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WO2016031999A1 - Composant électronique en couches - Google Patents

Composant électronique en couches Download PDF

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Publication number
WO2016031999A1
WO2016031999A1 PCT/JP2015/074609 JP2015074609W WO2016031999A1 WO 2016031999 A1 WO2016031999 A1 WO 2016031999A1 JP 2015074609 W JP2015074609 W JP 2015074609W WO 2016031999 A1 WO2016031999 A1 WO 2016031999A1
Authority
WO
WIPO (PCT)
Prior art keywords
magnetic
electronic component
coil
metal magnetic
conductor pattern
Prior art date
Application number
PCT/JP2015/074609
Other languages
English (en)
Japanese (ja)
Inventor
小林　武士
野口　裕
山本　誠
Original Assignee
東光株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東光株式会社 filed Critical 東光株式会社
Publication of WO2016031999A1 publication Critical patent/WO2016031999A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/04—Fixed inductances of the signal type with magnetic core

Definitions

  • a metal magnetic layer formed using metal magnetic particles and a conductor pattern are laminated, a conductor pattern between metal magnetic layers is spirally connected, and a coil is formed in the laminate, thereby forming a power inductor.
  • the present invention relates to a multilayer electronic component used.
  • a multilayer inductor used as an inductor or transformer for a power circuit or a DC / DC converter circuit through which a large current flows is laminated with an insulator layer and a conductor pattern, and the conductor pattern between the insulator layers is spirally connected. Some laminates are formed with a coil that wraps around in the stacking direction.
  • multilayer inductors used as this type of power inductor are required to be reduced in size and thickness as mobile devices are reduced in size and performance. Further, as the voltage of the device is lowered, it is desired to have a further large DC superposition allowable current value and low loss. Under such circumstances, the conventional multilayer inductor is generally formed of ferrite, and the maximum magnetic flux density is as low as about 0.4 T.
  • the DC superimposition characteristics are mainly determined by the material and structure used for the laminate, there are two methods for improving the DC superimposition characteristics: a method of forming the laminate with a material having a high maximum magnetic flux density and a magnetic structure of the laminate. There is a method to make a structure that is not easily saturated.
  • the position of the magnetic gap is devised (for example, refer to Japanese Patent Application Laid-Open Nos. 2004-14549 and 2001-44037), or a Zn—Cu ferrite (for example, Japanese Patent Application Laid-Open No. 2-165607, JP-A-2006-261577, and JP-A-2005-45108) and glass ceramics (see, for example, JP-A-2009-44030 and JP-A-2008-16619). ) And ZnCuTiO 4 ceramics (for example, see JP 2013-249246 A).
  • a conventional multilayer electronic component in which a multilayer body is formed of a metal magnetic body is composed of an internal conductor formation region and upper and lower cover regions, and the particle diameter of the metal magnetic body is different between the internal conductor formation region and the cover region.
  • a laminated body is formed by laminating an inner conductor forming layer composed of an inner conductor and a surrounding reverse pattern portion and a magnetic layer, and having a reverse pattern.
  • an inner conductor forming layer composed of an inner conductor and a surrounding reverse pattern portion and a magnetic layer, and having a reverse pattern.
  • the particle diameter of the metal magnetic material is different between the portion and the magnetic material layer (see, for example, JP-A-2013-55316).
  • such a conventional multilayer electronic component can reduce the distance between the inner conductors by simply reducing the particle diameter of the metal magnetic body between the inner conductors to form a densely wound coil. Or by simply forming an inductance value such as increasing the magnetic permeability by forming layers with large particle diameters of metal magnetic material above and below the coil with a simple structure, and controlling the magnetic flux. There was nothing to alleviate magnetic saturation or reduce inductor loss.
  • the inductor loss is determined mainly by the material and structure used for the multilayer body, as well as the DC superposition characteristics.
  • the structure in the multilayer body is devised as shown in FIG.
  • a multilayer body 51 is formed by laminating an insulator layer and conductor patterns 52A to 52E, and a conductor pattern 52A is formed.
  • nonmagnetic layers 53A to 53D are formed between ⁇ 52E to weaken the magnetic coupling between the turns, thereby strengthening the magnetic coupling in the entire coil.
  • such a conventional multilayer electronic component has a problem that when the multilayer body is formed of ferrite, magnetic saturation is easily caused when a large current is input, the loss of the inductor increases, and the characteristics deteriorate. .
  • the particle diameter capable of obtaining sufficient magnetic properties is at least 3 ⁇ m, which is larger than ferrite.
  • the thickness between conductor patterns becomes thick, a dense winding structure cannot be formed, and the winding length Becomes longer. Therefore, the conventional multilayer electronic component has a problem that it is difficult to secure characteristics with a limited volume.
  • An object of one or more embodiments of the present invention is to provide a multilayer electronic component that can achieve both high DC superposition characteristics and low loss even when the multilayer body is formed of a metal magnetic body. To do.
  • a metal magnetic layer formed using metal magnetic particles and a conductor pattern are laminated, and the conductor pattern between the metal magnetic layers is spirally connected to form a laminate.
  • the non-magnetic body portion is formed in the multilayer body.
  • a metal magnetic layer formed using metal magnetic particles and a conductor pattern are laminated, and the conductor pattern between the metal magnetic layers is spirally connected to form a laminate. Since the coil is formed and the non-magnetic part is formed in the laminated body, it is possible to achieve both high DC superposition characteristics and low loss.
  • 1 is a cross-sectional view showing a first embodiment of a multilayer electronic component of the present invention.
  • 1 is an exploded perspective view of a multilayer electronic component according to a first embodiment of the present invention. It is sectional drawing which shows 2nd Embodiment of the multilayer electronic component of this invention. It is a characteristic view of the multilayer electronic component of the present invention. It is sectional drawing which shows the conventional multilayer electronic component.
  • a metal magnetic layer formed using metal magnetic particles containing at least iron and silicon, and a conductor pattern are laminated, and a conductor pattern between the metal magnetic layers is formed.
  • a coil is formed in the laminated body in a spiral connection.
  • a nonmagnetic part is provided in a part of the magnetic path of the coil. Therefore, according to one or more embodiments of the present invention, the magnetic flux generated by the coil can be controlled by the non-magnetic portion, and the laminated body can be hardly magnetically saturated.
  • FIG. 1 is a cross-sectional view showing a first embodiment of a multilayer electronic component according to the present invention.
  • 11 is a laminate
  • 12A to 12E are conductor patterns
  • 13A to 13D are nonmagnetic parts.
  • the laminate 11 is formed by laminating a metal magnetic layer and a conductor pattern.
  • the metal magnetic layer is more oxidized than metal magnetic alloy powder containing iron and silicon, metal magnetic alloy powder containing iron, silicon and chromium, iron, silicon and iron. It is formed using metal magnetic particles such as powder of a metal magnetic alloy containing an easy element.
  • the coil conductor patterns 12A to 12E are formed using a conductor paste obtained by pasting a metal material such as silver, silver-based, gold, gold-based, copper, or copper-based.
  • a coil is formed in the laminate 11 by connecting the coil conductor patterns 12A to 12E between the metal magnetic layers in a spiral.
  • a nonmagnetic portion 13A is provided between the coil conductor pattern 12A and the coil conductor pattern 12B, and a nonmagnetic portion 13B is provided between the coil conductor pattern 12B and the coil conductor pattern 12C.
  • a nonmagnetic body portion 13C is formed between the conductor patterns 12D, and a nonmagnetic body portion 13D is formed between the coil conductor pattern 12D and the coil conductor pattern 12E.
  • the nonmagnetic parts 13A to 13D are formed using a nonmagnetic material such as glass, glass ceramics, or a mixture of glass and alumina. Further, the nonmagnetic parts 13A, 13C, and 13D are formed along the shape of the coil conductor pattern between the upper and lower coil conductor patterns. Furthermore, the non-magnetic body portion 13B is formed on the entire inner portion of the coil conductor pattern so as to cross the winding axis portion of the coil. Then, external terminals 14A and 14B are formed on both end faces of the laminate 11, and a coil is connected between the external terminal 14A and the external terminal 14B.
  • a nonmagnetic material such as glass, glass ceramics, or a mixture of glass and alumina.
  • the nonmagnetic parts 13A, 13C, and 13D are formed along the shape of the coil conductor pattern between the upper and lower coil conductor patterns. Furthermore, the non-magnetic body portion 13B is formed on the entire inner portion of the coil conductor pattern so as to cross the
  • the metal magnetic layers 11A to 11M, the conductor patterns 12A to 12E, and the nonmagnetic portions 13A to 13D are stacked, and the conductor patterns 12A to 12E are spirally formed.
  • a laminated body 11 in which coils and nonmagnetic parts 13A to 13D are formed is formed.
  • 2 indicates a conductor for connecting the upper and lower conductor patterns.
  • FIG. 3 is a cross-sectional view showing a second embodiment of the multilayer electronic component of the present invention.
  • 31 is a laminate
  • 32A to 32E are conductor patterns
  • 33A to 33D are non-magnetic parts.
  • the multilayer body 31 is formed by laminating a metal magnetic layer and conductor patterns 32A to 32E.
  • the metal magnetic layer is more oxidized than metal magnetic alloy powder containing iron and silicon, metal magnetic alloy powder containing iron, silicon and chromium, iron, silicon and iron. It is formed using metal magnetic particles such as powder of a metal magnetic alloy containing an easy element.
  • the coil conductor patterns 32A to 32E are formed using a conductor paste obtained by pasting a metal material such as silver, silver-based, gold, gold-based, copper, or copper-based.
  • a coil is formed in the laminate 31 by connecting the coil conductor patterns 32A to 32E between the metal magnetic layers in a spiral.
  • a non-magnetic part 33A is provided between the coil conductor pattern 32A and the coil conductor pattern 32B, and a non-magnetic part 33B is provided between the coil conductor pattern 32B and the coil conductor pattern 32C.
  • a nonmagnetic body portion 33C is formed between the conductor patterns 32D, and a nonmagnetic body portion 33D is formed between the coil conductor pattern 32D and the coil conductor pattern 32E.
  • the nonmagnetic parts 33A to 33D are formed using a nonmagnetic material such as glass, glass ceramics, or a mixture of glass and alumina. Further, the nonmagnetic parts 33A, 33C, 33D are formed along the shape of the coil conductor pattern between the upper and lower coil conductor patterns. Further, the non-magnetic body portion 33 ⁇ / b> B is formed so as to cross the winding shaft portion of the coil and to be exposed at both end faces of the multilayer body 31. External terminals 34A and 34B are formed on both end surfaces of the laminate 31, and a coil is connected between the external terminal 34A and the external terminal 34B.
  • a nonmagnetic material such as glass, glass ceramics, or a mixture of glass and alumina.
  • the nonmagnetic parts 33A, 33C, 33D are formed along the shape of the coil conductor pattern between the upper and lower coil conductor patterns.
  • the non-magnetic body portion 33 ⁇ / b> B is formed so as to cross the winding shaft
  • the metal magnetic layer is formed of a powder of a metal magnetic alloy containing iron and silicon
  • the non-magnetic member is formed of glass ceramic
  • the initial inductance value is 1 ⁇ H.
  • the inductance value obtained by the direct current flowing through the coil is measured, and the same structure as that of the conventional multilayer electronic component shown in FIG.
  • the horizontal axis indicates the direct current
  • the vertical axis indicates the inductance value.
  • the characteristic 41 shown in the first embodiment and the characteristic 42 shown in the second embodiment both have an inductance value that is greater than the characteristic 43 of the conventional multilayer electronic component shown in FIG. 4 as the direct current increases.
  • the DC resistance value is 165 m ⁇ for the conventional multilayer electronic component, whereas it is 175 m ⁇ for the multilayer electronic component of the present invention.
  • the DC current value when the inductance value is reduced by 30% is the same as the conventional multilayer electronic component.
  • the multilayer electronic component of the present invention was 1.9 A while the electronic component was 1.6 A. This is because the magnetic flux passing through the winding portion of the coil pattern is controlled by the non-magnetic body portion located at the winding portion of the coil pattern, despite the high permeability of the laminate and the large inductance value. It was possible to suppress the magnetic saturation of the metal magnetic material present in the winding part of the coil pattern. In addition, the loss of the inductor can be reduced by the non-magnetic portion located between the coil patterns.
  • the metal magnetic layer is formed by adding glass to metal magnetic particles, a metal magnetic alloy powder containing iron and silicon, or a metal magnetic alloy powder containing iron, silicon, and chromium. Further, an element that is more easily oxidized than iron may be added. At this time, a plurality of elements that are more easily oxidized than glass or iron may be added. Further, the thickness, position, and number of the non-magnetic parts can be changed according to the characteristics.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)

Abstract

　Des corps multicouches formés à partir de ferrite assument facilement une saturation magnétique lorsqu'un fort courant est entré. De plus, une bobine d'inductance est gravement endommagée, et les caractéristiques se dégradent. Lorsqu'un corps multicouche est formé d'un matériau métallique magnétique, des structures d'enroulement dense sont impossibles à former. Même si le corps multicouche est formé en faisant appel à un matériau métallique magnétique, il lui est par conséquent difficile de garantir des caractéristiques avec son volume limité. Selon la présente invention, des couches de matériau métallique magnétique formées au moyen de particules de matériau métallique magnétique sont disposées en couches en faisant appel à un motif conducteur, et le motif conducteur est connecté en spirale entre les couches de matériau métallique magnétique pour former une bobine à l'intérieur du corps multicouche. Une section de matériau non magnétique est formée à l'intérieur du corps multicouche.
PCT/JP2015/074609 2014-08-29 2015-08-31 Composant électronique en couches WO2016031999A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014175059A JP6233246B2 (ja) 2014-08-29 2014-08-29 積層型電子部品
JP2014-175059 2014-08-29

Publications (1)

Publication Number Publication Date
WO2016031999A1 true WO2016031999A1 (fr) 2016-03-03

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PCT/JP2015/074609 WO2016031999A1 (fr) 2014-08-29 2015-08-31 Composant électronique en couches

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JP (1) JP6233246B2 (fr)
WO (1) WO2016031999A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180218822A1 (en) * 2017-01-27 2018-08-02 Murata Manufacturing Co., Ltd. Layered electronic component

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7553220B2 (ja) * 2018-03-20 2024-09-18 太陽誘電株式会社 コイル部品及び電子機器
JP2020061410A (ja) 2018-10-05 2020-04-16 株式会社村田製作所 積層型電子部品
JP6919641B2 (ja) 2018-10-05 2021-08-18 株式会社村田製作所 積層型電子部品
JP7235026B2 (ja) 2020-11-05 2023-03-08 株式会社村田製作所 インダクタ部品、ｄｃｄｃコンバータ及びインダクタ部品の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005045108A (ja) * 2003-07-24 2005-02-17 Fdk Corp 磁心型積層インダクタ
JP2013105807A (ja) * 2011-11-11 2013-05-30 Panasonic Corp 積層インダクタ
WO2014061670A1 (fr) * 2012-10-19 2014-04-24 株式会社村田製作所 Dispositif de bobine stratifiée et son procédé de fabrication

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005045108A (ja) * 2003-07-24 2005-02-17 Fdk Corp 磁心型積層インダクタ
JP2013105807A (ja) * 2011-11-11 2013-05-30 Panasonic Corp 積層インダクタ
WO2014061670A1 (fr) * 2012-10-19 2014-04-24 株式会社村田製作所 Dispositif de bobine stratifiée et son procédé de fabrication

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180218822A1 (en) * 2017-01-27 2018-08-02 Murata Manufacturing Co., Ltd. Layered electronic component
US11551844B2 (en) * 2017-01-27 2023-01-10 Murata Manufacturing Co., Ltd. Layered electronic component

Also Published As

Publication number Publication date
JP2016051752A (ja) 2016-04-11
JP6233246B2 (ja) 2017-11-22

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