[go: up one dir, main page]

WO2016080931A1 - Actionneur d'intervalle vertical pour des transducteurs ultrasonores et fabrication de ce dernier - Google Patents

Actionneur d'intervalle vertical pour des transducteurs ultrasonores et fabrication de ce dernier Download PDF

Info

Publication number
WO2016080931A1
WO2016080931A1 PCT/TR2015/050097 TR2015050097W WO2016080931A1 WO 2016080931 A1 WO2016080931 A1 WO 2016080931A1 TR 2015050097 W TR2015050097 W TR 2015050097W WO 2016080931 A1 WO2016080931 A1 WO 2016080931A1
Authority
WO
WIPO (PCT)
Prior art keywords
membrane
substrate
layer
central part
poly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/TR2015/050097
Other languages
English (en)
Inventor
Goksen Goksenin YARALIOGLU
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ozyegin Universitesi
Original Assignee
Ozyegin Universitesi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ozyegin Universitesi filed Critical Ozyegin Universitesi
Priority to EP15784792.2A priority Critical patent/EP3221064B1/fr
Publication of WO2016080931A1 publication Critical patent/WO2016080931A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292—Electrostatic transducers, e.g. electret-type

Definitions

  • the present invention relates generally to the field of ultrasonic transducers. More specifically it is related to electrostatically driven capacitive micromachined ultrasonic transducers (CMUTs). STATE OF THE ART
  • CMUTs capacitive micromachined ultrasonic transducers
  • a CMUT transducer is composed of many movable membranes which are actuated by electrostatic forces. These membranes are manufactured in such a way that the cavities at the rear side of them constitute vacuum. The cavity height or the distance between the bottom and the top electrode determines the performance parameters such as the sensitivity, output pressure of the transducer.
  • the membranes are built using micromachining techniques on a highly doped silicon substrate which forms the bottom electrode. There is usually a metal electrode on the membrane. The top metal electrode and the bottom electrode constitute a parallel plate actuator for actuating the membrane. During operation, a high DC electrical voltage is applied between the substrate and the top electrode. Due to the electrostatic force, the membrane is attracted towards the bottom electrode. The induced stress inside the membrane resists the electrostatic force.
  • the membrane moves up and down at the same frequency as the AC voltage. This movement of the membrane generates ultrasound in the transducer immersion medium. If the biased membranes are subject to an incoming ultrasound field below the DC voltage, the membrane vibrates at the frequency of the incoming field and an electrical current at the frequency of the incoming field is generated.
  • the mechanical impedance of the CMUT transducer consisting of membranes is much smaller than that of piezoelectric materials. This enables operation of CMUT transducers with much larger bandwidth.
  • the lithography defines the membrane shape and the geometry of array elements, much complex array geometries such as rings, annular arrays can be fabricated.
  • CMUTs have also been demonstrated for high frequency applications such as intravascular imaging [18] and 3D volumetric imaging [19].
  • the literature on the CMUTs is immense, only a few of them have been cited above to show the variety of the work that has been performed up to date.
  • CMUT transducers output pressure and receive sensitivity have conflicting requirements over the cavity height (gap).
  • the output pressure is fundamentally limited by the cavity height (distance between the bottom surface of the membrane and the top surface of the substrate).
  • the membrane cannot travel more than the cavity height. Therefore, to be able to generate high output pressure levels one needs to build transducers with large cavity heights.
  • high receive sensitivity requires high e-fields at small cavity heights. This can be achieved by reducing the cavity height. Therefore, high output pressure and high receive sensitivity cannot be obtained at the same time from the same transducer geometry.
  • CMUT transducers also generate high level of non-linearity due to the parallel plate actuation. As the membrane displaces when the electrical field inside the gap changes, this results in spring softening effect and shifts the resonant frequency. As a result, high levels of non-linearity are generated.
  • a thick part in form of a piston is added to the middle part of the membrane. This part will move within a cavity opened on the substrate.
  • the movement of the membrane is achieved by an electric field created on the gap between the piston-shaped part of the membrane and the side walls of the cavity in the substrate.
  • the motion of the membrane does not affect the height of the gap where the actuation forces are built.
  • the gaps between the thin part of the membrane and the bottom part of the piston and the substrate are selected too large, these do not interfere with the membrane motion. This enables membrane to move without any hard limits.
  • the proposed geometry can be fabricated using micromachining techniques and transducers can be manufactured by repeating the cellular structure.
  • an electromechanical micromachined transducer comprising
  • the cellular structure comprising:
  • a free movable membrane consisting of a thin peripheral part and a thick central part
  • the membrane consists of single crystal silicon, poly-silicon layer or both.
  • the insulating layer consists of silicon dioxide.
  • the substrate consists of single crystal silicon, glass or quartz.
  • the membranes have an electrically connected structure to form ID, 2D or annular arrays.
  • an electromechanical micromachined transducer production method comprising the following processing steps:
  • FIGURE 1 shows the proposed geometry for the vertical gap CMUT cell.
  • FIGURE 2 shows the electrical field lines between the side walls of the first silicon wafer gap and the piston part of the membrane.
  • FIGURE 3 shows the geometry of a standard CMUT cell.
  • FIGURE 4 shows the parallel plate modeling of a standard CMUT cell.
  • FIGURE 5 shows the equivalent circuit modeling of a standard CMUT cell.
  • FIGURE 6 shows the simplified modeling of the vertical gap CMUT.
  • FIGURE 7 shows the equivalent circuit modeling of the vertical gap CMUT.
  • FIGURE 8.8, FIGURE 8.9, FIGURE 8.10, FIGURE 8.11, FIGURE 8.12, show a method to fabricate vertical gap CMUTs.
  • FIGURE 9.1, FIGURE 9.2, FIGURE 9.3, FIGURE 9.4, FIGURE 9.5, FIGURE 9.6, FIGURE 9.7, FIGURE 9.8, FIGURE 9.9, show another method to fabricate vertical gap CMUTs.
  • FIGURE 10.1, FIGURE 10.2 AND FIGURE 10.3 show ID, 2D and annular transducer arrays.
  • the main objective of this invention is to develop novel cell geometry for
  • CMUT transducers where the sensitivity and the maximum output pressure do not have conflicting requirements over the gap.
  • electrodes instead of parallel plate actuation, electrodes will be positioned such that the cavity height does not change with the membrane (100) motion.
  • an electrostatic gap is formed vertically in the capacitor formed by a piston like part of the membrane (100) with the side walls of the gap.
  • Fig. l This new geometry is shown in Fig. l.
  • the actuation of the membrane (100) is achieved through a vertical gap (101).
  • the membrane (100) is composed of two parts: thick central part (piston part) (103) and thin peripheral part (108).
  • the thin peripheral part (108) is more flexible than the thick central part (103).
  • the thick central part (the piston part) (103) has a vertical side wall (1001) as shown in the Fig. l.
  • the membrane (100) could be in circular, square or rectangular shape. It could be made of a highly conducting material, preferably highly doped silicon. To increase the electrical conductivity, a metal electrode (not shown) could be deposited on top of the membrane (100).
  • the substrate (102) which can be preferably silicon wafer is etched to form a cavity (105) with several steps as shown in Fig.l.
  • Cavity (105) is composed of three different gaps: horizontal gap 1 (106) under the thin peripheral (108) part of the membrane (100), horizontal gap 2 (107) under the thick central part (the piston part) (103) of the membrane (100) and vertical gap (101) between the vertical side walls (104) of the substrate (102) and the thick central part side walls (1001).
  • First silicon wafer namely substrate (102) is also made of a highly conducting material, preferably highly doped silicon.
  • Membrane (100) is attached to the substrate (102) through an insulating material (109) whose electrical impedance is very high.
  • the insulating material is preferably made of silicon dioxide.
  • the thick central part (103) can move freely in the cavity (105) of the substrate (102). When a voltage is applied between the membrane (100) and the substrate (102), electrical field is formed between the membrane (100) and the substrate (102) over the cavity (105).
  • Fig. 2 shows electric field formed in the gap when there is voltage applied between the membrane (100) and the substrate (102).
  • the vertical gap (101) is substantially smaller than the horizontal gap 1 (106) and the horizontal gap 2 (107). Therefore there is a stronger electrostatic force between the side walls (104) of the substrate (102) and the thick central part sidewalls (1001).
  • This electric field has two components as shown in Fig 2: electric field horizontal component (110) and fringing fields (111).
  • the horizontal component does not move the membrane (100) because it is balanced around the perimeter of the piston.
  • fringing fields (111) between the thick central part (103) and the side walls (104) of the substrate (102) in horizontal gaps as shown in Fig. 2 can apply a net force on the thick central part (103), moving it towards the substrate (102).
  • the gaps between the membrane (100) thin peripheral part (108) and the thick central part (103) and the substrate (102) can be chosen substantially larger than the maximum membrane (100) stroke such that they these two gaps do not interfere with the membrane (100) motion.
  • Horizontal gap 1 (106) and horizontal gap 2 (107) can be different from each other and horizontal gap 2 (107) can be chosen much larger than horizontal gap 1 (106).
  • Fig.3 shows the schematic of a standard CMUT cell.
  • the CMUT is composed of a membrane (100), substrate (102) and an insulator layer (109) which electrically isolates the membrane (100) and the substrate (102).
  • the cavity (105) is obtained by etching into the substrate (102).
  • the bottom of the cavity and the membrane (100) forms a parallel plate actuator.
  • the gap distance (117) changes with the applied voltage.
  • the main difference between the geometry constituting the object of the invention disclosed in this patent application and the geometry shown in Fig 3 is that the vertical gap (101) of Fig. l can be chosen as small as possible for increased transmit and receive sensitivity.
  • the important feature of this design is that the selection of the gap does not impose any limits on the maximum output pressure.
  • Fig. 4 shows the simplified model for a standard CMUT cell.
  • the membrane (100) is modelled by a spring (119) and a parallel plate electrode (118).
  • the electrode area is assumed to be A.
  • the gap distance is denoted by g.
  • the details of the calculation of the parameters for the equivalent circuit have been given in [15, 22] for a standard CMUT cell.
  • Fig. 5 shows the equivalent circuit model for the standard CMUT cell.
  • the transformer (121) connects electrical domain to mechanical domain.
  • electrical capacitor (120) represents the electrical parallel capacitance of the CMUT.
  • the membrane (100) impedance is modelled by a series (array) combination of a capacitor (123) and an inductor (124).
  • the spring softening is modelled by another capacitor (122).
  • the radiation losses are modelled by a resistor (125) which is terminated the acoustic port of the transducer.
  • Fig 6 shows the simplified model for vertical gap CMUT.
  • the membrane (100) is modelled by a spring (119) and a piston (126). This time the electrodes are on the side of the piston.
  • the piston radius, namely the membrane radius is denoted by r p .
  • h denotes the length of the electrodes.
  • the equivalent circuit is composed of an electrical capacitor (120) in the electrical part, a transformer (121), a series capacitor (123) and an inductor (124).
  • the output port is again terminated by a resistor (125).
  • the main difference between this circuit and the circuit shown in Fig 5 is that this circuit does not have any spring softening capacitor.
  • the main reason for the lack of spring softening is that the motion of the membrane (100) does not change the gap distance.
  • the calculation of the circuit parameters are given in Table 1. Assuming electrical capacitance and the membrane impedance can be made the same for both types of CMUTs, the main difference between the two circuits is the transformer ratio and the spring softening capacitance.
  • the transformer ratio represents the conversion efficiency between electrical and mechanical domains.
  • the electrode radius (r p ) of the standard CMUT is the same as the piston radius of vertical gap CMUT.
  • g st and g v represents the gap height for standard and vertical gap CMUTs, respectively.
  • 10 micro-meter radius and 0.5 micro-meter standard gap CMUT if one can build a vertical gap device with 50 nm gap, it is possible to get similar transformation ratios. Based on this first order approach, one can achieve similar sensitivities using both devices.
  • Fig. 8.1, Fig. 8.2, Fig. 8.3, Fig. 8.4, Fig. 8.5, Fig. 8.6, Fig. 8.7, Fig. 8.8, Fig. 8.9, Fig. 8.10, Fig. 8.11, Fig. 8.12 show a process to build vertical gap CMUT where the vertical gap height can be made substantially small.
  • the fabrication process starts with a highly doped silicon wafer, namely a substrate (102).
  • the conductivity of the starting substrate (102) should be high because this wafer will provide the side wall electrodes required to actuate the membrane (100).
  • the first silicon wafer (102) is etched as shown in Fig 8.2. For this etch first the substrate (102) is coated by a photoresist.
  • the photoresist is patterned to define the gaps as shown in Fig 8.2.
  • a thin sacrificial layer of dry oxide (134) is grown over the wafer surface. This oxide layer will be later etched to define the vertical gap height.
  • the gap height is substantially small, between 50 nm to 200 nm. To define such a small gap height a well-controlled dry oxide deposition is preferred.
  • Fig 8.4 demonstrates poly-silicon layer (135) deposition. LPCVD method can be used to deposit poly-silicon.
  • poly-silicon should be doped to achieve high conductivity.
  • the poly-silicon is etched back down to oxide layer, leaving poly-silicon only in the cavities etched in Fig 8.2.
  • Poly- silicon can be etched using dry etching or chemical wafer polishing (CMP).
  • CMP chemical wafer polishing
  • more poly-silicon is deposited and is patterned. This part of the poly-silicon will be part of the piston.
  • a thick conformal oxide layer (136) is grown over the wafer surface. This oxide layer will provide the insulation layer between the membrane (100) and the substrate (102).
  • the thick oxide layer is patterned as shown in the figure. This also defines the membrane diameter.
  • the wafer surface is planarized using CMP process (Fig. 8.9). After planarization, an SOI wafer is bonded to the top surface of the wafer (Fig. 8.10). After removing the handle and the box oxide, a membrane (100) is formed.
  • the back side of the wafer is etched using deep reactive ion etching down to the oxide layer as shown in Fig 8.11. This step exposes the oxide layer that is filling the vertical gap. At step 12, the vertical side wall is etched until it is completely cleared of oxide.
  • the oxide etching can be done using vapor phase HF or wet BOE (buffered oxide etch).
  • step 12 the main structure of the membrane (100) is completed.
  • the bottom side of the wafer can be bonded to another wafer at low pressure to evacuate the air in the back side of the membrane cavity (the reason for naming this wafer second wafer is the evaluation of the substrate (102) as the first wafer).
  • Further metallization steps can be found in CMUT fabrication references [11, 12] and same methods can be employed here.
  • Fig 9.1, Fig. 9.2, Fig. 9.3, Fig. 9.4, Fig. 9.5, Fig. 9.6, Fig. 9.7, Fig. 9.8 and Fig. 9.9 shows an alternative approach which also starts with a highly doped silicon wafer (102).
  • the surface of the wafer is etched to form a trench as shown in the figure. This trench will be filled with poly-silicon to form the piston part of the membrane (100) in the subsequent processing steps.
  • step 3 a thin sacrificial layer of dry oxide (134) is grown on the silicon wafer surface. Dry oxidation is the method of choice for this step due to its high uniformity and well- controlled thickness.
  • a thick layer of poly-silicon layer (135) is deposited.
  • the poly-silicon layer is patterned and etched using reactive ion etching.
  • the wafer surface is covered by a thin layer of oxide (136).
  • this oxide layer is patterned and etched. The oxide pattern at this step determines the diameter of the membrane (100).
  • the wafer is polished using CMP process. The purpose of the polishing is to planarize the wafer surface by bringing the oxide part and the poly- silicon islands to the same height for the subsequent bonding process.
  • an SOI wafer is bonded on top of the wafer.
  • the device layer (142) is attached to the oxide layer (136) and the poly-silicon part (135).
  • step 8 the back side of the wafer is patterned and etched until the thin dry oxide sacrificial layer (134) is exposed using deep reactive ion etching.
  • the thin oxide layer covering the bottom part of the poly- silicon layer (135) and the vertical gap is etched and the membrane (100) is released.
  • the back side of the wafer is bonded to another wafer at low pressure to seal the gaps and electrodes are fabricated to provide electrical interface to the mechanical structure.
  • Figure 10.1, Figure 10.2 and Figure 10.3 shows various transducer array geometries where the cells of the transducers are fabricated as explained above.
  • the array geometries consist of electrodes providing electrical connections to the membrane (100) and the substrate (102).
  • the array geometries are not limited to the ones that are shown in this figure.
  • array elements (143) belonging to a linear ID array are formed by electrically isolating the membranes (100) on the substrate (102).
  • the boundary of the isolation layer defines the membranes (100) which are shown by dotted lines in the figure.
  • Fig 10.2 shows array elements (146) belonging to a 2D array where the membrane layer is patterned to form a 2D array of transducer elements.
  • Fig.10.3 shows an array formed by the array elements (147) belonging to an annular array. In all these configurations, the array geometry is defined by patterning the conducting membrane layer.
  • PROC IEEE ULTRASON. SYMP., 1994, PP. 1241-1244.
  • ORALKAN O. ; BAYRAM, B . ; YARALIOGLU, G.G. ; ERGUN, A.S. ; KUPNIK, M. ; YEH, D.T. ; WYGANT, I.O. ; KHURI- YAKUB , B .T., "EXPERIMENTAL CHARACTERIZATION OF COLLAPSE-MODE CMUT OPERATION" ULTRASONICS, FERROELECTRICS AND FREQUENCY CONTROL, IEEE TRANSACTIONS ON, VOLUME: 53 , ISSUE: 8, PAGE(S): 1513 - 1523, 2006.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Transducers For Ultrasonic Waves (AREA)

Abstract

L'invention concerne les transducteurs ultrasonores micro-usinés capacitifs (CMUT) actionnés de manière électrostatique.
PCT/TR2015/050097 2014-11-19 2015-09-09 Actionneur d'intervalle vertical pour des transducteurs ultrasonores et fabrication de ce dernier Ceased WO2016080931A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP15784792.2A EP3221064B1 (fr) 2014-11-19 2015-09-09 Actionneur avec intervalle vertical pour transducteurs ultrasonores et fabrication correspondante

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TR201413718 2014-11-19
TR2014/13718 2014-11-19

Publications (1)

Publication Number Publication Date
WO2016080931A1 true WO2016080931A1 (fr) 2016-05-26

Family

ID=54347803

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/TR2015/050097 Ceased WO2016080931A1 (fr) 2014-11-19 2015-09-09 Actionneur d'intervalle vertical pour des transducteurs ultrasonores et fabrication de ce dernier

Country Status (2)

Country Link
EP (1) EP3221064B1 (fr)
WO (1) WO2016080931A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210362188A1 (en) * 2020-05-22 2021-11-25 GE Precision Healthcare LLC Micromachined ultrasonic transducers with non-coplanar actuation and displacement
US20220219198A1 (en) * 2021-01-12 2022-07-14 GE Precision Healthcare LLC Micromachined ultrasonic transources with dual out-of-plane and in-plane actuation and displacement
US12350710B2 (en) 2018-11-16 2025-07-08 Vermon S.A. Capacitive micromachined ultrasonic transducer and method of manufacturing the same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1574833A2 (fr) * 2004-03-12 2005-09-14 General Electric Company Capteur de pression à système micromécanique
US20060075818A1 (en) * 2004-06-04 2006-04-13 Yongli Huang Capacitive micromachined ultrasonic transducer array with through-substrate electrical connection and method of fabricating same
US20070058825A1 (en) * 2005-09-09 2007-03-15 Yamaha Corporation Capacitor microphone
US20090152980A1 (en) 2006-04-04 2009-06-18 Kolo Technologies, Inc. Electrostatic Comb Driver Actuator/Transducer and Fabrication of the Same
WO2010150660A1 (fr) * 2009-06-25 2010-12-29 株式会社ジー・ビー・エス Procédé de fabrication d'unité à membrane vibrante

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1574833A2 (fr) * 2004-03-12 2005-09-14 General Electric Company Capteur de pression à système micromécanique
US20060075818A1 (en) * 2004-06-04 2006-04-13 Yongli Huang Capacitive micromachined ultrasonic transducer array with through-substrate electrical connection and method of fabricating same
US20070058825A1 (en) * 2005-09-09 2007-03-15 Yamaha Corporation Capacitor microphone
US20090152980A1 (en) 2006-04-04 2009-06-18 Kolo Technologies, Inc. Electrostatic Comb Driver Actuator/Transducer and Fabrication of the Same
WO2010150660A1 (fr) * 2009-06-25 2010-12-29 株式会社ジー・ビー・エス Procédé de fabrication d'unité à membrane vibrante

Non-Patent Citations (30)

* Cited by examiner, † Cited by third party
Title
A.S. ERGUN; Y. HUANG; X. ZHUANG; O. ORALKAN; G.G. YARALIOGLU; B.T. KHURI-YAKUB: "CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCERS: FABRICATION TECHNOLOGY", ULTRASONICS, FERROELECTRICS AND FREQUENCY CONTROL, IEEE TRANSACTIONS, vol. 52, no. 12, December 2005 (2005-12-01), pages 2242 - 2258
BADI, M.H.; YARALIOGLU, G.G.; SANLI ERGUN, A.; YONGLI HUANG; KHURI-YAKUB, B.T.: "IMPROVED MODELING AND FABRICATION TECHNIQUES FOR CAPACITIVE MICROMACHINED ULTRASONIC LAMB WAVE TRANSDUCERS", ULTRASONICS, 2003 IEEE SYMPOSIUM ON
BAYRAM, B.; KUPNIK, M.; YARALIOGLU, G.G.; ORALKAN, O.; ERGUN, A.S.; WONG, S.H.; KHURI-YAKUB, B.T.: "FINITE ELEMENT MODELING AND EXPERIMENTAL CHARACTERIZATION OF CROSSTALK IN 1-D CMUT ARRAYS", ULTRASONICS, FERROELECTRICS AND FREQUENCY CONTROL, vol. 54, no. 2, 2007, pages 418 - 430
BAYRAM, B.; ORALKAN, 0.; ERGUN, A.S.; HAEGGSTROM, E.; YARALIOGLU, G.G.; KHURI-YAKUB, B.T., CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER DESIGN FOR HIGH POWER TRANSMISSION, vol. 52, no. 2, 2005, pages 326 - 339
DUSSIK, K. T.: "Z. NEUROL. PSYCHIAT.", vol. 174, 1942, article "POSSIBILITY OF USING MECHANICAL HIGH FREQUENCY VIBRATIONS AS A DIAGNOSTIC AID", pages: 153 - 168
ERGURI A S ET AL: "Capacitive micromachined ultrasonic transducers: fabrication technology", IEEE TRANSACTIONS ON ULTRASONICS, FERROELECTRICS AND FREQUENCY CONTROL, IEEE, US, vol. 52, no. 12, 1 December 2005 (2005-12-01), pages 2242 - 2258, XP011367557, ISSN: 0885-3010, DOI: 10.1109/TUFFC.2005.1563267 *
F.V.HUNT: "ELECTROACOUSTICS: THE ANALYSIS OF TRANSDUCTION, AND ITS HISTORICAL BACKGROUND", 1982, ACOUSTICAL SOCIETY OF AMERICA
G.G. YARALIOGLU; S.A. ERGUN; B.T. KHURI-YAKUB: "FINITE-ELEMENT ANALYSIS OF CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCERS", IEEE TRANSACTIONS ON UFFC, vol. 52, no. 12, December 2005 (2005-12-01), pages 2185 - 2198
GULDIKEN, R.O.; MCLEAN, J.; DEGERTEKIN, F.: "CMUTS WITH DUAL ELECTRODE STRUCTURE FOR IMPROVED TRANSMIT AND RECEIVE PERFORMANCE", ULTRASONICS, FERROELECTRICS AND FREQUENCY CONTROL, IEEE TRANSACTIONS ON, vol. 53, no. 2, 2006, pages 483 - 491
H.T. SOH; 1. LADABAUM; A. ATALAR; C.F. QUATE; B.T. KHURI-YAKUB: "SILICON MICROMACHINED ULTRASONIC IMMERSION TRANSDUCERS", APPL. PHYS. LETT., vol. 69, December 1996 (1996-12-01), pages 3674 - 3676
HOWRY, D.; BLISS, W.: "ULTRASONIC VISUALIZATION OF SOFT TISSUE STRUCTURES OF THE BODY", J. LAB. AND CLIN.MED., vol. 40, 1952, pages 579 - 592
HUANG Y.; ZHUANG X.; HAEGGSTROM, E.; ERGUN, A.; CHING-HSIANG CHENG; KHURI-YAKUB, B.: "CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCERS WITH PISTON-SHAPED MEMBRANES: FABRICATION AND EXPERIMENTAL CHARACTERIZATION", ULTRASONICS, FERROELECTRICS AND FREQUENCY CONTROL, IEEE TRANSACTIONS ON, vol. 56, no. 1, 2009, pages 136 - 145
HUANG, Y.; SANLI ERGUN, A.; HEGGSTROM, E.; BADI, M.H.; KHURI-YAKUB, B.T.: "FABRICATING CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCERS WITH WAFER-BONDING TECHNOLOGY", JMEMS, vol. 12, no. 2, 2003, pages 128 - 137
JEONG, B.-G.; KIM, D.-K.; HONG, S.-W.; CHUNG, S.-W.; SHIN, H.-J.: "PERFORMANCE AND RELIABILITY OF NEW CMUT DESIGN WITH IMPROVED EFFICIENCY", SENSORS AND ACTUATORS, A: PHYSICAL, vol. 199, 2013, pages 325 - 333
LEE, B.C.; NIKOOZADEH, A.; PARK, K.-K.; KHURI-YAKUB, B.T.: "UNDERSTANDING CMUTS WITH SUBSTRATE-EMBEDDED SPRINGS", IEEE INTERNATIONAL ULTRASONICS SYMPOSIUM, IUS, 2011, pages 1008 - 1011
LOHFINK, A; ECCARDT, P.-C.: "LINEAR AND NONLINEAR EQUIVALENT CIRCUIT MODELING OF CMUTS", ULTRASONICS, FERROELECTRICS AND FREQUENCY CONTROL, IEEE TRANSACTIONS ON, vol. 52, no. 12, 2005, pages 2163 - 2172
M. I. HALLER; B. T. KHURI-YAKUB: "A SURFACE MICROMACHINED ELECTROSTATIC ULTRASONIC AIR TRANSDUCER", PROC. IEEE ULTRASON.SYMP., 1994, pages 1241 - 1244
M.I. HALLER; B.T. KHURI-YAKUB: "A SURFACE MICROMACHINED ELECTROSTATIC ULTRASONIC AIR TRANSDUCER", ULTRASONICS, FERROELECTRICS AND FREQUENCY CONTROL, IEEE TRANSACTIONS, vol. 43, no. 1, January 1996 (1996-01-01), pages 1 - 6
MILLS, D.M.; SMITH, L.S.: "REAL-TIME IN-VIVO IMAGING WITH CAPACITIVE MICROMACHINED ULTRASOUND TRANSDUCER (CMUT) LINEAR ARRAYS", ULTRASONICS, 2003 IEEE SYMPOSIUM ON, vol. 1, no. 1, 2003, pages 568 - 571
O. ORALKAN; A.S. ERGUN; C.H. CHENG; J.A. JOHNSON; M. KARAMAN; T.H. LEE; B.T. KHURI-YAKUB: "VOLUMETRIC ULTRASOUND IMAGING USING 2-D CMUT ARRAYS", ULTRASONICS, FERROELECTRICS AND FREQUENCY CONTROL, IEEE TRANSACTIONS ON, vol. 50, no. 11, November 2003 (2003-11-01), pages 1581 - 1594
OGUZ, H.K.; ;ATALAR, A.; KOYMEN, H.: "EQUIVALENT CIRCUIT-BASED ANALYSIS OF CMUT CELL DYNAMICS IN ARRAYS", ULTRASONICS, FERROELECTRICS AND FREQUENCY CONTROL, IEEE TRANSACTIONS ON, vol. 60, no. 5, 2013
OLCUM, S.; YAMANER, F.Y.; BOZKURT, A.; KOYMEN, H.; ATALAR, A.: "CMUT ARRAY ELEMENT IN DEEP-COLLAPSE MODE", ULTRASONICS SYMPOSIUM (IUS), 2011 IEEE INTERNATIONAL, 2011, pages 108 - 111
ORALKAN, 0.; BAYRAM, B.; YARALIOGLU, G.G.; ERGUN, A.S.; KUPNIK, M.; YEH, D.T.; WYGANT, 1.0.; KHURI-YAKUB, B.T.: "EXPERIMENTAL CHARACTERIZATION OF COLLAPSE-MODE CMUT OPERATION", ULTRASONICS, FERROELECTRICS AND FREQUENCY CONTROL, IEEE TRANSACTIONS ON, vol. 53, no. 8, 2006, pages 1513 - 1523
REID, J.; WILD, J.: "APPLICATION OF ECHO RANGING TECHNIQUES IN DETERMINATION OF STRUCTURE OF BIOLOGICAL TISSUES", SCL, vol. 115, 1952, pages 226 - 230
S. H. WONG; M. KUPNIK; R. D. WATKINS; K. BUTTS-PAULY; B. T. KHURI-YAKUB: "CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCERS FOR THERAPEUTIC ULTRASOUND APPLICATIONS BIOMEDICAL ENGINEERING", IEEE TRANSACTIONS ON, vol. 57, no. 1, January 2010 (2010-01-01), pages 114 - 123
SMITH, W. A.: "THE ROLE OF PIEZOCOMPOSITES IN ULTRASONIC TRANSDUCERS", IN PROC. IEEE ULTRASON. SYMP., 1989, pages 755 - 766
WILD, J.: "THE USE OF ULTRASONIC PULSES FOR MEASUREMENT OF BIOLOGICAL TISSUES AND THE DETECTION OF TISSUE DENSITY CHANGES", SURG, vol. 127, no. 2, 1950, pages 183 - 188
YARALIOGLU, G.G.; BADI, M.H.; ERGUN, A.S.; KHURI-YAKUB, B.T.: "IMPROVED EQUIVALENT CIRCUIT AND FINITE ELEMENT METHOD MODELING OF CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCERS", PROCEEDINGS OF THE IEEE ULTRASONICS SYMPOSIUM, vol. 1, 2003, pages 469 - 472
YARALIOGLU, G.G.; ERGUN, A.S.; BAYRAM, B.; HAEGGSTROM, E.; KHURI-YAKUB; BUTRUS T.: "CALCULATION AND MEASUREMENT OF ELECTROMECHANICAL COUPLING COEFFICIENT OF CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCERS", ULTRASONICS, FERROELECTRICS AND FREQUENCY CONTROL, IEEE TRANSACTIONS ON, vol. 50, no. 4, 2003, pages 449 - 456
YEH, D.T.; ORALKAN, O.; WYGANT, 1.0.; O'DONNELL, M.; KHURI-YAKUB, B.T.: "3-D ULTRASOUND IMAGING USING A FORWARD-LOOKING CMUT RING ARRAY FOR INTRAVASCULAR/INTRACARDIAC APPLICATIONS", ULTRASONICS, FERROELECTRICS AND FREQUENCY CONTROL, IEEE TRANSACTIONS ON, vol. 53, no. 6, 2006, pages 1202 - 1211

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12350710B2 (en) 2018-11-16 2025-07-08 Vermon S.A. Capacitive micromachined ultrasonic transducer and method of manufacturing the same
US20210362188A1 (en) * 2020-05-22 2021-11-25 GE Precision Healthcare LLC Micromachined ultrasonic transducers with non-coplanar actuation and displacement
US11904357B2 (en) * 2020-05-22 2024-02-20 GE Precision Healthcare LLC Micromachined ultrasonic transducers with non-coplanar actuation and displacement
US20220219198A1 (en) * 2021-01-12 2022-07-14 GE Precision Healthcare LLC Micromachined ultrasonic transources with dual out-of-plane and in-plane actuation and displacement
US11911792B2 (en) * 2021-01-12 2024-02-27 GE Precision Healthcare LLC Micromachined ultrasonic transources with dual out-of-plane and in-plane actuation and displacement

Also Published As

Publication number Publication date
EP3221064B1 (fr) 2018-09-26
EP3221064A1 (fr) 2017-09-27

Similar Documents

Publication Publication Date Title
JP4401958B2 (ja) マイクロ機械加工された超音波トランスデューサ及び製造方法
Logan et al. Fabricating capacitive micromachined ultrasonic transducers with a novel silicon-nitride-based wafer bonding process
Wang et al. Enhancement of the transmission of piezoelectric micromachined ultrasonic transducer with an isolation trench
Smyth et al. High electromechanical coupling piezoelectric micro-machined ultrasonic transducer (PMUT) elements for medical imaging
Khuri-Yakub et al. Silicon micromachined ultrasonic transducers
Huang et al. Capacitive micromachined ultrasonic transducers with piston-shaped membranes: Fabrication and experimental characterization
CN115532572B (zh) 一种多频压电微机械超声换能器及制备方法
US20130049526A1 (en) Ultrasonic transducer and method of manufacturing the same
Zheng et al. Development of a novel CMUT-based concentric dual-element ultrasonic transducer: Design, fabrication, and characterization
EP3221064B1 (fr) Actionneur avec intervalle vertical pour transducteurs ultrasonores et fabrication correspondante
EP3317026B1 (fr) Système d'ultrasons et procédé de transmission d'impulsions ultrasonores
Ergun et al. Broadband capacitive micromachined ultrasonic transducers ranging from 10 kHz to 60 MHz for imaging arrays and more
Pappalardo et al. Micromachined ultrasonic transducers
JP6267787B2 (ja) 超音波トランスデューサ及びその製造方法、並びに超音波検査装置
CN106315506A (zh) 制造复合微机械电容式超声换能器的微加工工艺
Thacker et al. Design and characterization of low frequency capacitive micromachined ultrasonic transducer (CMUT)
Huang et al. Fabrication of Capacitive Micromachined Ultrasonic Transducers (CMUTs) using wafer bonding technology for low frequency (10 kHz-150 kHz) sonar applications
Degertekin Microscale systems based on ultrasonic MEMS—CMOS integration
US12486159B2 (en) Micro-machined ultrasound transducers with insulation layer and methods of manufacture
EP4363369A1 (fr) Transducteurs ultrasonores micro-usinés avec couche d'isolation et procédés de fabrication
Ergun et al. Capacitive micromachined ultrasonic transducer technology for medical ultrasound imaging
Wang et al. Fabrication Process and Performance Analysis of AlN based Piezoelectric Micromachined Ultrasonic Transducer with a Suspended Structure
Liu et al. Sensitivity Enhanced High Frequency pMUT with 3 rd-Order Flexural Mode Using LN Thin Film
Yaralioglu et al. Finite element modeling of capacitive micromachined ultrasonic transducers
CN205949255U (zh) 一种复合微机械电容式超声换能器

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15784792

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

REEP Request for entry into the european phase

Ref document number: 2015784792

Country of ref document: EP