WO2016117298A1 - Crystalline polymorphism of inclusion compound, curable composition containing same, and cured product - Google Patents
Crystalline polymorphism of inclusion compound, curable composition containing same, and cured product Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D233/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
- C07D233/54—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members
- C07D233/56—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, attached to ring carbon atoms
- C07D233/58—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, attached to ring carbon atoms with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, attached to ring nitrogen atoms
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
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- C—CHEMISTRY; METALLURGY
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- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C65/00—Compounds having carboxyl groups bound to carbon atoms of six—membered aromatic rings and containing any of the groups OH, O—metal, —CHO, keto, ether, groups, groups, or groups
- C07C65/01—Compounds having carboxyl groups bound to carbon atoms of six—membered aromatic rings and containing any of the groups OH, O—metal, —CHO, keto, ether, groups, groups, or groups containing hydroxy or O-metal groups
- C07C65/03—Compounds having carboxyl groups bound to carbon atoms of six—membered aromatic rings and containing any of the groups OH, O—metal, —CHO, keto, ether, groups, groups, or groups containing hydroxy or O-metal groups monocyclic and having all hydroxy or O-metal groups bound to the ring
Definitions
- An object of the present invention is to provide a novel crystal polymorph of an inclusion compound of 5-hydroxyisophthalic acid and 2-ethyl-4-methylimidazole.
- crystal clathrate compound a new clathrate compound (hereinafter, referred to as “crystal clathrate compound”) is obtained by recrystallizing a conventional clathrate compound (hereinafter sometimes abbreviated as crystal A).
- crystal A a conventional clathrate compound
- the present invention (1) Powder X-ray diffraction measured by CuK ⁇ rays, which is a crystalline polymorph of an inclusion compound (molar ratio 1: 1) consisting of 5-hydroxyisophthalic acid and 2-ethyl-4-methylimidazole In the pattern at diffraction angles (2 ⁇ ) of 14.68 °, 16.96 °, 20.36 °, 23.48 °, 25.92 °, 26.52 °, 27.84 ° and 29.56 °.
- a polymorph with crystallographic peaks (2) In powder X-ray diffraction patterns measured with CuK ⁇ rays, diffraction angles of 16.32 °, 18.56 °, 21.84 °, 22.52 °, 23.84 ° and 27.56 ° ( (1) includes a step of recrystallizing a crystal of an inclusion compound (molar ratio 1: 1) comprising 5-hydroxyisophthalic acid and 2-ethyl-4-methylimidazole having a diffraction peak at 2 ⁇ ).
- the present invention relates to a method for producing a crystalline polymorph according to (1), which comprises a step of crystallizing an inclusion compound (molar ratio 1: 1) comprising methylimidazole.
- the crystal B of the present invention can be obtained, for example, by recrystallizing the crystal A obtained by the method described in Patent Document 2 in a solvent. Crystal A or the like may be completely dissolved in a solvent, or a solution obtained by partially dissolving the crystal A may be used.
- Preferred examples of the solvent used for recrystallization include alcohols having 1 to 4 carbon atoms. Specific examples of such alcohols include methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, 2 -Methyl-1-propanol, 2-butanol, 2-methyl-2-propanol and the like can be exemplified, and methanol can be preferably exemplified.
- the temperature at which the crystals A and the like are dissolved is not particularly limited and may be any temperature as long as it is in the range of room temperature to the boiling point of the solvent.
- the method of recrystallization is not particularly limited, and specifically, a method of dissolving by heating and then cooling, a method of dissolving in a solvent and gradually distilling off the solvent to precipitate crystals, Examples thereof include a method of adding a poor solvent, a method of combining these, and the like. Among them, a method of precipitating crystals by gradually distilling the solvent to a saturation concentration or less after dissolving the crystals is preferable. After the crystals are precipitated, the target crystals B are obtained by filtering and drying.
- an epoxy resin having two or more epoxy groups in one molecule (hereinafter also referred to as “polyfunctional epoxy resin”) is preferably used.
- the epoxy resin means a prepolymer before curing, and includes monomers and oligomers.
- the curable composition of the present invention and the cured product thereof are used in applications such as adhesives, semiconductor encapsulants, laminated boards for printed wiring boards, varnishes, powder paints, casting materials, inks, fiber reinforced composite materials, etc. It can be preferably used.
- the cured product can be obtained by heat-treating the curable composition, and examples thereof include a cured film obtained by painting or coating the composition on a substrate.
- the heat treatment can be performed at 50 to 250 ° C. for 15 minutes to 50 hours, preferably at 60 to 200 ° C. for 2 to 24 hours.
- the composition can be painted or coated by a known method.
- thermogravimetric measurement device product name: TGA-DSC1, manufactured by METTLER TOLEDO
- nitrogen flow rate 50 mL / min nitrogen flow rate 50 mL / min
- the XRD and TG-DSC of the clathrate compound obtained in Example 1 were measured, and the results are shown in FIGS. 1 and 2, respectively.
- the clathrate compound has diffraction angles (2 ⁇ ) of 14.68 °, 16.96 °, 20.36 °, 23.48 °, 25.92 °, 26.52 °, 27.84 ° and It was found to be a crystal polymorph (crystal B) having a characteristic diffraction peak at 29.56 °.
- the release temperature of 2E4MZ was found to be 189 ° C.
- the same measurement results were obtained for Examples 2 to 5.
- the crystal was subjected to X-ray structural analysis to identify its three-dimensional structure.
- the obtained crystal data is shown in Table 2, and the three-dimensional arrangement of crystals drawn based on the crystal data is shown in FIG.
- Example 6 To the flask, 11.3 g (103 mmol) of 2E4MZ and 40 ml of methanol were added and stirred. 18.7 g (103 mmol) of HIPA was added thereto, and the mixture was refluxed with heating for 3 hours while stirring. After cooling, filtration and drying were performed to obtain 24.3 g of an inclusion compound at a recovery rate of 81%. The XRD and TG-DSC of the resulting clathrate were measured, and the same results as in Example 1 were obtained.
- Example 7 In a beaker, 30 g (0.1 mol) of the clathrate crystal obtained in Comparative Example 1 and 40 ml of methanol were added, and the crystal was completely dissolved while heating. Thereafter, the mixture was cooled to room temperature, crystals were precipitated and filtered to obtain 25 g of an inclusion compound at a recovery rate of 83%. The XRD and TG-DSC of the resulting clathrate were measured, and the same results as in Example 1 were obtained.
- Example 8 In a beaker, 30 g (0.1 mol) of the clathrate crystal obtained in Comparative Example 1 and 240 ml of methanol were added to completely dissolve the crystal. The mixture was allowed to stand at room temperature as it was, methanol was slowly evaporated, and crystals were precipitated to obtain clathrate compound crystals (crystal B). The XRD and TG-DSC of the resulting clathrate were measured, and the same results as in Example 1 were obtained.
- Example 9 In a beaker, 3.04 g (16.7 mmol) of HIPA, 1.84 g (16.7 mmol) of 2E4MZ and methanol were added to completely dissolve the crystals. The mixture was allowed to stand at room temperature under open conditions, methanol was slowly evaporated, crystals were precipitated, and filtered to obtain an inclusion compound. The XRD and TG-DSC of the resulting clathrate were measured, and the same results as in Example 1 were obtained.
- the obtained epoxy resin composition was stored at 40 ° C., and the storage stability was evaluated by measuring the number of days until the solidification was visually confirmed. The results are shown in Table 5. Furthermore, the DSC of the epoxy resin composition was measured. Table 5 shows the curing start temperature and the peak temperature of the reaction heat, and FIG. 7 shows the DSC chart.
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Abstract
Description
本発明は、包接化合物の新規な結晶多形と、それを含有する硬化性組成物、及び硬化物に関する。本願は、2015年1月19日に出願された日本国特許出願第2015-8063号に対し優先権を主張し、その内容をここに援用する。 The present invention relates to a novel crystal polymorph of an inclusion compound, a curable composition containing the same, and a cured product. This application claims priority to Japanese Patent Application No. 2015-8063 filed on January 19, 2015, the contents of which are incorporated herein by reference.
エポキシ樹脂は、その硬化物が、機械的特性、電気的特性、及び熱的特性等の点で優れた性能を有することから、塗料、電子材料、接着剤等の幅広い用途に利用されている。 Epoxy resins are used in a wide range of applications such as paints, electronic materials, adhesives and the like because their cured products have excellent performance in terms of mechanical properties, electrical properties, thermal properties, and the like.
近年、特に電子材料用途において、室温以下における保存安定性と短時間硬化性を両立した一液性の硬化組成物が求められていることから、エポキシ樹脂に混合する潜在性硬化剤又は潜在性硬化促進剤が各種開発されている。 In recent years, especially in electronic materials, there is a need for a one-component curing composition that achieves both storage stability at room temperature and below and short-term curing, so a latent curing agent or latent curing mixed with an epoxy resin is required. Various accelerators have been developed.
例えば、特許文献1には、硬化触媒としてイソフタル酸化合物とイミダゾール化合物とを少なくとも含む包接化合物を用いると、エポキシ樹脂組成物の低温での硬化を抑制して一液安定性が向上すると共に、加熱処理により効果的に樹脂が硬化することが記載されている。
For example, in
また、特許文献2には、プリプレグ用エポキシ樹脂組成物の硬化触媒として、5-ヒドロキシイソフタル酸(以下、HIPAと略すことがある)と2-エチル-4-メチルイミダゾール(以下、2E4MZと略すことがある)が1:1のモル比で包接された包接化合物が例示されている。
Further,
上記特許文献で得られるいずれの包接化合物も結晶多形に関する記載はなく、また、前記包接化合物を含むエポキシ樹脂組成物の保存安定性が十分なものではなかった。本発明は、5-ヒドロキシイソフタル酸と2-エチル-4-メチルイミダゾールとの包接化合物の新規な結晶多形を提供することを課題とする。 None of the clathrate compounds obtained in the above-mentioned patent documents describes the crystal polymorphism, and the storage stability of the epoxy resin composition containing the clathrate compound was not sufficient. An object of the present invention is to provide a novel crystal polymorph of an inclusion compound of 5-hydroxyisophthalic acid and 2-ethyl-4-methylimidazole.
本発明者らは、上記課題を解決すべく鋭意検討を行った結果、従来の包接化合物(以下、結晶Aと略すことがある)を再結晶することにより得られる新しい包接化合物(以下、結晶Bと略すことがある)が、より一液安定性に優れるエポキシ樹脂組成物を与えることを見出し、本発明を完成するに至った。 As a result of intensive studies to solve the above problems, the present inventors have found that a new clathrate compound (hereinafter, referred to as “crystal clathrate compound”) is obtained by recrystallizing a conventional clathrate compound (hereinafter sometimes abbreviated as crystal A). Has been found to give an epoxy resin composition having more excellent one-component stability, and has led to the completion of the present invention.
すなわち本発明は、
(1)5-ヒドロキシイソフタル酸と、2-エチル-4-メチルイミダゾールとからなる包接化合物(モル比1:1)の結晶多形であって、CuKα線にて測定される粉末X線回折パターンにおいて、14.68°、16.96°、20.36°、23.48°、25.92°、26.52°、27.84°および29.56°の回折角(2θ)に回析ピークを有する結晶多形、
(2)CuKα線にて測定される粉末X線回折パターンにおいて、16.32°、18.56°、21.84°、22.52°、23.84°および27.56°の回折角(2θ)に回析ピークを有する、5-ヒドロキシイソフタル酸と2-エチル-4-メチルイミダゾールとからなる包接化合物(モル比1:1)の結晶を、再結晶する工程を含む(1)に記載の結晶多形の製造方法、及び
(3)5-ヒドロキシイソフタル酸と2-エチル-4-メチルイミダゾールとを含むアルコール溶液又は懸濁液から、5-ヒドロキシイソフタル酸と2-エチル-4-メチルイミダゾールとからなる包接化合物(モル比1:1)を晶析させる工程を含む(1)に記載の結晶多形の製造方法に関する。
That is, the present invention
(1) Powder X-ray diffraction measured by CuKα rays, which is a crystalline polymorph of an inclusion compound (molar ratio 1: 1) consisting of 5-hydroxyisophthalic acid and 2-ethyl-4-methylimidazole In the pattern at diffraction angles (2θ) of 14.68 °, 16.96 °, 20.36 °, 23.48 °, 25.92 °, 26.52 °, 27.84 ° and 29.56 °. A polymorph with crystallographic peaks,
(2) In powder X-ray diffraction patterns measured with CuKα rays, diffraction angles of 16.32 °, 18.56 °, 21.84 °, 22.52 °, 23.84 ° and 27.56 ° ( (1) includes a step of recrystallizing a crystal of an inclusion compound (molar ratio 1: 1) comprising 5-hydroxyisophthalic acid and 2-ethyl-4-methylimidazole having a diffraction peak at 2θ). And (3) from an alcohol solution or suspension containing 5-hydroxyisophthalic acid and 2-ethyl-4-methylimidazole, 5-hydroxyisophthalic acid and 2-ethyl-4- The present invention relates to a method for producing a crystalline polymorph according to (1), which comprises a step of crystallizing an inclusion compound (molar ratio 1: 1) comprising methylimidazole.
さらに、
(4)(1)に記載の結晶多形を含有する、エポキシ樹脂用硬化剤又はエポキシ樹脂用硬化促進剤、及び
(5)エポキシ樹脂と(4)に記載のエポキシ樹脂用硬化剤又はエポキシ樹脂用硬化促進剤とを含有する硬化性組成物、及びその硬化物に関する。
further,
(4) Curing agent for epoxy resin or curing accelerator for epoxy resin containing the crystal polymorph as described in (1), and (5) Epoxy resin and curing agent for epoxy resin or epoxy resin as described in (4) The present invention relates to a curable composition containing a curing accelerator and a cured product thereof.
本発明のHIPAと2E4MZとからなる包接化合物は新規の結晶多形であり、本発明の包接化合物を含むエポキシ樹脂組成物は、従来の包接化合物を含むエポキシ樹脂組成物と比して、一液安定性の点で優れている。 The clathrate compound comprising HIPA and 2E4MZ of the present invention is a novel crystalline polymorph, and the epoxy resin composition containing the clathrate compound of the present invention is compared with the epoxy resin composition containing the conventional clathrate compound. In terms of one-component stability.
本発明のHIPAと2E4MZとからなる包接化合物(HIPA:2E4MZがモル比で1:1)は、粉末X線回折において回折角(2θ)14.68°、16.96°、20.36°、23.48°、25.92°、26.52°、27.84°および29.56°にピークを有する結晶多形である。 The inclusion compound comprising HIPA of the present invention and 2E4MZ (HIPA: 2E4MZ is 1: 1 in molar ratio) has diffraction angles (2θ) of 14.68 °, 16.96 °, 20.36 ° in powder X-ray diffraction. , 23.48 °, 25.92 °, 26.52 °, 27.84 ° and 29.56 °.
ここで包接化合物とは、単独で安定に存在することのできる2種以上の化学種により構成される化合物で、そのうちの一方の化学種が分子規模の空間をつくり、その空間に形状と寸法が適合することを第一要件として、他方の化学種を取り込む(包接する)ことにより特定の結晶構造をなしている化合物である。空間を提供する側の化学種をホスト、包接される側の化学種をゲストと言う。ホストとゲスト間は、水素結合、ファンデルワールス力、イオン結合等の共有結合以外の相互作用により結合している。イオン結合性の包接化合物であれば、イオン結晶、塩構造を形成しているとも言える。 Here, an inclusion compound is a compound composed of two or more chemical species that can exist stably alone, and one of these chemical species creates a molecular-scale space, and the shape and dimensions in that space. Is a compound having a specific crystal structure by incorporating (inclusion) the other chemical species with the first requirement that The chemical species on the side that provides the space is called the host, and the chemical species on the side of the inclusion is called the guest. The host and guest are bonded by an interaction other than a covalent bond such as a hydrogen bond, van der Waals force, or ionic bond. It can be said that an ionic crystal or salt structure is formed in the case of an ion-binding clathrate compound.
本発明の結晶Bは、例えば、特許文献2に記載の方法で得られた結晶Aを溶媒に溶解させて再結晶することで得ることができる。結晶A等は、溶媒に完全に溶解させてもよいし、一部溶解させた後、ろ過した溶液を用いてもよい。再結晶に用いる溶媒として、好ましくは炭素数1~4のアルコールを例示することができ、そのようなアルコールとして具体的には、メタノール、エタノール、1-プロパノール、2-プロパノール、1-ブタノール、2-メチル-1-プロパノール、2-ブタノール、2-メチル-2-プロパノール等を例示することができ、中でもメタノールを好ましく例示することができる。結晶A等を溶解させる温度は、特に制限がなく、室温から溶媒の沸点の範囲であれば、どのような温度であってもかまわない。再結晶の方法は、特に制限されないが、具体的には、加熱して溶解させその後冷却する方法、溶媒に溶解させ徐々に溶媒を留去させて結晶を析出させる方法、溶液に対して結晶の貧溶媒を添加する方法、又はこれらの組み合わせた方法等を例示することができ、中でも結晶を溶解後、徐々に溶媒を飽和濃度以下に留去して結晶を析出させる方法が好ましい。結晶を析出させた後、ろ過して乾燥することにより、目的とする結晶Bが得られる。
The crystal B of the present invention can be obtained, for example, by recrystallizing the crystal A obtained by the method described in
また、本発明の結晶Bは、約1モルのHIPAと約1モルの2E4MZとを溶媒に混合し、加熱した後冷却することにより、晶析させて得ることもできる。晶析に用いる溶媒として、上記に例示した炭素数1~4のアルコールが挙げられ、中でもメタノールが特に好ましい。HIPAと2E4MZは溶媒に溶解又は懸濁するが、両方とも溶媒に溶解することが好ましい。溶媒に溶解する場合、その全量が溶媒に溶解する必要はなく、少なくともごく一部が溶媒に溶解すればよい。
HIPAと2E4MZと溶媒とを混合する方法は、特に制限されないが、溶媒にHIPAと2E4MZを同時に加えてもよく、HIPAと溶媒との混合物に2E4MZを加えてもよく、さらに溶媒と2E4MZとの混合物にHIPAを加えてもよい。中でもHIPAと溶媒の混合物に、前記溶媒に溶解した2E4MZ溶液を滴下しながら加える方法が好ましい。加熱温度は、用いる溶媒の沸点付近であればよく、加熱還流させることが好ましい。加熱は、HIPAと2E4MZと溶媒とを混合する時点から行っても、混合後から行ってもよい。
加熱した後の工程は、単に加熱を止めることにより結晶を析出させてもよいが、加熱した後に室温で一晩放置することが好ましい。結晶を析出させた後、ろ過して乾燥することにより、目的とする結晶Bが得られる。
The crystal B of the present invention can also be obtained by crystallization by mixing about 1 mol of HIPA and about 1 mol of 2E4MZ in a solvent, heating and then cooling. Examples of the solvent used for crystallization include alcohols having 1 to 4 carbon atoms exemplified above, and methanol is particularly preferable. HIPA and 2E4MZ are dissolved or suspended in a solvent, but both are preferably dissolved in the solvent. When dissolved in a solvent, the entire amount does not need to be dissolved in the solvent, and at least a part of the amount only needs to be dissolved in the solvent.
The method of mixing HIPA, 2E4MZ and the solvent is not particularly limited, but HIPA and 2E4MZ may be added simultaneously to the solvent, 2E4MZ may be added to the mixture of HIPA and the solvent, and a mixture of the solvent and 2E4MZ. HIPA may be added. Among them, a method of adding a 2E4MZ solution dissolved in the above solvent dropwise to a mixture of HIPA and a solvent is preferable. The heating temperature may be around the boiling point of the solvent to be used, and it is preferably heated to reflux. Heating may be performed from the time of mixing HIPA, 2E4MZ, and the solvent, or after mixing.
In the step after heating, crystals may be precipitated by simply stopping the heating, but it is preferable to leave at room temperature overnight after heating. After the crystals are precipitated, the target crystals B are obtained by filtering and drying.
得られる包接化合物の構造は、NMR、固体NMRスペクトル、赤外吸収スペクトル(IR)、マススペクトル、X線回折(XRD)パターン、X線構造解析等公知の分析手段により確認することができる。また、得られる包接化合物の組成は、熱分析、1H-NMRスペクトル、高速液体クロマトグラフィー(HPLC)、TG-DSC、元素分析等により確認することができる。 The structure of the clathrate compound obtained can be confirmed by known analytical means such as NMR, solid NMR spectrum, infrared absorption spectrum (IR), mass spectrum, X-ray diffraction (XRD) pattern, X-ray structure analysis. The composition of the clathrate compound obtained can be confirmed by thermal analysis, 1H-NMR spectrum, high performance liquid chromatography (HPLC), TG-DSC, elemental analysis or the like.
本発明の硬化性組成物は、エポキシ樹脂と、硬化剤又は硬化促進剤としての結晶Bとを含む組成物である。 The curable composition of the present invention is a composition containing an epoxy resin and crystal B as a curing agent or a curing accelerator.
エポキシ樹脂としては、1分子中に2個以上のエポキシ基を有するエポキシ樹脂(以下、「多官能エポキシ樹脂」ともいう)を用いることが好ましい。ここでエポキシ樹脂とは、硬化前のプレポリマーを意味し、モノマー及びオリゴマーを含む。
具体的には、
フェノール、クレゾール、キシレノール、レゾルシン、カテコール、ビスフェノールA、ビスフェノールF等のフェノール化合物及びα-ナフトール、β-ナフトール、ジヒドロキシナフタレン等のナフトール化合物からなる群より選ばれる少なくとも1種のフェノール性化合物と、ホルムアルデヒド、アセトアルデヒド、プロピオンアルデヒド等の脂肪族アルデヒド化合物とを酸性触媒下で縮合又は共縮合させて得られるノボラック樹脂をエポキシ化した、フェノールノボラック型エポキシ樹脂、オルソクレゾールノボラック型エポキシ樹脂等のノボラック型エポキシ樹脂;
上記フェノール性化合物と、ベンズアルデヒド、サリチルアルデヒド等の芳香族アルデヒド化合物とを酸性触媒下で縮合又は共縮合させて得られるトリフェニルメタン型フェノール樹脂をエポキシ化したトリフェニルメタン型エポキシ樹脂;
上記フェノール化合物及びナフトール化合物と、アルデヒド化合物とを酸性触媒下で共縮合させて得られるノボラック樹脂をエポキシ化した共重合型エポキシ樹脂;
ビスフェノールA、ビスフェノールF等のジグリシジルエーテルであるジフェニルメタン型エポキシ樹脂;
アルキル置換又は非置換のビフェノールのジグリシジルエーテルであるビフェニル型エポキシ樹脂;
スチルベン系フェノール化合物のジグリシジルエーテルであるスチルベン型エポキシ樹脂;
ビスフェノールS等のジグリシジルエーテルである硫黄原子含有エポキシ樹脂;
ブタンジオール、ポリエチレングリコール、ポリプロピレングリコール等のアルコール類のグリシジルエーテルであるエポキシ樹脂;
フタル酸、イソフタル酸、テトラヒドロフタル酸等の多価カルボン酸化合物のグリシジルエステル型エポキシ樹脂;
アニリン、ジアミノジフェニルメタン、イソシアヌル酸等の窒素原子に結合した活性水素をグリシジル基で置換したグリシジルアミン型エポキシ樹脂;
ジシクロペンタジエンとフェノール化合物の共縮合樹脂をエポキシ化したジシクロペンタジエン型エポキシ樹脂;
分子内のオレフィン結合をエポキシ化して得られるビニルシクロヘキセンジエポキシド、3,4-エポキシシクロヘキシルメチル-3,4-エポキシシクロヘキサンカルボキシレート、2-(3,4-エポキシ)シクロヘキシル-5,5-スピロ(3,4-エポキシ)シクロヘキサン-m-ジオキサン等の脂環型エポキシ樹脂;
パラキシリレン変性フェノール樹脂のグリシジルエーテル;
メタキシリレン変性フェノール樹脂のグリシジルエーテル;
テルペン変性フェノール樹脂のグリシジルエーテル;
ジシクロペンタジエン変性フェノール樹脂のグリシジルエーテル;
シクロペンタジエン変性フェノール樹脂のグリシジルエーテル;
多環芳香環変性フェノール樹脂のグリシジルエーテル;
ナフタレン環含有フェノール樹脂のグリシジルエーテルであるナフタレン型エポキシ樹脂;
ハロゲン化フェノールノボラック型エポキシ樹脂;
ハイドロキノン型エポキシ樹脂;
トリメチロールプロパン型エポキシ樹脂;
オレフィン結合を過酢酸等の過酸で酸化して得られる線状脂肪族エポキシ樹脂;
ジフェニルメタン型エポキシ樹脂;
フェノールアラルキル樹脂、ナフトールアラルキル樹脂等のアラルキル型フェノール樹脂のエポキシ化物であるアラルキル型エポキシ樹脂;など
が挙げられる。これらは単独で用いても2種以上を組み合わせて用いてもよい。
As the epoxy resin, an epoxy resin having two or more epoxy groups in one molecule (hereinafter also referred to as “polyfunctional epoxy resin”) is preferably used. Here, the epoxy resin means a prepolymer before curing, and includes monomers and oligomers.
In particular,
At least one phenolic compound selected from the group consisting of phenol compounds such as phenol, cresol, xylenol, resorcin, catechol, bisphenol A, bisphenol F, and naphthol compounds such as α-naphthol, β-naphthol, and dihydroxynaphthalene; Novolak type epoxy resins such as phenol novolak type epoxy resins and orthocresol novolak type epoxy resins obtained by epoxidizing novolak resins obtained by condensation or cocondensation with aliphatic aldehyde compounds such as acetaldehyde and propionaldehyde in the presence of an acidic catalyst ;
A triphenylmethane type epoxy resin obtained by epoxidizing a triphenylmethane type phenol resin obtained by condensation or cocondensation of the phenolic compound with an aromatic aldehyde compound such as benzaldehyde or salicylaldehyde under an acidic catalyst;
A copolymerization type epoxy resin obtained by epoxidizing a novolak resin obtained by cocondensation of the above phenol compound and naphthol compound with an aldehyde compound under an acidic catalyst;
Diphenylmethane type epoxy resins which are diglycidyl ethers such as bisphenol A and bisphenol F;
A biphenyl type epoxy resin which is a diglycidyl ether of an alkyl-substituted or unsubstituted biphenol;
A stilbene type epoxy resin which is a diglycidyl ether of a stilbene phenol compound;
A sulfur atom-containing epoxy resin which is a diglycidyl ether such as bisphenol S;
Epoxy resins that are glycidyl ethers of alcohols such as butanediol, polyethylene glycol, polypropylene glycol;
Glycidyl ester type epoxy resin of polyvalent carboxylic acid compounds such as phthalic acid, isophthalic acid and tetrahydrophthalic acid;
A glycidylamine type epoxy resin in which active hydrogen bonded to a nitrogen atom such as aniline, diaminodiphenylmethane, isocyanuric acid or the like is substituted with a glycidyl group;
A dicyclopentadiene type epoxy resin obtained by epoxidizing a co-condensation resin of dicyclopentadiene and a phenol compound;
Vinylcyclohexene diepoxide obtained by epoxidizing an olefin bond in the molecule, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 2- (3,4-epoxy) cyclohexyl-5,5-spiro ( 3,4-epoxy) cycloaliphatic epoxy resins such as cyclohexane-m-dioxane;
Glycidyl ether of paraxylylene-modified phenolic resin;
Glycidyl ether of metaxylylene-modified phenolic resin;
Glycidyl ether of terpene-modified phenolic resin;
Glycidyl ether of dicyclopentadiene-modified phenolic resin;
Glycidyl ether of cyclopentadiene modified phenolic resin;
Glycidyl ether of polycyclic aromatic ring-modified phenolic resin;
A naphthalene type epoxy resin which is a glycidyl ether of a naphthalene ring-containing phenol resin;
Halogenated phenol novolac epoxy resin;
Hydroquinone type epoxy resin;
Trimethylolpropane type epoxy resin;
A linear aliphatic epoxy resin obtained by oxidizing an olefinic bond with a peracid such as peracetic acid;
Diphenylmethane type epoxy resin;
And an aralkyl type epoxy resin which is an epoxidized product of an aralkyl type phenol resin such as a phenol aralkyl resin and a naphthol aralkyl resin. These may be used alone or in combination of two or more.
本発明の硬化性組成物に含まれる結晶Bの配合割合は、結晶に含まれる2E4MZに換算して、2E4MZがエポキシ樹脂組成物中に通常含まれる量と同じ量が含まれていればよく、具体的には、組成物中に含まれるエポキシ樹脂100重量部に対して、0.1~10重量部の範囲が好ましく、さらに1~5重量部の範囲が好ましい。 The blending ratio of the crystal B contained in the curable composition of the present invention may be the same as the amount that 2E4MZ is normally contained in the epoxy resin composition in terms of 2E4MZ contained in the crystal, Specifically, the range of 0.1 to 10 parts by weight is preferable with respect to 100 parts by weight of the epoxy resin contained in the composition, and the range of 1 to 5 parts by weight is more preferable.
本発明の硬化性組成物は、必要に応じて、他の硬化剤、他の硬化促進剤、可塑剤、有機溶剤、反応性希釈剤、増量剤、充填剤、補強剤、顔料、難燃化剤、増粘剤及び離型剤など種々の添加剤を配合することができる。 If necessary, the curable composition of the present invention may contain other curing agents, other curing accelerators, plasticizers, organic solvents, reactive diluents, extenders, fillers, reinforcing agents, pigments, flame retardants. Various additives such as an agent, a thickener and a release agent can be blended.
本発明の硬化性組成物及びその硬化物は、例えば、接着剤、半導体封止材、プリント配線板用積層板、ワニス、粉体塗料、注型材料、インク、繊維強化複合材料等の用途に好適に使用することができる。 The curable composition of the present invention and the cured product thereof are used in applications such as adhesives, semiconductor encapsulants, laminated boards for printed wiring boards, varnishes, powder paints, casting materials, inks, fiber reinforced composite materials, etc. It can be preferably used.
本発明の硬化性組成物は、エポキシ樹脂と結晶Bと必要に応じて配合される添加剤とを、直接混合するか、あるいは溶媒中で混合することにより得ることができる。十分な混合状態が形成されるよう、60~100℃程度に加熱して混合を行ってもよい。混合手段は特に限定されないが、例えば、遊星式撹拌装置、押出機、ホモジナイザー、メカノケミカル撹拌機、2本ロール、バンバリーミキサー等が好適に用いられる。 The curable composition of the present invention can be obtained by directly mixing the epoxy resin, the crystal B, and an additive blended as necessary, or mixing them in a solvent. Mixing may be performed by heating to about 60 to 100 ° C. so that a sufficient mixed state is formed. The mixing means is not particularly limited, and for example, a planetary stirrer, an extruder, a homogenizer, a mechanochemical stirrer, two rolls, a Banbury mixer and the like are preferably used.
硬化物は、硬化性組成物を加熱処理することによって得ることができ、例えば、前記組成物を基材に塗装やコーティングすることにより得られる硬化膜等があげられる。加熱処理は、50℃~250℃で15分間~50時間、好ましくは60℃~200℃で2時間~24時間で行うことができる。前記組成物の塗装またはコーティングは公知の方法により行うことができる。 The cured product can be obtained by heat-treating the curable composition, and examples thereof include a cured film obtained by painting or coating the composition on a substrate. The heat treatment can be performed at 50 to 250 ° C. for 15 minutes to 50 hours, preferably at 60 to 200 ° C. for 2 to 24 hours. The composition can be painted or coated by a known method.
以下、実施例を示して本発明を詳細に説明するが、本発明は、実施例に限定されるものではない。 Hereinafter, the present invention will be described in detail with reference to examples, but the present invention is not limited to the examples.
[分析方法]
<粉末X線回折(XRD)>
結晶をガラス試験板の試料充填部に充填し、粉末X線回折装置(Ultima IV、株式会社リガク製)を用いて、以下の条件で測定を行った。
X線源 :Cu、40kV-40mA
測定方法:集中法
フィルター:Kβフィルター
スキャン速度:5°/分
<X線結晶構造解析>
結晶AのX線結晶構造解析は、イメージングプレート単結晶X線構造解析装置(R-AXIS RAPID、株式会社リガク製)を用いて、X線源CuKα(λ=0.71075Å)、-150℃にて測定を行った。
結晶BのX線結晶構造解析は、デスクトップ単結晶X線構造解析装置(XtaLAB mini、株式会社リガク製)を用いて、X線源CuKα(λ=0.71073Å)、30-100℃にて測定を行った。
[Analysis method]
<Powder X-ray diffraction (XRD)>
The crystal was filled in the sample filling portion of the glass test plate, and measurement was performed under the following conditions using a powder X-ray diffractometer (Ultima IV, manufactured by Rigaku Corporation).
X-ray source: Cu, 40 kV-40 mA
Measurement method: Concentration method Filter: Kβ filter Scan speed: 5 ° / min <X-ray crystal structure analysis>
X-ray crystal structure analysis of crystal A was performed using an imaging plate single crystal X-ray structure analyzer (R-AXIS RAPID, manufactured by Rigaku Corporation) at an X-ray source CuKα (λ = 0.71075 mm) at −150 ° C. And measured.
X-ray crystal structure analysis of crystal B was measured at 30-100 ° C. using an X-ray source CuKα (λ = 0.10773Å) using a desktop single crystal X-ray structure analyzer (XtaLAB mini, manufactured by Rigaku Corporation). Went.
<熱重量測定・示差走査熱量測定(TG-DSC)>
熱重量測定装置(製品名:TGA-DSC1、メトラー・トレド社製)を用いて、アルミ容器内に約3mgの結晶を設置し、窒素パージ下(窒素の流速50mL/分)昇温速度20℃/分、30~500℃の温度範囲で測定を行った。
<Thermogravimetry / Differential Scanning Calorimetry (TG-DSC)>
Using a thermogravimetric measurement device (product name: TGA-DSC1, manufactured by METTLER TOLEDO), about 3 mg of crystal was placed in an aluminum container, and under a nitrogen purge (
<示差走査熱量測定(DSC)>
示差走査熱量測定装置(製品名:DSC1、メトラー・トレド社製)を用いて、アルミ容器内に約8mgの結晶を設置し、窒素パージ下(窒素の流速50mL/分)昇温速度10℃/分、30℃~350℃の温度範囲で測定を行った。
<Differential scanning calorimetry (DSC)>
Using a differential scanning calorimeter (product name: DSC1, manufactured by METTLER TOLEDO), about 8 mg of crystal was placed in an aluminum container, and under a nitrogen purge (nitrogen flow rate: 50 mL / min) The measurement was carried out in the temperature range of 30 ° C. to 350 ° C. per minute.
[実施例1]~[実施例5]
フラスコに、3.04g(16.7mmol)のHIPAと表1に示す量の溶媒を加えて攪拌した。そこへ予め少量の溶媒に溶解させた1.84g(16.7mmol)の2E4MZ(製品名:2E4MZ、四国化成工業(株)製)を室温で滴下し、攪拌しながら加熱還流を3時間行った。冷却後、ろ過、乾燥を行い、モル比(HIPA:2E4MZ)=1:1の包接化合物を得た。
[Example 1] to [Example 5]
To the flask, 3.04 g (16.7 mmol) of HIPA and the amount of solvent shown in Table 1 were added and stirred. To this, 1.84 g (16.7 mmol) of 2E4MZ (product name: 2E4MZ, manufactured by Shikoku Kasei Kogyo Co., Ltd.) dissolved in a small amount of solvent in advance was added dropwise at room temperature, followed by heating and refluxing for 3 hours while stirring. . After cooling, filtration and drying were performed to obtain an inclusion compound having a molar ratio (HIPA: 2E4MZ) = 1: 1.
実施例1で得られた包接化合物のXRD及びTG-DSCを測定し、その結果を、図1および図2にそれぞれ示す。図1より前記包接化合物は、回折角(2θ):14.68°、16.96°、20.36°、23.48°、25.92°、26.52°、27.84°および29.56°に特徴的な回折ピークを有する結晶多形(結晶B)であることがわかった。また、2E4MZの放出温度は189℃であることがわかった。実施例2~5についても同じ測定結果を得た。前記結晶につきX線構造解析を行い、その立体構造を特定した。得られた結晶データを表2に、該結晶データに基づき作図した結晶の立体配置図を図3に示す。 The XRD and TG-DSC of the clathrate compound obtained in Example 1 were measured, and the results are shown in FIGS. 1 and 2, respectively. From FIG. 1, the clathrate compound has diffraction angles (2θ) of 14.68 °, 16.96 °, 20.36 °, 23.48 °, 25.92 °, 26.52 °, 27.84 ° and It was found to be a crystal polymorph (crystal B) having a characteristic diffraction peak at 29.56 °. The release temperature of 2E4MZ was found to be 189 ° C. The same measurement results were obtained for Examples 2 to 5. The crystal was subjected to X-ray structural analysis to identify its three-dimensional structure. The obtained crystal data is shown in Table 2, and the three-dimensional arrangement of crystals drawn based on the crystal data is shown in FIG.
[比較例1]
特許文献2に記載の方法に準じてHIPAと2E4MZの包接化合物を製造し、包接化合物を得た。得られた包接化合物のXRD及びTG-DSCを測定し、その結果を図4と図5にそれぞれ示す。図4より前記包接化合物は、回折角(2θ):16.32°、18.56°、21.84°、22.52°、23.84°および27.56°に特徴的な回折ピークを有する結晶多形(結晶A)であった。また、図5の結果より、2E4MZの放出温度は173℃であることがわかった。前記結晶につき、X線構造解析を行い、その立体構造を特定した。得られた結晶データを表3に、該結晶データに基づき作図した結晶の立体配置図を図6に示す。
以上の結果より、実施例1と比較例1で得られたそれぞれの包接化合物は異なる結晶多形であることがわかった。
[Comparative Example 1]
According to the method described in
From the above results, it was found that the clathrate compounds obtained in Example 1 and Comparative Example 1 were different crystal polymorphs.
[実施例6]
フラスコに、11.3g(103mmol)の2E4MZとメタノール40mlを加えて攪拌した。そこへ18.7g(103mmol)のHIPAを添加して、攪拌しながら加熱還流を3時間行った。冷却後、ろ過、乾燥を行い、24.3gの包接化合物を回収率81%で得た。得られた包接化合物のXRD及びTG-DSCを測定し、実施例1と同じ結果を得た。
[Example 6]
To the flask, 11.3 g (103 mmol) of 2E4MZ and 40 ml of methanol were added and stirred. 18.7 g (103 mmol) of HIPA was added thereto, and the mixture was refluxed with heating for 3 hours while stirring. After cooling, filtration and drying were performed to obtain 24.3 g of an inclusion compound at a recovery rate of 81%. The XRD and TG-DSC of the resulting clathrate were measured, and the same results as in Example 1 were obtained.
[実施例7]
ビーカーに、比較例1で得られた包接化合物の結晶30g(0.1mol)とメタノール40mlを加え、加熱をしながら完全に結晶を溶解させた。その後室温まで冷却し、結晶を析出、ろ過することで、25gの包接化合物を回収率83%で得た。得られた包接化合物のXRD及びTG-DSCを測定し、実施例1と同じ結果を得た。
[Example 7]
In a beaker, 30 g (0.1 mol) of the clathrate crystal obtained in Comparative Example 1 and 40 ml of methanol were added, and the crystal was completely dissolved while heating. Thereafter, the mixture was cooled to room temperature, crystals were precipitated and filtered to obtain 25 g of an inclusion compound at a recovery rate of 83%. The XRD and TG-DSC of the resulting clathrate were measured, and the same results as in Example 1 were obtained.
[実施例8]
ビーカーに、比較例1で得られた包接化合物の結晶30g(0.1mol)とメタノール240mlを加えて完全に結晶を溶解させた。そのまま室温で開放下静置し、メタノールをゆっくりと蒸発させ、結晶を析出することで、包接化合物の結晶(結晶B)を得た。得られた包接化合物のXRD及びTG-DSCを測定し、実施例1と同じ結果を得た。
[Example 8]
In a beaker, 30 g (0.1 mol) of the clathrate crystal obtained in Comparative Example 1 and 240 ml of methanol were added to completely dissolve the crystal. The mixture was allowed to stand at room temperature as it was, methanol was slowly evaporated, and crystals were precipitated to obtain clathrate compound crystals (crystal B). The XRD and TG-DSC of the resulting clathrate were measured, and the same results as in Example 1 were obtained.
[実施例9]
ビーカーに、3.04g(16.7mmol)のHIPA、1.84g(16.7mmol)の2E4MZ、及びメタノールを加えて完全に結晶を溶解させた。そのまま室温で開放下静置し、メタノールをゆっくりと蒸発させ、結晶を析出させ、ろ過することで、包接化合物を得た。得られた包接化合物のXRD及びTG-DSCを測定し、実施例1と同じ結果を得た。
[Example 9]
In a beaker, 3.04 g (16.7 mmol) of HIPA, 1.84 g (16.7 mmol) of 2E4MZ and methanol were added to completely dissolve the crystals. The mixture was allowed to stand at room temperature under open conditions, methanol was slowly evaporated, crystals were precipitated, and filtered to obtain an inclusion compound. The XRD and TG-DSC of the resulting clathrate were measured, and the same results as in Example 1 were obtained.
[実施例10]及び[比較例2]~[比較例3]
表4に示す配合割合で、エポキシ樹脂に硬化剤を2E4MZ換算でエポキシ樹脂に対して4phrになるように混合し、エポキシ樹脂組成物を得た。
[Example 10] and [Comparative Example 2] to [Comparative Example 3]
In the blending ratio shown in Table 4, a curing agent was mixed with the epoxy resin so as to be 4 phr with respect to the epoxy resin in terms of 2E4MZ to obtain an epoxy resin composition.
得られたエポキシ樹脂組成物を40℃で保存し、目視で固化を確認するまでの日数を測定することにより、保存安定性の評価を行った。その結果を表5に示す。さらに、前記エポキシ樹脂組成物のDSCを測定した。硬化開始温度と反応熱のピーク温度を表5に、DSCチャートを図7にそれぞれ示す。 The obtained epoxy resin composition was stored at 40 ° C., and the storage stability was evaluated by measuring the number of days until the solidification was visually confirmed. The results are shown in Table 5. Furthermore, the DSC of the epoxy resin composition was measured. Table 5 shows the curing start temperature and the peak temperature of the reaction heat, and FIG. 7 shows the DSC chart.
表5の結果から、結晶Bを硬化剤として用いると、結晶Aの包接化合物や2E4MZを用いる場合と比較して、エポキシ樹脂組成物の固化までの日数が延長されるともに硬化開始温度と反応熱のピーク温度が上昇することから、一液安定性が向上することがわかった。 From the results of Table 5, when crystal B is used as a curing agent, the number of days until solidification of the epoxy resin composition is extended and the curing start temperature and reaction are compared with the case where the inclusion compound of crystal A and 2E4MZ are used. Since the peak temperature of heat rose, it was found that the stability of one liquid was improved.
Claims (5)
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2007039449A (en) * | 2005-07-06 | 2007-02-15 | Nippon Soda Co Ltd | Inclusion compound, curing catalyst, cured resin-forming composition and cured resin |
| WO2008075427A1 (en) * | 2006-12-21 | 2008-06-26 | Nippon Soda Co., Ltd. | Clathrate compound, curing catalyst, composition for forming cured resin, and cured resin |
| JP2013213168A (en) * | 2012-04-04 | 2013-10-17 | Nippon Soda Co Ltd | Epoxy resin composition for prepreg |
| JP2014185115A (en) * | 2013-03-25 | 2014-10-02 | Nippon Soda Co Ltd | Novel inclusion compound |
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| JP2007039449A (en) * | 2005-07-06 | 2007-02-15 | Nippon Soda Co Ltd | Inclusion compound, curing catalyst, cured resin-forming composition and cured resin |
| WO2008075427A1 (en) * | 2006-12-21 | 2008-06-26 | Nippon Soda Co., Ltd. | Clathrate compound, curing catalyst, composition for forming cured resin, and cured resin |
| JP2013213168A (en) * | 2012-04-04 | 2013-10-17 | Nippon Soda Co Ltd | Epoxy resin composition for prepreg |
| JP2014185115A (en) * | 2013-03-25 | 2014-10-02 | Nippon Soda Co Ltd | Novel inclusion compound |
Non-Patent Citations (2)
| Title |
|---|
| KIICHI TAKEMOTO, HOSETSU KAGOBUTSU NO KAGAKU, KABUSHIKI KAISHA TOKYO KAGAKU DOJIN, 1 July 1969 (1969-07-01), pages 142 - 143 * |
| MITSUTAKA KITAMURA, TAKEI GENSHO NO MECHANISM TO TAKEI SEIGYO, 10 August 2010 (2010-08-10), pages 281 - 282, ISBN: 978-4-901493-11-6 * |
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