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WO2016027601A1 - Élément de support de semi-conducteur et élément de fixation de semi-conducteur - Google Patents

Élément de support de semi-conducteur et élément de fixation de semi-conducteur Download PDF

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Publication number
WO2016027601A1
WO2016027601A1 PCT/JP2015/070531 JP2015070531W WO2016027601A1 WO 2016027601 A1 WO2016027601 A1 WO 2016027601A1 JP 2015070531 W JP2015070531 W JP 2015070531W WO 2016027601 A1 WO2016027601 A1 WO 2016027601A1
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor
mounting member
carbon nanotube
fibrous columnar
carbon nanotubes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2015/070531
Other languages
English (en)
Japanese (ja)
Inventor
前野　洋平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of WO2016027601A1 publication Critical patent/WO2016027601A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00—Carbon; Compounds thereof
    • C01B32/05—Preparation or purification of carbon not covered by groups C01B32/15, C01B32/20, C01B32/25, C01B32/30
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Definitions

  • the conventional semiconductor mounting member having a strong gripping force has a problem that contaminants tend to adhere and remain on the semiconductor side when the semiconductor is peeled off from the semiconductor mounting member after transport.
  • At least a portion including the tip of the fibrous columnar material is covered with an inorganic material.
  • the gripping power is expressed when the content ratio of the fibrous columnar body in which at least the portion including the tip is covered with the inorganic material is within the above range.
  • any appropriate material can be adopted as the material for the fibrous columnar material.
  • examples thereof include metals such as aluminum and iron; inorganic materials such as silicon; carbon materials such as carbon nanofibers and carbon nanotubes (CNT); and high modulus resins such as engineering plastics and super engineering plastics.
  • the resin include polystyrene, polyethylene, polypropylene, polyethylene terephthalate, acetyl cellulose, polycarbonate, polyimide, polyamide, and the like.
  • Any appropriate physical properties can be adopted as the physical properties such as the molecular weight of the resin as long as the object of the present invention can be achieved.
  • the shape of the carbon nanotube it is sufficient that its cross section has any appropriate shape.
  • the cross section may be substantially circular, elliptical, n-gonal (n is an integer of 3 or more), and the like.
  • the thickness of the catalyst layer that can be used in the production of the carbon nanotube aggregate is preferably 0.01 nm to 20 nm, more preferably 0.1 nm to 10 nm in order to form fine particles.
  • the formed carbon nanotubes can have both excellent mechanical properties and a high specific surface area. It can be a carbon nanotube aggregate exhibiting excellent adhesive properties. Therefore, the semiconductor transport member having such an aggregate of carbon nanotubes can be a semiconductor transport member having a semiconductor mounting member that can express a stronger grip force and hardly cause contaminants to adhere and remain on the semiconductor side.
  • Arbitrary appropriate temperature can be employ
  • the temperature is preferably 400 ° C to 1000 ° C, more preferably 500 ° C to 900 ° C, and further preferably 600 ° C to 800 ° C. .
  • Example 3 A carbon nanotube aggregate (3) in which the carbon nanotubes were oriented in the length direction was obtained in the same manner as in Example 1, except that the standing time was changed to 30 minutes.
  • the length of the carbon nanotube with which the carbon nanotube aggregate (3) is provided was 600 ⁇ m.
  • the mode value was present in two layers, and the relative frequency was 75%. It carried out similarly to Example 1 and obtained the semiconductor mounting member (3) and the semiconductor conveyance member (3A).

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Nanotechnology (AREA)
  • Inorganic Chemistry (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Carbon And Carbon Compounds (AREA)

Abstract

L'invention concerne un élément de support de semi-conducteur pourvu d'un élément de fixation de semi-conducteur apte à exercer une grande force de serrage et permettant difficilement à des contaminants de se fixer et de rester du côté du semi-conducteur. En outre, l'invention concerne un élément de fixation de semi-conducteur apte à exercer une grande force de serrage et permettant difficilement à des contaminants de se fixer et de rester du côté du semi-conducteur. L'élément de support de semi-conducteur selon la présente invention comporte un substrat de support et un élément de fixation de semi-conducteur, l'élément de fixation de semi-conducteur comprenant une structure colonnaire fibreuse et la structure colonnaire fibreuse étant pourvue d'une pluralité d'objets colonnaires fibreux. Les objets colonnaires fibreux sont orientés dans une direction sensiblement verticale par rapport au substrat de support, et la surface de la structure colonnaire fibreuse du côté opposé au substrat de support présente un coefficient de frottement statique supérieur ou égal à 2,0 vis-à-vis d'une surface spéculaire d'une tranche de silicium.
PCT/JP2015/070531 2014-08-21 2015-07-17 Élément de support de semi-conducteur et élément de fixation de semi-conducteur Ceased WO2016027601A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014168244 2014-08-21
JP2014-168244 2014-08-21

Publications (1)

Publication Number Publication Date
WO2016027601A1 true WO2016027601A1 (fr) 2016-02-25

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2015/070531 Ceased WO2016027601A1 (fr) 2014-08-21 2015-07-17 Élément de support de semi-conducteur et élément de fixation de semi-conducteur

Country Status (1)

Country Link
WO (1) WO2016027601A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017126696A (ja) * 2016-01-15 2017-07-20 日東電工株式会社 載置部材

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011077785A1 (fr) * 2009-12-25 2011-06-30 日東電工株式会社 Structure composite de nanotubes de carbone et element adhesif
JP2012162437A (ja) * 2011-02-09 2012-08-30 Nitto Denko Corp 繊維状柱状構造体集合体および放熱部材
WO2013090898A1 (fr) * 2011-12-16 2013-06-20 Brooks Automation, Inc. Appareil de transport
JP2013248661A (ja) * 2012-06-04 2013-12-12 Nitto Denko Corp 接合部材および接合方法
JP2014098107A (ja) * 2012-11-15 2014-05-29 Nitto Denko Corp 宇宙空間で用いる把持材料

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011077785A1 (fr) * 2009-12-25 2011-06-30 日東電工株式会社 Structure composite de nanotubes de carbone et element adhesif
JP2012162437A (ja) * 2011-02-09 2012-08-30 Nitto Denko Corp 繊維状柱状構造体集合体および放熱部材
WO2013090898A1 (fr) * 2011-12-16 2013-06-20 Brooks Automation, Inc. Appareil de transport
JP2013248661A (ja) * 2012-06-04 2013-12-12 Nitto Denko Corp 接合部材および接合方法
JP2014098107A (ja) * 2012-11-15 2014-05-29 Nitto Denko Corp 宇宙空間で用いる把持材料

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
HIROKI NAKANISHI ET AL.: "Capture System for Space Plane-Structure with High Friction Material", JAPAN SOCIETY OF MECHANICAL ENGINEERS CONFERENCE ON ROBOTICS AND MECHATRONICS 2013 KOEN RONBUNSHU, 21 May 2013 (2013-05-21), pages 1 - 4 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017126696A (ja) * 2016-01-15 2017-07-20 日東電工株式会社 載置部材
US10777446B2 (en) 2016-01-15 2020-09-15 Nitto Denko Corporation Mounting member

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