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WO2017059234A1 - Plateforme de lampe à del - Google Patents

Plateforme de lampe à del Download PDF

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Publication number
WO2017059234A1
WO2017059234A1 PCT/US2016/054751 US2016054751W WO2017059234A1 WO 2017059234 A1 WO2017059234 A1 WO 2017059234A1 US 2016054751 W US2016054751 W US 2016054751W WO 2017059234 A1 WO2017059234 A1 WO 2017059234A1
Authority
WO
WIPO (PCT)
Prior art keywords
leds
led
mounting board
board assembly
platform
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2016/054751
Other languages
English (en)
Inventor
Bruce Richard Roberts
Glenn Howard Kuenzler
Jon Bennett Jansma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Current Lighting Solutions LLC
Original Assignee
GE Lighting Solutions LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GE Lighting Solutions LLC filed Critical GE Lighting Solutions LLC
Publication of WO2017059234A1 publication Critical patent/WO2017059234A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/10—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H05B45/44—Details of LED load circuits with an active control inside an LED matrix
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/50—Light sources with three-dimensionally disposed light-generating elements on planar substrates or supports, but arranged in different planes or with differing orientation, e.g. on plate-shaped supports with steps on which light-generating elements are mounted
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Definitions

  • the disclosed exemplary embodiments relate generally to lighting systems, and more particularly to light emitting diode (LED) lighting systems.
  • LED light emitting diode
  • Incandescent lamps create light by conducting electricity through a resistive filament, heating the filament to a very high temperature to produce visible light.
  • Incandescent lamps are made in a wide range of sizes and voltages.
  • the lamps typically include an enclosure with a tungsten filament inside and a base connector that provides both an electrical and structural support connection.
  • Incandescent lamps are generally inefficient and are in the process of being replaced by more efficient types of electric light such as fluorescent lamps, high-intensity discharge lamps, and, in particular, LED light sources.
  • LED technology continues to advance resulting in improved efficiencies and lower costs with LED light sources found in lighting applications ranging from small pin point sources to stadium lights.
  • An LED light source may be more efficient than an incandescent light but may still generate significant amounts of heat.
  • LEDs are generally point sources of light and may provide poor light distribution patterns, and require special manufacturing processes.
  • LED light sources may have unconventional envelope shapes, mounting structures and materials, and multiple components, for example, a power supply mounted in a base, connected by wires to LEDs mounted in the envelope.
  • the disclosed embodiments are directed to an LED platform configured to be installed in an envelope of a lamp, the LED platform including a mounting board assembly configured to be coupled to mains supply conductors within the lamp, one or more LEDs disposed on the mounting board assembly, and a power supply mounted on the mounting board assembly, the power supply configured to receive mains power from the mains supply conductors and provide power to the one or more LEDs.
  • the power supply may include components configured to condition mains power for use by the one or more LEDs.
  • the power supply may include a rectifier coupled to a control circuit.
  • the rectifier may be configured to rectify mains power and the control circuit may be configured to control power provided to the one or more LEDs.
  • the one or more LEDs may include a plurality of LEDs, and the control circuit may be configured to provide power to the plurality of LEDs in series or parallel depending on the rectified voltage provided by the rectifier.
  • the mounting board assembly may include a reflective coating.
  • the reflective coating may be at least partially specular.
  • the reflective coating may be at least partially diffuse reflective.
  • the reflective coating may be thermally conductive.
  • the mounting board assembly may include one or more glass-reinforced epoxy laminates.
  • the mounting board assembly may include a first mounting board and a second mounting board fastened together at an angle.
  • the first and second mounting boards may be fastened together to define quadrants of the mounting board assembly.
  • the one or more LEDs may include a plurality of LEDs arranged to face into the quadrants defined by the mounting boards.
  • the disclosed embodiments are also directed to an LED lamp including an envelope, a base fastened to the envelope, and an LED platform disposed within the envelope, the LED platform including a mounting board assembly configured to be coupled to mains supply conductors protruding from the base, one or more LEDs disposed on the mounting board assembly, and a power supply mounted on the mounting board assembly, the power supply configured to receive mains power from the mains supply conductors and provide power to the one or more LEDs.
  • the power supply may include components configured to condition mains power for use by the one or more LEDs.
  • the power supply may include a rectifier coupled to a control circuit.
  • the rectifier may be configured to rectify mains power and the control circuit may be configured to control power provided to the one or more LEDs.
  • the one or more LEDs may include a plurality of LEDs, and the control circuit may be configured to provide power to the plurality of LEDs in series or parallel depending on the rectified voltage provided by the rectifier.
  • the envelope may be sealed (e.g., hermetically sealed) and charged with a gas to improve heat flow from the LED platform to the envelope.
  • the envelope may include a diffusive coating on a surface thereof.
  • the mounting board assembly may include a reflective coating.
  • the reflective coating may be thermally conductive.
  • the mounting board assembly may include a first mounting board and a second mounting board fastened together at an angle.
  • the first and second mounting boards may be fastened together to define quadrants of the mounting board assembly.
  • the one or more LEDs may include a plurality of LEDs arranged to face into the quadrants defined by the mounting boards.
  • Figure 1 shows an exemplary LED platform according to the disclosed embodiments installed in an envelope of a lamp
  • Figures 2A-2C show an example of the LED platform in various stages of manufacture
  • Figure 3 shows a perspective view of the LED platform according to the disclosed embodiments
  • Figure 4A shows an exemplary block diagram of a power supply according to the disclosed embodiments
  • Figure 4B shows an exemplary circuit for implementing the power supply
  • Figure 5 shows an embodiment that includes a mantle positioned around the LED platform
  • Figure 6 shows an exemplary spectral output for a combination of coatings utilized as part of the disclosed embodiments
  • Figure 7 shows a light distribution curve according to the disclosed embodiments
  • Figure 8 shows temperatures on a surface of the LED platform resulting from an amount of power used to drive the LEDs; and [0041] Figure 9 shows a visual comparison between a bulb utilizing the LED platform and an incandescent A19 light bulb.
  • the disclosed embodiments are directed to an LED platform that provides sufficient lumen output, thermal management, color control, and light distribution characteristics. Thermal management, color control, and sufficient lumen output are three significant challenges facing most LED lamp designs, in particular applications for retrofitting existing light fixtures with LED light sources. These constraints are clearly evident when evaluating cost effective LED retrofits for existing envelope configurations, e.g., A19 configuration.
  • the disclosed embodiments are at least directed to a method for improving the performance of an LED assembly when it is encapsulated within a glass envelope.
  • the use of existing glass envelope technology is highly desirable because the envelope is easily identified by consumers and is easily supported by current manufacturing components, machinery and techniques.
  • a halogen bulb finishing process that installs a halogen capsule inside a glass envelope may be easily adapted to install the LED platform of the disclosed embodiments.
  • the resulting LED lamp may have a look and feel almost indistinguishable from an existing A19 incandescent lamp.
  • FIG. 1 shows an exemplary LED platform 100 according to the disclosed embodiments installed in an envelope 105 of a lamp or light bulb 150.
  • the LED platform 100 may include a mounting board assembly 110, one or more LEDs 115, and a power supply 120.
  • the LED platform 100 may be attached to a stem arrangement 125 within the envelope 105.
  • a "power supply" may comprise one or more of driver circuitry or controller circuitry.
  • the LEDs 115 may comprise a white-light emitting package such as Nichia 757 package or any other suitable light emitting package.
  • the mounting board assembly 110 may be constructed of one or more glass-reinforced epoxy laminates, composed of, for example, woven fiberglass with an epoxy resin binder, or any suitable material for mounting the LEDs and power supply circuitry.
  • the stem arrangement 125 may include two conductors 130, 135 mounted in a rigid, and usually insulating, material 140, typically glass. The two conductors may be connected to a mains power supply through a base 145 of the light bulb 150.
  • the mains supply may typically range from 120V to 240V A.C. but may include other voltages.
  • Figures 2A-2C show an example of the LED platform 100 in various stages of manufacture.
  • the mounting board assembly 110 may include a first mounting board 210 and a second mounting board 215 assembled together in an X-wing configuration.
  • Figure 2A shows the first mounting board 210.
  • the first mounting board 210 may include pads 220 for mounting various components including the LEDs and components of the power supply circuitry, conductors 225 providing electrical connections between the LEDs and power supply circuitry components and a slot 230 for receiving the second mounting board.
  • the pads 220 and conductors 225 may have a surface area and shape to distribute heat across the surface of the first mounting board 210.
  • the second mounting board 215 may have the same features and characteristics.
  • Figure 2B shows the first and second mounting boards 210, 215 assembled together in an X-wing configuration with at least some components 235 of the power supply 120.
  • the first and second mounting boards 210, 215 may be assembled perpendicular to each other, or in some embodiments may be assembled at some other angle.
  • Figure 2C shows the first and second mounting boards 210, 215 assembled together with the LEDs 115.
  • the LED platform 100 in Figures 2B and 2C may include 12 LEDs with 3 LEDs mounted on each side of the first mounting board 210 and the second mounting board 215; however, it should be understood that any number of LEDs may be used.
  • the LED platform 100 may be partially or wholly coated with a highly reflective coating to cover the various surfaces and components.
  • the LEDs 115 may not be coated.
  • the coating may be at least partially specular or it may be at least partially diffuse reflective (e.g., matte).
  • the coating may increase the light output by reducing light bounce losses, and may also increase the thermal conductivity of the surfaces of the mounting boards 210, 215.
  • the mounting boards may be inserted into each other and may be fastened together (for example, fastened by soldering), to form the LED platform 100.
  • This may effectively increase the surface area of the mounting boards, resulting in improved thermal characteristics of the LED platform 100 and also distributes the LEDs 115 over a larger source distribution angle.
  • the power supply 120 and the LEDs 115 on the same mounting board assembly 110, a single set of conductors supplying the mains power may be used and the LED platform may be handled and processed in manufacturing in a manner similar to the halogen bulb assembly process described above.
  • the surface area and shapes of the conductors 225 on the first and second mounting boards may be selected to achieve particular thermal characteristics. By using selected surface areas and shapes, heat may be more efficiently dissipated from the LEDs 115 and more power may be applied to the LEDs.
  • Figure 3 shows a perspective view of the LED platform 100 with LEDs 310, 315, 320, and 325 energized.
  • the LEDs may be surface mount components with a color temperature of approximately 5000K and a light distribution pattern of approximately 120 degrees; however, any suitable LEDs may be used in the disclosed embodiments.
  • FIG 4A shows an exemplary block diagram of power supply 120.
  • the power supply 120 may include components for conditioning power provided by the stem conductors 130, 135 for use by the LEDs 115.
  • power supply 120 may include a rectifier 410 for rectifying the mains power from the stem conductors 130, 135, and a control circuit 415 for providing power to the LEDs 115.
  • FIG. 4B shows an exemplary circuit 420 for implementing the power supply of Figure 4 A.
  • the rectifier 410 receives AC power from an AC mains supply 425 and provides a rectified voltage 430 to the control circuit 415.
  • the control circuit operates to drive LEDs 1 and 2 in series while the rectified voltage 430 is increasing. As the rectified voltage 430 exceeds a predetermined threshold, the control circuit drives LEDs 1 and 2 in parallel and then again in series when the rectified voltage 430 falls below the predetermined threshold.
  • LEDs 1 and 2 may correspond to one or more of LEDs 115.
  • the envelope 105 may be filled with a gas to improve heat flow from the LED platform 100 to the envelope 105.
  • a gas for example, helium and/or hydrogen
  • the envelope may be sealed (e.g., hermetically sealed) to retain the heat transfer gas (e.g., a gas comprising helium) with no openings in the envelope 105 that would permit gas to leak out when the lamp is fully assembled.
  • Electrical leads may be provided through the sealed envelope in a fashion that does not allow leakage of the heat transfer gas or ingress of the ambient atmosphere.
  • Figure 5 shows an embodiment that includes a mantle 510 positioned around the LED platform 100.
  • a mantle may be positioned in any location that can intercept light from the LED platform.
  • the mantle 510 may generally operate as an optical diffuser and as a substrate for various coatings for enhancing the light output from the LEDs.
  • the coatings which may be applied to the mantle may include many types of coating which heretofore have been applied to the surface of LEDs, such a wavelength-converting materials such as phosphors. Applying the coatings to the mantle 510 may result in lower operating temperatures to which the coatings are exposed relative to a location directly on an LED, and a more efficient manufacturing process.
  • the mantle 510 may be comprised of glass, plastic, translucent ceramic or any other suitable material suitable for supporting one or more coatings.
  • Coatings may comprise a phosphor or a neodymium based coatings for enhancing the light output from the LEDs 1 15.
  • Exemplary coatings may include one or more of potassium fluorosilicate (PFS)-based phosphors (where PFS phosphor may have the formula K2SiF 6 :Mn), NdF 3 coatings, and NdFO coatings (where NdFO refers to compositions comprising Nd, fluorine and oxygen such as a neodymium oxyfluoride).
  • PFS potassium fluorosilicate
  • NdFO NdFO coatings
  • the coatings may be applied in any combination to any suitable surface of the mantle 510.
  • the coatings may also be applied in any combination or in different combinations to one or more of a surface of the envelope 105, a surface of the mantle 510, or a surface of the LEDs 115.
  • the envelope 105 may comprise a diffusive coating such as an electrostatic diffusive coating.
  • one or more of the LEDs 115 may be provided as a white-light emitting LED package which comprises a blue LED chip and one or more phosphors that convert blue to another color, which may also include a narrow- red phosphor such as PFS.
  • Figure 6 shows an exemplary spectral output 610 of a lamp using an exemplary combination PFS-NdFO coating that may be utilized as part of the disclosed embodiments, compared to a spectral output 615 of a lamp with no coatings.
  • the exemplary combination PFS- NdFO coating provides a spectral output with a depression in the yellow region of about 570-610 nm.
  • Objects illuminated by the lamp using the combination PFS-NdFO coating may have an enhanced color contrast and an improved Lighting Preference Indicator (LPI).
  • LPI Lighting Preference Indicator
  • a lamp utilizing the LED platform with a PFS and a neodymium -based coating may generally emit light with a Lighting Preference Indicator of over 100.
  • the Lighting Preference Index color rendering metric is generally known and would be understood by persons skilled in the art, especially by reference to commonly-owned PCT publications WO-2015-066099 and WO-2015-035425.
  • the LED platform 100 of the disclosed embodiments also provides a light distribution curve that may correspond to that of a typical incandescent bulb with an A19 envelope.
  • curve 710 shows the average intensity of light over the vertical angle of a bulb utilizing the LED platform 100
  • curve 715 shows the average intensity of light over the vertical angle of a typical incandescent bulb with an A19 envelope. It should be noted that the output of the LED platform 100 bulb falls between the upper and lower boundaries 720 and 725 which show the present limits for qualification as an Energy Star® bulb.
  • Figure 8 shows temperatures on a surface of the LED platform resulting from an amount of power used to drive the LEDs 115 for various configurations of LED support systems.
  • line 805 depicts a board temperature vs. input watts for an LED support system comprising a flat printed circuit board material such as FR4, while line 810 depicts a board temperature vs. input watts for an LED support system comprising a flat printed circuit board material with metal tabs, for example, aluminum tabs.
  • the LED platform 100 as disclosed herein provides a stable output of approximately 820 lumens while dissipating approximately 6.9 watts at a surface temperature of approximately 90C.
  • Figure 9 demonstrates that a bulb 910 utilizing the LED platform 100 may be visually indistinguishable in appearance from an incandescent A19 bulb 915, and may be capable of producing approximately the same lumen output.
  • the disclosed embodiments provide an LED platform in an "X-wing" configuration. Because the internal neck diameter of the typical A19 glass envelope is slightly less than 1 inch, the width of any assembly to be inserted through the neck is limited. However, in embodiments, the LED platform may have a width which is less than the internal neck diameter of the envelope into which it is to be inserted. This may be important in methods of manufacturing a lamp.
  • the "X" shape provides the platform with an increased surface area and helps both optical distribution and thermal distribution. Distributing the LEDs across the increased surface area provides better thermal spreading.
  • one or more of the LEDs 115 may be arranged to face into the quadrants defined by the X-wing configuration of the LED platform 100.
  • one or more LEDs facing a particular quadrant may be offset by 90 degrees.
  • LEDs 310, 315, and 320 each face the same quadrant 330 defined by the X-wing configuration, but LED 320 faces the quadrant at an angle 90 degrees from the angle at which LEDs 310 and 315 face the quadrant.
  • Each of the other quadrants defined by the LED platform X- wing configuration may have the same arrangement of LEDs.
  • a manufacturing process similar to the halogen bulb finishing process may be achieved.
  • such manufacturing process may include steps comprising insertion of the LED platform into the neck of an envelope, followed by evacuation and then charging with a low-molecular weight gas such as helium, following with a sealing step.
  • a low-molecular weight gas such as helium
  • existing production lines may be utilized for manufacturing with only slight modifications to the process (i.e. fill-gas changes and flame adjustments).
  • Another advantage is that the connections to the stem conductors is not polarity specific, greatly reducing the possibility of miswiring the mains connection to the LED platform.
  • a glass envelope encloses a gas comprising helium enables efficient and fast transport of the heat away from the LED platform and the LEDs and power supply to the surface of the glass envelope and, thus to the outside environment.
  • This approach provides simultaneous cooling to both the LEDs and the power supply.
  • Low atomic mass gas cooling He or H2, for example
  • Effective heat transport has been demonstrated at fill pressures as low as approximately 50 Torr; however, any suitable fill pressure may be utilized.
  • the present disclosure also provides a lamp (or lighting apparatus) comprising the described LED platform contained within a glass envelope enclosing the heat transfer gas (such as helium), wherein the glass envelope is hermetically sealed to contain the LED platform and the heat transfer gas.
  • the heat transfer gas such as helium
  • driver circuitry and/or controller circuitry is enclosed within the sealed glass envelope, and there typically may be no driver circuitry or controller circuitry outside the sealed glass envelope.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

L'invention concerne une plateforme de lampe à DEL (100) configurée pour être installée dans une ampoule électrique (150) comprenant un ensemble panneau de montage (110) configuré pour être couplé à des conducteurs d'alimentation de secteur (130, 135) à l'intérieur de l'ampoule électrique (150), une ou plusieurs DEL (115) disposées sur l'ensemble panneau de montage (110), et une alimentation (120) montée sur l'ensemble panneau de montage (110), l'alimentation (120) étant configurée pour recevoir une énergie de secteur des conducteurs d'alimentation de secteur (130, 135) et fournir de l'énergie au(x) DEL (115).
PCT/US2016/054751 2015-09-30 2016-09-30 Plateforme de lampe à del Ceased WO2017059234A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562235566P 2015-09-30 2015-09-30
US62/235,566 2015-09-30

Publications (1)

Publication Number Publication Date
WO2017059234A1 true WO2017059234A1 (fr) 2017-04-06

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WO (1) WO2017059234A1 (fr)

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US20090135595A1 (en) * 2007-11-23 2009-05-28 Taiming Chen Light bulb with light emitting elements for use in conventional incandescent light bulb sockets
WO2009089529A1 (fr) * 2008-01-10 2009-07-16 Goeken Group Corp. Remplacement de lampe del d'une lampe à incandescence de faible puissance
DE102009009288A1 (de) * 2009-02-17 2010-08-26 Osram Gesellschaft mit beschränkter Haftung Starrflexible Trägerplatte
US20110163675A1 (en) * 2010-01-04 2011-07-07 Dongguan Hexi Optical Electric Technology Co., Ltd Led bulb
US20110163681A1 (en) * 2011-02-22 2011-07-07 Quarkstar, Llc Solid State Lamp Using Modular Light Emitting Elements
WO2011143153A1 (fr) * 2010-05-11 2011-11-17 Goeken Group Corporation Remplacement de led haute intensité de lampes incandescentes
US20120033407A1 (en) * 2010-08-05 2012-02-09 Access 2 Communications, Inc. High powered universal led lamp
WO2015035425A1 (fr) 2013-09-09 2015-03-12 GE Lighting Solutions, LLC Sources de lumière perfectionnées à préférence chromatique
WO2015066099A2 (fr) 2013-10-28 2015-05-07 Ge Lighting Solutions, L.L.C. Lampes permettant un azurage optique amélioré et une préférence de couleur

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060215422A1 (en) * 2005-03-25 2006-09-28 Five Star Import Group L.L.C. LED light bulb
US20090135595A1 (en) * 2007-11-23 2009-05-28 Taiming Chen Light bulb with light emitting elements for use in conventional incandescent light bulb sockets
WO2009089529A1 (fr) * 2008-01-10 2009-07-16 Goeken Group Corp. Remplacement de lampe del d'une lampe à incandescence de faible puissance
DE102009009288A1 (de) * 2009-02-17 2010-08-26 Osram Gesellschaft mit beschränkter Haftung Starrflexible Trägerplatte
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