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WO2016076452A1 - Different material case embedded capacitor, and capacitor igbt inverter housing assembly - Google Patents

Different material case embedded capacitor, and capacitor igbt inverter housing assembly Download PDF

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Publication number
WO2016076452A1
WO2016076452A1 PCT/KR2014/010838 KR2014010838W WO2016076452A1 WO 2016076452 A1 WO2016076452 A1 WO 2016076452A1 KR 2014010838 W KR2014010838 W KR 2014010838W WO 2016076452 A1 WO2016076452 A1 WO 2016076452A1
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WIPO (PCT)
Prior art keywords
capacitor
case
inverter
plastic
metal
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Ceased
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PCT/KR2014/010838
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French (fr)
Korean (ko)
Inventor
박대진
전용원
한기주
박진아
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Newintech Co ltd
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Newintech Co ltd
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Priority to PCT/KR2014/010838 priority Critical patent/WO2016076452A1/en
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Anticipated expiration legal-status Critical
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/236Terminals leading through the housing, i.e. lead-through

Definitions

  • the present invention relates to a dissimilar material case embedded capacitor, or a dissimilar material case embedded capacitor composed of dissimilar materials of metal and plastic.
  • capacitors for electric devices, fastening devices, electronic devices, and the like are widely used in various industrial fields.
  • the capacitor uses a plastic film such as polyester (PET) resin, polypropylene (PP) resin, polyethylene naphthalate (PEN) resin, polycarbonate (PC) resin, polyphenylene sulfide (PPS) resin as a dielectric,
  • PET polyester
  • PP polypropylene
  • PEN polyethylene naphthalate
  • PC polycarbonate
  • PPS polyphenylene sulfide
  • Capacitor capacitance varies according to the purpose of the capacitor, so the capacitors are manufactured by adding or subtracting the number of capacitor elements (hereinafter referred to as “elements”) to other N-pole bus bars and P-pole bus bars. Wire and the large capacity capacitor is connected to a plurality of devices to manufacture the capacitor.
  • Japanese Patent Laid-Open No. 2001-0072178 Patent Laid-Open No. 2001-0072178 discloses a capacitor and a capacitor manufacturing method.
  • a capacitor was manufactured by injecting plastic, PPS, PBT, ABS, PC, etc. into a capacitor housing case material for a hybrid, electric vehicle, hydrogen fuel cell vehicle, and renewable inverter.
  • Capacitor molding material is epoxy resin, urethane, silicone, etc., and the case is non-conductor plastic, so the thermal conductivity is low, so the heat generated from the capacitor element (element) is not easily released to the outside. Or poor pressure resistance may occur due to deterioration of the film.
  • Capacitor life factor is a factor that determines the lifetime of the capacitor because the heat generation characteristics and heat dissipation function of the capacitor is different depending on the temperature and voltage used.
  • the present invention is to provide a capacitor with a built-in dissimilar material case by introducing a metal plate portion in the capacitor housing case, thereby easily dissipating heat generated inside the capacitor to the outside to prevent the life of the capacitor due to high temperatures during operation.
  • the present invention is to provide a capacitor, IGBT, inverter housing assembly that can be easily mounted to the metal plate portion of the capacitor housing case adjacent to the inverter heat sink (cooling means) to facilitate the heat dissipation inside the capacitor.
  • Capacitor elements 1 formed by winding a dielectric film and having conductive sprayed surfaces formed on both sides thereof,
  • the dissimilar material case 100 is composed of a plastic part and a metal material having a higher thermal conductivity than the material of the plastic part, and comprises a metal part constituting all or at least part of a wall surface of the dissimilar material case 100. Capacitors with heterogeneous materials case.
  • the present invention by introducing a metal plate portion in the capacitor housing case, it is possible to easily discharge the heat generated inside the capacitor to the outside to prevent the life of the capacitor due to the high temperature during operation, the capacitor, and the capacitor, To provide an IGBT, inverter housing assembly.
  • the present invention facilitates heat dissipation inside the capacitor by mounting a metal plate portion of the capacitor housing case adjacent to a portion close to the inverter heat sink (cooling means), and also allows the metal plate portion of the case to be positioned adjacent to the bus bar. It was configured to better release the generated heat.
  • FIG. 1 is a block diagram of a capacitor built-in different material case according to an embodiment of the present invention.
  • Figure 2 (a, b) is a block diagram of a capacitor built-in different materials according to another embodiment of the present invention.
  • Figure 3 is a block diagram of a heterogeneous material case according to an embodiment of the present invention (manufacturing method explanatory diagram).
  • Figure 4 is a perspective view of a capacitor, IGBT, inverter housing assembly according to a second embodiment of the present invention.
  • FIG. 5 is a cross-sectional view of a capacitor, an IGBT, and an inverter housing assembly according to a second embodiment of the present invention.
  • Figure 6 is a cross-sectional view of the capacitor, IGBT, inverter housing assembly according to the first embodiment of the present invention.
  • FIG. 7 is a cross-sectional view of a capacitor, an IGBT, and an inverter housing assembly according to a third embodiment of the present invention.
  • FIG. 1 is a block diagram of a capacitor built-in different materials according to an embodiment of the present invention
  • Figure 2 (a, b) is a block diagram of a capacitor built-in different materials according to another embodiment of the present invention
  • Figure 3 Dissimilar materials case configuration diagram (manufacturing method explanatory diagram) according to an embodiment
  • Figure 4 is a perspective view of a capacitor, IGBT, inverter housing assembly according to a second embodiment of the present invention
  • Figure 5 is a capacitor according to a second embodiment of the present invention
  • Figure 6 is a capacitor, IGBT, inverter housing assembly cross-sectional view according to a first embodiment of the present invention
  • Figure 7 is a capacitor, IGBT, inverter housing assembly cross-sectional view according to a first embodiment of the present invention
  • a housing-integrated capacitor having a dissimilar material case includes a dissimilar material case in which a metal part having a different thermal conductivity from plastic is formed outside the case. do.
  • Capacitor elements 1 formed by winding a dielectric film and having conductive sprayed surfaces formed on both sides thereof, busbars 3 electrically connected to both sides of the sprayed surfaces of the capacitors 1, and capacitor elements and busbars.
  • the dissimilar material case 100 is composed of a plastic part, a metal material having a higher thermal conductivity than the material of the plastic part and wall surface of the dissimilar material case 100 It is preferable to include a metal portion constituting all or at least a portion of the.
  • the dissimilar material case 100 is preferably configured to include a plastic wall portion 20 forming an inner wall of the case and having an insulating property, and a metal wall portion 10 which is configured to be in contact with all or part of an outer surface of the plastic wall portion 20.
  • the dissimilar material case 100 is put the molded metal wall portion 10 in a plastic injection molding machine
  • the plastic wall portion 20 is molded by insert injection.
  • the material of the metal wall part 10 is one selected from aluminum (Al), copper (Cu), zinc (Zn), magnesium (Mg), iron, lead, brass, and stainless steel, or aluminum (Al) or copper. It is preferably an alloy containing one metal selected from (Cu), zinc (Zn), magnesium (Mg), iron, lead, brass, and stainless steel.
  • the material of the metal wall portion 10 is one selected from aluminum (Al), copper (Cu), and zinc (Zn), or aluminum (Al) copper (Cu).
  • Zn (Zn) is an alloy containing one metal selected from magnesium, and is manufactured by a die casting pressure casting method in which a molten metal in which a selected material is dissolved is injected into a casting mold and then pressurized.
  • the thickness of the metal wall 10 is 0.2 ⁇ 10mm
  • the plastic material forming the plastic wall (20) is preferably at least one selected from the group consisting of PPS, PBT, PP, PC, PET, ABS. Difficulties occur during the manufacturing process in the case of 0.2 mm or less, and thicker than necessary in the case of 10 mm or more, thereby increasing the weight and material cost.
  • the metal wall portion 10 may be configured outside at least one surface of the plastic wall portion 20. That is, in the case of a rectangular parallelepiped case, it may be configured even on a part of one surface of the five surfaces except for the opening.
  • the plastic wall portion 20 is composed of one plastic wall 21 of the dissimilar material case 100 and a plastic side wall 23 surrounding the plastic wall 21.
  • the metal wall portion 10 is preferably composed of a metal one wall 11 which is formed on the outer side of the plastic one wall 21 and a metal side wall 13 which is formed on the outer side of the plastic side wall 23.
  • the dissimilar material case 100 includes one plastic wall 21 and one metal wall 11 forming one surface and five plastic side walls forming the other four surfaces except for the opening. It is preferably configured in the form of a rectangular parallelepiped comprising 23 and metal sidewalls 13.
  • the capacitor having a different material case built-in of the present invention is used for an inverter of a hybrid vehicle, an electric vehicle, a hydrogen fuel cell vehicle, and a plug-in electric vehicle, and the metal wall portion of the heterogeneous material case 100 ( 10 is preferably mounted to the inverter case bottom portion 210, the inverter case bottom portion 210 is cooled by the cooling means (300).
  • test state diagram 2 the dissimilar material case built-in capacitor, the IGBT, and the inverter housing assembly of the present invention are equipped with a housing built-in capacitor having a dissimilar material case and a housing built-in capacitor.
  • the metal wall 10 of the housing case 100 may be mounted to be in contact with the inverter case bottom 210, and the inverter case bottom 210 may be cooled by the cooling means 300.
  • the dissimilar material case embedded capacitor, the IGBT, and the inverter housing assembly of the present invention may include a dissimilar material case embedded capacitor, an inverter housing 200 to which the housing embedded capacitor is mounted. , An IGBT electrically connected to the connection terminal of the housing-embedded capacitor, and a cooling means 300 for cooling the inverter housing 200 in which the IGBT is mounted, wherein the inverter case bottom part 210 includes a cooling means ( Cooled by 300, the IGBT is positioned on the upper portion of the inverter case bottom 210, and is fixed to the dissimilar material case embedded capacitor on the IGBT by fixing means.
  • the dissimilar material case embedded capacitor, the IGBT, and the inverter housing assembly of the present invention may include an inverter housing 200 in which the dissimilar material case embedded capacitor and the housing embedded capacitor are mounted; IGBT electrically connected to the connection terminal of the housing-embedded capacitor, comprising a cooling means 300 for cooling the inverter housing 200 equipped with the IGBT, the IGBT is located on the top of the inverter case bottom 210, IGBT
  • the dissimilar material case embedded capacitor is fixed to the upper part by a fixing means, and the dissimilar material case embedded capacitor is fixed to the opening of the inverter housing 200 to perform the cover function of the inverter housing 200 while serving as a capacitor.
  • a metal pad may be interposed between the metal wall part 10 and the bottom portion 210 of the inverter case cooled by the cooling means 300 or thermal grease may be applied to improve cooling efficiency.
  • the temperature of the capacitor plastic housing was increased by about 10.2 ° C., but the temperature of the capacitor of the heterogeneous case embedded with the present invention was increased by 2.4 ° C.
  • the capacitor outer housing was made of a die-casting casting made of aluminum, and the die-casting housing was inserted into an injection molding machine to insert injection.
  • the outer outer wall of the capacitor housing is made of aluminum and maximizes the internal heat dissipation effect.
  • the housing from which the automotive inverter housing cover is injected into the capacitor aluminum die casting can be used as it is. Shorting was prevented.
  • Capacitors were fabricated from a die-cast die-cast housing and assembled on a mount inside a hybrid vehicle inverter housing, resulting in very low temperature rise and excellent characteristics.
  • the mount was weak, but in the case of a die-cast housing made of aluminum, the mount part was made of aluminum, which was very strong and vibrated.
  • test voltage 640Vdc
  • ripple current 136Arms
  • This development item has a very high ambient temperature, so when the capacitor element temperature is used above 95 °C, the life of the capacitor is greatly reduced, so the method for lowering the temperature is required.
  • Aluminum die-casting insert of the capacitor The capacitor was manufactured by changing the concept so that the bottom surface of the injection housing could directly contact the inverter heat sink (cooling water circulation part). It was possible to lower the temperature rise. (Test state diagram 2, when the capacitor migration material case is in contact with the inverter cooling means.)
  • the test results showed that the internal temperature of the capacitor dropped about -1.5 °C further, but the unit price and work was increased. Considering the thermal pad and the like, even if the thermal pad is lowered to a temperature that does not deteriorate the life of the capacitor, it is judged that it is possible to attach without the thermal pad.
  • thermal grease was applied to the bottom of the capacitor to maximize the heat dissipation by making the contact of the bottom of the capacitor housing with the car's inverter heat sink better. Considering this, it is thought that it is possible to apply thermal grease without lowering the life of the capacitor even if thermal grease is not applied.
  • Test voltage 640Vdc
  • Ripple current 136Arms
  • Switching frequency 16KHz Cooling water 65 °C
  • Ambient temperature 95 °C Cooling water circulation at 7L per minute on the bottom of capacitor housing
  • Capacitor elements 1 formed by winding a dielectric film and having conductive sprayed surfaces formed on both sides thereof,
  • the dissimilar material case 100 is composed of a plastic part and a metal material having a higher thermal conductivity than the material of the plastic part, and comprises a metal part constituting all or at least part of a wall surface of the dissimilar material case 100. Capacitors with heterogeneous materials case.
  • the present invention by introducing a metal plate portion in the capacitor housing case, it is possible to easily discharge the heat generated inside the capacitor to the outside to prevent the life of the capacitor due to the high temperature during operation, the capacitor, and the capacitor, To provide an IGBT, inverter housing assembly.
  • the present invention facilitates heat dissipation inside the capacitor by mounting a metal plate portion of the capacitor housing case adjacent to a portion close to the inverter heat sink (cooling means), and also allows the metal plate portion of the case to be positioned adjacent to the bus bar. It was configured to better release the generated heat.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Inverter Devices (AREA)

Abstract

A different material case embedded capacitor comprising: capacitor elements (1) which are formed with dielectric film wound therearound and each have conductive thermally-sprayed surfaces at both sides thereof; a bus bar (3) which is electrically connected to both sides of the thermally-sprayed surfaces of the capacitor elements (1); and a different material case (100) in which an assembly of the capacitor elements and the bus bar is embedded, wherein the different material case (100) consists of a plastic part and a metal part which is made of a metal material having higher heat conductivity than the material of the plastic part, and forms all or at least a part of the wall surface of the different material case (100).

Description

이종 재료 케이스 내장형 커패시터, 및 커패시터 IGBT 인버터 하우징 결합체Capacitors with Dissimilar Material Case, and Capacitor IGBT Inverter Housing Assembly

본 발명은 이종 재료 케이스 내장형 커패시터, 또는 금속과 플라스틱의 이종재료로 구성된 이종 재료 케이스 내장형 커패시터에 관한 것이다.The present invention relates to a dissimilar material case embedded capacitor, or a dissimilar material case embedded capacitor composed of dissimilar materials of metal and plastic.

일반적으로, 전기기기용, 진상용, 전자기기용 커패시터 등은 각종 산업분야에서 널리 사용되고 있다. 이러한 커패시터는 유전체로 폴리에스터(PET) 수지, 폴리프로필렌(PP) 수지, 폴리에칠렌나프탈레이트(PEN) 수지, 폴리카보네이트(PC) 수지, 폴리페닐렌설파이드(PPS) 수지 등의 프라스틱필름을 사용하여, 프라스틱필름의 한 면 또는 양면에 금속을 증착한 증착필름을 권취하고, 권취된 증착필름의 양면에는 아연, 아연 합금, 주석 또는 1차 아연 2차 주석을 용사하여, 용사면을 만들어 커패시터 소자를 제조한다. 커패시터의 정전용량은 커패시터의 용도에 따라 차이가 있으므로 다른 N극버스바와 P극 버스바에 커패시터 소자 (이하 소자)의 갯수를 가감하여 결선하여 커패시터를 제조하게 되는데, 작은 용량의 커패시터는 적은 수량의 소자를 결선하고 대용량 커패시터는 다수의 소자를 결선하여 커패시터를 제조한다. 공개특허 특2001-0072178호(파나소닉)는 커패시터 및 커패시터 제조방법을 게시한다.In general, capacitors for electric devices, fastening devices, electronic devices, and the like are widely used in various industrial fields. The capacitor uses a plastic film such as polyester (PET) resin, polypropylene (PP) resin, polyethylene naphthalate (PEN) resin, polycarbonate (PC) resin, polyphenylene sulfide (PPS) resin as a dielectric, Manufacture a capacitor device by winding a deposited film in which metal is deposited on one or both sides of the plastic film, and spraying zinc, zinc alloy, tin or primary zinc secondary tin on both sides of the wound deposited film. do. Capacitor capacitance varies according to the purpose of the capacitor, so the capacitors are manufactured by adding or subtracting the number of capacitor elements (hereinafter referred to as “elements”) to other N-pole bus bars and P-pole bus bars. Wire and the large capacity capacitor is connected to a plurality of devices to manufacture the capacitor. Japanese Patent Laid-Open No. 2001-0072178 (Panasonic) discloses a capacitor and a capacitor manufacturing method.

종래 하이브리드, 전기자동차, 수소연료전지 자동차, 신재생 인버터용 커패시터 하우징 케이스 재질을 프라스틱, PPS, PBT, ABS, PC 등을 사출하여 커패시터를 제조하였다. 1) 하이브리드 및 전기자동차의 인버터가 스위칭시 커패시터에서는 충 방전이 발생하면서 커패시터 내부 에레먼트에서 열이 발생하면서 커패시터 버스바, 케이스를 통해서 열을 방출하여 방열되는 문제점이 있다. 2) 커패시터 몰딩 재질이 에폭시 수지, 우레탄, 실리콘 등 이고 케이스는 부도체 프라스틱이므로 인하여 열 전도도가 낮아 커패시터 엘레먼트(소자)에서 발생한 열을 외부로 방출이 잘 되지 않아 커패시터 내부 온도가 상승하여 커패시터 수명이 단축되거나 필름의 열화로 인하여 내압 불량이 발생할 수 있다. 커패시터 수명 팩터는 온도와 사용하는 전압에 따라 수명의 차이가 발생하기 때문에 커패시터의 발열 특성 및 방열 기능은 수명을 결정하는 중요 인자이다.A capacitor was manufactured by injecting plastic, PPS, PBT, ABS, PC, etc. into a capacitor housing case material for a hybrid, electric vehicle, hydrogen fuel cell vehicle, and renewable inverter. 1) When switching inverters of hybrid and electric vehicles, there is a problem that heat is generated by discharging heat through the capacitor busbar and the case while generating heat in the capacitor while charging and discharging occurs in the capacitor. 2) Capacitor molding material is epoxy resin, urethane, silicone, etc., and the case is non-conductor plastic, so the thermal conductivity is low, so the heat generated from the capacitor element (element) is not easily released to the outside. Or poor pressure resistance may occur due to deterioration of the film. Capacitor life factor is a factor that determines the lifetime of the capacitor because the heat generation characteristics and heat dissipation function of the capacitor is different depending on the temperature and voltage used.

본 발명은, 커패시터 하우징 케이스에 금속판부를 도입함으로써, 커패시터 내부에서 발생한 열을 용이하게 외부로 배출하여 작동시 고온에 의한 커패시터의 수명 단축으로 방지할 수 있는 이종 재료 케이스 내장형 커패시터를 제공하기 위함이다.The present invention is to provide a capacitor with a built-in dissimilar material case by introducing a metal plate portion in the capacitor housing case, thereby easily dissipating heat generated inside the capacitor to the outside to prevent the life of the capacitor due to high temperatures during operation.

본 발명은 인버터 히트싱크(냉각수단)에 가까운 부분에 커패시터 하우징 케이스의 금속판부를 인접하게 장착시켜서 커패시터 내부 열 방출을 용이하게 할수 있는 커패시터, IGBT, 인버터 하우징 결합체를 제공하기 위함이다.The present invention is to provide a capacitor, IGBT, inverter housing assembly that can be easily mounted to the metal plate portion of the capacitor housing case adjacent to the inverter heat sink (cooling means) to facilitate the heat dissipation inside the capacitor.

유전체 필름이 권취되어 형성되고 양측에 전도성의 용사면이 형성된 커패시터 소자(1)들과,Capacitor elements 1 formed by winding a dielectric film and having conductive sprayed surfaces formed on both sides thereof,

상기 커패시터 소자(1)들의 용사면의 양측에 전기적으로 연결되는 버스바(3)와,A bus bar 3 electrically connected to both sides of the thermal sprayed surface of the capacitor elements 1,

상기 커패시터 소자 및 버스바 결합체를 내장하는 이종 재료 케이스(100)로 구성되되,Consists of a heterogeneous material case (100) containing the capacitor element and the busbar combination,

상기 이종 재료 케이스(100)는 플라스틱부와, 상기 플라스틱부의 재질보다 열전도율이 높은 금속 재료로 구성되고 상기 이종 재료 케이스(100) 벽면의 전부 또는 적어도 일부를 구성하는 금속부를 포함하여 구성되는 것을 특징으로 하는 이종 재료 케이스 내장형 커패시터.The dissimilar material case 100 is composed of a plastic part and a metal material having a higher thermal conductivity than the material of the plastic part, and comprises a metal part constituting all or at least part of a wall surface of the dissimilar material case 100. Capacitors with heterogeneous materials case.

본 발명에 따르는 경우, 커패시터 하우징 케이스에 금속판부를 도입함으로써, 커패시터 내부에서 발생한 열을 용이하게 외부로 배출하여 작동시 고온에 의한 커패시터의 수명 단축으로 방지할 수 있는 이종 재료 케이스 내장형 커패시터, 및 커패시터, IGBT, 인버터 하우징 결합체를 제공하기 위함이다.According to the present invention, by introducing a metal plate portion in the capacitor housing case, it is possible to easily discharge the heat generated inside the capacitor to the outside to prevent the life of the capacitor due to the high temperature during operation, the capacitor, and the capacitor, To provide an IGBT, inverter housing assembly.

본 발명은 인버터 히트싱크(냉각수단)에 가까운 부분에 커패시터 하우징 케이스의 금속판부를 인접하게 장착시켜서 커패시터 내부 열 방출을 용이하게 하고, 또한, 버스바 인접부위에 케이스의 금속판부가 위치하도록 하여 버스바에서 발생한 열의 배출이 더 잘 되도록 구성하였다.The present invention facilitates heat dissipation inside the capacitor by mounting a metal plate portion of the capacitor housing case adjacent to a portion close to the inverter heat sink (cooling means), and also allows the metal plate portion of the case to be positioned adjacent to the bus bar. It was configured to better release the generated heat.

도 1은 본 발명의 일실시예에 따른 이종 재료 케이스 내장형 커패시터 구성도.1 is a block diagram of a capacitor built-in different material case according to an embodiment of the present invention.

도 2(a, b)은 본 발명의 다른 실시예에 따른 이종 재료 케이스 내장형 커패시터 구성도.Figure 2 (a, b) is a block diagram of a capacitor built-in different materials according to another embodiment of the present invention.

도 3은 본 발명의 일실시예에 따른 이종 재료 케이스 구성도(제조 방법 설명도).Figure 3 is a block diagram of a heterogeneous material case according to an embodiment of the present invention (manufacturing method explanatory diagram).

도 4은 본 발명의 제2 실시예에 따른 커패시터, IGBT, 인버터 하우징 결합체 사시도.Figure 4 is a perspective view of a capacitor, IGBT, inverter housing assembly according to a second embodiment of the present invention.

도 5는 본 발명의 제2 실시예에 따른 커패시터, IGBT, 인버터 하우징 결합체 단면도.5 is a cross-sectional view of a capacitor, an IGBT, and an inverter housing assembly according to a second embodiment of the present invention.

도 6은 본 발명의 제1 실시예에 따른 커패시터, IGBT, 인버터 하우징 결합체 단면도.Figure 6 is a cross-sectional view of the capacitor, IGBT, inverter housing assembly according to the first embodiment of the present invention.

도 7은 본 발명의 제3 실시예에 따른 커패시터, IGBT, 인버터 하우징 결합체 단면도.7 is a cross-sectional view of a capacitor, an IGBT, and an inverter housing assembly according to a third embodiment of the present invention.

이하에서 본 발명의 일실시예에 따른 이종 재료 케이스를 구비한 하우징 내장형 커패시터, 커패시터, IGBT, 인버터 하우징 결합체에 대하여 첨부된 도면을 참조하여 상세하게 설명한다. 도 1은 본 발명의 일실시예에 따른 이종 재료 케이스 내장형 커패시터 구성도, 도 2(a, b)은 본 발명의 다른 실시예에 따른 이종 재료 케이스 내장형 커패시터 구성도, 도 3은 본 발명의 일실시예에 따른 이종 재료 케이스 구성도(제조 방법 설명도), 도 4은 본 발명의 제2 실시예에 따른 커패시터, IGBT, 인버터 하우징 결합체 사시도, 도 5는 본 발명의 제2 실시예에 따른 커패시터, IGBT, 인버터 하우징 결합체 단면도, 도 6은 본 발명의 제1 실시예에 따른 커패시터, IGBT, 인버터 하우징 결합체 단면도이고, 도 7은 본 발명의 제3 실시예에 따른 커패시터, IGBT, 인버터 하우징 결합체 단면도이다.Hereinafter, a housing-containing capacitor, a capacitor, an IGBT, and an inverter housing assembly having a heterogeneous material case according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. 1 is a block diagram of a capacitor built-in different materials according to an embodiment of the present invention, Figure 2 (a, b) is a block diagram of a capacitor built-in different materials according to another embodiment of the present invention, Figure 3 Dissimilar materials case configuration diagram (manufacturing method explanatory diagram) according to an embodiment, Figure 4 is a perspective view of a capacitor, IGBT, inverter housing assembly according to a second embodiment of the present invention, Figure 5 is a capacitor according to a second embodiment of the present invention , IGBT, inverter housing assembly cross-sectional view, Figure 6 is a capacitor, IGBT, inverter housing assembly cross-sectional view according to a first embodiment of the present invention, Figure 7 is a capacitor, IGBT, inverter housing assembly cross-sectional view according to a third embodiment of the present invention to be.

도 1 내지 도 3에 도시된 바와 같이, 본 발명의 일실시예에 따른 이종 재료 케이스를 구비한 하우징 내장형 커패시터는, 플라스틱과 열전도율이 다른 금속부위를 케이스 외측에 형성시킨 이종 재료 케이스를 포함하여 구성된다. 유전체 필름이 권취되어 형성되고 양측에 전도성의 용사면이 형성된 커패시터 소자(1)들과, 커패시터 소자(1)들의 용사면의 양측에 전기적으로 연결되는 버스바(3)와, 커패시터 소자 및 버스바 결합체를 내장하는 이종(different kind) 재료 케이스(100)로 구성되되, 이종 재료 케이스(100)는 플라스틱부와, 상기 플라스틱부의 재질보다 열전도율이 높은 금속 재료로 구성되고 상기 이종 재료 케이스(100) 벽면의 전부 또는 적어도 일부를 구성하는 금속부를 포함하여 구성되는 것이 바람직하다. 이종 재료 케이스(100)는, 케이스의 내벽을 이루며 절연성을 갖는 플라스틱 벽부(20)와, 상기 플라스틱 벽부(20) 외면의 전부 또는 일부에 접면되어 구성된 금속벽부(10)를 포함하여 구성되는 것이 바람직하다.As shown in FIGS. 1 to 3, a housing-integrated capacitor having a dissimilar material case according to an embodiment of the present invention includes a dissimilar material case in which a metal part having a different thermal conductivity from plastic is formed outside the case. do. Capacitor elements 1 formed by winding a dielectric film and having conductive sprayed surfaces formed on both sides thereof, busbars 3 electrically connected to both sides of the sprayed surfaces of the capacitors 1, and capacitor elements and busbars. Consists of a heterogeneous (different kind) material case 100 that incorporates a combination, the dissimilar material case 100 is composed of a plastic part, a metal material having a higher thermal conductivity than the material of the plastic part and wall surface of the dissimilar material case 100 It is preferable to include a metal portion constituting all or at least a portion of the. The dissimilar material case 100 is preferably configured to include a plastic wall portion 20 forming an inner wall of the case and having an insulating property, and a metal wall portion 10 which is configured to be in contact with all or part of an outer surface of the plastic wall portion 20. Do.

도 1 내지 도 3에 도시된 바와 같이, 본 발명의 일실시예에 따른 이종 재료 케이스를 구비한 하우징 내장형 커패시터에 있어서, 이종 재료 케이스(100)는 성형된 금속벽부(10)를 플라스틱 사출기에 넣어 인서트 사출 방식으로 플라스틱 벽부(20) 부위가 성형되는 것이 바람직하다. 금속벽부(10)의 재료는 알루미늄(Al), 구리(Cu), 아연(Zn), 마그네슘(Mg), 철(iron), 납, 황동, 스테인레스 스틸 중에서 선택된 하나이거나, 알루미늄(Al), 구리(Cu), 아연(Zn), 마그네슘(Mg), 철(iron), 납, 황동, 스테인레스 스틸 중에서 선택된 하나의 금속을 포함하는 합금인 것이 바람직하다. As shown in Figures 1 to 3, in a housing-integrated capacitor having a dissimilar material case according to an embodiment of the present invention, the dissimilar material case 100 is put the molded metal wall portion 10 in a plastic injection molding machine Preferably, the plastic wall portion 20 is molded by insert injection. The material of the metal wall part 10 is one selected from aluminum (Al), copper (Cu), zinc (Zn), magnesium (Mg), iron, lead, brass, and stainless steel, or aluminum (Al) or copper. It is preferably an alloy containing one metal selected from (Cu), zinc (Zn), magnesium (Mg), iron, lead, brass, and stainless steel.

도 1 내지 도 3에 도시된 바와 같이, 더욱 바람직하게, 금속벽부(10)의 재료는 알루미늄(Al), 구리(Cu), 및 아연(Zn) 중에서 선택된 하나이거나, 알루미늄(Al) 구리(Cu) 아연(Zn) 마그네슘 중에서 선택된 하나의 금속을 포함하는 합금이며, 주조 금형에 선택된 재료를 녹인 용탕(molten metal)을 주입한 후 가압하는 다이캐스팅(Die Casting) 가압 주조 방식으로 제조된다. 금속벽부(10)의 두께는 0.2 ~ 10mm이고, 라스틱 벽부(20)를 형성하는 플라스틱 재료는 PPS, PBT, PP, PC, PET, ABS 중에서 선택된 적어도 하나인 것이 바람직하다. 0.2 mm 이하의 경우 제조과정에서 어려움이 발생하고 10 mm 이상의 경우 필요 이상으로 두꺼워져서 무게 및 재료비가 증가한다. 1 to 3, more preferably, the material of the metal wall portion 10 is one selected from aluminum (Al), copper (Cu), and zinc (Zn), or aluminum (Al) copper (Cu). ) Zn (Zn) is an alloy containing one metal selected from magnesium, and is manufactured by a die casting pressure casting method in which a molten metal in which a selected material is dissolved is injected into a casting mold and then pressurized. The thickness of the metal wall 10 is 0.2 ~ 10mm, the plastic material forming the plastic wall (20) is preferably at least one selected from the group consisting of PPS, PBT, PP, PC, PET, ABS. Difficulties occur during the manufacturing process in the case of 0.2 mm or less, and thicker than necessary in the case of 10 mm or more, thereby increasing the weight and material cost.

금속벽부(10)는 플라스틱 벽부(20)의 적어도 일면 전부 외측에 구성될 수 있다. 즉, 직육면체 케이스의 경우 개구부를 제외한 오면 중 일면의 일부에도 구성될 수 있지만 이처럼 일면 전체에 구성될 수도 있다.The metal wall portion 10 may be configured outside at least one surface of the plastic wall portion 20. That is, in the case of a rectangular parallelepiped case, it may be configured even on a part of one surface of the five surfaces except for the opening.

도 1 내지 도 7에 도시된 바와 같이, 플라스틱 벽부(20)는, 이종 재료 케이스(100)의 1개의 플라스틱 일벽(21)과, 상기 플라스틱 일벽(21)을 감싸는 플라스틱 측벽(23)으로 구성되고, 금속벽부(10)는 상기 플라스틱 일벽(21)의 외측에 접면 형성되는 금속 일벽(11)과, 플라스틱 측벽(23)의 외측에 접면 형성되는 금속 측벽(13)으로 구성되는 것이 바람직하다. 도 1 내지 도 3에 도시된 바와 같이, 이종 재료 케이스(100)는 개구부를 제외한 5면 중, 1면을 이루는 플라스틱 일벽(21) 및 금속 일벽(11)과, 나머지 4면을 이루는 플라스틱 측벽(23) 및 금속 측벽(13)을 포함하는 직육면체 형으로 구성되는 것이 바람직하다. 1 to 7, the plastic wall portion 20 is composed of one plastic wall 21 of the dissimilar material case 100 and a plastic side wall 23 surrounding the plastic wall 21. The metal wall portion 10 is preferably composed of a metal one wall 11 which is formed on the outer side of the plastic one wall 21 and a metal side wall 13 which is formed on the outer side of the plastic side wall 23. As shown in FIGS. 1 to 3, the dissimilar material case 100 includes one plastic wall 21 and one metal wall 11 forming one surface and five plastic side walls forming the other four surfaces except for the opening. It is preferably configured in the form of a rectangular parallelepiped comprising 23 and metal sidewalls 13.

도 4 내지 도 7에 도시된 바와 같이, 본 발명의 이종 재료 케이스 내장형 커패시터는 하이브리드 자동차, 전기자동차, 수소연료전지 자동차, 플러그인 전기자동차의 인버터용으로 사용되고, 이종 재료 케이스(100)의 금속벽부(10)가 인버터 케이스 바닥부(210)에 접면되게 장착되고, 인버터 케이스 바닥부(210)는 냉각수단(300)에 의해 냉각되는 것이 바람직하다.As shown in FIGS. 4 to 7, the capacitor having a different material case built-in of the present invention is used for an inverter of a hybrid vehicle, an electric vehicle, a hydrogen fuel cell vehicle, and a plug-in electric vehicle, and the metal wall portion of the heterogeneous material case 100 ( 10 is preferably mounted to the inverter case bottom portion 210, the inverter case bottom portion 210 is cooled by the cooling means (300).

도 4 내지 도 5(시험 상태도 2)에 도시된 바와 같이, 본 발명의 이종 재료 케이스 내장형 커패시터, IGBT, 인버터 하우징 결합체는, 이종 재료 케이스를 구비한 하우징 내장형 커패시터와, 하우징 내장형 커패시터가 장착되는 인버터 하우징(200)과, 하우징 내장형 커패시터의 연결단자에 전기적으로 연결되는 IGBT, IGBT가 장착된 인버터 하우징(200)을 냉각시키는 냉각수단(300)을 포함하여 구성된다. 하우징 케이스(100)의 금속벽부(10)가 인버터 케이스 바닥부(210)에 접면되게 장착되고, 인버터 케이스 바닥부(210)는 냉각수단(300)에 의해 냉각되는 것이 바람직하다.4 to 5 (test state diagram 2), the dissimilar material case built-in capacitor, the IGBT, and the inverter housing assembly of the present invention are equipped with a housing built-in capacitor having a dissimilar material case and a housing built-in capacitor. The inverter housing 200 and the IGBT electrically connected to the connection terminal of the housing built-in capacitor, the cooling means 300 for cooling the inverter housing 200 equipped with the IGBT. The metal wall 10 of the housing case 100 may be mounted to be in contact with the inverter case bottom 210, and the inverter case bottom 210 may be cooled by the cooling means 300.

도 6(시험 상태도 1)에 도시된 바와 같이, 본 발명의 이종 재료 케이스 내장형 커패시터, IGBT, 인버터 하우징 결합체는, 이종 재료 케이스 내장형 커패시터와, 상기 하우징 내장형 커패시터가 장착되는 인버터 하우징(200)과, 상기 하우징 내장형 커패시터의 연결단자에 전기적으로 연결되는 IGBT, 상기 IGBT가 장착된 인버터 하우징(200)을 냉각시키는 냉각수단(300)을 포함하여 구성되되, 인버터 케이스 바닥부(210)는 냉각수단(300)에 의해 냉각되고, 인버터 케이스 바닥부(210) 상부에 IGBT가 위치하고, IGBT 상부에 이종 재료 케이스 내장형 커패시터에 고정 수단에 의해 고정된다. As shown in FIG. 6 (test state diagram 1), the dissimilar material case embedded capacitor, the IGBT, and the inverter housing assembly of the present invention may include a dissimilar material case embedded capacitor, an inverter housing 200 to which the housing embedded capacitor is mounted. , An IGBT electrically connected to the connection terminal of the housing-embedded capacitor, and a cooling means 300 for cooling the inverter housing 200 in which the IGBT is mounted, wherein the inverter case bottom part 210 includes a cooling means ( Cooled by 300, the IGBT is positioned on the upper portion of the inverter case bottom 210, and is fixed to the dissimilar material case embedded capacitor on the IGBT by fixing means.

도 6(시험 상태도 3)에 도시된 바와 같이, 본 발명의 이종 재료 케이스 내장형 커패시터, IGBT, 인버터 하우징 결합체는, 이종 재료 케이스 내장형 커패시터와, 하우징 내장형 커패시터가 장착되는 인버터 하우징(200)과, 하우징 내장형 커패시터의 연결단자에 전기적으로 연결되는 IGBT, IGBT가 장착된 인버터 하우징(200)을 냉각시키는 냉각수단(300)을 포함하여 구성되되, 인버터 케이스 바닥부(210) 상부에 IGBT가 위치하고, IGBT 상부에 이종 재료 케이스 내장형 커패시터에 고정 수단에 의해 고정되고, 이종 재료 케이스 내장형 커패시터가 인버터 하우징(200)의 개구부에 고정되어 커패시터 기능을 하면서 인버터 하우징(200)의 덮개 기능을 동시에 수행할 수 있다. 금속벽부(10)와 냉각수단(300)에 의해 냉각되는 상기 인버터 케이스 바닥부(210) 사이에 금속성 패드가 개재되거나 써멀(Thermal) 구리스가 도포되어 냉각 효율이 향상될 수 있다.As shown in FIG. 6 (test state diagram 3), the dissimilar material case embedded capacitor, the IGBT, and the inverter housing assembly of the present invention may include an inverter housing 200 in which the dissimilar material case embedded capacitor and the housing embedded capacitor are mounted; IGBT electrically connected to the connection terminal of the housing-embedded capacitor, comprising a cooling means 300 for cooling the inverter housing 200 equipped with the IGBT, the IGBT is located on the top of the inverter case bottom 210, IGBT The dissimilar material case embedded capacitor is fixed to the upper part by a fixing means, and the dissimilar material case embedded capacitor is fixed to the opening of the inverter housing 200 to perform the cover function of the inverter housing 200 while serving as a capacitor. A metal pad may be interposed between the metal wall part 10 and the bottom portion 210 of the inverter case cooled by the cooling means 300 or thermal grease may be applied to improve cooling efficiency.

이하에서 본 발명의 구성 및 작용 효과에 대하여 부연 설명한다. 표 1과 같이, 온도상승 시험결과 커패시터 프라스틱 하우징의 경우 약 10.2℃ 정도 온도가 상승했으나, 본 발명의 이종 재료 케이스 내장형 커패시터의 경우, 온도가 2.4℃ 상승하였다. 본 발명의 이종 재료 케이스는 대량 양산할 수 있도록 하기 위해서 커패시터 외측 하우징을 알루미늄으로 다이캐스팅 주물로 제작했고 이 다이캐스팅 주물 하우징을 사출기에 넣어서 인서트 사출하였다. 커패시터 하우징의 외측 외벽은 알루미늄 재질이고 내부 열 방출 효과를 극대화, 자동차용 인버터 하우징 덥개를 커패시터 알루미늄 다이캐스팅 주물 사출한 하우징을 그대로 사용할 수 있었고 커패시터 하우징 내측은 프라스틱 PPS 재질로 사출하여 하우징 내부에 절연시켜서 커패시터 쇼트되는 것을 방지하였다.Hereinafter, the configuration and the effect of the present invention will be described in detail. As shown in Table 1, as a result of the temperature increase test, the temperature of the capacitor plastic housing was increased by about 10.2 ° C., but the temperature of the capacitor of the heterogeneous case embedded with the present invention was increased by 2.4 ° C. In order to enable mass production of the dissimilar material case of the present invention, the capacitor outer housing was made of a die-casting casting made of aluminum, and the die-casting housing was inserted into an injection molding machine to insert injection. The outer outer wall of the capacitor housing is made of aluminum and maximizes the internal heat dissipation effect.The housing from which the automotive inverter housing cover is injected into the capacitor aluminum die casting can be used as it is. Shorting was prevented.

알루미늄으로 다이캐스팅 주물을 인서트 사출한 하우징으로 커패시터를 제작하여 하이브리드 자동차 인버터 하우징 내부 마운트 위에 커패시터를 조립하여 시험결과 온도상승이 매우 낮고 특성이 우수했다. 그리고 마운트가 프라스틱의 경우 강도가 약했으나 알루미늄으로 다이캐스팅된 하우징의 경우 마운트부가 알루미늄으로 되어 있어 강도가 매우 강했고 진동이 심함 자동차용 커패시터에 적합했다.Capacitors were fabricated from a die-cast die-cast housing and assembled on a mount inside a hybrid vehicle inverter housing, resulting in very low temperature rise and excellent characteristics. In the case of plastic, the mount was weak, but in the case of a die-cast housing made of aluminum, the mount part was made of aluminum, which was very strong and vibrated.

시험조건 : 시험전압 = 640Vdc, 리플전류 = 136Arms, 스위칭 주파수 16KHz, 냉각수 65℃, 커패시터 주위온도 95℃, 냉각수 순환은 분당 7ℓ로 순환하면서 시험실시 하였다.Test conditions: test voltage = 640Vdc, ripple current = 136Arms, switching frequency 16KHz, cooling water 65 ℃, capacitor ambient temperature 95 ℃, cooling water circulation was carried out while circulating at 7ℓ per minute.

기존 프라스틱 PPS 케이스 커패시터 온도상승 시험시 엘레먼트 최대 온도가 105.4℃, 본 발명의 알루미늄 다이캐스팅 인서트 사출한 커패시터의 온도상승은 97.3℃ 약 -8.2℃까지 떨어진 결과를 도출하였다.(시험 상태도 1, 커패시터 케이스 가 인버터 냉각 수단 인접 면에서 접촉되지 않는 경우) In the case of the conventional plastic PPS case capacitor temperature rise test, the maximum temperature of the element was 105.4 ° C., and the temperature rise of the aluminum die-casting insert ejected capacitor of the present invention resulted in a drop of 97.3 ° C. to about -8.2 ° C. (Test state diagram 1, capacitor case). Is not in contact with the adjacent surfaces of the inverter cooling means)

본 개발 아이템은 주위온도가 매우 높은 관계로 커패시터 엘레먼트 온도가 95℃ 이상에서 사용시 커패시터 수명이 현격히 감소하므로 온도를 더 낮출 수 있는 방법을 요구하게 되었다. 커패시터의 알루미늄 다이캐스팅 인서트 사출 하우징의 바닥 면이 인버터 히트싱크(냉각수 순환 부분)에 직접 접촉할 수 있도록 컨셉을 변경하여 커패시터를 제조하여 시험결과 커패시터의 열 전달 계수가 매우 우수하여 커패시터 냉각이 잘되어 커패시터 온도상승을 낮출 수 있었다.(시험 상태도 2, 커패시터 이주 재료 케이스가 인버터 냉각 수단 근접 면에 접촉하는 경우)This development item has a very high ambient temperature, so when the capacitor element temperature is used above 95 ℃, the life of the capacitor is greatly reduced, so the method for lowering the temperature is required. Aluminum die-casting insert of the capacitor The capacitor was manufactured by changing the concept so that the bottom surface of the injection housing could directly contact the inverter heat sink (cooling water circulation part). It was possible to lower the temperature rise. (Test state diagram 2, when the capacitor migration material case is in contact with the inverter cooling means.)

알루미늄 다이캐스팅 인서트 사출 하우징이 하이브리드 인버터 내부 마운트 윗 부분에 설치된 커패시터의 온도상승 시험시 엘레먼트 최대 온도가 97.3℃(시험 상태도 1), 알루미늄 다이캐스팅 인서트 사출한 커패시터 하우징의 바닥 면이 히트싱크(냉각수 순환 부분) 직접 접촉한 커패시터의 온도상승은 90.5℃(시험 상태도 2) , 약 -6.7℃까지 떨어진 결과를 도출하였다.In case of temperature rise test of capacitors in which aluminum die-casting insert injection housing is installed on the upper part of the inside of the hybrid inverter, the maximum element temperature is 97.3 ℃ (test state diagram 1), and the bottom surface of the aluminum die-casting insert-injected capacitor housing is heatsink ) The temperature rise of the directly contacted capacitor resulted in a drop of 90.5 ° C (test state diagram 2) to about -6.7 ° C.

부수적으로, 커패시터 하우징 바닥면과 자동차용 인버터 히트싱크 접촉을 잘 시켜서 방열을 극대화 시키기 위해서 커패시터 바닥면에 써멀 패드를 부착하여 시험결과 커패시터 내부온도가 약 -1.5℃ 더 떨어진 효과가 있었으나 단가 상승 및 작업 등을 고려하면 써멀 패드는 부착하지 않아도 커패시터 수명 저하되지 않는 온도까지 내려가므로 써멀패드를 부착하지 않아도 가능할 것으로 판단되었다.Incidentally, in order to maximize heat dissipation by maximizing contact between the bottom of the capacitor housing and the heat sink of the automobile, the test results showed that the internal temperature of the capacitor dropped about -1.5 ℃ further, but the unit price and work was increased. Considering the thermal pad and the like, even if the thermal pad is lowered to a temperature that does not deteriorate the life of the capacitor, it is judged that it is possible to attach without the thermal pad.

부수적으로, 커패시터 하우징 바닥면과 자동차용 인버터 히트싱크 접촉을 잘 시켜서 방열을 극대화 시키기 위해서 커패시터 바닥면에 써멀 구리스를 바르고 시험결과 커패시터 내부온도가 약 -1.8℃ 더 떨어진 효과가 있었으나 단가 상승 및 작업 등을 고려하면 써멀 구리스 바르지 않아도 커패시터 수명 저하되지 않는 온도까지 내려가므로 써멀구리스를 바르지 않아도 가능할 것으로 판단되었다.Incidentally, thermal grease was applied to the bottom of the capacitor to maximize the heat dissipation by making the contact of the bottom of the capacitor housing with the car's inverter heat sink better. Considering this, it is thought that it is possible to apply thermal grease without lowering the life of the capacitor even if thermal grease is not applied.

6) 시험조건 : 시험전압 = 640Vdc, 리플전류 = 136Arms, 스위칭 주파수 16KHz, 냉각수 65℃, 커패시터 주위온도 95℃, 커패시터 하우징 바닥 면에 냉각수 순환은 분당 7ℓ로 순환하면서 시험실시6) Test condition: Test voltage = 640Vdc, Ripple current = 136Arms, Switching frequency 16KHz, Cooling water 65 ℃, Ambient temperature 95 ℃, Cooling water circulation at 7L per minute on the bottom of capacitor housing

표 1 구분 오븐 주위온도 ℃ 엘레멘트 평균 온도℃ ΔT ℃ 냉각수℃ 인버터 하우징 내부 마운트부에 커패시터 장착 (히트싱크 미접촉) PPS 케이스 95.2 105.4 10.2 66.0 AL 이종 재료 케이스 94.8 97.3(※8.1℃ 감소) 2.4 67.2 인버터 하우징 내부 히트싱크에 커패시터 부착 AL 이종 재료 케이스 94.4 90.5(※14.9℃ 감소) -3.9 67.1 Table 1 division Oven Ambient Temperature ℃ Element Average Temperature ℃ ΔT ℃ Cooling water ℃ Capacitor mounted inside the inverter housing (no heat sink) PPS case 95.2 105.4 10.2 66.0 AL dissimilar material case 94.8 97.3 (※ 8.1 degrees Celsius decrease) 2.4 67.2 Attach capacitor to heat sink inside inverter housing AL dissimilar material case 94.4 90.5 (※ 14.9 degrees Celsius decrease) -3.9 67.1

본 발명은 상기에서 언급한 바람직한 실시예와 관련하여 설명됐지만, 본 발명의 범위가 이러한 실시예에 한정되는 것은 아니며, 본 발명의 범위는 이하의 특허청구범위에 의하여 정하여지는 것으로 본 발명과 균등 범위에 속하는 다양한 수정 및 변형을 포함할 것이다.Although the present invention has been described in connection with the above-mentioned preferred embodiments, the scope of the present invention is not limited to these embodiments, and the scope of the present invention is defined by the following claims, and equivalent scope of the present invention. It will include various modifications and variations belonging to.

아래의 특허청구범위에 기재된 도면부호는 단순히 발명의 이해를 보조하기 위한 것으로 권리범위의 해석에 영향을 미치지 아니함을 밝히며 기재된 도면부호에 의해 권리범위가 좁게 해석되어서는 안될 것이다.The reference numerals set forth in the claims below are merely to aid the understanding of the present invention, not to affect the interpretation of the scope of the claims, and the scope of the claims should not be construed narrowly.

유전체 필름이 권취되어 형성되고 양측에 전도성의 용사면이 형성된 커패시터 소자(1)들과,Capacitor elements 1 formed by winding a dielectric film and having conductive sprayed surfaces formed on both sides thereof,

상기 커패시터 소자(1)들의 용사면의 양측에 전기적으로 연결되는 버스바(3)와,A bus bar 3 electrically connected to both sides of the thermal sprayed surface of the capacitor elements 1,

상기 커패시터 소자 및 버스바 결합체를 내장하는 이종 재료 케이스(100)로 구성되되,Consists of a heterogeneous material case (100) containing the capacitor element and the busbar combination,

상기 이종 재료 케이스(100)는 플라스틱부와, 상기 플라스틱부의 재질보다 열전도율이 높은 금속 재료로 구성되고 상기 이종 재료 케이스(100) 벽면의 전부 또는 적어도 일부를 구성하는 금속부를 포함하여 구성되는 것을 특징으로 하는 이종 재료 케이스 내장형 커패시터.The dissimilar material case 100 is composed of a plastic part and a metal material having a higher thermal conductivity than the material of the plastic part, and comprises a metal part constituting all or at least part of a wall surface of the dissimilar material case 100. Capacitors with heterogeneous materials case.

본 발명에 따르는 경우, 커패시터 하우징 케이스에 금속판부를 도입함으로써, 커패시터 내부에서 발생한 열을 용이하게 외부로 배출하여 작동시 고온에 의한 커패시터의 수명 단축으로 방지할 수 있는 이종 재료 케이스 내장형 커패시터, 및 커패시터, IGBT, 인버터 하우징 결합체를 제공하기 위함이다.According to the present invention, by introducing a metal plate portion in the capacitor housing case, it is possible to easily discharge the heat generated inside the capacitor to the outside to prevent the life of the capacitor due to the high temperature during operation, the capacitor, and the capacitor, To provide an IGBT, inverter housing assembly.

본 발명은 인버터 히트싱크(냉각수단)에 가까운 부분에 커패시터 하우징 케이스의 금속판부를 인접하게 장착시켜서 커패시터 내부 열 방출을 용이하게 하고, 또한, 버스바 인접부위에 케이스의 금속판부가 위치하도록 하여 버스바에서 발생한 열의 배출이 더 잘 되도록 구성하였다.The present invention facilitates heat dissipation inside the capacitor by mounting a metal plate portion of the capacitor housing case adjacent to a portion close to the inverter heat sink (cooling means), and also allows the metal plate portion of the case to be positioned adjacent to the bus bar. It was configured to better release the generated heat.

Claims (15)

플라스틱과 열전도율이 다른 금속부위를 케이스 외측에 형성시킨 이종 재료 케이스를 포함하여 구성되는 것을 특징으로 하는 이종 재료 케이스 내장형 커패시터.Capacitor with a built-in dissimilar material case, characterized in that it comprises a dissimilar material case formed by forming a metal portion different from the plastic and the thermal conductivity outside the case. 유전체 필름이 권취되어 형성되고 양측에 전도성의 용사면이 형성된 커패시터 소자(1)들과,Capacitor elements 1 formed by winding a dielectric film and having conductive sprayed surfaces formed on both sides thereof, 상기 커패시터 소자(1)들의 용사면의 양측에 전기적으로 연결되는 버스바(3)와,A bus bar 3 electrically connected to both sides of the thermal sprayed surface of the capacitor elements 1, 상기 커패시터 소자 및 버스바 결합체를 내장하는 이종 재료 케이스(100)로 구성되되,Consists of a heterogeneous material case (100) containing the capacitor element and the busbar combination, 상기 이종 재료 케이스(100)는 플라스틱부와, 상기 플라스틱부의 재질보다 열전도율이 높은 금속 재료로 구성되고 상기 이종 재료 케이스(100) 벽면의 전부 또는 적어도 일부를 구성하는 금속부를 포함하여 구성되는 것을 특징으로 하는 이종 재료 케이스 내장형 커패시터.The dissimilar material case 100 is composed of a plastic part and a metal material having a higher thermal conductivity than the material of the plastic part, and comprises a metal part constituting all or at least part of a wall surface of the dissimilar material case 100. Capacitors with heterogeneous materials case. 제2항에 있어서,The method of claim 2, 상기 이종 재료 케이스(100)는, 케이스의 내벽을 이루며 절연성을 갖는 플라스틱 벽부(20)와, 상기 플라스틱 벽부(20) 외면의 전부 또는 일부에 접면되어 구성된 금속벽부(10)를 포함하여 구성되는 것을 특징으로 하는 이종 재료 케이스 내장형 커패시터.The dissimilar material case 100 is configured to include a plastic wall part 20 forming an inner wall of the case and having an insulating property, and a metal wall part 10 formed in contact with all or part of an outer surface of the plastic wall part 20. Capacitor with built-in dissimilar materials case. 제3항에 있어서,The method of claim 3, 상기 이종 재료 케이스(100)는 성형된 금속벽부(10)를 플라스틱 사출기에 넣어 인서트 사출 방식으로 플라스틱 벽부(20) 부위가 성형되는 것을 특징으로 하는 이종 재료 케이스 내장형 커패시터.The dissimilar material case 100 includes a molded metal wall part 10 in a plastic injection molding machine, wherein the plastic wall part 20 is molded by insert injection. 제3항에 있어서,The method of claim 3, 상기 금속벽부(10)의 재료는 알루미늄(Al), 구리(Cu), 아연(Zn), 마그네슘(Mg), 철(iron), 납, 황동, 스테인레스 스틸 중에서 선택된 하나이거나, 알루미늄(Al), 구리(Cu), 아연(Zn), 마그네슘(Mg), 철(iron), 납, 황동, 스테인레스 스틸 중에서 선택된 하나의 금속을 포함하는 합금인 것을 특징으로 하는 이종 재료 케이스 내장형 커패시터.The material of the metal wall part 10 is one selected from aluminum (Al), copper (Cu), zinc (Zn), magnesium (Mg), iron, lead, brass, stainless steel, aluminum (Al), Capacitor with a different material case, characterized in that the alloy containing one metal selected from copper (Cu), zinc (Zn), magnesium (Mg), iron (iron), lead, brass, stainless steel. 제4항에 있어서,The method of claim 4, wherein 상기 금속벽부(10)의 재료는 알루미늄(Al), 구리(Cu), 및 아연(Zn) 중에서 선택된 하나이거나, 알루미늄(Al) 구리(Cu) 아연(Zn) 마그네슘 중에서 선택된 하나의 금속을 포함하는 합금이며,The material of the metal wall part 10 is one selected from aluminum (Al), copper (Cu), and zinc (Zn), or includes one metal selected from aluminum (Al) copper (Cu) zinc (Zn) magnesium. Alloy, 주조 금형에 선택된 재료를 녹인 용탕(molten metal)을 주입한 후 가압하는 다이캐스팅(Die Casting) 가압 주조 방식으로 제조되는 것을 특징으로 하는 이종 재료 케이스 내장형 커패시터.A capacitor with a built-in dissimilar material case, which is manufactured by a die casting pressure casting method in which a molten metal in which a selected material is dissolved in a casting mold is injected and then pressed. 제6항에 있어서,The method of claim 6, 상기 금속벽부(10)의 두께는 0.2 ~ 10mm이고, The thickness of the metal wall portion 10 is 0.2 ~ 10mm, 상기 라스틱 벽부(20)를 형성하는 플라스틱 재료는 PPS, PBT, PP, PC, PET, ABS 중에서 선택된 적어도 하나인 것을 특징으로 하는 이종 재료 케이스 내장형 커패시터.The flat plastic material forming the plastic wall (20) is bi-material casing embedded capacitors, characterized in that at least one selected from the group consisting of PPS, PBT, PP, PC, PET, ABS. 제6항에 있어서,The method of claim 6, 상기 금속벽부(10)는 플라스틱 벽부(20)의 적어도 일면 전부 외측에 구성되는 것을 특징으로 하는 이종 재료 케이스 내장형 커패시터.The metal wall portion (10) is a capacitor built-in different materials, characterized in that the at least one surface of the plastic wall portion 20 is configured on the outside. 제6항에 있어서,The method of claim 6, 상기 플라스틱 벽부(20)는, 이종 재료 케이스(100)의 1개의 플라스틱 일벽(21)과, 상기 플라스틱 일벽(21)을 감싸는 플라스틱 측벽(23)으로 구성되고, The plastic wall portion 20 is composed of one plastic wall 21 of the dissimilar material case 100 and a plastic side wall 23 surrounding the plastic wall 21, 상기 금속벽부(10)는 상기 플라스틱 일벽(21)의 외측에 접면 형성되는 금속 일벽(11)과, 상기 플라스틱 측벽(23)의 외측에 접면 형성되는 금속 측벽(13)으로 구성되는 것을 특징으로 하는 이종 재료 케이스 내장형 커패시터.The metal wall portion 10 is composed of a metal one wall 11 is formed on the outer side of the plastic one wall 21 and a metal side wall 13 is formed on the outer side of the plastic side wall 23. Capacitors with dissimilar materials case. 제9항에 있어서,The method of claim 9, 상기 이종 재료 케이스(100)는 개구부를 제외한 5면 중, 1면을 이루는 플라스틱 일벽(21) 및 금속 일벽(11)과, 나머지 4면을 이루는 플라스틱 측벽(23) 및 금속 측벽(13)을 포함하는 직육면체 형으로 구성되는 것을 특징으로 하는 이종 재료 케이스 내장형 커패시터.The dissimilar material case 100 includes a plastic one wall 21 and a metal one wall 11, which form one surface, and a plastic side wall 23 and a metal side wall 13, which form the other four surfaces, except for five openings. Capacitor with a heterogeneous material case, characterized in that consisting of a rectangular parallelepiped type. 제2항 내지 제10항 중에서 선택된 하나의 청구항에 기술된 이종 재료 케이스를 구비한 하우징 내장형 커패시터를 사용하며, A housing-integrated capacitor with a heterogeneous material case as described in claim 1 selected from claims 2 to 10 is used, 하이브리드 자동차, 전기자동차, 수소연료전지 자동차, 플러그인 전기자동차의 인버터용으로 사용되고,Used for inverter of hybrid car, electric car, hydrogen fuel cell car, plug-in electric car, 이종 재료 케이스(100)의 금속벽부(10)가 인버터 케이스 바닥부(210)에 접면되게 장착되고, The metal wall portion 10 of the dissimilar material case 100 is mounted to be in contact with the bottom of the inverter case 210, 상기 인버터 케이스 바닥부(210)는 냉각수단(300)에 의해 냉각되는 것을 특징으로 하는 이종 재료 케이스 내장형 커패시터.The inverter case bottom portion 210 is a capacitor built-in different materials, characterized in that the cooling means 300 is cooled. 제2항 내지 제10항 중에서 선택된 하나의 청구항에 기술된 이종 재료 케이스를 구비한 하우징 내장형 커패시터와,A housing-integrated capacitor having a heterogeneous material case according to one of claims 2 to 10, 상기 하우징 내장형 커패시터가 장착되는 인버터 하우징(200)과,An inverter housing 200 in which the housing embedded capacitor is mounted; 상기 하우징 내장형 커패시터의 연결단자에 전기적으로 연결되는 IGBT,An IGBT electrically connected to a connection terminal of the housing embedded capacitor, 상기 IGBT가 장착된 인버터 하우징(200)을 냉각시키는 냉각수단(300),Cooling means 300 for cooling the inverter housing 200 equipped with the IGBT, 을 포함하여 구성되되,Consists of including 상기 하우징 케이스(100)의 금속벽부(10)가 인버터 케이스 바닥부(210)에 접면되게 장착되고, The metal wall portion 10 of the housing case 100 is mounted to be in contact with the inverter case bottom portion 210, 상기 인버터 케이스 바닥부(210)는 냉각수단(300)에 의해 냉각되는 것을 특징으로 하는 이종 재료 케이스 내장형 커패시터, IGBT, 인버터 하우징 결합체.The inverter case bottom portion 210 is heterogeneous material case embedded capacitor, IGBT, inverter housing assembly, characterized in that the cooling means 300 is cooled. 제2항 내지 제10항 중에서 선택된 하나의 청구항에 기술된 이종 재료 케이스 내장형 커패시터와,A capacitor with a different material case described in one of claims 2 to 10, 상기 하우징 내장형 커패시터가 장착되는 인버터 하우징(200)과,An inverter housing 200 in which the housing embedded capacitor is mounted; 상기 하우징 내장형 커패시터의 연결단자에 전기적으로 연결되는 IGBT,An IGBT electrically connected to a connection terminal of the housing embedded capacitor, 상기 IGBT가 장착된 인버터 하우징(200)을 냉각시키는 냉각수단(300),Cooling means 300 for cooling the inverter housing 200 equipped with the IGBT, 을 포함하여 구성되되,Consists of including 상기 인버터 케이스 바닥부(210)는 냉각수단(300)에 의해 냉각되고,The inverter case bottom portion 210 is cooled by the cooling means 300, 상기 인버터 케이스 바닥부(210) 상부에 IGBT가 위치하고,IGBT is located on the upper portion of the inverter case bottom 210, IGBT 상부에 이종 재료 케이스 내장형 커패시터에 고정 수단에 의해 고정되는 것을 특징으로 하는 이종 재료 케이스 내장형 커패시터, IGBT, 인버터 하우징 결합체.A heterogeneous material case-embedded capacitor, an IGBT, and an inverter housing assembly, which are fixed to the dissimilar material-case-embedded capacitor on the IGBT. 제2항 내지 제10항 중에서 선택된 하나의 청구항에 기술된 이종 재료 케이스 내장형 커패시터와,A capacitor with a different material case described in one of claims 2 to 10, 상기 하우징 내장형 커패시터가 장착되는 인버터 하우징(200)과,An inverter housing 200 in which the housing embedded capacitor is mounted; 상기 하우징 내장형 커패시터의 연결단자에 전기적으로 연결되는 IGBT,An IGBT electrically connected to a connection terminal of the housing embedded capacitor, 상기 IGBT가 장착된 인버터 하우징(200)을 냉각시키는 냉각수단(300),Cooling means 300 for cooling the inverter housing 200 equipped with the IGBT, 을 포함하여 구성되되,Consists of including 상기 인버터 케이스 바닥부(210) 상부에 IGBT가 위치하고,IGBT is located on the upper portion of the inverter case bottom 210, IGBT 상부에 이종 재료 케이스 내장형 커패시터에 고정 수단에 의해 고정되고,On the upper part of the IGBT is fixed by means of fastening means to a capacitor with a built-in heterogeneous material 상기 이종 재료 케이스 내장형 커패시터가 인버터 하우징(200)의 개구부에 고정되어 커패시터 기능을 하면서 인버터 하우징(200)의 덮개 기능을 동시에 수행하는 것을 특징으로 하는 이종 재료 케이스 내장형 커패시터, IGBT, 인버터 하우징 결합체.The dissimilar material case embedded capacitor, IGBT, inverter housing assembly, characterized in that the capacitor is fixed to the opening of the inverter housing 200 to perform the cover function of the inverter housing 200 at the same time as a capacitor function. 제12항에 있어서,The method of claim 12, 상기 금속벽부(10)와 냉각수단(300)에 의해 냉각되는 상기 인버터 케이스 바닥부(210) 사이에 금속성 패드가 개재되거나 써멀(Thermal) 구리스가 도포되어 냉각 효율이 향상되는 것을 특징으로 하는 이종 재료 케이스 내장형 커패시터, IGBT, 인버터 하우징 결합체.Heterogeneous material, characterized in that the cooling efficiency is improved by interposing a metallic pad or a thermal grease is applied between the metal wall portion 10 and the inverter case bottom portion 210 that is cooled by the cooling means 300. Integrated capacitors, IGBTs, inverter housing assembly.
PCT/KR2014/010838 2014-11-12 2014-11-12 Different material case embedded capacitor, and capacitor igbt inverter housing assembly Ceased WO2016076452A1 (en)

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