[go: up one dir, main page]

WO2016185698A1 - Dispositif d'imagerie infrarouge - Google Patents

Dispositif d'imagerie infrarouge Download PDF

Info

Publication number
WO2016185698A1
WO2016185698A1 PCT/JP2016/002351 JP2016002351W WO2016185698A1 WO 2016185698 A1 WO2016185698 A1 WO 2016185698A1 JP 2016002351 W JP2016002351 W JP 2016002351W WO 2016185698 A1 WO2016185698 A1 WO 2016185698A1
Authority
WO
WIPO (PCT)
Prior art keywords
infrared
imaging device
pixel
value
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2016/002351
Other languages
English (en)
Japanese (ja)
Inventor
小林　誠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of WO2016185698A1 publication Critical patent/WO2016185698A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/20—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from infrared radiation only
    • H04N23/23—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from infrared radiation only from thermal infrared radiation
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/70—Circuitry for compensating brightness variation in the scene
    • H04N23/76—Circuitry for compensating brightness variation in the scene by influencing the image signals
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F99/00—Subject matter not provided for in other groups of this subclass

Definitions

  • the present invention relates to an imaging device that captures an infrared image, and more particularly to an infrared imaging device that corrects fluctuations in the value of a pixel signal output from an infrared sensor.
  • An infrared imaging device that captures an infrared image by detecting infrared rays emitted from a subject such as an object or a person with an infrared sensor is known. It is generally known that a subject whose temperature is higher than absolute zero emits infrared light, and that the higher the temperature of the subject, the more infrared light with a shorter wavelength, and the lower the temperature of the subject, the less infrared light with a longer wavelength. When a subject is imaged by an infrared imaging device, the captured image is displayed white at a high temperature and black at a low temperature. However, when a temperature change occurs in the vicinity of the infrared imaging device or the like, the detection signal detected by the infrared sensor changes due to the temperature change, and noise is generated in the captured subject image.
  • Patent Document 1 among detection regions in which pixels that are thermal infrared imaging elements are two-dimensionally arranged, pixels in a region where infrared rays are incident are effective pixels, and pixels in a region where infrared rays are not incident are reference pixels.
  • An infrared imaging device is disclosed in which, when a temperature rise occurs in a region where a reference pixel is located, the fluctuation of the detection signal of the infrared sensor due to the temperature rise is suppressed by reducing the bias current flowing to the effective pixel. ing.
  • Patent Document 1 a ridge that covers the periphery of the detection region, that is, an infrared shielding body is provided inside the infrared sensor, and the infrared shielding body shields infrared light incident on the infrared sensor, thereby generating a region where no infrared light is incident. I am letting.
  • infrared rays emitted from a subject and infrared rays emitted from an infrared imaging device main body are incident on the infrared sensor.
  • the temperature of the infrared imaging device main body rises, the amount of infrared rays emitted from the infrared imaging device main body increases, so that the entire captured image becomes whitish.
  • the captured infrared image is generally whitish on the right side. Therefore, it is desired to perform correction for offsetting fluctuations of infrared rays radiated from the infrared imaging device main body from pixel signals output from the infrared sensor.
  • FIG. 22 is a diagram illustrating an example of the difference in the amount of infrared depending on the presence or absence of the infrared shielding body 99 in the infrared sensor.
  • an effective area where infrared rays from a subject are incident is indicated by A
  • a reference area where infrared rays from a subject are not incident is indicated by B, among detection areas of the infrared sensor.
  • the infrared shield 99 is not provided, as shown in the left diagram of FIG. 22, the infrared rays radiated from the imaging device main body 12 are added to the infrared rays radiated from the subject (indicated by a solid line in the figure). As indicated by the dotted line in the figure, the amount of infrared radiation in the entire detection area of the infrared sensor 3 increases, so that the increased infrared radiation can be easily offset-corrected.
  • the temperature of the infrared shielding body 99 does not increase immediately even if the temperature of the imaging apparatus body 12 rises.
  • Infrared rays radiated from the infrared shielding body 99 having a lower temperature are added, and as shown in the right diagram of FIG. 22, the amount of infrared radiation that increases between the effective region A and the reference region B is different. It becomes difficult to accurately perform offset correction.
  • the present invention has been made in view of such a problem, and an infrared imaging device main body that enters an effective region and a reference region, respectively, when an effective region where infrared rays are incident and a reference region where no infrared rays are incident are formed by an infrared shield.
  • the difference in the amount of infrared radiation from the infrared shielding body can be reduced, and the value that contributes to the infrared radiation emitted from the infrared imaging device main body and the infrared shielding body can be accurately corrected from the pixel signal output by the infrared sensor.
  • An object of the present invention is to provide an infrared imaging device.
  • An infrared imaging device of the present invention includes an imaging optical system that forms an infrared image, It has a detection region located on the imaging surface of the imaging optical system and in which a plurality of pixels that are thermoelectric conversion elements are arranged, and outputs a pixel signal based on infrared rays incident from the imaging optical system for each pixel.
  • An infrared sensor By shielding a part of infrared rays between the imaging optical system and the imaging plane, the infrared region from the imaging optical system does not enter the effective region where the infrared rays from the imaging optical system enter the detection region.
  • a reference region, and an infrared shielding body thermally coupled to the infrared imaging device main body.
  • infrared rays includes all of near infrared rays, middle infrared rays, and far infrared rays.
  • the “effective region where infrared rays from the imaging optical system are incident” means a region where infrared rays incident from the imaging optical system reach in the detection region, and the connection between the detection region and the imaging optical system. It means an area where image areas overlap.
  • the “reference region where the infrared rays from the imaging optical system are not incident” means a region where the infrared rays incident from the imaging optical system do not reach in the detection region, and means a region where the detection region and the imaging region do not overlap.
  • the “reference area” means an area that is not an effective area among the detection areas.
  • thermalally coupled means that thermal energy is movably coupled in a direction in which there is no temperature difference between the infrared imaging device main body and the infrared shielding body.
  • the infrared shielding body may be formed of a shielding plate extending from the infrared imaging device main body toward the inside of the infrared imaging device main body.
  • the infrared shielding body includes a plate-like member having an opening, and a support member that supports the plate-like member by thermally coupling the plate-like member and the infrared imaging device main body. Good.
  • the infrared imaging device of the present invention includes a signal correction unit that performs correction processing on the value of the pixel signal output from the infrared sensor,
  • the signal correction unit corrects the value of the pixel signal of the effective pixel that is the pixel in the effective area by using the value of the pixel signal of the reference pixel that is the pixel in the reference area, thereby correcting the value of the pixel signal due to the temperature change. It is preferable to correct the variation.
  • the signal correction unit may perform offset correction by subtracting the average value of the pixel signal value of the reference pixel from the value of the pixel signal of the effective pixel.
  • the infrared imaging device of the present invention is provided with two or more reference regions in the detection region,
  • the signal correction unit performs offset correction by subtracting the average value of the pixel signals of the reference pixels in at least one reference region of the two or more reference regions from the value of the pixel signal of the effective pixel. Also good.
  • the infrared imaging device of the present invention is provided with two or more reference regions in the detection region,
  • the signal correction unit calculates the average value of the pixel signals of the reference pixels in at least two reference areas among the two or more reference areas, and uses the calculated at least two average values to obtain the pixel signal of the effective pixel Shading correction may be performed on the value of.
  • shading correction refers to non-uniformity of incident infrared rays generated on the imaging surface of a two-dimensional infrared detection element such as a reduction in the amount of infrared rays at the periphery of an image circle caused by the imaging optical system, or a circuit board Means a correction for reducing non-uniformity of infrared rays caused by non-uniformity of infrared rays generated from the circuit board and non-uniformity of external heat from the lens, the main body of the infrared imaging device, and the like.
  • the reference area may be provided at the upper and lower ends of the detection area.
  • the reference area may be provided at the left and right ends of the detection area.
  • the infrared imaging device of the present invention is provided with a frame-shaped reference region in which a plurality of reference pixels are arranged at an edge in a detection region, and the frame-shaped reference region is divided into a plurality of regions.
  • the signal correction unit calculates the average value of the pixel signal values of the reference pixels located in the plurality of regions for each of the plurality of regions, and uses the calculated average value to calculate the pixel signal value of the effective pixel. On the other hand, shading correction may be performed.
  • the infrared imaging device of the present invention is provided with at least one temperature sensor in the infrared imaging device body,
  • the signal correction unit may perform offset correction by calculating a value corresponding to the value of the output signal from the temperature sensor to the value of the pixel signal of the effective pixel.
  • the “value according to the value of the output signal from the temperature sensor” is a value set in advance for each type of infrared imaging device.
  • a table corresponding to the value of the output signal is created in advance, and a value based on this table can be used.
  • the temperature sensor can be provided inside the infrared imaging device body.
  • the temperature sensor can be provided on the infrared shielding body.
  • the infrared imaging device of the present invention it is preferable to provide a temperature sensor at a position facing the imaging optical system.
  • the difference in the amount of infrared radiation from the infrared imaging device main body and the infrared shielding body incident on the effective area and the reference area can be reduced, so that the difference in the correction amount to be offset between the effective area and the reference area is small. It becomes small and can correct
  • FIG. 1 is a schematic cross-sectional view illustrating a configuration of an infrared imaging device according to an embodiment of the present invention.
  • 1 is a schematic block diagram illustrating a configuration of an infrared imaging device according to an embodiment of the present invention.
  • the figure which shows an example of the infrared shielding body which shields infrared rays (the 1)
  • the figure which shows an example of the infrared shielding body which shields infrared rays the 2)
  • the figure which shows an example of the infrared shielding body which shields infrared rays (the 3) Flowchart of a series of processes of the infrared imaging device of the present embodiment Flowchart of the first correction process of the signal correction unit Flowchart of second correction process of signal correction unit
  • the figure explaining the correction method when a reference field is frame shape
  • the figure explaining the calculation method of the correction value of the shading correction when a reference area is frame shape
  • FIG. 1 is a diagram showing an example of an infrared shielding method by masking the back of a lens (part 1).
  • Figure 2 shows an example of infrared shielding method by masking the back of the lens FIG.
  • FIG. 3 is a diagram showing an example of an infrared shielding method by masking the back of the lens (part 3).
  • FIG. 1 is a schematic cross-sectional view illustrating the configuration of an infrared imaging device according to an embodiment of the present invention
  • FIG. 2 is a schematic block diagram illustrating the configuration of an infrared imaging device 1 according to an embodiment of the present invention.
  • the infrared imaging device 1 according to the present embodiment is installed in an infrared imaging device main body 12 including a first main body portion 10 and a second main body portion 11, and the first main body portion 10.
  • An imaging optical system 2 capable of imaging infrared rays emitted from a subject on the imaging plane 30 and a second main body 11, located on the imaging plane 30 of the imaging optical system 2,
  • An infrared sensor 3 having a detection region 31 in which a plurality of pixels as conversion elements are arranged and outputting pixel signals based on infrared rays incident from the imaging optical system 2 is provided for each pixel.
  • the infrared imaging device body 12 is made of a metal material such as aluminum or stainless steel or a resin material such as plastic, but is preferably formed of a material having a higher thermal conductivity than aluminum or stainless steel.
  • the imaging device body 12 is made of copper. The internal structure of the infrared imaging device body 12 will be described later in detail.
  • the imaging optical system 2 is a lens group composed of one or more lenses.
  • the lenses are held by a holding frame, and the holding frame is fixed to the first main body 10.
  • the imaging optical system 2 is described as a fixed focus optical system, but the present invention is not limited to this, and may be a variable focus optical system.
  • the infrared sensor 3 is installed so that the region C of the detection region 31 is located in the imaging region of the imaging optical system 2, that is, the region D of the image circle.
  • the object image that is driven by the unit and imaged on the detection area 31 is captured as an infrared image, converted into a pixel signal, and output.
  • the infrared sensor 3 outputs a pixel signal by sequentially transferring charges accumulated in each pixel and converting them into an electrical signal.
  • the infrared shielding body 9 is provided.
  • the infrared shield 9 is thermally coupled to the infrared imaging device body 12 and after a certain time has elapsed, the maximum temperature difference between the infrared shielding body 9 and the infrared imaging device body 12 is within ⁇ 1 degree.
  • the shield plate extends from the inner wall surface of the infrared imaging device main body 12 toward the optical axis 0.
  • the infrared shielding body 9 is made of copper.
  • the infrared shielding body 9 is made of copper.
  • the material for forming the infrared shielding body 9 is the size of the infrared imaging device main body 12 and the like.
  • the infrared shielding body 9 is preferably formed of, for example, a material having a thermal conductivity of aluminum or higher, that is, a material having a thermal conductivity of 236 W / mk or higher.
  • the infrared imaging device main body 12 and the infrared shielding body 9 are integrally coupled so that thermal energy can move in a direction in which there is no temperature difference. That is, when the temperature around the infrared imaging device body 12 rises and the temperature of the infrared imaging device body 12 rises, the temperature of the infrared shielding body 9 is reduced so that there is no temperature difference between the infrared imaging device body 12 and the infrared shielding body 9. The temperature will also rise.
  • the infrared shielding body 9 shields a part of infrared rays incident from the imaging optical system 2 and forms a reference region B that is a region where infrared rays are not incident in the region C of the detection region 31.
  • a reference region B is defined as a reference region B.
  • FIGS. 3 to 4 show examples of the infrared shielding body 9 that shields infrared rays.
  • 3 to 4 are schematic diagrams for explaining the shielding of infrared rays by the infrared shielding body 9, and the size of each part is different from the actual one.
  • the infrared shielding body 9 is constituted by a shielding plate extending from the upper wall inner surface and the lower wall inner surface of the infrared imaging device main body 12 toward the optical axis 0, as shown in the upper diagram of FIG.
  • the infrared rays incident from the imaging optical system 2 are shielded at the upper and lower end portions of the region C, and the reference region B1 is provided at each of the upper and lower end portions of the region C of the detection region 31 as shown in the lower diagram of FIG. , B2, and an effective area A is formed between the areas excluding the reference areas B1, B2, that is, the reference areas B1, B2.
  • the infrared shielding body 9 is constituted by a shielding plate extending from the left wall inner surface and the right wall inner surface of the infrared imaging device main body 12 toward the optical axis 0, as shown in the upper diagram of FIG.
  • Infrared rays incident from the imaging optical system 2 are shielded at the left and right ends of the region C of the area 31, and as shown in the lower diagram of FIG. Regions B3 and B4 are formed, and an effective region A is formed between the regions other than the reference regions B3 and B4, that is, between the reference regions B3 and B4.
  • the infrared shielding body 9 is constituted by a shielding plate extending toward the optical axis 0 from the upper wall inner surface, the lower wall inner surface, the left wall inner surface and the right wall inner surface of the infrared imaging device main body 12, that is, the infrared shielding body 9 is In the case of a plate member having an opening 9c in the center, as shown in the upper diagram of FIG. 5, the upper and lower ends and the left and right ends of the region C of the detection region 31 are separated from the imaging optical system 2. As shown in the lower diagram of FIG. 5, a frame-like reference region B is formed around the region C of the detection region 31 and is surrounded by the region excluding the reference region B, that is, the reference region B. An effective area A is formed in the center area.
  • the effective pixels in the effective area A and the reference pixels in the reference area B are infrared detection elements (infrared detectors) capable of detecting infrared rays (wavelength 0.7 ⁇ m to 1 mm), and particularly far infrared rays (wavelength 8 ⁇ m).
  • Infrared detecting element capable of detecting ( ⁇ 15 ⁇ m).
  • a microbolometer-type or SOI (Silicon-on-Insulator) diode-type infrared detection element can be used as the infrared detection element used as the effective pixel and the reference pixel.
  • the same structure is used not by a method of changing the presence or absence of the detection region 31 for detecting infrared rays or the structure of the detection region 31, but by a method of changing the presence or absence of incidence of infrared rays.
  • the infrared imaging device 1 includes the imaging optical system 2, the infrared sensor 3, an analog signal processing unit 4 that performs various analog signal processing such as amplifying an output signal from the infrared sensor 3, and the like.
  • a / D conversion (Analog-to-Digital conversion) unit 5 for converting the analog image signal processed by the analog signal processing unit 4 into digital image data, and the digital image data converted by the A / D conversion unit 5
  • a digital signal processing unit 6 that performs various signal processing, a storage unit 7 that stores information associated with various digital signal processing, and an output that outputs an infrared image subjected to the digital signal to the storage unit 7 or a display unit (not shown). Part 8.
  • the storage unit 7 stores various types of information used in the digital signal processing unit 6, infrared images subjected to various digital signal processing, and the like as necessary, and a volatile memory such as a DRAM (Dynamic Random Access Memory).
  • a non-volatile memory such as a flash memory is included.
  • the storage unit 7 is provided separately from the digital signal processing unit 6, but the present invention is not limited to this, and the storage unit 7 is provided in the digital signal processing unit 6. Also good.
  • the output unit 8 outputs an infrared image subjected to various digital signal processing to the storage unit 7, a display unit (not shown), or a storage unit outside the apparatus by wireless or wired communication.
  • the digital signal processing unit 6 includes a signal correction unit 61 that performs correction processing on the value of the pixel signal output from the infrared sensor 3. Normally, when the temperature of the infrared imaging device main body 12 or the infrared shielding body 9 rises, the amount of infrared radiation emitted from the infrared imaging device main body 12 or the infrared shielding body 9 increases, so that the entire captured infrared image becomes whitish. End up. Therefore, the signal correction unit 61 of the present embodiment performs a correction to offset the value that contributes to the infrared rays radiated from the infrared imaging device main body 12 and the infrared shielding body 9 from the pixel signal output from the infrared sensor 3. The value of the pixel signal of the reference pixel that is the pixel in B is used to correct the value of the pixel signal of the effective pixel that is the pixel in the effective area A.
  • FIG. 6 shows a flowchart of a series of processes of the infrared imaging apparatus 1 of the present embodiment.
  • the infrared imaging device 1 of the present embodiment first images a subject (S1), and the infrared sensor 3 analogally outputs pixel signals based on infrared rays incident from the imaging optical system 2 for each pixel.
  • the analog signal processing unit 4 performs various analog signal processing such as amplifying the detection signal from the infrared sensor 3, and the A / D conversion unit 5 converts the processed analog image signal into digital image data.
  • the digital signal processing unit 6 performs various signal processing on the digital image data converted by the A / D conversion unit 5, and stores the image data subjected to the various signal processing in the storage unit 7 (S2). ).
  • FIG. 7 is a flowchart of the first correction process of the signal correction unit 61 of this embodiment.
  • B1 1, ..., B1 i indicate the value of the pixel signal of each reference pixel in the reference area B1
  • B2 1, ... B2 j indicate the value of the pixel signal of each reference pixel in the reference area B2.
  • B3 1, ..., B3 i indicate the pixel signal value of each reference pixel in the reference area B3, and B4 1, ... B4 j indicate the value of the pixel signal of each reference pixel in the reference area B4.
  • the average value of the pixel signal values of the reference pixels in the frame-shaped reference area B is calculated. calculate.
  • B 1, ... B i indicate pixel signal values of the respective reference pixels in the reference region B.
  • the signal correction unit 61 subtracts the value of the calculated average value M from each of the pixel signal values of the effective pixels in the effective region A to offset the value of the image signal, as shown in FIG. Correction is performed (S12).
  • the signal correction unit 61 stores the value of the pixel signal subjected to the correction process in the storage unit 7 (S4).
  • the image data stored in the storage unit 7 is appropriately output by the output unit 8 to an external storage unit or a display unit (not shown).
  • the corrected image data may be appropriately subjected to other necessary correction processing by the digital signal processing unit 6 of the infrared imaging device 1.
  • an image is formed in the region C of the detection region 31 by shielding a part of infrared rays between the imaging optical system 2 and the imaging surface 30.
  • the infrared shielding body 9 is provided to provide the effective area A in which infrared rays from the optical system 2 are incident and the reference area B in which infrared rays from the imaging optical system 2 are not incident, the effective area A emits infrared radiation from the subject.
  • the reference area B can capture only infrared radiation from the infrared imaging device main body 12 and the infrared shielding body 9 at the same timing as capturing. Therefore, the average value M calculated above is a value that contributes to infrared radiation from the infrared imaging device main body 12 and the infrared shielding body 9.
  • the temperature of the infrared shield 99 does not rise immediately. Infrared rays emitted from the infrared shielding member 99 having a low temperature are added. Accordingly, the amount of incident infrared rays differs between the effective area A and the reference area B, and the correction amount to be offset differs between the effective area A and the reference area B. Therefore, the pixel signal of the effective pixel in the effective area A In the offset correction in which the average value M is subtracted from each of the values, it is difficult to perform correction with high accuracy.
  • the infrared imaging device main body 12 and the infrared shielding body 9 are thermally coupled, so that the temperature difference between the infrared imaging device main body 12 and the infrared shielding body 9 is reduced.
  • the difference between the amount of infrared rays emitted from the infrared imaging device main body 12 and the amount of radiation emitted from the infrared shielding body 9 can be reduced.
  • the difference in the amount of infrared radiation from the infrared imaging device main body 12 and the infrared shielding body 9 incident on the effective area A and the reference area B can be reduced, so that the effective area A and the reference area B are offset.
  • the difference in power correction amount becomes smaller. Therefore, by performing offset correction that subtracts the value of the average value M from each of the pixel signal values of the effective pixels in the effective area A, the infrared imaging device main body 12 and the infrared shielding body 9 from the pixel signal output from the infrared sensor 3. Thus, it is possible to accurately perform correction for offsetting a value that contributes to infrared rays emitted from.
  • the present invention is not limited to this.
  • the average value of the pixel signal values of the reference pixels only in the reference region B1 at the upper end may be used, or the reference region at the lower end. You may use the average value of the pixel signal value of the reference pixel of only B2.
  • the average value of the pixel signals of the reference pixels only in the reference region B3 at the left end may be used, or the average value of the pixel signals of the reference pixels in the reference region B4 at the right end is used. It may be changed as appropriate.
  • FIG. 8 is a flowchart of the correction process of the second embodiment of the signal correction unit 61 of the present embodiment
  • FIG. 9 is a diagram for explaining a correction method when the reference area is frame-shaped
  • FIG. 11 is a diagram illustrating a method for calculating a correction value for shading correction when the frame is in a frame shape
  • FIG. 11 is a diagram illustrating an example of a correction value for shading correction when the reference region is frame-shaped.
  • the signal correction unit 61 first calculates an average value of pixel signal values of reference pixels that are pixels in the reference region B (S21). As shown in FIG. 3, when the reference area B is provided at the upper and lower ends of the detection area C, the average value M1 and the lower end of the pixel signal values of the reference pixels in the reference area B1 at the upper end An average value M2 of the pixel signal values of the reference pixels in the reference region B2 of the part is calculated. If the number of reference pixels in the reference region B1 at the upper end is i and the number of reference pixels in the reference region B2 at the lower end is j, the average values M1 and M2 can be calculated by the following equations (5) and (6), respectively. .
  • B1 1, ..., B1 i indicate the value of the pixel signal of each reference pixel in the reference area B1
  • B2 1, ... B2 j indicate the value of the pixel signal of each reference pixel in the reference area B2.
  • M4 (B4 1 + B4 2 +,... + B4 j ) / j (8)
  • B3 1, ..., B3 i indicate the pixel signal value of each reference pixel in the reference area B3
  • B4 1, ... B4 j indicate the value of the pixel signal of each reference pixel in the reference area B4.
  • the frame-shaped reference area B is divided into a plurality of reference areas.
  • the upper row and the lower row are each divided into five divided reference regions B11 to B15 and B51 to B55, and the remaining reference regions, that is, divided reference regions B11 to B15, B51 to The left column and the right column, which are reference regions excluding B55, are divided into three divided reference regions B21 to B41 and B25 to B45, respectively, to create a total of 16 divided reference regions B11 to B55.
  • the signal correction unit 61 performs shading correction on the value of the pixel signal of the effective pixel in the effective area A.
  • the average value M2 of the pixel signal values of the reference pixels in the reference region B2 at the lower end are calculated to calculate the shading amount S of each effective pixel in the effective region A, and the calculated shading amount S Shading correction is performed by calculating the value of the pixel signal of the effective pixel in the effective area A (S22).
  • the captured infrared image is generally whitish on the right side. That is, the density of the infrared image captured by the temperature difference around the infrared imaging device body 12 is uneven.
  • the shading amount S in the vertical direction of the image can be acquired in detail, the unevenness in the vertical direction of the infrared image can be accurately corrected.
  • the reference area B is provided at the left and right ends of the detection area C as shown in FIG. 4, it is the same as when the reference area B is provided at the upper and lower ends of the detection area C.
  • linear interpolation is performed using the calculated step difference between the average value M3 of the pixel signal values of the reference pixels in the reference region B3 at the left end portion and the average value M4 of the pixel signal values of the reference pixels in the reference region B4 at the right end portion.
  • the shading correction is performed by calculating the calculated shading amount S to the pixel signal value of the effective pixels in the effective area A.
  • the calculation is performed for each of the 16 divided reference areas B11 to B55 created above.
  • the shading amount S is calculated using the average values M11 to M55 of the pixel signal values of the reference pixels in the divided reference regions B11 to B55.
  • the shading amount S can be calculated using, for example, pixel signal values of surrounding pixels.
  • a method for calculating the shading amount S will be described in detail.
  • the shading amount in the upper left effective pixel Z22 in the effective region A is expressed by the following formula ( 10).
  • the shading amount at the upper right effective pixel Z24 in the effective area A can be calculated by the following equation (11).
  • the effective area A is divided into four areas each divided at the center in the horizontal direction and the vertical direction, and the effective pixel T1 positioned in the upper left area with respect to the center of the effective area A is above the effective pixel T1.
  • the average value M or effective pixel value of the divided reference region B adjacent to the left is added, and the average value M or effective pixel value of the divided reference region B adjacent to the upper left of the effective pixel T1 is added from the added value.
  • the shading amount S at the effective pixel T is calculated.
  • the average value M or the effective pixel value of the divided reference area B adjacent to the lower and left sides of the effective pixel T2 is added.
  • the shading amount S in the effective pixel T2 is calculated by subtracting the average value M or the value of the effective pixel of the divided reference region B adjacent to the lower left of the effective pixel T2 from the added value.
  • the shading amount S in the effective pixel T3 is calculated by subtracting the average value M or the value of the effective pixel in the divided reference region B adjacent to the upper right of the effective pixel T3 from the added value.
  • the average value M or the value of the effective pixel of the divided reference region B adjacent to the lower and right sides of the effective pixel T4 is added. Then, the shading amount S in the effective pixel T4 is calculated by subtracting the average value M or the effective pixel value of the divided reference region B adjacent to the lower left of the effective pixel T4 from the added value.
  • the shading amount is calculated for each effective pixel in the effective region A by calculating the shading amount from the effective pixel farthest from the center of the effective region A.
  • the effective pixel Z23 in FIG. 10 is a pixel located at the center in the horizontal direction of the effective area A.
  • the shading amount may be calculated using the average value Z13 above the effective pixel Z23, the right effective pixel Z24, and the diagonally right average value Z14.
  • the value of the shading amount calculated previously in the surrounding pixels can be used.
  • the pixel located in the center in the vertical direction of the effective area A can be calculated in the same manner. Further, when the effective pixel is located in the center of the effective area A, the value of the shading amount calculated in any of the surrounding pixels may be used or can be selected as appropriate.
  • the signal correcting unit 61 calculates the value of the calculated shading amount for each effective pixel from each of the pixel signal values of the effective pixels in the effective region A, and performs shading correction on the value of the pixel signal.
  • the value of the shading amount calculated for each pixel may include a positive value and a negative value.
  • the absolute value of this shading amount value is added to the value of the pixel signal of the effective pixel in the effective area A.
  • the value of the shading amount is positive, The value of the shading amount is subtracted from the value of the pixel signal of the effective pixel in the effective area A.
  • the shading correction is performed using the average values M11 to M55 of the pixel signal values of the reference pixels in the 16 divided reference regions B11 to B55 provided in a frame shape at the edge of the detection region C.
  • the shading amount S in the vertical direction and the horizontal direction of the infrared image due to the temperature difference around the infrared imaging device main body 12 can be acquired in detail, the unevenness of the entire infrared image can be accurately corrected.
  • the infrared imaging device main body 12 and the infrared shielding body 9 are thermally coupled, so the infrared imaging device main body 12 and the infrared shielding body. 9 can be reduced, and the difference between the amount of infrared radiation emitted from the infrared imaging device main body 12 and the amount of radiation emitted from the infrared shielding body 9 can be reduced.
  • the difference in the amount of infrared radiation from the infrared imaging device main body 12 and the infrared shielding body 9 incident on the effective area A and the reference area B can be reduced, so that the effective area A and the reference area B are offset.
  • the difference in power correction amount becomes smaller.
  • the value of the pixel signal is corrected by calculating the value of the calculated shading amount S for each effective pixel from each of the pixel signal values of the effective pixels in the effective area A, thereby correcting the value of the pixel signal.
  • 3 can be corrected with high accuracy by offsetting the shading amount S that contributes to the infrared rays emitted from the infrared imaging device main body 12 and the infrared shielding body 9 from the pixel signals output by the infrared ray 3.
  • the above-described interpolation method is used to calculate the shading amount S.
  • the present invention is not limited to this, and a known method such as linear interpolation or nonlinear interpolation can be used. .
  • FIG. 12 is a schematic cross-sectional view illustrating the configuration of an infrared imaging device according to the second embodiment of the present invention.
  • the infrared imaging device of the second embodiment has a configuration in which a temperature sensor, which will be described later, is provided in the infrared imaging device 1 of the above-described embodiment, and therefore, the description of the configuration in FIG.
  • a temperature sensor which will be described later
  • a temperature sensor 13 is provided at a position facing the imaging optical system 2 in the infrared shielding body 9.
  • a known one such as a thermistor, a thermocouple, or a resistance temperature detector can be used.
  • the output signal from the temperature sensor 13 is sent to the signal correction unit 61 by wired or wireless communication (not shown).
  • FIG. 13 is a flowchart of the third correction process of the signal correction unit 61.
  • a series of processing of the infrared imaging apparatus of the present embodiment is the same as the processing of the flowchart of FIG. 6 of the above-described embodiment, and thus description thereof is omitted here, and only correction processing by the signal correction unit 61 is described. To do.
  • the same processing as in FIG. 7 is denoted by the same step number, and detailed description thereof is omitted.
  • the signal correction unit 61 calculates an average value M of pixel signal values of reference pixels, which are pixels in the reference region B, in step S11, and in step S12, the valid value in the effective region A. Offset correction is performed by subtracting the average value M from the pixel signal value of each pixel.
  • the signal correction unit 61 detects an output signal from the temperature sensor 13 and calculates a value corresponding to the detected value of the output signal (step S13).
  • FIG. 14 shows a relationship between the value of the output signal from the temperature sensor 13 and the calculated value corresponding to this value.
  • the calculation value corresponding to the value of the output signal from the temperature sensor 13 is set in advance for each type of the infrared imaging device 1, and corresponds to the value of the output signal from the temperature sensor 13, for example, as shown in FIG.
  • a table of calculation values is stored in the storage unit 7. In this table, the amount of infrared rays emitted for each temperature of the infrared shielding body 9 is detected, and a value based on the amount of infrared rays emitted is set as a calculation value.
  • the infrared imaging device 1 in a state where the infrared imaging device 1 is placed in a thermostat and the temperatures of the infrared imaging device 1 and the infrared shield 9 are set to be constant, a reference heat source whose absolute temperature is known by the infrared imaging device 1 is photographed. Then, the value of the pixel signal of the effective pixel is detected. Next, the temperature of the infrared imaging device 1, that is, the infrared shield 9 is changed to detect the value of the output signal from the temperature sensor 13 and the value of the pixel signal of the effective pixel, and the value of the pixel signal of the detected effective pixel. And the value of the pixel signal value of the effective pixel detected above is calculated.
  • the temperature of the infrared shielding body 9 is changed stepwise, and the value of the output signal from the temperature sensor 13 at each temperature and the difference are calculated.
  • the value of the output signal from the temperature sensor 13 output when the temperature of the infrared shielding body 9 is changed is set as the value N of the output signal from the temperature sensor of FIG.
  • the difference value is the calculated value in FIG.
  • the table of FIG. 14 is set in advance at the design stage or manufacturing stage of the infrared imaging device 1.
  • the signal correction unit 61 refers to the table stored in the storage unit 7 to calculate a calculation value corresponding to the value of the output signal from the temperature sensor 13.
  • the signal correction unit 61 calculates a calculation value corresponding to the value of the output signal of the temperature sensor 13 calculated in step S13 to the value after the offset correction in step S12, and further performs offset correction (step) S14).
  • step S14 the infrared image indicated by the value after offset correction is stored in the storage unit 7 in step S12. Is done.
  • the calculated values M1 to M3 when the value of the output signal from the temperature sensor 13 is any of N1 to N3 are positive values
  • the calculated values M1 to M3 are offset in step S12.
  • the value of the pixel signal is further offset-corrected by subtracting from the corrected value. If the value after the calculated value M5 when the value of the output signal from the temperature sensor 13 is any value after N5 is a negative value, the absolute value of the value after the calculated value M5 is obtained in step S12.
  • the value of the pixel signal is further offset corrected by adding to the value after the offset correction.
  • infrared rays emitted from the subject and infrared rays emitted from the infrared imaging device main body 12 and the infrared shielding body 9 are incident on the infrared sensor 3.
  • the infrared imaging device body 12 and the infrared shielding body 9 are thermally coupled, the temperature difference between the infrared imaging device body 12 and the infrared shielding body 9 is small. That is, the difference between the amount of infrared rays emitted from the infrared imaging device main body 12 and the amount of infrared rays emitted from the infrared shielding body 9 is small.
  • the value of the output signal from the temperature sensor 13, that is, the calculated value that is a value based on the amount of infrared rays emitted from the infrared shielding body 9 is based on the amount of infrared rays emitted from the infrared imaging device body 12. It is also a value. Therefore, by calculating the calculation value, which is a value based on the value of the output signal from the temperature sensor 13, to the value of the pixel signal after the offset correction, the infrared shielding body 9 and the infrared imaging among the infrared rays incident on the infrared sensor 3.
  • the value due to the infrared ray radiated from the apparatus main body 12 can be offset, it is possible to obtain a highly accurate image signal value based on the infrared ray radiated from the subject, and to obtain an accuracy based on the absolute temperature of the subject. A high infrared image can be acquired.
  • FIG. 15 is a flowchart of the correction process of the signal correction unit 61 according to the fourth embodiment.
  • a series of processing of the infrared imaging apparatus of the present embodiment is the same as the processing of the flowchart of FIG. 6 of the above-described embodiment, and thus description thereof is omitted here, and only correction processing by the signal correction unit 61 is described. To do.
  • the same processes as those in FIG. 8 are denoted by the same step numbers, and detailed description thereof is omitted.
  • the signal correction unit 61 calculates an average value M of pixel signal values of reference pixels, which are pixels in each reference area B, in step S21, and in the effective area A in step S22. Shading correction is performed on the value of the pixel signal of the effective pixel.
  • the signal correction unit 61 detects an output signal from the temperature sensor 13 and calculates a value corresponding to the detected value of the output signal (step S23).
  • step S23 since the process of step S23 is the same as the process of step 13 of FIG. 13, description here is abbreviate
  • the signal correction unit 61 performs an offset correction by calculating a calculation value corresponding to the value of the output signal of the temperature sensor 13 calculated in step S23 to the value after the shading correction in step S22 (step S24). ).
  • the calculated values M1 to M3 when the value of the output signal from the temperature sensor 13 is any of N1 to N3 are positive values
  • the calculated values M1 to M3 are shaded in step S22.
  • the value of the pixel signal is offset-corrected by subtracting from the corrected value. If the value after the calculated value M5 when the value of the output signal from the temperature sensor 13 is any value after N5 is a negative value, the absolute value of the value after the calculated value M5 is determined in step S22.
  • the value of the pixel signal is offset corrected by adding to the value after the shading correction.
  • infrared rays emitted from the subject and infrared rays emitted from the infrared imaging device main body 12 and the infrared shielding body 9 are incident on the infrared sensor 3.
  • the infrared imaging device body 12 and the infrared shielding body 9 are thermally coupled, the temperature difference between the infrared imaging device body 12 and the infrared shielding body 9 is small. That is, the difference between the amount of infrared rays emitted from the infrared imaging device main body 12 and the amount of infrared rays emitted from the infrared shielding body 9 is small.
  • the value of the output signal from the temperature sensor 13, that is, the calculated value that is a value based on the amount of infrared rays emitted from the infrared shielding body 9 is based on the amount of infrared rays emitted from the infrared imaging device body 12. It is also a value.
  • the infrared shield 9 and the infrared ray Since the value due to the infrared rays radiated from the imaging device body 12 can be offset, it is possible to acquire a highly accurate image signal value based on the infrared rays radiated from the subject, and the accuracy based on the absolute temperature of the subject. High infrared image can be acquired.
  • the temperature sensor 13 is provided at a position facing the imaging optical system 2 in the infrared shielding body 9, but the present invention is not limited to this.
  • the temperature sensor 13 since the infrared imaging device body 12 and the infrared shielding body 9 are thermally coupled, the infrared imaging device body 12 and the infrared shielding body 9 are at the same temperature. Therefore, the temperature sensor 13 may be provided anywhere on the infrared imaging device 12 and the infrared shielding body 9. For example, the temperature sensor 13 may be provided on the opposite side of the infrared shielding body 9 with respect to the temperature sensor 13 in FIG.
  • the first main body 10 or the second main body 11 inside the infrared imaging device main body 12 may be provided on the wall surface constituting the first main body 10 or the second main body 11, or the first main body 10 or the second main body outside the infrared imaging device main body 12. You may provide in the wall surface which comprises the part 11, and can change suitably.
  • the temperature sensor 13 is provided inside the infrared imaging device main body 12, the temperature of the wall located in the space where the infrared sensor 3 is installed is measured, and the temperature of the wall that radiates infrared rays to the infrared sensor 3. Therefore, the correction accuracy can be improved.
  • the infrared sensor 3 when the infrared sensor 3 is provided at a position corresponding to the imaging optical system 2 in the infrared imaging apparatus main body 12, the temperature of the wall that emits infrared rays to the infrared sensor 3 can be measured. Further improvement can be achieved.
  • one temperature sensor 13 is provided, but a plurality of temperature sensors 13 may be provided at different positions. When a plurality of temperature sensors 13 are provided, the average value of the output signals from each temperature sensor 13 can be used.
  • FIG. 16 is a schematic cross-sectional view illustrating the configuration of an infrared imaging device according to the third embodiment of the present invention.
  • the infrared imaging apparatus of the third embodiment has the same configuration as the infrared imaging apparatus 1 of the second embodiment shown in FIG. 12 except for the structure of the infrared shield 91 shown in FIG.
  • the same reference numerals are assigned to the same parts as those in FIG. 1, and the description thereof is omitted.
  • the correction method of the infrared imaging apparatus 1 of the second embodiment can also be used for the correction method using the output signal from the temperature sensor 13 by the signal correction unit 61.
  • the infrared shield 91 includes a plate-shaped member 91b having an opening 91a disposed between the imaging optical system 2 and the infrared sensor 3 in parallel with the imaging surface 30 of the infrared sensor 3, and infrared imaging from the plate-shaped member 91b.
  • a support member 91c is provided that extends toward the apparatus main body 12 and supports the plate member 91b by thermally connecting the plate-shaped member 91b and the infrared imaging apparatus main body 12 to each other.
  • the plate-like member 91b is formed of a material that shields infrared rays, is formed of a single plate, and has a rectangular opening 91a at the center thereof. As shown in FIG.
  • infrared rays are incident from the openings 91 a of the plate-like member 91 b and are blocked by the plate-like members 91 b, so that an effective region A and a reference region B are included in the region C of the detection region 31.
  • the support member 91c and the plate-like member 91b may be formed integrally or may be formed separately. If formed separately, they may be formed of different materials as long as they are thermally coupled.
  • the number of the plate-shaped members 91b is one, but the present invention is not limited to this, and a configuration using two plate-shaped members 91b may be used.
  • a support member 91c is provided on each plate member 91b.
  • this gap forms an opening 91a, and as shown in FIG. 3, the upper and lower ends in the area C of the detection area 31 are formed.
  • a reference region B can be formed.
  • the two plate-like members 91b are arranged on the left and right sides with an interval between them, this interval forms an opening 91a, and the left and right end portions in the region C of the detection region 31 as shown in FIG.
  • the reference region B can be formed.
  • FIG. 17 is a schematic cross-sectional view for explaining the configuration of an infrared imaging device according to the fourth embodiment of the present invention.
  • FIGS. 18 to 20 are diagrams showing an example of an infrared shielding method by masking the back of the lens.
  • the infrared imaging apparatus of the fourth embodiment has the same configuration as the infrared imaging apparatus 1 of the second embodiment shown in FIG. 12 except for the structure of the infrared shield 92 shown in FIG.
  • the same reference numerals are assigned to the same parts as in FIG. 1, and the description thereof is omitted.
  • the correction method of the infrared imaging apparatus 1 of the second embodiment can also be used for the correction method using the output signal from the temperature sensor 13 by the signal correction unit 61.
  • the infrared shield 92 is made of a material that shields infrared rays, and is made of a member that masks the surface of the imaging optical system 2 that is closest to the infrared sensor 3.
  • the masking member is more preferably formed of a material having a higher thermal conductivity than aluminum or stainless steel, and in this embodiment, the member is formed of copper.
  • the infrared shield 92 and the infrared imaging device main body 12 are thermally coupled by the connection body 93.
  • the connection body 93 is formed of a heat conductive material, and the infrared shield 92 and the infrared imaging apparatus main body 12 are configured such that thermal energy can move in a direction in which there is no temperature difference.
  • the infrared shield 92 has a rectangular opening 9a at the center thereof.
  • the opening 9a is formed to be smaller than the region C of the detection region 31, and infrared rays are incident from the opening 9a of the plate-like member 91b, and the infrared rays are blocked by the infrared shielding body 92, whereby the region C of the detection region 31 is formed.
  • An effective area A and a reference area B can be provided inside.
  • the number of the infrared shields 92 is one.
  • the present invention is not limited to this, and two infrared shields 92 may be used.
  • a connection body 93 is provided on each infrared shielding body 92.
  • the reference pixel B can be provided in the detection region 31 only by making the size of 9c smaller than the region C of the detection region 31 of the infrared sensor 3, it is possible to reduce the cost required for manufacturing the infrared imaging device. it can.
  • resolution performance can be enhanced by capturing an infrared image at the center of the lens.
  • the effect of the shape of the reference region B the same effect as the effect described with reference to FIGS. 3 to 5 of the above-described embodiment can be obtained, and thus the description thereof is omitted here.
  • each effect described above can be suitably obtained with respect to offset fluctuation of a detection signal generated in a thermal detection element such as a microbolometer type or an SOI (Silicon on Insulator) diode type.
  • a thermal detection element such as a microbolometer type or an SOI (Silicon on Insulator) diode type.
  • an infrared sensor that detects far infrared rays (wavelength of 8 ⁇ m to 15 ⁇ m) is used, the present invention is not limited to this, and an infrared sensor that detects middle infrared rays and near infrared rays may be used.
  • the infrared imaging device 1 can be suitably applied to a security imaging device, an in-vehicle imaging device, and the like, and may be configured as a single imaging device that captures an infrared image. It may be configured to be incorporated in an imaging system having an infrared image capturing function.
  • the infrared imaging device of the present invention is not limited to the above embodiment, and can be appropriately changed without departing from the spirit of the invention.

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

[Problème] Corriger, avec un degré élevé de précision, des valeurs qui contribuent à la lumière infrarouge émise à partir d'un corps de dispositif d'imagerie infrarouge et d'un corps de blindage infrarouge, à partir de signaux de pixels émis par un capteur infrarouge (3), lorsqu'une région efficace (A) dans laquelle la lumière infrarouge est incidente, et une région de référence (B) sur laquelle la lumière infrarouge n'est pas incidente, sont formés par un corps de blindage infrarouge, dans un dispositif d'imagerie infrarouge (1). [Solution] Ce dispositif d'imagerie infrarouge (1) comprend : un système optique d'imagerie (2) qui image la lumière infrarouge; un capteur infrarouge (3) qui est positionné sur le plan d'imagerie (30) du système optique d'imagerie (2), présente une région de détection (31) dans laquelle une pluralité de pixels qui sont des éléments de thermocouple sont agencés en un réseau, et un signal de pixel basé sur la lumière infrarouge incidente depuis le système optique d'imagerie est émis à chaque pixel; et un corps de blindage infrarouge (9) qui est lié thermiquement au corps de dispositif d'imagerie infrarouge (12) et qui est pourvu, dans une région de détection (31), d'une région efficace (A) sur laquelle la lumière infrarouge provenant du système optique d'imagerie (2) est incidente, et une région de référence (B) sur laquelle la lumière infrarouge n'est pas incidente, par blocage partiel de la lumière infrarouge entre le système optique d'imagerie (2) et le plan d'imagerie (30).
PCT/JP2016/002351 2015-05-21 2016-05-13 Dispositif d'imagerie infrarouge Ceased WO2016185698A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015103563 2015-05-21
JP2015-103563 2015-05-21

Publications (1)

Publication Number Publication Date
WO2016185698A1 true WO2016185698A1 (fr) 2016-11-24

Family

ID=57319720

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2016/002351 Ceased WO2016185698A1 (fr) 2015-05-21 2016-05-13 Dispositif d'imagerie infrarouge

Country Status (1)

Country Link
WO (1) WO2016185698A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020085224A1 (fr) * 2018-10-24 2020-04-30 国立研究開発法人産業技術総合研究所 Procédé de mesure et système de mesure de profil de faisceau de laser infrarouge

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0342531A (ja) * 1989-07-11 1991-02-22 Mitsubishi Electric Corp 赤外線計測装置
JP2004532701A (ja) * 2001-06-19 2004-10-28 ウェルチ・アリン・インコーポレーテッド 赤外線体温計
JP2006074172A (ja) * 2004-08-31 2006-03-16 Canon Inc 画像信号処理回路、カメラ、及び画像信号処理方法
JP2008113141A (ja) * 2006-10-30 2008-05-15 Fujifilm Corp 撮像装置及び信号処理方法
JP2009042164A (ja) * 2007-08-10 2009-02-26 Hitachi Maxell Ltd 赤外線カメラ
US20090194696A1 (en) * 2005-03-24 2009-08-06 Udi Mizrahi Method and System for Determining the Rate of Non Uniformity of Bolometer Based Systems
WO2014018948A2 (fr) * 2012-07-26 2014-01-30 Olive Medical Corporation Système de caméra à capteur d'image cmos monolithique à surface minimale

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0342531A (ja) * 1989-07-11 1991-02-22 Mitsubishi Electric Corp 赤外線計測装置
JP2004532701A (ja) * 2001-06-19 2004-10-28 ウェルチ・アリン・インコーポレーテッド 赤外線体温計
JP2006074172A (ja) * 2004-08-31 2006-03-16 Canon Inc 画像信号処理回路、カメラ、及び画像信号処理方法
US20090194696A1 (en) * 2005-03-24 2009-08-06 Udi Mizrahi Method and System for Determining the Rate of Non Uniformity of Bolometer Based Systems
JP2008113141A (ja) * 2006-10-30 2008-05-15 Fujifilm Corp 撮像装置及び信号処理方法
JP2009042164A (ja) * 2007-08-10 2009-02-26 Hitachi Maxell Ltd 赤外線カメラ
WO2014018948A2 (fr) * 2012-07-26 2014-01-30 Olive Medical Corporation Système de caméra à capteur d'image cmos monolithique à surface minimale

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020085224A1 (fr) * 2018-10-24 2020-04-30 国立研究開発法人産業技術総合研究所 Procédé de mesure et système de mesure de profil de faisceau de laser infrarouge
JPWO2020085224A1 (ja) * 2018-10-24 2021-09-30 国立研究開発法人産業技術総合研究所 赤外線レーザのビームプロファイルの測定方法及び測定システム

Similar Documents

Publication Publication Date Title
US20200351461A1 (en) Shutterless calibration
US7880777B2 (en) Method for fixed pattern noise reduction in infrared imaging cameras
US9497397B1 (en) Image sensor with auto-focus and color ratio cross-talk comparison
EP4006510B1 (fr) Dispositif de détection infrarouge et méthode de mesure de signaux infrarouges utilisant le dispositif de détection infrarouge
US7132648B2 (en) Uniform, non-disruptive, and radiometrically accurate calibration of infrared focal plane arrays using global scene motion
US9706138B2 (en) Hybrid infrared sensor array having heterogeneous infrared sensors
CN103312980B (zh) 成像设备及其图像传感器
US10345154B2 (en) Infrared sensing devices and methods
JP2011128024A (ja) ３次元撮像装置
KR20130010429A (ko) 멀티센서 검출기들의 이득 특성의 바느질 방식의 결합 및 선형화 방법
JP2008219613A (ja) 非冷却赤外線カメラ
EP3804296B1 (fr) Dispositif et procédé de compensation de la chaleur parasite dans une caméra infrarouge
JP2016126592A5 (fr)
EP3803780B1 (fr) Dispositif et procédé de compensation de la chaleur parasite dans une caméra infrarouge
WO2016185698A1 (fr) Dispositif d'imagerie infrarouge
WO2016185699A1 (fr) Dispositif d'imagerie infrarouge
JP7271604B2 (ja) 赤外線撮像装置
EP2833621B1 (fr) Capteur d'image à détection d'ombrage
Jin et al. Infrared nonuniformity correction and radiometric calibration technology using U-shaped blackbody
JP5551510B2 (ja) 電子増倍率の測定方法及び撮像装置
US20210068774A1 (en) Radiographic imaging apparatus and control method therefor
JPS62209980A (ja) 光線撮影装置
JP2018006881A (ja) 画像処理装置及び画像処理方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16796094

Country of ref document: EP

Kind code of ref document: A1

DPE2 Request for preliminary examination filed before expiration of 19th month from priority date (pct application filed from 20040101)
NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 16796094

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP