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WO2016105162A1 - Polyamide resin composition and moulded article produced from same - Google Patents

Polyamide resin composition and moulded article produced from same Download PDF

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Publication number
WO2016105162A1
WO2016105162A1 PCT/KR2015/014261 KR2015014261W WO2016105162A1 WO 2016105162 A1 WO2016105162 A1 WO 2016105162A1 KR 2015014261 W KR2015014261 W KR 2015014261W WO 2016105162 A1 WO2016105162 A1 WO 2016105162A1
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WO
WIPO (PCT)
Prior art keywords
polyamide resin
resin composition
weight
molded article
reflectance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2015/014261
Other languages
French (fr)
Korean (ko)
Inventor
강태곤
이민수
이선희
홍상현
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung SDI Co Ltd
Original Assignee
Samsung SDI Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020150185381A external-priority patent/KR20160078285A/en
Application filed by Samsung SDI Co Ltd filed Critical Samsung SDI Co Ltd
Publication of WO2016105162A1 publication Critical patent/WO2016105162A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers

Definitions

  • the present invention relates to a polyamide resin composition and a molded article prepared therefrom, and more particularly, to a polyamide resin composition excellent in reflectivity and yellowing resistance and a molded article prepared therefrom.
  • Polyamide resins have excellent performance in heat resistance, abrasion resistance, chemical resistance, and flame retardancy, and are used in a wide range of fields such as electric parts, electronic parts, and automobile parts.
  • polyamide resins are rapidly replacing many conventional light sources due to their excellent energy efficiency and lifespan, and are reflectors, scramblers or housings, which are the accessories of light emitting diodes (LEDs), which are in the spotlight. ) Is used as a material.
  • the reflector for light emitting diode is a component material that improves luminous efficiency by reflecting light from the light emitting diode chip to the front while wrapping and protecting the light emitting diode chip from the outside. There is a problem that falls and the light extraction ability is also lowered.
  • An object of the present invention is to solve such a conventional problem, and to provide a polyamide resin composition having excellent reflectivity and yellowing resistance.
  • the polyamide resin composition according to an embodiment of the present invention (A) polyamide resin; (B) white pigments; (C) about 0.01 to about 10 parts by weight based on 100 parts by weight of the sum of the polyamide resin (A) and the white pigment (B); And (D) about 0.01 to about 10 parts by weight of magnesium oxide.
  • the polyamide resin composition may comprise about 40 to about 95 weight percent of the polyamide resin (A) based on 100 weight percent of the polyamide resin (A) and the white pigment (B); And about 5 to about 60% by weight of the white pigment (B).
  • the polyamide resin (A) may be an aromatic polyamide resin.
  • the polyamide resin (A) may have a melting point of about 200 ° C to about 350 ° C.
  • the white pigment (B) may be selected from the group consisting of titanium oxide, zinc oxide, zinc sulfide, lead white, zinc sulfate, barium sulfate, calcium carbonate, aluminum oxide and combinations thereof.
  • the sodium phosphate salt (C) and the magnesium oxide (D) may be included in a weight ratio of about 1:10 to about 10: 1.
  • the sodium phosphate salt (C) may be selected from the group consisting of sodium pyrophosphate, sodium triphosphate, sodium tetrapolyphosphate, sodium pentapolyphosphate, sodium hexametaphosphate, and combinations thereof.
  • the concentration of magnesium ion (Mg + 2) contained in the polyamide resin composition may be from about 60 to about 60,000ppm.
  • the molded article according to one embodiment of the present invention may be prepared from the polyamide resin composition described above.
  • the molded article may have an initial reflectance measured at 440 nm with a color difference meter of about 90 or more, and a reflectance measured at 440 nm after standing at a temperature of 85 ° C. and a relative humidity of 85% for 1,000 hours.
  • the molded article is a non-(R 1 / R 0) of the initial reflectance (R 0) and then the temperature allowed to stand at 85 °C, relative humidity 85% 1000 hours a reflectance measurement from the color difference to step 440nm (R 1) measured at the color difference to step 440nm About 0.75 to about 0.99.
  • the molded article has an initial yellowness (Y 0 ) of less than about 6.5 measured by a color difference meter, and yellowness measured by a color difference meter (Y 1) after 144 hours at an initial yellowness (Y 0 ), a temperature of 85 ° C., and a relative humidity of 85%.
  • Ratio (Y 1 / Y 0 ) may be from about 1.5 to about 2.9.
  • the molded article may be a reflector for a light emitting diode (LED).
  • LED light emitting diode
  • the polyamide resin composition according to the present invention is excellent in initial reflectance by simultaneously adding sodium phosphate salt and magnesium oxide, and maintains a high level of reflectance even after being left for a long time under constant temperature and constant humidity.
  • the polyamide resin composition according to the present invention has excellent yellowing resistance, and when applied as a reflector of a light emitting diode, it is possible to realize improved light extraction ability even for long-term use.
  • the polyamide resin composition according to the present invention contains (A) polyamide resin, (B) white pigment, (C) sodium phosphate salt and (D) magnesium oxide.
  • Polyamide resin (A) is a basic resin which comprises a polyamide resin composition, Preferably an aromatic polyamide resin can be used.
  • the aromatic polyamide resin may have a structure including a benzene ring in the main chain and may be formed by using an aromatic dicarboxylic acid and an aliphatic or alicyclic diamine as a repeating unit.
  • the aromatic dicarboxylic acid unit is, for example, terephthalic acid, isophthalic acid, 2,6-naphthalenedicarboxylic acid, 2,7-naphthalenedicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 1,4- Derived from at least one selected from phenylenedioxydiacetic acid, 1,3-phenylenedioxydiacetic acid, diphenic acid, 4,4'-oxydibenzoic acid, and diphenylmethane-4,4'-dicarboxylic acid. It may be.
  • the aliphatic diamine units are, for example, 1,6-hexanediamine, 1,7-heptane diamine, 1,10-decanediamine, 1,11-undecanediamine, 1,12-dodecanediamine, 1-butyl-1 , 2-ethanediamine, 1,1-dimethyl-1,4-butanediamine, 1-ethyl-1,4-butanediamine, 1,2-dimethyl-1,4-butanediamine, 1,3-dimethyl-1 , 4-butanediamine, 1,4-dimethyl-1,4-butanediamine, 2,3-dimethyl-1,4-butanediamine, 2-methyl-1,5-pentanediamine, 3-methyl-1,5 -Pentanediamine, 2,5-dimethyl-1,6-hexanediamine, 2,4-dimethyl-1,6-hexanediamine, 3,3-dimethyl-1,6-hexanediamine, 2,2-dimethyl-1 , 6-hexanediamine, 2,2,4-trimethyl
  • the polyamide may have a melting point of about 200 ° C to about 350 ° C, preferably about 250 ° C to 320 ° C. When the melting point of the polyamide satisfies the above range, the heat resistance is excellent.
  • polystyrene resin examples include polytetramethylene adipamide (PA 46), polycaproamide / polyhexamethylene terephthalamide copolymer (PA 6 / 6T), polyhexamethylene adipamide / polyhexamethylene terephthalamide copolymer (PA 66 / 6T), polyhexamethylene adipamide / polyhexamethylene isophthalamide copolymer (PA 66 / 6I), polyhexamethylene terephthalamide / polyhexamethylene isophthalamide copolymer (PA 6T / 6I), Polyhexamethylene terephthalamide / polydodecaneamide copolymer (PA 6T / 12), polyhexamethylene adipamide / polyhexamethylene terephthalamide / polyhexamethylene isophthalamide copolymer (PA66, 6T, 6I), poly Silylene Adipamide (PA MXD6), Polyhexamethylene Terephthalamide /
  • PA 6T polyhexamethylene terephthalamide
  • PA 10T polydecamethylene terephthalamide
  • the polyamide resin may be included in an amount of about 40 wt% to about 95 wt%, preferably about 50 wt% to about 90 wt%, based on 100 wt% of the total polyamide resin and the white pigment.
  • the content of the polyamide resin is within the above range, the heat resistance or mechanical strength is excellent.
  • White pigment (B) can be used in the present invention to realize sufficient reflectance.
  • the white pigment may be titanium oxide, zinc oxide, zinc sulfide, lead white, zinc sulfate, barium sulfate, calcium carbonate, or aluminum oxide, and may be used by mixing two or more kinds.
  • the white pigment may be used by treating with a silane coupling agent or a titanium coupling agent on its surface for stable bonding with the polyamide resin (A), and the silane coupling agent may be used in vinyltriethoxysilane, 2-aminopropyltri Methoxysilane, 2-glycidoxypropyltriethoxysilane, and the like.
  • the white pigment may be used by modifying the surface with an inorganic surface treatment agent or an organic surface treatment agent, the surface modification may be carried out a plurality of times.
  • the inorganic surface treatment agent may be aluminum oxide, silicon dioxide (silica), zirconium dioxide (zirconia), sodium silicate, sodium aluminate, sodium aluminum silicate, zinc oxide or mica.
  • the organic surface treating agent may be polydimethylsiloxane, trimethylpropane or pentaerythritol.
  • aluminum oxide can be used.
  • the inorganic surface treating agent or the organic surface treating agent may be included in an amount of 0.1 to 1 parts by weight based on 100 parts by weight of the white pigment.
  • the white pigment may be included in an amount of about 5 wt% to about 60 wt%, preferably about 10 wt% to about 50 wt%, based on 100 wt% of the polyamide resin and the total amount of the white pigment. All of these compositions can be obtained.
  • Sodium phosphate salt (C) is added in order to achieve sufficient reflectivity while at the same time realizing sufficient reflectivity.
  • the sodium phosphate salt is excellent in water stability and thermal stability and can be added to the polyamide resin composition to maintain whiteness even after constant temperature and humidity, and to reduce the decrease in reflectance, thereby achieving high reflectance and at the same time ensuring excellent heat resistance. .
  • the sodium phosphate salt is, for example, sodium pyrophosphate, sodium triphosphate, sodium tetrapolyphosphate, sodium tetrapolyphosphate, sodium pentapolyphosphate, and sodium hexametaphosphate (soate hexametaphosphate). It may include any one or a mixture of two or more selected from.
  • Sodium phosphate salt in the present invention may preferably comprise sodium pyrophosphate or sodium hexametaphosphate.
  • sodium phosphate salt when used, even when the molded article manufactured from the resin composition is exposed to high temperature and high humidity conditions for a long time, the reflectance and the light efficiency are not lowered, and excellent light stability and discoloration resistance can be exhibited.
  • the sodium phosphate salt may be used that is surface-treated with a surface treatment agent to improve the adhesion and dispersibility with the polyamide resin.
  • Examples of the surface treatment agent include silane coupling agents such as silane and epoxy silane, titanium coupling agents, organic acids such as organic acids, polyols, and silicon.
  • the sodium phosphate salt may be included in an amount of about 0.01 to about 10 parts by weight, preferably about 0.1 to about 7 parts by weight, based on 100 parts by weight of the polyamide resin and the white pigment. If the sodium phosphate salt is less than 0.01 parts by weight, the reflectivity may be lowered. If it exceeds 10 parts by weight, impact resistance and yellowing resistance may be lowered.
  • magnesium oxide (D) together with the sodium phosphate salt (C), it is possible to suppress the decrease in the light reflectance of the polyamide resin composition and to improve the reflectance and the retention of the reflectance.
  • the magnesium oxide has an ultraviolet absorbing effect, excellent in the ability to trap radicals, and when used in combination with the sodium phosphate salt to suppress the increase in yellowness can further improve the reflectance.
  • the inventors of the present invention not only realize excellent whiteness of the polyamide resin composition, but also discoloration does not occur well even after long-term exposure to light, so that the light extraction ability can be maintained to a similar level as the initial stage. I found out.
  • the magnesium oxide may be included in an amount of about 0.01 to about 10 parts by weight, preferably about 0.1 to about 7 parts by weight, based on 100 parts by weight of the polyamide resin and the white pigment.
  • the content of magnesium oxide is less than 0.01 parts by weight, it is difficult to prevent discoloration when the molded article prepared from the polyamide resin composition is exposed to light, and when the content is more than 10 parts by weight, the effect of improving the reflectance is insignificant.
  • the polyamide resin composition including magnesium oxide may include magnesium ions (Mg 2 + ) of 60 to 60,000 ppm concentration, preferably magnesium ions (Mg 2 + ) of 600 to 40,000 ppm concentration. can do. Within this range, discoloration prevention and reflectance improvement effects are excellent.
  • the sodium phosphate salt and the magnesium oxide may be included in a weight ratio of about 1:10 to about 10: 1, preferably in a weight ratio of about 1: 5 to about 5: 1. Can be. When the content ratio of sodium phosphate salt and the magnesium oxide satisfies the above range, the effect of preventing discoloration and improving the reflectance retention is more excellent.
  • the polyamide resin composition may optionally further include an additive according to its use.
  • the additive may further include a filler, a flame retardant, a lubricant, a plasticizer, a heat stabilizer, an antioxidant, a light stabilizer, or a colorant, and may be used by mixing two or more kinds according to the properties of the final molded product.
  • the filler may be added to improve the mechanical properties, heat resistance and dimensional stability of the polyamide resin composition.
  • the fillers include carbon fibers, glass fibers, boron fibers, glass beads, glass flakes, carbon black, talc, clay, kaolin, talc, mica, calcium carbonate, and mixtures thereof.
  • glass fibers may be used, and the glass fibers are conventional ones used in the art, and those having a diameter of 8 to 20 ⁇ m and a length of 1.5 to 8 mm may be used.
  • the diameter of the glass fiber is in the above range can be obtained an effect of excellent strength reinforcement, when the length of the glass fiber has the above range it is easy to put into the processing equipment such as an extruder and the strength reinforcement effect can also be greatly improved.
  • the glass fiber may have an aspect ratio of less than 1.5, and specifically, a circular shape having an aspect ratio of 1 may be used.
  • the aspect ratio is then defined as the ratio of the longest diameter to the smallest diameter in the cross section of the glass fiber.
  • the flame retardant is a material for reducing combustibility, and includes a phosphate compound, a phosphite compound, a phosphonate compound, a polysiloxane, a phosphazene compound, a phosphinate compound or a melamine compound It may include at least one of, but is not limited thereto.
  • the lubricant is a material that helps the flow or movement of the resin composition by lubricating the metal surface in contact with the polyamide resin composition during processing, molding, extrusion, may be used a commonly used material.
  • the plasticizer is a material that increases the flexibility, processing workability, or expandability of the polyamide resin composition, and may be a material commonly used.
  • the heat stabilizer is a material that suppresses thermal decomposition of the polyamide resin composition when kneading or molding at a high temperature, and may be a material that is commonly used.
  • the antioxidant is a substance that prevents decomposition of the resin composition and loss of intrinsic properties by inhibiting or blocking a chemical reaction between the polyamide resin composition and oxygen, and is a phenol type, phosphite type, thioether type or amine type antioxidant. It may include at least one of, but is not limited thereto.
  • the light stabilizer is a material for inhibiting or blocking the polyamide resin composition from being decomposed from ultraviolet rays and changing color or losing mechanical properties, preferably titanium oxide.
  • the colorant may be used conventional pigments or dyes.
  • the additive may be included in about 1 to 15 parts by weight based on 100 parts by weight of polyamide resin.
  • the polyamide resin composition according to the present invention can be prepared by a known method, for example, in the form of pellets by mixing the components of the present invention and other additives at the same time and then melt extrusion in an extruder. Can be.
  • the molded article according to one embodiment of the present invention may be prepared from the polyamide resin composition described above.
  • the polyamide resin composition is excellent in reflectance, retention of reflectance and yellowing resistance.
  • the molded article may have an initial reflectance of about 90 or more measured at 440 nm with a color difference meter, and a reflectance measured at 440 nm after 1,000 hours at a temperature of 85 ° C. and a relative humidity of 85% of about 70 or more, preferably about 70 to about 90 , More preferably about 73 to about 90.
  • the molded article is a ratio (R 1 / R 0 ) of the initial reflectance (R 0 ) measured at 440 nm with a color difference meter and the reflectance (R 1 ) measured at 440 nm with a color difference meter after 1,000 hours at 85 ° C. and 85% relative humidity . ) May be about 0.75 to about 0.99, preferably about 0.78 to about 0.99.
  • the molded article has an initial yellowness (Y 0 ) measured by a color difference meter of less than about 6.5, and the yellowness measured by a color difference meter after 144 hours at an initial yellowness (Y 0 ), a temperature of 85 ° C., and a relative humidity of 85% ( Y 1) may be a ratio (Y 1 / Y 0) is about 1.5 to about 2.9.
  • the initial yellowness (Y 0) is from about 6 or less, the ratio (Y 1 / Y 0) of the Y 1 to Y 0 may be about 1.5 to about 2.8.
  • the polyamide resin composition according to the present invention is excellent in reflectance, retention of reflectance, and yellowing resistance, and can be used without limitation in a molded article requiring such properties, and specifically, may be usefully applied as a reflector for a light emitting diode (LED). Can be.
  • LED light emitting diode
  • the component used for the polyamide resin composition of the following Example and a comparative example is as follows.
  • An aromatic polyamide resin having a melting point of 305 ° C / 295 ° C and an intrinsic viscosity (IV) of 0.78 dl / g was used. (The intrinsic viscosity was measured using a Ubbelodhde viscometer at 25 ° C. after dissolving the sample in 98% sulfuric acid solution.)
  • Sodium hexametaphosphate from INNOPHOS was used.
  • the components shown in Table 1 were put into a mixer and dry mixed. Then, using a twin screw extruder having a diameter of 36 mm was processed at a barrel temperature of 250 °C to 310 °C to prepare a thermoplastic resin composition in the form of pellets through the extruder. The prepared pellets were dried at 80 ° C. for at least 4 hours, and then the specimens were injected.
  • each component listed in Table 1 is based on (a) and (b) 100% by weight of the total (a) and (b), the content of (c), (d) and (e) A total of 100 parts by weight of (a) and (b) was described, and the content of magnesium ions (Mg 2+ ) relative to the total polyamide resin composition was described in ppm.
  • Example Comparative example One 2 3 4 One 2 3 4 (a) 60 60 60 60 60 60 60 60 60 (b) 40 40 40 40 40 40 40 40 40 40 (c) 0.5 0.5 3 3 3 3 - - (d) 0.5 3 0.5 3 - - 3 3 (e) - - - - - 0.5 - 0.5 Mg 2+ content (ppm) 3,000 18,000 3,000 18,000 - - 18,000 18,000
  • Minolta 3600D CIE Lab The initial reflectance (SCI, specular component included) of 440 nm was measured with a color difference meter, and the reflectance was measured again after 1,000 hours at 85 ° C. and 85% relative humidity to evaluate the retention of the reflectance.
  • Minolta 3600D CIE Lab The initial yellowness (Yellow Index) was measured by a color difference meter, and the yellowness was measured again after being left for 144 hours at a temperature of 85 ° C. and a relative humidity of 85% to evaluate the change in yellowness.
  • sodium phosphate salt and magnesium oxide have a major influence on the reflectivity and yellowing resistance of the polyamide resin composition, and the retention of reflectance can be maintained at an excellent level by adding an optimal content of sodium phosphate salt and magnesium oxide. .

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Abstract

The present invention concerns a polyamide resin composition and a moulded article produced from same, and the polyamide resin composition may comprise: (A) a polyamide resin; (B) a white pigment; (C) approximately 0.01 to approximately 10 parts by weight of a sodium phosphate salt, with respect to 100 parts by weight of the sum of the polyamide resin (A) and the white pigment (B); and (D) approximately 0.01 to approximately 10 parts by weight of magnesium oxide. The polyamide resin composition of the present invention has outstanding reflectance and anti-yellowing properties and thus has the advantage that the reflectance rate is maintained even as time passes.

Description

폴리아미드 수지 조성물 및 이로부터 제조된 성형품Polyamide Resin Compositions and Molded Articles Made therefrom

본 발명은 폴리아미드 수지 조성물 및 이로부터 제조된 성형품에 관한 것으로, 보다 상세하게는 반사성 및 내황변성이 우수한 폴리아미드 수지 조성물 및 이로부터 제조된 성형품에 관한 것이다.The present invention relates to a polyamide resin composition and a molded article prepared therefrom, and more particularly, to a polyamide resin composition excellent in reflectivity and yellowing resistance and a molded article prepared therefrom.

폴리아미드 수지는 내열성, 내마모성, 내약품성, 난연성의 우수한 성능을 가져 전기 부품, 전자 부품, 자동차 부품 등의 폭 넓은 분야에 이용되고 있다.Polyamide resins have excellent performance in heat resistance, abrasion resistance, chemical resistance, and flame retardancy, and are used in a wide range of fields such as electric parts, electronic parts, and automobile parts.

이러한 폴리아미드 수지는 뛰어난 에너지 효율 및 수명으로 인하여 최근 기존의 많은 광원을 급속히 대체하며 각광을 받고 있는 발광다이오드(LED, light emitting diode)의 부속품인 리플렉터(reflector), 스크램블러(scrambler) 또는 하우징(housing) 등의 소재로 사용되고 있다.These polyamide resins are rapidly replacing many conventional light sources due to their excellent energy efficiency and lifespan, and are reflectors, scramblers or housings, which are the accessories of light emitting diodes (LEDs), which are in the spotlight. ) Is used as a material.

발광다이오드용 리플렉터는 발광다이오드 칩(LED chip)을 외부에서 감싸서 보호하면서 발광다이오드 칩에서 나온 빛을 전방으로 반사시켜 발광 효율을 높이는 부품 소재로, 장시간 사용하게 되면 리플렉터가 변색되면서 초기의 반사율이 크게 떨어지고 광 추출능력도 저하되는 문제가 있다.The reflector for light emitting diode is a component material that improves luminous efficiency by reflecting light from the light emitting diode chip to the front while wrapping and protecting the light emitting diode chip from the outside. There is a problem that falls and the light extraction ability is also lowered.

이에 리플렉터 소재에 굴절률이 큰 무기 안료를 도입하는 방법이 제안되었다. 그러나, 상기 방법의 경우, 초기 반사율은 어느 정도 개선시킬 수 있으나, 성형 시에 색상의 변화가 일어나고 시간 경과에 따라 반사율이 현저히 감소하여 충분한 휘도를 얻을 수 없는 문제가 있다.Accordingly, a method of introducing an inorganic pigment having a large refractive index into a reflector material has been proposed. However, in the case of the above method, although the initial reflectance can be improved to some extent, there is a problem that color change occurs during molding and the reflectance decreases significantly with time, so that sufficient luminance cannot be obtained.

또한, 소재를 달리하여 세라믹으로 리플렉터를 제조하는 시도를 하였으나 세라믹 소재는 내열성 및 내화학성이 우수한 반면에, 생산성이 떨어져 비경제적인 단점이 있다.In addition, while attempting to produce a reflector with a ceramic different from the material, while the ceramic material is excellent in heat resistance and chemical resistance, there is a disadvantage in that the productivity is low.

따라서, 발광다이오드 조명의 수명 연장을 위해 장시간 사용하더라도 반사율 및 백색도의 특성이 변하지 않아 우수한 반사성 및 황변색도를 유지할 수 있는 폴리아미드 수지 조성물에 대한 연구가 필요하다.Therefore, there is a need for a study of a polyamide resin composition capable of maintaining excellent reflectivity and yellow color change because the characteristics of reflectance and whiteness do not change even when used for a long time to extend the life of the light emitting diode illumination.

본 발명의 목적은 이와 같은 종래의 문제점을 해결하기 위한 것으로서, 반사성 및 내황변성이 우수한 폴리아미드 수지 조성물을 제공함을 목적으로 한다.An object of the present invention is to solve such a conventional problem, and to provide a polyamide resin composition having excellent reflectivity and yellowing resistance.

상기 과제를 달성하기 위하여, 본 발명의 일 실시예에 따른 폴리아미드 수지 조성물은 (A) 폴리아미드 수지; (B) 백색 안료; 상기 폴리아미드 수지(A) 및 상기 백색 안료(B)의 합 100중량부에 대하여, (C) 소듐 포스페이트염 약 0.01 내지 약 10중량부; 및 (D) 마그네슘 산화물 약 0.01 내지 약 10중량부를 포함할 수 있다.In order to achieve the above object, the polyamide resin composition according to an embodiment of the present invention (A) polyamide resin; (B) white pigments; (C) about 0.01 to about 10 parts by weight based on 100 parts by weight of the sum of the polyamide resin (A) and the white pigment (B); And (D) about 0.01 to about 10 parts by weight of magnesium oxide.

상기 폴리아미드 수지 조성물은, 상기 폴리아미드 수지(A) 및 백색 안료(B)의 합 100중량%에 대하여, 상기 폴리아미드 수지(A) 약 40 내지 약 95중량%; 및 상기 백색 안료(B) 약 5 내지 약 60중량%를 포함할 수 있다.The polyamide resin composition may comprise about 40 to about 95 weight percent of the polyamide resin (A) based on 100 weight percent of the polyamide resin (A) and the white pigment (B); And about 5 to about 60% by weight of the white pigment (B).

상기 폴리아미드 수지(A)는 방향족 폴리아미드 수지일 수 있다.The polyamide resin (A) may be an aromatic polyamide resin.

상기 폴리아미드 수지(A)는 약 200℃ 내지 약 350℃의 융점을 가질 수 있다.The polyamide resin (A) may have a melting point of about 200 ° C to about 350 ° C.

상기 백색 안료(B)는 산화 티탄, 산화 아연, 황화 아연, 연백, 황산 아연, 황산 바륨, 탄산 칼슘, 산화 알루미늄 및 이들의 조합으로 이루어진 군으로부터 선택될 수 있다.The white pigment (B) may be selected from the group consisting of titanium oxide, zinc oxide, zinc sulfide, lead white, zinc sulfate, barium sulfate, calcium carbonate, aluminum oxide and combinations thereof.

상기 소듐 포스페이트염(C) 및 상기 마그네슘 산화물(D)은 약 1:10 내지 약 10:1의 중량비로 포함될 수 있다.The sodium phosphate salt (C) and the magnesium oxide (D) may be included in a weight ratio of about 1:10 to about 10: 1.

상기 소듐 포스페이트염(C)은 소듐 피로포스페이트, 소듐 트리포스페이트, 소듐 테트라폴리포스페이트, 소듐 펜타폴리포스페이트, 소듐 헥사메타포스페이트 및 이들의 조합으로 이루어진 군에서 선택될 수 있다.The sodium phosphate salt (C) may be selected from the group consisting of sodium pyrophosphate, sodium triphosphate, sodium tetrapolyphosphate, sodium pentapolyphosphate, sodium hexametaphosphate, and combinations thereof.

상기 폴리아미드 수지 조성물에 포함된 마그네슘 이온(Mg2 +)의 농도는 약 60 내지 약 60,000ppm일 수 있다.The concentration of magnesium ion (Mg + 2) contained in the polyamide resin composition may be from about 60 to about 60,000ppm.

본 발명의 일 실시예에 의한 성형품은 상술한 폴리아미드 수지 조성물로부터 제조될 수 있다.The molded article according to one embodiment of the present invention may be prepared from the polyamide resin composition described above.

상기 성형품은 색차계로 440nm에서 측정한 초기 반사율이 약 90 이상이고, 온도 85℃, 상대습도 85%에서 1,000시간 방치 후 440nm에서 측정한 반사율이 약 70 이상일 수 있다.The molded article may have an initial reflectance measured at 440 nm with a color difference meter of about 90 or more, and a reflectance measured at 440 nm after standing at a temperature of 85 ° C. and a relative humidity of 85% for 1,000 hours.

상기 성형품은 색차계로 440nm에서 측정한 초기 반사율(R0)과 온도 85℃, 상대습도 85%에서 1,000시간 방치 후 색차계로 440nm에서 측정한 반사율(R1)의 비(R1/R0)가 약 0.75 내지 약 0.99일 수 있다.The molded article is a non-(R 1 / R 0) of the initial reflectance (R 0) and then the temperature allowed to stand at 85 ℃, relative humidity 85% 1000 hours a reflectance measurement from the color difference to step 440nm (R 1) measured at the color difference to step 440nm About 0.75 to about 0.99.

상기 성형품은 색차계로 측정한 초기 황색도(Y0)이 약 6.5 미만이고, 초기 황색도(Y0)와 온도 85℃, 상대습도 85%에서 144시간 방치 후 색차계로 측정한 황색도(Y1)의 비(Y1/Y0)가 약 1.5 내지 약 2.9일 수 있다.The molded article has an initial yellowness (Y 0 ) of less than about 6.5 measured by a color difference meter, and yellowness measured by a color difference meter (Y 1) after 144 hours at an initial yellowness (Y 0 ), a temperature of 85 ° C., and a relative humidity of 85%. Ratio (Y 1 / Y 0 ) may be from about 1.5 to about 2.9.

상기 성형품은 발광다이오드(LED)용 리플렉터(reflector)일 수 있다.The molded article may be a reflector for a light emitting diode (LED).

본 발명에 따른 폴리아미드 수지 조성물은 소듐 포스페이트염 및 산화 마그네슘을 동시에 첨가함으로써, 초기 반사율이 우수하고, 항온·항습의 조건에서 장시간 방치된 후에도 높은 수준의 반사율을 유지한다.The polyamide resin composition according to the present invention is excellent in initial reflectance by simultaneously adding sodium phosphate salt and magnesium oxide, and maintains a high level of reflectance even after being left for a long time under constant temperature and constant humidity.

또한, 본 발명에 따른 폴리아미드 수지 조성물은 내황변성이 우수하여, 발광다이오드의 리플렉터로 적용하는 경우 장기간 사용에도 향상된 광 추출능력을 구현할 수 있다.In addition, the polyamide resin composition according to the present invention has excellent yellowing resistance, and when applied as a reflector of a light emitting diode, it is possible to realize improved light extraction ability even for long-term use.

본 발명의 효과들은 이상에서 언급한 효과들로 제한되지 않으며, 언급되지 않은 또 다른 효과들은 청구범위의 기재로부터 당업자에게 명확하게 이해될 수 있을 것이다.The effects of the present invention are not limited to the above-mentioned effects, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

본 발명의 이점 및 특징, 그리고 그것들을 달성하는 방법은 상세하게 후술되어 있는 실시예들을 참조하면 명확해질 것이다. 그러나 본 발명은 이하에서 개시되는 실시예들에 한정되는 것이 아니라 서로 다른 다양한 형태로 구현될 수 있으며, 단지 본 실시예들은 본 발명의 개시가 완전하도록 하고, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에게 발명의 범주를 완전하게 알려주기 위해 제공되는 것이며, 본 발명은 청구항의 범주에 의해 정의될 뿐이다. Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various different forms, and only the embodiments make the disclosure of the present invention complete, and the general knowledge in the art to which the present invention belongs. It is provided to fully inform the person having the scope of the invention, which is defined only by the scope of the claims.

다른 정의가 없다면, 본 명세서에서 사용되는 모든 용어(기술 및 과학적 용어를 포함)는 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에게 공통적으로 이해될 수 있는 의미로 사용될 수 있을 것이다. 또 일반적으로 사용되는 사전에 정의되어 있는 용어들은 명백하게 특별히 정의되어 있지 않은 한 이상적으로 또는 과도하게 해석되지 않는다.Unless otherwise defined, all terms (including technical and scientific terms) used in the present specification may be used in a sense that can be commonly understood by those skilled in the art. In addition, the terms defined in the commonly used dictionaries are not ideally or excessively interpreted unless they are specifically defined clearly.

이하, 본 발명의 일 실시예에 의한 폴리아미드 수지 조성물에 대하여 설명하도록 한다.Hereinafter, the polyamide resin composition according to an embodiment of the present invention will be described.

본 발명에 의한 폴리아미드 수지 조성물은 (A) 폴리아미드 수지, (B) 백색 안료, (C) 소듐 포스페이트염 및 (D) 마그네슘 산화물을 포함한다.The polyamide resin composition according to the present invention contains (A) polyamide resin, (B) white pigment, (C) sodium phosphate salt and (D) magnesium oxide.

본 발명의 일 실시예에 따른 폴리아미드 수지 조성물을 이루는 각 성분에 대하여 구체적으로 설명한다.Each component of the polyamide resin composition according to an embodiment of the present invention will be described in detail.

(A) 폴리아미드 수지(A) polyamide resin

폴리아미드 수지(A)는 폴리아미드 수지 조성물을 구성하는 기초 수지로서, 바람직하게 방향족 폴리아미드 수지를 사용할 수 있다.Polyamide resin (A) is a basic resin which comprises a polyamide resin composition, Preferably an aromatic polyamide resin can be used.

상기 방향족 폴리아미드 수지는 주사슬에 벤젠고리를 포함하는 구조로 방향족 디카르복실산과 지방족 또는 지환족 디아민을 반복 단위로 하여 이루어질 수 있다.The aromatic polyamide resin may have a structure including a benzene ring in the main chain and may be formed by using an aromatic dicarboxylic acid and an aliphatic or alicyclic diamine as a repeating unit.

상기 방향족 디카르복실산 단위는 예를 들어 테레프탈산, 이소프탈산, 2,6-나프탈렌디카르복실산, 2,7-나프탈렌디카르복실산, 1,4-나프탈렌디카르복실산, 1,4-페닐렌디옥시디아세트산, 1,3-페닐렌디옥시디아세트산, 디펜산, 4,4'-옥시디벤조산, 및 디페닐메탄-4,4'-디카르복실산로부터 선택된 1종 이상으로부터 유래된 것일 수 있다. The aromatic dicarboxylic acid unit is, for example, terephthalic acid, isophthalic acid, 2,6-naphthalenedicarboxylic acid, 2,7-naphthalenedicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 1,4- Derived from at least one selected from phenylenedioxydiacetic acid, 1,3-phenylenedioxydiacetic acid, diphenic acid, 4,4'-oxydibenzoic acid, and diphenylmethane-4,4'-dicarboxylic acid. It may be.

상기 지방족 디아민 단위는 예를 들어 1,6-헥산디아민, 1,7-헵탄디아민, 1,10-데칸디아민, 1,11-운데칸디아민, 1,12-도데칸디아민, 1-부틸-1,2-에탄디아민, 1,1-디메틸-1,4-부탄디아민, 1-에틸-1,4-부탄디아민, 1,2-디메틸-1,4-부탄디아민, 1,3-디메틸-1,4-부탄디아민, 1,4-디메틸-1,4-부탄디아민, 2,3-디메틸-1,4-부탄디아민, 2-메틸-1,5-펜탄디아민, 3-메틸-1,5-펜탄디아민, 2,5-디메틸-1,6-헥산디아민, 2,4-디메틸-1,6-헥산디아민, 3,3-디메틸-1,6-헥산디아민, 2,2-디메틸-1,6-헥산디아민, 2,2,4-트리메틸-1,6-헥산디아민, 2,4,4-트리메틸-1,6-헥산디아민, 2,4-디에틸-1,6-헥산디아민, 2,2-디에틸-1,7-헵탄디아민, 2,3-디메틸-1,7-헵탄디아민, 2,4-디메틸-1,7-헵탄디아민, 및 2,5-디메틸-1,7-헵탄디아민로부터 선택되는 1종 이상의 디아민으로부터 유래된 것일 수 있다.The aliphatic diamine units are, for example, 1,6-hexanediamine, 1,7-heptane diamine, 1,10-decanediamine, 1,11-undecanediamine, 1,12-dodecanediamine, 1-butyl-1 , 2-ethanediamine, 1,1-dimethyl-1,4-butanediamine, 1-ethyl-1,4-butanediamine, 1,2-dimethyl-1,4-butanediamine, 1,3-dimethyl-1 , 4-butanediamine, 1,4-dimethyl-1,4-butanediamine, 2,3-dimethyl-1,4-butanediamine, 2-methyl-1,5-pentanediamine, 3-methyl-1,5 -Pentanediamine, 2,5-dimethyl-1,6-hexanediamine, 2,4-dimethyl-1,6-hexanediamine, 3,3-dimethyl-1,6-hexanediamine, 2,2-dimethyl-1 , 6-hexanediamine, 2,2,4-trimethyl-1,6-hexanediamine, 2,4,4-trimethyl-1,6-hexanediamine, 2,4-diethyl-1,6-hexanediamine, 2,2-diethyl-1,7-heptane diamine, 2,3-dimethyl-1,7-heptane diamine, 2,4-dimethyl-1,7-heptane diamine, and 2,5-dimethyl-1,7 It may be derived from at least one diamine selected from -heptane diamine.

또한, 상기 폴리아미드는 융점이 약 200℃ 내지 약 350℃일 수 있으며, 바람직하게는 약 250℃ 내지 320℃일 수 있다. 폴리아미드의 융점이 상기 범위를 만족할 경우, 내열성이 우수하다. In addition, the polyamide may have a melting point of about 200 ° C to about 350 ° C, preferably about 250 ° C to 320 ° C. When the melting point of the polyamide satisfies the above range, the heat resistance is excellent.

상기 폴리아미드의 구체적인 예로, 폴리테트라메틸렌 아디파아미드(PA 46), 폴리카프로아미드/폴리헥사메틸렌 테레프탈아미드 코폴리머(PA 6/6T), 폴리헥사메틸렌 아디파미드/폴리헥사메틸렌 테레프탈아미드 코폴리머(PA 66/6T), 폴리헥사메틸렌 아디파미드/폴리헥사메틸렌 이소프탈아미드 코폴리머(PA 66/6I), 폴리헥사메틸렌 테레프탈아미드/폴리헥사메틸렌 이소프탈아미드 코폴리머(PA 6T/6I), 폴리헥사메틸렌 테레프탈아미드/폴리도데칸아미드 코폴리머(PA 6T/12), 폴리헥사메틸렌 아디파미드/폴리헥사메틸렌 테레프탈아미드/폴리헥사메틸렌 이소프탈아미드 코폴리머(PA66, 6T, 6I), 폴리크실리렌 아디파미드(PA MXD6), 폴리헥사메틸렌 테레프탈아미드/폴리 2-메틸펜타메틸렌 테레프탈아미드 코폴리머(PA 6T, M5T), 폴리헥사메틸렌 테레프탈아미드(PA 6T), 폴리노나메틸렌 테레프탈아미드(PA 9T), 폴리데카메틸렌 테레프탈아미드(PA 10T) 및 이들의 혼합물 등을 들 수 있다.Specific examples of the polyamide include polytetramethylene adipamide (PA 46), polycaproamide / polyhexamethylene terephthalamide copolymer (PA 6 / 6T), polyhexamethylene adipamide / polyhexamethylene terephthalamide copolymer (PA 66 / 6T), polyhexamethylene adipamide / polyhexamethylene isophthalamide copolymer (PA 66 / 6I), polyhexamethylene terephthalamide / polyhexamethylene isophthalamide copolymer (PA 6T / 6I), Polyhexamethylene terephthalamide / polydodecaneamide copolymer (PA 6T / 12), polyhexamethylene adipamide / polyhexamethylene terephthalamide / polyhexamethylene isophthalamide copolymer (PA66, 6T, 6I), poly Silylene Adipamide (PA MXD6), Polyhexamethylene Terephthalamide / Poly 2-methylpentamethylene Terephthalamide Copolymer (PA 6T, M5T), Polyhexamethylene Terephthalamide (PA 6T), Polynonnamethyl Lene terephthalamide (PA 9T), polydecamethylene terephthalamide (PA 10T), mixtures thereof, and the like.

바람직하게는, 폴리헥사메틸렌 테레프탈아미드(PA 6T) 또는 폴리데카메틸렌 테레프탈아미드(PA 10T)일 수 있다.Preferably, it may be polyhexamethylene terephthalamide (PA 6T) or polydecamethylene terephthalamide (PA 10T).

상기 폴리아미드 수지는 폴리아미드 수지 및 백색 안료의 합 100중량%에 대하여 약 40 내지 약 95중량%, 바람직하게는 약 50 내지 약 90중량%으로 포함될 수 있다. 상기 폴리아미드 수지의 함량이 상기 범위 내인 경우, 내열성 또는 기계적 강도가 우수하다.The polyamide resin may be included in an amount of about 40 wt% to about 95 wt%, preferably about 50 wt% to about 90 wt%, based on 100 wt% of the total polyamide resin and the white pigment. When the content of the polyamide resin is within the above range, the heat resistance or mechanical strength is excellent.

(B) 백색 안료(B) white pigment

백색 안료(B)는 본 발명에서 충분한 반사율을 구현하기 위하여 사용될 수 있다. White pigment (B) can be used in the present invention to realize sufficient reflectance.

상기 백색 안료는 구체적으로 산화 티탄, 산화 아연, 황화 아연, 연백, 황산 아연, 황산 바륨, 탄산 칼슘 또는 산화 알루미늄을 사용할 수 있으며, 2종 이상을 혼합하여 사용할 수도 있다.Specifically, the white pigment may be titanium oxide, zinc oxide, zinc sulfide, lead white, zinc sulfate, barium sulfate, calcium carbonate, or aluminum oxide, and may be used by mixing two or more kinds.

상기 백색 안료는 폴리아미드 수지(A)와의 안정적 결합을 위해 그 표면에 실란 커플링제 또는 티탄 커플링제 등으로 처리하여 사용할 수 있으며, 상기 실란 커플링제는 비닐트리에톡시실란, 2-아미노프로필트리에톡시실란, 2-글리시독시프로필트리에톡시실란 등일 수 있다.The white pigment may be used by treating with a silane coupling agent or a titanium coupling agent on its surface for stable bonding with the polyamide resin (A), and the silane coupling agent may be used in vinyltriethoxysilane, 2-aminopropyltri Methoxysilane, 2-glycidoxypropyltriethoxysilane, and the like.

상기 백색 안료는 무기 표면처리제 또는 유기 표면처리제로 표면을 개질하여 사용할 수 있으며, 상기 표면 개질은 복수 회 실시될 수 있다.The white pigment may be used by modifying the surface with an inorganic surface treatment agent or an organic surface treatment agent, the surface modification may be carried out a plurality of times.

상기 무기 표면처리제는 산화 알루미늄, 이산화규소(실리카), 이산화 지르코늄(지르코니아), 규산나트륨, 알루민산나트륨, 규산나트륨알루미늄, 산화아연 또는 운모일 수 있다. 상기 유기 표면처리제는 폴리디메틸실록산, 트리메틸프로판 또는 펜타에리트리톨일 수 있다. 바람직하게는 산화 알루미늄을 사용할 수 있다.The inorganic surface treatment agent may be aluminum oxide, silicon dioxide (silica), zirconium dioxide (zirconia), sodium silicate, sodium aluminate, sodium aluminum silicate, zinc oxide or mica. The organic surface treating agent may be polydimethylsiloxane, trimethylpropane or pentaerythritol. Preferably, aluminum oxide can be used.

상기 무기 표면처리제 또는 상기 유기 표면처리제는 백색 안료 100중량부에 대하여 0.1 내지 1중량부로 포함될 수 있다. The inorganic surface treating agent or the organic surface treating agent may be included in an amount of 0.1 to 1 parts by weight based on 100 parts by weight of the white pigment.

상기 백색 안료는 폴리아미드 수지 및 백색 안료의 합 100중량%에 대하여, 약 5 내지 약 60중량%, 바람직하게는 약 10 내지 약 50중량%로 포함될 수 있다.. 상기 범위에서 광학 특성 및 기계적 물성이 모두 우수한 조성물을 얻을 수 있다. The white pigment may be included in an amount of about 5 wt% to about 60 wt%, preferably about 10 wt% to about 50 wt%, based on 100 wt% of the polyamide resin and the total amount of the white pigment. All of these compositions can be obtained.

(C) 소듐 포스페이트염(C) sodium phosphate salt

소듐 포스페이트염(C)은 본 발명에서 충분한 반사율을 구현하면서, 동시에 우수한 반사율의 유지율을 확보하기 위하여 첨가된다.Sodium phosphate salt (C) is added in order to achieve sufficient reflectivity while at the same time realizing sufficient reflectivity.

상기 소듐 포스페이트염은 수분 안정성 및 열안정성이 뛰어나 폴리아미드 수지 조성물에 첨가됨으로써 항온, 항습 후에도 백색도가 유지될 수 있으며, 반사율의 저하도 감소시킴으로써 높은 반사율을 구현하면서도 동시에 우수한 내열성을 확보하게 할 수 있다.The sodium phosphate salt is excellent in water stability and thermal stability and can be added to the polyamide resin composition to maintain whiteness even after constant temperature and humidity, and to reduce the decrease in reflectance, thereby achieving high reflectance and at the same time ensuring excellent heat resistance. .

상기 소듐 포스페이트염은 일예로, 소듐 피로포스페이트(sodium pyrophosphate), 소듐 트리포스페이트(sodium tripolyphosphate), 소듐 테트라폴리포스페이트(sodium tetrapolyphosphate), 소듐 펜타폴리포스페이트(sodium pentapolyphosphate) 및 소듐 헥사메타포스페이트(sodium hexametaphosphate) 중에서 선택되는 어느 하나 또는 둘 이상의 혼합물을 포함할 수 있다.The sodium phosphate salt is, for example, sodium pyrophosphate, sodium triphosphate, sodium tetrapolyphosphate, sodium tetrapolyphosphate, sodium pentapolyphosphate, and sodium hexametaphosphate (soate hexametaphosphate). It may include any one or a mixture of two or more selected from.

본 발명에서 소듐 포스페이트염은 바람직하게는 소듐 피로포스페이트 또는 소듐 헥사메타포스페이트를 포함할 수 있다. 상기 소듐 포스페이트염을 사용하면 수지 조성물로부터 제조되는 성형품이 장기간 고온 다습한 조건에 노출 시에도 반사율 및 광효율이 저하되지 않고, 우수한 광안정성 및 내변색성을 나타낼 수 있다.Sodium phosphate salt in the present invention may preferably comprise sodium pyrophosphate or sodium hexametaphosphate. When the sodium phosphate salt is used, even when the molded article manufactured from the resin composition is exposed to high temperature and high humidity conditions for a long time, the reflectance and the light efficiency are not lowered, and excellent light stability and discoloration resistance can be exhibited.

상기 소듐 포스페이트염은 폴리아미드 수지와의 밀착성 및 분산성을 향상시키기 위하여 표면처리제로 표면처리된 것을 사용할 수 있다. The sodium phosphate salt may be used that is surface-treated with a surface treatment agent to improve the adhesion and dispersibility with the polyamide resin.

상기 표면처리제로는 실란, 에폭시 실란 등의 실란 커플링제, 티탄 커플링제, 유기산, 폴리올 또는 실리콘 등의 유기물 등이 있다.Examples of the surface treatment agent include silane coupling agents such as silane and epoxy silane, titanium coupling agents, organic acids such as organic acids, polyols, and silicon.

상기 소듐 포스페이트염은 폴리아미드 수지 및 백색 안료의 합 100중량부에 대하여, 약 0.01 내지 약 10중량부, 바람직하게는 약 0.1 내지 약 7중량부로 포함될 수 있다. .소듐 포스페이트염이 0.01중량부 미만이면 반사성이 저하될 수 있으며, 10중량부를 초과하면 내충격성 및 내황변성이 저하될 수 있다.The sodium phosphate salt may be included in an amount of about 0.01 to about 10 parts by weight, preferably about 0.1 to about 7 parts by weight, based on 100 parts by weight of the polyamide resin and the white pigment. If the sodium phosphate salt is less than 0.01 parts by weight, the reflectivity may be lowered. If it exceeds 10 parts by weight, impact resistance and yellowing resistance may be lowered.

(D) 산화 마그네슘(D) magnesium oxide

산화 마그네슘(D)은 소듐 포스페이트염(C)과 함께 첨가됨으로써, 폴리아미드 수지 조성물의 광 반사율의 저하를 억제하여 반사율 및 반사율의 유지율을 향상시킬 수 있다. By adding magnesium oxide (D) together with the sodium phosphate salt (C), it is possible to suppress the decrease in the light reflectance of the polyamide resin composition and to improve the reflectance and the retention of the reflectance.

상기 산화 마그네슘은 자외선 흡수 효과가 있으며, 라디칼 포착능력이 뛰어나 상기 소듐 포스페이트염과 병용하여 사용시 황색도의 증가를 억제시켜 반사율을 더욱 개선시킬 수 있다.The magnesium oxide has an ultraviolet absorbing effect, excellent in the ability to trap radicals, and when used in combination with the sodium phosphate salt to suppress the increase in yellowness can further improve the reflectance.

본 발명의 발명자들은 소듐 포스페이트염과 산화 마그네슘을 동시에 사용함으로써, 폴리아미드 수지 조성물의 우수한 백색도를 구현할 수 있을 뿐만 아니라, 장시간 광에 노출되더라도 변색이 잘 일어나지 않아 광 추출능력을 초기와 유사한 정도로 유지할 수 있음을 알아내었다.By using sodium phosphate salt and magnesium oxide simultaneously, the inventors of the present invention not only realize excellent whiteness of the polyamide resin composition, but also discoloration does not occur well even after long-term exposure to light, so that the light extraction ability can be maintained to a similar level as the initial stage. I found out.

상기 산화 마그네슘은 폴리아미드 수지 및 백색 안료의 합 100중량부에 대하여 약 0.01 내지 약 10중량부, 바람직하게는 약 0.1 내지 약 7중량부로 포함될 수 있다. 산화 마그네슘의 함량이 0.01 중량부 미만인 경우에는 폴리아미드 수지 조성물로부터 제조된 성형품이 광에 노출되는 경우 변색 방지가 어려우며, 10중량부를 초과하는 경우에는 반사율 개선 효과가 미미하다.The magnesium oxide may be included in an amount of about 0.01 to about 10 parts by weight, preferably about 0.1 to about 7 parts by weight, based on 100 parts by weight of the polyamide resin and the white pigment. When the content of magnesium oxide is less than 0.01 parts by weight, it is difficult to prevent discoloration when the molded article prepared from the polyamide resin composition is exposed to light, and when the content is more than 10 parts by weight, the effect of improving the reflectance is insignificant.

또한, 상기 산화 마그네슘을 포함하는 폴리아미드 수지 조성물은 60 내지 60,000ppm 농도의 마그네슘 이온(Mg2 +)을 포함할 수 있으며, 바람직하게는 600 내지 40,000ppm 농도의 마그네슘 이온(Mg2 +)을 포함할 수 있다. 상기 범위에서, 변색 방지 및 반사율 개선 효과가 뛰어나다. 본 발명의 조성물에 있어서, 상기 소듐 포스페이트염 및 상기 마그네슘 산화물은 약 1:10 내지 약 10:1의 중량비율로 포함될 수 있으며, 바람직하게는 약 1:5 내지 약 5:1의 중량비율로 포함될 수 있다. 소듐 포스페이트염 및 상기 마그네슘 산화물의 함량 비율이 상기 범위를 만족할 경우, 변색 방지 및 반사율 유지율 개선 효과가 더욱 우수하다. In addition, the polyamide resin composition including magnesium oxide may include magnesium ions (Mg 2 + ) of 60 to 60,000 ppm concentration, preferably magnesium ions (Mg 2 + ) of 600 to 40,000 ppm concentration. can do. Within this range, discoloration prevention and reflectance improvement effects are excellent. In the composition of the present invention, the sodium phosphate salt and the magnesium oxide may be included in a weight ratio of about 1:10 to about 10: 1, preferably in a weight ratio of about 1: 5 to about 5: 1. Can be. When the content ratio of sodium phosphate salt and the magnesium oxide satisfies the above range, the effect of preventing discoloration and improving the reflectance retention is more excellent.

상기 폴리아미드 수지 조성물은 그 용도에 따라 선택적으로 첨가제를 더 포함할 수 있다. 상기 첨가제로는 충진제, 난연제, 활제, 가소제, 열안정제, 산화방지제, 광안정제 또는 착색제를 더 포함할 수 있으며, 최종 성형품의 특성에 따라 2종 이상 혼합하여 사용할 수 있다.The polyamide resin composition may optionally further include an additive according to its use. The additive may further include a filler, a flame retardant, a lubricant, a plasticizer, a heat stabilizer, an antioxidant, a light stabilizer, or a colorant, and may be used by mixing two or more kinds according to the properties of the final molded product.

상기 충진제는 폴리아미드 수지 조성물의 기계적 특성, 내열성 및 치수안정성 등을 향상시키기 위하여 첨가할 수 있다. 상기 충진제는 탄소섬유, 유리섬유, 붕소섬유, 유리 비드, 유리 플레이크, 카본블랙, 활석, 클레이, 카올린, 탈크, 마이카, 탄산칼슘 및 이의 혼합물 등을 들 수 있고, 침상 충진제로서는 월라스트나이트, 티탄산칼슘 휘스카, 붕산 알미늄 휘스카, 산화 아연 휘스카, 칼슘 휘스카 등을 들 수 있다. The filler may be added to improve the mechanical properties, heat resistance and dimensional stability of the polyamide resin composition. The fillers include carbon fibers, glass fibers, boron fibers, glass beads, glass flakes, carbon black, talc, clay, kaolin, talc, mica, calcium carbonate, and mixtures thereof. Calcium whisker, aluminum borate whisker, zinc oxide whisker, calcium whisker and the like.

바람직하게 유리 섬유를 사용할 수 있으며, 유리 섬유는 상기 유리섬유는 당업계에서 사용되는 통상적인 것으로서, 직경이 8 내지 20㎛이고, 길이가 1.5 내지 8㎜인 것을 사용할 수 있다. 유리섬유의 직경이 상기 범위인 경우 우수한 강도 보강의 효과를 얻을 수 있으며, 유리섬유의 길이가 상기 범위인 가지는 경우 압출기 등 가공기기에 투입하는 것이 용이하며 강도 보강 효과도 크게 개선될 수 있다.Preferably, glass fibers may be used, and the glass fibers are conventional ones used in the art, and those having a diameter of 8 to 20 μm and a length of 1.5 to 8 mm may be used. When the diameter of the glass fiber is in the above range can be obtained an effect of excellent strength reinforcement, when the length of the glass fiber has the above range it is easy to put into the processing equipment such as an extruder and the strength reinforcement effect can also be greatly improved.

상기 유리섬유는 단면의 종횡비(aspect ratio)가 1.5 미만의 것을 사용할 수 있으며, 구체적으로는 단면의 종횡비가 1인 원형 모양의 것을 사용할 수 있다. 이때 상기 종횡비는 유리섬유의 단면에서 가장 작은 직경에 대한 가장 긴 직경의 비율로 정의된다. 상기 단면의 종횡비 범위를 가진 유리섬유를 사용할 경우 가격적인 측면에서 제품의 단가를 낮출 수 있으며, 단면이 원형인 유리섬유를 사용하여 치수 안정성 및 외관을 좋게 할 수 있다.The glass fiber may have an aspect ratio of less than 1.5, and specifically, a circular shape having an aspect ratio of 1 may be used. The aspect ratio is then defined as the ratio of the longest diameter to the smallest diameter in the cross section of the glass fiber. When using a glass fiber having an aspect ratio of the cross section, it is possible to lower the unit cost of the product in terms of cost, and to improve the dimensional stability and appearance by using a glass fiber having a circular cross section.

상기 난연제는 연소성을 감소시키는 물질로, 포스페이트(phosphate) 화합물, 포스파이트(phosphite) 화합물, 포스포네이트(phosphonate) 화합물, 폴리실록산, 포스파젠(phosphazene) 화합물, 포스피네이트(phosphinate) 화합물 또는 멜라민 화합물 중 적어도 하나를 포함할 수 있으나, 이에 한정되는 것은 아니다.The flame retardant is a material for reducing combustibility, and includes a phosphate compound, a phosphite compound, a phosphonate compound, a polysiloxane, a phosphazene compound, a phosphinate compound or a melamine compound It may include at least one of, but is not limited thereto.

상기 활제는 가공, 성형, 압출 중에 폴리아미드 수지 조성물과 접촉하는 금속 표면을 윤활시켜 수지 조성물의 흐름 또는 이동을 도와주는 물질로, 통상적으로 사용되는 물질을 사용할 수 있다.The lubricant is a material that helps the flow or movement of the resin composition by lubricating the metal surface in contact with the polyamide resin composition during processing, molding, extrusion, may be used a commonly used material.

상기 가소제는 폴리아미드 수지 조성물의 유연성, 가공 작업성 또는 팽창성을 증가시키는 물질로, 통상적으로 사용되는 물질을 사용할 수 있다.The plasticizer is a material that increases the flexibility, processing workability, or expandability of the polyamide resin composition, and may be a material commonly used.

상기 열안정제는 고온에서 혼련 또는 성형할 경우 폴리아미드 수지 조성물의 열적 분해를 억제하는 물질로, 통상적으로 사용되는 물질을 사용할 수 있다.The heat stabilizer is a material that suppresses thermal decomposition of the polyamide resin composition when kneading or molding at a high temperature, and may be a material that is commonly used.

상기 산화방지제는 폴리아미드 수지 조성물과 산소와의 화학적 반응을 억제 또는 차단시킴으로써 수지 조성물이 분해되어 고유 물성이 상실되는 것을 방지하는 물질로, 페놀형, 포스파이트형, 티오에테르형 또는 아민형 산화방지제 중 적어도 하나를 포함할 수 있으나, 이에 한정되는 것은 아니다.The antioxidant is a substance that prevents decomposition of the resin composition and loss of intrinsic properties by inhibiting or blocking a chemical reaction between the polyamide resin composition and oxygen, and is a phenol type, phosphite type, thioether type or amine type antioxidant. It may include at least one of, but is not limited thereto.

상기 광안정제는 자외선으로부터 폴리아미드 수지 조성물이 분해되어 색이 변하거나 기계적 성질이 상실되는 것을 억제 또는 차단시키는 물질로, 바람직하게는 산화티탄을 사용할 수 있다.The light stabilizer is a material for inhibiting or blocking the polyamide resin composition from being decomposed from ultraviolet rays and changing color or losing mechanical properties, preferably titanium oxide.

상기 착색제는 통상적인 안료 또는 염료를 사용할 수 있다.The colorant may be used conventional pigments or dyes.

상기 첨가제는 폴리아미드 수지 100중량부에 대하여, 약 1 내지 15중량부로 포함될 수 있다.The additive may be included in about 1 to 15 parts by weight based on 100 parts by weight of polyamide resin.

본 발명에 따른 폴리아미드 수지 조성물은 공지의 방법에 의해서 제조될 수 있으며 예를 들어, 본 발명의 구성 성분과 기타 첨가제들을 동시에 혼합한 후 압출기 내에서 용융 압출하는 방법에 의하여 펠렛의 형태로 제조될 수 있다.The polyamide resin composition according to the present invention can be prepared by a known method, for example, in the form of pellets by mixing the components of the present invention and other additives at the same time and then melt extrusion in an extruder. Can be.

본 발명의 일 실시예에 의한 성형품은 상술한 폴리아미드 수지 조성물로부터 제조될 수 있다. 상기 폴리아미드 수지 조성물은 반사율, 반사율의 유지율 및 내황변성이 우수하다.The molded article according to one embodiment of the present invention may be prepared from the polyamide resin composition described above. The polyamide resin composition is excellent in reflectance, retention of reflectance and yellowing resistance.

상기 성형품은 색차계로 440nm에서 측정한 초기 반사율이 약 90 이상이고, 온도 85℃, 상대습도 85%에서 1,000시간 방치 후 440nm에서 측정한 반사율이 약 70 이상일 수 있으며, 바람직하게는 약 70 내지 약 90, 더 바람직하게는 약 73 내지 약 90일 수 있다.The molded article may have an initial reflectance of about 90 or more measured at 440 nm with a color difference meter, and a reflectance measured at 440 nm after 1,000 hours at a temperature of 85 ° C. and a relative humidity of 85% of about 70 or more, preferably about 70 to about 90 , More preferably about 73 to about 90.

또한, 상기 성형품은 색차계로 440nm에서 측정한 초기 반사율(R0)과 온도 85℃, 상대습도 85%에서 1,000시간 방치 후 색차계로 440nm에서 측정한 반사율(R1)의 비(R1/R0)가 약 0.75 내지 약 0.99일 수 있고, 바람직하게는 약 0.78 내지 약 0.99일 수 있다.In addition, the molded article is a ratio (R 1 / R 0 ) of the initial reflectance (R 0 ) measured at 440 nm with a color difference meter and the reflectance (R 1 ) measured at 440 nm with a color difference meter after 1,000 hours at 85 ° C. and 85% relative humidity . ) May be about 0.75 to about 0.99, preferably about 0.78 to about 0.99.

또한, 상기 성형품은 색차계로 측정한 초기 황색도(Y0)이 약 6.5 미만이고, 초기 황색도(Y0)와 온도 85℃, 상대습도 85%에서 144시간 방치 후 색차계로 측정한 황색도(Y1)의 비(Y1/Y0)이 약 1.5 내지 약 2.9일 수 있다. 바람직하게는 초기 황색도(Y0)가 약 6 미만이고, Y0 에 대한 Y1의 비(Y1/Y0)가 약 1.5 내지 약 2.8일 수 있다.In addition, the molded article has an initial yellowness (Y 0 ) measured by a color difference meter of less than about 6.5, and the yellowness measured by a color difference meter after 144 hours at an initial yellowness (Y 0 ), a temperature of 85 ° C., and a relative humidity of 85% ( Y 1) may be a ratio (Y 1 / Y 0) is about 1.5 to about 2.9. Preferably, the initial yellowness (Y 0) is from about 6 or less, the ratio (Y 1 / Y 0) of the Y 1 to Y 0 may be about 1.5 to about 2.8.

본 발명에 의한 폴리아미드 수지 조성물은 반사율, 반사율의 유지율, 내황변성이 우수하여, 이러한 특성이 요구되는 성형품에 제한없이 사용될 수 있으며, 구체적으로 발광다이오드(LED)용 리플렉터(reflector)로 유용하게 적용될 수 있다.The polyamide resin composition according to the present invention is excellent in reflectance, retention of reflectance, and yellowing resistance, and can be used without limitation in a molded article requiring such properties, and specifically, may be usefully applied as a reflector for a light emitting diode (LED). Can be.

이하에서는, 본 발명의 폴리아미드 수지 조성물의 우수한 효과를 입증하기 위한 실험을 실시한 결과를 나타낸다.Hereinafter, the result of having performed the experiment for demonstrating the outstanding effect of the polyamide resin composition of this invention is shown.

하기 실시예 및 비교예의 폴리아미드 수지 조성물에 사용된 구성 성분은 아래와 같다.The component used for the polyamide resin composition of the following Example and a comparative example is as follows.

(a) 폴리아미드 수지(a) polyamide resin

융점이 305℃/295℃이며, 고유점도(IV)가 0.78dl/g인 방향족 폴리아미드 수지를 사용하였다. (고유점도는 시료를 98%의 황산용액에 녹인 후 25℃에서 우베로드(Ubbelodhde) 점도계를 사용하여 측정하였다.)An aromatic polyamide resin having a melting point of 305 ° C / 295 ° C and an intrinsic viscosity (IV) of 0.78 dl / g was used. (The intrinsic viscosity was measured using a Ubbelodhde viscometer at 25 ° C. after dissolving the sample in 98% sulfuric acid solution.)

(b) 백색 안료(b) white pigment

우신피크먼트社의 산화 티탄인 SAOMAI SM2515 제품을 사용하였다.A product of SAOMAI SM2515, titanium oxide of Wooshin Peakment, was used.

(c) 소듐 포스페이트염(c) sodium phosphate salt

이노포스(INNOPHOS)社의 소듐 헥사메타포스페이트를 사용하였다.Sodium hexametaphosphate from INNOPHOS was used.

(d) 산화 마그네슘(d) magnesium oxide

코노쉬마社의 산화마그네슘인 STARMAG 150 제품을 사용하였다. Konarmsma's magnesium oxide, STARMAG 150, was used.

(e) 산화 방지제(e) antioxidants

치바가이기(Ciba Geigy)社의 힌더드 페놀계 산화방지제인 Irganox1010 제품을 사용하였다.A product of Irganox 1010, a hindered phenolic antioxidant of Ciba Geigy, was used.

표 1에 기재된 성분을 혼합기에 투입하고 건식 혼합하였다. 그 다음 Φ가 36mm인 이축 압출기를 사용하여 바렐 온도 250℃ 내지 310℃에서 가공하여 압출기를 통하여 펠렛 형태의 열가소성 수지 조성물을 제조하였다. 제조된 펠렛을 80℃에서 4시간 이상 건조한 후 시편을 사출하였다.The components shown in Table 1 were put into a mixer and dry mixed. Then, using a twin screw extruder having a diameter of 36 mm was processed at a barrel temperature of 250 ℃ to 310 ℃ to prepare a thermoplastic resin composition in the form of pellets through the extruder. The prepared pellets were dried at 80 ° C. for at least 4 hours, and then the specimens were injected.

표 1에 기재된 각 성분의 함량은 (a)와 (b)의 함량은 (a) 및 (b) 합 100중량%를 기준으로 기재하였으며, (c), (d) 및 (e)의 함량은 (a)와 (b)의 총합 100중량부를 기준으로 기재하였고, 전체 폴리아미드 수지 조성물에 대한 마그네슘 이온(Mg2+)의 함량을 ppm 단위로 기재하였다.The content of each component listed in Table 1 is based on (a) and (b) 100% by weight of the total (a) and (b), the content of (c), (d) and (e) A total of 100 parts by weight of (a) and (b) was described, and the content of magnesium ions (Mg 2+ ) relative to the total polyamide resin composition was described in ppm.

실시예Example 비교예Comparative example 1One 22 33 44 1One 22 33 44 (a)(a) 6060 6060 6060 6060 6060 6060 6060 6060 (b)(b) 4040 4040 4040 4040 4040 4040 4040 4040 (c)(c) 0.50.5 0.50.5 33 33 33 33 -- -- (d)(d) 0.50.5 33 0.50.5 33 -- -- 33 33 (e)(e) -- -- -- -- -- 0.50.5 -- 0.50.5 Mg2+ 함량(ppm)Mg 2+ content (ppm) 3,0003,000 18,00018,000 3,0003,000 18,00018,000 -- -- 18,00018,000 18,00018,000

상기 실시예 1 내지 4 및 비교예 1 내지 4의 폴리아미드 수지 조성물에 대하여 반사율 및 내황변성을 평가하였다. 평가 항목의 평가 방법은 아래와 같으며, 각 항목의 평가 결과는 표 2에 기재하였다.Reflectance and yellowing resistance of the polyamide resin compositions of Examples 1 to 4 and Comparative Examples 1 to 4 were evaluated. The evaluation method of the evaluation item is as follows, and the evaluation result of each item is described in Table 2.

<반사율 평가><Evaluation of Reflectance>

미놀타 3600D CIE Lab. 색차계로 440nm의 초기 반사율(SCI, specular component included)를 측정하고, 온도 85℃, 상대습도 85%에서 1,000시간 방치 후 다시 반사율을 측정하여, 반사율의 유지율을 평가하였다.Minolta 3600D CIE Lab. The initial reflectance (SCI, specular component included) of 440 nm was measured with a color difference meter, and the reflectance was measured again after 1,000 hours at 85 ° C. and 85% relative humidity to evaluate the retention of the reflectance.

<내황변성><Yellowing resistance>

미놀타 3600D CIE Lab. 색차계로 초기 황색도(Yellow Index)를 측정하고, 온도 85℃, 상대습도 85%에서 144시간 방치 후 다시 황색도를 측정하여, 황색도의 변화를 평가하였다.Minolta 3600D CIE Lab. The initial yellowness (Yellow Index) was measured by a color difference meter, and the yellowness was measured again after being left for 144 hours at a temperature of 85 ° C. and a relative humidity of 85% to evaluate the change in yellowness.

실시예Example 비교예Comparative example 1One 22 33 44 1One 22 33 44 반사율reflectivity R0 R 0 94.594.5 94.194.1 94.994.9 94.894.8 93.493.4 93.693.6 93.093.0 93.293.2 R1 R 1 75.875.8 76.476.4 74.574.5 75.675.6 65.865.8 66.166.1 66.566.5 66.766.7 R1/R0 R 1 / R 0 0.800.80 0.810.81 0.790.79 0.800.80 0.700.70 0.710.71 0.720.72 0.720.72 황색도Yellow road Y0 Y 0 5.05.0 5.25.2 4.64.6 4.84.8 7.27.2 6.96.9 6.66.6 6.46.4 Y1 Y 1 11.911.9 10.510.5 12.812.8 12.312.3 20.720.7 20.320.3 19.819.8 19.519.5 Y1/Y0 Y 1 / Y 0 2.382.38 2.022.02 2.782.78 2.562.56 2.882.88 2.942.94 3.003.00 3.053.05

상기 표 1 및 표 2로부터 실시예 1 내지 4의 폴리아미드 수지 조성물은 반사율 및 황색도가 모두 우수함을 알 수 있었다.From Table 1 and Table 2, it was found that the polyamide resin compositions of Examples 1 to 4 were excellent in both reflectance and yellowness.

산화 마그네슘을 첨가하지 않거나(비교예 1), 소듐 포스페이트염을 첨가하지 않은 경우(비교예 3)에는 초기 반사율이 실시예들에 비하여 작을 뿐만 아니라, 항온, 항습의 조건에서 장시간 방치되는 경우 반사율이 크게 떨어지고, 초기 황색도 및 황색도의 변화율도 크게 측정되어 내황변색성이 현저히 떨어져 반사율의 유지율이 저하됨을 알 수 있었다.When magnesium oxide is not added (Comparative Example 1), or when sodium phosphate salt is not added (Comparative Example 3), the initial reflectance is smaller than that of the embodiments, and the reflectance is long when left at a constant temperature and constant humidity. It was greatly dropped, and the change in the initial yellowness and the yellowness was also greatly measured, indicating that the yellowing discoloration resistance was remarkably decreased and the retention of the reflectance was lowered.

또한, 산화 마그네슘을 첨가하지 않은 대신 산화방지제를 첨가하거나(비교예 2) 소듐 포스페이트염을 첨가하지 않은 대신 산화방지제를 첨가하더라도(비교예 4), 산화 마그네슘과 소듐 포스페이트염을 동시에 첨가한 실시예들에 비하여 반사율이 낮게 측정되었으며, 초기 황색도도 높고 시간이 경과함에 따라 색상 변화도 많이 일어나 시간이 경과함에 따라 초기의 반사율이 크게 떨어지고 광 추출능력이 저하됨을 예상할 수 있다.Also, an example in which magnesium oxide and sodium phosphate salt were added simultaneously, even though antioxidant was added instead of magnesium oxide (Comparative Example 2) or antioxidant was added instead of sodium phosphate salt (Comparative Example 4). The reflectance was measured lower than that of the light bulbs, and the initial yellowness was also high, and the color variation also increased with time, and thus, the initial reflectance was greatly decreased and the light extraction ability was deteriorated with time.

이로써, 폴리아미드 수지 조성물의 반사성과 내황변색성에 소듐 포스페이트염 및 산화마그네슘가 주요한 영향을 미침을 알 수 있으며, 소듐 포스페이트염과 산화마그네슘의 최적의 함량을 첨가함으로써 반사율의 유지율을 우수한 수준으로 유지할 수 있다.Thus, it can be seen that sodium phosphate salt and magnesium oxide have a major influence on the reflectivity and yellowing resistance of the polyamide resin composition, and the retention of reflectance can be maintained at an excellent level by adding an optimal content of sodium phosphate salt and magnesium oxide. .

본 발명의 권리범위는 상술한 실시예에 한정되는 것이 아니라 첨부된 특허청구범위 내에서 다양한 형태의 실시예로 구현될 수 있다. 특허청구범위에서 청구하는 본 발명의 요지를 벗어남이 없이 당해 발명이 속하는 기술 분야에서 통상의 지식을 가지는 자라면 누구든지 변형 가능한 다양한 범위까지 본 발명의 청구범위 기재의 범위 내에 있는 것으로 본다.The scope of the present invention is not limited to the above-described embodiment, but may be embodied in various forms of embodiments within the scope of the appended claims. Without departing from the gist of the present invention as claimed in the claims, any person having ordinary skill in the art to which the present invention pertains is considered to be within the scope of the claims described in the present invention to various extents which can be modified.

Claims (13)

(A) 폴리아미드 수지;(A) polyamide resin; (B) 백색 안료;(B) white pigments; 상기 폴리아미드 수지(A) 및 상기 백색 안료(B)의 합 100중량부에 대하여,To 100 parts by weight of the total of the polyamide resin (A) and the white pigment (B), (C) 소듐 포스페이트염 약 0.01 내지 약 10중량부; 및(C) about 0.01 to about 10 parts by weight of sodium phosphate salt; And (D) 마그네슘 산화물 약 0.01 내지 약 10중량부를 포함하는 폴리아미드 수지 조성물.(D) Polyamide resin composition comprising about 0.01 to about 10 parts by weight of magnesium oxide. 제1항에 있어서,The method of claim 1, 상기 폴리아미드 수지(A) 및 백색 안료(B)의 합 100중량%에 대하여,To 100% by weight of the sum of the polyamide resin (A) and the white pigment (B), 상기 폴리아미드 수지(A) 약 40 내지 약 95중량%; 및About 40 to about 95 weight percent of the polyamide resin (A); And 상기 백색 안료(B) 약 5 내지 약 60중량%를 포함하는 폴리아미드 수지 조성물.Polyamide resin composition comprising about 5 to about 60% by weight of the white pigment (B). 제1항에 있어서,The method of claim 1, 상기 폴리아미드 수지(A)는 방향족 폴리아미드 수지인 폴리아미드 수지 조성물.The polyamide resin (A) is a polyamide resin composition is an aromatic polyamide resin. 제2항에 있어서,The method of claim 2, 상기 폴리아미드 수지(A)는 약 200℃ 내지 약 350℃의 융점을 가지는 폴리아미드 수지 조성물.The polyamide resin (A) has a melting point of about 200 ℃ to about 350 ℃. 제1항에 있어서,The method of claim 1, 상기 백색 안료(B)는 산화 티탄, 산화 아연, 황화 아연, 연백, 황산 아연, 황산 바륨, 탄산 칼슘, 산화 알루미늄 및 이들의 조합으로 이루어진 군으로부터 선택되는 폴리아미드 수지 조성물.The white pigment (B) is a polyamide resin composition selected from the group consisting of titanium oxide, zinc oxide, zinc sulfide, lead white, zinc sulfate, barium sulfate, calcium carbonate, aluminum oxide and combinations thereof. 제1항에 있어서,The method of claim 1, 상기 소듐 포스페이트염(C) 및 상기 마그네슘 산화물(D)은 약 1:10 내지 약 10:1의 중량비로 포함되는 폴리아미드 수지 조성물.Wherein said sodium phosphate salt (C) and said magnesium oxide (D) are included in a weight ratio of about 1:10 to about 10: 1. 제1항에 있어서,The method of claim 1, 상기 소듐 포스페이트염(C)은 소듐 피로포스페이트, 소듐 트리포스페이트, 소듐 테트라폴리포스페이트, 소듐 펜타폴리포스페이트, 소듐 헥사메타포스페이트 및 이들의 조합으로 이루어진 군에서 선택되는 폴리아미드 수지 조성물.The sodium phosphate salt (C) is polyamide resin composition selected from the group consisting of sodium pyrophosphate, sodium triphosphate, sodium tetrapolyphosphate, sodium pentapolyphosphate, sodium hexametaphosphate and combinations thereof. 제1항에 있어서,The method of claim 1, 상기 폴리아미드 수지 조성물에 포함된 마그네슘 이온(Mg2 +)의 농도가 약 60 내지 약 60,000ppm인 폴리아미드 수지 조성물.The polyamide resin composition having a concentration of magnesium ions (Mg 2 + ) contained in the polyamide resin composition is about 60 to about 60,000 ppm. 제1항 내지 제8항 중 어느 한 항의 폴리아미드 수지 조성물로부터 제조되는 성형품.The molded article manufactured from the polyamide resin composition of any one of Claims 1-8. 제9항에 있어서,The method of claim 9, 상기 성형품은 색차계로 440nm에서 측정한 초기 반사율이 약 90 이상이고, 온도 85℃, 상대습도 85%에서 1,000시간 방치 후 440nm에서 측정한 반사율이 약 70 이상인 성형품.The molded article has an initial reflectance of about 90 or more measured at 440 nm with a color difference meter, and a reflectance measured at 440 nm of about 70 or more after 1,000 hours at 85 ° C. and 85% relative humidity. 제9항에 있어서,The method of claim 9, 상기 성형품은 색차계로 440nm에서 측정한 초기 반사율(R0)과 온도 85℃, 상대습도 85%에서 1,000시간 방치 후 색차계로 440nm에서 측정한 반사율(R1)의 비(R1/R0)가 약 0.75 내지 약 0.99인 성형품.The molded article is a non-(R 1 / R 0) of the initial reflectance (R 0) and then the temperature allowed to stand at 85 ℃, relative humidity 85% 1000 hours a reflectance measurement from the color difference to step 440nm (R 1) measured at the color difference to step 440nm Molded article that is about 0.75 to about 0.99. 제9항에 있어서,The method of claim 9, 상기 성형품은 색차계로 측정한 초기 황색도(Y0)가 약 6.5 미만이고, 초기 황색도(Y0)와 온도 85℃, 상대습도 85%에서 144시간 방치 후 색차계로 측정한 황색도(Y1)의 비(Y1/Y0)이 약 1.5 내지 약 2.9인 성형품.The molded article has an initial yellowness (Y 0 ) of less than about 6.5 measured by a color difference meter, and an yellowness (Y 1) measured by a color difference meter after 144 hours at an initial yellowness (Y 0 ), a temperature of 85 ° C., and a relative humidity of 85%. Molded article having a ratio (Y 1 / Y 0 ) of about 1.5 to about 2.9. 제9항에 있어서,The method of claim 9, 상기 성형품은 발광다이오드(LED)용 리플렉터(reflector)인 성형품.The molded article is a molded article is a reflector for a light emitting diode (LED).
PCT/KR2015/014261 2014-12-24 2015-12-24 Polyamide resin composition and moulded article produced from same Ceased WO2016105162A1 (en)

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