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WO2016189577A1 - Procédé de formation de câblage - Google Patents

Procédé de formation de câblage Download PDF

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Publication number
WO2016189577A1
WO2016189577A1 PCT/JP2015/064700 JP2015064700W WO2016189577A1 WO 2016189577 A1 WO2016189577 A1 WO 2016189577A1 JP 2015064700 W JP2015064700 W JP 2015064700W WO 2016189577 A1 WO2016189577 A1 WO 2016189577A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring
resin layer
via hole
metal
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2015/064700
Other languages
English (en)
Japanese (ja)
Inventor
謙磁 塚田
政利 藤田
良崇 橋本
明宏 川尻
雅登 鈴木
克明 牧原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Machine Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Machine Manufacturing Co Ltd filed Critical Fuji Machine Manufacturing Co Ltd
Priority to JP2017520055A priority Critical patent/JPWO2016189577A1/ja
Priority to PCT/JP2015/064700 priority patent/WO2016189577A1/fr
Publication of WO2016189577A1 publication Critical patent/WO2016189577A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits

Definitions

  • the present invention relates to a wiring forming method for forming a wiring with a metal-containing liquid containing metal fine particles.
  • a wiring forming method of the present invention includes a first wiring forming step of forming a first wiring with a metal-containing liquid containing metal fine particles on a base material, A first resin layer forming step of forming a first resin layer having a first inclined surface that is partially continuous; and the first resin layer that is connected to the first wiring that is continuous to the first inclined surface. And a second wiring forming step of forming a second wiring with the metal-containing liquid on one resin layer.
  • a first wiring is formed on a base material by a metal-containing liquid, and a resin layer having a via hole in which a part of the first wiring is exposed is formed on the base material. It is formed. And the inside of a via hole is filled with the metal lump by laminating
  • the first wiring is formed on the base material by the metal-containing liquid, and the resin layer having an inclined surface continuous with a part of the first wiring is formed on the base material. Formed.
  • the second wiring is formed on the resin layer by the metal-containing liquid so as to be connected to the first wiring continuous to the inclined surface. That is, in the wiring forming method of the present invention, the second wiring is formed instead of the metal block. Thereby, it is not necessary to stack metal thin films, and throughput can be improved. Further, unlike the metal lump filled in the via hole, the amount of the metal-containing liquid necessary for forming the second wiring is relatively small, so that the material cost can be greatly reduced.
  • FIG. 1 shows an electronic device manufacturing apparatus 10.
  • the electronic device manufacturing apparatus (hereinafter may be abbreviated as “manufacturing apparatus”) 10 includes a transport device 20, a first modeling unit 22, a second modeling unit 24, and a control device (see FIG. 6) 26.
  • the conveying device 20, the first modeling unit 22, and the second modeling unit 24 are disposed on the base 28 of the manufacturing apparatus 10.
  • the base 28 has a generally rectangular shape.
  • the longitudinal direction of the base 28 is orthogonal to the X-axis direction
  • the short direction of the base 28 is orthogonal to both the Y-axis direction, the X-axis direction, and the Y-axis direction.
  • the direction will be described as the Z-axis direction.
  • the transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32.
  • the X-axis slide mechanism 30 has an X-axis slide rail 34 and an X-axis slider 36.
  • the X-axis slide rail 34 is disposed on the base 28 so as to extend in the X-axis direction.
  • the X-axis slider 36 is held by an X-axis slide rail 34 so as to be slidable in the X-axis direction.
  • the X-axis slide mechanism 30 has an electromagnetic motor (see FIG. 6) 38, and the X-axis slider 36 moves to an arbitrary position in the X-axis direction by driving the electromagnetic motor 38.
  • the Y axis slide mechanism 32 includes a Y axis slide rail 50 and a stage 52.
  • the Y-axis slide rail 50 is disposed on the base 28 so as to extend in the Y-axis direction, and is movable in the X-axis direction.
  • One end of the Y-axis slide rail 50 is connected to the X-axis slider 36.
  • a stage 52 is held on the Y-axis slide rail 50 so as to be slidable in the Y-axis direction.
  • the Y-axis slide mechanism 32 has an electromagnetic motor (see FIG. 6) 56, and the stage 52 moves to an arbitrary position in the Y-axis direction by driving the electromagnetic motor 56.
  • the stage 52 moves to an arbitrary position on the base 28 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.
  • the stage 52 has a base 60, a holding device 62, and a lifting device 64.
  • the base 60 is formed in a flat plate shape, and a circuit board or the like is placed on the upper surface.
  • the holding device 62 is provided on both sides of the base 60 in the X-axis direction. Then, both edge portions in the X-axis direction of the circuit board or the like placed on the base 60 are sandwiched by the holding device 62, whereby the circuit board or the like is fixedly held.
  • the lifting device 64 is disposed below the base 60 and lifts the base 60.
  • the first modeling unit 22 is, for example, a unit that models the wiring (see FIG. 3) 80 on the circuit board (see FIG. 3) 70 placed on the base 60 of the stage 52, and the first printing unit 72. And a firing part 74.
  • the first printing unit 72 includes an inkjet head 76, and discharges the metal ink 77 in a linear manner onto the circuit board 70 placed on the base 60.
  • the metal ink 77 is obtained by dispersing metal fine particles in a solvent.
  • the inkjet head 76 discharges a conductive material from a plurality of nozzles by, for example, a piezo method using a piezoelectric element.
  • the firing unit 74 has a laser irradiation device 78, as shown in FIG.
  • the laser irradiation device 78 is a device that irradiates the metal ink 77 discharged onto the circuit board 70 with a laser, and the metal ink 77 irradiated with the laser is baked to form the wiring 80.
  • the firing of the metal ink 77 is a phenomenon in which, by applying energy, the solvent is vaporized, the metal fine particle protective film is decomposed, and the like, and the metal fine particles are contacted or fused to increase the conductivity. It is.
  • the metal wiring 77 is formed by baking the metal ink 77.
  • the 2nd modeling unit 24 is a unit which models the resin layer (refer FIG. 5) 82 on the circuit board (refer FIG. 5) 70 mounted in the base 60 of the stage 52, for example, FIG.
  • the second printing unit 84 and the curing unit 86 are provided.
  • the second printing unit 84 has an inkjet head 88 and discharges the ultraviolet curable resin 90 onto the circuit board 70 placed on the base 60.
  • the ink jet head 88 may be, for example, a piezo method using a piezoelectric element, or a thermal method in which a resin is heated to generate bubbles and ejected from a nozzle.
  • the curing unit 86 includes a flattening device 96 and an irradiation device 98.
  • the flattening device 96 flattens the upper surface of the ultraviolet curable resin 90 discharged onto the circuit board 70 by the ink jet head 88.
  • the flattening device 96 removes excess resin while leveling the surface of the ultraviolet curable resin 90.
  • the thickness of the ultraviolet curable resin 90 is made uniform by scraping with a roller or a blade.
  • the irradiation device 98 includes a mercury lamp or LED as a light source, and irradiates the ultraviolet curable resin 90 discharged onto the circuit board 70 with ultraviolet rays. Thereby, the ultraviolet curable resin 90 discharged on the circuit board 70 is cured, and the resin layer 82 is formed.
  • the control device 26 includes a controller 102 and a plurality of drive circuits 104 as shown in FIG.
  • the plurality of drive circuits 104 are connected to the electromagnetic motors 38 and 56, the holding device 62, the lifting device 64, the inkjet head 76, the laser irradiation device 78, the inkjet head 88, the flattening device 96, and the irradiation device 98.
  • the controller 102 includes a CPU, a ROM, a RAM, and the like, mainly a computer, and is connected to a plurality of drive circuits 104. Thereby, the operation of the transport device 20, the first modeling unit 22, and the second modeling unit 24 is controlled by the controller 102.
  • a multilayer circuit pattern is formed on the circuit board 70 with the above-described configuration.
  • the circuit board 70 is set on the base 60 of the stage 52, and the stage 52 is moved below the first modeling unit 22.
  • the metal ink 77 is ejected linearly on the circuit board 70 by the inkjet head 76 in accordance with the circuit pattern.
  • the laser is irradiated to the metal ink 77 discharged onto the circuit board 70 by the laser irradiation device 78 in the firing unit 74.
  • the metal ink 77 is baked, and the wiring 80 is formed on the circuit board 70 as shown in FIG.
  • the thickness of the wiring 80 is 5 ⁇ m or less, and the width of the wiring 80 is about 100 to 250 ⁇ m.
  • a resin layer 82 is formed on the circuit board 70 so as to cover the wiring 80 as shown in FIG.
  • the resin layer 82 has a via hole 110 for exposing a part of the wiring 80, and discharges the ultraviolet curable resin 90 from the inkjet head 88 and the irradiation device 98 for the discharged ultraviolet curable resin 90. It is formed by repeating ultraviolet irradiation. Specifically, the stage 52 is moved below the second modeling unit 24, and in the second printing unit 84, the ultraviolet curable resin 90 is thinly formed on the circuit board 70 so that the inkjet head 88 covers the wiring 80. To discharge.
  • the ultraviolet curable resin 90 is discharged to a portion excluding a circular portion centering on a part of the wiring 80. That is, the inkjet head 88 discharges the ultraviolet curable resin 90 in a thin film shape on the circuit board 70 so that a part of the wiring 80 is exposed in a circle and the wiring 80 other than the part is covered.
  • the ultraviolet curable resin 90 is discharged in a thin film shape
  • the ultraviolet curable resin 90 is flattened by the flattening device 96 so that the film thickness becomes uniform.
  • the irradiation device 98 irradiates the thin-film ultraviolet curable resin 90 with ultraviolet rays. As a result, a thin resin layer is formed on the circuit board 70.
  • the inkjet head 88 discharges the ultraviolet curable resin 90 in a thin film form only on the upper part of the thin resin layer. That is, the inkjet head 88 discharges the ultraviolet curable resin 90 in a thin film shape on the thin resin layer so that a part of the wiring 80 is exposed in a circular shape. Then, the thin-film ultraviolet curable resin 90 is flattened by the flattening device 96, and the irradiation device 98 irradiates the ultraviolet-curable resin 90 discharged in the thin film shape with ultraviolet rays, so that the upper surface of the thin-film resin layer is irradiated. A thin resin layer is laminated on the substrate.
  • the discharge of the ultraviolet curable resin onto the thin resin layer excluding the portion where the part of the wiring 80 is exposed in a circular shape and the irradiation with the ultraviolet rays are repeated, whereby the via hole 110 is formed.
  • a resin layer 82 having the above is formed.
  • the ultraviolet curable resin 90 is discharged onto the thin resin layer in a state in which a part of the wiring 80 is left slightly exposed in consideration of wettability and the like.
  • the inner peripheral surface of the hole 110 is tapered. That is, the via hole 110 has a mortar shape, and the inner peripheral surface of the via hole 110 is an inclined surface.
  • the wiring 80 formed on the circuit board 70 needs to be conducted to the upper surface side of the resin layer 82 in order to laminate the circuit pattern.
  • the discharge of the metal ink 77 into the via hole 110 and the laser irradiation to the metal ink 77 are repeated, so that the metal in the via hole 110 is formed as shown in FIG. A lump 112 is formed, and the metal lump 112 causes the wiring 80 formed on the circuit board 70 to conduct to the upper surface side of the resin layer 82.
  • the inkjet head 76 ejects the metal ink 77 into the via hole 110 in a thin film shape in the first printing unit 72 of the first modeling unit 22. To do.
  • the laser irradiation apparatus 78 irradiates a laser to the metal ink 77 discharged in the thin film shape. As a result, a metal thin film is formed inside the via hole 110. Then, the discharge of the metal ink 77 into the via hole 110 and the laser irradiation to the discharged metal ink 77 are repeated, so that a metal thin film is laminated inside the via hole 110, and the metal block 112. Is formed.
  • the metal lump 112 is formed inside the via hole 110, whereby the wiring 80 formed on the circuit board 70 is conducted to the upper surface side of the resin layer 82.
  • this method it is necessary to repeat the discharge of the metal ink 77 into the via hole 110 and the laser irradiation of the discharged metal ink 77 a plurality of times, so that the throughput is lowered.
  • the metal ink 77 corresponding to the internal capacity of the via hole 110 is required, which increases the material cost.
  • the resin layer 82 is deteriorated by the laser irradiation into the via hole 110 a plurality of times.
  • the wiring 120 is formed on a part of the inclined surface of the inner peripheral surface of the via hole 110, and the wiring formed on the circuit board 70. 80 is electrically connected to the upper surface side of the resin layer 82.
  • the laser irradiation device 78 is applied to the wiring 80 exposed from the via hole 110 of the resin layer 82. Irradiate laser. As a result, the excess resin residue on the wiring 80 exposed from the via hole 110 is removed.
  • the metal ink 77 is ejected linearly onto the inclined surface of the inner peripheral surface of the via hole 110 by the inkjet head 76. At this time, the metal ink 77 is discharged from the wiring 80 continuing to the inclined surface of the via hole 110 to the upper surface of the resin layer 82 via the inclined surface.
  • the laser irradiation device 78 irradiates the metal ink 77 discharged from the wiring 80 to the upper surface of the resin layer 82 in the firing unit 74. Thereby, the metal ink 77 is baked, and the wiring 120 extending from the wiring 80 to the upper surface of the resin layer 82 is formed.
  • the wiring 80 formed on the circuit board 70 is conducted to the upper surface side of the resin layer 82.
  • the thickness and width of the wiring 120 are approximately the same as those of the wiring 80.
  • the angle of the inclined surface of the via hole 110 in which the wiring 120 is formed is set to 25 degrees or less in order to form the wiring 120 appropriately.
  • the resin layer 82 is formed so that the thickness t of the resin layer 82 is 20 to 40 ⁇ m and the length dimension l in the direction parallel to the circuit board 70 of the inclined surface of the via hole 110 is 100 to 300 ⁇ m. Has been.
  • the wiring 120 is formed on a part of the inclined surface of the inner peripheral surface of the via hole 110, so that the wiring 80 formed on the circuit board 70 is changed to the upper surface side of the resin layer 82. Is conducting. This eliminates the need to repeat the discharge of the metal ink 77 and the laser irradiation a plurality of times as in the conventional method, thereby improving throughput and reducing damage to the resin layer 82 due to laser irradiation. It becomes. Further, unlike the metal block 112 filled in the via hole 110, the wiring 120 is formed on a part of the inclined surface of the via hole 110, so that the amount of metal ink 77 used can be significantly reduced. Thus, the material cost can be greatly reduced. Furthermore, before the wiring 120 is formed, the wiring 80 exposed from the via hole 110 is irradiated with a laser to remove excess resin, thereby ensuring the reliability of the connection between the wiring 80 and the wiring 120. Has been.
  • the resin layer 122 is laminated on the resin layer 82 so as to cover the wiring 120 as shown in FIG. Similar to the resin layer 82, the resin layer 122 is formed by repeating the discharge of the ultraviolet curable resin 90 and the irradiation of the ultraviolet rays onto the discharged ultraviolet curable resin 90 to expose a part of the wiring 120.
  • the inkjet head 88 discharges the ultraviolet curable resin 90 into the via hole 110 in a thin film shape.
  • the ultraviolet curable resin 90 irradiates the ultraviolet curable resin 90 discharged in a thin film shape with ultraviolet rays.
  • a thin resin layer is formed inside the via hole 110.
  • a thin resin layer is laminated inside the via hole 110, The inside of the via hole 110 is filled with the resin layer 122.
  • the wiring 120 positioned on the inclined surface of the via hole 110 is covered with the resin layer 122, but the end portion of the wiring 120 positioned on the upper surface side of the resin layer 82 is exposed.
  • the ultraviolet curable resin 90 is ejected in a thin film shape by the inkjet head 88 to a portion excluding the circular portion centering on the end portion on the upper surface side of the resin layer 82 of the wiring 120. Then, the ultraviolet curable resin 90 discharged in the form of a thin film is flattened by the flattening device 96, and the flattened ultraviolet curable resin 90 is irradiated with ultraviolet rays by the irradiation device 98. As a result, a thin resin layer is formed on the resin layer 82.
  • the resin layer 122 having the via hole 126 is laminated on the resin layer 82 by repeating the discharge of the ultraviolet curable resin 90 and the ultraviolet irradiation of the discharged ultraviolet curable resin 90.
  • the shape of the resin layer 122 is substantially the same as that of the resin layer 82 except for the portion filled in the via hole 110 and the location where the via hole 126 is formed.
  • the shape of the via hole 126 is The shape is substantially the same as the hole 110.
  • the wiring 128 is formed on a part of the inclined surface of the inner peripheral surface of the via hole 126, and the wiring 120 formed on the resin layer 82. Is conducted to the upper surface side of the resin layer 122.
  • the laser irradiation device 78 irradiates the laser toward the wiring 120 exposed from the via hole 126 of the resin layer 122. .
  • the excess resin residue on the wiring 120 exposed from the via hole 126 is removed.
  • the metal ink 77 is ejected linearly onto the inclined surface of the inner peripheral surface of the via hole 126 by the inkjet head 76. At this time, the metal ink 77 is discharged from the wiring 120 continuing to the inclined surface of the via hole 126 to the upper surface of the resin layer 122 via the inclined surface.
  • the inclination direction of the inclined surface of the via hole 126 from which the metal ink 77 is discharged is opposite to the inclination direction of the inclined surface of the via hole 110 in which the wiring 120 is formed.
  • the laser irradiation device 78 irradiates the metal ink 77 discharged from the wiring 120 to the upper surface of the resin layer 122 in the firing unit 74.
  • the metal ink 77 is baked, and the wiring 128 extending from the wiring 120 to the upper surface of the resin layer 122 is formed. Thereby, the wiring 120 formed on the resin layer 82 is conducted to the upper surface side of the resin layer 122. Note that the thickness and width of the wiring 128 are approximately the same as those of the wiring 80. Further, since the metal ink 77 is discharged onto the inclined surface of the via hole 126 in the direction opposite to the inclined direction of the inclined surface of the via hole 110 where the wiring 120 is formed, the wiring 128 extends above the wiring 120. Formed in a state.
  • FIG. 13 A simple circuit pattern is formed.
  • the resin layers 82 and 122 are electrically connected by the wirings 120 and 128.
  • the direction in which the wires 120 and 128 extend is opposite to the direction in which the wires positioned in the vertical direction extend. As a result, the area occupied by the circuit pattern can be reduced.
  • the controller 102 of the control device 26 includes a first wiring formation unit 130, a first resin layer formation unit 132, a resin removal unit 134, a second wiring formation unit 136, and a second And a resin layer forming portion 138.
  • the first wiring forming unit 130 is a functional unit for forming the wiring 80 on the circuit board 70.
  • the first resin layer forming part 132 is a functional part for forming the resin layer 82 having the via hole 110.
  • the resin removing unit 134 is a functional unit for removing the resin by irradiating a laser on the wiring 80 exposed from the via hole 110.
  • the second wiring formation unit 136 is a functional unit for forming the wiring 120 on the resin layer 82.
  • the second resin layer forming part 138 is a functional part for forming the resin layer 122 having the via hole 126.
  • the circuit board 70 is an example of a base material.
  • the metal ink 77 is an example of a metal-containing liquid.
  • the wiring 80 is an example of a first wiring.
  • the resin layer 82 is an example of a first resin layer.
  • the inclined surface of the via hole 110 is an example of a first inclined surface.
  • the wiring 120 is an example of a second wiring.
  • the resin layer 122 is an example of a second resin layer.
  • the inclined surface of the via hole 126 is an example of a second inclined surface.
  • the wiring 128 is an example of a third wiring.
  • the process executed by the first wiring forming unit 130 is an example of a first wiring forming process.
  • the process executed by the first resin layer forming unit 132 is an example of a first resin layer forming process.
  • the process executed by the resin removing unit 134 is an example of a resin removing process.
  • the process executed by the second wiring forming unit 136 is an example of a second wiring forming process.
  • the process executed by the second resin layer forming unit 138 is an example of a second resin layer forming process.
  • the wirings 120 and 128 are formed on the inner peripheral surfaces of the via holes 110 and 126 of the resin layers 82 and 122.
  • inclined surfaces are formed on the resin layer.
  • a wiring may be formed on the surface.
  • an ultraviolet curable resin that is cured by irradiation with ultraviolet rays is employed, but various curable resins such as a thermosetting resin that is cured by heat can be employed.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

Dans un procédé de formation de câblage selon la présente invention, un premier câblage 80 est formé à partir d'un liquide contenant du métal sur une carte de circuit imprimé 70, et une couche de résine 82 ayant un trou d'interconnexion 110 est formée sur la carte de circuit imprimé, ledit trou d'interconnexion étant continu à une partie du premier câblage en raison d'une surface inclinée. Ensuite, un second câblage 120 est formé à partir du liquide contenant du métal sur la couche de résine de telle sorte que le second câblage est connecté au premier câblage continu au trou d'interconnexion. Tandis que dans des procédés de formation de câblage classiques, l'intérieur d'un trou d'interconnexion est rempli avec un bloc de métal par stratification de films minces de métal dans le trou d'interconnexion, lesdits films minces de métal étant formés à partir d'un liquide contenant du métal. C'est-à-dire que dans le procédé de formation de câblage selon la présente invention, il n'est pas nécessaire de stratifier les films minces de métal et le rendement peut être amélioré. En outre, étant donné que la quantité nécessaire de liquide contenant du métal devant être utilisé dans le but de former le second câblage est relativement petite, contrairement aux cas où l'intérieur du trou d'interconnexion est rempli avec le bloc de métal, le coût en matériel peut être considérablement réduit.
PCT/JP2015/064700 2015-05-22 2015-05-22 Procédé de formation de câblage Ceased WO2016189577A1 (fr)

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Application Number Priority Date Filing Date Title
JP2017520055A JPWO2016189577A1 (ja) 2015-05-22 2015-05-22 配線形成方法
PCT/JP2015/064700 WO2016189577A1 (fr) 2015-05-22 2015-05-22 Procédé de formation de câblage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2015/064700 WO2016189577A1 (fr) 2015-05-22 2015-05-22 Procédé de formation de câblage

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WO2016189577A1 true WO2016189577A1 (fr) 2016-12-01

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JP2018157014A (ja) * 2017-03-16 2018-10-04 株式会社Ｆｕｊｉ 回路形成装置
WO2020079744A1 (fr) * 2018-10-16 2020-04-23 株式会社Ｆｕｊｉ Procédé de formation de circuit
EP4117397A4 (fr) * 2020-03-02 2023-05-10 Fuji Corporation Procédé de formation de câblage
WO2024257216A1 (fr) * 2023-06-13 2024-12-19 株式会社Fuji Procédé de formation de circuit et appareil de formation de circuit

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JP2018157014A (ja) * 2017-03-16 2018-10-04 株式会社Ｆｕｊｉ 回路形成装置
WO2020079744A1 (fr) * 2018-10-16 2020-04-23 株式会社Ｆｕｊｉ Procédé de formation de circuit
JPWO2020079744A1 (ja) * 2018-10-16 2021-03-18 株式会社Ｆｕｊｉ 回路形成方法
CN112868273A (zh) * 2018-10-16 2021-05-28 株式会社富士 电路形成方法
JP7083039B2 (ja) 2018-10-16 2022-06-09 株式会社Fuji 回路形成方法
CN112868273B (zh) * 2018-10-16 2023-08-29 株式会社富士 电路形成方法
EP4117397A4 (fr) * 2020-03-02 2023-05-10 Fuji Corporation Procédé de formation de câblage
US12096570B2 (en) 2020-03-02 2024-09-17 Fuji Corporation Wiring formation method
WO2024257216A1 (fr) * 2023-06-13 2024-12-19 株式会社Fuji Procédé de formation de circuit et appareil de formation de circuit

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