[go: up one dir, main page]

WO2017057909A1 - Appareil de séparation de puce et procédé de séparation de puce - Google Patents

Appareil de séparation de puce et procédé de séparation de puce Download PDF

Info

Publication number
WO2017057909A1
WO2017057909A1 PCT/KR2016/010891 KR2016010891W WO2017057909A1 WO 2017057909 A1 WO2017057909 A1 WO 2017057909A1 KR 2016010891 W KR2016010891 W KR 2016010891W WO 2017057909 A1 WO2017057909 A1 WO 2017057909A1
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor chip
tape
elastic member
chip
deetching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2016/010891
Other languages
English (en)
Korean (ko)
Inventor
고윤성
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Protec Co Ltd Korea
Original Assignee
Protec Co Ltd Korea
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Protec Co Ltd Korea filed Critical Protec Co Ltd Korea
Priority to SG11201802752PA priority Critical patent/SG11201802752PA/en
Priority to CN201680057311.9A priority patent/CN108140601B/zh
Publication of WO2017057909A1 publication Critical patent/WO2017057909A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Definitions

  • the present invention relates to a chip deetching apparatus and a chip deetching method, and more particularly, to a chip deetching apparatus and a chip deetching method for supplying a semiconductor chip attached to a tape to be mounted on a package or a substrate.
  • the semiconductor chip formed on the wafer is transferred to the next process while attached to a thin adhesive tape.
  • FIG. 1 shows an example of a semiconductor chip attached to a tape and supplied.
  • a wafer on which a plurality of semiconductor chips are formed is attached to a thin tape and then sawed by each semiconductor chip unit.
  • the tension is applied to the tape T and pulled uniformly, as shown in FIG. 1, the plurality of semiconductor chips C are attached to the tape T at regular intervals.
  • the plurality of semiconductor chips C attached to the tape T are sequentially detached from the tape T and attached to the substrate one by one.
  • the thickness of such a semiconductor chip (C) is often made very thin.
  • the semiconductor chip C is likely to be damaged in the process of separating the semiconductor chip C from the tape T.
  • the adhesive force between the tape T and the semiconductor chip C in the process of separating the semiconductor chip C from the tape T Due to this, there is a problem in that the semiconductor chip C is easily broken.
  • the edge of the semiconductor chip C was separated from the tape T by fixing the tape T and pushing the tape T with a pin from the lower side of the tape T. In this manner, the semiconductor chip C whose edge is separated from the tape T is lifted by the pickup head and transferred to the substrate. In the case of pushing up the tape T with the pins, there is a problem that the semiconductor chip C is damaged by the impact of the pins hitting the semiconductor chip C. As described above, when the area of the semiconductor chip C is relatively large compared to the thickness of the semiconductor chip C, the semiconductor chip C is elastically deformed or torn even when the tape T is pushed up with a pin. The case where it does not separate from the tape T also arises.
  • the present invention has been made in view of the above-described problems, and relates to a chip deetching apparatus and a chip deetching method capable of effectively separating a semiconductor chip from a tape while minimizing an impact transmitted to the semiconductor chip.
  • the chip deetching apparatus of the present invention for solving the above object is a chip deetching apparatus for detetching a semiconductor chip adhered to a thin tape, the chip lower surface of the semiconductor chip outer periphery to be deetched from the tape
  • a support hole supporting the support body an adsorption hole formed in the upper surface of the support body so as to adsorb the lower surface of the tape in contact with the support body, and a push hole formed to penetrate the upper and lower center portions of the support body up and down.
  • An eject hood having a; A lifting body which is inserted into a push hole of the eject hood and is capable of lifting up and down so as to push up the tape adsorbed by the vacuum transferred through the suction hole of the eject hood upward through the push hole; An elevating member having a through hole formed to penetrate the upper and lower center portions of the elevating body up and down, and a cavity formed in the elevating body so as to communicate with the through hole; An elastic member that is convexly elastically deformed through the through hole and is filled in and installed in the cavity of the elevating member to push up the tape together with the semiconductor chip; A pressing member which is formed to correspond to the inner circumferential shape of the cavity of the lifting member so as to elastically deform the elastic member by applying pressure to the elastic member, and is installed on the lifting body so as to be able to move back and forth with respect to the cavity; And a pickup head disposed on an upper side of the eject hood and adsorbing and raising the semiconductor chip to be pushed
  • the chip deetching method of the present invention for solving the above object, in the chip deetching method for deetching a semiconductor chip adhered to a thin tape, (a) a state in which the tape is disposed on the eject hood Adsorbing a lower surface of the tape around the semiconductor chip to be etched through the tape through a plurality of adsorption holes formed in an upper surface of the eject hood; (b) pushing up the tape in contact with the elevating member by raising the elevating member inserted into the push hole formed in the center portion of the eject hood; (c) applying the pressure to the elastic member filled in the cavity formed to communicate with the through hole formed in the center of the elevating member so as to correspond to the inner circumferential shape of the cavity, and to apply pressure to the cavity so as to move back and forth to the cavity; Separating the tape from the semiconductor chip around the semiconductor chip by convex elastic deformation of the member upwardly; (d) adsorbing the upper surface of the semiconductor chip by lowering the pickup head
  • the chip deetching apparatus and chip deetching method of the present invention for achieving the above object and object have an effect of providing an apparatus and method capable of effectively deetching while preventing breakage of a semiconductor chip attached to a tape.
  • 1 is a plan view illustrating a semiconductor chip adhering to a tape.
  • FIG. 2 is a plan view illustrating a state in which a tape on which a semiconductor chip is adhered is disposed in a chip deetching apparatus according to an exemplary embodiment of the present invention.
  • 3 to 7 are cross-sectional views taken along the line II-II for explaining a process of deetching a semiconductor chip using the chip deetching apparatus shown in FIG. 2.
  • FIG. 8 is a flowchart illustrating a chip deetching method according to an exemplary embodiment of the present invention for deetching a semiconductor chip using the chip deetching apparatus illustrated in FIG. 2.
  • FIG. 2 is a plan view illustrating a state in which a tape attached with a semiconductor chip is disposed on a chip deetching apparatus according to an exemplary embodiment of the present invention
  • FIG. 3 is a cross-sectional view taken along line II-II of the chip deetching apparatus illustrated in FIG. 2. to be.
  • the chip deetching apparatus of the present embodiment includes an eject hood 10, a lifting member 20, an elastic member 30, a pressing member 40, and a pickup head 50.
  • the eject hood 10 has a support body 11, a suction hole 12, and a push hole 13.
  • the support body 11 is formed in a shape similar to a square tube extending up and down.
  • the upper surface of the support body 11 is formed in a rectangular outer circumference.
  • the outer circumference of the upper surface of the support body 11 is formed to be larger than the outer size of the semiconductor chip C to be deetched from the tape T.
  • a plurality of suction holes 12 are formed on the upper surface of the support body 11.
  • the eject hood 10 forms a vacuum through the adsorption holes 12 to adsorb the bottom surface of the tape T in contact with the adsorption holes 12.
  • the suction holes 12 are arranged along the outer circumference of the semiconductor chip C.
  • the adsorption holes 12 are disposed at positions between the semiconductor chips C adhered to the tape T to adsorb the tape T.
  • a push hole 13 penetrating the support body 11 up and down is formed in the upper center portion of the support body 11.
  • the suction holes 12 are arranged along the outer circumference of the push hole 13.
  • the push hole 13 is formed in a square.
  • the size of the push hole 13 is preferably smaller than the size of the semiconductor chip (C).
  • the elevating member 20 includes an elevating body 21, a through hole 22, a cavity 23, and a locking portion 24.
  • the upper portion of the elevating body 21 is inserted into the push hole 13 of the eject hood 10 to be elevated.
  • the outer circumference of the upper and lower surfaces of the lifting body 21 is formed in a quadrangular shape to fit the size of the push hole 13.
  • the upper outer circumference of the lifting body 21 may be smaller than the size of the semiconductor chip C.
  • the through hole 22 is formed in the center of the upper surface of the lifting body 21.
  • the through hole 22 is formed to penetrate up and down the central portion of the upper surface of the elevating body 21.
  • the outer shape of the through hole 22 is formed in a square.
  • the cavity 23 is formed in the lifting body 21.
  • the cavity 23 is formed to communicate with the through hole 22.
  • the cavity 23 is provided with a space for accommodating the elastic member 30.
  • the catching part 24 is formed at an upper portion of the through hole 22.
  • the locking portion 24 is formed to protrude toward the inside of the through hole 22. The locking portion 24 prevents the elastic member 30 from being detached to the outside when the elastic member 30 is elastically deformed and protrudes toward the upper side of the through hole 22.
  • the elastic member 30 is provided by filling the cavity 23 and the through hole 22 of the elevating member 20. To this end, the elastic member 30 is formed in accordance with the inner circumferential shape of the cavity 23 and the through hole 22. Referring to FIG. 3, the elastic member 30 has a stepped portion in accordance with the shape of the locking portion 24 to be filled in the through hole 22.
  • the contact surface 31 is formed on the upper surface of the elastic member 30. The contact surface 31 of the elastic member 30 is exposed through the through hole 22. The contact surface 31 of the elastic member 30 is formed concave so as not to contact the tape T.
  • the contact surface 31 of the elastic member 30 is formed of an adhesive material.
  • the elastic member 30 is formed of a good elastic material such as rubber, gel.
  • the elastic member 30 may be formed of a material having no voids therein, and may be formed of a material that is compressed by external force and does not reduce its volume.
  • the pressing member 40 is inserted into the cavity 23 of the lifting body 21 and disposed below the elastic member 30.
  • the pressing member 40 is formed to correspond to the inner circumferential shape of the cavity 23.
  • the pressing member 40 may elastically deform the elastic member 30 by applying pressure to the elastic member 30. To this end, the pressing member 40 is elevated along the cavity 23 and provides pressure to the lower surface of the elastic member 30.
  • the pickup head 50 is disposed above the eject hood 10.
  • the pickup head 50 has a suction plate 51 formed of a porous ceramic.
  • the pickup head 50 is configured to raise and lower the suction plate 51.
  • the pickup head 50 adsorbs the semiconductor chip C by contacting the adsorption plate 51 on the upper surface of the semiconductor chip C, and then lifts the semiconductor chip C in this state to tape the semiconductor chip C to the tape T. ).
  • FIG. 8 is a flowchart illustrating a chip deetching method according to an embodiment of the present invention in which the semiconductor chip is deetched using the chip deetching apparatus illustrated in FIG. 2.
  • the semiconductor chip C to be deetched among the semiconductor chips C adhered to the tape T is disposed on the upper surface of the eject hood 10 and the elevating member 20. To place. In this state, a vacuum is transmitted through the suction holes 12 of the eject hood 10 to adsorb the lower surface of the tape T to the upper surface of the eject hood 10 ((a); S110). At this time, since the contact surface 31 of the elastic member 30 is formed concave, it is not in contact with the tape (T).
  • Step S120 the vacuum is transferred through the suction plate 51 of the pickup head 50 to absorb the upper surface of the semiconductor chip C.
  • the elevating member 20 is raised so that the edge portion of the semiconductor chip C is separated from the tape T ((b) step; S130).
  • the tape T is formed at the edge of the semiconductor chip C as shown in FIG. 5. It begins to separate from (C).
  • the tape T outside the semiconductor chip C is fixed by the adsorption holes 12, so that the semiconductor chip C and the tape T under the semiconductor chip C are elevated. 20, the tape T of the outer circumference of the semiconductor chip C is separated from the semiconductor chip C.
  • the pickup head 50 is also raised in synchronization with the movement of the elevating member 20 (step (e); S140). As such, the pickup head 50 rises in synchronization with the movement of the elevating member 20, thereby preventing damage to the semiconductor chip C.
  • the pressing member 40 is partially raised to adhere the adhesive face 31 of the elastic member 30 to the lower surface of the tape T.
  • the semiconductor chip C is removed from the tape T while the adhesive surface 31 of the elastic member 30 is brought into contact with the tape T to support the lower surface of the semiconductor chip C with the elastic member 30. Proceed with the separation process.
  • the pressure member 40 is raised to apply pressure to the lower side of the elastic member 30.
  • the tape T and the semiconductor chip C are pushed upward by elastically convex elastically deforming the elastic member 30 (step (c); S150).
  • the contact surface 31 of the elastic member 30 is in a state of being adhered to the tape (T).
  • the pickup head 50 when the semiconductor chip is raised by the elastic member 30, the pickup head 50 also raises the semiconductor chip C in synchronization with the movement of the elastic member 30 ((e) step; S160).
  • the tape T of the portion where the lower surface is not supported by the elastic member 30 gradually becomes a semiconductor chip C. Is separated from the lower surface. That is, the detetching (separation) of the tape T proceeds from the edge of the semiconductor chip C toward the central portion of the semiconductor chip C. As described above, the de-etching of the semiconductor chip C is performed while supporting the tape T by the pressure acting on the elastic member 30, so that the tape T can be effectively separated from the lower surface of the semiconductor chip C. There is an advantage.
  • the adhesive force of the tape T is effective without damaging the semiconductor chip C.
  • This has the advantage of being able to perform deetching work.
  • the elastic member 30 is elastically deformed in proportion to the displacement of the pressing member 40, there is an advantage in that the rising height of the tape T and the semiconductor chip C can be precisely controlled.
  • the pickup head 50 is raised during the step (b) of raising the elevating member 20 (S130) and raising the elastic member 30 ((c); S150).
  • steps S140 and S160 are performed continuously at the same time.
  • the lifting head 20 does not lower the pick-up head 50 to adsorb the semiconductor chip C after the tape T is sucked through the suction hole 12. It is also possible to operate the chip deetching apparatus to lower the pick-up head 50 and to adsorb the semiconductor chip C (d); Do.
  • the pickup head 50 is performed after raising the elevating member 20 (b); S130 and raising the elastic member 30 (c); It is also possible to operate the chip de-etching device to lower the (S) step of adsorbing the semiconductor chip (C) (S120).
  • the pressing member 40 is lowered and removed so that the elastic member 30 is elastic as shown in FIGS. 3 to 5 again. To be restored.
  • the semiconductor chip C is detached by rapidly lowering the pressing member 40 while restoring the elastic member 30 while the semiconductor chip C is partially separated. You can also When the convex elastically deformed elastic member 30 temporarily restores elasticity, the tape T portion adhered to the elastic member 30 also temporarily returns to its original state while the tape T is removed from the lower surface of the semiconductor chip C. Can be completely separated.
  • the contact surface 31 of the elastic member 30 has been described as being concave, the contact surface of the elastic member may be formed horizontally at a position lower than the upper surface of the lifting body. Alternatively, the contact surface of the elastic member may be formed at the same height as the upper surface of the lifting body. Accordingly, the pressing member can pull the elastic member downward so as to separate the tape from the contact surface of the elastic member, and elastically deform the contact surface of the elastic member in the cavity direction.
  • the contact surface of the elastic member 30 has been described as being formed of an adhesive material, an adhesive material may be applied to the contact surface of the elastic member, or the elastic member may further include an adhesive layer on the contact surface. Alternatively, the contact surface of the elastic member may not be formed of an adhesive material.
  • the pressing member 40 has been described as being lifted along the cavity 23 formed in the lifting body, the pressing member may be installed on the side of the cavity to retreat in the horizontal direction and apply pressure to the elastic member.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

La présente invention se rapporte à un appareil de séparation de puce et à un procédé de séparation de puce, et plus particulièrement, à un appareil de séparation de puce et à un procédé de séparation de puce permettant de séparer une puce à semi-conducteur fixée à une bande et de fournir la puce à semi-conducteur qui doit être montée sur un boîtier ou un substrat. Pour atteindre l'objectif ci-dessus, un appareil de séparation de puce et un procédé de séparation de puce selon la présente invention ont l'effet de fournir un appareil et un procédé qui peuvent séparer de manière efficace une puce à semi-conducteur fixée à une bande tout en empêchant une rupture de la puce à semi-conducteur.
PCT/KR2016/010891 2015-10-02 2016-09-29 Appareil de séparation de puce et procédé de séparation de puce Ceased WO2017057909A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
SG11201802752PA SG11201802752PA (en) 2015-10-02 2016-09-29 Chip detaching apparatus and chip detaching method
CN201680057311.9A CN108140601B (zh) 2015-10-02 2016-09-29 芯片分离装置与芯片分离方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2015-0139251 2015-10-02
KR1020150139251A KR101683398B1 (ko) 2015-10-02 2015-10-02 칩 디테칭 장치 및 칩 디테칭 방법

Publications (1)

Publication Number Publication Date
WO2017057909A1 true WO2017057909A1 (fr) 2017-04-06

Family

ID=57573116

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2016/010891 Ceased WO2017057909A1 (fr) 2015-10-02 2016-09-29 Appareil de séparation de puce et procédé de séparation de puce

Country Status (5)

Country Link
KR (1) KR101683398B1 (fr)
CN (1) CN108140601B (fr)
SG (1) SG11201802752PA (fr)
TW (1) TWI637454B (fr)
WO (1) WO2017057909A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102430018B1 (ko) 2017-12-20 2022-08-05 엘지디스플레이 주식회사 이송 헤드 어셈블리 및 발광소자 이송장치
KR102394825B1 (ko) * 2020-04-23 2022-05-06 주식회사 프로텍 빅셀 소자를 이용한 플립칩 본딩 장치

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100701814B1 (ko) * 2004-05-11 2007-04-02 에이에스엠 어쌤블리 오토메이션 리미티드 반도체 칩 분리를 위한 방법 및 장치
KR20110053033A (ko) * 2009-11-13 2011-05-19 (주)큐엠씨 픽업장치
KR20140029115A (ko) * 2012-08-29 2014-03-10 가부시끼가이샤 히다찌 하이테크 인스트루먼츠 다이 본딩 장치 및 다이 픽업 장치 및 다이 픽업 방법
KR20140001476U (ko) * 2012-08-31 2014-03-11 세메스 주식회사 다이 이젝팅 유닛 및 다이 픽업 장치
US20150279716A1 (en) * 2014-04-01 2015-10-01 Protec Co., Ltd. Apparatus and method for detaching chip

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7303647B2 (en) * 2004-10-29 2007-12-04 Asm Assembly Automation Ltd. Driving mechanism for chip detachment apparatus
JP4765536B2 (ja) * 2005-10-14 2011-09-07 パナソニック株式会社 チップピックアップ装置およびチップピックアップ方法ならびにチップ剥離装置およびチップ剥離方法
JP4825637B2 (ja) * 2006-10-31 2011-11-30 芝浦メカトロニクス株式会社 半導体チップのピックアップ装置
US8092645B2 (en) * 2010-02-05 2012-01-10 Asm Assembly Automation Ltd Control and monitoring system for thin die detachment and pick-up
JP5123357B2 (ja) * 2010-06-17 2013-01-23 株式会社日立ハイテクインスツルメンツ ダイボンダ及びピックアップ装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100701814B1 (ko) * 2004-05-11 2007-04-02 에이에스엠 어쌤블리 오토메이션 리미티드 반도체 칩 분리를 위한 방법 및 장치
KR20110053033A (ko) * 2009-11-13 2011-05-19 (주)큐엠씨 픽업장치
KR20140029115A (ko) * 2012-08-29 2014-03-10 가부시끼가이샤 히다찌 하이테크 인스트루먼츠 다이 본딩 장치 및 다이 픽업 장치 및 다이 픽업 방법
KR20140001476U (ko) * 2012-08-31 2014-03-11 세메스 주식회사 다이 이젝팅 유닛 및 다이 픽업 장치
US20150279716A1 (en) * 2014-04-01 2015-10-01 Protec Co., Ltd. Apparatus and method for detaching chip

Also Published As

Publication number Publication date
CN108140601B (zh) 2022-04-05
KR101683398B1 (ko) 2016-12-07
SG11201802752PA (en) 2018-05-30
CN108140601A (zh) 2018-06-08
TW201724331A (zh) 2017-07-01
TWI637454B (zh) 2018-10-01

Similar Documents

Publication Publication Date Title
KR101596461B1 (ko) 칩 디테칭 장치 및 칩 디테칭 방법
KR100549359B1 (ko) 박형의 다이 분리용 장치 및 방법
KR20040041789A (ko) 에어 블로잉을 이용한 칩 픽업 방법 및 장치
KR20180112489A (ko) 기판 지지 부재 및 이의 기판 디척킹 방법
WO2017057909A1 (fr) Appareil de séparation de puce et procédé de séparation de puce
KR101503018B1 (ko) Led 칩용 형광 필름 픽업 장치
KR101322571B1 (ko) 반도체 소자들을 픽업하기 위한 장치
KR101719168B1 (ko) 디테칭피커모듈을 포함하는 웨이퍼링 프레임방식용 픽앤플레이스 시스템
JP2012232826A (ja) シール剥離装置及びシール剥離方法
KR100643714B1 (ko) 칩 분리장치
KR200460715Y1 (ko) 반도체 칩 픽업 장치
KR20160006790A (ko) 반도체 칩의 픽업 장치
KR102382558B1 (ko) 다이 픽업 장치 및 다이 픽업 장치의 동작방법
KR101350565B1 (ko) 다이 픽업 방법
KR20090026611A (ko) 반도체 칩 픽업 장치 및 이를 이용한 반도체 칩 픽업 방법
CN108666257B (zh) 元件剥离装置及元件剥离方法
KR20140063941A (ko) 대면적 기판 홀딩 장치
KR20110107118A (ko) 스테이지 및 이를 이용한 반도체 다이 픽업 장치
KR20050113934A (ko) 반도체 다이 픽업 방법
KR101397070B1 (ko) 기판-리드 부착 장치 및 기판-리드 부착 방법
JP2006294763A (ja) 半導体素子のピックアップ装置
TW202016549A (zh) 具定位功能之電子元件移載裝置、具備該裝置之檢測設備及其移載方法
CN213622181U (zh) 一种下料夹持装置及下料装置
JP5197426B2 (ja) 保持治具の保持層取り外し装置及び保持治具の保持層取り外し方法
KR20090090482A (ko) 다이 분리 방법 및 장치

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16852055

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 11201802752P

Country of ref document: SG

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 16852055

Country of ref document: EP

Kind code of ref document: A1