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WO2016153184A1 - Capteur tactile à film et son procédé de fabrication - Google Patents

Capteur tactile à film et son procédé de fabrication Download PDF

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Publication number
WO2016153184A1
WO2016153184A1 PCT/KR2016/001998 KR2016001998W WO2016153184A1 WO 2016153184 A1 WO2016153184 A1 WO 2016153184A1 KR 2016001998 W KR2016001998 W KR 2016001998W WO 2016153184 A1 WO2016153184 A1 WO 2016153184A1
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WO
WIPO (PCT)
Prior art keywords
layer
touch sensor
electrode pattern
protective layer
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2016/001998
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English (en)
Korean (ko)
Inventor
최봉진
박민혁
차진규
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongwoo Fine Chem Co Ltd
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Dongwoo Fine Chem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongwoo Fine Chem Co Ltd filed Critical Dongwoo Fine Chem Co Ltd
Publication of WO2016153184A1 publication Critical patent/WO2016153184A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Definitions

  • the present invention relates to a film touch sensor and a manufacturing method thereof.
  • an ultra-thin flexible display that achieves ultralight weight, low power, and improved portability has been attracting attention as a next generation display, and development of a touch sensor applicable to such a display has been required.
  • a flexible display means a display manufactured on a flexible substrate that can bend, bend, or roll without loss of properties, and technology development is in progress in the form of a flexible LCD, a flexible OLED, and an electronic paper.
  • a touch sensor having excellent bending and resilience and excellent flexibility and elasticity is required.
  • a wiring forming step of forming a metal wiring on the carrier substrate a lamination step of applying and drying a transparent resin solution to cover the metal wiring to form a transparent resin substrate, and a peeling process of peeling the transparent resin substrate from the carrier substrate. It is.
  • an inorganic peeling material such as an organic peeling material such as a silicone resin or a fluororesin, a diamond like carbon thin film (DLC) thin film or a zirconium oxide thin film is applied to the surface of the substrate.
  • a method of forming in advance is used.
  • the inorganic release material when peeling the substrate and the metal wiring from the carrier substrate, there is a problem that the peeling of the wiring and the substrate does not proceed smoothly and some of the metal wiring and the substrate remain on the substrate surface. There is a problem that the organic material used adheres to the surface of the wiring and the substrate.
  • the method proposed in Korean Patent No. 1191865 includes a sacrificial layer, a metal wiring, and a polymer material which can be removed by light or a solvent in the manufacturing of a flexible substrate having a metal wiring embedded therein. After the (flexible substrate) is formed on the carrier substrate, the metal wiring and the polymer material (flexible substrate) are separated from the carrier substrate by removing the sacrificial layer using light or a solvent.
  • An object of this invention is to provide the film touch sensor provided with the protective layer which coat
  • An object of the present invention is to provide a film touch sensor having a protective layer excellent in heat resistance and capable of suppressing thermal damage that may occur during high temperature deposition and annealing processes.
  • An object of the present invention is to provide a film touch sensor having excellent bending characteristics.
  • An object of the present invention is to provide a method for manufacturing a film touch sensor having excellent heat resistance and bending characteristics.
  • the inorganic protective layer is an inorganic oxide or inorganic nitride layer, film touch sensor.
  • the inorganic protective layer is a silicon oxide layer
  • film touch sensor In the above 1, wherein the inorganic protective layer is a silicon oxide layer, film touch sensor.
  • the electrode pattern layer has a thickness of 30 to 150nm, film touch sensor.
  • the film touch sensor In the above 1, wherein the electrode pattern layer is manufactured through a high temperature process of 150 °C to 250 °C, the film touch sensor.
  • the adhesive layer has an elastic modulus of 107Pa to 109Pa, the peel force is 10N / 25mm or more, film touch sensor.
  • the image display device including the film touch sensor of any one of the above 1 to 9.
  • the inorganic protective layer is a silicon oxide layer having a thickness of less than 200 nm.
  • the electrode pattern layer is formed through a high temperature process of 150 °C to 250 °C, manufacturing method of the film touch sensor.
  • the film touch sensor of the present invention is excellent in heat resistance, and can suppress thermal damage such as wrinkles, cracks, and color changes that may occur during high temperature deposition and annealing processes. Accordingly, a high temperature deposition and annealing process may be performed to implement an electrode pattern layer having a lower resistance.
  • the film touch sensor of the present invention is excellent in flexural characteristics, low probability of cracking during peeling, and may be applied as a flexible touch sensor.
  • 1 to 3 are schematic cross-sectional views of a film touch sensor according to an embodiment of the present invention.
  • 4 and 5 is a schematic process diagram of a method of manufacturing a film touch sensor according to an embodiment of the present invention.
  • the present invention is a separation layer; An inorganic protective layer having an elastic modulus of 10 GPa to 15 GPa located on the separation layer; And by including an electrode pattern layer located on the inorganic protective layer, it is excellent in heat resistance, it is possible to suppress thermal damage such as wrinkles, cracks, etc. that may occur during the high temperature deposition and annealing process, and excellent bending characteristics to crack during peeling
  • the present invention relates to a film touch sensor and a method for manufacturing the same, which have a low possibility of occurrence and can be applied to a flexible touch sensor.
  • the film touch sensor of the present invention includes a separation layer, an inorganic protective layer and an electrode pattern layer.
  • FIG. 1 is a schematic cross-sectional view of a film touch sensor according to an embodiment of the present invention.
  • a manufacturing process is performed on the carrier substrate 10, and the manufactured laminate is manufactured by separating the carrier substrate 10, and the separation layer 20 is separated from the carrier substrate 10. Layer is formed.
  • the separation layer 20 is a layer for protecting the electrode pattern layer 40 by covering the electrode pattern layer 40 without being removed after separation from the carrier substrate 10.
  • the separation layer 20 may be a polymer organic membrane, for example, a polyimide polymer, a polyvinyl alcohol polymer, a polyamic acid polymer, a polyamide polymer , Polyethylene polymer, polystylene polymer, polynorbornene polymer, phenylmaleimide copolymer polymer, polyazobenzene polymer, polyphenylene phthalamide (polyphenylenephthalamide) polymer, polyester polymer, polymethyl methacrylate polymer, polyarylate polymer, cinnamate polymer, coumarin polymer, It may be made of a polymer such as phthalimidine-based polymer, chalcone-based polymer, aromatic acetylene-based polymer, but That's not one. These can be used individually or in mixture of 2 or more types.
  • the separation layer 20 is easily peeled from the carrier substrate 10, and the peeling force on the carrier substrate 10 of the material is 1 N / 25 mm so that the separation layer 20 is not peeled off from the protective layer 30 to be described later. It is preferable to be manufactured from the following materials.
  • 10-1000 nm is preferable and, as for the thickness of the separation layer 20, it is more preferable that it is 50-500 nm. If the thickness of the separation layer 20 is less than 10 nm, the uniformity during application of the separation layer 20 may be inferior, or the electrode pattern may be unevenly formed, or the peeling force may be locally increased to cause tearing or separation from the carrier substrate 10. After that, there is a problem that the curl of the film touch sensor is not controlled. And when the thickness exceeds 1000nm, there is a problem that the peeling force is no longer lowered, there is a problem that the flexibility of the film is lowered.
  • the protective layer 30 is disposed on the separation layer 20 and covers the electrode pattern layer 40 similarly to the separation layer 20 to prevent contamination of the electrode pattern layer 40 and separation from the carrier substrate 10. It serves to prevent breakage of the electrode pattern layer 40.
  • the inorganic protective layer 30 according to the present invention is made of an inorganic material, it is excellent in heat resistance can reduce the occurrence of cracks due to thermal deformation and thermal stress. Accordingly, the electrode pattern layer 40 having a lower resistance may be implemented by performing a high temperature deposition and annealing process. Moreover, it is excellent in chemical resistance and suppresses swelling, peeling, etc. of the separation layer 20. FIG.
  • the inorganic material constituting the inorganic protective layer 30 is not particularly limited as long as it is an inorganic material, and may be, for example, an inorganic oxide or an inorganic nitride.
  • the inorganic oxide include silicon oxide, alumina, titanium oxide, and the like
  • examples of the inorganic nitride include silicon nitride and titanium nitride. It may be preferably silicon oxide in terms of achieving high transmittance.
  • the inorganic protective layer 30 according to the present invention may have an elastic modulus of 10 GPa to 15 GPa. If the elastic modulus is less than 10 GPa or greater than 15 GPa, cracks may occur in the inorganic protective layer 30, the electrode pattern layer 40, or the touch sensor when the manufactured film touch sensor is peeled from the carrier substrate 10.
  • the method for allowing the inorganic protective layer 30 to have the elastic modulus range is not particularly limited, and can be adjusted by adjusting the thickness and curing density of the inorganic protective layer 30, for example.
  • Specific examples of adjusting the curing density may be cured for 10 to 30 minutes at 160 ° C to 240 ° C, preferably at 180 to 220 ° C for 15 minutes to 25 minutes after coating the inorganic protective layer 30. It is not limited to this.
  • the thickness of the inorganic protective layer 30 is not particularly limited as long as it is a range showing the modulus of elasticity, and may be, for example, less than 200 nm. When the thickness is 200 nm or more, it may be difficult to satisfy the elastic modulus range, and when the manufactured film touch sensor is peeled from the carrier substrate 10, a crack may occur in the protective layer, the electrode pattern layer 40, or the touch sensor. Within this range, for example, it may be 10nm to 190nm, 10nm to 195nm, 20nm to 190nm, 30nm to 150nm and the like.
  • the electrode pattern layer 40 is positioned on the inorganic protective layer 30.
  • the electrode pattern layer 40 may include not only an electrode sensing a touch but also a wiring pattern connected to the electrode.
  • the electrode pattern layer 40 may be used without limitation as long as it is a conductive material.
  • the electrode pattern layer 40 may be formed of two or more conductive layers in the form of a first electrode layer and a second electrode layer in order to reduce electrical resistance.
  • the electrode pattern layer 40 may be formed of one layer of ITO, silver nanowires (AgNW), or a metal mesh, and in the case of forming two or more layers, the first electrode layer may be formed of a transparent metal oxide such as ITO.
  • the second electrode layer may be formed using a metal, AgNW, or the like on the ITO electrode layer.
  • the electrode pattern layer 40 made of a metal or a metal oxide may be formed to include at least one or more layers.
  • the electrode pattern layer 40 forms a transparent conductive layer of a metal or a metal oxide on the separation layer 20 or the protective layer, and then further laminates the transparent conductive layer to form an electrode pattern or a separation layer ( 20)
  • an electrode pattern may be formed by stacking one or more transparent conductive layers on the protective layer and then further forming a transparent conductive layer with a metal or a metal oxide.
  • Specific examples of the laminated structure of the electrode pattern is as follows.
  • a structure for laminating metal oxides and laminating silver nanowires thereon, a structure for laminating metal oxides and laminating metals thereon, a structure for laminating metal oxides and laminating metal mesh electrodes thereon, and silver nanowires A structure for laminating and stacking metal oxides on top of it, a structure for laminating metals and stacking metal oxide on top of it, a structure for laminating metal mesh electrodes and laminating metal oxide on top of it, a lamination of metal oxide on top of it Stacking silver nanowires and further stacking a metal layer thereon; stacking silver nanowires, stacking a metal oxide thereon, and further stacking a metal layer thereon; and the electrode stacking structure is a touch sensor. It can be changed in consideration of the signal processing, the resistance and is not limited to the above-described laminated structure.
  • an electrical insulation layer may be formed between the first electrode pattern layer 40 and the second electrode pattern layer 40, and the second conductive layer may be formed by patterning the electrical insulation layer to form a contact hole. May be formed to be a bridge electrode.
  • the structure of the electrode pattern layer 40 will be described below in terms of the touch sensor method.
  • the pattern structure of the electrode pattern layer 40 is preferably an electrode pattern structure used in the capacitive method, a mutual capacitance method (self-capacitance) or a self-capacitance method (self-capacitance) may be applied.
  • the grid electrode structure may have a horizontal axis and a vertical axis.
  • a bridge electrode may be included at an intersection point of the electrodes of the horizontal axis and the vertical axis, or the horizontal electrode pattern layer 40 and the vertical axis electrode pattern layer 40 may be formed to be electrically spaced apart from each other.
  • the electrode layer structure may be a method of reading capacitance change by using one electrode at each point.
  • the electrode pattern layer 40 is preferably formed by including a high temperature heat treatment process to implement a low resistance.
  • the high temperature may be, for example, 150 °C to 250 °C. Specifically, it may be formed by a deposition process of 150 ° C to 250 ° C, or may be formed by a room temperature deposition and a heat treatment process of 150 ° C to 250 ° C, but is not limited thereto.
  • the film touch sensor of the present invention may further include a base film attached to the electrode pattern layer 40 through the adhesive layer 50.
  • 2 is a schematic cross-sectional view of a film touch sensor according to such an embodiment.
  • the adhesive layer 50 means an adhesive layer or an adhesive layer.
  • a transparent film made of a material widely used in the art may be used without limitation, and for example, a cellulose ester (eg, cellulose triacetate, cellulose propionate, cellulose butyrate, cellulose acetate Propionate, and nitrocellulose), polyimide, polycarbonate, polyester (e.g. polyethylene terephthalate, polyethylene naphthalate, poly-1,4-cyclohexanedimethylene terephthalate, polyethylene 1,2-diphenoxyethane -4,4'-dicarboxylate and polybutylene terephthalate, polystyrene (e.g. syndiotactic polystyrene), polyolefins (e.g.
  • the transparent film may be an isotropic film or a retardation film.
  • the thickness direction retardation (Rth, Rth [(nx + ny) / 2-nz] xd) is preferably -90 nm to +75 nm, preferably -80 nm to +60 nm, particularly -70 nm to +45 nm. desirable.
  • Retardation film is a film produced by the method of uniaxial stretching, biaxial stretching, polymer coating, liquid crystal coating of a polymer film, and is generally used for improving and adjusting optical properties such as viewing angle compensation, color reduction, light leakage improvement, and color control of a display. do.
  • a polarizing plate can also be used for the base film 60.
  • the polarizing plate may be a polarizer protective film is attached to one side or both sides of the polyvinyl alcohol polarizer.
  • a protective film can also be used as the base film 60.
  • the protective film may be a film including an adhesive layer on at least one surface of a film made of a polymer resin or a film having a self-adhesive property such as polypropylene, and may be used for protecting the touch sensor surface and improving process resolution.
  • the light transmittance of the base film 60 is preferably 85% or more, more preferably 90% or more. Moreover, it is preferable that the total haze value measured according to JISK7136 is 10% or less, and, as for the said base film 60, it is more preferable that it is 7% or less.
  • the thickness of the said base film 60 is not restrict
  • thermosetting or photocurable pressure-sensitive adhesive or adhesive any thermosetting or photocurable pressure-sensitive adhesive or adhesive known in the art may be used without limitation.
  • thermosetting or photocurable adhesives or adhesives such as polyester type, polyether type, urethane type, epoxy type, silicone type, and acryl type, can be used.
  • the adhesive bond layer 50 has a high elasticity of 107 Pa or more in terms of suppressing crack generation during the peeling process of the film touch sensor.
  • the elastic modulus may be preferably 107 Pa to 109 Pa in view of suppressing crack generation and at the same time showing excellent adhesion.
  • the adhesive force layer 50 has peeling force of 10 N / 25mm or more from a viewpoint of suppressing a crack generation at the peeling process of a film touch sensor.
  • the film touch sensor of the present invention may further include a second protective layer 70 positioned between the electrode pattern layer 40 and the adhesive layer 50.
  • 3 is a schematic cross-sectional view of a film touch sensor according to such an embodiment.
  • the second protective layer 70 covers the electrode pattern layer 40 to prevent corrosion of the electrode pattern layer 40, and prevents damage to the electrode pattern layer 40 by static electricity.
  • the second protective layer 70 may be a layer formed of the same material as the organic insulating layer or the inorganic protective layer 30.
  • an object of this invention is to provide the image display apparatus containing the said film touch sensor.
  • the film touch sensor of the present invention can be applied to various image display devices such as electroluminescent display devices, plasma display devices, field emission display devices, as well as ordinary liquid crystal display devices.
  • the film touch sensor of the present invention has excellent bending characteristics
  • the image display device may be a flexible image display device.
  • the present invention also provides a method of manufacturing a film touch sensor.
  • FIG. 4 and 5 is a schematic process diagram of a method of manufacturing a film touch sensor according to an embodiment of the present invention. This is one embodiment in the case of including the step of attaching the base film to be described later, the present invention is not limited thereto.
  • the separation layer 20 is formed on the carrier substrate 10.
  • the carrier substrate 10 may be used without particular limitation as long as it provides a suitable strength so that it can be fixed without being easily bent or twisted during the process and has little effect on heat or chemical treatment.
  • glass, quartz, silicon wafers, sus etc. may be used, preferably glass may be used.
  • the separation layer 20 may be formed of the aforementioned polymer material.
  • the separation layer 20 is formed because the separation layer 20 is well separated from the carrier substrate 10. In this case, since the impact applied to the touch sensor during peeling from the carrier substrate 10 is small, problems such as damage to the electrode pattern layer 40 can be reduced.
  • the separation layer 20 may have a peel force of about 1 N / 25 mm or less on the carrier substrate 10 in terms of minimizing physical damage applied to the peeling.
  • the formation method of the separation layer 20 is not specifically limited, Slit coating method, knife coating method, spin coating method, casting method, micro gravure coating method, gravure coating method, bar coating method, roll coating method, wire bar coating method To methods known in the art such as dip coating, spray coating, screen printing, gravure printing, flexographic printing, offset printing, inkjet coating, dispenser printing, nozzle coating, capillary coating, etc. You can.
  • an additional curing process may be further performed.
  • the hardening method of the separation layer 20 is not specifically limited, either photocuring or thermosetting, or both methods can be used.
  • the order in which both photocuring and thermosetting are performed is not specifically limited.
  • an inorganic protective layer 30 having an elastic modulus of 10 GPa to 15 GPa is formed on the separation layer 20.
  • the inorganic protective layer 30 may be formed of the above-described materials, and the method of forming the inorganic protective layer 30 is not particularly limited, but may be a physical vapor deposition method, a chemical vapor deposition method, a plasma deposition method, a plasma polymerization method, a thermal vapor deposition method, a thermal oxidation method, an anodization method, a cluster ion beam deposition method, It may be by a method known in the art such as screen printing, gravure printing, flexographic printing, offset printing, inkjet coating, dispenser printing.
  • the inorganic protective layer 30 may be formed to have the aforementioned thickness range.
  • the inorganic protective layer 30 may be manufactured by a high temperature curing process after coating by the above-described method. For example, curing may be performed at 160 ° C. to 240 ° C. for 10 to 30 minutes, preferably at 180 to 220 ° C. for 15 minutes to 25 minutes, but is not limited thereto.
  • an electrode pattern layer 40 is formed on the inorganic protective layer 30.
  • the electrode pattern layer 40 is made of the material described above, and can be formed by the same method as the method for forming the inorganic protective layer 30.
  • the electrode pattern layer 40 may be formed through a high temperature process of 150 °C to 250 °C.
  • it may be formed by a deposition process of 150 ° C to 250 ° C, or may be formed by room temperature deposition and a heat treatment process of 150 ° C to 250 ° C, but is not limited thereto.
  • the separation layer 20 is peeled from the carrier substrate 10.
  • a laminate obtained by sequentially separating the separation layer 20, the inorganic protective layer 30, and the electrode pattern layer 40 on the carrier substrate 10 may be obtained, and the separation layer 20 may be transferred to the carrier. It peels off from the board
  • the manufacturing method of the film touch sensor of the present invention may further include attaching a base film on the electrode pattern layer 40, as shown in FIG. Specifically, forming an adhesive layer 50 on the electrode pattern layer 40; And attaching a base film on the adhesive layer 50.
  • the peeling process may be performed before or after the attachment of the base film.
  • 5 illustrates a case where a peeling process is performed after the adhesion of the base film.
  • the adhesive layer 50 may be formed by the above-described pressure-sensitive adhesive or adhesive, and may be formed on the electrode pattern layer 40 by a coating method exemplified as the separation layer 20 forming method, and may be dried or cured. have.
  • the adhesive layer 50 has the above-mentioned elastic modulus range and peeling force range in view of crack generation suppression of the film touch sensor during the peeling process.
  • the method of manufacturing a film touch sensor according to the present invention may further include forming a second protective layer 70 on the electrode pattern layer 40 before attaching the base film.
  • the second protective layer 70 may be formed of the material described above and may be formed in the same manner as the separation layer 20 is formed.
  • the second protective layer 70 may be formed before or after the exfoliation.
  • Sodium lime glass having a thickness of 700 ⁇ m was used as a carrier substrate, and 50 parts by weight of melamine-based resin and 50 parts by weight of cinnamate-based resin were propylene glycol monomethyl ether on the carrier substrate.
  • the separation layer composition diluted in acetate (Propylene glycol monomethyl ether acetate, PGMEA) was applied by spin coating to a thickness of 300nm, and dried for 30 minutes at 150 °C to form a separation layer.
  • SiOx Precursor hexamethyldisilazane
  • SiOx Precursor hexamethyldisilazane
  • the nozzle gap was maintained at 50mm and coated at a speed of 500mm / min, and cured at 200 ° C. for 20 minutes to form an inorganic protective layer having a thickness of 60 nm.
  • ITO was deposited to a thickness of 35 nm at 25 ° C., and the ITO layer was annealed at 230 ° C. for 30 minutes to form an electrode pattern layer.
  • a second protective layer composition (40 parts by weight of a polyfunctional acrylic monomer and 60 parts by weight of an epoxy resin is mixed and 30 parts by weight of diethylene glycol methylethyl ether (MEDG), PGMEA and 3-methoxybutanol, respectively) , 40 parts by weight, and 30 parts by weight of a solvent, the solid content of which is to have a proportion of 20 parts by weight) was applied by spin coating method with a thickness of 2 ⁇ m, UV curing at 200mJ / cm 2 to perform photocuring, 200 Dry curing was performed at 30 ° C. for 30 minutes to form a second protective layer.
  • MEDG diethylene glycol methylethyl ether
  • PGMEA PGMEA and 3-methoxybutanol
  • a film touch sensor was manufactured in the same manner as in Example 1, except that the thickness of the inorganic protective layer was 120 nm.
  • a film touch sensor was manufactured in the same manner as in Example 1, except that the thickness of the inorganic protective layer was 200 nm.
  • a film touch sensor was manufactured in the same manner as in Example 1, except that the thickness of the inorganic protective layer was 190 nm.
  • a film touch sensor was manufactured in the same manner as in Example 1, except that the inorganic protective layer was formed of TiO 2.
  • a first protective layer composition (40 parts by weight of a polyfunctional acrylic monomer and 60 parts by weight of an epoxy resin is mixed on the electrode pattern layer, and diethylene glycol methylethyl ether (MEDG), PGMEA and 3- Methoxybutanol was prepared in a solvent mixed with 30 parts by weight, 40 parts by weight and 30 parts by weight, respectively, with a solid coating having a proportion of 20 parts by weight) by spin coating at a thickness of 2 ⁇ m, and UV irradiation at 200 mJ / cm 2. Photocuring was carried out and dried and cured at 200 ° C. for 30 minutes to form a first protective layer,
  • a film touch sensor was manufactured in the same manner as in Example 1, except that annealing of the ITO layer was not performed.
  • a film touch sensor was manufactured in the same manner as in Comparative Example 1, except that the ITO layer was annealed at 230 ° C. for 30 minutes.
  • An inorganic protective layer was formed by coating SiO 2, curing at 150 ° C. for 20 minutes, and setting the ITO annealing condition to 80 ° C. for 10 minutes to prepare a film touch sensor in the same manner as in Example 1.
  • the inorganic protective layer was formed by coating SiOx, curing at 250 ° C. for 20 minutes, and setting the film touch sensor in the same manner as in Example 1 except that the ITO annealing conditions were set at 300 ° C. and 60 minutes.
  • the elastic modulus of the inorganic protective layer (first protective layer) of the film touch sensor of the Example and the comparative example was measured with the nanoindenter.
  • Each substrate was set in a nanoindenter and pressed to a force of 2000 mN to measure the elastic modulus of the exposed inorganic protective layer (first protective layer) portion.
  • the sheet resistance of the electrode pattern layer of the film touch sensor of the Example and the comparative example was measured by the 4-point probe.
  • the total light transmittance of the film touch sensors of Examples and Comparative Examples was measured using a haze meter (HM-150, Murakamisa), and the measurement results are described in Table 2 below by calculating the transmittance with respect to the glass substrate.
  • the color b value of the film touch sensor of an Example and a comparative example was measured with the N & K analyzer (N & K Technology Inc.).
  • the film touch sensors manufactured in Examples and Comparative Examples were peeled off from the carrier substrate, and cracks were observed in the peeled film touch sensors to evaluate whether cracks were generated according to the following criteria.
  • the film touch sensor of the embodiment having a protective layer of the elastic modulus range of the present invention has a small color change even after ITO annealing, it can be seen that the wrinkles do not occur, the crack generation is minimized.

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  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Position Input By Displaying (AREA)
  • Laminated Bodies (AREA)

Abstract

La présente invention concerne un capteur tactile à film et un procédé de fabrication associé et, plus particulièrement, un capteur tactile à film et son procédé de fabrication, le capteur tactile à film comprenant : une couche de séparation ; une couche de protection inorganique ayant un module d'une élasticité de 10 GPa à 15 GPa et placée sur la couche de séparation ; et une couche de motif d'électrode placée sur la couche de protection inorganique. Par conséquent, le capteur tactile à film présente une excellente résistance thermique et peut de ce fait supprimer l'endommagement thermique tel que les rides et les fissures qui peuvent être occasionnées au cours d'un processus de dépôt et de recuit à haute température, il présente d'excellentes caractéristiques de flexion et réduit ainsi la possibilité de provoquer des fissures pendant un processus de décollement, et il peut être appliqué sous forme d'un capteur tactile souple et analogue.
PCT/KR2016/001998 2015-03-20 2016-02-29 Capteur tactile à film et son procédé de fabrication Ceased WO2016153184A1 (fr)

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KR1020150038626A KR20160112600A (ko) 2015-03-20 2015-03-20 필름 터치 센서 및 이의 제조 방법
KR10-2015-0038626 2015-03-20

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CN108062176B (zh) 2016-11-09 2021-07-09 东友精细化工有限公司 触摸传感器层叠体及其制造方法
KR20180052067A (ko) * 2016-11-09 2018-05-17 동우 화인켐 주식회사 터치 센서 적층체 및 이의 제조 방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100070730A (ko) * 2008-12-18 2010-06-28 엘지디스플레이 주식회사 플렉서블 표시장치의 제조 방법
KR20110051151A (ko) * 2009-11-09 2011-05-17 닛토덴코 가부시키가이샤 광학용 점착 시트
WO2013081385A1 (fr) * 2011-12-01 2013-06-06 (주)엘지하우시스 Film intérieur comprenant un motif en trois dimensions, et procédé pour sa préparation
KR20140024216A (ko) * 2012-08-17 2014-02-28 제일모직주식회사 표시소자용 플렉서블 기판, 그 제조방법 및 이를 이용한 디스플레이 장치
KR20140114257A (ko) * 2013-03-18 2014-09-26 (주)삼원에스티 터치패널센서용 적층필름

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101191865B1 (ko) 2011-04-20 2012-10-16 한국기계연구원 금속 배선이 함몰된 유연 기판의 제조방법 및 이에 따라 제조되는 유연 기판

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100070730A (ko) * 2008-12-18 2010-06-28 엘지디스플레이 주식회사 플렉서블 표시장치의 제조 방법
KR20110051151A (ko) * 2009-11-09 2011-05-17 닛토덴코 가부시키가이샤 광학용 점착 시트
WO2013081385A1 (fr) * 2011-12-01 2013-06-06 (주)엘지하우시스 Film intérieur comprenant un motif en trois dimensions, et procédé pour sa préparation
KR20140024216A (ko) * 2012-08-17 2014-02-28 제일모직주식회사 표시소자용 플렉서블 기판, 그 제조방법 및 이를 이용한 디스플레이 장치
KR20140114257A (ko) * 2013-03-18 2014-09-26 (주)삼원에스티 터치패널센서용 적층필름

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