WO2016136571A1 - Metal hybrid resin and method for producing same - Google Patents
Metal hybrid resin and method for producing same Download PDFInfo
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- WO2016136571A1 WO2016136571A1 PCT/JP2016/054660 JP2016054660W WO2016136571A1 WO 2016136571 A1 WO2016136571 A1 WO 2016136571A1 JP 2016054660 W JP2016054660 W JP 2016054660W WO 2016136571 A1 WO2016136571 A1 WO 2016136571A1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
Definitions
- the present invention relates to a metal hybrid resin and a manufacturing method thereof.
- Patent Document 1 a printing adhesive layer forming ink containing conductive particles having a primary particle diameter of 1 to 300 nm, a curable resin, a dispersant, and a solvent is prepared, printed on a substrate, and cured.
- a technique for forming an adhesive layer in a composite layer is disclosed. According to such a technique, it is said that the adhesion between the substrate and the wiring layer can be improved and the connection resistance can be lowered.
- Patent Document 2 discloses a conductive layer-forming composition containing inorganic particles including a dispersion medium and a metal oxide, a binder material, and conductive particles containing conductive particles having a number average particle diameter of 1 nm to 3000 nm.
- a composition set comprising an adhesive composition is disclosed, and according to such a conductive adhesive composition, high adhesion between a conductive substrate and a conductor layer formed from a metal-containing particle dispersion is provided on the surface. It is said that the continuity between the conductor layer and the substrate can be secured.
- the present invention has been made in view of the above problems, and provides a metal resin composite material in which metal particles are uniformly dispersed in a resin and can exhibit high mechanical strength.
- a phenolic resin (B) A metal hybrid resin comprising metal particles composed of metal atoms coordinated to oxygen atoms in the phenol resin is provided.
- (A) (A) a step of preparing a phenol resin; (B) (B ′) preparing a metal salt solution; (C) A step of mixing the (A) phenol resin and the (B ′) metal salt solution to coordinate a metal atom to an oxygen atom in the (A) phenol resin to obtain a metal hybrid resin.
- the present invention is a composite material including a phenol resin and metal particles, wherein a metal atom constituting the metal particle is coordinated to an oxygen atom in the phenol resin.
- a metal atom constituting the metal particle is coordinated to an oxygen atom in the phenol resin.
- the metal particles and the resin can be bonded through a chemical bond, the metal particles can be uniformly dispersed in the resin, and high mechanical strength can be expressed.
- the name of the “metal hybrid resin” is the name of the present inventors and refers to a novel metal resin composite material in which the metal particles and the resin material as described above are bonded through a coordinate bond. Is.
- FIG. 2 is a chart of an Ag3d narrow scan spectrum measured for the metal resin composite material obtained in Example 1.
- FIG. It is a chart of Ag3d narrow scan spectrum measured about the sample which cleaned Ag foil with Ar ion. It is a photograph figure which shows the result of having observed the surface with the transmission electron microscope (TEM) about the metal resin composite material obtained by Example 1.
- TEM transmission electron microscope
- the metal hybrid resin of this embodiment contains the following components (A) and (B).
- ((A) Phenolic resin What is necessary is just to select suitably the phenol resin used for the metal hybrid resin of this embodiment from well-known phenol resins in view of a use etc.
- this phenol resin for example, a novolak type phenol resin, a resol type phenol resin, an aryl alkylene type phenol resin, or the like can be used.
- the novolac-type phenol resin can be obtained, for example, by reacting phenols and aldehydes under an acidic catalyst.
- phenols used in producing the novolak type phenol resin include phenol, cresol, xylenol, ethylphenol, p-phenylphenol, p-tert-butylphenol, p-tert-amylphenol, p-octylphenol, p- Nonylphenol, p-cumylphenol, bisphenol A, bisphenol F, resorcinol, 2-hydroxybenzaldehyde, 3-hydroxybenzaldehyde, 4-hydroxybenzaldehyde or derivatives thereof may be mentioned.
- these phenols can also be used individually or in combination of 2 or more types.
- aldehydes used in the production of novolak type phenol resins include alkyl aldehydes such as formaldehyde, acetaldehyde, propyl aldehyde, and butyraldehyde, aromatic aldehydes such as benzaldehyde, 2-hydroxybenzaldehyde, 3-hydroxybenzaldehyde, 4- And aromatic aldehydes having a hydroxyl phenol such as hydroxybenzaldehyde.
- the formaldehyde source include formalin (aqueous solution), paraformaldehyde, hemi-formal with alcohols, and trioxane. In addition, you may use these aldehydes individually or in combination of 2 or more types.
- the reaction molar ratio of phenols to aldehydes is usually 0.3 to 1.7 mol of aldehydes with respect to 1 mol of phenols, preferably 0.5 ⁇ 1.5 moles.
- Examples of the acidic catalyst used for the production of the novolak type phenol resin include organic carboxylic acids such as oxalic acid and acetic acid, organic sulfonic acids such as benzenesulfonic acid, paratoluenesulfonic acid and methanesulfonic acid, and 1-hydroxyethylidene-1
- organic phosphonic acids such as 1,1'-diphosphonic acid and 2-phosphonobutane-1,2,4-tricarboxylic acid
- inorganic acids such as hydrochloric acid, sulfuric acid and phosphoric acid.
- the resol type phenol resin can be obtained, for example, by reacting phenols and aldehydes in the presence of a catalyst such as an alkali metal, an amine, or a divalent metal salt.
- a catalyst such as an alkali metal, an amine, or a divalent metal salt.
- phenols used for the production of the resol type phenol resin include cresols such as phenol, o-cresol, m-cresol, p-cresol, 2,3-xylenol, 2,4-xylenol, and 2,5-xylenol.
- Xylenols such as 2,6-xylenol, 3,4-xylenol and 3,5-xylenol, ethylphenols such as o-ethylphenol, m-ethylphenol and p-ethylphenol, isopropylphenol, butylphenol, p- Butylphenols such as tert-butylphenol, p-tert-amylphenol, p-octylphenol, p-nonylphenol, alkylphenols such as p-cumylphenol, fluorophenol, chlorophenol, bromophenol, iodo Halogenated phenols such as enol, monovalent phenol substitutes such as p-phenylphenol, aminophenol, nitrophenol, dinitrophenol and trinitrophenol, and monovalent phenols such as 1-naphthol and 2-naphthol, Resorcin, alkylresorcin, pyr
- aldehydes used in the production of resol type phenol resins include formaldehyde, paraformaldehyde, trioxane, acetaldehyde, propionaldehyde, polyoxymethylene, chloral, hexamethylenetetramine, furfural, glyoxal, n-butyraldehyde, capro
- These aldehydes may be used alone or in combination of two or more.
- formaldehyde and paraformaldehyde are preferably selected and used from the viewpoint of excellent reactivity and low cost.
- Examples of the catalyst used in the production of the resol type phenolic resin include alkali metal hydroxides such as sodium hydroxide, lithium hydroxide and potassium hydroxide, alkaline earth metal oxides such as calcium, magnesium and barium, and the like. Examples thereof include hydroxides, sodium carbonate, aqueous ammonia, amines such as triethylamine and hexamethylenetetramine, and divalent metal salts such as magnesium acetate and zinc acetate. These catalysts may be used alone or in combination of two or more.
- the reaction molar ratio of phenols to aldehydes is preferably 0.80 to 2.50 moles of aldehydes per mole of phenols, more preferably Aldehydes are 1.00 to 2.30 mol.
- An arylalkylene type phenol resin refers to a phenol resin having one or more arylalkylene groups in a repeating unit.
- Examples of such aryl alkylene type phenol resins include xylylene type phenol resins and biphenyl dimethylene type phenol resins.
- Such an arylalkylene type phenol resin can be produced according to a known method, and the above-described phenols may be used as a raw material.
- the metal hybrid resin of this embodiment has a feature that metal atoms constituting metal particles described later are coordinated to oxygen atoms in the phenol resin.
- the coordinated oxygen atom is not limited to the phenolic hydroxyl group provided in the phenol resin, and may be an oxygen atom derived from a functional group other than this, and thus oxygen atoms derived from various functional groups and By causing the metal particles to interact, the adhesion between the metal particles and the phenol resin can be further increased.
- the phenol resin includes a phenol resin having an aliphatic alcohol group in the molecule, a phenol resin having an ether group in the molecule, a phenol resin having a ketone group in the molecule, and a phenol having an aldehyde group in the molecule. It is preferable to use a resin, a phenol resin having a carboxyl group in the molecule, a phenol resin having an ester group in the molecule, and a phenol resin having a urethane group in the molecule.
- a phenol resin having a carbonyl moiety such as a ketone group, an aldehyde group, a carboxyl group, an ester group, or a urethane group in the molecule.
- carbonyl group such as a ketone group, an aldehyde group, a carboxyl group, an ester group, or a urethane group
- the metal hybrid resin in the present embodiment is a mixture of a metal salt solution and a phenol resin, and coordinates a metal atom to an oxygen atom in the phenol resin.
- the aldehyde group brings about a reducing action on the metal cation constituting the metal salt.
- the metal atom can be easily coordinated to the oxygen atom in the phenol resin.
- Such a phenol resin having an aldehyde group in the molecule is, for example, a phenol used for producing the phenol resin, for example, hydroxybenzaldehyde such as 2-hydroxybenzaldehyde, 3-hydroxybenzaldehyde, 4-hydroxybenzaldehyde, A derivative thereof may be used.
- a desired phenol resin can be produced by performing a conversion reaction on this phenol according to a known production method of a phenol resin.
- the number average molecular weight (Mn) of the phenol resin of the present embodiment can be appropriately set according to the application to which the metal hybrid resin is applied, but is, for example, 150 or more, preferably 200 or more, more preferably 250. That's it. Moreover, the number average molecular weight (Mn) of the phenol resin of this embodiment is 1500 or less, for example, Preferably it is 1200 or less, More preferably, it is 1000 or less. By setting to such a range, moderate flexibility as a resin component can be imparted.
- the weight average molecular weight (Mw) of the phenol resin of this embodiment can be suitably set according to the use which applies a metal hybrid resin, it is 200 or more, for example, Preferably it is 300 or more, More preferably, it is 400. That's it. Moreover, the weight average molecular weight (Mw) of the phenol resin of this embodiment is 2500 or less, for example, Preferably it is 2000 or less, More preferably, it is 1800 or less. By setting to such a range, moderate flexibility as a resin component can be imparted.
- the ratio (Mw / Mn) of the weight average molecular weight to the number average molecular weight of the phenol resin of the present embodiment can be appropriately set according to the use, for example, 2.5 or less as an upper limit value, Preferably it is 2.2 or less, More preferably, it is 2.0 or less. By setting in this way, it becomes easy to express the properties unique to the metal hybrid resin.
- the lower limit of the ratio (Mw / Mn) of the weight average molecular weight to the number average molecular weight of the phenol resin of the present embodiment is not particularly limited, but is, for example, 1.05 or more.
- the phenol resin used as the raw material and the phenol resin contained as the metal hybrid resin may not have the same molecular weight. is there.
- the molecular weight of the phenol resin used as a raw material should be set so that the phenol resin contained in the metal hybrid resin falls within the above molecular weight range in consideration of the manufacturing conditions. Is a preferred embodiment.
- the phenol resin of the present embodiment is preferably contained in an amount of 10% by mass or more, more preferably 15% by mass or more, and further preferably 20% by mass or more based on the entire metal hybrid resin. Thereby, moderate flexibility as a composite material can be imparted and workability can be improved. Moreover, it is preferable that the phenol resin of this embodiment contains 99 mass% or less with respect to the whole metal hybrid resin, It is more preferable to contain 95 mass% or less, It is further more preferable to contain 90 mass% or less. By doing in this way, the degree of expression of mechanical strength derived from metal particles can be raised.
- the metal hybrid resin of this embodiment includes metal particles composed of metal atoms coordinated to oxygen atoms in the phenol resin. That is, since the metal atoms constituting the metal particles are coordinated to the oxygen atoms in the phenol resin, the adhesion between the metal particles and the phenol resin is further increased as compared with the composite materials that existed in the past. be able to.
- Coordinated to an oxygen atom specifically means that an oxygen atom (referred to herein as “O”) and a metal atom (referred to herein as “M”) are OM bonds. Refers to being chemically linked. More specifically, in the X-ray photoelectron spectroscopy (ESCA (Electron Spectroscopy for Chemical Analysis)), the above-mentioned OM bond is observed when a composite material of metal particles and a resin is analyzed. .
- ESA Electrodectron spectroscopy for Chemical Analysis
- the metal atom which comprises the metal particle contained in the metal hybrid resin of this embodiment can be suitably selected according to the use to which this metal hybrid resin is applied. More specifically, silver (Ag), copper (Cu), zinc (Zn), calcium (Ca), iron (Fe), aluminum (Al), magnesium (Mg), titanium (Ti), scandium (Sc) , Vanadium (V), chromium (Cr), manganese (Mn), cobalt (Co), nickel (Ni), gallium (Ga), strontium (Sr), yttrium (Y), niobium (Nb), molybdenum (Mo) , Ruthenium (Ru), palladium (Pd), cadmium (Cd), barium (Ba), lanthanum (La), cerium (Ce), praseodymium (Pr), neodymium (Nd), promethium (Pm), samarium (Sm) Europium (Eu), gadolinium (Gd), terb
- the metal atoms are silver (Ag), copper (Cu), zinc (Zn), calcium (Ca), iron (Fe) due to the ease of manufacturing the metal hybrid resin and the wide range of application fields. ), Aluminum (Al), magnesium (Mg), and preferably one or more metal atoms.
- the metal particles contained in the metal hybrid resin of the present embodiment are usually mostly “zero-valent” metal atoms, but some metal ions having a cationic property may be mixed.
- the mechanical strength can be improved as the interaction between the metal ions and the phenolic resin may be combined.
- the lower limit value of the average particle diameter of the metal particles according to the present embodiment can be appropriately set according to the application to be used, but is, for example, 1 nm or more, preferably 3 nm or more, more preferably 5 nm or more. . By setting in this way, it becomes easy to express desired mechanical strength.
- the upper limit value of the average particle diameter of the metal particles according to the present embodiment can be appropriately set according to the application to be used, but is, for example, 1 ⁇ m or less, preferably 600 nm or less, more preferably 300 nm or less. More preferably, it is 150 nm or less, still more preferably 100 nm or less, particularly preferably 50 nm or less.
- the particle size of the metal particles in the metal hybrid resin can be determined by observing with a transmission electron microscope (TEM), for example. More specifically, the surface of the metal hybrid resin is observed with a transmission electron microscope (TEM), the particle size of 100 arbitrarily selected metal particles is measured, and the average particle size of the metal particles is obtained as the average value. It can be.
- TEM transmission electron microscope
- the metal particles of the present embodiment are preferably contained in an amount of 1% by mass or more, more preferably 3% by mass or more, and further preferably 5% by mass or more based on the entire metal hybrid resin. Thereby, the performance specific to the metal particles can be expressed. Moreover, it is preferable that the metal particle of this embodiment contains 85 mass% or less with respect to the whole metal hybrid resin, It is more preferable to contain 75 mass% or less, It is further more preferable to contain 65 mass% or less. By doing in this way, the specific gravity as the whole metal hybrid resin can be suppressed, and the range of application can be expanded.
- the metal hybrid resin according to the present embodiment can be blended with a known resin material for the purpose of modifying the characteristics of the resin in addition to the above-described phenol resin.
- various additives used in ordinary metal resin composite materials for example, release agents such as stearic acid, calcium stearate or polyethylene, flame retardants such as calcium hydroxide, and colorants such as carbon black A coupling agent, a solvent, or the like may be blended.
- the specific gravity of the metal hybrid resin according to the present embodiment can be set as appropriate depending on the intended use.
- the lower limit of the specific gravity is, for example, 1.25 g / cm 3 or more, and preferably 1.27 g / cm 3. Or more, and more preferably 1.30 g / cm 3 or more.
- the specific gravity of the metal hybrid resin according to the present embodiment can be appropriately set depending on the application to be used, the upper limit of this specific gravity, for example 16.6 g / cm 3 or less, preferably 16.0 g / cm 3 or less More preferably, it is 15.5 g / cm 3 or less.
- the manufacturing method of the metal hybrid resin of this embodiment includes the following steps. (A) (A) Step of preparing phenol resin (b) Step of preparing (B ′) metal salt solution (c) Mixing (A) phenol resin and (B ′) metal salt solution, Step of obtaining metal hybrid resin by coordinating metal atom to oxygen atom in (A) phenol resin Each step will be described below.
- a solution of (B ′) metal salt is prepared.
- the solution of (B ′) metal salt is formed on the metal atoms constituting “(B) metal particles composed of metal atoms coordinated to oxygen atoms in the phenol resin” described above. It can be prepared using the corresponding salt.
- silver (Ag), copper (Cu), zinc (Zn), calcium (Ca), iron (Fe), aluminum from the ease of production of metal hybrid resins and the wide range of application fields. It is preferable to use a metal salt corresponding to one or more metal atoms selected from the group consisting of Al) and magnesium (Mg).
- a metal salt is comprised by the cation (cation) and anion (anion) of said metal atom.
- anions include halogen ions such as chlorine ion, bromine ion and iodine ion; carboxylate ions such as acetate ion, oxalate ion and fumarate ion; p-toluenesulfonate ion, methanesulfonate ion, butanesulfonate ion, Examples thereof include sulfonate ions such as benzenesulfonate ion; sulfate ion; perchlorate ion; carbonate ion; nitrate ion.
- the metal particles constituting the metal hybrid resin of the present embodiment are silver, that is, silver particles will be described as an example.
- a salt is prepared by combining silver ions with the above anions, and a solution is prepared therefrom.
- nitrate ion it is preferable to use nitrate ion as an anion and to use silver nitrate as a metal salt because of its high solubility in a solvent.
- an appropriate metal salt may be selected in consideration of the solubility of the metal salt as appropriate.
- copper copper sulfate, copper nitrate, etc.
- zinc zinc as a metal atom
- zinc chloride, zinc sulfate, zinc nitrate when using calcium as a metal atom, calcium chloride, calcium nitrate, iron are used.
- metal chloride, iron sulfate, iron nitrate when used as a metal atom, aluminum is used as a metal atom, aluminum nitrate can be used, and when magnesium is used as a metal atom, magnesium chloride, magnesium sulfate, magnesium nitrate, or the like can be used.
- the metal valence of the metal salt may be appropriately selected in consideration of solubility in a solvent, ease of reduction, and the like.
- a metal salt solution is prepared, and a solvent for dissolving the metal salt may be appropriately selected according to the characteristics of the metal salt.
- a solvent for dissolving the metal salt may be appropriately selected according to the characteristics of the metal salt.
- water can be selected as the solvent.
- organic solvents other than water can be employed as the solvent, for example, alcohol solvents such as methanol, ethanol, propanol, butanol, pentanol, hexanol, and ethylene glycol; ketones such as acetone, methyl ethyl ketone, and methyl isobutyl ketone Solvents: ether solvents such as dimethyl ether, diethyl ether, methyl ethyl ether, dipropyl ether, tetrahydrofuran, etc., cellosolves such as methyl cellosolve, ethyl cellosolve, butyl cellosolve, methyl cellosolve acetate, ethyl cellosolve acetate; N-methyl-2-pyrrolidone And amide solvents such as N, N-dimethylformamide; dimethyl carbonate and the like can be used.
- alcohol solvents such as methanol, ethanol, propanol, butanol
- organic solvents may be used alone or in combination. Moreover, when these organic solvents are miscible with water, they can be used by appropriately mixing with water. Moreover, the solution of the metal salt of this embodiment can also adjust the pH of a solution for the purpose of improving the solubility of a metal salt.
- the concentration of the metal salt in the metal salt solution of the present embodiment is, for example, 1% or more, preferably 3% or more, and more preferably 5% or more.
- the concentration of the metal salt in the metal salt solution is, for example, 20% or less, preferably 15% or less, and more preferably 12% or less. By setting to such a range, it is possible to stably convert from a metal salt to desired metal particles.
- the concentration of the metal salt is defined as a ratio of the mass of the dissolved metal salt to the mass of the entire solution.
- Step (c) In this step, a phenol resin and a metal salt solution are mixed, and metal atoms are coordinated to oxygen atoms in the phenol resin to obtain a metal hybrid resin. Specifically, the above-described phenol resin and a metal salt solution are mixed, and a reduction reaction is performed on the metal salt to form metal particles from the metal salt (that is, “zero-valent” metal Precipitate as particles) to obtain a metal hybrid resin.
- a reduction reaction is performed on the above-described metal salt.
- This reduction reaction can be performed using a known reducing agent, or can be performed utilizing a reducing functional group resulting from the structure of the phenol resin.
- a phenol resin having an aldehyde group in the molecule can be employed as the phenol resin.
- the aldehyde group in the molecule brings about a reducing action on the metal cation constituting the metal salt and can be converted into metal particles.
- a phenol resin having an aldehyde group in the molecule for example, 0.1 times or more of the phenol resin can be used, preferably 0.5 times the mass of the metal salt contained in the solution.
- An amount of phenol resin can be used, and more preferably twice as much phenol resin can be used.
- the upper limit of the amount of phenol resin to be used is not specifically limited, For example, it is 100 times or less.
- the reducing agent other than the phenol resin having an aldehyde group in the molecule known ones can be employed, for example, sodium hypophosphite, dimethylamine borane, sodium borohydride, potassium borohydride, An inorganic or organic reducing agent such as formaldehyde, hydrazine, or ascorbic acid can be used.
- the amount of the reducing agent used can be set as appropriate depending on the type of the reducing agent, and it is sufficient to set an amount sufficient to deposit a sufficient amount of metal particles.
- a reducing adjuvant in order to accelerate
- amine compounds and alcohols can also be used as reducing aids. More specifically, ammonia, ethylamine, diethylamine, triethylamine, propylamine, dipropylamine, tripropylamine, isopropyldiethylamine, diethanolamine, triethanolamine, morpholine, ethylenediamine, pyridine, or the like is used as a reducing auxiliary agent as an amine compound. Can do. Moreover, as alcohols, ethoxyethanol, ethylene glycol, diethylene glycol, etc. can be used as a reduction aid.
- this process can also be performed by heating after mixing various raw materials.
- the lower limit of the temperature condition when performing this heating is, for example, 30 ° C. or higher, preferably 40 ° C. or higher, and more preferably 45 ° C. or higher.
- the upper limit of temperature conditions is 100 degrees C or less, for example, Preferably it is 90 degrees C or less, More preferably, it is 80 degrees C or less.
- the reaction time may be appropriately set while observing the degree of change of the mixed raw materials, but the lower limit of the reaction time is, for example, 10 minutes or more, preferably 30 minutes or more, more preferably 1 hour or more. is there. Moreover, the upper limit of reaction time is 24 hours or less, for example, Preferably it is 12 hours or less, More preferably, it is 8 hours or less.
- the metal hybrid resin according to the present embodiment is expected to be used in a wide range of applications because the metal particles are uniformly dispersed in the resin and can exhibit high mechanical strength.
- it is expected that it can be used as a conductive material by paying attention to the conductivity, and can also be used as a heat dissipation material, paying attention to thermal conductivity.
- application as an electronic member in ceramic capacitors, power inductors, etc. application as automotive parts such as tire bead parts, application as friction materials and abrasives, bond magnets, building materials, structural materials, Expected to be used as sports equipment and soundproofing materials.
- the number average molecular weight (Mn), the weight average molecular weight (Mw), and the ratio of the weight average molecular weight to the number average molecular weight (Mw / Mn) are as follows.
- the number average molecular weight and the weight average molecular weight are measured by GPC (Gel Permeation Chromatography) using TSK-GEL G1000H, G2000H, G3000H as column types and tetrahydrofuran as a mobile phase. went.
- monodisperse polystyrene was used as a standard substance.
- the same operation is repeated to sequentially obtain the phenol resin 1, and a metal resin composite material is produced using this.
- Example 1 A four-neck 1 L flask equipped with a stirring blade, a thermometer, a dropping funnel, and a condenser was prepared. In this flask, 30.0 g of the phenol resin 1 obtained above and sodium hydroxide 4 with respect to 300 g of water. An aqueous solution of sodium hydroxide in which 0.6 g (0.11 mol) was dissolved, 6.0 g (0.05 mol) of thiodiethanol, and 31.6 g (0.03 mol) of 1N silver nitrate were charged. After stirring and dissolving them uniformly, the temperature was raised until the internal temperature reached 50 ° C., and the reaction was carried out for 2 hours while maintaining the temperature from the time when the internal temperature reached 50 ° C.
- the obtained solid was dried, and the molecular weight of the portion soluble in tetrahydrofuran was measured by GPC.
- the number average molecular weight (Mn), the weight average molecular weight (Mw), and the ratio of the weight average molecular weight to the number average molecular weight (Mw / Mn) are as follows.
- the metal resin composite material obtained in Example 1 was measured with an X-ray photoelectron spectrometer Escalab-220iXL manufactured by Thermo Fisher Scientific Co., Ltd.
- the measurement conditions are as follows. ⁇ Irradiated X-ray: Monochrome AlK ⁇ ⁇ Detection depth: about 5nm ⁇ X-ray spot diameter: about 1mm
- FIG. 2 shows a chart of an Ag3d narrow scan spectrum measured for a sample obtained by cleaning an Ag foil with Ar ions.
- the peak position of the Ag3d narrow scan spectrum is 368.9 eV
- the peak position is 368.3 eV. Differences were observed.
- the peak of Ag alone is observed around 368.1 to 368.3 eV, whereas in a compound in which an Ag atom and an O atom interact, such as silver acetate, this peak is 368.3 to Shift to 368.9 eV (Source: Handbook of X-ray Photoelectron Spectroscopy (Physical Electronics)). This confirms that the metal resin composite material obtained in Example 1 has an Ag—O bond in its chemical structure.
- the surface of the composite material obtained in Example 1 was observed with a transmission electron microscope (TEM). The result is shown in FIG. As shown in FIG. 3, the metal resin composite material obtained in Example 1 uniformly contained silver particles on the order of several tens of nm (average particle diameter: 13 nm).
- Example 2 A four-neck 1 L flask equipped with a stirring blade, a thermometer, a dropping funnel, and a condenser was prepared. In this flask, 30.0 g of the phenol resin 1 obtained above was hydroxylated with respect to 300.0 g of water. An aqueous sodium hydroxide solution in which 4.6 g (0.11 mol) of sodium was dissolved, 6.0 g (0.05 mol) of thiodiethanol, and 15.8 g (0.015 mol) of 1N silver nitrate were charged. After stirring and dissolving them uniformly, the temperature was raised until the internal temperature reached 50 ° C., and the reaction was carried out for 2 hours while maintaining the temperature from the time when the internal temperature reached 50 ° C.
- Example 3 A four-neck 1 L flask equipped with a stirring blade, a thermometer, a dropping funnel, and a condenser was prepared. In this flask, 30.0 g of the phenol resin 1 obtained above and sodium hydroxide 4 with respect to 300 g of water. An aqueous solution of sodium hydroxide in which 0.6 g (0.11 mol) was dissolved, 6.0 g (0.05 mol) of thiodiethanol, and 31.6 g (0.03 mol) of 1N silver nitrate were charged. After stirring and dissolving them uniformly, the temperature was raised until the internal temperature reached 30 ° C., and the reaction was carried out for 24 hours while maintaining the temperature from the time when the internal temperature reached 30 ° C.
- the metal resin composite materials obtained in Examples 1 to 3 and Comparative Examples 1 and 2 were evaluated based on the following.
- the specific gravity of the metal resin composite material of each example and the metal resin composite material of each comparative example does not differ greatly, it can be said that the content of silver particles in the composite material is almost the same level.
- the bending strengths of the examples and the comparative examples are compared, a remarkable difference is observed in these strengths.
- the metal-resin composite material (metal hybrid resin) of the present invention has a metal and a resin bonded through a chemical bond, so that it exhibits appropriate adhesion and can thus achieve high mechanical strength. It is to support.
- the metal hybrid resin according to the present invention is expected to be used in a wide range of applications because the metal particles are uniformly dispersed in the resin and can exhibit high mechanical strength. In addition, it is expected that it can be used as a conductive material by paying attention to the conductivity, and can also be used as a heat dissipation material, paying attention to thermal conductivity.
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Abstract
Description
本発明は、メタルハイブリッドレジンおよびその製造方法に関する。 The present invention relates to a metal hybrid resin and a manufacturing method thereof.
従来、金属粒子を樹脂材料に対して配合することで、金属粒子特有の性質を樹脂材料に付与する試みがなされている。この金属粒子特有の性質とは、たとえば、導電性や、あるいは、機械的強度の高さ等が挙げられる。 Conventionally, attempts have been made to impart properties unique to metal particles to resin materials by blending metal particles with resin materials. Examples of the properties unique to the metal particles include conductivity and high mechanical strength.
これに関する技術として、特許文献1や特許文献2に開示された技術が知られている。
特許文献1には、一次粒径が1~300nmの導電性粒子、硬化性樹脂、分散剤及び溶媒を含む印刷用接着層形成インクを調製し、これを基板上に印刷し、硬化することで複合層における接着剤層を形成する技術が開示されている。係る技術によれば、基板と配線層との接着性を向上させ、接続抵抗を低くすることができるとされている。
As techniques relating to this, techniques disclosed in Patent Document 1 and Patent Document 2 are known.
In Patent Document 1, a printing adhesive layer forming ink containing conductive particles having a primary particle diameter of 1 to 300 nm, a curable resin, a dispersant, and a solvent is prepared, printed on a substrate, and cured. A technique for forming an adhesive layer in a composite layer is disclosed. According to such a technique, it is said that the adhesion between the substrate and the wiring layer can be improved and the connection resistance can be lowered.
また、特許文献2には、分散媒及び金属酸化物を含む無機粒子を含有する導体層形成用組成物と、バインダ材及び数平均粒子径が1nm~3000nmである導電性粒子を含有する導電性接着剤組成物と、を含む組成物セットが開示されており、係る導電性接着剤組成物によれば表面に導電性のある基板と金属含有粒子分散液から形成される導体層との高接着性を発現し、導体層と基板との導通が確保できるとされている。 Patent Document 2 discloses a conductive layer-forming composition containing inorganic particles including a dispersion medium and a metal oxide, a binder material, and conductive particles containing conductive particles having a number average particle diameter of 1 nm to 3000 nm. A composition set comprising an adhesive composition is disclosed, and according to such a conductive adhesive composition, high adhesion between a conductive substrate and a conductor layer formed from a metal-containing particle dispersion is provided on the surface. It is said that the continuity between the conductor layer and the substrate can be secured.
しかしながら、本発明者らが検討した結果、以下のような課題があることが分かってきた。
すなわち、特許文献1や特許文献2に記載の技術においては、金属粒子と樹脂材料とを配合することこそなされているが、無機材料である金属粒子と有機材料である樹脂材料とでは、各々の持つ性質が乖離しており、金属粒子の分散性の面で課題を残していた。
ここで、分散性が不十分であると、たとえば金属粒子と樹脂材料との複合材料に外部から機械的な力を掛けた時に、金属粒子と樹脂材料との界面から亀裂が発生するという懸念がある。
However, as a result of studies by the present inventors, it has been found that there are the following problems.
That is, in the techniques described in Patent Document 1 and Patent Document 2, the metal particles and the resin material are blended. In the metal particles that are inorganic materials and the resin material that is organic materials, The properties possessed were different, leaving problems in terms of dispersibility of metal particles.
Here, if the dispersibility is insufficient, for example, when a mechanical force is applied to the composite material of the metal particles and the resin material from the outside, there is a concern that cracks may occur from the interface between the metal particles and the resin material. is there.
本発明は、上記のような課題に鑑みてなされたものであり、金属粒子が樹脂に対して均一に分散され、高い機械的強度を発現することのできる金属樹脂複合材料を提供する。 The present invention has been made in view of the above problems, and provides a metal resin composite material in which metal particles are uniformly dispersed in a resin and can exhibit high mechanical strength.
本発明によれば、
(A)フェノール樹脂と、
(B)前記フェノール樹脂中の酸素原子に配位した金属原子により構成される金属粒子と、を含むメタルハイブリッドレジンが提供される。
According to the present invention,
(A) a phenolic resin;
(B) A metal hybrid resin comprising metal particles composed of metal atoms coordinated to oxygen atoms in the phenol resin is provided.
また、本発明によれば、
(a)(A)フェノール樹脂を準備する工程と、
(b)(B')金属塩の溶液を準備する工程と、
(c)前記(A)フェノール樹脂と、前記(B')金属塩の溶液とを混合し、金属原子を前記(A)フェノール樹脂中の酸素原子に配位させて、メタルハイブリッドレジンを得る工程と、
を含むメタルハイブリッドレジンの製造方法が提供される。
Moreover, according to the present invention,
(A) (A) a step of preparing a phenol resin;
(B) (B ′) preparing a metal salt solution;
(C) A step of mixing the (A) phenol resin and the (B ′) metal salt solution to coordinate a metal atom to an oxygen atom in the (A) phenol resin to obtain a metal hybrid resin. When,
A method for producing a metal hybrid resin containing
本発明はフェノール樹脂と、金属粒子とを含む複合材料であり、金属粒子を構成する金属原子がフェノール樹脂中の酸素原子に配位していることを特徴とする。
これにより、金属粒子と樹脂とを化学的結合を介して結合させることができ、金属粒子を樹脂に対して均一に分散することができ、また、高い機械的強度を発現することができる。
なお、「メタルハイブリッドレジン」の名称については、本発明者らが命名したものであり、上述のような金属粒子と樹脂材料とが配位結合を介して結合した新規な金属樹脂複合材料を指すものである。
The present invention is a composite material including a phenol resin and metal particles, wherein a metal atom constituting the metal particle is coordinated to an oxygen atom in the phenol resin.
As a result, the metal particles and the resin can be bonded through a chemical bond, the metal particles can be uniformly dispersed in the resin, and high mechanical strength can be expressed.
The name of the “metal hybrid resin” is the name of the present inventors and refers to a novel metal resin composite material in which the metal particles and the resin material as described above are bonded through a coordinate bond. Is.
上述した目的、およびその他の目的、特徴および利点は、以下に述べる好適な実施の形態、およびそれに付随する以下の図面によってさらに明らかになる。 The above-described object and other objects, features, and advantages will be further clarified by a preferred embodiment described below and the following drawings attached thereto.
以下、本発明について、実施の形態に基づいて詳しく説明する。なお、本明細書中において「~」は特に断りがなければ以上から以下を表す。 Hereinafter, the present invention will be described in detail based on embodiments. In the present specification, “˜” represents the following from the above unless otherwise specified.
[メタルハイブリッドレジン]
まず、本実施形態に係るメタルハイブリッドレジンについて説明する。
本実施形態のメタルハイブリッドレジンは以下の成分(A)、(B)を含むものである。
(A)フェノール樹脂
(B)フェノール樹脂中の酸素原子に配位した金属原子により構成される金属粒子
[Metal hybrid resin]
First, the metal hybrid resin according to the present embodiment will be described.
The metal hybrid resin of this embodiment contains the following components (A) and (B).
(A) Phenolic resin (B) Metal particles composed of metal atoms coordinated to oxygen atoms in the phenolic resin
((A)フェノール樹脂)
本実施形態のメタルハイブリッドレジンに用いるフェノール樹脂は、用途等を鑑み、公知のフェノール樹脂の中から適宜選択すればよい。
このフェノール樹脂としては、たとえばノボラック型フェノール樹脂、レゾール型フェノール樹脂、アリールアルキレン型フェノール樹脂等を用いることができる。
((A) Phenolic resin)
What is necessary is just to select suitably the phenol resin used for the metal hybrid resin of this embodiment from well-known phenol resins in view of a use etc.
As this phenol resin, for example, a novolak type phenol resin, a resol type phenol resin, an aryl alkylene type phenol resin, or the like can be used.
ノボラック型フェノール樹脂は、例えば、フェノール類とアルデヒド類とを酸性触媒のもとで反応させることにより得ることができる。 The novolac-type phenol resin can be obtained, for example, by reacting phenols and aldehydes under an acidic catalyst.
ノボラック型フェノール樹脂を製造する際に用いるフェノール類としては、例えば、フェノール、クレゾール、キシレノール、エチルフェノール、p-フェニルフェノール、p-tert-ブチルフェノール、p-tert-アミルフェノール、p-オクチルフェノール、p-ノニルフェノール、p-クミルフェノール、ビスフェノールA、ビスフェノールF、レゾルシノール、2-ヒドロキシベンズアルデヒド、3-ヒドロキシベンズアルデヒド、4-ヒドロキシベンズアルデヒドまたはこれらの誘導体などが挙げられる。なお、これらフェノール類を単独または2種類以上併用して用いることもできる。 Examples of the phenols used in producing the novolak type phenol resin include phenol, cresol, xylenol, ethylphenol, p-phenylphenol, p-tert-butylphenol, p-tert-amylphenol, p-octylphenol, p- Nonylphenol, p-cumylphenol, bisphenol A, bisphenol F, resorcinol, 2-hydroxybenzaldehyde, 3-hydroxybenzaldehyde, 4-hydroxybenzaldehyde or derivatives thereof may be mentioned. In addition, these phenols can also be used individually or in combination of 2 or more types.
また、ノボラック型フェノール樹脂の製造に用いるアルデヒド類としては、例えば、ホルムアルデヒド、アセトアルデヒド、プロピルアルデヒド、ブチルアルデヒド等のアルキルアルデヒド、ベンズアルデヒド等の芳香族アルデヒド、2-ヒドロキシベンズアルデヒド、3-ヒドロキシベンズアルデヒド、4-ヒドロキシベンズアルデヒド等の水酸基フェノールを有する芳香族アルデヒド等が挙げられる。ホルムアルデヒド源としては、ホルマリン(水溶液)、パラホルムアルデヒド、アルコール類とのヘミホルマール、トリオキサン等が挙げられる。なお、これらアルデヒド類を単独または2種類以上併用して用いてもよい。 Examples of aldehydes used in the production of novolak type phenol resins include alkyl aldehydes such as formaldehyde, acetaldehyde, propyl aldehyde, and butyraldehyde, aromatic aldehydes such as benzaldehyde, 2-hydroxybenzaldehyde, 3-hydroxybenzaldehyde, 4- And aromatic aldehydes having a hydroxyl phenol such as hydroxybenzaldehyde. Examples of the formaldehyde source include formalin (aqueous solution), paraformaldehyde, hemi-formal with alcohols, and trioxane. In addition, you may use these aldehydes individually or in combination of 2 or more types.
ノボラック型フェノール樹脂を合成する際、フェノール類とアルデヒド類との反応モル比率は、通常、フェノール類1モルに対して、アルデヒド類が0.3~1.7モルであり、好ましくは0.5~1.5モルである。 When synthesizing a novolac type phenol resin, the reaction molar ratio of phenols to aldehydes is usually 0.3 to 1.7 mol of aldehydes with respect to 1 mol of phenols, preferably 0.5 ~ 1.5 moles.
また、ノボラック型フェノール樹脂の製造に用いる酸性触媒としては、例えば、蓚酸、酢酸等の有機カルボン酸、ベンゼンスルホン酸、パラトルエンスルホン酸、メタンスルホン酸等の有機スルホン酸、1-ヒドロキシエチリデン-1,1'-ジホスホン酸、2-ホスホノブタン-1,2,4-トリカルボン酸等の有機ホスホン酸、塩酸、硫酸、リン酸等の無機酸等が挙げられる。なお、これらの酸性触媒を単独、または2種類以上併用して使用してもよい。 Examples of the acidic catalyst used for the production of the novolak type phenol resin include organic carboxylic acids such as oxalic acid and acetic acid, organic sulfonic acids such as benzenesulfonic acid, paratoluenesulfonic acid and methanesulfonic acid, and 1-hydroxyethylidene-1 Organic phosphonic acids such as 1,1'-diphosphonic acid and 2-phosphonobutane-1,2,4-tricarboxylic acid, and inorganic acids such as hydrochloric acid, sulfuric acid and phosphoric acid. In addition, you may use these acidic catalysts individually or in combination of 2 or more types.
レゾール型フェノール樹脂は、例えば、フェノール類とアルデヒド類をアルカリ金属やアミン類、二価金属塩などの触媒の存在下で反応させることによって得ることができる。 The resol type phenol resin can be obtained, for example, by reacting phenols and aldehydes in the presence of a catalyst such as an alkali metal, an amine, or a divalent metal salt.
レゾール型フェノール樹脂の製造に用いるフェノール類としては、例えば、フェノール、o-クレゾール、m-クレゾール、p-クレゾール等のクレゾール類、2,3-キシレノール、2,4-キシレノール、2,5-キシレノール、2,6-キシレノール、3,4-キシレノール、3,5-キシレノール等のキシレノール類、o-エチルフェノール、m-エチルフェノール、p-エチルフェノール等のエチルフェノール類、イソプロピルフェノール、ブチルフェノール、p-tert-ブチルフェノール等のブチルフェノール類、p-tert-アミルフェノール、p-オクチルフェノール、p-ノニルフェノール、p-クミルフェノール等のアルキルフェノール類、フルオロフェノール、クロロフェノール、ブロモフェノール、ヨードフェノール等のハロゲン化フェノール類、p-フェニルフェノール、アミノフェノール、ニトロフェノール、ジニトロフェノール、トリニトロフェノール等の1価フェノール置換体、及び、1-ナフトール、2-ナフトール等の1価のフェノール類、レゾルシン、アルキルレゾルシン、ピロガロール、カテコール、アルキルカテコール、ハイドロキノン、アルキルハイドロキノン、フロログルシン、ビスフェノールA、ビスフェノールF、ビスフェノールS、ジヒドロキシナフタリン等の多価フェノール類、2-ヒドロキシベンズアルデヒド、3-ヒドロキシベンズアルデヒド、4-ヒドロキシベンズアルデヒドなどのアルデヒド基を有するフェノール類またはこれらの誘導体等が挙げられる。なお、これらフェノール類を単独あるいは2種以上を混合して使用してもよい。 Examples of the phenols used for the production of the resol type phenol resin include cresols such as phenol, o-cresol, m-cresol, p-cresol, 2,3-xylenol, 2,4-xylenol, and 2,5-xylenol. Xylenols such as 2,6-xylenol, 3,4-xylenol and 3,5-xylenol, ethylphenols such as o-ethylphenol, m-ethylphenol and p-ethylphenol, isopropylphenol, butylphenol, p- Butylphenols such as tert-butylphenol, p-tert-amylphenol, p-octylphenol, p-nonylphenol, alkylphenols such as p-cumylphenol, fluorophenol, chlorophenol, bromophenol, iodo Halogenated phenols such as enol, monovalent phenol substitutes such as p-phenylphenol, aminophenol, nitrophenol, dinitrophenol and trinitrophenol, and monovalent phenols such as 1-naphthol and 2-naphthol, Resorcin, alkylresorcin, pyrogallol, catechol, alkylcatechol, hydroquinone, alkylhydroquinone, phloroglucin, polyphenols such as bisphenol A, bisphenol F, bisphenol S, dihydroxynaphthalene, 2-hydroxybenzaldehyde, 3-hydroxybenzaldehyde, 4-hydroxy Examples thereof include phenols having an aldehyde group such as benzaldehyde or derivatives thereof. In addition, you may use these phenols individually or in mixture of 2 or more types.
また、レゾール型フェノール樹脂の製造に用いるアルデヒド類としては、例えば、ホルムアルデヒド、パラホルムアルデヒド、トリオキサン、アセトアルデヒド、プロピオンアルデヒド、ポリオキシメチレン、クロラール、ヘキサメチレンテトラミン、フルフラール、グリオキザール、n-ブチルアルデヒド、カプロアルデヒド、アリルアルデヒド、ベンズアルデヒド、クロトンアルデヒド、アクロレイン、テトラオキシメチレン、フェニルアセトアルデヒド、o-トルアルデヒド、2-ヒドロキシベンズアルデヒド、3-ヒドロキシベンズアルデヒド、4-ヒドロキシベンズアルデヒド等が挙げられる。これらアルデヒド類を、単独または2種類以上組み合わせて使用してもよい。なお、これらのアルデヒド類の中でも、反応性が優れ、安価であるという観点から、ホルムアルデヒド、パラホルムアルデヒドを選択して用いることが好ましい。 Examples of aldehydes used in the production of resol type phenol resins include formaldehyde, paraformaldehyde, trioxane, acetaldehyde, propionaldehyde, polyoxymethylene, chloral, hexamethylenetetramine, furfural, glyoxal, n-butyraldehyde, capro Examples include aldehyde, allyl aldehyde, benzaldehyde, crotonaldehyde, acrolein, tetraoxymethylene, phenylacetaldehyde, o-tolualdehyde, 2-hydroxybenzaldehyde, 3-hydroxybenzaldehyde, 4-hydroxybenzaldehyde and the like. These aldehydes may be used alone or in combination of two or more. Of these aldehydes, formaldehyde and paraformaldehyde are preferably selected and used from the viewpoint of excellent reactivity and low cost.
また、レゾール型フェノール樹脂の製造に用いる触媒としては、例えば、水酸化ナトリウム、水酸化リチウム、水酸化カリウムなどのアルカリ金属の水酸化物、カルシウム、マグネシウム、バリウムなどアルカリ土類金属の酸化物及び水酸化物、炭酸ナトリウム、アンモニア水、トリエチルアミン、ヘキサメチレンテトラミンなどのアミン類、酢酸マグネシウムや酢酸亜鉛などの二価金属塩などが挙げられる。これら触媒は、単独または2種類以上併用してもよい。 Examples of the catalyst used in the production of the resol type phenolic resin include alkali metal hydroxides such as sodium hydroxide, lithium hydroxide and potassium hydroxide, alkaline earth metal oxides such as calcium, magnesium and barium, and the like. Examples thereof include hydroxides, sodium carbonate, aqueous ammonia, amines such as triethylamine and hexamethylenetetramine, and divalent metal salts such as magnesium acetate and zinc acetate. These catalysts may be used alone or in combination of two or more.
なお、レゾール型フェノール樹脂を製造する際、フェノール類とアルデヒド類との反応モル比としては、好ましくはフェノール類1モルに対して、アルデヒド類0.80~2.50モルであり、さらに好ましくは、アルデヒド類1.00~2.30モルである。 When producing a resol-type phenol resin, the reaction molar ratio of phenols to aldehydes is preferably 0.80 to 2.50 moles of aldehydes per mole of phenols, more preferably Aldehydes are 1.00 to 2.30 mol.
アリールアルキレン型フェノール樹脂は、繰り返し単位中に一つ以上のアリールアルキレン基を有するフェノール樹脂を示す。このようなアリールアルキレン型フェノール樹脂としては、例えば、キシリレン型フェノール樹脂、ビフェニルジメチレン型フェノール樹脂等が挙げられる。
このようなアリールアルキレン型フェノール樹脂の製造方法は公知の方法に従って行うことができ、原料として先述したようなフェノール類を用いればよい。
An arylalkylene type phenol resin refers to a phenol resin having one or more arylalkylene groups in a repeating unit. Examples of such aryl alkylene type phenol resins include xylylene type phenol resins and biphenyl dimethylene type phenol resins.
Such an arylalkylene type phenol resin can be produced according to a known method, and the above-described phenols may be used as a raw material.
本実施形態のメタルハイブリッドレジンは、後述する金属粒子を構成する金属原子がフェノール樹脂中の酸素原子に配位しているという特徴を備えるものである。ここで、配位する酸素原子はフェノール樹脂の備えるフェノール性水酸基に限定されず、これ以外の官能基に由来する酸素原子であってもよく、このように種々の官能基に由来する酸素原子と金属粒子とが相互作用を起こすことで、より金属粒子とフェノール樹脂との密着性を高めることができる。 The metal hybrid resin of this embodiment has a feature that metal atoms constituting metal particles described later are coordinated to oxygen atoms in the phenol resin. Here, the coordinated oxygen atom is not limited to the phenolic hydroxyl group provided in the phenol resin, and may be an oxygen atom derived from a functional group other than this, and thus oxygen atoms derived from various functional groups and By causing the metal particles to interact, the adhesion between the metal particles and the phenol resin can be further increased.
より具体的には、フェノール樹脂として、分子内に脂肪族アルコール基を有するフェノール樹脂、分子内にエーテル基を有するフェノール樹脂、分子内にケトン基を有するフェノール樹脂、分子内にアルデヒド基を有するフェノール樹脂、分子内にカルボキシル基を有するフェノール樹脂、分子内にエステル基を有するフェノール樹脂、分子内にウレタン基を有するフェノール樹脂を用いることが好ましい。
これらの中でも、分子内にケトン基やアルデヒド基、カルボキシル基、エステル基、ウレタン基のようなカルボニル部位(カルボニル基)を有するフェノール樹脂を用いることが好ましい。
このようにすることで、金属原子はフェノール樹脂中のフェノール性水酸基の酸素原子のみならず部分的にカルボニル基の酸素原子に配位することが可能となる。これにより、よりいっそう金属原子とフェノール樹脂との密着性を高めることができる。
なお、このような分子内にカルボニル基を有するフェノール樹脂を製造する際は、先に列挙したフェノール類について、対応する官能基を分子内に有したものを原料として用いればよい。
More specifically, the phenol resin includes a phenol resin having an aliphatic alcohol group in the molecule, a phenol resin having an ether group in the molecule, a phenol resin having a ketone group in the molecule, and a phenol having an aldehyde group in the molecule. It is preferable to use a resin, a phenol resin having a carboxyl group in the molecule, a phenol resin having an ester group in the molecule, and a phenol resin having a urethane group in the molecule.
Among these, it is preferable to use a phenol resin having a carbonyl moiety (carbonyl group) such as a ketone group, an aldehyde group, a carboxyl group, an ester group, or a urethane group in the molecule.
By doing in this way, it becomes possible to coordinate a metal atom not only to the oxygen atom of the phenolic hydroxyl group in the phenol resin but also partially to the oxygen atom of the carbonyl group. Thereby, the adhesiveness of a metal atom and a phenol resin can be improved further.
In addition, when manufacturing the phenol resin which has a carbonyl group in such a molecule | numerator, what has the corresponding functional group in the molecule | numerator about the phenols enumerated above should just be used as a raw material.
また、分子内にアルデヒド基を有するフェノール樹脂を用いた場合は、メタルハイブリッドレジンの製造が容易になるという利点もある。
すなわち、後述するように、本実施形態におけるメタルハイブリッドレジンは、金属塩の溶液とフェノール樹脂とを混合し、フェノール樹脂中の酸素原子に金属原子を配位させるものであるが、分子内にアルデヒド基を有するフェノール樹脂をメタルハイブリッドレジンの原料として用いた場合は、このアルデヒド基が金属塩を構成する金属カチオンに対して還元作用をもたらす。また、この条件を採用することにより、金属原子をフェノール樹脂中の酸素原子に配位させやすくなるという利点がある。
In addition, when a phenol resin having an aldehyde group in the molecule is used, there is an advantage that the production of the metal hybrid resin is facilitated.
That is, as will be described later, the metal hybrid resin in the present embodiment is a mixture of a metal salt solution and a phenol resin, and coordinates a metal atom to an oxygen atom in the phenol resin. When a phenol resin having a group is used as a raw material for the metal hybrid resin, the aldehyde group brings about a reducing action on the metal cation constituting the metal salt. In addition, by adopting this condition, there is an advantage that the metal atom can be easily coordinated to the oxygen atom in the phenol resin.
このような分子内にアルデヒド基を有するフェノール樹脂は、たとえば、フェノール樹脂を製造する際に用いるフェノール類として、たとえば、2-ヒドロキシベンズアルデヒド、3-ヒドロキシベンズアルデヒド、4-ヒドロキシベンズアルデヒドのようなヒドロキシベンズアルデヒドやその誘導体を用いればよい。
このフェノール類に対して、フェノール樹脂の公知の製造方法に従って、変換反応を行うことにより、所望のフェノール樹脂を作製することができる。
Such a phenol resin having an aldehyde group in the molecule is, for example, a phenol used for producing the phenol resin, for example, hydroxybenzaldehyde such as 2-hydroxybenzaldehyde, 3-hydroxybenzaldehyde, 4-hydroxybenzaldehyde, A derivative thereof may be used.
A desired phenol resin can be produced by performing a conversion reaction on this phenol according to a known production method of a phenol resin.
本実施形態のフェノール樹脂の数平均分子量(Mn)は、メタルハイブリッドレジンを適用する用途に合わせて適宜設定することができるが、たとえば150以上であり、好ましくは200以上であり、より好ましくは250以上である。
また、本実施形態のフェノール樹脂の数平均分子量(Mn)は、たとえば1500以下であり、好ましくは1200以下であり、より好ましくは1000以下である。
このような範囲に設定することで、樹脂成分としての適度な柔軟性を付与することができる。
The number average molecular weight (Mn) of the phenol resin of the present embodiment can be appropriately set according to the application to which the metal hybrid resin is applied, but is, for example, 150 or more, preferably 200 or more, more preferably 250. That's it.
Moreover, the number average molecular weight (Mn) of the phenol resin of this embodiment is 1500 or less, for example, Preferably it is 1200 or less, More preferably, it is 1000 or less.
By setting to such a range, moderate flexibility as a resin component can be imparted.
本実施形態のフェノール樹脂の重量平均分子量(Mw)は、メタルハイブリッドレジンを適用する用途に合わせて適宜設定することができるが、たとえば200以上であり、好ましくは300以上であり、より好ましくは400以上である。
また、本実施形態のフェノール樹脂の重量平均分子量(Mw)は、たとえば2500以下であり、好ましくは2000以下であり、より好ましくは1800以下である。
このような範囲に設定することで、樹脂成分としての適度な柔軟性を付与することができる。
Although the weight average molecular weight (Mw) of the phenol resin of this embodiment can be suitably set according to the use which applies a metal hybrid resin, it is 200 or more, for example, Preferably it is 300 or more, More preferably, it is 400. That's it.
Moreover, the weight average molecular weight (Mw) of the phenol resin of this embodiment is 2500 or less, for example, Preferably it is 2000 or less, More preferably, it is 1800 or less.
By setting to such a range, moderate flexibility as a resin component can be imparted.
また、本実施形態のフェノール樹脂の数平均分子量に対する重量平均分子量の比(Mw/Mn)は、その用途に合わせて適宜設定することができるが、たとえば、上限値として2.5以下であり、好ましくは2.2以下であり、より好ましくは2.0以下である。このように設定することでメタルハイブリッドレジン固有の性質を発現しやすくなる。
また、本実施形態のフェノール樹脂の数平均分子量に対する重量平均分子量の比(Mw/Mn)の下限値は特に限定されるものではないが、たとえば1.05以上である。
Further, the ratio (Mw / Mn) of the weight average molecular weight to the number average molecular weight of the phenol resin of the present embodiment can be appropriately set according to the use, for example, 2.5 or less as an upper limit value, Preferably it is 2.2 or less, More preferably, it is 2.0 or less. By setting in this way, it becomes easy to express the properties unique to the metal hybrid resin.
Moreover, the lower limit of the ratio (Mw / Mn) of the weight average molecular weight to the number average molecular weight of the phenol resin of the present embodiment is not particularly limited, but is, for example, 1.05 or more.
なお、本実施形態において、メタルハイブリッドレジンを製造する段階で、化学的な反応を行うため、必ずしも原料として用いたフェノール樹脂と、メタルハイブリッドレジンとして含まれるフェノール樹脂はその分子量等が一致しないことがある。
すなわち、メタルハイブリッドレジンを製造するにあたっては、その製造条件を勘案の上、メタルハイブリッドレジンに含まれるフェノール樹脂が上記の分子量範囲となるように、原料となるフェノール樹脂の分子量を設定しておくことが好ましい態様といえる。
In this embodiment, since a chemical reaction is performed at the stage of manufacturing the metal hybrid resin, the phenol resin used as the raw material and the phenol resin contained as the metal hybrid resin may not have the same molecular weight. is there.
In other words, when manufacturing a metal hybrid resin, the molecular weight of the phenol resin used as a raw material should be set so that the phenol resin contained in the metal hybrid resin falls within the above molecular weight range in consideration of the manufacturing conditions. Is a preferred embodiment.
本実施形態のフェノール樹脂は、メタルハイブリッドレジン全体に対して10質量%以上含むことが好ましく、15質量%以上含むことがより好ましく、20質量%以上含むことがさらに好ましい。これにより、複合材料としての適度な可とう性の付与や、加工性の向上を図ることができる。
また、本実施形態のフェノール樹脂は、メタルハイブリッドレジン全体に対して99質量%以下含むことが好ましく、95質量%以下含むことがより好ましく、90質量%以下含むことがさらに好ましい。このようにすることで、金属粒子に由来する機械的強度の発現の度合いを高めることができる。
The phenol resin of the present embodiment is preferably contained in an amount of 10% by mass or more, more preferably 15% by mass or more, and further preferably 20% by mass or more based on the entire metal hybrid resin. Thereby, moderate flexibility as a composite material can be imparted and workability can be improved.
Moreover, it is preferable that the phenol resin of this embodiment contains 99 mass% or less with respect to the whole metal hybrid resin, It is more preferable to contain 95 mass% or less, It is further more preferable to contain 90 mass% or less. By doing in this way, the degree of expression of mechanical strength derived from metal particles can be raised.
((B)フェノール樹脂中の酸素原子に配位した金属原子により構成される金属粒子)
本実施形態のメタルハイブリッドレジンは、フェノール樹脂中の酸素原子に配位した金属原子により構成される金属粒子を含む。すなわち、金属粒子を構成する金属原子がフェノール樹脂中の酸素原子に配位しているものであるため、金属粒子とフェノール樹脂との密着性を従来存在していた複合材料に比べ、一段と増加させることができる。
((B) Metal particles composed of metal atoms coordinated to oxygen atoms in phenol resin)
The metal hybrid resin of this embodiment includes metal particles composed of metal atoms coordinated to oxygen atoms in the phenol resin. That is, since the metal atoms constituting the metal particles are coordinated to the oxygen atoms in the phenol resin, the adhesion between the metal particles and the phenol resin is further increased as compared with the composite materials that existed in the past. be able to.
ここで、「酸素原子に配位した」とは、具体的に、酸素原子(ここでは「O」と称する。)と金属原子(ここでは「M」と称する。)とがO-M結合で化学的に連結されていることを指す。
より具体的には、X線光電子分光法(ESCA(Electron Spectroscopy for Chemical Analysis))において、金属粒子と樹脂との複合材料を分析した際に、上述のO-M結合が観察されることを指す。
Here, “coordinated to an oxygen atom” specifically means that an oxygen atom (referred to herein as “O”) and a metal atom (referred to herein as “M”) are OM bonds. Refers to being chemically linked.
More specifically, in the X-ray photoelectron spectroscopy (ESCA (Electron Spectroscopy for Chemical Analysis)), the above-mentioned OM bond is observed when a composite material of metal particles and a resin is analyzed. .
本実施形態のメタルハイブリッドレジンに含まれる金属粒子を構成する金属原子は、このメタルハイブリッドレジンを適用する用途に合わせて適宜選択することができる。
より具体的には、銀(Ag)、銅(Cu)、亜鉛(Zn)、カルシウム(Ca)、鉄(Fe)、アルミニウム(Al)、マグネシウム(Mg)、チタン(Ti)、スカンジウム(Sc)、バナジウム(V)、クロム(Cr)、マンガン(Mn)、コバルト(Co)、ニッケル(Ni)、ガリウム(Ga)、ストロンチウム(Sr)、イットリウム(Y)、ニオブ(Nb)、モリブデン(Mo)、ルテニウム(Ru)、パラジウム(Pd)、カドミウム(Cd)、バリウム(Ba)、ランタン(La)、セリウム(Ce)、プラセオジム(Pr)、ネオジム(Nd)、プロメチウム(Pm)、サマリウム(Sm)、ユウロピウム(Eu)、ガドリニウム(Gd)、テルビウム(Tb)、ジスプロシウム(Dy)、ホルミウム(Ho)、エルビウム(Er)、ツリウム(Tm)、イッテルビウム(Yb)、ルテチウム(Lu)、ハフニウム(Hf)、タンタル(Ta)、タングステン(W)、レニウム(Re)、オスミウム(Os)、イリジウム(Ir)、白金(Pt)及び金(Au)からなる群から選ばれる1種又は2種以上の金属原子を採用することができる。
これらの中でも、メタルハイブリッドレジンの製造のしやすさ、また、適用分野の広さから、金属原子が、銀(Ag)、銅(Cu)、亜鉛(Zn)、カルシウム(Ca)、鉄(Fe)、アルミニウム(Al)、マグネシウム(Mg)からなる群から選ばれる1又は2以上の金属原子であることが好ましい。
The metal atom which comprises the metal particle contained in the metal hybrid resin of this embodiment can be suitably selected according to the use to which this metal hybrid resin is applied.
More specifically, silver (Ag), copper (Cu), zinc (Zn), calcium (Ca), iron (Fe), aluminum (Al), magnesium (Mg), titanium (Ti), scandium (Sc) , Vanadium (V), chromium (Cr), manganese (Mn), cobalt (Co), nickel (Ni), gallium (Ga), strontium (Sr), yttrium (Y), niobium (Nb), molybdenum (Mo) , Ruthenium (Ru), palladium (Pd), cadmium (Cd), barium (Ba), lanthanum (La), cerium (Ce), praseodymium (Pr), neodymium (Nd), promethium (Pm), samarium (Sm) Europium (Eu), gadolinium (Gd), terbium (Tb), dysprosium (Dy), holmium (Ho), erbium (Er), thulium (Tm), ytterbium (Yb), lutetium (Lu), hafnium (Hf), tantalum (Ta), tungsten (W), rhenium (Re), osmium (Os), iridium (Ir), platinum One or more metal atoms selected from the group consisting of (Pt) and gold (Au) can be employed.
Among these, the metal atoms are silver (Ag), copper (Cu), zinc (Zn), calcium (Ca), iron (Fe) due to the ease of manufacturing the metal hybrid resin and the wide range of application fields. ), Aluminum (Al), magnesium (Mg), and preferably one or more metal atoms.
本実施形態のメタルハイブリッドレジン中に含まれる金属粒子は、通常、その大部分が「0価」の金属原子であるが、一部、カチオン性を帯びた金属イオンが混在してもよい。この金属イオンとフェノール樹脂との相互作用も相俟っていっそうの機械的強度の向上を図ることができる。 The metal particles contained in the metal hybrid resin of the present embodiment are usually mostly “zero-valent” metal atoms, but some metal ions having a cationic property may be mixed. The mechanical strength can be improved as the interaction between the metal ions and the phenolic resin may be combined.
本実施形態に係る金属粒子の平均粒径の下限値は、用いる用途等に応じて適宜設定することができるが、たとえば1nm以上であり、好ましくは3nm以上であり、さらに好ましくは5nm以上である。このように設定することで、所望の機械的強度を発現させやすくなる。
また、本実施形態に係る金属粒子の平均粒径の上限値は、用いる用途等に応じて適宜設定することができるが、たとえば1μm以下であり、好ましくは600nm以下であり、より好ましくは300nm以下であり、さらに好ましくは150nm以下であり、さらにより好ましくは100nm以下、特に好ましくは50nm以下である。このように設定することで、フェノール樹脂に対しての分散性を向上させることができる。
なお、メタルハイブリッドレジン中の金属粒子の粒径は、たとえば透過型電子顕微鏡(TEM)により観察することで決定することができる。
より具体的には、メタルハイブリッドレジンの表面を透過型電子顕微鏡(TEM)にて観察し、任意に選んだ金属粒子100点についてその粒径を測定し、この平均値として金属粒子の平均粒径とすることができる。
The lower limit value of the average particle diameter of the metal particles according to the present embodiment can be appropriately set according to the application to be used, but is, for example, 1 nm or more, preferably 3 nm or more, more preferably 5 nm or more. . By setting in this way, it becomes easy to express desired mechanical strength.
Further, the upper limit value of the average particle diameter of the metal particles according to the present embodiment can be appropriately set according to the application to be used, but is, for example, 1 μm or less, preferably 600 nm or less, more preferably 300 nm or less. More preferably, it is 150 nm or less, still more preferably 100 nm or less, particularly preferably 50 nm or less. By setting in this way, the dispersibility with respect to a phenol resin can be improved.
The particle size of the metal particles in the metal hybrid resin can be determined by observing with a transmission electron microscope (TEM), for example.
More specifically, the surface of the metal hybrid resin is observed with a transmission electron microscope (TEM), the particle size of 100 arbitrarily selected metal particles is measured, and the average particle size of the metal particles is obtained as the average value. It can be.
本実施形態の金属粒子は、メタルハイブリッドレジン全体に対して1質量%以上含むことが好ましく、3質量%以上含むことがより好ましく、5質量%以上含むことがさらに好ましい。これにより、金属粒子固有の性能を発現することができる。
また、本実施形態の金属粒子は、メタルハイブリッドレジン全体に対して85質量%以下含むことが好ましく、75質量%以下含むことがより好ましく、65質量%以下含むことがさらに好ましい。このようにすることで、メタルハイブリッドレジン全体としての比重を抑えることができ、適用の幅を広げることができる。
The metal particles of the present embodiment are preferably contained in an amount of 1% by mass or more, more preferably 3% by mass or more, and further preferably 5% by mass or more based on the entire metal hybrid resin. Thereby, the performance specific to the metal particles can be expressed.
Moreover, it is preferable that the metal particle of this embodiment contains 85 mass% or less with respect to the whole metal hybrid resin, It is more preferable to contain 75 mass% or less, It is further more preferable to contain 65 mass% or less. By doing in this way, the specific gravity as the whole metal hybrid resin can be suppressed, and the range of application can be expanded.
(その他の成分)
また、本実施形態に係るメタルハイブリッドレジンは、上述のフェノール樹脂以外にも樹脂の特性の改質を目的として公知の樹脂材料を配合することができる。
また、必要に応じて、通常の金属樹脂複合材料に使用される各種添加剤、たとえばステアリン酸、ステアリン酸カルシウム、もしくはポリエチレンなどの離型剤、水酸化カルシウムなどの難燃剤、カーボンブラックなどの着色剤、カップリング剤、溶剤等を配合してもよい。
(Other ingredients)
Moreover, the metal hybrid resin according to the present embodiment can be blended with a known resin material for the purpose of modifying the characteristics of the resin in addition to the above-described phenol resin.
Further, as required, various additives used in ordinary metal resin composite materials, for example, release agents such as stearic acid, calcium stearate or polyethylene, flame retardants such as calcium hydroxide, and colorants such as carbon black A coupling agent, a solvent, or the like may be blended.
本実施形態に係るメタルハイブリッドレジンの比重は、用いる用途によって適宜設定することができるが、この比重の下限値としては、たとえば1.25g/cm3以上であり、好ましくは1.27g/cm3以上であり、より好ましくは1.30g/cm3以上である。
本実施形態に係るメタルハイブリッドレジンの比重は、用いる用途によって適宜設定することができるが、この比重の上限としては、たとえば16.6g/cm3以下であり、好ましくは16.0g/cm3以下であり、より好ましくは15.5g/cm3以下である。
The specific gravity of the metal hybrid resin according to the present embodiment can be set as appropriate depending on the intended use. The lower limit of the specific gravity is, for example, 1.25 g / cm 3 or more, and preferably 1.27 g / cm 3. Or more, and more preferably 1.30 g / cm 3 or more.
The specific gravity of the metal hybrid resin according to the present embodiment, can be appropriately set depending on the application to be used, the upper limit of this specific gravity, for example 16.6 g / cm 3 or less, preferably 16.0 g / cm 3 or less More preferably, it is 15.5 g / cm 3 or less.
[メタルハイブリッドレジンの製造方法]
続いて、本実施形態に係るメタルハイブリッドレジンの製造方法について説明する。
本実施形態のメタルハイブリッドレジンの製造方法は以下の工程を含むものである。
(a)(A)フェノール樹脂を準備する工程
(b)(B')金属塩の溶液を準備する工程
(c)(A)フェノール樹脂と、(B')金属塩の溶液とを混合し、金属原子を(A)フェノール樹脂中の酸素原子に配位させて、メタルハイブリッドレジンを得る工程
以下各工程について説明する。
[Production method of metal hybrid resin]
Then, the manufacturing method of the metal hybrid resin which concerns on this embodiment is demonstrated.
The manufacturing method of the metal hybrid resin of this embodiment includes the following steps.
(A) (A) Step of preparing phenol resin (b) Step of preparing (B ′) metal salt solution (c) Mixing (A) phenol resin and (B ′) metal salt solution, Step of obtaining metal hybrid resin by coordinating metal atom to oxygen atom in (A) phenol resin Each step will be described below.
((a)工程)
本工程では、フェノール樹脂を準備する。
ここで用いるフェノール樹脂としては、先述したフェノール樹脂を適宜選択すればよい。
((A) Process)
In this step, a phenol resin is prepared.
What is necessary is just to select the phenol resin mentioned above suitably as a phenol resin used here.
((b)工程)
本工程では、(B')金属塩の溶液を準備する。
ここで、本実施形態において、この(B')金属塩の溶液は、先述の「(B)フェノール樹脂中の酸素原子に配位した金属原子により構成される金属粒子」を構成する金属原子に対応する塩を用いて調製することができる。
((B) Process)
In this step, a solution of (B ′) metal salt is prepared.
Here, in the present embodiment, the solution of (B ′) metal salt is formed on the metal atoms constituting “(B) metal particles composed of metal atoms coordinated to oxygen atoms in the phenol resin” described above. It can be prepared using the corresponding salt.
より具体的には、銀(Ag)、銅(Cu)、亜鉛(Zn)、カルシウム(Ca)、鉄(Fe)、アルミニウム(Al)、マグネシウム(Mg)、チタン(Ti)、スカンジウム(Sc)、バナジウム(V)、クロム(Cr)、マンガン(Mn)、コバルト(Co)、ニッケル(Ni)、ガリウム(Ga)、ストロンチウム(Sr)、イットリウム(Y)、ニオブ(Nb)、モリブデン(Mo)、ルテニウム(Ru)、パラジウム(Pd)、カドミウム(Cd)、バリウム(Ba)、ランタン(La)、セリウム(Ce)、プラセオジム(Pr)、ネオジム(Nd)、プロメチウム(Pm)、サマリウム(Sm)、ユウロピウム(Eu)、ガドリニウム(Gd)、テルビウム(Tb)、ジスプロシウム(Dy)、ホルミウム(Ho)、エルビウム(Er)、ツリウム(Tm)、イッテルビウム(Yb)、ルテチウム(Lu)、ハフニウム(Hf)、タンタル(Ta)、タングステン(W)、レニウム(Re)、オスミウム(Os)、イリジウム(Ir)、白金(Pt)及び金(Au)からなる群から選ばれる1種又は2種以上の金属原子に対応する金属塩を準備すればよい。
これらの中でも、メタルハイブリッドレジンの製造のしやすさ、また、適用分野の広さから、銀(Ag)、銅(Cu)、亜鉛(Zn)、カルシウム(Ca)、鉄(Fe)、アルミニウム(Al)、マグネシウム(Mg)からなる群から選ばれる1又は2以上の金属原子に対応する金属塩を用いることが好ましい。
More specifically, silver (Ag), copper (Cu), zinc (Zn), calcium (Ca), iron (Fe), aluminum (Al), magnesium (Mg), titanium (Ti), scandium (Sc) , Vanadium (V), chromium (Cr), manganese (Mn), cobalt (Co), nickel (Ni), gallium (Ga), strontium (Sr), yttrium (Y), niobium (Nb), molybdenum (Mo) , Ruthenium (Ru), palladium (Pd), cadmium (Cd), barium (Ba), lanthanum (La), cerium (Ce), praseodymium (Pr), neodymium (Nd), promethium (Pm), samarium (Sm) Europium (Eu), gadolinium (Gd), terbium (Tb), dysprosium (Dy), holmium (Ho), erbium (Er), thulium (Tm), ytterbium (Yb), lutetium (Lu), hafnium (Hf), tantalum (Ta), tungsten (W), rhenium (Re), osmium (Os), iridium (Ir), platinum A metal salt corresponding to one or more metal atoms selected from the group consisting of (Pt) and gold (Au) may be prepared.
Among these, silver (Ag), copper (Cu), zinc (Zn), calcium (Ca), iron (Fe), aluminum (from the ease of production of metal hybrid resins and the wide range of application fields. It is preferable to use a metal salt corresponding to one or more metal atoms selected from the group consisting of Al) and magnesium (Mg).
本実施形態において、金属塩は、上記の金属原子のカチオン(陽イオン)とアニオン(陰イオン)によって構成される。
このようなアニオンとしては、塩素イオン、臭素イオン、ヨウ素イオンなどのハロゲンイオン;酢酸イオン、シュウ酸イオン、フマル酸イオンなどのカルボキシレートイオン;p-トルエンスルホネートイオン、メタンスルホネートイオン、ブタンスルホネートイオン、ベンゼンスルホネートイオンなどのスルホネートイオン;硫酸イオン;過塩素酸イオン;炭酸イオン;硝酸イオン等が挙げられる。
In this embodiment, a metal salt is comprised by the cation (cation) and anion (anion) of said metal atom.
Examples of such anions include halogen ions such as chlorine ion, bromine ion and iodine ion; carboxylate ions such as acetate ion, oxalate ion and fumarate ion; p-toluenesulfonate ion, methanesulfonate ion, butanesulfonate ion, Examples thereof include sulfonate ions such as benzenesulfonate ion; sulfate ion; perchlorate ion; carbonate ion; nitrate ion.
本実施形態のメタルハイブリッドレジンを構成する金属粒子が銀、すなわち銀粒子である場合を例にとって説明すると、銀イオンに対して上記のアニオンと結びついた塩を準備し、そこから溶液を調製する。
なお、銀を用いた場合は、溶媒への溶解性の高さからアニオンとして硝酸イオンを用い、金属塩として硝酸銀とすることが好ましい。
The case where the metal particles constituting the metal hybrid resin of the present embodiment are silver, that is, silver particles will be described as an example. A salt is prepared by combining silver ions with the above anions, and a solution is prepared therefrom.
In addition, when using silver, it is preferable to use nitrate ion as an anion and to use silver nitrate as a metal salt because of its high solubility in a solvent.
もちろん、銀以外の金属を用いる場合であっても、適宜金属塩の溶解性等を考慮し、適切な金属塩を選択すればよい。
たとえば、銅を金属原子と用いる場合は硫酸銅や硝酸銅等、亜鉛を金属原子として用いる場合は塩化亜鉛や硫酸亜鉛や硝酸亜鉛、カルシウムを金属原子として用いる場合は塩化カルシウムや硝酸カルシウム、鉄を金属原子として用いる場合は塩化鉄や硫酸鉄、硝酸鉄、アルミニウムを金属原子として用いる場合は硝酸アルミニウム、マグネシウムを金属原子として用いる場合は塩化マグネシウム、硫酸マグネシウム、硝酸マグネシウム等を用いることができる。
また、金属塩の金属の価数は溶媒に対する溶解性や、還元のしやすさ等を勘案して適切なものを採用すればよい。
Of course, even when a metal other than silver is used, an appropriate metal salt may be selected in consideration of the solubility of the metal salt as appropriate.
For example, when using copper as a metal atom, copper sulfate, copper nitrate, etc.When using zinc as a metal atom, zinc chloride, zinc sulfate, zinc nitrate, when using calcium as a metal atom, calcium chloride, calcium nitrate, iron are used. When used as a metal atom, iron chloride, iron sulfate, iron nitrate, when aluminum is used as a metal atom, aluminum nitrate can be used, and when magnesium is used as a metal atom, magnesium chloride, magnesium sulfate, magnesium nitrate, or the like can be used.
In addition, the metal valence of the metal salt may be appropriately selected in consideration of solubility in a solvent, ease of reduction, and the like.
本工程においては、金属塩の溶液を準備するが、金属塩を溶解する溶媒は、その金属塩の特性に応じて適宜選択すればよい。
たとえば、溶媒としては水を選択することができる。このように、水を用いることによれば、製造コストの低減に資することとなる。
In this step, a metal salt solution is prepared, and a solvent for dissolving the metal salt may be appropriately selected according to the characteristics of the metal salt.
For example, water can be selected as the solvent. Thus, using water contributes to a reduction in manufacturing cost.
また、溶媒としては水以外の有機溶媒を採用することができ、たとえば、メタノール、エタノール、プロパノール、ブタノール、ペンタノール、ヘキサノール、エチレングリコール等のアルコール系溶媒;アセトン、メチルエチルケトン、メチルイソブチルケトン等のケトン系溶媒;ジメチルエーテル、ジエチルエーテル、メチルエチルエーテル、ジプロピルエーテル、テトラヒドロフラン等のエーテル系溶媒、メチルセロソルブ、エチルセロソルブ、ブチルセロソルブ、メチルセロソルブアセテート、エチルセロソルブアセテート等のセロソルブ類;N-メチル-2-ピロリドンやN,N-ジメチルホルムアミド等のアミド系溶媒;ジメチルカーボネートなどを用いることができる。これらの有機溶媒は単独で用いてもよく、また、複数を組み合わせて用いてもよい。
また、これら有機溶媒が水と混和する場合は、適宜、水と混合することで用いることもできる。
また、本実施形態の金属塩の溶液は、金属塩の溶解性を向上させること等を目的として、溶液のpHを調整することもできる。
Moreover, organic solvents other than water can be employed as the solvent, for example, alcohol solvents such as methanol, ethanol, propanol, butanol, pentanol, hexanol, and ethylene glycol; ketones such as acetone, methyl ethyl ketone, and methyl isobutyl ketone Solvents: ether solvents such as dimethyl ether, diethyl ether, methyl ethyl ether, dipropyl ether, tetrahydrofuran, etc., cellosolves such as methyl cellosolve, ethyl cellosolve, butyl cellosolve, methyl cellosolve acetate, ethyl cellosolve acetate; N-methyl-2-pyrrolidone And amide solvents such as N, N-dimethylformamide; dimethyl carbonate and the like can be used. These organic solvents may be used alone or in combination.
Moreover, when these organic solvents are miscible with water, they can be used by appropriately mixing with water.
Moreover, the solution of the metal salt of this embodiment can also adjust the pH of a solution for the purpose of improving the solubility of a metal salt.
本実施形態の金属塩の溶液における金属塩の濃度は、たとえば1%以上であり、好ましくは3%以上であり、さらに好ましくは5%以上である。また、金属塩の溶液における金属塩の濃度はたとえば20%以下であり、好ましくは15%以下であり、より好ましくは12%以下である。
このような範囲に設定することで、安定的に金属塩から所望の金属粒子へ変換することができる。
なお、この金属塩の濃度は、溶液全体の質量に対する、溶解した金属塩の質量の割合として定義されるものである。
The concentration of the metal salt in the metal salt solution of the present embodiment is, for example, 1% or more, preferably 3% or more, and more preferably 5% or more. The concentration of the metal salt in the metal salt solution is, for example, 20% or less, preferably 15% or less, and more preferably 12% or less.
By setting to such a range, it is possible to stably convert from a metal salt to desired metal particles.
The concentration of the metal salt is defined as a ratio of the mass of the dissolved metal salt to the mass of the entire solution.
((c)工程)
本工程では、フェノール樹脂と、金属塩の溶液とを混合し、金属原子をフェノール樹脂中の酸素原子に配位させて、メタルハイブリッドレジンを得る。
具体的には、先述のフェノール樹脂と、金属塩の溶液とを混合し、金属塩に対して還元反応を行うことで、金属塩から金属粒子を形成させ(すなわち、「0価」の金属の粒子として析出させ)、メタルハイブリッドレジンを得る。
(Step (c))
In this step, a phenol resin and a metal salt solution are mixed, and metal atoms are coordinated to oxygen atoms in the phenol resin to obtain a metal hybrid resin.
Specifically, the above-described phenol resin and a metal salt solution are mixed, and a reduction reaction is performed on the metal salt to form metal particles from the metal salt (that is, “zero-valent” metal Precipitate as particles) to obtain a metal hybrid resin.
本工程を行うにあたっては、先述の金属塩に対して還元反応を行う。
この還元反応は公知の還元剤を用いることもできるし、フェノール樹脂の構造に起因する還元性の官能基を活用して行うこともできる。
In performing this step, a reduction reaction is performed on the above-described metal salt.
This reduction reaction can be performed using a known reducing agent, or can be performed utilizing a reducing functional group resulting from the structure of the phenol resin.
すなわち、先述の通り、本実施形態においてはフェノール樹脂として分子内にアルデヒド基を有するフェノール樹脂を採用することができる。
この場合においては、分子内のアルデヒド基が金属塩を構成する金属カチオンに還元作用をもたらし、金属粒子へと変換することができる。
That is, as described above, in this embodiment, a phenol resin having an aldehyde group in the molecule can be employed as the phenol resin.
In this case, the aldehyde group in the molecule brings about a reducing action on the metal cation constituting the metal salt and can be converted into metal particles.
このような分子内にアルデヒド基を有するフェノール樹脂を用いる場合、溶液に含まれる金属塩の質量に対して、たとえば0.1倍量以上のフェノール樹脂を用いることができ、好ましくは0.5倍量のフェノール樹脂を用いることができ、より好ましくは2倍量のフェノール樹脂を用いることができる。
また、用いるフェノール樹脂量の上限は特に限定されないが、たとえば100倍量以下である。
When such a phenol resin having an aldehyde group in the molecule is used, for example, 0.1 times or more of the phenol resin can be used, preferably 0.5 times the mass of the metal salt contained in the solution. An amount of phenol resin can be used, and more preferably twice as much phenol resin can be used.
Moreover, although the upper limit of the amount of phenol resin to be used is not specifically limited, For example, it is 100 times or less.
また、分子内にアルデヒド基を有するフェノール樹脂以外の還元剤としては、公知のものを採用することができ、たとえば、次亜リン酸ナトリウム、ジメチルアミンボラン、水素化ホウ素ナトリウム、水素化ホウ素カリウム、ホルムアルデヒド、ヒドラジン、アスコルビン酸などの無機もしくは有機の還元剤を用いることができる。
還元剤の使用量はその種類によって適宜設定することができ、十分な量の金属粒子が析出するだけの量を設定すればよい。
In addition, as the reducing agent other than the phenol resin having an aldehyde group in the molecule, known ones can be employed, for example, sodium hypophosphite, dimethylamine borane, sodium borohydride, potassium borohydride, An inorganic or organic reducing agent such as formaldehyde, hydrazine, or ascorbic acid can be used.
The amount of the reducing agent used can be set as appropriate depending on the type of the reducing agent, and it is sufficient to set an amount sufficient to deposit a sufficient amount of metal particles.
また、本工程においては、還元反応を促進するために、適宜、還元補助剤を用いることができる。たとえば、金属塩として硝酸銀を用い、かつ、分子内にアルデヒド基を有するフェノール樹脂を混合する場合、ジメチルスルフィド、ジエチルスルフィド、ジプロピルスルフィド、ジブチルスルフィド、ジペンチルスルフィド、ジヘキシルスルフィド、ジフェニルスルフィド、エチルフェニルスルフィド、チオジエタノール、チオジプロパノール、チオジブタノール、1-(2-ヒドロキシエチルチオ)-2-プロパノール、1-(2-ヒドロキシエチルチオ)-2-ブタノール、1-(2-ヒドロキシエチルチオ)-3-ブトキシ-1-プロパノール等を還元補助剤として用いることができる。
また、同様にアミン化合物やアルコール類も還元補助剤として用いることもできる。
より具体的には、アミン化合物としてアンモニア、エチルアミン、ジエチルアミン、トリエチルアミン、プロピルアミン、ジプロピルアミン、トリプロピルアミン、イソプロピルジエチルアミン、ジエタノールアミン、トリエタノールアミン、モルホリン、エチレンジアミン、ピリジン等を還元補助剤として用いることができる。
また、アルコール類としては、エトキシエタノール、エチレングリコール、ジエチレングリコール等を還元補助剤として用いることができる。
Moreover, in this process, in order to accelerate | stimulate a reductive reaction, a reducing adjuvant can be used suitably. For example, when silver nitrate is used as the metal salt and a phenol resin having an aldehyde group in the molecule is mixed, dimethyl sulfide, diethyl sulfide, dipropyl sulfide, dibutyl sulfide, dipentyl sulfide, dihexyl sulfide, diphenyl sulfide, ethylphenyl sulfide Thiodiethanol, thiodipropanol, thiodibutanol, 1- (2-hydroxyethylthio) -2-propanol, 1- (2-hydroxyethylthio) -2-butanol, 1- (2-hydroxyethylthio)- 3-Butoxy-1-propanol or the like can be used as a reduction aid.
Similarly, amine compounds and alcohols can also be used as reducing aids.
More specifically, ammonia, ethylamine, diethylamine, triethylamine, propylamine, dipropylamine, tripropylamine, isopropyldiethylamine, diethanolamine, triethanolamine, morpholine, ethylenediamine, pyridine, or the like is used as a reducing auxiliary agent as an amine compound. Can do.
Moreover, as alcohols, ethoxyethanol, ethylene glycol, diethylene glycol, etc. can be used as a reduction aid.
また、本工程は、各種原料を混合した後、加熱して行うこともできる。
この加熱を行う際の温度条件の下限値は、たとえば30℃以上であり、好ましくは40℃以上であり、より好ましくは45℃以上である。また、温度条件の上限値はたとえば100℃以下であり、好ましくは90℃以下であり、より好ましくは80℃以下である。
Moreover, this process can also be performed by heating after mixing various raw materials.
The lower limit of the temperature condition when performing this heating is, for example, 30 ° C. or higher, preferably 40 ° C. or higher, and more preferably 45 ° C. or higher. Moreover, the upper limit of temperature conditions is 100 degrees C or less, for example, Preferably it is 90 degrees C or less, More preferably, it is 80 degrees C or less.
反応時間は、混合した原料の変化の度合いを観察しながら適宜設定すればよいが、反応時間の下限値はたとえば10分以上であり、好ましくは30分以上であり、より好ましくは1時間以上である。また、反応時間の上限値はたとえば24時間以下であり、好ましくは12時間以下であり、より好ましくは8時間以下である。 The reaction time may be appropriately set while observing the degree of change of the mixed raw materials, but the lower limit of the reaction time is, for example, 10 minutes or more, preferably 30 minutes or more, more preferably 1 hour or more. is there. Moreover, the upper limit of reaction time is 24 hours or less, for example, Preferably it is 12 hours or less, More preferably, it is 8 hours or less.
[用途]
本実施形態に係るメタルハイブリッドレジンは、金属粒子が樹脂に対して均一に分散され、高い機械的強度を発現することのできることから、幅広い用途への展開が期待される。
また、有する導電性に着目し、導電材としても用いることができるし、熱伝導性に着目し、放熱材としても用いることができるものと期待される。
具体的には、セラミックコンデンサやパワーインダクタ等における電子部材としての適用、タイヤのビード部等の自動車部品としての適用、摩擦材や研磨材としての適用の他、ボンド磁石、建築材料、構造材料、スポーツ用品、防音材料としての適用が期待される。
[Usage]
The metal hybrid resin according to the present embodiment is expected to be used in a wide range of applications because the metal particles are uniformly dispersed in the resin and can exhibit high mechanical strength.
In addition, it is expected that it can be used as a conductive material by paying attention to the conductivity, and can also be used as a heat dissipation material, paying attention to thermal conductivity.
Specifically, application as an electronic member in ceramic capacitors, power inductors, etc., application as automotive parts such as tire bead parts, application as friction materials and abrasives, bond magnets, building materials, structural materials, Expected to be used as sports equipment and soundproofing materials.
以上、本発明の実施形態について述べたが、これらは本発明の例示であり、上記以外の様々な構成を採用することができる。 As mentioned above, although embodiment of this invention was described, these are illustrations of this invention and various structures other than the above are employable.
以下、実施例により本発明をさらに具体的に説明するが、本発明の範囲はこれらの実施例等に限定されるものではない。 Hereinafter, the present invention will be described more specifically with reference to examples. However, the scope of the present invention is not limited to these examples.
[フェノール樹脂1の製造]
まず、撹拌羽根、温度計、滴下漏斗、コンデンサーを備えた4つ口の1Lフラスコを用意し、4-ヒドロキシベンズアルデヒド24.4g(0.20モル)、92%パラホルムアルデヒド6.5g(0.20モル)、溶媒として酢酸210.0gと2-エトキシエタノール186.0gを装入し、撹拌を行い、これらを均一に溶解させた。
その後、滴下漏斗に98%硫酸を73.4g仕込み、フラスコ内が60℃以上にならないように温度を観察しながら少量ずつこの硫酸を滴下した。
硫酸の滴下が終わった段階で、内温が100℃になるまで昇温し、内温が100℃になった時点から温度を保ちつつ2時間反応を行った。
反応後、フラスコの内温が30℃以下まで低下したことを確認し、フラスコの内容物を水1Lに注入し、この際に析出した固体を回収した(回収量(乾燥後):22g)。
[Production of phenolic resin 1]
First, a four-neck 1 L flask equipped with a stirring blade, a thermometer, a dropping funnel and a condenser was prepared, and 24.4 g (0.20 mol) of 4-hydroxybenzaldehyde, 6.5 g of 92% paraformaldehyde (0.20). Mol), 210.0 g of acetic acid and 186.0 g of 2-ethoxyethanol as a solvent were added and stirred to dissolve them uniformly.
Thereafter, 73.4 g of 98% sulfuric acid was charged into the dropping funnel, and this sulfuric acid was added dropwise little by little while observing the temperature so that the temperature in the flask did not exceed 60 ° C.
When the dropping of sulfuric acid was completed, the temperature was raised until the internal temperature reached 100 ° C., and the reaction was carried out for 2 hours while maintaining the temperature from the time when the internal temperature reached 100 ° C.
After the reaction, it was confirmed that the internal temperature of the flask had dropped to 30 ° C. or less, and the contents of the flask were poured into 1 L of water, and the solid precipitated at this time was recovered (recovered amount (after drying): 22 g).
得られた固体を乾燥し、分析した結果、この固体は分子内にアルデヒド基を有するフェノール樹脂であることが確認された。なお、数平均分子量(Mn)、重量平均分子量(Mw)、数平均分子量に対する重量平均分子量の比(Mw/Mn)は以下の通りである。
・数平均分子量(Mn):334
・重量平均分子量(Mw):607
・数平均分子量に対する重量平均分子量の比(Mw/Mn):1.82
なお、本実施例項において、数平均分子量および重量平均分子量の測定は、GPC(Gel Permeation Chromatography)にて、カラム種にTSK-GEL G1000H、G2000H、G3000Hを用い、移動相にはテトラヒドロフランを用いて行った。また、標準物質として単分散ポリスチレンを使用した。
以下に示す実施例および比較例では、同様の操作を繰り返しフェノール樹脂1を逐次得、これを用いて金属樹脂複合材料を作製している。
As a result of drying and analyzing the obtained solid, it was confirmed that this solid was a phenol resin having an aldehyde group in the molecule. The number average molecular weight (Mn), the weight average molecular weight (Mw), and the ratio of the weight average molecular weight to the number average molecular weight (Mw / Mn) are as follows.
Number average molecular weight (Mn): 334
Weight average molecular weight (Mw): 607
-Ratio of weight average molecular weight to number average molecular weight (Mw / Mn): 1.82
In this Example section, the number average molecular weight and the weight average molecular weight are measured by GPC (Gel Permeation Chromatography) using TSK-GEL G1000H, G2000H, G3000H as column types and tetrahydrofuran as a mobile phase. went. Moreover, monodisperse polystyrene was used as a standard substance.
In the following examples and comparative examples, the same operation is repeated to sequentially obtain the phenol resin 1, and a metal resin composite material is produced using this.
(実施例1)
撹拌羽根、温度計、滴下漏斗、コンデンサーを備えた4つ口の1Lフラスコを用意し、このフラスコ内に、上記で得られたフェノール樹脂1を30.0g、水300gに対して水酸化ナトリウム4.6g(0.11モル)を溶解させた水酸化ナトリウム水溶液、チオジエタノール6.0g(0.05モル)、1N硝酸銀31.6g(0.03モル)を装入した。撹拌を行い、これらを均一に溶解させた上で、内温が50℃になるまで昇温し、内温が50℃になった時点から温度を保ちつつ2時間反応を行った。
反応後、フラスコの内温が30℃以下まで低下したこと確認し、滴下漏斗から酢酸を0.5g滴下して、反応系を中性からpH=5を限界とする弱酸性とし、これにより、金属樹脂複合材料を析出させた。
最後に、フラスコ内に析出した金属樹脂複合材料について回収を行った(回収量(乾燥後):33g)。
(Example 1)
A four-neck 1 L flask equipped with a stirring blade, a thermometer, a dropping funnel, and a condenser was prepared. In this flask, 30.0 g of the phenol resin 1 obtained above and sodium hydroxide 4 with respect to 300 g of water. An aqueous solution of sodium hydroxide in which 0.6 g (0.11 mol) was dissolved, 6.0 g (0.05 mol) of thiodiethanol, and 31.6 g (0.03 mol) of 1N silver nitrate were charged. After stirring and dissolving them uniformly, the temperature was raised until the internal temperature reached 50 ° C., and the reaction was carried out for 2 hours while maintaining the temperature from the time when the internal temperature reached 50 ° C.
After the reaction, it was confirmed that the internal temperature of the flask had dropped to 30 ° C. or less, and 0.5 g of acetic acid was dropped from the dropping funnel to make the reaction system neutral to weakly acidic with pH = 5 as the limit. A metal resin composite material was deposited.
Finally, the metal resin composite material deposited in the flask was recovered (recovered amount (after drying): 33 g).
得られた固体を乾燥し、テトラヒドロフランに可溶である部分について、GPCにて分子量の測定を行った。数平均分子量(Mn)、重量平均分子量(Mw)、数平均分子量に対する重量平均分子量の比(Mw/Mn)は以下の通りである。
・数平均分子量(Mn):282
・重量平均分子量(Mw):478
・数平均分子量に対する重量平均分子量の比(Mw/Mn):1.70
The obtained solid was dried, and the molecular weight of the portion soluble in tetrahydrofuran was measured by GPC. The number average molecular weight (Mn), the weight average molecular weight (Mw), and the ratio of the weight average molecular weight to the number average molecular weight (Mw / Mn) are as follows.
Number average molecular weight (Mn): 282
Weight average molecular weight (Mw): 478
-Ratio of weight average molecular weight to number average molecular weight (Mw / Mn): 1.70
実施例1で得られた金属樹脂複合材料については、サーモフィッシャーサイエンティフィック株式会社製X線光電子分光分析装置Escalab-220iXLにて測定を行った。
なお、測定条件については以下の通りである。
・照射X線:モノクロAlKα
・検出深さ:約5nm
・X線スポット径:約1mm
The metal resin composite material obtained in Example 1 was measured with an X-ray photoelectron spectrometer Escalab-220iXL manufactured by Thermo Fisher Scientific Co., Ltd.
The measurement conditions are as follows.
・ Irradiated X-ray: Monochrome AlKα
・ Detection depth: about 5nm
・ X-ray spot diameter: about 1mm
実施例1にて得られた金属樹脂複合材料について、Ag3dナロースキャンスペクトルを測定した結果を示すチャートを図1として示す。また、これとあわせて、Ag箔をArイオンでクリーニングした試料について測定したAg3dナロースキャンスペクトルのチャートを図2として示す。
図1に示されるチャートにおいては、Ag3dナロースキャンスペクトルのピーク位置が368.9eVである一方、図2に示されるチャートにおいては、ピーク位置が368.3eVとなっており、これらにおいてはピーク位置の差が観察された。
通常、Ag単体のピークは368.1~368.3eV付近に観察されるのに対し、たとえば酢酸銀のようなAg原子とO原子とが相互作用する化合物においては、このピークが368.3~368.9eVへとシフトする(出典:Handbook of X-ray Photoelectron Spectroscopy(Physical Electronics))。
このことから、実施例1で得られた金属樹脂複合材料は、その化学構造中にAg-O結合を有していることが裏付けられる。
A chart showing the results of measuring the Ag3d narrow scan spectrum of the metal resin composite material obtained in Example 1 is shown in FIG. In addition, FIG. 2 shows a chart of an Ag3d narrow scan spectrum measured for a sample obtained by cleaning an Ag foil with Ar ions.
In the chart shown in FIG. 1, the peak position of the Ag3d narrow scan spectrum is 368.9 eV, while in the chart shown in FIG. 2, the peak position is 368.3 eV. Differences were observed.
Usually, the peak of Ag alone is observed around 368.1 to 368.3 eV, whereas in a compound in which an Ag atom and an O atom interact, such as silver acetate, this peak is 368.3 to Shift to 368.9 eV (Source: Handbook of X-ray Photoelectron Spectroscopy (Physical Electronics)).
This confirms that the metal resin composite material obtained in Example 1 has an Ag—O bond in its chemical structure.
また、実施例1で得られた金属樹脂複合材料は透過型電子顕微鏡(TEM)にて、その複合材料の表面を観察した。その結果を図3に示す。
この図3に示されるように、実施例1によって得られた金属樹脂複合材料は数十nmオーダー(平均粒径:13nm)の銀粒子を均一に含むものであった。
Moreover, the surface of the composite material obtained in Example 1 was observed with a transmission electron microscope (TEM). The result is shown in FIG.
As shown in FIG. 3, the metal resin composite material obtained in Example 1 uniformly contained silver particles on the order of several tens of nm (average particle diameter: 13 nm).
(実施例2)
撹拌羽根、温度計、滴下漏斗、コンデンサーを備えた4つ口の1Lフラスコを用意し、このフラスコ内に、上記で得られたフェノール樹脂1を30.0g、水300.0gに対して水酸化ナトリウム4.6g(0.11モル)を溶解させた水酸化ナトリウム水溶液、チオジエタノール6.0g(0.05モル)、1N硝酸銀15.8g(0.015モル)を装入した。撹拌を行い、これらを均一に溶解させた上で、内温が50℃になるまで昇温し、内温が50℃になった時点から温度を保ちつつ2時間反応を行った。
反応後、フラスコの内温が30℃以下まで低下したことを確認し、滴下漏斗から酢酸を0.5g滴下して、反応系を中性からpH=5を限界とする弱酸性とし、これにより、金属樹脂複合材料を析出させた。
最後に、フラスコ内に析出した金属樹脂複合材料について回収を行った(回収量(乾燥後):31g)。
(Example 2)
A four-neck 1 L flask equipped with a stirring blade, a thermometer, a dropping funnel, and a condenser was prepared. In this flask, 30.0 g of the phenol resin 1 obtained above was hydroxylated with respect to 300.0 g of water. An aqueous sodium hydroxide solution in which 4.6 g (0.11 mol) of sodium was dissolved, 6.0 g (0.05 mol) of thiodiethanol, and 15.8 g (0.015 mol) of 1N silver nitrate were charged. After stirring and dissolving them uniformly, the temperature was raised until the internal temperature reached 50 ° C., and the reaction was carried out for 2 hours while maintaining the temperature from the time when the internal temperature reached 50 ° C.
After the reaction, it was confirmed that the internal temperature of the flask had dropped to 30 ° C. or less, and 0.5 g of acetic acid was dropped from the dropping funnel to make the reaction system neutral to weakly acidic with pH = 5 as the limit. A metal resin composite material was deposited.
Finally, the metal resin composite material deposited in the flask was collected (recovered amount (after drying): 31 g).
(実施例3)
撹拌羽根、温度計、滴下漏斗、コンデンサーを備えた4つ口の1Lフラスコを用意し、このフラスコ内に、上記で得られたフェノール樹脂1を30.0g、水300gに対して水酸化ナトリウム4.6g(0.11モル)を溶解させた水酸化ナトリウム水溶液、チオジエタノール6.0g(0.05モル)、1N硝酸銀31.6g(0.03モル)を装入した。撹拌を行い、これらを均一に溶解させた上で、内温が30℃になるまで昇温し、内温が30℃になった時点から温度を保ちつつ24時間反応を行った。
反応後、フラスコの内温が30℃以下まで低下したことを確認し、滴下漏斗から酢酸を0.5g滴下して、反応系を中性からpH=5を限界とする弱酸性とし、これにより、金属樹脂複合材料を析出させた。
最後に、フラスコ内に析出した金属樹脂複合材料について回収を行った(回収量(乾燥後):33g)。
(Example 3)
A four-neck 1 L flask equipped with a stirring blade, a thermometer, a dropping funnel, and a condenser was prepared. In this flask, 30.0 g of the phenol resin 1 obtained above and sodium hydroxide 4 with respect to 300 g of water. An aqueous solution of sodium hydroxide in which 0.6 g (0.11 mol) was dissolved, 6.0 g (0.05 mol) of thiodiethanol, and 31.6 g (0.03 mol) of 1N silver nitrate were charged. After stirring and dissolving them uniformly, the temperature was raised until the internal temperature reached 30 ° C., and the reaction was carried out for 24 hours while maintaining the temperature from the time when the internal temperature reached 30 ° C.
After the reaction, it was confirmed that the internal temperature of the flask had dropped to 30 ° C. or less, and 0.5 g of acetic acid was dropped from the dropping funnel to make the reaction system neutral to weakly acidic with pH = 5 as the limit. A metal resin composite material was deposited.
Finally, the metal resin composite material deposited in the flask was recovered (recovered amount (after drying): 33 g).
(比較例1)
上記で得られたフェノール樹脂1を95gと、平均粒径1μmの銀粉(DOWA社製)5gとをラボプラストミルを用いて30分間混練し、金属樹脂複合材料を得た。
(Comparative Example 1)
95 g of the phenol resin 1 obtained above and 5 g of silver powder (manufactured by DOWA) having an average particle diameter of 1 μm were kneaded for 30 minutes using a lab plast mill to obtain a metal resin composite material.
(比較例2)
上記で得られたフェノール樹脂1を90gと、平均粒径1μmの銀粉(DOWA社製)10gとをラボプラストミルを用いて30分間混練し、金属樹脂複合材料を得た。
(Comparative Example 2)
90 g of the phenol resin 1 obtained above and 10 g of silver powder (manufactured by DOWA) having an average particle diameter of 1 μm were kneaded for 30 minutes using a lab plast mill to obtain a metal resin composite material.
実施例1~3および比較例1、2によって得られた金属樹脂複合材料については以下に基づいて評価を行った。 The metal resin composite materials obtained in Examples 1 to 3 and Comparative Examples 1 and 2 were evaluated based on the following.
(比重)
各実施例および各比較例で得られた金属樹脂複合材料を用い、プレス圧100MPa、金型温度:175℃の条件による圧縮成形により、ISO 294-4に示される60×60×2mmの試験片を作製した。
この試験片について、JIS K 6911に準じて比重を測定した。結果を表1に示した。
(specific gravity)
A test piece of 60 × 60 × 2 mm shown in ISO 294-4 was formed by compression molding under the conditions of a press pressure of 100 MPa and a mold temperature of 175 ° C. using the metal resin composite materials obtained in each Example and each Comparative Example. Was made.
About this test piece, specific gravity was measured according to JISK6911. The results are shown in Table 1.
(曲げ強度)
各実施例および各比較例で得られた金属樹脂複合材料を用い、プレス圧100MPa、金型温度:175℃の条件による圧縮成形により、ISO 178に示される80×10×4mmの試験片を作製した。
続いて、得られた試験片について、ISO 178に準拠し、曲げ強度を測定した。結果を表1に示した。
(Bending strength)
Using the metal resin composite materials obtained in each Example and each Comparative Example, a test piece of 80 × 10 × 4 mm shown in ISO 178 was produced by compression molding under conditions of a press pressure of 100 MPa and a mold temperature of 175 ° C. did.
Subsequently, the bending strength of the obtained test piece was measured according to ISO 178. The results are shown in Table 1.
各実施例の金属樹脂複合材料と各比較例の金属樹脂複合材料とはその比重が大きく異ならないことから、複合材料中の銀粒子の含有量としては、ほぼ同水準であるといえる。しかしながら、各実施例と各比較例の曲げ強度を比較した際に、これらの強度には顕著な差が観察される。
これは、本発明の金属樹脂複合材料(メタルハイブリッドレジン)は金属と樹脂とが化学的結合を介して結合しているため、適度な密着性を発現し、ひいては高い機械的強度を達成できることを裏付けるものである。
Since the specific gravity of the metal resin composite material of each example and the metal resin composite material of each comparative example does not differ greatly, it can be said that the content of silver particles in the composite material is almost the same level. However, when the bending strengths of the examples and the comparative examples are compared, a remarkable difference is observed in these strengths.
This is because the metal-resin composite material (metal hybrid resin) of the present invention has a metal and a resin bonded through a chemical bond, so that it exhibits appropriate adhesion and can thus achieve high mechanical strength. It is to support.
本発明に係るメタルハイブリッドレジンは、金属粒子が樹脂に対して均一に分散され、高い機械的強度を発現することができることから、幅広い用途への展開が期待される。
また、有する導電性に着目し、導電材としても用いることができるし、熱伝導性に着目し、放熱材としても用いることができるものと期待される。
The metal hybrid resin according to the present invention is expected to be used in a wide range of applications because the metal particles are uniformly dispersed in the resin and can exhibit high mechanical strength.
In addition, it is expected that it can be used as a conductive material by paying attention to the conductivity, and can also be used as a heat dissipation material, paying attention to thermal conductivity.
この出願は、2015年2月27日に出願された日本出願特願2015-038557号を基礎とする優先権を主張し、その開示の全てをここに取り込む。 This application claims priority based on Japanese Patent Application No. 2015-038557 filed on February 27, 2015, the entire disclosure of which is incorporated herein.
Claims (12)
(B)前記フェノール樹脂中の酸素原子に配位した金属原子により構成される金属粒子と、を含むメタルハイブリッドレジン。 (A) a phenolic resin;
(B) A metal hybrid resin comprising metal particles composed of metal atoms coordinated to oxygen atoms in the phenol resin.
(b)(B')金属塩の溶液を準備する工程と、
(c)前記(A)フェノール樹脂と、前記(B')金属塩の溶液とを混合し、金属原子を前記(A)フェノール樹脂中の酸素原子に配位させて、メタルハイブリッドレジンを得る工程と、
を含むメタルハイブリッドレジンの製造方法。 (A) (A) a step of preparing a phenol resin;
(B) (B ′) preparing a metal salt solution;
(C) A step of mixing the (A) phenol resin and the (B ′) metal salt solution to coordinate a metal atom to an oxygen atom in the (A) phenol resin to obtain a metal hybrid resin. When,
A method for producing a metal hybrid resin containing
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| JP2017502307A JP6706804B2 (en) | 2015-02-27 | 2016-02-18 | Metal hybrid resin and manufacturing method thereof |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5440898A (en) * | 1977-09-06 | 1979-03-31 | Mead Corp | Preparation of novel metallimproved novolak resin* and application to pressureesensitive paper |
| JP2006193640A (en) * | 2005-01-14 | 2006-07-27 | Showa Highpolymer Co Ltd | Phenolic resin composition and highly water-resistant phenolic resin cured product using the same |
| JP2014523468A (en) * | 2011-06-30 | 2014-09-11 | コーネル ユニバーシティ | Hybrid materials and nanocomposite materials, methods for making them, and uses thereof |
| WO2016009754A1 (en) * | 2014-07-14 | 2016-01-21 | 住友ベークライト株式会社 | Method for manufacturing electroconductive resin, electroconductive resin, electroconductive paste, and electronic member |
-
2016
- 2016-02-18 WO PCT/JP2016/054660 patent/WO2016136571A1/en not_active Ceased
- 2016-02-18 JP JP2017502307A patent/JP6706804B2/en not_active Expired - Fee Related
- 2016-02-24 TW TW105105365A patent/TW201704331A/en unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5440898A (en) * | 1977-09-06 | 1979-03-31 | Mead Corp | Preparation of novel metallimproved novolak resin* and application to pressureesensitive paper |
| JP2006193640A (en) * | 2005-01-14 | 2006-07-27 | Showa Highpolymer Co Ltd | Phenolic resin composition and highly water-resistant phenolic resin cured product using the same |
| JP2014523468A (en) * | 2011-06-30 | 2014-09-11 | コーネル ユニバーシティ | Hybrid materials and nanocomposite materials, methods for making them, and uses thereof |
| WO2016009754A1 (en) * | 2014-07-14 | 2016-01-21 | 住友ベークライト株式会社 | Method for manufacturing electroconductive resin, electroconductive resin, electroconductive paste, and electronic member |
Non-Patent Citations (1)
| Title |
|---|
| ZHI, L. ET AL.: "Preparation of phenolic resin/silver nanocomposites via in situ reduction", SCRIPTA MATERIALIA, vol. 47, 2002, pages 875 - 879, ISSN: 1359-6462 * |
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