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WO2016012189A1 - Lampe en semiconducteur et son procédé de fabrication - Google Patents

Lampe en semiconducteur et son procédé de fabrication Download PDF

Info

Publication number
WO2016012189A1
WO2016012189A1 PCT/EP2015/064369 EP2015064369W WO2016012189A1 WO 2016012189 A1 WO2016012189 A1 WO 2016012189A1 EP 2015064369 W EP2015064369 W EP 2015064369W WO 2016012189 A1 WO2016012189 A1 WO 2016012189A1
Authority
WO
WIPO (PCT)
Prior art keywords
piston
contact
semiconductor lamp
end cap
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2015/064369
Other languages
German (de)
English (en)
Inventor
Thomas Bittmann
Franz Seibold
Johann Mayer
Wiglef Kutschke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE102014214604.6 external-priority patent/DE102014214604B4/de
Application filed by Osram GmbH filed Critical Osram GmbH
Publication of WO2016012189A1 publication Critical patent/WO2016012189A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/101Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/27Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • F21K9/272Details of end parts, i.e. the parts that connect the light source to a fitting; Arrangement of components within end parts
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • F21V3/02Globes; Bowls; Cover glasses characterised by the shape
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • F21V3/04Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/061Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being glass
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Definitions

  • the invention relates to a semiconductor lamp comprising a translucent piston of a tubular basic shape, at least one substrate accommodated in the piston, which piston has end-to-end contact regions, and end caps for closing the end of the piston and constant-volume adhesive at least cohesive connection of a respective pair of end cap and
  • the invention also relates to a method for producing a semiconductor lamp.
  • the invention is particularly applicable to replacement lamps or retrofit lamps for replacement of conventional fluorescent lamps or line lamps.
  • tubular LED lamps known that are used as a replacement for conventional fluorescent lamps.
  • Such LED retrofit lamps 101 are essentially composed of a translucent tubular piston 102 (with a longitudinal axis A), a printed circuit board 103 accommodated in the piston 102 with LEDs 104 arranged thereon,
  • the electronic components 105 form a
  • the putty is on a cylindrical
  • Metal base is not critical due to the foaming property of the cement for sealing the piston.
  • Retrofit lamp 101 e.g. the LEDs 104 and the
  • LED retrofit lamps 101 In the LED retrofit lamps 101 is therefore typically to avoid a
  • High Temperature Cure Adhesive 109 is used in the form of epoxy or silicone instead of the cement.
  • the epoxy or silicone does not foam so that the annular gap 107 between the curl 108 and the end cap 106 must be particularly narrow (typically with a gap width or gap height Rh in a range of 0.2 mm to 1.0 mm) to ensure a tightness.
  • this low gap height Rh increases a requirement for a
  • the adhesive 109 In order to provide sufficient tightness of the piston 102, the adhesive 109 must also be pressed against the corresponding adhesive surfaces, which further increases a requirement for joining, in particular with respect to an inclination or tilting of the piston 102 and end cap 106.
  • the object is achieved by a semiconductor lamp
  • tubular basic shape which piston end-circumferential contact areas, (ii) at least one accommodated in the piston substrate, on which at least one
  • Semiconductor light source is arranged, (iii) end caps for the end closure of the piston and (iv) volume constant adhesive for material connection of the end caps with a respective contact area.
  • the contact areas are arranged, (iii) end caps for the end closure of the piston and (iv) volume constant adhesive for material connection of the end caps with a respective contact area.
  • the tapering of the contact areas greatly facilitates the joining of the end cap and the piston.
  • such an influence of a tilt between the end cap and the piston on the tightness is substantially reduced. Also, it can now be due to the pushing on the end cap
  • the piston may be completely or partially translucent.
  • the piston since in the piston, the at least one substrate is housed, and thus the piston envelops the substrate, the piston may also be regarded as an enveloping body. Since the piston also holds or carries the at least one substrate directly or indirectly, the piston can also be considered as a carrier body.
  • the piston may have an imaginary rectilinear longitudinal axis.
  • the piston may also be curved at least in sections be, for example, U-shaped curved, and then have a correspondingly shaped longitudinal extent.
  • the at least one semiconductor light source comprises at least one light-emitting diode. If several LEDs are present, they can be lit in the same color or in different colors. A color may be monochrome (e.g., red, green, blue, etc.) or multichrome (e.g., white). This can also be done by the at least one light emitting diode
  • emitted light is an infrared light (IR-LED) or an ultraviolet light (UV-LED).
  • IR-LED infrared light
  • UV-LED ultraviolet light
  • Several light emitting diodes can produce a mixed light; e.g. a white mixed light.
  • the at least one light-emitting diode can have at least one
  • wavelength-converting phosphor included conversion LED
  • the phosphor may alternatively or additionally
  • Light emitting diode may be in the form of at least one individually housed light emitting diode or in the form of at least one LED chip
  • the at least one light emitting diode may be equipped with at least one own and / or common optics for beam guidance, e.g. at least one
  • Fresnel lens, collimator, and so on are also generally organic LEDs.
  • inorganic light emitting diodes e.g. based on InGaN or AlInGaP, are also generally organic LEDs.
  • the at least one semiconductor light source may be e.g. have at least one diode laser.
  • the substrate may in particular be a printed circuit board which is equipped with the at least one semiconductor light source.
  • the circuit board may be a ribbon-shaped circuit board. It may be unilateral or bilateral, with at least one each
  • the substrate will be without
  • both are designed for mechanical fastening of the lamp in a socket, for example in a conventional version.
  • At least one of the end caps also serves for electrical contacting of the lamp, for example for supplying an electrical supply signal.
  • such an end cap may have two metal pins at the front end, which are connected to a driver.
  • the end cap is designed for both mechanical and electrical connection, it may be referred to as a "socket".
  • the end caps in particular have contact counter regions, which are provided for contacting the contact regions of the piston.
  • Pistons and the contact counter areas of the end caps circumferential areas are to ensure a particularly secure sealing of the
  • the contact counter regions of the end caps can be placed on a respective contact region of the piston in particular circumferentially to close the piston.
  • a contact area of the piston is understood in particular to mean an area or a surface intended to contact the contact area of the end cap.
  • Contact counter areas may in particular be larger than the actual contact area or contact counter area on which the piston actually (directly or indirectly via the
  • Adhesive comes into contact with the end cap.
  • the fact that the contact areas of the piston are tapered surfaces towards the respective end may include that with decreasing longitudinal distance to a next end of the piston (e.g., towards its end face) in each
  • a volume-constant adhesive may, in particular, be understood as meaning an adhesive, for example an adhesive, which does not significantly change its volume after application, in particular does not foam.
  • the adhesive may be an organic adhesive, especially glue.
  • Adhesive may be epoxy or silicone.
  • the end portions may be formed as continuously tapered contact portions. This allows a particularly compact and material-saving construction.
  • a continuously tapering end region may, in particular, be understood to mean a terminal region or section of the piston which tapers from a certain distance from its nearest end surface until it reaches the end face and, for example, after a taper, does not have sections which are closer to the end face has, for example no sections with constant profile and / or no extensions.
  • the contact areas of the piston have a frusto-conical outer contour.
  • the conical outer contour has a rectilinear shape in a longitudinal section.
  • a wall thickness of the piston in the end region or contact region is at least substantially constant.
  • Longitudinal section have curved outer contour. This extends a design possibility of contacting, e.g. in the
  • an inclination or an inclination angle of a contact area of the piston against a longitudinal axis of the piston is at least 2 ° and at most 10 °, in particular in a range between 3 ° and 6 °, in particular in a range between 4 ° and 6 °.
  • These slope areas are so shallow that they advantageously allow a long bonding area and contact area as well as a long attachment path of the end cap (s) and are large enough to allow high manufacturing tolerance.
  • Base body having an end wall and a piston side attached thereto circumferential side wall, wherein at least a portion of the side wall, in particular an inner surface thereof, a contact counter portion is, which is placed on a respective contact region of the piston.
  • the end cap is thus placed with its inner side, which provides a contact counter area, on the tapered contact area of the piston, in particular
  • the circumferential side wall of the end cap or its inner surface may be formed as a hollow cylinder in a development, wherein the end wall covering a side facing away from the piston surface of the side wall.
  • the other end face of the side wall is open.
  • the end cap may therefore in particular in the form of a one-sided open
  • Hollow cylinder present. It is an advantageous for a particularly large current contact surface between the end cap and the piston and thus a particularly strong and dense adhesion
  • Tilt direction of the contact area of the piston and a Tilt direction of the contact counter portion of the end cap is thus the same.
  • the contact counter region of the end cap may in particular have a basic shape which is at least similar to the contact region of the piston. It is a development that the side wall of the end cap has at least in sections a frustoconical basic shape. It is yet another embodiment that one
  • Inclination angle of the contact counter region of the end cap in particular against a longitudinal axis, in a range between 2 ° and 10 °, in particular in a range between 3 ° and 7 °, in particular in a range between 5 ° and 7 °.
  • Inclination angle of the contact surface of the piston With a different opening or inclination angle between the piston and the end cap can be a flow direction of the
  • Adhere adhesive and thus determine at which longitudinal end excess adhesive exits. For a difference in the inclination angle between 1 ° and 2 ° is particularly advantageous.
  • the main body of the end caps consists of plastic.
  • it may be made entirely of plastic.
  • the end cap may additionally have at least one electrically conductive element (e.g.
  • the driver can serve electrical connector between a socket and a driver.
  • the driver likes one or more electrical and / or
  • the driver likes
  • driver electronics in particular be a driver electronics.
  • the components of the driver may be wholly or partially on an independent circuit board (hereinafter without limitation
  • driver board Generality called "driver board"
  • the components of the driver may be arranged wholly or partially on the light source substrate.
  • the components of the driver like in particular partially on the
  • Driver board is present, it may be arranged in particular in or on an end cap. It is also an embodiment that the piston a
  • Glass bulb is.
  • a glass bulb is, among other things, particularly mechanically, chemically and thermally resistant.
  • the present invention is particularly effective applicable to a combination of a glass bulb with an end cap (or its body) made of plastic, since a plastic
  • Plastic piston is. Such is particularly easy and inexpensive to produce.
  • end caps or their contact counter regions touch the contact areas of the piston only via the adhesive, so the end caps do not contact the piston directly or directly.
  • a tightness of the adhesive connection is achieved particularly reliable.
  • This embodiment may e.g. by a
  • This embodiment can be e.g. By pushing on an end cap to the stop at a comparatively high maximum force implement.
  • a gap width or gap height of an adhesive gap filled by the adhesive between the contact area of the piston and the end cap, in particular its contact counter area is in a range between 0.2 mm and 1 mm.
  • Semiconductor lamp is a retrofit lamp. In particular, it likes a form factor of a fluorescent lamp, e.g. type T5 or T8, or a line lamp.
  • At least one end cap of the retrofit lamp may be shaped similarly to a type G5 or G13 socket.
  • the object is achieved by a method for producing a semiconductor lamp, the method comprising at least the following steps: (a) providing a
  • the method can be configured analogously to the lamp described above and has the same advantages.
  • Fig.l shows a semiconductor lamp in the form of a
  • Fluorescent tube retrofit lamp 1 e.g. for replacement
  • Retrofit lamp 1 comprises a translucent piston 2 of tubular basic shape, which is e.g. made of plastic or glass.
  • piston 2 is a translucent piston 2 of tubular basic shape, which is e.g. made of plastic or glass.
  • the piston 2 is a translucent piston 2 of tubular basic shape, which is e.g. made of plastic or glass.
  • the piston 2 is a translucent piston 2 of tubular basic shape, which is e.g. made of plastic or glass.
  • the piston 2 is a translucent piston 2 of tubular basic shape, which is e.g. made of plastic or glass.
  • the piston 2 has as its end regions in each case a circumferential contact region 5, which are covered with an adhesive 6, as shown in more detail in FIG. In Fig. 2, the light source substrate 3 and the LED chips 4 are not
  • the end cap 7 has a base body 15 which at least from an end wall 7 a with
  • the contact area 5 has a to a final or
  • An inclination angle al against a longitudinal axis A is between 5 ° and 7 °, in particular 6 ° to 7 °.
  • the adhesive 6 can securely seal the piston 2 and the end cap 7 with high tolerance to positioning inaccuracies, e.g.
  • An inner diameter dl of the end cap 7 is in particular smaller than a widest edge of the contact region 5, which here corresponds to the outer diameter dK of the central region 8 of the piston 2 (corresponding to dK> dl). This ensures that the end cap 7 does not over the
  • the main body 15, 7a, 7b of the end cap 7 consists of
  • Components 105 are connected via electrical lines 17 with the
  • Light source substrate 3 connected (not in Fig.2
  • the components 105 are also guided via electrical lines 18 through the main body 15,
  • End caps 7 can thus in particular as a bipin socket
  • FIG. 3 shows a representation analogous to FIG
  • Retrofitlampe 21 has, in contrast to the retrofit lamp 1, an end cap 22, the circumferential side wall 23 in
  • the angle of inclination 2 of the side wall 23 is here 4 ° to 6 °, in particular 4 ° to 5 ° and is in particular 1 ° to 2 ° lower than the inclination angle l of the
  • At least part of an inner surface of the side wall 23 is formed as a contact opposing portion 24 which is located on the
  • Contact counter area 24 of the end cap 22 here corresponds at least approximately to the actual contact area 25.
  • the basically usable contact counter area 24 thus becomes here practically completely used actually as a contact surface 25.
  • the actual contact surface 11 of the end cap 22 here corresponds at least approximately to the actual contact area 25.
  • Retrofit lamp 1 and therefore denser and safer.
  • a number may include exactly the specified number as well as a usual tolerance range, as long as this is not explicitly excluded.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

L'invention concerne une lampe en semiconducteur et son procédé de fabrication. Une lampe en semiconducteur (21) possède une ampoule transparente (2) de forme tubulaire, qui possède des zones de contact (5) circonférentielles du côté de l'extrémité, au moins un substrat (3) logé dans l'ampoule sur lequel est disposée au moins une source de lumière en semiconducteur (4), des embouts (22) servant à fermer l'ampoule (2) du côté de l'extrémité et un agent adhésif (6) à volume constant destiné à l'assemblage par liaison de matières d'une paire respective constituée d'un embout et d'une zone de contact (5). Les zones de contact (5) se rétrécissent en direction d'une extrémité (9) respective de l'ampoule (2). L'invention concerne en outre un procédé de fabrication d'une lampe en semiconducteur (21), comprenant les étapes suivantes : production d'une ampoule transparente ayant une forme de base tubulaire, dont les zones de contact (5) circonférentielles se rétrécissent en direction de l'extrémité (9) respective ; production d'embouts (22) ; application d'un agent adhésif (6) à volume constant sur les zones de contact (5) et/ou sur les zones homologues de contact (24) des embouts ; et pose des embouts sur les zones de contact de manière à ce qu'ils exercent une pression sur l'agent adhésif. L'invention est particulièrement adaptée aux lampes de remplacement ou aux lampes de rénovation destinée à remplacer les lampes fluorescentes ou les lampes linéaires conventionnelles.
PCT/EP2015/064369 2014-07-24 2015-06-25 Lampe en semiconducteur et son procédé de fabrication Ceased WO2016012189A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014214604.6 DE102014214604B4 (de) 2014-07-24 Halbleiter-Lampe und Verfahren zu ihrer Herstellung
DE102014214604.6A DE102014214604A1 (de) 2014-07-24 2014-07-24 Halbleiter-Lampe und Verfahren zu ihrer Herstellung

Publications (1)

Publication Number Publication Date
WO2016012189A1 true WO2016012189A1 (fr) 2016-01-28

Family

ID=53491513

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2015/064369 Ceased WO2016012189A1 (fr) 2014-07-24 2015-06-25 Lampe en semiconducteur et son procédé de fabrication

Country Status (2)

Country Link
DE (1) DE102014214604A1 (fr)
WO (1) WO2016012189A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD811627S1 (en) 2016-06-16 2018-02-27 Curtis Alan Roys LED lamp
EP3318798A1 (fr) * 2016-11-08 2018-05-09 OSRAM GmbH Embout pour dispositif d'éclairage, procede et dispositif correspondants
USD851816S1 (en) 2017-04-14 2019-06-18 Curtis A. Roys Lamp support
USD901754S1 (en) 2017-04-14 2020-11-10 RetroLED Components, LLC Lamp support
US11002438B2 (en) 2019-04-03 2021-05-11 Sidney Howard Norton Adjustable clip-on base for LED assembly

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017126257B4 (de) * 2017-11-09 2019-06-19 Ledvance Gmbh Leuchtmittel

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070076428A1 (en) * 2005-09-30 2007-04-05 Chia-Yeh Wu Festoon lamp
WO2008136458A1 (fr) * 2007-05-01 2008-11-13 Sharp Kabushiki Kaisha Dispositif d'éclairage et lampe utilisant celui-ci
JP2010140843A (ja) * 2008-12-15 2010-06-24 Rohm Co Ltd Ledランプ
EP2239493A2 (fr) * 2009-04-06 2010-10-13 Yadent Co., Ltd. Appareil d'éclairage à économie d'énergie
WO2012127387A1 (fr) * 2011-03-22 2012-09-27 Cosmo Wealth Creation Limited Tube lumineux
US20130182425A1 (en) * 2010-10-22 2013-07-18 Panasonic Corporation Lamp and lighting apparatus

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5575459A (en) * 1995-04-27 1996-11-19 Uniglo Canada Inc. Light emitting diode lamp
DE19734687C1 (de) * 1997-08-11 1999-01-28 Ald Vacuum Techn Gmbh Induktionskappentrennverfahren
WO2002023589A1 (fr) * 2000-09-14 2002-03-21 Koninklijke Philips Electronics N.V. Lampe fluorescente et procede de fabrication de cette derniere
DE102010053654B4 (de) * 2010-12-06 2013-03-07 Bundesrepublik Deutschland, vertreten durch das Bundesministerium für Wirtschaft und Technologie, dieses vertreten durch den Präsidenten der Physikalisch-Technischen Bundesanstalt Beleuchtungseinrichtung
CN103511870B (zh) * 2012-06-27 2018-03-23 欧司朗股份有限公司 照明装置
DE102012222103B4 (de) * 2012-12-03 2024-01-11 Ledvance Gmbh Leuchtvorrichtung mit miteinander verbundenen teilen

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070076428A1 (en) * 2005-09-30 2007-04-05 Chia-Yeh Wu Festoon lamp
WO2008136458A1 (fr) * 2007-05-01 2008-11-13 Sharp Kabushiki Kaisha Dispositif d'éclairage et lampe utilisant celui-ci
JP2010140843A (ja) * 2008-12-15 2010-06-24 Rohm Co Ltd Ledランプ
EP2239493A2 (fr) * 2009-04-06 2010-10-13 Yadent Co., Ltd. Appareil d'éclairage à économie d'énergie
US20130182425A1 (en) * 2010-10-22 2013-07-18 Panasonic Corporation Lamp and lighting apparatus
WO2012127387A1 (fr) * 2011-03-22 2012-09-27 Cosmo Wealth Creation Limited Tube lumineux

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10222005B2 (en) 2015-07-24 2019-03-05 Sidney Howard Norton Method and assembly for replacing fluorescent lights
USD811627S1 (en) 2016-06-16 2018-02-27 Curtis Alan Roys LED lamp
USD893092S1 (en) 2016-06-16 2020-08-11 Curtis Alan Roys End cap for an LED stick
USD917776S1 (en) 2016-06-16 2021-04-27 Curtis Alan Roys End cap for an LED stick
EP3318798A1 (fr) * 2016-11-08 2018-05-09 OSRAM GmbH Embout pour dispositif d'éclairage, procede et dispositif correspondants
USD851816S1 (en) 2017-04-14 2019-06-18 Curtis A. Roys Lamp support
USD901754S1 (en) 2017-04-14 2020-11-10 RetroLED Components, LLC Lamp support
US11002438B2 (en) 2019-04-03 2021-05-11 Sidney Howard Norton Adjustable clip-on base for LED assembly

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