WO2016038649A1 - Antenna module - Google Patents

Abstract

Provided is an antenna module whereby directivity distortion can be further suppressed. A non-contact type hentenna module (20) is provided with: a substrate (1); a rectangular loop-shaped first conductor (2) that is formed on one surface of the substrate (1); and a rectangular second conductor (6), which is formed, without being short-circuited to the first conductor (2), on the substrate surface on the same side where the first conductor (2) is formed, and which is electrostatically coupled to the first conductor (2) when supplied with power. On a part of one long side of the first conductor (2), a protruding portion (3) is formed, said protruding portion protruding further than other portions of the long side toward at least the inner side of the rectangular loop, a first recessed section (7) and a second recessed section (8) are respectively formed in the protruding portion (3) and a part of the other long side of the first conductor (2), said part facing the protruding portion (3), one end section of the second conductor (6) is inserted to the inner side of the first recessed section (7), and the other end section of the second conductor (6) is inserted to the inner side of the second recessed section (8).

Description

Antenna module

The present invention relates to an antenna module.

Conventionally, a loop antenna called hentena is known. For example, Patent Documents 1 to 4 disclose loop antennas in which a feeding portion is short-circuited on two long sides of a rectangular loop as an example of a henna. In general, communication is performed by connecting a small wireless module to a pattern antenna formed on a substrate.

As one method for connecting the wireless module to the pattern antenna, there is a method in which a part of the pattern antenna is arranged so as to overlap the area of the substrate on which the wireless module is mounted, and the pattern antenna and the wireless module are connected.

Japanese Patent Laid-Open No. 9-284028 JP 2004-266500 A JP-A-2005-252406 JP 2006-174362 A

However, if a part of the pattern antenna is arranged so as to overlap the area where the wireless module is mounted, the directivity may be distorted. For this reason, one of the major issues in the development of such an antenna is to be able to suppress directivity distortion.

The present invention has been made to solve the above-described problems, and an object thereof is to provide an antenna module that can further suppress directivity distortion.

The antenna module of the present invention includes a substrate, a rectangular loop-shaped first conductor formed on one surface of the substrate, and a short circuit with the first conductor on the surface of the substrate on the same side as the first conductor. And a rectangular second conductor that is electrostatically coupled to the first conductor by being fed, and a part of one long side of the first conductor includes the other of the long side. A protruding portion that protrudes toward the inside of the rectangular loop from the portion of the first loop is formed, and the first concave portion and the second long side of the first conductor facing the protruding portion are respectively formed on the protruding portion and the protruding portion. Two recesses are formed, and one end portion of the second conductor enters the inside of the first recess, and the other end portion of the second conductor enters the inside of the second recess.

According to the present invention, directivity distortion can be further suppressed.

The figure which shows an example of the 1st surface of a contact-type henna module The figure which shows an example of the 1st surface of a non-contact type henna module The figure which shows the other example of the 1st surface of a non-contact type henna module The figure which shows an example of the vertical surface directivity of the Hentena module The figure which shows an example of horizontal plane directivity of a Hentena module The figure which shows the other example of the henna module which concerns on embodiment of this invention

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a diagram illustrating an example of a first surface of a contact-type henna module 10 used for comparison with a non-contact type henna module. FIG. 2 is a diagram illustrating an example of the first surface of the non-contact type henna module 20. FIG. 3 is a diagram illustrating an example of the first surface of the non-contact type henna module 30.

Here, as shown in FIGS. 2 and 3, in the non-contact type henna module 20, 30, the conductor 6 having a portion that becomes the feeding point 5 is not in contact with the conductor 2, but is fed at the feeding point 5. Thus, the fed conductor 6 and the conductor 2 are electrostatically coupled to function as an antenna.

On the other hand, as shown in FIG. 1, the contact-type henna module 10 is different from the non-contact type henna modules 20 and 30 in that the conductor 2 constituting the henna has a portion that becomes a feeding point 5.

1 is provided with a substrate 1 and a conductor 2. The substrate 1 is a plate-like component on which the conductor 2 is formed. The material of the substrate 1 is, for example, Frame Returnant Type 4 (FR-4), the thickness is 1 mm, the relative dielectric constant is 4.3 at a frequency of 1 GHz, and the dielectric loss tangent is 0.016. However, the substrate 1 is not limited to this, and other types of substrates may be used.

The conductor 2 is a conductor formed on the first surface of the substrate 1. For example, a copper foil having a thickness of 35 μm is used as the conductor 2. However, the conductor 2 is not limited to this.

As shown in FIG. 1, the conductor 2 has a rectangular loop shape. In addition, a protruding portion 3 is formed on a part of one long side of the rectangular loop-shaped conductor 2 so as to protrude toward the inside and the outside of the rectangular loop from the other part of the long side.

An electronic component c such as a wireless module is mounted on the back surface (second surface) of the first surface where the protruding portion 3 is formed. In this case, each power supply pin of the wireless module is connected to the power supply points 4 and 5, and power is supplied to the conductor 2.

As the electronic component c, in addition to the wireless module, an LED (Light Emitting Diode) or a tact switch may be mounted.

2 and FIG. 3, the non-contact type henna module 20, 30 includes a substrate 1 and conductors 2, 6. The substrate 1 is a plate-like component on which the conductors 2 and 6 are formed. The material of the substrate 1 is, for example, Frame Regentant Type 4 (FR-4), the thickness is 1 mm, the relative dielectric constant is 4.3, and the dielectric loss tangent is 0.0016, similar to the contact type henna module 10. . However, the substrate 1 is not limited to this, and other types of substrates may be used.

Conductors 2 and 6 are conductors formed on the first surface of the substrate 1. For example, a copper foil having a thickness of 35 μm is used as the conductors 2 and 6. However, the conductors 2 and 6 are not limited to this.

2 and 3, the conductor 2 has a rectangular loop shape. A concave portion 8 is formed in the conductor 2 at a position facing a protruding portion 3 described later.

Also, as shown in FIGS. 2 and 3, the shape of the conductor 6 is rectangular. One end of the conductor 6 enters the recess 8, and the other end enters a later-described recess 7.

Here, the conductor 6 is formed on the first surface of the substrate 1 without being physically connected to the conductor 2, and is electrostatically coupled to the conductor 2 by being fed at a feeding point 5 described later. . Note that the gap between the conductor 2 and the conductor 6 in the recess 7 is made larger than the gap between the conductor 2 and the conductor 6 in the recess 8.

Further, the non-contact type henna module 20, 30 has a protruding portion 3 formed thereon.

Specifically, in the non-contact type henna module 20 shown in FIG. 2, a part of one long side of the rectangular loop-shaped conductor 2 is directed to the inside and the outside of the rectangular loop rather than the other part of the long side. A protruding portion 3 is formed.

Further, in the non-contact type henna module 30 shown in FIG. 3, a protruding portion that protrudes toward the inside of the rectangular loop at a part of one long side of the conductor 2 in the rectangular loop shape than the other part of the long side. 3 is formed.

An electronic component c such as a wireless module is mounted on the back surface (second surface) of the first surface where the protruding portion 3 is formed. In this case, each power supply pin of the wireless module is connected to the power supply points 4 and 5, and power is supplied to the conductor 2.

In addition to the wireless module, an LED, a tact switch, or the like may be mounted as the electronic component c.

Further, in the protruding portion 3, a recess 7 is formed in a portion protruding inside the rectangular loop. As described above, the end of the conductor 6 enters the recess 7.

Next, the difference in directivity between the contact-type henna module 10 and the non-contact type henna module 20, 30 will be described. FIG. 4A is a diagram illustrating vertical plane directivity at a frequency of 2.4 GHz. FIG. 4B is a diagram illustrating horizontal plane directivity at a frequency of 2.4 GHz. 4A and 4B show the results when power is supplied to the feeding points 4 and 5 with a coaxial cable.

Here, the vertical plane directivity is a characteristic indicating the relationship between the radiation direction and the radiation intensity in the vertical plane when the long side of the rectangular loop conductor 2 shown in FIGS. 1 to 3 is placed vertically. . Here, in FIGS. 1 to 3, the radiation angle is set to be 0 ° in the front direction of the paper, 90 ° in the right direction, 180 ° in the depth direction of the paper, and 270 ° in the left direction.

The horizontal plane directivity is a characteristic indicating the relationship between the radiation direction and the radiation intensity in the horizontal plane when the long side of the rectangular loop conductor 2 is placed vertically. Here, in FIGS. 1 to 3, the radiation angle is set so that the front side of the paper is 0 °, the upward direction is 90 °, the depth direction of the paper is 180 °, and the downward direction is 270 °.

As shown in FIG. 4A, the radiant intensity of the non-contact type henna module 20, 30 is larger than that in the vicinity of the 90 ° and 270 ° directions and the distortion is smaller than that of the contact type henna module 10. Yes.

Further, as shown in FIG. 4B, the radiation intensity of the non-contact type henna module 20, 30 is larger in the vicinity of the 0 ° direction and in the vicinity of the 180 ° direction than the contact type henna module 10, and the distortion is also large. It is suppressed.

As described above, according to the non-contact henna modules 20 and 30 according to the present embodiment, the conductor 6 having the feeding point 5 and the conductor 2 are brought into non-contact with each other so as to overlap the region where the wireless module is mounted. Even when a part of the pattern antenna is arranged, it is possible to realize directivity without distortion in a specific range.

Further, when the non-contact type henna module 20 or 30 having such a shape is used, it can be observed that the leakage current is reduced, so that an inductor for suppressing the leakage current becomes unnecessary. As a result, it is possible to reduce the leakage current countermeasure components compared to the case where the inductor is provided, and to suppress a voltage drop due to the resistance component of the components that prevent the leakage current.

Note that the present invention is not limited to the above-described embodiment, and various modifications can be made.

For example, in the above-described embodiment, the shapes of the non-contact henna modules 20 and 30 are not limited to the shapes shown in FIGS. For example, it may have a shape in which one or more loops are added on both sides like a conductor 9 shown in FIG.

In addition, the electronic component c is mounted on the back surface (second surface) of the first surface of the substrate 1 on which the protruding portion 3 is formed, but the first of the substrate 1 on which the protruding portion 3 is formed. It is good also as mounting on the surface side.

The present invention can be used for an antenna module including a substrate on which electronic components are mounted.

DESCRIPTION OF SYMBOLS 1 Board | substrate 2,6,9 Conductor 3 Protruding part 4,5 Feeding point 7,8 Concave part 10 Contact type henna module 20, 30 Non-contact type henna module c Electronic component

Claims (4)

A substrate,
A rectangular loop-shaped first conductor formed on one surface of the substrate;
A rectangular second conductor formed on the surface of the substrate on the same side as the first conductor without being short-circuited with the first conductor and electrostatically coupled to the first conductor by being supplied with power; , And
A protruding portion that protrudes toward at least the inside of the rectangular loop from the other portion of the long side is formed in a part of one long side of the first conductor,
A first concave portion and a second concave portion are respectively formed on a part of the other long side of the first conductor facing the protruding portion and the protruding portion,
One end of the second conductor enters the inside of the first recess, and the other end of the second conductor enters the inside of the second recess,
Antenna module. The antenna module according to claim 1, wherein the protruding portion protrudes toward the inside and the outside of the rectangular loop. The antenna module according to claim 1, wherein an electronic component is mounted in a region corresponding to the protruding portion on one surface of the substrate. The antenna module according to claim 3, wherein the electronic component is mounted in a region corresponding to the protruding portion on the back surface of one surface of the substrate.

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