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WO2016013072A1 - Radiateur - Google Patents

Radiateur Download PDF

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Publication number
WO2016013072A1
WO2016013072A1 PCT/JP2014/069462 JP2014069462W WO2016013072A1 WO 2016013072 A1 WO2016013072 A1 WO 2016013072A1 JP 2014069462 W JP2014069462 W JP 2014069462W WO 2016013072 A1 WO2016013072 A1 WO 2016013072A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
heat pipe
transfer plate
bulging
heat transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2014/069462
Other languages
English (en)
Japanese (ja)
Inventor
拓海 中村
樋野　治道
哲伸 奥野
耀▲恵▼ ▲頼▼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Light Metal Co Ltd
Tai Sol Electronics Co Ltd
Original Assignee
Nippon Light Metal Co Ltd
Tai Sol Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Light Metal Co Ltd, Tai Sol Electronics Co Ltd filed Critical Nippon Light Metal Co Ltd
Priority to PCT/JP2014/069462 priority Critical patent/WO2016013072A1/fr
Priority to TW104123646A priority patent/TW201616079A/zh
Publication of WO2016013072A1 publication Critical patent/WO2016013072A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a radiator using a heat pipe.
  • Patent Document 1 discloses a technique in which one end of a heat pipe is flattened to increase the contact area between the heat transfer plate and the heat pipe.
  • the length of the heat pipe is increased to increase the embedded length in the heat transfer plate, and a configuration in which the heat pipe is bent in an L shape or a U shape and embedded in the heat transfer plate.
  • an object of the present invention is to provide a radiator that can suppress an increase in the thickness of a heat transfer plate and an increase in installation space.
  • the invention according to claim 1 for solving the above-mentioned problems includes a heat pipe, a heat transfer plate provided at one end of the heat pipe, and a heat dissipating fin provided at the other end of the heat pipe.
  • the heat pipe includes a straight portion and a bulge portion provided at one end of the straight portion, and the bulge portion is embedded in the heat transfer plate. It is a radiator.
  • the contact area between the heat pipe and the heat transfer plate can be increased without increasing the thickness dimension of the heat transfer plate. Can be increased. That is, according to the radiator of the present invention, it is possible to improve the heat dissipation performance while suppressing an increase in the thickness of the heat transfer plate and an increase in installation space.
  • the bulging portion has a disk shape that extends along a plane that intersects the axial direction of the linear portion. According to such a configuration, an increase in the thickness dimension of the heat transfer plate can be suppressed.
  • the heat transfer plate includes a substrate portion having a concave portion that accommodates the bulging portion and a lid portion that covers the bulging portion, and a through hole is formed in the bottom surface of the concave portion, It is preferable that the straight part is inserted through the through hole. According to such a structure, the bulging part of a heat pipe can be embedded in a heat exchanger plate with an easy process.
  • the lid portion is fixed to the substrate portion by friction stir welding. According to such a configuration, since the amount of heat generated during joining is small, deformation of the heat transfer plate and the heat pipe can be suppressed.
  • the radiator according to the present invention it is possible to suppress an increase in the thickness of the heat transfer plate and an increase in installation space while improving the heat dissipation performance.
  • the radiator 1 includes a heat pipe 10, a heat transfer plate 20, and a radiation fin 30.
  • the heat pipe 10 transports heat by the phase change of evaporation / condensation of the working liquid sealed in the sealed space inside.
  • the heat pipe 10 is made of a metal having high thermal conductivity such as copper.
  • the heat pipe 10 includes a straight portion 11 and a bulging portion 12 provided at one end of the straight portion 11.
  • the straight part 11 constitutes a condensing part in which the evaporated working liquid is condensed. That is, the linear part 11 is a part which performs heat output.
  • the straight portion 11 is connected to the upper portion of the bulging portion 12 and extends upward from the bulging portion 12.
  • the straight portion 11 has a cylindrical shape with the upper end closed.
  • the lower end of the straight part 11 is open and connected to the internal space of the bulging part 12.
  • the heat pipe 10 is used with the bulging portion 12 on the bottom and the straight portion 11 on the top.
  • the inner wall of the pipe is provided with a wire mesh (wick) or a fine groove (groove), and the inside has a capillary structure. Then, the heat pipe 10 can also be used in a sideways state.
  • the linear part 11 of this embodiment becomes a cylindrical shape of the same diameter from a lower end to an upper end, it is not limited to this, It becomes a two-stage cylindrical shape which the upper end part was restrict
  • the bulging portion 12 is located at the lower end of the heat pipe 10 and is embedded in the heat transfer plate 20.
  • the bulging part 12 constitutes an evaporation part in which the working liquid evaporates. That is, the bulging part 12 is a part which inputs heat.
  • the bulging portion 12 extends in a flat plate shape along a plane that intersects the axial direction of the linear portion 11 (in the present embodiment, a plane in which the axial direction of the linear portion 11 is the normal direction). In addition, the intersection angle of the bulging part 12 and the linear part 11 is not limited to a right angle.
  • the straight portion 11 may stand upright with respect to the bulging portion 12.
  • the bulging portion 12 has a cavity inside.
  • the outer shape of the bulging portion 12 has a disk shape.
  • the bulging portion 12 includes a main body portion 13 and a bottom plate portion 14.
  • the main body 13 has a cylindrical shape with a top plate 15 and is open downward.
  • the outer peripheral edge at the upper end of the main body 13 is chamfered. That is, the taper part 19a is formed in the intersection part of the upper surface and outer peripheral side surface of the top plate 15 (refer FIG. 5).
  • an inclined surface 19b whose diameter is reduced toward the upper side is formed at the peripheral edge portion (the intersection of the lower surface of the top plate 15 and the inner peripheral side surface) of the upper end of the internal cavity of the bulging portion 12 (see FIG. 5). ).
  • a through hole 16 is formed at the center of the top plate 15.
  • a cylindrical upright portion 17 rising upward is formed on the top surface of the top plate 15.
  • the inner peripheral surface of the rising portion 17 is continuously connected to the through hole 16, and the inner space portion of the rising portion 17 is communicated with the internal space of the bulging portion 12 through the through hole 16.
  • the inner diameter dimension of the upright portion 17 is equal to the outer diameter dimension of the linear portion 11.
  • a lower end portion of the linear portion 11 is fitted to the upright portion 17.
  • the straight line part 11 is fixed to the main body part 13 so that the inside and the outside of the main body part 13 are in an airtight state, for example, by welding or brazing.
  • An inclined portion 16 a that gradually increases in diameter downward is formed at the lower end portion of the through hole 16. This facilitates the flow of the working liquid vapor to the straight portion 11.
  • the bottom plate portion 14 covers the opening at the lower end of the main body portion 13.
  • the bottom plate portion 14 has a disk shape.
  • a chamfering process is performed on the peripheral edge at the lower end of the bottom plate portion 14. That is, the intersection of the bottom surface and the outer peripheral side surface of the bottom plate portion 14 has a tapered shape.
  • the outer diameter of the bottom plate portion 14 is larger than the inner diameter of the inner space of the heat transfer plate 20.
  • An enlarged diameter portion 18 having an inner diameter dimension equivalent to the outer diameter dimension of the bottom plate portion 14 is formed at the lower end portion of the main body portion 13.
  • the thickness dimension of the bottom plate portion 14 is slightly larger than the height dimension of the enlarged diameter portion 18.
  • the bottom plate portion 14 is fitted to the enlarged diameter portion 18 with the tapered portion slightly protruding downward.
  • the bottom plate part 14 is fixed to the main body part 13 so that the inside and the outside of the main body part 13 are in an airtight state, for example, by welding or brazing. Since the tapered portion of the bottom plate portion 14 slightly protrudes from the lower end of the main body portion 13, welding or brazing work is easy to perform.
  • the bulging portion 12 has a disk shape, but may have another shape such as a rectangular or polygonal plate shape in plan view.
  • the heat transfer plate 20 is a member that contacts a heat source (not shown) to be cooled and absorbs heat from the heat source.
  • a heat source contacts the lower surface of the heat transfer plate 20.
  • the heat transfer plate 20 is made of a lightweight and highly heat conductive metal such as an aluminum alloy.
  • the heat transfer plate 20 has a rectangular shape in plan view.
  • the heat transfer plate 20 of the present embodiment includes a substrate portion 21 and a lid portion 22.
  • the substrate portion 21 includes a recess 23 for accommodating the bulging portion 12.
  • the recess 23 is open downward.
  • the recess 23 has a circular cross section, and the inner diameter of the recess 23 is equal to the outer diameter of the bulging portion 12.
  • the depth dimension of the recess 23 is equivalent to the thickness dimension of the bulging portion 12.
  • An inclined portion 27 that abuts against the tapered portion 19 a of the bulging portion 12 is formed at the upper end of the inner peripheral edge of the recess 23.
  • the upper surface of the bulging portion 12 is in close contact with the bottom surface (upper surface) of the concave portion 23, and the outer peripheral surface of the bulging portion 12 is in close contact with the side surface of the concave portion 23.
  • the tapered portion 19 a of the bulging portion 12 is in close contact with the inclined portion 27 of the recess 23. Thereby, the adhesiveness of the recessed part 23 and the bulging part 12 is improved.
  • a through hole 24 reaching the upper surface of the heat transfer plate 20 is formed on the bottom surface (upper surface) of the recess 23.
  • the straight portion 11 is inserted through the through hole 24.
  • the through hole 24 has an inner diameter dimension equivalent to the outer diameter dimension of the rising portion 17 of the bulging portion 12.
  • the upright portion 17 is also inserted into the through hole 24.
  • an enlarged diameter recessed portion 25 into which the lid portion 22 is fitted is formed below the recessed portion 23.
  • the inner diameter dimension of the enlarged diameter concave portion 25 is equal to the outer diameter dimension of the lid portion 22, and the depth dimension of the enlarged diameter concave portion 25 is equal to the thickness dimension of the lid portion 22.
  • the lid portion 22 is fixed to the substrate portion 21 by friction stir welding. Specifically, while rotating a rotating tool (not shown), the rotating tool is moved along the abutting portion between the outer peripheral surface of the lid portion 22 and the inner peripheral surface of the enlarged-diameter concave portion 25, and is abutted by frictional heat between the rotating tool and the metal member.
  • the metal members are solid-phase bonded by causing the metal of the part to flow plastically.
  • the plasticized region 26 is formed along the abutting portion between the outer peripheral surface of the lid portion 22 and the inner peripheral surface of the enlarged diameter concave portion 25.
  • the plasticized region 26 is formed over the entire circumference of the outer peripheral portion of the lid portion 22, and at least the start end and the end end overlap (see (c) of FIG. 2).
  • heat pipes 10, 10 are attached to one heat transfer plate 20.
  • the centers of the four heat pipes 10 are located on the diagonal line of the heat transfer plate 20 and are arranged so as to form a rectangular vertex.
  • the number of heat pipes 10 is not limited to four, and may be smaller than four or larger than four. Further, the arrangement position of the heat pipe 10 is not limited to the above configuration.
  • the radiation fin 30 is attached to the straight part 11 of the heat pipe 10.
  • the radiating fins 30 are arranged along a plane whose normal direction is the axial direction of the straight portion 11.
  • a plurality of radiating fins 30 are formed at intervals in the axial direction of the linear portion 11.
  • a mounting hole 31 (see FIG. 1) through which the linear portion 11 passes is formed in the heat radiation fin 30.
  • the inner diameter dimension of the mounting hole 31 is the same as the outer diameter dimension of the linear portion 11, and the radiating fins 30 are in circumferential contact over the entire outer periphery of the linear portion 11.
  • the heat radiation fin 30 is fixed to the straight portion 11 by welding or brazing, for example.
  • Four mounting holes 31, 31,... Are formed in one radiating fin 30, and four heat pipes 10, 10,.
  • the heat pipe 10 is formed with the bulging portion 12 extending in a flat plate shape along a plane including an orthogonal line orthogonal to the axial direction of the linear portion 11 at one end portion of the heat pipe 10.
  • An increase in the thickness dimension of the hot plate 20 (the length of the linear portion 11 in the axial direction) can be suppressed.
  • the surface area of the bulging portion 12 can be efficiently increased as compared with a conventional one in which the heat pipe is simply bent (hereinafter referred to as “bent heat pipe”). That is, when trying to obtain the same surface area, the amount of increase in the length dimension in the plane direction may be smaller in the heat pipe 10 according to the present invention than in the bent heat pipe. Therefore, heat dissipation performance can be improved while suppressing an increase in the thickness of the heat transfer plate 30 and an increase in installation space.
  • the bulging portion 12 has a disk shape, and further, an inclined surface 19b is formed at the peripheral edge of the upper end of the internal cavity of the bulging portion 12, so that the action generated in the bulging portion 12 is achieved.
  • the liquid vapor easily flows to the straight portion 11. That is, since the peripheral edge of the internal cavity of the bulging portion 12 is annular, it does not stop and the steam is guided to the inner straight portion 11 by the inclined surface 19b.
  • the surface area of the bulging portion 12 can be increased efficiently, the heat dissipation performance can be improved. Furthermore, an increase in the thickness dimension of the heat transfer plate 20 and an increase in the length dimension in the plane direction can be suppressed. Thereby, the weight of the entire radiator 1 can be suppressed, and the installation space for the radiator 1 can be reduced.
  • the heat transfer plate 20 has a substrate portion 21 having a recess 23 and a lid portion 22, and a through hole 24 through which the linear portion 11 is inserted is formed on the bottom surface of the recess 23.
  • the bulging portion 12 of the heat pipe 10 can be embedded in the heat transfer plate 20 by an easy process such as “attaching the heat pipe 10 to the recess 23 and fixing the lid portion 22 to the substrate portion 21”.
  • the lid portion 22 is fixed to the substrate portion 21 by friction stir welding, the amount of heat generated during the joining is small. Therefore, thermal deformation of the heat transfer plate 20 and the heat pipe 10 can be suppressed. Furthermore, since the adhesiveness between the heat transfer plate 20 and the heat pipe 10 can be improved, high heat dissipation performance can be obtained.
  • this invention is not limited to the said embodiment, A design change is possible suitably in the range which does not deviate from the meaning of this invention.
  • the linear part 11 is being fixed to the center part of the bulging part 12, it is not limited to this.
  • the straight line portion may be fixed at a position eccentric from the center of the bulging portion.
  • you may fix a some linear part to the one bulging part.
  • the bulging part 12 is exhibiting disk shape, it is not limited to this.
  • Other shapes such as a spherical shape may be used as long as the outer shape of the straight portion 11 swells.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un radiateur grâce auquel une augmentation d'une épaisseur de plaque d'échangeur de chaleur et une augmentation de l'espace d'installation peuvent être supprimées. La présente invention est caractérisé en ce qu'elle comprend : un caloduc (10) ; une plaque d'échangeur de chaleur (20) qui est disposée au niveau d'une section d'extrémité du caloduc (10) ; et une ailette de dissipation de chaleur (30) qui est disposée au niveau de l'autre section d'extrémité du caloduc (10). La présente invention est également caractérisé en ce que : le caloduc (10) comprend une section linéaire (11), et une section renflée (12) qui est disposée au niveau d'une extrémité de la section linéaire (11) ; et la section de renflement (12) est intégrée dans la plaque d'échangeur de chaleur (20).
PCT/JP2014/069462 2014-07-23 2014-07-23 Radiateur Ceased WO2016013072A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2014/069462 WO2016013072A1 (fr) 2014-07-23 2014-07-23 Radiateur
TW104123646A TW201616079A (zh) 2014-07-23 2015-07-22 放熱器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2014/069462 WO2016013072A1 (fr) 2014-07-23 2014-07-23 Radiateur

Publications (1)

Publication Number Publication Date
WO2016013072A1 true WO2016013072A1 (fr) 2016-01-28

Family

ID=55162628

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2014/069462 Ceased WO2016013072A1 (fr) 2014-07-23 2014-07-23 Radiateur

Country Status (2)

Country Link
TW (1) TW201616079A (fr)
WO (1) WO2016013072A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3084733A1 (fr) 2018-08-06 2020-02-07 Thermie Production Dispositif de radiateur electrique vertical d'une hauteur maximum de deux metres a l'usage d'habitation selon la technologie de fluides caloporteur

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI805943B (zh) * 2020-09-09 2023-06-21 萬在工業股份有限公司 堆疊式垂直散熱裝置

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0262067A (ja) * 1988-08-29 1990-03-01 Matsushita Electric Ind Co Ltd 半導体パッケージ
JPH02130948A (ja) * 1988-11-11 1990-05-18 Mitsubishi Electric Corp 半導体冷却装置
US20040035558A1 (en) * 2002-06-14 2004-02-26 Todd John J. Heat dissipation tower for circuit devices
JP2004071635A (ja) * 2002-08-01 2004-03-04 Fujikura Ltd タワー型ヒートシンク
US6725909B1 (en) * 2003-01-06 2004-04-27 Chin-Kuang Luo Heat-dissipating device and method for fabricating the same
US20080257527A1 (en) * 2007-04-18 2008-10-23 Foxconn Technology Co., Ltd. Heat sink assembly having a fin also functioning as a supporting bracket
US20090025909A1 (en) * 2007-07-25 2009-01-29 Tsung-Hsien Huang Cooler module
WO2010041529A1 (fr) * 2008-10-06 2010-04-15 日本軽金属株式会社 Procédé de fabrication de plaque de transfert de chaleur
JP2011040778A (ja) * 2005-04-21 2011-02-24 Nippon Light Metal Co Ltd 液冷ジャケット
JP2012057906A (ja) * 2010-09-13 2012-03-22 Calsonic Kansei Corp 伝熱板

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0262067A (ja) * 1988-08-29 1990-03-01 Matsushita Electric Ind Co Ltd 半導体パッケージ
JPH02130948A (ja) * 1988-11-11 1990-05-18 Mitsubishi Electric Corp 半導体冷却装置
US20040035558A1 (en) * 2002-06-14 2004-02-26 Todd John J. Heat dissipation tower for circuit devices
JP2004071635A (ja) * 2002-08-01 2004-03-04 Fujikura Ltd タワー型ヒートシンク
US6725909B1 (en) * 2003-01-06 2004-04-27 Chin-Kuang Luo Heat-dissipating device and method for fabricating the same
JP2011040778A (ja) * 2005-04-21 2011-02-24 Nippon Light Metal Co Ltd 液冷ジャケット
US20080257527A1 (en) * 2007-04-18 2008-10-23 Foxconn Technology Co., Ltd. Heat sink assembly having a fin also functioning as a supporting bracket
US20090025909A1 (en) * 2007-07-25 2009-01-29 Tsung-Hsien Huang Cooler module
WO2010041529A1 (fr) * 2008-10-06 2010-04-15 日本軽金属株式会社 Procédé de fabrication de plaque de transfert de chaleur
JP2012057906A (ja) * 2010-09-13 2012-03-22 Calsonic Kansei Corp 伝熱板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3084733A1 (fr) 2018-08-06 2020-02-07 Thermie Production Dispositif de radiateur electrique vertical d'une hauteur maximum de deux metres a l'usage d'habitation selon la technologie de fluides caloporteur

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