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WO2016089362A1 - Systèmes de bassin thermique permettant de refroidir un ensemble moule - Google Patents

Systèmes de bassin thermique permettant de refroidir un ensemble moule Download PDF

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Publication number
WO2016089362A1
WO2016089362A1 PCT/US2014/068026 US2014068026W WO2016089362A1 WO 2016089362 A1 WO2016089362 A1 WO 2016089362A1 US 2014068026 W US2014068026 W US 2014068026W WO 2016089362 A1 WO2016089362 A1 WO 2016089362A1
Authority
WO
WIPO (PCT)
Prior art keywords
thermal
quench plate
mold assembly
quench
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2014/068026
Other languages
English (en)
Inventor
Clayton Arthur OWNBY
Grant O. COOK III
Jeffrey G. Thomas
Christopher Charles PROPES
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Halliburton Energy Services Inc
Original Assignee
Halliburton Energy Services Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Halliburton Energy Services Inc filed Critical Halliburton Energy Services Inc
Priority to US14/889,260 priority Critical patent/US20160346835A1/en
Priority to PCT/US2014/068026 priority patent/WO2016089362A1/fr
Publication of WO2016089362A1 publication Critical patent/WO2016089362A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D30/00—Cooling castings, not restricted to casting processes covered by a single main group
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D27/00—Treating the metal in the mould while it is molten or ductile ; Pressure or vacuum casting
    • B22D27/04—Influencing the temperature of the metal, e.g. by heating or cooling the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D27/00—Treating the metal in the mould while it is molten or ductile ; Pressure or vacuum casting
    • B22D27/04—Influencing the temperature of the metal, e.g. by heating or cooling the mould
    • B22D27/045—Directionally solidified castings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/12—Both compacting and sintering
    • B22F3/14—Both compacting and sintering simultaneously
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/10—Alloys containing non-metals
    • C22C1/1036—Alloys containing non-metals starting from a melt
    • C22C1/1068—Making hard metals based on borides, carbides, nitrides, oxides or silicides
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D15/00—Handling or treating discharged material; Supports or receiving chambers therefor
    • F27D15/02—Cooling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/02—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by influencing fluid boundary
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F28F13/12—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F25/00—Component parts of trickle coolers
    • F28F25/02—Component parts of trickle coolers for distributing, circulating, and accumulating liquid
    • F28F25/06—Spray nozzles or spray pipes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/24—After-treatment of workpieces or articles
    • B22F3/26—Impregnating
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C29/00—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides
    • C22C29/02—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on carbides or carbonitrides
    • C22C29/06—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on carbides or carbonitrides based on carbides, but not containing other metal compounds
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B5/00—Muffle furnaces; Retort furnaces; Other furnaces in which the charge is held completely isolated

Definitions

  • Rotary drill bits are often used to drill wellbores.
  • One type of rotary drill bit is a fixed-cutter drill bit that has a bit body comprising matrix and reinforcement materials, i.e., a "matrix drill bit" as referred to herein.
  • Matrix drill bits are typically manufactured by placing powder material into a mold and infiltrating the powder material with a binder material, such as a metallic alloy.
  • the various features of the resulting matrix drill bit, such as blades, cutter pockets, and/or fluid-flow passageways, may be provided by shaping the mold cavity and/or by positioning temporary displacement materials within interior portions of the mold cavity.
  • a preformed bit blank (or steel mandrel) may be placed within the mold cavity to provide reinforcement for the matrix bit body and to allow attachment of the resulting matrix drill bit with a drill string.
  • a quantity of matrix reinforcement material (typically in powder form) may then be placed within the mold cavity with a quantity of the binder material.
  • the mold is then placed within a furnace and heated to a desired temperature to allow the binder (e.g., metallic alloy) to liquefy and infiltrate the matrix reinforcement material.
  • the furnace typically maintains a desired temperature until the infiltration process is deemed complete, such as when a specific location in the bit reaches a certain temperature.
  • the mold is then removed from the furnace and begins to rapidly lose heat to its surrounding environment via heat transfer, such as radiation and/or convection in all directions.
  • one or more intermediate regions within the bit body may sol idify prior to adjacent regions and thereby stop the flow of molten material to locations where shrinkage porosity is developing .
  • shrinkage porosity may result in poor metal l urgical bonding at the interface between the bit blank and the molten materials, which can resu lt in the formation of cracks within the bit body that can be difficu lt or impossible to inspect.
  • This additional cool ing can produce mu ltiple sol idification fronts, which could resu lt in blank bond-l ine cracking, apex cracking, binder-rich zones, bevel cracking, a nd cracking between nozzles.
  • FIG. 1 is a perspective view of a n exemplary fixed-cutter drill bit that may be fabricated in accordance with the principles of the present disclosu re.
  • FIG. 2 is a cross-sectional view of the dril l bit of FIG. 1.
  • FIG. 3 is a cross-sectiona l side view of an exemplary mold assembly for use in forming the drill bit of FIG. 1.
  • FIGS. 4A-4C are progressive schematic diagrams of a n exemplary method of fabricating a dril l bit.
  • FIGS. 5A-5C are partial cross-sectional side views of exemplary thermal sink systems used to cool the mold assembly of FIG. 3.
  • FIG. 6 is a partial cross-sectional side view of another exemplary thermal sink system used to cool the mold assembly of FIG. 3.
  • FIGS. 7A-7C depict exemplary flow channel designs that may be employed in a quench plate.
  • FIGS. 8A and 8B are partial cross-sectional side views of additional exemplary thermal sink systems used to cool the mold assembly of FIG. 3.
  • FIG. 9 is an isometric view of an exemplary quench plate. DETAILED DESCRIPTION
  • the present disclosure relates to downhole tool manufacturing and, more particularly, to thermal sink systems having impermeable quench plates that prevent the influx of steam or vapor during cooling of infiltrated downhole tools.
  • the embodiments described herein provide thermal sink systems that may be used to help cool a mold assembly following an infiltration process for an infiltrated downhole tool.
  • the thermal sink systems described herein include a quench plate configured to prevent the mold assembly from being exposed to a thermal fluid that is used to help cool the mold assembly through the quench plate.
  • the thermal fluid may either impinge upon the bottom of the quench plate or flow through one or more flow channels defined through the quench plate to exchange thermal energy with the mold assembly across or through the quench plate via thermal conduction.
  • the impermeable quench plate may prevent any vapor that may be generated from the thermal fluid from escaping into an insulation enclosure placed about the mold assembly and resting on the quench plate.
  • the quench plate may include an insert made of a thermally conductive material that accelerates heat transfer between the mold assembly and the thermal fluid through the quench plate.
  • FIG. 1 illustrates a perspective view of an example fixed-cutter drill bit 100 that may be fabricated in accordance with the principles of the present disclosure. It should be noted that, while FIG. 1 depicts a fixed-cutter drill bit 100, the principles of the present disclosure are equally applicable to any type of downhole tool that may be formed or otherwise manufactured through an infiltration process.
  • suitable infiltrated downhole tools include, but are not limited to, oilfield drill bits or cutting tools (e.g., fixed-angle drill bits, roller-cone drill bits, coring drill bits, bi-center drill bits, impregnated drill bits, reamers, stabilizers, hole openers, cutters, cutting elements), non-retrievable drilling components, aluminum drill bit bodies associated with casing drilling of wellbores, drill-string stabilizers, cones for roller-cone drill bits, models for forging dies used to fabricate support arms for roller-cone drill bits, arms for fixed reamers, arms for expandable reamers, internal components associated with expandable reamers, sleeves attached to an uphole end of a rotary drill bit, rotary steering tools, logging-while-drilling tools, measurement-while-drilling tools, side-wall coring tools, fishing spears, washover tools, rotors, stators and/or housings for downhole drilling motors,
  • oilfield drill bits or cutting tools e.g
  • the fixed-cutter drill bit 100 may include or otherwise define a plurality of cutter blades 102 arranged along the circumference of a bit head 104.
  • the bit head 104 is connected to a shank 106 to form a bit body 108.
  • the shank 106 may be connected to the bit head 104 by welding, brazing, or other fusion methods, such as using submerged arc or metal inert gas arc welding that results in the formation of a weld 110 around a weld groove 112.
  • the shank 106 may further include or otherwise be connected to a threaded pin 114.
  • the drill bit 100 includes five cutter blades 102, in which multiple recesses or pockets 116 are formed.
  • Cutting elements 118 may be fixedly installed within each pocket 116. This can be done, for example, by brazing each cutting element 118 into a corresponding pocket 116. As the drill bit 100 is rotated in use, the cutting elements 118 engage the rock and underlying earthen materials, to dig, scrape or grind away the material of the formation being penetrated.
  • drilling fluid or "mud” can be pumped downhole through a drill string (not shown) coupled to the drill bit 100 at the threaded pin 114.
  • the drilling fluid circulates through and out of the drill bit 100 at one or more nozzles 120 positioned in nozzle openings 122 defined in the bit head 104.
  • Junk slots 124 are formed between each adjacent pair of cutter blades 102. Cuttings, downhole debris, formation fluids, drilling fluid, etc., may pass through the junk slots 124 and circulate back to the well surface within an annulus formed between exterior portions of the drill string and the inner wall of the wellbore being drilled.
  • FIG. 2 is a cross-sectional side view of the drill bit 100 of FIG. 1. Similar numerals from FIG. 1 that are used in FIG. 2 refer to similar components that are not described again.
  • the shank 106 may be securely attached to a metal blank (or mandrel) 202 at the weld 110 and the metal blank 202 extends into the bit body 108.
  • the shank 106 and the metal blank 202 are generally cylindrical structures that define corresponding fluid cavities 204a and 204b, respectively, in fluid communication with each other.
  • the fluid cavity 204b of the metal blank 202 may further extend longitudinally into the bit body 108.
  • At least one flow passageway may extend from the fluid cavity 204b to exterior portions of the bit body 108.
  • the nozzle openings 122 may be defined at the ends of the flow passageways 206a and 206b at the exterior portions of the bit body 108.
  • the pockets 116 are formed in the bit body 108 and are shaped or otherwise configured to receive the cutting elements 118 (FIG. 1).
  • FIG. 3 is a cross-sectional side view of a mold assembly 300 that may be used to form the drill bit 100 of FIGS. 1 and 2. While the mold assembly 300 is shown and discussed as being used to help fabricate the drill bit 100, those skilled in the art will readily appreciate that mold assembly 300 and its several variations described herein may be used to help fabricate any of the infiltrated downhole tools mentioned above, without departing from the scope of the disclosure.
  • the mold assembly 300 may include several components such as a mold 302, a gauge ring 304, and a funnel 306.
  • the funnel 306 may be operatively coupled to the mold 302 via the gauge ring 304, such as by corresponding threaded engagements, as illustrated.
  • the gauge ring 304 may be omitted from the mold assembly 300 and the funnel 306 may instead be operatively coupled directly to the mold 302, such as via a corresponding threaded engagement, without departing from the scope of the disclosure.
  • the mold assembly 300 may further include a binder bowl 308 and a cap 310 placed above the funnel 306.
  • the mold 302, the gauge ring 304, the funnel 306, the binder bowl 308, and the cap 310 may each be made of or otherwise comprise graphite or alumina (Al 2 0 3 ), for example, or other suitable materials.
  • An infiltration chamber 312 may be defined or otherwise provided within the mold assembly 300. Materials, such as consolidated sand or graphite, may be positioned within the mold assembly 300 at desired locations to form various features of the drill bit 100 (FIGS. 1 and 2).
  • consolidated sand legs 314a and 314b may be positioned to correspond with desired locations and configurations of the flow passageways 206a, b (FIG. 2) and their respective nozzle openings 122 (FIGS. 1 and 2).
  • a cylindrically-shaped consolidated central displacement 316 may be placed on the legs 314a, b. The number of legs 314a, b extending from the central displacement 316 will depend upon the desired number of flow passageways and corresponding nozzle openings 122 in the drill bit 100.
  • matrix reinforcement materials 318 may then be placed within the mold assembly 300.
  • Suitable matrix reinforcement materials 318 include, but are not limited to, tungsten carbide, monotungsten carbide (WC), ditungsten carbide (W 2 C), macrocrystalline tungsten carbide, other metal carbides, metal borides, metal oxides, metal nitrides, natural and synthetic diamond, and polycrystalline diamond (PCD).
  • tungsten carbide monotungsten carbide (WC), ditungsten carbide (W 2 C), macrocrystalline tungsten carbide, other metal carbides, metal borides, metal oxides, metal nitrides, natural and synthetic diamond, and polycrystalline diamond (PCD).
  • PCD polycrystalline diamond
  • examples of other metal carbides may include, but are not limited to, titanium carbide and tantalum carbide, and various mixtures of such materials may also be used.
  • the metal blank 202 may be supported at least partially by the matrix reinforcement materials 318 within the infiltration chamber 312. More particularly, after a sufficient volume of the matrix reinforcement materials 318 has been added to the mold assembly 300, the metal blank 202 may then be placed within mold assembly 300.
  • the metal blank 202 may include an inside diameter 320 that is greater than an outside diameter 322 of the central displacement 316, and various fixtures (not expressly shown) may be used to position the metal blank 202 within the mold assembly 300 at a desired location.
  • the matrix reinforcement materials 318 may then be filled to a desired level within the infiltration chamber 312.
  • Binder material 324 may then be placed on top of the matrix reinforcement materials 318, the metal blank 202, and the central displacement 316.
  • binder materials 324 may be used and include, but are not limited to, metallic alloys of copper (Cu), nickel (Ni), manganese (Mn), lead (Pb), tin (Sn), cobalt (Co), phosphorous (P), and silver (Ag).
  • the binder material 324 may be covered with a flux layer (not expressly shown).
  • the amount of binder material 324 and optional flux material added to the infiltration chamber 312 should be at least enough to infiltrate the matrix reinforcement materials 318 during the infiltration process.
  • some or all of the binder material 324 may be placed in the binder bowl 308, which may be used to distribute the binder material 324 into the infiltration chamber 312 via various conduits 326 that extend therethrough.
  • the cap 310 (if used) may then be placed over the mold assembly 300, thereby readying the mold assembly 300 for heating.
  • FIGS. 4A-4C illustrated are schematic diagrams that sequentially illustrate an example method of heating and cooling the mold assembly 300 of FIG. 3, in accordance with the principles of the present disclosure.
  • the mold assembly 300 is depicted as being positioned within a furnace 402. The temperature of the mold assembly 300 and its contents are elevated within the furnace 402 until the binder material 324 liquefies and is able to infiltrate the matrix reinforcement materials 318.
  • the mold assembly 300 is then removed from the furnace 402 and immediately begins to lose heat by radiating thermal energy to its surroundings while heat is also convected away by cooler air outside the furnace 402.
  • the mold assembly 300 may be transported to and set down upon a thermal sink 404.
  • the radiative and convective heat losses from the mold assembly 300 to the environment continue until an insulation enclosure 406 is lowered around the mold assembly 300.
  • the insulation enclosure 406 may be a rigid shell or structure used to insulate the mold assembly 300 and thereby slow the cooling process.
  • the insulation enclosure 406 may include a hook 408 attached to a top surface thereof.
  • the hook 408 may provide an attachment location whereby the insulation enclosure 406 may be grasped and/or otherwise attached to for transport. For instance, a chain or wire 410 may be coupled to the hook 408 to lift and move the insulation enclosure 406, as illustrated.
  • the insulation enclosure 406 may include an outer frame 412, an inner frame 414, and insulation material 416 arranged between the outer and inner frames 412, 414.
  • both the outer frame 412 and the inner frame 414 may be made of rolled steel and shaped ⁇ i.e., bent, welded, etc.) into the general shape, design, and/or configuration of the insulation enclosure 406.
  • the inner frame 414 may be a metal wire mesh that holds the insulation material 416 between the outer frame 412 and the inner frame 414.
  • the insulation material 416 may be selected from a variety of insulative materials.
  • the insulation material 416 may be a ceramic fiber blanket, such as INSWOOL® or the like.
  • the insulation enclosure 406 may enclose the mold assembly 300 such that thermal energy radiating from the mold assembly 300 is dramatically reduced from the top and sides of the mold assembly 300 and is instead directed substantially downward and otherwise toward/into the thermal sink 404 or back towards the mold assembly 300. With the insulation enclosure 406 positioned over the mold assembly 300 and the thermal sink 404 in operation, the majority of the thermal energy is transferred through the bottom 418 of the mold assembly 300 and into the thermal sink 404.
  • This controlled cooling of the mold assembly 300 and its contents allows an operator to regulate or control the thermal profile of the mold assembly 300 to a certain extent and may help facilitate directional solidification of the molten contents within the mold assembly 300, where axial solidification of the molten contents dominates radial solidification.
  • the face of the drill bit ⁇ i.e., the end of the drill bit that includes the cutters
  • the shank 106 FIG. 1
  • the drill bit 100 (FIGS. 1 and 2) may be cooled axially upward, from the cutters 118 (FIG.
  • the thermal sink 404 may comprise a system that includes a quench plate designed to circulate a fluid (e.g., water) at a reduced temperature relative to the mold assembly 300 (i.e., at or near ambient) to draw thermal energy from the mold assembly 300 and into the circulating fluid, and thereby reduce the temperature of the mold assembly 300.
  • a fluid e.g., water
  • vapor refers to any gasified liquid including, but not limited to, water vapor in the form of steam. This additional cooling can produce unwanted solidification fronts within the mold assembly 300, which could result in defects caused by lack of thermal control.
  • the embodiments of the present disclosure describe several concepts for reducing or eliminating the influx of vapor into the interior of the insulation enclosure 406.
  • FIGS. 5A-5C illustrated are partial cross- sectional side views of exemplary thermal sink systems 500 that may be used to cool the mold assembly 300, according to one or more embodiments. More particularly, FIG. 5A depicts a first thermal sink system 500a, FIG. 5B depicts a second thermal sink system 500b, and FIG. 5C depicts a third thermal sink system 500c. Each thermal sink system 500a-c may be similar in some respects to the thermal sink 404 described above with reference to FIGS. 4B and 4C. As illustrated, each thermal sink system 500a-c may include a quench plate 502, a table 504 that supports the quench plate 502, and a fluid reservoir 506 disposed below the quench plate 502. The table 504 may provide or otherwise define one or more shoulders 508 configured to receive and support the quench plate 502 above the fluid reservoir 506.
  • the mold assembly 300 may be positioned on the quench plate 502 such that the bottom 418 is in direct contact with the upper surface of the quench plate 502, and the insulation enclosure 406 may be disposed about the mold assembly 300 and rest on the quench plate 502.
  • a gap 510 may be defined between the table 504 and the quench plate 502.
  • the quench plate 502 may exhibit a generally square shape, and the gap 510 may also be square to accommodate the shape of the quench plate 502. In other embodiments, however, the quench plate 502 may exhibit other shapes, such as circular, ovoid, or other polygonal shapes (e.g., rectangular, etc.).
  • the quench plate 502 may be configured to prevent exposure of the mold assembly 300 to a thermal fluid 512 used to help cool the mold assembly 300.
  • the thermal fluid 512 may be any suitable fluid or gas including, but not limited to, water, steam, an oil, a coolant (e.g. , glycols), a gas (e.g. , air, carbon dioxide, argon, helium, oxygen, nitrogen), a molten metal, a molten metal alloy, a fluidized bed, or a molten salt.
  • Suitable molten metals or metal alloys used for the thermal fluid 512 may include Pb, Bi, Pb-Bi, K, Na, Na-K, Ga, In, Sn, Li, Zn, or any alloys thereof.
  • Suitable molten salts used for the thermal fluid 512 include alkali fluoride salts (e.g. , LiF-KF, LiF-NaF-KF, LiF-RbF, LiF-NaF- RbF), BeF 2 salts (e.g. , LiF-BeF 2 , NaF-BeF 2 , LiF-NaF-BeF 2 ), ZrF 4 salts (e.g.
  • alkali fluoride salts e.g. , LiF-KF, LiF-NaF-KF, LiF-RbF, LiF-NaF- RbF
  • BeF 2 salts e.g. , LiF-BeF 2 , NaF-BeF 2 , LiF-NaF-BeF 2
  • ZrF 4 salts e.g.
  • KF- ZrF 4 NaF-ZrF 4 , NaF-KF-ZrF 4 , LiF-ZrF 4 , LiF-NaF-ZrF 4 , RbF-ZrF 4
  • chloride-based salts e.g., LiCI-KCI, LiCI-RbCI, KCI-MgCI 2 , NaCI-MgCI 2 , LiCI-KCI-MgCI 2 , KCI-NaCI- MgCI 2
  • fluoroborate-based salts e.g., NaF-NaBF 4 , KF-KBF 4 , RbF-RbBF 4
  • nitrate-based salts e.g., NaN0 3 -KN0 3 , Ca(N0 3 ) 2 -NaN0 3 -KN0 3 , LiN0 3 -NaN0 3 - KN0 3 ), and any alloys thereof.
  • One or more nozzles 514 may be positioned within the fluid reservoir 506 and otherwise configured to eject the thermal fluid 512 such that it impinges on a bottom surface 516 of the quench plate 502.
  • the quench plate 502 may be impermeable to the thermal fluid 512 and otherwise prevent the thermal fluid 512 from coming into direct contact with the mold assembly 300. Instead, the thermal fluid 512 may thermally communicate with the mold assembly 300 across or through the quench plate 502 via thermal conduction and subsequently flow into the fluid reservoir 506 for recycling or disposal.
  • the term "thermally communicate,” or any variation thereof refers to the ability to exchange thermal energy between the thermal fluid 512 and the mold assembly 300 and/or its contents, even across the quench plate 502.
  • any vapor that may be generated from contacting the thermal fluid 512 on the bottom surface 516 of the quench plate may either condense into the fluid reservoir 506 or migrate along the bottom surface 516 of the quench plate 502 until eventually locating the gap 510 and escaping into the surrounding environment outside of the insulation enclosure 406.
  • the quench plate 502 may sealingly engage and otherwise form a seal against the shoulder 508 and thereby prevent the efflux of vapor into the surrounding environment.
  • a pressure- release line (not shown) may be included to relieve any built-up pressure in the fluid reservoir 506 caused by the vapor.
  • the insulation enclosure 406 may prevent any escaping vapor from entering the interior 518 of the insulation enclosure 406 and, upon contacting the cooler air of the surrounding environment, some of the vapor may condense and flow back into the fluid reservoir 506 via the gap 510. Furthermore, the interior 518 may be sealed off using an appropriate member between the quench plate 502 and insulation enclosure 406. In such embodiments, the interior 518 may be evacuated to provide a vacuum (and thermal insulation) between the insulation enclosure 406 and the mold assembly 300.
  • the interior 518 may be filled with a controlled atmosphere by flowing in a gas, such as argon or helium, at an elevated temperature to promote directional solidification of the contents of the mold assembly 300 by insulating the upper portions of mold assembly 300 while its bottom portion is cooled via the quench plate 502.
  • a gas such as argon or helium
  • the quench plate 502 may be made of a variety of materials that help facilitate thermal energy transfer from the mold assembly 300 to the thermal fluid 512. Suitable materials for the quench plate 502 include, but are not limited to, a ceramic (e.g., oxides, carbides, borides, nitrides, silicides), a metal (e.g., steel, stainless steel, nickel, tungsten, titanium or alloys thereof), alumina, graphite, diamond, graphene, and any combination thereof.
  • FIGS. 5A- 5C depict various exemplary designs and configurations of the quench plate 502 that may be employed to help cool the mold assembly 300 while simultaneously isolating the mold assembly 300 from the thermal fluid 512 and any vapor generated therefrom.
  • the quench plate 502 may comprise a monolithic slab or block of material having a generally uniform thickness.
  • a single nozzle 514 may be positioned within the fluid reservoir 506 and otherwise configured to eject the thermal fluid 512 such that it impinges on the bottom surface 516 at or near the center of the quench plate 502.
  • more than one nozzle 514 may be employed, without departing from the scope of the disclosure.
  • the quench plate 502 is depicted as an arched member and otherwise narrowing toward its center. More particularly, the thickness of the quench plate 502 may be g reater at its outer periphery as compared to the center. As will be appreciated, this configuration provides less mass at or near the center of the quench plate 502, thereby al lowing for qu icker heat conduction through the reduced-mass sections.
  • FIG. 5B also il lustrates a pl ural ity of nozzles 514 (three shown) configu red to eject the thermal fl uid 512 such that it impinges on the bottom su rface 516 across a larger area as compared to the single nozzle 514 of FIG.
  • the bottom su rface 516 may be designed in conju nction with the nozzles 514 to facilitate attachment of a cooling fil m to the bottom su rface 516, el iminate a vapor bou ndary layer at the bottom surface 516, and/or promote tu rbu lent flow at the interface between the quench plate 502 and the thermal fl uid 512.
  • the quench plate 502 may provide one or more grooves 520 (three shown) defined into the bottom surface 516 thereof.
  • the grooves 520 may prove advantageous in providing local zones in the quench plate 502 that provide less mass and thereby al low for quicker heat conduction through the quench plate 502 at those areas.
  • the grooves 520 may facil itate attached fl u id flow along the bottom surface 516, thereby enhancing the heat-transfer rate.
  • the thermal sink system 500c may incl ude a nozzle 514 (three shown) a capitad with each groove 520 to eject the thermal fl uid 512 into the grooves 520 and thereby provide for local ly increased heat transfer.
  • Each nozzle 514 may be oriented at a specific angle with respect to the bottom surface 516, such as perpendicular (90°, as shown), 60°, 45°, 30°, 0°, or any orientation within the 0-90° range to optimize fl uid flow and heat transfer via the q uench plate 502 a long bottom surface 516.
  • the quench plate 502 design of FIG. 5C may function as a type of heat excha nger, with the thicker portions of the quench plate 502 between the g rooves 520 simu lating or otherwise serving as at type of heat-exchanging fins.
  • various designs and configu rations of the grooves 520 may be integrated into the quench plate 520 as heat-exchang ing features that include, but are not l imited to, protruding knobs, fins, cyl inders, coils, tu bes, bundled tubes, concentric tu bes, plates, corrugated plates, strips, shells, baffles, channels, micro-channels, finned coils, finned plates, finned strips, louvered fins, wavy fins, pin fins, and the l ike, or any combination thereof to ma ke the bottom surface 516 of the quench plate 502 operate as a heat exchanger.
  • heat-exchanging features may be integrated in other locations on the bottom surface 516 of a quench plate 502 to enhance heat transfer between the quench plate 502 and the fluid reservoir 506.
  • FIG. 6 illustrated is a partial cross-sectional side view of another exemplary thermal sink system 600 that may be used to cool the mold assembly 300, according to one or more embodiments.
  • the thermal sink system 600 may be similar in some respects to the thermal sink systems 500a-c of FIGS. 5A-5C, respectively, and therefore may be best understood with reference thereto, where like numerals represent like components not described again in detail.
  • the thermal sink system 600 may include the quench plate 502, the table 504 that supports the quench plate 502, and the fluid reservoir 506 disposed below the quench plate 502.
  • the mold assembly 300 may be positioned on the quench plate 502 and the insulation enclosure 406 may be disposed about the mold assembly 300 and rest on the quench plate 502.
  • the thermal sink system 600 may include one or more flow channels 602 defined within and otherwise through the quench plate 502.
  • the flow channel 602 may extend between an inlet 604a and an outlet 604b, and a nozzle 514 or other type of piping or conduit may be configured to provide the thermal fluid 512 into the flow channel 602 via the inlet 604a.
  • the thermal fluid 512 may be provided to the inlet 604a and flowed into the flow channel 602 and subsequently exit the flow channel 602 at the outlet 604b where it flows into the fluid reservoir 506 for recycling or disposal. While circulating through the flow channel 602, the thermal fluid 512 may thermally communicate ⁇ i.e., exchange thermal energy) with the mold assembly 300 across or through the quench plate 502 via thermal conduction.
  • the flow channel 602 may prove advantageous in allowing the thermal fluid 512 to thermally communicate with the mold assembly 300 through the quench plate 502 while simultaneously preventing the thermal fluid 512 from coming into direct contact with the mold assembly 300. Any vapor that may be generated as the thermal fluid 512 circulates through the flow channel 602 may either condense into the fluid reservoir 506 or migrate along the bottom surface 516 of the quench plate 502 until eventually locating the gap 510 and escaping into the surrounding environment outside of the insulation enclosure 406.
  • the flow channel 602 defined in the quench plate 502 may exhibit various configurations and designs while isolating the mold assembly 300 from contact with the thermal fluid 512 or vapor generated therefrom.
  • FIGS. 7A-7C show at least three exemplary designs for the flow channel 602 that may be employed in the quench plate 502 to provide enhanced or more controlled thermal profiles for the mold assembly 300.
  • the flow channel 602 may provide a plurality of branches 702 that extend from a common and/or centralized inlet 604a. Each of the branches 702 may be fed thermal fluid 512 from the central inlet 604a and may terminate in a corresponding outlet 604b.
  • the flow channel 602 is depicted as comprising a plurality of flow channels shown as flow channels 602a, 602b, and 602c.
  • Each flow channel 602a-c may be configured to circulate the thermal fluid 512 between an inlet 604a and an outlet 604b.
  • the flow channels 602a-c each form a generally angled or triangular flow pathway. It will be appreciated, however, that other designs or configurations of the flow channels 602a-c may alternatively be employed, without departing from the scope of the disclosure.
  • FIG. 7B depictsix if the full quench plate 502 were shown past the centerline
  • more or less than three flow channels 502a-c may be employed.
  • the flow channel 602 is depicted as a single flow channel 602 that is spiraled or coiled within the quench plate 502.
  • the flow channel 602 may include the inlet 604a located at or near the center of the quench plate 502, and the outlet 604b located adjacent the outer periphery of the quench plate 502. It will be appreciated that several other designs for the flow channel 602 may be possible and are contemplated as being within the scope of the present disclosure.
  • FIGS. 8A and 8B illustrated are partial cross- sectional side views of other exemplary thermal sink systems 800 that may be used to cool the mold assembly 300, according to one or more embodiments. More particularly, FIG. 8A depicts a first thermal sink system 800a, and FIG. 8B depicts a second thermal sink system 800b.
  • the thermal sink systems 800a, b may be similar in some respects to the thermal sink systems 500a-c and 600 of FIGS. 5A-5C and 6, respectively, and therefore may be best understood with reference thereto, where like numerals represent like components not described again in detail.
  • each thermal sink system 800a, b may include the quench plate 502, the table 504 that supports the quench plate 502, and the fluid reservoir 506 disposed below the quench plate 502.
  • the mold assembly 300 may be positioned on the quench plate 502 and the insulation enclosure 406 may be disposed about the mold assembly 300 and rest on the quench plate 502.
  • the quench plate 502 of the thermal sink systems 800a, b may comprise a multi-component structure. More particularly, the quench plate 502 may define an aperture 802 configured to receive and seat an insert 804 that forms part of the quench plate 502. In some embodiments, as illustrated, the aperture 802 may provide a radial shoulder 806 configured to support the insert 804 within the aperture 802 as the quench plate 502 is supported by the table 504 at the shoulder 508.
  • the aperture 802 may receive the insert 804 via a threaded engagement or the insert 804 may be secured within the aperture 802 using one or more mechanical fasteners (e.g., screws, bolts, snap rings, pins, etc.).
  • a compression fitting may be necessary in some cases to provide a complete seal along the interface between the insert 804 and the quench plate 502.
  • an appropriate sealing material or device e.g., O-ring, etc.
  • the insert 804 may be permanently bonded to the quench plate 502 using an appropriate method, such as brazing or welding.
  • the aperture 802 may be defined at or near the center of the quench plate 502. In other embodiments, however, the aperture 802 may alternatively be defined off- center, without departing from the scope of the disclosure.
  • the insert 804 may be made of a variety of materials configured to provide different thermal properties (e.g., thermal conductivity) intended to produce different thermal profiles in the mold assembly 300 during the cooling process. Suitable materials for the insert 804 include, but are not limited to, a ceramic (e.g., oxides, carbides, borides, nitrides, silicides), a metal (e.g., steel, stainless steel, nickel, copper, tungsten, titanium or alloys thereof), alumina, graphite, and any combination thereof. In some embodiments, the insert 804 and the quench plate 502 may be made of the same material. In other embodiments, however, the insert 804 and the quench plate 502 may be made of dissimilar materials.
  • a ceramic e.g., oxides, carbides, borides, nitrides, silicides
  • a metal e.g., steel, stainless steel, nickel, copper, tungsten, titanium or alloys thereof
  • alumina graphite, and any combination
  • the material of the insert 804 may prove advantageous in quickly drawing heat out of the mold assembly 300 during operation whereas the material of the quench plate 502 may prove advantageous in retaining heat in the insulation enclosure 406 and/or the interior 518, thereby promoting directional solidification of the mold assembly 300 and its contents.
  • the insert 804 in FIG. 8A is smaller than the insert
  • FIG. 8A one nozzle 514 is depicted as ejecting the thermal fluid 512 such that it impinges on the bottom surface 516 of the quench plate 502 and, more particularly, on a bottom or underside 808 of the insert 804.
  • FIG. 8B a plurality of nozzles 514 (four shown) are depicted as ejecting the thermal fluid 512 such that it impinges on the underside 808 of the insert 804.
  • thermal energy may be transferred from the mold assembly 300, through the insert 804, and to the thermal fluid 512.
  • FIG. 9 illustrated is an isometric view of an exemplary quench plate 900, according to one or more embodiments.
  • the quench plate 900 may be similar in some respects to the quench plate 502 described above, and therefore able to prevent exposure of the mold assembly 300 (FIGS. 5A-5C, 6, 8A-8B) to the thermal fluid 512 (FIGS. 5A-5C, 6, 8A-8B) that is used to cool the mold assembly 300 and any resulting vapor generated by the thermal fluid 512.
  • the quench plate 900 may include one or more backstops 902 (shown as backstops 902a, 902b, and 902c) to assist in accurate and repeatable locating of the mold assembly 300 during the transfer process from the furnace 402 (FIG. 4A) to the quench plate 900.
  • backstops 902 shown as backstops 902a, 902b, and 902c
  • Each mold base diameter 904a-c corresponds generally to a size of the bottom 418 (FIGS. 5A-5C, 6, 8A-8B) of the mold assembly 300 (FIGS. 5A-5C, 6, 8A-8B), and each mold base diameter 904a-c provides a different design or type of backstop 902 configured to receive and center the mold assembly 300 on the quench plate 900.
  • first and smallest mold base diameter 904a illustrates a first backstop 902a design
  • second mold base diameter 904b illustrates a second backstop 902b design
  • third and largest mold base diameter 904c illustrates a third backstop 902c design.
  • the first backstop 902a may include or otherwise provide two or more pegs 906 (three shown) positioned at predetermined locations about the circumference of the first mold base diameter 904a and otherwise protruding from the upper surface of the quench plate 900.
  • the pegs 906 may be configured to receive the bottom 418 (FIGS. 5A-5C, 6, 8A-8B) of the mold assembly 300 (FIGS. 5A-5C, 6, 8A-8B) as the mold assembly 300 is moved in the direction A toward the pegs 906.
  • the pegs 906 may be spaced from each other about the circumference of the first mold base diameter 904a such that the mold assembly 300 is received by the pegs 906 and simultaneously concentrically located on the quench plate 900 around the center 908.
  • one or more of the pegs 906 may be inserted into corresponding apertures defined on the upper surface of the quench plate 900. In other embodiments, one or more of the pegs 906 may be threaded into such apertures. In yet other embodiments, one or more of the pegs 906 may penetrate the quench plate 900 and may be secured to the quench plate 900 on its underside, such as through the use of a nut and watertight washer combination.
  • the second backstop 902b may include or otherwise provide two or more blocks 910 (three shown) positioned about the circumference of the second mold base diameter 904b and otherwise protruding from the upper surface of the quench plate 900. Similar to the pegs 906, the blocks 910 may be configured to receive the bottom 418 (FIGS. 5A-5C, 6, 8A-8B) of the mold assembly 300 (FIGS. 5A-5C, 6, 8A-8B) as the mold assembly 300 is moved in the direction A toward the blocks 910. The blocks 910 may be spaced from each other about the circumference of the second mold base diameter 904b such that the mold 300 is received by the blocks 910 and simultaneously located on the quench plate 900 at the center 908.
  • the blocks 910 may be combined into a single arcuate member configured to receive and locate the mold assembly 300 at the center 908.
  • one or more of the blocks 910 may be inserted into corresponding polygonal apertures defined on the upper surface of the quench plate 900.
  • one or more of the blocks 910 may be secured to the upper surface of the quench plate 900 using one or more mechanical fasteners, such as screws or bolts that thread into the upper surface of the quench plate 900.
  • the third backstop 902c may include an elongate member 912 positioned on the third mold base diameter 904c. While shown in FIG. 9 as generally straight, in at least one embodiment, the elongate member 912 may be curved or otherwise arcuate in shape. In some embodiments, the elongate member 912 may be anchored to the quench plate 900 using one or more mechanical fasteners 914 (one shown in exploded view), such as bolts, screws, pegs, snap rings, etc. In other embodiments, the elongate member 912 may be anchored to the table 504 (FIGS. 5A-5C, 6, 8A-8B) using the same type of mechanical fasteners 916 (one shown in exploded view).
  • mechanical fasteners 914 one shown in exploded view
  • the elongate member 912 may be configured to receive the bottom 418 (FIGS. 5A-5C, 6, 8A-8B) of the mold assembly 300 (FIGS. 5A-5C, 6, 8A-8B) as the mold assembly 300 is moved in the direction A toward the elongate member 912.
  • the elongate member 912 may be removed or otherwise movable, such as via an actuation member, to accommodate the insulation enclosure 406 (FIGS. 5A-5C, 6, 8A-8B) being lowered onto the upper surface of the quench plate 900.
  • the elongate member 912 may be a recessable member, either via an actuation member or with a curved top surface so that the vertical force from the insulation enclosure 406 may force the elongate member 912 to lower.
  • any of the backstops 902a-c described above may be employed at any of the mold base diameters 904a-c and in any combination, if desired.
  • the various embodiments described and illustrated herein may be combined in any combination, in keeping within the scope of this disclosure. Indeed, variations in the size and configuration of any of the thermal sink systems described herein may be implemented in any of the embodiments, as generally described herein, without departing from the scope of the disclosure.
  • Embodiments disclosed herein include:
  • a thermal sink system that includes a quench plate having an upper surface for receiving a mold assembly to be cooled, and a thermal fluid in thermal communication with the mold assembly via conduction through the quench plate, wherein the quench plate interposes the thermal fluid and the mold assembly and thereby prevents the thermal fluid from contacting the mold assembly.
  • a method of cooling a mold assembly that includes positioning the mold assembly on an upper surface of a quench plate, placing a thermal fluid in thermal communication with the mold assembly via conduction through the quench plate, and preventing the thermal fluid from contacting the mold assembly with the quench plate.
  • each of embodiments A and B may have one or more of the following additional elements in any combination :
  • Element 1 wherein the thermal fluid is a fluid selected from the group consisting of water, steam, an oil, a coolant, a gas, a molten metal, a molten metal alloy, a fluidized bed, and a molten salt.
  • Element 2 further comprising a table having a shoulder that receives and supports the quench plate, and a fluid reservoir arranged below the quench plate.
  • Element 3 wherein the quench plate sealingly engages the table.
  • Element 4 further comprising one or more nozzles arranged to eject the thermal fluid such that the thermal fluid impinges on a bottom surface of the quench plate.
  • Element 5 wherein the quench plate is arched such that a thickness of the quench plate is greater at an outer periphery as compared to a thickness of the quench plate at a center location.
  • Element 6 further comprising one or more grooves defined in a bottom surface of the quench plate.
  • Element 7 further comprising one or more nozzles arranged to eject the thermal fluid into the one or more grooves.
  • Element 8 further comprising one or more heat- exchanging features defined in a bottom surface of the quench plate.
  • Element 9 further comprising one or more flow channels defined in the quench plate for circulating the thermal fluid.
  • Element 10 wherein the one or more flow channels comprise a plurality of branches extending from a common inlet.
  • Element 11 wherein the one or more flow channels comprise a single, spiraling flow channel.
  • Element 12 wherein the quench plate defines an aperture and includes an insert receivable into the aperture.
  • Element 13 wherein the insert comprises a thermally conductive material selected from the group consisting of a ceramic, a metal, alumina, graphite, and any combination thereof.
  • Element 14 wherein the insert and the quench plate are made of dissimilar materials.
  • Element 15 further comprising a backstop to locate the mold assembly at a desired location on the upper surface of the quench plate.
  • Element 16 wherein the backstop is at least one of two or more pegs protruding from the upper surface of the quench plate, one or more blocks protruding from the upper surface of the quench plate, an arcuate block member protruding from the upper surface of the quench plate, an elongate member, and an arcuate member.
  • Element 17 further comprising an insulation enclosure that rests on the upper surface of the quench plate and provides an interior for receiving the mold assembly, the quench plate further preventing vapor generated by the thermal fluid from migrating into the interior of the insulation enclosure.
  • Element 18 further comprising positioning an insulation enclosure over the mold assembly such that the mold assembly is received into an interior of the insulation enclosure and the insulation enclosure rests on the upper surface of the quench plate, and preventing vapor generated by the thermal fluid from migrating into the interior of the insulation enclosure with the quench plate.
  • placing the thermal fluid in thermal communication with the mold assembly comprises ejecting the thermal fluid from one or more nozzles such that the thermal fluid impinges on a bottom surface of the quench plate.
  • the bottom surface of the quench plate defines one or more grooves, the method further comprising ejecting the thermal fluid from the one or more nozzles into the one or more grooves.
  • Element 21 wherein the bottom surface of the quench plate defines one or more heat-exchanging features, the method further comprising placing at least one of the thermal fluid and a fluid reservoir in thermal communication with the mold assembly via conduction through the quench plate.
  • Element 22 wherein ejecting the thermal fluid from the one or more nozzles comprises at least one of reducing a vapor boundary layer at the bottom surface of the quench plate, and promoting turbulent flow at the bottom surface of the quench plate.
  • placing the thermal fluid in thermal communication with the mold assembly comprises circulating the thermal fluid through one or more flow channels defined in the quench plate.
  • Element 24 wherein the quench plate defines an aperture and includes an insert receivable into the aperture, the method further comprising placing the thermal fluid in thermal commu nication with the mold assembly via conduction through the insert as received in the aperture of the quench plate.
  • positioning the mold assembly on the u pper surface of the quench plate comprises locating the mold assembly at a desired location on the upper su rface of the quench plate with a backstop, wherein the backstop is at least one of two or more pegs protruding from the u pper su rface of the quench plate, one or more blocks protruding from the upper surface of the quench plate, an arcuate block member protruding from the u pper surface of the quench plate, an elongate member, and an arcuate mem ber.
  • exemplary combinations appl icable to A, B, and C incl ude Element 2 with Element 3 ; Element 6 with Element 7; Element 9 with Element 10; Element 9 with Element 11 ; Element 12 with Element 13 ; Element 12 with Element 14; Element 15 with Element 16; Element 19 with Element 20; Element 19 with Element 21 ; and Element 19 with Element 22.
  • the disclosed systems and methods are wel l adapted to attain the ends and advantages mentioned as wel l as those that are inherent therein .
  • the particu lar embodiments disclosed above are ill ustrative only, as the teachings of the present disclosu re may be mod ified and practiced in different but equiva lent manners apparent to those skilled in the art having the benefit of the teachings herein. Fu rthermore, no l imitations are intended to the details of construction or design herein shown, other than as described in the claims below. It is therefore evident that the particu lar il lustrative embodiments disclosed above may be altered, combined, or modified and al l such variations are considered within the scope of the present disclosu re.
  • compositions and methods may su itably be practiced in the absence of any element that is not specifical ly disclosed herein and/or any optional element disclosed herein .
  • compositions and methods are described in terms of “comprising,” “containing,” or “incl uding” various components or steps, the compositions and methods can also “consist essential ly of” or “consist of” the various components and steps.
  • Al l nu mbers and ranges disclosed above may vary by some amount. Whenever a numerical range with a lower l imit and an upper limit is disclosed, any number and any incl uded range fal ling within the range is specifically disclosed .
  • the phrase "at least one of” preceding a series of items, with the terms “and” or “or” to separate any of the items, modifies the list as a whole, rather than each member of the list ⁇ i.e., each item).
  • the phrase "at least one of” allows a meaning that includes at least one of any one of the items, and/or at least one of any combination of the items, and/or at least one of each of the items.
  • the phrases “at least one of A, B, and C” or “at least one of A, B, or C” each refer to only A, only B, or only C; any combination of A, B, and C; and/or at least one of each of A, B, and C.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Composite Materials (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

Selon l'invention, un système de bassin thermique donné à titre d'exemple comprend une plaque de trempe ayant une surface supérieure permettant de recevoir un ensemble moule qui doit être refroidi. Un fluide thermique est en communication thermique avec l'ensemble moule par conduction à travers la plaque de trempe. La plaque de trempe empêche le fluide thermique d'entrer en contact avec l'ensemble moule.
PCT/US2014/068026 2014-12-02 2014-12-02 Systèmes de bassin thermique permettant de refroidir un ensemble moule Ceased WO2016089362A1 (fr)

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US14/889,260 US20160346835A1 (en) 2014-12-02 2014-12-02 Thermal sink systems for cooling a mold assembly
PCT/US2014/068026 WO2016089362A1 (fr) 2014-12-02 2014-12-02 Systèmes de bassin thermique permettant de refroidir un ensemble moule

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9896886B2 (en) * 2014-06-25 2018-02-20 Halliburton Energy Services, Inc. Insulation enclosure with compliant independent members
US11027368B2 (en) 2017-08-02 2021-06-08 General Electric Company Continuous additive manufacture of high pressure turbine
CN109128109A (zh) * 2018-07-28 2019-01-04 宁国市金优机械配件有限公司 一种带有远程遥控器的用于铸铁件的冷却装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57159235A (en) * 1981-03-26 1982-10-01 Sintokogio Ltd Molding method for mold
US20020170700A1 (en) * 2000-09-01 2002-11-21 Shigeru Yanagimoto Metal-casting method and apparatus, casting system and cast-forging system
US20080179189A1 (en) * 2006-08-02 2008-07-31 Szokolay Robert E Mold tooling with integrated conformal thermal management fluid channels and method
US20100278604A1 (en) * 2007-01-18 2010-11-04 Glass Kevin L Casting of tungsten carbide matrix bit heads and heating bit head portions with microwave radiation
US7905354B1 (en) * 2008-09-04 2011-03-15 Durston Manufacturing Company Magnetic tool holder

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1410417A (en) * 1921-08-27 1922-03-21 John W Simon Pig mold
US1745475A (en) * 1927-02-10 1930-02-04 E And G Brooke Iron Company Pig mold
JPS62197268A (ja) * 1986-02-24 1987-08-31 Toyota Motor Corp 強制冷却連続鋳造装置
US5791098A (en) * 1996-09-24 1998-08-11 Cott Manufacturing Co. Reinforced structure for below-grade housing of equipment
WO1999030857A1 (fr) * 1997-12-18 1999-06-24 Lockheed Martin Advanced Environmental Systems, I Nc. Fusion et coulage de metaux a hautes performances
US7418993B2 (en) * 1998-11-20 2008-09-02 Rolls-Royce Corporation Method and apparatus for production of a cast component
US20060207742A1 (en) * 2005-03-16 2006-09-21 Oscar Garza-Ondarza Method and apparatus for improved heat extraction from aluminum castings for directional solidification
US8622113B1 (en) * 2012-09-16 2014-01-07 Charles B. Rau, III Apparatus and method for controlled optimized rapid directional solidification of mold shaped metal castings
US9782825B2 (en) * 2013-04-15 2017-10-10 Magna International Inc. Liquid cooled die casting mold with heat sinks
US10145179B2 (en) * 2013-12-13 2018-12-04 Halliburton Energy Services, Inc. Fiber-reinforced tools for downhole use

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57159235A (en) * 1981-03-26 1982-10-01 Sintokogio Ltd Molding method for mold
US20020170700A1 (en) * 2000-09-01 2002-11-21 Shigeru Yanagimoto Metal-casting method and apparatus, casting system and cast-forging system
US20080179189A1 (en) * 2006-08-02 2008-07-31 Szokolay Robert E Mold tooling with integrated conformal thermal management fluid channels and method
US20100278604A1 (en) * 2007-01-18 2010-11-04 Glass Kevin L Casting of tungsten carbide matrix bit heads and heating bit head portions with microwave radiation
US7905354B1 (en) * 2008-09-04 2011-03-15 Durston Manufacturing Company Magnetic tool holder

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