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WO2016036790A3 - Pattern edge placement predictor and monitor for lithographic exposure tool - Google Patents

Pattern edge placement predictor and monitor for lithographic exposure tool Download PDF

Info

Publication number
WO2016036790A3
WO2016036790A3 PCT/US2015/048037 US2015048037W WO2016036790A3 WO 2016036790 A3 WO2016036790 A3 WO 2016036790A3 US 2015048037 W US2015048037 W US 2015048037W WO 2016036790 A3 WO2016036790 A3 WO 2016036790A3
Authority
WO
WIPO (PCT)
Prior art keywords
image
exposure
field
maps
factors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2015/048037
Other languages
French (fr)
Other versions
WO2016036790A2 (en
Inventor
Jacek K. TYMINSKI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Nippon Kogaku KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp, Nippon Kogaku KK filed Critical Nikon Corp
Priority to US15/014,677 priority Critical patent/US10018922B2/en
Publication of WO2016036790A2 publication Critical patent/WO2016036790A2/en
Publication of WO2016036790A3 publication Critical patent/WO2016036790A3/en
Anticipated expiration legal-status Critical
Priority to US16/014,399 priority patent/US10345715B2/en
Priority to US16/417,210 priority patent/US10488763B2/en
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

Method and system for predicting and monitoring locations of edges of an image of the reticle pattern on the wafer in a lithographic exposure process based on factors affecting optical imaging and factors affecting image placement of the exposure field of the scanner. Optical imaging factors are defined based on relationships between defocus of image formation, exposure dose, critical dimensions, and image shift values. Image placement factors are defined based on field overlay capability of the system. The method includes at least one exposure run to determine operational characteristics of the scanner, creating of defocus and dose maps and image field overlay maps, resulting in formation of intra- field and across wafer pattern edge placement maps.
PCT/US2015/048037 2014-09-02 2015-09-02 Pattern edge placement predictor and monitor for lithographic exposure tool Ceased WO2016036790A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US15/014,677 US10018922B2 (en) 2014-09-02 2016-02-03 Tuning of optical projection system to optimize image-edge placement
US16/014,399 US10345715B2 (en) 2014-09-02 2018-06-21 Pattern-edge placement predictor and monitor for lithographic exposure tool
US16/417,210 US10488763B2 (en) 2014-09-02 2019-05-20 Pattern-edge placement predictor and monitor for lithographic exposure tool

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201462044777P 2014-09-02 2014-09-02
US62/044,777 2014-09-02

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US15/014,677 Continuation-In-Part US10018922B2 (en) 2014-09-02 2016-02-03 Tuning of optical projection system to optimize image-edge placement

Publications (2)

Publication Number Publication Date
WO2016036790A2 WO2016036790A2 (en) 2016-03-10
WO2016036790A3 true WO2016036790A3 (en) 2016-06-02

Family

ID=55440484

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2015/048037 Ceased WO2016036790A2 (en) 2014-09-02 2015-09-02 Pattern edge placement predictor and monitor for lithographic exposure tool

Country Status (1)

Country Link
WO (1) WO2016036790A2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080013089A1 (en) * 2004-08-31 2008-01-17 Nikon Corporation Positioning method, processing system, measurement method of substrate loading repeatability, position measurement method, exposure method, substrate processing apparatus, measurement method, and measurement apparatus
US20120331427A1 (en) * 2011-06-23 2012-12-27 Nikon Precision Inc. In-situ scanner exposure monitor
US20140233025A1 (en) * 2004-08-16 2014-08-21 Asml Netherlands B.V. Method and Apparatus for Angular-Resolved Spectroscopic Lithography Characterization

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140233025A1 (en) * 2004-08-16 2014-08-21 Asml Netherlands B.V. Method and Apparatus for Angular-Resolved Spectroscopic Lithography Characterization
US20080013089A1 (en) * 2004-08-31 2008-01-17 Nikon Corporation Positioning method, processing system, measurement method of substrate loading repeatability, position measurement method, exposure method, substrate processing apparatus, measurement method, and measurement apparatus
US20120331427A1 (en) * 2011-06-23 2012-12-27 Nikon Precision Inc. In-situ scanner exposure monitor
US20130339910A1 (en) * 2011-06-23 2013-12-19 Nikon Precision Inc. In-situ scanner exposure monitor

Also Published As

Publication number Publication date
WO2016036790A2 (en) 2016-03-10

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