WO2016187992A1 - Heat dissipation device - Google Patents

Abstract

A heat dissipation device comprises a component (1), a PCB board (5), a heat transfer module (2) and a liner board (3) configured to protect the PCB board (5). The component (1) is fixed on a front side of the PCB board (5), and the liner board (3) is connected to a back side of the PCB board (5). One end of the heat transfer module (2) is connected to the component (1), and the other end thereof is connected to the liner board (3) to form a heat conductive path configured to conduct the heat of the component (1) to the liner board (3). The present invention addresses the current technical problem of difficulty in heat dissipation of certain components of a service module.

Description

Heat sink Technical field

The utility model relates to the technical field of heat dissipation of communication devices, in particular to a heat dissipation device.

Background technique

Thermal design is one of the key technologies to ensure product reliability and improve product life. Its status has become increasingly prominent in the field of communication products, and has become a key technical indicator for measuring product performance.

With the rapid development of communication products, the performance requirements of components supporting the product business capability are increased, the device volume is increased, and the heat flux density is getting higher and higher; the device density of the service module is increased, the heat dissipation space is getting smaller and smaller, and the wind resistance is increased; The system and business modules are difficult to dissipate heat, and the problem of heat dissipation of local components is prominent, especially the heat dissipation of local high-heat-consumption components and heat-sensitive components becomes a bottleneck problem.

It can be seen that due to the large wind resistance and high heat consumption of the current business module, the local components of the service module may have technical problems of heat dissipation.

Utility model content

The main technical problem to be solved by the utility model is to provide a heat dissipating device, which can solve the technical problem that the local components of the current business module are difficult to dissipate heat.

In order to solve the above technical problem, the present invention provides a heat dissipating device, comprising: a component, a PCB board (printed circuit board), a heat transfer module, and a lining plate disposed to protect the PCB board;

The component is fixed on a front surface of the PCB board, and the backing board is connected to a back surface of the PCB board; one end of the heat transfer module is connected to the component, and the other end is connected with the backing plate to form a The heat of the component is conducted to a thermally conductive path of the liner.

Optionally, the heat transfer module includes: a heat dissipation substrate disposed to derive heat of the component; and a heat transfer member disposed to conduct heat on the heat dissipation substrate to the liner;

The heat dissipating substrate is fixed on an upper surface of the component, the heat transfer member is connected to the heat dissipating substrate at one end, and the other end is connected to the lining plate, and the heat dissipating substrate and the heat transfer member are formed to be disposed The heat of the component is conducted to a thermally conductive path of the liner.

Optionally, one end of the heat transfer member is connected to the heat dissipation substrate, and the other end is connected to the liner through the PCB board.

Optionally, the heat transfer member includes: at least one heat pipe disposed to conduct heat on the heat dissipation substrate to the backing plate; and the PCB board is provided with at least one hole corresponding to the heat pipe; One end of the heat pipe is connected to the heat dissipation substrate The other end is connected to the backing plate through a corresponding hole on the PCB board.

Optionally, the heat dissipation substrate is provided with a hole corresponding to the heat pipe; one end of the heat pipe is inserted into a corresponding hole in the heat dissipation substrate, and the other end passes through a corresponding hole on the PCB board. Connected to the liner.

Optionally, the heat pipe is formed by sequentially connecting a first straight pipe, a curved pipe and a second straight pipe; at least a part of the first straight pipe is inserted in a corresponding hole in the heat dissipation substrate, the second At least a portion of the straight tube contacts the liner through a corresponding aperture in the PCB.

Optionally, the heat transfer member includes: a heat conductor disposed to conduct heat on the heat dissipation substrate; and at least one first heat pipe disposed to conduct heat on the heat conductor to the liner; the PCB board Providing at least one hole corresponding to the first heat pipe;

The heat conductor is in contact with the heat dissipation substrate;

One end of the first heat pipe is connected to the heat conductor, and the other end is connected to the liner through a corresponding hole on the PCB board.

Optionally, the heat conductor is provided with at least one hole corresponding to the first heat pipe;

One end of the first heat pipe is inserted into a corresponding hole in the heat conductor, and the other end is connected to the liner through a corresponding hole on the PCB.

Optionally, the first heat pipe is formed by sequentially connecting a first straight pipe, an arc pipe, and a second straight pipe;

At least a portion of the first straight tube is inserted into a corresponding hole in the heat conductor, and at least a portion of the second straight tube contacts the liner through a corresponding hole in the PCB.

Optionally, the heat transfer member further includes: at least one second heat pipe; the heat dissipation substrate is provided with at least one hole corresponding to the second heat pipe; and the second heat pipe is inserted in the heat dissipation substrate In the hole in the slot.

Optionally, the heat dissipation substrate extends a certain distance from a flush surface of the component, and the heat conductor is in contact with an extension of the heat dissipation substrate.

Optionally, the heat transfer module includes: a heat conducting member disposed to be thermally conductive; the heat transfer member is located between the PCB board and the backing plate, and one end of the heat conducting member passes through the PCB board and the The component is connected and the other end is connected to the backing plate; the heat conducting member forms a heat conduction path with the PCB board to conduct heat of the component to the backing plate.

Optionally, the heat conducting member is connected at one end to a back surface region corresponding to the component fixing region on the back surface of the PCB board, and the other end is connected to a region corresponding to the component fixing region on the backing plate.

Optionally, the upper surface of the component is further provided with a heat dissipation structure.

Optionally, the upper surface of the heat dissipation substrate is further provided with a heat dissipation structure.

Optionally, the heat dissipation structure comprises: a toothed structure; or a heat dissipation plate having a tooth structure on the upper surface, and a lower surface of the heat dissipation plate is connected to an upper surface of the heat dissipation substrate.

Optionally, the heat sink further includes: a panel; the PCB board is fixed on the panel.

Optionally, the panel comprises: a first bending panel and a second bending panel; the PCB board is fixed on the second bending panel.

Optionally, the liner is an extension panel of the second bending panel.

The beneficial effects of the utility model are:

The utility model provides a heat dissipating device, comprising: a component, a PCB board, a heat transfer module and a lining plate arranged to protect the PCB board; the component is fixed on the front side of the PCB board, the lining board and the lining The back side of the PCB board is connected; the heat transfer module is connected at one end to the component, and the other end is connected to the lining plate to form a heat conduction path arranged to conduct heat of the component to the lining plate; The heat dissipation device of the utility model can form a heat conduction path to conduct heat of the component to the lining plate, and use the heat dissipation area of the lining plate and the surrounding temperature field and the velocity field to dissipate heat; since the utility model transfers heat to the lining plate for heat dissipation, The module has a large wind resistance and high heat consumption, and can effectively dissipate heat for local components. The heat sink of the present invention can save space and improve the heat dissipation efficiency of components, and in communication equipment and electronics. On the product, it has a good application.

DRAWINGS

The drawings are intended to provide a further understanding of the present invention, and are intended to be a part of the present invention, and the description of the present invention is intended to be illustrative of the invention and is not intended to limit the invention. In the drawing:

1 is a schematic structural view of a heat dissipation device according to Embodiment 2 of the present invention;

2 is a schematic structural view of the heat dissipating device shown in FIG. 1 hiding a PCB and components;

3 is a schematic view showing the disassembly of the conduction module in the heat dissipation device shown in FIG. 1;

Figure 4 is a side view of the heat sink shown in Figure 1;

FIG. 5 is a schematic structural view of a heat dissipation device according to Embodiment 3 of the present invention; FIG.

6 is a schematic structural view of the heat dissipation device shown in FIG. 5 hiding the PCB and components;

7 is a schematic exploded view of a conduction module in the heat dissipation device shown in FIG. 5;

Figure 8 is a side view of the heat sink shown in Figure 5;

9 is a schematic structural view of a heat dissipation device according to Embodiment 4 of the present invention;

Figure 10 is a side elevational view of the heat sink of Figure 9.

detailed description

The present invention will be further described in detail below with reference to the accompanying drawings.

Embodiment 1:

In view of the technical problem that the local components of the service module are difficult to dissipate heat, the embodiment provides a heat dissipation device, including: a component, a PCB board, a heat transfer module, and a liner disposed to protect the PCB board;

The components are fixed on the front side of the PCB, and the lining is connected to the back side of the PCB; the heat transfer module is connected to the components at one end and the lining at the other end to form a heat conduction path for conducting heat of the components to the lining.

In practical applications, the service module needs a plurality of component combinations with a certain heat consumption to meet the business function requirements; therefore, the components in this embodiment may be a component of the business module, and the component implements a certain service. Function, with a certain heat consumption.

In this embodiment, the PCB board is an attachment body of components, and a signal line, a circuit, and the like are disposed therein, and different components are combined to realize a business function of the module. In this embodiment, the components can be fixed on the front surface of the PCB by means of pads, pins, rails or sockets.

In this embodiment, the lining plate can be fixed on the back surface of the PCB board, for example, by screws or the like to be fixed to the back surface of the PCB board, for protecting the back surface of the PCB board and functioning as an electromagnetic shielding.

In this embodiment, the heat transfer module is mainly used to form a heat conduction path to conduct heat of the component to the lining.

The heat dissipating device of the embodiment can form a heat conduction path to conduct heat of the component to the lining plate, and use the heat dissipating area of the lining plate and the surrounding temperature field and the velocity field to dissipate heat; since the heat is transmitted to the lining plate for heat dissipation in the embodiment, In the case of large wind resistance and high heat consumption of the module to which the component belongs, the heat dissipation of the local component can also be effectively performed; the heat dissipation device of the embodiment can save space and improve the heat dissipation efficiency of the component, and in the communication device and the electronic device. On the product, it has a good application.

In this embodiment, the heat transfer module is mainly used to form a heat conduction path to conduct heat of the component to the lining plate; specifically, the heat transfer module of the embodiment may include: a heat dissipation substrate and a setting configured to derive heat of the component a heat transfer member for conducting heat on the heat dissipation substrate to the liner;

The heat dissipation substrate is fixed on the upper surface of the component, one end of the heat transfer member is connected to the heat dissipation substrate, and the other end is connected to the lining plate, and the heat dissipation substrate and the heat transfer member are formed to conduct heat to the heat conduction path of the lining.

In this embodiment, a heat dissipating substrate can be disposed on the upper surface of the component to absorb the heat of the component, and then a heat transfer component is respectively connected to the heat dissipating substrate and the lining plate, so that heat transfer can transfer the heat on the heat dissipating substrate to The lining plate performs heat dissipation. In this embodiment, the heat conduction path is composed of a heat dissipation substrate and a heat transfer member. In this embodiment, a heat conductive medium may be filled between the contact surface of the heat dissipation substrate and the component (specifically, between the lower surface of the heat dissipation substrate and the upper surface of the component) to reduce the thermal resistance of the interface contact.

The heat transfer member in this embodiment is all components having a heat conducting function, such as a metal member or the like.

In consideration of space saving, in one embodiment, one end of the heat transfer member is connected to the heat dissipation substrate, and the other end is connected to the liner through the PCB. Specifically, a hole may be formed in the PCB so that the other end of the heat transfer member can pass through the PCB.

In this embodiment, the heat transfer member may be a heat pipe, a heat conductor, or a combination of a heat pipe and a heat conductor, wherein the material having thermal conductivity of the heat conductor can conduct heat, such as a metal block or the like, wherein the heat pipe has strong thermal conductivity.

Preferably, the heat transfer member in the embodiment may include: at least one heat pipe disposed to conduct heat on the heat dissipation substrate to the lining plate; the PCB is provided with at least one hole corresponding to the heat pipe; and one end of the heat pipe is connected to the heat dissipation substrate, The other end is connected to the lining through a corresponding hole in the PCB. One of the holes corresponds to a heat pipe, that is, the number of heat pipes and holes is equal. The number of heat pipes in this embodiment can be set according to actual needs, and may be one or more.

In the embodiment, the heat dissipation substrate is provided with a hole corresponding to the heat pipe; the one end of the heat pipe is inserted into the corresponding hole in the heat dissipation substrate, and the other end passes through the corresponding hole on the PCB board. Connected to the liner. One of the holes corresponds to the same number of heat pipes, heat pipes, holes and holes.

Preferably, in this embodiment, the heat pipe is connected by a first straight pipe, a curved pipe and a second straight pipe; at least a part of the first straight pipe is inserted into a corresponding hole in the heat dissipation substrate, and at least a part of the second straight pipe Contact the liner through the corresponding hole on the PCB. For example, the first straight tube is completely inserted into the corresponding hole in the heat dissipation substrate, and the second straight tube is in contact with the lining plate through the PCB board.

In this embodiment, the heat pipe can be bent on the same plane, and the bending radius is 2-3 times of the diameter of the heat pipe (that is, the bending radius of the curved pipe is 2-3 times of the diameter of the heat pipe), forming a curve, that is, a curved pipe. One end of the heat pipe extends into a first straight pipe and the other end extends into a second straight pipe.

The above describes the case where the heat transfer member only includes the heat pipe. The following describes the case where the heat transfer member is formed by the combination of the heat pipe and the heat conduction. Specifically, the heat transfer member in the embodiment includes: heat conduction that is set to derive heat from the heat dissipation substrate. And a body disposed to transmit heat to the at least one first heat pipe of the heat shield; the PCB board is provided with at least one hole corresponding to the first heat pipe;

The heat conductor is in contact with the heat dissipation substrate;

One end of the first heat pipe is connected to the heat conductor, and the other end is connected to the lining plate through a corresponding hole on the PCB board.

In the embodiment, the heat conductor has a material having thermal conductivity and can conduct heat. In this embodiment, the heat dissipation substrate, the heat conductor and the first heat pipe form a heat conduction path, and are arranged to conduct heat of the component to the liner for heat dissipation. In this embodiment, the number of holes on the PCB is the same as the number of the first heat pipes, and one hole corresponds to one heat pipe, and the number of the first heat pipes can be set according to actual needs.

In the embodiment, the heat conductor is provided with at least one hole corresponding to the first heat pipe, and the first heat pipe has one end inserted in the corresponding hole in the heat conductor and the other end passing through the PCB. The corresponding holes in the plate are connected to the liner. In this embodiment, the interface material can be filled between the contact faces of the heat conductor and the heat dissipation substrate to reduce the interface contact thermal resistance.

Preferably, in the embodiment, the first heat pipe may be connected by a first straight pipe, an arc pipe and a second straight pipe; at least a part of the first straight pipe is inserted into a corresponding hole in the heat conductor, and the second straight At least a portion of the tube contacts the liner through a corresponding aperture in the PCB. For example, the first straight tubes are all inserted in the corresponding holes, and the second straight tubes are all in contact with the lining plate through corresponding holes on the PCB board, wherein at least one portion of the curved tubes can pass through corresponding holes on the PCB board.

In the embodiment, the heat transfer member further includes: at least one second heat pipe; the heat dissipation substrate is provided with at least one hole corresponding to the second heat pipe; and the second heat pipe is inserted in the heat dissipation substrate. In the hole in the slot. The number of holes in the heat dissipation substrate is the same as the number of the second heat pipes, and one hole corresponds to a second heat pipe.

Preferably, in the case where the heat transfer member is formed by the combination of the heat pipe and the heat conduction, the heat dissipation substrate in the embodiment extends a certain distance from the flush surface of the component, and the heat conductor and the heat dissipation substrate are formed in consideration of the fact that the heat dissipation is faster. The extension is in contact.

In the above heat dissipating device, the heat transfer member includes a heat dissipating substrate, and in order to accelerate heat dissipation of the component, the embodiment may further provide a heat dissipating structure on the upper surface of the heat dissipating substrate. Specifically, a tooth-shaped structure may be directly disposed on the upper surface of the heat dissipation substrate, or a heat dissipation plate may be fixed on the upper surface of the heat dissipation substrate, and then a tooth-shaped structure may be disposed on the upper surface of the heat dissipation plate. In this embodiment, the tooth-shaped structure can be formed by die-casting, welding, etc., and the tooth-shaped structure can increase the heat-dissipating area and accelerate heat dissipation.

In practical applications, the general communication device has a uniform panel, and the panel is a support member for the service module to be inserted and removed on the device. Therefore, based on the heat dissipation device, the panel may further include: a panel; the PCB board is fixed on the panel. For example, the PCB board is fixed to the panel by screws.

Preferably, the panel comprises: a first bending panel and a second bending panel; and the PCB board is fixed on the second bending panel.

It should be noted that the lining plate may be an extension panel of the second bending surface of the panel; or may be separated, if the lining plate is separated, the lining plate is fixed on the PCB board. In the embodiment, the lining plate is an extension panel of the second bending panel, in consideration of the fact that the panel heat dissipation can be further used to accelerate the heat dissipation of the component. A portion of the heat on the liner can be transferred to the panel to dissipate.

Compared with the prior art, the heat dissipating device provided by the embodiment fully utilizes the space environment around the service module, and transfers the heat of the component to the structural member such as the lining plate through the heat transfer module, and utilizes the heat dissipating area and the surrounding area of the lining plate. The temperature field and the velocity field are used for heat dissipation, which can reduce the temperature of the component by about 10% to achieve the purpose of optimizing heat dissipation. The heat dissipating device improves the heat dissipation efficiency of components while saving space, and has good application in communication equipment and electronic products.

Embodiment 2:

The heat dissipation device is specifically described on the basis of the first embodiment with reference to the accompanying drawings. The heat dissipation device of the embodiment includes: components, a PCB board, a heat transfer module, a panel, and a liner disposed to protect the PCB board; The device is fixed on the front side of the PCB, the backing plate is connected to the back side of the PCB board, and the PCB board is fixed on the panel; the heat transfer module comprises: a heat dissipating substrate disposed to derive heat of the component and configured to conduct heat to the heat dissipating substrate to a heat transfer member of the lining plate; the heat dissipation substrate is fixed on the upper surface of the component, one end of the heat transfer member is connected to the heat dissipation substrate, and the other end is connected to the lining plate, and the heat dissipation substrate and the heat transfer member are formed to conduct heat of the component to the lining a heat conduction path of the board; wherein the heat transfer member comprises: at least one heat pipe disposed to conduct heat on the heat dissipation substrate to the lining plate; the PCB is provided with at least one hole corresponding to the heat pipe; and the heat dissipation substrate is provided with a heat pipe corresponding to the heat pipe The slot is inserted into the corresponding slot on the heat dissipation substrate, and the other end is connected to the lining through a corresponding hole on the PCB.

According to the above description, as shown in FIGS. 1 and 2, a heat dissipating device for dissipating components arranged as a service module includes: a component 1, a heat transfer module 2, a lining plate 3, a panel 4, and a PCB 5.

The business module needs a combination of components with a certain heat consumption to meet the needs of the business function. In the embodiment, the component 1 represents the component that needs the heat sink to dissipate heat; the component 1 passes through the pad, the lead, the rail or the rail. A socket or the like is fixed on the PCB 5.

The panel 4 is a support member for inserting and removing the service module on the device, and includes a first bending surface 41 and a second bending surface 42.

The PCB 5 includes a hole 50. The number of holes is set according to actual needs, and the PCB 5 is fixed to the bent surface 42 of the panel 4 by screws.

The lining plate 3 is fixed by the screw and the PCB 5 to protect the back surface of the PCB and has an electromagnetic shielding effect; the lining plate 3 can be an extended surface of the bent surface 42 of the panel 4, and the two are integrated structures to enhance the strength of the service module, and the heat can be The heat is radiated to the panel 4 through the lining 3; the panel 4, the PCB 5 and the lining 3 are fixed together to form a space structure of the service module.

Referring to FIGS. 3 and 4 , the heat transfer module 2 may include a heat dissipation substrate 20 and a heat pipe 21 .

The heat dissipation substrate 20 is made of a material having thermal conductivity, and includes a lower surface 200, an upper surface 201, and a hole 202. The number of the holes 202 is set according to actual needs.

The heat pipe 21 is bent on the same plane, and the bending radius is 2-3 times of the diameter of the heat pipe, forming a curved section 210, one end extends into the first straight pipe 211, and the other end extends into the second straight pipe 212, and the number of the heat pipes 21 is determined according to Actually need to be set.

The first straight tube 211 is assembled with the hole 202 by soldering or the like to form the heat transfer module 2.

The heat dissipation substrate 20 of the heat transfer module 2 is fixed to the component 1 by screwing or the like, and the lower surface 200 is in contact with the surface of the component 1 to be filled with a heat conductive medium to reduce thermal resistance of the interface contact; The surface 201 can be fixed to the heat dissipation plate 203 by screwing, gluing, etc., and then the tooth piece 204 is formed on the heat dissipation plate 203 by die casting, welding, etc., thereby increasing the heat dissipation area and enhancing heat dissipation. In another embodiment, the tooth piece 204 may be directly formed on the upper surface of the heat dissipation substrate 20 by die casting, welding, or the like to increase the heat dissipation area and enhance heat dissipation.

The curved section 210 of the heat pipe 21 of the heat transfer module 2 and the second straight pipe 212 pass through the hole 50 of the PCB 5. The second straight pipe 212 is fixedly contacted with the lining plate 3 by welding or screwing to form the component 1 and the lining. The thermal path of the board 3.

The heat of the component 1 is transmitted to the lining plate 3 through the heat transfer module 2, and the heat dissipation area of the lining plate 3 and the temperature field and the velocity field thereof are used for heat dissipation to achieve the purpose of optimizing heat dissipation.

Embodiment 3:

The heat dissipation device is specifically described on the basis of the first embodiment with reference to the accompanying drawings. The heat dissipation device of the embodiment includes: components, a PCB board, a heat transfer module, a panel, and a liner disposed to protect the PCB board; The device is fixed on the front side of the PCB, the backing plate is connected to the back side of the PCB board, and the PCB board is fixed on the panel; the heat transfer module comprises: a heat dissipating substrate disposed to derive heat of the component and configured to conduct heat to the heat dissipating substrate to a heat transfer member of the lining plate; the heat dissipation substrate is fixed on the upper surface of the component, one end of the heat transfer member is connected to the heat dissipation substrate, and the other end is connected to the lining plate, and the heat dissipation substrate and the heat transfer member are formed to conduct heat of the component to the lining a heat conduction path of the board; wherein the heat transfer member comprises: a heat conductor disposed to conduct heat from the heat dissipation substrate; and at least one first heat pipe disposed to conduct heat on the heat conductor to the lining; at least one of the PCB board is provided a hole corresponding to the first heat pipe; the heat conductor is provided with at least one hole corresponding to the first heat pipe; the heat conductor is in contact with the heat dissipation substrate; one end of the first heat pipe is inserted into the corresponding hole in the heat conductor, One end of a corresponding hole through the PCB board and the connector plate.

As shown in FIG. 5-8, the embodiment provides a heat dissipating device configured to dissipate components of the service module, including: a component 1, a heat transfer module 2', a lining plate 3, a panel 4, and a PCB 5'. The heat sink shown in FIG. 5 and FIG. 1 in the second embodiment The heat sink differs in the form of the opening of the PCB 5' and the manner in which the heat transfer module 2' is constructed.

The PCB 5' is provided with a hole 50', and the number is set according to actual needs.

The panel 4 is a support member for inserting and removing the service module on the device, and includes a first bending surface 41 and a second bending surface 42. The lining plate 3 may be an extended surface of the bent surface 42 of the panel 4, and the two are integrated structures to enhance the strength of the service module, and the heat may be transmitted to the panel 4 through the lining plate 3 for heat dissipation; the panel 4, the PCB 5 and the lining plate 3 Fixed together to form the spatial architecture of the business module.

The heat transfer module 2' includes a heat dissipation substrate 20', a first heat pipe 21', a heat conductor 22', and a second heat pipe 23'. The number of the first heat pipe 21' and the second heat pipe 23' is set according to actual needs.

The heat dissipating substrate 20' is a material having thermal conductivity, and includes an upper surface 201', a lower surface 200', and a hole 202'. The shape and the number of the holes 202' are set according to actual needs.

The first heat pipe 21' may have a straight pipe shape, a curved shape, or the like.

The heat conductor 22' is made of a material having thermal conductivity, and includes an upper surface 220' and a hole 221'. The number of the holes 221' is set according to actual needs.

The second heat pipe 23' includes a first straight pipe 230', an arc segment 231', and a second straight pipe 232'.

The first heat pipe 21' is welded in the hole 202' of the heat dissipation substrate 20'.

The first straight pipe 230' of the second heat pipe 23' is welded in the hole 221' of the heat conductor 22'; the second straight pipe 232' is fixedly contacted with the lining plate 3 by welding or screwing.

The heat dissipation substrate 20' is assembled with the component 1 by means of screwing or the like, and the lower surface 200' is in contact with the surface of the component 1, and the heat transfer medium can be filled between the contact faces to reduce the interface contact thermal resistance.

The heat dissipation substrate 20' extends a certain distance from the flush surface of the component 1; the heat conductor 22' passes through the hole 50' of the PCB 5', and the upper surface 220' contacts the lower surface 200' of the extended portion of the heat dissipation substrate 20'. The interface material can be filled between.

The upper surface 201' of the heat dissipation substrate 20' may be fixed to the heat sink 203 by means of screwing, gluing or the like. The tooth piece 204 may be formed by die casting, welding or the like to increase the heat dissipation area and enhance heat dissipation.

In this embodiment, the heat dissipation path composed of the heat dissipation substrate 20', the heat conductor 22', and the second heat pipe 23' is arranged to conduct heat of the component to the backing plate 3. The heat dissipation area of the lining plate 3 and the surrounding temperature field and velocity field are used for heat dissipation to achieve optimized heat dissipation. The heat dissipating device improves the heat dissipation efficiency of components while saving space, and has good application in communication equipment and electronic products.

Embodiment 4:

The embodiment provides a heat dissipating device, comprising: a component, a PCB board, a heat transfer module, and a lining plate disposed to protect the PCB board; the component is fixed on the front side of the PCB board, and the lining board is connected with the back side of the PCB board; One end of the thermal module is connected to the component And connecting the other end to the lining plate to form a heat conduction path disposed to conduct heat of the component to the lining plate; wherein the heat transfer module comprises: a heat conducting member disposed to conduct heat; the heat transfer member is located between the PCB board and the lining plate One end of the heat conducting member is connected to the component through the PCB board, and the other end is connected to the lining plate; the heat conducting member and the PCB board form a heat conduction path arranged to conduct heat of the component to the lining plate.

In this embodiment, by providing a heat conducting member between the PCB board and the lining plate, heat transferred from the component to the PCB board can be transmitted to the lining plate for heat dissipation, and the heat dissipation area of the lining plate and the surrounding temperature field and velocity field are quickly used. Cooling. The heat dissipating device of the embodiment can save the heat of the component while saving space, and has the advantages of simple structure, wide application and the like.

Considering the efficiency of heat dissipation, in one embodiment, the heat conducting member is connected at one end to a region corresponding to the component fixing region on the back surface of the PCB board, and the other end is connected to a region corresponding to the component fixing region on the backing plate.

In order to accelerate the heat dissipation of the component, the embodiment may further be provided with a heat dissipation structure on the upper surface of the component. For example, the teeth can be formed by die casting, welding, etc., and the heat dissipation area can be increased to enhance heat dissipation.

In practical applications, the general communication device has a uniform panel, and the panel is a support member for the service module to be inserted and removed on the device. Therefore, based on the heat dissipation device, the panel may further include: a panel; the PCB board is fixed on the panel. For example, the PCB board is fixed to the panel by screws.

Preferably, the panel comprises: a first bending panel and a second bending panel; and the PCB board is fixed on the second bending panel.

In the embodiment, the lining plate is an extension panel of the second bending panel, in consideration of the fact that the panel heat dissipation can be further used to accelerate the heat dissipation of the component. A portion of the heat on the liner can be transferred to the panel to dissipate.

The heat dissipating device of the present embodiment will be described below with reference to the accompanying drawings. As shown in FIGS. 9 and 10, the heat dissipating device includes: a component 1, a metal block 7, a lining plate 3, a panel 4, and a PCB 5 〞.

PCB5〞 is a conventional printed circuit board with components 1.

The heat dissipation structure 6 is fixed to the component 1 by means of screw fixing or gluing to enhance heat dissipation.

The position of the PCB5〞 corresponding to the component 1 usually has vias, pads, pins, etc. to transfer the heat of the component 1 to the Bottom surface of the PCB; the metal block 7 is fixed at the position of the component 1 of the lining plate 3 ( Or stamped into a boss), a distance of 2mm-3mm is left between the metal block 7 and the Bottom surface device, and the heat conductive medium 8 is filled in the safety distance.

The heat of the component 1 is conducted to the backing plate 3 through the PCB 5 〞, the heat conducting medium 8 and the metal block 7 for heat dissipation optimization.

The panel 4 is a support member for inserting and removing the service module on the device, and includes a first bending surface 41 and a second bending surface 42. The lining 3 can be an extended surface of the bent surface 42 of the panel 4, and the two are integrated structures to enhance the strength of the service module, and heat can be transmitted to the panel 4 through the lining 3 for heat dissipation; the panel 4, the PCB 5 and the lining 3 fixed together to form the spatial architecture of the business module.

The number of metal blocks 7 described above can be set according to actual needs, for example, one or more metal blocks 7 are disposed between the lining plate 3 and the PCB PCB 5 〞.

The heat dissipating device of the embodiment uses the heat conductive material to conduct the heat of the component to the lining plate; the thermal characteristics of the lining plate and The temperature field and the velocity field are used for heat dissipation to achieve optimized heat dissipation.

The above is a further detailed description of the present invention in conjunction with the specific embodiments, and the specific implementation of the present invention is not limited to the description. For those skilled in the art to which the present invention pertains, a number of simple deductions or substitutions may be made without departing from the spirit and scope of the invention.

Industrial applicability

As described above, the heat dissipation device provided by the above embodiments and the preferred embodiments can form a heat conduction path to conduct heat of the component to the lining plate, and use the heat dissipation area of the lining plate and the surrounding temperature field and velocity field to dissipate heat; The utility model transmits heat to the lining plate for heat dissipation, so that the heat resistance of the module to which the component belongs can be effectively cooled for the local component; the heat dissipation device of the utility model can save space while Improve the heat dissipation efficiency of components, and have better applications in communication equipment and electronic products.

Claims (19)

A heat dissipation device includes: a component, a PCB board, a heat transfer module, and a liner disposed to protect the PCB board; The component is fixed on a front surface of the PCB board, and the backing board is connected to a back surface of the PCB board; one end of the heat transfer module is connected to the component, and the other end is connected with the backing plate to form a The heat of the component is conducted to a thermally conductive path of the liner. The heat dissipation device according to claim 1, wherein the heat transfer module comprises: a heat dissipation substrate disposed to derive heat of the component and a heat dissipation substrate disposed to conduct heat to the liner Heat transfer member The heat dissipating substrate is fixed on an upper surface of the component, the heat transfer member is connected to the heat dissipating substrate at one end, and the other end is connected to the lining plate, and the heat dissipating substrate and the heat transfer member are formed to be disposed The heat of the component is conducted to a thermally conductive path of the liner. The heat sink according to claim 2, wherein one end of the heat transfer member is connected to the heat dissipation substrate, and the other end is connected to the backing plate through the PCB. The heat sink according to claim 3, wherein said heat transfer member comprises: at least one heat pipe disposed to conduct heat on said heat dissipation substrate to said liner; said PCB board being provided with at least one a hole corresponding to the heat pipe; one end of the heat pipe is connected to the heat dissipation substrate, and the other end is connected to the liner through a corresponding hole on the PCB board. The heat dissipation device of claim 4, wherein the heat dissipation substrate is provided with a hole corresponding to the heat pipe; one end of the heat pipe is inserted in a corresponding hole in the heat dissipation substrate, and the other end passes through A corresponding hole on the PCB board is connected to the backing plate. The heat dissipation device according to claim 5, wherein the heat pipe is formed by sequentially connecting a first straight pipe, a curved pipe and a second straight pipe; at least a part of the first straight pipe is inserted on the heat dissipation substrate. In the slot, at least a portion of the second straight tube contacts the backing plate through a corresponding hole in the PCB board. The heat sink according to claim 3, wherein said heat transfer member comprises: a heat conductor disposed to conduct heat from said heat dissipation substrate; and at least one disposed to conduct heat on said heat conductor to said liner a heat pipe; the PCB board is provided with at least one hole corresponding to the first heat pipe; The heat conductor is in contact with the heat dissipation substrate; One end of the first heat pipe is connected to the heat conductor, and the other end is connected to the liner through a corresponding hole on the PCB board. The heat sink according to claim 7, wherein the heat conductor is provided with at least one hole corresponding to the first heat pipe; One end of the first heat pipe is inserted into a corresponding hole in the heat conductor, and the other end is connected to the liner through a corresponding hole on the PCB. The heat sink according to claim 8, wherein said first heat pipe is constituted by a first straight pipe, a curved pipe and a second straight pipe Secondary connection At least a portion of the first straight tube is inserted into a corresponding hole in the heat conductor, and at least a portion of the second straight tube contacts the liner through a corresponding hole in the PCB. The heat sink according to claim 7, wherein the heat transfer member further comprises: at least one second heat pipe; the heat dissipation substrate is provided with at least one hole corresponding to the second heat pipe; The heat pipe is inserted in a hole in the heat dissipation substrate. The heat dissipation device according to claim 7, wherein the heat dissipation substrate extends a certain distance from a flush surface of the component, and the heat conductor contacts the extension portion of the heat dissipation substrate. The heat dissipation device according to claim 1, wherein the heat transfer module comprises: a heat conducting member disposed to conduct heat; the heat transfer member is located between the PCB board and the backing plate, and one end of the heat conducting member Connecting to the component through the PCB board and connecting the other end to the backing plate; the heat conducting member and the PCB board together form a heat conduction path arranged to conduct heat of the component to the backing plate . The heat dissipation device according to claim 12, wherein one end of the heat conducting member is connected to a back surface region corresponding to the component fixing region on the back surface of the PCB board, and the other end is connected to the backing plate and the component The area corresponding to the fixed area. The heat sink according to claim 12, wherein the upper surface of the component is further provided with a heat dissipation structure. The heat dissipation device according to any one of claims 2 to 11, wherein the upper surface of the heat dissipation substrate is further provided with a heat dissipation structure. The heat dissipation device according to claim 14, wherein the heat dissipation structure comprises: a toothed structure; or a heat dissipation plate having a tooth structure on the upper surface, and a lower surface of the heat dissipation plate is connected to an upper surface of the heat dissipation substrate . The heat sink according to any one of claims 1 to 14, further comprising: a panel; the PCB board being fixed on the panel. The heat sink according to claim 17, wherein the panel comprises: a first bent panel and a second bent panel; and the PCB board is fixed on the second bent panel. The heat sink according to claim 18, wherein the backing plate is an extension panel of the second bent panel.

Images