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WO2017015814A1 - 板状均温装置 - Google Patents

板状均温装置 Download PDF

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Publication number
WO2017015814A1
WO2017015814A1 PCT/CN2015/085146 CN2015085146W WO2017015814A1 WO 2017015814 A1 WO2017015814 A1 WO 2017015814A1 CN 2015085146 W CN2015085146 W CN 2015085146W WO 2017015814 A1 WO2017015814 A1 WO 2017015814A1
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WO
WIPO (PCT)
Prior art keywords
ribs
plate
abutting end
rib
capillary material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2015/085146
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English (en)
French (fr)
Inventor
金积德
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
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Individual
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Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to EP15899166.1A priority Critical patent/EP3330654A4/en
Priority to PCT/CN2015/085146 priority patent/WO2017015814A1/zh
Priority to JP2018522835A priority patent/JP2018523088A/ja
Priority to KR1020187002432A priority patent/KR20180021145A/ko
Publication of WO2017015814A1 publication Critical patent/WO2017015814A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0283—Means for filling or sealing heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2225/00—Reinforcing means
    • F28F2225/04—Reinforcing means for conduits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2240/00—Spacing means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/18—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes sintered
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/06—Fastening; Joining by welding
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/06—Fastening; Joining by welding
    • F28F2275/067—Fastening; Joining by welding by laser welding

Definitions

  • the invention relates to the heat dissipating technology, in particular to a plate-shaped temperature equalizing device which is provided with a capillary structure and a vacuum chamber, and can be used for liquid-gas exchange of the working fluid to achieve the uniform temperature effect.
  • Taiwan Patent No. TW 201331538 the creation of the inventor of the present application, discloses a temperature equalizing device without a liquid injection tube, which can achieve good reliability and heat dissipation performance.
  • the structure of the support frame is known from FIG. 9, and the support portion is a bent piece body which is punched upward and downward by the net frame, and the bent piece body is produced.
  • the heat source is usually attached to one side of the temperature equalizing device, and a heat sink is attached to the other surface of the temperature equalizing device, and in order to make the bonding effect good, usually A clamp (not shown) is used to apply force to the heat sink to attach it to the surface of the temperature equalizing device. Therefore, when the temperature equalizing device is actually used, both sides thereof are subject to Pressure squeezed.
  • the thickness of the entire temperature equalizing device may be thinned due to the action of the external force, thereby reducing the internal space, and the flow space in which the liquid is heated to be converted into steam is insufficient. This will result in poor overall thermal conductivity.
  • the bent piece body may still be bent again when subjected to pressure, and thus the supportability thereof is insufficient.
  • the main object of the present invention is to provide a plate-like temperature equalizing device, wherein the structure of the support frame can provide sufficient support to ensure that the plate-like temperature equalizing device is not crushed by normal external force, thereby maintaining the temperature uniformity.
  • the effect of heat conduction does not decrease or decrease.
  • a plate-shaped temperature equalizing device includes: an upper casing and a lower casing, which are connected to each other by an edge to form an accommodation space therebetween; a support frame is disposed in the accommodation space
  • the support frame is formed by a plurality of ribs connected to each other, and a plurality of enclosed spaces are formed between the ribs, and the two ends of the ribs are respectively defined as an upper abutting end and a lower abutting end.
  • the upper abutting ends of the ribs are located on the lower abutting ends of the ribs, and the lower abutting ends of the ribs are located below the upper abutting ends of the ribs; a capillary material is disposed in the accommodating portion In the space, the capillary material is banded and has a flat ring A portion of the capillary material above the support frame is defined as an upper portion, and a portion of the capillary material under the support frame is defined as a lower portion, and the upper portion is attached to the lower portion.
  • the support frame is provided by the plurality of The upper abutting end formed by the rib and the lower abutting end abut against the capillary material to support the capillary material against the bottom surface of the upper casing and the top surface of the lower casing, and the ribs are mutually connected by the ribs
  • the upper abutting end and the lower top abutting end are connected to each other such that the rib has a high end and a low end with respect to the supporting frame, so that the ribs are below the upper abutting end and close to the rib
  • a subspace is formed above the body of the lower abutting end, and the subspace is spatially connected to the enclosure space.
  • the ribs are integrally formed with each other.
  • the two ribs located below the upper abutting ends of the ribs are connected to each other by their lower abutting ends; the two ribs located above the lower abutting ends of the ribs are opposite to each other with the top abutting ends thereof connection.
  • the lower casing has a plate shape
  • the upper casing has a plate body, and a vertical wall extends downward from a periphery of the plate body, and a shoulder plate extends horizontally outward from the vertical wall
  • the upper casing has the shoulder The plate is placed on the top surface of the lower casing, and the edge of the shoulder plate in contact with the top surface of the lower casing is welded by solderless welding to form a seamlessly connected state.
  • the upper casing and the edge of the lower casing are welded by solderless welding to form a seamlessly connected state.
  • the solderless soldering method is a high energy soldering method, and is one of electron beam welding method, high frequency argon arc welding method or laser welding method.
  • the capillary material is sintered by copper mesh or copper powder.
  • the enclosed space is enclosed by four ribs.
  • each of the upper abutting ends of the support frame cooperates with the lower top abutting end thereof to form a solid body which is top and bottom against the capillary material, and provides a relatively strong support to ensure the plate-like uniform temperature.
  • the device is not crushed by normal external force, and the effect of maintaining uniform temperature heat conduction is not reduced or reduced.
  • Figure 1 is an exploded view of a first preferred embodiment of the present invention.
  • Figure 2 is a perspective view of the combination of the first preferred embodiment of the present invention.
  • Figure 3 is a cross-sectional view showing a first preferred embodiment of the present invention.
  • Figure 4 is a perspective view of a partial assembly of the first preferred embodiment of the present invention showing the structure of the support frame.
  • Figure 5 is a cross-sectional view taken along line 5-5 of Figure 4.
  • Figure 6 is a diagram showing the state of use of the first preferred embodiment of the present invention.
  • a plate-like temperature equalizing device 10 mainly comprises an upper casing 11, a lower casing 21, a support frame 31, and a capillary material 41. And an activator consisting of:
  • the upper casing 11 and the lower casing 21 are connected to each other at an edge to form an accommodation space 12 therebetween.
  • the lower casing 21 has a plate shape;
  • the upper casing 11 has a plate body 111, and a vertical wall 112 extends downward from the periphery of the plate body 111, and then extends horizontally outward from the vertical wall 112.
  • the upper casing 11 is attached to the top surface of the lower casing 21 with the shoulder plate 113, and the edge of the shoulder plate 113 contacting the top surface of the lower casing 21 is welded by solderless welding. And form a seamlessly connected state.
  • the aforementioned method of solderless soldering is a high energy soldering method, and is one of electron beam welding, high frequency argon arc welding or laser welding.
  • the support frame 31 is disposed in the accommodating space 12, and the support frame 31 is formed by a plurality of ribs 32 connected to each other, and a plurality of circumscribed spaces 34 are formed between the ribs 32, and the ribs 32 are respectively arranged.
  • the two ends of the rib 32 are respectively defined as an upper abutting end 321 and a lower abutting end 322.
  • the 321 is located on the lower abutting end 322 of the rib 32, and the lower abutting end 322 of each rib 32 is located below the upper abutting end 321 of the rib 32.
  • the ribs 32 are integrally formed with each other; further, the two ribs 32 located below the upper abutting end 321 of each of the ribs 32 are connected to each other with their lower abutting ends 322, and are located at each of the ribs 32.
  • the two ribs 32 above the lower abutting end 322 of the rib 32 are connected to each other with their upper abutting ends 321 .
  • each of the enclosed spaces 34 is formed by four ribs 32, and generally has a quadrangular shape or a rhombus shape.
  • the capillary material 41 is disposed in the accommodating space 12, and the capillary material 41 is in a strip shape and surrounds the upper, lower and both sides of the support frame 31 in a flat ring shape, and the capillary material 41 is located above the support frame 31.
  • the portion is defined as the upper portion 42.
  • the portion of the capillary material 41 located below the support frame 31 is defined as a lower portion 44.
  • the upper portion 42 is attached to the bottom surface of the upper casing 11 and the lower portion 44 is attached to the lower portion.
  • the capillary material 41 is formed by sintering a copper mesh or a copper powder. As shown in FIG.
  • a strip-shaped copper mesh having a predetermined width is wound around the support frame 31 and overlapped by a certain length, and then cut, so that a surrounding frame can be formed.
  • the actuating liquid is injected into the accommodating space 12 and adsorbed by the capillary material 41.
  • the operating liquid since it is difficult to indicate the operating liquid adsorbed by the capillary material in the drawing, and the operating fluid is an existing component, it is not shown in the drawings.
  • the upper abutting end 321 and the lower abutting end 322 formed by the plurality of ribs 32 abut against the capillary material 41 to support the capillary material 41 against the bottom surface of the upper casing 11 .
  • the top surface of the lower casing 21, and by the connection relationship between the upper abutting end 321 and the lower abutting end 322 of the ribs 32, the rib 32 has a high end with respect to the support frame 31.
  • the plate-like temperature equalizing device 10 of the present invention is assembled with a heat source 91 (for example, a computer chip) and a heat sink 99, and the heat source 91 is attached to the lower casing 21.
  • the heat sink 99 is attached to the upper casing 11.
  • the upper abutting end 321 and the lower abutting end 322 of the support frame 31 of the embodiment support the capillary material 41 against the bottom surface of the upper casing 11 and the lower casing. 21 top surface, and the upper top abutting end 321 is located above the lower top abutting end 322, therefore, each of the upper abutting ends 321 is The lower lower abutting end 322 jointly forms a physical object S which is top and bottom against the capillary material 41. This solid object S is not crushed by an external force, thereby providing a relatively strong support for supporting the board of the present invention.
  • the uniform temperature device 10 does not become flatter under the action of a normal external force, and the normal external force herein refers to the pressure applied by a normal jig or a clip for holding a heat sink in the art. In this way, it is ensured that the uniform temperature heat conduction effect of the plate-like temperature equalizing device 10 of the present invention is not reduced or reduced.
  • the spatial communication relationship between the subspace 33 and the enclosure space 34 allows the vapor of the operating fluid to be in the accommodating space 12.
  • the plate-shaped temperature equalizing device 10 of the present invention can be arbitrarily moved to have a rapid average temperature and heat conduction effect.
  • the remaining working principle of the plate-like temperature equalizing device of the present invention such as the heat conduction or heat dissipation effect formed by vaporization and condensation of the working fluid, is the same as the prior art, and therefore will not be described again.
  • each of the upper abutting ends of the support frame cooperates with the lower top abutting end thereof to form a solid body which is vertically opposed to the capillary material, thereby providing a relatively strong support to ensure the plate-like uniform temperature.
  • the device is not crushed by normal external force, and the effect of maintaining uniform temperature heat conduction is not reduced or reduced.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laser Beam Processing (AREA)
  • Welding Or Cutting Using Electron Beams (AREA)

Abstract

一种板状均温装置（10），包含有：一上壳体（11）、一下壳体（21）、一支撑架（31）、一毛细材（41）以及一作动液；其中，该支撑架（31）由多个肋条（32）彼此相连所形成，并于该肋条（32）之间形成规则排列的多个围合空间（34），且各该肋条（32）的两端分别定义为一上顶抵端（321）以及一下顶抵端（322），各该肋条（32）的上顶抵端（321）位于二该肋条（32）的下顶抵端（322）之上，而各该肋条（32）的下顶抵端（322）位于二该肋条（32）的上顶抵端（321）之下；借由该肋条（32）彼此之间的上顶抵端（321）与下顶抵端（322）连接关系，使得该肋条（32）呈现一端高而一端低的歪斜状态，进而使得各该肋条（32）靠近该上顶抵端（321）的身部下方以及靠近该下顶抵端（322）的身部上方都形成一子空间（33），该子空间（33）与该围合空间（34）在空间上相连通。

Description

板状均温装置 技术领域
本发明与散热技术有关，特别是指内部设置有毛细结构及真空腔室而可供作动液进行液气相交换，进而达到均温效果的一种板状均温装置。
背景技术
中国台湾第TW 201331538号专利，本申请发明人的创作，该案揭露了一种无注液管的均温装置，其可达到良好的可靠度及散热性能。
然而，前述现有技术中，其支撑架的结构由其图9可知，具有支撑性的部分乃是由该网架向上及向下冲压出来的弯折片体，这样的弯折片体所产生的支撑力道尚有不足。由于均温装置在使用时，通常会将热源贴设于该均温装置的一面，并将散热片(heat sink)贴设于该均温装置的另一面，而为了使贴接效果良好，通常会使用夹具(clamp)(图中未示)来对该散热片施力以使其受力而贴附于该均温装置的表面，因此，均温装置在实际使用时，其两面是会受到压力挤压的。进而可知，如果该支撑架的支撑性不足，则整个均温装置的厚度可能会因为外力的作用而导致变薄，进而使得内部空间减少，作动液受热转变为蒸气的流动空间即不足，进而会导致整体均温导热的效果变差。前述现有技术的支撑架，其弯折片体在受到压力作用时仍有可能再弯折，因此其支撑性尚有不足。
发明内容
本发明的主要目的乃在于提供一种板状均温装置，其支撑架的结构可提供足够的支撑性，可确保该板状均温装置不会被正常外力所压扁，进而可保持均温导热的效果不会降低或减少。
依据本发明所提供的一种板状均温装置，包含有：一上殻体及一下殻体，彼此以边缘相连接而于其间形成一容置空间；一支撑架，置于该容置空间，该支撑架由多个肋条彼此相连所形成，并于该肋条之间形成规则排列的多个围合空间，且各该肋条的两端分别定义为一上顶抵端以及一下顶抵端，各该肋条的上顶抵端位于二该肋条的下顶抵端之上，而各该肋条的下顶抵端位于二该肋条的上顶抵端之下；一毛细材，设置于该容置空间内，该毛细材呈带状而以扁环 状围绕该支撑架的上方、下方及两侧，位于该支撑架上方的该毛细材的部分定义为上部，位于该支撑架下方的该毛细材的部分定义为下部，该上部贴接烧结于该上殻体的底面，该下部则贴接烧结于该下殻体的顶面；以及一作动液，注入于该容置空间而被该毛细材所吸附；其中，该支撑架借由其多个肋条所形成的该上顶抵端与该下顶抵端顶抵于该毛细材而将该毛细材撑抵于该上壳体底面以及该下壳体顶面，且借由该肋条彼此之间的上顶抵端与下顶抵端连接关系，使得该肋条相对于该支撑架而言呈现一端高而一端低的歪斜状态，进而使得各该肋条靠近该上顶抵端的身部下方以及靠近该下顶抵端的身部上方都形成一子空间，该子空间与该围合空间在空间上相连通。
其中，该肋条彼此间一体成形。
其中，位于各该肋条的上顶抵端的下方的该二肋条，以其下顶抵端彼此相连接；位于各该肋条的下顶抵端的上方的该二肋条，以其上顶抵端彼此相连接。
其中，该下壳体呈板状；该上壳体具有一板身，且由该板身周缘向下延伸一立壁，再由该立壁向外水平延伸一肩板；该上壳体以该肩板贴置于该下壳体的顶面，并借由无焊料焊接的方式焊接该肩板与该下壳体顶面接触的边缘，而形成无缝相连接的状态。
其中，该上殻体与该下殻体的边缘借由无焊料焊接的方式相焊接，而形成无缝相连接的状态。
其中，该无焊料焊接的方式为高能量焊接法，而为电子束焊接法、高频氩弧焊接法或激光焊接法的其中一种。
其中，该毛细材为铜网或铜粉烧结而成。
其中，一该围合空间由四该肋条所围合而成。
借此，该支撑架的各该上顶抵端与其下方的下顶抵端联合形成一上下都顶抵该毛细材的实体物，而提供了相当强大的支撑性，可确保该板状均温装置不会被正常外力所压扁，进而可保持均温导热的效果不会降低或减少。
以下结合附图和具体实施例对本发明进行详细描述，但不作为对本发明的限定。
附图说明
图1为本发明第一较佳实施例的爆炸图。
图2为本发明第一较佳实施例的组合立体图。
图3为本发明第一较佳实施例的剖视示意图。
图4为本发明第一较佳实施例的局部组件立体图，显示支撑架的结构。
图5为沿图4中5-5剖线的剖视示意图。
图6为本发明第一较佳实施例的使用状态图。
10板状均温装置
11上壳体     111板身     112立壁
113肩板      12容置空间  21下壳体
31支撑架     32肋条      321上顶抵端
322下顶抵端  33子空间    34围合空间
41毛细材     42上部      44下部
91热源       99散热片
S实体物
具体实施方式
为了详细说明本发明的技术特点所在，兹举以下的较佳实施例并配合图式说明如后，其中：
如图1至图5所示，本发明一较佳实施例所提供的一种板状均温装置10，主要由一上壳体11、一下壳体21、一支撑架31、一毛细材41以及一作动液所组成，其中：
该上壳体11与该下壳体21彼此以边缘相连接而于其间形成一容置空间12。于本实施例中，该下壳体21呈板状；该上壳体11具有一板身111，且由该板身111周缘向下延伸一立壁112，再由该立壁112向外水平延伸一肩板113；该上壳体11以该肩板113贴置于该下壳体21的顶面，并借由无焊料焊接的方式焊接该肩板113与该下壳体21顶面接触的边缘，而形成无缝相连接的状态。前述的无焊料焊接的方式为高能量焊接法，而为电子束焊接法、高频氩弧焊接法或激光焊接法的其中一种。
该支撑架31，置于该容置空间12，该支撑架31由多个肋条32彼此相连所形成，并于该肋条32之间形成规则排列的多个围合空间34，且各该肋条32的两端分别定义为一上顶抵端321以及一下顶抵端322，各该肋条32的上顶抵端 321位于二该肋条32的下顶抵端322之上，而各该肋条32的下顶抵端322则位于二该肋条32的上顶抵端321之下。于本实施例中，该肋条32彼此间一体成形；此外，位于各该肋条32的上顶抵端321的下方的该二肋条32，以其下顶抵端322彼此相连接，而位于各该肋条32的下顶抵端322的上方的该二肋条32，以其上顶抵端321彼此相连接。由本申请的图4可看出，各该围合空间34由四该肋条32所围合形成，而大致上呈现四边形或菱形。
该毛细材41，设置于该容置空间12内，该毛细材41呈带状而以扁环状围绕该支撑架31的上方、下方及两侧，位于该支撑架31上方的该毛细材41的部分定义为上部42，位于该支撑架31下方的该毛细材41的部分定义为下部44，该上部42贴接烧结于该上壳体11的底面，该下部44则贴接烧结于该下壳体21的顶面。于本实施例中，该毛细材41为铜网或铜粉烧结而成。如图1所示，该毛细材41为铜网时，以具有预定宽度的带状铜网卷绕于该支撑架31，并重迭一定长度后裁断，如此一来，即可形成围绕该支撑架31的上方、下方及两侧的状态。
该作动液，注入于该容置空间12而被该毛细材41所吸附。其中，由于在图式中表示被该毛细材所吸附的作动液有所困难，而作动液又系现有元件，因此容不以图式表示之。
其中，该支撑架31借由多个肋条32所形成的该上顶抵端321与该下顶抵端322顶抵于该毛细材41而将该毛细材41撑抵于该上壳体11底面以及该下壳体21顶面，且借由该肋条32彼此之间的上顶抵端321与下顶抵端322的连接关系，使得该肋条32相对于该支撑架31而言呈现一端高而一端低的歪斜状态，进而使得各该肋条32靠近该上顶抵端321的身部下方以及靠近该下顶抵端322的身部上方都形成一子空间33，该子空间33与该围合空间34在空间上相连通。
以上说明了本实施例的架构，接下来说明本实施例的使用状态。
请再参阅图6，在使用前，将本发明的板状均温装置10与一热源91(例如计算机芯片)及一散热片99组装，使该热源91贴接于该下壳体21而该散热片99贴接于该上壳体11。
如图3至图5所示，由于本实施例的支撑架31的该上顶抵端321与该下顶抵端322将该毛细材41撑抵于该上壳体11底面以及该下壳体21顶面，而且该上顶抵端321又位于该下顶抵端322的上方，因此，各该上顶抵端321即与其 下方的下顶抵端322联合形成一上下都顶抵该毛细材41的实体物S，这个实体物S不会被外力所压扁，因此提供了相当强大的支撑性，可支撑本发明的板状均温装置10在正常外力作用下也不会变得更扁，此处的正常外力是指所属技术领域中夹持散热片的正常夹具或扣具施加的压力。如此一来，即可确保本发明的板状均温装置10的均温导热效果不会降低或减少。
此外，在使用时，该作动液受热汽化为蒸气时，借由该子空间33与该围合空间34在空间上的连通关系，可使得该作动液的蒸气在该容置空间12内任意移动，而可使得本发明的板状均温装置10具有快速均温导热的效果。
本发明的板状均温装置的其余工作原理，例如作动液的汽化及冷凝所形成的导热或散热效果，乃同于现有技术，因此不再赘述。
工业应用性
本发明中，支撑架的各该上顶抵端与其下方的下顶抵端联合形成一上下都顶抵该毛细材的实体物，而提供了相当强大的支撑性，可确保该板状均温装置不会被正常外力所压扁，进而可保持均温导热的效果不会降低或减少。
当然，本发明还可有其它多种实施例，在不背离本发明精神及其实质的情况下，熟悉本领域的技术人员可根据本发明作出各种相应的改变和变形，但这些相应的改变和变形都应属于本发明权利要求的保护范围。

Claims (8)

  1. 一种板状均温装置，其特征在于，包含有：
    一上殼体及一下殼体，彼此以边缘相连接而于其间形成一容置空间；
    一支撑架，置于该容置空间，该支撑架由多个肋条彼此相连所形成，并于该肋条之间形成规则排列的多个围合空间，且各该肋条的两端分别定义为一上顶抵端以及一下顶抵端，各该肋条的上顶抵端位于二该肋条的下顶抵端之上，各该肋条的下顶抵端位于二该肋条的上顶抵端之下；
    一毛细材，设置于该容置空间内，该毛细材呈带状而以扁环状围绕该支撑架的上方、下方及两侧，位于该支撑架上方的该毛细材的部分定义为上部，位于该支撑架下方的该毛细材的部分定义为下部，该上部贴接烧结于该上殼体的底面，该下部则贴接烧结于该下殼体的顶面；以及
    一作动液，注入于该容置空间而被该毛细材所吸附；
    其中，该支撑架借由其多个肋条所形成的该上顶抵端与该下顶抵端顶抵于该毛细材而将该毛细材撑抵于该上壳体底面以及该下壳体顶面，且借由该肋条彼此之间的上顶抵端与下顶抵端连接关系，使得该肋条相对于该支撑架而言呈现一端高而一端低的歪斜状态，进而使得各该肋条靠近该上顶抵端的身部下方以及靠近该下顶抵端的身部上方都形成一子空间，该子空间与该围合空间在空间上相连通。
  2. 根据权利要求1所述的板状均温装置，其特征在于，该肋条彼此间一体成形。
  3. 根据权利要求1所述的板状均温装置，其特征在于，位于各该肋条的上顶抵端的下方的该二肋条，以其下顶抵端彼此相连接；位于各该肋条的下顶抵端的上方的该二肋条，以其上顶抵端彼此相连接。
  4. 根据权利要求1所述的板状均温装置，其特征在于，该下壳体呈板状；该上壳体具有一板身，且由该板身周缘向下延伸一立壁，再由该立壁向外水平延伸一肩板；该上壳体以该肩板贴置于该下壳体的顶面，并借由无焊料焊接的方式焊接该肩板与该下壳体顶面接触的边缘，而形成无缝相连接的状态。
  5. 根据权利要求1所述的板状均温装置，其特征在于，该上殼体与该下殼体的边缘借由无焊料焊接的方式相焊接，而形成无缝相连接的状态。
  6. 根据权利要求4或5所述的板状均温装置，其特征在于，该无焊料焊 接的方式为高能量焊接法，而为电子束焊接法、高频氩弧焊接法或激光焊接法的其中一种。
  7. 根据权利要求1所述的板状均温装置，其特征在于，该毛细材为铜网或铜粉烧结而成。
  8. 根据权利要求1所述的板状均温装置，其特征在于，一该围合空间由四该肋条所围合而成。
PCT/CN2015/085146 2015-07-27 2015-07-27 板状均温装置 Ceased WO2017015814A1 (zh)

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