WO2016093519A1 - Film touch sensor and method for manufacturing same - Google Patents

Abstract

The present invention relates to a film touch sensor and a method for manufacturing same, and more specifically, to a film touch sensor and a method for manufacturing same, the film touch sensor comprising: a separation layer; a first protection layer positioned on the separation layer; and an electrode pattern layer comprising a sensing electrode and a pad electrode, the sensing electrode formed on a sensing area and the pad electrode formed on a pad area on the first protection layer, wherein the areas other than the pad electrode on the pad area on the first protection layer are filled with first protection layer material, thereby preventing thermal damage, etc. of a base film, enabling the easy formation of a pattern layer, and preventing damage from exposure to the etchant, etc. of the separation layer.

Description

Film touch sensor and manufacturing method thereof

The present invention relates to a film touch sensor and a manufacturing method thereof.

As the touch input method has been spotlighted as the next generation input method, attempts have been made to introduce the touch input method to a variety of electronic devices. Therefore, research and development on touch sensors that can be applied to various environments and enable accurate touch recognition are also actively conducted. have.

For example, in the case of an electronic device having a touch type display, an ultra-thin flexible display that achieves ultralight weight, low power, and improved portability has been attracting attention as a next generation display, and development of a touch sensor applicable to such a display has been required.

A flexible display means a display manufactured on a flexible substrate that can bend, bend, or roll without loss of properties, and technology development is in progress in the form of a flexible LCD, a flexible OLED, and an electronic paper.

In order to apply the touch input method to such a flexible display, a touch sensor having excellent bending and resilience and excellent flexibility and elasticity is required.

Regarding the film touch sensor for manufacturing such a flexible display, a wiring board including wiring embedded in a transparent resin substrate has been proposed.

A wiring forming step of forming a metal wiring on the substrate, a laminating step of applying and drying a transparent resin solution to cover the metal wiring to form a transparent resin substrate, and a peeling process of peeling the transparent resin substrate from the substrate. .

In this manufacturing method, in order to perform the peeling process smoothly, an inorganic peeling material such as an organic peeling material such as a silicone resin or a fluororesin, a diamond like carbon thin film (DLC) thin film or a zirconium oxide thin film is applied to the surface of the substrate. A method of forming in advance is used.

However, in the case of using the inorganic release material, when peeling the substrate and the metal wiring from the substrate, there is a problem that the peeling of the wiring and the substrate does not proceed smoothly and some of the metal wiring and the substrate remain on the surface of the substrate, and used as the release material There is a problem that the organic substance is deposited on the surface of the wiring and the substrate.

In other words, even when the release material is used, there is a problem that the metal wiring of the wiring board cannot be peeled off completely from the board.

In order to solve this problem, the method proposed in Korean Patent No. 10-1191865 includes a sacrificial layer, a metal wiring, and a metal layer, which may be removed by light or a solvent in the manufacturing of a flexible substrate having a metal wiring embedded therein. After the polymer material (flexible substrate) is formed on the substrate, the metal wiring and the polymer material (flexible substrate) are peeled off from the substrate by removing the sacrificial layer using light or a solvent.

However, this method is difficult to remove the sacrificial layer in a large size, there is a problem that can not use a variety of film substrates because the high temperature process is impossible.

[Preceding technical literature]

[Patent Documents]

Korean Patent No. 1191865

SUMMARY OF THE INVENTION An object of the present invention is to provide a film touch sensor and a method of manufacturing the same, in which a process proceeds on a carrier substrate to facilitate formation of a pattern layer or the like.

An object of the present invention is to provide a film touch sensor which is easily peeled from a carrier substrate and a method of manufacturing the same.

1. Separation layer;

A first protective layer on the separation layer; And

And an electrode pattern layer including a sensing electrode formed in the sensing region on the first protective layer and a pad electrode formed in the pad region.

And a region other than the pad electrode in the pad region on the first protective layer is filled with the first protective layer material.

2. In the above 1, the separation layer is a polyimide-based polymer, polyvinyl alcohol-based polymer, polyamic acid-based polymer, polyamide-based polymer, polyethylene (polyethylene) ) Polymer, polystylene polymer, polynorbornene polymer, phenylmaleimide copolymer polymer, polyazobenzene polymer, polyphenylenephthalamide Polymer, polyester polymer, polymethyl methacrylate polymer, polyarylate polymer, cinnamate polymer, coumarin polymer, phthalimidine ( It is made of a polymer selected from the group consisting of phthalimidine-based polymers, chalc (chalcone) -based polymers, aromatic acetylene-based polymers, the film touch sensor.

3. In the above 1, wherein the separation layer is first formed on the carrier substrate and separated from it, the film touch sensor.

4. In the above 3, wherein the separation layer has a peel force of less than 1N / 25mm to the carrier substrate, the film touch sensor.

5. In the above 3, wherein the separation layer has a peel force of less than 0.1N / 25mm to the carrier substrate, the film touch sensor.

6. In the above 3, wherein the carrier substrate is a glass substrate, film touch sensor.

7. In the above 1, wherein the first protective layer covers at least a portion of the side of the separation layer, the film touch sensor.

8. In the above 1, wherein the pad electrode has a surface energy difference of 20 mN / m or less with the separation layer and the first protective layer, the film touch sensor.

9. In the above 1, wherein the electrode pattern layer is formed of at least one material selected from the group consisting of metal oxides, metals, metal nanowires, carbon-based materials and conductive polymer materials, film touch sensor.

10. In the above 1, wherein the electrode pattern layer further comprises a second protective layer located on the first protective layer, film touch sensor.

11. In the above 10, wherein the second protective layer is an adhesive layer, the first protective layer and the second protective layer has a modulus of elasticity difference of less than 300MPa at 25 ℃, film touch sensor.

12. In the above 10, further comprising a base film attached on the second protective layer, the film touch sensor.

13. In the above 12, wherein the base film is attached on the second protective layer through the adhesive layer, the second protective layer and the adhesive layer has a modulus of elasticity difference of less than 300MPa at 25 ℃, the film touch sensor.

14. In the above 12, wherein the base film is a polarizing plate or a transparent film, the touch sensor film.

15. The touch sensor of claim 1, further comprising a circuit board electrically connected to the pad electrode.

16. Touch screen panel comprising the film touch sensor of any one of the above 1 to 15.

17. An image display device including the touch screen panel of 16 above.

18. forming a separation layer on the carrier substrate;

Forming a first passivation layer on the separation layer;

Selectively etching only a portion of the pad region on the first passivation layer on which the pad electrode is to be formed; And

Forming a sensing electrode in a sensing region on the first protective layer and forming a pad electrode in the etched portion.

19. The method of claim 18, further comprising forming a second protective layer on the first protective layer on which the sensing electrode and the pad electrode are formed.

20. The method according to the above 19, wherein the second protective layer is an adhesive layer, the first protective layer and the second protective layer has a modulus of elasticity of 300 MPa or less at 25 ° C.

21. In the above 19, further comprising the step of attaching the base film on the second protective layer, manufacturing method of the film touch sensor.

22. The method according to the above 21, wherein the base film is attached on the second protective layer through the adhesive layer, the second protective layer and the adhesive layer has a modulus of elasticity difference of less than 300MPa at 25 ℃, the manufacturing method of the film touch sensor.

23. The method of 18 above, further comprising the step of peeling the separation layer from the carrier substrate, manufacturing method of the film touch sensor.

24. In the above 18, the separation layer is a polyimide-based polymer, a polyvinyl alcohol-based polymer, a polyamic acid-based polymer, a polyamide-based polymer, polyethylene ) Polymer, polystylene polymer, polynorbornene polymer, phenylmaleimide copolymer polymer, polyazobenzene polymer, polyphenylenephthalamide Polymer, polyester polymer, polymethyl methacrylate polymer, polyarylate polymer, cinnamate polymer, coumarin polymer, phthalimidine ( The film touch sensor is formed of a polymer selected from the group consisting of a phthalimidine polymer, a chalcone polymer, and an aromatic acetylene polymer. Manufacturing method.

25. The method of claim 18, wherein the separation layer has a peel force of 1 N / 25 mm or less on a carrier substrate.

26. The method according to the above 18, wherein the carrier substrate is a glass substrate, a film touch sensor manufacturing method.

27. The method according to the above 18, wherein the first protective layer is formed to cover at least a portion of the side of the separation layer, the method of manufacturing a touch sensor film.

28. The method according to the above 23, further comprising attaching a circuit board on the pad region of the separation layer after the peeling, and electrically connecting the circuit board with the pad electrode.

29. In the above 28, the anisotropic conductive film having a conductive ball in the pad area on the separation layer is placed and then heated and pressurized, so that the conductive ball is connected to the pad electrode through the separation layer, the circuit board is anisotropic The manufacturing method of a film touch sensor connected with an electroconductive film.

The present invention proceeds a process such as forming a pattern layer for implementing a film touch sensor on the carrier substrate, and then attach the base film, thereby preventing heat damage of the base film.

In the present invention, the carrier substrate plays a sufficient supporting role, so that the pattern layer can be easily formed.

In the present invention, the separation layer is also peeled from the carrier substrate at the time of peeling from the carrier substrate, so that the electrode pattern layer can be protected, and then the electrical connection of the circuit board is easy.

In addition, a region other than the pad electrode in the pad region on the first protective layer may be filled with the first protective layer material, thereby preventing damage due to exposure to an etchant of the separation layer.

1 is a cross-sectional view of a film touch sensor according to an embodiment of the present invention.

2 is a plan view of a pad electrode a formed according to the present invention and a pad electrode b otherwise.

3 is a cross-sectional view of a film touch sensor according to an embodiment of the present invention.

4 is a cross-sectional view of a film touch sensor according to an embodiment of the present invention.

5 is a cross-sectional view of a film touch sensor according to an embodiment of the present invention.

6 to 15 is a schematic process diagram of a method of manufacturing a film touch sensor according to an embodiment of the present invention.

The present invention is a separation layer; A first protective layer on the separation layer; And an electrode pattern layer including a sensing electrode formed in the sensing region on the first protective layer and a pad electrode formed in the pad region, wherein a region other than the pad electrode in the pad region on the first protective layer is a first protective layer. The present invention relates to a film touch sensor and a method for manufacturing the same, which can prevent thermal damage to a base film, and can easily form a pattern layer, and prevent damage caused by exposure to an etchant of a separation layer.

Film touch sensor according to an embodiment of the present invention includes a separation layer, the first protective layer and the electrode pattern layer.

1 to 5 are cross-sectional views of a film touch sensor according to an embodiment of the present invention, a plan view of a pad electrode, and FIGS. 6 to 15 illustrate a process of manufacturing a film touch sensor. Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. do.

The separation layer 20 is a layer formed for separation from the carrier substrate 10, and covers the electrode pattern layers 40 and 50 to protect the electrode pattern layers 40 and 50.

The separation layer 20 may be a polymer organic membrane, for example, a polyimide polymer, a polyvinyl alcohol polymer, a polyamic acid polymer, a polyamide polymer , Polyethylene polymer, polystylene polymer, polynorbornene polymer, phenylmaleimide copolymer polymer, polyazobenzene polymer, polyphenylene phthalamide (polyphenylenephthalamide) polymer, polyester polymer, polymethyl methacrylate polymer, polyarylate polymer, cinnamate polymer, coumarin polymer, It may be made of a polymer such as phthalimidine-based polymer, chalcone-based polymer, aromatic acetylene-based polymer, but That's not one. These can be used individually or in mixture of 2 or more types.

The separation layer 20 is easily peeled off from the carrier substrate 10, and the peeling force on the carrier substrate 10 of the material is 1 N so as not to be peeled off from the first protective layer 30 to be described later. It is preferable that the material is / 25 mm or less, more preferably, the material having a peel force of 0.1 N / 25 mm or less on the carrier substrate 10.

The carrier substrate 10 may be used without particular limitation as long as it provides a suitable strength so that it can be fixed without being easily bent or twisted during the process and has little effect on heat or chemical treatment. For example, glass, quartz, silicon wafers, sus etc. may be used, preferably glass may be used.

The first protective layer 30 is located on the separation layer 20.

Like the separation layer 20, the first protective layer 30 covers the electrode pattern layers 40 and 50 to be described later to protect the electrode pattern layers 40 and 50, and the manufacturing process of the film touch sensor of the present invention. The separation layer 20 serves to prevent exposure to the etchant for forming the electrode pattern layers 40 and 50.

As the first protective layer 30, a polymer known in the art may be used without limitation, and for example, may be made of an organic insulating layer.

The first passivation layer 30 may cover at least a portion of the side surface of the separation layer 20 so as to minimize the side surface of the separation layer 20 being exposed to an etchant during a process of patterning patterns to be described later. In the aspect of completely blocking the exposure of the side of the separation layer 20, the first protective layer 30 may preferably cover the entire side of the separation layer 20.

Electrode pattern layers 40 and 50 are disposed on the first passivation layer 30.

The electrode pattern layers 40 and 50 include the sensing electrode 50 and the pad electrode 40.

The sensing electrode 50 may be located in the sensing area on the first protective layer, and the pad electrode 40 may be located in the pad area on the first protective layer. However, since the sensing electrode 50 and the pad electrode 40 must be electrically connected, at least a part of the sensing electrode 50 may be located in the pad area, and at least a part of the pad electrode 40 is located in the sensing area. You may.

The sensing area refers to an area corresponding to the display unit on which the touch is performed in the film touch sensor, and the pad area refers to an area corresponding to the pad part. That is, the sensing area on the first passivation layer refers to an area corresponding to the display unit on the first passivation layer, and the pad area refers to an area corresponding to the pad unit on the first passivation layer.

The electrode pattern layers 40 and 50 may be used without limitation as long as it is a conductive material. For example, indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (IZTO), and aluminum zinc oxide (AZO). ), Gallium zinc oxide (GZO), florin tin oxide (FTO), indium tin oxide-silver-indium tin oxide (ITO-Ag-ITO), indium zinc oxide-silver-indium zinc oxide (IZO-Ag-IZO), Metal oxides selected from the group consisting of indium zinc tin oxide-silver-indium zinc tin oxide (IZTO-Ag-IZTO) and aluminum zinc oxide-silver-aluminum zinc oxide (AZO-Ag-AZO); Metals selected from the group consisting of gold (Au), silver (Ag), copper (Cu), molybdenum (Mo), and APC; Nanowires of metals selected from the group consisting of gold, silver, copper and lead; Carbon-based materials selected from the group consisting of carbon nanotubes (CNT) and graphene; And conductive polymer materials selected from the group consisting of poly (3,4-ethylenedioxythiophene) (PEDOT) and polyaniline (PANI). These can be used individually or in mixture of 2 or more types.

The unit patterns of the electrode pattern layers 40 and 50 may be, for example, triangular, tetragonal, pentagonal, hexagonal, or polygonal polygonal patterns independently of each other.

In addition, the electrode pattern layers 40 and 50 may include a regular pattern. A regular pattern means that the pattern form has regularity. For example, the unit patterns may include, independently of each other, a mesh shape such as a rectangle or a square, or a pattern like a hexagon.

In addition, the electrode pattern layers 40 and 50 may include irregular patterns. Irregular pattern means that the shape of the pattern does not have regularity.

When the electrode pattern layers 40 and 50 are formed of a material such as metal nanowires, carbon-based materials, or polymer materials, the electrode pattern layers 40 and 50 may have a network structure.

In the case of having a network structure, since signals are sequentially transmitted to adjacent patterns in contact with each other, a pattern having high sensitivity can be realized.

The pad electrode 40 may be electrically connected to the circuit board 80 to be described later.

FIG. 2 is a plan view immediately after the pad electrode 40 is formed (a red rectangle means a pad area), as illustrated in FIG. 2A, the pad electrode in the pad area on the first protective layer 30. Regions other than 40 are filled with the first protective layer 30 material.

The pad electrode 40 may be formed by selectively patterning only a portion where the pad electrode 40 is to be formed in the pad region on the first protective layer 30, but is not limited thereto.

As shown in FIG. 2A, when the pad area on the first passivation layer 30 is filled with the material of the first passivation layer 30, the pad area of the separation layer 20 is not exposed. Therefore, at the time of forming the electrode pattern layers 40 and 50, the pad region of the separation layer 20 is not exposed to the etchant. As a result, it is possible to obtain an excellent separation layer 20 in which problems such as cracking, peeling, and deterioration do not occur due to chemical impact caused by etchant.

However, when the pad electrode 40 is formed by etching the entire pad region as shown in FIG. 2B, the pad region of the separation layer 20 is subsequently exposed to the etchant when the electrode pattern layers 40 and 50 are formed. do.

Preferably, in terms of minimizing the exposure of the pad region of the separation layer 20 to the etchant, the pad electrode 40 has a surface energy difference of 20 from the separation layer 20 and the first protective layer 30, respectively. mN / m or less.

As illustrated in FIGS. 2A and 10, the pad electrode 40 is adjacent to the separation layer 20 and the first protective layer 30, and the separation layer 20 of the pad electrode 40 and When the surface energy difference from the first protective layer 30 is 20 mN / m or less (measured according to ASTM D7490), the adhesion of the pad electrode 40 to the separation layer 20 and the first protective layer 30 is reduced. It is excellent and it can suppress that an etchant flows into a clearance gap.

As illustrated in FIG. 3, the film touch sensor of the present invention may further include a second protective layer 60 positioned on the first protective layer on which the electrode pattern layers 40 and 50 are formed.

The second protective layer 60 may itself serve as a substrate and a passivation layer. In addition, corrosion of the electrode pattern layers 40 and 50 may be prevented, and the surface thereof may be planarized to suppress generation of micro bubbles during adhesion to the base film 70. In addition, it may serve as an adhesive layer.

When the second protective layer 60 serves as a substrate or passivation layer, silicone-based polymers such as polydimethylsiloxane (PDMS), polyorganosiloxane (POS); Polyimide-based polymers; It may be made of a polyurethane-based polymer, but is not limited thereto. These can be used individually or in mixture of 2 or more types.

When the second protective layer 60 serves as an adhesive layer, a thermosetting or photocurable pressure-sensitive adhesive or adhesive known in the art may be used without limitation. For example, thermosetting or photocurable adhesives or adhesives, such as polyester type, polyether type, urethane type, epoxy type, silicone type, and acryl type, can be used.

When the second protective layer 60 serves as an adhesive layer, in the film touch sensor of the present invention, the first protective layer 30 and the second protective layer 60 has a modulus of elasticity of 300 MPa or less at 25 ° C. It is preferable from the viewpoint of suppressing crack generation due to the difference in elastic modulus. Modulus of elasticity can be measured with a rheometer or a UTM device.

As illustrated in FIG. 4, the film touch sensor of the present invention may further include a base film 70 attached to the second protective layer 60.

When the second protective layer 60 is an adhesive layer, the base film 70 adheres onto the second protective layer 60, otherwise, through the adhesive layer on the second protective layer 60 as illustrated in FIG. 5. Can be.

In such a case, it is preferable that the second protective insect 60 and the adhesive layer have an elastic modulus difference of 300 MPa or less at 25 ° C in view of suppressing crack generation due to the elastic modulus difference.

As the base film 70, a transparent film made of a material widely used in the art may be used without limitation, and for example, a cellulose ester (eg, cellulose triacetate, cellulose propionate, cellulose butyrate, cellulose acetate) Propionate, and nitrocellulose), polyimide, polycarbonate, polyester (e.g. polyethylene terephthalate, polyethylene naphthalate, poly-1,4-cyclohexanedimethylene terephthalate, polyethylene 1,2-diphenoxyethane -4,4'-dicarboxylate and polybutylene terephthalate, polystyrene (e.g. syndiotactic polystyrene), polyolefins (e.g. polypropylene, polyethylene and polymethylpentene), polysulfones, polyether sulfones , Polyarylate, polyether-imide, polymethylmethacrylate, polyether ketone, It may be a film made of a single or a mixture thereof selected from the group consisting of polyvinyl alcohol and polyvinyl chloride.

In addition, the transparent film may be an isotropic film or a retardation film.

In the case of an isotropic film, in-plane retardation (Ro, Ro = [(nx-ny) xd], nx, ny are principal refractive index in the film plane, nz is refractive index in the film thickness direction, d is film thickness) is 40 nm or less, and 15 nm The thickness direction retardation (Rth, Rth = [(nx + ny) / 2-nz] xd) is preferably -90 nm to +75 nm, preferably -80 nm to +60 nm, particularly -70 nm to +45 nm. desirable.

Retardation film is a film produced by the method of uniaxial stretching, biaxial stretching, polymer coating, liquid crystal coating of a polymer film, and is generally used for improving and adjusting optical properties such as viewing angle compensation, color reduction, light leakage improvement, and color control of a display. do.

In addition, a polarizing plate can also be used for the base film 70.

The polarizing plate may be a polarizer protective film is attached to one side or both sides of the polyvinyl alcohol polarizer.

In addition, a protective film may be used as the base film 70.

The protective film may be a film including an adhesive layer on at least one surface of a film made of a polymer resin or a film having a self-adhesive property such as polypropylene, and may be used for protecting the touch sensor surface and improving process resolution.

The light transmittance of the base film 70 is preferably 85% or more, more preferably 90% or more. Moreover, it is preferable that the total haze value measured according to JISK7136 is 10% or less, and, as for the said base film 70, it is more preferable that it is 7% or less.

Although the thickness of the said base film 70 is not restrict | limited, Preferably it is 30-150 micrometers, More preferably, it is 70-120 micrometers.

In addition, the film touch sensor of the present invention may further include a circuit board 80.

The circuit board 80 may be a flexible printed circuit board (FPCB).

The circuit board 80 may be electrically connected to the pad electrode.

Specifically, the case in which the separation layer 20 is attached will be described. The circuit board 80 may be connected to the pad electrode 40 through an anisotropic conductive film (ACF).

The anisotropic conductive film may have a form in which conductive balls, which are conductive particles, are dispersed in the curable resin.

The conductive ball may be nickel, nickel, or a gold alloy, and the curable resin may be an acrylic or epoxy resin, but is not limited thereto.

Commercially available conductive balls include, for example, the TGP series of H & C High Tech.

The film touch sensor of the present invention as described above may be used as a film touch sensor after peeling from the carrier substrate 10.

In addition, the present invention provides a touch screen panel including the film touch sensor, and an image display device including the same.

The touch screen panel of the present invention can be applied to various image display devices such as electroluminescent display devices, plasma display devices, field emission display devices, as well as ordinary liquid crystal display devices. In addition, the present invention can be particularly usefully applied to an image display device having flexible characteristics.

In addition, the present invention provides a method of manufacturing the film touch sensor.

Hereinafter, a method of manufacturing a film touch sensor according to an embodiment of the present invention will be described in detail.

According to one embodiment of the method of manufacturing the film touch sensor of the present invention, first, as shown in FIG. 6, the separation layer 20 is formed on the carrier substrate 10.

The carrier substrate 10 may be used without particular limitation as long as it provides a suitable strength so that it can be fixed without being easily bent or twisted during the process and has little effect on heat or chemical treatment. For example, glass, quartz, silicon wafers, sus etc. may be used, preferably glass may be used.

The separation layer 20 may be formed of the aforementioned polymer material.

In the case of the pad electrode 40 formed of a metal material, which will be described later, it may be difficult to peel from the carrier substrate 10, but in the case of the separation layer 20, the separation layer 20 may be separated from the carrier substrate 10. In the case of forming the film, the impact applied to the film touch sensor at the time of peeling from the carrier substrate 10 may be reduced, thereby reducing problems such as damage to the electrode pattern layers 40 and 50.

Preferably, the separation layer 20 may have a peel force of 1 N / 25 mm or less, preferably 0.1 N / 25 mm or less, in terms of minimizing physical damage applied to the peeling.

The formation method of the separation layer 20 is not specifically limited, Slit coating method, knife coating method, spin coating method, casting method, micro gravure coating method, gravure coating method, bar coating method, roll coating method, wire bar coating method To methods known in the art such as dip coating, spray coating, screen printing, gravure printing, flexographic printing, offset printing, inkjet coating, dispenser printing, nozzle coating, capillary coating, etc. You can.

After forming the separation layer 20 by the method described above, an additional curing process may be further performed.

The hardening method of the separation layer 20 is not specifically limited, either photocuring or thermosetting, or both methods can be used. The order in which both photocuring and thermosetting are performed is not specifically limited.

As the curing conditions, for example, in the case of thermosetting, it can be performed for 1 minute to 60 minutes at 50 to 300 ℃, preferably at 5 to 30 minutes at 100 to 200 ℃. In the case of photocuring, UV of 0.01 to 10 J / cm 2 may be irradiated for 1 second to 500 seconds, and preferably, UV of 0.05 to 1 J / cm 2 may be irradiated for 1 second to 120 seconds, but is not limited thereto.

Thereafter, as shown in FIG. 7, the first protective layer 30 is formed on the separation layer 20.

The first protective layer 30 may be formed of the material described above, and the method of forming the first protective layer 30 is not particularly limited, and the same method as the method of forming the separation layer 20 may be used.

The first protective layer 30 may be formed to cover at least a part of the side of the separation layer 20 so as to minimize the side surface of the separation layer 20 exposed to an etchant during a process such as patterning patterns to be described later. have. In terms of completely blocking the exposure of the side of the separation layer 20, the first protective layer 30 may be formed to cover all of the side surfaces of the separation layer 20.

Next, as shown in FIG. 8 and FIG. 2A, only a portion of the pad region on the first protective layer 30 on which the pad electrode 40 is to be formed is selectively etched.

When the entire pad region on the first passivation layer 30 is etched as shown in FIG. 2B, a part of the pad region of the separation layer 20 is exposed even when or after the pad electrode 40 is formed. Accordingly, the exposed portion of the separation layer 20 is exposed to chemicals such as etchant and stripper when the pad electrode 40 is formed or the sensing electrode 50 to be described later. May occur.

However, since the present invention selectively etches only a portion of the pad region on the first passivation layer 30 where the pad electrode 40 is to be formed, after forming the pad electrode 40 at the etching portion, the first passivation layer 30 The lower separation layer 20 is not exposed at all. Accordingly, the problem of exposure to the etchant can be solved.

Thereafter, as shown in FIGS. 9 and 10, a pad electrode 40 is formed on the etched portion.

The pad electrode 40 may be formed of the above-described metal or metal oxide.

The method for forming the pad electrode 40 is not particularly limited, and physical vapor deposition, chemical vapor deposition, plasma deposition, plasma polymerization, thermal deposition, thermal oxidation, anodic oxidation, cluster ion beam deposition, screen printing, gravure printing, flexo It may be by a method known in the art, such as a printing method, an offset printing method, an inkjet coating method, a dispenser printing method.

In terms of more reliably preventing exposure of the separation layer 20 to an etchant, the pad electrode 40 may be formed to have a wider width than the etching area, leaving the etching area, thereby forming the first protective layer 30. It may be formed to further cover some of the pad region of the image.

FIG. 11 is a view of the film touch sensor viewed from the pad region side after forming the pad electrode 40. Thus, when the width of the pad electrode 40 is formed to have a wider width than the etching site, the film touch sensor is etched. You can more reliably prevent the etchant from flowing into the gap.

12 and 13, the sensing electrode 50 is formed in the sensing area on the first protective layer 30.

The sensing electrode 50 may be formed of the above-described metal oxides, metals, nanowires, carbon-based materials, polymer materials, and the like.

The formation method of the sensing electrode 50 is not specifically limited, The same method as the formation method of the pad electrode 40 can be used.

In the case of forming the unit patterns of the sensing electrode 50 and the pad electrode 40, the photoetching method may be used.

The photoetching method is to apply a photoresist on the layer to be patterned, to selectively cure the applied photoresist using a mask, to develop and remove the uncured photoresist, and then to etch to form a pattern, A method of forming a pattern through a series of processes known in the art to remove the cured photoresist.

Photoresist can be divided into positive type photoresist and negative type photoresist. Positive type photoresist is soluble to developer upon UV exposure, and negative type is insoluble to developer upon UV exposure. Photoresist.

Therefore, in the case of using a positive type, a portion exposed to UV may be developed, and a pattern may be formed through a subsequent process. In the case of a negative type, a portion not exposed to UV may be developed, and a pattern may be formed through a subsequent process. Can be.

Conditions for curing the photoresist are not particularly limited, and for example, UV of 0.01 to 10 J / cm 2 can be irradiated for 1 second to 500 seconds, and preferably UV of 0.05 to 1 J / cm 2 for 1 second to 120 seconds. You can investigate.

The present invention may further include forming a second protective layer 60 on the first protective layer 30 on which the sensing electrode 50 and the pad electrode 40 are formed.

The second protective layer 60 may itself serve as a substrate and a passivation layer. In addition, corrosion of the electrode pattern layers 40 and 50 may be prevented, and the surface thereof may be planarized to suppress generation of micro bubbles during adhesion to the base film 70. In addition, it may serve as an adhesive layer.

The second protective layer 60 may be formed of the aforementioned polymer or the aforementioned adhesive or adhesive.

When the second protective layer 60 serves as an adhesive layer, the first protective layer 30 and the second protective layer 60 may have the aforementioned elastic modulus difference.

The present invention may further include attaching the base film 70 on the second protective layer 60 as shown in FIG. 14.

The base film 70 may be a film made of the aforementioned material, or a polarizing plate, a retardation film, or a protective film.

The polarizing plate may be a polarizer protective film is attached to one side or both sides of the polyvinyl alcohol polarizer.

When the second protective layer 60 serves as a substrate, the base film 70 may be attached onto the second protective layer 60 through the above-described thermosetting or photocurable adhesive. In such a case, the second protective layer 60 and the adhesive layer may have the above-described elastic modulus difference.

The base film 70 may be attached under pressure, and the pressure range applied is not particularly limited, and may be, for example, 1 to 200 Kg / cm 2 and preferably 10 to 100 Kg / cm 2.

At the time of attachment of the base film 70, in order to improve the adhesion between the base film 70 and the second protective layer 60, the corona treatment, the flame treatment, the plasma treatment, the ultraviolet ray are applied to the surface to which the base film 70 is attached. Surface treatment, such as irradiation, a primer application | coating process, and saponification process, can be performed.

Thereafter, the separation layer 20 is peeled off from the carrier substrate 10.

Even after the peeling, the separation layer 20 may remain on the side of the film touch sensor without being removed to serve as a coating to protect the electrode pattern layers 40 and 50.

After the separation layer 20 is peeled off from the carrier substrate 10, the circuit board 80 may be attached to the pad region of the separation layer 20 as shown in FIG. 15.

The circuit board 80 is electrically connected to the pad electrode 40.

Electrical connection between the circuit board 80 and the pad electrode 40 may be performed through an anisotropic conductive film.

The anisotropic conductive film may have a form in which conductive balls, which are conductive particles, are dispersed in the curable resin.

The conductive ball may be nickel, nickel, or a gold alloy, and the curable resin may be an acrylic or epoxy resin, but is not limited thereto.

Specifically, the electrical connection is performed by first placing an anisotropic conductive film having conductive balls in the pad region on the separation layer 20, and then heating and pressing. Then, the conductive ball penetrates through the separation layer 20 and is connected to the pad electrode 40. Then, the circuit board 80 can be electrically connected to the pad electrode 40 by connecting the circuit board 80 with the anisotropic conductive film.

According to another embodiment of the present invention, the separation layer 20 may be removed from the carrier substrate 10, and then the separation layer 20 of the pad region may be chemically removed.

The chemical liquid used for the removal of the separation layer 20 can be used without limitation, the chemical liquid used in the removal of the polymer in the art, for example, basic chemicals such as KOH, TMAH, amines; Acidic chemicals such as phosphoric acid, acetic acid and nitric acid can be used. These can be used individually or in mixture of 2 or more types.

After removing the separation layer 20, the circuit board 80 may be attached to the first protective layer side to be electrically connected to the pad electrode 40.

Since the manufacturing method of the film touch sensor of the present invention including the above step proceeds with the process of forming a pattern layer for implementing the film touch sensor on the carrier substrate 10, and then attaches the base film 70, Heat damage of the base film 70 can be prevented.

And, if the pattern layer is formed on the base film 70 according to a conventional method, the base film 70 may not play a sufficient support role when using a thin base film 70, the present invention is a carrier Since the pattern layer is formed on the substrate 10, the pattern layer can be easily formed without occurrence of such a problem.

In addition, since the separation layer 20 also peels off from the carrier substrate 10 at the time of peeling from the carrier substrate 10, the electrode pattern layers 40 and 50 can be protected, and then the electrical circuit of the circuit board 80 is removed. Easy to connect

In addition, since the pad electrode 40 is formed by selectively etching the pad region on the first passivation layer 30, damage due to exposure to an etchant of the separation layer 20 may be prevented.

Preferred embodiments have been presented to aid the understanding of the present invention as described above, but these embodiments are merely illustrative of the present invention and are not intended to limit the scope of the appended claims, but are implemented within the scope and spirit of the present invention. It is obvious to those skilled in the art that various changes and modifications to the examples are possible, and it is natural that such variations and modifications fall within the scope of the appended claims.

[Description of the code]

10 carrier substrate 20 separation layer

30: first protective layer 40: pad electrode

50: sensing electrode 60: second protective layer

70: base film 80: circuit board

90: adhesive layer

Claims (29)

Separation layer; A first protective layer on the separation layer; And And an electrode pattern layer including a sensing electrode formed in the sensing region on the first protective layer and a pad electrode formed in the pad region. And a region other than the pad electrode in the pad region on the first protective layer is filled with the first protective layer material. The method of claim 1, wherein the separation layer is a polyimide-based polymer, a polyvinyl alcohol-based polymer, a polyamic acid-based polymer, a polyamide-based polymer, a polyethylene-based Polymer, polystylene-based polymer, polynorbornene-based polymer, phenylmaleimide copolymer-based polymer, polyazobenzene-based polymer, polyphenylenephthalamide-based polymer, Polyester polymer, polymethyl methacrylate polymer, polyarylate polymer, cinnamate polymer, coumarin polymer, phthalimidine Film touch sensor made of a polymer selected from the group consisting of a polymer, a chalcone (chalcone) polymer, an aromatic acetylene polymer . The film touch sensor of claim 1, wherein the separation layer is first formed on and separated from a carrier substrate. The film touch sensor of claim 3, wherein the separation layer has a peel force of 1 N / 25 mm or less on a carrier substrate. The film touch sensor of claim 3, wherein the separation layer has a peel force of 0.1 N / 25 mm or less on a carrier substrate. The film touch sensor of claim 3, wherein the carrier substrate is a glass substrate. The film touch sensor of claim 1, wherein the first protective layer covers at least a portion of a side of the separation layer. The film touch sensor of claim 1, wherein the pad electrode has a surface energy difference of 20 mN / m or less from the separation layer and the first protective layer. The film touch sensor of claim 1, wherein the electrode pattern layer is formed of at least one material selected from the group consisting of metal oxides, metals, metal nanowires, carbon-based materials, and conductive polymer materials. The touch sensor of claim 1, further comprising a second passivation layer on the first passivation layer on which the electrode pattern layer is formed. The film touch sensor according to claim 10, wherein the second protective layer is an adhesive layer, and the first protective layer and the second protective layer have elastic modulus differences of 25 MPa or less at 25 ° C. The film touch sensor of claim 10, further comprising a base film attached on the second protective layer. The film touch sensor according to claim 12, wherein the base film is attached onto the second protective layer through an adhesive layer, and the second protective layer and the adhesive layer have an elastic modulus difference of 25 MPa or less at 25 ° C. The film touch sensor according to claim 12, wherein the base film is a polarizing plate or a transparent film. The film touch sensor of claim 1, further comprising a circuit board electrically connected to the pad electrode. A touch screen panel comprising the film touch sensor of claim 1. An image display device comprising the touch screen panel of claim 16. Forming a separation layer on the carrier substrate; Forming a first passivation layer on the separation layer; Selectively etching only a portion of the pad region on the first passivation layer on which the pad electrode is to be formed; And Forming a sensing electrode in a sensing region on the first protective layer and forming a pad electrode in the etched portion. The method of claim 18, further comprising forming a second protective layer on the first protective layer on which the sensing electrode and the pad electrode are formed. The method of claim 19, wherein the second protective layer is an adhesive layer, and the first protective layer and the second protective layer have an elastic modulus difference of 300 MPa or less at 25 ° C. 20. The method of claim 19, further comprising attaching a base film on the second protective layer. The method of claim 21, wherein the base film is attached onto the second protective layer through an adhesive layer, and the second protective layer and the adhesive layer have an elastic modulus difference of 25 MPa or less at 25 ° C. 25. The method of claim 18, further comprising peeling the separation layer from the carrier substrate. The method of claim 18, wherein the separation layer is a polyimide-based polymer, a polyvinyl alcohol-based polymer, a polyamic acid-based polymer, a polyamide-based polymer, a polyethylene-based Polymer, polystylene-based polymer, polynorbornene-based polymer, phenylmaleimide copolymer-based polymer, polyazobenzene-based polymer, polyphenylenephthalamide-based polymer, Polyester polymer, polymethyl methacrylate polymer, polyarylate polymer, cinnamate polymer, coumarin polymer, phthalimidine Film touch sensor formed of a polymer selected from the group consisting of a polymer, a chalcone polymer, and an aromatic acetylene polymer Method. The method of claim 18, wherein the separation layer has a peel force of 1 N / 25 mm or less on a carrier substrate. The method of claim 18, wherein the carrier substrate is a glass substrate. The method of claim 18, wherein the first protective layer is formed to cover at least a portion of the side of the separation layer. The method of claim 23, further comprising attaching a circuit board on the pad area of the separation layer after the exfoliation, and electrically connecting the circuit board with the pad electrode. 29. The anisotropic conductive film of claim 28, wherein the anisotropic conductive film having conductive balls is placed in a pad region on the separation layer, and then heated and pressed to connect the conductive balls to the pad electrodes through the separation layer, and the circuit board is anisotropic conductive film. The manufacturing method of the film touch sensor connected with.

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