WO2016078018A1 - Led module - Google Patents

Abstract

An LED module, comprising a substrate (1), an accommodation cavity (2) formed in the substrate (1), an LED chip (4) disposed on a metal area (3) on the bottom of the accommodation cavity (2), and an adhesive sheet (5) that is arranged above the LED chip (4) in a covering manner and has a predetermined interval with the LED chip (4). The adhesive sheet (5) and the accommodation cavity (2) are sealed by means of an adhesive (6). Due to the sealing effect of the adhesive (6) between the adhesive sheet (5) and the accommodation cavity (2), external corrosive substances are blocked and cannot enter the bottom of the accommodation cavity (2) along the accommodation cavity (2), so that the metal area (3) on the bottom of the accommodation cavity (2) is prevented from corrosion by external corrosive substances, and luminous efficiency and reliability of the LED are ensured.

Description

LED module Technical field

The present application relates to the field of light emitting diodes, and in particular, to an LED module.

Background technique

In recent years, more and more high-power light-emitting diodes (LEDs) have been gradually applied to traffic lighting. According to the latest research results, high-power LED technology will greatly replace the current various lighting products in the next five years. And it will be applicable to all kinds of lighting of automobiles, including: headlights, brake lights, fog lights, emergency lights, interior lighting, etc. LED has many advantages such as high safety, stable operation, power saving and long life. It is a development trend of vehicle lighting in the future. LED automotive lighting will become an important application field in the LED industry.

The automotive environment puts high demands on the reliability of high-power LEDs for vehicles. At present, the high-power LED used in automotive lighting uses ceramic as the carrier, the metal area at the bottom of the cavity is silver plated, and the LED chip is placed on the surface of the metal area and adopts a eutectic soldering process to rapidly dissipate heat, reduce the junction temperature of the LED, and improve the reliability of the LED. The commonly used LED comprises a base (ceramic substrate), a cavity is arranged on the base, and the cavity wall of the cavity is provided with a plurality of inclined faces. The metal area at the bottom of the cavity is provided with an LED chip. The metal area and the electrode are electrically connected by metal filling and interconnection technology, and the cavity is also filled with a colloid. The colloid is generally made of silica gel, which has oxygen permeability, ventilation, and a cavity bevel. The weak binding force and the like, oxygen and foreign matter are more likely to penetrate into the bottom of the cavity through the contact surface of the colloid and the inclined surface of the cavity. The surface of the metal region at the bottom of the cavity is a relatively low-cost silver layer. The silver layer is more active and easily oxidized and vulcanized, which may easily cause problems such as vulcanization or oxidation of the surface of the metal region, thereby causing "blackening" and reducing the light of the LED. Efficiency, low reliability, can not meet the requirements of LED automotive lighting.

Summary of the invention

The present application aims to solve at least one of the above technical problems to some extent.

The present application provides an LED module including: a susceptor, a accommodating cavity formed on the pedestal, an LED chip disposed on a metal region at a bottom of the accommodating cavity, and overlying the LED chip And a film having a predetermined interval from the LED chip, and the film and the accommodating cavity are sealed by an adhesive.

Further, the inner side of the base is provided with a snap structure that is engaged with the film.

Further, the snap structure has a barb body that projects into the film.

Further, the film has a barb body that projects into the buckle structure.

Further, the film is a fluorescent film.

Further, the film comprises: a transparent film and a fluorescent film.

Further, a protective layer is disposed on a side of the film opposite to the LED chip.

Further, the protective layer is made of an alumina or titanium oxide material.

The beneficial effects of the application are:

An LED module includes: a susceptor, a receiving cavity formed on the pedestal, an LED chip disposed on a metal area at a bottom of the accommodating cavity, and overlying the LED chip A film having a predetermined interval from the LED chip, the film and the accommodating cavity being sealed by a glue. In this way, due to the sealing action of the adhesive between the film and the accommodating cavity, the external corrosive substance is blocked from entering the bottom portion along the accommodating cavity, thereby avoiding corrosion of the metal material at the bottom of the accommodating cavity by the external corrosive substance, thereby ensuring the LED light effect. And reliability.

DRAWINGS

FIG. 1 is a schematic structural view of an LED module according to an embodiment of the present application.

detailed description

The embodiments of the present application are described in detail below, and the examples of the embodiments are illustrated in the drawings, wherein the same or similar reference numerals are used to refer to the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are intended to be illustrative, and are not to be construed as limiting.

In the description of the present application, it is to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation or position of indications such as "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. The relationship is based on the orientation or positional relationship shown in the drawings, and is merely for the convenience of the description and the simplified description, and is not intended to indicate or imply that the device or component referred to has a specific orientation, and is constructed and operated in a specific orientation. It is not to be construed as limiting the application.

Moreover, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" and "second" may include one or more of the features either explicitly or implicitly. In the description of the present application, the meaning of "a plurality" is two or more unless specifically and specifically defined otherwise.

In the present application, the terms "installation", "connected", "connected", "fixed" and the like shall be understood broadly, and may be either a fixed connection or a detachable connection, unless otherwise explicitly stated and defined. , or connected integrally; may be mechanical connection or electrical connection; may be directly connected, or may be indirectly connected through an intermediate medium, and may be internal communication between the two elements. For those skilled in the art, the specific meanings of the above terms in the present application can be understood on a case-by-case basis.

In the present application, the first feature "on" or "under" the second feature may include direct contact of the first and second features, and may also include first and second features, unless otherwise specifically defined and defined. It is not in direct contact but through additional features between them. Moreover, the first feature is "above", "above" and "above" the second feature The first feature is directly above and above the second feature, or merely indicates that the first feature level is higher than the second feature. The first feature "below", "below" and "below" the second feature includes the first feature directly above and above the second feature, or merely the first feature level being less than the second feature.

The present application will be further described in detail below with reference to the accompanying drawings.

Referring to FIG. 1, the embodiment provides an LED module, which can be mainly used for LED illumination or display on an automobile or an open-air display.

The LED module mainly includes: a susceptor 1, an accommodating cavity 2 formed on the susceptor 1, an LED chip 4 disposed on the bottom metal region 3 of the accommodating cavity 2, and an overlying LED chip 4 and an LED The chip 4 has a film 5 of a predetermined interval. The film 5 and the accommodating chamber 2 are sealed by an adhesive 6.

In this way, due to the sealing action of the adhesive between the film and the accommodating cavity, the external corrosive substance is blocked from entering the bottom portion along the accommodating cavity, thereby avoiding corrosion of the metal material at the bottom of the accommodating cavity by the external corrosive substance, thereby ensuring the LED light effect. And reliability.

In order to further block external corrosive substances, the inner side of the base 1 is provided with a snap structure 11 that is engaged with the film 5. The buckle structure 11 has a barb body 111 extending into the film 5, so that the external corrosive substance enters the path to be more curved, and the entry is more difficult. Of course, as a further alternative embodiment, the film 5 has a barb that projects into the snap structure 11.

In a specific application, the film 5 may be a fluorescent film, or a combination of a transparent film and a fluorescent film, and the transparent film may be disposed outside the fluorescent film and may be attached or spaced apart.

In order to protect the internal structure of the film and the LED module, a protective layer is disposed on the opposite side of the film 5 from the LED chip 4. Specifically, the protective layer may be made of a material such as alumina or titania, or directly used as a silica gel.

In the description of the present specification, reference is made to the descriptions of the terms "one embodiment", "some embodiments", "one embodiment", "some embodiments", "example", "specific examples", or "some examples" The specific features, structures, materials, or characteristics described in connection with the embodiments or examples are included in at least one embodiment or example of the application. In the present specification, the schematic representation of the above terms does not necessarily mean the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples.

The above content is a further detailed description of the present application in conjunction with the specific embodiments, and the specific implementation of the present application is not limited to the description. For the ordinary person skilled in the art to which the present invention pertains, a number of simple deductions or substitutions may be made without departing from the spirit of the present application.

Claims (8)

An LED module includes: a susceptor, a accommodating cavity formed on the pedestal, an LED chip disposed on a metal area at a bottom of the accommodating cavity, and a cover over the LED chip and The LED chip has a predetermined interval of film, characterized in that the film and the accommodating cavity are sealed by a glue. The LED module according to claim 1, wherein the inner side of the base is provided with a snap structure that is engaged with the film. The LED module of claim 2 wherein said snap structure has a barb extending into said film. The LED module of claim 2 wherein said film has a barb that extends into said snap structure. The LED module of claim 1 wherein said film is a fluorescent film. The LED module of claim 1 wherein said film comprises: a transparent film and a fluorescent film. The LED module according to claim 1, wherein a protective layer is disposed on a side of the film opposite to the LED chip. The LED module according to claim 7, wherein said protective layer is made of an alumina or a titanium oxide material.

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