WO2016078766A1 - Radio-frequency conductor system having a plurality of chambers - Google Patents

Abstract

A radio-frequency conductor system (1) having a plurality of chambers (6₁, 6₂,... 6_n) comprises a radio-frequency housing (2) with at least one recess (7). Furthermore, there is at least one separating element (5₁, 5₂,... 5_n), which is formed in the radio-frequency housing (2) and divides the at least one recess (7) into at least two chambers (6₁, 6₂,... 6_n). At least one wired RF bushing (3), which is arranged within the at least one recess (7), is guided through the at least one separating element (5₁, 5₂,... 5_n), wherein the at least one RF bushing (3) is electrically insulated from the separating element (5₁, 5₂,... 5_n). The radio-frequency housing (2) and the at least one separating element (5₁, 5₂,... 5_n) have a two-part form, wherein the at least one separating element (5₁, 5₂,... 5_n) is mounted fixedly in the radio-frequency housing (2). The at least one separating element (5₁, 5₂,... 5_n) comprises at least one contact face (41), via which it is galvanically connected to a supporting face (42) of the radio-frequency housing (2).

Description

High-frequency conductor system with several chambers

The invention relates to a high-frequency conductor system with a plurality of chambers. Such a high-frequency conductor system is used for example in radio systems, in particular in the mobile sector. In this case, a common antenna is often used for the transmit and receive signals. The transmit and receive signals each use different frequency ranges, and the antenna must be suitable for transmitting and receiving in both frequency ranges. To separate the transmit and receive signals, therefore, suitable frequency filtering is required with which, on the one hand, the transmit signals from the transmitter to the antenna and, on the other hand, the receive signals from the antenna to the receiver are forwarded. For the distribution of the transmit and receive signals, high-frequency filters in cavity design and / or coaxial design are used today.

For example, a pair of high frequency filters can be used, both of which are a specific frequency band let through (bandpass filter). Alternatively, a pair of high frequency filters may be used, both of which block a particular frequency band (bandstop filter). Furthermore, a pair of high-frequency filters can be used, of which a filter transmits frequencies below a frequency between transmit and receive band and blocks frequencies above this frequency (low-pass filter) and blocks the other filter frequencies below a frequency between transmit and receive band and overlying Passing frequencies (high pass filter). Other combinations of the just mentioned filter types are conceivable.

Such filters often have a coaxial structure, since they consist of milling or castings, whereby they are easy to produce.

From the prior art, as shown by way of example in Figure 12, a high-frequency conductor system with a plurality of chambers is known, which can be used for example for filtering RF signals. The high-frequency - conductor system 1 is shown in plan view with the lid open. This comprises a high frequency housing 2, an RF feedthrough 3 in the form of an inner conductor and a connecting piece 4 in the form of a coaxial plug. The RF feedthrough 3 is guided by cross connections 5, which subdivide the high-frequency conductor system 1 into different chambers 6χ, 6 ₂ to 6 _n . These cross connections 5 have a receiving opening in the axial direction and are formed integrally with the high-frequency housing 2. The high-frequency housing 2 is preferably milled out of a workpiece, wherein the cross-connections 5 are left to stand. A disadvantage of the prior art of Figure 12 is that the receiving opening is provided in the cross connections 5 with a drill inserted through the opening for the connection piece 4, wherein the drill has a slight play or swinging at the tip which leads to it in that the cross-links 5, which are furthest from the receiving opening, are no longer pierced cleanly and centered. Electroplating also occurs unevenly and the layer thickness can not be set exactly. Even a deburring to reduce the surface roughness is difficult. This degrades the filter behavior. From CN 202 474 151 U a low-pass filter is known, which has a housing and extending through the housing metal wire. The metal wire is galvanically connected to several metal disks so that it has areas of different diameter along its length. The metal discs are isolated from the housing.

US 3,070,873 A shows a cavity resonator having a plurality of resonator chambers. The resonator chambers are separated by partitions. The partitions each have an opening through which the individual resonator hammers are coupled to the respective adjacent resonator chamber. It is therefore the object of the present invention to provide a high-frequency conductor system with a plurality of chambers, which has reproducible properties, It is easy to produce and keeps the levels of resulting intermodulation products as low as possible.

The object is solved by the present invention according to independent claim 1. Advantageous embodiments are specified in the subclaims.

A high-frequency conductor system consists of several chambers and has a high-frequency housing with a recess. In the Hochf equenzgehäuse at least one separating element is formed, which divides the at least one recess in at least two chambers. A line-connected RF feedthrough, in particular an inner conductor, is arranged within the at least one cutout and passed through the at least one separating element. The high-frequency housing and the at least one separating element are formed in two parts, wherein the at least one separating element is fixedly mounted in the high-frequency housing. The at least one RF feedthrough is galvanically isolated from the at least one separating element. The at least one separating element has at least one contact surface. The at least one contact surface is galvanically connected to a support surface, wherein the support surface is formed by a surface of the high-frequency housing within the at least one recess and / or wherein the support surface is formed by a surface of the cover closing the high-frequency housing on one side. Because the high-frequency housing and the at least one separating element are formed in two parts, the separating element can therefore be produced separately from the high-frequency housing separately and is fixed firmly to the high-frequency current only during assembly. connected housing. This allows the receiving opening within the separator, through which the conducted RF feedthrough is routed, to be very easily and accurately drilled, milled, stamped, or made by other means. A deburring of any unevenness is just as easily possible as the exact galvanization of the component. As a result, a high-frequency conductor system, for example for filtering high-frequency signals, which has exactly reproducible characteristics, can be produced easily and the levels of resulting intermodulation products are below -150 dBc, preferably below -160 dBc, more preferably below. 175 dBc stops. The separator is also a separately mounted partition, or a separately mountable release agent, or a separately mounted divider. The contact surface causes the separating element to contact the high-frequency housing only at a precisely defined location. Preferably, only a part of the respective side of the separating element forms the contact surface. As a result, the reproducibility of the entire arrangement is further increased.

In addition, there is an advantage if the at least one separating element has at least one projection through which the at least one contact surface is formed. This ensures that the at least one separating element does not contact the high-frequency housing at any other locations.

In addition, there is an advantage if the high-frequency conductor system according to the invention has a contact surface within the at least one recess of the high-frequency housing has, which is formed by a groove in the high-frequency housing, so that in this groove, the at least one contact surface of the at least one separating element is located. This allows that during the assembly of the high-frequency conductor system according to the invention, the separating element can be very easily positioned.

A further advantage exists if the at least one separating element has at least one bore which enters at least one contact surface and if a further housing bore in the form of a through bore in the high-frequency housing and / or the cover of the high-frequency housing at which at least one contact hole surface corresponding bearing surface exits, wherein at least the bore within the partition member has a thread or wherein self-tapping screws are used, so that a screw connects the separating element fixed to the high-frequency housing and / or the cover of the high-frequency housing. As a result, the separating element can be connected particularly firmly to the high-frequency housing and / or to the cover of the high-frequency housing. By a screw that can be tightened with a specified torque, a precisely reproducible electrical contact can be adjusted because the hole exits directly on the single contact surface of the separator with the high-frequency housing, or the cover of the high-frequency housing.

In addition, there is an advantage if the at least one separating element has at least one bore in the form of a through-bore which emerges at the at least one contact surface and if a housing bore in the high-frequency housing at which at least one connector contact surface occurs, wherein at least the housing bore within the high-frequency housing preferably has a thread or self-tapping screws are used, so that a ne screw connects the separator firmly with high-frequency housing. This allows all screws to be screwed in from a single side. In this case, the housing bore in the high frequency housing is not a through hole, so that the high frequency housing has no additional opening. All screws which are required for fastening the separating element to the high-frequency housing and / or to the cover of the high-frequency housing, have the same direction with respect. their axis and the orientation of their screw heads. This additionally facilitates the production.

In addition, there is an advantage if the bore and / or housing bore in the form of a through hole has at least two different Bohrradien so that the screw completely within the at least one bore of the separating element and / or completely within the at least one housing bore of the high frequency housing and / or the lid the high frequency housing is located. As a result, do not stand out parts of screws, such as the screw heads, at the same time the high-frequency conductor system has the desired electrical properties. Furthermore, there is an advantage if the at least one separating element is only galvanically connected to the high-frequency housing via the at least one contact surface. The thereby adjusting electrical contact This makes it particularly accurate reproducible. In this case, the separating element is galvanically connected directly or indirectly to the high-frequency housing via its at least one contact surface. A direct connection is understood to mean that the contact surface corresponding to the at least one contact surface is a surface of the high-frequency housing. An indirect connection means a connection in which the at least one contact surface is galvanically connected to the cover of the high-frequency housing, the cover of the high-frequency housing also being galvanically connected to the high-frequency housing.

In addition, there is an advantage if the at least one separating element is integrally formed with its at least one contact surface. As a result, the production of the separating element is facilitated and the electrical properties are more reproducible. Furthermore, it is particularly advantageous if the at least one separating element is electrically isolated from the high-frequency housing and / or from the cover of the high-frequency housing at locations other than those belonging to the at least one contact area. The gap is to be chosen in relation to the frequency range in which the high-frequency conductor system is used. The high-frequency conductor system according to the invention operates in a very broadband manner and can be used, for example, in frequency ranges from 380 MHz to 3.8 GHz. The gap should be smaller than K / 2 or smaller than λ / 5 or preferably smaller than λ / 10 or more preferably smaller than λ / 15 or more preferably smaller than λ / 20 of the highest frequency of the transmitted Frequency band. This has the effect that the chambers resulting from the at least one separating element within the high-frequency conductor system do not influence one another.

In addition, there is an advantage if the high-frequency conductor system according to the invention has within the at least one separating element a continuous receiving opening for receiving the RF feedthrough, wherein the RF feedthrough in the areas where it is passed through the at least one separating element, through a dielectric medium galvanically isolated from the at least one separating element but supported by this or when the RF feedthrough in the areas where it is passed through the at least one separating element is separated from the at least one separating element by a free space. In the latter case, there is no contact of the RF feedthrough with the at least one separating element. The dielectric medium is, for example, a clip made of plastic, in particular made of Teflon, which radially surrounds the cylindrical RF feedthrough. The clip can be easily clipped around the cylindrical RF feedthrough. It is also possible for the preferably cylindrical or rectangular or oval RF feedthrough to have an insulating coating at the region where it is held by the separating element. Other isolation options are also conceivable. It is also possible that there are separating elements which do not support the RF feedthrough, but instead provide a free space between the separating element and the HF feedthrough, so that the RF feedthrough is carried out by the separator. element is spaced. The free space can be filled with air, for example. There may also be a vacuum in the free space. A further advantage exists if the at least one separating element has guide pins which engage in a guide groove of the high-frequency housing. In this case, the assembly can be done very easily and the separator remains locked up to a certain extent within the recess of the high frequency housing until it is screwed by a screw connection with a well-defined torque with the high frequency housing and / or the cover of the high frequency housing.

Finally, in the high-frequency conductor system according to the invention, there is an advantage if the at least one separating element is rectangular and / or if the at least one separating element and / or the high-frequency housing are made of aluminum and coated with a copper / silver

Layer are galvanized.

A rectangular separator can be made very easily. Separating elements and / or high-frequency housings made of aluminum or brass or steel or a metal casting or a plastic provided with a metal layer can be produced inexpensively and have a high electrical conductivity. A galvanization with a copper / silver layer is also favorable and additionally increases the electrical conductivity. However, the at least one separating element can also consist of brass and it is also possible that both the separating element and the high-frequency housing are covered with a thin layer of gold.

Various embodiments of the invention will now be described by way of example with reference to the drawings. Same objects have the same reference numerals. The corresponding figures of the drawing show in detail: FIG. 1: a spatial plan view of an exemplary embodiment of the high-frequency conductor system according to the invention with a plurality of chambers;

FIG. 2 shows a side view of an embodiment of the high-frequency conductor system according to the invention with a plurality of chambers;

Figure 3A, 3B: a perspective view of a separator of the high-frequency conductor system according to the invention with performed RF implementation;

FIG. 4 shows a side view of an embodiment of the separating element of the high-frequency conductor system according to the invention;

FIG. 5A shows a side view of an embodiment of the separating element and its attachment in the high-frequency housing; FIG. 5B shows a side view of a further exemplary embodiment of the separating element and its attachment in the high-frequency housing; a side view of another embodiment of the separating element and its attachment in the high frequency housing; a side view of another embodiment of the separating element and its attachment in the high frequency housing; a plan view of an embodiment of the separating element and its contact surface; a plan view of an embodiment of the separating element and its contact surfaces; a plan view of an embodiment of the separating element and its contact surfaces; a side view of an embodiment of the separation element and its attachment in the high frequency housing; a section through a separator with a through hole for attachment to the high frequency housing; a plan view of the separator with a through hole for attachment to the high frequency housing; a side view of a separating element, wherein the contact surfaces protrude as wings; a side view of a separating element having wings for attachment; a spatial view of a separating element, wherein the contact surfaces protrude laterally as a base and in the direction of the recess; a spatial view of a separating element, wherein the contact surfaces protrude as a base circumferentially and in the direction of the recess; a plan view of an inventive embodiment of the high-frequency conductor system with a plurality of chambers, wherein the wings projecting contact surfaces of the separating element engage in a guide of the high-frequency housing; a plan view of a recess of the high frequency housing, wherein the bearing surfaces are visible in the high frequency housing for the corresponding contact surfaces of the separating element; a section through the Hochfrequenzgehäu- se, wherein the insertion of the separating element and configured as grooves receiving surfaces are visible;

FIG. 9C shows a section through the high-frequency housing with the separating element completely inserted; Figure 10A-E: a plan view of the separator on whose sides different forms of guide pins are formed; Figure 11A-B is a side view of the separator having various shapes for the receiving aperture of the RF feedthrough; and

FIG. 12: a top view of a high-frequency conductor system as known from the prior art.

FIG. 1 shows a spatial plan view of an exemplary embodiment of the high-frequency conductor system 1 according to the invention with a plurality of chambers 6 _X , 6 ₂ , 6 _n . The high-frequency conductor system 1 consists of a high-frequency housing 2, which may be made of aluminum, for example. The high-frequency housing 2 is provided with at least one recess 7, which can be created for example by a milling process. Within the high-frequency housing 2, at least one separating element 5i, 5 ₂ , .. ·, 5 _{n is} formed, whereby the at least one recess 7 is divided into at least two chambers 6 _lt 6 ₂ , 6 _n . A line-connected RF feedthrough 3 is connected at one end of the high-frequency conductor system 1 to a preferably coaxially designed connecting piece 4. The RF feedthrough 3 has the shape of a cylindrical inner conductor. Within the recess, the conducted RF feedthrough 3 is passed through the at least one separating element 5i, 5 ₂ , 5 _n and is supported on it, or is supported on it. The at least one HF feedthrough 3 is, however, galley vanish from the high-frequency housing 2 and the at least one separating element 5 _{1 (} 5 ₂ , 5 _n separated.

Within FIG. 1, an L-shaped recess is shown. This allows the cable-bound RF feedthrough 3 arranged inside the L-shaped recess 7 to be bent and / or bent at at least one point. It is also possible for the conducted RF feedthrough 3 to consist of two segments which are connected to one another at the at least one point. Such a connection of two segments of the conducted RF feedthrough 3 can take place, for example, by means of a solder connection or a welded connection. The RF feedthrough 3 is preferably made of copper. Like the separating element 5i, 5 ₂ ,..., 5 _n or the high-frequency housing ₂ , the HF feedthrough 3 can also be made of aluminum or brass or a cast metal or a plastic provided with a metal layer. In the latter, a favorable production takes place, wherein nevertheless a high electrical conductivity is achieved. As a result, a high-frequency conductor system 1 can be provided, in which the conducted RF feedthroughs 3 can be wound in any desired shape. The RF feedthroughs 3 are at regular distance through the at least one separating element

5i, 5 ₂ , 5 _n held.

The separating elements 5i, 5 ₂ , 5 _n not only cause one

Holding the conducted RF feedthrough 3, but they are also elementary in order to realize the desired filtering effect. The conducted RF feedthrough 3 in particular represents an inductance. By the at least one separating element 5i, 5 ₂ , 5 _n a capacitance forms between the conducted RF feedthrough 3 and the high-frequency housing 2. By way of the interaction between the RF feedthrough 3 and the at least one separating element 5i, 5 ₂ , 5 _n , any desired filter structures can be realized.

The inductance of the conducted RF feedthrough 3 can be changed, for example, by increasing or decreasing the diameter. The same applies to the capacity which is formed by the at least one separating element 5i, 5 ₂ , 5 _n . _{N is} an alteration of at least one separating element 5i, 5, 5 causes a change in capacitance. For example, such a change in capacitance can by the used material of the separating element 5i, 5 _2, 5 _n, by the used dielectric medium 31 between the wired RF Procedure 3 and the at least one separating element 5i, 5, -, 5 _n, or the general Position of the RF feedthrough 3 can be achieved within the separating element 5i, 5 ₂ , 5 _n .

Within FIG. 1, a cover 8 is not shown, with which the high-frequency housing 2 is sealed in a high-frequency-tight manner. A high-frequency-tight closure is understood to be a connection between the cover 8 and the high-frequency housing 2, which does not permit the occurrence of interference radiation. The lid 8 may be, for example, a metal lid which, like the high-frequency housing 2, is also made of aluminum, in particular milled. However, the cover 8 can also be formed inexpensively from a printed circuit board, which on at least one side, preferably on the inside, a preferably carried out Hende electrically conductive surface, in particular made of copper. It is also possible that a very thin layer of silver over the copper layer for the preservation of the copper is formed in order to prevent the corrosion. Such a cover 8 can be pressed onto the high-frequency housing 2 and / or screwed firmly to it by a screw connection. The lid 8 can be screwed on the one hand to the high frequency housing 2 and on the other hand with the at least one separating element 5i, 5 ₂ , 5 _n . Such

Hole 45, which is in particular a bore with an internal thread, can be seen in FIG. Instead of a threaded hole, the bore 45 may be configured without thread. In this case, however, self-tapping screws must be used. The bore 45 takes place in the at least one separating element 5i, 5 ₂ , 5 _n , so that it can be screwed via the bore 45 by means of a screw connection with the cover 8 of the high-frequency housing 2. The high frequency housing 2 is preferably made entirely of electrically conductive material. But it can also consist of a dielectric, which is coated with a conductive layer. In particular, all surfaces of the high frequency housing 2, which are surrounded by the recess 7, must be electrically conductive.

FIG. 2 shows a side view of an exemplary embodiment of the high-frequency conductor system 1 according to the invention, which has a plurality of chambers 6i, 6 ₂ , 6 _n which are electrically separate from one another. The chambers 6 _X , 6 ₂ , 6 _n are formed by the insertion of the separating elements 5i, 5 ₂ , 5 _n . The HF feedthrough 3 in the form of an inner conductor from FIG. 1 extends from the connection piece 4 and runs in a curve within the known from Figure 1 recess. 7

Via a screw connection, the at least one separating element 5i, 5 ₂ , 5 _n with the lid 8 and / or the

High frequency housing 2 screwed. So that the at least one separating element 5χ, 5 ₂ , 5 _n can not rotate within the recess 7, at least two screw connections per separating element 5i, 5 ₂ , 5 _n are preferably formed. The at least one separating element 5χ, 5 ₂ ,

5 _n is preferably connected via two of its sides to the high-frequency housing 2 and the cover 8 of the high-frequency housing 2. In the illustrated embodiment of Figure 2, the screws are rotated from the outside through the lid 8 and from the outside by the high frequency housing ₂ to fix the at least one separating element 5i, 5 ₂ , 5 _n within the recess 7. The screw head has a larger diameter than the bore, so that in the embodiment of Figure 2, for the case that the screws from the outside through the cover 8 and the high-frequency housing 2 in the at least one separating element 5i, 5 ₂ , 5 _n , only the bore within the at least one separating element 5, 5 ₂ , 5 _n a

Internal thread must have. But it is also possible that all holes shown are automatically provided with an internal thread. It is also possible that the internal thread consists of another, preferably resistance-resistant material compared to the material into which the internal thread is inserted. Self-tapping screws can also be used. Figure 3A shows a perspective view of the separating element 5i, 5 _2, ... 5 _n of the inventive high frequency circuit system 1 having undergone RF implementation 3. The at ^¬ least one RF bushing 3 is in this case completeness dig of the high-frequency package 2 and the at least one separating element 5i, 5 ₂ , 5 _n galvanically isolated. However, it could also be that the RF feedthrough 3 is galvanically connected to the high-frequency housing 2 via a terminating resistor, for example in the form of 50 Ω or via an inductance. The at least one separating element 5 _lt 5 ₂ , 5 _{n in} this case has a continuous receiving opening 30. The radius of the receiving opening 30 is greater than the radius of the RF feedthrough 3. The cross section of the receiving opening 30 is round in the embodiment shown. The RF feedthrough 3 is galvanically separated from the at least one separating element 5 _X , 5 ₂ , 5 _n by a dielectric medium 31 in the regions where it is passed through the at least one separating element 5i, 5 ₂ , 5 _n , Within FIG. 3A, the dielectric medium 31 is laid radially around the RF feedthrough 3. Shown is also a thickened portion 3 ¹ of the RF implementation 3. The RF Procedure 3 may preferably be in the range in which it is guided by the partition member 5 _lf 5 _2, 5 _n have a different, preferably larger diameter, so characterized the forming capacity is adjustable. The RF feedthrough can be produced in one piece as a turned part, for example. In this embodiment, the dielectric medium 31 has a small thickness. In the further embodiments, the dielectric medium 31 is shown with a greater thickness. A change in the diameter of the HF bushing 3 is used for better understanding. depiction omitted in the future. The thickness of the dielectric medium 31 is not to scale in all embodiments. FIG. 3B shows a three-dimensional view of the separating element 5i, 5 ₂ ,... 5 _{n of} the high-frequency conductor system 1 according to the invention with the HF feedthrough performed. 3. In contrast to FIG. 3A, thickening of the HF feedthrough is dispensed with. Instead, the dielectric medium 31 has a larger diameter. The diameter of the RF feedthrough 3 together with the dielectric medium 31 must be slightly smaller than the diameter of the receiving opening 30. This is indicated by a small gap 32, which does not correspond to the actual dimensions.

FIG. 4 shows a side view of an embodiment of the separating element 5i, 5 ₂ , 5 _n and its attachment in the high-frequency housing 2. The at least one separating element 5 χ, 5 ₂ , 5 _n is rectangular. In this case, two sides of the at least one separating element 5i, 5 ₂ , 5 _n are preferably of different lengths. However, it is also possible that all sides of the cross-section shown, at least one separating element 5i, 5 ₂ , 5 _n , have the same length. The at least one separating element 5 i, 5 _2/5 However, _n can also have a round cross section.

The at least one separating element 5i, 5 ₂ , 5 _n has in FIG. 4 three contact surfaces 41 formed by projections 40. Each separating element 5 i, 5 ₂ , 5 _n preferably has at least one such projection 40. The contact surface formed by the end of the respective projection 40 surface 41 may be in the form of a rectangle, a circle, an oval or generally an n-corner. The contact surface 41 is preferably formed solely at the end of the projection 40. Any side surfaces of the projection 40 are not considered in the context of this application as a contact surface 41.

The contact surfaces 41 formed by the projections 40 are in this case of the at least one separating element 5i, 5 ₂ ,

5 _n by less than K / 2, preferably by less than λ / 5, more preferably by less than λ / 10, more preferably by less than λ / 15 or more preferably by less than λ / 20 of the highest frequency of the transmitted frequency band ,

It can also be seen that the two contact surfaces 41 are arranged on two different sides of the at least one separating element 5i, 5 ₂ , 5 _n . So that

Separating element 5 _X , 5 ₂ , 5 _n can be mounted against rotation within the recess 7, this must have at least two projections 40.

FIG. 4 also shows the conducted RF feedthrough 3 in the form of an inner conductor, which is held by the dielectric medium 31 in the region of the passage through the at least one separating element 5 _lt 5 ₂ , 5 _n . For better illustration, the dielectric medium 31 is shown to be approximately as thick as the RF feedthrough 3. In practice, however, the dielectric medium 31 may be significantly thinner, in particular a thickness of only a few millimeters, preferably less than 3 mm, further preferably less than 2 mm, more preferably less than 1 mm. The HF Carrying out 3 can therefore have a thickening 3 ¹ , over which the capacity is adjustable.

Within the projections 40, a bore 45 is executed, which enters in the region of the contact points 41. The bore 45 has a depth which is preferably selected such that the bore 45 still protrudes into the at least one separating element 5i, 5 ₂ , 5 _n . The bore 45 is preferably equipped with an internal thread. About this internal thread, the at least one separating element 5 _lt 5 ₂ , 5 _n firmly with a contact surface 41 corresponding to the bearing surface 42 within the high-frequency housing 2, and the cover 8 with this, or firmly bolted to it. When using self-tapping screws can be dispensed with a thread.

FIG. 5A shows a side view of an exemplary embodiment of the separating element 5i, 5 ₂ , 5 _n and its attachment in the high-frequency housing 2. The at least one separating element 5i, 5 ₂ , 5 _n becomes galvanic only via the contact surfaces 41 formed by the projections 40 connected to the high-frequency housing 2, and the cover 8 of the high-frequency housing 2. The at least one separating element 5i, 5 ₂ , 5 _n is galvanically separated from the high-frequency housing 2 and / or the cover 8 of the high-frequency housing by an air gap at all locations other than the at least two contact surfaces 41. The gap must preferably be smaller than half the wavelength of the high frequency signal, whereby the chambers 6 _l7 6 ₂ , 6 _n do not affect each other electrically. The at least one separating element 5 _lt 5 ₂ , 5 _n is formed in one piece with its contact surfaces 41 formed by the at least two projections 40. The at least one separating element 5 i, 5 ₂ , 5 _n can be produced in the form shown in FIG. 5A, for example by means of a milling process.

So that the at least one separating element 5 i, 5 ₂ , 5 _{n can be} firmly connected to the high-frequency housing 2, the high-frequency housing 2 must also have a housing bore 46. In the example shown in FIG. 5A, the high-frequency housing 2 has a housing bore 46 in the form of a through-bore. A thread is not necessary within this housing bore 46, but may be formed. The head of the screw must have a larger diameter than the housing bore 46 in the form of a through hole, so that it can be supported on the high-frequency housing 2. The screw penetrates the high frequency housing 2 and penetrates into the bore 45 of the projections 40 a. The bore 45 within the projections 40 has an internal thread, so that the screw connection can be tightened. The tightening of the screw connection results in a precisely defined contact between the contact surface 41 and the galvanically connected support surface 42 of the high frequency housing 2. The support surface 42 is formed by a surface of the high frequency housing 2 within the at least one recess 7. The support surface 42 may also be formed by a surface of a high-frequency housing 2 on one side occlusive cover 8. FIG. 5B shows a side view of a further _exemplary embodiment of the separating element 5 _lf 5 ₂ , 5 _n and its attachment in the high-frequency _housing 2. In contrast to the exemplary embodiment from FIG. 5A, the exemplary embodiment in FIG. 5B shows the cover 8, which closes the high-frequency housing 2 in a high-frequency-tight manner , Good to see that a projection 40 is formed at the end of a contact surface 41 is formed, which is in galvanic contact with the inside of the lid 8. Also, this projection preferably has a threaded bore 45 which occurs at the location of the contact surface 41 to the outside. About this threaded hole 45, the lid 8 by means of a screw fixed to the at least one separating element 5 _lt 5 ₂ , 5 _{n are} fixed. Of course, self-tapping screws can also be used. It is also shown that the cover 8 is firmly connected at other locations by means of a screw connection with the high-frequency housing 2. The cover 8 can also be pressed onto the high-frequency housing 2.

Figure 5C shows a side view of another embodiment of the separating element 5 _lt 5 ₂ , 5 _n and its attachment in the high frequency housing 2. In contrast to the previous embodiments, the embodiment in Figure 5C shows no projection 40 and only one contact surface 41. The contact surface 41 is through a side surface, to which also the top and bottom of the separating element 5i, 5 ₂ , 5 _n belongs formed. In this case, the contact surface 41 is formed by the entire underside of the separating element 5 _λ , 5 ₂ , 5 _n . It is important that the screw connection on the side of the separating elements 5i, 5 ₂ , 5 _{n is} formed, on which the contact surface 41 is present.

FIG. 5D shows a side view of a further exemplary embodiment of the separating element 5i, 5 ₂ , 5 _n and its

Attachment in the high-frequency housing 2. In contrast to the previous embodiments, the screw does not penetrate the contact surface 41, but a surface adjacent to the contact surface 41 of the separating element 5i, 5 ₂ , 5 _n . In the example shown in FIG. 5D, the high-frequency housing 2 has a housing bore 46 in the form of a through-bore. The screw penetrates the high-frequency housing 2 and penetrates into the bore 45, which adjoins an area adjacent to the contact surface 41 of the separating element 5 _X , 5 ₂ , 5 _n . The bore 45, which begins at the adjacent surface, preferably has an internal thread, so that the screw can be tightened. The tightening of the screw connection results in a precisely defined galvanic contact between the contact surface 41 and the contact surface 42 of the high-frequency housing 2 which corresponds to this. The use of self-tapping screws is also possible. FIG. 5E shows a plan view of an embodiment of the separating element 5 _{1 #} 5 ₂ , 5 _n and its contact surface 41. The contact surface 41 has the shape of a rectangle. Other shapes, such as a square or a circle or an oval are also conceivable. Within the contact surface 41, preferably in the center of the contact surface 41, the bore 45 is formed for receiving the screw connection of the cover 8 or the high-frequency housing 2. The diameter of the bore 45 is smaller than the width of the contact surface 41. The diameter of the bore 45 is preferably less than half, more preferably less than 1/4, more preferably less than 1/8 of the width of the contact surface 41. In the illustrated embodiment, the width of the contact surface 41 smaller than the length of the contact surface 41st

FIG. 5F shows a further plan view of an exemplary embodiment of a separating element 5i, 5 ₂ , 5 _n and its contact surfaces 41. Shown are two projections 40 on one side of the at least one separating element

5 ₁ , 5 ₂ , .. ·, 5 _n protrude. Therefore, this has one side of the separating element 5χ, 5 ₂ , 5 _n two contact surfaces 41, which, as shown in Figures 5A and 5B, for contacting a corresponding bearing surface 42 of the high-frequency housing 2 are used. The contact surfaces 41, which on one side of the at least one separating element 5i,

5 ₂ , 5 _{n are} formed, may have a different surface shape to help for the

To give assembly.

FIG. 5G shows a further plan view of an exemplary embodiment of the separating element 5i, 5 ₂ , 5 _n and its contact surfaces 41. In this case, one side of the separating element 5i, 5 ₂ , 5 _{n has} four projections 40 and thus four contact surfaces 41 in each contact surface 41, a bore 45 extends in the direction of the projections.

Figure 6 shows a side view of an exemplary embodiment of the separation element 5i, _{5/5 n} and its attachment in high-frequency package 2. The separation element 5i, 5 _{2 /} 5 _n may be arranged with respect to its contact surfaces 41 anywhere within the recess 7 of the high-frequency housing 2. The contact surfaces 41 can the separating element 5i, 5 _2, .. ·, 5 _n the bottom of the high-frequency housing 2 support or on one of the side surfaces of the high-frequency housing 2. In this case, Zvi ^¬ rule another side surface of the partition member is 5i, 5 ₂ , 5 _n and the bottom a continuous gap. The

Screw connection would in this case take place through the side walls of the high-frequency housing 2. There may be any number of screw that connect the separator 5 _lr 5 ₂ , 5 _n with the high-frequency housing 2 and / or with the lid 8 of the high-frequency housing 2.

FIG. 7A shows a section through a separating element 5i, 5 ₂ ,..., 5 _n with a bore 45 in the form of a through-bore 45 for attachment to the high-frequency housing 2. The at least one separating element 5i, 5 ₂ , 5 _n has at least one through-bore 45 on, which emerges at the at least one contact surface 41 and on the contact surface 41 opposite surface of the separating element 5i, 5 ₂ , 5 _n enters and with respect. the position / orientation is arranged coaxially with a housing bore 46. Preferably, the at least one through-bore 45 has at least two different radii of curvature. A first larger Bohrradius is within the separating element 5 _lt 5 ₂ , 5 _n available. A smaller Bohrradius is formed at the transition between the separating element 5i, 5 ₂ , 5 _n and its projection 40. This allows a screw to lie completely within the at least one through-hole 45 of the separating element 5i, 5 ₂ , 5 _n . The screw head is protected and the screw body penetrates the bore 45 on the projection 4 0 through the contact surface 41 out into the housing bore 46, which has an internal thread within the high-frequency housing 2 a .. Another advantage here is that within the separating element 5χ, 5 ₂ , 5 _n no thread be formed got to. In this case, a thread is preferably present only in the threaded bore 46 within the bearing surface 42 corresponding to the corresponding contact surface 41 on the surface of the high-frequency housing 2. However, self-tapping screws can also be used. The advantage here is that the high frequency housing 2 does not have to be provided with a through hole 46. The electrical properties of the high-frequency housing 2 are optimized in this case.

In the opposite case, which is shown for example in Figure 6, there is a housing bore 46 in the form of a through hole in the high frequency housing 2, whereas a bore 45 in the form of a blind bore in the contact surface 41 in the direction of the projection 4 0 begins.

Good to see that in the projection 40 in the exemplary embodiment from FIG. 7A all screws of the screw connection shown have the same orientation and are arranged parallel to one another.

FIG. 7B shows a top view of the separating element 5 χ, 5 ₂ , 5 _n with the through bore 45 shown in FIG. 7A for attachment to the high-frequency housing 2. It can be seen that the through hole 45 at the opposite end of the contact surface 41 has a larger radius than the bore 45 from the Contact surface 41 exits and serves to attach the lid 8.

Figure 8A shows a side view of a separating element 5i, 5 ₂ , 5 _n wherein the contact surfaces 41 as a wing 80 project laterally from the separating element 5 _lr 5 ₂ , 5 _n . The wings 80 have a smaller cross-section, ie axial extent, than the main body 81 of the separating element 5 _lt 5 ₂ , 5 _n .

FIG. 8B shows a side view of the separating element 5i, 5 ₂ , 5 _n , which has wings 80 for attachment. A

Screwed connection penetrates the wings 80 and engages in an underneath, that is in the high-frequency housing 2 threaded hole. Self-tapping screws can also be used. The separating element 5i, 5 ₂ , 5 _n of Figure 8B also has a projection 40, which is not formed on the wing 80, however. The contact surface 41 formed by the projection 40 is pressed firmly against the high-frequency housing 2 by tightening the screw connection.

FIG. 8C has a three-dimensional view of a separating element 5i, 5 ₂ ,..., 5 _n , wherein the contact surface 41 as a base 85 projects laterally from the separating element 5i, 5 ₂ , 5 _n and in the direction of the recess 7 and thus in the direction the bottom of the high-frequency housing 2 extends. The base 85 can protrude laterally from one side of the separating element 5i, 5 ₂ , 5 _n . In the exemplary embodiment from FIG. 8C, the base projects from two sides laterally from the separating element 5i, 5 ₂ , 5 _n . The screw connection preferably penetrates the part of the base 85 projecting from the separating element 5i, 5 ₂ , 5 _n to the side. Ekel 85 can on any side of the separating element 5 i, 5 ₂ ,. , 5 _{n be} formed. Base 85 and separator 5 χ, 5 ₂ , 5 _n are integrally formed. 8D has a spatial view of a separating element 5 _X , 5 ₂ , 5 _n , the contact surface 41 as a base 85 laterally protruding from the separating element 5 _if 5 ₂ , 5 _n and in the direction of the recess 7 and thus in the direction of the bottom of the High frequency housing 2 runs. The base 85 is in the embodiment of Figure 8D from all four sides of the separating element 5 _lt 5 ₂ , 5 _n from the side. In addition, the base 85 is still in Rich ^¬ tion of the recess 7 of the separating element 5 i, 5 ₂ , 5 _n from. The separating element 5 i, 5 ₂ , 5 _n perched on the base 85th

Figure 8E shows a plan view of an inventive embodiment of the high-frequency conductor system 1 with a plurality of chambers 6 _lt 6 ₂ , 6 _n , wherein the protruding wings 80 contact surfaces 41 engage with their projections 4 0 in a guide 82 of the high-frequency housing 2. Evident is the bore 45, which is shown in Figure 8E as a through hole 45 through the wing 8 0. This emerges from the contact surfaces 41. At the contact surfaces 41 corresponding contact surfaces 42 is also a housing bore 46 is formed so that a screw the wing 80 and thus the separator 5 i, 5 ₂ , 5 _n with the high-frequency housing 2 firmly connects. The position of the RF feedthrough 3 is shown dashed in FIG. 8E.

The side surfaces 83 of the separating element 5 χ, 5 ₂ , 5 _n continue to close flush, preferably at right angles, with a side wall 84 of the high-frequency housing 2, wherein between the side walls 83 of the separating element 8 _1; 8, 8 _n and the side wall 84 of the high-frequency housing

2 a gap is formed. The galvanic contact between the separating element 5i, 5 ₂ , 5 _n and the high-frequency housing 2 also takes place in FIG. 8A solely via the contact surfaces 41.

FIG. 9A shows a plan view of a recess 7 of the high-frequency housing 2, the bearing surfaces 42 being visible in the high-frequency housing 2 for the contact surfaces 41 of the separating element 5i, 5 ₂ , 5 _n corresponding thereto. The bearing surfaces 42 also have a housing bore 46. The housing bore 46 can be designed as a passage bore or as a blind hole. In the event that the housing bore 46 is designed as a through hole, no internal thread is required. In the context of this invention, a bore within the high-frequency housing 2 or within the cover 8 is understood as a housing bore 46. This housing bore 46 may be designed as a through hole or blind hole and have a thread. It can be dispensed with a thread when self-tapping screws are used. A bore 45 is understood to mean a blind hole or through hole which is formed in the at least one separating element 5i, 5 ₂ ,..., 5 _n . The bore 45 and the housing bore 46 are arranged coaxially with each other and are diametrically opposed.

If the housing bore 46 is designed as a blind hole, then an internal thread must preferably be used to fasten the separating element S _Xl 5, 5 _n . the. You can also use self-tapping screws. Good to see are also the different chambers 6 _lt 6 ₂ , 6 _{n of} the high-frequency _{conductor system} 1. The chambers 6 _lr 6 ₂ , 6 _n are separated by the _separator 5 _lf 5 ₂ , 5 _n . A part of the side wall of the high frequency housing 2 protrudes by means of recesses 90 in the chambers 6 _lt 6 ₂ , 6 _n into it. On the one hand, these indentations 90 serve to adjust the filter properties and, on the other hand, can still have bores for fastening the lid 8.

FIG. 9B shows a section along the axis 91 through the high-frequency housing 2, the insertion of the separating element 5 _X , 5 ₂ , 5 _n and the bearing surfaces 42 provided in grooves being visible. It is shown that the housing bore 46 is executed within the high frequency housing 2 as a through hole. This is arranged coaxially with the bore 45 within the separating element 5i, 5 _{2 (} 5 _n , so that a screw engages through both drill openings 45, 46. The bearing surface is formed inside a groove in this embodiment i, 5 ₂ , 5 _n can be easily centered and partially locked in the correct position during assembly, but a groove is not absolutely necessary.

The height 92 of the projections 40 is greater than the depth 93 of the groove. This has the effect that there is always a gap between the surfaces of the at least one separating element 5i, 5 ₂ , 5 _n which are not formed as contact surfaces 41 and the surfaces which are not formed as bearing surfaces 42 of the high-frequency housing ₂ . FIG. 9C shows a section through the high-frequency housing 2 with the separating element 5 _X , 5 ₂ completely inserted.

5 _n . It can be seen that the separating element 5i, 5 ₂ , 5 _n galvanically contacted the high frequency housing 2 only at the contact points 41. The side surfaces of the projections 40 are not in galvanic contact with any side surfaces of the groove, in which the support surface 42 is arranged. Figures 10A, 10B, IOC, 10D and 10E show a plan view of the separator 5 _X , 5 ₂ , 5 _n at the

Pages different shapes of guide pins 100 are formed. The guide pins 100 may, for example, have the shape of a cuboid or several cuboids. A tappered shape as in FIG. 10C is also possible, such as a convex or unillustrated concave shape in FIG. 10D. It is also possible that the separating element 5 _1; 5 ₂ , 5 _n different forms of

Guide pins 100 has on the sides, so that the separating element 5 _i7 5 ₂ , 5 _{n /} if this is necessary due to the filter properties, is always installed in the correct orientation.

In this case, the guide pins 100 engage in a guide groove (not shown) within the high-frequency housing 2. The guide pins 100 are preferably made of a dielectric material and can be fastened to the separating element 5 _X , 5 ₂ , 5 _n , for example by means of an adhesive bond. It is also possible that the guide pins 100 together with the separating element 5 _1; 5 ₂ ,

5 _{n are formed in} one piece, wherein the guide pins 100 in the assembled state of the separating element 5i, 5 ₂ , 5 _n within the high frequency housing 2 no galvanic see contact between the separator 5 _X , 5 ₂ , 5 _n and the high frequency housing 2 establish.

Figures IIA and IIB show a side view of the separating element 5i, 5 ₂ , 5 _n which has various shapes for the receiving opening 30 of the RF feedthrough 3. Within FIG. 11A, the cylindrical RF feedthrough 3 is held by a dielectric medium 31, which has a pyramidal or triangular shape. The dielectric medium 31 is likewise supported on the receiving opening 30, which is pyramid-shaped or triangular in cross-section.

FIG. 11B shows that the RF feedthrough 3 is guided through or held by a dielectric medium 31, which has the shape of a hexagon. The dielectric medium 31 with the shape of a hexagon is in turn supported by a hexagonal receiving opening 30 in cross-section. The receiving opening 30 may also have a round or an octagonal or a regular polygonal cross section. It is also possible that the receiving openings 30 of various separation elements 5 _X, 5 _2, 5 have _n different cross-sectional shapes, whereby different Filterwir- give diseases, and whereby the respective dividing members 5i, 5 _2, 5 _n to the right place within the high-frequency housing 2 are arranged, because the RF feedthrough 3 is already provided with a correspondingly having the corresponding form dielectric medium 31 ready for mounting. In this case, the dielectric medium 31 has the same cross-sectional shape as the receiving opening 30. In the case in which the cross-section of the receiving opening 30 or of the dielectric medium 31 is not round, the dielectric medium is protected against twisting.

The dielectric medium 31 is preferably made of a plastic, or Teflon. The dielectric medium 31 may be formed as a clip, which encloses the cylindrical RF feedthrough 3 radially, that is clipped around this. The dielectric medium 31 may also be air, so that the RF feedthrough of the _separator 5 _lf 5 ₂ , 5 _n is not being held. In this case, a free space is formed between the separating element 5i, 5 ₂ , 5 _n and the HF feedthrough 3, so that the HF feedthrough 3 from the separating element 5i, 5 ₂ ,

5 _{n is} spaced. The free space can be filled with air, for example. The air pressure may also be below the atmospheric pressure of the environment. It may also be a vacuum formed in the free space, or the free space to be filled with a gas other than air. The recess 7 has in cross-section preferably a trough shape with preferably rounded corners.

The separating element 5i, 5 ₂ , 5 _n is preferably arranged exclusively within the recess 7 of the high-frequency housing 2. The recess 7 of the high-frequency housing 2 does not extend to the outside of the Hochf equenzgehäuses 2. The separating element 5i, 5 ₂ , 5 _n is preferably not apparent from this recess 7. The recess 7 is bounded by the bottom and the side walls of the high-frequency housing 2. In the area of

Separating element 5i, 5 ₂ , 5 _n , the high-frequency housing 2, in particular the bottom and the side walls of the high-frequency housing 2, no openings to the outside High frequency housing 2 on. The separating element 5i, 5 ₂ , 5 _n is not part of the outer wall, or of the outer circumferential wall of the high-frequency housing 2. The high-frequency housing 2 is therefore preferably not separated into different housing sections in the longitudinal direction. The outer wall or outer circumferential wall of the high-frequency housing 2 is completely closed in the region of the separating element 5i, 5 ₂ , 5 _n . By using at least one separating element 5i, 5 ₂ ,

5 _n is the recess 7 in at least two chambers 6i, 6 ₂ , ... 6 _n divided. The chambers 6 _lt 6 ₂ , ... 6 _n are electrically, or electromagnetically coupled only via the at least one RF feedthrough 3 with each other. This is achieved because the at least one separating element 5 _lt 5 ₂ , 5 _{n is} at the same potential as the high-frequency housing 2.

The invention is not limited to the embodiments described. In the context of the invention, all described and / or drawn features can be combined with each other as desired.

Claims

New claims; 1. High-frequency conductor system (1) with a plurality of chambers (6i, 6 ₂ , ... 6 _n ) having the following features:  a high-frequency housing (2) with at least one recess (7); at least one in the high-frequency housing (2) formed separating element (5i, 5 ₂ , ... 5 _n ), which divides the at least one recess (7) in at least two chambers (6i, 6 ₂ , ... 6 _n ) ;  at least one conducted RF feedthrough (3) disposed within the at least one recess (7) and passing through the at least one Separating element (5i, 5 ₂ , ... 5 _n ) is guided through; the high-frequency housing (2) and the at least one separating element (5 _{1 (} 5 ₂ , ... 5 _n ) are formed in two parts, wherein the at least one separating element (5i, 5 _{2 /} ... 5 _n ) in the high frequency housing (2) is firmly mounted; characterized by the following features: the at least one RF feedthrough (3) is galvanically isolated from the at least one separating element (5i, 5 ₂ , 5 _n ); the at least one separating element (5i, 5 ₂ , ... 5 _n ) has at least one contact surface (41); and the at least one contact surface (41) is galvanically connected to a bearing surface (42), wherein the bearing surface (42) is formed by a surface of the high frequency housing (2) within the at least one recess (7) and / or wherein the bearing surface (42) is formed by a surface of a high-frequency housing (2) on one side occlusive cover (8). 2. High-frequency conductor system with a plurality of chambers according to claim 1, characterized in that the at least one separating element (5 _X , 5 ₂ , ... 5 _n ) at least one projection (40) through which the at least one contact surface (41) is formed or in that the at least one contact surface (41) is formed by a side surface of the separating element (5i, 5 ₂ , ... 5 _n ). 3. A high-frequency conductor system with a plurality of chambers according to claim 2, characterized in that the at least one projection (40) formed at least one contact surface (41) of the at least one separating element (5i, 5 ₂ , ... 5 _n ) by less as λ / 2 or less than λ / 5 or less than λ / 10 or less than λ / 15 or less than K / 20 the highest frequency of the transmitted frequency band is spaced. 4. high-frequency conductor system having a plurality of chambers according to one of the preceding claims, characterized in that the at least one separating element (5i, 5 ₂ , ... 5 _n ) at least two contact surfaces (41) and / or that these on two different sides of the at least one separating element (5i, 5 ₂ , ... 5 _n ) are arranged. 5. high-frequency conductor system with a plurality of chambers according to one of the preceding claims, characterized in that the at least one contact surface (41) of the at least one separating element (5i, 5 ₂ , ... 5 _n ) parallel to the Aufla- gefläche (42) within the at least one recess (7) of the high frequency housing (2) or parallel to the support surface (42) on which the high frequency housing (2) occlusive lid (8) is arranged. 6. high-frequency conductor system having a plurality of chambers according to one of the preceding claims, characterized in that the bearing surface (42) within the at least one recess (7) of the high-frequency housing (2) in a groove in the high frequency housing (2) is formed, in which the at least a contact surface (41) of the at least one separating element (5i, 5 ₂ , ... 5 _n ) is located. 7. high-frequency conductor system having a plurality of chambers according to one of the preceding claims, characterized in that the at least one separating element {5 _lr 5 ₂ , ... 5 _n ) at least one bore (45) which at the at least one contact surface (41) or a surface adjacent to the contact surface (41) and that a further housing bore (46) in the form of a through hole in the high-frequency housing and / or the lid (8) of the high-frequency housing (2) on which, at least one contact surface (41) or to the contact surface (41) adjacent surface corresponding support surface (42) emerges, wherein at least the bore (45) within the separating element (5i, 5 ₂ , ... 5 _n ) preferably has a thread or self-tapping screws are used, so that a screw Separating element (5i, 5 ₂ , ... 5 _n ) firmly with the high frequency housing (2) and / or the cover (8) of the high frequency housing (2) connects. 8. high-frequency conductor system having a plurality of chambers according to one of the preceding claims, characterized in that the at least one separating element (5i, 5 ₂ , ... 5 _n ) at least one bore (45) in the form of a through hole, which at the at least one contact surface (41) or the surface adjacent to the at least one contact surface (41) and that a housing bore (46) in the high-frequency housing (2) at the, to the at least one contact surface (41) or to at least one contact surface (41). At least the housing bore (46) within the high-frequency housing (2) preferably has a thread or self-tapping screws are used so that a screw the separator (5i, 5 ₂ , ... 5 _n ) firmly connected to the high-frequency housing (2). 9. high-frequency conductor system having a plurality of chambers according to claim 7 or 8, characterized in that the at least one bore (45) in the form of a through hole (45) and / or that the at least one Gehäuseboh- tion (46) in the form of a through hole at least two Bohrradien so that the screw completely within the at least one bore (45) of the separating element (5i, 5 ₂ , ... 5 _n ) and / or completely within the at least one housing bore (46) of the high-frequency housing (2) and / or the lid (8) of the high frequency housing (2) is located. 10. High-frequency conductor system with a plurality of chambers according to one of the preceding claims, characterized in that the at least one separating element (5 _l7 5 ₂ , ... 5 _n ) only via the at least one contact surface (41) galvanic with the high-frequency housing (2) connected is. 11. High-frequency conductor system with a plurality of chambers according to one of the preceding claims, characterized in that the at least one separating element (5i, 5 ₂ , ... 5 _n ) with its at least one contact surface (41) is integrally formed. 12. High-frequency conductor system with a plurality of chambers according to one of the preceding claims, characterized in that the at least one separating element (5i, 5 ₂ , ... 5 _n ) at other than the at least one contact surface (41) belonging point, through a gap from the high-frequency housing (2) and / or the cover (8) of the high frequency housing (2) is electrically isolated. 13. A high-frequency conductor system with a plurality of chambers according to claim 2 or 3, characterized in that the at least one projection (40) with the contact surface (41) of the at least one separating element (5i, 5 ₂ , 5 _n ) as a wing (80) or base ( 85) laterally and / or in the direction of the recess (7) protrudes from the at least one separating element (5 _Χ , 5 ₂ , 5 _n ), wherein the wing (80) and / or the base (85) (40) in a guide (82) of the high-frequency housing (2) engages. 14. High-frequency conductor system with a plurality of chambers according to one of the preceding claims, characterized in that the at least one separating element (5i, 5 ₂ , ... 5 _n ) a having continuous receiving opening (30) for receiving the RF feedthrough (3). 15. High-frequency conductor system with a plurality of chambers according to claim 14, characterized in that the receiving opening (30) has a round or a n-square or a regular polygonal cross-section. 16. A high-frequency conductor system with a plurality of chambers according to claim 14 or 15, characterized in that the RF feedthrough (3) in the areas where it is passed through the at least one separating element (5i, 5 ₂ , ... 5 _n ) , by a dielectric medium (31) galvanically separated from the at least one separating element (5i, 5 ₂ , ... 5 _n ) but mechanically held by the latter or that the RF feedthrough (3) in the areas where they pass through the at least one separating element (5i, 5 ₂ , ... 5 _n ) is guided through a free space of the at least one separating element (5i, 5 ₂ , ... 5 _n ) is separated and thus without contact by the separating element ( 5i, 5 ₂ , ... 5 _n ) is guided. 17. A high-frequency conductor system with a plurality of chambers according to claim 16, characterized in that it is the dielectric medium (31) is a plastic clip, which encloses the cylindrical RF feedthrough (3) radially. 18, high-frequency conductor system having a plurality of chambers according to claim 17, characterized in that the clip is rotatably mounted or against rotation on the RF feedthrough (3) and / or has the shape of the receiving opening (30). 19. High-frequency conductor system having a plurality of chambers according to one of the preceding claims, characterized in that the at least one separating element (5 _X , 5 ₂ , ... 5 _n ) guide pins (100) which engage in a guide groove of the high frequency housing (2). 20. A high-frequency conductor system with a plurality of chambers according to claim 19, characterized in that the guide pins (100) consist of a dielectric material (31) and / or that the separating element (5i, 5 ₂ , ... 5 _n ) in firmly mounted state via the guide pins (100) is not galvanically connected to the high-frequency housing (2). 21. High-frequency conductor system with a plurality of chambers according to one of the preceding claims, characterized in that the at least one separating element (5i, 5 ₂ , ... 5 _n ) is rectangular and / or that the at least one separating element (5i, 5 ₂ , .. 5 _n ) and / or the high-frequency housing (2) made of aluminum or brass or steel or a metal casting or provided with a metal layer plastic and are galvanized with a copper / silver layer. 22. High-frequency conductor system with a plurality of chambers according to one of the preceding claims, characterized in that the at least one separating element (5i, 5 ₂ , ... 5 _n ) is completely disposed within the high-frequency housing (2) and that the high-frequency housing (2) in the area the at least one separating element (5i, 5 ₂ , ... 5 _n ) is closed to the outside.