WO2017073313A1 - Joining member and joining member joining method - Google Patents

Abstract

This joining member (100) is provided with a first metal foil (11) configured from a first metal, a third metal paste (15) configured from a third metal, and a second metal foil (12) configured from a second metal. The first metal foil (11) and the second metal foil (12) are fused on the entire periphery of the third metal paste (15) in a state of sandwiching the third metal paste (15). The first metal foil (11) and the second metal foil (12) seal the third metal paste (15). The third metal paste (15) is a paste in which a plurality of third metal particles (5) comprising the third metal are uniformly dispersed in an organic component (8). The third metal is a metal for reacting with the first metal and the second metal and generating an intermetallic compound. The melting point of the third metal is higher than the melting points of the first metal and the second metal.

Description

Joining member and joining method for joining member

The present invention relates to a joining member for joining a first joining object and a second joining object, and a joining method for the joining member.

Conventionally, a joining member for joining the first joining object and the second joining object has been widely used. For example, Patent Document 1 discloses a composite solder including a metal net and two foils sandwiching the metal net. The material of the metal net is Cu, and the material of the two foils is Sn.

By rolling the metal net and the two foils, the foil Sn enters the gaps in the metal net. The composite solder is used for connection such as die bonding of a semiconductor chip. At the time of die bonding, the semiconductor chip is brought into contact with the mounting surface of the wiring substrate through the composite solder and bonded by heating while applying pressure.

JP 2004-174522 A

However, when the semiconductor chip is joined to the mounting surface of the wiring board via the composite solder, Cu remains in the composite solder. Therefore, when the joined body is left in a high temperature environment, the two metal atoms Cu and Sn diffuse and the composite solder becomes hard and brittle. Furthermore, fine voids (so-called Kirkendall voids) are generated in the composite solder due to the difference in the diffusion rates of the two metal atoms Cu and Sn.

Therefore, in the composite solder disclosed in Patent Document 1, a crack is generated due to a fine gap, and the composite solder may be broken. Therefore, Patent Document 1 discloses a technique for performing Sn plating on a portion where Cu is exposed, but Sn plating is only aggregated by intermolecular force and prevents breakage of the composite solder. Does not have as much binding power.

An object of the present invention is to provide a joining member that can prevent breakage and a joining method for the joining member.

The joining member of the present invention includes a first metal layer, a second metal layer, and a third metal layer. The first metal layer is composed of a first metal that is Sn or an Sn-based alloy. The second metal layer is made of a second metal that is Sn or an Sn-based alloy. The third metal layer is composed of a third metal having a higher melting point than the first metal and the second metal. The third metal layer preferably contains a particulate third metal.

The third metal is a metal that reacts with the first metal and the second metal to generate an intermetallic compound. The third metal is at least one alloy selected from the group consisting of a CuNi alloy, a CuMn alloy, a CuAl alloy, and a CuCr alloy. The first metal layer and the second metal layer are fused while sandwiching the third metal layer, and accommodate the third metal layer.

When joining the first joining object and the second joining object using the joining member having this configuration, the joining member is disposed between the first joining object and the second joining object, and the joining member is heated. To do.

When the temperature of the joining member reaches the melting point of the first metal and the second metal by heating, the first metal and the second metal are melted. And the fuse | melted 1st metal, 2nd metal, and 3rd metal react, and the aggregate which consists of intermetallic compounds is produced | generated. Here, the aggregate is hard and brittle. Furthermore, the aggregate includes a plurality of fine voids. Therefore, even in the agglomerate, there is a possibility that cracks are generated due to fine voids.

However, in the joining member having this configuration, excess first metal enters a plurality of fine voids from the first metal layer. Similarly, excess second metal enters a plurality of fine voids from the second metal layer.

Therefore, the reaction between the melted first metal and second metal and the third metal further occurs, and a dense intermetallic compound phase having almost no fine voids is generated. Therefore, the joining member having this configuration can prevent cracks caused by fine voids from occurring in the intermetallic compound phase.

Therefore, the joining member having this configuration can prevent the joining member from being broken.

In addition, it is preferable that the first metal layer and the second metal layer are fused around the entire circumference of the third metal layer to seal the third metal layer. In this case, since the third metal is completely sealed, the third metal can be further prevented from being oxidized.

Moreover, the manufacturing method of the joining member of this invention provides the 3rd metal layer comprised with the 3rd metal whose melting | fusing point is higher than a 1st metal on the surface of the 1st metal layer comprised with a 1st metal. And the manufacturing method of the joining member of this invention melt | fuses the 1st metal layer and the 2nd metal layer comprised with a 2nd metal in the state which pinched | interposed the 3rd metal layer, Store.

Here, the first metal is Sn or an Sn-based alloy. The second metal is Sn or an Sn-based alloy. The third metal is a metal that reacts with the first metal and the second metal to form an intermetallic compound.

This manufacturing method is a method for manufacturing the above-described joining member of the present invention. Therefore, the manufacturing method of the joining member of this invention has an effect similar to the joining member of this invention.

The present invention can prevent the joining member from breaking.

FIG. 1 is a front view of a joining member 100 according to the first embodiment of the present invention. 2 is a cross-sectional view taken along line SS shown in FIG. FIG. 3 is a flowchart showing a method for manufacturing the joining member 100 shown in FIG. FIG. 4 is a front view showing an installation process performed by the manufacturing method shown in FIG. 3. FIG. 5 is a front view showing the state of the laminating step and the fusing step performed by the manufacturing method shown in FIG. FIG. 6 is a cross-sectional view showing the fused portion M shown in FIGS. 1, 2, and 5. FIG. 7 is a front view showing the state of the dividing step performed by the manufacturing method shown in FIG. FIG. 8 is a flowchart showing a joining method using the joining member 100 shown in FIG. FIG. 9 is a cross-sectional view showing a state of an arrangement process performed by the joining method shown in FIG. FIG. 10 is a cross-sectional view showing a heating process performed by the bonding method shown in FIG. FIG. 11 is a diagram showing a temperature profile of a heating process performed by the bonding method shown in FIG. FIG. 12 is a cross-sectional view showing the state of the aggregate 19 generated by the heating process performed by the joining method shown in FIG. FIG. 13 is a cross-sectional view showing a state of an intermetallic compound phase 119 generated by a heating process performed by the bonding method shown in FIG. FIG. 14 is an enlarged cross-sectional view showing a state of the intermetallic compound phase 119 generated by the heating process performed by the joining method shown in FIG. FIG. 15 is a front view of the joining member 200 according to the second embodiment of the present invention.

Hereinafter, the joining member according to the first embodiment of the present invention will be described.

FIG. 1 is a front view of a joining member 100 according to a first embodiment of the present invention. 2 is a cross-sectional view taken along line SS shown in FIG. In addition, the dotted line in FIG. 1 has shown the fusion | melting part M to which the 1st metal foil 11 and the 2nd metal foil 12 were fuse | melted.

The joining member 100 includes a first metal foil 11 made of a first metal, a third metal paste 15 made of a third metal, and a second metal foil 12 made of a second metal.

The first metal foil 11 corresponds to an example of the first metal layer of the present invention. The second metal foil 12 corresponds to an example of the second metal layer of the present invention. The third metal paste 15 corresponds to an example of the third metal layer of the present invention.

As shown in FIG. 1, the first metal foil 11 and the second metal foil 12 are fused around the entire circumference of the third metal paste 15 with the third metal paste 15 sandwiched therebetween. Thereby, the 1st metal foil 11 and the 2nd metal foil 12 have accommodated the 3rd metal paste 15, as shown in FIG. That is, the first metal foil 11 and the second metal foil 12 seal the third metal paste 15. Sealing corresponds to an example of storage.

Thereby, the third metal paste 15 is completely sealed. As shown in FIG. 2, the third metal paste 15 is a paste in which a plurality of third metal particles 5 that are metal components are uniformly dispersed in an organic component 8. Therefore, the first metal foil 11 and the second metal foil 12 can further prevent the plurality of third metal particles 5 made of the third metal from being oxidized.

The third metal is a metal that reacts with the first metal and the second metal to generate an intermetallic compound. The melting point of the third metal is higher than the melting points of the first metal and the second metal. The melting point of the intermetallic compound is higher than the melting points of the first metal and the second metal. The intermetallic compound includes a first metal, a second metal, and a third metal.

Note that the material of the first metal is Sn or a Sn-based alloy. The material of the second metal is Sn or an Sn-based alloy. Examples of the Sn-based alloy include Sn, Cu, Ni, Ag, Au, Sb, Zn, Bi, In, Ge, Al, Co, Mn, Fe, Cr, Mg, Mn, Pd, Si, Sr, Te, and P. An alloy containing at least one selected from the group consisting of: For example, Sn, Sn-3Ag-0.5Cu, Sn-3.5Ag, Sn-5Ag, Sn-0.7Cu, Sn-0.75Cu, Sn-58Bi, Sn-52In, Sn-0.7Cu-0. 05Ni, Sn-5Sb, Sn-2Ag-0.5Cu-2Bi, Sn-57Bi-1Ag, Sn-3.5Ag-0.5Bi-8In, Sn-9Zn, or Sn-8Zn-3Bi.

In the above notation, for example, “Sn-3Ag-0.5Cu” indicates an alloy containing 3% by weight of Ag, 0.5% by weight of Cu, and the balance being Sn.

The third metal is a metal that reacts with the molten first metal and second metal to generate an intermetallic compound. The material of the third metal is at least one selected from the group consisting of a CuNi alloy, a CuMn alloy, a CuAl alloy, and a CuCr alloy. Further, the third metal is Ag, Au, Al, Bi, C, Co, Cu, Fe, Ga, Ge, In, Mn, Mo, Ni, P, Pb, Pd, Pt, Si, Sb, Zn, etc. A third component may be included. The material of the intermetallic compound is, for example, (Cu, Ni) ₆ Sn ₅ , Cu ₄ Ni ₂ Sn ₅ , Cu ₅ NiSn ₅ , (Cu, Ni) ₃ Sn, CuNi ₂ Sn, Cu ₂ NiSn, or the like.

The average particle diameter (D50) of the third metal particles 5 is preferably 0.1 μm or more and 30 μm or less. In particular, the average particle size of the third metal particles 5 greatly affects the amount of the intermetallic compound produced. Here, the average particle size (D50) means, for example, the particle size at an integrated value of 50% in the particle size distribution obtained by the laser diffraction / scattering method.

Further, when the average particle size of the third metal particles 5 is smaller than 0.1 μm, the surface area of the third metal particles 5 increases. Therefore, more oxide is formed on the surface of the third metal particle 5, the wettability of the third metal particle 5 with respect to molten Sn tends to be reduced, and the generation reaction tends to be inhibited.

On the other hand, when the average particle diameter of the third metal particles 5 is larger than 30 μm, the size of the gap between the third metal particles 5 increases. Thereby, it cannot utilize for the production | generation reaction of an intermetallic compound to the center part of the 3rd metal particle 5, and the 3rd metal utilized for a production | generation reaction is insufficient. Therefore, the production amount of intermetallic compounds is reduced.

In the third metal paste 15 of the joining member 100, the compounding ratio of the metal component and the organic component is in the range of metal component: organic component = 75: 25 to 99.5: 0.5 by weight ratio. It is preferable. When the amount of the metal component is larger than the above range, sufficient viscosity cannot be obtained, and the adhesion with the first metal foil and / or the second metal foil may be lowered. On the other hand, when the compounding amount of the metal component is less than the above range, the third metal particles 5 cannot be sufficiently reacted with the first metal foil and / or the second metal foil, and the intermetallic compound phase described later is used. A large amount of unreacted third metal particles 5 may remain in 119.

Next, the organic component 8 includes a flux, a solvent, a thixotropic agent, and the like.

Flux contains rosin and activator. The flux fulfills a reducing function of removing oxide films on the surfaces of the first metal foil 11, the second metal foil 12, and the third metal particles 5.

The rosin is, for example, natural rosin, hydrogenated rosin, disproportionated rosin, polymerized rosin, rosin derivatives such as unsaturated dibasic acid-modified rosin, acrylic acid-modified rosin, or a mixture thereof. As the rosin, for example, polymerized rosin R-95 is used.

Activators also promote the flux reduction reaction. Activators include, for example, monocarboxylic acids (eg, formic acid, acetic acid, lauric acid, palmitic acid, stearic acid, benzoic acid), dicarboxylic acids (eg, oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, suberin) Acid, azelaic acid, sebacic acid, phthalic acid, etc.), bromoalcohols (eg, 1-bromo-2-butanol, etc.), organic amine hydrohalides, bromoalkanes, bromoalkenes, benzylbromides, polyamines And chlorinated activators. For example, adipic acid is used as the activator.

The solvent adjusts the viscosity of the third metal paste 15 of the joining member 100. Examples of the solvent include alcohols, ketones, esters, ethers, aromatics, and hydrocarbons. For example, hexyl diglycol (HeDG) is used as the solvent.

The thixotropic agent is maintained so that the metal component and the organic component are not separated after the metal component and the organic component are uniformly mixed. Examples of thixotropic agents include hydrogenated castor oil, carnauba wax, amides, hydroxy fatty acids, dibenzylidene sorbitol, bis (p-methylbenzylidene) sorbitol, beeswax, stearamide, hydroxystearic acid ethylene bisamide, and the like.

In addition, the joining member 100 includes, as additives, Ag, Au, Al, Bi, C, Co, Cu, Fe, Ga, Ge, In, Mn, Mo, Ni, P, Pb, Pd, Pt, Si, Sb, Zn, etc. may be contained. Further, the joining member 100 may contain not only these additives but also a metal complex, a metal compound, or the like as an additive.

Hereinafter, a method for manufacturing the joining member 100 will be described.

FIG. 3 is a flowchart showing a manufacturing method of the joining member 100 shown in FIG. FIG. 4 is a front view showing an installation process performed by the manufacturing method shown in FIG. 3. FIG. 5 is a front view showing the state of the laminating step and the fusing step performed by the manufacturing method shown in FIG. FIG. 6 is a cross-sectional view showing the fused portion M shown in FIGS. 1, 2, and 5. FIG. 7 is a front view showing the state of the dividing step performed by the manufacturing method shown in FIG.

First, a first metal foil 11, a third metal paste 15, and a second metal foil 12 are prepared.

And as shown in FIG. 4, the 3rd metal paste 15 is apply | coated to the several area | region on the surface of the 1st metal foil 11 so that it may become uniform thickness and the same quantity (S1: installation process). That is, in this installation step, the third metal paste 15 is provided in a plurality of regions on the surface of the first metal foil 11.

Note that the installation is not limited to coating, and may be thermal spraying, vapor deposition, or plating. The application may be spray coating.

Next, as shown in FIG. 5, the second metal foil 12 is laminated on the first metal foil 11 provided with the plurality of third metal pastes 15 (S2: lamination step).

Next, the first metal foil 11 and the second metal foil 12 are fused around the entire circumference of each third metal paste 15 with each third metal paste 15 being sandwiched (S3: fusion process). In the fusing step, the first metal foil 11 and the second metal foil 12 are heated to a temperature equal to or higher than the melting points of the first metal foil 11 and the second metal foil 12.

For example, when the material of the first metal foil 11 and the second metal foil 12 is Sn, the melting point of Sn is 231.9 ° C. When the material of the 1st metal foil 11 and the 2nd metal foil 12 is Sn, a melt | fusion process heats the 1st metal foil 11 and the 2nd metal foil 12 for 5 second at 240 degreeC, for example.

In addition, as a fusion method in the fusion process, a method of fusing by pressing with a high-temperature jig, a method of fusing by pressing the jig instantaneously to a high temperature, and fusing by directly applying hot air And a method of fusing with a laser.

As a result of the fusing process, fused portions M in which the first metal foil 11 and the second metal foil 12 are fused are formed in a lattice shape as shown in FIG. In the fusion | melting part M, as shown in FIG. 6, the 1st metal foil 11 and the 2nd metal foil 12 are integrated. In the fusion part M, the particle interface cannot be determined. On the other hand, in the plating, the particle interface can be distinguished. Therefore, fusion and plating can be distinguished by the difference in particle interface.

Thus, a plurality of joining members 100 are completed.

And it cut | disconnects with the dashed-two dotted line shown in FIG. 7, and the some joining member 100 is divided | segmented into the individual joining member 100 (S4: division | segmentation process). By this dividing step, one joining member 100 is obtained.

As mentioned above, the manufacturing method of the joining member 100 can manufacture the several joining member 100 collectively. Therefore, the manufacturing method of the joining member 100 can reduce the manufacturing cost.

Hereinafter, a specific joining method for joining the first joining object 101 and the second joining object 102 using the joining member 100 will be described.

FIG. 8 is a flowchart showing a joining method using the joining member 100 shown in FIG. FIG. 9 is a cross-sectional view showing a state of an arrangement process performed by the joining method shown in FIG. FIG. 10 is a cross-sectional view showing a heating process performed by the bonding method shown in FIG. FIG. 11 is a diagram showing a temperature profile of a heating process performed by the bonding method shown in FIG. FIG. 12 is a cross-sectional view showing the state of the aggregate 19 generated by the heating process performed by the joining method shown in FIG. FIG. 13 is a cross-sectional view showing a state of an intermetallic compound phase 119 generated by a heating process performed by the bonding method shown in FIG. FIG. 14 is an enlarged cross-sectional view showing a state of the intermetallic compound phase 119 generated by the heating process performed by the joining method shown in FIG.

First, a joining member 100, a first joining object 101, and a second joining object 102 are prepared.

In the present joining method, Sn is used for the material of the first metal foil 11 and the second metal foil 12, and a CuNi alloy is used for the material of the third metal particle 5 for the sake of simplicity. A CuNi alloy is a material that reacts with molten Sn to produce a CuNiSn alloy that is an intermetallic compound.

The first joining object 101 and the second joining object 102 are, for example, electrode members formed on the surface of an element body such as a surface electrode of an electronic component such as a multilayer ceramic capacitor, and a print on which the electronic component is mounted. It is an electrode member provided on the surface of the wiring board. The material of the first joining object 101 and the second joining object 102 is, for example, Cu.

Next, as shown in FIG. 9, the joining member 100 is disposed between the first joining object 101 and the second joining object 102 (S11: placement step). In this state, the third metal paste 15 is sealed by the first metal foil 11 and the second metal foil 12 and does not contact the air outside the first metal foil 11 and the second metal foil 12.

Next, as shown in FIG. 10, the joining member 100 is heated while compressing the joining member 100 from the thickness direction by the first joining object 101 and the second joining object 102 (S12: heating step). In this heating step, for example, the joining member 100 is heated according to the temperature profile shown in FIG. 11 using a reflow apparatus.

Heating step specifically, to a temperature in the range below the melting point of the melting point T _m above CuNi alloy of Sn, heating the bonding member 100. Melting point _{T m} of a Sn is 231.9 ° C.. The melting point of the CuNi alloy varies depending on the Ni content, and is, for example, 1220 ° C. to 1300 ° C. In the heating step, for example, after preheating at 150 ° C. to 230 ° C., heating is performed at a heating temperature of 250 ° C. to 400 ° C. for 2 minutes to 10 minutes. The peak temperature is allowed to reach 400 ° C.

A solvent contained in the organic component 8, during a period from the start of heating until time t ₁ has elapsed, volatilizes or evaporates.

When the temperature of the joining member 100 reaches above the melting point T _m of a Sn by heating the first metal foil 11 and the second metal foil 12 melts. Then, the melted Sn reacts with the CuNi alloy that is the third metal particle 5, and aggregates 19 are generated as shown in FIG. Aggregate 19 is made of an intermetallic compound (CuNiSn alloy). This reaction is, for example, a reaction accompanying liquid phase diffusion bonding (“TLP bonding: Transient Liquid Phase Diffusion Bonding”).

Here, the aggregate 19 is hard and brittle. Furthermore, the aggregate 19 includes a plurality of fine voids. Therefore, also in the aggregate 19, as shown in FIG. 12, there is a possibility that a crack C is generated due to a fine gap.

However, in the joining member 100, excess Sn enters the plurality of fine gaps from the first metal foil 11 and the second metal foil 12. Therefore, the reaction between the molten Sn and the third metal particles 5 (CuNi alloy) further occurs, and as shown in FIGS. 13 and 14, a dense intermetallic compound phase 119 with almost no fine voids is generated. . The intermetallic compound phase 119 is a phase made of an intermetallic compound (CuNiSn alloy).

Next, as shown in FIG. 11, after the time t _2, the reflow apparatus stops heating. Accordingly, the temperature of the joining member 100 is less than the melting point T _m of a Sn, the reaction between the Sn and the third metal particles 5 were melted completed. After the time t _2, the intermetallic compound phase 119 continue to cool to room temperature.

From the above, the joining of the first joining object 101 and the second joining object 102 by the joining member 100 is completed.

In the joining member 100, the intermetallic compound phase 119 has a dense structure with almost no fine voids, as shown in FIG. Therefore, the bonding member 100 can prevent cracks due to fine voids from occurring in the intermetallic compound phase 119.

Therefore, the joining member 100 and the manufacturing method of the joining member 100 can prevent the joining member 100 from being broken.

Further, in the third metal paste 15, an alloying reaction between Sn and the third metal particles 5 proceeds by heat treatment at a relatively low temperature. The intermetallic compound phase 119 has a high melting point (for example, 400 ° C. or higher). Therefore, the joining member 100 can join the first joining object 101 and the second joining object 102 at a low temperature and has high heat resistance.

In particular, since the intermetallic compound has a melting point higher than that of the first metal and the second metal, the electronic component having the bonding member 100 therein is further mounted on another device, component, substrate, etc. by heating such as reflow. In this case, the structure of the intermetallic compound phase 119 is not impaired. That is, the joining member 100 can maintain the joining force.

Hereinafter, the joining member according to the second embodiment of the present invention will be described.

FIG. 15 is a front view of the joining member 200 according to the second embodiment of the present invention. The difference between the bonding member 200 and the bonding member 100 shown in FIG. 1 is that the third metal paste 15 is not completely sealed, and the third metal paste 15 is simply stored. Further, the manufacturing method of the joining member 200 is different from the manufacturing method of the joining member 100 shown in FIG. 3 in that the first metal foil 11 and the second metal foil 12 are connected to each third metal paste 15 in the fusion process of S3. It is the point which fuse | melts in a part of outer periphery of. Since the 3rd metal paste 15 contains a flux, it does not need to be sealed completely. Since the other points are the same, the description thereof is omitted.

Even when the first bonding target object 101 and the second bonding target object 102 are bonded using the bonding member 200, as shown in FIGS. 13 and 14, a dense intermetallic compound phase 119 having almost no fine voids is present. Is generated.

Therefore, similarly to the joining member 100, the joining member 200 and the manufacturing method of the joining member 200 can prevent the joining member 200 from breaking.

<< Other embodiments >>
In addition, although the material of the 1st metal foil 11 and the 2nd metal foil 12 is Sn single-piece | unit in the joining method of this embodiment, it is not restricted to this. In implementation, the material of the first metal foil 11 and the second metal foil 12 may be an Sn-based alloy. Further, the material of the first metal foil 11 and the material of the second metal foil 12 may be different. Examples of Sn-based alloys include Sn-3Ag-0.5Cu, Sn-3.5Ag, Sn-5Ag, Sn-0.7Cu, Sn-0.75Cu, Sn-58Bi, Sn-52In, Sn-0.7Cu- 0.05Ni, Sn-5Sb, Sn-2Ag-0.5Cu-2Bi, Sn-57Bi-1Ag, Sn-3.5Ag-0.5Bi-8In, Sn-9Zn, or Sn-8Zn-3Bi .

Further, in the joining method of the present embodiment, the material of the third metal particles 5 is a CuNi alloy, but is not limited thereto. In implementation, the material of the third metal particles 5 may be, for example, at least one alloy selected from the group consisting of CuMn alloy particles, CuAl alloy particles, and CuCr alloy particles. The ratio of Ni, Mn, Al and Cr is preferably 5 to 20% by weight of Cu alloy particles.

When CuMn alloy particles are used, an intermetallic compound containing at least two selected from the group consisting of Cu, Mn, and Sn is generated by a reaction between molten Sn and CuMn alloy particles. This intermetallic compound is, for example, (Cu, Mn) ₆ Sn ₅ , Cu ₄ Mn ₂ Sn ₅ , Cu ₅ MnSn ₅ , (Cu, Mn) ₃ Sn, Cu ₂ MnSn, or CuMn ₂ Sn.

In the present embodiment, the heating step heats the bonding member 100 with hot air, but is not limited thereto. In the implementation, the heating step may be performed, for example, far-infrared heating, high-frequency induction heating, hot plate, or the like on the bonding member 100.

In the present embodiment, the heating step heats the bonding member 100 with hot air in the atmosphere, but is not limited thereto. At the time of implementation, in the heating step, the joining member 100 may be heated with hot air in, for example, N ₂ , H ₂ , formic acid, or vacuum.

In the present embodiment, the heating step pressurizes the joining member 100 during heating, but is not limited thereto. In the implementation, the heating process may not pressurize the bonding member 100 during the heating.

The joining member 100 may include a plurality of third metal pastes 15 (there is a gap between the third metal pastes 15). Correspondingly, the periphery of the plurality of third metal pastes 15 may be fused in the fusion process, and the plurality of third metal pastes 15 may be divided in the division process.

Also, the fusion may be performed individually, and the division may be performed for a plurality of pieces. In this case, the size of the joining member 100 can be changed according to the application used by the user of the joining member 100. In this case, it is preferable to perforate along the two-dot chain line shown in FIG. In this case, the user can easily cut the third metal paste 15 without exposing it.

In the present embodiment, the dividing step is performed after the fusing step, but the present invention is not limited to this. At the time of implementation, the fusing process may be performed after the dividing process. However, the direction in which the dividing step is performed after the fusing step is less likely to be oxidized than the direction in which the fusing step is performed after the dividing step.

Further, in the present embodiment, a plurality of joining members 100 are created at the same time, but this is not restrictive. In implementation, the joining member 100 may be created one by one. In this case, the dividing step is not necessary.

Finally, the description of the embodiment should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above embodiments but by the claims. Furthermore, the scope of the present invention is intended to include all modifications within the meaning and scope equivalent to the scope of the claims.

C ... Crack M ... Fusion part 5 ... 3rd metal particle 8 ... Organic component 11 ... 1st metal foil 12 ... 2nd metal foil 15 ... 3rd metal paste 19 ... Aggregate 100 ... Joining member 101 ... 1st joining object Object 102 ... Second object 119 ... Intermetallic phase 200 ... Joining member

Claims (5)

A first metal layer composed of a first metal that is Sn or a Sn-based alloy;
A second metal layer composed of a second metal that is Sn or a Sn-based alloy;
A third metal layer composed of a third metal having a melting point higher than that of the first metal and the second metal,
The third metal is a metal that reacts with the first metal and the second metal to form an intermetallic compound,
The first metal layer and the second metal layer are fused together with the third metal layer interposed therebetween, and accommodate the third metal layer. The joining member according to claim 1, wherein the third metal is at least one alloy selected from the group consisting of a CuNi alloy, a CuMn alloy, a CuAl alloy, and a CuCr alloy. The joining member according to claim 1 or 2, wherein the first metal layer and the second metal layer are fused around the entire circumference of the third metal layer to seal the third metal layer. The joining member according to any one of claims 1 to 3, wherein the third metal layer includes the particulate third metal. A third metal layer made of a third metal having a melting point higher than that of the first metal is provided on the surface of the first metal layer made of the first metal that is Sn or an Sn-based alloy,
The first metal layer and a second metal layer made of a second metal that is Sn or an Sn-based alloy are fused with the third metal layer interposed therebetween, and the third metal layer is accommodated. A method for manufacturing a joining member,
The method for manufacturing a joining member, wherein the third metal is a metal that reacts with the first metal and the second metal to generate an intermetallic compound.

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