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WO2016104188A1 - Feuille pour le thermosoudage et feuille de thermosoudage avec bande de découpage en dés fixée - Google Patents

Feuille pour le thermosoudage et feuille de thermosoudage avec bande de découpage en dés fixée Download PDF

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Publication number
WO2016104188A1
WO2016104188A1 PCT/JP2015/084813 JP2015084813W WO2016104188A1 WO 2016104188 A1 WO2016104188 A1 WO 2016104188A1 JP 2015084813 W JP2015084813 W JP 2015084813W WO 2016104188 A1 WO2016104188 A1 WO 2016104188A1
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WIPO (PCT)
Prior art keywords
heat bonding
sheet
dicing tape
heat
bonding sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2015/084813
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English (en)
Japanese (ja)
Inventor
悠樹 菅生
菜穂 鎌倉
石坂　剛
光昭 襖田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
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Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2015204211A external-priority patent/JP6682235B2/ja
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to CN201580070430.3A priority Critical patent/CN107109146A/zh
Priority to EP15872757.8A priority patent/EP3239258A4/fr
Priority to US15/539,657 priority patent/US10301509B2/en
Publication of WO2016104188A1 publication Critical patent/WO2016104188A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J169/00—Adhesives based on polycarbonates; Adhesives based on derivatives of polycarbonates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives

Definitions

  • the present invention relates to a heat bonding sheet and a heat bonding sheet with a dicing tape.
  • the method of bonding a semiconductor element to an adherend such as a metal lead frame has started from the conventional gold-silicon eutectic, and has changed to a method using solder and resin paste. At present, a conductive resin paste is sometimes used.
  • Patent Document 2 describes a technique for improving flexibility and reducing thermal damage of a lead frame or the like by using an acrylic acid copolymer having a glass transition temperature of ⁇ 10 ° C. to 50 ° C. .
  • Si Insulated Gate Bipolar Transistors
  • MOSFETs Metal-Oxide-Semiconductor Field-Effect Transistors
  • a semiconductor using SiC or GaN has features such as a large band gap and a high dielectric breakdown electric field, and can operate at low loss, high speed, and high temperature.
  • High-temperature operation is advantageous in automobiles and small power conversion devices that have a severe thermal environment.
  • Semiconductor devices used in severe thermal environments are expected to operate at a high temperature of around 250 ° C., and solder and conductive adhesives, which are conventional bonding / adhesive materials, have problems in thermal characteristics and reliability.
  • paste materials containing sintered metal particles have been proposed (see, for example, Patent Document 3).
  • the sintered metal particle-containing paste material contains nano- and micro-sized metal particles, and these metal particles melt at a temperature lower than the normal melting point due to the nano-size effect, and sintering between the particles proceeds. Because of joining by sintering, high reliability is obtained even in an environment of 250 ° C., and high thermal characteristics are obtained.
  • Patent Document 4 discloses a heat-bonding sheet body. This heat-bonding sheet body is formed by pressing a high-viscosity heat-bonding material into a sheet shape. Concerns about overhang and creeping on the chip surface cannot be resolved.
  • the present invention has been made in view of the above-mentioned problems, and its purpose is to suppress the protrusion during die attachment and the creeping to the chip surface, and heating that provides high reliability and thermal characteristics even in a high temperature environment.
  • An object of the present invention is to provide a bonding sheet and a heating bonding sheet with a dicing tape having the heating bonding sheet.
  • the inventors of the present application examined a heat bonding sheet and a heat bonding sheet with a dicing tape having the heat bonding sheet. As a result, by adopting the following configuration, it has been found that protrusion and die-up on the chip surface during die attach are suppressed, and that high reliability and thermal characteristics can be obtained even in a high temperature environment. It came to complete.
  • the heat bonding sheet according to the present invention is:
  • the tensile modulus obtained by the following tensile test method is 10 to 3000 MPa, Containing metal fine particles in the range of 60 to 98% by weight,
  • the carbon concentration obtained by energy dispersive X-ray analysis after heating from 23 ° C. to 400 ° C. under the condition of a heating rate of 10 ° C./min in an air atmosphere is 15% by weight or less. To do.
  • Tensile test method (1) As a test sample, a heat bonding sheet having a thickness of 200 ⁇ m, a width of 10 mm, and a length of 40 mm is prepared, (2) A tensile test was performed under the conditions of a distance between chucks of 10 mm, a tensile speed of 50 mm / min, and 23 ° C. (3) The slope of the straight line portion of the obtained stress-strain diagram is the tensile modulus.
  • the tensile elasticity modulus obtained by the said tensile test method is 10 Mpa or more, it can suppress that the constituent material of the sheet
  • the organic substance for example, the resin component constituting the heat bonding sheet
  • the heat resistance after the heat bonding process is more excellent.
  • the sheet shape is more easily maintained before the heat bonding step. Moreover, it is easier to thermally decompose during the heat bonding process.
  • the metal fine particles are preferably at least one selected from the group consisting of silver, copper, silver oxide, and copper oxide.
  • metal fine particles are at least one selected from the group consisting of silver, copper, silver oxide, and copper oxide, heat bonding can be more suitably performed.
  • the thickness at 23 ° C. is preferably 5 to 100 ⁇ m.
  • the thickness at 23 ° C. is 5 ⁇ m or more, the protrusion can be further suppressed.
  • it is 100 ⁇ m or less, it is possible to further suppress the occurrence of inclination during heat bonding.
  • the sheet for heat bonding with a dicing tape according to the present invention Dicing tape, It has the said sheet
  • the step of bonding to the dicing tape can be omitted.
  • the sheet for heat bonding is provided, the protrusion at the time of heat bonding and the creeping to the chip surface are suppressed.
  • two objects for example, a semiconductor chip and a lead frame
  • the carbon concentration obtained by energy dispersive X-ray analysis after heating from 23 ° C. to 400 ° C. under the condition of a heating rate of 10 ° C./min in an air atmosphere is 15% by weight or less, After heating up to 400 ° C., there is almost no organic matter.
  • the heat resistance is excellent, and high reliability and thermal characteristics are obtained even in a high temperature environment.
  • FIG. 1 is a schematic cross-sectional view showing a heat bonding sheet with a dicing tape according to an embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view showing another heat bonding sheet with dicing tape according to another embodiment of the present invention.
  • a heat bonding sheet 10 with a dicing tape has a configuration in which a heat bonding sheet 3 is laminated on a dicing tape 11.
  • the dicing tape 11 is configured by laminating the pressure-sensitive adhesive layer 2 on the base material 1, and the heat bonding sheet 3 is provided on the pressure-sensitive adhesive layer 2.
  • work affixing part may be sufficient as this invention like the sheet
  • the heat bonding sheets 3, 3 ′ have a tensile modulus of 10 MPa to 3000 MPa, preferably 12 MPa to 2900 MPa, and more preferably 15 MPa to 2500 MPa, obtained by the following tensile test method.
  • Tensile test method (1) As a test sample, a heat bonding sheet (heat bonding sheet for tensile test) having a thickness of 200 ⁇ m, a width of 10 mm, and a length of 40 mm is prepared. (2) A tensile test was performed under the conditions of a distance between chucks of 10 mm, a tensile speed of 50 mm / min, and 23 ° C. (3) The slope of the straight line portion of the obtained stress-strain diagram is the tensile modulus.
  • the heat bonding sheets 3, 3 ′ have a tensile modulus of 10 MPa or more obtained by the above-described tensile test method, and therefore prevent the constituent material of the heat bonding sheet from protruding or rising to the chip surface during die attachment. it can. Further, since the tensile elastic modulus is 3000 MPa or less, for example, the semiconductor wafer can be fixed during dicing.
  • the content of the metal fine particles is preferably in the range of 65 to 97% by weight, and more preferably in the range of 70 to 95% by weight. Since the metal fine particles are contained in the range of 60 to 98% by weight, the metal fine particles can be sintered or melted to join two objects (for example, a semiconductor chip and a lead frame).
  • Examples of the metal fine particles include sinterable metal particles.
  • the sinterable metal particles aggregates of metal fine particles can be suitably used.
  • the metal fine particles include fine particles made of metal.
  • the metal include gold, silver, copper, silver oxide, and copper oxide.
  • it is preferable that it is at least 1 sort (s) chosen from the group which consists of silver, copper, silver oxide, and copper oxide.
  • the metal fine particles are at least one selected from the group consisting of silver, copper, silver oxide, and copper oxide, heat bonding can be more suitably performed.
  • the average particle size of the sinterable metal particles is preferably 0.0005 ⁇ m or more, more preferably 0.001 ⁇ m or more. Moreover, 0.005 micrometer or more and 0.01 micrometer or more may be sufficient. Examples of the lower limit of the average particle diameter include 0.01 ⁇ m, 0.05 ⁇ m, and 0.1 ⁇ m. Furthermore, 0.5 micrometer and 1 micrometer can also be illustrated. On the other hand, the average particle size of the sinterable metal particles is preferably 30 ⁇ m or less, more preferably 25 ⁇ m or less. Examples of the upper limit of the average particle diameter include 20 ⁇ m, 15 ⁇ m, 10 ⁇ m, and 5 ⁇ m.
  • the average particle size of the sinterable metal particles is measured by the following method. That is, the sinterable metal particles are observed with an SEM (scanning electron microscope), and the average particle diameter is measured.
  • the SEM observation is, for example, observing at a magnification of 5000 when the sinterable metal particles are in a micro size, observing at a magnification of 50000 in the case of a submicron size, and observing at a magnification of 300000 in the case of a nano size. preferable.
  • the shape of the sinterable metal particles is not particularly limited, and is, for example, spherical, rod-like, scale-like, or indefinite.
  • the heat-bonding sheets 3 and 3 ′ have a carbon concentration obtained by energy dispersive X-ray analysis after heating from 23 ° C. to 400 ° C. in an air atmosphere under a temperature rising rate of 10 ° C./min. It is 15% by weight or less, preferably 12% by weight or less, and more preferably 10% by weight or less. Since the carbon concentration is 15% by weight or less, the heat-bonding sheets 3 and 3 ′ have almost no organic matter after the temperature is raised to 400 ° C. As a result, after the heat bonding step, the heat resistance is excellent, and high reliability and thermal characteristics are obtained even in a high temperature environment.
  • the heat bonding sheets 3 and 3 ′ may have a peak at 150 to 350 ° C. when differential thermal analysis is performed from 23 ° C. to 500 ° C. under an air atmosphere at a temperature rising rate of 10 ° C./min. Preferably, it exists at 170 to 320 ° C, more preferably at 180 to 310 ° C.
  • the peak is present at 150 to 350 ° C., it can be said that the organic substance (for example, the resin component constituting the heat bonding sheet) is thermally decomposed in this temperature region. As a result, the heat resistance after the heat bonding process is more excellent.
  • the heat bonding sheets 3 and 3 ′ contain a thermally decomposable binder.
  • a thermally decomposable binder is contained, the sheet shape is easily maintained before the heat bonding step. Moreover, it is easy to thermally decompose at the time of a heat joining process.
  • the “thermally decomposable binder” refers to a binder that can be thermally decomposed in the heat bonding step. It is preferable that the thermally decomposable binder hardly remains in the heat bonding sheet after the heat bonding step.
  • the thermally decomposable binder for example, energy after heating from 23 ° C. to 400 ° C. under the condition of a heating rate of 10 ° C./min in an air atmosphere even if it is contained in the heat bonding sheet.
  • Examples thereof include materials whose carbon concentration obtained by the dispersion X-ray analysis is 15% by weight or less. For example, if a material that is more easily thermally decomposed is used as the thermally decomposable binder, even if the content is relatively increased, it can be made to hardly remain in the heat bonding sheet after the heat bonding step.
  • the heat decomposable binder is preferably a solid material at normal temperature (23 ° C.).
  • the thermally decomposable binder is a solid material at room temperature (23 ° C.)
  • thermally decomposable binder examples include acrylic resin and polycarbonate resin.
  • the acrylic resin is an ester of acrylic acid or methacrylic acid ester having a linear or branched alkyl group having 30 or less carbon atoms, particularly 4 to 18 carbon atoms, as long as it can be thermally decomposed in the heat bonding step.
  • Polymers (acrylic copolymers) containing seeds or two or more kinds as components are listed.
  • alkyl group examples include a methyl group, ethyl group, propyl group, isopropyl group, n-butyl group, t-butyl group, isobutyl group, amyl group, isoamyl group, hexyl group, heptyl group, cyclohexyl group, 2- Examples include ethylhexyl group, octyl group, isooctyl group, nonyl group, isononyl group, decyl group, isodecyl group, undecyl group, lauryl group, tridecyl group, tetradecyl group, stearyl group, octadecyl group, and dodecyl group.
  • the other monomer forming the polymer is not particularly limited, and for example, acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid Or a carboxyl group-containing monomer such as crotonic acid, an acid anhydride monomer such as maleic anhydride or itaconic anhydride, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, (meth ) 4-hydroxybutyl acrylate, 6-hydroxyhexyl (meth) acrylate, 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate or (4 -Hydroxymethyl cycle Hexyl) -hydroxyl group-containing monomers such as methyl acrylate, styrene sulfonic
  • acrylic resins those having a weight average molecular weight of 10,000 to 1,000,000 are more preferable, and those having a weight average molecular weight of 30,000 to 700,000 are more preferable. It is because it is excellent in the adhesiveness before a heat joining process and the thermal decomposability in the heat joining process as it is in the said numerical range.
  • the weight average molecular weight is a value measured by GPC (gel permeation chromatography) and calculated in terms of polystyrene.
  • acrylic resins acrylic resins that thermally decompose at 200 ° C. to 400 ° C. are preferable.
  • the polycarbonate resin is not particularly limited as long as it can be thermally decomposed in the heat bonding step, but an aromatic compound (for example, between the carbonate ester groups (—O—CO—O—) of the main chain)
  • An aliphatic polycarbonate containing an aliphatic chain without a benzene ring or the like, and an aromatic polycarbonate containing an aromatic compound between carbonic acid ester groups (—O—CO—O—) of the main chain can be mentioned.
  • aliphatic polycarbonate is preferable.
  • Examples of the aliphatic polycarbonate include polyethylene carbonate and polypropylene carbonate.
  • polypropylene carbonate is preferable from the viewpoint of solubility in an organic solvent in producing a varnish for forming a sheet.
  • aromatic polycarbonate include those containing a bisphenol A structure in the main chain.
  • the weight average molecular weight of the polycarbonate resin is preferably in the range of 10,000 to 1,000,000.
  • the weight average molecular weight is a value measured by GPC (gel permeation chromatography) and calculated in terms of polystyrene.
  • heat bonding sheets 3 and 3 ′ may appropriately contain, for example, a plasticizer in addition to the above components.
  • the heat bonding sheets 3, 3 ' can be manufactured by a usual method. For example, a varnish containing each of the above components is prepared, and the varnish is applied on a base separator so as to have a predetermined thickness to form a coating film, and then the coating film is dried, whereby the heat bonding sheet 3 3 ′ can be manufactured.
  • the solvent used in the varnish is not particularly limited, but an organic solvent or an alcohol solvent that can uniformly dissolve, knead, or disperse the above components is preferable.
  • the organic solvent include ketone solvents such as dimethylformamide, dimethylacetamide, N-methylpyrrolidone, acetone, methyl ethyl ketone, and cyclohexanone, toluene, and xylene.
  • alcohol solvent examples include ethylene glycol, diethylene glycol, 1,2-propanediol, 1,3-propanediol, 1,2-butanediol, 1,3-butanediol, 1,4-butanediol, 2- Examples include butene-1,4-diol, 1,2,6-hexanetriol, glycerin, octanediol, 2-methyl-2,4-pentanediol, and terpineol.
  • the application method is not particularly limited.
  • the solvent coating method include a die coater, a gravure coater, a roll coater, a reverse coater, a comma coater, a pipe doctor coater, and screen printing.
  • a die coater is preferable in terms of high uniformity of coating thickness.
  • the drying conditions for the coating film are not particularly limited, and for example, the drying can be performed at a drying temperature of 70 to 160 ° C. and a drying time of 1 to 5 minutes. Even after the coating film is dried, depending on the type of solvent, the entire solvent may remain in the coating film without being vaporized.
  • polyethylene terephthalate (PET) polyethylene
  • polypropylene polypropylene
  • a release agent such as a fluorine-type release agent or a long-chain alkyl acrylate release agent
  • a method for producing the heat-bonding sheets 3 and 3 ′ for example, a method for producing the heat-bonding sheets 3 and 3 ′ by mixing the respective components with a mixer and press-molding the obtained mixture is also suitable. It is. A planetary mixer etc. are mentioned as a mixer.
  • the thickness of the heat-bonding sheets 3 and 3 'at 23 ° C. before heating is preferably 5 to 100 ⁇ m, and more preferably 10 to 80 ⁇ m.
  • the thickness at 23 ° C. is 5 ⁇ m or more, the protrusion can be further suppressed.
  • it is 100 ⁇ m or less, it is possible to further suppress the occurrence of inclination during heat bonding.
  • the dicing tape 11 is configured by laminating an adhesive layer 2 on a substrate 1.
  • the base material 1 is a strength base of the heat bonding sheets 10 and 12 with a dicing tape, and preferably has ultraviolet transparency.
  • the substrate 1 include low density polyethylene, linear polyethylene, medium density polyethylene, high density polyethylene, ultra low density polyethylene, random copolymer polypropylene, block copolymer polypropylene, homopolyprolene, polybutene, polymethylpentene, and the like.
  • Polyolefin ethylene-vinyl acetate copolymer, ionomer resin, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) acrylic acid ester (random, alternating) copolymer, ethylene-butene copolymer, ethylene -Hexene copolymer, Polyester such as polyurethane, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyetheretherketone, polyetherimide, polyamide, wholly aromatic polyamide, polyphenyls Fuido, aramid (paper), glass, glass cloth, fluorine resin, polyvinyl chloride, polyvinylidene chloride, cellulose resin, silicone resin, metal (foil), paper, and the like.
  • Polyester such as polyurethane, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyetheretherketone, polyetherimide, polyamide, wholly aromatic polyamide,
  • examples of the material of the substrate 1 include polymers such as a crosslinked body of the resin.
  • the plastic film may be used unstretched or may be uniaxially or biaxially stretched as necessary.
  • the adhesive area between the pressure-sensitive adhesive layer 2 and the heat bonding sheets 3 and 3 ′ is reduced by thermally shrinking the base material 1 after dicing, The collection of the semiconductor chip can be facilitated.
  • the surface of the substrate 1 is chemically treated by conventional surface treatments such as chromic acid treatment, ozone exposure, flame exposure, high piezoelectric impact exposure, ionizing radiation treatment, etc. in order to improve adhesion and retention with adjacent layers.
  • a physical treatment or a coating treatment with a primer for example, an adhesive substance described later can be performed.
  • the thickness of the substrate 1 is not particularly limited and can be appropriately determined, but is generally about 5 to 200 ⁇ m.
  • the pressure-sensitive adhesive used for forming the pressure-sensitive adhesive layer 2 is not particularly limited, and for example, a general pressure-sensitive adhesive such as an acrylic pressure-sensitive adhesive or a rubber-based pressure-sensitive adhesive can be used.
  • a general pressure-sensitive adhesive such as an acrylic pressure-sensitive adhesive or a rubber-based pressure-sensitive adhesive
  • an acrylic pressure-sensitive adhesive having an acrylic polymer as a base polymer from the viewpoint of cleanability with an organic solvent such as ultrapure water or alcohol of an electronic component that is difficult to contaminate a semiconductor wafer or glass Is preferred.
  • acrylic polymer examples include (meth) acrylic acid alkyl esters (for example, methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester, t-butyl ester, pentyl ester, Isopentyl ester, hexyl ester, heptyl ester, octyl ester, 2-ethylhexyl ester, isooctyl ester, nonyl ester, decyl ester, isodecyl ester, undecyl ester, dodecyl ester, tridecyl ester, tetradecyl ester, hexadecyl ester , Octadecyl esters, eicosyl esters, etc., alkyl groups having 1 to 30 carbon atoms, especially 4 to 18 carbon atoms, such as
  • the acrylic polymer contains units corresponding to other monomer components copolymerizable with the (meth) acrylic acid alkyl ester or cycloalkyl ester, if necessary, for the purpose of modifying cohesive force, heat resistance and the like. You may go out.
  • Such monomer components include, for example, carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid; maleic anhydride Acid anhydride monomers such as itaconic anhydride; 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate Hydroxyl group-containing monomers such as 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate, (4-hydroxymethylcyclohexyl) methyl (meth) acrylate; Styrene Contains sulfonic acid groups such as phonic acid, allyl sulf
  • a polyfunctional monomer or the like can be included as a monomer component for copolymerization as necessary.
  • examples of such polyfunctional monomers include hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, Pentaerythritol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, epoxy (meth) acrylate, polyester (meth) acrylate, urethane (meth) An acrylate etc. are mentioned. These polyfunctional monomers can also be used alone or in combination of two or more. The amount of the polyfunctional monomer used is preferably
  • the acrylic polymer can be obtained by subjecting a single monomer or a mixture of two or more monomers to polymerization.
  • the polymerization can be performed by any method such as solution polymerization, emulsion polymerization, bulk polymerization, suspension polymerization and the like.
  • the content of the low molecular weight substance is preferably small.
  • the number average molecular weight of the acrylic polymer is preferably 100,000 or more, more preferably about 200,000 to 3,000,000, and particularly preferably about 300,000 to 1,000,000.
  • an external cross-linking agent can be appropriately employed for the pressure-sensitive adhesive in order to increase the number average molecular weight of an acrylic polymer as a base polymer.
  • the external crosslinking method include a method of adding a so-called crosslinking agent such as a polyisocyanate compound, an epoxy compound, an aziridine compound, a melamine crosslinking agent, and reacting them.
  • a so-called crosslinking agent such as a polyisocyanate compound, an epoxy compound, an aziridine compound, a melamine crosslinking agent, and reacting them.
  • the amount used is appropriately determined depending on the balance with the base polymer to be cross-linked, and further depending on the intended use as an adhesive. In general, it is preferable to add about 5 parts by weight or less, and further 0.1 to 5 parts by weight with respect to 100 parts by weight of the base polymer.
  • additives such as conventionally well-known various tackifiers and anti-aging agent, other than the said component as needed to an adhesive.
  • the pressure-sensitive adhesive layer 2 can be formed of a radiation curable pressure-sensitive adhesive.
  • the radiation curable pressure-sensitive adhesive can increase the degree of cross-linking by irradiation with radiation such as ultraviolet rays, and can easily reduce its adhesive strength, and a portion 2a corresponding to the work pasting portion of the pressure-sensitive adhesive layer 2 shown in FIG.
  • the difference in adhesive strength with the other part 2b can be provided by irradiating only with radiation.
  • the portion 2 a having a significantly reduced adhesive force can be easily formed. Since the heat bonding sheet 3 ′ is attached to the portion 2 a that has been cured and has reduced adhesive strength, the interface between the portion 2 a of the pressure-sensitive adhesive layer 2 and the heat bonding sheet 3 ′ is easily peeled off during pick-up. Have. On the other hand, the portion not irradiated with radiation has a sufficient adhesive force, and forms the portion 2b. In addition, you may perform irradiation of the radiation to an adhesive layer after dicing and before pick-up.
  • the portion 2b formed of the uncured radiation-curing pressure-sensitive adhesive adheres to the heat bonding sheet 3, and dicing is performed. It is possible to secure a holding force when performing. In this way, the radiation curable pressure-sensitive adhesive can support the heat bonding sheet 3 for fixing a chip-like work (semiconductor chip or the like) to an adherend such as a substrate with a good balance of adhesion and peeling.
  • the portion 2b can fix the wafer ring.
  • the radiation curable pressure-sensitive adhesive those having a radiation curable functional group such as a carbon-carbon double bond and exhibiting adhesiveness can be used without particular limitation.
  • the radiation curable pressure sensitive adhesive for example, an addition type radiation curable pressure sensitive adhesive in which a radiation curable monomer component or an oligomer component is blended with a general pressure sensitive pressure sensitive adhesive such as an acrylic pressure sensitive adhesive or a rubber pressure sensitive adhesive. An agent can be illustrated.
  • Examples of the radiation curable monomer component to be blended include urethane oligomer, urethane (meth) acrylate, trimethylolpropane tri (meth) acrylate, tetramethylolmethane tetra (meth) acrylate, pentaerythritol tri (meth) acrylate, and pentaerythritol.
  • Examples include stall tetra (meth) acrylate, dipentaerystol monohydroxypenta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, and 1,4-butanediol di (meth) acrylate.
  • the radiation curable oligomer component examples include urethane, polyether, polyester, polycarbonate, and polybutadiene oligomers, and those having a molecular weight in the range of about 100 to 30000 are suitable.
  • the compounding amount of the radiation-curable monomer component or oligomer component can be appropriately determined in accordance with the type of the pressure-sensitive adhesive layer, and the amount capable of reducing the adhesive strength of the pressure-sensitive adhesive layer. In general, the amount is, for example, about 5 to 500 parts by weight, preferably about 40 to 150 parts by weight with respect to 100 parts by weight of the base polymer such as an acrylic polymer constituting the pressure-sensitive adhesive.
  • the radiation-curable pressure-sensitive adhesive has a carbon-carbon double bond in the polymer side chain, main chain, or main chain terminal as a base polymer.
  • Intrinsic radiation curable pressure sensitive adhesives using Intrinsic radiation curable pressure-sensitive adhesive does not need to contain an oligomer component, which is a low-molecular component, or does not contain much, so that the oligomer component or the like does not move in the pressure-sensitive adhesive over time and is stable. Since the adhesive layer of a layer structure can be formed, it is preferable.
  • the base polymer having a carbon-carbon double bond those having a carbon-carbon double bond and having adhesiveness can be used without particular limitation.
  • those having an acrylic polymer as a basic skeleton are preferable.
  • the basic skeleton of the acrylic polymer include the acrylic polymers exemplified above.
  • the method for introducing the carbon-carbon double bond into the acrylic polymer is not particularly limited, and various methods can be adopted. However, it is easy in terms of molecular design to introduce the carbon-carbon double bond into the polymer side chain. It is. For example, after a monomer having a functional group is copolymerized in advance with an acrylic polymer, a compound having a functional group capable of reacting with the functional group and a carbon-carbon double bond is converted into a radiation-curable carbon-carbon double bond. A method of performing condensation or addition reaction while maintaining the above.
  • combinations of these functional groups include carboxylic acid groups and epoxy groups, carboxylic acid groups and aziridyl groups, hydroxyl groups and isocyanate groups, and the like.
  • a combination of a hydroxyl group and an isocyanate group is preferable because of easy tracking of the reaction.
  • the functional group may be on either side of the acrylic polymer and the compound as long as the combination of these functional groups generates an acrylic polymer having the carbon-carbon double bond.
  • it is preferable that the acrylic polymer has a hydroxyl group and the compound has an isocyanate group.
  • examples of the isocyanate compound having a carbon-carbon double bond include methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, m-isopropenyl- ⁇ , ⁇ -dimethylbenzyl isocyanate, and the like.
  • the acrylic polymer a copolymer obtained by copolymerizing the above-mentioned exemplified hydroxy group-containing monomers, ether compounds of 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, diethylene glycol monovinyl ether, or the like is used.
  • the base polymer (particularly acrylic polymer) having the carbon-carbon double bond can be used alone, but the radiation curable monomer does not deteriorate the characteristics.
  • Components and oligomer components can also be blended.
  • the radiation-curable oligomer component or the like is usually in the range of 30 parts by weight, preferably in the range of 0 to 10 parts by weight, with respect to 100 parts by weight of the base polymer.
  • the radiation curable pressure-sensitive adhesive contains a photopolymerization initiator when cured by ultraviolet rays or the like.
  • the photopolymerization initiator include 4- (2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone, ⁇ -hydroxy- ⁇ , ⁇ '-dimethylacetophenone, 2-methyl-2-hydroxypropio ⁇ -ketol compounds such as phenone and 1-hydroxycyclohexyl phenyl ketone; methoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, 2-methyl-1- [4- ( Acetophenone compounds such as methylthio) -phenyl] -2-morpholinopropane-1; benzoin ether compounds such as benzoin ethyl ether, benzoin isopropyl ether and anisoin methyl ether; ketal compounds such as benzyldimethyl ketal; 2-naphthalene
  • the radiation curable pressure-sensitive adhesive examples include photopolymerizable compounds such as an addition polymerizable compound having two or more unsaturated bonds and an alkoxysilane having an epoxy group disclosed in JP-A-60-196956. And a rubber-based pressure-sensitive adhesive and an acrylic pressure-sensitive adhesive containing a photopolymerization initiator such as a carbonyl compound, an organic sulfur compound, a peroxide, an amine, and an onium salt-based compound.
  • photopolymerizable compounds such as an addition polymerizable compound having two or more unsaturated bonds and an alkoxysilane having an epoxy group disclosed in JP-A-60-196956.
  • a rubber-based pressure-sensitive adhesive and an acrylic pressure-sensitive adhesive containing a photopolymerization initiator such as a carbonyl compound, an organic sulfur compound, a peroxide, an amine, and an onium salt-based compound.
  • a compound that is colored by irradiation with radiation may be contained as necessary.
  • a compound to be colored in the pressure-sensitive adhesive layer 2 by irradiation with radiation only the irradiated portion can be colored. That is, the portion 2a corresponding to the workpiece pasting portion 3a shown in FIG. 1 can be colored. Accordingly, whether or not the pressure-sensitive adhesive layer 2 has been irradiated with radiation can be immediately determined by visual observation, the workpiece pasting portion 3a can be easily recognized, and workpieces can be easily pasted together.
  • the detection accuracy is increased, and no malfunction occurs when the semiconductor chip is picked up.
  • the compound that is colored by irradiation with radiation is a colorless or light color compound before irradiation with radiation, but becomes a color by irradiation with radiation, and examples thereof include leuco dyes.
  • the use ratio of the compound colored by radiation irradiation can be set as appropriate.
  • the thickness of the pressure-sensitive adhesive layer 2 is not particularly limited, but is preferably about 1 to 50 ⁇ m from the viewpoint of preventing chipping of the chip cut surface and compatibility of fixing and holding the heat bonding sheets 3 and 3 ′. .
  • the thickness is preferably 2 to 30 ⁇ m, more preferably 5 to 25 ⁇ m.
  • the base material 1 can be formed by a conventionally known film forming method.
  • the film forming method include a calendar film forming method, a casting method in an organic solvent, an inflation extrusion method in a closed system, a T-die extrusion method, a co-extrusion method, and a dry lamination method.
  • the coating film is dried under predetermined conditions (heat-crosslinked as necessary), and the pressure-sensitive adhesive layer 2 is formed.
  • a coating method For example, roll coating, screen coating, gravure coating, etc. are mentioned.
  • drying conditions for example, a drying temperature of 80 to 150 ° C. and a drying time of 0.5 to 5 minutes are performed.
  • the coating film may be dried on the said drying conditions, and the adhesive layer 2 may be formed. Then, the adhesive layer 2 is bonded together with the separator on the base material 1. Thereby, the dicing tape 11 is produced.
  • the heat bonding sheet 10 with dicing tape can be manufactured by a usual method.
  • seat 10 for heat joining with a dicing tape can be manufactured by bonding the adhesive layer 2 of the dicing tape 11 and the sheet
  • the method of manufacturing a semiconductor device includes the step of preparing the heat bonding sheet; A heat bonding step of heat bonding the semiconductor chip onto the adherend via the heat bonding sheet (hereinafter also referred to as the first embodiment).
  • the method for manufacturing a semiconductor device includes the step of preparing the heat bonding sheet with dicing tape described above, A bonding step of bonding the heat bonding sheet of the heat bonding sheet with the dicing tape and the back surface of the semiconductor wafer; A dicing step of dicing the semiconductor wafer together with the heat bonding sheet to form a chip-like semiconductor chip; Picking up the semiconductor chip together with the heat bonding sheet from the heat bonding sheet with the dicing tape; A heat bonding step of heat bonding the semiconductor chip onto the adherend via the heat bonding sheet (hereinafter also referred to as a second embodiment).
  • the semiconductor device manufacturing method according to the first embodiment is different from the semiconductor device manufacturing method according to the second embodiment in that the semiconductor device according to the first embodiment uses a heat bonding sheet with dicing tape.
  • the manufacturing method of the apparatus is different in that the heat bonding sheet is used alone, and is common in other points.
  • the step of bonding the sheet to the dicing tape is performed.
  • the manufacturing method of the semiconductor device according to the second embodiment is performed. And can be similar. Therefore, hereinafter, a method for manufacturing a semiconductor device according to the second embodiment will be described.
  • the heat bonding sheets with dicing tape 10 and 12 are prepared (preparing step).
  • the dicing tape-attached heat bonding sheets 10 and 12 are used in the following manner by appropriately separating the separator arbitrarily provided on the heat bonding sheets 3 and 3 ′.
  • a case where the heat bonding sheet with dicing tape 10 is used will be described as an example with reference to FIG.
  • the semiconductor wafer 4 is pressure-bonded onto the semiconductor wafer bonding portion 3a of the heat bonding sheet 3 in the heat bonding sheet 10 with dicing tape, and this is bonded and held (fixing step). This step is performed while pressing with a pressing means such as a pressure roll.
  • the attaching temperature at the time of mounting is not particularly limited and is preferably in the range of 23 to 90 ° C., for example.
  • the semiconductor wafer 4 is diced (dicing process). Thereby, the semiconductor wafer 4 is cut into a predetermined size and separated into individual pieces, and the semiconductor chip 5 is manufactured.
  • the method of dicing is not particularly limited, for example, the dicing is performed from the circuit surface side of the semiconductor wafer 4 according to a conventional method. Further, in this step, for example, a cutting method called full cut in which cutting is performed up to the heat bonding sheet with dicing tape 10 can be adopted. It does not specifically limit as a dicing apparatus used at this process, A conventionally well-known thing can be used. Further, since the semiconductor wafer 4 is bonded and fixed by the heat bonding sheet 10 with a dicing tape, chip chipping and chip jumping can be suppressed, and damage to the semiconductor wafer 4 can also be suppressed.
  • the semiconductor chip 5 is picked up in order to peel the semiconductor chip 5 adhered and fixed to the heat bonding sheet 10 with dicing tape (pickup process).
  • the pickup method is not particularly limited, and various conventionally known methods can be employed. For example, there is a method in which each semiconductor chip 5 is pushed up by a needle from the heating bonding sheet 10 with dicing tape, and the pushed-up semiconductor chip 5 is picked up by a pickup device.
  • the needle push-up speed is preferably 5 to 100 mm / sec, more preferably 5 to 10 mm / sec from the viewpoint of preventing chipping.
  • the pickup is performed after the pressure-sensitive adhesive layer 2 is irradiated with ultraviolet rays.
  • seat 3 for heat bonding of the adhesive layer 2 falls, and peeling of the semiconductor chip 5 becomes easy.
  • the pickup can be performed without damaging the semiconductor chip 5.
  • Conditions such as irradiation intensity and irradiation time at the time of ultraviolet irradiation are not particularly limited, and may be set as necessary.
  • a well-known thing can be used as a light source used for ultraviolet irradiation.
  • the adhesive layer is preliminarily irradiated with ultraviolet rays and cured, and the cured adhesive layer and the heat bonding sheet are bonded together, the ultraviolet irradiation here is not necessary.
  • the picked-up semiconductor chip 5 is die-attached (heat bonded) to the adherend 6 via the heat bonding sheet 3 (heat bonding process).
  • the adherend 6 include a lead frame, a TAB film, a substrate, and a separately manufactured semiconductor chip.
  • the adherend 6 may be, for example, a deformable adherend that can be easily deformed or a non-deformable adherend (such as a semiconductor wafer) that is difficult to deform.
  • the lead frame examples include metal lead frames such as a Cu lead frame and a 42 Alloy lead frame.
  • a conventionally well-known thing can be used as said board
  • examples thereof include organic substrates made of glass epoxy, BT (bismaleimide-triazine), polyimide, and the like.
  • BT bismaleimide-triazine
  • polyimide polyimide
  • the substrate may be an insulating circuit substrate in which a copper circuit substrate is laminated on an insulating substrate such as a ceramic plate. If an insulated circuit board is used, for example, a power semiconductor device that controls and supplies power can be manufactured.
  • the metal fine particles are sintered by heating, and the thermally decomposable binder is thermally decomposed as necessary.
  • the heating temperature is preferably 180 to 400 ° C, more preferably 190 to 370 ° C, and further preferably 200 to 350 ° C.
  • the heating time is preferably 0.3 to 300 minutes, more preferably 0.5 to 240 minutes, and still more preferably 1 to 180 minutes.
  • the pressurizing condition is preferably in the range of 1 to 500 kg / cm 2 , more preferably in the range of 5 to 400 kg / cm 2 .
  • the heat bonding under pressure can be performed with an apparatus capable of simultaneously performing heating and pressure, such as a flip chip bonder. Moreover, a parallel plate press may be used.
  • the heat bonding sheet 3 has a tensile elastic modulus of 10 MPa or more obtained by the tensile test method, so that the constituent material of the heat bonding sheet 3 protrudes during die attachment (at the time of heat bonding) or the surface of the semiconductor chip 5. It is possible to suppress crawling up. Further, since the heat bonding sheet 3 contains metal fine particles in the range of 60 to 98% by weight, the semiconductor fine particles 5 and the adherend 6 (for example, a lead frame) are sintered or melted. Can be joined. In addition, the heat bonding sheet 3 has a carbon concentration of 15 obtained by energy dispersive X-ray analysis after heating from 23 ° C. to 400 ° C. in an air atmosphere under a temperature rising rate of 10 ° C./min. Since the content is less than or equal to the weight percent, there is almost no organic matter after the heat bonding step. As a result, after the heat bonding step, the heat resistance is excellent, and high reliability and thermal characteristics are obtained even in a high temperature environment.
  • the tip of the terminal portion (inner lead) of the adherend 6 and an electrode pad (not shown) on the semiconductor chip 5 are electrically connected by a bonding wire 7.
  • a bonding wire 7 for example, a gold wire, an aluminum wire, a copper wire or the like is used.
  • the temperature for wire bonding is 23 to 300 ° C., preferably 23 to 250 ° C. Further, it may be carried out in the range of 80 to 250 ° C. or in the range of 80 to 220 ° C.
  • the heating time is several seconds to several minutes.
  • the connection is performed by a combination of vibration energy by ultrasonic waves and crimping energy by applying pressure while being heated so as to be within the temperature range.
  • the semiconductor chip 5 is sealed with a sealing resin 8 as shown in FIG. 3 (sealing step).
  • This step is performed to protect the semiconductor chip 5 and the bonding wire 7 mounted on the adherend 6.
  • This step can be performed by molding a sealing resin with a mold.
  • the sealing resin 8 for example, an epoxy resin is used.
  • the heating temperature at the time of resin sealing is usually 175 ° C. for 60 to 90 seconds, but the present invention is not limited to this. For example, it can be cured at 165 to 185 ° C. for several minutes. Thereby, the sealing resin 8 is cured.
  • a method of embedding the semiconductor chip 5 in a sheet-like sealing sheet (for example, see JP2013-7028A) can also be employed.
  • a gel sealing type in which silicone gel is poured into a case type container may be used.
  • heating is performed as necessary to completely cure the insufficiently cured sealing resin 8 in the sealing process (post-curing process).
  • the heating temperature in this step varies depending on the type of the sealing resin, but is in the range of 165 to 185 ° C., for example, and the heating time is about 0.5 to 8 hours.
  • seat for heat joining with a dicing tape can be used suitably also when laminating
  • the heat bonding sheet and the spacer may be stacked between the semiconductor chips, or only the heat bonding sheet may be stacked between the semiconductor chips without stacking the spacer. It can be changed as appropriate.
  • the heat bonding sheet and the heat bonding sheet with dicing tape of the present invention are not limited to the applications exemplified above, and can be used for heat bonding two things.
  • Acrylic resin A SPB-TE1 (molecular weight 40000) manufactured by Soken Chemical Co., Ltd.
  • Acrylic resin B IB-27 (molecular weight 370000) manufactured by Soken Chemical Co., Ltd.
  • Polypropylene carbonate resin QPAC40 (Molecular weight 200000) manufactured by Empower Ethylcellulose A: Etcelle STD100 manufactured by Nisshin Kasei Metal fine particle A: SPH02J manufactured by Mitsui Mining & Smelting Co., Ltd.
  • Metal fine particle mixed paste A ANP-1 manufactured by Applied Nanoparticles Laboratory (paste in which nano-sized silver fine particles are dispersed)
  • Organic solvent A Methyl ethyl ketone (MEK)
  • Alcohol solvent A Terpineol

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)

Abstract

L'invention concerne une feuille de thermosoudage, qui présente un module d'élasticité en traction de 10 à 3000 MPa, qui contient de fines particules métalliques en une quantité dans la plage de 60-98 % en poids et qui, lorsqu'elle est chauffée de 23°C à 400°C dans l'air à une vitesse de chauffage de 10°C/min et ensuite examinée par spectrométrie de rayons X à dispersion d'énergie, présente une concentration en carbone de 15 % en poids ou moins.
PCT/JP2015/084813 2014-12-24 2015-12-11 Feuille pour le thermosoudage et feuille de thermosoudage avec bande de découpage en dés fixée Ceased WO2016104188A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201580070430.3A CN107109146A (zh) 2014-12-24 2015-12-11 加热接合用片材和带有切割带的加热接合用片材
EP15872757.8A EP3239258A4 (fr) 2014-12-24 2015-12-11 Feuille pour le thermosoudage et feuille de thermosoudage avec bande de découpage en dés fixée
US15/539,657 US10301509B2 (en) 2014-12-24 2015-12-11 Sheet for thermal bonding and sheet for thermal bonding with affixed dicing tape

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JP2014-260265 2014-12-24
JP2014260265 2014-12-24
JP2015-204211 2015-10-16
JP2015204211A JP6682235B2 (ja) 2014-12-24 2015-10-16 加熱接合用シート、及び、ダイシングテープ付き加熱接合用シート

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017065188A1 (fr) * 2015-10-13 2017-04-20 リンテック株式会社 Feuille adhésive sensible à la pression
CN109478519A (zh) * 2016-08-31 2019-03-15 日东电工株式会社 加热接合用片材、及带有切割带的加热接合用片材
EP3509092A4 (fr) * 2016-08-31 2019-07-10 Nitto Denko Corporation Feuille de liaison thermique, et feuille de liaison thermique pourvue d'un ruban de découpage en dés
EP3517586A4 (fr) * 2016-09-21 2019-09-25 Nitto Denko Corporation Feuille de thermocollage, et feuille de thermocollage dotée d'un ruban de découpage en dés
US11352527B2 (en) * 2017-11-13 2022-06-07 Nitto Denko Corporation Sinter-bonding composition, sinter-bonding sheet and dicing tape with sinter-bonding sheet

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017065188A1 (fr) * 2015-10-13 2017-04-20 リンテック株式会社 Feuille adhésive sensible à la pression
JP6147458B1 (ja) * 2015-10-13 2017-06-14 リンテック株式会社 粘着シート
US10450485B2 (en) 2015-10-13 2019-10-22 Lintec Corporation Pressure sensitive adhesive sheet
CN109478519A (zh) * 2016-08-31 2019-03-15 日东电工株式会社 加热接合用片材、及带有切割带的加热接合用片材
EP3509093A4 (fr) * 2016-08-31 2019-07-10 Nitto Denko Corporation Feuille pour liaison thermique, et feuille pour liaison thermique ayant une bande de coupe en dés
EP3509092A4 (fr) * 2016-08-31 2019-07-10 Nitto Denko Corporation Feuille de liaison thermique, et feuille de liaison thermique pourvue d'un ruban de découpage en dés
US11786966B2 (en) * 2016-08-31 2023-10-17 Nitto Denko Corporation Sheet for heat bonding, and sheet for heat bonding having dicing tape
EP3517586A4 (fr) * 2016-09-21 2019-09-25 Nitto Denko Corporation Feuille de thermocollage, et feuille de thermocollage dotée d'un ruban de découpage en dés
US11352527B2 (en) * 2017-11-13 2022-06-07 Nitto Denko Corporation Sinter-bonding composition, sinter-bonding sheet and dicing tape with sinter-bonding sheet

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