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WO2016104169A1 - Procédé de fabrication de feuille thermoconductrice, feuille thermoconductrice et dispositif à semi-conducteur - Google Patents

Procédé de fabrication de feuille thermoconductrice, feuille thermoconductrice et dispositif à semi-conducteur Download PDF

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Publication number
WO2016104169A1
WO2016104169A1 PCT/JP2015/084665 JP2015084665W WO2016104169A1 WO 2016104169 A1 WO2016104169 A1 WO 2016104169A1 JP 2015084665 W JP2015084665 W JP 2015084665W WO 2016104169 A1 WO2016104169 A1 WO 2016104169A1
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WIPO (PCT)
Prior art keywords
heat conductive
sheet
heat
conductive sheet
molded body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2015/084665
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English (en)
Japanese (ja)
Inventor
荒巻　慶輔
麻紗子 菅原
俊介 内田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
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Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2015239317A external-priority patent/JP6178389B2/ja
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to CN201580067250.XA priority Critical patent/CN107004651B/zh
Publication of WO2016104169A1 publication Critical patent/WO2016104169A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a method for manufacturing a heat conductive sheet disposed between a heat source such as a semiconductor element and a heat radiating member such as a heat sink, a heat conductive sheet, and a semiconductor device including the heat conductive sheet.
  • a heat conduction sheet is provided between the semiconductor device and the heat sink in order to efficiently release the heat of the semiconductor device.
  • a heat conductive sheet a material in which a filler such as a heat conductive filler [scale-like particles (boron nitride (BN), graphite, etc.), carbon fiber, etc.] is dispersed in silicone resin is widely used (for example, , See Patent Document 1).
  • heat conductive fillers have anisotropy of heat conduction.
  • a heat of about 600 W / m ⁇ K to 1200 W / m ⁇ K in the fiber direction.
  • boron nitride when used, it has a thermal conductivity of about 110 W / m ⁇ K in the plane direction and about 2 W / m ⁇ K in the direction perpendicular to the plane direction. It is known to have.
  • the thermal resistance which is an index indicating the difficulty of transferring heat.
  • it is effective to improve the adhesion to an electronic component as a heat source and a heat radiating member such as a heat sink.
  • the sheet surface has low adhesiveness (tackiness) and cannot be temporarily fixed to a heat source or a heat radiating member. Therefore, when mounting a heat conductive sheet between a heat source and a heat radiating member, it becomes necessary to temporarily fix it separately using an adhesive sheet or an adhesive. However, when such an adhesive sheet or adhesive is interposed, the mounting process becomes complicated.
  • the present invention makes it a subject to solve the said various problems in the past and to achieve the following objectives. That is, the present invention improves the adhesion to a heat source and a heat radiating member, is excellent in thermal conductivity, can be temporarily fixed without using an adhesive, etc., and is manufactured as a heat conductive sheet excellent in mountability. It is an object to provide a method, a heat conductive sheet, and a semiconductor device using the same.
  • the binder resin contains a liquid silicone gel main ingredient and a curing agent
  • the heat conductive sheet manufacturing method according to ⁇ 1>, wherein a mixing ratio of the main agent and the curing agent is, as a mass ratio, main agent: curing agent 35: 65 to 65:35.
  • the molded body preparation step is performed by filling the thermally conductive resin composition in a hollow mold and thermosetting the thermally conductive resin composition.
  • the thermally conductive filler contains carbon fiber and an inorganic filler, The method for producing a heat conductive sheet according to any one of ⁇ 1> to ⁇ 2>, wherein the carbon fibers are randomly oriented in the heat conductive sheet.
  • ⁇ 4> The method for producing a heat conductive sheet according to any one of ⁇ 1> to ⁇ 3>, wherein the pressing step is performed using a spacer for compressing the molded body sheet to a predetermined thickness.
  • the pressing step is performed by pressing a plurality of the molded body sheets adjacently and collectively to obtain a heat conductive sheet in which the plurality of molded body sheets are integrated.
  • a heat conductive sheet having a sheet body formed by curing a heat conductive resin composition containing a binder resin and a heat conductive filler The heat conductive sheet is characterized in that the surface of the sheet body is covered with an exuding component that has exuded from the sheet main body so as to follow the protruding shape of the protruding heat conductive filler.
  • the inorganic filler is attached to a surface of the carbon fiber in a protruding shape formed of the protruding heat conductive filler.
  • ⁇ 10> having a heat source, a heat radiating member, and a heat conductive sheet sandwiched between the heat source and the heat radiating member,
  • the heat conductive sheet is the heat conductive sheet according to any one of ⁇ 6> to ⁇ 9>.
  • the conventional problems can be solved, the object can be achieved, adhesion to a heat source and a heat radiating member is improved, heat conductivity is excellent, and an adhesive is not used.
  • a method of manufacturing a heat conductive sheet that can be temporarily fixed and is excellent in mountability, a heat conductive sheet, and a semiconductor device using the same can be provided.
  • FIG. 1 is a perspective view showing a state in which a molded body sheet is pressed through a spacer.
  • FIG. 2: A is a perspective view which shows the process of obtaining the large-sized heat conductive sheet by adjoining a some molded object sheet
  • FIG. 2B is a perspective view showing a process of obtaining a large heat conductive sheet by pressing a plurality of molded sheets adjacent to each other and collectively (No. 2).
  • FIG. 3 is a schematic cross-sectional view of an example of the semiconductor device of the present invention.
  • 4A is a SEM (scanning electron microscope) photograph of the surface of the heat conductive sheet sample of Example 4.
  • FIG. 4B is a SEM photograph of the surface of the heat conductive sheet sample of Example 4.
  • FIG. 5A is an SEM photograph of the surface of the heat conductive sheet sample of Example 5.
  • FIG. 5B is an SEM photograph of the surface of the heat conductive sheet sample of Example 5.
  • FIG. 6A is an SEM photograph of the surface of the heat conductive sheet sample of Example 6.
  • FIG. 6B is a SEM photograph of the surface of the heat conductive sheet sample of Example 6.
  • FIG. 7A is an SEM photograph of the surface of the heat conductive sheet sample of Example 7.
  • FIG. 7B is an SEM photograph of the surface of the heat conductive sheet sample of Example 7.
  • FIG. 8A is an SEM photograph of the surface of the heat conductive sheet sample of Comparative Example 2.
  • FIG. 8B is a SEM photograph of the surface of the heat conductive sheet sample of Comparative Example 2.
  • FIG. 8B is a SEM photograph of the surface of the heat conductive sheet sample of Comparative Example 2.
  • FIG. 8B
  • the manufacturing method of the heat conductive sheet of this invention contains a molded object preparation process, a molded object sheet preparation process, and a press process at least, and also includes another process as needed.
  • the heat conductive sheet of the present invention is a heat conductive sheet having a sheet body formed by curing a heat conductive resin composition containing a binder resin and a heat conductive filler, and the surface of the sheet main body protrudes from the above It is covered with an exuding component that has exuded from the sheet body so as to follow the convex shape of the thermally conductive filler.
  • the said heat conductive sheet of this invention can be suitably manufactured with the manufacturing method of the said heat conductive sheet of this invention.
  • molded body manufacturing step a process of obtaining a molded body of the thermally conductive resin composition by molding and curing a thermally conductive resin composition containing a binder resin and a thermally conductive filler into a predetermined shape. If it is, there will be no restriction
  • Thermal conductive resin composition contains binder resin and a heat conductive filler at least, and also contains another component as needed.
  • the said heat conductive resin composition can be prepared with a well-known method.
  • binder resin- There is no restriction
  • thermosetting polymer examples include crosslinked rubber, epoxy resin, polyimide resin, bismaleimide resin, benzocyclobutene resin, phenol resin, unsaturated polyester, diallyl phthalate resin, silicone resin, polyurethane, polyimide silicone, thermosetting type.
  • examples thereof include polyphenylene ether and thermosetting modified polyphenylene ether. These may be used individually by 1 type and may use 2 or more types together.
  • crosslinked rubber examples include natural rubber, butadiene rubber, isoprene rubber, nitrile rubber, hydrogenated nitrile rubber, chloroprene rubber, ethylene propylene rubber, chlorinated polyethylene, chlorosulfonated polyethylene, butyl rubber, halogenated butyl rubber, fluorine rubber, Examples thereof include urethane rubber, acrylic rubber, polyisobutylene rubber, and silicone rubber. These may be used individually by 1 type and may use 2 or more types together.
  • thermosetting polymer is a silicone resin from the viewpoints of excellent moldability and weather resistance, and adhesion and followability to electronic components.
  • the silicone resin is not particularly limited and may be appropriately selected depending on the intended purpose, but preferably contains a liquid silicone gel main component and a curing agent.
  • a silicone resin include an addition reaction type liquid silicone resin, a heat vulcanization type millable type silicone resin using a peroxide for vulcanization, and the like.
  • an addition reaction type liquid silicone resin is particularly preferable as a heat radiating member of an electronic device because adhesion between a heat generating surface of an electronic component and a heat sink surface is required.
  • the addition reaction type liquid silicone resin is preferably a two-component addition reaction type silicone resin containing a polyorganosiloxane having a vinyl group as a main ingredient and a polyorganosiloxane having a Si—H group as a curing agent.
  • the exuding component that has exuded from the molded body sheet in the pressing step can easily impart moderate fine tackiness to the obtained heat conductive sheet.
  • the content of the binder resin in the heat conductive resin composition is not particularly limited and may be appropriately selected depending on the intended purpose, but is preferably 10% by mass to 50% by mass, and more preferably 15% by mass to 40% by mass. % Is more preferable.
  • the thermally conductive filler is for efficiently conducting heat from a heat source to the heat radiating member.
  • the heat conductive filler carbon fiber and inorganic filler are preferable.
  • Carbon fiber--- There is no restriction
  • carbon fibers obtained by graphitizing PBO fibers and pitch-based carbon fibers are particularly preferable from the viewpoint of thermal conductivity.
  • the carbon fiber can be used after partially or entirely surface-treating as necessary.
  • the surface treatment include oxidation treatment, nitriding treatment, nitration, sulfonation, or attaching a metal, a metal compound, an organic compound, or the like to the surface of a functional group or carbon fiber introduced to the surface by these treatments.
  • the process etc. which combine are mentioned.
  • the functional group include a hydroxyl group, a carboxyl group, a carbonyl group, a nitro group, and an amino group.
  • the average fiber length (average major axis length) of the carbon fiber is not particularly limited and may be appropriately selected depending on the intended purpose, but is preferably 50 ⁇ m to 250 ⁇ m, more preferably 75 ⁇ m to 200 ⁇ m, and more preferably 90 ⁇ m to 170 ⁇ m. Is particularly preferred.
  • the average fiber diameter (average minor axis length) of the carbon fiber is not particularly limited and may be appropriately selected depending on the intended purpose, but is preferably 4 ⁇ m to 20 ⁇ m, more preferably 5 ⁇ m to 14 ⁇ m.
  • the aspect ratio (average major axis length / average minor axis length) of the carbon fiber is not particularly limited and may be appropriately selected depending on the intended purpose, but is preferably 8 or more, more preferably 9 to 30. . When the aspect ratio is less than 8, since the fiber length (major axis length) of the carbon fiber is short, the thermal conductivity may be lowered.
  • the average major axis length and the average minor axis length of the carbon fiber can be measured, for example, with a microscope, a scanning electron microscope (SEM), or the like.
  • the carbon fiber content in the heat conductive sheet is not particularly limited and may be appropriately selected depending on the intended purpose, but is preferably 10% by volume to 40% by volume, more preferably 12% by volume to 38% by volume. 15 vol% to 35 vol% is particularly preferable.
  • the content is less than 10% by volume, it may be difficult to obtain a sufficiently low thermal resistance.
  • the content exceeds 40% by volume, the moldability of the heat conductive sheet and the orientation of the carbon fibers may be obtained. May be affected.
  • Inorganic filler-- There is no restriction
  • the inorganic filler examples include aluminum nitride (aluminum nitride: AlN), silica, alumina (aluminum oxide), boron nitride, titania, glass, zinc oxide, silicon carbide, silicon (silicon), silicon oxide, aluminum oxide, and metal. And particles. These may be used individually by 1 type and may use 2 or more types together. Among these, alumina, boron nitride, aluminum nitride, zinc oxide, and silica are preferable, and alumina and aluminum nitride are particularly preferable from the viewpoint of thermal conductivity.
  • the inorganic filler may be subjected to a surface treatment.
  • the inorganic filler is treated with a coupling agent as the surface treatment, the dispersibility of the inorganic filler is improved and the flexibility of the heat conductive sheet is improved.
  • the average particle size of the said inorganic filler is preferably 1 ⁇ m to 10 ⁇ m, more preferably 1 ⁇ m to 5 ⁇ m, and particularly preferably 4 ⁇ m to 5 ⁇ m.
  • the average particle size is less than 1 ⁇ m, the viscosity increases and mixing may become difficult.
  • the average particle size exceeds 10 ⁇ m, the thermal resistance of the heat conductive sheet may increase.
  • the average particle size is preferably 0.3 ⁇ m to 6.0 ⁇ m, more preferably 0.3 ⁇ m to 2.0 ⁇ m, and particularly preferably 0.5 ⁇ m to 1.5 ⁇ m. If the average particle size is less than 0.3 ⁇ m, the viscosity may increase and mixing may be difficult, and if it exceeds 6.0 ⁇ m, the thermal resistance of the heat conductive sheet may increase.
  • the average particle diameter of the inorganic filler can be measured by, for example, a particle size distribution meter or a scanning electron microscope (SEM).
  • the content of the inorganic filler in the heat conductive sheet is not particularly limited and may be appropriately selected depending on the intended purpose, but is preferably 25% by volume to 65% by volume, more preferably 30% by volume to 60% by volume. preferable. When the content is less than 25% by volume, the thermal resistance of the heat conductive sheet may increase, and when it exceeds 60% by volume, the flexibility of the heat conductive sheet may decrease.
  • the other components in the thermally conductive resin composition are not particularly limited and may be appropriately selected depending on the intended purpose.
  • examples thereof include thixotropic agents, dispersants, curing accelerators, retarders, and slight adhesion.
  • examples include an imparting agent, a plasticizer, a flame retardant, an antioxidant, a stabilizer, and a colorant.
  • the molded body preparation step is performed by filling the heat conductive resin composition in a hollow mold and thermosetting the heat conductive resin composition.
  • the thermally conductive filler for example, carbon fiber
  • the thermally conductive filler can be randomly oriented.
  • the carbon fibers are randomly oriented, the entanglement between the carbon fibers increases, so that the carbon fibers are heated more than in the case where they are oriented in a certain direction. Conductivity increases.
  • the thermally conductive filler contains the carbon fiber and the spherical inorganic filler
  • the carbon fibers are randomly oriented, Since the number of contact points between the carbon fiber and the spherical inorganic filler also increases, the thermal conductivity is further increased as compared with the case where the carbon fiber is oriented in a certain direction.
  • the extrusion molding method and the mold molding method are not particularly limited, and the viscosity of the heat conductive resin composition and the obtained heat conduction can be selected from various known extrusion molding methods and mold molding methods. It can be appropriately employed depending on the characteristics required for the sheet.
  • the binder resin flows.
  • Some carbon fibers are oriented along the flow direction, but many are randomly oriented.
  • the carbon fiber tends to be easily oriented at the center with respect to the width direction of the extruded molded body block.
  • the carbon fiber tends to be randomly oriented in the peripheral portion with respect to the width direction of the molded body block due to the influence of the slit wall.
  • the size and shape of the molded body can be determined according to the required size of the heat conductive sheet. For example, there is a rectangular parallelepiped having a vertical size of 0.5 cm to 15 cm and a horizontal size of 0.5 cm to 15 cm. The length of the rectangular parallelepiped may be determined as necessary.
  • the molded body sheet production step is not particularly limited as long as it is a process of cutting the molded body into a sheet shape and obtaining a molded body sheet with the thermally conductive filler protruding on the surface, and is appropriately selected depending on the purpose. For example, it can be performed by a slicing apparatus.
  • the molded body is cut into a sheet shape to obtain a molded body sheet.
  • the thermally conductive filler protrudes from the surface of the obtained molded body sheet. This is because when the molded body is cut into a sheet shape by a slicing device or the like, the cured component of the binder resin is cut by a slicing device or the like due to a difference in hardness between the cured component of the binder resin and the thermally conductive filler. This is considered to be because the cured component of the binder resin is removed from the surface of the thermally conductive filler on the surface of the molded body sheet.
  • the slicing apparatus is not particularly limited and may be appropriately selected depending on the intended purpose. Examples thereof include an ultrasonic cutter and a planer.
  • the cutting direction of the molded body is preferably 60 ° to 120 ° with respect to the extrusion direction because some are oriented in the extrusion direction, and preferably 70 ° to 100 °. The degree is more preferable, and 90 degrees (vertical) is particularly preferable.
  • the pressure at the time of pressing is not particularly limited and can be appropriately selected according to the purpose. However, if it is too low, the thermal resistance tends to be the same as when not pressing, and if it is too high, the sheet is stretched. Since there is a tendency, 0.1 MPa to 100 MPa is preferable, and 0.5 MPa to 95 MPa is more preferable.
  • the position in the vertical axis (z-axis) direction indicating brightness is indicated by L *.
  • the value of the lightness L * is a positive number. The smaller the number, the lower the lightness and the darker the tendency. Specifically, the value of L * varies from 0 corresponding to black to 100 corresponding to white.
  • the two-component addition reaction type liquid silicone resin is a mixture of 35% by mass of silicone A liquid (main agent) and 65% by mass of silicone B liquid (curing agent).
  • the obtained silicone resin composition was extruded into a rectangular parallelepiped mold (50 mm ⁇ 50 mm) with a PET film peel-treated on the inner wall to mold a silicone molded body.
  • the obtained silicone molding was cured in an oven at 100 ° C. for 6 hours to obtain a silicone cured product.
  • Example 2 As a two-component addition reaction type liquid silicone resin, except for using a mixture of 40% by mass of a silicone A solution and 60% by mass of a silicone B solution, the same conditions as in Example 1, A heat conductive sheet sample was prepared.
  • Comparative Example 3 the two-component addition reaction type liquid silicone resin was the same as in Example 1 except that a mixture of 70% by mass of silicone A solution and 30% by mass of silicone B solution was used. A heat conductive sheet sample was prepared.

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Abstract

La présente invention concerne un procédé de fabrication d'une feuille thermoconductrice, comprenant : une étape de production d'article moulé consistant à mouler une composition de résine thermoconductrice comprenant un liant résineux et une charge thermoconductrice en une forme souhaitée et à durcir ensuite le produit moulé afin de produire un article moulé fait de la composition de résine thermoconductrice; une étape de production de feuille d'article moulé consistant à découper l'article moulé en une forme du type feuille afin de produire une feuille d'article moulé dans laquelle la charge thermoconductrice est en saillie sur la surface de la feuille; et une étape de pressage consistant à presser la feuille d'article moulé de manière que la surface de la feuille d'article moulé soit revêtue d'un constituant ayant suinté qui a suinté de la feuille d'article moulé de telle manière que le constituant ayant suinté puisse suivre la forme saillante formée par la charge thermoconductrice en saillie sur la surface de la feuille d'article moulé.
PCT/JP2015/084665 2014-12-25 2015-12-10 Procédé de fabrication de feuille thermoconductrice, feuille thermoconductrice et dispositif à semi-conducteur Ceased WO2016104169A1 (fr)

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CN201580067250.XA CN107004651B (zh) 2014-12-25 2015-12-10 导热片的制造方法、导热片和半导体装置

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JP2014-262740 2014-12-25
JP2014262740 2014-12-25
JP2015239317A JP6178389B2 (ja) 2014-12-25 2015-12-08 熱伝導シートの製造方法、熱伝導シート、及び半導体装置
JP2015-239317 2015-12-08

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110739223A (zh) * 2018-07-18 2020-01-31 迪睿合株式会社 导热性片的制造方法
CN110739224A (zh) * 2018-07-18 2020-01-31 迪睿合株式会社 导热性片的制造方法
JP7093902B1 (ja) 2021-05-12 2022-06-30 広東思泉新材料股▲フン▼有限公司 方向性熱伝導シート及びその製造方法、並びに半導体放熱装置
WO2022264790A1 (fr) * 2021-06-16 2022-12-22 デクセリアルズ株式会社 Feuille thermoconductrice et procédé de production de feuille thermoconductrice
US11615999B1 (en) 2022-07-22 2023-03-28 GuangDong Suqun New Material Co., Ltd Oriented heat conducting sheet and preparation method thereof, and semiconductor heat dissipating device

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JP2009215404A (ja) * 2008-03-10 2009-09-24 Teijin Ltd シート状熱伝導性成形体
JP2011074303A (ja) * 2009-10-01 2011-04-14 Hitachi Chem Co Ltd 樹脂シート、その製造方法およびこれを用いたサーマルモジュール
JP2012001638A (ja) * 2010-06-17 2012-01-05 Sony Chemical & Information Device Corp 熱伝導性シート及び熱伝導性シートの製造方法
JP2012038763A (ja) * 2010-08-03 2012-02-23 Hitachi Chem Co Ltd 熱伝導シート、熱伝導シートの製造方法、及び熱伝導シートを用いた放熱装置
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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110739223A (zh) * 2018-07-18 2020-01-31 迪睿合株式会社 导热性片的制造方法
CN110739224A (zh) * 2018-07-18 2020-01-31 迪睿合株式会社 导热性片的制造方法
JP7093902B1 (ja) 2021-05-12 2022-06-30 広東思泉新材料股▲フン▼有限公司 方向性熱伝導シート及びその製造方法、並びに半導体放熱装置
JP2022176076A (ja) * 2021-05-12 2022-11-25 広東思泉新材料股▲フン▼有限公司 方向性熱伝導シート及びその製造方法、並びに半導体放熱装置
WO2022264790A1 (fr) * 2021-06-16 2022-12-22 デクセリアルズ株式会社 Feuille thermoconductrice et procédé de production de feuille thermoconductrice
JP2022191599A (ja) * 2021-06-16 2022-12-28 デクセリアルズ株式会社 熱伝導シート及び熱伝導シートの製造方法
US11615999B1 (en) 2022-07-22 2023-03-28 GuangDong Suqun New Material Co., Ltd Oriented heat conducting sheet and preparation method thereof, and semiconductor heat dissipating device

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