WO2017050047A1 - Chipset and electronic device - Google Patents
Chipset and electronic device Download PDFInfo
- Publication number
- WO2017050047A1 WO2017050047A1 PCT/CN2016/094474 CN2016094474W WO2017050047A1 WO 2017050047 A1 WO2017050047 A1 WO 2017050047A1 CN 2016094474 W CN2016094474 W CN 2016094474W WO 2017050047 A1 WO2017050047 A1 WO 2017050047A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- chipset
- electronic device
- inexpensive
- chip
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Semiconductor Integrated Circuits (AREA)
- Electronic Switches (AREA)
Abstract
A chipset (8) and an electronic device (100) comprising the chipset (8). The chipset (8) comprises: a first chip (81), which comprises an insulating substrate (811) and a first integrated circuit (813) provided on the insulating substrate (811); and a second chip (83), which comprises a semiconductor substrate (831) and a second integrated circuit (833) provided on the semiconductor substrate (831). The chipset (8) is inexpensive; correspondingly, the electronic device (100) comprising the chipset (8) also is inexpensive.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520744364.0U CN205028275U (en) | 2015-09-23 | 2015-09-23 | Chipset and electronic equipment |
| CN201520744364.0 | 2015-09-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2017050047A1 true WO2017050047A1 (en) | 2017-03-30 |
Family
ID=55260792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2016/094474 Ceased WO2017050047A1 (en) | 2015-09-23 | 2016-08-10 | Chipset and electronic device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN205028275U (en) |
| WO (1) | WO2017050047A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205028275U (en) * | 2015-09-23 | 2016-02-10 | 深圳信炜科技有限公司 | Chipset and electronic equipment |
| EP3316180A4 (en) | 2016-05-30 | 2018-08-29 | Shenzhen Xinwei Technology Co, Ltd. | Biosensing chip and electronic device |
| CN106206549B (en) * | 2016-05-30 | 2019-06-28 | 深圳信炜科技有限公司 | Chip and electronic equipment |
| CN106062951B (en) * | 2016-05-30 | 2019-06-28 | 深圳信炜科技有限公司 | Bio-sensing module, bio-sensing chip and electronic equipment |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1683960A (en) * | 2004-04-14 | 2005-10-19 | 株式会社日立显示器 | Display device and manufacturing method thereof |
| CN101162699A (en) * | 2006-10-12 | 2008-04-16 | 株式会社瑞萨科技 | Semiconductor device and manufacturing method thereof |
| CN103488361A (en) * | 2012-06-08 | 2014-01-01 | 速博思股份有限公司 | Embedded touch display panel system for increasing touch position accuracy |
| CN104536603A (en) * | 2014-12-18 | 2015-04-22 | 深圳市华星光电技术有限公司 | Displayer and panel with touch function |
| CN104536637A (en) * | 2015-01-29 | 2015-04-22 | 京东方科技集团股份有限公司 | Embedded touch screen and display device |
| CN105138203A (en) * | 2015-09-23 | 2015-12-09 | 深圳信炜科技有限公司 | Capacitive sensing system and electronic equipment |
| CN205028275U (en) * | 2015-09-23 | 2016-02-10 | 深圳信炜科技有限公司 | Chipset and electronic equipment |
| CN205080387U (en) * | 2015-09-23 | 2016-03-09 | 深圳信炜科技有限公司 | Electronic equipment |
-
2015
- 2015-09-23 CN CN201520744364.0U patent/CN205028275U/en not_active Withdrawn - After Issue
-
2016
- 2016-08-10 WO PCT/CN2016/094474 patent/WO2017050047A1/en not_active Ceased
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1683960A (en) * | 2004-04-14 | 2005-10-19 | 株式会社日立显示器 | Display device and manufacturing method thereof |
| CN101162699A (en) * | 2006-10-12 | 2008-04-16 | 株式会社瑞萨科技 | Semiconductor device and manufacturing method thereof |
| CN103488361A (en) * | 2012-06-08 | 2014-01-01 | 速博思股份有限公司 | Embedded touch display panel system for increasing touch position accuracy |
| CN104536603A (en) * | 2014-12-18 | 2015-04-22 | 深圳市华星光电技术有限公司 | Displayer and panel with touch function |
| CN104536637A (en) * | 2015-01-29 | 2015-04-22 | 京东方科技集团股份有限公司 | Embedded touch screen and display device |
| CN105138203A (en) * | 2015-09-23 | 2015-12-09 | 深圳信炜科技有限公司 | Capacitive sensing system and electronic equipment |
| CN205028275U (en) * | 2015-09-23 | 2016-02-10 | 深圳信炜科技有限公司 | Chipset and electronic equipment |
| CN205080387U (en) * | 2015-09-23 | 2016-03-09 | 深圳信炜科技有限公司 | Electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN205028275U (en) | 2016-02-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
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| NENP | Non-entry into the national phase |
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| 122 | Ep: pct application non-entry in european phase |
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