dissipation cavity, and the heat absorbing member absorbs heat generated when the electronic component operates, and transfers the heat to the expansion interface.
  • the expansion interface includes a heat conducting portion and a fixing portion extending from the heat conducting portion, the fixing portion passes through the housing and extends into the heat dissipation cavity, and the heat conducting portion abuts the housing
  • the outer surface of the fixing portion is for fixing the heat conducting portion to the outer casing.
  • the housing is provided with a mounting hole and a plurality of heat dissipation holes, and the plurality of heat dissipation holes are adjacent to and surround the mounting hole, and the fixing portion fixes the heat conducting portion through the mounting hole
  • the heat conducting portion abuts against an outer surface of the casing and shields a plurality of the heat dissipation holes.
  • the heat absorbing member includes a body and a covering portion protruding from the edge of the body, the covering portion covering the fixing portion and abutting the outer edge of the plurality of the heat dissipation holes An inner surface of the housing, the body absorbing heat generated by the electronic component and transferring the heat to the cladding portion, the cladding portion transferring the heat to the heat conducting portion through the fixing portion The covering portion also transfers the heat to the heat conducting portion through a plurality of the heat dissipation holes, and the heat conducting portion guides the heat out of the housing.
  • the fixing portion has a cylindrical shape
  • the covering portion has an arc shape
  • the heat absorbing member includes a body and a covering portion protruding from the edge of the body, the covering portion covers the fixing portion, and the body absorbs heat generated by the electronic component and The heat is transferred to the cladding portion, and the cladding portion transfers the heat to the heat conducting portion through the fixing portion, and the heat conducting portion guides the heat out of the housing.
  • the fixing portion has a cylindrical shape
  • the covering portion has an arc shape
  • the heat conducting portion is provided with a heat dissipation protrusion
  • the heat conducting portion is provided with a heat dissipating groove.
  • an outer surface of the housing is provided with an operation surface for mounting a function button and a mounting surface for mounting the expansion interface; the operation surface is a plane and is inclined with respect to an axial direction of the housing The mounting surface extends in the axial direction of the housing.
  • the electronic component includes a first circuit board that is vertically disposed within the electrical cavity and disposed along an axial direction of the housing.
  • the first circuit board includes at least one of the following: a wireless fidelity module, a voltage conversion module, a photoelectric conversion module, an image processing module, and an image transmission module, where the wireless fidelity module is configured to implement a wireless fidelity function.
  • the voltage conversion module is configured to implement a voltage conversion function
  • the photoelectric conversion module is configured to implement a photoelectric conversion function
  • the image processing module is configured to process an image
  • the image transmission module is configured to transmit an image.
  • the electronic component further includes a second circuit board, the second circuit board is located at a side of the first circuit board facing the operation surface, and is disposed facing the operation surface; the second circuit The board includes at least one of the following: a power management module and a PTZ management module, the power management module is configured to implement a power management function, and the PTZ management module is configured to implement a PTZ management function.
  • the electronic component further includes a third circuit board corresponding to one end of the first circuit board and perpendicular to the first circuit board; the third circuit board includes a connection module, The connection module is configured to implement an interface connection function between the handheld device and the pan-tilt device.
  • the electronic component further includes a fourth circuit board, the fourth circuit board being located between the third circuit board and the first circuit board, and disposed parallel to the third circuit board;
  • the fourth circuit board includes at least one of the following: an audio signal acquisition module and a displacement sensing module, wherein the audio signal acquisition module is configured to implement an audio signal collection function, and the position sensing module is configured to implement a displacement sense of the handheld device. Test function.
  • the heat absorbing member is a heat dissipation plate disposed parallel to the first circuit board.
  • the heat absorbing member is disposed on a side of the first circuit board facing the second circuit board.
  • the handheld device further includes a carrier disposed on a surface of the first circuit board facing the second circuit board, the carrier being configured to carry the heat sink.
  • the handheld device further includes an electromagnetic shielding plate disposed between the carrier and the heat absorbing member, and the heat absorbing member absorbs the operation generated when the first circuit board is operated by the electromagnetic shielding plate Heat.
  • the pan/tilt device includes at least one of a pitch axis mechanism, a roll axis mechanism, and a translation axis mechanism.
  • An electronic device comprising:
  • a heat absorbing member is mounted in the accommodating cavity, the heat absorbing member is fixedly connected to the circuit board for carrying the circuit board, and the heat absorbing member and the circuit board are insulated from each other;
  • An expansion interface mounted to the housing and for mechanical connection or/and electrical connection with an external interface
  • the expansion interface is connected to the heat absorbing member, and is capable of conducting heat between the heat absorbing member.
  • the expansion interface at least partially exposes the outside of the housing
  • the heat absorbing member absorbs heat generated by the electronic device on the circuit board and transmits the heat to the expansion interface to dissipate heat to the outside of the housing to perform electronic devices on the circuit board. Cooling.
  • the present invention extends the heat generated by the operation of the electronic components in the housing out of the housing by an expansion interface disposed on the housing and extending from the outside of the housing into the housing, thereby enabling the handheld
  • the device, the handheld cloud platform and the electronic device have better heat dissipation functions, and do not need to separately provide a heat dissipation device, which is advantageous for miniaturization design.
  • FIG. 1 is a schematic diagram of a pan/tilt provided by an embodiment of the present invention.
  • Fig. 2 is a front elevational view of the hand held mechanism of the pan/tilt head shown in Fig. 1.
  • Figure 3 is a partial cross-sectional view of Figure 2 taken along the line III-III.
  • FIG. 4 is a partial exploded view of the hand-held mechanism of the pan/tilt head shown in FIG. 1.
  • Figure 5 is a partial assembled view of Figure 4.
  • a component when referred to as being “fixed” to another component, it can be directly on the other component or the component can be present.
  • a component When a component is considered to "connect” another component, it can be directly connected to another component or possibly a central component.
  • a component When a component is considered to be “set to” another component, it can be placed directly on another component or possibly with a centered component.
  • the terms “vertical,” “horizontal,” “left,” “right,” and the like, as used herein, are for illustrative purposes only.
  • an embodiment of the present invention provides a handheld cloud platform 1000.
  • the handheld cloud platform 1000 includes a handheld device 100 and a pan-tilt device 200 disposed on the handheld device 100.
  • the pan/tilt head device 200 may be a two-axis pan/tilt head or a three-axis pan/tilt head. In the present embodiment, a three-axis pan/tilt head will be described as an example.
  • the pan/tilt head device 200 includes a pitch axis mechanism 210, a roll axis mechanism 220, and a translation axis mechanism 230.
  • the pitch axis mechanism 210 is configured to carry an image capturing device 300, and the image capturing device 300 may be a camera, a camera, or the like.
  • the roll axis mechanism 220 is coupled to the pitch axis mechanism 210 and the translation axis mechanism 230.
  • the translational axis mechanism 230 is coupled to the handheld device 100.
  • the handheld device 100 includes a housing 110, a connector 130, electronic components, a heat dissipation component, a carrier 170, an electromagnetic shielding panel 180, and a battery assembly 190.
  • the connecting member 130 is disposed at the top of the housing 110 for connecting the translational shaft mechanism 230.
  • the electronic component, the carrier 170, the electromagnetic shielding plate 180, and the battery assembly 190 are disposed in the housing 110.
  • the heat dissipating component is partially located in the housing 110 and a portion is located outside the housing 110.
  • the heat dissipating component is configured to derive heat generated when the electronic component operates from the outside of the housing 110 to dissipate heat from the electronic component.
  • the battery assembly 190 is used to power the handheld cloud platform 1000.
  • the housing 110 has a substantially rectangular parallelepiped shape. One end of the inner cavity 111 of the housing 110 is partitioned into a battery chamber 112, and the other end is partitioned into a receiving cavity 113.
  • the accommodating cavity 113 includes an electrical cavity 114 and a heat dissipation cavity 115 communicating with the electrical cavity 114.
  • the electronic component is disposed in the electrical cavity 114
  • the heat dissipation component is disposed in the heat dissipation cavity 115
  • the carrier 170 and the electromagnetic shielding plate 180 are disposed in the electrical cavity 114 and the heat dissipation cavity
  • the battery assembly 190 is disposed within the battery cavity 112.
  • the housing 110 includes an operation surface 121 , a first mounting surface 123 adjacent to the operation surface 121 , and a surface adjacent to the operation surface 121 and opposite to the first mounting surface 123 .
  • Second mounting surface 125 The operation surface 121 is provided with a plurality of function buttons (such as the shooting button 122 shown in FIG. 1).
  • An expansion interface (such as the expansion interface 165 shown in FIG. 1) is disposed on the first mounting surface 123.
  • the second mounting surface 125 is provided with function buttons (such as the power button 126 shown in FIG. 2).
  • the operation surface 121 is a flat surface and is disposed obliquely with respect to an axial direction of the housing 110.
  • the first mounting surface 123 and the second mounting surface 125 extend in the axial direction of the housing 110.
  • the electronic component includes circuit boards 152, 154, 156, 158.
  • the circuit board 152 is vertically disposed within the electrical cavity 114 and disposed along an axial direction of the housing 110.
  • the circuit board 154 is located on a side of the circuit board 152 facing the operation surface 121 and is disposed facing the operation surface 121.
  • the circuit board 158 corresponds to one end of the circuit board 152 and is perpendicular to the circuit board 152.
  • the circuit board 156 is located between the circuit board 152 and the circuit board 158 and is parallel to the circuit board 158.
  • the circuit board 152 is connected to the energy card 154, 156, 158 by a flexible cable.
  • the circuit board 152 includes at least one of the following: a Wi-Fi (Wireless Fidelity) module, a voltage conversion module, a photoelectric conversion module, an image processing module, and an image transmission module.
  • the Wi-Fi module is configured to implement a Wi-Fi function
  • the voltage conversion module is configured to implement a voltage conversion function
  • the photoelectric conversion module is configured to implement a photoelectric conversion function
  • the image processing module is configured to implement an image processing function.
  • the image transmission module is configured to implement an image transmission function.
  • the circuit board 154 includes at least one of the following: a power management module and a pan/tilt management module.
  • the power management module is configured to implement a power management function
  • the cloud platform management module is configured to implement a cloud platform management function.
  • the circuit board 156 includes at least one of the following: an audio signal acquisition module and a displacement sensing module.
  • the audio signal acquisition module is configured to implement an audio signal collection function
  • the position sensing module is configured to implement a displacement sensing function of the handheld device 100.
  • the displacement sensing module includes a gyroscope and a compass.
  • the circuit board 158 includes, but is not limited to, a connection module for implementing an interface connection function between the handheld device 100 and the pan/tilt device 200.
  • the heat dissipating component includes a heat absorbing member 162 and an expansion interface 165 for connecting the electronic device.
  • the heat absorbing member 162 is disposed in the heat dissipation cavity 115, parallel to the circuit board 152, and located on a side of the circuit board facing the circuit board 154.
  • the heat absorbing member 162 includes a body 163 and a covering portion 164 protruding from a rim of the body 163.
  • the expansion interface 165 is a heat conduction interface, and includes a heat conduction portion 166 and a fixing portion 168 extending from the heat conduction portion 166 .
  • the fixing portion 168 passes through the mounting hole 128 of the first mounting surface 123 and extends into the heat dissipation cavity 115.
  • the fixing portion 168 is in an interference fit or threaded engagement with the mounting hole 128 to fix the heat conducting portion 166 to the housing 110.
  • the first mounting surface 123 is further provided with a plurality of heat dissipation holes 129 adjacent to and surrounding the mounting holes 128.
  • the heat conducting portion 166 abuts against an outer surface of the second mounting surface 125 and shields the plurality of the heat dissipation holes 129 .
  • the covering portion 164 covers the fixing portion 168 and abuts against an inner surface of the second mounting surface 125 at an outer edge of the plurality of heat dissipation holes 129 .
  • the expansion interface 165 is used for mechanical connection or/and electrical connection with an interface of the electronic device.
  • the heat absorbing member 162 is a heat dissipation plate disposed parallel to the circuit board 152.
  • the expansion interface 165 is a disk-shaped expansion interface, and the disk-tooth expansion interface is used to expand the handheld cloud platform 1000 to connect electronic devices such as mobile phones and tablets.
  • the fixing portion 168 is substantially cylindrical, and the covering portion 164 is substantially arcuate.
  • the carrier 170 is disposed on a surface of the circuit board 152 facing the circuit board 154 for carrying the electromagnetic shielding plate 180 and the heat absorbing member 162.
  • the electromagnetic shielding plate 180 is used to shield electromagnetic waves and has good thermal conductivity.
  • the electromagnetic shielding plate 180 is disposed between the carrier 170 and the heat absorbing member 162 , and the opposite surfaces of the electromagnetic shielding plate 180 and the heat absorbing member 162 and the carrier 170 respectively contact.
  • the heat absorbing member 162 absorbs heat generated by the operation of the circuit board 152 through the electromagnetic shielding plate 180.
  • the functional modules on the circuit boards 152, 154, 156, 158 operate and generate heat.
  • the body 163 absorbs heat generated by the circuit board 152 through the electromagnetic shielding plate 180, and transmits the absorbed heat to the covering portion 164.
  • the covering portion 164 transfers heat to the heat conducting portion 166 through the fixing portion 168 , and the covering portion 164 also transfers heat to the heat conducting portion 166 through the plurality of the heat dissipation holes 129 .
  • the heat conducting portion 166 conducts the heat out of the housing 110 to achieve a heat dissipation function.
  • a plurality of the heat dissipation holes 129 are provided to enhance heat transfer between the cladding portion 164 and the heat transfer portion 166.
  • the heat conducting portion 166 abuts against the outer surface of the second mounting surface 125, and the covering portion 164 covers the covering portion.
  • the fixing portion 168 abuts against the inner surface of the second mounting surface 125.
  • the covering portion 164 transfers heat to the heat conducting portion 166 through the fixing portion 168, and the heat conducting portion 166 conducts the heat out of the housing 110.
  • the electronic component further includes a chip, a resistor, a capacitor, an inductor, etc.
  • the number of circuit boards included in the electronic component may be one or more, for example, two, three, six, and the like.
  • the number of function modules included in each board and the functions to be implemented by the function modules can be adjusted accordingly.
  • a heat absorbing member 162 can be disposed beside each of the circuit boards to dissipate heat from each of the circuit boards. Therefore, the number of the heat absorbing members 162 can be one or more, and the number of the expansion interfaces 165 can be It can also be one or more.
  • the heat conducting portion 166 is provided with at least one of a heat dissipation protrusion and a heat dissipation groove, and the heat conduction portion 166 enhances the heat conduction area.
  • the battery assembly 190 includes one or more rechargeable batteries.
  • a portion of the housing 110 corresponding to the battery chamber 112 is provided with a plurality of indicator lights (not shown) for indicating the amount of power of the battery assembly 190.
  • the present invention provides the heat sink 162 on the circuit board 152 to absorb the heat of the circuit board 152, and the heat absorbed by the heat sink 162 is led out of the housing through the expansion interface 165. Therefore, the handheld cloud platform 1000 has a better heat dissipation function, and does not need to separately provide a heat dissipation device, which is advantageous for miniaturization design.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
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Abstract

一种手持装置(100)，所述手持装置(100)包括壳体(110)以及设置于所述壳体(110)内的电子元件，所述壳体(110)上设置有用于连接电子设备的扩展接口(165)，所述扩展接口(165)为导热接口并自所述壳体外延伸至所述壳体内，所述扩展接口(165)能够将所述电子元件工作时产生的热量导出所述壳体外。还公开了使用所述手持装置(100)的手持云台(1000)及电子装置。上述手持装置(100)以及使用该手持装置(100)的手持云台(1000)及电子装置具有较好的散热功能并且利于小型化设计。

Description

手持装置及使用该手持装置的手持云台及电子装置 技术领域
本发明涉及一种手持装置，以及使用所述手持装置的手持云台及电子装置。
背景技术
通常手持云台包括壳体及设置于所述壳体内的电路板。所述电路板上设置有多个用于实现不同功能的功能模块，例如图像处理模块、电源模块等，所述功能模块在工作时通常会产生热量。由于所述功能模块位于所述壳体形成的密闭的空间内，因此，所述功能模块产生的热量往往难以有效、及时的散去。如果所述热量积累到一定程度，将影响所述功能模块的性能，进而影响所述云台的整体性能。
另外，虽然有些手持云台为了对上述功能模块进行散热，单独设置了散热装置，例如，风扇等。然而，该散热装置会增大手持云台的体积，使得手持云台不利于小型化设计。
发明内容
有鉴于此，有必要提供一种散热性较好、并且利于小型化设计的手持装置及使用所述手持装置的手持云台及电子装置。
一种手持装置，包括壳体以及设置于所述壳体内的电子元件，所述壳体上设置有用于连接电子设备的扩展接口，所述扩展接口为导热接口并自所述壳体外延伸至所述壳体内，所述扩展接口能够将所述电子元件工作时产生的热量导出所述壳体外。
进一步地，所述壳体的内腔包括电池腔及及容置腔，所述电池腔用于收容电池组件。
进一步地，所述容置腔包括电气腔及与所述电气腔相连通的散热腔，所述电子元件设置于所述电气腔内，所述电气腔内产生的热量通过所述散热腔传递给所述扩展接口。
进一步地，所述散热腔内设有吸热件，所述吸热件吸收所述电子元件工作时产生的热量，并将所述热量传递给所述扩展接口。
进一步地，所述扩展接口包括导热部及自所述导热部延伸出固定部，所述固定部穿过所述壳体并延伸至所述散热腔内，所述导热部抵靠所述壳体的外表面，所述固定部用于将所述导热部固定在所述外壳上。
进一步地，所述壳体上设置有安装孔及多个散热孔，多个所述散热孔靠近且围绕所述安装孔，所述固定部通过所述安装孔将所述导热部固定在所述外壳上，所述导热部抵靠所述壳体的外表面并遮蔽多个所述散热孔。
进一步地，所述吸热件包括本体及凸设于所述本体缘边的包覆部，所述包覆部包覆所述固定部并于多个所述散热孔的外缘抵靠所述壳体的内表面，所述本体吸收所述电子元件产生的热量并将所述热量传递给所述包覆部，所述包覆部将所述热量通过所述固定部传递所述导热部，所述包覆部还将所述热量通过多个所述散热孔传递给所述导热部，所述导热部将所述热量导出所述壳体外。
进一步地，所述固定部呈圆柱状，所述包覆部呈弧形。
进一步地，所述吸热件包括本体及凸设于所述本体缘边的包覆部，所述包覆部包覆所述固定部，所述本体吸收所述电子元件产生的热量并将所述热量传递给所述包覆部，所述包覆部将所述热量通过所述固定部传递所述导热部，所述导热部将所述热量导出所述壳体外。
进一步地，所述固定部呈圆柱状，所述包覆部呈弧形。
进一步地，所述导热部上设置有散热凸起；
或/及，所述导热部上设置有散热凹槽。
进一步地，所述壳体的外表面设有用于安装功能按键的操作面及用于安装所述扩展接口的安装面；所述操作面为平面，并且相对于所述壳体的轴向倾斜设置，所述安装面沿所述壳体的轴向延伸。
进一步地，所述电子元件包括第一电路板，所述第一电路板竖直设置于所述电气腔内，且沿所述壳体的轴向设置。
进一步地，所述第一电路板包括如下至少一种：无线保真模块、电压转换模块、光电转换模块、图像处理模块及图像传输模块，所述无线保真模块用于实现无线保真功能，所述电压转换模块用于实现电压转换功能，所述光电转换模块用于实现光电转换功能，所述图像处理模块用于对图像进行处理，所述图像传输模块用于传输图像。
进一步地，所述电子元件还包括第二电路板，所述第二电路板位于所述第一电路板朝向所述操作面的一侧，且面对所述操作面设置；所述第二电路板包括如下至少一种：电源管理模块及云台管理模块，所述电源管理模块用于实现电源管理功能，所述云台管理模块用于实现云台管理功能。
进一步地，所述电子元件还包括第三电路板，所述第三电路板对应于所述第一电路板的一端且垂直于所述第一电路板；所述第三电路板包括连接模块，所述连接模块用于实现所述手持装置与云台装置的接口连接功能。
进一步地，所述电子元件还包括第四电路板，所述第四电路板位于所述第三电路板与所述第一电路板之间，且平行于所述第三电路板设置；所述第四电路板包括如下至少一种：音频信号采集模块及位移感测模块，所述音频信号采集模块用于实现音频信号采集功能，所述位置感测模块用于实现所述手持装置的位移感测功能。
进一步地，所述吸热件为平行于所述第一电路板设置的散热板。
进一步地，所述吸热件设置于所述第一电路板朝向所述第二电路板的一侧。
进一步地，所述手持装置还包括设置于所述第一电路板朝向所述第二电路板的表面上的承载件，所述承载件用于承载所述吸热件。
进一步地，所述手持装置还包括设置于所述承载件与所述吸热件之间的电磁屏蔽板，所述吸热件通过所述电磁屏蔽板吸收所述第一电路板工作时产生的热量。
一种手持云台，包括手持装置及设置于所述手持装置上的云台装置，所述手持装置包括壳体以及设置于所述壳体内的电子元件，所述壳体上设置有用于连接电子设备的扩展接口以及连接件，所述手持装置通过所述连接件与所述云台装置相连，所述扩展接口为导热接口并自所述壳体外延伸至所述壳体内，所述扩展接口能够将所述电子元件工作时产生的热量导出所述壳体外。
进一步地，所述壳体的内腔包括电池腔及及容置腔，所述电池腔用于收容电池组件。
进一步地，所述容置腔包括电气腔及与所述电气腔相连通的散热腔，所述电子元件设置于所述电气腔内，所述电气腔内产生的热量通过所述散热腔传递给所述扩展接口。
进一步地，所述散热腔内设有吸热件，所述吸热件吸收所述电子元件工作时产生的热量，并将所述热量传递给所述扩展接口。
进一步地，所述扩展接口包括导热部及自所述导热部延伸出固定部，所述固定部穿过所述壳体并延伸至所述散热腔内，所述导热部抵靠所述壳体的外表面，所述固定部用于将所述导热部固定在所述外壳上。
进一步地，所述壳体上设置有安装孔及多个散热孔，多个所述散热孔靠近且围绕所述安装孔，所述固定部通过所述安装孔将所述导热部固定在所述外壳上，所述导热部抵靠所述壳体的外表面并遮蔽多个所述散热孔。
进一步地，所述吸热件包括本体及凸设于所述本体缘边的包覆部，所述包覆部包覆所述固定部并于多个所述散热孔的外缘抵靠所述壳体的内表面，所述本体吸收所述电子元件产生的热量并将所述热量传递给所述包覆部，所述包覆部将所述热量通过所述固定部传递所述导热部，所述包覆部还将所述热量通过多个所述散热孔传递给所述导热部，所述导热部将所述热量导出所述壳体外。
进一步地，所述固定部呈圆柱状，所述包覆部呈弧形。
进一步地，所述吸热件包括本体及凸设于所述本体缘边的包覆部，所述包覆部包覆所述固定部，所述本体吸收所述电子元件产生的热量并将所述热量传递给所述包覆部，所述包覆部将所述热量通过所述固定部传递所述导热部，所述导热部将所述热量导出所述壳体外。
进一步地，所述固定部呈圆柱状，所述包覆部呈弧形。
进一步地，所述导热部上设置有散热凸起；
或/及，所述导热部上设置有散热凹槽。
进一步地，所述壳体的外表面设有用于安装功能按键的操作面及用于安装所述扩展接口的安装面；所述操作面为平面，并且相对于所述壳体的轴向倾斜设置，所述安装面沿所述壳体的轴向延伸。
进一步地，所述电子元件包括第一电路板，所述第一电路板竖直设置于所述电气腔内，且沿所述壳体的轴向设置。
进一步地，所述第一电路板包括如下至少一种：无线保真模块、电压转换模块、光电转换模块、图像处理模块及图像传输模块，所述无线保真模块用于实现无线保真功能，所述电压转换模块用于实现电压转换功能，所述光电转换模块用于实现光电转换功能，所述图像处理模块用于对图像进行处理，所述图像传输模块用于传输图像。
进一步地，所述电子元件还包括第二电路板，所述第二电路板位于所述第一电路板朝向所述操作面的一侧，且面对所述操作面设置；所述第二电路板包括如下至少一种：电源管理模块及云台管理模块，所述电源管理模块用于实现电源管理功能，所述云台管理模块用于实现云台管理功能。
进一步地，所述电子元件还包括第三电路板，所述第三电路板对应于所述第一电路板的一端且垂直于所述第一电路板；所述第三电路板包括连接模块，所述连接模块用于实现所述手持装置与云台装置的接口连接功能。
进一步地，所述电子元件还包括第四电路板，所述第四电路板位于所述第三电路板与所述第一电路板之间，且平行于所述第三电路板设置；所述第四电路板包括如下至少一种：音频信号采集模块及位移感测模块，所述音频信号采集模块用于实现音频信号采集功能，所述位置感测模块用于实现所述手持装置的位移感测功能。
进一步地，所述吸热件为平行于所述第一电路板设置的散热板。
进一步地，所述吸热件设置于所述第一电路板朝向所述第二电路板的一侧。
进一步地，所述手持装置还包括设置于所述第一电路板朝向所述第二电路板的表面上的承载件，所述承载件用于承载所述吸热件。
进一步地，所述手持装置还包括设置于所述承载件与所述吸热件之间的电磁屏蔽板，所述吸热件通过所述电磁屏蔽板吸收所述第一电路板工作时产生的热量。
进一步地，所述云台装置包括如下至少一种：俯仰轴机构、横滚轴机构以及平移轴机构。
一种电子装置，其特征在于，包括：
壳体，设有容置腔；
电路板，安装在所述容置腔内；
吸热件，安装在所述容置腔内，所述吸热件与所述电路板固定连接，用于承载所述电路板，并且所述吸热件与所述电路板相互绝缘；
扩展接口，安装在所述壳体，并且用于与外部接口机械连接或/及电连接；
其中，所述扩展接口与所述吸热件连接，并且能够与所述吸热件之间进行导热。
进一步地，所述扩展接口至少局部外露所述壳体外；
或者，所述吸热件吸收所述电路板上的电子器件产生的热量，传递给所述扩展接口，从而将热量散热到所述壳体的外部，以对所述电路板上的电子器件进行散热。
本发明通过设置在所述壳体上并自所述壳体外延伸至所述壳体内的扩展接口，将所述壳体内的电子元件工作时产生的热量导出所述壳体外，从而使所述手持装置、所述手持云台及所述电子装置具有较好的散热功能，并且无需单独设置散热装置，利于小型化设计。
 附图说明
图1为本发明的实施方式提供的云台的示意图。
图2为图1所示的云台的手持机构的主视图。
图3为图2沿III-III方向的局部剖视图。
图4为图1所示的云台的手持机构的局部爆炸图。
图5为图4的局部组装图。
主要元件符号说明
手持云台 1000
手持装置 100
壳体 110
内腔 111
电池腔 112
容置腔 113
电气腔 114
散热腔 115
操作面 121
拍摄按键 122
第一安装面 123
第二安装面 125
电源按键 126
安装孔 128
散热孔 129
连接件 130
电路板 152、154、156、158
吸热件 162
本体 163
包覆部 164
扩展接口 165
导热部 166
固定部 168
承载件 170
电磁屏蔽板 180
电池组件 190
云台装置 200
俯仰轴机构 210
横滚轴机构 220
平移轴机构 230
图像拍摄装置 300
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
需要说明的是，当组件被称为“固定于”另一个组件，它可以直接在另一个组件上或者也可以存在居中的组件。当一个组件被认为是“连接”另一个组件，它可以是直接连接到另一个组件或者可能同时存在居中组件。当一个组件被认为是“设置于”另一个组件，它可以是直接设置在另一个组件上或者可能同时存在居中组件。本文所使用的术语“垂直的”、“水平的”、“左”、“右”以及类似的表述只是为了说明的目的。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本发明。本文所使用的术语“及／或”包括一个或多个相关的所列项目的任意的和所有的组合。
下面结合附图，对本发明的一些实施方式作详细说明。在不冲突的情况下，下述的实施例及实施例中的特征可以相互组合。
请参阅图1，本发明的实施方式提供一种手持云台1000。所述手持云台1000包括手持装置100及设置于所述手持装置100上的云台装置200。所述云台装置200可以为二轴云台、三轴云台等，在本实施方式中，以三轴云台为例进行说明。
在本实施方式中，所述云台装置200包括俯仰轴机构210、横滚轴机构220、以及平移轴机构230。其中，所述俯仰轴机构210用于承载图像拍摄装置300，所述图像拍摄装置300可以为照相机、摄像头等。所述横滚轴机构220与所述俯仰轴机构210及所述平移轴机构230相连。所述平移轴机构230与所述手持装置100相连。
请同时参阅图1至图5，所述手持装置100包括壳体110、连接件130、电子元件、散热组件、承载件170、电磁屏蔽板180及电池组件190。所述连接件130设置于所述壳体110的顶部，用于连接所述平移轴机构230。所述电子元件、所述承载件170、所述电磁屏蔽板180及所述电池组件190设于所述壳体110内。所述散热组件一部分位于所述壳体110内，一部分位于所述壳体110外。所述散热组件用于将所述电子元件工作时产生的热量导出所述壳体110外，以对所述电子元件散热。所述电池组件190用于为所述手持云台1000供电。
在本实施方式中，所述壳体110大致呈长方体状。所述壳体110的内腔111的一端被分隔为电池腔112，另外一端被分隔为容置腔113。所述容置腔113包括电气腔114及与所述电气腔114相连通的散热腔115。所述电子元件设置于所述电气腔114内，所述散热组件设置于所述散热腔115内，所述承载件170及所述电磁屏蔽板180设于所述电气腔114与所述散热腔115之间，所述电池组件190设置于所述电池腔112内。
在本实施方式中，所述壳体110包括操作面121、与所述操作面121相邻的第一安装面123及与所述操作面121相邻且与所述第一安装面123相对的第二安装面125。所述操作面121上设置有多个功能按键（如图1所示的拍摄按键122等）。所述第一安装面123上设置有扩展接口（如图1所示的扩展接口165等）。所述第二安装面125上设置有功能按键（如图2所示的电源按键126等）。所述操作面121为平面，并且相对于所述壳体110的轴向倾斜设置。所述第一安装面123及所述第二安装面125沿所述壳体110的轴向延伸。
在本实施方式中，所述电子元件包括电路板152、154、156、158。所述电路板152竖直设置于所述电气腔114内，且沿所述壳体110的轴向设置。所述电路板154位于所述电路板152朝向所述操作面121的一侧，且面对所述操作面121设置。所述电路板158对应于所述电路板152的一端且垂直于所述电路板152。所述电路板156位于所述电路板152于所述电路板158之间，且平行于所述电路板158。所述电路板152通过软排线与所述能板卡154、156、158相连。
所述电路板152包括如下至少一种：Wi-Fi（Wireless Fidelity，无线保真）模块、电压转换模块、光电转换模块、图像处理模块及图像传输模块。所述Wi-Fi模块用于实现Wi-Fi功能，所述电压转换模块用于实现电压转换功能，所述光电转换模块用于实现光电转换功能，所述图像处理模块用于实现图像处理功能，所述图像传输模块用于实现图像传输功能。所述电路板154包括如下至少一种：电源管理模块及云台管理模块。所述电源管理模块用于实现电源管理功能，所述云台管理模块用于实现云台管理功能。所述电路板156包括如下至少一种：音频信号采集模块及位移感测模块。所述音频信号采集模块用于实现音频信号采集功能，所述位置感测模块用于实现所述手持装置100的位移感测功能。所述位移感测模块包括陀螺仪及指南针。所述电路板158包括但不限于连接模块，所述连接模块用于实现所述手持装置100与所述云台装置200的接口连接功能。
所述散热组件包括吸热件162及用于连接电子设备的扩展接口165。所述吸热件162设置于所述散热腔115内，平行于所述电路板152，且位于所述电路板朝向所述电路板154的一侧。所述吸热件162包括本体163及凸设于所述本体163缘边的包覆部164。所述扩展接口165为导热接口，其包括导热部166及自所述导热部166延伸出固定部168。所述固定部168穿过所述第一安装面123的安装孔128并延伸至所述散热腔115内。所述固定部168与所述安装孔128过盈配合或螺纹配合，以将所述导热部166固定在所述壳体110上。所述第一安装面123上还设置有靠近且围绕所述安装孔128的多个散热孔129。所述导热部166抵靠所述第二安装面125的外表面并遮蔽多个所述散热孔129。所述包覆部164包覆所述固定部168并于多个所述散热孔129的外缘抵靠所述第二安装面125的内表面。在本实施方式中，所述扩展接口165用于与所述电子设备的接口机械连接或/及电连接。
在本实施方式中，所述吸热件162为平行于所述电路板152设置的散热板。所述扩展接口165为一盘齿状扩展接口，所述盘齿状扩展接口用于将所述手持云台1000拓展连接手机、平板等电子设备。所述固定部168大致呈圆柱状，所述包覆部164大致呈弧形。
所述承载件170设置于所述电路板152朝向所述电路板154的表面上，用于承载所述电磁屏蔽板180及所述吸热件162。所述电磁屏蔽板180用于屏蔽电磁波且具有良好的导热性。所述电磁屏蔽板180设置于所述承载件170与所述吸热件162之间，并且所述电磁屏蔽板180的相对的两个表面分别与所述吸热件162及所述承载件170接触。所述吸热件162通过所述电磁屏蔽板180吸收所述电路板152工作时产生的热量。
当所述手持云台1000工作时，所述电路板152、154、156、158上的功能模块工作并产生热量。所述本体163通过所述电磁屏蔽板180吸收所述电路板152产生的热量，并将吸收的热量传递给所述包覆部164。所述包覆部164将热量通过所述固定部168传递所述导热部166，所述包覆部164还将热量通过多个所述散热孔129传递给所述导热部166。所述导热部166将所述热量导出所述壳体110外，从而实现对散热功能。在本实施方式中，设置多个所述散热孔129是为了增强所述包覆部164与所述导热部166之间的热传递。
可以理解，当所述第二安装面125上未设置多个所述散热孔129时，所述导热部166抵靠所述第二安装面125的外表面，所述包覆部164包覆所述固定部168抵靠所述第二安装面125的内表面。所述包覆部164将热量通过所述固定部168传递所述导热部166，所述导热部166将所述热量导出所述壳体110外。
可以理解，所述电子元件还包括芯片、电阻、电容、电感等，所述电子元件所包括的电路板的数量可以为一个或多个，例如，两个、三个、六个等等。每一个电路板所包括的功能模块的数量以及功能模块所要实现的功能均可根据实际情况进行相应调整。
可以理解，多个所述电路板在所述电气腔114内的排布方式、位置关系及连接关系均可根据是实际情况进行相应调整。
可以理解，每一个电路板的旁边都可以设置一个吸热件162，以对每一个电路板散热，因此，所述吸热件162的数量可以为一个或多个，所述扩展接口165的数量也可以为一个或多个。
可以理解，所述导热部166上至少设置有散热凸起及散热凹槽中的一种，以所述导热部166增强导热面积。
可以理解，所述电池组件190包括一个或多个充电电池。
可以理解，所述壳体110上对应于所述电池腔112的部分设置有多个指示灯（图未示），所述指示灯用于指示所述电池组件190的电量。
本发明通过将所述吸热件162设置于所述电路板152上以吸收所述电路板152的热量，并通过所述扩展接口165将所述吸热件162吸收的热量导出所述壳体外，从而使所述手持云台1000具有较好的散热功能，并且无需单独设置散热装置，利于小型化设计。
以上实施方式仅用以说明本发明的技术方案而非限制，尽管参照以上实施方式对本发明进行了详细说明，本领域的普通技术人员应当理解，可以对本发明的技术方案进行修改或等同替换都不应脱离本发明技术方案的精神和范围。

Claims (45)

  1. 一种手持装置，包括壳体以及设置于所述壳体内的电子元件，所述壳体上设置有用于连接电子设备的扩展接口以及用于连接云台装置的连接件，其特征在于：所述扩展接口为导热接口并自所述壳体外延伸至所述壳体内，所述扩展接口能够将所述电子元件工作时产生的热量导出所述壳体外。
  2. 如权利要求1所述的手持装置，其特征在于：所述壳体的内腔包括电池腔及及容置腔，所述电池腔用于收容电池组件。
  3. 如权利要求2所述的手持装置，其特征在于：所述容置腔包括电气腔及与所述电气腔相连通的散热腔，所述电子元件设置于所述电气腔内，所述电气腔内产生的热量通过所述散热腔传递给所述扩展接口。
  4. 如权利要求3所述的手持装置，其特征在于：所述散热腔内设有吸热件，所述吸热件吸收所述电子元件工作时产生的热量，并将所述热量传递给所述扩展接口。
  5. 如权利要求4所述的手持装置，其特征在于：所述扩展接口包括导热部及自所述导热部延伸出固定部，所述固定部穿过所述壳体并延伸至所述散热腔内，所述导热部抵靠所述壳体的外表面，所述固定部用于将所述导热部固定在所述外壳上。
  6. 如权利要求5所述的手持装置，其特征在于：所述壳体上设置有安装孔及多个散热孔，多个所述散热孔靠近且围绕所述安装孔，所述固定部通过所述安装孔将所述导热部固定在所述外壳上，所述导热部抵靠所述壳体的外表面并遮蔽多个所述散热孔。
  7. 如权利要求6所述的手持装置，其特征在于：所述吸热件包括本体及凸设于所述本体缘边的包覆部，所述包覆部包覆所述固定部并于多个所述散热孔的外缘抵靠所述壳体的内表面，所述本体吸收所述电子元件产生的热量并将所述热量传递给所述包覆部，所述包覆部将所述热量通过所述固定部传递所述导热部，所述包覆部还将所述热量通过多个所述散热孔传递给所述导热部，所述导热部将所述热量导出所述壳体外。
  8. 如权利要求7所述的手持装置，其特征在于：所述固定部呈圆柱状，所述包覆部呈弧形。
  9. 如权利要求5所述的手持装置，其特征在于：所述吸热件包括本体及凸设于所述本体缘边的包覆部，所述包覆部包覆所述固定部，所述本体吸收所述电子元件产生的热量并将所述热量传递给所述包覆部，所述包覆部将所述热量通过所述固定部传递所述导热部，所述导热部将所述热量导出所述壳体外。
  10. 如权利要求9所述的手持装置，其特征在于：所述固定部呈圆柱状，所述包覆部呈弧形。
  11. 如权利要求5所述的手持装置，其特征在于：所述导热部上设置有散热凸起；
    或/及，所述导热部上设置有散热凹槽。
  12. 如权利要求4所述的手持装置，其特征在于：所述壳体的外表面设有用于安装功能按键的操作面及用于安装所述扩展接口的安装面；所述操作面为平面，并且相对于所述壳体的轴向倾斜设置，所述安装面沿所述壳体的轴向延伸。
  13. 如权利要求12所述的手持装置，其特征在于：所述电子元件包括第一电路板，所述第一电路板竖直设置于所述电气腔内，且沿所述壳体的轴向设置。
  14. 如权利要求13所述的手持装置，其特征在于：所述第一电路板包括如下至少一种：无线保真模块、电压转换模块、光电转换模块、图像处理模块及图像传输模块，所述无线保真模块用于实现无线保真功能，所述电压转换模块用于实现电压转换功能，所述光电转换模块用于实现光电转换功能，所述图像处理模块用于对图像进行处理，所述图像传输模块用于传输图像。
  15. 如权利要求14所述的手持装置，其特征在于：所述电子元件还包括第二电路板，所述第二电路板位于所述第一电路板朝向所述操作面的一侧，且面对所述操作面设置；所述第二电路板包括如下至少一种：电源管理模块及云台管理模块，所述电源管理模块用于实现电源管理功能，所述云台管理模块用于实现云台管理功能。
  16. 如权利要求15所述的手持装置，其特征在于：所述电子元件还包括第三电路板，所述第三电路板对应于所述第一电路板的一端且垂直于所述第一电路板；所述第三电路板包括连接模块，所述连接模块用于实现所述手持装置与云台装置的接口连接功能。
  17. 如权利要求16所述的手持装置，其特征在于：所述电子元件还包括第四电路板，所述第四电路板位于所述第三电路板与所述第一电路板之间，且平行于所述第三电路板设置；所述第四电路板包括如下至少一种：音频信号采集模块及位移感测模块，所述音频信号采集模块用于实现音频信号采集功能，所述位置感测模块用于实现所述手持装置的位移感测功能。
  18. 如权利要求13所述的手持装置，其特征在于：所述吸热件为平行于所述第一电路板设置的散热板。
  19. 如权利要求15所述的手持装置，其特征在于：所述吸热件设置于所述第一电路板朝向所述第二电路板的一侧。
  20. 如权利要求15所述的手持装置，其特征在于：所述手持装置还包括设置于所述第一电路板朝向所述第二电路板的表面上的承载件，所述承载件用于承载所述吸热件。
  21. 如权利要求20所述的手持装置，其特征在于：所述手持装置还包括设置于所述承载件与所述吸热件之间的电磁屏蔽板，所述吸热件通过所述电磁屏蔽板吸收所述第一电路板工作时产生的热量。
  22. 一种手持云台，包括手持装置及设置于所述手持装置上的云台装置，所述手持装置包括壳体以及设置于所述壳体内的电子元件，所述壳体上设置有用于连接电子设备的扩展接口以及连接件，所述手持装置通过所述连接件与所述云台装置相连，其特征在于：所述扩展接口为导热接口并自所述壳体外延伸至所述壳体内，所述扩展接口能够将所述电子元件工作时产生的热量导出所述壳体外。
  23. 如权利要求22所述的手持云台，其特征在于：所述壳体的内腔包括电池腔及及容置腔，所述电池腔用于收容电池组件。
  24. 如权利要求23所述的手持云台，其特征在于：所述容置腔包括电气腔及与所述电气腔相连通的散热腔，所述电子元件设置于所述电气腔内，所述电气腔内产生的热量通过所述散热腔传递给所述扩展接口。
  25. 如权利要求24所述的手持云台，其特征在于：所述散热腔内设有吸热件，所述吸热件吸收所述电子元件工作时产生的热量，并将所述热量传递给所述扩展接口。
  26. 如权利要求25所述的手持云台，其特征在于：所述扩展接口包括导热部及自所述导热部延伸出固定部，所述固定部穿过所述壳体并延伸至所述散热腔内，所述导热部抵靠所述壳体的外表面，所述固定部用于将所述导热部固定在所述外壳上。
  27. 如权利要求26所述的手持云台，其特征在于：所述壳体上设置有安装孔及多个散热孔，多个所述散热孔靠近且围绕所述安装孔，所述固定部通过所述安装孔将所述导热部固定在所述外壳上，所述导热部抵靠所述壳体的外表面并遮蔽多个所述散热孔。
  28. 如权利要求27所述的手持云台，其特征在于：所述吸热件包括本体及凸设于所述本体缘边的包覆部，所述包覆部包覆所述固定部并于多个所述散热孔的外缘抵靠所述壳体的内表面，所述本体吸收所述电子元件产生的热量并将所述热量传递给所述包覆部，所述包覆部将所述热量通过所述固定部传递所述导热部，所述包覆部还将所述热量通过多个所述散热孔传递给所述导热部，所述导热部将所述热量导出所述壳体外。
  29. 如权利要求28所述的手持云台，其特征在于：所述固定部呈圆柱状，所述包覆部呈弧形。
  30. 如权利要求26所述的手持云台，其特征在于：所述吸热件包括本体及凸设于所述本体缘边的包覆部，所述包覆部包覆所述固定部，所述本体吸收所述电子元件产生的热量并将所述热量传递给所述包覆部，所述包覆部将所述热量通过所述固定部传递所述导热部，所述导热部将所述热量导出所述壳体外。
  31. 如权利要求30所述的手持云台，其特征在于：所述固定部呈圆柱状，所述包覆部呈弧形。
  32. 如权利要求26所述的手持云台，其特征在于：所述导热部上设置有散热凸起；
    或/及，所述导热部上设置有散热凹槽。
  33. 如权利要求25所述的手持云台，其特征在于：所述壳体的外表面设有用于安装功能按键的操作面及用于安装所述扩展接口的安装面；所述操作面为平面，并且相对于所述壳体的轴向倾斜设置，所述安装面沿所述壳体的轴向延伸。
  34. 如权利要求33所述的手持云台，其特征在于：所述电子元件包括第一电路板，所述第一电路板竖直设置于所述电气腔内，且沿所述壳体的轴向设置。
  35. 如权利要求34所述的手持云台，其特征在于：所述第一电路板包括如下至少一种：无线保真模块、电压转换模块、光电转换模块、图像处理模块及图像传输模块，所述无线保真模块用于实现无线保真功能，所述电压转换模块用于实现电压转换功能，所述光电转换模块用于实现光电转换功能，所述图像处理模块用于对图像进行处理，所述图像传输模块用于传输图像。
  36. 如权利要求35所述的手持云台，其特征在于：所述电子元件还包括第二电路板，所述第二电路板位于所述第一电路板朝向所述操作面的一侧，且面对所述操作面设置；所述第二电路板包括如下至少一种：电源管理模块及云台管理模块，所述电源管理模块用于实现电源管理功能，所述云台管理模块用于实现云台管理功能。
  37. 如权利要求36所述的手持云台，其特征在于：所述电子元件还包括第三电路板，所述第三电路板对应于所述第一电路板的一端且垂直于所述第一电路板；所述第三电路板包括连接模块，所述连接模块用于实现所述手持装置与云台装置的接口连接功能。
  38. 如权利要求37所述的手持云台，其特征在于：所述电子元件还包括第四电路板，所述第四电路板位于所述第三电路板与所述第一电路板之间，且平行于所述第三电路板设置；所述第四电路板包括如下至少一种：音频信号采集模块及位移感测模块，所述音频信号采集模块用于实现音频信号采集功能，所述位置感测模块用于实现所述手持装置的位移感测功能。
  39. 如权利要求34所述的手持云台，其特征在于：所述吸热件为平行于所述第一电路板设置的散热板。
  40. 如权利要求36所述的手持云台，其特征在于：所述吸热件设置于所述第一电路板朝向所述第二电路板的一侧。
  41. 如权利要求36所述的手持云台，其特征在于：所述手持装置还包括设置于所述第一电路板朝向所述第二电路板的表面上的承载件，所述承载件用于承载所述吸热件。
  42. 如权利要求41所述的手持云台，其特征在于：所述手持装置还包括设置于所述承载件与所述吸热件之间的电磁屏蔽板，所述吸热件通过所述电磁屏蔽板吸收所述第一电路板工作时产生的热量。
  43. 如权利要求22所述的手持云台，其特征在于：所述云台装置包括如下至少一种：俯仰轴机构、横滚轴机构以及平移轴机构。
  44. 一种电子装置，其特征在于，包括：
    壳体，设有容置腔；
    电路板，安装在所述容置腔内；
    吸热件，安装在所述容置腔内，所述吸热件与所述电路板固定连接，用于承载所述电路板，并且所述吸热件与所述电路板相互绝缘；
    扩展接口，安装在所述壳体，并且用于与外部接口机械连接或/及电连接；
    其中，所述扩展接口与所述吸热件连接，并且能够与所述吸热件之间进行导热。
  45. 如权利要求44所述的电子装置，其特征在于：所述扩展接口至少局部外露所述壳体外；
    或者，所述吸热件吸收所述电路板上的电子器件产生的热量，传递给所述扩展接口，从而将热量散热到所述壳体的外部，以对所述电路板上的电子器件进行散热。
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