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WO2016006024A1 - Film conducteur photosensible, ensemble de films conducteurs et procédé de fabrication d'un film de protection de surface et d'un film de base comportant un motif conducteur à l'aide de cet ensemble, et procédé de fabrication d'un film de base comportant un motif conducteur - Google Patents

Film conducteur photosensible, ensemble de films conducteurs et procédé de fabrication d'un film de protection de surface et d'un film de base comportant un motif conducteur à l'aide de cet ensemble, et procédé de fabrication d'un film de base comportant un motif conducteur Download PDF

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Publication number
WO2016006024A1
WO2016006024A1 PCT/JP2014/068049 JP2014068049W WO2016006024A1 WO 2016006024 A1 WO2016006024 A1 WO 2016006024A1 JP 2014068049 W JP2014068049 W JP 2014068049W WO 2016006024 A1 WO2016006024 A1 WO 2016006024A1
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WO
WIPO (PCT)
Prior art keywords
film
conductive
photosensitive
layer
photosensitive resin
Prior art date
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Ceased
Application number
PCT/JP2014/068049
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English (en)
Japanese (ja)
Inventor
奏美 中村
山崎　宏
田仲　裕之
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Resonac Corp
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Hitachi Chemical Co Ltd
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Publication date
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Priority to PCT/JP2014/068049 priority Critical patent/WO2016006024A1/fr
Publication of WO2016006024A1 publication Critical patent/WO2016006024A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports

Definitions

  • the present invention relates to a photosensitive conductive film, a conductive film set, and a method for producing a surface protective film and a substrate film with a conductive pattern using the same, a surface protective film having a two-layer stack-up structure, and a method for producing a substrate film with a conductive pattern
  • the present invention relates to a method for producing a base film with a conductive pattern having a two-layer stack-up structure.
  • Liquid crystal display elements and touch screens are used in large electronic devices such as personal computers and televisions, small electronic devices such as car navigation systems, mobile phones and electronic dictionaries, and display devices such as OA and FA devices.
  • display devices such as OA and FA devices.
  • liquid crystal display elements, touch screens, solar cells and lighting a transparent conductive film is used as part of transparent wiring, pixel electrodes or terminals.
  • the capacitive touch panel is formed with a two-layer structure of a plurality of X electrodes and a plurality of Y electrodes orthogonal to the X electrodes in order to express two-dimensional coordinates by the X axis and the Y axis. .
  • ITO Indium-Tin-Oxide
  • indium oxide Indium oxide
  • tin oxide Tin oxide
  • an electrode such as a substrate for a liquid crystal display element
  • a pattern obtained by patterning a transparent conductive film made of the above-described material has become mainstream.
  • a method for patterning a transparent conductive film As a method for patterning a transparent conductive film, a method is generally employed in which after forming a transparent conductive film, a resist pattern is formed by a photolithography method, and a predetermined portion of the conductive film is removed by wet etching to form a conductive pattern.
  • a mixed liquid composed of two liquids of hydrochloric acid and ferric chloride is often used as the etching liquid (see, for example, Patent Document 1).
  • An ITO film or tin oxide film is generally formed by sputtering, but the film quality of the transparent conductive film is likely to change depending on the sputtering method, sputtering power, gas pressure, substrate temperature, type of atmospheric gas, and the like. Differences in the film quality of the transparent conductive film due to variations in sputtering conditions cause variations in the etching rate when the transparent conductive film is wet-etched, and are liable to reduce product yield due to patterning defects. In addition, since the transparent conductive pattern forming method has undergone a sputtering process, a resist forming process, and an etching process, the process is long and has a large cost.
  • Patent Document 2 discloses a transfer type photosensitivity provided with a support film, a conductive layer containing conductive fibers provided on the support film, and a photosensitive resin layer provided on the conductive layer. Laminate the conductive film on the substrate so that the photosensitive resin layer is in close contact, and then expose and develop the conductive film. A conductive pattern with sufficient adhesion to the substrate and low surface resistivity is sufficient. It is possible to form at a high resolution.
  • Patent Document 3 when exposing a photosensitive resin layer having a conductive layer on the surface, the first exposure is performed through a support film on which a mask is placed, and the second exposure is performed on the support film.
  • a two-stage exposure method is disclosed, which is performed under the removed oxygen. As a result, it is possible to cure the resin to such an extent that only the conductive layer on the surface is removed in the development process at the first exposure process.
  • Patent Document 4 By the way, as a surface protection film for a transparent conductive film, in Patent Document 4, even when placed in a heating environment in the pattern formation of transparent electrodes and wiring, the surface protection film that can perform subsequent peeling work well. Is disclosed. However, in the film configuration described in Patent Document 4, an adhesive for bonding the first and second conductive pattern base materials is required in a capacitive touch panel in which two layers of XY electrodes are formed. There was still room for improvement in making the pattern substrate thinner.
  • This invention is made
  • a photosensitive conductive film including a support film, a conductive layer containing conductive fibers, a photosensitive resin layer, a base film, and a surface protective film in this order.
  • ⁇ 4> The photosensitive conductive layer according to any one of ⁇ 1> to ⁇ 3>, wherein the photosensitive resin layer contains a binder polymer, a photopolymerizable compound having an ethylenically unsaturated bond, and a photopolymerization initiator. the film.
  • ⁇ 5> The photosensitive conductive film according to any one of ⁇ 1> to ⁇ 4>, wherein the surface protective film is an acrylic adhesive.
  • ⁇ 6> a first exposure step of irradiating the conductive layer and the photosensitive resin layer of the photosensitive conductive film according to any one of ⁇ 1> to ⁇ 5> with actinic rays in a pattern form from the support film side; , A second exposure step of irradiating a part or all of the unexposed portion in the first exposure step of the conductive layer and the photosensitive resin layer with actinic rays in the presence of oxygen after peeling the support film;
  • the manufacturing method of the surface protection film provided with the image development process which forms a conductive pattern by developing the said conductive layer and the said photosensitive resin layer after a said 2nd exposure process, and a base film with a conductive pattern.
  • a surface protective film obtained by the production method according to ⁇ 6> and a base film with a conductive pattern, a support film, a conductive layer containing conductive fibers provided on the support film, and the conductive layer Laminating a transfer type photosensitive conductive film having a photosensitive resin layer provided on the conductive pattern side of the surface protective film and the substrate film with a conductive pattern from the photosensitive resin layer side; A first exposure step of irradiating the conductive layer and the photosensitive resin layer with actinic rays in a pattern from the support film side; and after peeling the support film, in the presence of oxygen, the conductive layer and the photosensitive resin.
  • a conductive film set comprising a transfer type photosensitive conductive film having a conductive layer containing conductive fibers provided on the support film and a photosensitive resin layer provided on the conductive layer.
  • the substrate film with a conductive pattern can be thinned to about 30 to 100 ⁇ m while protecting the substrate film with a conductive pattern from scratches and dirt.
  • (meth) acrylate means “acrylate” or “methacrylate” corresponding thereto.
  • a or B only needs to include one of A and B, or may include both.
  • process is not limited to an independent process, and even if it cannot be clearly distinguished from other processes, the term “process” is used as long as the intended action of the process is achieved. included.
  • the numerical range indicated by using “to” indicates a range including the numerical values described before and after “to” as the minimum value and the maximum value, respectively.
  • each component in the composition is the sum of the plurality of substances present in the composition unless there is a specific indication when there are a plurality of substances corresponding to each component in the composition. Means quantity.
  • the exemplary materials may be used alone or in combination of two or more unless otherwise specified.
  • FIG. 1 is a schematic cross-sectional view of the photosensitive conductive film of the present invention.
  • the photosensitive conductive film shown in FIG. 1 includes a support film 1, a conductive layer 2 containing conductive fibers, a photosensitive resin layer 3, a base film 4, and a surface protective film 5 in this order.
  • the boundary of each layer does not need to be separated clearly.
  • the support film 1 examples include a polyethylene terephthalate film, a polyethylene film, a polypropylene film, and a polycarbonate film.
  • a polyethylene terephthalate film is preferable from the viewpoint of transparency and heat resistance.
  • the support film may be subjected to surface treatment within a range that can be removed from the photosensitive resin layer later.
  • the thickness of the support film 1 is preferably 5 to 300 ⁇ m, more preferably 10 to 200 ⁇ m, still more preferably 15 to 100 ⁇ m, and particularly preferably 15 to 50 ⁇ m.
  • the thickness of the support film is 5 ⁇ m or more, the mechanical strength is improved, and the step of applying the conductive fiber dispersion to form the conductive layer 2 and the photosensitive resin for forming the photosensitive resin layer 3 are performed.
  • the step of applying the composition the step of peeling the support film before developing the exposed photosensitive resin layer 3, and the like, it is possible to prevent the support film from being damaged.
  • the thickness of the support film 1 is 300 ⁇ m or less, the resolution of the pattern can be improved when the photosensitive resin layer is irradiated with actinic rays through the support film 1.
  • the haze value of the support film 1 is preferably 0.01 to 5.0%, more preferably 0.01 to 3.0%, from the viewpoint of improving sensitivity and resolution. It is more preferably from 2.0% to 2.0%, particularly preferably from 0.01% to 1.1%.
  • the haze value can be measured according to JIS K 7105. For example, it can be measured with a commercially available turbidimeter such as NDH-5000 (trade name, manufactured by Nippon Denshoku Industries Co., Ltd.).
  • Examples of the conductive fibers contained in the conductive layer 2 include metal fibers such as gold, silver, copper, and platinum, and carbon fibers such as carbon nanotubes. From the viewpoint of conductivity, it is preferable to use gold fibers, silver fibers, or copper fibers, and it is more preferable to use silver fibers or copper fibers. Furthermore, silver fiber is preferable from the viewpoint of easily adjusting the conductivity of the formed conductive film.
  • the metal fiber can be prepared by, for example, a method of reducing metal ions with a reducing agent such as NaBH 4 or a polyol method.
  • a reducing agent such as NaBH 4 or a polyol method.
  • the carbon nanotubes commercially available products such as HiPco single-walled carbon nanotubes from Unidym Corporation can be used.
  • the fiber diameter of the conductive fiber is preferably 1 to 50 nm, more preferably 2 to 20 nm, and further preferably 3 to 10 nm.
  • the fiber length of the metal fiber is preferably 1 to 100 ⁇ m, more preferably 2 to 50 ⁇ m, still more preferably 3 to 40 ⁇ m, and particularly preferably 5 to 35 ⁇ m.
  • the fiber diameter and fiber length can be measured with a scanning electron microscope.
  • the thickness of the conductive layer 2 varies depending on the conductive film to be formed, the use of the conductive pattern and the required conductivity, but is preferably 1 ⁇ m or less, more preferably 1 nm to 0.5 ⁇ m, and more preferably 5 nm to 0 nm. More preferably, it is 1 ⁇ m.
  • the thickness of the conductive layer 2 is 1 ⁇ m or less, the light transmittance in the wavelength range of 450 to 650 nm is high, the pattern formability is excellent, and it is suitable for the production of a transparent electrode.
  • the conductive layer 2 can have a network structure in which conductive fibers are in contact with each other.
  • the conductive layer 2 having such a network structure may be formed on the surface of the photosensitive resin layer 3 on the support film side, but conductivity is obtained in the surface direction on the surface exposed when the support film is peeled off. If it is, it may be formed in the form included in the support film side surface layer of the photosensitive resin layer 3.
  • the thickness of the conductive layer 2 having a network structure refers to a value measured by a scanning electron microscope.
  • the conductive layer 2 containing conductive fibers is coated on the support film 1 with a conductive fiber dispersion obtained by adding the above-described conductive fibers to water or a dispersion stabilizer such as an organic solvent or a surfactant. After processing, it can be formed by drying. After drying, the conductive layer 2 formed on the support film 1 may be laminated as necessary.
  • Coating can be performed by a known method such as a roll coating method, a comma coating method, a gravure coating method, an air knife coating method, a die coating method, a bar coating method, or a spray coating method, but the film thickness distribution is good. In view of the fact that there is little foreign matter mixed into the coating liquid in a closed system, the die coating method is preferred.
  • the drying temperature is 65 ° C. or less from the viewpoint of preventing convection from forming and forming a Benard cell and becoming difficult to form a low-resistance conductive layer. Moreover, it is preferable that it is 20 degreeC or more from a viewpoint which prevents a solvent volatilizing and it takes time and becomes a problem on a process.
  • the drying temperature is more preferably 25 ° C. or more and less than 65 ° C., more preferably 35 ° C. or more and less than 65 ° C., and particularly preferably 40 to 60 ° C. Drying can be performed with a hot air convection dryer or the like.
  • the conductive fibers may coexist with a surfactant or a dispersion stabilizer.
  • the photosensitive resin layer 3 may be formed from a photosensitive resin composition containing (a) a binder polymer, (b) a photopolymerizable compound having an ethylenically unsaturated bond, and (c) a photopolymerization initiator.
  • a photosensitive resin composition containing (a) a binder polymer, (b) a photopolymerizable compound having an ethylenically unsaturated bond, and (c) a photopolymerization initiator.
  • Conventionally known ones can be used without particular limitation, but the photosensitive resin composition described in International Publication No. 2013/084886 is preferable.
  • the binder polymer of component (a) preferably has a carboxyl group.
  • the acid value of component (a) is preferably 75 to 200 mgKOH / g, more preferably 75 to 150 mgKOH / g, and 75 to 130 mgKOH / g from the viewpoint of excellent patternability. Further preferred.
  • the photopolymerizable compound having an ethylenically unsaturated bond as the component (b) is derived from a (meth) acrylate compound having a skeleton derived from pentaerythritol, a (meth) acrylate compound having a skeleton derived from dipentaerythritol, or derived from trimethylolpropane.
  • a (meth) acrylate compound having a skeleton of more preferably a (meth) acrylate compound having a skeleton derived from dipentaerythritol or a (meth) acrylate compound having a skeleton derived from trimethylolpropane, More preferably, erythritol triacrylate, dipentaerythritol hexaacrylate, or trimethylolpropane triacrylate is included.
  • PET-30, DPHA, and TMPTA all manufactured by Nippon Kayaku Co., Ltd., trade names).
  • the (C) component photopolymerization initiator preferably contains an oxime ester compound or a phosphine oxide compound.
  • oxime ester compounds IRGACURE OXE 01 (1,2-octanedione, 1-[(4-phenylthio) -phenyl, 2- (o-benzoyloxime)], BASF Corporation, trade name) and the like are commercially available. It is available.
  • phosphine oxide compound Lucirin® TPO (2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, trade name, manufactured by BASF Corporation) is commercially available.
  • the photosensitive resin layer 3 can be formed by applying and drying a photosensitive resin composition having a solid content of about 10 to 60% by mass on the conductive layer 2 formed on the support film 1.
  • the amount of the remaining organic solvent in the photosensitive resin layer after drying is preferably 2% by mass or less in order to prevent the organic solvent from diffusing in the subsequent step.
  • the solvent include methanol, ethanol, acetone, methyl ethyl ketone, methyl cellosolve, ethyl cellosolve, toluene, N, N-dimethylformamide, propylene glycol monomethyl ether and the like.
  • the coating can be performed by a known method such as a roll coating method, a comma coating method, a gravure coating method, an air knife coating method, a die coating method, a bar coating method, or a spray coating method. After coating, drying to remove the organic solvent and the like can be performed at 70 to 150 ° C. for about 5 to 30 minutes with a hot air convection dryer or the like.
  • the photosensitive resin layer 3 is formed by applying and drying the above-described photosensitive resin composition on a base film 4 described later, and the photosensitive resin layer 3 is formed on the conductive layer 2 formed on the support film 1. It can also be formed by laminating so as to be in contact with each other.
  • the thickness of the photosensitive resin layer 3 varies depending on the use, but it is preferably 1 to 50 ⁇ m, more preferably 1 to 30 ⁇ m, and further preferably 1 to 15 ⁇ m after drying. A thickness of 10 ⁇ m is particularly preferable. From the viewpoint of coating on the support film, a thickness of 1 ⁇ m or more is preferable, and from the viewpoint of photocurability, 50 ⁇ m or less is preferable.
  • the base film 4 and the surface protective film 5 are laminated so that the photosensitive conductive film of the present invention is in contact with the surface of the photosensitive resin layer 3 opposite to the support film 1 side.
  • polyethylene terephthalate PET
  • polyethylene naphthalate PEN
  • polyphenylene sulfide PPS
  • polycarbonate polymethyl methacrylate
  • polystyrene polyvinyl chloride
  • polyethylene polypropylene
  • polyethylene / polypropylene blend film polyamide
  • polyamide examples thereof include polyimide, cellulose acetate, polysulfone, and polyethersulfone.
  • polyethylene terephthalate, polyethylene naphthalate, or polyphenylene sulfide is preferable from the viewpoints of transparency and heat resistance.
  • the thickness of the base film 4 is preferably 10 to 200 ⁇ m, more preferably 15 to 100 ⁇ m, and further preferably 20 to 70 ⁇ m. 10 ⁇ m or more is preferable from the viewpoint of strength at the time of peeling the surface protective film 5 and the surface protection function, and 200 ⁇ m or less is preferable from the viewpoint of handleability and cost.
  • the surface of the base film may be subjected to treatment such as corona discharge, electron beam irradiation, sputtering, and easy adhesion treatment.
  • the surface protective film 5 has an adhesive formed on the film surface, and an adhesive (adhesive) that can be adhered (adhered) to the base film 4 and peeled off can be used without particular limitation.
  • an adhesive adhered (adhered) to the base film 4 and peeled off
  • Specific examples include acrylic adhesives, rubber adhesives, and synthetic rubber adhesives. Among them, an acrylic adhesive that can easily control the adhesive force depending on the composition is preferable.
  • the surface protective film is commercially available as HITALEX (trade name, manufactured by Hitachi Chemical Co., Ltd.).
  • the thickness of the surface protective film 5 is preferably 10 to 200 ⁇ m, more preferably 50 to 150 ⁇ m, and even more preferably 100 to 150 ⁇ m. 10 ⁇ m or more is preferable from the viewpoint of preventing bending during handling, and 200 ⁇ m or less is preferable from the viewpoint of reducing peel strength and improving handleability.
  • the minimum light transmittance in the wavelength region of 450 to 650 nm of the photosensitive conductive film of the present invention is preferably 80% or more, and more preferably 85% or more.
  • the minimum light transmittance in this case is 80% or more in the laminate of the support film excluding the surface protective film of the photosensitive conductive film, the conductive layer containing conductive fibers, the photosensitive resin layer, and the base film.
  • the surface protective film is for protecting the photosensitive conductive film from scratches and dirt, and for increasing the strength of the film during various treatments, and may be colored because it is not incorporated into the final product.
  • the total thickness of the photosensitive conductive film of the present invention is preferably 100 to 300 ⁇ m, more preferably 100 to 250 ⁇ m, still more preferably 120 to 250 ⁇ m, and particularly preferably 120 to 220 ⁇ m.
  • FIG. 2 is a schematic cross-sectional view of a transfer type photosensitive conductive film.
  • the transfer type photosensitive conductive film shown in FIG. 2 includes a support film 6, a conductive layer 7 containing conductive fibers provided on the support film 6, and a photosensitive resin layer 8 provided on the conductive layer 7.
  • a protective film 9 is preferably provided on the photosensitive resin layer 8.
  • Each of the support film 6 constituting the transfer type photosensitive conductive film, the conductive layer 7 containing conductive fibers, and the photosensitive resin layer 8 is the same as the details of the photosensitive conductive film described above.
  • a polyethylene terephthalate film, a polypropylene film, a polyethylene film, or the like can be used. Moreover, you may use the same film as the above-mentioned support body film as a protective film.
  • the number of fish eyes with a diameter of 80 micrometers or more contained in a protective film is 5 pieces / m ⁇ 2 > or less.
  • “Fish eye” means that when a material is melted by heat, kneaded, extruded, biaxially stretched, casting method, etc., foreign materials, undissolved materials, oxidized degradation products, etc. It is taken in.
  • the thickness of the protective film 9 is preferably 1 to 100 ⁇ m, more preferably 5 to 50 ⁇ m, still more preferably 5 to 30 ⁇ m, and particularly preferably 15 to 30 ⁇ m. From the viewpoint of preventing the protective film from being broken during lamination, the thickness is preferably 1 ⁇ m or more.
  • the photosensitive conductive film or the transfer-type photosensitive conductive film may be stored as it is in the form of a flat plate, or may be wound around a cylindrical core or the like and stored in the form of a roll.
  • the conductivity of the photosensitive conductive film including the support film 1, the conductive layer 2 containing conductive fibers, the photosensitive resin layer 3, the base film 4, and the surface protective film 5 in this order.
  • FIGS. 3A to 3D are developed to form a surface protection film and a substrate film with a conductive pattern by a developing step for forming a conductive pattern (see FIGS. 3A to 3D).
  • a mask may be used to expose a part of the unexposed portion.
  • the second exposure step is performed in the presence of oxygen, for example, preferably in the air. Further, the condition of increasing the oxygen concentration may be used. In the presence of oxygen, the surface portion of the photosensitive resin layer is not cured by the influence of oxygen even when irradiated with actinic rays, and the photosensitive resin layer excluding the surface portion is exposed and cured. Therefore, the unexposed portion in the first exposure step is cured except for the surface layer in the second exposure step, and only the surface layer is developed during development. Thereby, the resin cured layer which does not have a conductive film with a conductive pattern is provided on the base film 4, and the level
  • the transfer type photosensitive conductive film shown in FIG. 2 is peeled off from the produced surface protective film and the base film with a conductive pattern, and the protective film 9 is peeled off. Lamination is performed on the pattern forming surface from the photosensitive resin layer 8 side (see FIG. 3E).
  • a first exposure step of irradiating actinic light L in a pattern from the support film 6 side of the transfer type photosensitive conductive film (see FIG. 3 (f)), after the support film 6 is peeled off, oxygen is present
  • the second exposure step of irradiating a part or all of the unexposed portion in at least the first exposure step of the conductive layer and the photosensitive resin layer with an actinic ray L (see (g) of FIG. 3) )
  • the conductive layer and the photosensitive resin layer are developed to form a conductive layer and a two-layer stack (see FIG. 3H).
  • An up-structured surface protective film and a substrate film with a conductive pattern can be produced.
  • a base film with a conductive pattern having a two-layer stack-up structure can be produced by peeling the surface protective film 5 from the surface protective film having a two-layer stack-up structure and the base film with a conductive pattern (see (i) in FIG. 3). ).
  • the thickness of the substrate film with a conductive pattern ((i) in FIG. 3) having a two-layer stack-up structure of the present invention is preferably 30 to 100 ⁇ m, more preferably 30 to 90 ⁇ m, further preferably 40 to 90 ⁇ m, and 50 to 80 ⁇ m. Is particularly preferred.
  • the substrate film with a conductive pattern of the present invention can be used as a substrate with a transparent conductive pattern, such as a plasma display panel, an electroluminescence panel, an electrochromic element, a liquid crystal panel, and a touch panel.
  • a transparent conductive pattern such as a plasma display panel, an electroluminescence panel, an electrochromic element, a liquid crystal panel, and a touch panel.
  • FIG. 4A is a schematic top view illustrating an example of a capacitive touch panel sensor.
  • the touch panel sensor shown in FIG. 4A has a touch screen 102 for detecting a touch position on one side of a transparent base material 101. This area detects a change in capacitance and is transparent as an X position coordinate.
  • An electrode 103 and a transparent electrode 104 having Y position coordinates are provided.
  • FIG. 4B is a schematic cross-sectional view taken along the line II of FIG.
  • Each of the transparent electrodes 103 and 104 having the X and Y position coordinates includes a lead wire 105 for connecting to a driver element circuit for controlling an electric signal as a touch panel, and the lead wire 105 and the transparent electrodes 103 and 104.
  • a connection electrode 106 for connecting the two is disposed.
  • a connection terminal 107 connected to the driver element circuit is disposed at the end of the lead-out wiring 105 opposite to the connection electrode 106.
  • the reaction solution was allowed to stand at 30 ° C. or lower, diluted 10-fold with acetone, centrifuged at 2000 rpm for 20 minutes with a centrifuge, and the supernatant was decanted.
  • Acetone was added to the precipitate, and after stirring, the mixture was centrifuged under the same conditions as described above, and acetone was decanted. Then, it centrifuged twice similarly using distilled water, and obtained the silver fiber.
  • the fiber diameter (diameter) was about 5 nm
  • the fiber length was about 5 ⁇ m.
  • Silver fiber dispersion 1 was obtained by dispersing 0.2% by mass of the silver fiber obtained above and 0.1% by mass of dodecyl-pentaethylene glycol in pure water.
  • PET-30 Pentaerythritol triacrylate (trade name, manufactured by Shin-Nakamura Chemical Co., Ltd.)
  • IRGACURE OXE 01 1,2-octanedione, 1-[(4-phenylthio) -phenyl, 2- (o-benzoyloxime)] (trade name, manufactured by BASF Corporation)
  • SH-30 Octamethylcyclotetrasiloxane (trade name, manufactured by Toray Dow Corning Co., Ltd.)
  • Example 1 ⁇ Preparation of photosensitive conductive film>
  • the conductive fiber dispersion 1 was uniformly applied at 25 g / m 2 onto a 16 ⁇ m-thick polyethylene terephthalate film (trade name “A-1517”, manufactured by Toyobo Co., Ltd.) as a support film 1, and hot air convection at 100 ° C.
  • the conductive layer 2 was formed on the support film 1 (1st film) by drying with a type dryer for 10 minutes, and pressurizing with the linear pressure of 10 kg / cm at room temperature (25 degreeC). The thickness of the conductive layer after drying was about 0.01 ⁇ m.
  • a surface protective film (made by Hitachi Chemical Co., Ltd., trade name “Hitarex”, 175 ⁇ m thickness) 5 is a base film of a 50 ⁇ m thick polyethylene terephthalate film (made by Toray Film Processing Co., Ltd., trade name “Tough Top”). 4 was laminated at room temperature (25 ° C.) and 0.4 MPa. Then, the prepared photosensitive resin composition is uniformly applied to the surface of the base film 4 opposite to the surface to which the surface protective film 5 is laminated, and dried for 10 minutes in a hot air convection dryer at 100 ° C. Layer 3 was formed. In addition, the film thickness after drying of the photosensitive resin layer was 5 micrometers.
  • the conductive film 2 and the photosensitive resin layer 3 of the two films obtained as described above are arranged so as to face each other, laminated under the conditions of 120 ° C. and 0.4 MPa, support film 1 ⁇ conductive layer 2 ⁇ photosensitive resin layer A photosensitive conductive film constituted in the order of 3-substrate film 4-surface protective film 5 was produced (see FIG. 1).
  • the conductive fiber dispersion 1 was uniformly applied at 25 g / m 2 onto a 16 ⁇ m-thick polyethylene terephthalate film (trade name “A-1517” manufactured by Toyobo Co., Ltd.) as the support film 6, and hot air at 100 ° C.
  • the conductive layer 7 was formed on the support film 6 by drying with a convection dryer for 10 minutes and pressurizing at a linear pressure of 10 kg / cm at room temperature. The thickness of the conductive layer after drying was about 0.01 ⁇ m.
  • the photosensitive resin composition is uniformly coated on a 16 ⁇ m-thick polyethylene terephthalate film on which the conductive layer 7 is formed, and dried for 10 minutes with a hot air convection dryer at 100 ° C. to be photosensitive resin layer 8. Formed.
  • the film thickness after drying of the photosensitive resin layer was 5 micrometers.
  • a 30 ⁇ m-thick polyethylene terephthalate film (trade name “ES-201”, manufactured by Oji Film Co., Ltd.) is laminated as a protective film on the above-obtained film under the conditions of room temperature and 0.4 MPa, and the support film 6-
  • ES-201 polyethylene terephthalate film
  • a photomask having a wiring pattern with a line width / space width of 1/1 mm and a length of 120 mm was adhered to the support film 1 of the photosensitive conductive film obtained above.
  • the conductive layer and the photosensitive resin layer were irradiated with light at an exposure amount of 50 mJ / cm 2 using an exposure machine having a high-pressure mercury lamp lamp (trade name “EXM-1201” manufactured by Oak Manufacturing Co., Ltd.).
  • the support film 1 was peeled off, and the conductive layer and the photosensitive resin layer were irradiated with light at an exposure amount of 100 mJ / cm 2 in an oxygen atmosphere without using a photomask.
  • the film was allowed to stand at room temperature for 15 minutes, and developed by spraying a 1% by mass aqueous sodium carbonate solution at 30 ° C. for 30 seconds. After the development, a conductive pattern having a line width / space width of about 1/1 mm was formed. It was confirmed that the conductive pattern was formed satisfactorily.
  • the surface protection film formed using the photosensitive conductive film and the base film with a conductive pattern are heated at 80 ° C. for 10 minutes to deactivate the polymerization reaction of the photosensitive resin layer 3, and then the transfer form produced above.
  • the protective film 9 of the photosensitive conductive film was peeled off, and the photosensitive resin layer 8 was laminated on a conductive pattern formed using the photosensitive conductive film at 110 ° C. and 0.4 MPa.
  • a photomask having a wiring pattern with a line width / space width of 1/1 mm and a length of 120 mm was adhered to the support film 6 of the transfer type photosensitive conductive film.
  • the conductive layer and the photosensitive resin layer were irradiated with light at an exposure amount of 50 mJ / cm 2 using an exposure machine (trade name “EXM-1201” manufactured by Oak Manufacturing Co., Ltd.) having a high-pressure mercury lamp.
  • the support film 6 was peeled off, and the conductive layer and the photosensitive resin layer were irradiated with light at an exposure amount of 100 mJ / cm 2 in an oxygen atmosphere without using a photomask.
  • the film was allowed to stand at room temperature (25 ° C.) for 15 minutes and developed by spraying at 30 ° C. with a 1 mass% sodium carbonate aqueous solution for 30 seconds. After the development, a conductive pattern having a line width / space width of about 1/1 mm was formed. It was confirmed that the conductive pattern was formed satisfactorily. From this, it was confirmed that a two-layer electrode could be formed by the photosensitive conductive film and the transfer-type photosensitive conductive film, and a surface protective film having a two-layer stack-up structure and a base film with a conductive pattern were obtained.
  • the location where both the conductive layer 2 and the conductive layer 7 are formed was measured with a Nikon Digi Microhead (MH-15M, manufactured by Nikon Corporation), and the thickness was 60 ⁇ m.
  • the total light transmittance measured with a haze meter (NDH-5000, Nippon Denshoku Industries Co., Ltd.) was 88%.
  • the conductive pattern forming method of the present invention it is possible to protect the substrate film from scratches and dirt in the pattern forming step. Further, the touch panel can be made thin by using the photosensitive conductive film and the transfer type photosensitive conductive film in combination.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials For Photolithography (AREA)
  • Laminated Bodies (AREA)

Abstract

La présente invention a trait à un film conducteur photosensible qui comprend, dans l'ordre, un film de support, une couche conductrice contenant une fibre conductrice, une couche de résine photosensible, un film de base, et un film de protection de surface. Un procédé de fabrication d'un film de protection de surface/d'un film de base comportant un motif conducteur comprend : une première étape d'exposition consistant à appliquer une lumière active sur le film conducteur photosensible depuis le côté film de support, de manière à former un motif ; une seconde étape d'exposition consistant à appliquer, en présence d'oxygène, après le retrait du film de support, une lumière active sur une partie ou la totalité des sections du film conducteur photosensible n'ayant pas été exposées au moins au cours de la première étape d'exposition ; et une étape de développement consistant à former un motif conducteur grâce au développement de la couche conductrice et de la couche de résine photosensible après la seconde étape d'exposition.
PCT/JP2014/068049 2014-07-07 2014-07-07 Film conducteur photosensible, ensemble de films conducteurs et procédé de fabrication d'un film de protection de surface et d'un film de base comportant un motif conducteur à l'aide de cet ensemble, et procédé de fabrication d'un film de base comportant un motif conducteur Ceased WO2016006024A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2014/068049 WO2016006024A1 (fr) 2014-07-07 2014-07-07 Film conducteur photosensible, ensemble de films conducteurs et procédé de fabrication d'un film de protection de surface et d'un film de base comportant un motif conducteur à l'aide de cet ensemble, et procédé de fabrication d'un film de base comportant un motif conducteur

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2014/068049 WO2016006024A1 (fr) 2014-07-07 2014-07-07 Film conducteur photosensible, ensemble de films conducteurs et procédé de fabrication d'un film de protection de surface et d'un film de base comportant un motif conducteur à l'aide de cet ensemble, et procédé de fabrication d'un film de base comportant un motif conducteur

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WO2016006024A1 true WO2016006024A1 (fr) 2016-01-14

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106782771A (zh) * 2016-12-02 2017-05-31 天津宝兴威科技股份有限公司 一种新型纳米银复合导电薄膜

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009505358A (ja) * 2005-08-12 2009-02-05 カンブリオス テクノロジーズ コーポレイション ナノワイヤに基づく透明導電体
WO2013051516A1 (fr) * 2011-10-03 2013-04-11 日立化成株式会社 Procédé de formation de motif conducteur, substrat à motif conducteur et capteur d'écran tactile
JP2013073828A (ja) * 2011-09-28 2013-04-22 Fujifilm Corp 導電性組成物、その製造方法、導電性部材、並びに、タッチパネル及び太陽電池
JP2013224397A (ja) * 2012-02-28 2013-10-31 Fujifilm Corp 銀イオン拡散抑制層形成用組成物、銀イオン拡散抑制層用フィルム、配線基板、電子機器、導電膜積層体、およびタッチパネル

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009505358A (ja) * 2005-08-12 2009-02-05 カンブリオス テクノロジーズ コーポレイション ナノワイヤに基づく透明導電体
JP2013073828A (ja) * 2011-09-28 2013-04-22 Fujifilm Corp 導電性組成物、その製造方法、導電性部材、並びに、タッチパネル及び太陽電池
WO2013051516A1 (fr) * 2011-10-03 2013-04-11 日立化成株式会社 Procédé de formation de motif conducteur, substrat à motif conducteur et capteur d'écran tactile
JP2013224397A (ja) * 2012-02-28 2013-10-31 Fujifilm Corp 銀イオン拡散抑制層形成用組成物、銀イオン拡散抑制層用フィルム、配線基板、電子機器、導電膜積層体、およびタッチパネル

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106782771A (zh) * 2016-12-02 2017-05-31 天津宝兴威科技股份有限公司 一种新型纳米银复合导电薄膜

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